KR20230065616A - Loadlock module and substrate processing system having the same - Google Patents

Abstract

The present invention relates to a load lock module and a substrate processing system having the same. The present invention relates to a load lock module (200) which delivers substrates between the outside at atmospheric pressure and a process module (100) where substrate processing is performed. The load lock module (200) comprises: a load lock chamber (210) forming a sealed internal space (S) and having at least one pair of gates (T) for a substrate to enter and exit; a substrate support unit (220) installed in the load lock chamber (210) and configured to support a substrate (G) introduced into the internal space (S); a gas injection unit (230) for injecting an inert gas into the internal space (S); a gas exhaust unit (240) for exhausting gas from the internal space (S); a heat exchange unit (270) for controlling the temperature of the substrate (G) introduced into the internal space (S); and a gate valve unit (250) which opens and closes the gate (T). According to the present invention, the load lock module includes a guide block which can improve gas flow in the internal space of the load lock module, and thus, productivity of the load lock module can be improved.

Description

Loadlock module and substrate processing system including the same

The present invention relates to a load lock module and a substrate processing system including the same.

A semiconductor substrate processing apparatus that performs a semiconductor manufacturing process, etc., generally includes a plurality of process chambers for performing a substrate processing process, and an environment so that the substrate can enter the process chamber before the substrate enters the corresponding process chamber. A load lock chamber that creates a load lock chamber and a robot arm that connects the process chamber and the load lock chamber and transfers the substrate in the load lock chamber to the corresponding process chamber or transfers the substrate in the corresponding process chamber to the load lock chamber is installed. It includes a transfer chamber to be.

In a process chamber, a substrate processing process is generally performed at a high temperature and a process pressure close to vacuum. At this time, since it is difficult to enter the substrate under atmospheric pressure into the process chamber under high temperature and process pressure, it is necessary to create the same environment as the process chamber before transferring the substrate to the corresponding process chamber. It is a road lock chamber.

That is, the load lock chamber refers to a chamber accommodating a substrate in a state substantially the same as an environment of the process chamber or an external environment before a substrate is introduced into the process chamber from the outside or before a substrate is taken out of the process chamber.

In the case of a conventional substrate processing apparatus, efforts are being made through methods such as increasing the number of process chambers in order to improve productivity by removing bottlenecks in the process chamber.

However, if the bottleneck in the process chamber is resolved in any way, then the productivity of the load lock chamber becomes the bottleneck in the entire system.

On the other hand, the substrate processing in the load-lock chamber means opening the substrate loading gate from the transfer chamber, loading the substrate, closing the board loading gate, injecting a venting gas, opening the gate for transporting the substrate to atmospheric transport, transporting the substrate, Refers to a series of processes that lead to the closing of the substrate transport gate.

To this end, gate valves for opening and closing the gates may be coupled to the substrate carrying-in gate and the substrate carrying-out gate of the load lock chamber.

Members affected by thermal damage during transfer of substrates that are not sufficiently cooled are deformed or melted, making it difficult to perform their original functions, or leaving traces on the substrate, resulting in particles in manufacturing chips. (contaminants) and can be a factor that can cause defects in semiconductor products.

In addition, the conventional load lock chamber is configured such that the gate is opened and closed by a valve housing of a gate valve being coupled to one outer wall of the load lock chamber and a valve plate of the gauge valve being brought into close contact with a valve seat provided in the valve housing.

Meanwhile, the load lock chamber repeats pumping for forming process pressure and venting for forming atmospheric pressure, and the outer wall of the chamber may be deformed due to the pressure difference, and such deformation may appear larger as the load lock chamber becomes larger.

When the outer wall of the load lock chamber is deformed, a metal contact occurs between the valve housing coupled to the substrate loading gate and the substrate carrying gate and the outer wall of the load lock chamber, which causes a particle issue inside the load lock chamber. .

An object of the present invention is to recognize the above problems and to provide a load-lock module capable of preventing particles from being generated in the internal space of the load-lock module and a substrate processing system including the same by integrating a gate valve into the load-lock module. is in providing

In addition, another object of the present invention is to provide a load-lock module capable of improving productivity by reducing the volume of the internal space of the load-lock module and improving gas flow in the internal space of the load-lock module, and a substrate processing system including the same. are doing

The present invention has been created to achieve the object of the present invention as described above, and discloses a load lock module 200 that transfers a substrate between the outside of the atmospheric pressure and the process module 100 in which substrate processing is performed.

