KR20230115734A - Novel compound and organic light emitting device comprising the same - Google Patents
Novel compound and organic light emitting device comprising the same Download PDFInfo
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- KR20230115734A KR20230115734A KR1020220012555A KR20220012555A KR20230115734A KR 20230115734 A KR20230115734 A KR 20230115734A KR 1020220012555 A KR1020220012555 A KR 1020220012555A KR 20220012555 A KR20220012555 A KR 20220012555A KR 20230115734 A KR20230115734 A KR 20230115734A
- Authority
- KR
- South Korea
- Prior art keywords
- compound
- deuterium
- group
- light emitting
- compounds
- Prior art date
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 571
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 claims description 65
- 229910052805 deuterium Inorganic materials 0.000 claims description 65
- 239000011368 organic material Substances 0.000 claims description 43
- 125000001424 substituent group Chemical group 0.000 claims description 23
- 238000006467 substitution reaction Methods 0.000 claims description 23
- 125000005647 linker group Chemical group 0.000 claims description 16
- 125000004957 naphthylene group Chemical class 0.000 claims description 10
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 10
- 125000004431 deuterium atom Chemical group 0.000 claims description 9
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 9
- 125000001624 naphthyl group Chemical group 0.000 claims description 6
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 claims description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 2
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 claims description 2
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 73
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- 125000000623 heterocyclic group Chemical group 0.000 description 3
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- 125000003373 pyrazinyl group Chemical group 0.000 description 1
- 150000003220 pyrenes Chemical class 0.000 description 1
- 125000001725 pyrenyl group Chemical group 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 229940083082 pyrimidine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 150000003230 pyrimidines Chemical class 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002294 quinazolinyl group Chemical group N1=C(N=CC2=CC=CC=C12)* 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 125000001567 quinoxalinyl group Chemical group N1=C(C=NC2=CC=CC=C12)* 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- JLBRGNFGBDNNSF-UHFFFAOYSA-N tert-butyl(dimethyl)borane Chemical group CB(C)C(C)(C)C JLBRGNFGBDNNSF-UHFFFAOYSA-N 0.000 description 1
- 125000001113 thiadiazolyl group Chemical group 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- IBBLKSWSCDAPIF-UHFFFAOYSA-N thiopyran Chemical compound S1C=CC=C=C1 IBBLKSWSCDAPIF-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- KWQNQSDKCINQQP-UHFFFAOYSA-K tri(quinolin-8-yloxy)gallane Chemical compound C1=CN=C2C(O[Ga](OC=3C4=NC=CC=C4C=CC=3)OC=3C4=NC=CC=C4C=CC=3)=CC=CC2=C1 KWQNQSDKCINQQP-UHFFFAOYSA-K 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- LALRXNPLTWZJIJ-UHFFFAOYSA-N triethylborane Chemical group CCB(CC)CC LALRXNPLTWZJIJ-UHFFFAOYSA-N 0.000 description 1
- WXRGABKACDFXMG-UHFFFAOYSA-N trimethylborane Chemical group CB(C)C WXRGABKACDFXMG-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- MXSVLWZRHLXFKH-UHFFFAOYSA-N triphenylborane Chemical group C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1 MXSVLWZRHLXFKH-UHFFFAOYSA-N 0.000 description 1
- 125000003960 triphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C3=CC=CC=C3C12)* 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- HTPBWAPZAJWXKY-UHFFFAOYSA-L zinc;quinolin-8-olate Chemical compound [Zn+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 HTPBWAPZAJWXKY-UHFFFAOYSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07B—GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
- C07B59/00—Introduction of isotopes of elements into organic compounds ; Labelled organic compounds per se
- C07B59/001—Acyclic or carbocyclic compounds
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C15/00—Cyclic hydrocarbons containing only six-membered aromatic rings as cyclic parts
- C07C15/20—Polycyclic condensed hydrocarbons
- C07C15/27—Polycyclic condensed hydrocarbons containing three rings
- C07C15/28—Anthracenes
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07B—GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
- C07B2200/00—Indexing scheme relating to specific properties of organic compounds
- C07B2200/05—Isotopically modified compounds, e.g. labelled
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- Electroluminescent Light Sources (AREA)
Abstract
Description
본 발명은 신규한 화합물 및 이를 포함하는 유기 발광 소자에 관한 것이다. The present invention relates to a novel compound and an organic light emitting device including the same.
일반적으로 유기 발광 현상이란 유기 물질을 이용하여 전기에너지를 빛에너지로 전환시켜주는 현상을 말한다. 유기 발광 현상을 이용하는 유기 발광 소자는 넓은 시야각, 우수한 콘트라스트, 빠른 응답 시간을 가지며, 휘도, 구동 전압 및 응답 속도 특성이 우수하여 많은 연구가 진행되고 있다. In general, the organic light emitting phenomenon refers to a phenomenon in which electrical energy is converted into light energy using an organic material. An organic light emitting device using an organic light emitting phenomenon has a wide viewing angle, excellent contrast, and a fast response time, and has excellent luminance, driving voltage, and response speed characteristics, and thus many studies are being conducted.
유기 발광 소자는 일반적으로 양극과 음극 및 상기 양극과 음극 사이에 유기물층을 포함하는 구조를 가진다. 상기 유기물층은 유기 발광 소자의 효율과 안정성을 높이기 위하여 각기 다른 물질로 구성된 다층의 구조로 이루어진 경우가 많으며, 예컨대 정공주입층, 정공수송층, 발광층, 전자수송층, 전자주입층 등으로 이루어질 수 있다. 이러한 유기 발광 소자의 구조에서 두 전극 사이에 전압을 걸어주게 되면 양극에서는 정공이, 음극에서는 전자가 유기물층에 주입되게 되고, 주입된 정공과 전자가 만났을 때 엑시톤(exciton)이 형성되며, 이 엑시톤이 다시 바닥상태로 떨어질 때 빛이 나게 된다. An organic light emitting device generally has a structure including an anode, a cathode, and an organic material layer between the anode and the cathode. In order to increase the efficiency and stability of the organic light emitting device, the organic material layer is often composed of a multi-layered structure composed of different materials, and may include, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. In the structure of this organic light emitting device, when a voltage is applied between the two electrodes, holes are injected from the anode and electrons from the cathode are injected into the organic material layer, and when the injected holes and electrons meet, excitons are formed. When it falls back to the ground state, it glows.
상기와 같은 유기 발광 소자에 사용되는 유기물에 대하여 새로운 재료의 개발이 지속적으로 요구되고 있다.The development of new materials for organic materials used in the organic light emitting device as described above is continuously required.
한편, 최근에는 공정 비용 절감을 위하여 기존의 증착 공정 대신 용액 공정, 특히 잉크젯 공정을 이용한 유기 발광 소자가 개발되고 있다. 초창기에는 모든 유기 발광 소자 층을 용액 공정으로 코팅하여 유기 발광 소자를 개발하려 하였으나 현재 기술로는 한계가 있어, HIL, HTL, EML만을 용액 공정으로 진행하고 추후 공정은 기존의 증착 공정을 활용하는 하이브리드(hybrid) 공정이 연구 중이다. Meanwhile, in recent years, an organic light emitting device using a solution process, particularly an inkjet process, instead of a conventional deposition process has been developed to reduce process costs. In the early days, an attempt was made to develop an organic light emitting device by coating all organic light emitting device layers with a solution process, but current technology has limitations, so only HIL, HTL, and EML are processed as a solution process, and the subsequent process is a hybrid that utilizes the existing deposition process. (hybrid) process is under investigation.
이에 본 발명에서는 유기 발광 소자에 사용될 수 있으면서 동시에 용액 공정에 사용 가능한 신규한 유기 발광 소자의 소재를 제공한다.Accordingly, the present invention provides a novel organic light emitting device material that can be used in an organic light emitting device and can be used in a solution process at the same time.
본 발명은 신규한 화합물 및 이를 포함하는 유기 발광 소자에 관한 것이다. The present invention relates to a novel compound and an organic light emitting device including the same.
본 발명은 하기 화학식 1로 표시되는 화합물을 제공한다: The present invention provides a compound represented by Formula 1 below:
[화학식 1][Formula 1]
상기 화학식 1에서,In Formula 1,
D는 중수소를 의미하고,D means deuterium,
P1 및 P2는 각각 독립적으로 단일 결합; 또는 비치환되거나 또는 중수소로 치환된 페닐렌이고,P 1 and P 2 are each independently a single bond; or phenylene which is unsubstituted or substituted with deuterium;
Q1 및 Q2는 각각 독립적으로 비치환되거나 또는 중수소로 치환된 나프틸렌이고,Q 1 and Q 2 are each independently unsubstituted or deuterium-substituted naphthylene,
L1 내지 L4는 각각 독립적으로 단일 결합; 비치환되거나 또는 중수소로 치환된 페닐렌; 또는 비치환되거나 또는 중수소로 치환된 나프틸렌이고,L 1 to L 4 are each independently a single bond; phenylene unsubstituted or substituted with deuterium; or naphthylene unsubstituted or substituted with deuterium;
Ar1 및 Ar2는 각각 독립적으로 비치환되거나 또는 중수소로 치환된 페닐; 또는 비치환되거나 또는 중수소로 치환된 나프틸이고,Ar 1 and Ar 2 are each independently unsubstituted or deuterium-substituted phenyl; or naphthyl unsubstituted or substituted with deuterium;
x, y 및 z는 각각 독립적으로 0 내지 8의 정수이고,x, y and z are each independently an integer from 0 to 8;
단, 상기 화합물은 적어도 하나의 중수소를 포함한다.provided that the compound contains at least one deuterium.
또한, 본 발명은 제1 전극; 상기 제1 전극과 대향하여 구비된 제2 전극; 및 상기 제1 전극과 상기 제2 전극 사이에 구비된 1층 이상의 유기물층을 포함하는 유기 발광 소자로서, 상기 유기물층 중 1층 이상은 상기 화학식 1로 표시되는 화합물을 포함하는, 유기 발광 소자를 제공한다.In addition, the present invention is a first electrode; a second electrode provided to face the first electrode; and one or more organic material layers provided between the first electrode and the second electrode, wherein at least one of the organic material layers includes the compound represented by Chemical Formula 1. .
상술한 화학식 1로 표시되는 화합물은 유기 발광 소자의 유기물층의 재료로서 사용될 수 있으며, 또한 용액 공정에 사용이 가능하며, 유기 발광 소자에서 효율 및 수명 특성을 향상시킬 수 있다. The compound represented by Formula 1 described above can be used as a material for an organic layer of an organic light emitting device, and can also be used in a solution process, and can improve efficiency and lifetime characteristics of an organic light emitting device.
도 1은 기판(1), 양극(2), 발광층(3), 음극(4)으로 이루어진 유기 발광 소자의 예를 도시한 것이다.
도 2는 기판 (1), 양극(2), 정공주입층(5), 정공수송층(6), 발광층(3), 전자주입 및 수송층(7) 및 음극(4)으로 이루어진 유기 발광 소자의 예를 도시한 것이다. 1 shows an example of an organic light emitting device composed of a substrate 1, an anode 2, a light emitting layer 3, and a cathode 4.
2 is an example of an organic light emitting device composed of a substrate (1), an anode (2), a hole injection layer (5), a hole transport layer (6), a light emitting layer (3), an electron injection and transport layer (7), and a cathode (4). is shown.
이하, 본 발명의 이해를 돕기 위하여 보다 상세히 설명한다.Hereinafter, in order to aid understanding of the present invention, it will be described in more detail.
(용어의 정의)(Definition of Terms)
본 명세서에서, 및 는 다른 치환기에 연결되는 결합을 의미하고, D는 중수소를 의미한다.In this specification, and means a bond connected to another substituent, and D means deuterium.
본 명세서에서 "치환 또는 비치환된" 이라는 용어는 중수소, 할로겐기, 시아노기, 니트로기, 히드록시기, 카보닐기, 에스테르기, 이미드기, 아미노기, 포스핀옥사이드기, 알콕시기, 아릴옥시기, 알킬티옥시기, 아릴티옥시기, 알킬술폭시기, 아릴술폭시기, 실릴기, 붕소기, 알킬기, 사이클로알킬기, 알케닐기, 아릴기, 아르알킬기, 아르알케닐기, 알킬아릴기, 알킬아민기, 아랄킬아민기, 헤테로아릴아민기, 아릴아민기, 아릴포스핀기, 또는 N, O 및 S 원자 중 1개 이상을 포함하는 헤테로아릴로 이루어진 군에서 선택된 1개 이상의 치환기로 치환 또는 비치환되거나; 상기 예시된 치환기 중 2 이상의 치환기가 연결된 치환 또는 비치환된 것을 의미한다. 예컨대, "2 이상의 치환기가 연결된 치환기"는 비페닐기일 수 있다. 즉, 비페닐이기는 아릴기일 수도 있고, 2개의 페닐기가 연결된 치환기로 해석될 수도 있다. 일례로, "치환 또는 비치환된" 이라는 용어는 "비치환되거나, 또는 중수소, 할로겐, C1-10 알킬, C1-10 알콕시 및 C6-20 아릴로 구성되는 군으로부터 선택되는 1개 이상, 예를 들어 1개 내지 5개의 치환기로 치환된"이라는 의미로 이해될 수 있다. 또한, 본 명세서에서 "1개 이상의 치환기로 치환된"이라는 용어는, 예를 들어 "1개 내지 5개의 치환기로 치환된", 또는 "1개 또는 2개의 치환기로 치환된"이라는 의미로 이해될 수 있다.As used herein, the term “substituted or unsubstituted” refers to heavy hydrogen, a halogen group, a cyano group, a nitro group, a hydroxy group, a carbonyl group, an ester group, an imide group, an amino group, a phosphine oxide group, an alkoxy group, an aryloxy group, an alkyl Thioxy group, arylthioxy group, alkylsulfoxyl group, arylsulfoxyl group, silyl group, boron group, alkyl group, cycloalkyl group, alkenyl group, aryl group, aralkyl group, aralkenyl group, alkylaryl group, alkylamine group, aralkylamine substituted or unsubstituted with one or more substituents selected from the group consisting of a group, a heteroarylamine group, an arylamine group, an arylphosphine group, or a heteroaryl containing at least one of N, O, and S atoms; It means that two or more substituents among the substituents exemplified above are linked to each other, substituted or unsubstituted. For example, "a substituent in which two or more substituents are connected" may be a biphenyl group. That is, the biphenyl group may be an aryl group or may be interpreted as a substituent in which two phenyl groups are connected. For example, the term “substituted or unsubstituted” means “unsubstituted or one or more selected from the group consisting of deuterium, halogen, C 1-10 alkyl, C 1-10 alkoxy and C 6-20 aryl. , for example, substituted with 1 to 5 substituents". In addition, the term "substituted with one or more substituents" in this specification will be understood to mean, for example, "substituted with 1 to 5 substituents" or "substituted with 1 or 2 substituents". can
본 명세서에서 카보닐기의 탄소수는 특별히 한정되지 않으나, 탄소수 1 내지 40인 것이 바람직하다. 구체적으로 하기와 같은 구조의 치환기가 될 수 있으나, 이에 한정되는 것은 아니다.In the present specification, the number of carbon atoms of the carbonyl group is not particularly limited, but is preferably 1 to 40 carbon atoms. Specifically, it may be a substituent having the following structure, but is not limited thereto.
본 명세서에 있어서, 에스테르기는 에스테르기의 산소가 탄소수 1 내지 25의 직쇄, 분지쇄 또는 고리쇄 알킬기 또는 탄소수 6 내지 25의 아릴기로 치환될 수 있다. 구체적으로, 하기 구조식의 치환기가 될 수 있으나, 이에 한정되는 것은 아니다.In the present specification, the ester group may be substituted with an aryl group having 6 to 25 carbon atoms or a straight-chain, branched-chain or cyclic chain alkyl group having 1 to 25 carbon atoms in the ester group. Specifically, it may be a substituent of the following structural formula, but is not limited thereto.
본 명세서에 있어서, 이미드기의 탄소수는 특별히 한정되지 않으나, 탄소수 1 내지 25인 것이 바람직하다. 구체적으로 하기와 같은 구조의 치환기가 될 수 있으나, 이에 한정되는 것은 아니다.In the present specification, the number of carbon atoms of the imide group is not particularly limited, but is preferably 1 to 25 carbon atoms. Specifically, it may be a substituent having the following structure, but is not limited thereto.
본 명세서에 있어서, 실릴기는 구체적으로 트리메틸실릴기, 트리에틸실릴기, t-부틸디메틸실릴기, 비닐디메틸실릴기, 프로필디메틸실릴기, 트리페닐실릴기, 디페닐실릴기, 페닐실릴기 등이 있으나 이에 한정되지 않는다. In the present specification, the silyl group is specifically a trimethylsilyl group, a triethylsilyl group, a t-butyldimethylsilyl group, a vinyldimethylsilyl group, a propyldimethylsilyl group, a triphenylsilyl group, a diphenylsilyl group, a phenylsilyl group, and the like. but not limited to
본 명세서에 있어서, 붕소기는 구체적으로 트리메틸붕소기, 트리에틸붕소기, t-부틸디메틸붕소기, 트리페닐붕소기, 페닐붕소기 등이 있으나 이에 한정되지 않는다.In the present specification, the boron group specifically includes a trimethyl boron group, a triethyl boron group, a t-butyldimethyl boron group, a triphenyl boron group, a phenyl boron group, but is not limited thereto.
