WO2021149422A1

WO2021149422A1 - Display device, display device manufacturing method, and electronic device

Info

Publication number: WO2021149422A1
Application number: PCT/JP2020/047304
Authority: WO
Inventors: 昭綱高木; 崇山崎; 宏史藤巻; 英輔根岸
Original assignee: ソニーグループ株式会社; ソニーセミコンダクタソリューションズ株式会社
Priority date: 2020-01-22
Filing date: 2020-12-17
Publication date: 2021-07-29
Also published as: CN114946274A; JPWO2021149422A1

Abstract

In the display device according to the invention, light emitting portions formed by laminating a first electrode, an organic layer, and a second electrode are formed and arrayed on a substrate in a two-dimensional matrix. The first electrode is provided for each light emitting portion. A partition portion is formed between adjacent first electrodes. The organic layer and the second electrode are laminated on the entire surface over the first electrodes and the partition portion. The partition portion has a light reflection surface made of a metal layer. At a part of the side surface of the partition portion on the first electrode side, a concave portion toward the inside of the partition portion is provided.

Description

Display devices, manufacturing methods for display devices, and electronic devices

This disclosure relates to a display device, a method of manufacturing the display device, and an electronic device.

In recent years, a display device using organic electroluminescence has been attracting attention as a display device that replaces a liquid crystal display device. Hereinafter, a display device using organic electroluminescence may be abbreviated as "organic EL display device" or simply "display device". The organic EL display device is a self-luminous type, and further has sufficient responsiveness to a high-definition high-speed video signal, and is being enthusiastically commercialized.

In display devices for wearing on eyewear such as eyeglasses and goggles, for example, in addition to setting the pixel size to about several micrometers to 10 micrometers, it is required to increase the brightness. There is. For example, Japanese Patent Application Laid-Open No. 2007-165214 (Patent Document 1) discloses that light is reflected by a partition wall portion that separates a light emitting portion and a light emitting portion to improve light extraction efficiency and increase brightness. ing.

JP-A-2007-165214

When a light reflecting surface is formed on the partition wall that separates the light emitting portion and the light emitting portion, abnormal light emission may occur due to a leak at the end of the light reflecting surface, or the interface of the organic layer constituting the light emitting portion may be affected. It is conceivable that there is a leak between adjacent pixels. These are factors such as a decrease in brightness and a decrease in reliability.

Therefore, an object of the present disclosure is a display device capable of improving the light extraction efficiency and reducing leakage between adjacent pixels, a method for manufacturing the display device, and an electronic device including the display device. To provide equipment.

The display device according to the present disclosure for achieving the above object is
The light emitting portion formed by laminating the first electrode, the organic layer, and the second electrode is formed on the substrate by arranging them in a two-dimensional matrix.
The first electrode is provided for each light emitting part, and is provided for each light emitting part.
A partition wall is formed between the adjacent first electrodes.
The organic layer and the second electrode are laminated on the entire surface including the first electrode and the partition wall portion.
The partition wall has a light reflecting surface made of a metal layer, and has a light reflecting surface.
A recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.
It is a display device.

A method for manufacturing a display device according to the present disclosure for achieving the above object is described.
A method for manufacturing a display device in which light emitting portions formed by stacking a first electrode, an organic layer, and a second electrode are arranged on a substrate in a two-dimensional matrix.
The process of forming the first electrode corresponding to each light emitting part,
The step of forming a partition wall in the corresponding region between the adjacent first electrodes, and
A step of laminating an organic layer and a second electrode on the entire surface including the first electrode and the partition wall,
Have and
The step of forming the partition wall portion includes a step of providing a recess toward the inside of the partition wall portion on a side surface portion of the partition wall portion on the first electrode side and a step of providing a light reflecting surface made of a metal layer on the partition wall portion.
This is a method for manufacturing a display device.

The electronic devices according to the present disclosure for achieving the above objectives are
The light emitting portion formed by laminating the first electrode, the organic layer, and the second electrode is formed on the substrate by arranging them in a two-dimensional matrix.
The first electrode is provided for each light emitting part, and is provided for each light emitting part.
A partition wall is formed between the adjacent first electrodes.
The organic layer and the second electrode are laminated on the entire surface including the first electrode and the partition wall portion.
The partition wall has a light reflecting surface made of a metal layer, and has a light reflecting surface.
A recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.
It is an electronic device equipped with a display device.

FIG. 1 is a schematic plan view of a display device according to the first embodiment of the present disclosure. FIG. 2 is a schematic partial cross-sectional view of the display device according to the first embodiment. 3A, 3B and 3C are schematic partial end views for explaining the method of manufacturing the display device according to the first embodiment. 4A and 4B are schematic partial end views for explaining the method of manufacturing the display device according to the first embodiment, following FIG. 3C. 5A and 5B are schematic partial end views for explaining the method of manufacturing the display device according to the first embodiment, following FIG. 4B. 6A and 6B are schematic partial end views for explaining the method of manufacturing the display device according to the first embodiment, following FIG. 5B. 7A and 7B are schematic partial end views for explaining the method of manufacturing the display device according to the first embodiment, following FIG. 6B. FIG. 8 is a schematic partial cross-sectional view of the display device according to the modified example of the first embodiment. 9A and 9B are schematic partial end face views for explaining a method of manufacturing a display device according to a modification of the first embodiment. 10A and 10B are schematic partial end view views for explaining a method of manufacturing a display device according to a modification of the first embodiment, following FIG. 9B. 11A and 11B are schematic partial end views for explaining a method of manufacturing a display device according to a modification of the first embodiment, following FIG. 10B. FIG. 12 is a schematic partial cross-sectional view of the display device according to the second embodiment. 13A and 13B are schematic partial end views for explaining the manufacturing method of the display device according to the second embodiment. 14A and 14B are schematic partial end views for explaining the method of manufacturing the display device according to the second embodiment, following FIG. 13B. FIG. 15 is a schematic partial cross-sectional view of the display device according to the third embodiment. 16A and 16B are schematic partial end views for explaining the method of manufacturing the display device according to the third embodiment. 17A and 17B are schematic partial end views for explaining the method of manufacturing the display device according to the third embodiment, following FIG. 16B. FIG. 18 is a schematic partial cross-sectional view of the display device according to the modified example of the third embodiment. FIG. 19 is a schematic partial cross-sectional view of the display device according to the fourth embodiment. 20A and 20B are schematic partial end views for explaining the manufacturing method of the display device according to the fourth embodiment. 21A and 21B are schematic partial end views for explaining the method of manufacturing the display device according to the fourth embodiment, following FIG. 20B. FIG. 22 is a schematic partial cross-sectional view of the display device according to the fifth embodiment. 23A and 23B are schematic partial end views for explaining the manufacturing method of the display device according to the fifth embodiment. FIG. 24 is an external view of an interchangeable lens type single-lens reflex type digital still camera, the front view thereof is shown in FIG. 24A, and the rear view thereof is shown in FIG. 24B. FIG. 25 is an external view of the head-mounted display. FIG. 26 is an external view of the see-through head-mounted display.

Hereinafter, the present disclosure will be described based on an embodiment with reference to the drawings. The present disclosure is not limited to embodiments, and various numerical values and materials in the embodiments are examples. In the following description, the same reference numerals will be used for the same elements or elements having the same function, and duplicate description will be omitted. The description will be given in the following order.
1. 1. Description of the display device, the manufacturing method of the display device, the electronic device, and the general related to the present disclosure. First Embodiment and Modification 3. Second embodiment 4. Third embodiment 5. Fourth Embodiment 6. Fifth Embodiment and modification 7. Explanation of electronic devices 8. others

[Explanation of Display Devices, Manufacturing Methods of Display Devices, Electronic Devices, and General Related to the present Disclosure]
As described above, the display device according to the present disclosure, the display device obtained by the manufacturing method of the display device according to the present disclosure, and the display device used for the electronic device according to the present disclosure (hereinafter, these are simply referred to as "the present disclosure". In some cases, it is called "display device".
The light emitting portion formed by laminating the first electrode, the organic layer, and the second electrode is formed on the substrate by arranging them in a two-dimensional matrix.
The first electrode is provided for each light emitting part, and is provided for each light emitting part.
A partition wall is formed between the adjacent first electrodes.
The organic layer and the second electrode are laminated on the entire surface including the first electrode and the partition wall portion.
The partition wall has a light reflecting surface made of a metal layer, and has a light reflecting surface.
A recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.

