KR20230090415A - Film for spacer and method of forming spacer using the same - Google Patents

Abstract

The present invention relates to a spacer film applied to a multi-chip package and a spacer forming method using the same. The spacer film according to the present invention includes a first film and an adhesive layer disposed under the first film. The spacer film according to the present invention includes a first film instead of a dummy wafer, and has a product of a storage modulus and a curl value of 10 to 200 GPa·mm. Accordingly, it is possible to suppress die recognition defects occurring in the dicing process and improve pick-up performance.

Description

Film for spacer and method for forming spacer using the same {FILM FOR SPACER AND METHOD OF FORMING SPACER USING THE SAME}

The present invention relates to a spacer film applied to a multi-chip package and a spacer forming method using the same.

With the development of semiconductor device manufacturing technology, many studies on miniaturization and multifunctionalization of electronic devices have been conducted. A multi-chip package (MCP) technology is one of semiconductor chip packaging technologies, and is a technology for implementing semiconductor chips of the same type or semiconductor chips of different types into a single package. The multi-chip package technology enables high-speed transmission in a small package area, and has advantages in terms of size and weight compared to implementing each semiconductor chip in a separate package.

In order to obtain an effect of reducing the size of a multi-chip package, it is necessary to stack a plurality of semiconductor chips and arrange them in one package. A spacer is used at this time. For example, in a package in which two semiconductor chips are stacked, one semiconductor chip is directly attached to the package substrate, but the other semiconductor chip is not directly attached to the package substrate. A spacer serves to support a semiconductor chip that is not directly attached to such a package substrate.

The spacer is generally formed of metal, polymer, photosensitive resist or the like. When the spacer is formed of metal or photosensitive resist, a method of depositing or coating the metal or photosensitive resist on the package substrate and then removing parts other than the spacer by etching may be used. When the spacer is formed of metal or polymer, a method of fabricating the spacer in a predetermined shape and adhering it to the package substrate may be used.

A method of forming a spacer by etching after depositing or coating a metal or photosensitive resist not only requires a complicated process such as photolithography, but also wastes materials. A method of manufacturing a spacer having a predetermined size and attaching the spacer to a package substrate has problems in that it is not easy to accurately manufacture a spacer of the size and it is difficult to accurately attach the spacer to the package substrate.

In addition, there is a method of manufacturing a spacer by using (cutting) a dummy wafer and bonding it on a package substrate. In this method, waste of the dummy wafer is a problem.

On the other hand, it is possible to consider using a polymer film containing a component such as polyimide as a spacer instead of a dummy wafer. occurs, a defect occurs in recognizing the die, and pick-up performance deteriorates.

An object of the present invention is to provide a film for a spacer capable of performing a dicing process without using a dummy wafer, suppressing die recognition defects and improving pick-up properties.

Another object of the present invention is to provide a method of forming a spacer capable of performing a dicing process with excellent efficiency without using a dummy wafer.

Another object of the present invention is to provide a multi-chip package that does not use a dummy wafer.

The technical problem to be achieved by the present invention is not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A film for a spacer according to exemplary embodiments includes a first film and an adhesive layer disposed under the first film, and satisfies Equation 1 below.

[Equation 1]

10 GPa mm ≤ (storage modulus x curl amount) ≤ 200 GPa mm

에서의 저장탄성률이고, 컬량은 상기 제1 필름과 접착층을 가로 50 mm, 세로 15 mm인 직사각형으로 절취하여 상기 접착층이 아래 측이 되도록 수평면 위에 두고 측정한 컬량이다.)(In Equation 1, the storage modulus is 25

It is the storage modulus at , and the amount of curl is measured by cutting the first film and the adhesive layer into a rectangle with a width of 50 mm and a length of 15 mm and placing the adhesive layer on a horizontal surface so that the adhesive layer is on the lower side.)

In some embodiments, the storage modulus may be 2 GPa to 10 GPa.

In some embodiments, the curl amount may be 5 mm to 20 mm.

In some embodiments, the first film may include at least one of polyimide, polyetheretherketone, polyamideimide, polyphenylene sulfide, polyphthalamide, polysulfone, polyethersulfone, and polyetherimide. can

In some embodiments, the first film may include a coating layer thereon.