본 명세서에 있어서, 할로겐기의 예로는 플루오로, 클로로, 브로모, 또는 아이오도가 있다.In this specification, examples of the halogen group include fluoro, chloro, bromo, or iodo.
본 명세서에 있어서, 상기 알킬기는 직쇄 또는 분지쇄일 수 있고, 탄소수는 특별히 한정되지 않으나 1 내지 40인 것이 바람직하다. 일 실시상태에 따르면, 상기 알킬기의 탄소수는 1 내지 20이다. 또 하나의 실시상태에 따르면, 상기 알킬기의 탄소수는 1 내지 10이다. 또 하나의 실시상태에 따르면, 상기 알킬기의 구체적인 예로는 메틸, 에틸, 프로필, n-프로필, 이소프로필, 부틸, n-부틸, 이소부틸, tert-부틸, sec-부틸, 1-메틸-부틸, 1-에틸부틸, 펜틸, n-펜틸, 이소펜틸, 네오펜틸, tert-펜틸, 1-에틸-프로필, 1,1-디메틸프로필, 헥실, n-헥실, 1-메틸펜틸, 2-메틸펜틸, 4-메틸-2-펜틸, 3,3-디메틸부틸, 2-에틸부틸, 헵틸, n-헵틸, 이소헥실, 1-메틸헥실, 2-메틸헥실, 3-메틸헥실, 4-메틸헥실, 5-메틸헥실, 사이클로펜틸메틸, 사이클로헥실메틸, 옥틸, n-옥틸, tert-옥틸, 1-메틸헵틸, 2-에틸헥실, 2,4,4-트리메틸-1-펜틸, 2,4,4-트리메틸-2-펜틸, 2-프로필펜틸, n-노닐, 2,2-디메틸헵틸 등이 있으나, 이에 한정되는 것은 아니다.In the present specification, the alkyl group may be straight-chain or branched-chain, and the number of carbon atoms is not particularly limited, but is preferably 1 to 40. According to one embodiment, the number of carbon atoms of the alkyl group is 1 to 20. According to another exemplary embodiment, the number of carbon atoms of the alkyl group is 1 to 10. According to another embodiment, specific examples of the alkyl group include methyl, ethyl, propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, tert-butyl, sec-butyl, 1-methyl-butyl, 1-ethylbutyl, pentyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, 1-ethyl-propyl, 1,1-dimethylpropyl, hexyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4-methyl-2-pentyl, 3,3-dimethylbutyl, 2-ethylbutyl, heptyl, n-heptyl, isohexyl, 1-methylhexyl, 2-methylhexyl, 3-methylhexyl, 4-methylhexyl, 5 -methylhexyl, cyclopentylmethyl, cyclohexylmethyl, octyl, n-octyl, tert-octyl, 1-methylheptyl, 2-ethylhexyl, 2,4,4-trimethyl-1-pentyl, 2,4,4- trimethyl-2-pentyl, 2-propylpentyl, n-nonyl, 2,2-dimethylheptyl, etc., but is not limited thereto.
본 명세서에 있어서, 상기 알케닐기는 직쇄 또는 분지쇄일 수 있고, 탄소수는 특별히 한정되지 않으나, 2 내지 40인 것이 바람직하다. 일 실시상태에 따르면, 상기 알케닐기의 탄소수는 2 내지 20이다. 또 하나의 실시상태에 따르면, 상기 알케닐기의 탄소수는 2 내지 10이다. 또 하나의 실시상태에 따르면, 상기 알케닐기의 탄소수는 2 내지 6이다. 구체적인 예로는 비닐, 1-프로페닐, 이소프로페닐, 1-부테닐, 2-부테닐, 3-부테닐, 1-펜테닐, 2-펜테닐, 3-펜테닐, 3-메틸-1-부테닐, 1,3-부타디에닐, 알릴, 1-페닐비닐-1-일, 2-페닐비닐-1-일, 2,2-디페닐비닐-1-일, 2-페닐-2-(나프틸-1-일)비닐-1-일, 2,2-비스(디페닐-1-일)비닐-1-일, 스틸베닐기, 스티레닐기 등이 있으나 이에 한정되는 것은 아니다.In the present specification, the alkenyl group may be linear or branched, and the number of carbon atoms is not particularly limited, but is preferably 2 to 40. According to one embodiment, the alkenyl group has 2 to 20 carbon atoms. According to another exemplary embodiment, the alkenyl group has 2 to 10 carbon atoms. According to another exemplary embodiment, the alkenyl group has 2 to 6 carbon atoms. Specific examples include vinyl, 1-propenyl, isopropenyl, 1-butenyl, 2-butenyl, 3-butenyl, 1-pentenyl, 2-pentenyl, 3-pentenyl, 3-methyl-1- Butenyl, 1,3-butadienyl, allyl, 1-phenylvinyl-1-yl, 2-phenylvinyl-1-yl, 2,2-diphenylvinyl-1-yl, 2-phenyl-2-( naphthyl-1-yl)vinyl-1-yl, 2,2-bis(diphenyl-1-yl)vinyl-1-yl, a stilbenyl group, a styrenyl group, and the like, but are not limited thereto.
본 명세서에 있어서, 사이클로알킬기는 특별히 한정되지 않으나, 탄소수 3 내지 60인 것이 바람직하며, 일 실시상태에 따르면, 상기 사이클로알킬기의 탄소수는 3 내지 30이다. 또 하나의 실시상태에 따르면, 상기 사이클로알킬기의 탄소수는 3 내지 20이다. 또 하나의 실시상태에 따르면, 상기 사이클로알킬기의 탄소수는 3 내지 6이다. 구체적으로 사이클로프로필, 사이클로부틸, 사이클로펜틸, 3-메틸사이클로펜틸, 2,3-디메틸사이클로펜틸, 사이클로헥실, 3-메틸사이클로헥실, 4-메틸사이클로헥실, 2,3-디메틸사이클로헥실, 3,4,5-트리메틸사이클로헥실, 4-tert-부틸사이클로헥실, 사이클로헵틸, 사이클로옥틸 등이 있으나, 이에 한정되지 않는다.In the present specification, the cycloalkyl group is not particularly limited, but preferably has 3 to 60 carbon atoms, and according to an exemplary embodiment, the cycloalkyl group has 3 to 30 carbon atoms. According to another exemplary embodiment, the number of carbon atoms of the cycloalkyl group is 3 to 20. According to another exemplary embodiment, the number of carbon atoms of the cycloalkyl group is 3 to 6. Specifically, cyclopropyl, cyclobutyl, cyclopentyl, 3-methylcyclopentyl, 2,3-dimethylcyclopentyl, cyclohexyl, 3-methylcyclohexyl, 4-methylcyclohexyl, 2,3-dimethylcyclohexyl, 3, 4,5-trimethylcyclohexyl, 4-tert-butylcyclohexyl, cycloheptyl, cyclooctyl, and the like, but are not limited thereto.
본 명세서에 있어서, 아릴기는 특별히 한정되지 않으나 탄소수 6 내지 60인 것이 바람직하며, 방향족성(aromaticity)을 갖는 단환식 아릴기 또는 다환식 아릴기일 수 있다. 일 실시상태에 따르면, 상기 아릴기의 탄소수는 6 내지 30이다. 일 실시상태에 따르면, 상기 아릴기의 탄소수는 6 내지 20이다. 상기 아릴기가 단환식 아릴기로는 페닐기, 비페닐이기, 터페닐기 등이 될 수 있으나, 이에 한정되는 것은 아니다. 상기 다환식 아릴기로는 나프틸기, 안트라세닐기, 페난쓰레닐기, 트리페닐레닐기, 파이레닐기, 페릴레닐기, 크라이세닐기 등이 될 수 있으나, 이에 한정되는 것은 아니다.In the present specification, the aryl group is not particularly limited, but preferably has 6 to 60 carbon atoms, and may be a monocyclic aryl group or a polycyclic aryl group having aromaticity. According to one embodiment, the number of carbon atoms of the aryl group is 6 to 30. According to one embodiment, the number of carbon atoms of the aryl group is 6 to 20. The aryl group may be a phenyl group, a biphenyl group, a terphenyl group, etc. as a monocyclic aryl group, but is not limited thereto. The polycyclic aryl group may be a naphthyl group, anthracenyl group, phenanthrenyl group, triphenylenyl group, pyrenyl group, perylenyl group, chrysenyl group, etc., but is not limited thereto.
본 명세서에 있어서, 헤테로아릴은 이종 원소로 O, N, Si 및 S 중 1개 이상을 포함하는 헤테로아릴로서, 탄소수는 특별히 한정되지 않으나, 탄소수 2 내지 60인 것이 바람직하다. 헤테로아릴의 예로는 티오펜기, 퓨란기, 피롤기, 이미다졸기, 티아졸기, 옥사졸기, 옥사디아졸기, 트리아졸기, 피리딜기, 비피리딜기, 피리미딜기, 트리아진기, 아크리딜기, 피리다진기, 피라지닐기, 퀴놀리닐기, 퀴나졸린기, 퀴녹살리닐기, 프탈라지닐기, 피리도 피리미디닐기, 피리도 피라지닐기, 피라지노 피라지닐기, 이소퀴놀린기, 인돌기, 카바졸기, 벤조옥사졸기, 벤조이미다졸기, 벤조티아졸기, 벤조카바졸기, 벤조티오펜기, 디벤조티오펜기, 벤조퓨라닐기, 페난쓰롤린기(phenanthroline), 이소옥사졸릴기, 티아디아졸릴기, 페노티아지닐기 및 디벤조퓨라닐기 등이 있으나, 이에 한정되는 것은 아니다.In the present specification, heteroaryl is a heteroaryl containing at least one of O, N, Si, and S as a heterogeneous element, and the number of carbon atoms is not particularly limited, but preferably has 2 to 60 carbon atoms. Examples of the heteroaryl include a thiophene group, a furan group, a pyrrole group, an imidazole group, a thiazole group, an oxazole group, an oxadiazole group, a triazole group, a pyridyl group, a bipyridyl group, a pyrimidyl group, a triazine group, an acridyl group, Pyridazine group, pyrazinyl group, quinolinyl group, quinazoline group, quinoxalinyl group, phthalazinyl group, pyridopyrimidinyl group, pyridopyrazinyl group, pyrazinopyrazinyl group, isoquinoline group, indole group, Carbazole group, benzoxazole group, benzoimidazole group, benzothiazole group, benzocarbazole group, benzothiophene group, dibenzothiophene group, benzofuranyl group, phenanthroline group, isoxazolyl group, thiadiazolyl group group, a phenothiazinyl group and a dibenzofuranyl group, but are not limited thereto.
본 명세서에 있어서, 아르알킬기, 아르알케닐기, 알킬아릴기, 아릴아민기, 아릴실릴기 중의 아릴기는 전술한 아릴기의 예시와 같다. 본 명세서에 있어서, 아르알킬기, 알킬아릴기, 알킬아민기 중 알킬기는 전술한 알킬기의 예시와 같다. 본 명세서에 있어서, 헤테로아릴아민 중 헤테로아릴은 전술한 헤테로아릴에 관한 설명이 적용될 수 있다. 본 명세서에 있어서, 아르알케닐기 중 알케닐기는 전술한 알케닐기의 예시와 같다. 본 명세서에 있어서, 아릴렌은 2가기인 것을 제외하고는 전술한 아릴기에 관한 설명이 적용될 수 있다. 본 명세서에 있어서, 헤테로아릴렌은 2가기인 것을 제외하고는 전술한 헤테로아릴에 관한 설명이 적용될 수 있다. 본 명세서에 있어서, 탄화수소 고리는 1가기가 아니고, 2개의 치환기가 결합하여 형성한 것을 제외하고는 전술한 아릴기 또는 사이클로알킬기에 관한 설명이 적용될 수 있다. 본 명세서에 있어서, 헤테로고리는 1가기가 아니고, 2개의 치환기가 결합하여 형성한 것을 제외하고는 전술한 헤테로아릴에 관한 설명이 적용될 수 있다.In the present specification, an aralkyl group, an aralkenyl group, an alkylaryl group, an arylamine group, and an aryl group among arylsilyl groups are the same as the examples of the aryl group described above. In the present specification, the alkyl group among the aralkyl group, the alkylaryl group, and the alkylamine group is the same as the examples of the above-mentioned alkyl group. In the present specification, the description of the above-described heteroaryl may be applied to the heteroaryl among heteroarylamines. In the present specification, the alkenyl group among the aralkenyl groups is the same as the examples of the alkenyl group described above. In the present specification, the description of the aryl group described above may be applied except that the arylene is a divalent group. In the present specification, the description of heteroaryl described above may be applied except that the heteroarylene is a divalent group. In the present specification, the hydrocarbon ring is not a monovalent group, and the description of the aryl group or cycloalkyl group described above may be applied, except that the hydrocarbon ring is formed by combining two substituents. In the present specification, the heterocyclic group is not a monovalent group, and the description of the above-described heteroaryl may be applied, except that it is formed by combining two substituents.
본 명세서 있어서, 용어 "중수소화된 또는 중수소로 치환된"이란, 각 화학식에서 적어도 하나의 이용가능한 수소가 중수소로 치환된 것을 의미한다. 구체적으로, 각 화학식 또는 치환기의 정의에서 중수소로 치환된다는 것은, 분자 내 수소가 결합될 수 있는 위치 중 적어도 하나 이상이 중수소로 치환되는 것을 의미한다.In this specification, the term "deuterated or substituted with deuterium" means that at least one available hydrogen in each formula is replaced with deuterium. Specifically, substituting with deuterium in each chemical formula or definition of a substituent means that at least one of hydrogen-bonding positions in a molecule is substituted with deuterium.
또한, 본 명세서에 있어서, 용어 "중수소 치환율"이란, 각 화학식에 존재할 수 있는 수소의 총 개수 대비 치환된 중수소의 개수의 백분율을 의미한다.In addition, in the present specification, the term "deuterium substitution rate" means the percentage of the number of deuterium substituted with respect to the total number of hydrogens that may be present in each chemical formula.
(화합물)(compound)
본 발명은 상기 화학식 1로 표시되는 화합물을 제공한다. The present invention provides a compound represented by Formula 1 above.
구체적으로,Specifically,
상기 화학식 1에서,In Formula 1,
P1 및 P2는 각각 독립적으로 단일 결합; 또는 비치환되거나 또는 1개 내지 4개의 중수소로 치환된 페닐렌이고,P 1 and P 2 are each independently a single bond; or phenylene unsubstituted or substituted with 1 to 4 deuterium atoms;
Q1 및 Q2는 각각 독립적으로 비치환되거나 또는 1개 내지 6개의 중수소로 치환된 나프틸렌이고,Q 1 and Q 2 are each independently unsubstituted or 1 to 6 deuterium-substituted naphthylene,
L1 내지 L4는 각각 독립적으로 단일 결합; 비치환되거나 또는 1개 내지 4개의 중수소로 치환된 페닐렌; 또는 비치환되거나 또는 1개 내지 6개의 중수소로 치환된 나프틸렌이고,L 1 to L 4 are each independently a single bond; phenylene unsubstituted or substituted with 1 to 4 deuterium; or naphthylene unsubstituted or substituted with 1 to 6 deuterium atoms;
Ar1 및 Ar2는 각각 독립적으로 비치환되거나 또는 1개 내지 5개의 중수소로 치환된 페닐; 또는 비치환되거나 또는 1개 내지 7개의 중수소로 치환된 나프틸이고,Ar 1 and Ar 2 are each independently phenyl unsubstituted or substituted with 1 to 5 deuterium atoms; or naphthyl unsubstituted or substituted with 1 to 7 deuterium atoms;
x, y 및 z는 각각 독립적으로 0 내지 8의 정수이고,x, y and z are each independently an integer from 0 to 8;
단, 상기 화합물은 적어도 하나의 중수소를 포함한다.provided that the compound contains at least one deuterium.
이러한 화학식 1로 표시되는 화합물은 3 개의 9,10-안트라세닐렌이 2 개의 나프틸렌 링커로 연결된 구조를 갖는 화합물로, 상기 화합물은 적어도 하나의 중수소를 포함하는 것을 그 특징으로 한다.The compound represented by Formula 1 is a compound having a structure in which three 9,10-anthracenylenes are connected by two naphthylene linkers, and the compound contains at least one deuterium.
여기서, "상기 화합물은 적어도 하나의 중수소를 포함한다"는 것은, 화합물 분자 내 적어도 하나의 수소가 중수소로 치환된 것을 의미하는 것으로, 보다 구체적으로는 상기 화합물이 하기 1) 내지 5) 중 하나 이상의 경우를 만족한다는 것을 의미한다:Here, "the compound contains at least one deuterium" means that at least one hydrogen in the compound molecule is substituted with a deuterium, and more specifically, the compound has one or more of the following 1) to 5) means that the case is satisfied:
1) x+y+z는 1 이상임;1) x+y+z is greater than or equal to 1;
2) P1 및 P2 중 적어도 하나가 1개 이상의 중수소로 치환된 페닐렌임;2) at least one of P 1 and P 2 is phenylene substituted with one or more deuterium;
3) Q1 및 Q2 중 적어도 하나가 1개 이상의 중수소로 치환된 나프틸렌임;3) at least one of Q 1 and Q 2 is naphthylene substituted with one or more deuterium;
4) L1 내지 L4 중 적어도 하나가 1개 이상의 중수소로 치환된 페닐렌; 또는 1개 이상의 중수소로 치환된 나프틸렌임; 또는4) phenylene in which at least one of L 1 to L 4 is substituted with one or more deuterium; or naphthylene substituted with one or more deuterium; or
5) Ar1 및 Ar2 중 적어도 하나가 1개 이상의 중수소로 치환된 페닐; 또는 1개 이상의 중수소로 치환된 나프틸임.5) phenyl in which at least one of Ar 1 and Ar 2 is substituted with one or more deuterium; or naphthyl substituted with one or more deuterium.
