KR20230141699A - Organic light emitting display apparatus and method for manufacturing the same - Google Patents

Abstract

An organic light emitting display device according to an embodiment of the present invention includes a substrate having a first sub-pixel and a second sub-pixel, a first common layer disposed on the first sub-pixel, and a second common layer disposed on the second sub-pixel. a layer, and a dummy common layer disposed between the first sub-pixel and the second sub-pixel, wherein the first common layer, the second common layer, and the dummy common layer are made of the same material and are separated from each other. do. In the organic light emitting display device according to an embodiment of the present invention, current leakage due to a common layer shared by a plurality of organic light emitting elements can be prevented.

Description

Organic light emitting display device and manufacturing method thereof {ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more specifically, to an organic light emitting display device and a method of manufacturing the same in which current leakage due to a common layer shared by a plurality of organic light emitting devices is reduced.

An organic light-emitting display apparatus (OLED apparatus) is a self-luminance display device. Unlike a liquid crystal display apparatus (LCD), an organic light-emitting display apparatus (OLED apparatus) does not require a separate light source, so it is lightweight and thin. It can be manufactured with In addition, organic light emitting display devices are not only advantageous in terms of power consumption due to low voltage driving, but also have excellent color rendering, response speed, viewing angle, and contrast ratio (CR), and are being studied as next-generation displays.

In an organic light emitting display device, holes and electrons injected from two electrodes recombine in the organic light emitting layer to form excitons, and light of a specific wavelength is generated by the energy emission of the formed excitons. It is a display device that uses phenomena.

[Related technical literature]

1. White organic light emitting device (Patent Application No. 10-2007-0053472)

Depending on the design, the organic light emitting display device may have a patterned emission layer structure.

An organic light emitting display device with a patterned light emitting layer structure has a structure in which organic light emitting layers that emit different colors are separated for each pixel between two electrodes. For example, a red organic light-emitting layer for emitting red light, a green organic light-emitting layer for emitting green light, and a blue organic light-emitting layer for emitting blue light are respectively a red sub-pixel, a green sub-pixel, and a blue sub-pixel. It can be configured separately. In each of the red organic light-emitting layer, green organic light-emitting layer, and blue organic light-emitting layer, holes and electrons supplied through two electrodes combine with each other to emit light. Each organic light emitting layer may be deposited in a pattern using a mask with openings for each sub-pixel, for example, a fine metal mask (FMM).

Between the two electrodes, in addition to the organic light-emitting layer, additional organic layers such as an injecting layer and a transporting layer may be disposed to improve the light-emitting efficiency of the organic light-emitting device. At least some of these additional organic layers may have a common structure that is commonly disposed in a plurality of sub-pixels to take advantage of the manufacturing process.

Here, a layer having a common structure can be formed using a common mask in which all sub-pixels are open, and can be stacked with the same structure on all sub-pixels without a pattern for each sub-pixel. That is, a layer having a common structure is arranged to be connected or extended from one sub-pixel to a neighboring sub-pixel without a break, and is therefore shared by a plurality of sub-pixels. A layer having a common structure may hereinafter be referred to as a common layer or a layer of a common structure.

For example, between two electrodes, in addition to the organic light emitting layer, a p-type dopant is doped in a hole injecting layer or a hole transporting layer to facilitate the movement of holes. A p-type hole transport layer may be further disposed, and the hole injection layer or p-type hole transport layer may have a common structure commonly disposed in a plurality of sub-pixels.

The problem is that, as at least some of the additional organic layers, such as the hole injection layer or the p-type hole transport layer, are composed of a common structure sharing a plurality of sub-pixels, when applying a current to drive a specific sub-pixel, the hole injection layer Alternatively, a phenomenon in which current flows to another neighboring sub-pixel through the p-type hole transport layer, that is, a current leakage phenomenon, may occur. This current leakage phenomenon causes other sub-pixels to unintentionally emit light, causing color mixing between sub-pixels and lowering the luminance of the driven sub-pixels, thereby deteriorating the display quality of the organic light emitting display device and increasing power consumption. It is becoming a cause.

This problem of color mixing between sub-pixels due to current leakage may occur more seriously in low gray scale driving of an organic light emitting display device. In other words, the problem of color mixing between sub-pixels occurs more seriously depending on the difference in turn-on voltage of neighboring sub-pixels at the initial point when the voltage between the two electrodes exceeds the turn-on voltage. It can be.

Here, the turn-on voltage refers to the driving voltage applied to the organic light-emitting device at the time defined as light being emitted from one sub-pixel, and the gray scale is the minimum number of luminance units that the organic light-emitting device can express, or It refers to the level of each individual step. From the point where the turn-on voltage is applied, the gray level gradually increases as the driving voltage increases. In this specification, the level corresponding to the bottom 30% of the total gray scale of the organic light emitting device is referred to as low gray scale.

The organic light emitting display device having the patterned light emitting layer structure described above has different turn-on voltages for each sub-pixel due to differences in the organic light emitting layer. For example, the turn-on voltage for driving the red sub-pixel on which the red organic emission layer is disposed may have a smaller value than the turn-on voltage for driving the blue sub-pixel on which the blue organic emission layer is disposed.

As such, in a structure in which the turn-on voltages between neighboring sub-pixels are different from each other, when a sub-pixel with a large turn-on voltage is driven, light may be unintentionally generated from the adjacent pixels with a small turn-on voltage. You can. The reason is that the barrier through which current can flow is lower in a sub-pixel with a small turn-on voltage than in a sub-pixel with a large turn-on voltage, so the current leaked through the additional organic layer having a common structure is transmitted to the sub-pixel with a large turn-on voltage. Since light flows more easily to a sub-pixel with a smaller turn-on voltage than a sub-pixel, light can be generated from the sub-pixel with a small turn-on voltage even though no driving voltage is applied.

Moreover, when a sub-pixel is driven in a low gray scale, the luminance of the driven sub-pixel is low, so if light from a neighboring sub-pixel is emitted undesirably, color mixing of light may be more easily perceived by the user. . That is, at an initial point when the driving voltage applied to the organic light emitting device exceeds the turn-on voltage, color mixing between neighboring sub-pixels may be perceived more seriously.

In addition, when low current is applied to the red sub-pixel, green sub-pixel, and blue sub-pixel to implement low-gradation white light, the current leaks through the additional organic layer commonly disposed in all sub-pixels, resulting in the lowest current. A problem may occur in that the sub-pixel with the turn-on voltage emits light first and the brightest light. For example, if the sub-pixel with the lowest turn-on voltage is a red sub-pixel, a problem may occur in which the red sub-pixel emits the brightest light first when the organic light emitting display device is driven at a low gray level. there is. As a result, when implementing low-gradation white light, a redish phenomenon may occur in which reddish white light is emitted rather than pure white.

This current leakage phenomenon can become more serious as the temperature increases. Specifically, when an organic light emitting display device is driven at a high temperature, the leakage current increases as the movement of charge becomes relatively rapid, resulting in unwanted discharge in the sub-pixel with the lowest turn-on voltage, for example, the red sub-pixel. The problem of unintended light being emitted may further increase. As a result, the redish phenomenon may occur more seriously in the process of implementing white light.

The inventors of the present invention have invented an organic light emitting display device with a new structure and a method of manufacturing the same that can solve the above-described problem, that is, the problem of current leakage due to some organic layers being commonly disposed in all sub-pixels.

The problem to be solved by the present invention is to provide an organic light emitting display device and a manufacturing method thereof that minimize the phenomenon of unintended light emission from neighboring sub-pixels due to current leakage.

Another problem to be solved by the present invention is to provide an organic light emitting display device and a manufacturing method thereof that can improve luminance and reduce power consumption by emitting light only from targeted sub-pixels.

Another problem to be solved by the present invention is to provide an organic light emitting display device and a manufacturing method thereof in which organic layers having a common structure can be easily separated and arranged for each sub-pixel even by using a common mask.

Another problem to be solved by the present invention is to provide an organic light emitting display device capable of implementing pure white at low grayscale and a method of manufacturing the same.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

In order to achieve the above-described object, an organic light emitting display device according to an embodiment of the present invention includes a first pixel electrode disposed in a first sub-pixel of a substrate, and a second pixel disposed in a second sub-pixel of the substrate. It includes an electrode, a first common layer disposed on the first pixel electrode, a second common layer disposed on the second pixel electrode, and a dummy common layer disposed between the first sub-pixel and the second sub-pixel. The first common layer, the second common layer, and the dummy common layer are made of the same material and are separated from each other. In the organic light emitting display device according to an embodiment of the present invention, current leakage through a common layer configured to share a plurality of sub-pixel areas is reduced.

The organic light emitting display device according to an embodiment of the present invention further includes a first bank layer and a second bank layer disposed between the first pixel electrode and the second pixel electrode, wherein the first bank layer and the second bank layer Each of the second bank layers includes an undercut, and the dummy common layer may be disposed between the undercut of the first bank layer and the undercut of the second bank layer.

In the organic light emitting display device according to an embodiment of the present invention, the minimum gap inside the undercut of the first bank layer and the minimum gap inside the undercut of the second bank layer are each of the first common layer or the second common layer. It can have a value greater than the thickness of the layer.

The organic light emitting display device according to an embodiment of the present invention has a conductive layer disposed separately between the first pixel electrode and the second pixel electrode, and made of the same material as the first pixel electrode or the second pixel electrode. It further includes, wherein the undercut of the first bank layer and the undercut of the second bank layer are respectively located above both ends of the conductive layer, and the dummy common layer is disposed at the upper center of the conductive layer. You can.

The organic light emitting display device according to an embodiment of the present invention further includes a common bank layer disposed between the first pixel electrode and the second pixel electrode and a partition wall disposed on the common bank layer, the partition wall being It is composed of a first barrier rib having an inverse taper shape and a second barrier rib disposed on the first barrier rib, and the dummy common layer may be disposed on the second barrier rib.

In the organic light emitting display device according to an embodiment of the present invention, the first barrier rib may be made of a metallic material, and the second barrier rib may be made of a heat or UV curable material.

The organic light emitting display device according to an embodiment of the present invention further includes a common bank layer disposed between the first pixel electrode and the second pixel electrode, the common bank layer located close to the first pixel electrode. One side of and the other side of the common bank layer located close to the second pixel electrode each include an undercut, and the dummy common layer may be disposed on the common bank layer.

The organic light emitting display device according to an embodiment of the present invention further includes a common electrode commonly disposed in the first sub-pixel and the second sub-pixel, and the minimum gap inside the undercut of the common bank layer is the second sub-pixel. It may have a value greater than the thickness of the first common layer or the second common layer, and may have a value smaller than the distance between the common electrode and the first pixel electrode or the common electrode and the second pixel electrode.

In the organic light emitting display device according to an embodiment of the present invention, ends of the first pixel electrode and the second pixel electrode may not be covered by the common bank layer.

An organic light emitting display device according to an embodiment of the present invention includes a first bank layer disposed between the first pixel electrode and the second pixel electrode, and an overlapping arrangement on the first bank layer, the first bank It may further include a second bank layer having a width greater than that of the second bank layer, and the dummy common layer may be disposed on the second bank layer.

The organic light emitting display device according to an embodiment of the present invention further includes a common electrode commonly disposed in the first sub-pixel and the second sub-pixel, and extending from the top of the first pixel electrode to the first bank layer. The distance to the top surface of or the distance from the top surface of the second pixel electrode to the top surface of the first bank layer has a value greater than the thickness of the first common layer or the second common layer, and the distance between the common electrode and the second common layer is It may have a value smaller than one pixel electrode or the distance between the common electrode and the second pixel electrode.

In the organic light emitting display device according to an embodiment of the present invention, ends of the first pixel electrode and the second pixel electrode may not be covered by the first bank layer.

In order to achieve the above-described object, an organic light emitting display device according to another embodiment of the present invention includes a plurality of pattern electrodes, a common electrode disposed on the plurality of pattern electrodes, and a space between the plurality of pattern electrodes and the common electrode. and is disposed between the neighboring sub-pixels and a plurality of organic layers including at least one common layer having a structure separated for each neighboring sub-pixel to minimize current leakage to the neighboring sub-pixels, It includes a bank member having a structure that separates the common layer. Accordingly, the problem of color mixing between neighboring sub-pixels is reduced, thereby improving the display quality of the organic light emitting display device.

In the organic light emitting display device according to another embodiment of the present invention, the bank member includes a first bank layer and a second spaced apart from each other when viewed in cross section, between two neighboring pattern electrodes among the plurality of pattern electrodes. It includes two bank layers, and one side of the first bank layer and one side of the second bank layer facing the one side of the first bank layer each have an eaves shape that separates the common layer, and the eaves A portion of the common layer separated by shape may be disposed between the first bank layer and the second bank layer.

