KR20240001459A - Decoration film for mobile phones with antenna and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a mobile phone decoration film, and more specifically, to a mobile phone decoration film to which an antenna is applied, which can exhibit advantages such as miniaturization, weight reduction, and process cost reduction by forming an antenna pattern on the back of the back cover, and the same. It is about manufacturing method.

Description

Decoration film for mobile phones with antenna and manufacturing method thereof {Decoration film for mobile phones with antenna and manufacturing method thereof}

The present invention relates to a mobile phone decoration film, and more specifically, to a mobile phone decoration film to which an antenna is applied, which can exhibit advantages such as miniaturization, weight reduction, and process cost reduction by forming an antenna pattern on the back of the back cover, and the same. It is about manufacturing method.

Recently, various functions such as wireless tag (RFID, Radio Frequency Identification), Near Field Communication (NFC), Magnetic Secure Transmission (MST), wireless charging (WPT), and interactive pen tablet have been added to mobile terminals including mobile phones and tablet PCs. It is becoming. Among these, NFC (Near Field Communication) and MST (Magnetic Secure Transmission) are used in various services such as transportation, tickets, and payments.

These functions are generally performed through coil-shaped antenna wiring, and mobile terminals are equipped with antenna devices with antenna wiring. Recent smartphones include various types of antennas, but in order to reduce space, antennas integrated with the smartphone case are being used.

In the conventional manufacturing method for this, first, an antenna pattern for receiving external electromagnetic waves is placed in a mold, resin is injected to form a molded resin body, and then the formed resin body with the antenna pattern is placed on the case back cover. The method of manufacturing mobile phone case covers by placing them in a mold and injecting resin has been commonly used.

However, when placing the molded resin body with the antenna pattern and the mobile phone back cover in the case back cover mold, there was a problem in that not only was the time delayed and productivity decreased, but the temperature of the mold decreased and defects increased accordingly. .

Republic of Korea Patent Publication No. 10-2018-0097064

The present invention is intended to solve the problems described above. By performing pattern plating on the back of the back cover as a post-production process to manufacture an integrated antenna pattern, advantages such as miniaturization, weight reduction, and process cost reduction can be demonstrated. The aim is to provide a mobile phone decoration film to which an antenna is applied and a method of manufacturing the same.

The above and other objects and advantages of the present invention will become apparent from the following description of preferred embodiments.

The purpose is to prepare a base film layer; Forming a UV pattern layer on the back of the base film layer; Preparing a base portion for manufacturing a decoration film manufactured including; And forming the base portion; Producing a decoration film prepared including; And, forming an antenna pattern layer on the back of the decoration film; it can be achieved by a method of manufacturing a mobile phone decoration film to which an antenna is applied, which further includes.

Forming the antenna pattern layer includes patterning the back surface of the decoration film by irradiating a laser; Electroless plating using copper (Cu) ink on the patterned area; And performing nickel plating after electroless plating to form a conductive pattern.

The electroless plating step includes performing hydrophilic surface treatment on the patterned area; Inkjet printing with the copper (Cu) ink after surface treatment; and

Characterized in that it includes; performing drying after printing.

The hydrophilic surface treatment may be plasma treatment using helium (He) gas three to four times at a speed of 48 to 52 mm/s. The drying may be performed by first drying at 78 to 82°C for 30 seconds to 1.5 minutes and then completely drying at room temperature (18 to 26°C).

In the step of preparing the base film, a UV pattern layer exhibiting a matte effect is formed on the front surface of the base film layer, and a deposition layer and shielding print are sequentially laminated on the lower part of the UV pattern layer formed on the back surface of the base film layer. It is characterized in that it further includes a step of forming a layer.

The above object is, base film layer; A UV pattern layer formed on the back of the base film layer; Decoration film containing; And an antenna pattern layer formed on the back of the decoration film; It can be achieved by a mobile phone decoration film to which an antenna is applied, including.