In the display device of the present disclosure, the partition wall may be composed of a base material made of an insulating material and provided with recesses, and a metal layer formed on the surface of the base material excluding the recesses.

In the display device of the present disclosure including the above-mentioned preferable configuration, the base material of the partition wall portion has a lower layer portion composed of a first insulating material layer and a second layer portion having a shape protruding in an eaves shape with respect to the lower layer portion. It can be configured to include an upper layer portion composed of an insulating material layer.

In the display device of the present disclosure including the above-mentioned various preferable configurations, the first electrode may be configured to be formed of a metal layer of the same layer as the metal layer of the partition wall portion. The metal layer can be formed of, for example, a simple metal such as Cr, Au, Pt, Ni, Cu, Mo, W, Ti, Ta, Al, Fe, or Ag, or an alloy, but an aluminum or aluminum alloy. It is preferable that the composition is composed of either silver or silver.

In the display device of the present disclosure including the above-mentioned various preferable configurations, the partition wall is formed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and pixel-to-pixel insulation formed on the surface of the metal layer. It is composed of a film, and the recess can be configured to be provided by removing the inter-pixel insulating film on the side surface portion of the partition wall portion on the first electrode side.

Alternatively, in the display device of the present disclosure, the partition wall portion is composed of a base material made of an insulating material and a metal layer formed on the base material and protruding like an eaves with respect to the base material. be able to.

In this case, the metal layer can be formed of, for example, a simple metal such as Cr, Au, Pt, Ni, Cu, Mo, W, Ti, Ta, Al, Fe, or Ag, or an alloy. It is preferably composed of any of aluminum, aluminum alloy and silver. Further, a transparent conductive material layer may be formed on the surface of the metal layer of the partition wall portion. The first electrode can be covered with a transparent conductive material layer which is the same layer as the transparent conductive material layer of the partition wall. The transparent conductive material layer can be composed of indium tin oxide or zinc indium oxide.

As described above, the method for manufacturing the display device according to the present disclosure is as follows.
A method for manufacturing a display device in which light emitting portions formed by stacking a first electrode, an organic layer, and a second electrode are arranged on a substrate in a two-dimensional matrix.
The process of forming the first electrode corresponding to each light emitting part,
The step of forming a partition wall in the corresponding region between the adjacent first electrodes, and
A step of laminating an organic layer and a second electrode on the entire surface including the first electrode and the partition wall,
Have and
The step of forming the partition wall portion includes a step of providing a recess toward the inside of the partition wall portion on a side surface portion of the partition wall portion on the first electrode side, and a step of providing a light reflecting surface made of a metal layer on the partition wall portion.

In the method for manufacturing the display device according to the present disclosure, the first insulating material layer constituting the lower layer portion of the partition wall portion and the second insulating material forming the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion. By forming the material layer, it is possible to provide a recess toward the inside of the partition wall portion on the side surface portion of the partition wall portion on the first electrode side.

In this case, the step of forming the partition wall portion and the step of forming the first electrode are
In the corresponding region between the adjacent first electrodes, a first insulating material layer constituting the lower layer portion and a second insulating material layer forming the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion are formed. And the process to do
A step of forming a metal layer on the entire surface, thus forming a light reflecting surface composed of a metal layer on a partition wall portion, and forming a first electrode including a metal layer divided by an eaves in the upper layer portion.
It can be configured by.

In this case, it is possible to form a structure in which a metal layer is formed on the entire surface and then an organic layer is continuously laminated on the entire surface. By continuously forming the organic layer after forming the metal layer, the organic layer can be formed in a state where the oxide film is not formed on the surface of the first electrode.

Alternatively, in the method for manufacturing a display device according to the present disclosure, the first insulating material layer constituting the lower layer portion of the partition wall portion and the metal constituting the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion. By forming the layer, a recess toward the inside of the partition wall can be provided on the side surface portion of the partition wall on the first electrode side.

In this case, the step of forming the partition wall portion and the step of forming the first electrode are
The process of forming the lower layer electrode in the region corresponding to the first electrode and
Next, a step of forming a first insulating material layer constituting the lower layer portion and a metal layer constituting the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion between adjacent lower layer electrodes.
A step of forming a transparent conductive material layer on the entire surface including the partition wall portion, and thus forming a first electrode including the transparent conductive material layer divided by the eaves of the upper layer portion.
It can be configured by.

In this case, it is possible to form a structure in which a transparent conductive material layer is formed on the entire surface and then an organic layer is continuously laminated on the entire surface. By continuously forming the organic layer after forming the transparent conductive material layer, the organic layer can be formed in a state where the oxide film is not formed on the surface of the transparent conductive material layer.

Alternatively, in the method for manufacturing a display device according to the present disclosure, the partition wall is formed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and pixels formed on the surface of the metal layer. After forming from the inter-insulation film, by removing the inter-pixel insulating film on the side surface portion on the first electrode side of the partition wall portion, a recess toward the inside of the partition wall portion on the side surface portion on the first electrode side of the partition wall portion. Can be configured to be provided.

The insulating material constituting the partition wall is not particularly limited as long as the implementation of the present disclosure is not hindered. For example, inorganic materials such as silicon oxide, silicon nitride and silicon oxynitride, and organic materials such as polyimide resin and acrylic resin can be used.

The base material of the partition wall can be formed by using a material appropriately selected from known inorganic materials and organic materials. For example, a physical vapor deposition method (PVD method) exemplified by a vacuum deposition method or a sputtering method). , It can be formed by a combination of a well-known film forming method such as various chemical vapor deposition methods (CVD method) and a well-known patterning method such as an etching method or a lift-off method.

In the display device of the present disclosure, the light emitting unit can be configured to be a so-called top light emitting type. The light emitting portion is formed by sandwiching an organic layer including a hole transport layer, a light emitting layer, an electron transport layer, and the like between a first electrode and a second electrode. When the cathode is shared, the second electrode is the cathode electrode and the first electrode is the anode electrode. In some cases, some or all of the organic layers may be painted for each pixel. Even in such a case, it corresponds to [the organic layer is laminated on the entire surface including the first electrode and the partition wall portion].

It is preferable that a voltage equal to or lower than the threshold voltage of the light emitting unit ELP is applied to the metal layer constituting the light reflecting surface. For example, when the second electrode serves as the cathode electrode, the metal layer constituting the light reflecting surface can have the same voltage as the cathode electrode. The wiring that supplies voltage to the metal layer constituting the light reflecting surface may be connected between pixels or may be connected on the outer periphery of the display area.

The display device of the present disclosure including the above-mentioned preferable configuration may have a so-called monochrome display configuration or a color display configuration. In the case of color display, the emission color itself of the light emitting unit may be a predetermined color such as red, green, or blue. Alternatively, although the light emitting color of the light emitting unit is white, it may be configured to include a color filter arranged above the light emitting unit. The color filter can be formed by using, for example, a resin material impregnated with a pigment or a dye.

In the case of a color display configuration, one pixel is composed of a plurality of sub-pixels, specifically, one pixel is a red display sub-pixel, a green display sub-pixel, and a blue display sub-pixel. It can be configured to consist of two sub-pixels. Furthermore, a set of these three types of sub-pixels plus one or more types of sub-pixels (for example, a set of sub-pixels that emit white light to improve brightness, and a color reproduction range A set with a sub-pixel that emits complementary colors to expand, a set with a sub-pixel that emits yellow to expand the color reproduction range, and a set that emits yellow and cyan to expand the color reproduction range. It can also be composed of one set including sub-pixels).

As the pixel values of the display device, VGA (640,480), S-VGA (800,600), XGA (1024,768), APRC (1152,900), S-XGA (1280,1024), Image display such as U-XGA (1600,1200), HD-TV (1920,1080), Q-XGA (2048,1536), (1920,1035), (720,480), (1280,960), etc. Some of the resolutions can be illustrated, but are not limited to these values.