In the organic light emitting display device according to another embodiment of the present invention, the bank member is disposed on a common bank layer disposed between two neighboring patterns among the plurality of pattern electrodes, the common bank layer, and the common bank layer. a first partition having an inverse taper shape separating the layers and a second partition disposed on the first partition, wherein a portion of the common layer separated by the inverse taper shape is disposed on the second partition. You can.

In the organic light emitting display device according to another embodiment of the present invention, the bank member is disposed between two neighboring patterns among the plurality of pattern electrodes, and has an undercut on both sides to separate the common layer. A portion of the common layer comprising a layer and separated by the undercut may be disposed on the common bank layer.

In the organic light emitting display device according to another embodiment of the present invention, the bank member is disposed overlapping on a first bank layer and a first bank layer disposed between two neighboring patterns among the plurality of pattern electrodes. and a second bank layer having a side that protrudes more than the first bank layer, and a portion of the common layer separated by the protruding side of the second bank layer may be disposed on the second bank layer. there is.

In order to achieve the above-described object, a method of manufacturing an organic light emitting display device according to an embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode in each of the first sub-pixel and the second sub-pixel of the substrate. forming a bank member between the first pixel electrode and the second pixel electrode, and a first common layer located on the first pixel electrode and a second common layer located on the second pixel electrode. and simultaneously forming a dummy common layer located on the bank member.

In the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, forming the bank member includes forming a sacrificial layer between the first pixel electrode and the second pixel electrode, the first pixel electrode forming a first bank layer covering a pixel electrode and one end of the sacrificial layer and a second bank layer covering the second pixel electrode and the other end of the sacrificial layer; and forming the first bank layer and the second bank layer. The step of removing the sacrificial layer may be further included so that an undercut is formed on the side surface.

In the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, forming the bank member includes forming a common bank layer covering one end of the first pixel electrode and one end of the second pixel electrode. forming a first barrier material layer and a second barrier material layer on the first pixel electrode, the second pixel electrode, and the common bank layer, etching the second partition material layer to form the common bank layer. The method may further include forming a second barrier rib on the bank layer and etching the first barrier rib material layer using the second barrier rib as a mask to form a first barrier rib having an inverse taper shape.

In the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, forming the bank member includes forming a first sacrificial layer and a second sacrificial layer overlapping each of the first pixel electrode and the second pixel electrode. forming a layer, forming a common bank layer covering one end of the first sacrificial layer and one end of the second sacrificial layer, and forming an undercut on both sides of the common bank layer, the first sacrificial layer The method may further include removing the layer and the second sacrificial layer.

In the method of manufacturing an organic light emitting display device according to an embodiment of the present invention, forming the bank member includes forming a first bank material layer on the first pixel electrode and the second pixel electrode, In the first bank material layer, exposing an area A that overlaps the first pixel electrode and the second pixel electrode therebetween, forming a second bank material layer on the first bank material layer, the second In the bank material layer, exposing an area B that overlaps the area A of the first bank material layer and has a width smaller than the area A, and exposing the area B of the first bank material layer and the second bank material layer. The method may further include forming a first bank layer and a second bank layer having a width greater than that of the first bank layer by removing the B region.

Specific details of other embodiments are included in the detailed description and drawings.

The present invention has the effect of preventing neighboring sub-pixels from being driven together when driving a specific sub-pixel by separately arranging organic layers having a common structure for each sub-pixel. Accordingly, light is emitted only from the targeted sub-pixel, thereby improving the brightness and power consumption of the organic light emitting display device.

According to the present invention, organic layers having a common structure are arranged separately for each sub-pixel, thereby reducing the problem of color mixing between neighboring sub-pixels due to current leakage, thereby improving the display quality of the organic light emitting display device.

In the present invention, an organic layer having a common structure can be independently disposed on each of a plurality of sub-pixels using a common mask without a separate patterning process, thereby improving the display quality of the organic light emitting display device by improving the problem of color mixing between neighboring sub-pixels. There is an effect that can be improved.

In the present invention, organic layers with a common structure are arranged separately for each sub-pixel, so when implementing low-gradation white, unwanted light is emitted from the pixel with the lowest turn-on voltage due to current leakage, resulting in pure white light. It has the effect of solving problems that cannot be implemented.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

1 is a schematic cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention.
Figure 2 is a schematic cross-sectional view of an organic light emitting display device according to a second embodiment of the present invention.
Figure 3 is a flowchart for explaining a method of manufacturing an organic light emitting display device according to a first embodiment of the present invention.
4A to 4F are cross-sectional views of each step of the process for explaining the manufacturing method of the organic light emitting display device according to the first embodiment of the present invention.
Figure 5 is a flowchart for explaining a method of manufacturing an organic light emitting display device according to a second embodiment of the present invention.
6A to 6F are cross-sectional views of each step of the process for explaining a method of manufacturing an organic light emitting display device according to a second embodiment of the present invention.
Figure 7 is a schematic cross-sectional view of an organic light emitting display device according to a third embodiment of the present invention.
Figure 8 is a schematic cross-sectional view of an organic light emitting display device according to a fourth embodiment of the present invention.
FIG. 9 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to a third embodiment of the present invention.
10A to 10F are cross-sectional views of each step of the process for explaining a method of manufacturing an organic light emitting display device according to a third embodiment of the present invention.
FIG. 11 is a flowchart for explaining a method of manufacturing an organic light emitting display device according to a fourth embodiment of the present invention.
12A to 12F are cross-sectional views of each process step for explaining a method of manufacturing an organic light emitting display device according to a fourth embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

When an element or layer is referred to as “on” another element or layer, it includes instances where the other layer or other element is directly on top of or interposed between the other element and the other element.

Although first, second, etc. are used to describe various elements, these elements are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

Each feature of the various embodiments of the present invention can be combined or combined with each other, partially or entirely, and various technological interconnections and operations are possible, and each embodiment can be implemented independently of each other or together in a related relationship. It may be possible.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a schematic cross-sectional view of an organic light emitting display device 100 according to a first embodiment of the present invention. FIG. 1 shows an organic light emitting display device 100 having a patterned emission layer structure.

Referring to FIG. 1, the organic light emitting display device 100 includes a substrate 110, a buffer layer 120, a thin film transistor 130, a gate insulating layer 140, an interlayer insulating layer 142, an overcoating layer 144, First pixel electrode 152, second pixel electrode 154, conductive layer 156, first bank layer 162, second bank layer 164, first common layer 172, second common layer (174), a dummy common layer 176, a first organic emission layer 182, a second organic emission layer 184, and a common electrode 190.

The substrate 110 serves to support and protect various components of the organic light emitting display device 100. The substrate 110 may be made of an insulating material, for example, a material with flexibility, such as glass or a polyimide-based material.

Referring to FIG. 1 , the organic light emitting display device 100 or the substrate 110 of the organic light emitting display device 100 includes a plurality of sub-pixels SP1 and SP2 that are adjacent to each other. A sub-pixel is an area for displaying one color, and refers to the area of the smallest unit in which light is emitted, and may also be referred to as a sub-pixel area. In addition, a plurality of sub-pixels may be gathered to form a single pixel capable of expressing white light, for example, a red sub-pixel, a green sub-pixel, and A blue sub-pixel may be composed of one pixel. However, it is not limited to this, and various pixel designs are possible. In FIG. 1 , for convenience of explanation, only the first and second sub-pixels SP1 and SP2 that are adjacent to each other are shown. Each of the first sub-pixel SP1 and the second sub-pixel SP2 emits light of a different color, for example, one of red, green, and blue.

A buffer layer 120 is disposed on the substrate 110. The buffer layer 120 prevents moisture or impurities from penetrating through the substrate 110 and flattens the upper part of the substrate 110. However, the buffer layer 120 is not absolutely necessary. Whether or not the buffer layer 120 is formed is determined based on the type of substrate 110 or the type of thin film transistor 130 used in the organic light emitting display device 100. And, the buffer layer 120 may be formed of a transparent material.

As shown in FIG. 1 , the organic light emitting display device 100 includes a thin film transistor 130 and an organic light emitting device (ED) for each sub-pixel SP1 and SP2.

The thin film transistor 130 is disposed on the buffer layer 120 and supplies signals to the organic light emitting devices (ED1 and ED2). The thin film transistor 130 includes an active layer 131, a gate electrode 132, a source electrode 133, and a drain electrode 134. Specifically, the active layer 131 is formed on the buffer layer 120, and the gate insulating layer 140 is formed on the active layer 131 to insulate the active layer 131 and the gate electrode 132. In addition, a gate electrode 132 is formed on the gate insulating layer 140 to overlap the active layer 131, and an interlayer insulating layer 142 is formed on the gate electrode 132 and the gate insulating layer 140. , a source electrode 133 and a drain electrode 134 are formed on the interlayer insulating layer 142. The source electrode 133 and the drain electrode 134 are electrically connected to the active layer 131.

In this specification, the overlapping of two objects means that at least a portion of them overlaps regardless of the presence or absence of another object in the hierarchical relationship between the two objects, and may also be referred to by various other names. .

In this specification, for convenience of explanation, among the various thin film transistors 130 that may be included in the organic light emitting display device 100, the driving thin film transistor 130 connected to the pixel electrodes 152 and 154 of the organic light emitting elements ED1 and ED2 is used. Only shown. Each sub-pixel (SP1, SP2) may further include a switching thin film transistor or capacitor for driving the organic light-emitting elements (ED1, ED2). Additionally, in this specification, the thin film transistor 130 is described as having a coplanar structure, but a thin film transistor 130 with an inverted staggered structure may also be used. In addition, in the drawing, a structure is shown in which the pixel electrodes 152 and 154 of the organic light-emitting devices (ED1 and ED2) are connected to the source electrode 133 of the thin film transistor 130. However, depending on the design, the organic light-emitting devices (ED1, The pixel electrodes 152 and 154 of ED2) may be connected to the drain electrode 134 of the thin film transistor 130.

An over coating layer 144 is disposed on the thin film transistor 130. The overcoating layer 144 is a layer that planarizes the upper part of the substrate 110 and functions as a planarization film. The overcoating layer 144 is a contact for electrically connecting the source electrode 133 of the thin film transistor 130, the first pixel electrode 152, and the second pixel electrode 154 in each sub-pixel (SP1, SP2). Includes hall.

The organic light emitting elements (ED1, ED2) are disposed on the overcoating layer 144 and include pixel electrodes 152 and 154, common layers 172 and 174, organic light emitting layers 182 and 184, and common electrode 190. do. Referring to FIG. 1, the first organic light-emitting device (ED1) is located in the first sub-pixel (SP1), the second organic light-emitting device (ED2) is located in the second sub-pixel (SP2), and the first organic light-emitting device (ED1) is located in the first sub-pixel (SP1). (ED1) and the second organic light emitting device (ED2) are devices that emit light of different colors. The first organic light emitting device (ED1) includes a first pixel electrode 152, a first common layer 172, a first organic light emitting layer 182, and a common electrode 190, and the second organic light emitting device (ED2) includes a second pixel electrode 154, a second common layer 174, a second organic emission layer 184, and a common electrode 190. The first organic light emitting device (ED1) and the second organic light emitting device (ED1) have a turn-on voltage (turn-on) depending on the materials of the first organic light emitting layer 182 and the second organic light emitting layer 184 that emit different colors. on voltage) may be configured differently. For example, when the first organic light-emitting layer 182 is a layer that emits red light and the second organic light-emitting layer 184 is a layer that emits blue light, the turn-on of the first organic light-emitting device (ED1) The voltage may have a value smaller than the turn-on voltage of the second organic light emitting device ED2. However, it is not necessarily limited to this, and the turn-on voltage may vary depending on the material of the organic emission layers 182 and 184. For example, depending on the composition of the organic light-emitting layers 182 and 184, the turn-on voltage of an organic light-emitting device including an organic light-emitting layer that emits blue light may vary from that of an organic light-emitting device including an organic light-emitting layer that emits red light. It may be lower than the turn-on voltage of the light emitting device.

The first pixel electrode 152 and the second pixel electrode 154 are disposed on the overcoating layer 144. The first pixel electrode 152 and the second pixel electrode 154 serve to apply voltage to the first organic light-emitting layer 182 and the second organic light-emitting layer 184, respectively. As shown in FIG. 1, the first pixel electrode 152 and the second pixel electrode 154 are arranged separately for each sub-pixel SP1 and SP2. Specifically, the first pixel electrode 152 is disposed in the first sub-pixel SP1, and the second pixel electrode 154 is disposed in the second sub-pixel SP2. Since the first pixel electrode 152 and the second pixel electrode 154 are disposed separately for each sub-pixel (SP1, SP2), they may be referred to as a patterned electrode or an electrode with a patterned structure. there is.

