KR20230130525A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The purpose is to shorten a length of a substrate processing apparatus. The substrate processing apparatus comprises: a going way part where a substrate moves from an area where the substrate enters from an indexer device to an interface unit; and a returning way part where the substrate moves from the interface unit to an area where the substrate exits towards the indexer device. The returning way part comprises a first part and a second part which are located in a first horizontal direction, respectively. The first part comprises a developing unit executing a developing process on a coated film on the substrate. The second part comprises a cooling unit cooling the substrate heated by a heating unit after the developing process. In a case of plane projection from the upper side, a first area constituting part of the first part in a first horizontal direction, and a second area constituting at least part of the second part in the first horizontal direction are stood in a second horizontal direction perpendicular to the first horizontal direction. The returning way part comprises the heating unit and a first returning unit returning the substrate heated by the heating unit from the first area to the second area.

Description

Substrate processing apparatus and substrate processing method {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD}

The present invention relates to a substrate processing apparatus and a substrate processing method.

Conventionally, substrates brought in from an indexer device having a mounting table and a transport device for placing cassettes accommodating a plurality of substrates are subjected to pretreatment, formation of a resist film, drying of the resist film in a reduced pressure atmosphere, and heating. drying of the resist film by blowing cold air, cooling by blowing cold air, carrying it out to the exposure equipment, carrying it in from the exposure equipment, development of the resist film after exposure with a developer, washing of the developer with a rinse solution, drying of the rinse solution, and heating. There is a known substrate processing device in which the resist film after development is dried and cooled sequentially, and then the substrate is unloaded by an indexer device (for example, Patent Document 1, etc.).

Pretreatment includes, for example, removal of organic matter from the substrate by irradiation of ultraviolet light, cleaning with a cleaning solution, drying with a blower, drying with heating, and hydrophobization treatment by spraying hexamethyldisilane (HMDS). , and cooling by blowing out cold air, etc. are performed in that order.

The carrying out of the substrate into the exposure apparatus and the loading of the substrate from the exposure apparatus are performed, for example, by the transfer device of the interface unit.

Japanese Patent Publication No. 2019-220628

However, drying of the resist film after development by heating can be performed, for example, by heating the mounted substrate. In addition, the cooling of the substrate after heating the resist film after development is, for example, cooling of the substrate being transported by a conveyor, or cooling of the substrate by exhausting the local atmosphere of the shelf-shaped portion on which the substrate is placed. It can be realized.

However, for example, if there is a limit to the area where the substrate processing equipment can be installed within the factory, the part where the substrate moves from the interface section to the area where the substrate is delivered toward the indexer device (also called the return portion) There are cases where the plurality of components that make up cannot be arranged in a straight line. For this reason, there are cases where it is required to shorten the length of the substrate processing apparatus, for example, by shortening the length of the return portion.

The present invention was made in view of the above problems, and its purpose is to provide a technology that can shorten the length of a substrate processing device.

In order to solve the above problem, the substrate processing apparatus according to the first aspect includes a forward path part along which the substrate moves from an area where the substrate is loaded from the indexer device to an interface section that unloads the substrate toward the exposure device, and It is provided with a return portion along which the substrate brought in from the exposure device to the interface section moves from the interface section to the area where the substrate is unloaded toward the indexer device. The outbound portion has a cleaning section that performs a cleaning treatment on the substrate, and a film forming section that forms a coating film on the substrate on which the cleaning treatment has been performed. The return portion has a first portion and a second portion, each of which is located along the first horizontal direction. The first part includes a developing section that develops the coating film. The second part includes a cooling unit that cools the substrate heated in the heating unit after the development process. In the case of planar perspective from above, a first area constituting a portion of the first portion in the first horizontal direction, and a second region constituting at least a portion of the second portion in the first horizontal direction The regions are lined up in a second horizontal direction orthogonal to the first horizontal direction. The return portion includes the heating unit and a first transport unit that transports the substrate heated in the heating unit from the first area to the second area.

The substrate processing apparatus according to the second aspect is the substrate processing apparatus according to the first aspect, wherein, in the first portion, the developing unit, the first transport unit, and the heating unit are lined up in that order in the first horizontal direction. and the first transport unit transports the substrate from the developing unit to the heating unit and transports the substrate from the heating unit to the cooling unit.

The substrate processing apparatus according to the third aspect is the substrate processing apparatus according to the first aspect, wherein the first part includes a relay unit positioned to overlap in the vertical direction with respect to the developing unit, and the heating unit from the developing unit to the heating unit. In addition to transporting the substrate, it includes a second transport part that transports the substrate from the heating unit to the relay unit, and the first transport unit transports the substrate from the relay unit to the cooling unit.

The substrate processing apparatus according to the fourth aspect is the substrate processing apparatus according to the third aspect, wherein the relay unit includes a reverse conveyor that transports the substrate along a third horizontal direction opposite to the first horizontal direction, , the first transport unit transports the substrate from a portion of the reverse transport conveyor on the third horizontal direction side to the cooling unit.

The substrate processing apparatus according to the fifth aspect is the substrate processing apparatus according to the third or fourth aspect, wherein in the first part, the developing unit, the second transport unit, and the heating unit are located in the first horizontal direction. They are lined up in order.

The substrate processing apparatus according to the sixth aspect is the substrate processing apparatus according to any one of the first to fifth aspects, wherein the cooling unit is a cooling conveyor that cools the substrate while conveying the substrate along the first horizontal direction. Includes.

A substrate processing apparatus according to a seventh aspect is a substrate processing apparatus according to any one of the first to fifth aspects, wherein the cooling unit cools the substrate by exhausting air while temporarily storing the substrate. Contains units.

The substrate processing apparatus according to the eighth aspect is the substrate processing apparatus according to the first or second aspect, wherein the first part includes the first transport part, and the cooling part moves the substrate in the first horizontal direction. It includes a cooling conveyor that cools the substrate while conveying it toward the substrate, and extends beyond the first conveyance unit in a third horizontal direction opposite to the first horizontal direction, wherein the first conveyor unit is connected to the cooling unit. When transporting a substrate, the substrate is transported to an area that is shifted in the third horizontal direction from an area located in the second horizontal direction with respect to the first transport part of the cooling unit.

The substrate processing method according to the ninth aspect includes a forward path portion along which the substrate moves from an area where the substrate is loaded from the indexer device to an interface section that unloads the substrate toward an exposure device, and This is a substrate processing method using a substrate processing apparatus that has a return portion along which the substrate brought in from the exposure device to the interface unit moves until it reaches the area where the substrate is unloaded. The outbound portion has a cleaning section that performs a cleaning treatment on the substrate, and a film forming section that forms a coating film on the substrate on which the cleaning treatment has been performed. The return portion has a first portion and a second portion, each of which is located along the first horizontal direction. The first part includes a developing section. The second part includes a cooling section. In the case of planar perspective from above, a first area constituting a portion of the first portion in the first horizontal direction, and a second region constituting at least a portion of the second portion in the first horizontal direction The regions are lined up in a second horizontal direction orthogonal to the first horizontal direction. The return portion includes a heating unit and a first transport unit. The substrate processing method includes a first step of subjecting the coating film to development by the developing unit, and heating the substrate to which the coating film has been subjected to the development treatment in the first step by the heating unit. a second process, a third process of transferring the substrate heated in the second process from the first area to the second area by the first transfer unit, and a third process of transferring the substrate heated in the second process from the first area to the second area by the cooling unit. In the third process, there is a fourth process of cooling the substrate conveyed from the first area to the second area.

According to the substrate processing apparatus according to the first aspect, the length of the return portion in the first horizontal direction can be shortened, for example, by arranging parts of the return portion in parallel. Thereby, for example, the length of the substrate processing apparatus can be shortened.

According to the substrate processing apparatus according to the second aspect, installation of the substrate processing apparatus can be facilitated, for example, by simplifying the shape of the substrate processing apparatus.

According to the substrate processing apparatus according to the third aspect, for example, in the first part, the substrate is transported so as to be bent to the relay part by the second transport part. Thereby, for example, by arranging parts of the return passage portion in parallel, the length of the return passage portion in the first horizontal direction can be shortened.

According to the substrate processing apparatus according to the fourth aspect, for example, after the heated substrate is transported along a third horizontal direction opposite to the first horizontal direction by a reverse transport conveyor, the substrate is cooled by the first transport unit. Transfer the substrate to the main unit. Thereby, for example, by shifting the second part relative to the first part in the third horizontal direction opposite to the first horizontal direction, the length of the return portion in the first horizontal direction can be shortened.

According to the substrate processing apparatus according to the fifth aspect, installation of the substrate processing apparatus can be facilitated by, for example, simplifying the shape of the substrate processing apparatus.

According to the substrate processing apparatus according to the sixth aspect, it is difficult for the cost for installing a cooling unit to increase, for example.

According to the substrate processing apparatus according to the seventh aspect, for example, the length of the return portion in the first horizontal direction can be shortened.

According to the substrate processing apparatus according to the eighth aspect, for example, by shifting the second part with respect to the first part in the third horizontal direction opposite to the first horizontal direction, the return portion in the first horizontal direction The length can be shortened.

According to the substrate processing method according to the ninth aspect, for example, by adopting a configuration for transporting the substrate from the first area arranged in parallel in the return portion to the second area, the length of the return portion in the first horizontal direction is adopted. can be shortened. Thereby, for example, the length of the substrate processing apparatus can be shortened.