In the display device according to the present disclosure, the configuration of the drive circuit or the like that controls the light emission of the light emitting unit is not particularly limited. The light emitting portion may be formed, for example, in a certain plane on the substrate, and may be arranged above the drive circuit for driving the light emitting portion via, for example, an interlayer insulating layer. The configuration of the transistors constituting the drive circuit is not particularly limited. It may be a p-channel type field-effect transistor or an n-channel type field-effect transistor.

As the constituent material of the substrate, a semiconductor material, a glass material, or a plastic material can be exemplified. When the drive circuit is composed of transistors formed on a semiconductor substrate, for example, a well region may be provided on a semiconductor substrate made of silicon, and a transistor may be formed in the wells. On the other hand, when the drive circuit is composed of a thin film transistor or the like, a semiconductor thin film can be formed on the substrate made of a glass material or a plastic material to form the drive circuit. The various types of wiring can have a well-known configuration and structure.

The first electrode is provided on the substrate for each light emitting part and functions as an anode electrode of the light emitting part. The first electrode may be formed of, for example, a simple substance or an alloy of a metal such as Cr, Au, Pt, Ni, Cu, Mo, W, Ti, Ta, Al, Fe, or Ag, or these. It may be formed by laminating a plurality of metal layers. In some cases, the first electrode may be formed as a transparent electrode with a transparent conductive material such as indium zinc oxide or indium tin oxide. In such a case, a light reflecting layer made of metal or alloy may be provided between the substrate and the substrate.

The organic layer contains an organic light emitting material and is provided on the first electrode and the partition wall as a common continuous film. The organic layer emits light when a voltage is applied between the first electrode and the second electrode. The organic layer can be composed of, for example, a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are laminated in this order from the first electrode side. The hole transporting material, the hole transporting material, the electron transporting material, and the organic light emitting material constituting the organic layer are not particularly limited, and well-known materials can be used.

The organic layer may be composed of a so-called tandem structure in which a plurality of light emitting layers are connected via a charge generation layer or an intermediate electrode. For example, a light emitting portion that emits white light can be configured by stacking light emitting layers that emit red light, green light, and blue light.

The second electrode is provided on the organic layer as a common continuous film. The second electrode can be formed by using a material having high light transmission. For example, it can be formed using a transparent conductive material such as indium tin oxide, zinc oxide, zinc oxide, aluminum-doped zinc oxide, or gallium-doped zinc oxide. Alternatively, it can be formed by using a metal, an alloy, or the like to make it thin enough to have light transmission.

The protective layer and the filling layer are formed on the second electrode to prevent water and oxygen from entering the organic layer. The protective layer and the packing layer can be constructed by using a material having high light transmittance and low water permeability, for example, silicon oxide (SiO _x ), silicon nitride (SiN _x ), and aluminum oxide (AlO). _{It can be composed of x} ), a resin material such as an epoxy resin or an acrylic resin, or a combination thereof.

The various conditions in this specification are satisfied not only when they are strictly satisfied but also when they are substantially satisfied. The presence of various design or manufacturing variations in the display device is acceptable. The figures used in the following description are schematic. For example, FIG. 2, which will be described later, shows the cross-sectional structure of the display device, but does not show the ratios such as width, height, and thickness.

[First Embodiment]
The first embodiment relates to a display device, a method for manufacturing the display device, and an electronic device according to the present disclosure.

FIG. 1 is a schematic plan view of the display device according to the first embodiment of the present disclosure. The display device 1 is an active matrix type color display display device, and displays an image or the like by controlling the light emission of each of the light emitting units formed by arranging them in a two-dimensional matrix on a substrate. It is a device. A plurality of light emitting units arranged on a plane constitute, for example, a sub-pixel PX of any one of red display, green display, and blue display, and one pixel is composed of these three sub-pixel PXs. .. A partition wall portion 30, which will be described later, is provided between the pixels.

As shown in the figure, the sub-pixels PX are delta-arranged. The size of one pixel surrounded by a broken line is, for example, 5 micrometers × 5 micrometers. In FIG. 1, the red display sub-pixel is indicated by the reference numeral “R”, the green display sub-pixel is indicated by the reference numeral “G”, and the blue display sub-pixel is indicated by the reference numeral “B”.

The planar shape of the sub-pixel PX or the light emitting portion ELP shown in FIG. 2 to be described later is circular. The arrangement of the sub-pixel PX is not limited to the delta arrangement. For example, it may be a so-called stripe arrangement.

In the display device according to the present embodiment, the configuration of the drive circuit that controls the light emission of the sub-pixel PX and the power supply circuit that supplies power to the sub-pixel PX is not particularly limited. Therefore, illustrations and specific explanations relating to these will be omitted.

FIG. 2 is a schematic partial cross-sectional view of the display device according to the first embodiment.

In the display device 1, the light emitting portion ELP formed by laminating the first electrode 20, the organic layer 50, and the second electrode 60 is formed on the substrate 10 by arranging them in a two-dimensional matrix. The first electrode 20 is provided for each light emitting unit ELP. A partition wall 30 is formed between the adjacent first electrodes 20, and the organic layer 50 and the second electrode 60 are laminated on the entire surface including the first electrode 20 and the partition wall 30. A protective layer 70 and a filling layer 80 are sequentially formed on the entire surface including the second electrode 60, and a color filter 90 corresponding to the color to be displayed is formed on the protective layer 70. The partition wall portion 30 has a light reflecting surface RS made of a metal layer 32. A recess GP toward the inside of the partition wall 30 is provided on the side surface portion of the partition wall 30 on the side of the first electrode 20. The same applies to other embodiments described later.

In the first embodiment, the partition wall portion 30 is composed of a base material 31 made of an insulating material and provided with a recess GP, and a metal layer 32 formed on the surface of the base material 31 excluding the recess GP.

The substrate 10 is a support that supports a plurality of light emitting units ELP arranged on one surface. Although not shown, the substrate 10 is provided with a drive circuit for controlling light emission of the light emitting unit ELP, a power supply circuit for supplying electric power, scanning lines, data lines, and the like. The substrate 10 is made of, for example, a semiconductor material such as a transistor that can be easily formed.

The first electrode 20 is made of, for example, an aluminum-copper alloy (AlCu), and is provided for each light emitting unit ELP. The first electrode 20 functions as an anode electrode of the light emitting unit ELP. The partition wall portion 30 is provided between the adjacent first electrodes 20 and separates each of the light emitting portions ELP. The cross-sectional shape of the partition wall portion 30 is a substantially trapezoidal shape (tapered shape) having an inclined surface. A substantially circular opening is formed between the partition wall portion 30 and the partition wall portion 30 with the first electrode 20 side as the bottom and the opposite side open.

The organic layer 50 and the second electrode 60 are laminated on the entire surface including the first electrode 20 and the partition wall 30. The light emitting unit ELP is configured by sandwiching an organic layer 50 including a hole transport layer, a light emitting layer, an electron transport layer, and the like between a first electrode 20 and a second electrode 60. A protective layer 70 is laminated on the second electrode 60 in order to prevent the permeation of water into the light emitting portion ELP.

The organic layer 50 has a multi-layer structure, but this is shown as a single layer in the figure. The organic layer 50 has a structure in which a red light emitting layer, a green light emitting layer, a blue light emitting layer, and the like are laminated, and emits white light.

A filling layer 80 is formed on the protective layer 70, and the recess between the partition wall portion 30 and the partition wall portion 30 is filled with the filling layer 80. A color filter 90 corresponding to the color to be displayed is provided on the packing layer 80. Further, a transparent facing substrate (not shown) may be arranged.

As described above, a recess GP toward the inside of the partition wall 30 is provided on the side surface portion of the partition wall 30 on the first electrode 20 side. The height and width of the recess GP are generally set to about 10% to 100% of the film thickness of the organic layer 50, and are, for example, about 30 nanometers.