Here, the layer having a pattern structure can be formed using a mask with openings for each sub-pixel, for example, a fine metal mask (FMM), and has a separate structure for each sub-pixel. In other words, a layer with a pattern structure has a disconnected structure from one sub-pixel to neighboring sub-pixels, without being connected to each other.

Each of the first pixel electrode 152 and the second pixel electrode 154 is an electrode that supplies holes to the organic light emitting layers 182 and 184, and may be made of a transparent conductive material with a high work function. Here, the transparent conductive material may include indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). When the organic light emitting display device 100 is driven by the top emission method as shown in FIG. 1, each of the first pixel electrode 152 and the second pixel electrode 154 may further include a reflector. In Figure 1, for convenience of illustration, the first pixel electrode 152 and the second pixel electrode 154 are expressed as one layer.

On the overcoating layer 144, a conductive layer 156 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2. The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 are separated from each other. The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 may be disposed simultaneously in the same process. As a result, the first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 may be made of the same material and have the same thickness.

The first bank layer 162 and the second bank layer 164 partition the sub-pixels SP1 and SP2, and the first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 A portion of each upper surface is exposed. Specifically, as shown in FIG. 1, the first bank layer 162 is disposed to cover the edge of the first pixel electrode 152 and the edge of the conductive layer 156, and the conductive layer 156 The second bank layer 164 may be disposed to cover the edge of and the edge of the second pixel electrode 154. The first bank layer 162 and the second bank layer 164 are located between the first sub-pixel (SP1) and the second sub-pixel (SP2) or between the first pixel electrode 152 and the second pixel electrode 154. , When viewed in cross section, they are arranged spaced apart from each other. The first bank layer 162 and the second bank layer 164 are made of a transparent organic insulating material, for example, polyimide, photo acryl, benzocyclobutene (BCB), or black. It may be made of a material such as black resin.

The first bank layer 162 includes an undercut 163 formed on the edge of the conductive layer 156, and the second bank layer 164 also includes an undercut 165 formed on the edge of the conductive layer 156. do. In this specification, undercut refers to a concave portion formed along the boundary of the bank layer. In other words, as shown in FIG. 1, the lower area of the side of the first bank layer 162 that overlaps the conductive layer 156 and the lower area of the side of the second bank layer 164 are depressed inward. You can have Alternatively, the upper area of the side of the first bank layer 162 and the upper area of the side of the second bank layer 164 may have a shape that protrudes toward the center of the conductive layer 156. Alternatively, the side surfaces of the first bank layer 162 and the second bank layer 164 that overlap the conductive layer 156 may have an eaves shape when viewed in cross section. Alternatively, one side of the first bank layer 162 and one side of the second bank layer 164 facing the one side of the first bank layer 162 may each have an eaves shape. The undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 may have a symmetrical structure with respect to the dummy common layer 176. For example, as shown in Figure 1, the cross section of the undercut 163 of the first bank layer 162 is " "Having a shape, the cross section of the undercut 165 of the second bank layer 164 is " It may have a symmetrical "L" shape. The structure consisting of the first bank layer 162 and the second bank layer 164 may be referred to as a bank member.

A first common layer 172 is disposed on the first pixel electrode 152, and a second common layer 174 is disposed on the second pixel electrode 154. The first common layer 172 extends to the top of the first bank layer 162, and the second common layer 174 extends to the top of the second bank layer 164. As shown in FIG. 1, the first common layer 172 and the second common layer 174 are arranged separately for each sub-pixel. Specifically, the first common layer 172 is disposed in the first sub-pixel SP1, and the second common layer 174 is disposed in the second sub-pixel SP2. A dummy common layer 176 is disposed at the upper center of the conductive layer 156. The dummy common layer 176 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2 and is separated from the first common layer 172 and the second common layer 174.

In the organic light emitting display device 100 according to the first embodiment of the present invention, the first common The layer 172 and the second common layer 174 may be disposed separately from each other even in a process using a common mask. In addition, a dummy common layer 176 separated from the first common layer 172 and the second common layer 174 by the eaves shape of the first bank layer 162 and the second bank layer 164 is formed. It may be placed between the first bank layer 162 and the second bank layer 164. Specifically, the first common layer 172 and the second common layer 174 are formed using a common mask on the first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156. As the organic material for this is deposited on the entire surface, the lower regions of the sides of the first bank layer 162 and the second bank layer 164 that overlap the conductive layer 156 have a depressed shape, so that step coverage (step A phenomenon occurs in which organic materials with low coverage are not connected to each other and are broken. Here, step coverage means that a film of uniform thickness can be deposited on the bottom and walls of a trench or hole with a large aspect ratio, such as a reverse taper. Accordingly, the organic material with low step coverage penetrates into the lower regions of the sides of the first bank layer 162 and the second bank layer 164 that overlap the conductive layer 156, and is not deposited and is broken. That is, the side surfaces of the first bank layer 162 and the second bank layer 164 overlapping the conductive layer 156 are configured to have an eaves shape, so that a portion of the organic material can be formed into the sub-pixels SP1 and SP1 without a separate patterning process. SP2) It can be formed to be disconnected between them. At this time, the organic material disposed on the first pixel electrode 152 and the first bank layer 162 becomes the first common layer 172, and the organic material disposed on the second pixel electrode 154 and the second bank layer 164 becomes the first common layer 172. The organic material disposed on becomes the second common layer 174, and the organic material disposed on the conductive layer 156 between the first bank layer 162 and the second bank layer 164 becomes the first common layer ( 172) and a dummy common layer 176 separated from the second common layer 174.

The first common layer 172 and the second common layer 174 are additional organic layers disposed between the pixel electrodes 152 and 154 and the organic light emitting layers 172 and 174, and are formed through holes of the organic light emitting elements ED1 and ED2. It may be a hole injection layer or a p-type hole transport layer doped with a p-type dopant to facilitate the movement of the layer. More specifically, each of the first common layer 172 and the second common layer 174 may serve to facilitate injection of holes into each of the first organic light-emitting layer 182 and the second organic light-emitting layer 184. there is.

As previously mentioned, the first common layer 172, the second common layer 174, and the dummy common layer 176 are made of the same material. For example, the first common layer 172, the second common layer 174, and the dummy common layer 176 may include the same host material and the same p-type dopant. Here, the host materials include NPD (N,N-dinaphthyl-N,N'-diphenylbenzidine) and TPD (N,N'-bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine). , s-TAD(2,2',7,7'-tetrakis(N,N-diphenylamino)-9,9-spirofluorene) and MTDATA(4,4',4"-Tris(N-3-methylphenyl-N -phenyl-amino)-triphenylamine), etc., and p-type dopants include metal oxide, tetrafluoro-tetracyanoquinodimethane (F4-TCNQ), hexanitrile, hexaazatriphenylene, FeCl ₃ , FeF ₃ and SbCl ₅ may be included, but are not necessarily limited thereto.

The first common layer 172, the second common layer 174, and the dummy common layer 176 may have the same thickness. For example, the first common layer 172, the second common layer 174, and the dummy common layer 176 may all have a thickness of 100 Å to 1500 Å, but are not necessarily limited thereto.

A first common layer 172 disposed in the first sub-pixel SP1, a second common layer 174 disposed in the second sub-pixel SP2, and the first sub-pixel SP1 and the second sub-pixel ( This means that the dummy common layer 176 disposed between SP2) is made of the same material, meaning that the first common layer 172, the second common layer 174, and the dummy common layer 176 are the same using a common mask. It can be seen that they were formed simultaneously during the process. The first common layer 172, the second common layer 174, and the dummy common layer 176 may be referred to as common layers.

The first organic emission layer 182 is disposed on the first common layer 172, and the second organic emission layer 184 is disposed on the second common layer 174. As shown in FIG. 1, the first organic emission layer 182 and the second organic emission layer 184 are arranged separately for each sub-pixel. Specifically, the first organic emission layer 182 is disposed in the first sub-pixel SP1, and the second organic emission layer 184 is disposed in the second sub-pixel SP2. The first organic light-emitting layer 182 and the second organic light-emitting layer 184 each serve to emit light by receiving a voltage, and the first organic light-emitting layer 182 and the second organic light-emitting layer 184 have different colors. emits light. Since the first organic emission layer 182 and the second organic emission layer 184 have a pattern structure arranged separately for each sub-pixel SP1 and SP2, they may also be referred to as a patterned emission layer. .

A common electrode 190 is disposed on the first organic emission layer 182, the second organic emission layer 184, and the dummy common layer 176. The common electrode 190 is commonly disposed in the first sub-pixel (SP1) and the second sub-pixel (SP2). The common electrode 190 is connected to a separate Vss voltage wire to apply the same voltage to the first organic emission layer 182 and the second organic emission layer 184. The common electrode 190 is an electrode that supplies electrons, and is made of a metallic material with a relatively low work function, such as silver (Ag), titanium (Ti), aluminum (Al), molybdenum (Mo), or It may be composed of an alloy of silver (Ag) and magnesium (Mg). In FIG. 1, the common electrode 190 is shown as being commonly disposed in the first sub-pixel (SP1) and the second sub-pixel (SP2). However, the two common electrodes 190 are disposed in the first sub-pixel (SP1) and the second sub-pixel (SP2). It is also possible to be separately disposed in the two sub-pixels (SP2) and electrically connected through the conductive layer 156.

As mentioned earlier, a common structure in which additional organic layers such as a hole injection layer or a p-type hole transport layer disposed between the pixel electrodes 152 and 154 and the organic light emitting layers 172 and 174 share a plurality of sub-pixels (SP1 and SP2). (common structure), when current is applied to drive a specific sub-pixel, a current leakage phenomenon may occur in which current flows to other neighboring sub-pixels through an additional organic layer having a common structure. Specifically, the additional organic layer disposed between the pixel electrodes 152 and 154 and the organic emission layers 172 and 174 may be commonly disposed in the first sub-pixel SP1 and the second sub-pixel SP2. Additionally, the additional organic layer may have significantly higher mobility due to the p-type dopant added to facilitate the movement of holes in the organic light-emitting devices ED1 and ED2. Accordingly, when current flows vertically between the first pixel electrode 152 and the common electrode 190 so that light is emitted from the first organic light-emitting layer 182 of the first sub-pixel SP1, the mobility is high. Current may leak horizontally from the additional organic layer, causing current to flow into the second organic light-emitting layer 184, a so-called current leakage phenomenon. The current leakage phenomenon causes light to also be emitted from the neighboring second sub-pixel (SP2) when the first sub-pixel (SP1) is driven, thereby lowering the brightness of the organic light emitting display device 100 and increasing power consumption. It is becoming the main cause. That is, this current leakage phenomenon causes other unwanted sub-pixels to emit light, causing color mixing between the sub-pixels SP1 and SP2 and lowering the luminance of the driven sub-pixels, thereby reducing the display quality of the organic light emitting display device 100. This may lead to degradation and increase in power consumption.

Moreover, when a low current is applied to both the first organic emission layer 182 and the second organic emission layer 184 to implement low grayscale white, the first sub-pixel SP1 and the second sub-pixel SP2 Current leaks through a commonly disposed additional organic layer, for example, a hole injection layer or a p-type hole transport layer, so that the organic light-emitting layer has a low turn-on voltage among the first organic light-emitting layer 182 and the second organic light-emitting layer 182. , for example, a phenomenon may occur in which the first organic light-emitting layer 182, which emits red light, emits light first and the brightest light. In this case, a redish phenomenon may occur in which pure white light is not realized at low gray levels and reddish white light is realized.

In addition, this current leakage phenomenon occurs when, in a structure in which the turn-on voltage between neighboring sub-pixels is configured to be different, a pixel with a relatively large turn-on voltage among two pixels is driven. The problem of unwanted light being emitted may become more serious in other disposed pixels, that is, pixels with relatively low turn-on voltages. For example, in a structure in which the turn-on voltage of the first organic light-emitting device (ED1) has a smaller value than the turn-on voltage of the second organic light-emitting device (ED2), driving the second organic light-emitting device (ED2) When a driving voltage is applied to the second sub-pixel SP2, the turn-on voltage is low through an additional organic layer having a common structure, for example, a hole injection layer or a p-type hole transport layer, and the second organic light-emitting device ( Current may leak into the first organic light emitting device (ED1), which has a lower barrier for current flow than ED2). As a result, the first organic light emitting element (ED1) of the first sub-pixel (SP1) to which no driving voltage is applied may emit light undesirably, causing a more serious color mixing problem between neighboring sub-pixels (SP1, SP2). .