In some embodiments, the coating layer may include at least one of a compound containing a polyimide functional group, a compound containing a polyamideimide functional group, a compound containing an epoxy functional group, and a compound containing a urethane acrylate functional group. .

In some embodiments, the coating layer has a thickness of 2 um to 9 um, a film for a spacer.

In some embodiments, the adhesive layer may include at least one of an acrylic compound and an epoxy resin.

In some embodiments, the spacer film may further include a first pressure-sensitive adhesive layer disposed under the adhesive layer.

In some embodiments, the first pressure-sensitive adhesive layer may include an acrylic compound.

In some embodiments, an edge of an upper surface of the first pressure-sensitive adhesive layer may be exposed.

In some embodiments, the adhesive strength between the first pressure-sensitive adhesive layer and the adhesive layer is 20 to 200 N/m before UV curing of the first pressure-sensitive adhesive layer and 15 N/m after UV curing of the first pressure-sensitive adhesive layer. may be below.

In some embodiments, a second film disposed under the first pressure-sensitive adhesive layer may be further included.

In some embodiments, the second film may include a polyolefin-based resin.

In some embodiments, a second pressure-sensitive adhesive layer disposed on the first film and a cover film disposed on the second pressure-sensitive adhesive layer may be further included.

A spacer forming method according to exemplary embodiments includes a fixing step of fixing the spacer film to a frame, a dicing step of dicing and singling the spacer film, and a first film and an adhesive layer in the singulated result. A pick-up step of picking up the spacer, and an attaching step of attaching the picked-up spacer on the package substrate.

In some embodiments, the spacer film further includes a first pressure-sensitive adhesive layer disposed below the adhesive layer, an edge of an upper surface of the first pressure-sensitive adhesive layer is exposed, and a frame is provided with the first pressure-sensitive adhesive layer. It may be disposed on the edge of the upper surface of the pressure-sensitive adhesive layer.

A multi-chip package according to example embodiments includes a package substrate, a spacer including the spacer film according to claim 1 disposed on the package substrate, a first semiconductor chip unit disposed on the package substrate, the spacer, and a first semiconductor chip unit disposed on the package substrate. A second semiconductor chip unit stacked on one semiconductor chip unit, a chip pad of the first semiconductor chip unit and a corresponding first substrate pad, and a chip pad of the second semiconductor chip unit and a corresponding second substrate pad are electrically connected. A package body encapsulating a connecting wire, the first semiconductor chip unit, the second semiconductor chip unit, the wire, and the spacer is included.

The spacer film according to the present invention includes a first film instead of a dummy wafer, and the product of the storage modulus and the curl amount is 10 GPa·mm to 200 GPa·mm. Accordingly, it is possible to suppress die recognition defects occurring in the dicing process and improve pick-up performance.

Accordingly, it is possible to easily fabricate individualized spacers having a desired size from the spacer film according to the present invention through a dicing process.

In addition, the spacer forming method according to the present invention can easily attach the individualized spacers to the package substrate through a pick-up process and an attaching process.

In addition, the present invention can provide a multi-chip package that does not use a dummy wafer by using the spacer film.

1 is a cross-sectional view schematically showing an example of a multi-chip package including a spacer according to an embodiment of the present invention.
2 is a schematic cross-sectional view of a multi-chip package including a spacer according to another embodiment of the present invention.
3 is a schematic cross-sectional view of a multi-chip package including a spacer according to another embodiment of the present invention.
4 is a schematic cross-sectional view of a multi-chip package including a spacer according to another embodiment of the present invention.
5 is a schematic cross-sectional view of a film for a spacer according to an embodiment of the present invention.
6 is a schematic cross-sectional view of a film for a spacer according to another embodiment of the present invention.
7 schematically illustrates a spacer forming method using a dicing process according to the present invention.
8 is a plan view corresponding to (a), (b), and (c) of FIG. 7 .

In describing the present invention, if it is determined that a detailed description of the known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of a user or operator. Therefore, the definition should be made based on the contents throughout this specification.

The technical spirit of the present invention is determined by the claims, and the following examples are only one means for efficiently explaining the technical spirit of the present invention to those skilled in the art to which the present invention belongs.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is only an example and the present invention is not limited thereto.