Since a gap due to the recess GP is provided between the end of the light reflecting surface RS or the base material 31 and the first electrode 20, the electric charge injected from the first electrode 20 is adjacent via the surface of the partition wall 30. Leakage to the first electrode 20 and abnormal light emission of the organic layer 50 at the end of the partition wall 30 are suppressed. Further, since a part of the light incident on the recess GP can be reflected and taken out to the outside, the luminous efficiency is also improved.

In order to improve the contrast, for example, a light-shielding layer constituting a so-called black matrix may be provided. The shielding layer can be constructed using, for example, a material such as chromium (Cr) or graphite. The shielding layer may be formed in the same layer as the color filter 90, or may be formed in a layer different from the color filter 90.

Further, in order to further improve the luminous efficiency, a microlens for condensing may be arranged above the light emitting portion. The shape of the microlens is not particularly limited, and may be, for example, a hemispherical shape or a cylindrical shape.

Next, the manufacturing method of the display device 1 will be described.

As will be described in detail below, the method of manufacturing the display device 1 is as follows.
The process of forming the first electrode corresponding to each light emitting part,
The step of forming a partition wall in the corresponding region between the adjacent first electrodes, and
A step of laminating an organic layer and a second electrode on the entire surface including the first electrode and the partition wall,
have. The step of forming the partition wall portion includes a step of providing a recess toward the inside of the partition wall portion on a side surface portion of the partition wall portion on the first electrode side, and a step of providing a light reflecting surface made of a metal layer on the partition wall portion. The same applies to other embodiments described later.

3 to 7 are schematic partial end view views for explaining the manufacturing method of the display device according to the first embodiment.

[Step-100] (see FIGS. 3A, 3B and 3C)
First, the first electrode 20 is formed on the substrate 10. Specifically, a substrate 10 is prepared (see FIG. 3A), and a metal material layer 20A made of, for example, an aluminum-copper alloy (AlCu) is formed on the substrate 10 (see FIG. 3B). Next, the portion corresponding to the first electrode 20 is covered with a mask and etched to obtain the first electrode 20 (see FIG. 3C).

[Step-110] (see FIGS. 4A, 4B, 5A, 5B, 6A and 6B).
After that, the partition wall portion 30 is formed on the substrate 10. First, the insulating material layer 31A is formed on the entire surface of the substrate 10 including the first electrode 20 (see FIG. 4A). Next, the portion corresponding to the base material 31 is covered with a mask and etched to form the base material 31 (see FIG. 4B). In this etching, a treatment is performed so that the first electrode 20 between the base material 31 and the base material 31 is exposed.

Then, after covering the exposed portion of the first electrode 20 with an insulating material layer 39 using the same material as the base material 31 (see FIG. 5A), a metal material layer 32A is formed on the entire surface (see FIG. 5B). .. Next, the metal material layer 32A on the insulating material layer 39 is removed to form the metal layer 32 on the base material 31 (FIG. 6A). Then, the insulating material layer 39 is removed by etching. Since the metal layer 32 is not formed on the side surface of the base material 31 on the side of the first electrode 20, a recess GP is formed in the base material 31 by this etching process (see FIG. 6B).

[Step-120] (see FIGS. 7A and 7B)
Next, the organic layer 50 is formed on the entire surface (see FIG. 7A), and then the second electrode 60 is formed (see FIG. 7B).

[Step-130] (see FIG. 2)
After that, the display device 1 can be obtained by sequentially forming the protective layer 70 and the filling layer 80, and then arranging the color filter 90.

The manufacturing method of the display device 1 according to the first embodiment has been described above.

Subsequently, a modified example of the display device according to the first embodiment will be described.

FIG. 8 is a schematic partial cross-sectional view of the display device according to the modified example of the first embodiment. In the schematic plan view of the display device 1A according to the modified example, the display device 1 may be read as the display device 1A in FIG.

Also in the display device 1A, the light emitting portion ELP formed by laminating the first electrode 20, the organic layer 50, and the second electrode 60 is formed on the substrate 10 by arranging them in a two-dimensional matrix. The first electrode 20 is provided for each light emitting unit ELP. A partition wall 130 is formed between the adjacent first electrodes 20, and the organic layer 50 and the second electrode 60 are laminated on the entire surface including the first electrode 20 and the partition wall 130. A protective layer 70 and a filling layer 80 are sequentially formed on the entire surface including the second electrode 60, and a color filter 90 corresponding to the color to be displayed is formed on the protective layer 70.

In the display device 1A, the partition wall 130 is composed of a base material 131 made of an insulating material and a metal layer 132 formed on the base material 131 and protruding like a canopy with respect to the base material 131. In the display device 1A, the slope of the metal layer 132 constitutes the light reflecting surface RS. Further, similarly to the display device 1, a recess GP toward the inside of the partition wall 130 is provided on the side surface portion of the partition wall 130 on the first electrode 20 side.

Since the gap due to the recess GP is provided, the electric charge injected from the first electrode 20 may leak to the adjacent first electrode 20 through the surface of the partition wall 130, as described in the display device 1. , It is suppressed that the organic layer 50 emits light abnormally at the end of the partition wall 130. Further, since a part of the light incident on the recess GP can be reflected and taken out to the outside, the luminous efficiency is also improved.

Next, the manufacturing method of the display device 1A will be described.

9 to 11 are schematic partial end views for explaining the manufacturing method of the display device 1A.

[Step-100A]
The same steps as in [Step-100] described in the first embodiment are performed to form the first electrode 20 on the substrate 10 (see the previous FIG. 3C).

[Step-110A] (See FIGS. 9A, 9B, 10A, 10B and 11A).
After that, the partition wall portion 130 is formed on the substrate 10. First, the insulating material layer 131A is formed on the entire surface of the substrate 10 including the first electrode 20 (see FIG. 9A). Then, for example, the insulating material layer 131A is flattened and thinned by CMP (see FIG. 9B).

After that, the metal material layer 132A is formed on the entire surface (see FIG. 10A), and then the portion corresponding to the metal layer 132 is covered with a mask and etched to form the metal layer 132 (see FIG. 10B). In this etching, the metal layer 132 is treated so that the first electrode 20 side has an eaves shape.

After that, etching is performed using the metal layer 132 as a mask to remove the insulating material layer 131A. By this step, a recess GP is formed in the base material 131 (see FIG. 11A).

[Step-120A] (see FIG. 11B)
Next, the organic layer 50 is formed on the entire surface, and then the second electrode 60 is formed.

[Step-130A]
Next, the display device 1A can be obtained by sequentially forming the protective layer 70 and the filling layer 80, and then arranging the color filter 90.

[Second Embodiment]
The second embodiment also relates to a display device, a method for manufacturing the display device, and an electronic device according to the present disclosure.

In the second embodiment, the partition wall is composed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and an inter-pixel insulating film formed on the surface of the metal layer. The recess is provided by removing the inter-pixel insulating film on the side surface portion of the partition wall portion on the first electrode side. Except for the above points, the configuration is the same as that of the first embodiment.

FIG. 12 is a schematic partial cross-sectional view of the display device according to the second embodiment. In the schematic plan view of the display device 2 according to the second embodiment, the display device 1 may be read as the display device 2 in FIG.

Also in the display device 2, the light emitting portion ELP formed by laminating the first electrode 20, the organic layer 50, and the second electrode 60 is formed on the substrate 10 by arranging them in a two-dimensional matrix. The first electrode 20 is provided for each light emitting unit ELP. A partition wall 230 is formed between the adjacent first electrodes 20, and the organic layer 50 and the second electrode 60 are laminated on the entire surface including the first electrode 20 and the partition wall 230. A protective layer 70 and a filling layer 80 are sequentially formed on the entire surface including the second electrode 60, and a color filter 90 corresponding to the color to be displayed is formed on the protective layer 70.

In the display device 2, the partition wall portion 230 is composed of a base material 31 made of an insulating material, a metal layer 32 formed on the surface of the base material 31, and an inter-pixel insulating film 233 formed on the surface of the metal layer 32. .. The recess GP is provided by removing the inter-pixel insulating film 233 on the side surface portion of the partition wall 230 on the side of the first electrode 20. Except for the above points, the configuration is the same as that of the first embodiment.