The base film layer is characterized in that it is a polycarbonate (PC) sheet, a polymethyl methacrylate (PMMA) sheet, a polycarbonate polymethyl methacrylate (PCPMMA) sheet, or a combination thereof.

The base film layer is characterized in that it is formed by a combination of a PMMA layer with a thickness of 40 to 50 μm and a PC layer with a thickness of 585 to 595 μm and located on the back of the PMMA layer.

The antenna pattern layer includes a lower cover layer; a lower copper layer located on the lower cover layer; a base film layer located on the lower copper layer; an upper copper layer located on the base film layer; and an upper cover layer located on the upper copper layer and on the back of the decoration film.

According to the present invention, as a post-manufacturing process for the finished back cover product, pattern plating is performed on the back of the back cover to manufacture an integrated antenna pattern, thereby enabling advantages such as miniaturization and weight reduction of the device and reduction of process costs.

In addition, according to the present invention, the front surface of the decoration film can exhibit an anti-fingerprint effect due to a matte effect, a texture effect with excellent slipperiness, a design haze effect, etc., and the pattern can be used in various shapes to provide not only a matte effect but also various designs. can be implemented.

However, the effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Figure 1 is a schematic diagram showing the structure of a mobile phone decoration film to which an antenna pattern is applied according to an embodiment of the present invention.
FIG. 2 schematically shows the stacked structure of the antenna of FIG. 1.
Figure 3 is a schematic diagram sequentially showing the manufacturing process of an antenna pattern according to an embodiment of the present invention.
Figure 4 is an actual photograph implementing an antenna pattern according to an embodiment of the present invention.
Figures 5 and 6 show the results of an experimental example.

Hereinafter, the present invention will be described in detail with reference to embodiments of the present invention and drawings. These examples are merely presented as examples to explain the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .

Additionally, unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains, and in case of conflict, this specification including definitions The description will take precedence.

In order to clearly explain the proposed invention in the drawings, parts unrelated to the description have been omitted, and similar reference numerals have been assigned to similar parts throughout the specification. And, when it is said that a part "includes" a certain component, this means that it does not exclude other components, but may further include other components, unless specifically stated to the contrary. Additionally, “unit” as used in the specification refers to a unit or block that performs a specific function.

Identification codes (first, second, etc.) for each step are used for convenience of explanation. The identification codes do not describe the order of each step, and each step does not clearly state a specific order in context. It may be carried out differently from the order specified above. That is, each step may be performed in the same order as specified, may be performed substantially simultaneously, or may be performed in the opposite order.

One aspect of the present application is a base film layer; A UV pattern layer formed on the back of the base film layer; Decoration film containing; And an antenna pattern layer formed on the back of the decoration film; Provides a mobile phone decoration film to which an antenna is applied, including.

Hereinafter, implementation examples and examples of the present application will be described in detail with reference to the attached drawings. However, the present disclosure may not be limited to these implementations, examples, and drawings.

Figure 1 is a schematic diagram showing the structure of a mobile phone decoration film to which an antenna pattern is applied according to an embodiment of the present invention.

Referring to FIG. 1, the antenna pattern layer 10 according to an embodiment of the present invention may be formed on the back of the decoration film 1. That is, the antenna pattern layer 10 may be formed through a post-process performed after manufacturing the finished product form of the decoration film 1. The antenna pattern layer 10 will be described in detail later.

The decoration film 1 includes a UV pattern layer 200 formed on the back of the base film layer 100, and a UV pattern layer 300 that exhibits a matte effect and is formed on the front of the base film layer 100. ) may include.

The lower part of the UV pattern layer 200 formed on the back of the base film layer 100 may further include a sequentially laminated deposition layer (not shown) and a shielding printed layer 200.

The structure of the decoration film 1 is not limited to this, and may further include components commonly included in the field, such as layers and structures, without limitation.

The base film layer 100 may be any one selected from a polycarbonate (PC) sheet, a polymethyl methacrylate (PMMA) sheet, a polycarbonate polymethyl methacrylate (PCPMMA) sheet, or a combination thereof.