The load lock module 200 includes a load lock chamber 210 forming a sealed inner space S and having at least one pair of gates T for entering and exiting a substrate; a substrate support 220 installed in the load lock chamber 210 to support the substrate G introduced into the inner space S; a gas injection unit 230 for injecting an inert gas into the inner space (S); a gas exhaust unit 240 for exhausting gas in the inner space (S); a heat exchange unit 270 for temperature control of the substrate G introduced into the inner space S; It may include a gate valve unit 250 that opens and closes the gate (T).

The load lock chamber 210 may include a chamber body 212 having an open upper surface and an upper lid 214 coupled to the upper surface of the chamber body 212 to form the inner space S.

The chamber body 212 may include a chamber extension part 216 extending outward from the gate T along the substrate transfer direction D1.

The gate valve part 250 penetrates the chamber extension part 216 along the direction D2 perpendicular to the substrate transport direction and is attached to the valve seat 219 forming the edge circumference of the gate T. It may include a valve plate 252 movably installed so as to be in close contact or spaced apart.

The chamber body 212 may include a partition wall 218 that divides the inner space S vertically to form a first inner space S1 and a second inner space S2.

The substrate support part 220 and the heat exchange part 270 may be provided in the first inner space S1 and the second inner space S2, respectively.

The chamber body 212 may include two pairs of gates T respectively corresponding to the first inner space S1 and the second inner space S2.

A through hole 217 through which the valve plate 252 is installed may be formed in the chamber extension part 216 .

The gate valve unit 250 accommodates a valve rod 254 coupled to the valve plate 252, a valve driving unit 256 coupled to the valve rod 254, and the valve plate 252, A cover part 258 covering the through hole 217 may be included.

The gas injection unit 230 includes a valve block 232 having a gas flow path F therein, and at least one or more gas valves installed on the valve block 232 to open and close the gas flow path F. 234 and a diffuser 236 communicating with the gas flow path F to receive inert gas and injecting gas into the inner space S.

The diffuser 236 may be installed in a side wall inner space IS formed by penetrating the side wall of the chamber body 212 .

The gas injection unit 230 may further include a cover plate 238 for sealing the inner space S between the valve block 232 and the sidewall of the chamber body 212 .

A viewport V may be installed on the cover plate 238 .

In another aspect, the present invention, one or more process modules 100 for performing a substrate treatment for the substrate (G) in a preset process pressure state; a load lock module 200 for transferring the substrate G between the outside of the atmospheric pressure and the process module 100; Disclosed is a substrate processing system comprising a transport module 300 for transporting a substrate G between the process module 100 and the load lock module 200.

The load-lock module and the substrate processing system including the same according to the present invention integrate a gate valve into the load-lock module, so that even when the chamber body is deformed, it does not come into contact with other structures and prevents deformation of the chamber body. There is an advantage in preventing the formation of particles according to the method.

In addition, the load-lock module and the substrate processing system including the same according to the present invention can reduce the volume of the internal space of the load-lock module by removing a structure that can come into contact with the chamber body when the chamber body is deformed, and thus pumping / By minimizing the venting time and reducing the amount of gas used for venting, there is an advantage of improving the productivity of the load lock module.

In addition, the load-lock module and the substrate processing system including the same according to the present invention occupy unnecessary space in the internal space to reduce the volume of the internal space of the load-lock module and improve gas flow in the internal space of the load-lock module. By including the guide block, there is an advantage of improving the productivity of the load lock module.

1 is a plan view showing a substrate processing system according to an embodiment of the present invention.
FIG. 2 is a side view of the load lock module of the substrate processing system of FIG. 1 .
3 is a perspective view showing a chamber body of the load lock module of FIG. 2;
4 is a side view showing a heat exchange unit installed in the load lock module of FIG. 1 .
5A to 5B are bottom views illustrating the heat exchanger of FIG. 4 .
6A to 6B are cross-sectional views explaining the gate opening/closing structure and operation of the chamber body of FIG. 3 .
7 is a perspective view showing a gas injection unit installed in the load lock module of FIG. 1;
8 is a side view showing the chamber body of the load lock module of FIG. 3;
FIG. 9 is a view showing installation positions of guide blocks installed in the load-lock module of FIG. 1 .
10 is a view showing a guide space of the guide block of FIG. 9 .