Since the gap due to the recess GP is provided, the electric charge injected from the first electrode 20 may leak to the adjacent first electrode 20 through the surface of the partition wall 230, as described in the display device 1. , It is suppressed that the organic layer 50 emits light abnormally at the end of the partition wall 230. Further, since a part of the light incident on the recess GP can be reflected and taken out to the outside, the luminous efficiency is also improved.

Next, the manufacturing method of the display device 2 will be described.

13 and 14 are schematic partial end views for explaining the manufacturing method of the display device 2.

[Process-200]
In [Step-100] described in the first embodiment, the steps shown in FIGS. 3A to 5B are performed.

[Step-210] (See FIGS. 13A, 13B, 14A and 14B).
Next, the portion corresponding to the metal layer 32 is covered with a mask and etched to form the metal layer 32, and the insulating material layer 39 is also removed (see FIG. 13A).

After that, an insulating material film 233A is formed on the entire surface (see FIG. 13B). Next, etching is performed so as to leave the insulating material film 233A of the portion covering the base material 31 and the metal layer 33 to form the inter-pixel insulating film 233 (see FIG. 14A). After that, the inter-pixel insulating film 233 is etched to make the whole thin film. By this step, the inter-pixel insulating film 233 of the side surface portion on the first electrode 20 side of the partition wall portion 230 is removed, and the recess GP is formed.

[Process-220]
Next, the display device 2 can be obtained by performing the same steps as in [Step-120] and [Step-130] described in the first embodiment.

[Third Embodiment]
A third embodiment also relates to a display device, a method for manufacturing the display device, and an electronic device according to the present disclosure.

Similar to the first embodiment, in the third embodiment, the partition wall is made of a base material made of an insulating material and provided with recesses, and a metal layer formed on the surface of the base material excluding the recesses. Become. However, the base material of the partition wall is composed of a lower layer portion composed of the first insulating material layer and an upper layer portion composed of the second insulating material layer having a shape protruding like an eaves with respect to the lower layer portion. Become. Further, the first electrode is formed by a metal layer which is the same layer as the metal layer of the partition wall portion. Except for the above points, the configuration is the same as that of the first embodiment.

FIG. 15 is a schematic partial cross-sectional view of the display device according to the third embodiment. In the schematic plan view of the display device 3 according to the third embodiment, the display device 1 may be read as the display device 3 in FIG.

Also in the display device 3, the light emitting portion ELP formed by laminating the first electrode 320, the organic layer 50, and the second electrode 60 is formed on the substrate 10 by arranging them in a two-dimensional matrix. The first electrode 320 is provided for each light emitting unit ELP. A partition wall 330 is formed between the adjacent first electrodes 20, and the organic layer 50 and the second electrode 60 are laminated on the entire surface including the first electrode 320 and the partition wall 330. A protective layer 70 and a filling layer 80 are sequentially formed on the entire surface including the second electrode 60, and a color filter 90 corresponding to the color to be displayed is formed on the protective layer 70.

Also in the display device 3, the partition wall portion 330 is composed of a base material 331 made of an insulating material and provided with a recess GP, and a metal layer 332 formed on the surface of the base material 331 excluding the recess GP. However, the base material 331 of the partition wall portion 330 is composed of a lower layer portion 331B composed of a first insulating material layer and a second insulating material layer having a shape protruding in an eaves shape with respect to the lower layer portion 331B. It is composed of an upper layer portion 331T. Further, the first electrode 320 is formed of a metal layer in the same layer as the metal layer 332 of the partition wall 330.

Since the gap due to the recess GP is provided, the electric charge injected from the first electrode 320 may leak to the adjacent first electrode 320 through the surface of the partition wall 330, as described in the display device 1. The organic layer 50 is prevented from emitting abnormal light at the end of the partition wall 330. Further, since a part of the light incident on the recess GP can be reflected and taken out to the outside, the luminous efficiency is also improved.

Next, the manufacturing method of the display device 3 will be described.

16 and 17 are schematic partial end views for explaining the manufacturing method of the display device 3.

As will be described in detail below, in the manufacturing method of the display device 3, the partition wall portion 330 is formed by forming the upper layer portion 331T having a shape protruding in an eaves shape with respect to the lower layer portion 331B and the lower layer portion 331B of the partition wall portion 330. A recess GP facing the inside of the partition wall 330 is provided on the side surface of the first electrode 320.

Then, the step of forming the partition wall portion 330 and the step of forming the first electrode 320 are performed.
In the corresponding region between the adjacent first electrodes 320, the first insulating material layer constituting the lower layer portion 331B and the second insulating material forming the upper layer portion 331T having a shape protruding in an eaves shape with respect to the lower layer portion 331B. The process of forming the material layer and
A metal layer 332 is formed on the entire surface, thus a light reflecting surface RS composed of a metal layer 332 is formed on the partition wall 330, and a first electrode 320 including a metal layer 332 separated by the eaves of the upper layer 331T is formed. Process,
Do by.

Further, after forming the metal layer 332 on the entire surface, a step of continuously laminating the organic layer 50 on the entire surface is performed.

[Step-300] (see FIGS. 16A and 16B)
First, the base material 331 of the partition wall 330 is formed on the substrate 10. Specifically, the substrate 10 is prepared (see FIG. 3A), and the first insulating material layer 331B and the second insulating material layer 331T are sequentially laminated on the substrate 10. Next, a mask is placed on the portion corresponding to the partition wall portion 330, and etching treatment is performed. At the time of the etching process, the process is performed so that the upper side of the insulating material layer 331B is more etched (see FIG. 16A). Subsequently, by selectively etching the first insulating material layer 331B, the first insulating material layer constituting the lower layer portion 331B and the upper layer portion 331T having a shape protruding in an eaves shape with respect to the lower layer portion 331B are formed. A second insulating material layer is formed (see FIG. 16B).

[Step-310] (see FIGS. 17A and 17B)
After that, a metal layer 332 is formed on the entire surface. By setting the thickness of the metal layer 332 to be thinner than that of the first insulating material layer 331B, the metal layer 332 is divided at the eaves portion of the second insulating material layer 331T (see FIG. 17A). The metal layer 332 on the base material 331 forms a light reflecting surface RS composed of the metal layer 332. Further, the first electrode 320 is formed by the divided metal layer 332.

Next, a step of continuously laminating the organic layer 50 on the entire surface is performed, and then the second electrode 60 is formed (see FIG. 17B). Since the metal layer 332 and the organic layer 50 are continuously formed, no oxide film or the like is formed at the interface between the metal layer 332 and the organic layer 50. This makes it possible to improve the light emitting characteristics of the light emitting unit ELP. In order to prevent the organic layer 50 from being divided by the eaves of the upper layer portion 331T, the total film thickness of the metal layer 332 and the organic layer 50 should exceed the film thickness of the first insulating material layer 331B. good.

[Process-320]
After that, the display device 3 can be obtained by sequentially forming the protective layer 70 and the filling layer 80, and then arranging the color filter 90.

The manufacturing method of the display device 3 according to the third embodiment has been described above.

Subsequently, a modified example of the display device according to the third embodiment will be described.

FIG. 18 is a schematic partial cross-sectional view of the display device according to the modified example of the third embodiment. In the schematic plan view of the display device 3A according to the modified example, the display device 1 may be read as the display device 3A in FIG.

In the display device 3A, the first insulating material layer constituting the lower layer portion 331B and the second insulating material layer constituting the upper layer portion 331T are formed so as to have an inverted taper shape, respectively. Also in this configuration, the partition wall portion 330 is composed of a base material 331 made of an insulating material and provided with a recess GP, and a metal layer 332 formed on the surface of the base material 331 excluding the recess GP. The manufacturing method of the display device 3A is the same as the manufacturing method of the display device 3 except that the first insulating material layer 331B is etched in a reverse taper shape, and thus the description thereof will be omitted.

[Fourth Embodiment]
A fourth embodiment also relates to a display device, a method for manufacturing the display device, and an electronic device according to the present disclosure.

