KR20230092205A - Anti-slip pad comprising double sided bonding mounted on robot arm for transfering semiconductor wafer - Google Patents

Abstract

The present invention relates to an anti-slip pad attachable to and detachable from a blade of a robot arm for transporting semiconductor wafers, including a mounting portion having a mounting groove formed on a side surface so as to be attachable and detachable to a through hole formed in a blade, and a pad portion bonded to an upper surface of the mounting portion, the pad The part is formed on the base part and the upper surface of the base part and includes a pattern part including one or more micropatterns, the upper surface of the mounting part and the lower surface of the base part are bonded, and the mounting part and the pad part are formed in different colors or transparency, so that during the semiconductor device manufacturing process The semiconductor wafer is stably mounted on the robot arm, and when the pad wears out due to repeated use, it is possible to easily replace it by checking the appropriate replacement time.

Description

Anti-slip pad by double junction attached to and detached from the robot arm blade for semiconductor wafer transfer {ANTI-SLIP PAD COMPRISING DOUBLE SIDED BONDING MOUNTED ON ROBOT ARM FOR TRANSFERING SEMICONDUCTOR WAFER}

The present invention relates to an anti-slip pad attachable to and detachable from a robot arm blade for stably mounting a wafer to a transfer robot during a semiconductor device manufacturing process.

In general, a semiconductor device is manufactured by forming a multilayer film according to a desired circuit pattern on a single crystal silicon wafer. To this end, a plurality of unit processes such as a deposition process, a photolithography process, an oxidation process, an etching process, an ion implantation process, and a metal wiring process are repeatedly performed step by step.

In order for each of these unit processes to proceed according to the procedure, after each process is completed, the wafer is moved to equipment for subsequent processes. At this time, the wafers may be transferred individually or a plurality of wafers may be loaded and transferred in equipment such as a cassette.

A wafer transfer robot may be generally used in a process of loading or transferring a plurality of wafers loaded in a cassette to a specific equipment one by one.

A conventional wafer transfer robot has a blade that directly handles a wafer, and an anti-slip pad is attached to the blade to prevent the wafer from slipping. The wafer comes into direct contact with these non-slip pads. In general, the material of the non-slip pad is formed of rubber, and wear due to repeated use is inevitable. When the non-slip pad is worn, it becomes difficult for the wafer to be stably mounted on the blade, and there is a risk that the wafer may be separated from the blade due to movement and rotational inertia during the transfer process.

Embodiments of the present invention ensure that a semiconductor wafer is stably mounted on a robot arm during the semiconductor device manufacturing process, and when replacement due to wear due to repeated use is required, it is possible to easily know the replacement time, and to enable easy replacement. To provide a non-slip pad for transferring semiconductor wafers and a robot arm blade equipped with the non-slip pad.

In addition, a mounting portion mounted on a robot arm blade and a pad portion directly facing a wafer are formed, respectively, and manufactured by chemically or physically combining them to provide an anti-slip pad with reduced manufacturing cost.

The problem to be solved by the present invention is not limited to the above-mentioned problem (s), and another problem (s) not mentioned will be clearly understood by those skilled in the art from the following description.

An anti-slip pad detachable to a blade of a robot arm for transferring semiconductor wafers according to an embodiment of the present invention includes a mounting portion having a mounting groove formed on a side surface to be detachable from a through hole formed in the blade; and a pad portion bonded to an upper surface of the mounting portion, wherein the pad portion includes a base portion; and a pattern portion formed on an upper surface of the base portion and including one or more micropatterns, wherein an upper surface of the mounting portion and a lower surface of the base portion are bonded, and the mounting portion and the pad portion may be formed in different colors or transparency. .

In the above embodiment, bonding of the upper surface of the mounting part and the lower surface of the base part may include a chemical bond between oxygen (O) and silicon (Si) by plasma bonding.

In the above embodiment, the upper surface of the mounting part and the lower surface of the base part may be bonded with a silicon (Si)-based, polyimide (PI)-based, heat-resistant epoxy-based, or acrylic-based adhesive.