In the organic light emitting display device 100 according to the first embodiment of the present invention, an additional organic layer having a common structure between the pixel electrodes 152 and 154 and the organic light emitting layers 182 and 184, for example, a hole injection layer or Since the p-type hole transport layer is independently disposed in each of the plurality of sub-pixels SP1 and SP2, current leakage to other unwanted sub-pixels through the hole injection layer or the p-type hole transport layer can be prevented. That is, the additional organic layer having a common structure between the pixel electrodes 152 and 154 and the organic light emitting layers 182 and 184 is formed by forming an undercut 163 of the first bank layer 162 and an undercut of the second bank layer 164 ( 165), a first common layer 172 and a second common layer 174 are disposed in each sub-pixel SP1 and SP2. Therefore, the problem of light being emitted from an unwanted sub-pixel due to current leakage, and the problem of not being able to implement low-gray pure white, for example, the redish phenomenon, can be effectively solved. .

Moreover, in the organic light emitting display device 100 according to the first embodiment of the present invention, the undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 provide a separate The first common layer 172 and the second common layer 174 can be easily separated and disposed in the first sub-pixel SP1 and the second sub-pixel SP2 by using a common mask without a patterning process. Accordingly, the process time for arranging the first common layer 172 and the second common layer 174 can be shortened, and process costs can be reduced.

The minimum gap W1 inside the undercut 163 of the first bank layer 162 and the minimum gap W2 inside the undercut 165 of the second bank layer 164 are each of the first common layer 172 and The thickness may be greater than the thickness of the first common layer 172 or the second common layer 174 so that the second common layer 174 can be smoothly separated. For example, the minimum gap (W1) inside the undercut 163 of the first bank layer 162 and the minimum gap (W2) inside the undercut 165 of the second bank layer 164 may each be 200 Å to 2500 Å. there is. Here, the minimum spacing (W1, W2) inside the undercuts 163 and 165 of the bank layers 162 and 164 is from the top of the conductive layer 156 to the inside of the undercuts 163 and 165, as shown in FIG. refers to the distance to the upper surface of . In addition, according to the design, the minimum gap W1 inside the undercut 163 of the first bank layer 162 and the minimum gap W2 inside the undercut 165 of the second bank layer 164 are each a common electrode ( 190) may be desirable to have a value that prevents separation. The minimum gap W1 inside the undercut 163 of the first bank layer 162 and the minimum gap W2 inside the undercut 165 of the second bank layer 164 are outside the step coverage of the common electrode 190. If the value is too large, a part of the common electrode 190 may be broken, which may cause a problem in which a normal driving voltage cannot be applied to a specific sub-pixel.

The organic light emitting devices ED1 and ED2 may further include a hole transporting layer between the common layers 172 and 174 and the organic light emitting layers 182 and 184. Like the common layers 172 and 174, the hole transport layer may be arranged in a common structure to share a plurality of sub-pixels SP1 and SP2. Alternatively, in order to optimize the micro-cavity distance of the organic light emitting elements (ED1 and ED2) according to the characteristics of the organic light emitting layers (182, 184) arranged for each sub pixel (SP1, SP2), the sub pixel (SP1, SP2) SP1, SP2) may be arranged in a patterned structure with different thicknesses. In a structure in which the hole transport layer is arranged in a common structure, at least a portion of the hole transport layer, like the common layers 172 and 174, is sub-layered by the undercuts 163 and 165 of the bank layers 162 and 164 without a separate patterning process. They may be arranged separately for each pixel (SP1, SP2). In this case, between the neighboring sub-pixels SP1 and SP2, like the dummy common layer 176, a dummy hole transport layer, which is a hole transport layer remaining after being separated by the bank layers 162 and 164, is common with the conductive layer 156. It may be further disposed between the electrodes 190.

The organic light emitting devices ED1 and ED2 may further include an electron transporting layer or an electron injecting layer between the organic light emitting layers 182 and 184 and the common electrode 190.

In the first embodiment of the present invention, the organic light emitting display device 100 having a patterned emission layer structure is described, but the structure according to the first embodiment of the present invention can also be applied to an organic light emitting display device having a common emission layer structure. possible. This is explained in detail as follows.

An organic light emitting display device having a common light emitting layer structure may have a structure in which a plurality of organic light emitting layers for emitting white light, for example, a blue organic light emitting layer and a yellow organic light emitting layer, are stacked between a pixel electrode and a common electrode. Additionally, additional organic layers such as an injecting layer and a transporting layer may be disposed between the two electrodes to improve the characteristics of the organic light-emitting device. A plurality of organic layers included in an organic light emitting display device with a common light emitting layer structure are stacked in the same structure for all pixels without a pixel-specific pattern using a common mask, and the organic light emitting elements placed in each sub-pixel emit white light equally. do. When an organic light emitting display device with a common light emitting layer structure is driven, current leaks through at least some of the plurality of organic layers, causing a problem in which not only the sub-pixel to which the driving voltage is applied but also other sub-pixels arranged adjacently emit light unnecessarily. It can happen. For example, an organic light emitting display device having a common light emitting layer structure may further include a charge generation layer (carrier generation layer) disposed between the organic light emitting layers and supplying charges to each organic light emitting layer. In this case, a problem may occur in which current leaks to an undesired sub-pixel through a charge generation layer arranged to share a plurality of sub-pixels.

In this structure, the bank layers 162 and 164 including the undercuts 163 and 165 described in the first embodiment of the present invention are disposed between the neighboring sub-pixels SP1 and SP2, thereby creating a charge generation layer. The plurality of sub-pixels (SP1, SP2) can be configured not to be shared, that is, arranged separately for each sub-pixel (SP1, SP2). At this time, the minimum spacing (W1, W2) inside the undercuts 163 and 165 of the bank layers 162 and 164 is configured to have a larger value than the distance from the pixel electrode to the charge generation layer, so that the charge generation layer is a sub-pixel. The stars can be separated smoothly.

That is, the minimum spacing (W1, W2) inside the undercuts (163, 165) of the bank layers (162, 164) is configured to have a larger value than the distance from the pixel electrode to the organic layer to be separated for each sub-pixel, depending on the design. As a result, organic layers that may cause current leakage can be separated and arranged for each sub-pixel without a separate patterning process. Accordingly, the problem of deterioration in display quality of the organic light emitting display device due to color mixing between neighboring sub-pixels can be improved.

Depending on the design, the minimum spacing (W1, W2) inside the undercuts (163, 165) of the bank layers (162, 164) is a value greater than the distance from the pixel electrode to the organic layer to be separated for each sub-pixel, and at the same time, the common electrode (190) ) may have a value such that the bank layers 162 and 164 are not separated by the undercuts 163 and 165.

FIG. 2 is a schematic cross-sectional view of an organic light emitting display device 200 according to a second embodiment of the present invention.

Compared to the organic light emitting display device 100 of FIG. 1, the organic light emitting display device 200 of FIG. 2 includes a common bank layer 260 instead of the first bank layer 162 and the second bank layer 164. Configuration, the partition 266 is disposed on the common bank layer 260, and the corresponding first common layer 272, the second common layer 274, the dummy common layer 276, and the first organic light emitting layer ( 282), only the arrangement of the second organic light emitting layer 284 and the common electrode 290 is different, and the remaining configurations are the same, so overlapping descriptions will be omitted. That is, for convenience of explanation, detailed descriptions of components that are the same or corresponding to those of the previous embodiment will be omitted.

Referring to FIG. 2 , the organic light emitting display device 200 according to the second embodiment of the present invention includes a common bank layer 260 and a partition wall 266.

The common bank layer 260 partitions the sub-pixels SP1 and SP2 and exposes a portion of the upper surface of each of the first and second pixel electrodes 152 and 154. Specifically, as shown in FIG. 2, the common bank layer 260 may be disposed to cover the edges of the first pixel electrode 152 and the edges of the second pixel electrode 154. The common bank layer 260 is disposed between the first sub-pixel (SP1) and the second sub-pixel (SP2). The common bank layer 260 may be made of a transparent organic insulating material or a black material.

A partition 266 is disposed on the common bank layer 260. The partition wall 266 serves to disconnect the first common layer 272 and the second common layer 274. In other words, the first common layer 272 and the second common layer 274 may be separated and arranged for each sub-pixel SP1 and SP2 by a partition 266. The partition walls 266 may be arranged in a mesh structure over the entire surface of the substrate 110 . As shown in FIG. 2, the partition wall 266 may be composed of a first partition wall 267 and a second partition wall 269 disposed on the first partition wall 267.

The first partition 267 may have a reverse taper shape. As shown in FIG. 2, the lower surface of the first barrier rib 267 is in contact with a partial area of the common bank layer 260, and the cross-sectional area of the first barrier rib 267 increases as it moves away from the common bank layer 260. , the area of the upper surface of the first partition wall 267 may be larger than the area of the lower surface of the first partition wall 267 or the lower surface of the partition wall 266. Since the first partition 267 has a reverse taper shape, the first common layer 272 and the second common layer 274 can be arranged separately even when a common mask is used. The first partition 267 may be made of a soft metallic material, for example, molybdenum (Mo). The first partition 267 may have a thickness of 200Å to 5000Å, but is not necessarily limited thereto.

A second partition wall 269 is disposed on the first partition wall 267. When processing the first partition 267 into a reverse taper shape, the second partition 269 may serve as a mask disposed on the first partition 267. The second partition 269 may be made of a heat or ultraviolet (UV) curable material. For example, the second partition 269 may be made of polyimide, a thermosetting material. The second partition 269 may have a thickness of 1㎛ to 2.5㎛, but is not necessarily limited thereto. A structure consisting of a common bank layer 260 and a partition wall 266 may be referred to as a bank member.

The first common layer 272 and the second common layer 274 are disposed to extend to the top of the common bank layer 260. As shown in FIG. 2, the first common layer 272 and the second common layer 274 are arranged and separated for each sub-pixel SP1 and SP2 by a partition 266.

A dummy common layer 276 made of the same material as the first common layer 272 and the second common layer 274 is disposed on the partition wall 266. Specifically, the dummy common layer 276 separated by the reverse taper shape of the first barrier rib 267 is disposed on the second barrier rib 269. The dummy common layer 276 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2 and is separated from the first common layer 272 and the second common layer 274.

The common electrode 290 is disposed on the first organic emission layer 282 and the second organic emission layer 284. The common electrode 290 is disposed in common in the first sub-pixel SP1 and the second sub-pixel SP2, that is, so that it can be deposited along the side of the first partition 267, which has an inverse taper shape. The electrode 290 may include a layer of material having excellent step coverage. For example, the common electrode 290 is made of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). May include layers.

In the organic light emitting display device 200 according to the second embodiment of the present invention, the first common layer 272 and the second common layer 274 are formed by the partition wall 266 disposed on the common bank layer 260. can be easily arranged separately for each sub-pixel (SP1, SP2) even in a process using a common mask. Specifically, the first common layer 272 and the second common layer are formed using a common mask on the first pixel electrode 152, the second pixel electrode 154, the common bank layer 260, and the partition wall 266. In the process of depositing the organic material to form the layer 274 on the entire surface, the reverse taper shape of the first partition 267 causes the organic materials with low step coverage to be disconnected from each other and are disconnected. That is, the organic material with low step coverage cannot be deposited to the reverse-tapered side of the partition 266 and is broken off, so a portion of the organic material may be separated between the sub-pixels SP1 and SP2. At this time, the organic material disposed on the first pixel electrode 152 and the common bank layer 260 becomes the first common layer 272, and is disposed on the second pixel electrode 154 and the common bank layer 260. The organic material disposed on the partition 266 becomes the second common layer 274, and the organic material disposed on the partition 266 becomes a dummy common layer 276 separated from the first common layer 272 and the second common layer 274. do.

Accordingly, since the first common layer 272 and the second common layer 274 are arranged separately for each sub-pixel (SP1, SP2) without a separate patterning process, current leaks to neighboring sub-pixels, causing unwanted sub-pixels. The problem of light being emitted from a pixel can be improved.

The second embodiment of the present invention can also be applied to an organic light emitting display device having a common light emitting layer structure. Specifically, by disposing the common bank layer 260 and the partition wall 266 described in the second embodiment of the present invention between neighboring sub-pixels SP1 and SP2, an organic layer that causes current leakage like a charge generation layer can be separated and arranged for each sub-pixel (SP1, SP2) without a separate patterning process. Accordingly, the color mixing problem between neighboring sub-pixels can be improved, thereby improving the display quality of the organic light emitting display device.

