KR20240067406A - Loadlock module and substrate processing system having the same - Google Patents

Abstract

The present invention relates to a load lock module and a substrate processing system including the same.
The present invention includes a load lock chamber (210) forming an internal space (S) and having at least one gate (T) for entering and exiting a substrate; a substrate support portion 220 installed in the load lock chamber 210 to support the substrate (G) introduced into the internal space (S); a substrate cooling unit 230 for cooling the substrate (G) introduced into the internal space (S); Disclosed is a load lock module 200 that faces the substrate cooling unit 230 at a vertical distance and includes a substrate heating unit 240 for heating a substrate (G) introduced into the internal space (S).

Description

Loadlock module and substrate processing system including the same {Loadlock module and substrate processing system having the same}

The present invention relates to a load lock module and a substrate processing system including the same.

A semiconductor substrate processing device that performs a chemical vapor deposition process generally includes a plurality of process chambers that perform a substrate processing process and a device that allows the substrate to enter the process chamber before the substrate enters the process chamber. There is a load lock chamber that creates an environment, and a robot arm that connects the process chamber and the load lock chamber and transfers the substrates in the load lock chamber to the corresponding process chamber or transfers the substrates in the process chamber to the load lock chamber. Includes an installed transfer chamber.

The process chamber generally performs a substrate processing process at high temperature and process pressure close to vacuum. At this time, because it is difficult to enter the substrate at atmospheric pressure into the process chamber at high temperature and process pressure, it is necessary to create the same environment as the process chamber before transferring the substrate to the process chamber. This is the load lock chamber.

That is, the load lock chamber refers to a chamber that receives a substrate in a state substantially the same as the environment of the process chamber or the external environment before the substrate is introduced into the process chamber from the outside or before the substrate is taken out from the process chamber.

In the case of conventional substrate processing equipment, efforts are being made to improve productivity by eliminating bottlenecks in the process chamber by increasing the number of process chambers.

Regardless of the method, if the bottleneck in the process chamber is resolved, the productivity of the load lock chamber becomes the bottleneck of the entire system.

Meanwhile, substrate processing in the load lock chamber involves opening the substrate loading gate from the transfer chamber, loading the substrate, closing the substrate loading gate, injecting venting gas, opening the substrate loading gate to atmospheric transfer, substrate loading, etc., which is carried out in a short period of time. It refers to a series of processes leading to the closing of the substrate unloading gate.

For this purpose, a gate valve for opening and closing the gate may be coupled to the substrate loading gate and substrate loading gate of the load lock chamber.

In order to proceed with the substrate processing process, the substrate may be heated and processed in a process chamber. At this time, a lot of time may be required to heat the substrate to meet the process conditions, which is a factor that reduces the productivity of the entire substrate processing system. It can be.

If the high-temperature substrate, which moves into the atmosphere through the load lock module after the process is completed, is not cooled sufficiently and is released into the atmosphere, there is a possibility that the substrate may be damaged due to rapid temperature changes. To prevent this, it is necessary to quickly cool it to the appropriate temperature.

While transferring a substrate that was not sufficiently cooled after the substrate processing process in the process chamber, members affected by thermal damage become deformed or melted, making it difficult to perform their original function or leaving traces on the substrate. When buried, it acts as a particle (contaminant) in chip manufacturing and can become a factor that can cause defects in semiconductor products.

The purpose of the present invention is to recognize the above problems and needs, and to reduce the time required for heating the substrate by pre-heating the substrate and delivering it to the process module, thereby reducing the process time and increasing productivity, including a load lock module and the same. The purpose is to provide a substrate processing system that

In addition, the purpose of the present invention is to install both a substrate heating unit for substrate heating and a substrate cooling unit for cooling in the load lock module, so that substrates that have completed the process can be cooled and discharged from the load lock module without a separate buffer space for substrate cooling. The aim is to provide a load lock module and a substrate processing system including the same.

The present invention was created to achieve the object of the present invention as described above, and includes a load lock chamber (210) forming an internal space (S) and having at least one gate (T) for entering and exiting a substrate; a substrate support portion 220 installed in the load lock chamber 210 to support the substrate (G) introduced into the internal space (S); a substrate cooling unit 230 for cooling the substrate (G) introduced into the internal space (S); Disclosed is a load lock module 200 that faces the substrate cooling unit 230 at a vertical distance and includes a substrate heating unit 240 for heating a substrate (G) introduced into the internal space (S).

The substrate support unit 220 is coupled to the substrate support bracket 222, which is located between the substrate cooling unit 230 and the substrate heating unit 240, and the substrate G. It may include a substrate seating portion 224 that forms a seating surface on which the substrate is seated, and a lifting drive portion 226 that drives the substrate support bracket 222 to rise and fall.

The substrate seating portion 224 may include a first substrate seating portion 224a and a second substrate seating portion 224b installed at vertical intervals.

The substrate support portion 220 is installed between the first substrate seating portion 224a and the second substrate seating portion 224b for thermal insulation between the substrate cooling portion 230 and the substrate heating portion 240. It may include an insulating part 228.