1 is a schematic diagram showing an example of the configuration of a substrate processing apparatus.
Fig. 2 is a plan view schematically showing an example of a part of the configuration of the return path portion.
Fig. 3 is a longitudinal cross-sectional view schematically showing an example of a partial configuration of the first portion.
Fig. 4 is a longitudinal cross-sectional view schematically showing an example of a partial configuration of the second portion.
Fig. 5 is a plan view schematically showing a reference example of a part of the configuration of the return path portion.
FIG. 6 is a flowchart showing an example of the flow of processing and transportation of the substrate in the return portion.
Fig. 7 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 8 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 9 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 10 is a longitudinal cross-sectional view schematically showing an example of a partial configuration of the second portion.
Fig. 11 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 12 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 13 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 14 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 15 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 16 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 17 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 18 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 19 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 20 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 21 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 22 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 23 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 24 is a plan view schematically showing a variation of a part of the configuration of the return path portion.
Fig. 25 is a plan view schematically showing a variation of a part of the configuration of the return path portion.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. The components described in these embodiments are merely examples and are not intended to limit the scope of the present invention to these only. In the drawings, parts having the same structure and function are given the same reference numerals, and duplicate descriptions are omitted in the following description. In addition, in the drawings, in order to facilitate understanding, the dimensions and numbers of each part are exaggerated or simplified as necessary. In each drawing, in order to explain the positional relationship of each element, a right-handed XYZ orthogonal coordinate system is given in Figs. 2 to 5 and Figs. 7 to 25. Here, it is assumed that the X-axis and Y-axis extend in the horizontal direction, and the Z-axis extends in the vertical direction (up and down direction). In addition, in the following description, the direction toward which the tip of the arrow faces is taken to be the + (plus) direction, and the opposite direction is taken to be the - (minus) direction. Here, the vertical direction upward is the +Z direction, and the vertical direction downward is the -Z direction.

Expressions expressing relative or absolute positional relationships (e.g., “in one direction,” “along one direction,” “parallel,” “orthogonal,” “center,” “concentric,” “coaxial,” etc.) refer to the position, unless specifically stated. Not only does it represent the relationship strictly, but it also represents a state of relative displacement in terms of angle or distance within the range where tolerance or the same degree of function is obtained. Expressions indicating the same state (e.g., "same," "same," "homogeneous," etc.) not only express the strictly identical state quantitatively, unless otherwise specified, but also indicate the existence of tolerances or differences in obtaining the same level of function. It should also indicate the status. Unless otherwise specified, expressions representing shapes (e.g., “rectangular” or “cylindrical”) not only strictly represent the shape geometrically, but are also used to the extent that the same effect can be obtained, for example. For example, shapes with irregularities, convexities, chamfers, etc. are also shown. The expressions “to have,” “to have,” “to have,” “to include,” or “to have” one component are not exclusive expressions that exclude the presence of other components. Unless otherwise specified, “above” and “below” may include cases where two elements are in contact as well as cases where two elements are separated. Unless otherwise specified, “moving in a specific direction” may include not only moving in parallel to this specific direction, but also moving in a direction that has components of this specific direction.

<1. First embodiment>

＜1-1. Schematic configuration of substrate processing equipment>

FIG. 1 is a schematic diagram showing an example of the configuration of the substrate processing apparatus 1. For example, the substrate processing device 1 cleans the substrate G1 brought in from the indexer device 2, forms a coating film, carries it out to the exposure device 3, carries it in from the exposure device 3, It is a device that performs development after exposure, drying and cooling by heating after development. The substrate G1 after processing in the substrate processing apparatus 1 is carried into the indexer apparatus 2. In FIG. 1, the substrate G1 located in the area 11i (also referred to as the loading area) into which the substrate G1 is loaded from the indexer device 2 is schematically drawn with a solid line, and the substrate processing device The substrate G1 located in another area of (1) is schematically drawn with a thin two-dot chain line.

For the substrate G1, for example, a flat glass substrate or the like is applied. The substrate G1 is, for example, a flat substrate having a first surface (also referred to as the upper surface) as the first main surface and a second surface (also referred to as the lower surface) as the second main surface opposite to the first surface. am. The treatment liquid for forming the coating film is, for example, a coating liquid (also referred to as a coating liquid) such as a resist liquid or a liquid containing a polyimide precursor and a solvent (also referred to as a PI liquid). Polyimide precursors include, for example, polyamic acid (polyamic acid). As a solvent, for example, NMP (N-Methyl-2-Pyrrolidone) is used.

The substrate processing apparatus 1 has, for example, an outbound portion 11, an interface portion 12, and a return portion 13. For example, the outbound portion 11 has an area (imported area) 11i into which the substrate G1 is loaded from the indexer device 2, and reaches the interface portion 12 from the loaded area 11i. This is the part where the substrate (G1) moves. For example, the interface unit 12 is a part that unloads the substrate G1 toward the exposure apparatus 3 and also loads the substrate G1 from the exposure apparatus 3 . For example, the return portion 13 has an area 13o from which the substrate G1 is unloaded toward the indexer device 2 (also referred to as a to-be-carried out area), and a to-be-carried out area 13o from the interface portion 12. ), this is the part where the substrate G1 brought into the interface section 12 from the exposure apparatus 3 moves.

The indexer device 2 has, for example, a table on which a cassette containing a plurality of substrates G1 is placed, and a transport mechanism. The transfer mechanism includes, for example, a transfer robot that transfers the substrate G1 between the cassette on the table and the outbound portion 11, and between the return portion 13 and the cassette on the table.

The outbound portion 11 has, for example, a washing section 111 and a tabernacle section 112. In the outbound portion 11, for example, the washing section 111 and the tabernacle section 112 as one processing section are arranged in order. The cleaning unit 111 is a part that performs cleaning processing on the substrate G1. The film forming portion 112 is a portion that forms a coating film on the substrate G1 that has been cleaned by the cleaning portion 111 . The film forming unit 112 includes, for example, an application unit 1121, a reduced pressure drying unit 1122, and a heat drying unit (also referred to as a pre-bake unit) 1123 as a plurality of processing units. Each processing section of the outbound portion 11 is arranged in the order of, for example, a washing section 111, an application section 1121, a reduced pressure drying section 1122 and a heating drying section 1123. The substrate G1 is transferred to each processing unit as the processing progresses, as indicated by an arrow drawn with a thin two-dot chain line, by a transfer mechanism such as a transfer robot or conveyor, for example, the cleaning unit 111, It is conveyed in the order of the application unit 1121, the reduced pressure drying unit 1122, and the heating drying unit 1123.

The cleaning unit 111 performs a cleaning process on the substrate G1 loaded from the indexer device 2, for example. The cleaning treatment includes, for example, treatment to remove fine particles, organic contamination, metal contamination, grease and natural oxide films, etc. In the cleaning unit 111, for example, removal of organic substances attached to the surface of the substrate G1 by irradiation of ultraviolet light, supply of a cleaning liquid such as deionized water, and cleaning of the substrate (G1) by cleaning members such as a brush. The surface of G1) is cleaned, and the substrate G1 is dried using a blower or the like. Drying of the substrate G1 using a blower or the like includes, for example, removal of the cleaning liquid from the substrate G1 using an air knife.

The application unit 1121 applies the treatment liquid to the surface of the substrate G1 after being cleaned in the cleaning unit 111, for example. For example, a slit coater is applied to the application portion 1121. The slit coater can apply the processing liquid onto the substrate G1 by, for example, moving a slit nozzle that discharges the processing liquid from the discharge port relative to the substrate G1. An applicator of another application method may be applied to the applicator 1121.

For example, the reduced pressure drying unit 1122 performs a process of drying the processing liquid applied on the substrate G1 by reduced pressure (also referred to as reduced pressure drying process). Here, for example, the solvent of the processing liquid applied to the surface of the substrate G1 is vaporized (evaporated) by reduced pressure, thereby drying the processing liquid.

For example, the heating and drying unit 1123 heats the substrate G1 on which the processing liquid has been dried in the reduced pressure drying unit 1122 and solidifies the components contained in the processing liquid on the surface of the substrate G1. As a result, a coating film as a film based on the processing liquid is formed on the substrate G1. For example, when the processing liquid is a resist liquid, heat treatment is performed on the dried resist liquid film to form a resist film as a coating film. For example, when the treatment liquid is a PI liquid, heat treatment is performed on the dried PI liquid film, thereby imidizing the polyimide precursor contained in the PI liquid, thereby forming a polyimide film as a coating film. The heating and drying unit 1123 may be, for example, a single-wafer type heat treatment that heats a single substrate G1, or a batch type heat treatment that heats a plurality of substrates G1 at once. Here, for example, the tact time of the reduced pressure drying process in the reduced pressure drying unit 1122 and the tact time of the heat treatment in the heating drying unit 1123 are significantly different, so that the heating drying unit 1123 is A case where there is a heat treatment unit of the type is assumed. In this case, the heating and drying unit 1123 may have, for example, a plurality of single wafer type heating processing units that perform heating processing in parallel. A plurality of heat treatment units are arranged, for example, in a vertically stacked state.