FIG. 19 is a schematic partial cross-sectional view of the display device according to the fourth embodiment. In the schematic plan view of the display device 4 according to the fourth embodiment, the display device 1 may be read as the display device 4 in FIG.

In the third embodiment, the first electrode 320 was formed by the divided metal layer 332. In the fourth embodiment, the first electrode 420 is different in that the divided metal layer 332 is laminated on the lower electrode 421 provided in advance on the substrate. Other than the above points, the other configurations are the same as the configurations described in the display device 3.

Next, the manufacturing method of the display device 4 will be described.

20 and 21 are schematic partial end views for explaining the manufacturing method of the display device 4.

[Step-400] (see FIG. 20A)
First, the lower layer electrode 421 is formed on the portion of the substrate 10 corresponding to the light emitting portion ELP. The lower layer electrode 421 is formed so as to cover a contact portion (not shown) provided on the substrate 10. As a result, it is possible to reliably secure the connection with the drive circuit of the light emitting unit ELP and the like.

[Step-410] (see FIG. 20B)
Next, the base material 331 of the partition wall 330 is formed on the substrate 10. Basically, the same steps as in [Step-300] described in the third embodiment are performed, and the shape protrudes like an eaves with respect to the first insulating material layer and the lower layer portion 331B constituting the lower layer portion 331B. A second insulating material layer constituting the upper layer portion 331T is formed.

[Step-420] (see FIG. 21A)
After that, a metal layer 332 is formed on the entire surface. By setting the thickness of the metal layer 332 to be thinner than that of the first insulating material layer 331B, the metal layer 332 is divided at the eaves portion of the second insulating material layer 331T. The metal layer 332 on the base material 331 forms a light reflecting surface RS composed of the metal layer 332. Further, the first electrode 420 is formed by the metal layer 332 separated from the lower electrode 421.

[Step-430] (see FIG. 21B)
Next, a step of continuously laminating the organic layer 50 on the entire surface is performed, and then the second electrode 60 is formed. Since the metal layer 332 and the organic layer 50 are continuously formed, no oxide film or the like is formed at the interface between the metal layer 332 and the organic layer 50. This makes it possible to improve the light emitting characteristics of the light emitting unit ELP. In order to prevent the organic layer 50 from being divided by the eaves of the upper layer portion 331T, the total film thickness of the metal layer 332 and the organic layer 50 should exceed the film thickness of the first insulating material layer 331B. good.

[Step-440]
After that, the display device 4 can be obtained by sequentially forming the protective layer 70 and the filling layer 80, and then arranging the color filter 90.

[Fifth Embodiment]
A fifth embodiment also relates to a display device, a method for manufacturing the display device, and an electronic device according to the present disclosure.

FIG. 22 is a schematic partial cross-sectional view of the display device according to the fifth embodiment. In the schematic plan view of the display device 5 according to the fifth embodiment, the display device 1 may be read as the display device 5 in FIG.

In the fifth embodiment, the partition wall portion 530 is composed of a base material 531 made of an insulating material and a metal layer 532 formed on the base material 531 and protruding like a canopy with respect to the base material 531. A transparent conductive material layer 533 is formed on the surface of the metal layer 532 of the partition wall portion 530. Further, the first electrode 520 is covered with a transparent conductive material layer which is the same layer as the transparent conductive material layer 533 of the partition wall portion 530.

Next, the manufacturing method of the display device 5 will be described.

FIG. 23 is a schematic partial end view for explaining the manufacturing method of the display device 5.

As will be described in detail below, in the manufacturing method of the display device 5, the first insulating material layer constituting the lower layer portion of the partition wall portion and the metal layer constituting the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion. By forming the above, a recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.

Then, the step of forming the partition wall portion 530 and the step of forming the first electrode 520 are performed.
The step of forming the lower electrode 421 in the region corresponding to the first electrode 520 and the process of forming the lower electrode 421.
Next, between the adjacent lower layer electrodes 421, a step of forming a first insulating material layer 531 constituting the lower layer portion and a metal layer 532 forming the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion, and a step of forming the metal layer 532.
A step of forming a transparent conductive material layer 533 on the entire surface including the partition wall portion 530, and thus forming a first electrode 520 including the transparent conductive material layer 533 separated by the eaves of the metal layer 532 of the upper layer portion.
Do by.

[Step-500] (see FIG. 23A).
First, the lower layer electrode 421 is formed on the portion of the substrate 10 corresponding to the light emitting portion ELP. Basically, the same process as in [Step-400] in the fourth embodiment is performed. Next, the partition wall portion 530 is formed on the substrate 10. A first insulating material layer constituting the lower layer portion 531 is performed in the same manner as in [Step-300] described in the third embodiment, except that the upper layer portion 532 is made of a metal material. And the metal layer constituting the upper layer portion 532 having a shape protruding in an eaves shape with respect to the lower layer portion 531 is formed. The light reflecting surface RS is formed by the slope of the metal layer 532.

[Step-510] (see FIG. 23B)
Then, a transparent conductive material layer 533 made of, for example, indium tin oxide is formed on the entire surface. By setting the thickness of the transparent conductive material layer 533 to be thinner than that of the first insulating material layer 531, the transparent conductive material layer 533 is divided at the eaves portion of the metal layer 532. The first electrode 520 is formed by the transparent conductive material layer 533 separated from the lower electrode 421.

[Process-520]
Next, a step of continuously laminating the organic layer 50 on the entire surface is performed, and then the second electrode 60 is formed. Since the transparent conductive material layer 533 and the organic layer 50 are continuously formed, no oxide film or the like is formed at the interface between the transparent conductive material layer 533 and the organic layer 50. This makes it possible to improve the light emitting characteristics of the light emitting unit ELP. In order to prevent the organic layer 50 from being divided by the eaves of the metal layer 532, the total film thickness of the transparent conductive material layer 533 and the organic layer 50 may exceed the film thickness of the lower layer portion 531.

[Process-530]
After that, the display device 5 can be obtained by performing [Step-430] and [Step-440] described in the fourth embodiment.

Although the embodiments of the present disclosure have been specifically described above, the present disclosure is not limited to the above-described embodiments, and various modifications based on the technical idea of the present disclosure are possible. For example, the numerical values, structures, processes, etc. mentioned in the above-described embodiments are merely examples, and numerical values, structures, processes, etc. different from these may be used as necessary.

For example, even in a configuration in which the metal layer of the partition wall is omitted and light is totally reflected at the interface by utilizing the difference in refractive index between the insulating material of the partition wall and the organic layer formed on the insulating material of the partition wall, the partition wall is also used. By providing a concave portion on the side surface portion on the first electrode side in the above, the light extraction efficiency can be improved and leakage between adjacent pixels can be reduced.

It should be noted that the effects described in the present specification are merely examples and are not limited, and other effects may be obtained.

[Explanation of electronic devices]
The display device of the present disclosure described above is used as a display unit (display device) of an electronic device in all fields for displaying a video signal input to an electronic device or a video signal generated in the electronic device as an image or a video. Can be used. As an example, it can be used as a display unit of, for example, a television set, a digital still camera, a notebook personal computer, a mobile terminal device such as a mobile phone, a video camera, a head mount display (head-mounted display), or the like.

The display device of the present disclosure also includes a modular device having a sealed configuration. As an example, a display module formed by attaching a facing portion such as transparent glass to a pixel array portion is applicable. The display module may be provided with a circuit unit for inputting / outputting a signal or the like from the outside to the pixel array unit, a flexible printed circuit (FPC), or the like. Hereinafter, a digital still camera and a head-mounted display will be illustrated as specific examples of the electronic device using the display device of the present disclosure. However, the specific examples illustrated here are only examples, and are not limited to these.

(Specific example 1)
FIG. 24 is an external view of an interchangeable lens type single-lens reflex type digital still camera, the front view thereof is shown in FIG. 24A, and the rear view thereof is shown in FIG. 24B. An interchangeable lens single-lens reflex type digital still camera has, for example, an interchangeable photographing lens unit (interchangeable lens) 712 on the front right side of the camera body (camera body) 711, and is held by the photographer on the front left side. It has a grip portion 713 for the purpose.