The substrate cooling unit 230 may be installed on the lower side of the internal space (S).

The substrate heating unit 240 may be installed on the upper side of the internal space (S).

The substrate heating unit 240 may be a halogen lamp heater.

The load lock chamber 210 may include a partition wall 212a that divides the internal space S into an upper first space S1 and a lower second space S2.

The substrate support portion 220 includes a first substrate support portion 220a installed in the first space S1 through the upper wall 214 of the load lock chamber 210 and a lower portion of the load lock chamber 210. It may include a second substrate support portion 220b installed in the second space S2 through the wall 216.

The substrate cooling unit 230 and the substrate heating unit 240 may be installed to vertically overlap the substrate G seated on the substrate support unit 220.

The lifting unit 226 may be coupled to the substrate support bracket 222 on the outside of the substrate cooling unit 230 and the substrate heating unit 240.

The substrate support portion 220 may further include a horizontal adjustment member 229 for maintaining the level of the substrate G mounted on the substrate seating portion 224.

The horizontal adjustment member 229 may be interposed on the coupling surface between the substrate support bracket 222 and the substrate seating portion 224.

The substrate support bracket 222 may be formed in a ring shape with an open center so that the substrate G on which it is seated faces the substrate cooling unit 230 and the substrate heating unit 240.

The first substrate seating portion 224a and the second substrate seating portion 224b include a plurality of support members (SP) disposed along the circumference of the substrate support bracket 222 and protruding inward to form the seating surface. may include.

The load lock module 200 further includes a gas injection unit 250 for injecting an inert gas into the internal space (S) and a gas exhaust unit 260 for exhausting gas from the internal space (S). It can be included.

In another aspect, the present invention includes one or more process modules 100 that perform substrate processing on a substrate G under a preset process pressure; a load lock module (200) that transfers the substrate (G) between the process module (100) and the outside at atmospheric pressure; Disclosed is a substrate processing system comprising a transfer module 300 that transfers a substrate G between the process module 100 and the load lock module 200.

The load lock module and the substrate processing system including the same according to the present invention install a substrate heating unit in the load lock module to heat the substrate in advance and deliver it to the process module, thereby reducing the time required for substrate heating, thereby reducing process time and increasing productivity. There are benefits to increasing it.

In addition, the load lock module and the substrate processing system including the same in the present invention install both a substrate heating unit for substrate heating and a substrate cooling unit for cooling in the load lock module, without a separate buffer space for substrate cooling. There is an advantage in that the processed substrate can be cooled and discharged.

In addition, the load lock module and the substrate processing system including the same according to the present invention install a heat sink that blocks radiant heat to prevent thermal interference that may occur between the substrate heating unit and the substrate cooling unit using radiant heat, thereby simultaneously It has the advantage of improving productivity by enabling substrate heating and cooling.

In addition, the load lock module and the substrate processing system including the same according to the present invention can keep the position of the end effector of the transfer robot constant when entering and exiting the substrate by driving the substrate supporter that supports the substrate within the load lock module up and down, and the resulting By minimizing the transfer amount in the Z-axis direction of the transfer robot, cost reduction and stability of the transfer robot can be greatly improved, and footprint reduction and productivity can be achieved by reducing the size of the opening and internal volume of the gate valve for board entry and exit. It can contribute to improvement.

In addition, the load lock module and the substrate processing system including the same according to the present invention ensure uniform heating of the substrate by allowing the substrate to be supported facing the substrate heating unit and the substrate cooling unit horizontally within the load lock module. and has the advantage of being capable of cooling.

1 is a plan view showing a substrate processing system according to an embodiment of the present invention.
FIG. 2 is a side view of the load lock module of the substrate processing system of FIG. 1.
Figure 3 is a perspective view showing the chamber main body of the load lock module of Figure 2.
FIG. 4 is an enlarged perspective view showing a partial configuration of a substrate support portion installed in the load lock module of FIG. 2.
FIG. 5 is an enlarged cross-sectional view showing an enlarged cross-section of a portion of the substrate support portion of FIG. 4.
Figure 6 is a side view showing the phenomenon of the substrate support installed in the load lock module of Figure 2 sagging due to its own weight.
Figure 7 is an exploded perspective view showing the horizontal adjustment member installed on the substrate support part of Figure 6.

Hereinafter, the load lock module and the substrate processing system including the same according to the present invention will be described with reference to the attached drawings.

As shown in FIGS. 1 to 7, the substrate processing system according to the present invention includes at least one process module 100 that performs substrate processing on the substrate G at a preset process pressure, and a process module 100 at atmospheric pressure. A load lock module 200 that transfers the substrate (G) between the outside and the process module 100, and a transport that transfers the substrate (G) between the process module 100 and the load lock module 200. It may include a module 300.