1 is a cross-sectional view schematically illustrating an example of a multi-chip package including a spacer.

Referring to FIG. 1 , a first semiconductor chip unit 120 is disposed on a package substrate 110 . The first semiconductor chip unit 120 may include a first adhesive layer 121 and a first semiconductor chip 122 . The first adhesive layer 121 serves to attach the first semiconductor chip 122 to the package substrate 110 . The first semiconductor chip unit 120 may be electrically connected to the package substrate 110 by connecting a chip pad and a corresponding first substrate pad through a wire 125 .

A spacer 130 is disposed around the first semiconductor chip unit 120 . The spacer 130 includes an adhesive layer 131 and a support 132 . The adhesive layer 131 serves to attach the support 132 to the substrate.

A second semiconductor chip unit 140 is disposed on the spacer 130 . The second semiconductor chip unit 140 may include a second adhesive layer 141 and a second semiconductor chip 142 . The second adhesive layer 141 serves to attach the second semiconductor chip 142 to the support 132 of the spacer 130 . The second semiconductor chip unit 140 may be electrically connected to the package substrate 110 by connecting a chip pad and a corresponding second substrate pad through a wire 145 . As another example, the second semiconductor chip 142 may be electrically connected to the package substrate 110 through a via hole penetrating the spacer 130 .

On the package substrate 110, the first semiconductor chip unit 120, the spacer 130, and the second semiconductor chip unit 140 are disposed, and after the wire bonding process is performed, the package body 150 seals them is formed The package body 150 may be formed of an encapsulant such as epoxy resin.

As shown in FIG. 1 , the height of the spacer 130 may be higher than that of the first semiconductor chip unit 120 . Through this, the second semiconductor chip unit 140 may be stacked using the spacer 130 as a support. As another example, the height of the spacer 130 may be the same as that of the first semiconductor chip unit 120 . Also, since the spacer 130 has the same height as the first semiconductor chip unit 120, the first semiconductor chip unit 120 is buried by the spacer 130 and the second semiconductor chip unit 140. effect can be obtained.

2 to 4 are cross-sectional views schematically illustrating another example of a multi-chip package including a spacer.

In FIGS. 2 to 4 , the second semiconductor chip units ( 140 - 1 to 140 - 4 in FIG. 2 , 140 - 1 to 140 - 5 in FIG. 3 , and 140 - 1 to 140 - 7 in FIG. 4 ) are shown in FIG. 1 . Similar to the illustrated example, it may be electrically connected to another second semiconductor chip unit or the package substrate 110 through wires (not shown) or via holes (not shown).

Even in the case of the multi-chip packages shown in FIGS. 2 to 4 , semiconductor chip units may be stacked through the spacer 130 disposed on the package substrate 110 .

5 is a schematic cross-sectional view of a film for a spacer according to an embodiment of the present invention.

Referring to FIG. 5 , the illustrated spacer film includes a first film 510 and an adhesive layer 520, and may further include a first pressure-sensitive adhesive layer 535 disposed under the adhesive layer 520. . A film for a spacer according to an embodiment of the present invention satisfies Equation 1 below.

[Equation 1]

10 GPa mm ≤ (storage modulus x curl amount) ≤ 200 GPa mm

In Equation 1, the storage modulus is the storage modulus of the spacer film at 25 ° C, and the curling amount is measured by cutting the first film and the adhesive layer into a rectangle 50 mm wide and 15 mm long, and placing the adhesive layer on a horizontal surface so that the adhesive layer is on the lower side. .

In Equation 1, the value of storage modulus x curl amount is preferably 10 GPa·mm to 200 GPa·mm. In the range of the above value, it is possible to suppress the occurrence of defective die recognition due to warpage during expansion, and the pick-up process by the needle pin can be performed well. As the storage modulus increases, the hardness of the film increases, so even if the curl amount decreases, warpage of the film can be suppressed during expansion. can

The storage modulus (E ') is obtained by cutting the portion where the first film and the adhesive layer are laminated in the spacer film into 5 mm x 20 mm, and using a DMA (dynamic mechanical analyzer, manufacturer: TA company, model name: DMA850) equipment to measure the temperature range The temperature may be increased from -30 ° C to 10 ° C / min to measure the 25 ° C storage modulus. The storage modulus is preferably 2 GPa to 10 GPa. If the storage modulus is less than 2 GPa, die recognition and pick-up failures due to warpage appear during expansion, and if the storage modulus is more than 10 GPa, the hardness is excessively increased, so that it may not be well commercialized in a roll form.