Hereinafter, a load-lock module according to the present invention and a substrate processing system including the same will be described with reference to the accompanying drawings.

As shown in FIGS. 1 to 10, the substrate processing system according to the present invention includes one or more process modules 100 for performing substrate processing on a substrate G under a preset process pressure, and an external atmosphere under atmospheric pressure. and a load-lock module 200 that transfers the substrate G between the process modules 100 and a transfer module that transfers the substrate G between the process module 100 and the load-lock module 200. (300).

As shown in FIG. 1, the substrate processing system includes a process module 100 composed of a plurality of individual chambers 101 and 102 performing at least one process, and a process module 100 composed of a plurality of individual chambers 101 and 102. ) may be configured in a cluster type including the transport module 300 that commonly connects, but this is only one embodiment and is not limited thereto.

Gate valves may be installed between the transfer module 300 and the individual chambers 101 and 102 to be opened and closed under the control of a controller (not shown).

In addition, the transfer module 300 may be provided with a substrate transfer robot 310 that takes out the substrate G from the load lock module 200 and transfers it to a desired location.

The process module 100 is a place where various processes such as an etching process or a deposition process using a plasma reaction or a chemical vapor method are performed, and pumping by a vacuum pump (not shown) as a preliminary operation before the process proceeds. After setting to have a vacuum state, a pressure control valve for adjusting the vacuum pressure may be included when an actual process is performed.

Specifically, the process module 100 includes a chamber body (not shown) for forming a closed processing space in which substrate processing is performed, a substrate support unit (not shown) for supporting a substrate G, and a process gas spraying It may include a process gas injection unit (not shown) and a heating jacket (not shown) for controlling the temperature of the process module 100 .

Meanwhile, the process module 100 may include a plurality of substrate processing spaces including a plurality of individual chambers 101 and 102 to perform substrate processing such as substrate deposition and substrate etching.

The plurality of individual chambers 101 and 102 may be arranged side by side with a plurality of substrate processing spaces connected to the transfer module 300 attached side by side.

Here, the process module 100 may be formed as a plurality of individual chambers 101 and 102 to implement a plurality of substrate processing spaces, but may have two independent substrate processing spaces in one chamber. Unlike this, Of course, one process module 100 may be configured to process one substrate (S).

The transfer module 300 is positioned between the load lock module 200 and the process module 100 to transfer the substrate G to each substrate processing space of the process module 100, and various configurations are possible.

The transport module 300 has a chamber body in which a plurality of gates through which the substrate G passes are formed and a space in which the substrate G is transported is formed between the load lock module 200 and the process module 100. can include

The transfer module 300 transfers the substrate G transferred from the load lock module 200 to the process module 100 for substrate processing, and conversely, the substrate processing is completed and transferred from the process module 100. The substrate G may be transferred to the load lock module 200 .

Specifically, the transfer module 300 takes out the substrate G from the load lock module 200 and transfers it to a desired location, and takes out the substrate G from the process module 100 to the load lock module ( A substrate transfer robot 310 for transferring to 200 may be provided.

The substrate transfer robot 310 is provided in the transfer module 300, and various configurations are possible for transferring the substrate G between each process module 100 and the transfer module 300 through a plurality of gates. .

The substrate transfer robot 310 transfers the substrate G transferred from the load lock module 30 to each individual chamber 101 and 102 through a gate, and transfers the substrate G transferred from the load lock module 30 to each individual chamber 101 and 102 of the process module 100 through the gate. The substrate (G) transferred from ) is transferred to the load lock module 200.

The transfer module 300 can always maintain a process pressure state close to vacuum.

However, when the substrate (G) is transferred from the process module 100 to the transfer module 200 or from the transfer module 200 to the process module 100, particles inside the process module 100 are transported to the transfer module 300. In order to minimize the introduction, the internal pressure of the transfer module 300 may be formed in a state (low vacuum) relatively higher than the pressure of the process module 100 .

