JPWO2022220271A1 - - Google Patents
Info
- Publication number
- JPWO2022220271A1 JPWO2022220271A1 JP2023514673A JP2023514673A JPWO2022220271A1 JP WO2022220271 A1 JPWO2022220271 A1 JP WO2022220271A1 JP 2023514673 A JP2023514673 A JP 2023514673A JP 2023514673 A JP2023514673 A JP 2023514673A JP WO2022220271 A1 JPWO2022220271 A1 JP WO2022220271A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0043—Inhomogeneous or irregular arrays, e.g. varying shape, size, height
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021068397 | 2021-04-14 | ||
| PCT/JP2022/017740 WO2022220271A1 (ja) | 2021-04-14 | 2022-04-13 | マイクロレンズアレイおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022220271A1 true JPWO2022220271A1 (https=) | 2022-10-20 |
| JPWO2022220271A5 JPWO2022220271A5 (https=) | 2024-01-25 |
Family
ID=83640730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023514673A Pending JPWO2022220271A1 (https=) | 2021-04-14 | 2022-04-13 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240036237A1 (https=) |
| JP (1) | JPWO2022220271A1 (https=) |
| KR (1) | KR20230169159A (https=) |
| CN (1) | CN117157561A (https=) |
| WO (1) | WO2022220271A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119403315A (zh) * | 2023-07-25 | 2025-02-07 | 无锡晶湛半导体有限公司 | 一种发光器件结构及其制备方法 |
| KR20250105747A (ko) | 2023-12-29 | 2025-07-09 | (주)애니캐스팅 | 마이크로 렌즈 어레이가 구비된 디스플레이 모듈 제조 방법 |
| WO2026071148A1 (ja) * | 2024-09-30 | 2026-04-02 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置、撮像装置、および電子機器 |
| US20260096273A1 (en) * | 2024-09-30 | 2026-04-02 | Seoul Semiconductor Co., Ltd. | Light emitting device and display device including the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7307788B2 (en) * | 2004-12-03 | 2007-12-11 | Micron Technology, Inc. | Gapless microlens array and method of fabrication |
| US7068432B2 (en) * | 2004-07-27 | 2006-06-27 | Micron Technology, Inc. | Controlling lens shape in a microlens array |
| JP5157436B2 (ja) | 2007-10-11 | 2013-03-06 | 株式会社ニコン | 固体撮像素子および撮像装置 |
| JP2013021168A (ja) | 2011-07-12 | 2013-01-31 | Sony Corp | 固体撮像装置、固体撮像装置の製造方法、電子機器 |
| JP2014154662A (ja) * | 2013-02-07 | 2014-08-25 | Sony Corp | 固体撮像素子、電子機器、および製造方法 |
| JP2019091853A (ja) * | 2017-11-16 | 2019-06-13 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子及び電子装置 |
| WO2019220861A1 (ja) * | 2018-05-16 | 2019-11-21 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および固体撮像素子の製造方法 |
| CN109302565A (zh) * | 2018-11-12 | 2019-02-01 | 德淮半导体有限公司 | 图像传感器及其制造方法 |
-
2022
- 2022-04-13 JP JP2023514673A patent/JPWO2022220271A1/ja active Pending
- 2022-04-13 CN CN202280027086.XA patent/CN117157561A/zh active Pending
- 2022-04-13 KR KR1020237034851A patent/KR20230169159A/ko active Pending
- 2022-04-13 WO PCT/JP2022/017740 patent/WO2022220271A1/ja not_active Ceased
-
2023
- 2023-10-09 US US18/483,039 patent/US20240036237A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240036237A1 (en) | 2024-02-01 |
| WO2022220271A1 (ja) | 2022-10-20 |
| CN117157561A (zh) | 2023-12-01 |
| KR20230169159A (ko) | 2023-12-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230522 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250319 |