In one embodiment, the base film layer 100 is located on the rear surface of the PMMA layer 102 and the PMMA layer 102 having a thickness of 40 to 50 ㎛, specifically 45 ㎛, but 585 to 595 ㎛. , Specifically, it may be formed by a combination of PC layers 101 with a thickness of 590 ㎛.

FIG. 2 schematically shows the stacked structure of the antenna pattern layer 10 of FIG. 1.

Referring to FIG. 2 together, the antenna pattern layer 10 includes a lower cover layer 11 that serves as an antenna and is exposed to the outside; a lower copper layer 12 located on the lower cover layer 11; a base film layer for an antenna (13) located on the lower copper layer (12); an upper copper layer 14 located on the base film layer 13; It is possible to form a laminated structure including an upper cover layer 15 located on the upper copper layer 14 and on the back of the mobile phone decoration film 1.

The antenna pattern layer 10 may form a structure in which a conductive pattern is embedded in the rear surface of the decoration film 1. The thickness of each layer is preferably independently 10 to 15 ㎛, specifically, 12.5 ㎛.

Referring to FIG. 3, the manufacturing process of the antenna pattern layer 10 is as follows.

First, the decoration film 1 can be manufactured. The decoration film 1 may be formed in the structure described above and may be manufactured by a conventional manufacturing method in the field.

In one embodiment, preparing the base film layer 100; Forming a UV pattern layer 200 on the back of the base film layer 100; It is possible to prepare a base material for manufacturing a decoration film manufactured including.

The base unit forms a UV pattern layer 300 exhibiting a matte effect on the front surface of the base film layer 100, forms a UV pattern layer 200 on the back surface of the base film layer 100, and forms a UV pattern layer 200 on the back surface of the base film layer 100. The pattern layer 200 may be manufactured by further including forming a sequentially laminated deposition layer (not shown) and a shielding printed layer (not shown) on the lower part of the pattern layer 200.

The total thickness of the base portion may be, for example, 1.0 mm or less, specifically, 0.01 mm to 1.0 mm, more specifically, 0.01 to 1 mm, but is not limited thereto.

Next, molding can be performed by supplying the base material to a molding machine. The molding machine is not particularly limited as long as it can perform general molding methods used in the field, such as injection thermoforming, vacuum molding, and pressure molding.

As an example, the molding machine may be a pressure molding machine, specifically, a molding machine that sprays high-pressure air to pressurize the molding machine. By applying pressure by spraying air, deformation or damage to the substrate can be prevented and more precise forming can be achieved. The pressing may be performed under certain conditions of heat and pressure, and these conditions may be appropriately adjusted depending on the type of substrate and desired shape.

For example, the molding may be performed by spraying air at 55 to 80 kg/cm ² and pressurizing for 5 to 10 minutes under conditions where heat is applied in a temperature range of 130 to 140°C.

After the forming step, processes commonly performed as essential or optional in the field, such as cutting, optical coating, and outer shell processing, can be performed without major restrictions to produce a decoration film.

Next, after the decoration film 1 is manufactured, the antenna pattern layer 10 can be formed in a post-process. In one embodiment of the present invention, to form the antenna pattern layer 10, a laser manufacturing (LMA) method, which is a method of performing plating after laser patterning, may be used.

In the past, antenna patterns were produced using the LDS (Laser Direct Structuring) method, which involves putting a material that can be plated on a resin and plating it by reacting it with a laser, but this was inconvenient in the process as it required the use of a specific dedicated resin. . On the other hand, in the present invention, by using the LMA (Laser manufacturing) method, it can be applied to all plastics such as PC and PMMA, and the antenna pattern can be formed by plating directly on the finished back cover product, thereby simplifying the process. and can contribute to improving productivity.