The amount of curl means a relative difference between the heights of the center and the outer edge of the sample, and has a + value when the center area is higher than the outer area, and a - value when the center area is lower than the outer area.

If the curl amount is less than 5 mm, a smile-shaped warpage occurs during expansion, resulting in poor vision recognition of the pickup equipment, and if the curl amount exceeds 20 mm, the first film 510 and the adhesive layer 520 do not adhere well. Therefore, the manufacturing process cannot proceed or chip flying occurs due to self-peeling when used in the pick-up process.

first film

The first film 510 is a part to be the support 132 of the spacer 130 of FIGS. 1 to 4 . The spacer 130 is required to have heat resistance in a semiconductor chip package manufacturing process and use of a semiconductor chip package.

Therefore, the first film 510 preferably has heat resistance. Therefore, in the present invention, the first film 510 is limited to a weight loss rate of 2% or less at 200 ° C and a linear expansion coefficient of 50 ppm / ° C or less at 100 ° C or less. When the weight reduction rate at 200 ° C. exceeds 2% or the linear expansion coefficient at 100 ° C. or less exceeds 50 ppm / ° C., it can be considered that the heat resistance is not good.

The first film 510 having heat resistance as described above is at least one of polyimide, polyetheretherketone, polyamideimide, polyphenylene sulfide, polyphthalamide, polysulfone, polyethersulfone, and polyetherimide. can include Among these, it is more preferable to use polyimide or polyether ether ketone, which is more excellent in heat resistance, as a material for the first film.

The first film 510 may have a single layer structure. As another example, the first film 510 may have a multilayer structure.

The first film 510 may include a coating layer thereon. The coating layer may have higher elasticity or shrinkage than the first film 510 . When the coating layer is included, the lower and upper portions of the first film 510 may have different modulus of elasticity or shrinkage, so that the spacer film can be more easily curled.

The coating layer may preferably include at least one of a compound containing a polyimide functional group, a compound containing a polyamideimide functional group, a compound containing an epoxy functional group, and a compound containing a urethane acrylate functional group. The compound may be included in the form of a cured product.

The coating layer may have a thickness of 2 to 9 um. If the thickness of the coating layer is less than 2 um, it is difficult to impart an appropriate amount of curl to achieve the effect of the present invention to the spacer film, and if it exceeds 9 um, rolls occur, making it difficult to manufacture the spacer film or pickup Flying may occur during processing.

The thickness of the first film layer may be determined according to the thickness of the target spacer support (132 in FIG. 1), but considering the formation of curls, the thickness may be 3 um to 100 um, but is not particularly limited thereto. .

adhesive layer

The adhesive layer 520 is a portion to be the adhesive layer 131 of the spacer 130 of FIGS. 1 to 4 .

The adhesive layer 520 is disposed under the first film 510 . The adhesive layer 520 may have a thickness of about 3 to 60 μm, but is not limited thereto.

In the present invention, the adhesive layer 520 may include an acrylic compound. Also, the adhesive layer 520 may include an epoxy resin for curing. Epoxy resins include bisphenol A type, bisphenol F type, bisphenol S type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type, orthocresol novolak type, glycidylamine type, etc. More than one species can be used.

In addition, one or more additives may be further included in the adhesive layer 520 . As additives, curing agents (phenolic resins, amines, etc.), inorganic particles (silica, aluminum hydroxide, alumina, titanium dioxide, calcium carbonate, etc.), curing accelerators, silane coupling agents, etc. may be suggested, but are not limited thereto.

The acrylic compound usable for the adhesive layer 520 and the first pressure-sensitive adhesive layer 535 and the second pressure-sensitive adhesive layer 545 to be described later preferably includes a monomer derived from (meth)acrylic acid ester.

Examples of the monomers include (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, and (meth)acrylic acid aryl esters.