The load lock module 200 enables access to environmental conditions close to those within the transport module 200 and blocks the environmental conditions within the transport module 200 from being influenced by the outside. Various configurations are possible.

That is, the load-lock module 200 can change from a process pressure state close to vacuum to an atmospheric pressure state, or from an atmospheric pressure state to a process pressure state.

In addition, the load lock module 200 may receive a substrate G from an outside of atmospheric pressure, for example, from a loader unit (not shown) connected to a substrate storage container (not shown).

One side of the load lock module 200 may be coupled to the loader unit 400 and the other side may be coupled to the transport module 300.

After the substrate G is transported from the substrate storage container (FOUP) in the standby state through the loader unit 400, the inside of the load lock module 200 is subjected to a process pressure close to vacuum similar to that of the transfer module 300. change to state

In addition, when the substrate (G) processed in the process module 100 is transferred to the load lock module 200 through the transfer module 300, the substrate is transferred to the external substrate storage container (FOUP) through the loader unit 400 In order for (G) to be transported, the inside of the load lock module 200 is changed to atmospheric pressure.

Specifically, the load lock module 200 includes a load lock chamber 210 forming a sealed inner space S and having at least one pair of gates T for entering and exiting a substrate; and the load lock chamber ( 210) and a substrate support 220 for supporting the substrate G introduced into the inner space S, a gas injection part 230 for injecting an inert gas into the inner space S, A gas exhaust unit 240 for exhausting gas in the inner space (S), a heat exchanger 270 for temperature control of the substrate (G) introduced into the inner space (S), and the gate (T) It may include a gate valve unit 250 that opens and closes.

As shown in FIGS. 1 to 3 , the load lock modules 200 may be configured as a pair, and the pair of load lock modules 200 may be disposed side by side on one side of the transport module 300. can

The load lock chamber 210 is a housing that forms an airtight inner space S and includes at least one pair of gates T for entering and exiting a substrate, and various configurations are possible.

The one or more pairs of gates T may be formed along the substrate transport direction D1 (substrate transport direction) of the substrate G.

The substrate transfer direction D1 may be defined as a direction parallel to a movement path through which the substrate G moving in and out of the load lock chamber 210 moves.

The one or more pairs of gates T are openings opened and closed by a gate valve unit 250 to be described later, and a first gate T1 corresponding to the side of the loader unit 400 and a side corresponding to the transfer module 300 A second gate T2 may be included.

When the load lock chamber 210 is formed in a hexahedral shape, the one or more pairs of gates T may be provided on a pair of opposite sidewalls of the load lock chamber 210 .

When the load lock chamber 210 consists of a plurality of independent substrate processing areas, the pair of gates T may be formed in plural to correspond to the substrate processing areas.

The load lock chamber 210 shown in FIGS. 1 to 10 shows an embodiment in which two pairs of gates T are formed at a vertical interval.

The load lock chamber 210 may have a rectangular (hexahedral shape) shape in plan, but is not limited thereto.

At this time, the load lock chamber 210 may be configured to form a plurality of independent substrate processing areas corresponding to the plurality of process modules 100 or to process a plurality of substrates G in one substrate processing area. there is.

The load lock chamber 210 may include a chamber body 212 having an open upper surface and an upper lid 214 coupled to the upper surface of the chamber body 212 to form the inner space S.

The chamber body 212 may be integrally formed as a single member.

When the lower surface of the chamber body 212 is opened, the load lock chamber 210 may further include a lower lid 213 coupled to the lower surface of the chamber body 212 .

For example, the chamber body 212 may include a partition wall 218 that divides the inner space S vertically to form a first inner space S1 and a second inner space S2.

The first inner space S1 and the second inner space S2 may be substrate processing areas independent of each other.

At this time, the chamber body 212 may include two pairs of gates T respectively corresponding to the first inner space S1 and the second inner space S2.

The substrate support part 220 is installed in the load lock chamber 210 to support the substrate G introduced into the inner space S, and various configurations are possible.

When the load lock chamber 210 consists of a plurality of independent substrate processing areas, a plurality of substrate support units 220 may be provided to correspond to the substrate processing areas.

That is, the substrate support part 220 may be provided in each of the first inner space S1 and the second inner space S2.