FIG. 3 is a flowchart for explaining a manufacturing method of the organic light emitting display device 100 according to the first embodiment of the present invention. 4A to 4F are cross-sectional views of each step of the process for explaining the manufacturing method of the organic light emitting display device 100 according to the first embodiment of the present invention. In describing this embodiment, for convenience of explanation, detailed description of components that are the same as or correspond to the previously described embodiment will be omitted.

Referring to FIG. 3, the manufacturing method of the organic light emitting display device 100 according to the first embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate, and forming the first pixel electrode and the second pixel electrode. Forming a conductive layer between the pixel electrodes (S310), forming a sacrificial layer on the conductive layer that at least partially overlaps the conductive layer (S320), and forming a first layer covering one end of the first pixel electrode and the sacrificial layer. Forming a second bank layer covering the other end of the bank layer, the second pixel electrode, and the sacrificial layer (S330), forming an undercut on the side of the first bank layer and the side of the second bank layer that overlaps the conductive layer. , removing the sacrificial layer (S340), the first common layer located on the first pixel electrode, the second common layer located on the second pixel electrode, and the first bank layer and the second bank layer located between the first and second bank layers. It includes simultaneously forming a dummy common layer (S350) and forming a common electrode on the first common layer, the second common layer, and the dummy common layer (S360).

First, referring to FIG. 4A, a buffer layer 120, a thin film transistor 130, a gate insulating layer 140, an interlayer insulating layer 142, and an overcoating layer 144 are formed on the substrate 100.

Next, a first pixel electrode 152 and a second pixel electrode 154 are formed on the substrate 110, and a conductive layer 156 is formed between the first pixel electrode 152 and the second pixel electrode 154. Form (S310). Specifically, the first pixel electrode 152 is formed on the first sub-pixel SP1 of the substrate 110, the second pixel electrode 154 is formed on the second sub-pixel SP2, and the first pixel electrode 154 is formed on the second sub-pixel SP2. A conductive layer 156 is formed between the pixel electrode 152 and the second pixel electrode 154. The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 are formed simultaneously in the same process. A patterned mask may be used so that the first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 are disposed separately from each other. The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 may be made of the same material.

Next, referring to FIG. 4B, a sacrificial layer 461 that at least partially overlaps the conductive layer 156 is formed on the conductive layer 156 (S320). The sacrificial layer 461 may be made of a soft metallic material, for example, molybdenum (Mo), but is not limited thereto. The thickness of the sacrificial layer 461 may be greater than the thickness of the first common layer 172 or the second common layer 174 formed later, and may be disposed to have a thickness of, for example, 200Å to 2500Å. there is. That is, the thickness of the sacrificial layer 461 is equal to the minimum gap W1 inside the undercut 163 of the first bank layer 162 and the minimum gap inside the undercut 165 of the second bank layer 164 described in FIG. (W2) can be determined.

The sacrificial layer 461 may be disposed between the first sub-pixel (SP1) and the second sub-pixel (SP2) using a patterned mask. That is, after depositing the material forming the sacrificial layer 461 on the first pixel electrode 152, the conductive layer 156, and the second pixel electrode 154, the material forming the sacrificial layer 461 is deposited on the metal layer 156 using a patterned mask. All parts except for the part overlapping with the metal layer 461 can be removed through an etching process. At this time, the sacrificial layer 461 and the conductive layer 156 may be made of materials with different etching selectivity.

Next, referring to FIG. 4C, the first bank layer 162, the second pixel electrode 154, and the sacrificial layer 461 cover one edge of the first pixel electrode 152 and the sacrificial layer 461. ) to form a second bank layer 164 covering the other end (S330). The first bank layer 162 and the second bank layer 164 are made of the same material and can be formed simultaneously through the same process.

Next, referring to FIG. 4D, a sacrificial layer ( 461) is removed (S340). Since the etching selectivity of the sacrificial layer 461 and the conductive layer 156 are different from each other, an etchant with a specific etching selectivity suitable for the sacrificial layer 461 can be used to affect other components such as the conductive layer 156. It can be removed by etching without damaging it. At this time, the etchant may be composed of, for example, an aqueous sulfuric acid (H ₂ SO ₄ ) solution, an aqueous nitric acid (HNO ₃ ) solution, an aqueous phosphoric acid (H ₃ PO ₄ ) solution, or a combination thereof.

Next, as shown in FIG. 4E, a first common layer 172 located on the first pixel electrode 152, a second common layer 174 located on the second pixel electrode 154, and The dummy common layer 176 located between the first bank layer 162 and the second bank layer 164 is formed simultaneously (S350). The first common layer 172, the second common layer 174, and the dummy common layer 176 may be formed simultaneously in the same process. Specifically, the first common layer 172, the second common layer 174, and the dummy common layer 176 may be simultaneously disposed using a thermal evaporation method using one common mask. At this time, the organic material constituting the first common layer 172, the second common layer 174, and the dummy common layer 176 is the first pixel electrode 152, a portion of the first bank layer 162, and the first common layer 176. 2 It is deposited only on the pixel electrode 154, a part of the second bank layer 164, and a part of the conductive layer 156, and the undercut 163 of the first bank layer 162 and the second bank layer 164 It does not reach the conductive layer 156 along the undercut 165 of . That is, the organic material with low step coverage has an undercut 163 formed on the side of the first bank layer 162 and a side of the second bank layer 164 that overlaps the conductive layer 156. It penetrates to the undercut 165 and is not deposited and is broken. As a result, the first common layer 172 and the second common layer 174 are patterned separately due to the undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164. Even without a process, the sub-pixels (SP1, SP2) can be separated and arranged.

Next, referring to FIG. 4F, a common electrode 190 is formed on the first common layer 172, the second common layer 174, and the dummy common layer 176 (S360). More specifically, the first organic light emitting layer 182 is formed on the first common layer 172 of the first sub-pixel SP1, and the second common layer 174 is formed on the second sub-pixel SP2. 2 Form the organic light emitting layer 184. The first organic emission layer 182 and the second organic emission layer 184 emit different colors, and the pattern is deposited using a mask with openings for each sub-pixel (SP1, SP2), for example, a fine metal mask (FMM). It can be. Afterwards, the common electrode 190 is disposed on the first organic emission layer 182, the second organic emission layer 184, and the dummy common layer 176. The common electrode 190 can be formed using a sputtering method using a common mask, and can be arranged to be connected or extended from one sub-pixel (SP1) to the neighboring sub-pixel (SP2) without a break.

In the method of manufacturing the organic light emitting display device 100 according to the first embodiment of the present invention, the sacrificial layer 461, the first bank layer 162, and the second bank layer 164 are sequentially disposed and then By a simple process of etching the layer 461, the undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 can be easily formed. And, by the undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164, the first common layer 172 and the first common layer 172 are formed using a common mask without a separate patterning process. 2 The common layer 174 can be stably disposed separately for each sub-pixel (SP1, SP2). Accordingly, the problem of deterioration of display quality or increase of power consumption of the organic light emitting display device due to current leakage can be improved.

FIG. 5 is a flowchart illustrating a method of manufacturing an organic light emitting display device 200 according to a second embodiment of the present invention. 6A to 6F are cross-sectional views of each step of the process for explaining the manufacturing method of the organic light emitting display device 200 according to the second embodiment of the present invention. In describing this embodiment, for convenience of explanation, detailed description of components that are the same as or correspond to the previously described embodiment will be omitted.

Referring to FIG. 5, the manufacturing method of the organic light emitting display device 200 according to the second embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate (S510), forming the first pixel electrode Forming a common bank layer covering one end of the electrode and one end of the second pixel electrode (S520), forming a first barrier material layer and a second barrier rib on the first pixel electrode, the second pixel electrode, and the common bank layer. Step of sequentially forming the material layers (S530), forming a second barrier rib on the common bank layer by etching the second barrier material layer (S540), etching the first barrier material layer using the second barrier rib as a mask to form a common bank layer. Forming a first barrier rib on the bank layer (S550), a first common layer located on the first pixel electrode, a second common layer located on the second pixel electrode, and a dummy common layer located on the second barrier rib. It includes simultaneously forming the layers (S560) and forming a common electrode on the first common layer, the second common layer, and the dummy common layer (S570).

First, referring to FIG. 6A, the first pixel electrode 152 and the second pixel electrode 154 are formed on the substrate 110 (S510). Specifically, the first pixel electrode 152 is formed on the first sub-pixel SP1 of the substrate 110, and the second pixel electrode 154 is formed on the second sub-pixel SP2. The first pixel electrode 152 and the second pixel electrode 154 are formed simultaneously in the same process and may be made of the same material.

Next, referring to FIG. 6B, a common bank layer 260 is formed covering one end of the first pixel electrode 152 and one end of the second pixel electrode 154 (S520), and the first pixel electrode ( 152), the first barrier material layer 668 and the second barrier material layer 670 are sequentially formed on the second pixel electrode 154 and the common bank layer 260 (S530). The first barrier material layer 668 and the second barrier material layer 670 are formed to share the first sub-pixel SP1 and the second sub-pixel SP2. The first barrier material layer 668 may be made of, for example, molybdenum (Mo), and the second barrier material layer 670 may be made of, for example, polyimide.

Next, referring to FIG. 6C, the second barrier rib material layer 670 is etched to form the second barrier rib 269 on the common bank layer 260 (S540). Before etching the second barrier material layer 670, an exposure process may be performed on the second barrier material layer 670 using a mask to apply heat or UV only to the portion that will remain as the second barrier rib 269. . After the exposure process, when the second barrier material layer 670 is etched with an etchant, the remaining portion excluding the hardened portion of the second barrier material layer 670 is removed, and the second barrier material layer 670 is formed on the common bank layer 260. A partition 269 may be formed.

Next, referring to FIG. 6D, the first barrier rib material layer 668 is etched using the second barrier rib 269 as a mask to form the first barrier rib 267 on the common bank layer 260 (S550). Specifically, the first barrier material layer 668 is etched using an etchant until only the portion overlapping with the second barrier rib 269 remains, and the first barrier material layer 668 is further etched for an additional period of time. In this case, the first barrier rib 267 having an inverse taper shape can be disposed on the common bank layer 260. That is, when the first barrier rib material layer 668 is overetched using the second barrier rib 269 as a mask, the first barrier rib 267 having an inverse taper shape will be formed, as shown in FIG. 6D. You can. The etchant for etching the first barrier material layer 668 so that the first barrier rib 267 easily has a reverse taper shape may include, for example, 40 to 70 wt% of phosphoric acid (H ₃ PO ₄ ) and 3 to 15 wt% of phosphoric acid (H 3 PO 4 ). % of nitric acid (HNO ₃ ), 5 to 35 wt % of acetic acid (CH ₃ COOH), 0.05 to 5 wt % of chlorine-based compound, 0.01 to 5 wt % of chlorine stabilizer, 0.01 to 5 wt % of pH stabilizer and the remaining amount. It may consist of water.

Next, referring to FIG. 6E, the first common layer 272 located on the first pixel electrode 152, the second common layer 274 located on the second pixel electrode 154, and the second partition The dummy common layer 276 located on (269) is formed simultaneously (S560). The first common layer 272, the second common layer 274, and the dummy common layer 276 may be formed simultaneously in the same process. Specifically, the organic material constituting the first common layer 272, the second common layer 274, and the dummy common layer 276 is the first pixel electrode 152, the second pixel electrode 154, and the partition ( 266) and the common bank layer 260, but is not deposited along the side of the partition wall 266. That is, the organic material with low step coverage penetrates into the side of the barrier rib 266, for example, the side of the first barrier rib 267, which has a reverse taper shape, and is not deposited and breaks off. As a result, the first common layer 272 and the second common layer 274 can be separated and arranged for each sub-pixel SP1 and SP2 by the partition 266 without a separate patterning process.

Next, referring to FIG. 6F, a common electrode 290 is formed on the first common layer 272, the second common layer 274, and the dummy common layer 276 (S670). More specifically, the first organic light emitting layer 282 is formed on the first common layer 272 of the first sub-pixel SP1, and the second common layer 274 of the second sub-pixel SP2 is formed. 2 An organic light-emitting layer 284 is formed. Afterwards, the common electrode 290 is disposed on the first organic emission layer 282, the second organic emission layer 284, and the dummy common layer 276. The common electrode 290 can be formed using a sputtering method using a common mask, and can be arranged to be connected or extended from one sub-pixel (SP1) to the neighboring sub-pixel (SP2) without a break.