A monitor 714 is provided in the center of the back of the camera body 711. A viewfinder (eyepiece window) 715 is provided on the upper part of the monitor 714. By looking into the viewfinder 715, the photographer can visually recognize the light image of the subject guided by the photographing lens unit 712 and determine the composition.

In the interchangeable lens single-lens reflex type digital still camera having the above configuration, the display device of the present disclosure can be used as the viewfinder 715. That is, the interchangeable lens type single-lens reflex type digital still camera according to this example is manufactured by using the display device of the present disclosure as its viewfinder 715.

(Specific example 2)
FIG. 25 is an external view of the head-mounted display. The head-mounted display has, for example, ear hooks 812 for being worn on the user's head on both sides of the eyeglass-shaped display unit 811. In this head-mounted display, the display device of the present disclosure can be used as the display unit 811. That is, the head-mounted display according to this example is manufactured by using the display device of the present disclosure as the display unit 811.

(Specific example 3)
FIG. 26 is an external view of the see-through head-mounted display. The see-through head-mounted display 911 includes a main body 912, an arm 913, and a lens barrel 914.

The main body 912 is connected to the arm 913 and the glasses 900. Specifically, the end portion of the main body portion 912 in the long side direction is connected to the arm 913, and one side of the side surface of the main body portion 912 is connected to the eyeglasses 900 via a connecting member. The main body 912 may be directly attached to the head of the human body.

The main body 912 incorporates a control board for controlling the operation of the see-through head-mounted display 911 and a display. The arm 913 connects the main body 912 and the lens barrel 914, and supports the lens barrel 914. Specifically, the arm 913 is coupled to the end of the main body 912 and the end of the lens barrel 914, respectively, to fix the lens barrel 914. Further, the arm 913 has a built-in signal line for communicating data related to an image provided from the main body 912 to the lens barrel 914.

The lens barrel 914 projects the image light provided from the main body 912 via the arm 913 toward the eyes of the user who wears the see-through head-mounted display 911 through the eyepiece. In this see-through head-mounted display 911, the display device of the present disclosure can be used for the display unit of the main body unit 912.

[others]
The technology of the present disclosure can also have the following configurations.

[A1]
The light emitting portion formed by laminating the first electrode, the organic layer, and the second electrode is formed on the substrate by arranging them in a two-dimensional matrix.
The first electrode is provided for each light emitting part, and is provided for each light emitting part.
A partition wall is formed between the adjacent first electrodes.
The organic layer and the second electrode are laminated on the entire surface including the first electrode and the partition wall portion.
The partition wall has a light reflecting surface made of a metal layer, and has a light reflecting surface.
A recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.
Display device.
[A2]
The partition wall is composed of a base material made of an insulating material and provided with recesses, and a metal layer formed on the surface of the base material excluding the recesses.
The display device according to the above [A1].
[A3]
The base material of the partition wall is composed of a lower layer portion composed of a first insulating material layer and an upper layer portion composed of a second insulating material layer having a shape protruding in an eaves shape with respect to the lower layer portion.
The display device according to the above [A2].
[A4]
The first electrode is formed of a metal layer that is the same as the metal layer of the partition wall.
The display device according to the above [A2] or [A3].
[A5]
The metal layer consists of either aluminum, aluminum alloy or silver,
The display device according to any one of the above [A2] to [A4].
[A6]
The partition wall is composed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and an inter-pixel insulating film formed on the surface of the metal layer.
The recess is provided by removing the inter-pixel insulating film on the side surface portion of the partition wall portion on the first electrode side.
The display device according to the above [A2].
[A7]
The partition wall is composed of a base material made of an insulating material and a metal layer formed on the upper part of the base material and protruding like an eaves with respect to the base material.
The display device according to the above [A1].
[A8]
The metal layer consists of either aluminum, aluminum alloy or silver,
The display device according to the above [A7].
[A9]
A transparent conductive material layer is formed on the surface of the metal layer of the partition wall.
The display device according to the above [A7] or [A8].
[A10]
The first electrode is covered with a transparent conductive material layer which is the same layer as the transparent conductive material layer of the partition wall.
The display device according to the above [A9].
[A11]
The transparent conductive material layer consists of indium tin oxide or zinc oxide,
The display device according to the above [A9] or [A10].

[B1]
A method for manufacturing a display device in which light emitting portions formed by stacking a first electrode, an organic layer, and a second electrode are arranged on a substrate in a two-dimensional matrix.
The process of forming the first electrode corresponding to each light emitting part,
The step of forming a partition wall in the corresponding region between the adjacent first electrodes, and
A step of laminating an organic layer and a second electrode on the entire surface including the first electrode and the partition wall,
Have and
The step of forming the partition wall portion includes a step of providing a recess toward the inside of the partition wall portion on a side surface portion of the partition wall portion on the first electrode side and a step of providing a light reflecting surface made of a metal layer on the partition wall portion.
How to manufacture a display device.
[B2]
The first electrode in the partition wall portion is formed by forming the first insulating material layer constituting the lower layer portion of the partition wall portion and the second insulating material layer forming the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion. Provide a recess toward the inside of the partition wall on the side surface.
The method for manufacturing a display device according to the above [B1].
[B3]
The process of forming the partition wall and the process of forming the first electrode,
In the corresponding region between the adjacent first electrodes, a first insulating material layer constituting the lower layer portion and a second insulating material layer forming the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion are formed. And the process to do
A step of forming a metal layer on the entire surface, thus forming a light reflecting surface composed of a metal layer on a partition wall portion, and forming a first electrode including a metal layer divided by an eaves in the upper layer portion.
Do by
The method for manufacturing a display device according to the above [B2].
[B4]
After forming a metal layer on the entire surface, a step of continuously laminating an organic layer on the entire surface is performed.
The method for manufacturing a display device according to the above [B3].
[B5]
By forming the first insulating material layer that constitutes the lower layer portion of the partition wall portion and the metal layer that constitutes the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion, the side surface of the partition wall portion on the first electrode side is formed. Provide a recess in the portion toward the inside of the partition wall,
The method for manufacturing a display device according to the above [B1].
[B6]
The process of forming the partition wall and the process of forming the first electrode,
The process of forming the lower layer electrode in the region corresponding to the first electrode and
Next, a step of forming a first insulating material layer constituting the lower layer portion and a metal layer constituting the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion between adjacent lower layer electrodes.
A step of forming a transparent conductive material layer on the entire surface including the partition wall portion, and thus forming a first electrode including the transparent conductive material layer divided by the eaves of the upper layer portion.
Do by
The method for manufacturing a display device according to the above [B5].
[B7]
After forming a transparent conductive material layer on the entire surface, a step of continuously laminating an organic layer on the entire surface is performed.
The method for manufacturing a display device according to the above [B6].
[B8]
The partition wall is formed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and an interpixel insulating film formed on the surface of the metal layer, and then on the first electrode side of the partition wall. By removing the inter-pixel insulating film on the side surface portion, a recess toward the inside of the partition wall portion is provided on the side surface portion on the first electrode side of the partition wall portion.
The method for manufacturing a display device according to the above [B1].