In addition, as shown in FIG. 2 , the substrate support part 220 may be configured to support a plurality of substrates G spaced vertically and stacked in one substrate processing area.

To this end, the substrate support unit 220 includes a plurality of substrate support members 222 installed at a vertical interval and supporting the lower surface of the substrate G, and a vertical movement of the plurality of substrate support members. A drive unit 224 may be included.

The up-and-down driving part 224 of the substrate support part 220 installed in the first inner space S1 is installed on the side of the upper lead 214, and a rod passing through the upper lead 214 is coupled to the substrate support member, so that the substrate The support member 222 may move up and down.

Conversely, the vertical driving part 224 of the substrate support 220 installed in the second inner space S2 located below the first inner space S1 is installed on the side of the lower lead 213 to move the lower lead 213 As the rod passing through is coupled to the substrate support member 222, the substrate support member can move up and down.

The gas injection unit 230 is a configuration for injecting an inert gas into the inner space (S), and various configurations are possible.

The gas injection unit 230 is installed in the chamber body 212 by injecting an inert gas into the inner space (S) to change the inner space (S) from a process pressure state to an atmospheric pressure state, and the substrate (G) It can also perform a cooling function of cooling.

The inert gas is a gas for venting/purging the inner space S, and may be, for example, N2 gas.

The inert gas is for the purpose of pressure change/purging of the internal space of the load lock chamber 210, but at the same time, heat of members that may occur when the heated substrate G is discharged as it is introduced from the process module 100. It also has the purpose of cooling the substrate (G) to a preset temperature in order to prevent damage (thermal damage) and the like.

For example, the gas injection unit 230 includes a valve block 232 having a gas flow path F therein, and at least one installed on the valve block 232 to open and close the gas flow path F. The above gas valve 234 and a diffuser 236 communicating with the gas flow path F to receive inert gas and injecting gas into the inner space S may be included.

The valve block 232 is a body portion having a gas flow path F therein, and various configurations are possible.

The valve block 232 includes one or more gas supply lines PL for supplying an inert gas (venting gas) from an external gas source (not shown) and one or more gas supply lines for supplying an inert gas (purge gas). A line SL may be coupled.

For example, the gas supply lines PL and SL may include a first gas supply line communicating with the first inner space S1 and a second gas supply line communicating with the second inner space S2. .

As another example, the gas supply lines PL and SL may be configured as a single line to communicate with both the first inner space S1 and the second inner space S2.

The gas flow path F is a flow path through which the inert gas flows in the valve block 232, and may be a flow path formed by forming a single path or branching in various ways.

When the internal space (S) of the load lock chamber 210 is partitioned into a first internal space (S1) and a second internal space (S2), the gas flow path (F) supplies gas to the first internal space (S1). It may consist of a gas flow path for injecting gas and a gas flow path for injecting gas into the second inner space (S2).

The gas valve 234 is an on-off valve installed on the valve block 232 to open and close the gas flow path F, and various configurations are possible.

When the internal space (S) of the load lock chamber 210 is partitioned into a first internal space (S1) and a second internal space (S2), the gas valve 234 operates in the first internal space (S1) and the second internal space (S1). In order to independently control gas injection into the inner space (S2), a plurality may be provided to correspond to the first inner space (S1) and the second inner space (S2).

That is, by installing one or a plurality of gas valves 234 in the gas passage for injecting gas into the first inner space S1, the gas injection into the first inner space S1 can be controlled.

Similarly, by installing one or a plurality of gas valves 234 in the gas passage for injecting gas into the second inner space S2, gas injection into the first inner space S1 can be controlled.

The diffuser 236 can have various configurations for injecting gas into the inner space (S), communicates with the gas flow path (F), receives inert gas, and injects gas into the inner space (S). can

The diffuser 236 has a gas diffusion space formed therein, and the gas diffusion space may communicate with the gas flow path F of the valve block 232 through the end connector 236a of the diffuser 236.

The diffuser 236 may be formed in various shapes such as a bar shape having a length, an angular shape, and a cylindrical shape. In addition, a plurality of gas ejection holes may be formed on an outer circumferential surface of the diffuser 236 to eject gas from an internal gas diffusion space.

At this time, the diffuser 236 may be installed parallel to the substrate transfer direction D1 on a side surface of the chamber body 212 where the gate T of the chamber body 212 is not formed.