The acrylic compound may further include a carboxyl group-containing monomer, an acid anhydride monomer, a hydroxyl group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, an acrylonitrile-containing monomer, and the like.

In addition, one or more polyfunctional monomers may be further included in the acrylic compound. Polyfunctional monomers include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and pentaerythritol. Di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy(meth)acrylate (i.e. polyglycylate) Dill (meth)acrylate), polyester (meth)acrylate, urethane (meth)acrylate and the like can be presented.

2nd film

The spacer film according to an exemplary embodiment of the present invention may further include a second film 530 disposed below the adhesive layer 520 .

A first pressure-sensitive adhesive layer 535 may be disposed between the second film 530 and the adhesive layer 520 . The first pressure-sensitive adhesive layer 535 may be formed by directly casting and drying the second film 530 or by laminating the second film 530 .

The second film 530 may serve as a support in the dicing process. The thickness of the second film 530 may be adjusted to 40 μm or more in order to secure expandability and pick-up properties. On the other hand, even when the thickness of the second film 530 exceeds 300 μm and is too thick, expansion defects and pick-up defects may occur. Therefore, the thickness of the second film 530 is preferably 300 μm or less. The thickness range of the second film 530 may be 40 to 300 μm, preferably 50 to 250 μm, more preferably 60 to 200 μm, and most preferably 70 to 150 μm.

The second film 530 may use a polyolefin-based resin. Specifically, the second film 530 is low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, homopolypropylene, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer It may be formed of a material containing at least one of a polymer, an ionomer resin, an ethylene-(meth)acrylic acid copolymer, an ethylene-(meth)acrylic acid ester copolymer, an ethylene-butene copolymer, and an ethylene-hexene copolymer.

The second film 530 may have a single-layer structure, or may have a multi-layer structure as another example.

The first pressure-sensitive adhesive layer 535 may be formed to a thickness of about 5 to 30 μm, but is not limited thereto. The first pressure-sensitive adhesive layer 535 may include an acrylic compound. However, unlike the adhesive layer 520, the first pressure-sensitive adhesive layer 535 may not contain an epoxy resin.

In addition, one or more additives may be further included in the first pressure-sensitive adhesive layer 535 . As an additive, a thermal curing agent such as an isocyanate curing agent or a photoinitiator such as benzophenone may be suggested, but is not limited thereto.

The first pressure-sensitive adhesive layer 535 may exist in a B-stage state until UV curing in the dicing process.

Meanwhile, the adhesive strength between the first pressure-sensitive adhesive layer 535 and the adhesive layer 520 may be 20 to 200 N/m before UV curing of the first pressure-sensitive adhesive layer, and may be 15 N/m or less after UV curing. This is to ensure that only the first film 510 and the adhesive layer 520 separated in the pick-up process after dicing are picked up. Control of the adhesive strength of the first pressure-sensitive adhesive layer 535 may be achieved through, for example, control of the components of the pressure-sensitive adhesive. For example, the acrylic compound of the first pressure-sensitive adhesive layer 535 includes 10 to 40 parts by weight of 2-hydroxyethyl acrylate and 2-methacryloyloxyethyl isocyanate based on 100 parts by weight of 2-ethylhexyl acrylate. 10 to 45 parts by weight of a copolymer obtained by copolymerization may be included.

Meanwhile, referring to FIG. 5 , the edge of the upper surface of the first pressure-sensitive adhesive layer 535 may be exposed. This is to facilitate fixing of the spacer film to the ring frame in the dicing process. This will be described later with reference to FIG. 7 .

6 is a schematic cross-sectional view of a film for a spacer according to another embodiment of the present invention.

The spacer film shown in FIG. 6 includes a first film 510, an adhesive layer 520, a second film 530, and a first pressure-sensitive adhesive layer 535, like the spacer film shown in FIG. . In the spacer film shown in FIG. 6, since the first film 510, the adhesive layer 520, the second film 530, and the first pressure-sensitive adhesive layer 535 are the same as those described in FIG. 5, their descriptions will be omitted. do.