Here, the outbound portion 11 may have a dehydration bake portion between the washing portion 111 and the film forming portion 112, for example. The dehydration bake unit dries the substrate G1 by, for example, heating the substrate G1 to vaporize the cleaning liquid adhering to the substrate G1 in the cleaning unit 111 . In this case, a treatment unit that performs hydrophobization treatment by blowing hexamethyldisilane (HMDS) and cooling by blowing cold air may exist between the dehydration bake part and the film forming part 112. In this case, for example, the film forming section 112 is formed on the substrate G1, which has been subjected to a cleaning treatment in the cleaning section 111, followed by drying, hydrophobization treatment, and cooling by heating in the dehydration bake section. forms a film on the

The interface unit 12 transports the substrate G1 from the outbound portion 11 toward the exposure apparatus 3, for example. The interface portion 12 is located between the outbound portion 11 and the exposure apparatus 3, for example. The substrate G1 is transferred from the outgoing portion 11 to the exposure device ( It is returned to 3). For example, the substrate G1 is transported from the heating and drying section 1123 of the outbound portion 11 toward the exposure apparatus 3. Additionally, the interface unit 12 transports the substrate G1 from the exposure apparatus 3 toward the return portion 13, for example. The interface portion 12 is located between the exposure device 3 and the return portion 13, for example. The substrate G1 is returned from the exposure apparatus 3 to the return portion 13, as indicated by an arrow drawn with a thin two-dot chain line, by a transport mechanism such as a transport robot included in the interface unit 12, for example. is returned towards. For example, the substrate G1 is transported from the exposure apparatus 3 toward the developing section 131 of the return portion 13.

The exposure device 3 performs exposure processing on the coating film formed on the substrate G1 in the outbound portion 11, for example. Specifically, the exposure device 3 irradiates light of a specific wavelength, such as deep ultraviolet rays, through a mask on which a circuit pattern is drawn, for example, and transfers the pattern to the coating film. The exposure apparatus 3 may include, for example, a peripheral exposure section and a titler. The peripheral exposure portion is a portion that performs exposure processing to remove the outer peripheral portion of the coating film on the substrate G1. The titler section is, for example, a section that records predetermined information on the substrate G1.

The return portion 13 has, for example, a plurality of processing sections, including a developing section 131, a heating section (also referred to as a post-bake section) 132, and a cooling section 133. Each processing unit of the return portion 13 is arranged in that order, for example, a developing unit 131, a heating unit 132, and a cooling unit 133. The substrate G1 is transferred to each processing unit as processing progresses, as indicated by an arrow drawn with a thin two-dot chain line, by a transfer mechanism such as a transfer robot or transfer conveyor, for example, a developing unit 131, It is conveyed in the order of the heating unit 132 and the cooling unit 133. Here, for example, the exposure apparatus 3 does not include a peripheral exposure portion and a titler portion, and the return portion 13 is a peripheral exposure portion and a title portion located between the interface portion 12 and the developing portion 131. You can have Lovebu.

The developing unit 131 performs development processing on the coating film formed on the substrate G1 in the outbound portion 11, for example. The development process includes, for example, a process for developing the coating film, a process for washing off the developing solution, and a process for drying the substrate G1. In the developing unit 131, for example, a process of immersing the coating film on the substrate G1, whose pattern has been exposed by the exposure device 3, into a developer solution, and a process of washing the developer solution on the substrate G1 with a cleaning solution such as deionized water. , and a process of drying the substrate G1 using a blower or the like is performed. Drying of the substrate G1 using a blower or the like includes, for example, removal of the cleaning liquid from the substrate G1 using an air knife.

The heating unit 132 heats the substrate G1, for example. In the heating unit 132, for example, the substrate G1 that has been developed in the developing unit 131 is heated to vaporize the cleaning liquid adhering to the substrate G1 in the developing unit 131, Dry the substrate (G1).

The cooling unit 133 cools the substrate G1 heated in the heating unit 132, for example. The cooling unit 133 is configured to cool the substrate G1 while transporting the substrate G1 by, for example, a conveyor, or by exhausting the substrate G1 while temporarily storing the substrate G1. A cooling configuration is applied. The substrate G1 cooled in the cooling unit 133 is carried out of the substrate processing apparatus 1 from the return portion 13 by, for example, the transport mechanism of the indexer device 2.

The operation of each part of the substrate processing apparatus 1 is controlled by the control device 14, for example. The control device 14 has the same configuration as a computer, for example, and includes a control unit 141 and a storage unit 142. The control unit 141 includes, for example, a central processing unit (CPU: Central Processing Unit) and volatile memory such as random access memory (RAM). The storage unit 142 includes a non-volatile storage medium such as a hard disk drive, for example. The control device 14 can control the operation of each part of the substrate processing apparatus 1 by, for example, reading and executing a program stored in the storage unit 142 by the control unit 141. For example, the control device 14 may be installed other than the substrate processing device 1 or may be included within the substrate processing device 1.

<1-2. Configuration of the return area>

FIG. 2 is a plan view schematically showing an example of a partial configuration of the return passage portion 13. In Fig. 2, the outer edge of the outward path portion 11 is schematically represented by a thin two-dot chain line. 2, the substrate G1 located in the discharged area 13o is schematically drawn with a solid line, and the substrate G1 located in other areas of the return portion 13 is drawn with a thin two-dot chain line. It is drawn schematically. Additionally, in FIG. 2, the path along which the substrate G1 moves is indicated by an arrow drawn with a thin one-dot chain line. Additionally, in FIG. 2, the state in which the substrate G1 is rotated is shown by an arc-shaped arrow drawn with a two-dot chain line.

As shown in Fig. 2, the return portion 13 has a first portion 13a and a second portion 13b. The first part 13a and the second part 13b are each located along the -X direction as the first horizontal direction.

FIG. 3 is a longitudinal cross-sectional view schematically showing an example of a partial configuration of the first portion 13a. In FIG. 3, a part of a conveyor as an example of a conveyance mechanism located near the end of the developing unit 131 on the heating unit 132 side is briefly described, and other configurations of the developing unit 131 are described. The description is omitted. Additionally, in FIG. 3, the substrate G1 located in each part is schematically drawn with a thin two-dot chain line. Additionally, in FIG. 3, the path along which the substrate G1 moves in the developing unit 131 is indicated by an arrow drawn with a thin one-dot chain line.

FIG. 4 is a longitudinal cross-sectional view schematically showing an example of a partial configuration of the second portion 13b. In FIG. 4 , the substrate G1 located in the discharged area 13o is schematically drawn with a solid line, and the substrate G1 located near the end of the cooling unit 133 on the opposite side from the discharged area 13o. ) is schematically drawn with a thin two-dot chain line. Additionally, in FIG. 4 , the path along which the substrate G1 moves in the cooling unit 133 is indicated by an arrow drawn with a thin one-dot chain line.

FIG. 5 is a plan view schematically showing a reference example of a part of the configuration of the return passage portion 13. In FIG. 5 , similarly to FIG. 2 , the outer edge of the outbound path portion 11 is schematically represented by a thin two-dot chain line. 5, the substrate G1 located in the middle of the developing unit 131 is schematically drawn with a solid line, and the substrate G1 located in other areas of the return portion 13 is drawn with a thin two-dot chain line. It is drawn schematically. Also, in FIG. 5, as in FIG. 2, the path along which the substrate G1 moves is indicated by an arrow drawn with a thin one-dash line, and the state in which the substrate G1 is rotated is shown by an arc-shaped arrow drawn with a two-dash line. It is indicated by an arrow.

As shown in FIGS. 2 and 3 , the first portion 13a includes a developing unit 131 . In the first embodiment, the first portion 13a includes a developing section 131, a first conveying section 134, and a heating section 132. As shown in FIGS. 2 and 4 , the second portion 13b includes a cooling portion 133.

As shown in FIG. 2, when viewed from above in plan view, an area (also referred to as a first area) P1 constituting a part of the first portion 13a in the -X direction as the first horizontal direction; , the area (also referred to as the second area) P2 constituting at least a portion of the second portion 13b in the -X direction as the first horizontal direction is -Y as the second horizontal direction orthogonal to the first horizontal direction. They are lined up in one direction. The return portion 13 has a first conveyance unit 134 . For example, the first transport unit 134 may transport the substrate G1 heated in the heating unit 132 from the first area P1 to the second area P2. In the first embodiment, for example, part of the return portion 13 is arranged in parallel. In other words, for example, along the horizontal plane, the return portion 13 is bent into a Z shape with the first conveyance section 134 as the starting point. As a result, as shown in FIG. 5, in the return portion 13, the developing section 131, the first conveying section 134, and the cooling section 133 are aligned in the -X direction as the first horizontal direction. Compared to the configuration in which they are lined up in a straight line, the length of the return portion 13 in the -X direction as the first horizontal direction is shortened. Therefore, for example, the length of the substrate processing apparatus 1 can be shortened.

In the first embodiment, in the first portion 13a, the developing section 131, the first conveying section 134, and the heating section 132 are lined up in that order in the -X direction as the first horizontal direction. In other words, in the -X direction as the first horizontal direction, the first transport unit 134 is located between the developing unit 131 and the heating unit 132. In the example of FIG. 2, the second area P2 is located in the area (also referred to as the inner area) A1 on the outbound portion 11 side of the first area P1. In other words, the second area P2 is located between the first area P1 and the outbound portion 11. The first area P1 includes the first transport unit 134 and the heating unit 132, and the second area P2 includes a third horizontal direction opposite to the first horizontal direction among the cooling units 133. Includes the part located on the +X direction side as the direction.

The developing unit 131 is located along the -X direction as the first horizontal direction, for example. In the developing unit 131, for example, the substrate G1 brought in from the interface unit 12 side is sequentially moved along the -X direction as the first horizontal direction, and a development process is performed on the coating film on the substrate G1. is implemented. Here, for example, when the return portion 13 has a peripheral exposure portion and a titler portion located between the interface portion 12 and the developing portion 131, the peripheral exposure portion, the titler portion, and the developing portion. (131) are lined up along the -X direction as the first horizontal direction. In this case, for example, the first portion 13a includes a peripheral exposure portion and a titler portion. Here, for example, in the - may be lined up in this order of description.