이와 같이, 화합물 내에 중수소를 적어도 하나 포함하는 화합물은, C-D 결합의 결합 에너지(bond energy)가 C-H 결합의 결합 에너지보다 크기 때문에, 중수소로 치환되지 않은 화합물에 비하여, 분자 내 더 강한 결합 에너지를 갖게 되고, 이에 따라 물질 안정성이 높아질 수 있다. 따라서, 상기 화학식 1로 표시되는 화합물은 중수소로 치환되어 있지 않은 구조를 갖는 화합물 대비, 유기 발광 소자의 효율 및 안정성을 높일 수 있다.As such, a compound containing at least one deuterium in the compound has a stronger bond energy in the molecule than a compound not substituted with deuterium because the bond energy of the C-D bond is greater than that of the C-H bond. and, accordingly, material stability may be increased. Therefore, the compound represented by Chemical Formula 1 can improve the efficiency and stability of the organic light emitting device compared to a compound having a structure not substituted with deuterium.
한편으로, 상기 화학식 1은 하기 화학식 1D로 표시될 수 있다:Alternatively, Formula 1 may be represented by the following Formula 1D:
[화학식 1D][Formula 1D]
상기 화학식 1D에서,In Formula 1D,
n은 화합물 내 중수소 치환 개수를 의미하고, n means the number of deuterium substitutions in the compound,
P'1 및 P'2는 각각 독립적으로 단일 결합; 또는 페닐렌이고,P' 1 and P' 2 are each independently a single bond; or phenylene;
Q'1 및 Q'2는 각각 독립적으로 나프틸렌이고,Q' 1 and Q' 2 are each independently naphthylene;
L'1 내지 L'4는 각각 독립적으로 단일 결합; 페닐렌; 또는 나프틸렌이고,L' 1 to L' 4 are each independently a single bond; phenylene; or naphthylene;
Ar'1 및 Ar'2는 각각 독립적으로 페닐; 또는 나프틸이고,Ar' 1 and Ar' 2 are each independently phenyl; or naphthyl;
단, n은 1 이상이다.However, n is 1 or more.
(다시 말하여, P'1, P'2, Q'1, Q'2, L'1 내지 L'4, Ar'1 및 Ar'2는 각각 P1, P2, Q1, Q2, L1 내지 L4, Ar1 및 Ar2가 중수소화되지 않은 치환기를 의미한다)(In other words, P' 1 , P' 2 , Q' 1 , Q' 2 , L' 1 to L' 4 , Ar' 1 and Ar' 2 are respectively P 1 , P 2 , Q 1 , Q 2 , L 1 to L 4 , Ar 1 and Ar 2 mean non-deuterated substituents)
구체적으로, 상기 화합물의 중수소 치환율은 50% 내지 100%일 수 있다. 구체적으로는, 상기 화합물의 중수소 치환율은 60% 이상, 70% 이상, 80% 이상, 85% 이상, 88% 이상, 90% 이상, 91% 이상, 92% 이상, 92.5% 이상, 93% 이상이면서, 100% 이하일 수 있다. 이러한 화합물의 중수소 치환율은 화학식 내 존재할 수 있는 수소의 총 개수 대비 치환된 중수소의 개수로 계산되며, 이때 치환된 중수소의 개수는 MALDI-TOF MS(Matrix-Assisted Laser Desorption/Ionization Time-of-Flight Mass Spectrometer) 분석을 통해 구해질 수 있다.Specifically, the deuterium substitution rate of the compound may be 50% to 100%. Specifically, the deuterium substitution rate of the compound is 60% or more, 70% or more, 80% or more, 85% or more, 88% or more, 90% or more, 91% or more, 92% or more, 92.5% or more, 93% or more , may be 100% or less. The deuterium substitution rate of these compounds is calculated as the number of substituted deuteriums relative to the total number of hydrogens that may exist in the formula. Spectrometer) analysis.
이 때, 특정 구조를 갖는 화합물이 중수소 치환에 따른 분자 내 결합 에너지의 증가 및 물질 안정성 향상 효과를 나타내기 위해서는, 화합물의 중수소 치환율이 높을수록 바람직하다. 따라서, 바람직하게는 상기 화합물의 중수소 치환율은 80% 이상이다. At this time, in order for a compound having a specific structure to exhibit an effect of increasing intramolecular binding energy and improving material stability according to deuterium substitution, the higher the deuterium substitution rate of the compound, the better. Therefore, preferably, the deuterium substitution rate of the compound is 80% or more.
따라서, 상기 화학식 1D로 표시되는 화합물의 중수소 치환율은 하기 식 1에 의해 계산될 수 있고, 바람직하게는 식 1의 값은 80% 이상이다.Therefore, the deuterium substitution rate of the compound represented by Formula 1D can be calculated by the following Formula 1, and preferably the value of Formula 1 is 80% or more.
[식 1][Equation 1]
중수소 치환율(%)= [치환된 중수소의 개수(n)/화학식 내 존재하는 중수소로 치환가능한 수소의 총 개수] * 100Deuterium substitution rate (%) = [number of deuterium substituted (n) / total number of hydrogens that can be substituted with deuterium present in the formula] * 100
특히, 상기 화합물이 80% 이상의 중수소 치환율을 나타내기 위해서는 안트라세닐렌 모이어티 내의 적어도 하나의 수소가 중수소로 치환되어 있어야 하므로, 3개의 안트라세닐렌의 수소 중 적어도 하나가 중수소로 치환된 경우가 상기 화합물이 중수소 치환에 따른 소자 특성 향상 효과를 나타내기에 적합할 수 있다. In particular, since at least one hydrogen in the anthracenylene moiety must be substituted with deuterium in order for the compound to exhibit a deuterium substitution rate of 80% or more, the case where at least one of the three anthracenylene hydrogens is substituted with deuterium is described above. The compound may be suitable for exhibiting an effect of improving device characteristics according to deuterium substitution.
따라서, 상기 화학식 1에서, x+y+z는 1 이상일 수 있다. Accordingly, in Chemical Formula 1, x+y+z may be 1 or more.
다시 말하여, a, b 및 c는 각각 독립적으로 0, 1, 2, 3, 4, 5, 6, 7, 또는 8이면서, x+y+z는 1 이상 24 이하이다. 이 때, x+y+z가 24인 화합물, 즉, 3 개의 9,10-안트라세닐렌의 1 내지 8번 위치의 탄소와 결합된 수소가 모두 중수소로 치환된 화합물은 분자 내 보다 많은 C-D 결합을 갖게 되고, 이에 따라 물질 안정성이 보다 높아질 수 있다. 따라서, 상기 화학식 1에서 x+y+z가 24인 화합물을 채용한 유기 발광 소자는 효율 및 수명 특성이 보다 향상될 수 있다.In other words, a, b, and c are each independently 0, 1, 2, 3, 4, 5, 6, 7, or 8, and x+y+z is 1 or more and 24 or less. At this time, a compound in which x+y+z is 24, that is, a compound in which all hydrogens bonded to carbons at positions 1 to 8 of three 9,10-anthracenylene are substituted with deuterium have more C-D bonds in the molecule. , and thus material stability may be higher. Accordingly, the organic light emitting device employing the compound in which x+y+z is 24 in Chemical Formula 1 may have improved efficiency and lifetime characteristics.
예를 들어, x, y 및 z는 각각 1 이상, 2 이상, 3 이상, 4 이상, 5 이상, 6 이상, 7 이상, 또는 8 이하이다. For example, each of x, y, and z is 1 or more, 2 or more, 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or less.
또한, P1 및 P2는 단일 결합; 비치환되거나 또는 1개 내지 4개의 중수소로 치환된 1,3-페닐렌; 또는 비치환되거나 또는 1개 내지 4개의 중수소로 치환된 1,4-페닐렌일 수 있다.In addition, P 1 and P 2 are single bonds; 1,3-phenylene unsubstituted or substituted with 1 to 4 deuterium; or 1,4-phenylene that is unsubstituted or substituted with 1 to 4 deuterium atoms.
또한, P1 및 P2는 서로 동일할 수 있다.Also, P 1 and P 2 may be identical to each other.
또한, Q1 및 Q2는 하기 화학식 2a 내지 2j로 표시되는 2가의 연결기 중 어느 하나일 수 있다:In addition, Q 1 and Q 2 may be any one of divalent linking groups represented by the following Chemical Formulas 2a to 2j:
상기 화학식 2a 내지 2j에서,In Formulas 2a to 2j,
r은 1 내지 6의 정수이다.r is an integer from 1 to 6;
또한, Q1 및 Q2는 서로 동일할 수 있다.Also, Q 1 and Q 2 may be equal to each other.
또한, L1 내지 L4는 각각 독립적으로 단일 결합; 또는 하기 화학식 3a 내지 3m으로 표시되는 2가의 연결기 중 어느 하나일 수 있다:In addition, L 1 to L 4 are each independently a single bond; Or it may be any one of the divalent linking groups represented by Formulas 3a to 3m:
상기 화학식 3a 내지 3m에서,In Formulas 3a to 3m,
s는 0 내지 4의 정수이고,s is an integer from 0 to 4;
t는 0 내지 6의 정수이다.t is an integer from 0 to 6;
바람직하게는, 상기 화학식 3a 내지 3m에서,Preferably, in Formulas 3a to 3m,
s는 1 내지 4의 정수이고,s is an integer from 1 to 4;
t는 1 내지 6의 정수이다.t is an integer from 1 to 6.
또한 바람직하게는, L1 및 L2는 각각 독립적으로 단일 결합; 상기 화학식 3a로 표시되는 2가의 연결기; 또는 상기 화학식 3b로 표시되는 2가의 연결기이고,Also preferably, L 1 and L 2 are each independently a single bond; A divalent linking group represented by Formula 3a; Or a divalent linking group represented by Formula 3b,
여기서, s는 1 내지 4의 정수이다.Here, s is an integer from 1 to 4.
또한, L1 및 L2는 서로 동일할 수 있다.Also, L 1 and L 2 may be the same as each other.
또한 바람직하게는, L3 및 L4는 각각 독립적으로 단일 결합; 상기 화학식 3a로 표시되는 2가의 연결기; 상기 화학식 3b로 표시되는 2가의 연결기; 또는 상기 화학식 3i로 표시되는 2가의 연결기이고,Also preferably, L 3 and L 4 are each independently a single bond; A divalent linking group represented by Formula 3a; A divalent linking group represented by Formula 3b; Or a divalent linking group represented by Formula 3i,
여기서, s는 1 내지 4의 정수이고, t는 1 내지 6의 정수이다. Here, s is an integer from 1 to 4, and t is an integer from 1 to 6.
또한, L3 및 L4는 서로 동일할 수 있다.Also, L 3 and L 4 may be the same as each other.
또한, Ar1 및 Ar2는 각각 독립적으로, 1개 내지 5개의 중수소로 치환된 페닐; 1개 내지 7개의 중수소로 치환된 1-나프틸; 또는 1개 내지 7개의 중수소로 치환된 2-나프틸일 수 있다.In addition, Ar 1 and Ar 2 are each independently phenyl substituted with 1 to 5 deuterium atoms; 1-naphthyl substituted with 1 to 7 deuterium; or 2-naphthyl substituted with 1 to 7 deuterium atoms.
이 때, 상기 및 상기 는 서로 동일할 수 있다.At this time, the and above may be equal to each other.
한편, 상기 화학식 1로 표시되는 화합물은 하기 화학식 1'로 표시되는 화합물로 구성되는 군으로부터 선택되는 어느 하나이다:Meanwhile, the compound represented by Formula 1 is any one selected from the group consisting of compounds represented by Formula 1' below:
[화학식 1'][Formula 1']
상기 화학식 1' 에서,In Formula 1',
n은 화합물 내 중수소 치환 개수를 의미하고,n means the number of deuterium substitutions in the compound,
Core는 하기 화학식 Core 1 내지 Core 44로 표시되는 2가의 연결기 중에서 선택되는 어느 하나이고,Core is any one selected from divalent linking groups represented by the following formulas Core 1 to Core 44,
R은 하기 화학식 R1 내지 R22로 표시되는 치환기 중에서 선택되는 어느 하나이고,R is any one selected from substituents represented by the following formulas R1 to R22,
상기 화학식 1'로 표시되는 화합물은 하기와 같다,The compound represented by Formula 1' is as follows,
..
상기 화학식 1'에서, "Core"는 상기 화학식 1D의 에 대응되고, "R"은 및 에 대응된다.In Formula 1', "Core" is of Formula 1D Corresponds to, "R" is and corresponds to
이 때, 상기 화합물 중 하나인 하기 화학식 3-2에서의 n이 50 내지 54의 정수라는 것의 의미는, 하기 화합물 3-2'에서 Z 중 50 내지 54 개가 중수소이고, 중수소가 아닌 나머지 Z가 수소임을 의미한다. At this time, the meaning that n in Formula 3-2, which is one of the above compounds, is an integer of 50 to 54, means that 50 to 54 of Z in the following compound 3-2' are deuterium, and the remaining Z other than deuterium is hydrogen. means that
. .
한편, 상기 화학식 1로 표시되는 화합물은 일례로 및 가 서로 동일한 경우 하기 반응식 1과 같은 제조 방법으로 제조할 수 있다: On the other hand, the compound represented by Formula 1 is, for example, and When are the same as each other, it can be prepared by the manufacturing method shown in Scheme 1 below:
[반응식 1][Scheme 1]
상기 반응식 1에서, P'1, P'2, Q'1, Q'2, L'1, L'3 및 Ar'1는 각각 P1, P2, Q1, Q2, L1, L3 및 Ar1가 중수소화되지 않은 치환기를 의미하고, 다른 치환기에 대한 정의는 앞서 설명한 바와 같다.In Scheme 1, P' 1 , P' 2 , Q' 1 , Q' 2 , L' 1 , L' 3 and Ar' 1 are respectively P 1 , P 2 , Q 1 , Q 2 , L 1 , L 3 and Ar 1 represent non-deuterated substituents, and definitions for other substituents are as described above.
구체적으로, 상기 화학식 1로 표시되는 화합물은 단계 a 내지 단계 c를 통해 제조될 수 있다.Specifically, the compound represented by Formula 1 may be prepared through steps a to c.
먼저, 상기 단계 a는 Tf2O(Trifluoromethanesulfonic anhydride)를 사용하여, 화합물 1-1에 스즈키 커플링 반응을 위한 반응기인 -OTf(-O3SCF3)기를 도입하여 화합물 1-2를 제조하는 단계이다.First, in the step a, using Tf 2 O (trifluoromethanesulfonic anhydride), compound 1-1 is prepared by introducing a -OTf (-O 3 SCF 3 ) group, which is a reactive group for the Suzuki coupling reaction, to prepare compound 1-2 am.
다음으로 상기 단계 b는 화합물 1-2 및 1-3의 스즈키 커플링 반응을 통해 상기 화학식 1"로 표시되는 화합물을 제조하는 단계이다. 이러한 스즈키 커플링 반응은 각각 팔라듐 촉매와 염기의 존재 하에 수행하는 것이 바람직하다. 또한, 상기 스즈키 커플링 반응을 위한 상기 반응기는 적절히 변경될 수 있다.Next, step b is a step for preparing the compound represented by Formula 1 "through the Suzuki coupling reaction of compounds 1-2 and 1-3. Each of these Suzuki coupling reactions is performed in the presence of a palladium catalyst and a base In addition, the reactor for the Suzuki coupling reaction may be appropriately changed.
다음으로, 상기 단계 c는 중간체 화합물 1'를 중수소화하여 화학식 1로 표시되는 화합물을 제조하는 단계로, 이때 중수소 치환 반응은 상기 중간체 화합물 1'를 벤젠-D6(C6D6) 용액과 같은 중수소화된 용매에 투입한 후 TfOH(trifluoromethanesulfonic acid)와 반응시켜 수행될 수 있다. Next, step c is a step of deuterating intermediate compound 1' to prepare a compound represented by Formula 1, wherein the deuterium substitution reaction is performed to convert intermediate compound 1' to a benzene-D 6 (C 6 D 6 ) solution and It can be carried out by adding to the same deuterated solvent and then reacting with TfOH (trifluoromethanesulfonic acid).
한편. 상기 화학식 1로 표시되는 화합물은 용액 공정에 사용되는 유기 용매, 예를 들어 사이클로헥사논과 같은 유기 용매에 대한 용해도가 높아, 높은 끓는점의 용매를 사용하는 잉크젯 도포법 등의 대면적 용액 공정에 사용이 적합하다.Meanwhile. The compound represented by Formula 1 has high solubility in an organic solvent used in a solution process, for example, an organic solvent such as cyclohexanone, so that it can be used in a large-area solution process such as an inkjet coating method using a solvent with a high boiling point. Suitable.