As shown in FIG. 1, the substrate processing system includes a process module 100 consisting of a plurality of individual chambers 101 and 102 that perform at least one process, and a process module 100 consisting of a plurality of individual chambers 101 and 102. ) can be configured as a cluster type including a transport module 300 that commonly connects, but this is only one system layout to which the load lock module 200 according to the present invention can be applied, and the present invention It is not limited.

A gate valve that is opened and closed under the control of a control unit (not shown) may be installed between the transfer module 300 and each individual chamber 101 and 102.

In addition, the transfer module 300 may be equipped with a substrate transfer robot 310 that withdraws the substrate G from the load lock module 200 and transfers it to a required predetermined location.

The process module 100 is a place where various processes such as an etching process or a deposition process using a plasma reaction or chemical vapor method are performed. Before the process proceeds, the process module 100 is pumped by a vacuum pump (not shown) as a preliminary operation. After being set to have a vacuum state, a pressure control valve may be included to control the vacuum pressure when the actual process is performed.

Specifically, the process module 100 includes a chamber body (not shown) that forms a closed processing space in which substrate processing is performed, a substrate supporter (not shown) that supports the substrate (G), and a device that sprays process gas. It may include a process gas injection unit (not shown) and a heating jacket (not shown) that controls the temperature of the process module 100.

Meanwhile, the process module 100 may be provided with a plurality of substrate processing spaces, including a plurality of individual chambers 101 and 102, where substrate processing such as substrate deposition and substrate etching is performed.

The plurality of individual chambers 101 and 102 may be arranged side by side, and a plurality of substrate processing spaces connected to the transfer module 300 may be arranged side by side.

Here, the process module 100 may be composed of a plurality of individual chambers 101 and 102 to implement a plurality of substrate processing spaces, but may have two independent substrate processing spaces within one chamber. In contrast, Of course, one process module 100 may be configured to process one substrate (S).

The transfer module 300 is located between the load lock module 200 and the process module 100 and transports the substrate G to each substrate processing space of the process module 100. Various configurations are possible.

The transfer module 300 is a chamber body that has a plurality of gates through which the substrate G passes and forms a space through which the substrate G is transferred between the load lock module 200 and the process module 100. It can be included.

The transfer module 300 transfers the substrate (G) transferred from the load lock module 200 to the process module 100 for substrate processing, and conversely, the substrate G transferred from the process module 100 after substrate processing is completed. The substrate (G) can be transferred to the load lock module (200).

Specifically, the transfer module 300 pulls out the substrate (G) from the load lock module 200 and transfers it to a required predetermined position, and pulls out the substrate (G) from the process module 100 to load the load lock module ( A substrate transfer robot 310 may be provided to transfer the substrate to 200).

The substrate transfer robot 310 is provided in the transfer module 300, and can be configured in various configurations to transfer the substrate (G) between each process module 100 and the transfer module 300 through a plurality of gates. .

The substrate transfer robot 310 transfers the substrate G transferred from the load lock module 30 to each individual chamber 101 and 102 through the gate, and each individual chamber 101 and 102 of the process module 100 through the gate. ) The substrate (G) transferred from ) is transferred to the load lock module (200).

The transfer module 300 can always maintain a process pressure close to vacuum.

However, when transferring the substrate (G) from the process module 100 to the transfer module 200 or from the transfer module 200 to the process module 100, particles inside the process module 100 are transferred to the transfer module 300. In order to minimize intrusion, the internal pressure of the transfer module 300 may be set to be relatively higher (low vacuum) than the pressure of the process module 100.

The load lock module 200 is configured to allow access to environmental conditions close to those within the transfer module 200 and to block the environmental conditions within the transfer module 200 from being influenced by the outside. Various configurations are possible.

That is, the load lock module 200 can change from a process pressure state close to vacuum to an atmospheric pressure state, or from an atmospheric pressure state to a process pressure state.

Additionally, the load lock module 200 may receive the substrate G from the outside at atmospheric pressure, for example, from the loader unit 400 connected to a substrate storage container (FOUP).

One side of the load lock module 200 may be coupled to the loader unit 400 and the other side may be coupled to the transfer module 300.

After the substrate (G) is transferred from the substrate storage container (FOUP) in a standby state through the loader unit 400, the inside of the load lock module 200 is subjected to a process pressure close to vacuum, similar to that of the transfer module 300. changes to the state.

In addition, when the substrate (G) processed in the process module 100 is transferred to the load lock module 200 through the transfer module 300, the substrate is transferred to the external substrate storage container (FOUP) through the loader unit 400. In order to transfer (G), the inside of the load lock module 200 changes to atmospheric pressure.

Specifically, the load lock module 200 includes a load lock chamber 210 that forms a sealed internal space (S) and has at least one gate (T) for entering and exiting a substrate, and the load lock chamber (210). ) and a substrate support unit 220 for supporting the substrate G introduced into the internal space S, and a substrate cooling unit 230 for cooling the substrate G introduced into the internal space S. and; It may include a substrate heating unit 240 that faces the substrate cooling unit 230 at a vertical distance and is configured to heat the substrate G introduced into the internal space S.