In the first embodiment, the first transport unit 134 transports the substrate G1 from the developing unit 131 to the heating unit 132, for example, and transfers the substrate G1 from the heating unit 132 to the cooling unit 133. The substrate G1 can be transported. Thereby, for example, in the first portion 13a, the substrate G1 is conveyed by the first conveyance section 134 so as to be bent in the heating section 132. Specifically, for example, the substrate G1 is carried into the heating unit 132 by the first transport unit 134 toward the -X direction as the first horizontal direction, and in the +X direction as the third horizontal direction. The substrate G1 is unloaded from the heating unit 132 toward .

For example, a transport robot (also referred to as a transport robot) is applied to the first transport unit 134. For example, a structure having a hand part, an arm mechanism, a rotation mechanism, and a lifting mechanism is applied to the transport robot. The hand portion is a portion capable of supporting or maintaining the substrate G1 in an attitude whose upper and lower surfaces are along the horizontal direction (also referred to as a horizontal posture). The arm mechanism is a mechanism equipped with a hand portion and capable of advancing and retreating the hand portion in the horizontal direction by expanding and contracting in the horizontal direction. The rotation mechanism is a mechanism that can rotate the arm mechanism around a rotation axis along the vertical direction. The lifting mechanism is a mechanism that can raise and lower the rotary mechanism together with the hand portion and the arm mechanism. In FIG. 3, the direction in which the rotation mechanism along with the hand portion and the arm mechanism is raised and lowered by the lifting mechanism in the transport robot is indicated by an arrow drawn as a thin two-dot chain line. Here, for example, a conveyance mechanism near the end of the developing unit 131 on the heating unit 132 side, and a conveyance mechanism near the end of the cooling unit 133 on the developing unit 131 side. In this case, an aspect in which a space, such as a groove or slit, into which the hand part of the transfer robot can be inserted is formed is formed below the substrate G1.

The heating unit 132 has, for example, a heating unit 132h. In the example of FIG. 3, the heating unit 132 has a plurality of heating units 132h stacked in the vertical direction. A plate-type heating unit is applied to the heating unit 132h. In a plate-type heating unit, for example, with the substrate G1 placed on a plate, the plate is heated to heat the substrate G1. For example, the transfer robot of the first transfer unit 134 can carry out the loading and unloading of the substrate G1 to each heating unit 132h.

In the example of FIG. 3, the heating unit 132 has three heating units 132h, but the present invention is not limited to this. The heating unit 132 may have one or two heating units 132h, or may have four or more heating units 132h. For example, when the heating unit 132 has two or more heating units 132h and the two or more heating units 132h are stacked in the vertical direction, installation of the substrate processing device 1 in the factory Even if there is a limit to the possible area, installation of the substrate processing apparatus 1 can be facilitated.

The cooling unit 133 is located along the -X direction as the first horizontal direction, for example. In the cooling unit 133, for example, the substrate G1 in a horizontal position is brought in by the first transport unit 134 near the end of the +X direction as the third horizontal direction. The cooling unit 133 has, for example, a conveyor (also referred to as a cooling conveyor) 133c that cools the substrate G1 while conveying the substrate G1 along the -X direction as the first horizontal direction. The cooling conveyor 133c rotates a plurality of rollers lined up along the - Move along. The substrate G1 transported by the cooling conveyor 133c is cooled, for example, by air cooling. For example, when a fan filter unit (FFU) 10 that generates a downward airflow of clean air is disposed at the top of the substrate processing apparatus 1, the substrate G1 transported by the cooling conveyor 133c can be cooled by the airflow generated by the FFU (10). In a configuration where the cooling unit 133 includes a cooling conveyor 133c that cools the substrate G1, for example, the cost for installing the cooling unit 133 is unlikely to increase.

In the first embodiment, for example, the substrate G1 is rotated to a horizontal position by the rotation mechanism of the first transport unit 134 and then transported into the cooling unit 133. In other words, for example, the first transport unit 134 rotates the substrate G1 in the horizontal position using a rotation mechanism and carries it into the cooling unit 133. Here, the rotation angle of the substrate G1 along the horizontal plane is, for example, a first predetermined angle of about 90 degrees. In this case, the cooling unit 133 is, for example, a rotation unit 133t that rotates the substrate G1 in a horizontal position around a virtual rotation axis (also referred to as a virtual rotation axis) Ax1 along the vertical direction. You may have it. In the example of FIG. 3 , the cooling unit 133 has a rotation unit 133t near the end on the developing unit 131 side.

The rotation unit 133t includes, for example, a turntable T1 at an opening near the center of the Y direction of two or more rollers lined up in succession among the cooling conveyor 133c, and this turntable T1 A configuration having a lifting mechanism that elevates can be applied. For the turntable T1, for example, a structure having a table portion, a shaft portion, and a rotation drive portion is applied. The table portion is, for example, a portion capable of supporting the substrate G1 in a horizontal position from below on a plurality of pins erected on the upper surface. The shaft portion is, for example, a column-shaped or rod-shaped portion that has an upper end portion to which the table portion is fixed and extends in the vertical direction along the virtual rotation axis Ax1. The rotation drive unit is, for example, a drive unit such as a motor that rotates the shaft unit around the virtual rotation axis Ax1. As the lifting mechanism, for example, a mechanism such as a cylinder that raises and lowers the rotary drive unit in the vertical direction is applied. The rotation unit 133t having the above-described structure raises the turntable T1 by a lifting mechanism, for example, with the substrate G1 positioned above the turntable T1 on the cooling conveyor 133c. The substrate G1 in a horizontal position is lifted from below by the table unit, and the table unit is rotated at a second predetermined angle, such as about 90 degrees, around the virtual rotation axis Ax1 by the rotation drive unit, and then the turntable is lifted by the lifting mechanism. By lowering (T1), the substrate (G1) is placed on the cooling conveyor (133c). As a result, the direction of the substrate G1 in the horizontal position can be rotated along the horizontal plane.

For example, assume that the upper and lower main surfaces of the substrate G1 have a rectangular shape with two opposing first sides and two opposing second sides. In this case, for example, the substrate G1 is transported in the direction along the first side in the developing unit 131 of the first portion 13a, and is viewed from above by the first transport unit 134. When rotated about 90 degrees counterclockwise, it is brought into the cooling unit 133. Here, the substrate G1 is rotated about 90 degrees clockwise when viewed from above by the rotation unit 133t. As a result, the substrate G1 can be transported in the direction along the first side also in the cooling section 133 of the second portion 13b. Here, for example, there is a case where the first side is the long side of the main surface of the substrate G1 and the second side is the short side of the main surface of the substrate G1, and the first side is the short side of the main surface of the substrate G1 and the second side is the short side of the main surface of the substrate G1. It is conceivable that the side is the long side of the main surface of the substrate G1. In these cases, for example, the rotation unit 133t can return the direction of the substrate G1 rotated along the horizontal plane by the first transfer unit 134 to its original direction.

Here, for example, the cooling unit 133 may have a rotation unit 133t at any position in the -X direction as the first horizontal direction.

<1-3. Flow of substrate processing and transport operation in return section>

FIG. 6 is a flowchart showing an example of the processing and conveyance flow for the substrate G1 in the return portion 13. In Fig. 6, a flow chart focusing on the processing and transport of one substrate G1 is shown. Processing and transport of the substrate G1 in the return portion 13 can be realized, for example, by controlling the operation of each part of the return portion 13 by the control unit 141 . Here, for example, the method of processing and transporting the substrate G1 in the return portion 13 constitutes at least a part of the substrate processing method using the substrate processing apparatus 1.

In the first embodiment, in the return portion 13, the processes from step S1 to step S5 shown in FIG. 6 are performed in order.

In the process of step S1 (also referred to as the first process), the developing unit 131 develops the coating film on the substrate G1.

In the process of step S2, the substrate G1 is transported from the developing unit 131 to the heating unit 132 by the first transport unit 134.

In the process of step S3 (also referred to as the second process), the substrate G1 on which the coating film has been developed in the first process of step S1 is heated by the heating unit 132.

In the process of step S4 (also referred to as the third process), the substrate G1 heated in the second process of step S3 is transferred from the first area P1 to the second area P2 by the first transfer unit 134. ) is returned. In the first embodiment, the substrate G1 is transported from the heating unit 132 to the cooling unit 133 by the first transport unit 134, for example.

In the process of step S5 (also referred to as the fourth process), the substrate G1 transported from the first area P1 to the second area P2 in the third process of step S4 is cooled by the cooling unit 133. Cool down. In the first embodiment, for example, the cooling unit 133 cools the substrate G1 carried into the cooling unit 133 by the first transport unit 134 . In the cooling unit 133, for example, the rotation unit 133t returns the direction of the substrate G1 rotated along the horizontal plane by the first transport unit 134 to its original direction and cools it. The substrate G1 in a horizontal position is cooled while being conveyed along the -X direction as the first horizontal direction by the conveyor 133c.

In this way, for example, by adopting a configuration in which the substrate G1 is transported from the first area P1 arranged in parallel among the return portion 13 to the second area P2, the first area of the return portion 13 is 1 The length in the -X direction as the horizontal direction can be shortened. As a result, for example, the length of the substrate processing apparatus 1 can be shortened.

<1-4. Summary of the first embodiment>

As described above, in the substrate processing apparatus 1 according to the first embodiment, for example, some of the return portions 13 are arranged in parallel. In other words, for example, along the horizontal plane, the return portion 13 is bent into a Z shape with the first conveyance section 134 as the starting point. Thereby, for example, the length of the return portion 13 in the -X direction as the first horizontal direction can be shortened. Therefore, for example, the length of the substrate processing apparatus 1 can be shortened. In addition, for example, there is a limit to the area where the substrate processing device 1 can be installed within the factory, so the distance between the exposure device 3 and the indexer device 2 in the -X direction as the first horizontal direction is limited. Even in cases where it is difficult to widen, the substrate processing apparatus 1 becomes easier to place.