In the method of manufacturing the organic light emitting display device 200 according to the second embodiment of the present invention, the first barrier rib 267 of an inverse taper shape can be easily formed by using the second barrier rib 269 as a mask. Then, the first common layer 272 and the second common layer 274 are formed using the first barrier rib 267 and the second barrier rib 269 of an inverse taper shape and a common mask without a separate patterning process. It can be stably placed separately for each sub-pixel (SP1, SP2). Accordingly, the problem of deteriorating display quality of the organic light emitting display device, such as a redish phenomenon due to current leakage, can be improved.

Figure 7 is a schematic cross-sectional view of an organic light emitting display device 700 according to a third embodiment of the present invention.

Compared to the organic light emitting display device 100 of FIG. 1 and the organic light emitting display device 200 of FIG. 2, the organic light emitting display device 700 of FIG. 7 has a configuration of a common bank layer 760 and a corresponding first common bank layer. Only the arrangement of the layer 772, the second common layer 774, the dummy common layer 776, the first organic light-emitting layer 782, the second organic light-emitting layer 784, and the common electrode 790 is different, and the remaining configurations are different. are the same, so redundant descriptions are omitted. That is, for convenience of explanation, detailed descriptions of components that are the same or corresponding to those of the previous embodiments will be omitted.

Referring to FIG. 7 , the organic light emitting display device 700 according to the third embodiment of the present invention includes a common bank layer 760 including undercuts 763 and 765.

The common bank layer 760 partitions the sub-pixels SP1 and SP2 and exposes the upper surfaces of the first and second pixel electrodes 152 and 154, respectively. Specifically, the upper surfaces of the first pixel electrode 152 and the second pixel electrode 154 are completely exposed by the undercuts 763 and 765 of the common bank layer 760. The common bank layer 760 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2 and may be made of a transparent organic insulating material or a black material.

The common bank layer 760 includes an undercut 763 formed on the top of the edge of the first pixel electrode 152 and an undercut 765 formed on the top of the edge of the second pixel electrode 154. In other words, as shown in FIG. 7, the upper area of the side of the common bank layer 760 that overlaps the first pixel electrode 152 has a shape that protrudes toward the center of the first pixel electrode 152, The upper area of the side of the common bank layer 760 that overlaps the second pixel electrode 154 has a shape that protrudes toward the center of the second pixel electrode !54. Alternatively, one side of the common bank layer 760 that overlaps the first pixel electrode 152 and the other side of the common bank layer 760 that overlaps the second pixel electrode 154 are each eaves when viewed in cross section. It can have a shape. Alternatively, one side of the common bank layer 760 located close to the first pixel electrode 152 and the other side of the common bank layer 760 located close to the second pixel electrode 154 have undercuts 763 and 765, respectively. ) includes. Additionally, the undercuts 763 and 765 of the common bank layer 760 may have a symmetrical structure with respect to the center of the common bank layer 760. For example, as shown in FIG. 7, the cross section of the undercut 763 on one side of the common bank layer 760 has an “L” shape, and the undercut 765 on the other side of the common bank layer 760 The cross section of is a symmetrical shape of "ㄱ" shape. " may have a shape. The common bank layer 760 may be referred to as a bank member.

As mentioned earlier, the top surfaces of the first and second pixel electrodes 152 and 154 are completely exposed by the undercuts 763 and 765 of the common bank layer 760. That is, the edge of the first pixel electrode 152 and the edge of the second pixel electrode 154 are not covered by the common bank layer 760. When forming the undercuts 763 and 765 of the common bank layer 760 by using the same masks that form the pixel electrodes 152 and 154 without an additional mask, the common bank layer ( The ends of the pixel electrodes 152 and 154 are not covered by 760). That is, since a separate mask is not required to form the undercuts 763 and 765, the process cost of the organic light emitting display device 700 can be reduced. A manufacturing method for forming the undercuts 763 and 765 of the common bank layer 760 without a separate mask will be described in more detail later with reference to FIGS. 9 and 10.

A first common layer 772 is disposed on the first pixel electrode 152, a second common layer 774 is disposed on the second pixel electrode 154, and a dummy common layer is disposed on the common bank layer 760. Layer 776 is placed. The first common layer 772, the second common layer 774, and the dummy common layer 776 are disposed separately from each other.

In the organic light emitting display device 700 according to the third embodiment of the present invention, the first common layer 772 and the second common layer 774 are formed by the undercuts 763 and 765 of the common bank layer 760. can be placed separately from each other even in a process using a common mask. Specifically, the first common layer 772 and the second common layer 774 are formed on the first pixel electrode 152, the second pixel electrode 154, and the common bank layer 760 using a common mask. As the organic material for construction is deposited on the entire surface, the lower regions on both sides of the common bank layer 760 have a depressed shape, so the organic materials with low step coverage are not connected to each other and are disconnected. In other words, organic materials with low step coverage cannot be deposited by digging into the undercuts 763 and 765 of the common bank layer 760, so the organic materials can be brokenly formed for each sub-pixel (SP1 and SP2) without a separate patterning process. You can. At this time, the organic material disposed on the first pixel electrode 152 becomes the first common layer 772, the organic material disposed on the second pixel electrode 154 becomes the second common layer 774, and the common bank The organic material disposed on layer 776 becomes a dummy common layer 776 that is separate from the first common layer 772 and the second common layer 774. That is, the dummy common layer 776 separated by the undercuts 763 and 765 formed on both sides of the common bank layer 776 is disposed on the common bank layer 776.

The minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 is set to the first common layer 772 or It may have a value greater than the thickness of the second common layer 774. In addition, the minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 is smaller than the sum of the thicknesses of all organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 790. By having this value, a short phenomenon between the pixel electrodes 152 and 154 and the common electrode 790 can be prevented. In other words, the minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 is between the first pixel electrode 152 and the common electrode 790 or between the second pixel electrode 154 and the common electrode. It can have a value smaller than the distance between (790). Here, the undercuts 762 and 765 of the common bank layer 760 refer to the distance from the top surfaces of the pixel electrodes 152 and 154 to the top surfaces inside the undercuts 763 and 765.

For example, in the structure shown in FIG. 7, the minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 is disposed between the pixel electrodes 152 and 154 and the common electrode 790. If it has a value greater than the sum of the thicknesses of all organic layers, specifically the common layers 772 and 774 and the organic light emitting layers 782 and 784, not only the common layers 772 and 774 but also the organic light emitting layers 782 made of an organic material. 784) Also, the common bank layer 760 is cut off by the undercuts 763 and 765. At this time, since the common electrode 790 is made of a material with high step coverage, the organic light emitting layers 782 and 784 are deposited on the side of the common bank layer 760, specifically along the undercut 763, through the broken space to form a pixel. It may be in contact with the electrodes 152 and 154. As a result, a short circuit phenomenon may occur between the pixel electrodes 152 and 154 and the common electrode 790, which may increase driving defects of the organic light emitting display device 700. Therefore, the minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 is smaller than the sum of the thicknesses of all organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 790. By having , it is possible to prevent the problem of poor driving of the organic light emitting display device 700 due to a short phenomenon between the pixel electrodes 152 and 154 and the common electrode 790.

The first organic emission layer 782 and the second organic emission layer 784 are disposed separately for each sub-pixel SP1 and SP2. Specifically, as shown in FIG. 7, the first organic emission layer 782 is disposed on a portion of the first common layer 772 and the common bank layer 760, and the second organic emission layer 782 is disposed on the second common layer 772 and the common bank layer 760. It is disposed on a portion of the common layer 774 and the common bank layer 760. The first organic emission layer 782 and the second organic emission layer 784 emit light of different colors.

A common electrode 790 is disposed on the first organic emission layer 782, the second organic emission layer 784, and the dummy common layer 776. The common electrode 790 is commonly disposed in the first sub-pixel (SP1) and the second sub-pixel (SP2).

In the organic light emitting display device 700 according to the third embodiment of the present invention, the first common layer 772 and the second common layer are formed by undercuts 764 and 765 formed on both sides of the common bank layer 760. The layer 774 may be arranged separately for each sub-pixel SP1 and SP2 without a separate patterning process. Accordingly, problems such as deterioration of display quality of the organic light emitting display device 700 due to color mixing between neighboring sub-pixels (SP1, SP2), increased power consumption, or inability to implement low-gray pure white, e.g. For example, problems such as redish phenomenon can be improved.

The third embodiment of the present invention can also be applied to an organic light emitting display device having a common light emitting layer structure. Specifically, by disposing the common bank layer 760 including the undercuts 763 and 765 described in the third embodiment of the present invention between neighboring sub-pixels SP1 and SP2, current leakage is prevented like a charge generation layer. The resulting organic layer can be separated without a separate patterning process. Accordingly, the problem of neighboring colors being mixed is reduced, so the display quality of the organic light emitting display device can be improved.

FIG. 8 is a schematic cross-sectional view of an organic light emitting display device 800 according to a fourth embodiment of the present invention.

Compared to the organic light emitting display device 700 of FIG. 7, the organic light emitting display device 800 of FIG. 8 has a common bank layer 860 including a first bank layer 861 and a second bank layer 862. Configuration and arrangement of the first common layer 872, the second common layer 874, the dummy common layer 876, the first organic emission layer 882, the second organic emission layer 884, and the common electrode 890 accordingly. Since only the components are different and the remaining configurations are the same, redundant descriptions will be omitted. That is, for convenience of explanation, detailed descriptions of components that are the same or corresponding to those of the previous embodiments will be omitted.

Referring to FIG. 8, the common bank layer 860 of the organic light emitting display device 800 according to the fourth embodiment of the present invention overlaps the first bank layer 861 and the first bank layer 861. It includes a second bank layer 862 disposed.

The common bank layer 860 including the first bank layer 861 and the second bank layer 862 partitions the sub-pixels SP1 and SP2, and the first pixel electrode 152 and the second pixel electrode 154 ) expose the upper surface of each. Specifically, the upper surfaces of the first pixel electrode 152 and the second pixel electrode 154 are completely damaged by the undercuts 863 and 865 due to the difference in width between the first bank layer 861 and the second bank layer 862. exposed. The first bank layer 861 and the second bank layer 862 are disposed between the first sub-pixel SP1 and the second sub-pixel SP2 and may be made of a transparent organic insulating material or a black material. Specifically, the first bank layer 861 and the second bank layer 862 may be made of a photo resist (PR) material that causes chemical changes by light. In addition, in order to form the undercuts 863 and 865 due to the difference in width between the first bank layer 861 and the second bank layer 862, a positive photo resist (which has the characteristic of removing the resist from the area exposed to light) is used. It may be desirable to make it from a positive PR) material. The manufacturing method of forming the common bank layer 860 using positive photoresist will be described in more detail later with reference to FIGS. 11 and 12.

Referring to FIG. 8, when viewed in cross section, the width of the second bank layer 862 is larger than the width of the first bank layer 861. Specifically, the width of the lower surface of the second bank layer 862 is larger than the width of the upper surface of the first bank layer 861, so that there is a gap between the first bank layer 861 and the second bank layer 862. Undercuts 863 and 865 are formed. In other words, both sides of the second bank layer 862 are configured to protrude more than both sides of the first bank layer 861, so that the first bank layer 861 and the second bank layer 862 are similar when viewed in cross section. When, it may have the shape of an eaves.

As mentioned earlier, the top surfaces of the first pixel electrode 152 and the second pixel electrode 154 are completely exposed by the undercuts 863 and 865 between the first bank layer 861 and the second bank layer 862. . That is, the edge (edgw) of the first pixel electrode 152 and the edge of the second pixel electrode 862 are not covered by the first bank layer 861 and the second bank layer 862. When forming the first bank layer 861, if the same mask for forming the pixel electrodes 152 and 154 is used without an additional mask, the first bank layer 861 and the second bank layer 862 The ends of the pixel electrodes 152 and 154 are not covered. That is, even if the common bank layer 860 is composed of a plurality of bank layers 861 and 862, it is possible to form a plurality of bank layers 861 and 862 without a separate additional mask, so that the organic light emitting display device 800 Process costs can be reduced. The manufacturing method of forming the first bank layer 861 without an additional mask will be described in more detail later with reference to FIGS. 11 and 12. The common bank layer 860 including the first bank layer 861 and the second bank layer 862 may be referred to as a bank member.

A first common layer 872 is disposed on the first pixel electrode 152, a second common layer 874 is disposed on the second pixel electrode 154, and a dummy layer is disposed on the second bank layer 862. A common layer 876 is disposed. The first common layer 872, the second common layer 874, and the dummy common layer 876 are disposed separately from each other.