Meanwhile, the spacer film shown in FIG. 6 further includes a cover film 540 and a second pressure-sensitive adhesive layer 545 .

cover film

The cover film 540 serves as a protective film to protect the first film 510 before the dicing process. The cover film 540 is previously removed in the dicing process. The cover film 540 may be formed of a material such as polyethylene terephthalate, polyethylene, polypropylene, polyvinyl chloride, polycarbonate, or polyimide, but is not limited thereto.

A second pressure-sensitive adhesive layer 545 may be disposed between the cover film 540 and the first film 510 .

The second pressure-sensitive adhesive layer 545 may be formed to a thickness of about 3 to 30 μm, but is not limited thereto. Like the first pressure-sensitive adhesive layer 535, the second pressure-sensitive adhesive layer 545 may include an acrylic compound but not an epoxy resin. The second pressure-sensitive adhesive layer 545 may further include a curing agent such as a phenolic resin or an amine, or one or more additives such as a silane coupling agent.

Meanwhile, referring to FIG. 6 , the edge of the lower surface of the second pressure-sensitive adhesive layer 545 may be exposed. This is to facilitate the removal of the cover film 540 and the second pressure-sensitive adhesive layer 545 immediately before the dicing process.

Spacer formation method

7 schematically illustrates a spacer forming method using a dicing process according to the present invention. FIG. 8 is a plan view corresponding to (a), (b) and (c) of FIG. 7 , and is referred to when describing the method of FIG. 7 .

Referring to FIG. 7 , the spacer forming method according to the present invention includes a fixing step, a dicing step, a pick-up step, and an attaching step.

First, as in the example shown in (a) of FIG. 7, a spacer including a first film 510, an adhesive layer 520, a first pressure-sensitive adhesive layer 535, and a second film 530 from above. arrange a film For example, by removing the second pressure-sensitive adhesive layer 545 and the cover film 540 from the spacer film shown in FIG. 6, a spacer film like the example shown in (a) of FIG. 7 can be prepared.

Then, as in the example shown in FIG. 7 (b) and FIG. 8 (b), the spacer film is fixed. A frame 610 such as a ring frame may be used to fix the film for the spacer. Meanwhile, when the edge of the upper surface of the first pressure-sensitive adhesive layer 535 is exposed in the spacer film, the frame 610 can be easily disposed on the edge of the upper surface of the first pressure-sensitive adhesive layer 535. .

Then, as in the example shown in (c) of FIG. 7, the spacer film is diced along a predetermined cutting line (SL) using a dicing saw 601 or a laser to separate it. . As described above, since curls are pre-applied to the spacer film according to the present invention, it is possible to prevent the spacer film from being bent upward at the chip edge during expansion, thereby suppressing poor expansion and poor pick-up. can do.

Then, as in the example shown in (d) of FIG. 7, the spacer made of the first film 510 and the adhesive layer 520 is separated from the resultant unit by using the pushing unit 620 and the adsorption unit 630. pick up

Then, as shown in (e) of FIG. 7 , a spacer made of the first film 510 and the adhesive layer 520 is attached to the package substrate 110 .

<Example>

Hereinafter, a preferred embodiment is presented to aid understanding of the present invention. However, the following examples are only provided to more easily understand the present invention, and the content of the present invention is not limited by the following examples.

Manufacture of adhesive film for spacers

Spacer films consisting of a first film (polyimide), an acrylic-epoxy adhesive layer, an acrylic pressure-sensitive adhesive layer, and a second film (polyethylene film) were prepared from above (see (a) in FIG. 7). As the first film, those with and without a coating layer formed thereon were used, respectively.

에서 DMA 장치를 이용하여 측정하였다. The storage modulus of the prepared adhesive film for spacers was measured at 25

was measured using a DMA device.

The amount of curl is measured by cutting the portion where the first film and the adhesive layer are laminated from the manufactured adhesive film for spacers into a rectangle with a width of 50 mm and a length of 15 mm, placing the adhesive layer on a horizontal surface so that the adhesive layer is on the lower side, and using a measuring device to measure the center and outermost part of the sample. The height difference was measured.