The load lock module 200 may be composed of a left and right pair, as shown in FIGS. 1 to 3, and the pair of load lock modules 200 are arranged side by side on one side of the transfer module 300. It can be.

The load lock chamber 210 is a housing that forms a sealed internal space (S) and has at least one gate (T) for entering and exiting a substrate, and can be configured in various ways.

The gates T are provided as a pair, and may be formed along the substrate transfer direction of the substrate G (the arrow direction in FIG. 1) and may be gates for loading and unloading the substrate, respectively.

The gate (T) is an opening that is opened and closed by a gate valve, which will be described later, and includes a first gate (T) corresponding to the loader unit 400 side and a second gate (T) corresponding to the transfer module 300 side. It can be included.

When the load lock chamber 210 is formed in a hexahedral shape, the pair of gates T may be provided on a pair of opposing side walls of the load lock chamber 210.

Of course, when the load lock chamber 210 forms a plurality of independent internal spaces (S1, S2), the gate (T) can also be formed in plurality to correspond to each internal space (S1, S2). As an example, the load lock chamber 210 shown in FIGS. 1 to 10 has an embodiment in which two pairs of gates T are formed at upper and lower intervals by forming two independent internal spaces S1 and S2 at the top and bottom. It is shown.

The load lock chamber 210 may have a hexahedral shape, but is not limited thereto.

At this time, the load lock chamber 210 may be configured to form a plurality of independent substrate processing areas corresponding to a plurality of process modules 100 or to process a plurality of substrates G in one substrate processing area. there is.

The load lock chamber 210 may include a chamber body 212 with an open upper surface and an upper lid 214 coupled to the upper surface of the chamber body 212 to form an internal space (S).

The chamber body 212 may be integrally formed as a single member.

When the bottom of the chamber body 212 is open, the load lock chamber 210 may additionally include a lower lid 216 coupled to the bottom of the chamber body 212.

At this time, the chamber body 212 may include a partition wall 212a that divides the internal space S up and down to form a first space S1 and a second space S2.

The first space (S1) may be an upper space of the internal space (S), and the second space (S2) may be a lower space of the internal space (S).

The first space (S1) and the second space (S2) form separate substrate processing spaces, and accordingly, the load lock module 200 can configure an upper and lower two-stage substrate processing system.

A gate valve for opening and closing may be installed on the gate (T) of the load lock module 200.

The gate valve is a valve for opening and closing the gate (T) and is a part of the load lock module 200, and the housing of the gate valve may be formed integrally with the load lock chamber 210.

For example, the gate valve includes a valve blade that is movably installed to be in close contact with or spaced apart from the valve seat forming the edge of the gate (T), a valve rod coupled to the valve blade, and a valve blade connected to the valve rod. It may include a valve driving part that operates.

Meanwhile, the load lock module 200 further includes a gas injection unit 250 for injecting inert gas into the internal space (S) and a gas exhaust unit 260 for exhausting gas from the internal space (S). It can be included.

The gas injection unit 250 is installed in the chamber main body 212, and can change the internal space (S) from a process pressure state to an atmospheric pressure state by injecting an inert gas into the internal space (S), and injects an inert gas into the internal space (S). ) can also perform a cooling function.

The inert gas is a venting gas for venting the internal space (S), and may be, for example, N2 gas.

The inert gas is intended to change the pressure of the internal space of the load lock chamber 210, but at the same time, it is introduced from the process module 100 and causes heat damage to the members that may occur when the heated substrate (G) is discharged as is ( It may also have the purpose of cooling the substrate G to a preset temperature in order to prevent thermal damage, etc.

For example, the gas injection unit 250 includes a valve block having a gas flow path therein, at least one gas valve installed on the valve block to open and close the gas flow path, and communicating with the gas flow path to make it inert. It may include a diffuser that receives gas and sprays the gas into the internal space (S).

When the internal space (S) of the load lock chamber 210 is divided into a first space (S1) and a second space (S2), the diffuser may be installed correspondingly to each space (S1, S2), respectively. Inert gas injection can be controlled independently.

The diffuser has a gas diffusion space formed therein, and may be formed in various shapes such as a long bar shape, square shape, or cylindrical shape. Additionally, a plurality of gas injection holes may be formed on the outer peripheral surface of the diffuser to spray gas from the internal gas diffusion space.

When the chamber body 212 is formed in a hexahedral shape, the diffuser may be installed on a side adjacent to the side where the gate T is provided.

The gas exhaust unit 260 is configured to exhaust gas from the internal space (S) and can be configured in various ways, and exhausts gas into the internal space to change the internal space (S) from atmospheric pressure to process pressure. can do.

The gas exhaust unit 260 may include a gas exhaust line 262 coupled to the load lock chamber 210 and a vacuum pump 264 connected to the gas exhaust line 262.

As shown in FIG. 2, when the substrate processing system includes a pair of load lock modules 200 arranged side by side, the gas exhaust unit 260 connects the pair of load lock modules 200 to one vacuum. It may include a common exhaust line for exhaust using the pump 264.

