KR20230153390A - 수지 조성물 - Google Patents

수지 조성물 Download PDF

Info

Publication number
KR20230153390A
KR20230153390A KR1020237029999A KR20237029999A KR20230153390A KR 20230153390 A KR20230153390 A KR 20230153390A KR 1020237029999 A KR1020237029999 A KR 1020237029999A KR 20237029999 A KR20237029999 A KR 20237029999A KR 20230153390 A KR20230153390 A KR 20230153390A
Authority
KR
South Korea
Prior art keywords
resin composition
mass
group
component
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237029999A
Other languages
English (en)
Korean (ko)
Inventor
겐지 가와이
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20230153390A publication Critical patent/KR20230153390A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • H01L23/295—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020237029999A 2021-03-02 2022-03-01 수지 조성물 Pending KR20230153390A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-032681 2021-03-02
JP2021032681 2021-03-02
PCT/JP2022/008661 WO2022186219A1 (ja) 2021-03-02 2022-03-01 樹脂組成物

Publications (1)

Publication Number Publication Date
KR20230153390A true KR20230153390A (ko) 2023-11-06

Family

ID=83154459

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237029999A Pending KR20230153390A (ko) 2021-03-02 2022-03-01 수지 조성물

Country Status (4)

Country Link
JP (1) JP7311064B2 (https=)
KR (1) KR20230153390A (https=)
CN (1) CN117120544A (https=)
WO (1) WO2022186219A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024102755A (ja) * 2023-01-19 2024-07-31 味の素株式会社 樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089165A (ja) 2014-10-29 2016-05-23 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2020023714A (ja) 2019-10-24 2020-02-13 積水化学工業株式会社 樹脂材料及び多層プリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6308713B2 (ja) * 2012-08-07 2018-04-11 味の素株式会社 樹脂組成物
JP2020132646A (ja) * 2019-02-12 2020-08-31 住友ベークライト株式会社 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089165A (ja) 2014-10-29 2016-05-23 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法
JP2020023714A (ja) 2019-10-24 2020-02-13 積水化学工業株式会社 樹脂材料及び多層プリント配線板

Also Published As

Publication number Publication date
JP7311064B2 (ja) 2023-07-19
WO2022186219A1 (ja) 2022-09-09
JPWO2022186219A1 (https=) 2022-09-09
TW202300552A (zh) 2023-01-01
CN117120544A (zh) 2023-11-24

Similar Documents

Publication Publication Date Title
JP7532932B2 (ja) 樹脂組成物
JP7793889B2 (ja) 樹脂組成物
KR20230132723A (ko) 수지 조성물
KR20240046520A (ko) 수지 조성물
CN112126193A (zh) 树脂组合物
JP7533107B2 (ja) 樹脂組成物、硬化物、シート状積層材料、樹脂シート、プリント配線板及び半導体装置
JP7689142B2 (ja) 樹脂組成物
KR20240137596A (ko) 수지 조성물, 경화물, 시트상 적층 재료, 수지 시트, 프린트 배선판, 및 반도체 장치
JP7560398B2 (ja) 樹脂組成物
KR20230063871A (ko) 수지 조성물
JP7700456B2 (ja) 樹脂組成物
JP7311064B2 (ja) 樹脂組成物
KR20210003678A (ko) 수지 조성물
JP7472839B2 (ja) 樹脂組成物
KR20220170772A (ko) 수지 조성물
JP2022151212A (ja) プリント配線板の製造方法
JP2023124504A (ja) 樹脂組成物
JP7718274B2 (ja) 樹脂組成物
JP7826647B2 (ja) 樹脂組成物
KR20240087832A (ko) 수지 조성물
KR20240028939A (ko) 수지 조성물
KR20240093356A (ko) 수지 조성물층
KR20240052681A (ko) 수지 조성물
WO2023027154A1 (ja) 樹脂組成物
KR20240053541A (ko) 수지 조성물

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902