KR20230131639A - Method for performing package vision inspection with axis misalignment compensation and sorting apparatus performing the same - Google Patents

Abstract

The present invention relates to a method of performing package vision inspection by compensating for axial distortion and a sorting device for performing package vision inspection by compensating for axial distortion. The method according to an embodiment of the present invention transfers cut semiconductor packages to a sorting device. A first step of placing it on the transfer table; A second step of obtaining the coordinates of at least two reference marks based on the virtual X-Y axis of the inspection unit after the entire semiconductor package is placed on the transfer table; A third step of calculating a slope (△Y/△X) formed between the coordinates of the at least two reference marks by a control unit; and a fourth step of transferring the inspection unit by a movement amount determined using the tilt so that the inspection unit inspects the state of the semiconductor package. may include.

Description

Method for performing package vision inspection by compensating for axis distortion and classification device for performing the method {METHOD FOR PERFORMING PACKAGE VISION INSPECTION WITH AXIS MISALIGNMENT COMPENSATION AND SORTING APPARATUS PERFORMING THE SAME}

The present invention relates to a method of performing package vision inspection by compensating for axial distortion and a classification device for performing package vision inspection by compensating for axial distortion.

Semiconductor packages cut in a sawing and sorter device for semiconductor equipment are inspected to determine whether they are good or bad while being transported to be sorted. Before they are finally sorted in the sorting device, semiconductor packages are photographed through an inspection unit such as a vision camera, and inspection can be performed as many as are visible in the captured images.

Semiconductor packages are gradually decreasing in size, and as a result, the number of semiconductor packages visible in one image increases, so the time required can be reduced. However, if the transfer table on which the semiconductor package is placed and the axis of the inspection unit are distorted, the number of semiconductor packages whose entire area is visible in one image is reduced, and as a result, additional time must be spent manually inspecting the semiconductor package, so the entire area is checked each time. There was a problem of detecting the unphotographed semiconductor package and manually performing the inspection again, which was inconvenient and took a lot of time and money due to the inspection.

In the prior art, alignment was performed by directly photographing three or more outer corners of the tray one by one and correcting the position of the vision camera for each setting value so that the vision center of the vision camera matches the point of the outer corner. However, sufficient inspection can be performed once the entire area of the semiconductor package is imaged, but it is still cumbersome to frequently adjust or reposition the vision camera so that the points at the vision center and the outer corners are aligned to perform perfect alignment. It was not sufficient to solve the existing problems as it took a lot of time and money.

Therefore, in order to capture the entire area of the semiconductor package through the inspection unit, without the need for separate pre-setting, the inspection unit is adjusted to capture the entire area of the semiconductor package being inspected by adjusting the moving direction or distance in real time as the inspection unit moves. An invention was needed.

(Patent Document 1) KR 10-2008-0102061 A

In order to solve the conventional problem, there is a method of performing package vision inspection by compensating for axial distortion by adjusting the amount of movement of the inspection section using the inclination of the reference mark without the need to change the position of the inspection section for each initial setting, and a method for performing package vision inspection by compensating for axial distortion. We would like to provide a classification device that performs

A method of performing a package vision inspection by compensating for axis distortion according to an embodiment of the present invention includes a transfer table on which at least two reference marks are displayed at preset positions; an inspection unit installed at an upper portion of the moving path of the transfer table to inspect a semiconductor package placed on the transfer table; and a control unit that determines the moving distance of the inspection unit based on the axis deviation of the transfer table with respect to the inspection unit.

A first step of transferring the cut semiconductor package to a sorting device and placing it on a transfer table; A second step of obtaining the coordinates of at least two reference marks based on the virtual X-Y axis of the inspection unit after the entire semiconductor package is placed on the transfer table; A third step of calculating a slope (△Y/△X) formed between the coordinates of the at least two reference marks by a control unit; and a fourth step of transferring the inspection unit by a movement amount determined using the tilt so that the inspection unit inspects the state of the semiconductor package. may include.

A classification device according to an embodiment of the present invention includes a transfer table on which at least two reference marks are displayed at preset positions; an inspection unit installed on an upper portion of the transfer table to inspect a semiconductor package placed on the transfer table; And a control unit that determines a moving distance of the inspection unit based on the axis deviation of the transfer table with respect to the inspection unit, wherein the control unit acquires coordinates of the at least two reference marks based on the virtual X-Y axis of the inspection unit. It may be configured to calculate the slope (△Y/△X) formed between the coordinates of the at least two reference marks and determine the amount of movement of the inspection unit.