In addition, in the substrate processing method using the substrate processing apparatus 1 according to the first embodiment, for example, the substrate is transferred from the first area P1 arranged in parallel in the return portion 13 to the second area P2. Return (G1). As a result, for example, the length of the return portion 13 in the -X direction as the first horizontal direction can be shortened. Therefore, for example, the length of the substrate processing apparatus 1 can be shortened.

＜2. Modification example>

The present invention is not limited to the above-described first embodiment, and various changes and improvements are possible without departing from the gist of the present invention.

7 to 25 are diagrams schematically showing modifications of some configurations of the return passage portion 13, respectively. Specifically, FIGS. 7 to 9 and FIGS. 11 to 25 are plan views schematically showing a variation of a part of the configuration of the return portion 13, respectively. Fig. 10 is a longitudinal cross-sectional view schematically showing an example of a partial configuration of the second portion 13b.

In each of FIGS. 7 to 9 and FIGS. 11 to 25 , similarly to FIG. 2 , the substrate G1 located in the discharged area 13o is schematically drawn with a solid line, and the rest of the return portion 13 The substrate G1 located in the area is schematically drawn with a thin two-dot chain line. In addition, in each of FIGS. 7 to 9 and FIGS. 11 to 25 , similarly to FIG. 2 , the path along which the substrate G1 moves is indicated by an arrow drawn with a thin one-dot chain line. In addition, in each of FIGS. 7 to 9 and FIGS. 11 to 25 , similarly to FIG. 2 , the rotation of the substrate G1 is shown by an arc-shaped arrow drawn with a two-dot chain line. In FIG. 10, an example of the substrate G1 located in the area to be carried out 13o is schematically drawn with a solid line, and each example of the substrate G1 located in other places is schematically drawn with a thin two-dot chain line. there is.

<2-1. First modification example>

In the first embodiment, for example, as shown in FIG. 7 , the heating unit 132 may be located in an area opposite to the outbound portion 11 of the first conveyance unit 134. In other words, the heating unit 132 may be located in the area (also referred to as the outer area) A2 on the opposite side to the outbound portion 11 of the first area P1. In this case, for example, the first part 13a includes the developing unit 131 and the first transport unit 134, and the first area P1 includes the first transport unit 134. And, the second area P2 includes a portion of the cooling unit 133 located on the +X direction side as the third horizontal direction. Also in this case, for example, part of the return portion 13 is arranged in parallel. In other words, for example, along the horizontal plane, the return portion 13 is bent with the first conveyance section 134 as a starting point. Thereby, for example, the length of the return portion 13 in the -X direction as the first horizontal direction can be shortened. Therefore, for example, the length of the substrate processing apparatus 1 can be shortened. Here, for example, as in the first embodiment, if the heating unit 132 is included in the first portion 13a, the shape of the substrate processing apparatus 1 is simplified, and the shape of the substrate processing apparatus 1 is simplified. Installation may become easier.

＜2-2. Second modification example>

In the first embodiment and the first modified example, for example, as shown in FIG. 8 and the like, the substrate G1 heated by the heating unit 132 is in the first portion 13a. It may be conveyed from the first area P1 to the second area P2 via the relay unit 136. Here, for example, as shown in FIG. 8, the first portion 13a is separated from the developing unit 131 and the relay unit 136, which is positioned to overlap the developing unit 131 in the vertical direction. It includes a second transfer unit 135 that transfers the substrate G1 to the heating unit 132 and transfers the substrate G1 from the heating unit 132 to the relay unit 136, and a first transfer unit ( 134) may transport the substrate G1 from the relay unit 136 to the cooling unit 133A. Thereby, for example, in the first portion 13a, the substrate G1 is transported by the second transport portion 135 so as to be bent to the relay portion 136. Thereby, for example, by arranging part of the return portion 13 in parallel, the length of the return portion 13 in the -X direction as the first horizontal direction can be shortened.

In the example of Fig. 8, in the first portion 13a, the developing section 131, the second conveying section 135, and the heating section 132 are lined up in that order in the -X direction as the first horizontal direction. In other words, in the -X direction as the first horizontal direction, the second transport unit 135 is located between the developing unit 131 and the heating unit 132. As a result, for example, in the first portion 13a, the substrate G1 is conveyed by the second conveyance section 135 so as to be bent in the heating section 132. In this way, for example, if the heating unit 132 is included in the first part 13a, the shape of the substrate processing apparatus 1 can be simplified, and installation of the substrate processing apparatus 1 can be facilitated.

In addition, in the example of FIG. 8, the relay unit 136 is located near the end of the developing unit 131 on the second transport unit 135 side. The relay unit 136 can temporarily support or maintain the substrate G1. In the second portion 13b, the first conveyance section 134 and the cooling section 133A are lined up in order in the -X direction as the first horizontal direction. The first area P1 includes a portion of the developing unit 131 near the end of the second transport unit 135, a relay unit 136, the second transport unit 135, and a heating unit 132. And the second area P2 includes a portion of the first transport unit 134 and the cooling unit 133A located on the +X direction side as the third horizontal direction. The first conveyance unit 134 is located in the area on the outbound portion 11 side of the relay unit 136. For example, the same transfer robot as that of the first transfer unit 134 may be applied to the second transfer unit 135 . For example, the relay unit 136 has the same configuration as the turntable T1 described above. The cooling unit 133A has a configuration in which, for example, the cooling unit 133 described above is used as a base, and the rotation unit 133t is removed.

In the return portion 13 having this configuration, the next substrate G1 is processed and transported. A development process is performed on the coating film on the substrate G1 by the developing unit 131 . Next, the substrate G1 is transported from the developing unit 131 to the heating unit 132 by the second transport unit 135 . Next, the substrate G1 on which the coating film has been developed in the developing unit 131 is heated by the heating unit 132. Next, the substrate G1 is transported from the heating unit 132 to the relay unit 136 by the second transport unit 135 . Next, the substrate G1 in the horizontal position is rotated along the horizontal plane by the relay unit 136. Here, for example, the direction of the substrate G1 is rotated by about 90 degrees. Next, the substrate G1 heated in the heating unit 132 is transferred from the first area P1 to the second area P2 by the first transfer unit 134 . Here, for example, the substrate G1 is transported from the relay unit 136 to the cooling unit 133A by the first transport unit 134. At this time, the substrate G1 is rotated approximately 90 degrees to a horizontal position by the rotation mechanism of the first transport unit 134, and then is transported into the cooling unit 133A. As a result, the first transport unit 134 returns the direction of the substrate G1 rotated along the horizontal plane by the relay unit 136 to its original direction. Next, the substrate G1 transported from the first area P1 to the second area P2 by the first transfer unit 134 is cooled by the cooling unit 133A. Here, for example, the substrate G1 carried into the cooling unit 133A by the first transfer unit 134 is cooled by the cooling unit 133A. The cooling unit 133A cools the substrate G1 in a horizontal position while conveying it along the -X direction as the first horizontal direction by, for example, the cooling conveyor 133c.

Here, for example, a configuration for simply temporarily supporting or holding the substrate G1 is applied to the relay unit 136, and the cooling unit 133A is configured as a cooling unit 133 having a rotation unit 133t. You can change it. In this case, for example, a buffer unit is applied to the relay unit 136. The buffer portion has a configuration in which, for example, the substrate G1 is temporarily accommodated. The buffer portion has, for example, a plurality of portions (also referred to as mounting portions) on which the substrate G1 can each be mounted. In the placement portion, for example, the substrate G1 is placed in a horizontal position on a plurality of pins installed upright. The buffer portion may have a single-stage structure with one mounting portion, or may have a multi-stage shelf-like structure with two or more mounting portions arranged vertically.

Here, for example, the relay unit 136 may be positioned above the developing unit 131 so as to overlap the developing unit 131, and may be located below the developing unit 131 in the developing unit ( 131) may be located so as to overlap. In other words, the relay unit 136 may be positioned to overlap the developing unit 131 in the vertical direction.

Here, for example, the heating unit 132 may be located in an area opposite to the outbound portion 11 of the second transport unit 135. In other words, the heating unit 132 may be located in the area (outside area) A2 on the opposite side to the outbound portion 11 of the first area P1. In this case, for example, the first part 13a includes the developing unit 131, the second transport unit 135, and the relay unit 136, and the first area P1 includes the second transport unit 136. It includes a unit 135 and a relay unit 136, and the second area P2 is a portion located on the +X direction side as the third horizontal direction among the first transfer unit 134 and the cooling unit 133. Includes.

<2-3. Third modification example>

In the second modification, for example, as shown in FIGS. 9 and 10, the cooling unit 133A exhausts the substrate G1 while temporarily storing the substrate G1. It may be changed to a cooling unit 133B having a cooling unit 133u for cooling. Thereby, for example, the length of the return portion 13 can be shortened. Therefore, for example, there is a limit to the area where the substrate processing device 1 can be installed within the factory, and the distance between the exposure device 3 and the indexer device 2 in the -X direction as the first horizontal direction is limited. Even in cases where it is difficult to widen, the substrate processing apparatus 1 becomes easier to place. In the example of FIG. 9 , the first area P1 includes a portion of the developing unit 131 near the end of the second transport unit 135, a relay unit 136, and the second transport unit 135. , the second area P2 includes the first transfer unit 134 and the cooling unit 133B.