The storage modulus and curl amount measured for each sample are shown in Table 1 below.

division first film
(thickness mm) coating insects
(thickness mm) adhesive layer
(thickness um) storage modulus
(Gpa) curl amount
(mm) Example 1 50 polyimide, 4 16 2.0 19.9 Example 2 50 polyimide, 4 16 5.4 19.8 Example 3 50 polyimide, 3 17 9.9 20.0 Example 4 50 polyimide, 7 13 2.1 5.0 Example 5 50 polyimide, 7 13 5.4 5.0 Example 6 50 polyimide, 7 13 9.8 5.1 Example 7 50 polyimide, 3 17 2.1 19.9 Example 8 50 polyimide, 4 16 2.4 19.7 Example 9 50 polyimide, 9 11 2.9 18.5 Example 10 50 polyimide, 5 15 8.7 12.7 Example 11 50 polyimide, 6 14 9.0 13.7 Example 12 50 polyimide, 9 11 9.7 15.5 Comparative Example 1 50 X, 0 mm 20 0.9 0 Comparative Example 2 50 X, 0 mm 20 10.2 0 Comparative Example 3 50 X, 0 mm 20 2.0 0 Comparative Example 4 50 Polyimide, 1um 19 0.9 10.0 Comparative Example 5 50 Polyimide, 1um 19 10.1 20.3 Comparative Example 6 50 Polyimide, 7um 13 2.2 4.5 Comparative Example 7 50 Polyimide, 10um 10 0.8 10.2 Comparative Example 8 50 Polyimide, 10um 10 10.2 20.2 Comparative Example 9 50 Polyimide, 10um 10 2.1 4.7

Adhesive film evaluation for spacers

Then, after bonding the ring frame to the upper edge side of the acrylic pressure-sensitive adhesive layer to fix the film for spacer, using a dicing device, DFD-6361 (manufactured by Disco), individual spacers were cut into 9mm Х 12mm for each specimen. After performing a dicing process for dividing into , individual spacers were expanded and picked up using a pickup equipment SPA-300 (manufactured by Shinkawa Co.).

The following evaluations were performed, and the results are shown in Table 2.

Chip Recognition Evaluation: After dicing, an expanding process of expanding the second film was performed to facilitate separation and pickup between chips in a pick-up device, and the chip recognition rate was measured at an expanding ring height of 3 mm. A recognition rate of 95% or more was evaluated as good (O), and a recognition rate of less than 95% was evaluated as poor (X).

Pickup evaluation: Pickup was performed at 0.35mm and 0.45mm height of the needle pin of the pick-up device, and when the pick-up success rate was 95% or more, it was evaluated as good (O), and when it was less than 95%, it was evaluated as bad (X).

division Storage modulus x curl amount
(Gpa mm) chip recognition pick-up 0.35mm 0.45mm Example 1 19.9 O O O Example 2 106.9 O O O Example 3 198.0 O O O Example 4 10.5 O O O Example 5 27.0 O O O Example 6 49.98 O O O Example 7 47.8 O O O Example 8 47.3 O O O Example 9 53.7 O O O Example 10 110.5 O O O Example 11 123.3 O O O Example 12 150.4 O O O Comparative Example 1 - X X X Comparative Example 2 - X X X Comparative Example 3 - X X X Comparative Example 4 9.0 X X X Comparative Example 5 205.0 O X (Chip Flying) X (Chip Flying) Comparative Example 6 9.9 X X X Comparative Example 7 8.2 X X X Comparative Example 8 206.0 O X (Chip Flying) X (Chip Flying) Comparative Example 9 9.9 X X X

Referring to Table 2, in the case of Examples 1 to 12 in which the product of the storage modulus and the amount of curl of the spacer film was 10 Gpa mm to 200 Gpa mm, no defects were shown in the expanding process and the pick-up process. On the other hand, in the case of Comparative Examples 1 to 9, pick-up defects were confirmed at a needle pin height of 0.45 mm of the pick-up device.

Therefore, it can be confirmed that imparting curl to the spacer film is effective in improving pickup properties, and it can be seen that the product of the storage modulus and the amount of curl is preferably 10 Gpa·mm to 200 Gpa·mm.

Although the present invention has been described as above, the present invention is not limited by the embodiments disclosed herein, and it is obvious that various modifications can be made by a person skilled in the art within the scope of the technical idea of the present invention. In addition, even if the operational effects according to the configuration of the present invention are not explicitly described and described while describing the embodiments of the present invention, it is natural that the effects predictable by the corresponding configuration should also be recognized.