Provided is a computer recording medium recording a computer program for executing on a computer a method of performing a package vision inspection by compensating for the axis deviation according to an embodiment of the present invention.

According to one embodiment of the present invention, in order to photograph the entire area of the semiconductor package through the inspection unit, the direction or distance of movement can be adjusted in real time as the inspection unit moves without the need for separate pre-setting, avoiding inconvenience. Cost and time are reduced to maximize inspection efficiency.

1 is a schematic diagram briefly illustrating the configuration of a classification device that performs package vision inspection by compensating for axis distortion according to an embodiment of the present invention.
Figure 2 shows a flow chart of a method of performing package vision inspection by compensating for axis distortion according to an embodiment of the present invention.
This is a schematic diagram briefly illustrating the configuration of a sorting device that performs package vision inspection by compensating for axis distortion according to an embodiment of the present invention.
Figure 3 is a front view briefly showing a state in which an inspection unit performs an inspection according to an embodiment of the present invention.
Figure 4 illustrates each mode of a method of performing package vision inspection by compensating for axis distortion according to an embodiment of the present invention.
Figure 5 illustrates an exemplary embodiment of calculating a slope in a method of performing package vision inspection by compensating for axis distortion according to an embodiment of the present invention.

Hereinafter, with reference to the attached drawings, preferred embodiments will be described in detail so that those skilled in the art can easily practice the present invention. However, when describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, the same symbols are used throughout the drawings for parts that perform similar functions and actions. In addition, in this specification, terms such as 'upper', 'top', 'upper surface', 'lower', 'lower', 'lower surface', 'side', etc. are based on the drawings and are actually elements or components. It may vary depending on the direction in which it is placed.

In addition, throughout the specification, when a part is said to be 'connected' to another part, this does not only mean 'directly connected', but also 'indirectly connected' with another element in between. Includes. In addition, 'including' a certain component means that other components may be further included rather than excluding other components, unless specifically stated to the contrary.

Figure 1 is a schematic configuration diagram briefly showing the configuration of a classification device in which a method of performing package vision inspection by compensating for axis distortion is performed according to an embodiment of the present invention, and Figure 2 is a schematic diagram showing the configuration of a classification device according to an embodiment of the present invention. This shows a flow chart of a method of performing package vision inspection by compensating for axis distortion.

The method according to an embodiment of the present invention may be performed in a classification device 100 as shown in FIG. 1, where the classification device 100 includes a transfer table with at least two reference marks displayed at preset positions. (200), an inspection unit 160 installed on the upper part of the moving path of the transfer table 200 to inspect the semiconductor package 20 placed on the transfer table 200, and the transfer table 200 for the inspection unit 160. ) may include a control unit 300 that determines the moving distance of the inspection unit 160 based on the axis distortion.

The semiconductor package 20 moved to the transfer table 200 is moved to the tray 170 by the chip picker 190, and the sorting device 100 sorts the semiconductor package 20 before being moved to the tray 170. It includes an inspection unit 160 that inspects. The inspection unit 160 may include a first inspection unit 160a disposed above the movement path of the transfer table 200, and as another embodiment, a second inspection unit 160a additionally disposed below the movement path of the chip picker 190. It may include an inspection unit 160b.

The inspection unit 160 according to an embodiment of the present invention may include a vision camera and a transfer rail through which the vision camera can be transferred, and the vision camera may move in the X-axis direction and the Y-axis direction through the transfer rail. there is. Through this, it is possible to inspect the entire area of the semiconductor device placed on the semiconductor package 20 by moving to the

Alternatively, the inspection unit 160 according to another embodiment of the present invention may be fixed and the transfer table 200 may move in the X-axis direction and the Y-axis direction through the transfer rail, through which the inspection unit 160 may (20) may move in the X-Y axis direction relative to the transfer table 200 on which it is placed.

In other words, the inspection unit 160 may move in the X-axis or Y-axis direction absolutely or relative to the transfer table 200 on which the semiconductor package 20 is placed.

The sorting device 100 includes a tray 170 for storing semiconductor packages 20 determined to be good products by the inspection unit 160, and a container 180 for storing semiconductor packages 20 determined to be defective products. It may include a tray moving unit (not shown) that moves the tray 170 along the moving rail 172, and a tray supply unit 174 for supplying the tray 170.