본 발명에 따른 화합물을 포함하는 유기물층은 진공 증착법, 용액 공정 등과 같은 다양한 방법을 이용하여 형성할 수 있으며, 용액 공정에 대해서는 이하 상세히 설명한다. The organic material layer containing the compound according to the present invention can be formed using various methods such as a vacuum deposition method and a solution process, and the solution process will be described in detail below.
(코팅 조성물)(coating composition)
한편, 본 발명에 따른 화합물은 용액 공정으로 유기 발광 소자의 유기물 층, 특히 발광층을 형성할 수 있다. 구체적으로, 상기 화합물은 발광층의 호스트 재료로 사용될 수 있다. 이를 위하여, 본 발명은 상술한 본 발명에 따른 화합물 및 용매를 포함하는 코팅 조성물을 제공한다. Meanwhile, the compound according to the present invention may form an organic material layer of an organic light emitting device, particularly a light emitting layer, through a solution process. Specifically, the compound may be used as a host material for the light emitting layer. To this end, the present invention provides a coating composition comprising the above-described compound and a solvent according to the present invention.
상기 용매는 본 발명에 따른 화합물을 용해 또는 분산시킬 수 있는 용매이면 특별히 제한되지 않으며, 일례로 클로로포름, 염화메틸렌, 1,2-디클로로에탄, 1,1,2-트리클로로에탄, 클로로벤젠, o-디클로로벤젠 등의 염소계 용매; 테트라하이드로퓨란, 디옥산 등의 에테르계 용매; 톨루엔, 크실렌, 트리메틸벤젠, 메시틸렌, 1-메틸나프탈렌, 2-메틸나프탈렌 등의 방향족 탄화수소계 용매; 시클로헥산, 메틸시클로헥산, n-펜탄, n-헥산, n-헵탄, n-옥탄, n-노난, n-데칸 등의 지방족 탄화수소계 용매; 아세톤, 메틸에틸케톤, 시클로헥사논 등의 케톤계 용매; 아세트산에틸, 아세트산부틸, 에틸셀로솔브아세테이트 등의 에스테르계 용매; 에틸렌글리콜, 에틸렌글리콜모노부틸에테르, 에틸렌글리콜모노에틸에테르, 에틸렌글리콜모노메틸에테르, 디메톡시에탄, 프로필렌글리콜, 디에톡시메탄, 트리에틸렌글리콜모노에틸에테르, 글리세린, 1,2-헥산디올 등의 다가 알코올 및 그의 유도체; 메탄올, 에탄올, 프로판올, 이소프로판올, 시클로헥산올 등의 알코올계 용매; 디메틸술폭사이드 등의 술폭사이드계 용매; 및 N-메틸-2-피롤리돈, N,N-디메틸포름아미드 등의 아미드계 용매; 부틸벤조에이트, 메틸-2-메톡시벤조에이트, 에틸벤조에이트 등의 벤조에이트계 용매; 디메틸 프탈레이트, 디에틸 프탈레이트, 디페닐 프탈레이트 등의 프탈레이트 계 용매; 테트랄린; 3-페녹시톨루엔 등의 용매를 들 수 있다. 또한, 상술한 용매를 1종 단독으로 사용하거나 2종 이상의 용매를 혼합하여 사용할 수 있다. 바람직하게는 상기 용매로 사이클로헥사논를 사용할 수 있다. The solvent is not particularly limited as long as it can dissolve or disperse the compound according to the present invention, and examples thereof include chloroform, methylene chloride, 1,2-dichloroethane, 1,1,2-trichloroethane, chlorobenzene, o -Chlorinated solvents such as dichlorobenzene; ether solvents such as tetrahydrofuran and dioxane; aromatic hydrocarbon solvents such as toluene, xylene, trimethylbenzene, mesitylene, 1-methylnaphthalene, and 2-methylnaphthalene; aliphatic hydrocarbon-based solvents such as cyclohexane, methylcyclohexane, n-pentane, n-hexane, n-heptane, n-octane, n-nonane, and n-decane; Ketone solvents, such as acetone, methyl ethyl ketone, and cyclohexanone; Ester solvents, such as ethyl acetate, butyl acetate, and ethyl cellosolve acetate; Ethylene glycol, ethylene glycol monobutyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, dimethoxyethane, propylene glycol, diethoxymethane, triethylene glycol monoethyl ether, glycerin, 1,2-hexanediol, etc. alcohol and its derivatives; alcohol solvents such as methanol, ethanol, propanol, isopropanol, and cyclohexanol; sulfoxide solvents such as dimethyl sulfoxide; and amide solvents such as N-methyl-2-pyrrolidone and N,N-dimethylformamide; benzoate-based solvents such as butyl benzoate, methyl-2-methoxy benzoate, and ethyl benzoate; phthalate-based solvents such as dimethyl phthalate, diethyl phthalate, and diphenyl phthalate; tetralin; Solvents, such as 3-phenoxytoluene, are mentioned. In addition, the above-mentioned solvent may be used alone or in combination of two or more solvents. Preferably, cyclohexanone may be used as the solvent.
또한, 상기 코팅 조성물은 도펀트 재료로 사용되는 화합물을 더 포함할 수 있고, 상기 호스트 재료에 사용되는 화합물에 대한 설명은 후술한다.In addition, the coating composition may further include a compound used as a dopant material, and a description of the compound used as the host material will be described later.
또한, 상기 코팅 조성물의 점도는 1 cP 이상이 바람직하다. 또한, 상기 코팅 조성물의 코팅 용이성을 감안하여, 상기 코팅 조성물의 점도는 10 cP 이하가 바람직하다. 또한, 상기 코팅 조성물 내 본 발명에 따른 화합물의 농도는 0.1 wt/v% 이상이 바람직하다. 또한, 상기 코팅 조성물이 최적으로 코팅될 수 있도록, 상기 코팅 조성물 내 본 발명에 따른 화합물의 농도는 20 wt/v%이하가 바람직하다. In addition, the viscosity of the coating composition is preferably 1 cP or more. In addition, considering the ease of coating of the coating composition, the viscosity of the coating composition is preferably 10 cP or less. Also, the concentration of the compound according to the present invention in the coating composition is preferably 0.1 wt/v% or more. In addition, the concentration of the compound according to the present invention in the coating composition is preferably 20 wt / v% or less so that the coating composition can be coated optimally.
또한, 상기 화학식 1로 표시되는 화합물의 상온/상압에서의 용해도(wt%)는 용매 사이클로헥사논을 기준으로 0.1 wt% 이상, 보다 구체적으로는 0.1 wt% 내지 5 wt%일 수 있다. 이에 따라, 상기 화학식 1로 표시되는 화합물 및 용매를 포함하는 코팅 조성물은 용액 공정에 사용될 수 있다.In addition, the solubility (wt%) of the compound represented by Formula 1 at room temperature/normal pressure may be 0.1 wt% or more, more specifically, 0.1 wt% to 5 wt% based on the solvent cyclohexanone. Accordingly, the coating composition including the compound represented by Chemical Formula 1 and a solvent may be used in a solution process.
또한, 본 발명은 상술한 코팅 조성물을 사용하여 발광층을 형성하는 방법을 제공한다. 구체적으로, 양극 상에, 또는 양극 상에 형성된 정공 수송층 상에 상술한 본 발명에 따른 발광층을 용액 공정으로 코팅하는 단계; 및 상기 코팅된 코팅 조성물을 열처리하는 단계를 포함한다. In addition, the present invention provides a method of forming a light emitting layer using the coating composition described above. Specifically, coating the light emitting layer according to the present invention described above on the anode or on the hole transport layer formed on the anode by a solution process; and heat-treating the coated coating composition.
상기 용액 공정은 상술한 본 발명에 따른 코팅 조성물을 사용하는 것으로, 스핀 코팅, 딥코팅, 닥터 블레이딩, 잉크젯 프린팅, 스크린 프린팅, 스프레이법, 롤 코팅 등을 의미하지만, 이들만으로 한정되는 것은 아니다.The solution process uses the above-described coating composition according to the present invention, and includes spin coating, dip coating, doctor blading, inkjet printing, screen printing, spraying, roll coating, etc., but is not limited thereto.
상기 열처리 단계에서 열처리 온도는 150 내지 230℃가 바람직하다. 또한, 상기 열처리 시간은 1분 내지 3시간이고, 보다 바람직하게는 10분 내지 1시간이다. 또한, 상기 열처리는 아르곤, 질소 등의 불활성 기체 분위기에서 수행하는 것이 바람직하다. In the heat treatment step, the heat treatment temperature is preferably 150 to 230 °C. In addition, the heat treatment time is 1 minute to 3 hours, more preferably 10 minutes to 1 hour. In addition, the heat treatment is preferably performed in an inert gas atmosphere such as argon or nitrogen.
(유기 발광 소자)(organic light emitting element)
한편, 본 발명은 상기 화학식 1로 표시되는 화합물을 포함하는 유기 발광 소자를 제공한다. 일례로, 본 발명은 제1 전극; 상기 제1 전극과 대향하여 구비된 제2 전극; 및 상기 제1 전극과 상기 제2 전극 사이에 구비된 1층 이상의 유기물층을 포함하는 유기 발광 소자로서, 상기 유기물층 중 1층 이상은 상기 화학식 1로 표시되는 화합물을 포함하는, 유기 발광 소자를 제공한다. Meanwhile, the present invention provides an organic light emitting device including the compound represented by Formula 1 above. In one example, the present invention provides a first electrode; a second electrode provided to face the first electrode; and one or more organic material layers provided between the first electrode and the second electrode, wherein at least one of the organic material layers includes the compound represented by Chemical Formula 1. .
본 발명의 유기 발광 소자의 유기물층은 단층 구조로 이루어질 수도 있으나, 2층 이상의 유기물층이 적층된 다층 구조로 이루어질 수 있다. 예컨대, 본 발명의 유기 발광 소자는 유기물층으로서 정공주입층, 정공수송층, 발광층, 전자수송층, 전자주입층 등을 포함하는 구조를 가질 수 있다. 그러나 유기 발광 소자의 구조는 이에 한정되지 않고 더 적은 수의 유기층을 포함할 수 있다.The organic material layer of the organic light emitting device of the present invention may have a single-layer structure, or may have a multi-layer structure in which two or more organic material layers are stacked. For example, the organic light emitting device of the present invention may have a structure including a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer as organic material layers. However, the structure of the organic light emitting device is not limited thereto and may include fewer organic layers.
일 구현예에서, 상기 유기물층은 발광층을 포함할 수 있고, 이때 상기 화합물을 포함하는 유기물층은 발광층일 수 있다.In one embodiment, the organic material layer may include a light emitting layer, and in this case, the organic material layer including the compound may be a light emitting layer.
다른 구현예에서, 상기 유기물층은 정공주입층, 정공수송층, 발광층 및 전자주입 및 수송층을 포함할 수 있고, 이때 상기 화합물을 포함하는 유기물층은 발광층 또는 전자주입 및 수송층일 수 있다.In another embodiment, the organic material layer may include a hole injection layer, a hole transport layer, a light emitting layer, and an electron injection and transport layer, wherein the organic material layer including the compound may be a light emitting layer or an electron injection and transport layer.
또 다른 구현예에서, 상기 유기물층은 정공주입층, 정공수송층, 전자억제층, 발광층 및 전자주입 및 수송층을 포함할 수 있고, 이때 상기 화합물을 포함하는 유기물층은 발광층 또는 전자주입 및 수송층일 수 있다.In another embodiment, the organic material layer may include a hole injection layer, a hole transport layer, an electron suppression layer, a light emitting layer, and an electron injection and transport layer, wherein the organic material layer containing the compound may be a light emitting layer or an electron injection and transport layer.
또 다른 구현예에서, 상기 유기물층은 정공주입층, 정공수송층, 전자억제층, 발광층, 전자저지층 및 전자주입 및 수송층을 포함할 수 있고, 이때 상기 화합물을 포함하는 유기물층은 발광층 또는 전자주입 및 수송층일 수 있다.In another embodiment, the organic material layer may include a hole injection layer, a hole transport layer, an electron blocking layer, a light emitting layer, an electron blocking layer, and an electron injection and transport layer, wherein the organic material layer containing the compound is a light emitting layer or an electron injection and transport layer. can be
본 발명의 유기 발광 소자의 유기물 층은 단층 구조로 이루어질 수도 있으나, 2층 이상의 유기물층이 적층된 다층 구조로 이루어질 수 있다. 예컨대, 본 발명의 유기 발광 소자는 유기물 층으로서 발광층 이외에, 상기 제1전극과 상기 발광층 사이의 정공주입층 및 정공수송층, 및 상기 발광층과 상기 제2전극 사이의 전자수송층 및 전자주입층을 더 포함하는 구조를 가질 수 있다. 그러나 유기 발광 소자의 구조는 이에 한정되지 않고 더 적은 수 또는 더 많은 수의 유기층을 포함할 수 있다.The organic material layer of the organic light emitting device of the present invention may have a single-layer structure, or may have a multi-layer structure in which two or more organic material layers are stacked. For example, the organic light emitting device of the present invention further includes a hole injection layer and a hole transport layer between the first electrode and the light emitting layer, and an electron transport layer and an electron injection layer between the light emitting layer and the second electrode, in addition to the light emitting layer as an organic material layer. can have a structure that However, the structure of the organic light emitting device is not limited thereto and may include fewer or more organic layers.
또한, 본 발명에 따른 유기 발광 소자는, 제1 전극이 양극이고, 제2 전극이 음극인, 기판 상에 양극, 1층 이상의 유기물층 및 음극이 순차적으로 적층된 구조(normal type)의 유기 발광 소자일 수 있다. 또한, 본 발명에 따른 유기 발광 소자는 제1 전극이 음극이고, 제2 전극이 양극인, 기판 상에 음극, 1층 이상의 유기물층 및 양극이 순차적으로 적층된 역방향 구조(inverted type)의 유기 발광 소자일 수 있다. 예컨대, 본 발명의 일실시예에 따른 유기 발광 소자의 구조는 도 1 및 2에 예시되어 있다.In addition, the organic light emitting device according to the present invention has a structure (normal type) in which an anode, one or more organic material layers, and a cathode are sequentially stacked on a substrate in which the first electrode is an anode and the second electrode is a cathode. can be In addition, the organic light emitting device according to the present invention has an inverted type organic light emitting device in which a cathode, one or more organic material layers, and an anode are sequentially stacked on a substrate in which a first electrode is a cathode and a second electrode is an anode. can be For example, the structure of an organic light emitting device according to an embodiment of the present invention is illustrated in FIGS. 1 and 2 .
도 1은 기판(1), 양극(2), 발광층(3), 음극(4)으로 이루어진 유기 발광 소자의 예를 도시한 것이다. 이와 같은 구조에 있어서, 상기 화학식 1로 표시되는 화합물은 상기 발광층에 포함될 수 있다. 1 shows an example of an organic light emitting device composed of a substrate 1, an anode 2, a light emitting layer 3, and a cathode 4. In this structure, the compound represented by Chemical Formula 1 may be included in the light emitting layer.
도 2는 기판 (1), 양극(2), 정공주입층(5), 정공수송층(6), 발광층(3), 전자주입 및 수송층(7) 및 음극(4)으로 이루어진 유기 발광 소자의 예를 도시한 것이다. 이와 같은 구조에 있어서, 상기 화학식 1로 표시되는 화합물은 상기 발광층에 포함될 수 있다.2 is an example of an organic light emitting device composed of a substrate (1), an anode (2), a hole injection layer (5), a hole transport layer (6), a light emitting layer (3), an electron injection and transport layer (7), and a cathode (4). is shown. In this structure, the compound represented by Chemical Formula 1 may be included in the light emitting layer.
본 발명에 따른 유기 발광 소자는, 상기 발광층이 본 발명에 따른 화합물을 포함하고, 상술한 방법과 같이 제조되는 것을 제외하고는 당 기술분야에 알려져 있는 재료와 방법으로 제조할 수 있다.The organic light emitting device according to the present invention may be manufactured with materials and methods known in the art, except that the light emitting layer includes the compound according to the present invention and is manufactured as described above.
예컨대, 본 발명에 따른 유기 발광 소자는 기판 상에 양극, 유기물층 및 음극을 순차적으로 적층시켜 제조할 수 있다. 이때, 스퍼터링법(sputtering)이나 전자빔 증발법(e-beam evaporation)과 같은 PVD(physical Vapor Deposition) 방법을 이용하여, 기판 상에 금속 또는 전도성을 가지는 금속 산화물 또는 이들의 합금을 증착시켜 양극을 형성하고, 그 위에 정공 주입층, 정공 수송층, 발광층 및 전자 수송층을 포함하는 유기물 층을 형성한 후, 그 위에 음극으로 사용할 수 있는 물질을 증착시켜 제조할 수 있다. For example, the organic light emitting device according to the present invention may be manufactured by sequentially stacking an anode, an organic material layer, and a cathode on a substrate. At this time, using a physical vapor deposition (PVD) method such as sputtering or e-beam evaporation, depositing a metal or a metal oxide having conductivity or an alloy thereof on the substrate to form an anode After forming an organic material layer including a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer thereon, and depositing a material that can be used as a cathode thereon, it can be prepared.