The substrate cooling unit 230 is configured to cool the substrate (G) introduced into the internal space (S) and can have various configurations.

When the internal space (S) of the load lock chamber 210 is divided up and down into a first space (S1) and a second space (S2), the substrate cooling unit 230, as shown in FIG. 3, It may be provided in the first space (S1) and the second space (S2), respectively.

For example, the substrate cooling unit 230 is a water-cooled type that includes a cooling plate, a refrigerant passage embedded inside the cooling plate through which refrigerant supplied from the outside flows, and a refrigerant port for supplying/discharging refrigerant to the refrigerant passage. It may be a cooling unit, but the configuration of the substrate cooling unit 230 is not limited to this.

The cooling plate may be formed in a planar shape corresponding to the substrate G, and may be, for example, a heat-conducting plate formed in a disk or square shape.

The distance between the substrate G supported on the substrate support 220 and the cooling plate may vary due to the vertical movement of the substrate support 220.

A seating surface on which the substrate G is seated may be formed on the cooling plate.

The coolant flow path is a flow path formed inside the cooling plate, and the coolant flows along the coolant flow path to cool the substrate G.

The refrigerant port may include an inlet port for supplying refrigerant to the refrigerant passage and an discharge port for discharging the refrigerant flowing out along the refrigerant passage.

Meanwhile, as shown in FIG. 3, when the substrate cooling unit 230 is provided in the first space (S1) and the second space (S2), the substrate cooling installed in the first space (S1) The refrigerant ports of the unit 230 and the substrate cooling unit 230 installed in the second space S2 may be formed in areas where they do not interfere with each other on a plane.

The substrate cooling unit 230 is installed on the lower side of the internal space (S), and when installed in the first space (S1) and the second space (S2), the substrate cooling unit 230 is installed in the first space (S1) and the second space (S2). It can be installed at the bottom.

Specifically, the substrate cooling unit 230 installed in the first space (S1) is installed on the upper side of the partition wall portion 212a of the load lock chamber 210, and the substrate cooling unit installed in the second space (S2) (230) may be installed on the lower lid 216 of the load lock chamber 210.

The substrate cooling unit 230 is coupled to the bottom of the first space (S1) and the second space (S2) and can cool the substrate (G) supported to face the upper side.

The substrate heating unit 240 faces the substrate cooling unit 230 at a vertical distance and is configured to heat the substrate G introduced into the internal space S, and can be configured in various ways.

The substrate heating unit 240 may be a heater using radiant heat, for example, a halogen lamp heater.

The halogen lamp heater has the characteristic of heating and cooling faster than the heating wire method and can heat the substrate (G) for a short period of time and transfer it to the next process, greatly reducing the bottleneck phenomenon in the load lock module 200. You can.

The substrate heating unit 240 is installed on the upper side of the internal space (S), and when installed in the first space (S1) and the second space (S2), the substrate heating unit 240 is installed in the first space (S1) and the second space (S2). ) can be installed at the top.

Specifically, the substrate heating unit 240 installed in the first space (S1) is installed on the upper lid 214 of the load lock chamber 210, and the substrate cooling unit 230 installed in the second space (S2) ) may be installed on the lower side of the partition wall portion 212a.

The substrate heating unit 240 includes a plurality of halogen heaters, and the plurality of halogen heaters may be arranged in various shapes and patterns for uniform heating.

The substrate support portion 220 is installed in the load lock chamber 210 to support the substrate (G) introduced into the internal space (S) and can be configured in various configurations.

When the internal space of the load lock chamber 210 is divided into a plurality of independent spaces S1 and S2, a plurality of substrate supports 220 may be provided corresponding to each space S1 and S2.

For example, as shown in FIG. 2, the substrate support 220 is a first substrate support 220a installed in the first space S1 through the upper wall 214 of the load lock chamber 210. ) and a second substrate support portion 220b installed in the second space S2 through the lower wall 216 of the load lock chamber 210.

The first substrate support portion 220a and the second substrate support portion 220b may be configured the same or similar except for the installation location.

The substrate support unit 220 is coupled to the substrate support bracket 222, which is located between the substrate cooling unit 230 and the substrate heating unit 240, and the substrate G. It includes a substrate seating part 224 that forms a seating surface, and a lifting drive unit 226 that drives the lifting and lowering of the substrate support bracket 222.

The substrate support bracket 222 is a bracket located between the substrate cooling unit 230 and the substrate heating unit 240 and can be configured in various ways.

As shown in FIG. 3, the substrate support bracket 222 may include a body portion formed in a ring shape with an open central portion.

The central opening corresponds to the planar shape of the substrate (G) to be supported and may be formed to have a size larger than the substrate (G) to be supported.

The opening of the substrate support bracket 222 may be formed at a position opposite to the substrate cooling unit 230 and the substrate heating unit 240.