In the example of Fig. 10, the cooling unit 133B has a plurality of cooling units 133u stacked in the vertical direction. The cooling unit 133u is, for example, a unit having a placement unit that can place the substrate G1 and an exhaust unit that locally discharges the atmosphere around the placement unit. The placement unit has a configuration that allows the substrate G1 to be placed in a horizontal position on, for example, a plurality of pins installed upright. In the cooling unit 133u, for example, with the substrate G1 placed on the mounting unit, the atmosphere around the substrate G1 is locally discharged by the exhaust unit, thereby cooling the substrate G1. For example, the transfer robot of the first transfer unit 134 can load the substrate G1 into each cooling unit 133u. The substrate G1 can be carried out from each cooling unit 133u, for example, by the transport mechanism of the indexer device 2.

In the example of Fig. 10, the cooling unit 133B has three cooling units 133u, but it is not limited to this. The cooling unit 133B may have one or two cooling units 133u, or may have four or more cooling units 133u. For example, when the cooling unit 133B has two or more cooling units 133u and the two or more cooling units 133u are stacked in the vertical direction, installation of the substrate processing device 1 in the factory Even if there is a limit to the possible area, installation of the substrate processing device 1 can be facilitated.

<2-4. Fourth modification example>

In the first embodiment, the first modification, and the second modification, as shown in FIG. 11, for example, between the cooling units 133 and 133A and the indexer device 2, a second 1 The third conveyance unit 137 located along the -X direction as the horizontal direction may be arranged. The third transport unit 137 can transport the substrate G1 brought in from the cooling units 133 and 133A, for example, to the indexer device 2 side. In other words, the third transport unit 137 can transport the substrate G1 in the -X direction as the first horizontal direction, for example. Here, for example, in relation to the length of the outgoing portion 11, when a gap occurs between the cooling units 133 and 133A and the indexer device 2, the third conveyance unit 137 is placed in the gap. By arranging , the length of the ear passage portion 13 can be adjusted.

For example, a conveyance mechanism such as a conveyor is applied to the third conveyance unit 137. The conveyor moves the substrate G1 in the horizontal position along the -X direction as the first horizontal direction by rotating a plurality of rollers lined up along the -X direction as the first horizontal direction by a drive mechanism (not shown).

FIG. 11 shows an example in which the third conveyance unit 137 is disposed between the cooling unit 133 and the indexer device 2 based on the configuration of FIG. 2 according to the first embodiment. In the example of FIG. 11, the third conveyance unit 137 is located along the -X direction as the first horizontal direction and is included in the second portion 13b. Here, for example, the third transfer unit 137 may be a separate device that is not included in the second portion 13b and is not included in the substrate processing apparatus 1.

<2-5. Fifth modification example>

In the third modification, for example, as shown in FIG. 12, etc., the cooling unit 133B is disposed on the +X direction side as the third horizontal direction of the first transport unit 134, and the first transport unit 134 The third conveyance unit 137 may be disposed on the -X direction side of the unit 134 as the first horizontal direction. In other words, in the second portion 13b, the cooling unit 133B, the first transport unit 134, and the third transport unit 137 may be lined up in that order in the -X direction as the first horizontal direction. . In the example of FIG. 12, the first area P1 includes a portion of the developing unit 131 on the second transport unit 135 side, a relay unit 136, and the second transport unit 135, and the second transport unit 135 Area P2 includes the cooling unit 133B, the first transfer unit 134, and the third transfer unit 137.

Here, for example, the heating unit 132 may be located in an area opposite to the outbound portion 11 of the second transport unit 135. In other words, the heating unit 132 may be located in the area (outside area) A2 on the opposite side to the outbound portion 11 of the first area P1. In this case, for example, the first part 13a includes the developing unit 131, the second conveying unit 135, and the relay unit 136, and the first area P1 includes the developing unit ( 131), it includes the portion on the second transport unit 135, the second transport unit 135, and the relay unit 136, and the second area P2 includes the first transport unit 134 and the cooling unit ( 133B), and a portion of the third conveyance unit 137 located on the +X direction side as the third horizontal direction.

In the return portion 13 having this configuration, when the substrate G1 heated in the heating unit 132 by the first transport unit 134 is transported from the first area P1 to the second area P2 , the substrate G1 is transported from the relay unit 136 to the cooling unit 133B by the first transport unit 134. At this time, the substrate G1 is rotated approximately 90 degrees to a horizontal position by the rotation mechanism of the first transport unit 134, and then is transported into the cooling unit 133B. As a result, the first transport unit 134 returns the direction of the substrate G1 rotated along the horizontal plane by the relay unit 136 to its original direction. After that, the substrate G1 transported from the first area P1 to the second area P2 by the first transfer unit 134 is cooled by the cooling unit 133B. Here, for example, the substrate G1 carried into the cooling unit 133B by the first transfer unit 134 is cooled by the cooling unit 133B. Then, the substrate G1 is transported from the cooling unit 133B to the third transport unit 137 by the first transport unit 134 .

Here, for example, the third transfer unit 137 may be included in the second part 13b, or may be a separate device that is not included in the second part 13b and is not included in the substrate processing apparatus 1. It's okay.

<2-6. 6th modification example>

In the first embodiment, the first modification example, and the fourth modification example, as shown in FIG. 13, for example, the cooling unit 133 is positioned at a third horizontal angle greater than the first transport unit 134. It extends in the + Therefore, the substrate G1 may be transported to an area that is shifted in the +X direction as the third horizontal direction from the area located in the -Y direction as the second horizontal direction orthogonal to the first horizontal direction. In this case, for example, the first area P1 also includes the vicinity of the end of the developing unit 131 on the first transport unit 134 side. Here, for example, the length of the return portion 13 can be shortened by shifting the second portion 13b in the +X direction as the third horizontal direction with respect to the first portion 13a. Therefore, for example, the length of the substrate processing apparatus 1 can be shortened.

In the return portion 13 having this configuration, when the substrate G1 heated in the heating unit 132 by the first transport unit 134 is transported from the first area P1 to the second area P2 , the substrate G1 is transported by the first transport unit 134 so as to be returned obliquely backward with respect to the -X direction as the first horizontal direction. At this time, the substrate G1 is in a horizontal position by the rotation mechanism of the first transport unit 134, and is oriented in a direction tilted with respect to the -X direction as the first horizontal direction. For example, when the upper and lower main surfaces of the substrate G1 have a rectangular shape with two opposing first sides and two opposing second sides, in the developing unit 131, as the first horizontal direction along the first side, The substrate G1 transported along the - In the cooling unit 133, the orientation of the substrate G1 can be returned to its original state by, for example, rotating the horizontal substrate G1 using the rotation unit 133t. For example, the rotation unit 133t can rotate the horizontal substrate G1 so that the extension direction of the first side is along the -X direction as the first horizontal direction.

<2-7. 7th modification example>

In the first embodiment and the first to sixth modifications, for example, as shown in FIGS. 14 and 15, a substrate G1 is provided at a location adjacent to the indexer device 2 in the return portion 13. ) may be disposed. In this case, the substrate G1 placed on the placement unit 138 can be unloaded from the substrate processing apparatus 1 by, for example, the transport mechanism of the indexer apparatus 2. The placement unit 138 has, for example, a placement unit. The mounting unit has a configuration in which the substrate G1 can be temporarily mounted, for example. In the placement unit, for example, the substrate G1 is placed in a horizontal position on a plurality of pins installed upright. The placement unit 138 may have a single-stage structure with one placement unit, or may have a multi-stage structure with two or more placement units arranged vertically.

Here, as shown in FIG. 14 , when the return portion 13 has the cooling portions 133 and 133A including the cooling conveyor 133c, the return portion 13 includes the cooling portions 133 and 133A. An aspect in which a fourth transfer unit 139 is disposed between 133A and the placement unit 138 and transfers the substrate G1 from the cooling units 133 and 133A to the placement unit 138 is conceivable. For example, the same transfer robot as that of the first transfer unit 134 may be applied to the fourth transfer unit 139 .

In Fig. 14, based on the configuration of Fig. 13 according to the sixth modification, a fourth transport unit 139 and a placement unit 138 are arranged between the cooling unit 133 and the indexer device 2. An example is shown. In the example of Fig. 14, in the second portion 13b, the cooling unit 133, the fourth conveyance unit 139, and the placing unit 138 are lined up in that order in the -X direction as the first horizontal direction. Here, for example, the substrate G1 cooled in the cooling unit 133 is transported from the cooling unit 133 to the placing unit 138 by the fourth transport unit 139 . At this time, the substrate G1 is placed on the placement unit 138 . Here, for example, the fourth transport unit 139 and the placement unit 138 may be included in the second part 13b as shown in FIG. 14, or may be included in the second part 13b. It may be a device or configuration external to the substrate processing apparatus 1.

FIG. 15 shows an example in which the placement unit 138 is arranged in place of the third transfer unit 137, based on the configuration of FIG. 12 according to the fifth modification. In the example of Fig. 15, in the second portion 13b, the cooling unit 133B, the first transport unit 134, and the placement unit 138 are lined up in that order in the -X direction as the first horizontal direction. Additionally, the first area P1 includes a portion of the developing unit 131 on the second transport unit 135 side, the relay unit 136, and the second transport unit 135, and the second area P2 includes a cooling unit 133B, a first transfer unit 134, and a placement unit 138. Here, for example, the substrate G1 cooled in the cooling unit 133B is transported from the cooling unit 133B to the placing unit 138 by the first transport unit 134 . At this time, the substrate G1 is placed on the placement unit 138 . Here, for example, the placement unit 138 may be included in the second part 13b as shown in FIG. 15, and may be included in the substrate processing apparatus 1 without being included in the second part 13b. It may be an external configuration.