이와 같은 방법 외에도, 기판 상에 음극 물질로부터 유기물층, 양극 물질을 차례로 증착시켜 유기 발광 소자를 제조할 수 있다(WO 2003/012890). 다만, 제조 방법이 이에 한정되는 것은 아니다. In addition to this method, an organic light emitting device may be manufactured by sequentially depositing an organic material layer and an anode material on a substrate from a cathode material (WO 2003/012890). However, the manufacturing method is not limited thereto.
일례로, 상기 제1 전극은 양극이고, 상기 제2 전극은 음극이거나, 또는 상기 제1 전극은 음극이고, 상기 제2 전극은 양극이다.In one example, the first electrode is an anode and the second electrode is a cathode, or the first electrode is a cathode and the second electrode is an anode.
상기 양극 물질로는 통상 유기물층으로 정공 주입이 원활할 수 있도록 일함수가 큰 물질이 바람직하다. 상기 양극 물질의 구체적인 예로는 바나듐, 크롬, 구리, 아연, 금과 같은 금속 또는 이들의 합금; 아연 산화물, 인듐 산화물, 인듐주석 산화물(ITO), 인듐아연 산화물(IZO)과 같은 금속 산화물; ZnO:Al 또는 SnO2:Sb와 같은 금속과 산화물의 조합; 폴리(3-메틸티오펜), 폴리[3,4-(에틸렌-1,2-디옥시)티오펜](PEDOT), 폴리피롤 및 폴리아닐린과 같은 전도성 고분자 등이 있으나, 이들에만 한정되는 것은 아니다. As the anode material, a material having a high work function is generally preferable so that holes can be smoothly injected into the organic material layer. Specific examples of the cathode material include metals such as vanadium, chromium, copper, zinc, and gold or alloys thereof; metal oxides such as zinc oxide, indium oxide, indium tin oxide (ITO), and indium zinc oxide (IZO); combinations of metals and oxides such as ZnO:Al or SnO 2 :Sb; Conductive polymers such as poly(3-methylthiophene), poly[3,4-(ethylene-1,2-dioxy)thiophene] (PEDOT), polypyrrole, and polyaniline, but are not limited thereto.
상기 음극 물질로는 통상 유기물층으로 전자 주입이 용이하도록 일함수가 작은 물질인 것이 바람직하다. 상기 음극 물질의 구체적인 예로는 마그네슘, 칼슘, 나트륨, 칼륨, 티타늄, 인듐, 이트륨, 리튬, 가돌리늄, 알루미늄, 은, 주석 및 납과 같은 금속 또는 이들의 합금; LiF/Al 또는 LiO2/Al과 같은 다층 구조 물질 등이 있으나, 이들에만 한정되는 것은 아니다. The cathode material is preferably a material having a small work function so as to easily inject electrons into the organic material layer. Specific examples of the anode material include metals such as magnesium, calcium, sodium, potassium, titanium, indium, yttrium, lithium, gadolinium, aluminum, silver, tin, and lead, or alloys thereof; There are multi-layered materials such as LiF/Al or LiO 2 /Al, but are not limited thereto.
상기 정공주입층은 전극으로부터 정공을 주입하는 층으로, 정공 주입 물질로는 정공을 수송하는 능력을 가져 양극에서의 정공 주입효과, 발광층 또는 발광재료에 대하여 우수한 정공 주입 효과를 갖고, 발광층에서 생성된 여기자의 전자주입층 또는 전자주입재료에의 이동을 방지하며, 또한, 박막 형성 능력이 우수한 화합물이 바람직하다. 정공 주입 물질의 HOMO(highest occupied molecular orbital)가 양극 물질의 일함수와 주변 유기물층의 HOMO 사이인 것이 바람직하다. 정공 주입 물질의 구체적인 예로는 금속 포피린(porphyrin), 올리고티오펜, 아릴아민 계열의 유기물, 헥사니트릴헥사아자트리페닐렌 계열의 유기물, 퀴나크리돈(quinacridone)계열의 유기물, 페릴렌(perylene) 계열의 유기물, 안트라퀴논 및 폴리아닐린과 폴리티오펜 계열의 전도성 고분자 등이 있으나, 이들에만 한정되는 것은 아니다. The hole injection layer is a layer for injecting holes from the electrode, and the hole injection material has the ability to transport holes and has a hole injection effect at the anode, an excellent hole injection effect for the light emitting layer or the light emitting material, and generated in the light emitting layer A compound that prevents migration of excitons to the electron injecting layer or electron injecting material and has excellent thin film formation ability is preferred. It is preferable that the highest occupied molecular orbital (HOMO) of the hole injection material is between the work function of the anode material and the HOMO of the surrounding organic layer. Specific examples of the hole injection material include metal porphyrins, oligothiophenes, arylamine-based organic materials, hexanitrilehexaazatriphenylene-based organic materials, quinacridone-based organic materials, and perylene-based organic materials. of organic materials, anthraquinone, polyaniline, and polythiophene-based conductive polymers, but are not limited thereto.
상기 정공수송층은 정공주입층으로부터 정공을 수취하여 발광층까지 정공을 수송하는 층으로, 정공 수송 물질로는 양극이나 정공 주입층으로부터 정공을 수송받아 발광층으로 옮겨줄 수 있는 물질로 정공에 대한 이동성이 큰 물질이 적합하다. 상기 정공 수송 물질로 상기 화학식 1로 표시되는 화합물을 사용하거나, 또는 아릴아민 계열의 유기물, 전도성 고분자, 및 공액 부분과 비공액 부분이 함께 있는 블록 공중합체 등을 사용할 수 있으나, 이에 한정되는 것은 아니다.The hole transport layer is a layer that receives holes from the hole injection layer and transports the holes to the light emitting layer. The hole transport material is a material that can receive holes from the anode or the hole injection layer and transfer them to the light emitting layer, and has high hole mobility. material is suitable. As the hole transport material, the compound represented by Formula 1, or an arylamine-based organic material, a conductive polymer, and a block copolymer having both a conjugated and a non-conjugated part may be used, but is not limited thereto. .
한편, 상기 유기 발광 소자에는 상기 정공수송층과 발광층 사이에 전자 억제층이 구비되어 있을 수 있다. 상기 전자억제층은 상기 정공수송층 상에 형성되어, 바람직하게는 발광층에 접하여 구비되어, 정공이동도를 조절하고, 전자의 과다한 이동을 방지하여 정공-전자간 결합 확률을 높여줌으로써 유기 발광 소자의 효율을 개선하는 역할을 하는 층을 의미한다. 상기 전자억제층은 전자저지물질을 포함하고, 이러한 전자저지물질의 예로 상기 화학식 1로 표시되는 화합물을 사용하거나, 또는 아릴아민 계열의 유기물 등을 사용할 수 있으나, 이에 한정되는 것은 아니다.Meanwhile, in the organic light emitting device, an electron suppression layer may be provided between the hole transport layer and the light emitting layer. The electron blocking layer is formed on the hole transport layer, and is preferably provided in contact with the light emitting layer to control hole mobility and prevent excessive movement of electrons to increase hole-electron coupling probability, thereby increasing the efficiency of the organic light emitting device. means a layer that serves to improve The electron blocking layer includes an electron blocking material, and as an example of the electron blocking material, a compound represented by Chemical Formula 1 or an arylamine-based organic material may be used, but is not limited thereto.
상기 발광층은 호스트 재료 및 도펀트 재료를 포함할 수 있다. 호스트 재료로는 상기 화학식 1로 표시되는 화합물이 사용될 수 있다. 또한, 상기 호스트 재료로 상기 화학식 1로 표시되는 화합물과 함께 축합 방향족환 유도체 또는 헤테로환 함유 화합물 등이 사용될 수 있다. 구체적으로 축합 방향족환 유도체로는 안트라센 유도체, 피렌 유도체, 나프탈렌 유도체, 펜타센 유도체, 페난트렌 화합물, 플루오란텐 화합물 등이 있고, 헤테로환 함유 화합물로는 카바졸 유도체, 디벤조퓨란 유도체, 래더형 퓨란 화합물, 피리미딘 유도체 등이 있으나, 이에 한정되는 것은 아니다. The light emitting layer may include a host material and a dopant material. As the host material, the compound represented by Chemical Formula 1 may be used. In addition, a condensed aromatic ring derivative or a compound containing a heterocyclic ring may be used together with the compound represented by Formula 1 as the host material. Specifically, condensed aromatic ring derivatives include anthracene derivatives, pyrene derivatives, naphthalene derivatives, pentacene derivatives, phenanthrene compounds, fluoranthene compounds, etc., and heterocyclic-containing compounds include carbazole derivatives, dibenzofuran derivatives, ladder type furan compounds, pyrimidine derivatives, etc., but are not limited thereto.
또한, 도펀트 재료로는 방향족 아민 유도체, 스트릴아민 화합물, 붕소 착체, 플루오란텐 화합물, 금속 착체 등이 있다. 구체적으로 방향족 아민 유도체로는 치환 또는 비치환된 아릴아미노기를 갖는 축합 방향족환 유도체로서, 아릴아미노기를 갖는 피렌, 안트라센, 크리센, 페리플란텐 등이 있으며, 스티릴아민 화합물로는 치환 또는 비치환된 아릴아민에 적어도 1개의 아릴비닐기가 치환되어 있는 화합물로, 아릴기, 실릴기, 알킬기, 사이클로알킬기 및 아릴아미노기로 이루어진 군에서 1 또는 2 이상 선택되는 치환기가 치환 또는 비치환된다. 구체적으로 스티릴아민, 스티릴디아민, 스티릴트리아민, 스티릴테트라아민 등이 있으나, 이에 한정되는 것은 아니다. 또한, 금속 착체로는 이리듐 착체, 백금 착체 등이 있으나, 이에 한정되는 것은 아니다.In addition, examples of the dopant material include aromatic amine derivatives, strylamine compounds, boron complexes, fluoranthene compounds, metal complexes, and the like. Specifically, aromatic amine derivatives are condensed aromatic ring derivatives having a substituted or unsubstituted arylamino group, such as pyrene, anthracene, chrysene, periplanthene, etc. having an arylamino group, and styrylamine compounds include substituted or unsubstituted arylamine is substituted with at least one arylvinyl group, wherein one or two or more substituents selected from the group consisting of an aryl group, a silyl group, an alkyl group, a cycloalkyl group, and an arylamino group are substituted or unsubstituted. Specifically, there are styrylamine, styryldiamine, styryltriamine, styryltetraamine, etc., but is not limited thereto. In addition, metal complexes include, but are not limited to, iridium complexes and platinum complexes.
한편, 상기 유기 발광 소자에는 상기 발광층과 전자 수송층 사이에 정공저지층이 구비되어 있을 수 있다. 상기 정공저지층은 발광층 상에 형성되어, 바람직하게는 발광층에 접하여 구비되어, 전자이동도를 조절하고 정공의 과다한 이동을 방지하여 정공-전자간 결합 확률을 높여줌으로써 유기 발광 소자의 효율을 개선하는 역할을 하는 층을 의미한다. 상기 정공저지층은 정공저지물질을 포함하고, 이러한 정공저지물질의 예로 트리아진을 포함한 아진류유도체; 트리아졸 유도체; 옥사디아졸 유도체; 페난트롤린 유도체; 포스핀옥사이드 유도체 등의 전자흡인기가 도입된 화합물을 사용할 수 있으나, 이에 한정되는 것은 아니다.Meanwhile, in the organic light emitting device, a hole blocking layer may be provided between the light emitting layer and the electron transport layer. The hole blocking layer is formed on the light emitting layer, preferably provided in contact with the light emitting layer, to improve the efficiency of the organic light emitting device by controlling electron mobility and preventing excessive movement of holes to increase the probability of hole-electron coupling layers that play a role. The hole blocking layer includes a hole blocking material, and examples of the hole blocking material include azine derivatives including triazine; triazole derivatives; oxadiazole derivatives; phenanthroline derivatives; A compound having an electron withdrawing group such as a phosphine oxide derivative may be used, but is not limited thereto.
상기 전자 주입 및 수송층은 전극으로부터 전자를 주입하고, 수취된 전자를 발광층까지 수송하는 전자수송층 및 전자주입층의 역할을 동시에 수행하는 층으로, 상기 발광층 또는 상기 정공저지층 상에 형성된다. 이러한 전자 주입 및 수송물질로는 음극으로부터 전자를 잘 주입 받아 발광층으로 옮겨줄 수 있는 물질로서, 전자에 대한 이동성이 큰 물질이 적합하다. 구체적인 전자 주입 및 수송물질의 예로는 8-히드록시퀴놀린의 Al 착물; Alq3를 포함한 착물; 유기 라디칼 화합물; 히드록시플라본-금속 착물; 트리아진 유도체 등이 있으나, 이들에만 한정되는 것은 아니다. 또는 플루오레논, 안트라퀴노다이메탄, 다이페노퀴논, 티오피란 다이옥사이드, 옥사졸, 옥사다이아졸, 트리아졸, 이미다졸, 페릴렌테트라카복실산, 프레오레닐리덴 메탄, 안트론 등과 그들의 유도체, 금속 착체 화합물, 또는 질소 함유 5원환 유도체 등과 함께 사용할 수도 있으나, 이에 한정되는 것은 아니다. The electron injection and transport layer is a layer that simultaneously serves as an electron transport layer and an electron injection layer for injecting electrons from an electrode and transporting the received electrons to the light emitting layer, and is formed on the light emitting layer or the hole blocking layer. As such an electron injecting and transporting material, a material capable of receiving electrons from the cathode and transferring them to the light emitting layer is suitable. Examples of specific electron injection and transport materials include Al complexes of 8-hydroxyquinoline; Complexes containing Alq 3 ; organic radical compounds; hydroxyflavone-metal complexes; triazine derivatives, etc., but are not limited thereto. Or fluorenone, anthraquinodimethane, diphenoquinone, thiopyran dioxide, oxazole, oxadiazole, triazole, imidazole, perylenetetracarboxylic acid, fluorenylidene methane, anthrone, etc. and their derivatives, metal complex compounds , or may be used together with nitrogen-containing 5-membered ring derivatives, etc., but is not limited thereto.
상기 전자 주입 및 수송층은 전자주입층 및 전자수송층과 같은 별개의 층으로도 형성될 수 있다. 이와 같은 경우, 전자 수송층은 상기 발광층 또는 상기 정공저지층 상에 형성되고, 상기 전자 수송층에 포함되는 전자 수송 물질로는 상술한 전자 주입 및 수송 물질이 사용될 수 있다. 또한, 전자 주입층은 상기 전자 수송층 상에 형성되고, 상기 전자 주입층에 포함되는 전자 주입 물질로는 LiF, NaCl, CsF, Li2O, BaO, 플루오레논, 안트라퀴노다이메탄, 다이페노퀴논, 티오피란 다이옥사이드, 옥사졸, 옥사다이아졸, 트리아졸, 이미다졸, 페릴렌테트라카복실산, 플루오레닐리덴 메탄, 안트론 등과 그들의 유도체, 금속 착체 화합물 및 질소 함유 5원환 유도체 등이 사용될 수 있다.The electron injection and transport layer may also be formed as a separate layer such as an electron injection layer and an electron transport layer. In this case, the electron transport layer is formed on the light emitting layer or the hole blocking layer, and the above-described electron injection and transport material may be used as an electron transport material included in the electron transport layer. In addition, the electron injection layer is formed on the electron transport layer, and examples of electron injection materials included in the electron injection layer include LiF, NaCl, CsF, Li 2 O, BaO, fluorenone, anthraquinodimethane, diphenoquinone, Thiophyran dioxide, oxazole, oxadiazole, triazole, imidazole, perylene tetracarboxylic acid, fluorenylidene methane, anthrone, etc. and their derivatives, metal complex compounds, nitrogen-containing 5-membered ring derivatives, and the like can be used.
상기 금속 착체 화합물로서는 8-하이드록시퀴놀리나토 리튬, 비스(8-하이드록시퀴놀리나토)아연, 비스(8-하이드록시퀴놀리나토)구리, 비스(8-하이드록시퀴놀리나토)망간, 트리스(8-하이드록시퀴놀리나토)알루미늄, 트리스(2-메틸-8-하이드록시퀴놀리나토)알루미늄, 트리스(8-하이드록시퀴놀리나토)갈륨, 비스(10-하이드록시벤조[h]퀴놀리나토)베릴륨, 비스(10-하이드록시벤조[h]퀴놀리나토)아연, 비스(2-메틸-8-하이드록시퀴놀리나토)클로로갈륨, 비스(2-메틸-8-하이드록시퀴놀리나토)(o-크레졸라토)갈륨, 비스(2-메틸-8-하이드록시퀴놀리나토)(1-나프톨라토)알루미늄, 비스(2-메틸-8-하이드록시퀴놀리나토)(2-나프톨라토)갈륨 등이 있으나, 이에 한정되는 것은 아니다.Examples of the metal complex compound include 8-hydroxyquinolinato lithium, bis(8-hydroxyquinolinato)zinc, bis(8-hydroxyquinolinato)copper, bis(8-hydroxyquinolinato)manganese, Tris(8-hydroxyquinolinato) aluminum, tris(2-methyl-8-hydroxyquinolinato) aluminum, tris(8-hydroxyquinolinato) gallium, bis(10-hydroxybenzo[h] Quinolinato) beryllium, bis(10-hydroxybenzo[h]quinolinato)zinc, bis(2-methyl-8-hydroxyquinolinato)chlorogallium, bis(2-methyl-8-hydroxyquine nolinato)(o-cresolato)gallium, bis(2-methyl-8-hydroxyquinolinato)(1-naphtolato)aluminum, bis(2-methyl-8-hydroxyquinolinato)(2- Naphtolato) gallium and the like, but are not limited thereto.