As the substrate G is positioned in the opening of the substrate support bracket 222, the mounted substrate G may face the substrate cooling unit 230 and the substrate heating unit 240 upward and downward.

The substrate mounting portion 224 is a support member that is coupled to the substrate support bracket 222 and forms a seating surface on which the substrate G is mounted, and can be configured in various ways.

The substrate seating portion 224 may include a first substrate seating portion 224a and a second substrate seating portion 224b installed at vertical intervals.

The first substrate seating portion 224a is located relatively above, and the substrate G mounted on the first substrate seating portion 224a may directly face the substrate heating portion 240.

The second substrate seating portion 224b is positioned at an interval below the first substrate seating portion 224a, and the substrate G mounted on the second substrate seating portion 224b is connected to the substrate cooling unit 230 and the substrate cooling unit 230. can be confronted directly.

That is, the substrate cooling unit 230 and the substrate heating unit 240 may be installed to vertically overlap the substrate G seated on the substrate support unit 220.

The first substrate seating portion 224a may include a plurality of support members (SP) disposed along the circumference of the substrate support bracket 222 and protruding inward to form a seating surface on which the substrate G is seated. You can.

The support members SP may be provided in numbers of at least two or more to stably support the substrate G.

Referring to FIG. 7, the support member SP has a step formed on one surface of the portion protruding toward the central opening of the substrate support bracket 222, and contacts the bottom surface of the substrate G through the step to support the substrate G. I can support it.

The plurality of support members SP may be symmetrically arranged around the central opening of the substrate support bracket 222.

The support member (SP) may be coupled directly to the substrate support bracket 222 or through a separate support block (SB).

A support block (SB) is disposed between the support member (SP) and the substrate support bracket 222 to form a gap between the support member (SP) and the substrate support bracket 222 and can be coupled through a bolt member. .

The support member SP may be formed in a corresponding arc shape to effectively support the bottom edge of the circular substrate G, but is not limited thereto.

The second substrate seating portion 224b is disposed along the circumference of the substrate support bracket 222 similarly to the first substrate seating portion 224a and protrudes inward to form a seating surface on which the substrate G is seated. It may include a plurality of support members (SP).

However, the support member (SP) of the second substrate mounting portion 224b is not directly coupled to the substrate support bracket 222, but is coupled to the support member (SP) of the first substrate mounting portion 224a. It can be fixedly coupled to the support bracket (222).

The support members (SP) of the second substrate seating portion 224b may be configured the same as or similar to the support members (SP) of the first substrate seating portion 224a, and may also be configured in number as the first substrate seating portion 224a. ) may be provided in the same number as the support members (SP).

Between the support member SP of the second substrate seating portion 224b and the support member SP of the first substrate seating portion 224a, there is a space between the first substrate seating portion 224a and the second substrate seating portion 224b. A support block (SB) may be installed to couple the support member (SP) of the second substrate seating portion 224b to the substrate support bracket 222 while forming an upper and lower gap of .

The support member SP of the second substrate seating portion 224b and the support member SP of the first substrate seating portion 224a may be formed to have similar or identical shapes and may be arranged to overlap vertically.

The lifting drive unit 226 is a driving source that drives the lifting and lowering of the substrate support bracket 222 and can be configured in various ways.

Referring to Figures 4 to 6, the lifting drive unit 226 includes a shaft 226a coupled to the substrate support bracket 222, and a housing 226b that accommodates the shaft 226a and forms a space that can move up and down. ) and a driving source that drives the vertical movement of the shaft 226a.

The driving source may be a variety of driving sources as long as it can drive the up and down movement of the shaft 226a. For example, it may be a pneumatic source that moves the piston member provided at the end of the shaft 226a by pneumatic pressure.

At this time, a pressure cylinder that accommodates the piston may be formed in the housing 226b so that the piston member can be driven by pneumatic pressure.

Additionally, the lifting drive unit 226 enables only the vertical movement of the shaft 226a and may include a rotation prevention unit to prevent rotation around the axial direction of the shaft 226a.

The rotation prevention unit can be configured in various ways as long as it can prevent rotation around the axis of the shaft 226a. For example, the LM guide is installed on the housing 22b and guides the vertical movement path of the shaft 226a ( 226c).

A bellows (V) is installed along the outer circumference of the shaft (226a) between the housing (226b) and the load lock chamber (210) to maintain the airtightness of the internal space (S).

The shaft 226a may be fixedly coupled to the substrate support bracket 222 at one end.

For example, the shaft 226a and the substrate support bracket 222 can be fixedly coupled by coupling the bolting member B that penetrates the substrate support bracket 222 to one end of the shaft 226a.

The lifting drive unit 226 may be coupled to the substrate support bracket 222 on the outside of the substrate cooling unit 230 and the substrate heating unit 240. More specifically, the shaft 226a is connected to the substrate support bracket ( 222).

Since the substrate support bracket 222 is formed in a ring shape so that the substrate G is seated and supported in the opening at the central portion, the shaft 226a is located outside the substrate cooling unit 230 and the substrate heating unit 240. It may be coupled to the substrate support bracket 222 at the edge of the substrate support bracket 222.