In the above embodiment, the mounting part or the pad part is made of carbon nanotube, graphene, C ₆₀ , C ₅₄₀ , C ₇₀ , amorphous carbon, graphite, elastomer, silicon-based Elastomer (Si based elastomer), fluoroelastomer (FKM), perfluoroelastomer (FFKM, perfluoroelastomer), polytetrafluoroethylene, polyimide, polyamideimide, polyacetylene ), polythiophene, polyaniline, polypyrrole, polybenzimidazole, polyetherketone, polyetheretherketone, poly(p) -phenylene)), polyphenylenevinylene, polyphenylenesulfide, poly(p-phenylenesulfide), poly(p-phenylene vinylene) ), polyisothianaphthene, polythienylenevinylene, polyhedral oligomeric silsesquioxanes, or fumed silica.

In the above embodiment, the mounting portion and the pad portion may be formed of different materials.

In the embodiment, the one or more micropatterns are formed in a columnar shape, a groove shape, or a line shape, a horizontal cross section of the columnar shape is a polygon, a circle, or an ellipse, a height of the columnar shape is 0.3 μm to 100 μm, and the columnar shape is 0.3 μm to 100 μm. The horizontal thickness of the shape is 0.3 μm to 100 μm, the horizontal cross section of the groove shape is a polygon, circle or ellipse, the depth of the groove shape is 0.3 μm to 100 μm, and the horizontal width of the groove shape is 0.3 μm. to 100 μm, the width of the line shape is 0.3 μm to 100 μm, the height of the line shape is 0.3 μm to 100 μm, and a Van der Waals force is applied between the lower surface of the wafer and the upper surface of the pattern part. A mounting force may be generated by

In the above embodiment, the one or more micropatterns may include micromorphology formed in an irregular shape by a dry etching process, a wet etching process, laser processing, or a polymer dissolution and drying process.

An anti-slip pad attached to and detachable from a blade of a robot arm for transferring semiconductor wafers according to another embodiment of the present invention includes a mounting portion including an adhesive layer on a lower surface to be detachable from an upper surface of the blade; and a pad portion bonded to an upper surface of the mounting portion, wherein the pad portion includes a base portion; and a pattern portion formed on an upper surface of the base portion and including one or more micropatterns, wherein an upper surface of the mounting portion and a lower surface of the base portion are joined, and the mounting portion and the pad portion are formed in different colors or transparency, wherein the The adhesive layer may include a silicon (Si)-based adhesive, a polyimide (PI)-based adhesive, a heat-resistant epoxy-based adhesive, or an acrylic-based adhesive.

In the above embodiment, bonding of the upper surface of the mounting part and the lower surface of the base part may include a chemical bond between oxygen (O) and silicon (Si) by plasma bonding.

In the above embodiment, the pad part is bonded to the upper surface of the mounting part with an adhesive, and the adhesive may include a silicon (Si)-based adhesive, a polyimide (PI)-based adhesive, a heat-resistant epoxy-based adhesive, or an acrylic-based adhesive.

In the above embodiment, the mounting part or the pad part is made of carbon nanotube, graphene, C ₆₀ , C ₅₄₀ , C ₇₀ , amorphous carbon, graphite, elastomer, silicon-based Elastomer (Si based elastomer), fluoroelastomer (FKM), perfluoroelastomer (FFKM, perfluoroelastomer), polytetrafluoroethylene, polyimide, polyamideimide, polyacetylene ), polythiophene, polyaniline, polypyrrole, polybenzimidazole, polyetherketone, polyetheretherketone, poly(p) -phenylene)), polyphenylenevinylene, polyphenylenesulfide, poly(p-phenylenesulfide), poly(p-phenylene vinylene) ), polyisothianaphthene, polythienylenevinylene, polyhedral oligomeric silsesquioxanes, or fumed silica.

In the above embodiment, the mounting portion and the pad portion may be formed of different materials.

In the embodiment, the one or more micropatterns are formed in a column shape, a groove shape, or a line shape, a horizontal cross section of the shape of the column is a polygon, a circle, or an ellipse, and a height of the column shape is 0.3 μm to 100 μm. The thickness of the pillar shape in the horizontal direction is 0.3 μm to 100 μm, the horizontal cross section of the groove shape is a polygon, circle or ellipse, the depth of the groove shape is 0.3 μm to 100 μm, and the horizontal width of the groove shape is 0.3 μm. ㎛ to 100㎛, the width of the line shape is 0.3㎛ to 100㎛, the height of the line shape is 0.3㎛ to 100㎛, van der Waals force between the lower surface of the wafer and the upper surface of the pattern portion (Van der Waals ) may generate a mounting force.