상술한 재료 외에도, 상기 발광층, 정공 주입층, 정공 수송층, 전자 수송층, 및 전자 주입층에는 퀀텀닷 등의 무기 화합물 또는 고분자 화합물을 추가로 포함할 수 있다.In addition to the above-described materials, an inorganic compound such as a quantum dot or a polymer compound may be further included in the light emitting layer, the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer.
상기 퀀텀닷은 예를 들어, 콜로이드 퀀텀닷, 합금 퀀텀닷, 코어셸 퀀텀닷, 또는 코어 퀀텀닷일 수 있다. 제2족 및 제16족에 속하는 원소, 제13족 및 제15족에 속하는 원소, 제13족 및 제17족에 속하는 원소, 제11족 및 제17족에 속하는 원소, 또는 제14족 및 제15족에 속하는 원소를 포함하는 퀀텀닷일 수 있으며, 카드뮴(Cd), 셀레늄(Se), 아연(Zn), 황(S), 인(P), 인듐(In), 텔루륨(Te), 납(Pb), 갈륨(Ga), 비소(As) 등의 원소를 포함하는 퀀텀닷이 사용될 수 있다.The quantum dot may be, for example, a colloidal quantum dot, an alloy quantum dot, a core-shell quantum dot, or a core quantum dot. An element belonging to groups 2 and 16, an element belonging to groups 13 and 15, an element belonging to groups 13 and 17, an element belonging to groups 11 and 17, or an element belonging to groups 14 and 17 It may be a quantum dot containing elements belonging to group 15, such as cadmium (Cd), selenium (Se), zinc (Zn), sulfur (S), phosphorus (P), indium (In), tellurium (Te), lead Quantum dots including elements such as (Pb), gallium (Ga), and arsenic (As) may be used.
본 발명에 따른 유기 발광 소자는 배면 발광(bottom emission) 소자, 전면 발광(top emission) 소자, 또는 양면 발광 소자일 수 있으며, 특히 상대적으로 높은 발광 효율이 요구되는 배면 발광 소자일 수 있다.The organic light emitting device according to the present invention may be a bottom emission device, a top emission device, or a double-sided light emitting device, and in particular, may be a bottom emission device requiring relatively high light emitting efficiency.
또한, 본 발명에 따른 화합물은 유기 발광 소자 외에도 유기 태양 전지 또는 유기 트랜지스터에 포함될 수 있다.In addition, the compound according to the present invention may be included in an organic solar cell or an organic transistor in addition to an organic light emitting device.
상기 화학식 1로 표시되는 화합물 및 이를 포함하는 유기 발광 소자의 제조는 이하 실시예에서 구체적으로 설명한다. 그러나 하기 실시예는 본 발명을 예시하기 위한 것이며, 본 발명의 범위가 이들에 의하여 한정되는 것은 아니다.Preparation of the compound represented by Chemical Formula 1 and the organic light emitting device including the same will be described in detail in the following examples. However, the following examples are intended to illustrate the present invention, and the scope of the present invention is not limited thereto.
제조예 1: 화합물 3-2의 제조Preparation Example 1: Preparation of compound 3-2
화합물 1-a(1.0 eq.) 및 화합물 1-b(2.1 eq.)를 둥근 바닥 플라스크에 넣고 THF:PhMe 1:1 (v/v)에 용해시켰다. 물에 용해된 Na2CO3(6.0 eq.)를 주입하였다. Bath 온도 130℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 1-c(67% 수율)를 제조하였다.Compound 1-a (1.0 eq.) and Compound 1-b (2.1 eq.) were placed in a round bottom flask and dissolved in THF:PhMe 1:1 (v/v). Na 2 CO 3 (6.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 130° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 1-c (67% yield).
화합물 1-c(1.0 eq.)를 둥근 바닥 플라스크에 넣고 무수 CH2Cl2에 용해하였다. 이후, pyridine(4.0 eq.)을 상온에서 적가한 뒤, bath 온도를 0℃로 낮춰 10분 동안 교반하였다. 이후, 무수 CH2Cl2에 용해한 Tf2O(2.4 eq.)를 dropping funnel을 이용하여 천천히 혼합물에 적가하고, bath 온도를 서서히 0℃에서 상온으로 올려준 뒤, 하룻밤 동안 교반하였다. 반응 후, 반응물을 CH2Cl2에 충분히 묽힌 뒤, CH2Cl2/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 1-d(98% 수율)를 제조하였다.Compound 1-c (1.0 eq.) was placed in a round bottom flask and dissolved in anhydrous CH 2 Cl 2 . Thereafter, pyridine (4.0 eq.) was added dropwise at room temperature, and then the bath temperature was lowered to 0° C. and stirred for 10 minutes. Thereafter, Tf 2 O (2.4 eq.) dissolved in anhydrous CH 2 Cl 2 was slowly added dropwise to the mixture using a dropping funnel, and the bath temperature was gradually raised from 0° C. to room temperature, followed by stirring overnight. After the reaction, the reactant was sufficiently diluted with CH 2 Cl 2 and washed with CH 2 Cl 2 /brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to prepare compound 1-d (98% yield).
화합물 1-d(1.0 eq.) 및 화합물 1-e(2.1 eq.)를 둥근 바닥 플라스크에 넣고 THF:PhMe 1:1 (v/v)에 용해시켰다. 물에 용해된 Na2CO3(6.0 eq.)를 주입하였다. Bath 온도 130℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 1-f(87% 수율)를 제조하였다.Compound 1-d (1.0 eq.) and Compound 1-e (2.1 eq.) were placed in a round bottom flask and dissolved in THF:PhMe 1:1 (v/v). Na 2 CO 3 (6.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 130° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 1-f (87% yield).
질소 분위기 하에 화합물 1-f(1.0 eq.)를 둥근 바닥 플라스크에 넣고 benzene-D6 (150 eq.)에 용해시켰다. TfOH(2.0 eq.)를 반응물에 천천히 적가하고, 25℃에서 2시간 동안 교반하였다. 반응물에 D2O를 적가하여 반응을 종결시키고, potassium phosphate tribasic(30 wt% in aqueous solution, 2.4 eq.)를 적가하여 수층의 pH를 9-10으로 맞추었다. CH2Cl2/DI water로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 3-2(a+b+c+d+e+f+g+h+i=50-54, 91% 수율)를 제조하였다.Compound 1-f (1.0 eq.) was placed in a round bottom flask under a nitrogen atmosphere and dissolved in benzene-D 6 (150 eq.). TfOH (2.0 eq.) was slowly added dropwise to the reaction and stirred at 25 °C for 2 hours. D 2 O was added dropwise to the reactant to terminate the reaction, and potassium phosphate tribasic (30 wt% in aqueous solution, 2.4 eq.) was added dropwise to adjust the pH of the aqueous layer to 9-10. The organic layer was separated by washing with CH 2 Cl 2 /DI water. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to prepare compound 3-2 (a+b+c+d+e+f+g+h+i = 50-54, 91% yield).
m/z [M+H]+ 1141.3m/z [M+H] + 1141.3
제조예 2: 화합물 3-3의 제조Preparation Example 2: Preparation of compound 3-3
합성은 화합물 1-e 대신 화합물 2-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-3(a+b+c+d+e+f+g+h+i=50-54)을 제조하였다.Compound 3-3 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 2-a was used instead of compound 1-e. = 50-54) was prepared.
m/z [M+H]+ 1141.4m/z [M+H] + 1141.4
제조예 3: 화합물 3-5의 제조Preparation Example 3: Preparation of compound 3-5
합성은 화합물 1-e 대신 화합물 3-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-5(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-5 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 3-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 4: 화합물 3-6의 제조Preparation Example 4: Preparation of compound 3-6
합성은 화합물 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-6(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-6 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 4-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.4m/z [M+H] + 1245.4
제조예 5: 화합물 3-8의 제조Preparation Example 5: Preparation of Compound 3-8
합성은 화합물 1-e 대신 화합물 5-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-8(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-8 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 5-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 6: 화합물 3-9의 제조Preparation Example 6: Preparation of compound 3-9
합성은 화합물 1-e 대신 화합물 6-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-9(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-9 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 6-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 7: 화합물 3-7의 제조Preparation Example 7: Preparation of compound 3-7
합성은 화합물 1-e 대신 화합물 7-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-7(a+b+c+d+e+f+g=46-50)을 제조하였다.Compound 3-7 (a + b + c + d + e + f + g = 46-50 ) was prepared.
m/z [M+H]+ 1085.5m/z [M+H] + 1085.5
제조예 8: 화합물 3-4의 제조Preparation Example 8: Preparation of Compound 3-4
합성은 화합물 1-e 대신 화합물 8-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-4(a+b+c+d+e+f+g=46-50)를 제조하였다.Compound 3-4 (a + b + c + d + e + f + g = 46-50 ) was prepared.
m/z [M+H]+ 1085.5m/z [M+H] + 1085.5
제조예 9: 화합물 3-14의 제조Preparation Example 9: Preparation of compound 3-14
합성은 화합물 1-e 대신 화합물 9-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-14(a+b+c+d+e+f+g+h+i+j+k=62-66)를 제조하였다.Compound 3-14 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 9-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 10: 화합물 3-15의 제조Preparation Example 10: Preparation of Compound 3-15
합성은 화합물 1-e 대신 화합물 10-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-15(a+b+c+d+e+f+g+h+i+j+k=62-66)를 제조하였다.Compound 3-15 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 10-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 11: 화합물 3-11의 제조Preparation Example 11: Preparation of compound 3-11
합성은 화합물 1-e 대신 화합물 11-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-11(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 3-11 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 11-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.4m/z [M+H] + 1405.4
제조예 12: 화합물 3-12의 제조Preparation Example 12: Preparation of compound 3-12
합성은 화합물 1-e 대신 화합물 12-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-12(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 3-12 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 12-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 13: 화합물 3-10의 제조Preparation Example 13: Preparation of Compound 3-10
합성은 화합물 1-e 대신 화합물 13-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-10(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-10 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 13-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.6m/z [M+H] + 1245.6
제조예 14: 화합물 3-13의 제조Preparation Example 14: Preparation of compound 3-13
합성은 화합물 1-e 대신 화합물 14-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-13(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-13 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 14-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 15: 화합물 3-16의 제조Preparation Example 15: Preparation of Compound 3-16
합성은 화합물 1-e 대신 화합물 15-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-16(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-16 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 15-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 16: 화합물 3-17의 제조Preparation Example 16: Preparation of Compound 3-17
합성은 화합물 1-e 대신 화합물 16-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-17(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 3-17 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 16-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 17: 화합물 3-18의 제조Preparation Example 17: Preparation of Compound 3-18
합성은 화합물 1-e 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 3-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 17-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 18: 화합물 3-19의 제조Preparation Example 18: Preparation of compound 3-19
합성은 화합물 1-e 대신 화합물 18-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-19(a+b+c+d+e+f+g+h+i=54-58)를 제조하였다.Compound 3-19 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 18-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 19: 화합물 3-20의 제조Preparation Example 19: Preparation of Compound 3-20
합성은 화합물 1-e 대신 화합물 19-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-20(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 3-20 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 19-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 20: 화합물 3-21의 제조Preparation Example 20: Preparation of compound 3-21
합성은 화합물 1-e 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 3-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 20-a was used instead of compound 1-e. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 21: 화합물 3-22의 제조Preparation Example 21: Preparation of compound 3-22
합성은 화합물 1-e 대신 화합물 21-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-22(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 3-22 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 21-a was used instead of compound 1-e. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 22: 화합물 3-1의 제조Preparation Example 22: Preparation of Compound 3-1
합성은 화합물 1-e 대신 화합물 22-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 3-1(a+b+c+d+e+f+g=42-46)을 제조하였다.Compound 3-1 (a + b + c + d + e + f + g = 42-46 ) was prepared.
m/z [M+H]+ 981.5m/z [M+H] + 981.5
제조예 23: 화합물 1-6의 제조Preparation Example 23: Preparation of Compound 1-6
합성은 화합물 1-b 대신 화합물 23-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 1-6(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 1-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 23-a was used instead of compound 1-b and compound 4-a was used instead of 1-e. +e+f+g+h+i=54-58) was prepared.
m/z [M+H]+ 1245.4m/z [M+H] + 1245.4
제조예 24: 화합물 1-9의 제조Preparation Example 24: Preparation of Compound 1-9
합성은 화합물 4-a 대신 화합물 6-a를 사용한 것을 제외하고는 상기 화합물 1-6의 제조 방법과 동일하게 화합물 1-9(a+b+c+d+e+f+g+h+i=54-58)를 제조하였다.Compound 1-9 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 1-6, except that compound 6-a was used instead of compound 4-a. = 54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 25: 화합물 1-17의 제조Preparation Example 25: Preparation of Compound 1-17
합성은 화합물 4-a 대신 화합물 16-a를 사용한 것을 제외하고는 상기 화합물 1-6의 제조 방법과 동일하게 화합물 1-17(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 1-17 (a + b + c + d + e + f + g + h + i) was synthesized in the same manner as in the method for preparing compound 1-6, except that compound 16-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 26: 화합물 1-18의 제조Preparation Example 26: Preparation of Compounds 1-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 1-6의 제조 방법과 동일하게 화합물 1-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 1-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 1-6, except that compound 17-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 27: 화합물 1-20의 제조Preparation Example 27: Preparation of Compounds 1-20
합성은 화합물 4-a 대신 화합물 19-a를 사용한 것을 제외하고는 상기 화합물 1-6의 제조 방법과 동일하게 화합물 1-20(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 1-20 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 1-6, except that compound 19-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 28: 화합물 1-21의 제조Preparation Example 28: Preparation of Compound 1-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 1-6의 제조 방법과 동일하게 화합물 1-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 1-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 1-6, except that compound 20-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 29: 화합물 16-6의 제조Preparation Example 29: Preparation of compound 16-6
합성은 화합물 1-b 대신 화합물 29-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 16-6(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 16-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 29-a was used instead of compound 1-b and compound 4-a was used instead of 1-e. +e+f+g+h+i=54-58) was prepared.
m/z [M+H]+ 1245.4m/z [M+H] + 1245.4
제조예 30: 화합물 16-18의 제조Preparation Example 30: Preparation of Compounds 16-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 16-6의 제조 방법과 동일하게 화합물 16-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 16-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 16-6, except that compound 17-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 31: 화합물 16-21의 제조Preparation Example 31: Preparation of Compounds 16-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 16-6의 제조 방법과 동일하게 화합물 16-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 16-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 16-6, except that compound 20-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 32: 화합물 17-6의 제조Preparation Example 32: Preparation of compound 17-6
합성은 화합물 1-b 대신 화합물 32-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 17-6(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 17-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 32-a was used instead of compound 1-b and compound 4-a was used instead of 1-e. +e+f+g+h+i=54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 33: 화합물 17-18의 제조Preparation Example 33: Preparation of Compounds 17-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 17-6의 제조 방법과 동일하게 화합물 17-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 17-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 17-6, except that compound 17-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 34: 화합물 17-21의 제조Preparation Example 34: Preparation of Compounds 17-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 17-6의 제조 방법과 동일하게 화합물 17-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 17-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 17-6, except that compound 20-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 35: 화합물 2-6의 제조Preparation Example 35: Preparation of Compound 2-6
합성은 화합물 1-b 대신 화합물 35-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 2-6(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 2-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 35-a was used instead of compound 1-b and compound 4-a was used instead of 1-e. +e+f+g+h+i=54-58) was prepared.