For example, when the chamber body 212 is formed in the shape of a hexahedron and a pair of gates T are provided on a pair of opposite side surfaces of the chamber body 212, the diffuser 236 has a gate T Can be installed on the side adjacent to the side provided with.

More specifically, the diffuser 236 may be installed in the side wall inner space IS formed by penetrating the side wall of the chamber body 212 .

To this end, a side wall opening 212a forming a side wall inner space IS for installing the diffuser 236 may be formed in the side wall of the chamber body 212 .

The sidewall opening 212a may be formed in various shapes and sizes according to the installation direction and shape of the diffuser 236 .

At this time, the gas injection unit 230 may further include a cover plate 238 for sealing the inner space S between the valve block 232 and the sidewall of the chamber body 212. .

The cover plate 238 may be a sealing plate for sealing the side wall opening 212a formed in the side wall of the chamber body 212 .

A valve block 232 may be fixedly installed on the cover plate 238 .

In addition, a viewport V for monitoring the inner space S of the load lock chamber 210 may be installed on the cover plate 238 .

Through the view port V and the side wall opening 212a, it is possible to check the inner space S from the outside of the load lock chamber 210.

The diffuser 236 is located in the side wall inner space IS formed by penetrating the side wall of the chamber body 212, so that convenient installation and maintenance can be performed without interfering with other structures installed in the inner space S. And, the inert gas injected from the diffuser 236 is more effectively diffused in the direction toward the substrate G by the side wall of the chamber body 212 and the rear cover plate 238 surrounding the diffuser 236 (gas flow improvement) Therefore, there is an advantage in that the substrate cooling effect (cooling speed, cooling time, temperature uniformity) using an inert gas can be further improved.

The gas exhaust unit 240 has various configurations for exhausting the gas in the internal space (S), and exhausts the gas in the internal space (S) to change the atmospheric pressure state to a process pressure state. can do.

The gas exhaust unit 240 may include a gas exhaust line 242 coupled to the load lock chamber 210 and a vacuum pump 244 connected to the gas exhaust line 242 .

As shown in FIG. 2 , when the substrate processing system includes a pair of load-lock modules 200, the gas exhaust unit 240 connects the pair of load-lock modules 200 to one vacuum pump 244. ) may include a common exhaust line for exhausting.

The heat exchanging unit 270 is a configuration for temperature control (cooling or heating) of the substrate G introduced into the inner space S, and various configurations are possible.

When the internal space (S) of the load lock chamber 210 is partitioned into a first internal space (S1) and a second internal space (S2), the heat exchange unit 270, as shown in FIG. 4, The first inner space (S1) and the second inner space (S2) may be provided respectively.

For example, referring to FIGS. 5A and 5B , the heat exchange unit 270 is embedded in a heat exchange plate 272 formed in a planar shape corresponding to the substrate G and the heat exchange plate 272, and can be accessed from the outside. A heat medium passage 274 through which the supplied heat medium flows, and a heat medium port 276 for supplying/discharging the heat medium to the heat medium passage 274 may be included.

The heat exchange plate 272 may be formed in a planar shape corresponding to the substrate G, and may be, for example, a heat conducting plate formed in a disk shape.

The heat exchange plate 272 may have a seating surface on which the substrate G is seated.

It is fixed in the inner space (S) of the heat exchange plate 272, and the distance between the substrate G supported by the substrate support 220 and the heat exchange plate 272 is variable by the vertical movement of the substrate support 220. can

The heat medium passage 274 is a passage formed inside the heat exchange plate 272, and the heat medium flows along the heat medium passage 274 to cool or heat the substrate G.

The heat medium port 276 may include an inlet port 276a for supplying the heat medium to the heat medium passage 274 and an outlet port 276b for discharging the heat medium flowing out along the heat medium passage 274.

The inlet port 276a and the outlet port 276b may be arranged next to each other in an outer region of the heat exchange plate 272 .

On the other hand, as shown in FIG. 4, when the heat exchanger 270 is provided in the first inner space S1 and the second inner space S2, respectively, it is installed in the first inner space S1. The heat exchanger 270 and the heat medium port 276 of the heat exchanger 270 installed in the second inner space S2 may be installed in an area where they do not interfere with each other on a plane.