In the above embodiment, the one or more micropatterns may include micromorphology formed in an irregular shape by a dry etching process, a wet etching process, laser processing, or a polymer dissolution and drying process.

According to an embodiment of the present invention, the non-slip pad is attached to and detached from the blade through a through hole formed in the blade of the robot arm, or the non-slip pad is attached and detached from the upper surface of the blade through an adhesive layer included in the lower surface, When the non-slip pad is worn due to prolonged use, it is possible to improve the stability of the semiconductor device manufacturing process by making it easy to replace with a new one.

In addition, a mounting part mounted on a robot arm blade and a pad part having a pattern for preventing slipping by directly facing the wafer are manufactured, respectively, and an anti-slip pad is manufactured by bonding the mounting part and the pad part through plasma bonding or adhesive bonding to manufacture a manufacturing process. can be simplified and the manufacturing cost can be reduced.

The pad part is formed of a material that can increase the mounting force of the wafer, the mounting part is formed of a material that meets each purpose so that the non-slip pad can be stably mounted on the blade, and the color or transparency of the pad part and the mounting part are different. Thus, it is possible to visually and immediately check whether or not the pad part remains or needs to be replaced according to repeated use, thereby improving the convenience and stability of the maintenance of the semiconductor device manufacturing process.

1 is a schematic diagram of a wafer transfer robot according to an embodiment of the present invention.
FIG. 2 is a view for explaining the robot arm blade shown in FIG. 1 in detail.
3 to 9 are views for explaining in detail the configuration of an anti-skid pad detachable from a blade including a through hole.
10 is a view for explaining the configuration of an anti-slip pad detachable from a blade through an adhesive layer.

Advantages and/or features of the present invention, and methods of achieving them, will become apparent with reference to the following detailed description of the embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various forms different from each other, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to completely inform the person who has the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram of a wafer transfer robot according to an embodiment of the present invention.

Referring to FIG. 1, the wafer transfer robot 100 according to an embodiment of the present invention is for transferring, for example, a wafer that has completed a corresponding process to the next process or to a loading space such as a cassette. It may include a robot body 110 and a multi-joint type robot arm 120 mounted on the upper part of the robot body 110 .

A wheel or the like is provided at the lower end of the robot body 110 so that the robot body 110 can be moved. As shown in FIG. 1 , the robot arm 120 may include a plurality of arms 121 and 123. In the present embodiment, the robot arm 120 may include a first arm 121 and a second arm 123. there is.

The first arm 121 and the robot body 110 are coupled by the shaft 111 so that the first arm 121 can rotate around the shaft 111, and the first arm 121 and the second arm 121 can rotate. The arms 123 are also coupled by a shaft so that each of the arms 121 and 123 can be rotated in a desired direction.

Accordingly, the blade 130 mounted on the second arm 123 may be moved to a desired position by each operation of the arms 121 and 123 . In particular, in the case of the shaft 111 connecting the robot body 110 and the first arm 121, it is possible to lift, and as a result, an operation of loading or unloading a wafer on the blade 130 may be performed. .

The blade 130 may be coupled to the second arm 123 by an arm mounting member 125 . As shown in FIG. 2, a screw hole 133 is formed in the blade 130, and a hole into which a screw can be coupled may also be formed in the arm mounting member 125 to correspond thereto. Coupled to the mounting member 125, of course, may be easily separated as needed.

2 is a view for explaining the robot arm blade shown in FIG. 1;

Referring to FIG. 2 , the blade 130 according to the present embodiment may include a blade body 131 for mounting a wafer and a blade tip 135 provided at one end of the blade body 131 . In FIG. 2, the tongs-shaped blade tip 135 is exemplified, but is not limited thereto, and may be provided in various shapes such as a circular shape as long as it can stably support a wafer.

An anti-slip pad 140 may be mounted on the blade tip 135 to prevent the wafer from slipping. A through hole may be formed in the blade tip 135, and the non-slip pad 140 may be mounted in the through hole in such a way that the loaded wafer may be more stably supported.