<2-8. 8th modification example>

In the first embodiment and the first to sixth modifications, for example, as shown in FIGS. 16 and 17, between the cooling units 133, 133A, 133B and the indexer device 2, A device with other functions, such as the inspection device 4, may be located. The inspection device 4 is a device for inspecting the substrate G1 using an optical member such as a camera, for example. In this case, for example, the substrate G1 can be transported from the inspection device 4 to the indexer device 2 by the transport mechanism of the indexer device 2.

FIG. 16 shows an example in which the inspection device 4 is disposed between the cooling unit 133 and the indexer device 2 based on the configuration of FIG. 13 according to the sixth modification. Here, for example, the substrate G1 can be transferred from the cooling unit 133 into the inspection device 4 by a transfer mechanism such as a transfer robot included in the inspection device 4.

FIG. 17 shows an example in which the inspection device 4 is disposed between the cooling unit 133B and the indexer device 2 based on the configuration of FIG. 9 according to the third modification. Here, for example, the substrate G1 can be transferred from the cooling unit 133B into the inspection device 4 by a transfer mechanism such as a transfer robot included in the inspection device 4.

<2-9. 9th modification example>

In the second to fifth modifications, the seventh modification, and the eighth modification, as shown, for example, in FIGS. 18 to 25, the relay unit 136 included in the return portion 13 ) is changed to the relay unit 136A including a conveyor (also referred to as a reverse transport conveyor) 136c for transporting the substrate G1 along the +X direction as the third horizontal direction, and the first transport unit 134 The substrate G1 may be transported to the cooling units 133, 133A, and 133B from a portion of the reverse transport conveyor 136c on the +X direction side as the third horizontal direction. In this case, for example, after transferring the substrate G1 after heating by the heating unit 132 in the + The substrate G1 is transported to the cooling units 133, 133A, and 133B by the unit 134. Thereby, for example, the second part 13b can be shifted in the +X direction as the third horizontal direction with respect to the first part 13a. As a result, for example, the length of the return portion 13 in the -X direction as the first horizontal direction can be shortened. In addition, for example, there is a limit to the area where the substrate processing device 1 can be installed within the factory, so the distance between the exposure device 3 and the indexer device 2 in the -X direction as the first horizontal direction is limited. Even in cases where it is difficult to widen, it becomes easier to place the substrate processing device 1.

In FIG. 18, based on the configuration of FIG. 8 according to the second modification, the relay unit 136 is changed to a relay unit 136A, and a second part 13b is replaced with the first part 13a. An example of shifting to the +X direction as the third horizontal direction is shown.

The relay unit 136A includes, for example, a reverse conveyor 136c and a rotation unit 136t. The back conveyor 136c rotates a plurality of rollers lined up along the + Move it to The rotation unit 136t has a configuration that rotates the horizontal substrate G1 around a virtual rotation axis (virtual rotation axis) along the vertical direction, similarly to the rotation unit 133t described above. In the example of FIG. 18 , the relay unit 136A has a rotation unit 136t near the end on the opposite side from the second transport unit 135.

The rotation unit 136t includes, for example, a turntable at an opening near the center of the Y-direction of two or more rollers lined up in succession among the back conveyor 136c, and a lifting mechanism that raises and lowers the turntable. A configuration having can be applied. For example, a structure having a table portion, a shaft portion, and a rotation drive portion is applied to the turntable. The table portion is, for example, a portion capable of supporting the substrate G1 in a horizontal position from below on a plurality of pins erected on the upper surface. The shaft portion is, for example, a column-shaped or rod-shaped portion that has an upper end portion to which the table portion is fixed and extends in the vertical direction along a virtual rotation axis. The rotation drive unit is, for example, a drive unit such as a motor that rotates the shaft unit around a virtual rotation axis. As the lifting mechanism, for example, a mechanism such as a cylinder that raises and lowers the rotary drive unit in the vertical direction is applied. For example, the rotation unit 136t having the above-described structure raises the turntable by a lifting mechanism in a state where the substrate G1 is positioned above the turntable on the reverse conveyor 136c, so that the turntable is horizontally positioned by the table portion. The substrate G1 in the posture position is lifted from below, and the table portion is rotated by a third predetermined angle, such as about 90 degrees, around the virtual rotation axis by the rotation drive portion. As a result, the direction of the substrate G1 in the horizontal position can be rotated along the horizontal plane. After that, for example, the substrate G1 may be placed on the reverse conveyance conveyor 136c by lowering the turntable using a lifting mechanism, and the substrate ( G1) may be transported to the cooling unit 133A by the first transport unit 134.

In addition, in the example of FIG. 18, the first area P1 is a portion of the developing unit 131 on the side of the second transport unit 135, the second transport unit 135, the heating unit 132, and the relay unit ( 136A), and the second area P2 includes the first transfer unit 134 and the cooling unit 133A.

In the return portion 13 having the configuration of the example in FIG. 18, the substrate G1 is transported from the heating unit 132 to the cooling unit 133A as follows. First, the substrate G1 is transported from the heating unit 132 to the relay unit 136A by the second transport unit 135. Next, in the relay unit 136A, the substrate G1 in the horizontal position is transported along the + The substrate G1 in the posture is rotated along the horizontal plane. Here, for example, the direction of the substrate G1 is rotated by about 90 degrees. Next, the substrate G1 heated in the heating unit 132 is transferred from the first area P1 to the second area P2 by the first transfer unit 134 . Here, for example, the substrate G1 is transported by the first transport unit 134 from the portion of the relay unit 136A on the +X direction side as the third horizontal direction to the cooling unit 133A. At this time, the substrate G1 is rotated approximately 90 degrees to a horizontal position by the rotation mechanism of the first transport unit 134, and then is transported into the cooling unit 133A. As a result, the first transport unit 134 returns the direction of the substrate G1 rotated along the horizontal plane by the relay unit 136A to its original direction.

In FIG. 19, based on the configuration of FIG. 9 according to the third modification, the relay unit 136 is replaced with a relay unit 136A, and a second part 13b is replaced with the first part 13a. An example of shifting to the +X direction as the third horizontal direction is shown. In the example of FIG. 19 , the first area P1 includes a portion of the developing unit 131 on the side of the second transport unit 135 and the relay unit 136A, and the second area P2 includes the first area P1. It includes a conveyance unit 134 and a cooling unit 133B.

In the return portion 13 having the configuration of the example in FIG. 19, the substrate G1 is transported from the heating unit 132 to the cooling unit 133B as follows. First, the substrate G1 is transported from the heating unit 132 to the relay unit 136A by the second transport unit 135. Next, in the relay unit 136A, the substrate G1 in the horizontal position is transported along the + The substrate G1 in the posture is rotated along the horizontal plane. Here, for example, the direction of the substrate G1 is rotated by about 90 degrees. Next, the substrate G1 heated in the heating unit 132 is transferred from the first area P1 to the second area P2 by the first transfer unit 134 . Here, for example, the substrate G1 is transported by the first transport unit 134 from a portion of the relay unit 136A on the +X direction side as the third horizontal direction to the cooling unit 133B. At this time, the substrate G1 is rotated approximately 90 degrees to a horizontal position by the rotation mechanism of the first transport unit 134, and then is transported into the cooling unit 133B. As a result, the first transport unit 134 returns the direction of the substrate G1 rotated along the horizontal plane by the relay unit 136A to its original direction.

In Fig. 20, based on the configuration of Fig. 18, the third conveyance unit 137 is disposed between the cooling unit 133A and the indexer device 2, in the same manner as in Fig. 11 according to the fourth modification. An example is shown. For example, the third transport unit 137 can transport the substrate G1 brought in from the cooling unit 133A to the indexer device 2 side. The third transport unit 137 can transport the substrate G1 in the -X direction as the first horizontal direction, for example. Here, for example, when a gap occurs between the cooling unit 133A and the indexer device 2 in relation to the length of the outgoing portion 11, the third conveyance unit 137 is disposed in the gap. By doing so, the length of the ear passage portion 13 can be adjusted.

In FIG. 21, based on the configuration of FIG. 12 according to the fifth modification, the relay unit 136 is changed to a relay unit 136A, and a second part 13b is replaced with the first part 13a. An example of shifting to the +X direction as the third horizontal direction is shown. In the example of FIG. 21, the first area P1 includes a portion of the developing unit 131 on the second transport unit 135 side, the second transport unit 135, and the relay unit 136A, and the second transport unit 135 Area P2 includes the first transfer unit 134, the cooling unit 133B, and the third transfer unit 137.

In the return portion 13 having the configuration of the example in FIG. 21, the substrate G1 is transported from the heating unit 132 to the cooling unit 133B as follows. First, the substrate G1 is transported from the heating unit 132 to the relay unit 136A by the second transport unit 135. Next, in the relay unit 136A, the substrate G1 in the horizontal position is transported along the + The substrate G1 in the posture is rotated along the horizontal plane. Here, for example, the direction of the substrate G1 is rotated by about 90 degrees. Next, the substrate G1 heated in the heating unit 132 is transferred from the first area P1 to the second area P2 by the first transfer unit 134 . Here, for example, the substrate G1 is transported by the first transport unit 134 from a portion of the relay unit 136A on the +X direction side as the third horizontal direction to the cooling unit 133B. At this time, the substrate G1 is rotated approximately 90 degrees to a horizontal position by the rotation mechanism of the first transport unit 134, and then is transported into the cooling unit 133B. As a result, the first transport unit 134 returns the direction of the substrate G1 rotated along the horizontal plane by the relay unit 136A to its original direction.