Before that, depending on the semiconductor up-down, the semiconductor package 20 is transferred from the package picker to the flipper 250 or buffer table 210 and then transferred to the transfer table 200.

As shown in FIG. 2, the method of performing package vision inspection by compensating for axis distortion according to an embodiment of the present invention involves transferring the cut semiconductor package 20 to the sorting device 100 and placing it on the transfer table 200. In the first step of placing the semiconductor package 20 on the transfer table 200 (S110), the second step is to obtain the coordinates of at least two reference marks based on the virtual X-Y axis of the inspection unit 160. Step (S120), a third step (S130) of calculating the slope (△Y/△X) formed between the coordinates of the at least two reference marks by the control unit 300, and the inspection unit 160 determines the semiconductor package It may include a fourth step (S140) of moving the inspection unit 160 by a movement amount determined using the inclination to inspect the state of (20).

At this time, in the fourth step (S140) according to an embodiment of the present invention, when the inspection unit 160 moves in the direction of at least one virtual axis from the inspection start position, the transfer table 200 for the inspection unit 160 The amount of movement in the direction of another virtual axis can be determined using the tilt to compensate for the axis distortion.

Figure 3 is a front view briefly showing the state in which the inspection unit 160 performs an inspection according to an embodiment of the present invention, and Figure 4 is a view showing a package vision inspection by compensating for axis distortion according to an embodiment of the present invention. Each mode of the method is shown, and Figure 5 shows an exemplary embodiment of calculating the slope in the method.

As shown in FIG. 3, the inspection unit 160 may perform an inspection by photographing the semiconductor package 20 placed on the moving table 200 while moving in the Y-axis direction along the transfer rail 201. Although not shown in the drawing, the inspection unit 160 can move in the X-axis direction along the transfer rail, and can inspect the entire semiconductor package 20 while moving in the X-axis or Y-axis direction.

In the fourth step (S140) according to an embodiment of the present invention, the inspection unit 200 varies by the movement amount determined by applying the tilt to a preset movement amount in the direction of at least one virtual axis of the inspection unit 200. It can be moved further in the direction of the virtual axis.

Specifically, when the inspection unit 160 performs a Y-axis movement, the inspection unit 160 may be further moved in the X-axis direction by an additional movement amount obtained by applying the slope to the preset Y-axis movement amount.

As shown in FIGS. 4 and 5, how distorted is the transfer table 200 and the semiconductor package 20 placed on the transfer table 200 based on the inspection unit 160 and the virtual X-Y axis of the inspection unit 160? You can check if it exists.

In FIG. 4, the transfer table 200 on which the semiconductor package 20 is placed is shown. It is assumed that the semiconductor package 20 and the transfer table 200 are always arranged side by side, and FIG. 4 shows the transfer table 200 placed upright. Although the inspection unit 160 is shown to be distorted, the same can be applied when the inspection unit 160, which is correctly arranged in the axial direction, inspects the transfer table 200 that is placed in an axial direction. In other words, the inspection unit 160 and the transfer table 200 on which the semiconductor package 20 are arranged side by side are relatively axially distorted, so that the axial distortion occurs with respect to the inspection unit 160 or the transfer table 200 placed in the correct position. The tilt calculation and movement amount can be determined using the transfer table 200 or the inspection unit 160.

For example, the center coordinates of the reference marks (X1, Y1) and (X2, Y2) of the transfer table 200 tilted with respect to the virtual X) can be calculated.

The degree of distortion between the transfer table 200 and the inspection unit 160 can be confirmed using images taken simultaneously with the inspection of the inspection unit 160, and through this, shaft distortion compensation can be performed.

As shown in FIG. 4, the inspection unit 160 photographs the entire semiconductor package 20 by moving its position based on the virtual X-Y axis direction, and, as an example, moves in the Y-axis direction based on the same ↑), and when the upper end of the semiconductor package 20 is reached, the entire semiconductor package 20 can be photographed by changing the X coordinate (←) and moving (↓) in the Y-axis direction based on the changed X coordinate. If the inspection unit 160 moves (↑) in the Y-axis direction at the same .

Therefore, it is necessary to perform package vision inspection by compensating for axis distortion, and according to one embodiment of the present invention, while moving in the Y axis to compensate for axis distortion, an additional automatic movement is made to the X axis by applying the slope for the Y axis movement amount. You can do this.