The area of the substrate support bracket 222 coupled to the shaft 226a may be formed to protrude outward to facilitate coupling with the shaft 226a, and as a result, one side may be formed in the shape of a water drop protruding outward on a plane. You can.

Since the shaft 226a is not coupled to the center of the substrate support bracket 222, but is coupled to the substrate support bracket 222 from the outside of the substrate cooling unit 230 and the substrate heating unit 240, it is seated. The substrate G can be vertically opposed to the substrate cooling unit 230 and the substrate heating unit 240 without interfering structures, and as a result, cooling or heating of the substrate G can be performed uniformly and effectively.

At this time, the substrate support portion 220 is located between the first substrate seating portion 224a and the second substrate seating portion 224b for insulation between the substrate cooling portion 230 and the substrate heating portion 240. It may include an insulation unit 228 installed in.

The insulation unit 228 is an insulation plate that blocks radiant heat transmitted from the substrate heating unit 240 and can be configured in various ways.

The insulation unit 228 is installed between the first substrate seating unit 224a and the second substrate seating unit 224b so that the radiant heat of the substrate heating unit 240 is seated on the second substrate seating unit 224b. Transfer to the substrate (G) can be effectively prevented.

The insulation portion 228 may be installed on the substrate support bracket 222, and more specifically, may be installed to block the central opening of the substrate support bracket 222.

As shown in FIG. 3, the insulation portion 228 may be installed between the support member SP of the first substrate seating portion 224a and the support member SP of the second substrate seating portion 224b. there is.

As a result, the load lock module 200 according to the present invention includes a substrate cooling unit 230 and a substrate heating unit 240 in one internal space S (first space S1 or second space S2). are all installed and have an insulating portion 228 installed between the first substrate mounting portion 224a and the second substrate mounting portion 224b, so that the substrate (G) mounted on the first substrate mounting portion 224a There is an advantage in that the processing time can be greatly shortened and the productivity of the equipment can be improved by simultaneously performing heating for the substrate (G) and cooling for the substrate (G) seated on the second substrate seating portion 224b.

Moreover, since heating and cooling for multiple substrates (G) are performed together within one load lock chamber 210, the overall footprint is reduced, the process time is shortened, and process defects that may occur during substrate transfer are reduced. Since factors can also be eliminated, efficient use of space is possible and yield and productivity can be greatly improved.

In addition, in the load lock module 200 according to the present invention, the substrate support portion 220 is installed to be movable up and down in the internal space (S), so the substrate (G) input or discharged from the load lock module 200 ( The height of G can be fixed, and as a result, the Z-axis displacement of the transfer robot transporting the substrate G can be reduced.

The fact that the Z-axis displacement of the transfer robot is not large means that the cost required for the transfer robot can be reduced and the operational stability of the transfer robot can be greatly improved, which has the advantage of improving the performance of the entire facility.

Meanwhile, the substrate support unit 220 may further include a horizontal adjustment member 229 for maintaining the level of the substrate G mounted on the substrate seating unit 224.

Referring to FIG. 6, the shaft 226a of the substrate support portion 220 is not coupled to the center of the substrate support bracket 222, but is biased toward one edge, so that the first substrate mounting portion 224a and the The distance between the shaft 226b and the plurality of support members SP constituting the second substrate mounting portion 224b is not constant.

The support member (SP) located further away from the shaft 226a sags downward due to its own weight than the support member (SP) located relatively close, which causes the substrate (G) and the substrate cooling unit 230 or the substrate heating unit 240 ) becomes a factor in that the spacing between them becomes uneven depending on the location.

If the gap between the substrate (G) and the substrate cooling unit 230 or the gap between the substrate (G) and the substrate heating unit 240 is uneven, the cooling or heating of the substrate (G) is not uniform, affecting yield. This can be a factor that reduces productivity by increasing the time required for cooling or heating.

In the case of Figure 6, it is a drawing to explain the sagging phenomenon of the substrate support part 220, and the heat insulating part 228 provided in the substrate support part 220 is omitted.

The horizontal adjustment member 229 can be configured in various ways as long as it compensates for the difference in height of the substrate G depending on the position and maintains the horizontality of the substrate G mounted on the support members SP.

For example, the horizontal adjustment member 229 may be a fitting member interposed on the coupling surface between the substrate support bracket 222 and the substrate seating portion 224.

More specifically, the horizontal adjustment member 229 may be a shim ring installed between the support member (SP) requiring height difference compensation and the substrate support bracket 222, depending on the height requiring adjustment. The dimensions of the designed or installed horizontal adjustment members 229 may vary.

Referring to FIG. 6, in the substrate support 220 installed in the first space S1, the support member SP located close to the shaft 226a is the support member SP located relatively far from the shaft 226a. ), the support member (SP) located close to the shaft 226a and the substrate support bracket 222 are used to position the support member (SP) located close to the shaft 226a lower than because the degree of sagging downward is less. At least one horizontal adjustment member 229 may be installed therebetween.