In the organic light emitting display device 800 according to the fourth embodiment of the present invention, the first common The layer 872 and the second common layer 874 may be disposed separately from each other even in a process using a common mask. Specifically, the first common layer 872 and the second common layer 874 are formed on the first pixel electrode 152, the second pixel electrode 154, and the second bank layer 862 using a common mask. As the organic material for forming is deposited on the entire surface, the side of the first bank layer 861 has a more depressed shape than the side of the second bank layer 862, so organic materials with low step coverage cannot be connected to each other. It gets cut off. In other words, organic materials with low step coverage cannot be deposited by penetrating into the undercuts 863 and 865 of the common bank layer 860, so the organic materials can be brokenly formed for each sub-pixel (SP1 and SP2) without a separate patterning process. You can. At this time, the organic material disposed on the first pixel electrode 152 becomes the first common layer 872, the organic material disposed on the second pixel electrode 154 becomes the second common layer 874, and the organic material disposed on the second pixel electrode 154 becomes the second common layer 874. The organic material disposed on the bank layer 862 becomes a dummy common layer 876 that is separated from the first common layer 872 and the second common layer 874. That is, the dummy common layer 876 separated by the protruding side of the second bank layer 862 is disposed on the second bank layer 862.

The minimum gap (W4) inside the undercuts (863, 865) of the common bank layer (860) composed of a plurality of bank layers (861, 862) is such that the first common layer (872) and the second common layer (874) are smooth. It may have a value greater than the thickness of the first common layer 872 or the second common layer 874 to ensure proper separation. In addition, the minimum gap W4 inside the undercuts 863 and 865 of the common bank layer 860 is smaller than the sum of the thicknesses of all organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 890. By having this value, a short phenomenon between the pixel electrodes 152 and 154 and the common electrode 890 can be prevented. In other words, the minimum gap W4 inside the undercuts 863 and 865 of the common bank layer 860 is between the first pixel electrode 152 and the common electrode 890 or between the second pixel electrode 154 and the common electrode. It can have a value smaller than the distance between (890). Here, the minimum gap W4 inside the undercuts 863 and 865 of the common bank layer 860 is the distance from the top surface of the pixel electrodes 152 and 154 to the top surface of the first bank layer 861 or the pixel electrode It refers to the distance from the upper surface of (152, 154) to the lower surface of the second bank layer (862).

The first organic emission layer 882 and the second organic emission layer 884 are disposed separately for each sub-pixel SP1 and SP2. Specifically, as shown in FIG. 8, the first organic light-emitting layer 882 is disposed on a portion of the first common layer 872 and the second bank layer 862, and the second organic light-emitting layer 882 is 2 It is disposed on a portion of the common layer 874 and the second bank layer 862. The first organic emission layer 882 and the second organic emission layer 884 emit light of different colors.

A common electrode 890 is disposed on the first organic emission layer 882, the second organic emission layer 884, and the dummy common layer 876. The common electrode 890 is commonly disposed in the first sub-pixel (SP1) and the second sub-pixel (SP2).

In the organic light emitting display device 800 according to the fourth embodiment of the present invention, the undercuts 863 and 865 formed due to the difference in width between the first bank layer 861 and the second bank layer 862, The first common layer 872 and the second common layer 874 may be separately arranged for each sub-pixel SP1 and SP2 without a separate patterning process. Accordingly, the problem of deterioration of display quality and increase of power consumption of the organic light emitting display device 800 due to color mixing between neighboring sub-pixels SP1 and SP2 can be solved. In addition, the problem of not being able to implement low-gray pure white, such as the redish phenomenon, can be solved.

The fourth embodiment of the present invention can also be applied to an organic light emitting display device having a common light emitting layer structure. Specifically, a common bank layer 760 including undercuts 863 and 865 formed by the plurality of bank layers 861 and 862 described in the fourth embodiment of the present invention between neighboring sub-pixels SP1 and SP2. ), the organic layer that causes current leakage, such as the charge generation layer, can be separated without a separate patterning process. Accordingly, the problem of neighboring colors being mixed is reduced, so the display quality of the organic light emitting display device can be improved.

FIG. 9 is a flowchart illustrating a method of manufacturing an organic light emitting display device 700 according to a third embodiment of the present invention. 10A to 10F are cross-sectional views of each process step to explain the manufacturing method of the organic light emitting display device 700 according to the third embodiment of the present invention. In describing this embodiment, for convenience of explanation, detailed description of components that are the same as or correspond to the previously described embodiment will be omitted.

Referring to FIG. 9, the manufacturing method of the organic light emitting display device 700 according to the third embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate (S910), the first pixel electrode Forming a first sacrificial layer and a second sacrificial layer overlapping each of the electrode and the second pixel electrode (S920), forming a common bank layer covering one end of the first sacrificial layer and one end of the second sacrificial layer. Step (S930), removing the first sacrificial layer and the second sacrificial layer so that undercuts are formed on both sides of the common bank layer (S940), the first common layer and the second pixel located on the first pixel electrode simultaneously forming a second common layer located on the electrode and a dummy common layer located on the common bank layer (S950) and forming a common electrode on the first common layer, the second common layer, and the dummy common layer. Includes (S960).

First, referring to FIG. 10A, the first pixel electrode 152 and the second pixel electrode 154 are formed on the substrate 110 (S910). The first pixel electrode 152 and the second pixel electrode 154 may be patterned simultaneously through the same process using the first mask M1.

Next, referring to FIG. 10B, a first sacrificial layer 1061 and a second sacrificial layer 1062 overlapping each of the first pixel electrode 152 and the second pixel electrode 154 are formed (S920). The first sacrificial layer 1061 and the second sacrificial layer 1062 may be made of a soft metallic material, for example, molybdenum (Mo), but are not limited thereto. The thickness of the first sacrificial layer 1061 and the second sacrificial layer 1062 have a greater value than the thickness of the first common layer 772 or the second common layer 774 formed later. It is preferable that the thickness is smaller than the sum of the thicknesses of all organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 790. That is, the thickness of the first sacrificial layer 1061 and the thickness of the second sacrificial layer 1062 can determine the minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 described in FIG. 7. .

The first sacrificial layer 1061 and the second sacrificial layer 1062 utilize the same first mask (M1) that was used to form the first pixel electrode 152 and the second pixel electrode 154, Since they are formed on the first pixel electrode 152 and the second pixel electrode 154, respectively, a separate mask is not required to form the first sacrificial layer 1061 and the second sacrificial layer 1062. That is, after depositing the material forming the sacrificial layers 1061 and 1062 on the first pixel electrode 152 and the second pixel electrode 154, using the patterned first mask M1, the first pixel electrode All parts except for the part overlapping with 152 and the second pixel electrode 154 can be removed through an etching process. At this time, the sacrificial layers 1061 and 1062 and the pixel electrodes 152 and 154 may be made of materials with different etching selectivity.

Since the sacrificial layers 1061 and 1062 and the pixel electrodes 152 and 154 are formed using the same first mask M1, they have the same width. Specifically, the width of the first pixel electrode 152 is the same as the width of the first sacrificial layer 1061, and the width of the second pixel electrode 154 is the same as the width of the second sacrificial layer 1062.

Next, referring to FIG. 10C, a common bank layer 760 is formed covering one edge of the first sacrificial layer 1061 and one edge of the second sacrificial layer 1062 (S930).

Next, referring to FIG. 10D, the first sacrificial layer 1061 and the second sacrificial layer 1062 are removed so that undercuts 763 and 765 are formed on both sides of the common bank layer 760 (S940). . Since the etching selectivity of the sacrificial layers 1061 and 1062 and the pixel electrodes 152 and 154 are different from each other, an etchant having a specific etching selectivity suitable for the sacrificial layers 1061 and 1062 is used to etch the pixel electrodes 152 and 154. It can be etched away and removed without affecting other components such as

Next, referring to FIG. 10E, the first common layer 772 located on the first pixel electrode 152, the second common layer 774 located on the second pixel electrode 154, and the common bank layer A dummy common layer 776 located on 760 is simultaneously formed (S950). The first common layer 772, the second common layer 774, and the dummy common layer 776 may be simultaneously disposed using a thermal evaporation method using one common mask. At this time, the organic material constituting the first common layer 772, the second common layer 774, and the dummy common layer 776 is the first pixel electrode 152, the second pixel electrode 154, and the common bank layer. It is deposited only on (760) and not along the undercuts (763, 765) of the common bank layer (760). That is, the organic material with low step coverage cannot be deposited until it penetrates into the undercuts 763 and 765 formed on both sides of the common bank layer 760 and is broken off. As a result, by the undercuts 763 and 765 of the common bank layer 760, the first common layer 772 and the second common layer 774 are separated into sub-pixels SP1 and SP2 without a separate patterning process. can be placed.

Next, referring to FIG. 10F, a common electrode 790 is formed on the first common layer 772, the second common layer 774, and the dummy common layer 776 (S960). More specifically, the first organic light emitting layer 782 is formed on the first common layer 772 of the first sub-pixel SP1, and the second common layer 774 is formed on the second sub-pixel SP2. 2 An organic light-emitting layer 784 is formed. The first organic emission layer 782 and the second organic emission layer 784 emit different colors, and the pattern is deposited using a mask with openings for each sub-pixel (SP1, SP2), for example, a fine metal mask (FMM). It can be. Afterwards, the common electrode 790 is disposed on the first organic emission layer 782, the second organic emission layer 784, and the dummy common layer 776. The common electrode 790 can be formed using a sputtering method with a common mask, and can be arranged to be connected or extended from one sub-pixel (SP1) to the neighboring sub-pixel (SP2) without a break.

In the method of manufacturing the organic light emitting display device 700 according to the third embodiment of the present invention, the sacrificial layers 1061 and 1062 and the common bank layer 760 overlapping with the same size as the pixel electrodes 152 and 154 are sequentially formed. Through a simple process of etching the sacrificial layers 1061 and 1062 after being disposed, the undercuts 763 and 765 of the common bank layer 760 can be easily formed. In addition, due to the undercuts 763 and 765 of the common bank layer 760, the first common layer 772 and the second common layer 774 are stably formed into the sub-pixel (SP1) using a common mask without a separate patterning process. , SP2) can be placed separately. Accordingly, current leakage to neighboring sub-pixels can be reduced, thereby improving the display quality of the organic light emitting display device 700. In addition, when forming the sacrificial layers 1061 and 1062 for forming the undercuts 763 and 765 of the common bank layer 760, the first mask M1 forming the pixel electrodes 152 and 154 is used in the same manner. By utilizing it effectively, a separate additional mask is not required, which has the effect of reducing the processing cost of the organic light emitting display device 700.

FIG. 11 is a flowchart for explaining a method of manufacturing an organic light emitting display device 800 according to a fourth embodiment of the present invention. 12A to 12F are cross-sectional views of each step of the process for explaining the manufacturing method of the organic light emitting display device 800 according to the fourth embodiment of the present invention. In describing this embodiment, for convenience of explanation, detailed description of components that are the same as or correspond to the previously described embodiment will be omitted.

Referring to FIG. 11, the manufacturing method of the organic light emitting display device 800 according to the fourth embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate (S1110), forming the first pixel electrode Forming a first bank material layer on the electrode and the second pixel electrode (S1120), exposing an area A in the first bank material layer that overlaps the first pixel electrode and the second pixel electrode (S1130), Forming a second bank material layer on the first bank material layer (S1140), exposing an area B in the second bank material layer that overlaps the area A of the first bank material layer and has a smaller width than the area A. Step (S1150), removing the area A of the first bank material layer and the area B of the second bank material layer to form the first bank layer and a second bank layer having a larger width than the first bank layer ( S1160), simultaneously forming a first common layer located on the first pixel electrode, a second common layer located on the second pixel electrode, and a dummy common layer located on the second bank layer (S1170), and It includes forming a common electrode on the first common layer, the second common layer, and the dummy common layer (S1180).

First, referring to FIG. 12A, the first pixel electrode 152 and the second pixel electrode 154 are formed on the substrate 110 (S1110). The first pixel electrode 152 and the second pixel electrode 154 may be patterned simultaneously through the same process using the first mask M1.

Next, referring to FIG. 12B, a first bank material layer 1261 is formed on the first pixel electrode 152 and the second pixel electrode 154 (S1120). Then, in the first bank material layer 1261, the area A that overlaps the first pixel electrode 152 and the second pixel electrode 154 is exposed (S1130). The first bank material layer 1261 is made of a positive photoresist (positive PR) material, which has the property of removing resist from areas exposed to light. As shown in FIG. 12B, the first mask M1 used to form the pixel electrodes 152 and 154 is used to expose the area A of the first bank material layer 1261, thereby exposing the first mask M1. The width of area A of the bank material layer 1261 has the same value as the width of the pixel electrodes 152 and 154. The thickness of the first bank material layer 1261 is greater than the thickness of the first common layer 872 or the second common layer 874 formed later, and the pixel electrodes 152 and 154 formed later. It is preferable to have a value smaller than the sum of the thicknesses of all organic layers disposed between and the common electrode 890. That is, the minimum gap W4 inside the undercuts 873 and 875 of the common bank layer 860 described in FIG. 8 can be adjusted depending on the thickness of the first bank material layer 1261.

