KR20230169159A - 마이크로렌즈 어레이 및 그 제조 방법 - Google Patents

마이크로렌즈 어레이 및 그 제조 방법 Download PDF

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Publication number
KR20230169159A
KR20230169159A KR1020237034851A KR20237034851A KR20230169159A KR 20230169159 A KR20230169159 A KR 20230169159A KR 1020237034851 A KR1020237034851 A KR 1020237034851A KR 20237034851 A KR20237034851 A KR 20237034851A KR 20230169159 A KR20230169159 A KR 20230169159A
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KR
South Korea
Prior art keywords
microlens
pixel
microlens array
lens
array
Prior art date
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Pending
Application number
KR1020237034851A
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English (en)
Korean (ko)
Inventor
도모히로 시마자키
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도판 인사츠 가부시키가이샤
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Application filed by 도판 인사츠 가부시키가이샤 filed Critical 도판 인사츠 가부시키가이샤
Publication of KR20230169159A publication Critical patent/KR20230169159A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
    • H01L27/14627—
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • H01L27/14621—
    • H01L33/58—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
KR1020237034851A 2021-04-14 2022-04-13 마이크로렌즈 어레이 및 그 제조 방법 Pending KR20230169159A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-068397 2021-04-14
JP2021068397 2021-04-14
PCT/JP2022/017740 WO2022220271A1 (ja) 2021-04-14 2022-04-13 マイクロレンズアレイおよびその製造方法

Publications (1)

Publication Number Publication Date
KR20230169159A true KR20230169159A (ko) 2023-12-15

Family

ID=83640730

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237034851A Pending KR20230169159A (ko) 2021-04-14 2022-04-13 마이크로렌즈 어레이 및 그 제조 방법

Country Status (5)

Country Link
US (1) US20240036237A1 (https=)
JP (1) JPWO2022220271A1 (https=)
KR (1) KR20230169159A (https=)
CN (1) CN117157561A (https=)
WO (1) WO2022220271A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250105747A (ko) 2023-12-29 2025-07-09 (주)애니캐스팅 마이크로 렌즈 어레이가 구비된 디스플레이 모듈 제조 방법
WO2026071815A1 (ko) * 2024-09-30 2026-04-02 서울반도체 주식회사 발광장치 및 이를 포함하는 디스플레이장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119403315A (zh) * 2023-07-25 2025-02-07 无锡晶湛半导体有限公司 一种发光器件结构及其制备方法
WO2026071148A1 (ja) * 2024-09-30 2026-04-02 ソニーセミコンダクタソリューションズ株式会社 光検出装置、撮像装置、および電子機器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009109965A (ja) 2007-10-11 2009-05-21 Nikon Corp 固体撮像素子および撮像装置
JP2013021168A (ja) 2011-07-12 2013-01-31 Sony Corp 固体撮像装置、固体撮像装置の製造方法、電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7307788B2 (en) * 2004-12-03 2007-12-11 Micron Technology, Inc. Gapless microlens array and method of fabrication
US7068432B2 (en) * 2004-07-27 2006-06-27 Micron Technology, Inc. Controlling lens shape in a microlens array
JP2014154662A (ja) * 2013-02-07 2014-08-25 Sony Corp 固体撮像素子、電子機器、および製造方法
JP2019091853A (ja) * 2017-11-16 2019-06-13 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子及び電子装置
WO2019220861A1 (ja) * 2018-05-16 2019-11-21 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および固体撮像素子の製造方法
CN109302565A (zh) * 2018-11-12 2019-02-01 德淮半导体有限公司 图像传感器及其制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009109965A (ja) 2007-10-11 2009-05-21 Nikon Corp 固体撮像素子および撮像装置
JP2013021168A (ja) 2011-07-12 2013-01-31 Sony Corp 固体撮像装置、固体撮像装置の製造方法、電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250105747A (ko) 2023-12-29 2025-07-09 (주)애니캐스팅 마이크로 렌즈 어레이가 구비된 디스플레이 모듈 제조 방법
WO2026071815A1 (ko) * 2024-09-30 2026-04-02 서울반도체 주식회사 발광장치 및 이를 포함하는 디스플레이장치

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Publication number Publication date
US20240036237A1 (en) 2024-02-01
WO2022220271A1 (ja) 2022-10-20
JPWO2022220271A1 (https=) 2022-10-20
CN117157561A (zh) 2023-12-01

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