Referring to FIG. 2 , the arrangement of the through holes formed in the blade tip 135 is shown as an example in three places, but can be arranged in various ways as long as the wafer can be uniformly supported.

3 to 9 are views for explaining in detail the configuration of the non-slip pad 140 detachable from the blade including the through hole.

Referring to FIG. 3 , the non-slip pad 140 may include a pad part 141 and a mounting part 143 . A mounting groove 1431 may be formed on the side of the mounting portion 143, and the mounting groove 1431 may be mounted in a way to fit into a through hole formed in the blade tip 135, and the non-slip pad 140 It can also be detached if replacement is required. The maximum outer diameter of the mounting portion 143 may be greater than the inner diameter of the through hole, and the outer diameter of the mounting groove 1431 may be greater than or equal to the inner diameter of the through hole. The height of the mounting groove 1431 may be equal to or smaller than the height of the through hole, that is, the thickness of the blade tip 135 . Due to this size relationship between the mounting groove 1431 and the through hole, the mounting portion 143 can be firmly attached to the through hole by elasticity. The non-slip pad may be mounted so that the lower portion of the mounting groove 1431 protrudes to the lower portion of the blade tip 135, or the lower aperture of the through hole is larger so that the lower portion of the mounting groove does not protrude below the blade tip and can be accommodated inside. It can also be fitted so that

The pad part 141 may include a base part 1411 bonded to the upper surface of the mounting part 143 and a pattern part 1413 formed on the upper surface of the base part 1411 and including one or more fine patterns. The base portion 1411 is formed to support one or more micropatterns from the lower side, and the base portion 1411 and one or more micropatterns may be integrally formed of the same material through the same process.

The lower surface of the pad part 141, that is, the lower surface of the base part 1411 and the upper surface of the mounting part 143 may be bonded together by plasma bonding. Surfaces to be bonded of the pad part 141 and the mounting part 143 may be combined and bonded after plasma treatment, or may be bonded by plasma treatment after being in contact with each other. Oxygen (O) or silicon (Si) atoms included in the lower surface of the pad part 141 are chemically bonded with silicon or oxygen atoms included in the upper surface of the mounting part 143 by plasma treatment, so that the lower surface of the pad part 141 And the upper surface of the mounting part 143 can be firmly bonded.

The lower surface of the pad part 141 and the upper surface of the mounting part 143 may be bonded together with an adhesive. The adhesive may include a silicon (Si)-based adhesive, a polyimide (PI)-based adhesive, a heat-resistant epoxy-based adhesive, or an acrylic-based adhesive.

Since the pad part 141 and the mounting part 143 including the micropattern have different size scales, it is not easy to simultaneously have the characteristics required for each configuration when integrally formed in the same process. The pad part 141 and the mounting part 143 can be formed independently and then bonded to each other, reducing the handling and process difficulty and having all the characteristics required for each configuration.

The pad part 141 and the mounting part 143 may be formed of the same material, but are not limited thereto and may be formed of different materials. The pad part 141 and the mounting part 143 may be formed of a material having elasticity.

The stretchable material may include an elastomer, a Si based elastomer, a fluoroelastomer (FKM), a perfluoroelastomer (FFKM), or polytetrafluoroethylene.

In addition, in order to stably seat a wafer heated to a high temperature, the pad part 141 or the mounting part 143 may include a heat-resistant material. Heat-resistant materials include carbon nanotube, graphene, C ₆₀ , C ₅₄₀ , C ₇₀ , amorphous carbon, graphite, polyimide, polyamideimide, poly Acetylene, polythiophene, polyaniline, polypyrrole, polybenzimidazole, polyetherketone, polyetheretherketone, polyparaphenylene ( poly(p-phenylene)), polyphenylenevinylene, polyphenylenesulfide, poly(p-phenylenesulfide), poly(p-phenylenesulfide) phenylene vinylene)), polyisothianaphthene, polythienylenevinylene, polyhedral oligomeric silsesquioxanes, or fumed silica.

The mounting portion 143 and the pad portion 141 may be formed of the same material or different materials. The different materials mean that the types of raw materials included in each material are different, or that the composition of each raw material is different when the raw materials of the same type are included.