For example, as shown in FIG. 4, the semiconductor package 20 may arrange the semiconductor elements 20a in a grid so that the semiconductor elements 20a and blanks 20b are alternately positioned, The inspection unit 160 can move along the Y-axis by a preset movement amount, and in one embodiment, can move by the length of two semiconductor devices 20a. This may be determined depending on the type of semiconductor package 20 and the imaging area that the vision camera of the inspection unit 160 can capture.

For example, the initial position of the inspection unit 160 is size x 2).

At this time, in principle, the X coordinate, Xpos1, should be fixed (Xpos2=Xpos1), but if the axis is distorted, the It becomes x 2 x △Y/△X. In other words, the X-axis position can be corrected according to the Y-axis movement amount and the slope between the reference marks.

Although + is used in the above formula, the axial distortion of the inspection unit 160 with respect to the moving table 200 can be compensated for by changing the sign depending on the direction in which the inspection unit 160 is twisted.

That is, as shown in FIG. 4, in the Fiducial Setup Mode, the coordinates of fiducial marks are detected in the area photographed by the inspection unit 160, the slope is calculated, and the inspection start position and inspection of the inspection unit 160 are simultaneously determined. The direction of movement and amount of movement can be determined.

Next, it may further include a setup mode for moving the inspection unit 160 to the inspection start position of the inspection unit 160, or the inspection movement direction and movement amount determined after moving the inspection unit 160 to the inspection start position in Auto Run Mode. And the inspection unit 160 can be transported based on the calculated slope.

As shown in FIG. 5, the preset positions of at least two reference marks according to an embodiment of the present invention are formed in the same column in the area of the transfer table 200 where the semiconductor package 20 is not located. It can be.

Specifically, the preset position of the reference mark according to an embodiment of the present invention may include the upper and lower edges of the outer corner area of the transfer table 200.

As shown in FIG. 5, the slope (ΔY/ΔX) between the reference marks can be calculated by connecting at least two reference marks with a straight line and forming a slope about the virtual X-Y axis of the inspection unit 160. there is. △Y/△X=(Y1-Y2)/(X1-X2) calculates the slope between reference marks using the reference coordinates and the virtual X-Y axis of the inspection unit 160, and uses this to calculate the movement of the inspection unit 160 while it is moving The position correction amount in another direction perpendicular to the direction can be calculated in real time.

This allows the inspection unit 160 to perform the inspection and determine the location of the inspection unit 160 at the same time without any additional actions such as pre-setting, thereby saving time and cost without hassle and achieving high inspection efficiency.

In addition, according to one embodiment of the present invention, when the entire area of the semiconductor package 20 located in the inspection area of the inspection unit 160 is not imaged, the inspection unit 160 is rotated by an angle formed by the tilt. Alternatively, additional movement of the inspection unit 160 may be performed in the direction of at least one virtual axis along which movement of the inspection unit 160 has been determined.

For example, if the axis distortion is severe, such as when the transfer table 200 and the inspection unit 160 are tilted at an angle of more than 45 degrees, the entire semiconductor device 20a within the imaging area of the inspection unit 160 is lost even if the position is corrected according to the tilt. The area may not be captured.

In that case, the inspection unit 160 can be rotated, or, if the inspection unit 160 has moved to the Y-axis, additional axis distortion compensation can be performed to determine the additional movement amount in the Y-axis as well.

That is, the classification device 100 that performs package vision inspection by compensating for axis distortion according to an embodiment of the present invention includes a transfer table 200 with at least two reference marks displayed at preset positions, and the transfer table 200 An inspection unit 160 installed on the top of the transfer table 200 to inspect the semiconductor package 20 disposed thereon, and the inspection unit 160 based on the axis distortion of the transfer table 200 with respect to the inspection unit 160. It may include a control unit 300 that determines the moving distance.

At this time, the control unit 300 according to an embodiment of the present invention acquires the coordinates of the at least two reference marks based on the virtual It may be configured to calculate the slope (ΔY/ΔX) and determine the amount of movement of the inspection unit 160 using the slope.

That is, when the inspection unit 160 moves from the inspection start position, the tilt is used to determine the amount of movement in another virtual axis direction to compensate for the axial distortion of the transfer table 200 with respect to the inspection unit 160. It can be configured.

