KR20230129043A - 수지 조성물, 경화물, 적층체, 경화물의 제조 방법,및, 반도체 디바이스, 및, 환화 수지의 전구체 - Google Patents

수지 조성물, 경화물, 적층체, 경화물의 제조 방법,및, 반도체 디바이스, 및, 환화 수지의 전구체 Download PDF

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KR20230129043A
KR20230129043A KR1020237027049A KR20237027049A KR20230129043A KR 20230129043 A KR20230129043 A KR 20230129043A KR 1020237027049 A KR1020237027049 A KR 1020237027049A KR 20237027049 A KR20237027049 A KR 20237027049A KR 20230129043 A KR20230129043 A KR 20230129043A
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South Korea
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group
formula
preferable
resin
compound
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KR1020237027049A
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English (en)
Korean (ko)
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다이스케 아사카와
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후지필름 가부시키가이샤
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Publication of KR20230129043A publication Critical patent/KR20230129043A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
KR1020237027049A 2021-02-12 2022-02-09 수지 조성물, 경화물, 적층체, 경화물의 제조 방법,및, 반도체 디바이스, 및, 환화 수지의 전구체 KR20230129043A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-021058 2021-02-12
JP2021021058 2021-02-12
PCT/JP2022/005156 WO2022172962A1 (ja) 2021-02-12 2022-02-09 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、環化樹脂の前駆体

Publications (1)

Publication Number Publication Date
KR20230129043A true KR20230129043A (ko) 2023-09-05

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KR1020237027049A KR20230129043A (ko) 2021-02-12 2022-02-09 수지 조성물, 경화물, 적층체, 경화물의 제조 방법,및, 반도체 디바이스, 및, 환화 수지의 전구체

Country Status (5)

Country Link
JP (1) JPWO2022172962A1 (zh)
KR (1) KR20230129043A (zh)
CN (1) CN116888187A (zh)
TW (1) TW202244129A (zh)
WO (1) WO2022172962A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121962A (ja) 2008-03-31 2011-06-23 Dainippon Printing Co Ltd 感光性樹脂組成物、当該感光性樹脂組成物からなるパターン形成用材料、パターン形成方法、及び当該感光性樹脂組成物を用いた物品、並びに塩基発生剤
JP2014201695A (ja) 2013-04-08 2014-10-27 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物及びそれを用いたパターン形成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04291235A (ja) * 1991-03-19 1992-10-15 Fuji Photo Film Co Ltd 液晶表示素子
JP4595417B2 (ja) * 2004-07-16 2010-12-08 チッソ株式会社 フェニレンジアミン、それを用いて形成される配向膜、および該配向膜を含む液晶表示素子
TWI694101B (zh) * 2015-08-28 2020-05-21 日商富士軟片股份有限公司 硬化膜的製造方法、再配線層用層間絕緣膜的製造方法及半導體元件的製造方法
JP7252020B2 (ja) * 2018-04-16 2023-04-04 旭化成株式会社 ネガ型感光性樹脂組成物及び硬化レリーフパターンの製造方法
JP7351637B2 (ja) * 2018-05-29 2023-09-27 旭化成株式会社 樹脂組成物、及び硬化膜の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121962A (ja) 2008-03-31 2011-06-23 Dainippon Printing Co Ltd 感光性樹脂組成物、当該感光性樹脂組成物からなるパターン形成用材料、パターン形成方法、及び当該感光性樹脂組成物を用いた物品、並びに塩基発生剤
JP2014201695A (ja) 2013-04-08 2014-10-27 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物及びそれを用いたパターン形成方法

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JPWO2022172962A1 (zh) 2022-08-18
TW202244129A (zh) 2022-11-16
WO2022172962A1 (ja) 2022-08-18
CN116888187A (zh) 2023-10-13

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