The mounting portion 143 and the pad portion 141 may be formed in different colors or transparency. When the mounting portion 143 and the pad portion 141 are formed of different materials as well as when they are formed of the same material, colors or transparency may be set differently. When the pad unit 141 is worn out and removed as the non-slip pad is used repeatedly, the mounting force capable of stably supporting the wafer is significantly reduced. Therefore, it is necessary to immediately check the degree of wear and tear so that it can be replaced. If the color or transparency of the pad part 141 and the mounting part 143 are different, the boundary surface of the joint part can be immediately checked with the naked eye. Accordingly, the stability of the semiconductor device manufacturing process can be improved by frequently checking the remaining amount of the pad unit 141 and replacing it with a new pad in a timely manner.

Referring to FIG. 4 , the non-slip pad 140 formed by bonding the pad part 141 and the mounting part 143 to each other through the bonding surface 145 is formed through the through-hole of the blade tip 135 through the mounting groove 1431. It can be inserted and installed.

FIG. 5 is a view illustrating the shape of the mounting portion 143 that enables the non-slip pad 140 to be attached to and detached from the blade tip 135 more easily. The lower shape of the mounting portion 143 may be formed in a shape in which the area decreases toward the bottom surface. The bottom area of the lower surface of the mounting portion 143 may be formed smaller than the area of the through hole, and in this case, aiming to the mounting position may be facilitated, and mounting may be easily performed even with a small force.

The non-slip pad 140 may include an expansion groove 1433 at the center of the lower surface of the mounting portion 143 . The expansion groove 1433 can more effectively reduce the outer diameter of the lower portion of the mounting portion 143 when the lower portion of the mounting portion 143 passes through the through hole by an external force. Therefore, even when the bottom area of the lower surface of the mounting part 143 is larger than the area of the through hole, the elastic groove 1433 allows the lower part of the mounting part 143 to pass through the through hole more easily, thereby preventing the slipping pad 140 from slipping. It makes it easier to mount on the blade tip 135.

When the pad part 141 of the non-slip pad is worn due to repeated use, the stability of the semiconductor device manufacturing process can be improved by removing the worn old part from the through hole and easily mounting the new part on the blade tip 135. .

6 to 9 are diagrams illustrating the shape of a pattern unit 1413 according to embodiments of the present invention.

Referring to FIG. 6(a) , the base portion 1411 is formed to support the pattern portion 1413, and the pattern portion 1413 may include one or more pillars or protrusions 1415. Referring to FIG. 6(b) , one or more pillars or protrusions 1415 may be formed to extend vertically with respect to the upper surface of the base portion 1411, but are not limited thereto and form a predetermined angle that is not perpendicular to the base portion 1411. Also, the angle formed by each of the pillars or protrusions 1415 and the upper surface of the base part 1411 may not be the same.

One or more pillars or protrusions 1415 are described as being formed in a straight line as an example, but are not limited thereto and may be formed in a curved shape.

One or more pillars or protrusions 1415 are spaced apart from each other, and the distances may be the same or different. One or more pillars or protrusions 1415 may have a circular horizontal cross-section, but are not limited thereto and may be formed in various cross-sectional shapes such as polygons such as triangles, squares, or pentagons, or ovals. Upper ends of the one or more pillars or protrusions 1415 may be flat or rounded.

One or more pillars or protrusions 1415 may be formed to a height of 0.3 μm to 100 μm, and each of the pillars or protrusions 1415 may be formed to have the same height, but is not limited thereto and may be formed to have different heights. there is.

The horizontal thickness, diameter, thickness or width of one or more pillars or protrusions 1415 may be formed in a range of 0.3 μm to 100 μm, and each of the pillars or protrusions 1415 has the same thickness, diameter, thickness or width It may be formed, but is not limited thereto and may be formed with different thicknesses, diameters, thicknesses or widths.

Referring to FIG. 7( a ) , the pattern portion 1413 of the non-slip pad may include one or more grooves or hole shapes 1416 . One or more grooves or hole shapes 1416 may be formed to vertically extend downward toward the top surface of the base portion 1411, but are not limited thereto and may be formed at a predetermined angle rather than perpendicular, and each groove or hole shape 1416 may be formed at a predetermined angle. The angle formed by the hole shapes 1416 and the upper surface of the base portion 1411 may not be the same.