For example, the heat exchanger 270 shown in FIG. 5A is a heat exchanger 270 installed in the first inner space S1, and the heat exchanger 270 shown in FIG. 5B is the first inner space S1. It may be the heat exchange unit 270 installed in the second inner space (S2) located on the lower side.

As shown in FIG. 5A, the heat exchanger port 276 of the heat exchanger 270 installed in the first inner space S1 has a heat transfer port 276 of the heat exchanger 270 installed in the second inner space S2. ), the heat medium passage 274 may include an extension passage 275 further extended to the outside.

Meanwhile, the chamber body 212 may include a chamber extension part 216 extending outward from the gate T along the substrate transfer direction D1.

Since the chamber body 212 is a single member integrally formed, the chamber extension 216 should also be understood as an area integrally formed with the chamber body 212 .

The chamber extension part 216 is formed to extend outward from the gate T along the substrate transfer direction D1, thereby forming a gate module for opening and closing the gate T together with the gate valve part 250 to be described later. can

The chamber extension part 216 extends along the substrate transfer direction D1 and may form a passage through which the substrate G moves.

The gate valve unit 250 is a valve that opens and closes the gate T, is a component of the load lock module 200, and may be integrally formed with the load lock chamber 210.

Specifically, the gate valve part 250 penetrates the chamber extension part 216 along a direction D2 perpendicular to the substrate transport direction D1, and forms an edge circumference of the gate T. It may include a valve plate 252 movably installed so as to come into close contact with or spaced apart from the valve seat 219 .

The valve plate 252 is a valve plate penetrating the chamber extension part 216 along a direction D2 perpendicular to the substrate transfer direction D1, and various configurations are possible.

To this end, a through hole 217 through which the valve plate 252 is installed may be formed in the chamber extension part 216 .

When the chamber body 212 is provided with two pairs of upper and lower gates T, the gate valve unit 250 may also be installed to correspond to each gate T, and the through hole 217 is also shown in FIGS. 6A to 6A. As shown in FIG. 6B, it may be formed on the upper and lower surfaces of the chamber extension 216, respectively.

Since the valve seat 219 to which the valve plate 252 installed through the through-hole 217 of the chamber extension 216 is in close contact is around the edge of the gate T, in the present invention, the valve seat 219 is a chamber It may be provided on the main body 212 .

That is, in the present invention, the valve plate 252 may be configured to open and close the gate T by being directly attached to the chamber body 212 of the load lock chamber 210, rather than a separate valve housing or connector member.

In addition, the gate valve unit 250 includes a valve rod 254 coupled to the valve plate 252, a valve driving unit 256 coupled to the valve rod 254, and the valve plate 252. A cover part 258 accommodating and covering the through hole 217 may be included.

The valve driving unit 256 is installed outside the chamber body 210 with the cover unit 258 as a boundary, and is coupled to the valve plate 252 through the driving rod 357 to form a gate (T) to the valve plate 252. A driving force for opening and closing can be transmitted.

The cover part 258 forms a moving space of the valve plate 252 and is a sealing plate that seals the inner space S of the chamber body 210, and various configurations are possible.

In the present invention, the valve seat to which the valve plate 252 is in close contact is formed on the chamber body 212 of the load-lock module 200, not on a separate valve housing or connector member, thereby solving problems due to a separate valve housing or connector member. There is an advantage of improving (friction between the valve housing (connector member) and the chamber body, particles, deformation, increase in the internal volume of the chamber body).

Meanwhile, the load lock module 200 occupies the inner space S and guides the gas injected from the diffuser 236 toward the substrate G seated on the substrate support 220. (GS) may further include a guide block 260 forming.

The guide block 260 may be installed in a position where it does not interfere with a moving area in which the substrate G is moved on a flat surface for substrate entry and exit.

In addition, the guide block 260 may be installed at a position where the substrate support 220 does not interfere with the vertical movement and the structure therefor.

For example, as shown in FIG. 9 , the guide block 260 may be a block member having a length along the sidewall of the chamber body 212 on which the diffuser 236 is installed.

The guide block 260 occupies the inner space (S) of the load lock chamber 210, thereby reducing the volume of the inner space (S), and as a result, substrate processing in the load lock chamber 210 is required. Productivity can be improved by reducing the required pumping/venting time and the amount of inert gas required.