In addition, the control unit 300 according to an embodiment of the present invention allows the inspection unit 160 to move the inspection unit 160 in a different virtual axis direction by a movement amount to which the tilt is applied with respect to a preset movement amount in the direction of at least one virtual axis of the inspection unit 160. You may decide to move further.

The method of performing a package vision inspection by compensating for axis distortion according to an embodiment of the present invention described above may be produced as a program to be executed on a computer and stored in a computer-readable recording medium. Examples of computer-readable recording media include ROM, RAM, CD-ROM, magnetic tape, floppy disk, and optical data storage devices. Additionally, the computer-readable recording medium can be distributed to computer systems connected to a network, so that computer-readable code can be stored and executed in a distributed manner. And functional programs, codes, and code segments for implementing the method can be easily deduced by programmers in the technical field to which the present invention pertains.

In addition, in describing the present invention, '~ part' refers to various methods, such as a processor, program instructions executed by the processor, software module, microcode, computer program product, logic circuit, application-specific integrated circuit, firmware. It can be implemented by etc.

The present invention is not limited by the above-described embodiments and attached drawings. It is intended to limit the scope of rights by the appended claims, and it is understood by those skilled in the art that various forms of substitution, modification, and change can be made without departing from the technical spirit of the present invention as set forth in the claims. It will be self-explanatory.

10: semiconductor strip 20: semiconductor package
20a: semiconductor element 20b: blank
100: Sorting device 160, 160a, 160b: Inspection unit
170: tray 172: moving rail
174: Tray supply unit 190: Chip picker
200: transfer table 201: transfer rail
210: buffer table 250: rotary table
270: transfer rail 300: control unit

Claims (9)

A transfer table with at least two reference marks displayed at preset positions; an inspection unit installed on a moving path of the transfer table to inspect a semiconductor package placed on the transfer table; and a control unit that determines the moving distance of the inspection unit based on the axis deviation of the transfer table with respect to the inspection unit.
A first step of transferring the cut semiconductor package to the sorting device and seating it on the transfer table;
A second step of obtaining coordinates of the at least two reference marks based on the virtual XY axis of the inspection unit after the entire semiconductor package is placed on the transfer table;
A third step of calculating a slope (△Y/△X) formed between the coordinates of the at least two reference marks by the control unit; and
a fourth step of transferring the inspection unit by a movement amount determined using the tilt so that the inspection unit inspects the state of the semiconductor package; A method of performing package vision inspection by compensating for axis distortion including. According to claim 1,
In the fourth step,
The inspection unit is further moved in another virtual axis direction by a movement amount determined by applying the tilt to a preset movement amount in the direction of at least one virtual axis of the inspection unit.
How to perform package vision inspection by compensating for axis distortion. According to clause 2,
In the fourth step,
When the inspection unit performs a Y-axis movement, the inspection unit is further moved in the
How to perform package vision inspection by compensating for axis distortion. According to claim 1,
The preset positions of at least two of the reference marks are formed in the same column in the transfer table area where the semiconductor package is not located.
How to perform package vision inspection by compensating for axis distortion. According to clause 4,
The preset position includes the upper and lower corners of the outer edge area of the transfer table.
How to perform package vision inspection by compensating for axis distortion. According to claim 1,
When the entire area of the semiconductor package located in the inspection area of the inspection unit is not imaged, the inspection unit is rotated by an angle formed by the tilt, or the inspection unit is added in the direction of at least one virtual axis in which movement of the inspection unit is determined. Further comprising steps in which the movement is performed
How to perform package vision inspection by compensating for axis distortion. A computer recording medium recording a computer program for executing the method according to any one of claims 1 to 6 on a computer. A transfer table with at least two reference marks displayed at preset positions;
an inspection unit installed on an upper portion of the transfer table to inspect a semiconductor package placed on the transfer table; and
It includes a control unit that determines the moving distance of the inspection unit based on the axis distortion of the transfer table with respect to the inspection unit,
The control unit
Obtaining the coordinates of the at least two reference marks based on the virtual
Configured to determine the amount of movement of the inspection unit using the inclination
A sorting device that performs package vision inspection by compensating for axis distortion. According to clause 8,
The control unit,
Determining that the inspection unit moves further in another virtual axis direction by a movement amount determined by applying the tilt to a preset movement amount in the direction of at least one virtual axis of the inspection unit.
A sorting device that performs package vision inspection by compensating for axis distortion.

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