KR20240009473A - 전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 형성 방법 및 전자 디바이스 봉지막 - Google Patents

전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 형성 방법 및 전자 디바이스 봉지막 Download PDF

Info

Publication number
KR20240009473A
KR20240009473A KR1020237043471A KR20237043471A KR20240009473A KR 20240009473 A KR20240009473 A KR 20240009473A KR 1020237043471 A KR1020237043471 A KR 1020237043471A KR 20237043471 A KR20237043471 A KR 20237043471A KR 20240009473 A KR20240009473 A KR 20240009473A
Authority
KR
South Korea
Prior art keywords
meth
electronic device
acrylate
composition
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237043471A
Other languages
English (en)
Korean (ko)
Inventor
유키히로 마키시마
신이치로 모리카와
Original Assignee
코니카 미놀타 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코니카 미놀타 가부시키가이샤 filed Critical 코니카 미놀타 가부시키가이샤
Publication of KR20240009473A publication Critical patent/KR20240009473A/ko
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/20Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Sealing Material Composition (AREA)
KR1020237043471A 2021-08-30 2022-05-31 전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 형성 방법 및 전자 디바이스 봉지막 Pending KR20240009473A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-140153 2021-08-30
JP2021140153 2021-08-30
PCT/JP2022/022031 WO2023032372A1 (ja) 2021-08-30 2022-05-31 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

Publications (1)

Publication Number Publication Date
KR20240009473A true KR20240009473A (ko) 2024-01-22

Family

ID=85411171

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237043471A Pending KR20240009473A (ko) 2021-08-30 2022-05-31 전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 형성 방법 및 전자 디바이스 봉지막

Country Status (4)

Country Link
JP (1) JP7835225B2 (https=)
KR (1) KR20240009473A (https=)
CN (1) CN117898023A (https=)
WO (1) WO2023032372A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025094586A1 (ja) * 2023-10-31 2025-05-08 コニカミノルタ株式会社 インクジェット用の電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014193970A (ja) 2013-03-29 2014-10-09 Nippon Kayaku Co Ltd エネルギー線硬化型樹脂組成物及びその硬化物
JP2014196387A (ja) 2013-03-29 2014-10-16 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
JP2018504735A (ja) 2014-10-29 2018-02-15 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. ディスプレイ密封材用組成物、これを含む有機保護層、及びこれを含むディスプレイ装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101616159B1 (ko) * 2012-12-12 2016-04-27 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층, 이를 포함하는 장벽 스택, 이를 포함하는 봉지화된 장치, 및 이를 이용하는 장치의 봉지 방법
KR102008177B1 (ko) * 2016-05-24 2019-08-07 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치
KR102008184B1 (ko) 2016-11-11 2019-08-07 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014193970A (ja) 2013-03-29 2014-10-09 Nippon Kayaku Co Ltd エネルギー線硬化型樹脂組成物及びその硬化物
JP2014196387A (ja) 2013-03-29 2014-10-16 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
JP2018504735A (ja) 2014-10-29 2018-02-15 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. ディスプレイ密封材用組成物、これを含む有機保護層、及びこれを含むディスプレイ装置

Also Published As

Publication number Publication date
CN117898023A (zh) 2024-04-16
JP7835225B2 (ja) 2026-03-25
JPWO2023032372A1 (https=) 2023-03-09
WO2023032372A1 (ja) 2023-03-09

Similar Documents

Publication Publication Date Title
JP7203903B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP7736004B2 (ja) 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜
CN109689700B (zh) 组合物
TWI618238B (zh) 有機發光二極體顯示裝置
CN107851730A (zh) 有机发光显示器
CN107683537A (zh) 有机发光显示器
JP4164885B2 (ja) 有機電界発光素子及びその製造方法
WO2023065723A1 (zh) 一种用于oled封装的油墨组合物及其应用
KR20120001163A (ko) 봉지막 및 이를 포함하는 유기전자소자
JP7835225B2 (ja) 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜
TWI501030B (zh) 光可固化型組成物、包含該組成物之保護層及包含該組成物之封裝裝置
JP7786457B2 (ja) 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜
KR102955051B1 (ko) 전자 디바이스 밀봉용 조성물, 전자 디바이스 밀봉막 및 전자 디바이스 밀봉막의 형성 방법
KR20250027790A (ko) 전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 및 전자 디바이스 봉지막의 형성 방법
WO2025094586A1 (ja) インクジェット用の電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜
TWI869953B (zh) 電子裝置密封用組成物、電子裝置密封膜及電子裝置密封膜的形成方法
JP2008218421A (ja) 有機電界発光素子及びその製造方法
WO2024024841A1 (ja) 電子デバイス封止用組成物、電子デバイス封止膜及び電子デバイス封止膜の形成方法
WO2025126843A1 (ja) インクジェット用の電子デバイス封止用組成物、電子デバイス封止膜及び電子デバイス封止膜形成方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701