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 36: 화합물 2-18의 제조Preparation Example 36: Preparation of Compound 2-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 2-6의 제조 방법과 동일하게 화합물 2-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 2-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 2-6, except that compound 17-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 37: 화합물 2-21의 제조Preparation Example 37: Preparation of compound 2-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 2-6의 제조 방법과 동일하게 화합물 2-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 2-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 2-6, except that compound 20-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 38: 화합물 6-6의 제조Preparation Example 38: Preparation of compound 6-6
합성은 화합물 1-a 대신 화합물 38-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 6-6(a+b+c+d+e+f+g+h+i+j=58-62)을 제조하였다.Compound 6-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 38-a was used instead of compound 1-a and compound 4-a was used instead of 1-e. +e+f+g+h+i+j=58-62) was prepared.
m/z [M+H]+ 1325.5m/z [M+H] + 1325.5
제조예 39: 화합물 6-18의 제조Preparation Example 39: Preparation of Compound 6-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 6-6의 제조 방법과 동일하게 화합물 6-18(a+b+c+d+e+f+g+h+i+j+k+l=66-70)을 제조하였다.Compound 6-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 6-6, except that compound 17-a was used instead of compound 4-a. +j+k+l=66-70) was prepared.
m/z [M+H]+ 1485.6m/z [M+H] + 1485.6
제조예 40: 화합물 6-21의 제조Preparation Example 40: Preparation of compound 6-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 6-6의 제조 방법과 동일하게 화합물 6-21(a+b+c+d+e+f+g+h+i+j+k+l=66-70)을 제조하였다.Compound 6-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 6-6, except that compound 20-a was used instead of compound 4-a. +j+k+l=66-70) was prepared.
m/z [M+H]+ 1485.6m/z [M+H] + 1485.6
제조예 41: 화합물 9-6의 제조Preparation Example 41: Preparation of compound 9-6
합성은 화합물 1-a 대신 화합물 41-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 9-6(a+b+c+d+e+f+g+h+i+j=58-62)을 제조하였다.Compound 9-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 41-a was used instead of compound 1-a and compound 4-a was used instead of 1-e. +e+f+g+h+i+j=58-62) was prepared.
m/z [M+H]+ 1325.5m/z [M+H] + 1325.5
제조예manufacturing example 42: 화합물 9-18의 제조 42: Preparation of compounds 9-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 9-6의 제조 방법과 동일하게 화합물 9-18(a+b+c+d+e+f+g+h+i+j+k+l=66-70)을 제조하였다.Compound 9-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 9-6, except that compound 17-a was used instead of compound 4-a. +j+k+l=66-70) was prepared.
m/z [M+H]+ 1485.6m/z [M+H] + 1485.6
제조예 43: 화합물 9-21의 제조Preparation Example 43: Preparation of compound 9-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 9-6의 제조 방법과 동일하게 화합물 9-21(a+b+c+d+e+f+g+h+i+j+k+l=66-70)을 제조하였다.Compound 9-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 9-6, except that compound 20-a was used instead of compound 4-a. +j+k+l=66-70) was prepared.
m/z [M+H]+ 1485.6m/z [M+H] + 1485.6
제조예 44: 화합물 36-6의 제조Preparation Example 44: Preparation of compound 36-6
화합물 1-a(1.0 eq.) 및 화합물 1-b(1.05 eq.)를 둥근 바닥 플라스크에 넣고 THF:PhMe 1:1 (v/v)에 용해시켰다. 물에 용해된 Na2CO3(3.0 eq.)를 주입하였다. Bath 온도 80℃ 하에서 Pd(PPh3)4(5 mol%)를 적가하고 4시간 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 44-a(52% 수율)를 제조하였다.Compound 1-a (1.0 eq.) and Compound 1-b (1.05 eq.) were placed in a round bottom flask and dissolved in THF:PhMe 1:1 (v/v). Na 2 CO 3 (3.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (5 mol%) was added dropwise under a bath temperature of 80° C. and stirred for 4 hours. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 44-a (52% yield).
화합물 44-a(1.0 eq.) 및 화합물 44-b(1.05 eq.)를 둥근 바닥 플라스크에 넣고 THF:PhMe 1:1 (v/v)에 용해시켰다. 물에 용해된 Na2CO3(6.0 eq.)를 주입하였다. Bath 온도 130℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 44-c(60% 수율)를 제조하였다.Compound 44-a (1.0 eq.) and Compound 44-b (1.05 eq.) were placed in a round bottom flask and dissolved in THF:PhMe 1:1 (v/v). Na 2 CO 3 (6.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 130° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 44-c (60% yield).
화합물 44-c(1.0 eq.)를 둥근 바닥 플라스크에 넣고 무수 CH2Cl2에 용해하였다. 이후, pyridine(4.0 eq.)을 상온에서 적가한 뒤, bath 온도를 0℃로 낮춰 10분 동안 교반하였다. 이후, 무수 CH2Cl2에 용해한 Tf2O(2.4 eq.)를 dropping funnel을 이용하여 천천히 혼합물에 적가하고, bath 온도를 서서히 0℃에서 상온으로 올려준 뒤, 하룻밤 동안 교반하였다. 반응 후, 반응물을 CH2Cl2에 충분히 묽힌 뒤, CH2Cl2/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 44-d(99% 수율)를 제조하였다.Compound 44-c (1.0 eq.) was placed in a round bottom flask and dissolved in anhydrous CH 2 Cl 2 . Thereafter, pyridine (4.0 eq.) was added dropwise at room temperature, and then the bath temperature was lowered to 0° C. and stirred for 10 minutes. Thereafter, Tf 2 O (2.4 eq.) dissolved in anhydrous CH 2 Cl 2 was slowly added dropwise to the mixture using a dropping funnel, and the bath temperature was gradually raised from 0° C. to room temperature, followed by stirring overnight. After the reaction, the reactant was sufficiently diluted with CH 2 Cl 2 and washed with CH 2 Cl 2 /brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 44-d (99% yield).
화합물 44-d(1.0 eq.) 및 화합물 4-a(2.1 eq.)를 둥근 바닥 플라스크에 넣고 THF:PhMe 1:1 (v/v)에 용해시켰다. 물에 용해된 Na2CO3(6.0 eq.)를 주입하였다. Bath 온도 130℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 44-e(79% 수율)를 제조하였다.Compound 44-d (1.0 eq.) and compound 4-a (2.1 eq.) were placed in a round bottom flask and dissolved in THF:PhMe 1:1 (v/v). Na 2 CO 3 (6.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 130° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 44-e (79% yield).
질소 분위기 하에 화합물 44-e(1.0 eq.)를 둥근 바닥 플라스크에 넣고 benzene-D6 (150 eq.)에 용해시켰다. TfOH(2.0 eq.)를 반응물에 천천히 적가하고, 25℃에서 2시간 동안 교반하였다. 반응물에 D2O를 적가하여 반응을 종결시키고, potassium phosphate tribasic(30 wt% in aqueous solution, 2.4 eq.)를 적가하여 수층의 pH를 9-10으로 맞추었다. CH2Cl2/DI water로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 36-6(a+b+c+d+e+f+g+h+i=54-58, 89% 수율)을 제조하였다.Compound 44-e (1.0 eq.) was placed in a round bottom flask under a nitrogen atmosphere and dissolved in benzene-D 6 (150 eq.). TfOH (2.0 eq.) was slowly added dropwise to the reaction and stirred at 25 °C for 2 hours. D 2 O was added dropwise to the reactant to terminate the reaction, and potassium phosphate tribasic (30 wt% in aqueous solution, 2.4 eq.) was added dropwise to adjust the pH of the aqueous layer to 9-10. The organic layer was separated by washing with CH 2 Cl 2 /DI water. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 36-6 (a+b+c+d+e+f+g+h+i=54-58, 89% yield).
m/z [M+H]+ 1245.5m/z [M+H] + 1245.5
제조예 45: 화합물 36-18의 제조Preparation Example 45: Preparation of Compound 36-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 36-6의 제조 방법과 동일하게 화합물 36-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 36-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 36-6, except that compound 17-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 46: 화합물 36-21의 제조Preparation Example 46: Preparation of compound 36-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 36-6의 제조 방법과 동일하게 화합물 36-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 36-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 36-6, except that compound 20-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예manufacturing example 47: 화합물 18-6의 제조 47: Preparation of compound 18-6
합성은 화합물 1-b 대신 화합물 47-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 18-6(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 18-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 47-a was used instead of compound 1-b and compound 4-a was used instead of 1-e. +e+f+g+h+i=54-58) was prepared.
m/z [M+H]+ 1245.4m/z [M+H] + 1245.4
제조예 48: 화합물 18-18의 제조Preparation Example 48: Preparation of Compounds 18-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 18-6의 제조 방법과 동일하게 화합물 18-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 18-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 18-6, except that compound 17-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 49: 화합물 18-21의 제조Preparation Example 49: Preparation of Compounds 18-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 18-6의 제조 방법과 동일하게 화합물 18-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 18-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 18-6, except that compound 20-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
제조예 50: 화합물 19-6의 제조Preparation Example 50: Preparation of compound 19-6
합성은 화합물 1-b 대신 화합물 50-a를, 1-e 대신 화합물 4-a를 사용한 것을 제외하고는 상기 화합물 3-2의 제조 방법과 동일하게 화합물 19-6(a+b+c+d+e+f+g+h+i=54-58)을 제조하였다.Compound 19-6 (a+b+c+d) was synthesized in the same manner as in the method for preparing compound 3-2, except that compound 50-a was used instead of compound 1-b and compound 4-a was used instead of 1-e. +e+f+g+h+i=54-58) was prepared.
m/z [M+H]+ 1245.4m/z [M+H] + 1245.4
제조예 51: 화합물 19-18의 제조Preparation Example 51: Preparation of Compounds 19-18
합성은 화합물 4-a 대신 화합물 17-a를 사용한 것을 제외하고는 상기 화합물 19-6의 제조 방법과 동일하게 화합물 19-18(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 19-18 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 19-6, except that compound 17-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.6m/z [M+H] + 1405.6
제조예 52: 화합물 19-21의 제조Preparation Example 52: Preparation of Compounds 19-21
합성은 화합물 4-a 대신 화합물 20-a를 사용한 것을 제외하고는 상기 화합물 19-6의 제조 방법과 동일하게 화합물 19-21(a+b+c+d+e+f+g+h+i+j+k=62-66)을 제조하였다.Compound 19-21 (a+b+c+d+e+f+g+h+i) was synthesized in the same manner as in the method for preparing compound 19-6, except that compound 20-a was used instead of compound 4-a. +j+k=62-66) was prepared.
m/z [M+H]+ 1405.5m/z [M+H] + 1405.5
비교제조예 1: 비교 화합물 F의 제조Comparative Preparation Example 1: Preparation of Comparative Compound F
화합물 F-a(1.0 eq.) 및 화합물 F-b(2.2 eq.)를 둥근 바닥 플라스크에 넣고 THF:PhMe 1:1 (v/v)에 용해시켰다. 물에 용해된 Na2CO3(6.0 eq.)를 주입하였다. Bath 온도 130℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 F(86% 수율)를 제조하였다.Compound Fa (1.0 eq.) and compound Fb (2.2 eq.) were placed in a round bottom flask and dissolved in THF:PhMe 1:1 (v/v). Na 2 CO 3 (6.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 130° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to prepare compound F (86% yield).
m/z [M+H]+ 935.4m/z [M+H] + 935.4
비교제조예 2: 비교 화합물 H의 제조Comparative Preparation Example 2: Preparation of Comparative Compound H
화합물 H-a(1.0 eq.) 및 화합물 H-b(2.1 eq.)를 둥근 바닥 플라스크에 넣고 무수 THF에 용해시켰다. 물에 용해된 Cs2CO3(20.0 eq.)를 주입하였다. Bath 온도 80℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 3일 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 H-c(76% 수율)를 제조하였다.Compound Ha (1.0 eq.) and compound Hb (2.1 eq.) were placed in a round bottom flask and dissolved in anhydrous THF. Cs 2 CO 3 (20.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 80° C. and stirred for 3 days. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound Hc (76% yield).
화합물 H-c(1.0 eq.)를 둥근 바닥 플라스크에 넣고 무수 CH2Cl2에 용해하였다. 이후, pyridine(2.0 eq.)을 상온에서 적가한 뒤, bath 온도를 0℃로 낮춰 10분 동안 교반하였다. 이후, 무수 CH2Cl2에 용해한 Tf2O(1.2 eq.)를 dropping funnel을 이용하여 천천히 혼합물에 적가하고, bath 온도를 서서히 0℃에서 상온으로 올려준 뒤, 하룻밤 동안 교반하였다. 반응 후, 반응물을 CH2Cl2에 충분히 묽힌 뒤, CH2Cl2/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 H-d(98% 수율)를 제조하였다.Compound Hc (1.0 eq.) was placed in a round bottom flask and dissolved in anhydrous CH 2 Cl 2 . Thereafter, pyridine (2.0 eq.) was added dropwise at room temperature, and then the bath temperature was lowered to 0° C. and stirred for 10 minutes. Thereafter, Tf 2 O (1.2 eq.) dissolved in anhydrous CH 2 Cl 2 was slowly added dropwise to the mixture using a dropping funnel, and the bath temperature was gradually raised from 0° C. to room temperature, followed by stirring overnight. After the reaction, the reactant was sufficiently diluted with CH 2 Cl 2 and washed with CH 2 Cl 2 /brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound Hd (98% yield).
화합물 H-d(1.0 eq.) 및 화합물 H-e(1.2 eq.)를 둥근 바닥 플라스크에 넣고 무수 THF에 용해시켰다. 물에 용해된 CS2CO3(10.0 eq.)를 주입하였다. Bath 온도 80℃ 하에서 Pd(PPh3)4(5 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 H(82% 수율)를 제조하였다.Compound Hd (1.0 eq.) and compound He (1.2 eq.) were placed in a round bottom flask and dissolved in anhydrous THF. CS 2 CO 3 (10.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (5 mol%) was added dropwise under a bath temperature of 80° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound H (82% yield).
m/z [M+H]+ 643.31m/z [M+H] + 643.31
비교제조예 3: 비교 화합물 I의 제조Comparative Preparation Example 3: Preparation of Comparative Compound I
화합물 I-a(1.0 eq.) 및 화합물 H-b(1.1 eq.)를 둥근 바닥 플라스크에 넣고 무수 THF에 용해시켰다. 물에 용해된 Cs2CO3(10.0 eq.)를 주입하였다. Bath 온도 80℃ 하에서 Pd(PPh3)4(5 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 I-b(64% 수율)를 제조하였다.Compound Ia (1.0 eq.) and Compound Hb (1.1 eq.) were placed in a round bottom flask and dissolved in anhydrous THF. Cs 2 CO 3 (10.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (5 mol%) was added dropwise under a bath temperature of 80° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to prepare compound Ib (64% yield).
화합물 I-c(1.0 eq.) 및 화합물 1-d(2.1 eq.)를 둥근 바닥 플라스크에 넣고 무수 THF에 용해시켰다. 물에 용해된 Cs2CO3(20.0 eq.)를 주입하였다. Bath 온도 80℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 3일 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 1-e(87% 수율)를 제조하였다.Compound Ic (1.0 eq.) and compound 1-d (2.1 eq.) were placed in a round bottom flask and dissolved in anhydrous THF. Cs 2 CO 3 (20.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 80° C. and stirred for 3 days. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to prepare compound 1-e (87% yield).
화합물 1-e(1.0 eq.)를 둥근 바닥 플라스크에 넣고 무수 CH2Cl2에 용해하였다. 이후, pyridine(4.0 eq.)을 상온에서 적가한 뒤, bath 온도를 0℃로 낮춰 10분 동안 교반하였다. 이후, 무수 CH2Cl2에 용해한 Tf2O(2.4 eq.)를 dropping funnel을 이용하여 천천히 혼합물에 적가하고, bath 온도를 서서히 0℃에서 상온으로 올려준 뒤, 하룻밤 동안 교반하였다. 반응 후, 반응물을 CH2Cl2에 충분히 묽힌 뒤, CH2Cl2/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 1-f(99% 수율)를 제조하였다.Compound 1-e (1.0 eq.) was placed in a round bottom flask and dissolved in anhydrous CH 2 Cl 2 . Thereafter, pyridine (4.0 eq.) was added dropwise at room temperature, and then the bath temperature was lowered to 0° C. and stirred for 10 minutes. Thereafter, Tf 2 O (2.4 eq.) dissolved in anhydrous CH 2 Cl 2 was slowly added dropwise to the mixture using a dropping funnel, and the bath temperature was gradually raised from 0° C. to room temperature, followed by stirring overnight. After the reaction, the reactant was sufficiently diluted with CH 2 Cl 2 and washed with CH 2 Cl 2 /brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to obtain compound 1-f (99% yield).
화합물 1-f(1.0 eq.) 및 화합물 H-e(1.2 eq.)를 둥근 바닥 플라스크에 넣고 무수 THF에 용해시켰다. 물에 용해된 CS2CO3(20.0 eq.)를 주입하였다. Bath 온도 80℃ 하에서 Pd(PPh3)4(10 mol%)를 적가하고 하룻밤 동안 교반하였다. 반응 후, 반응물을 상온에서 식히고 EtOAc에 충분히 묽힌 뒤, EtOAc/brine로 수세하여 유기층을 분리하였다. MgSO4로 물을 제거하고 Celite-Florisil-Silica pad에 통과시켰다. 통과된 용액을 감압 하에 농축시킨 뒤, Column Chromatography 정제하여 화합물 I(76% 수율)를 제조하였다.Compound 1-f (1.0 eq.) and compound He (1.2 eq.) were placed in a round bottom flask and dissolved in anhydrous THF. CS 2 CO 3 (20.0 eq.) dissolved in water was injected. Pd(PPh 3 ) 4 (10 mol%) was added dropwise under a bath temperature of 80° C. and stirred overnight. After the reaction, the reactant was cooled at room temperature, sufficiently diluted in EtOAc, and washed with EtOAc/brine to separate an organic layer. Water was removed with MgSO 4 and passed through a Celite-Florisil-Silica pad. The passed solution was concentrated under reduced pressure and purified by column chromatography to prepare Compound I (76% yield).
m/z [M+H]+ 895.4m/z [M+H] + 895.4
실험예 1: 중수소 치환율 확인Experimental Example 1: Confirmation of deuterium substitution rate
상기 제조예 1 내지 52에서 제조한 화합물에 대하여, 화합물 내 치환된 중수소의 개수를 MALDI-TOF MS(Matrix-Assisted Laser Desorption/ Ionization Time-of-Flight Mass Spectrometer) 분석을 통해 구한 후, 화학식 내 존재할 수 있는 수소의 총 개수 대비 치환된 중수소의 개수의 백분율로 중수소 치환율을 계산하였으며, 이를 하기 표 1에 나타내었다. For the compounds prepared in Preparation Examples 1 to 52, the number of deuterium substituted in the compound was obtained through MALDI-TOF MS (Matrix-Assisted Laser Desorption/Ionization Time-of-Flight Mass Spectrometer) analysis, and then The deuterium substitution rate was calculated as a percentage of the number of substituted deuteriums relative to the total number of hydrogens available, and is shown in Table 1 below.