110: package substrate 120: first semiconductor chip unit
130: spacer 131: adhesive layer
132: support 140: second semiconductor chip unit
150: package body 510: first film
520: adhesive layer 530: second film
535: first pressure-sensitive adhesive layer 540: cover film
545: second pressure-sensitive adhesive layer 601: saw for dicing
610: frame 620: pushing means
630: adsorption means

Claims (18)

first film; and
Including; an adhesive layer disposed under the first film,
A film for a spacer that satisfies Equation 1 below:
[Formula 1]
10 GPa mm ≤ (storage modulus x curl amount) ≤ 200 GPa mm
(In Equation 1, the storage modulus is the storage modulus of the spacer film at 25 ° C., and the amount of curl is obtained by cutting the portion where the first film and the adhesive layer are stacked into a rectangle with a width of 50 mm and a length of 15 mm, so that the adhesive layer is below. It is the amount of curl measured by placing it on a horizontal surface so that it is on the side.)
The method of claim 1,
The storage modulus is 2 GPa to 10 GPa, a film for a spacer.
The method of claim 1,
The amount of curl is 5 mm to 20 mm, a film for a spacer.
The method of claim 1,
The first film includes at least one of polyimide, polyetheretherketone, polyamideimide, polyphenylene sulfide, polyphthalamide, polysulfone, polyethersulfone, and polyetherimide.
The method of claim 1,
Wherein the first film comprises a coating layer on the bottom, a film for spacers.
The method of claim 5,
Wherein the coating layer includes at least one of a compound containing a polyimide functional group, a compound containing a polyamideimide functional group, a compound containing an epoxy functional group, and a compound containing a urethane acrylate functional group.
The method of claim 1,
The coating layer is a film for a spacer having a thickness of 2 to 9 um.
The method of claim 1,
The adhesive layer comprises at least one of an acrylic compound and an epoxy resin, a film for a spacer.
The method of claim 1,
The film for spacers further comprising a first pressure-sensitive adhesive layer disposed under the adhesive layer.
The method of claim 9,
The first pressure-sensitive adhesive layer comprises an acrylic compound, a film for spacers.
The method of claim 9,
A film for spacers in which the edge of the upper surface of the first pressure-sensitive adhesive layer is exposed.
The method of claim 9,
The adhesive strength between the first pressure-sensitive adhesive layer and the adhesive layer is 20 to 200 N / m before UV curing of the first pressure-sensitive adhesive layer, and 15 N / m or less after UV curing of the first pressure-sensitive adhesive layer. Film for spacers.
The method of claim 9,
The film for a spacer further comprising a second film disposed under the first pressure-sensitive adhesive layer.
The method of claim 13,
The film for spacers in which the second film is made of a polyolefin-based resin.
The method of claim 9,
a second pressure-sensitive adhesive layer disposed on the first film; and
The spacer film further comprising a cover film disposed on the second pressure-sensitive adhesive layer.
A fixing step of fixing the film for a spacer according to claim 1 to a frame;
a dicing step of dicing the spacer film into individual pieces;
A pick-up step of picking up the spacer made of the first film and the adhesive layer in the pieced product; and
A method of forming a spacer, comprising an attachment step of attaching the raised spacer on a package substrate.
The method of claim 16
The spacer film further includes a first pressure-sensitive adhesive layer disposed under the adhesive layer,
The edge of the upper surface of the first pressure-sensitive adhesive layer is exposed,
A method of forming a spacer, wherein a frame is disposed on an edge of an upper surface of the first pressure-sensitive adhesive layer.
package substrate;
a spacer comprising the spacer film according to claim 1 disposed on the package substrate;
a first semiconductor chip unit disposed on the package substrate;
a second semiconductor chip unit stacked on the spacer and the first semiconductor chip unit;
wires electrically connecting the chip pads of the first semiconductor chip unit and the corresponding first substrate pads and the chip pads of the second semiconductor chip unit and the corresponding second substrate pads; and
A multi-chip package including a package body encapsulating the first semiconductor chip unit, the second semiconductor chip unit, wires, and spacers.

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