[C1]
The light emitting portion formed by laminating the first electrode, the organic layer, and the second electrode is formed on the substrate by arranging them in a two-dimensional matrix.
The first electrode is provided for each light emitting part, and is provided for each light emitting part.
A partition wall is formed between the adjacent first electrodes.
The organic layer and the second electrode are laminated on the entire surface including the first electrode and the partition wall portion.
The partition wall has a light reflecting surface made of a metal layer, and has a light reflecting surface.
A recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.
An electronic device equipped with a display device.
[C2]
The partition wall is composed of a base material made of an insulating material and provided with recesses, and a metal layer formed on the surface of the base material excluding the recesses.
The electronic device according to the above [C1].
[C3]
The base material of the partition wall is composed of a lower layer portion composed of a first insulating material layer and an upper layer portion composed of a second insulating material layer having a shape protruding in an eaves shape with respect to the lower layer portion.
The electronic device according to the above [C2].
[C4]
The first electrode is formed of a metal layer that is the same as the metal layer of the partition wall.
The electronic device according to the above [C2] or [C3].
[C5]
The metal layer consists of either aluminum, aluminum alloy or silver,
The electronic device according to any one of the above [C2] to [C4].
[C6]
The partition wall is composed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and an inter-pixel insulating film formed on the surface of the metal layer.
The recess is provided by removing the inter-pixel insulating film on the side surface portion of the partition wall portion on the first electrode side.
The electronic device according to the above [C2].
[C7]
The partition wall is composed of a base material made of an insulating material and a metal layer formed on the upper part of the base material and protruding like an eaves with respect to the base material.
The electronic device according to the above [C1].
[C8]
The metal layer consists of either aluminum, aluminum alloy or silver,
The electronic device according to the above [C7].
[C9]
A transparent conductive material layer is formed on the surface of the metal layer of the partition wall.
The electronic device according to the above [C7] or [C8].
[C10]
The first electrode is covered with a transparent conductive material layer which is the same layer as the transparent conductive material layer of the partition wall.
The electronic device according to the above [C9].
[C11]
The transparent conductive material layer consists of indium tin oxide or zinc oxide,
The electronic device according to the above [C9] or [C10].

1,1A, 2,3,3A,4,5 ... Display device, 10 ... Substrate, 20 ... First electrode, 20A ... Metal material layer, 30 ... Partition part, 31. .. Substrate, 31A ... Insulating material layer, 32 ... Metal layer, 32A ... Metal material layer, 39 ... Insulating material layer, 50 ... Organic layer, 60 ... Second electrode , 70 ... protective layer, 80 ... filling layer, 90 ... color filter, 130 ... partition, 131 ... base material, 131A ... insulating material layer, 132 ... metal layer , 132A ... metal material layer, 230 ... partition wall portion, 233 ... interpixel insulating film, 233A ... insulating material film, 320 ... first electrode, 330 ... partition wall portion, 331. .. Substrate, 331B ... Lower layer of base material, 331T ... Upper layer of base material, 332 ... Metal layer, 420 ... First electrode, 421 ... Lower electrode, 520 ... First electrode, 530 ... partition, 513 ... base material, lower layer of base material, first insulating material layer, 532 ... metal layer, 533 ... transparent conductive material layer, 711.・・ Camera body, 712 ・・・ Shooting lens unit, 713 ・・・ Grip part, 714 ・・・ Monitor, 715 ・・・ Viewfinder, 811 ・・・ Glass-shaped display part, 812 ・・・ Ear hook Part, 900 ... Glasses (eyewear), 911 ... See-through head mount display, 912 ... Main body, 913 ... Arm, 914 ... Lens barrel, RS ... Light reflecting surface, GP ... recess, R ... red display pixel, G ... green display pixel, B ... blue display pixel

Claims

The light emitting portion formed by laminating the first electrode, the organic layer, and the second electrode is formed on the substrate by arranging them in a two-dimensional matrix.
The first electrode is provided for each light emitting part, and is provided for each light emitting part.
A partition wall is formed between the adjacent first electrodes.
The organic layer and the second electrode are laminated on the entire surface including the first electrode and the partition wall portion.
The partition wall has a light reflecting surface made of a metal layer, and has a light reflecting surface.
A recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.
Display device.
The partition wall is composed of a base material made of an insulating material and provided with recesses, and a metal layer formed on the surface of the base material excluding the recesses.
The display device according to claim 1.
The base material of the partition wall is composed of a lower layer portion composed of a first insulating material layer and an upper layer portion composed of a second insulating material layer having a shape protruding in an eaves shape with respect to the lower layer portion.
The display device according to claim 2.
The first electrode is formed of a metal layer that is the same as the metal layer of the partition wall.
The display device according to claim 2.
The metal layer consists of either aluminum, aluminum alloy or silver,
The display device according to claim 2.
The partition wall is composed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and an inter-pixel insulating film formed on the surface of the metal layer.
The recess is provided by removing the inter-pixel insulating film on the side surface portion of the partition wall portion on the first electrode side.
The display device according to claim 2.
The partition wall is composed of a base material made of an insulating material and a metal layer formed on the upper part of the base material and protruding like an eaves with respect to the base material.
The display device according to claim 1.
The metal layer consists of either aluminum, aluminum alloy or silver,
The display device according to claim 7.
A transparent conductive material layer is formed on the surface of the metal layer of the partition wall.
The display device according to claim 7.
The first electrode is covered with a transparent conductive material layer which is the same layer as the transparent conductive material layer of the partition wall.
The display device according to claim 9.
The transparent conductive material layer consists of indium tin oxide or zinc oxide,
The display device according to claim 9.
A method for manufacturing a display device in which light emitting portions formed by stacking a first electrode, an organic layer, and a second electrode are arranged on a substrate in a two-dimensional matrix.
The process of forming the first electrode corresponding to each light emitting part,
The step of forming a partition wall in the corresponding region between the adjacent first electrodes, and
A step of laminating an organic layer and a second electrode on the entire surface including the first electrode and the partition wall,
Have and
The step of forming the partition wall portion includes a step of providing a recess toward the inside of the partition wall portion on a side surface portion of the partition wall portion on the first electrode side and a step of providing a light reflecting surface made of a metal layer on the partition wall portion.
How to manufacture a display device.
The first electrode in the partition wall portion is formed by forming the first insulating material layer constituting the lower layer portion of the partition wall portion and the second insulating material layer forming the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion. Provide a recess toward the inside of the partition wall on the side surface.
The method for manufacturing a display device according to claim 12.
The process of forming the partition wall and the process of forming the first electrode,
In the corresponding region between the adjacent first electrodes, a first insulating material layer constituting the lower layer portion and a second insulating material layer forming the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion are formed. And the process to do
A step of forming a metal layer on the entire surface, thus forming a light reflecting surface composed of a metal layer on a partition wall portion, and forming a first electrode including a metal layer divided by an eaves in the upper layer portion.
Do by
The method for manufacturing a display device according to claim 13.
After forming a metal layer on the entire surface, a step of continuously laminating an organic layer on the entire surface is performed.
The method for manufacturing a display device according to claim 14.
By forming the first insulating material layer that constitutes the lower layer portion of the partition wall portion and the metal layer that constitutes the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion, the side surface of the partition wall portion on the first electrode side is formed. Provide a recess in the portion toward the inside of the partition wall,
The method for manufacturing a display device according to claim 12.
The process of forming the partition wall and the process of forming the first electrode,
The process of forming the lower layer electrode in the region corresponding to the first electrode and
Next, a step of forming a first insulating material layer constituting the lower layer portion and a metal layer constituting the upper layer portion having a shape protruding in an eaves shape with respect to the lower layer portion between adjacent lower layer electrodes.
A step of forming a transparent conductive material layer on the entire surface including the partition wall portion, and thus forming a first electrode including the transparent conductive material layer divided by the eaves of the upper layer portion.
Do by
The method for manufacturing a display device according to claim 16.
After forming a transparent conductive material layer on the entire surface, a step of continuously laminating an organic layer on the entire surface is performed.
The method for manufacturing a display device according to claim 17.
The partition wall is formed of a base material made of an insulating material, a metal layer formed on the surface of the base material, and an interpixel insulating film formed on the surface of the metal layer, and then on the first electrode side of the partition wall. By removing the inter-pixel insulating film on the side surface portion, a recess toward the inside of the partition wall portion is provided on the side surface portion on the first electrode side of the partition wall portion.
The method for manufacturing a display device according to claim 12.
The light emitting portion formed by laminating the first electrode, the organic layer, and the second electrode is formed on the substrate by arranging them in a two-dimensional matrix.
The first electrode is provided for each light emitting part, and is provided for each light emitting part.
A partition wall is formed between the adjacent first electrodes.
The organic layer and the second electrode are laminated on the entire surface including the first electrode and the partition wall portion.
The partition wall has a light reflecting surface made of a metal layer, and has a light reflecting surface.
A recess toward the inside of the partition wall is provided on the side surface portion of the partition wall portion on the first electrode side.
An electronic device equipped with a display device.