At this time, the guide block 260 may be installed between the substrate support 220 and the diffuser 236 and fixedly coupled to the upper surface of the heat exchange plate 272 .

The guide block 260 forms a guide space GS for guiding the gas injected from the diffuser 236 toward the substrate G seated on the substrate support 220, Gas flow toward the substrate G can also be improved.

The guide space GS may be formed in various ways as long as a gas movement path can be formed between the substrate support 220 and the diffuser 236 .

For example, as shown in FIG. 10/, the guide space GS is a part of the lower portion of the guide block 260, excluding the coupling portion 262 where the guide block 260 is coupled to the heat exchange plate 272. It may be formed by removing and sinking, but this is only showing possible embodiments, and it is clear that the present invention is not limited thereto.

Since the above has only been described with respect to some of the preferred embodiments that can be implemented by the present invention, as noted, the scope of the present invention should not be construed as being limited to the above embodiments, and the scope of the present invention described above It will be said that the technical idea and the technical idea together with the root are all included in the scope of the present invention.

100: process module
200: load lock module
300: transport module

Claims (10)

As a load lock module 200 that transfers a substrate between the outside of the atmospheric pressure and the process module 100 in which substrate processing is performed,
a load lock chamber 210 forming a sealed inner space S and having at least one pair of gates T for entering and exiting a substrate; a substrate support 220 installed in the load lock chamber 210 to support the substrate G introduced into the inner space S; a gas injection unit 230 for injecting an inert gas into the inner space (S); a gas exhaust unit 240 for exhausting gas in the inner space (S); a heat exchange unit 270 for temperature control of the substrate G introduced into the inner space S; It includes a gate valve unit 250 for opening and closing the gate (T),
The load lock chamber 210 includes a chamber body 212 having an open upper surface and an upper lid 214 coupled to the upper surface of the chamber body 212 to form the inner space S,
The chamber body 212 has a chamber extension part 216 extending outward from the gate T along the substrate transfer direction D1,
The gate valve part 250 penetrates the chamber extension part 216 along the direction D2 perpendicular to the substrate transport direction and is attached to the valve seat 219 forming the edge circumference of the gate T. The load-lock module 200, characterized in that it includes a valve plate 252 movably installed so as to be in close contact or spaced apart. The method of claim 1,
The chamber body 212 includes a partition wall 218 that divides the inner space S vertically to form a first inner space S1 and a second inner space S2,
The load-lock module (200), characterized in that the substrate support part (220) and the heat exchange part (270) are respectively provided in the first inner space (S1) and the second inner space (S2). The method of claim 1,
The chamber body 212 includes two pairs of gates T respectively corresponding to the first inner space S1 and the second inner space S2. The method of claim 1,
The load-lock module (200), characterized in that a through-hole (217) through which the valve plate (252) is installed is formed in the chamber extension (216). The method of claim 4,
The gate valve unit 250 accommodates a valve rod 254 coupled to the valve plate 252, a valve driving unit 256 coupled to the valve rod 254, and the valve plate 252, The load lock module 200, characterized in that it comprises a cover portion 258 covering the through hole 217. The method of claim 1,
The gas injection unit 230 includes a valve block 232 having a gas flow path F therein, and at least one or more gas valves installed on the valve block 232 to open and close the gas flow path F. (234) and a diffuser (236) communicating with the gas flow path (F) to receive inert gas and injecting gas into the internal space (S). The method of claim 6,
The diffuser 236 is a load lock module (200), characterized in that installed in the side wall inner space (IS) formed by penetrating the side wall of the chamber body (212). The method of claim 7,
The gas injection unit 230 further comprises a cover plate 238 for sealing the inner space S between the valve block 232 and the sidewall of the chamber body 212. Load lock module (200). The method of claim 8,
The load lock module (200), characterized in that the viewport (V) is installed on the cover plate (238). one or more process modules 100 for performing substrate processing on a substrate G in a preset process pressure state; A load lock module 200 according to any one of claims 1 to 9 for transferring the substrate G between the outside of the atmospheric pressure and the process module 100; A substrate processing system comprising a transport module 300 for transporting the substrate G between the process module 100 and the load lock module 200.

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