In the method of manufacturing the antenna pattern layer 10 using the LMA (Laser manufacturing) method, patterning may first be performed by irradiating a laser onto the back of the decoration film 1. The laser irradiation may be performed according to techniques known in the art. The shape of the pattern is not particularly limited and may follow the shape of an antenna pattern commonly formed in the field.

Next, electroless plating can be performed on the patterned area using copper (Cu) ink. The electroless plating may be performed by inkjet printing using copper (Cu) ink according to a known technology to form an antenna pattern.

In order to reduce the physical properties of the pattern, specifically, the phenomenon of ink spreading after drying due to the hydrophobic copper (Cu) ink, and to improve the physical properties such as uniformity of the formed pattern, the patterning is performed before performing the electroless plating. Hydrophilic surface treatment can be performed on the affected area.

Specifically, the hydrophilic surface treatment may be plasma treatment using helium (He) gas. A specific method for the plasma treatment may follow known techniques. For example, the hydrophilic surface treatment is performed by repeating plasma treatment with helium (He) gas at a speed of 48 to 52 mm/s, specifically 50 mm/s, 3 to 4 times, specifically 4 times, and The gap between nozzles is preferably 2.8 to 3.2 mm, specifically 3 mm.

After the hydrophilic surface treatment and inkjet printing with the copper (Cu) ink, drying may be performed. The drying may be performed by first drying at, for example, 78 to 82° C., specifically, 80° C., for 30 seconds to 1.5 minutes, for example, 1 minute, and then at room temperature (18 to 26° C.), for example, 25° C. It may be completely dried at ℃.

If drying is performed under the above-described conditions, the surface characteristics and physical properties of the formed pattern can be further improved, and synergy can be achieved with the effect of the hydrophilic surface treatment described above.

After the electroless plating is completed, nickel plating can be performed according to a known method to form a conductive pattern, that is, the antenna pattern layer 10.

The thickness of the antenna pattern layer 10 may be 50 to 70 ㎛, for example, 62.5 ㎛.

Meanwhile, the UV pattern layer 200 formed on the back of the base film 100 is intended to represent a three-dimensional design pattern, and can be formed by UV molding to have a predetermined pattern shape later using a transparent UV pattern molding paint. there is.

At this time, the predetermined pattern shape may include a variety of pattern shapes, including super precision machine patterns and hologram patterns. In addition, any UV pattern shape that is obvious to a person skilled in the art can be applied. At this time, the manufacturing method may be a UV molding method using a micro optical mold.

When a UV pattern layer is formed using the UV molding method, aesthetics can be improved by enabling various design expressions depending on the angle of light.

The paint for UV pattern forming may contain a binder material. The binder material includes epoxy resin, acrylic resin, polyolefin resin, polyamide resin, polyester resin, polyvinyl chloride resin, polyvinyl acetate resin, petroleum resin, phenolic resin, polystyrene resin, and It may contain at least one of urethane-based resins.

A deposition layer and a shielding printed layer may be formed below the UV pattern layer 200.

The deposition layer is performed to protect the UV pattern layer 200 and to clearly display the three-dimensional effect caused by the UV pattern layer 200. The deposition layer can be formed in the form of an inorganic thin film on the UV pattern layer using a deposition method commonly used in the industry, such as a Non Conductive Vacuum Metallization (NCVM) method including physical or chemical vapor deposition. .

When depositing an oxide semiconductor or GaAs on a substrate, the physical vapor deposition method melts the compounds, prepares them as a solid target, volatizes them with heat or an electron beam, and deposits them on the substrate. At this time, the raw material is blown into a gaseous state through heat, laser, electron beam, etc., and when the blown gaseous raw material touches the substrate, it changes into a solid state.

The chemical vapor deposition method is an industrial method of creating a thin film of silicon, etc., on a substrate using a chemical reaction in the manufacturing process of ICs. It is used to make silicon oxide films, silicon nitrogen films, and amorphous silicon thin films. When energy is applied to a gas containing a chemical substance through heat or light, or when it is turned into a plasma using high frequency, the raw material is radicalized, greatly increasing its reactivity, and adsorbed and deposited on the substrate.