치환수heavy hydrogen
number of substitutions
치환율 (%)heavy hydrogen
Substitution rate (%)
치환수heavy hydrogen
number of substitutions
치환율 (%)heavy hydrogen
Substitution rate (%)
실험예 2: 용해도 측정Experimental Example 2: Measurement of solubility
상기 제조예 1 내지 52에서 제조한 화합물 및 비교화합물 F 내지 I를 각각 25℃에서 사이클로헥사논에 1.3 wt% 농도로 용해가 가능한지 여부를 확인하였고, 그 결과를 표 2에 나타내었다. 이 때, 비교화합물 F 내지 I의 구조는 하기와 같다:It was confirmed whether the compounds and comparative compounds F to I prepared in Preparation Examples 1 to 52 could be dissolved in cyclohexanone at a concentration of 1.3 wt% at 25° C., and the results are shown in Table 2. At this time, the structures of comparative compounds F to I are as follows:
상기 표 2에서 확인할 수 있는 바와 같이, 상기 화학식 1로 표시되는 화합물들은 모두 사이클로헥사논에 1.3 wt% 농도로 용해가 가능하였지만, 비교화합물 G는 용해가 불가능하여, 유기 발광 소자 유기층을 용액 공정으로 제조 시 유기층을 이루는 화합물로 사용할 수 없음을 알 수 있다.As can be seen in Table 2, all of the compounds represented by Formula 1 were soluble in cyclohexanone at a concentration of 1.3 wt%, but the comparative compound G was not soluble, and thus the organic layer of the organic light emitting device was prepared by a solution process. It can be seen that it cannot be used as a compound constituting the organic layer during manufacture.
실시예 1Example 1
ITO(indium tin oxide)가 500 Å의 두께로 박막 코팅된 유리 기판을 세제를 녹인 증류수에 넣고 초음파로 세척하였다. 이때, 세제로는 피셔사(Fischer Co.) 제품을 사용하였으며, 증류수로는 밀리포어사(Millipore Co.) 제품의 필터(Filter)로 2차로 걸러진 증류수를 사용하였다. ITO를 30 분간 세척한 후, 증류수로 2 회 반복하여 초음파 세척을 10 분간 진행하였다. 증류수 세척이 끝난 후, 이소프로필, 아세톤의 용제로 초음파 세척을 하고 건조시킨 후, 상기 기판을 5 분 간 세정한 후 글로브박스로 기판을 수송시켰다.A glass substrate coated with indium tin oxide (ITO) to a thickness of 500 Å was put in distilled water in which detergent was dissolved and washed with ultrasonic waves. At this time, a product of Fischer Co. was used as a detergent, and distilled water filtered through a second filter of a product of Millipore Co. was used as distilled water. After washing the ITO for 30 minutes, ultrasonic cleaning was performed twice with distilled water for 10 minutes. After washing with distilled water, ultrasonic cleaning was performed with solvents such as isopropyl and acetone, and after drying, the substrate was cleaned for 5 minutes and transported to a glove box.
상기 ITO 투명 전극 위에, 상기 화합물 O 및 화합물 P(2:8의 중량비)를 20 wt/v%로 사이클로헥사논에 녹인 코팅 조성물을 스핀 코팅(4000 rpm)하고 200 ℃에서 30 분 동안 열처리(경화)하여 400 Å 두께로 정공주입층을 형성하였다. On the ITO transparent electrode, a coating composition in which the compound O and compound P (weight ratio of 2:8) was dissolved in cyclohexanone at 20 wt/v% was spin-coated (4000 rpm) and heat-treated (curing) at 200 ° C. for 30 minutes ) to form a hole injection layer with a thickness of 400 Å.
상기 정공주입층 위에 상기 화합물 Q(Mn: 27,900; Mw: 35,600; Agilent 1200 series를 이용하여 PC 스텐다드(Standard)를 이용한 GPC로 측정)를 6 wt/v%로 톨루엔에 녹인 코팅 조성물을 스핀 코팅(4000 rpm)하고 200 ℃에서 30 분 동안 열처리하여 200 Å 두께의 정공수송층을 형성하였다. On the hole injection layer, a coating composition in which the compound Q (Mn: 27,900; Mw: 35,600; measured by GPC using a PC standard using an Agilent 1200 series) was dissolved in toluene at 6 wt / v% was spin-coated ( 4000 rpm) and heat-treated at 200 °C for 30 minutes to form a hole transport layer having a thickness of 200 Å.
상기 정공수송층 위에 앞서 제조예 1에서 제조한 발광층 호스트 화합물 3-2와 발광층 도펀트 상기 화합물 R(98:2의 중량비)을 1.3 wt/v%로 사이클로헥사논에 녹인 코팅 조성물을 스핀 코팅(4000 rpm)하고 180℃에서 30 분 동안 열처리하여 400 Å 두께로 발광층을 형성하였다. On the hole transport layer, a coating composition in which the light emitting layer host compound 3-2 prepared in Preparation Example 1 and the light emitting layer dopant compound R (98:2 weight ratio) dissolved in cyclohexanone at 1.3 wt/v% was spin coated (4000 rpm) on the hole transport layer. ) and heat-treated at 180° C. for 30 minutes to form a light emitting layer with a thickness of 400 Å.
진공 증착기로 이송한 후, 상기 발광층 위에 상기 화합물 S를 350 Å 두께로 진공 증착하여 전자 주입 및 수송층을 형성하였다. 상기 전자 주입 및 수송층 위에 순차적으로 10 Å 두께로 LiF와 1000 Å 두께로 알루미늄을 증착하여 캐소드를 형성하였다. After transferring to a vacuum evaporator, the compound S was vacuum deposited to a thickness of 350 Å on the light emitting layer to form an electron injection and transport layer. A cathode was formed by sequentially depositing LiF to a thickness of 10 Å and aluminum to a thickness of 1000 Å on the electron injection and transport layer.
상기의 과정에서 유기물의 증착 속도는 0.4 내지 0.7 Å/sec를 유지하였고, LiF는 0.3 Å/sec, 알루미늄은 2 Å/sec의 증착 속도를 유지하였으며, 증착 시 진공도는 2*10-7 내지 5*10-8 torr를 유지하였다.In the above process, the deposition rate of organic materials was maintained at 0.4 to 0.7 Å / sec, LiF was maintained at 0.3 Å / sec, and aluminum was maintained at 2 Å / sec, and the vacuum degree during deposition was 2 * 10 -7 to 5 *10 -8 torr was maintained.
실시예 2 내지 실시예 52Examples 2 to 52
발광층의 호스트로 화합물 1 대신 하기 표 3에 기재된 화합물을 사용하는 것을 제외하고, 상기 실시예 1과 동일한 방법으로 유기 발광 소자를 제조하였다. An organic light emitting device was manufactured in the same manner as in Example 1, except that the compound shown in Table 3 was used instead of Compound 1 as a host of the light emitting layer.
비교예comparative example 1 내지 1 to 비교예comparative example 3 3
발광층의 호스트로 화합물 1 대신 하기 표 3에 기재된 화합물을 사용하는 것을 제외하고, 상기 실시예 1과 동일한 방법으로 유기 발광 소자를 제조하였다.An organic light emitting device was manufactured in the same manner as in Example 1, except that the compound shown in Table 3 was used instead of Compound 1 as a host of the light emitting layer.
실험예 3: 유기 발광 소자의 특성 평가Experimental Example 3: Characteristic evaluation of organic light emitting device
상기 실시예 및 비교예에서 제조한 유기 발광 소자에 전류를 인가하였을 때, 10 mA/cm2의 전류 밀도에서의 구동 전압, 외부 양자 효율(external quantum efficiency, EQE) 및 수명을 측정한 결과를 하기 표 3에 나타내었다. 이때, 외부양자효율(EQE)은 "(방출된 광자 수)/(주입된 전하운반체 수)*100"으로 구하였고, T90는 휘도가 초기 휘도(500 nit)에서 90 %로 감소하는데 소요되는 시간을 의미한다.When a current was applied to the organic light emitting device prepared in the above Examples and Comparative Examples, the driving voltage at a current density of 10 mA/cm 2 , the external quantum efficiency (EQE), and the lifetime were measured. Table 3 shows. At this time, the external quantum efficiency (EQE) was obtained as “(number of photons emitted) / (number of charge carriers injected) * 100”, and T90 is the time required for the luminance to decrease from the initial luminance (500 nit) to 90% means
호스트light emitting layer
host
(V @10mA/cm2)drive voltage
(V@10mA/cm 2 )
(% @10mA/cm2)EQE
(% @10mA/cm 2 )
(T90 @500 nit)Life (hr)
(T90 @500 nits)
상기 표 3에 나타난 바와 같이, 본 발명의 화합물을 발광층에 포함하는 유기 발광 소자는, 비교예의 소자 대비 효율 및 수명이 향상됨이 확인된다. As shown in Table 3, it is confirmed that the organic light emitting device including the compound of the present invention in the light emitting layer has improved efficiency and lifetime compared to the device of the comparative example.
구체적으로, 상기 화학식 1로 표시되는 화합물을 발광층의 호스트로 사용한 실시예의 유기 발광 소자는, 비교 화합물 F, H 및 I를 각각 발광층의 호스트로 사용한 비교예 1 내지 3의 유기 발광 소자에 비하여, 효율 및 수명이 향상되었다. 이는, 상기 화학식 1로 표시되는 화합물의 경우 중수소 치환율이 높아, 물질 안정성이 향상되었기 때문인 것으로 판단된다. Specifically, the organic light emitting device of Example using the compound represented by Formula 1 as a host of the light emitting layer has higher efficiency than the organic light emitting device of Comparative Examples 1 to 3 using Comparative Compounds F, H, and I as a host of the light emitting layer, respectively. and improved lifespan. It is believed that this is because the compound represented by Formula 1 has a high deuterium substitution rate and thus improves material stability.
따라서, 유기 발광 소자의 호스트 물질로 상기 화학식 1로 표시되는 화합물을 채용하는 경우, 유기 발광 소자의 외부 양자 효율 및 수명 특성을 동시에 향상시킬 수 있음을 알 수 있다. Accordingly, it can be seen that when the compound represented by Chemical Formula 1 is used as a host material of the organic light emitting diode, external quantum efficiency and lifetime characteristics of the organic light emitting diode can be simultaneously improved.
1: 기판
2: 양극
3: 발광층
4: 음극
5: 정공주입층
6: 정공수송층
7: 전자주입 및 수송층1: substrate 2: anode
3: light emitting layer 4: cathode
5: hole injection layer 6: hole transport layer
7: electron injection and transport layer
Claims (13)
[화학식 1]
상기 화학식 1에서,
D는 중수소를 의미하고,
P1 및 P2는 각각 독립적으로 단일 결합; 또는 비치환되거나 또는 중수소로 치환된 페닐렌이고,
Q1 및 Q2는 각각 독립적으로 비치환되거나 또는 중수소로 치환된 나프틸렌이고,
L1 내지 L4는 각각 독립적으로 단일 결합; 비치환되거나 또는 중수소로 치환된 페닐렌; 또는 비치환되거나 또는 중수소로 치환된 나프틸렌이고,
Ar1 및 Ar2는 각각 독립적으로 비치환되거나 또는 중수소로 치환된 페닐; 또는 비치환되거나 또는 중수소로 치환된 나프틸이고,
x, y 및 z는 각각 독립적으로 0 내지 8의 정수이고,
단, 상기 화합물은 적어도 하나의 중수소를 포함한다.
A compound represented by Formula 1 below:
[Formula 1]
In Formula 1,
D means deuterium,
P 1 and P 2 are each independently a single bond; or phenylene which is unsubstituted or substituted with deuterium;
Q 1 and Q 2 are each independently unsubstituted or deuterium-substituted naphthylene,
L 1 to L 4 are each independently a single bond; phenylene unsubstituted or substituted with deuterium; or naphthylene unsubstituted or substituted with deuterium;
Ar 1 and Ar 2 are each independently unsubstituted or deuterium-substituted phenyl; or naphthyl unsubstituted or substituted with deuterium;
x, y and z are each independently an integer from 0 to 8;
provided that the compound contains at least one deuterium.
상기 화합물의 중수소 치환율은 80% 이상인,
화합물.
According to claim 1,
The deuterium substitution rate of the compound is 80% or more,
compound.
x+y+z는 1 이상인,
화합물.
According to claim 1,
x+y+z is greater than or equal to 1;
compound.
P1 및 P2는 단일 결합; 비치환되거나 또는 1개 내지 4개의 중수소로 치환된 1,3-페닐렌; 또는 비치환되거나 또는 1개 내지 4개의 중수소로 치환된 1,4-페닐렌인,
화합물.
According to claim 1,
P 1 and P 2 are single bonds; 1,3-phenylene unsubstituted or substituted with 1 to 4 deuterium; or 1,4-phenylene, which is unsubstituted or substituted with 1 to 4 deuterium atoms;
compound.
Q1 및 Q2는 하기 화학식 2a 내지 2j로 표시되는 2가의 연결기 중 어느 하나인,
화합물:
상기 화학식 2a 내지 2j에서,
r은 1 내지 6의 정수이다.
According to claim 1,
Q 1 and Q 2 are any one of divalent linking groups represented by the following formulas 2a to 2j,
compound:
In Formulas 2a to 2j,
r is an integer from 1 to 6;
L1 내지 L4는 각각 독립적으로 단일 결합; 또는 하기 화학식 3a 내지 3m으로 표시되는 2가의 연결기 중 어느 하나인,
화합물:
상기 화학식 3a 내지 3m에서,
s는 0 내지 4의 정수이고,
t는 0 내지 6의 정수이다.
According to claim 1,
L 1 to L 4 are each independently a single bond; Or any one of the divalent linking groups represented by Formulas 3a to 3m,
compound:
In Formulas 3a to 3m,
s is an integer from 0 to 4;
t is an integer from 0 to 6;
L1 및 L2는 각각 독립적으로 단일 결합; 상기 화학식 3a로 표시되는 2가의 연결기; 또는 상기 화학식 3b로 표시되는 2가의 연결기이고,
여기서, s는 1 내지 4의 정수인,
화합물.
According to claim 6,
L 1 and L 2 are each independently a single bond; A divalent linking group represented by Formula 3a; Or a divalent linking group represented by Formula 3b,
Here, s is an integer from 1 to 4,
compound.
L3 및 L4는 각각 독립적으로 단일 결합; 상기 화학식 3a로 표시되는 2가의 연결기; 상기 화학식 3b로 표시되는 2가의 연결기; 또는 상기 화학식 3i로 표시되는 2가의 연결기이고,
여기서, s는 1 내지 4의 정수이고, t는 1 내지 6의 정수인,
화합물.
According to claim 6,
L 3 and L 4 are each independently a single bond; A divalent linking group represented by Formula 3a; A divalent linking group represented by Formula 3b; Or a divalent linking group represented by Formula 3i,
Here, s is an integer from 1 to 4, t is an integer from 1 to 6,
compound.
Ar1 및 Ar2는 각각 독립적으로, 1개 내지 5개의 중수소로 치환된 페닐; 1개 내지 7개의 중수소로 치환된 1-나프틸; 또는 1개 내지 7개의 중수소로 치환된 2-나프틸인,
화합물.
According to claim 1,
Ar 1 and Ar 2 are each independently phenyl substituted with 1 to 5 deuterium atoms; 1-naphthyl substituted with 1 to 7 deuterium; or 2-naphthyl substituted with 1 to 7 deuterium;
compound.
상기 및 상기 는 서로 동일한,
화합물.
According to claim 1,
remind and above are equal to each other,
compound.
상기 화학식 1로 표시되는 화합물은 하기 화학식 1'로 표시되는 화합물로 구성되는 군으로부터 선택되는 어느 하나인,
화합물:
[화학식 1']
상기 화학식 1' 에서,
n은 화합물 내 중수소 치환 개수를 의미하고,
Core는 하기 화학식 Core 1 내지 Core 44로 표시되는 2가의 연결기 중에서 선택되는 어느 하나이고,
R은 하기 화학식 R1 내지 R22로 표시되는 치환기 중에서 선택되는 어느 하나이고,
상기 화학식 1'로 표시되는 화합물은 하기와 같다,
.
According to claim 1,
The compound represented by Formula 1 is any one selected from the group consisting of compounds represented by Formula 1' below,
compound:
[Formula 1']
In Formula 1',
n means the number of deuterium substitutions in the compound,
Core is any one selected from divalent linking groups represented by the following formulas Core 1 to Core 44,
R is any one selected from substituents represented by the following formulas R1 to R22,
The compound represented by Formula 1' is as follows,
.
a first electrode; a second electrode provided to face the first electrode; and one or more organic material layers provided between the first electrode and the second electrode, wherein at least one of the organic material layers is a compound according to any one of claims 1 to 11. To include, an organic light emitting device.
상기 화합물을 포함하는 유기물층은 발광층인,
유기 발광 소자.According to claim 12,
The organic material layer containing the compound is a light emitting layer,
organic light emitting device.
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