Although one or more groove or hole shapes 1416 are described as being formed in a straight line as an example, it is not limited thereto and may be formed in a curved shape.

One or more groove or hole shapes 1416 are spaced apart from each other, and the distance may be the same or different. One or more grooves or hole shapes 1416 may have a circular horizontal cross section, but are not limited thereto and may be formed in various cross sectional shapes such as polygons such as triangles, squares, or pentagons, or ovals. The bottom of one or more groove or hole shapes 1416 may be flat, but may also be formed in a rounded shape.

One or more groove or hole shapes 1416 may be formed to a depth of 0.3 μm to 100 μm, and each groove or hole shape 1416 may be formed to the same depth, but is not limited thereto, and may be formed to different depths. there is.

One or more groove or hole shapes 1416 may have a horizontal width or width of 0.3 μm to 100 μm, and each groove or hole shape 1416 may have the same width or width, but is not limited thereto. It may be formed with different widths or widths.

Referring to FIG. 8 , the pattern portion 1413 of the non-slip pad may include one or more line shapes 1417 . The line shape 1417 is formed in a shape similar to a wall and may be formed to extend vertically with respect to the upper surface of the base portion 1411, but is not limited thereto and may be formed at a predetermined angle other than perpendicular. The angle formed by each of the line shapes 1417 and the upper surface of the base portion 1411 may not be the same. One or more line shapes 1417 are described as being formed in a straight line on a plan view as an example, but are not limited thereto and may be formed in a bent or curved shape.

One or more line shapes 1417 are disposed to be spaced apart from each other, and the separation distance may be the same or different. Upper ends of the one or more line shapes 1417 may be flat, but may also be formed in a rounded shape.

One or more line shapes 1417 may be formed with a height of 0.3 μm to 100 μm, and each line shape 1417 may be formed with the same height, but is not limited thereto and may be formed with different heights.

One or more line shapes 1417 may be formed with a width of 0.3 μm to 100 μm, and each line shape 1417 may be formed with the same width, but is not limited thereto and may be formed with different widths.

Although the case where one or more line shapes are embossed has been described above, it is also possible to be engraved.

The shape of the pattern portion 1413 according to FIGS. 6 to 8 may be formed using a mold or may be formed through a patterning process using a lithography process.

Referring to FIG. 9 , the pattern portion 1413 may include one or more irregularly shaped micro morphologies 1418 . The micro morphology 1418 may have a positive or negative shape. The micromorphology 1418 may be formed in different sizes, that is, different thicknesses, widths, heights, or depths in the range of 0.3 μm to 100 μm. The micro morphology 1418 may be disposed on the upper part of the base part 1411 at different distances from each other without a certain rule.

The micro morphology 1418 may be formed by dry and wet etching processes using an irregular pattern mask, or may be formed by a sputtering process using a metal, oxide, or polymer compound target. Also, the micro morphology 1418 may be formed through laser processing.

The micro morphology 1418 may be formed by dissolving and drying a polymer. Specifically, a mixed solution is prepared by dissolving a polymer in a mixed solvent containing one or more solvents. Irregular patterns can be formed by immersing the pattern portion 1413 to form the micro morphology 1418 in the mixed solution, taking it out, and then drying it. The size and shape of the atypical pattern can be diversified according to the type and mixing ratio of the solvent, the temperature of the mixed solution, and the speed at which the pattern unit 1413 is immersed and taken out of the mixed solution. In addition, an atypical pattern may be formed by spin-coating the mixed solution on the pattern portion 1413 and then drying it. The size and shape of irregular patterns can be diversified by adjusting the speed of spin coating, the thickness of the coating layer, and the drying speed.

The pattern part 1413 may enhance the mounting force with which the wafer is mounted on the blade tip 135 by providing a high frictional force in response to the normal force due to the gravity of the wafer. In addition, an attractive force due to van der Waals force may be generated between the upper surface of the pattern portion 1413 and the lower surface of the wafer. After mounting the non-slip pad 140 according to the embodiment of the present invention on the blade tip 135 and loading the wafer, a slip test was conducted, and it was confirmed that the wafer was stably mounted even when tilted at 65 degrees or more relative to the horizontal. Therefore, when the wafer is loaded on the non-slip pad 140 and transported by the robot arm, separation due to inertia is prevented, thereby significantly improving process stability.