Additionally, the deposition layer can be formed as a color deposition layer, for example, a gradient deposition layer, to improve aesthetics in various colors such as two-tone colors, multi-colors, and colors with various depths. For example, the gradient deposition layer may be formed using conventional electron beam deposition equipment.

The shielding printed layer (not shown) functions to block the transmission of light, and can be implemented by printing a dark color, so that the lower side of the shielding printed layer is not transparent when viewed from the top of the decoration film according to the present invention. do. As an example, the shielding printed layer may be a silk printed layer formed by silk screen printing. The shielding printed layer may be formed to have a thickness of 15 to 25 ㎛.

A UV pattern layer 300 that exhibits a matte effect may be formed on the entire surface of the base film layer 100. The UV pattern layer 300 may be formed using a slot die coating method using a transparent UV pattern forming paint. However, it is not limited to this, and can be formed using a coating method commonly used in the art.

The paint for UV pattern forming may include a binder material. The binder material includes epoxy resin, acrylic resin, polyolefin resin, polyamide resin, polyester resin, polyvinyl chloride resin, polyvinyl acetate resin, petroleum resin, phenolic resin, polystyrene resin, and It may contain at least one of urethane-based resins.

After performing the coating, a pattern showing a matte effect can be formed through a rubbing method. The rubbing method may use a pattern slave, and the specific manufacturing method may follow known techniques. After performing the rubbing, a curing step can be performed using an LED lamp, a mercury lamp, etc.

In addition to this, components such as structures and layers for forming the decoration film 1 may be further included without limitation, and a known manufacturing method may be used as long as it does not impair the characteristics of the antenna pattern layer of the present invention. You can follow without restrictions.

Figure 4 is an actual photograph implementing an antenna pattern according to an embodiment of the present invention.

Referring to Figure 4, it can be seen that the antenna pattern was formed by performing electroless plating using copper (Cu) ink.

According to one embodiment of the present invention, as a post-manufacturing process for the finished back cover product, pattern plating is performed on the back of the back cover to manufacture an integrated antenna pattern, thereby demonstrating advantages such as miniaturization and weight reduction of the device and reduction of process costs. there is.

Hereinafter, the configuration of the present invention and its effects will be described in more detail through specific examples and comparative examples. However, these examples are for illustrating the present invention in more detail, and the scope of the present invention is not limited to these examples.

<Experimental example: Evaluation of pattern properties>

Surface characteristics of patterns with and without plasma surface treatment

An example in which plasma surface treatment (gas used: He alone (hydrophilic), processing speed: 50 mm/s, repeated 4 times, gap between substrate and nozzle: 3 mm) was performed after manufacturing the decoration film, and an example in which surface treatment was not performed For comparative examples, inkjet printing using copper ink (Head used: KM1024i-LHE (discharge capacity: 30pl, resolution: 360DPI), Ink used: Dimatix XL-30(RED), Waveform: Head reference Voltage, T2 : 9㎲), followed by drying (80°C for 3 minutes, complete drying), and then the surface properties of the patterns were observed with the naked eye and compared. The results are shown in Figure 5.

Referring to Figure 5, in the comparative example, the surface remained hydrophobic and the ink spread, and the ink spread even after drying. In the example, the pattern was formed normally immediately after printing, but after drying, it was observed that the ink was absorbed into the coating and spread.

Surface characteristics of patterns according to drying conditions

Except as described below, the surface properties of the patterns were observed according to the method described above.

Comparative examples were excluded, and the examples were compared before and after drying, respectively.

In addition, drying was carried out under three experimental conditions (complete drying at 80°C, complete drying at room temperature (25°C), drying at 80°C for 1 minute and then complete drying at room temperature (25°C)) to create patterns according to each condition. The surface properties were compared, and the results are shown in Figure 6.