Conversely, in the substrate support unit 220 installed in the second space S2, the support member SP located closer to the shaft 226a moves downward than the support member SP located relatively further from the shaft 226a. Since the degree of sagging is less, at least one is provided between the support member (SP) located far from the shaft 226a and the substrate support bracket 222 in order to position the support member (SP) located far from the shaft 226a more upwardly. The horizontal adjustment member 229 may be installed.

As a result, the substrate support 220 can be positioned in a horizontal state with the substrate G in a state that reflects the deflection of the substrate support bracket 222 in a state in which the substrate G is seated, and the substrate G and the substrate The gap between the cooling units 230 or the gap between the substrate G and the substrate heating unit 240 may be made uniform.

As another example, although not shown, the degree of deflection of the substrate support bracket 222 is predicted when the substrate G is seated on the substrate support portion 220, and the substrate cooling unit 230 and the substrate heating unit are installed to correspond thereto. By forming an inclination at 240, the distance between the substrate G and the substrate cooling unit 230 or the distance between the substrate G and the substrate heating unit 240 can be made uniform.

The above is only a description of some of the preferred embodiments that can be implemented by the present invention, and therefore, as is well known, the scope of the present invention should not be construed as limited to the above embodiments, and the scope of the present invention as described above should not be construed. Both the technical idea and the technical idea underlying it will be said to be included in the scope of the present invention.

100: Process module
200: Load lock module
300: Return module

Claims (10)

A load lock chamber (210) forming an internal space (S) and having at least one gate (T) for entering and exiting a substrate; a substrate support portion 220 installed in the load lock chamber 210 to support the substrate (G) introduced into the internal space (S); a substrate cooling unit 230 for cooling the substrate (G) introduced into the internal space (S); It faces the substrate cooling unit 230 at a vertical distance and includes a substrate heating unit 240 for heating the substrate (G) introduced into the internal space (S),
The substrate support unit 220 is coupled to the substrate support bracket 222, which is located between the substrate cooling unit 230 and the substrate heating unit 240, and the substrate G. It includes a substrate seating portion 224 that forms a seating surface to be seated, and a lifting drive portion 226 that drives the lifting and lowering of the substrate support bracket 222,
The substrate seating portion 224 includes a first substrate seating portion 224a and a second substrate seating portion 224b installed at vertical intervals,
The substrate support portion 220 is installed between the first substrate seating portion 224a and the second substrate seating portion 224b for thermal insulation between the substrate cooling portion 230 and the substrate heating portion 240. A load lock module (200) characterized in that it includes an insulation portion (228). In claim 1,
The substrate cooling unit 230 is installed on the lower side of the internal space (S),
The load lock module 200 is characterized in that the substrate heating unit 240 is installed on the upper side of the internal space (S). In claim 1,
The load lock module 200 is characterized in that the substrate heating unit 240 is a halogen lamp heater. In claim 1,
The load lock chamber 210 includes a partition wall 212a that divides the internal space S into an upper first space S1 and a lower second space S2,
The substrate support portion 220 includes a first substrate support portion 220a installed in the first space S1 through the upper wall 214 of the load lock chamber 210 and a lower portion of the load lock chamber 210. A load lock module (200) comprising a second substrate support portion (220b) installed in the second space (S2) through the wall (216). In claim 1,
The substrate cooling unit 230 and the substrate heating unit 240 are installed to overlap vertically with the substrate G mounted on the substrate support unit 220,
The load lock module (200) is characterized in that the lifting drive unit (226) is coupled to the substrate support bracket (222) on the outside of the substrate cooling unit (230) and the substrate heating unit (240). In claim 5,
The substrate support unit 220 is a load lock module 200 characterized in that it further includes a horizontal adjustment member 229 for maintaining the level of the substrate G mounted on the substrate seating unit 224. In claim 6,
The load lock module 200 is characterized in that the horizontal adjustment member 229 is a fitting member interposed on the coupling surface between the substrate support bracket 222 and the substrate seating portion 224. In claim 5,
The substrate support bracket 222 is formed in a ring shape with an open center so that the substrate G on which it is seated faces the substrate cooling unit 230 and the substrate heating unit 240,
The first substrate seating portion 224a and the second substrate seating portion 224b include a plurality of support members (SP) disposed along the circumference of the substrate support bracket 222 and protruding inward to form the seating surface. A load lock module (200) comprising: In claim 1,
A load lock module further comprising a gas injection unit 250 for injecting an inert gas into the internal space (S), and a gas exhaust unit 260 for exhausting gas from the internal space (S). (200). One or more process modules (100) that perform substrate processing on the substrate (G) under a preset process pressure state; A load lock module (200) according to any one of claims 1 to 9, which transfers the substrate (G) between the outside and the process module (100) under atmospheric pressure; A substrate processing system comprising a transfer module (300) that transfers the substrate (G) between the process module (100) and the load lock module (200).

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