FIG. 10 is a view for explaining the configuration of an anti-slip pad 240 detachable from the blade 235 through an adhesive layer.

Referring to FIG. 10, the non-slip pad 240 according to an embodiment of the present invention includes an adhesive layer 2431 on the lower surface, and a mounting part 243 detachably attached to the upper surface of the blade 235 and an upper surface of the mounting part 243. It includes a pad part 241 to be bonded, and the pad part 241 includes a pattern part 2413 including one or more micropatterns and a base part 2411 supporting the pattern part 2413 from a lower portion. The upper surface of the mounting part 243 and the lower surface of the pad part 241, that is, the lower surface of the base part 2411 are joined, and the mounting part 243 and the pad part 241 may be formed in different colors or transparency.

The adhesive layer 2431 included in the mounting portion 243 may include silicon (Si)-based, polyimide (PI)-based, heat-resistant epoxy-based, or acrylic-based adhesives, and the lower surface of the mounting portion 243 is applied to the upper surface of the blade 235. firmly mounted on In addition, when replacement of the pad is required due to wear due to repeated use, the mounting portion 243 can be separated from the upper surface of the blade 235 without any residue.

Hereinafter, the overlapping contents with those described above will be omitted in order to simplify the description of the present invention.

Although the specific embodiments according to the present invention have been described so far, various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments and should not be defined, but should be defined by not only the scope of the claims to be described later, but also those equivalent to the scope of these claims.

As described above, the present invention has been described by the limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art in the field to which the present invention belongs can make various modifications and transformation is possible Therefore, the spirit of the present invention should be grasped only by the claims described below, and all equivalent or equivalent modifications thereof will be said to belong to the scope of the spirit of the present invention.

100: transfer robot
110: robot body
111: shaft
120: robot arm
121 first arm
123 second arm
125: arm mounting member
130: blade
131: blade body
133: screw hole
135: blade tip
140, 240: non-slip pad
1411, 2411: base part
1413, 2413: pattern part
1415: column or projection shape
1416: Groove or hole shape
1417: line shape
1418: irregular shape micromorphology
143, 243: mounting part
1431: mounting groove
1433: new home
145: junction
2431: adhesive layer

Claims (14)