In Fig. 22, based on the configuration of Fig. 18, a fourth conveyance unit 139 and a placement unit are provided between the cooling unit 133A and the indexer device 2, similarly to Fig. 14 according to the seventh modification. An example of arrangement of (138) is shown. In the example of FIG. 22, in the second portion 13b, the first transport unit 134, the cooling unit 133A, the fourth transport unit 139, and the placement unit 138 are positioned at -X in the first horizontal direction. They are lined up in order in terms of direction. Here, for example, the substrate G1 cooled in the cooling unit 133A is transported from the cooling unit 133 to the placing unit 138 by the fourth transport unit 139. At this time, the substrate G1 is placed on the placement unit 138 . Here, for example, the fourth transport unit 139 and the placement unit 138 may be included in the second part 13b as shown in FIG. 22, or may be included in the second part 13b. It may be a device or configuration external to the substrate processing apparatus 1.

In FIG. 23, based on the configuration of FIG. 15 according to the seventh modification, the relay unit 136 is changed to a relay unit 136A, and a second part 13b is replaced with the first part 13a. An example of shifting to the +X direction as the third horizontal direction is shown. In the example of FIG. 23 , the first area P1 includes a portion of the developing unit 131 on the side of the second transport unit 135 and the relay unit 136A, and the second area P2 includes the first area P1. It includes a conveyance unit 134, a cooling unit 133B, and a placement unit 138. Here, for example, the placement unit 138 may be included in the second part 13b and the second area P2 as shown in FIG. 23, and the second part 13b and the second area ( It may be a configuration external to the substrate processing apparatus 1 without being included in P2). In the return portion 13 having the configuration of the example in FIG. 23 , the substrate G1 is transported from the heating unit 132 to the cooling unit 133B in the same manner as the return portion 13 having the configuration of the example of FIG. 21 . .

In Fig. 24, based on the configuration of Fig. 18, an example in which the inspection device 4 is disposed between the cooling unit 133A and the indexer device 2 is shown in the same manner as Fig. 16 according to the eighth modification. It's messy. In the example of Fig. 24, for example, the substrate G1 is transported from the cooling unit 133A into the inspection device 4 by a transportation mechanism such as a transportation robot included in the inspection device 4, and the indexer device 2 The substrate G1 can be transported from the inspection device 4 to the indexer device 2 by the transport mechanism.

In FIG. 25, based on the configuration of FIG. 17 according to the eighth modification, the relay unit 136 is changed to a relay unit 136A, and a second part 13b is replaced with the first part 13a. An example of shifting to the +X direction as the third horizontal direction is shown. In the example of FIG. 25 , the first area P1 includes a portion of the developing unit 131 on the side of the second transport unit 135 and the relay unit 136A, and the second area P2 includes the first area P1. It includes a conveyance unit 134 and a cooling unit 133B. In the return portion 13 having the configuration of the example of FIG. 25 , the substrate G1 is transported from the heating unit 132 to the cooling unit 133B in the same manner as the return portion 13 having the configuration of the example of FIG. 19 . .

In the ninth modification, for example, the relay unit 136A may have the rotation unit 136t at any position in the +X direction as the third horizontal direction.

In the ninth modification, for example, an aspect in which the first transport unit 134 has a configuration in which a plurality of conveyors with different transport directions of the substrate G1 are lined up in order is also considered. In this case, for example, the first transport unit 134 may be positioned from the first part 13a to the second part 13b. In other words, for example, the first transport unit 134 may be located from the first area P1 to the second area P2. Here, for example, the height of the path (also referred to as the first pass line) along which the substrate G1 moves in the relay unit 136A and the position of the substrate G1 in the cooling units 133, 133A, and 133B When the heights are different, the first conveyance unit 134 may have a lifting mechanism that raises and lowers at least part of the plurality of conveyors.

<2-10. Others>

In the first embodiment and each of the above modified examples, for example, the return portion 13 is located along the -X direction as the first horizontal direction and is based on the XZ plane as an imaginary vertical plane perpendicular to the horizontal plane. It may be changed to a plane-symmetric configuration. In other words, for example, the second area P2 may be located in the outer area A2 on the opposite side to the outbound part 11 of the first area P1 in the first part 13a.

In the first embodiment and each of the above modifications, for example, the glass substrate as the substrate G1 as the processing target includes, for example, a glass substrate for a liquid crystal display device and a glass substrate for an organic EL (Electro Luminescence) display. , glass substrate for PDP or glass substrate for photomask, etc. are applied. In addition, as the substrate G1 to be processed, for example, a substrate for a precision electronic device different from a glass substrate, such as a semiconductor wafer, a color filter substrate, a recording disk substrate, or a solar cell substrate, may be adopted. .

In the first embodiment and each of the above modifications, for example, the substrate processing device 1 may include an indexer device 2 and may include an exposure device 3.

Furthermore, it goes without saying that all or part of the first embodiment and various modifications can be appropriately combined within a non-contradictory range.

1: Substrate processing device 11: Outward path portion
111: Tax Department 112: Tabernacle Department
12: interface part 13: return part
13a: first part 13b: second part
131: developing section 132: heating section
133, 133A, 133B: cooling unit 133c: cooling conveyor
133t, 136t: rotation unit 133u: cooling unit
134: first transport unit 135: second transport unit
136, 136A: relay unit 136c: reverse conveyor
137: Third delivery department 138: Delivery department
139: Fourth conveying unit 2: Indexer device
3: Exposure device G1: Substrate
P1: first area P2: second area

Claims (9)

A outward path portion along which the substrate moves from the area where the substrate is loaded from the indexer device to the interface section where the substrate is unloaded toward the exposure device, and the area where the substrate is unloaded from the interface section toward the indexer device. A substrate processing apparatus comprising a return portion along which the substrate transported from the exposure device to the interface unit moves,
The outbound portion has a cleaning section for performing a cleaning treatment on the substrate, and a film forming section for forming a coating film on the substrate on which the cleaning treatment has been performed,
The return portion has a first portion and a second portion, each of which is located along a first horizontal direction,
The first part includes a developing section that develops the coating film,
The second part includes a cooling unit that cools the substrate heated in the heating unit after the development process,
In the case of planar perspective from above, a first area constituting a portion of the first portion in the first horizontal direction, and a second region constituting at least a portion of the second portion in the first horizontal direction The regions are lined up in a second horizontal direction orthogonal to the first horizontal direction,
The return portion includes the heating unit and a first transport unit that transports the substrate heated in the heating unit from the first area to the second area. In claim 1,
In the first portion, the developing unit, the first transport unit, and the heating unit are lined up in that order in the first horizontal direction,
The substrate processing apparatus wherein the first transport unit transports the substrate from the developing unit to the heating unit and transports the substrate from the heating unit to the cooling unit. In claim 1,
The first part includes a relay unit positioned to overlap in the vertical direction with respect to the developing unit, and a second unit that transports the substrate from the developing unit to the heating unit and transports the substrate from the heating unit to the relay unit. Includes a conveyance unit,
A substrate processing apparatus, wherein the first transport unit transports the substrate from the relay unit to the cooling unit. In claim 3,
The relay unit includes a reverse conveyor that transports the substrate along a third horizontal direction opposite to the first horizontal direction,
The substrate processing apparatus wherein the first transport unit transports the substrate from a portion of the reverse transport conveyor on the third horizontal direction to the cooling unit. In claim 3 or claim 4,
In the first portion, the developing unit, the second transport unit, and the heating unit are lined up in that order in the first horizontal direction. The method according to any one of claims 1 to 4,
The cooling unit includes a cooling conveyor that cools the substrate while conveying the substrate along the first horizontal direction. The method according to any one of claims 1 to 4,
A substrate processing apparatus, wherein the cooling unit includes a cooling unit that cools the substrate by exhausting air while temporarily storing the substrate. In claim 1 or claim 2,
The first part includes the first transport unit,
The cooling unit includes a cooling conveyor that cools the substrate while transporting the substrate in the first horizontal direction, and extends from the first transport unit in a third horizontal direction opposite to the first horizontal direction. It is done,
When transporting the substrate to the cooling unit, the first transport unit moves the substrate to an area that is shifted in the third horizontal direction from an area located in the second horizontal direction with respect to the first transport unit among the cooling units. A substrate processing device that conveys. A outward path portion along which the substrate moves from the area where the substrate is loaded from the indexer device to the interface section where the substrate is unloaded toward the exposure device, and the area where the substrate is unloaded from the interface section toward the indexer device. A substrate processing method using a substrate processing apparatus having a return portion along which the substrate transported from the exposure device to the interface unit moves, comprising:
The outbound portion has a cleaning section for performing a cleaning treatment on the substrate, and a film forming section for forming a coating film on the substrate on which the cleaning treatment has been performed,
The return portion has a first portion and a second portion, each of which is located along a first horizontal direction,
The first part includes a developing section,
The second part includes a cooling part,
In the case of planar perspective from above, a first area constituting a portion of the first portion in the first horizontal direction, and a second region constituting at least a portion of the second portion in the first horizontal direction The regions are lined up in a second horizontal direction orthogonal to the first horizontal direction,
The return portion includes a heating portion and a first conveying portion,
A first step of subjecting the coating film to development by the developing unit;
a second process of heating, by the heating unit, the substrate on which the development treatment has been performed on the coating film in the first process;
A third process of transferring the substrate heated in the second process from the first area to the second area by the first transfer unit;
A substrate processing method comprising a fourth step of cooling the substrate conveyed from the first area to the second area in the third process by the cooling unit.