Referring to Figure 6, in the case of condition 1, the pattern was maintained before drying and there was no ink clumping, but after drying, the phenomenon of pattern collapse was observed. In the case of condition 2, collapse (smearing) of the pattern was also observed after drying. On the other hand, in the case of condition 3, it was confirmed that the pattern was maintained uniformly both before and after drying.

That is, as can be seen from the results according to Figures 5 and 6, when hydrophilic surface treatment and drying at 80°C for 1 minute followed by complete drying at room temperature (25°C) are performed together, the surface characteristics of the pattern are best realized. could be confirmed.

Optimal embodiments are disclosed in the drawings and specification. Although specific terms are used here, they are used only for the purpose of explaining the present invention and are not used to limit the meaning or scope of the present invention described in the claims. Therefore, those skilled in the art will understand that various modifications and other equivalent embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the attached patent claims.

1: Mobile phone decoration film
100: base film layer 101: PC layer
102: PMMA layer 200: UV pattern layer
200: UV pattern layer showing a matte effect
10: Antenna pattern layer 11: Lower cover layer
12: lower copper layer 13: base film layer
14: upper copper layer 15: upper cover layer

Claims (10)

Preparing a base film layer;
Forming a UV pattern layer on the back of the base film layer; Preparing a base portion for manufacturing a decoration film manufactured including; and
Molding the base portion; Producing a decoration film prepared including; and,
A method of manufacturing a mobile phone decoration film to which an antenna is applied, further comprising forming an antenna pattern layer on the back of the decoration film. According to paragraph 1,
The step of forming the antenna pattern layer is,
Patterning the back surface of the decoration film by irradiating a laser;
Electroless plating using copper (Cu) ink on the patterned area; and
A method of manufacturing a mobile phone decoration film to which an antenna is applied, comprising the step of performing nickel plating after electroless plating to form a conductive pattern. According to paragraph 2,
The electroless plating step is,
performing hydrophilic surface treatment on the patterned area;
Inkjet printing with the copper (Cu) ink after surface treatment; and
A method of manufacturing a mobile phone decoration film to which an antenna is applied, comprising: performing drying after printing. According to paragraph 3,
The hydrophilic surface treatment is a method of manufacturing a mobile phone decoration film with an antenna, wherein the helium (He) gas is repeatedly plasma treated 3 to 4 times at a speed of 48 to 52 mm/s. According to paragraph 3,
The drying is performed by first drying at 78 to 82° C. for 30 seconds to 1.5 minutes and then completely drying at room temperature (18 to 26° C.). According to paragraph 1,
In the step of preparing the base material,
Forming a UV pattern layer showing a matte effect on the front surface of the base film layer, and forming a sequentially laminated deposition layer and a shielding printed layer below the UV pattern layer formed on the back surface of the base film layer; A method of manufacturing a mobile phone decoration film to which an antenna is applied, comprising: base film layer;
A UV pattern layer formed on the back of the base film layer; Decoration film containing; and
An antenna pattern layer formed on the back of the decoration film; Including, a mobile phone decoration film to which an antenna is applied. In clause 7,
A mobile phone decoration film to which an antenna is applied, wherein the base film layer is a PC (Polycarbonate) sheet, a PMMA (Polymethyl methacrylate) sheet, a PCPMMA (Polycarbonate Polymethyl methacrylate) sheet, or a combination thereof. According to clause 8,
The base film layer is formed by a combination of a PMMA layer with a thickness of 40 to 50 ㎛ and a PC layer with a thickness of 585 to 595 ㎛ located on the back of the PMMA layer. A mobile phone decoration film to which an antenna is applied. In clause 7,
The antenna pattern layer is,
lower cover layer;
a lower copper layer located on the lower cover layer;
a base film layer located on the lower copper layer;
an upper copper layer located on the base film layer; and
A mobile phone decoration film to which an antenna is applied, comprising: an upper cover layer located on the upper copper layer and located on the back of the decoration film.