In the non-slip pad attached to and detached from the blade of a robot arm for transferring semiconductor wafers,
A mounting part having a mounting groove formed on a side surface to be detachable from the through hole formed in the blade; and
Including; pad portion bonded to the upper surface of the mounting portion,
The pad part base part; And a pattern portion formed on the upper surface of the base portion and including one or more micropatterns;
An anti-slip pad, characterized in that the upper surface of the mounting portion and the lower surface of the base portion are bonded, and the mounting portion and the pad portion are formed in different colors or transparency.
According to claim 1,
Bonding of the upper surface of the mounting part and the lower surface of the base part includes a chemical bond between oxygen (O) and silicon (Si) by plasma bonding.
According to claim 1,
An anti-slip pad, characterized in that the upper surface of the mounting portion and the lower surface of the base portion are bonded with a silicon (Si)-based, polyimide (PI)-based, heat-resistant epoxy-based or acrylic-based adhesive.
According to claim 1,
The mounting part or the pad part is made of carbon nanotube, graphene, C ₆₀ , C ₅₄₀ , C ₇₀ , amorphous carbon, graphite, elastomer, silicon-based elastomer (Si based elastomer), fluoroelastomer (FKM, perfluoroelastomer), perfluoroelastomer (FFKM, perfluoroelastomer), polytetrafluoroethylene, polyimide, polyamideimide, polyacetylene, polyty polythiophene, polyaniline, polypyrrole, polybenzimidazole, polyetherketone, polyetheretherketone, poly(p-phenylene) , polyphenylenevinylene, polyphenylenesulfide, poly(p-phenylenesulfide), poly(p-phenylene vinylene), polyiso An anti-slip pad comprising polyisothianaphthene, polythienylenevinylene, polyhedral oligomeric silsesquioxanes or fumed silica.
According to claim 4,
The anti-slip pad, characterized in that the mounting portion and the pad portion are formed of different materials.
According to claim 1,
The one or more micropatterns are formed in a column shape, a groove shape, or a line shape,
The horizontal cross section of the shape of the column is a polygon, circle or ellipse, the height of the column shape is 0.3 μm to 100 μm, the thickness of the column shape in the horizontal direction is 0.3 μm to 100 μm,
The horizontal cross section of the groove shape is a polygon, circle or ellipse, the depth of the groove shape is 0.3 μm to 100 μm, and the width of the groove shape in the horizontal direction is 0.3 μm to 100 μm,
The width of the line shape is 0.3 μm to 100 μm, the height of the line shape is 0.3 μm to 100 μm,
An anti-slip pad, characterized in that a mounting force by Van der Waals is generated between the lower surface of the wafer and the upper surface of the pattern part.
According to claim 1,
The anti-slip pad, characterized in that the one or more micropatterns include micro morphology formed in an irregular shape by a dry etching process, a wet etching process, laser processing, or a polymer melting and drying process.
In the non-slip pad attached to and detached from the blade of a robot arm for transferring semiconductor wafers,
A mounting unit including an adhesive layer on the lower surface to enable attachment and detachment from the upper surface of the blade; and
Including; pad portion bonded to the upper surface of the mounting portion,
The pad part base part; And a pattern portion formed on the upper surface of the base portion and including one or more micropatterns;
The upper surface of the mounting part and the lower surface of the base part are joined, and the mounting part and the pad part are formed in different colors or transparency,
The non-slip pad, characterized in that the adhesive layer comprises a silicon (Si)-based, polyimide (PI)-based, heat-resistant epoxy-based or acrylic-based adhesive.
According to claim 8,
Bonding of the upper surface of the mounting part and the lower surface of the base part includes a chemical bond between oxygen (O) and silicon (Si) by plasma bonding.
According to claim 8,
The pad portion is bonded to the upper surface of the mounting portion with an adhesive, and the adhesive includes a silicone (Si)-based, polyimide (PI)-based, heat-resistant epoxy-based or acrylic-based adhesive.
According to claim 8,
The mounting part or the pad part is made of carbon nanotube, graphene, C ₆₀ , C ₅₄₀ , C ₇₀ , amorphous carbon, graphite, elastomer, silicon-based elastomer (Si based elastomer), fluoroelastomer (FKM, perfluoroelastomer), perfluoroelastomer (FFKM, perfluoroelastomer), polytetrafluoroethylene, polyimide, polyamideimide, polyacetylene, polyty polythiophene, polyaniline, polypyrrole, polybenzimidazole, polyetherketone, polyetheretherketone, poly(p-phenylene) , polyphenylenevinylene, polyphenylenesulfide, poly(p-phenylenesulfide), poly(p-phenylene vinylene), polyiso An anti-slip pad comprising polyisothianaphthene, polythienylenevinylene, polyhedral oligomeric silsesquioxanes or fumed silica.
According to claim 11,
The anti-slip pad, characterized in that the mounting portion and the pad portion are formed of different materials.
According to claim 8,
The one or more micropatterns are formed in a column shape, a groove shape, or a line shape,
The horizontal cross section of the shape of the column is a polygon, circle or ellipse, the height of the column shape is 0.3 μm to 100 μm, the thickness of the column shape in the horizontal direction is 0.3 μm to 100 μm,
The horizontal cross section of the groove shape is a polygon, circle or ellipse, the depth of the groove shape is 0.3 μm to 100 μm, and the width of the groove shape in the horizontal direction is 0.3 μm to 100 μm,
The width of the line shape is 0.3 μm to 100 μm, the height of the line shape is 0.3 μm to 100 μm,
An anti-slip pad, characterized in that a mounting force by Van der Waals is generated between the lower surface of the wafer and the upper surface of the pattern part.
According to claim 8,
The anti-slip pad, characterized in that the one or more micropatterns include micro morphology formed in an irregular shape by a dry etching process, a wet etching process, laser processing, or a polymer melting and drying process.

Images