Next, referring to FIG. 12C, the second bank material layer 1262 is formed on the first bank material layer 1261 (S1140). Then, in the second bank material layer 1262, an area B that overlaps the area A of the first bank material layer 1261 and has a smaller width than the area A is exposed (S1150). Like the first bank material layer 1261, the second bank material layer 1262 is also made of a positive photoresist (positive PR) material. The first bank material layer 1261 and the second bank material layer 1262 may be made of the same material. As shown in FIG. 12C, area B, which overlaps area A of the first bank material layer 1261 and has a smaller width than area A, is exposed using the second mask M2.

Next, referring to FIG. 12D, the area A of the first bank material layer 1261 and the area B of the second bank material layer 1262 are removed to form the first bank layer 861 and the first bank layer 861. ) is formed (S1160). Area A of the first bank material layer 1261 and area B of the second bank material layer 1262 may be removed simultaneously through a strip process. Area A is removed from the first bank material layer 1261, and the remaining part becomes the first bank layer 861, and area B is removed from the second bank material layer 1262, and the remaining part becomes the second bank layer 862. ) becomes. The width of the first bank layer 861 formed by removing the A region of the first bank material layer 1261 is formed by removing the B region of the second bank material layer 1262, which has a width smaller than the A region. It has a value smaller than the width of the second bank layer 862. That is, the side of the second bank layer 862 is formed to protrude beyond the side of the first bank layer 861, so that the undercuts 863 and 865 are formed by the first bank layer 861 and the second bank layer 862. This is formed. In other words, eave-shaped undercuts 863 and 865 are formed on both sides of the common bank layer 860 composed of the first bank layer 861 and the second bank layer 862. Accordingly, the width of the upper surface of the first bank layer 861 is formed to have a smaller value than the width of the lower surface of the second bank layer 862.

In the process of removing area A of the first bank material layer 1261 and area B of the second bank material layer 1262, the side of the second bank layer 862 may be formed into an inclined shape by the strip solution. there is. Although not shown in the drawing, the side surface of the first bank layer 861 may also be formed in an inclined shape.

As mentioned earlier, the first bank material layer 1261 and the second bank material layer 1262 are preferably made of a positive photoresist (positive PR) material. When the first bank material layer 1261 and the second bank material layer 1262 are made of a negative photo resist (negative PR) material, there is a problem in that it is difficult to form the undercuts 863 and 865 of the common bank layer 860. . This is explained in detail as follows. Negative photoresist (negative PR) materials have the characteristic of leaving resist in areas exposed to light. To explain the process of forming the undercuts 863 and 865 using a negative photoresist material, first, a first bank material layer 1261 is formed, and then light is applied to the area to be made into the first bank layer 861. Investigate. Afterwards, the second bank material layer 1262 is formed on the first bank material layer 1261, and light is irradiated to the area to form the second bank layer 862. At this time, the area for creating the first bank layer 861 and the area for creating the second bank layer 862 overlap each other. In addition, in order to create the undercut (863, 865) shape, specifically, a shape in which the side of the second bank layer 862 protrudes more than the side of the first bank layer 861, The width of the region must be larger than the width of the region for creating the first bank layer 861. In this case, when light is irradiated to the area for forming the second bank layer 862 of the second bank material layer 1262, the space where the undercuts 863 and 865 are to be formed, that is, the second bank layer ( A problem may occur where light penetrates into an area that overlaps with the area for forming the first bank layer 862) but does not overlap with the area for forming the first bank layer 861. Because of this, the desired shape or size of the undercuts 863 and 865 may not be implemented properly.

Next, referring to FIG. 12E, the first common layer 872 located on the first pixel electrode 152, the second common layer 874 located on the second pixel electrode 154, and the second bank A dummy common layer 876 located on the layer 862 is simultaneously formed (S1170). The first common layer 872, the second common layer 874, and the dummy common layer 876 may be simultaneously disposed using a thermal evaporation method using one common mask. At this time, the organic materials constituting the first common layer 872, the second common layer 874, and the dummy common layer 876 are the first pixel electrode 152, the second pixel electrode 154, and the second bank. It is deposited only on the layer 862 and not along the undercuts 863 and 865 of the first bank layer 861 and the second bank layer 862. That is, the organic material with low step coverage penetrates into the undercuts 863 and 865 formed on both sides of the common bank layer 860 and is not deposited, but is broken. As a result, due to the undercuts 863 and 865 of the first bank layer 861 and the second bank layer 862, the first common layer 872 and the second common layer 874 are sub-layered without a separate patterning process. They can be arranged separately for each pixel (SP1, SP2).

Next, referring to FIG. 12F, a common electrode 890 is formed on the first common layer 872, the second common layer 874, and the dummy common layer 876 (S1180). Specifically, the first organic light emitting layer 882 is formed on the first common layer 872 of the first sub-pixel SP1, and the second organic light-emitting layer 882 is formed on the second common layer 872 of the second sub-pixel SP2. An organic light emitting layer 884 is formed. The first organic emission layer 882 and the second organic emission layer 884 emit different colors, and the pattern is deposited using a mask with openings for each sub-pixel (SP1, SP2), for example, a fine metal mask (FMM). It can be. Afterwards, a common electrode 890 is disposed on the first organic emission layer 882, the second organic emission layer 884, and the dummy common layer 876. The common electrode 890 can be formed using a sputtering method using a common mask, and can be arranged to be connected or extended from one sub-pixel (SP1) to the neighboring sub-pixel (SP2) without a break.

In the manufacturing method of the organic light emitting display device 800 according to the fourth embodiment of the present invention, separate The first common layer 872 and the second common layer 874 may be separately arranged for each sub-pixel SP1 and SP2 by using a common mask without a patterning process. Accordingly, the problem of color mixing between neighboring pixels due to current leakage is reduced, and the display quality of the organic light emitting display device 800 can be improved. In addition, the first mask M1 that forms the pixel electrodes 152 and 154 is used to form the first bank layer 861 of the common bank layer 860, thereby forming the common bank layer 860. Since a separate mask is not required for formation, the processing cost of the organic light emitting display device 800 can be reduced.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

100, 200, 700, 800: Organic light emitting display device
110: substrate
130: thin film transistor
152: first pixel electrode
154: second pixel electrode
156: conductive layer
162, 861: first bank layer
164, 862: second bank layer
172, 272, 772, 872: first common layer
174, 274, 774, 874: second common layer
176, 276, 776, 876: Dummy common layer
182, 282, 782, 882: first organic light-emitting layer
184, 284, 784, 884: second organic light-emitting layer
190, 290, 790, 890: common electrode
260, 760, 860: Common bank layer

Claims (16)

a first pixel electrode disposed in a first sub-pixel on the substrate;
a second pixel electrode disposed in a second sub-pixel on the substrate;
a first common layer disposed on the first pixel electrode;
a second common layer disposed on the second pixel electrode;
a common bank layer disposed between the first pixel electrode and the second pixel electrode; and
It includes a dummy common layer disposed between the first sub-pixel and the second sub-pixel,
The first common layer, the second common layer, and the dummy common layer are made of the same material and are separated from each other,
The organic light emitting display device wherein the dummy common layer overlaps the common bank layer. According to claim 1,
a first organic light-emitting layer disposed on the first common layer;
a second organic light-emitting layer disposed on the second common layer; and
The organic light emitting display device further includes a common electrode on the first and second organic light emitting layers and covering the first sub pixel and the second sub pixel. According to claim 1,
It is disposed on the common bank layer and further includes a partition wall composed of a first partition wall having an inverse taper shape and a second partition wall arranged on the first partition wall,
The organic light emitting display device wherein the dummy common layer is disposed on the second barrier rib. According to clause 3,
The first partition is made of a metallic material,
The organic light emitting display device wherein the second barrier rib is made of a heat or UV curable material. According to clause 3,
The common bank layer overlaps an edge of each of the first pixel electrode and the second pixel electrode,
The first common layer extends to one side and a portion of the top surface of the common bank layer,
The second common layer extends to the other side and a portion of the top of the common bank layer,
An organic light emitting display device wherein the first and second common layers are separated by the partition wall. According to clause 2,
One side of the common bank layer includes an undercut adjacent to the first pixel electrode,
The other side of the common bank layer includes an undercut adjacent to the second pixel electrode,
The organic light emitting display device wherein the dummy common layer is disposed on the common bank layer. According to clause 6,
The distance from the top surface of the first pixel electrode to the top surface inside the undercut on one side of the common bank layer has a value greater than the thickness of the first common layer and is greater than the distance between the common electrode and the first pixel electrode. It has a small value,
The distance from the top surface of the second pixel electrode to the top surface inside the undercut on the other side of the common bank layer has a value greater than the thickness of the second common layer and is greater than the distance between the common electrode and the second pixel electrode. An organic light emitting display device having a small value. According to clause 7,
An edge of the first pixel electrode and a portion of the lower surface of one side of the common bank layer overlap, and the upper surface of the first pixel electrode and the lower surface of one side of the common bank layer are spaced apart from each other,
An edge of the second pixel electrode and a portion of the other lower surface of the common bank layer overlap, and the upper surface of the second pixel electrode and the other lower surface of the common bank layer are spaced apart from each other. According to clause 2,
The common bank layer is,
a first bank layer disposed between the first pixel electrode and the second pixel electrode, and
a second bank layer partially overlapping with the first bank layer and having a width greater than that of the first bank layer;
The dummy common layer is disposed on the second bank layer. According to clause 9,
The distance from the top surface of the first pixel electrode to the top surface of one side of the first bank layer has a value greater than the thickness of the first common layer and has a value less than the distance between the common electrode and the first pixel electrode. ,
The distance from the top surface of the second pixel electrode to the top surface of the other side of the first bank layer has a value greater than the thickness of the second common layer and has a value less than the distance between the common electrode and the second pixel electrode. , organic light emitting display device. According to claim 10,
Edges of each of the first pixel electrode and the second pixel electrode do not overlap with the first bank layer,
An edge of the first pixel electrode and a portion of the lower surface of one side of the second bank layer overlap, and the upper surface of the first pixel electrode and the lower surface of one side of the second bank layer are spaced apart from each other,
An edge of the second pixel electrode and a portion of the other lower surface of the second bank layer overlap, and the upper surface of the second pixel electrode and the other lower surface of the second bank layer are spaced apart from each other. According to clause 2,
a first thin film transistor disposed between the substrate and the first pixel electrode;
a second thin film transistor disposed between the substrate and the second pixel electrode; and
Further comprising a planarization layer covering the first thin film transistor and the second thin film transistor,
The first pixel electrode, the second pixel electrode, and the common bank layer are disposed on the planarization layer. Pattern electrodes arranged for each plurality of sub-pixels;
an organic light-emitting layer disposed on the pattern electrode;
a common electrode disposed on the organic light emitting layer;
a plurality of additional organic layers disposed between the pattern electrode and the organic light emitting layer; and
It includes a bank member disposed between pattern electrodes of neighboring sub-pixels among the pattern electrodes,
the plurality of additional organic layers are separated from each other by the bank member,
Some of the plurality of additional organic layers are disposed on the bank member. According to claim 13,
The bank member is,
a common bank layer disposed between two neighboring pattern electrodes among the pattern electrodes;
a first partition disposed on the common bank layer and having a reverse tapered shape to separate the additional organic layer; and
It includes a second partition wall disposed on the first partition wall,
An organic light emitting display device, wherein some of the additional organic layers disposed on the bank member are disposed on an upper surface of the second barrier rib. According to claim 13,
The bank member is,
It is disposed between two neighboring pattern electrodes among the pattern electrodes, and includes a common bank layer having an eaves shape on both sides to separate the additional organic layer,
Some of the additional organic layers disposed on the bank member are disposed on an upper surface of the common bank layer. According to claim 13,
The bank member is,
a first bank layer disposed between two neighboring pattern electrodes among the pattern electrodes; and
a second bank layer partially overlapping with the first bank layer and protruding on both sides more than the first bank layer to have an eaves shape that separates the additional organic layer;
An organic light emitting display device, wherein some of the additional organic layers disposed on the bank member are disposed on an upper surface of the second bank layer.