KR20230055319A - Electronic device including foldable display - Google Patents

Abstract

An electronic device according to one embodiment of the present invention may comprise: a housing which includes a first housing and a second housing; a foldable display which includes a first area disposed on a front surface of the first housing, and a second area disposed on a front surface of the second housing; a hinge structure which connects the first housing and the second housing so that the second housing can rotate on a first axis with respect to the first housing; and a metal plate which is disposed on a rear surface of the foldable display. The metal plate may comprise: a first metal plate which is disposed on a rear surface of the first area, and covers at least a part of the first housing and a part of the hinge structure; and a second metal plate which is disposed on a rear surface of the second area, and covers at least a part of the second housing and a part of the hinge structure. The first metal plate may include a first recess recessed from a first edge of the first metal plate adjacent to the first axis, and a first protrusion unit spaced apart from the first recess and extending from the first edge. The second metal plate may include a second recess recessed from a second edge of the second plate adjacent to the first axis and accommodating the first protrusion unit when the housing is unfolded, and a second protrusion unit extending from the second edge and inserted into the first recess when the housing is unfolded. In addition, other various embodiments identified through the specification are possible.

Description

Electronic device including a foldable display {ELECTRONIC DEVICE INCLUDING FOLDABLE DISPLAY}

Various embodiments disclosed in this document relate to an electronic device including a foldable display.

In the case of an electronic device including a display, there is a limit in that the size of a housing of the electronic device must increase as the display increases. Accordingly, display electronic devices capable of meeting customer needs such as portability and convenience while overcoming these limitations are being developed.

As a representative example, an electronic device may include a foldable display. For example, an electronic device including a foldable display may secure portability by reducing the display by folding a housing and a display of the electronic device in half. In addition, an electronic device including a foldable display may provide convenience to a user by providing a wide screen as the housing and the display are unfolded.

An electronic device including a foldable display may provide a display that is folded or unfolded based on a folding axis. In order to provide a folded or unfolded display, a wrinkled lattice structure may be formed in a region adjacent to the folding axis of the foldable display (hereinafter referred to as “folding part”), and the thickness of the folding part of the foldable display may be formed thin. can

However, as the thickness of the lattice structure and the display is formed thin, the folding portion may be vulnerable to external impact. For example, when an electronic device receives an external shock, shear motion or torsion may occur in the housing and the display based on a folding axis. As the display shears or twists, the folding portion of the display may be damaged.

To overcome this, the electronic device may further include a cover panel. However, when the electronic device includes a thick cover panel to ensure durability of the display, the thickness of the folding portion of the display may increase. When the thickness of the folding portion increases, the folding radius of the electronic device may be limited.

Also, when the electronic device is in a folded state, the cover panel may receive deformation stress. Such deformation stress may cause wrinkles on the cover panel or the display when the electronic device is unfolded. Therefore, when wrinkles are generated on the display, the visibility of the electronic device may be impaired.

In addition, an additional adhesive layer for attaching the cover panel may be required, which may increase the cost of manufacturing the electronic device.

Various embodiments disclosed in this document may provide a foldable display with improved durability by reducing shearing or twisting of a folding axis of the display despite an external impact.

An electronic device according to various embodiments disclosed in this document includes a housing including a first housing and a second housing, a first area disposed in front of the first housing, and a second area disposed in front of the second housing. A foldable display including a foldable display, a hinge structure connecting the first housing and the second housing such that the second housing is rotatable about a first axis with respect to the first housing, and disposed on a rear surface of the foldable display. a first metal plate disposed on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a second metal plate disposed on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, wherein the first metal plate is adjacent to the first axis; a first recess recessed from a first edge of and a first protrusion spaced apart from the first recess and extending from the first edge, wherein the second metal plate is adjacent to the first axis; a second recess recessed from a second edge of a second metal plate and receiving the first protrusion when the housing is unfolded; and a second recess extending from the second edge and receiving the first recess when the housing is unfolded. A second protrusion drawn into the set may be included.

An electronic device according to various embodiments disclosed in this document includes a housing including a first housing and a second housing, a first area disposed in front of the first housing, and a second area disposed in front of the second housing. A foldable display comprising a, a hinge structure connecting the first housing and the second housing such that the second housing is rotatable with respect to the first housing about a first axis, the hinge structure is centered on the first axis a hinge gear that enables the second housing to rotate and a hinge module connected to the hinge gear, and a metal plate disposed on a rear surface of the foldable display, wherein the metal plate is a rear surface of the first region A first metal plate disposed on and covering at least a portion of the first housing and a portion of the hinge structure, and a second metal plate disposed on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, wherein the first metal plate is adjacent to the first axis; A first recess recessed from a first edge of the first recess, and a first protrusion spaced apart from the first recess and extending from the first edge, wherein the second metal plate is adjacent to the first shaft. A second recess recessed from the second edge of the plate and receiving the first protrusion when the housing is unfolded, and extending from the second edge and retracted into the first recess when the housing is unfolded. a second protrusion, wherein the hinge module is disposed on a rear surface of the first metal plate and overlaps the first hinge module protrusion overlapping the first protrusion and the first recess when viewed from the front of the electronic device. a first hinge module including a second hinge module recess, and a first hinge module protrusion disposed on a rear surface of the second metal plate and overlapping the second protrusion when viewed from the front of the electronic device, and the second and a second hinge module including a second hinge module recess overlapping the recess.

According to various embodiments disclosed in this document, the electronic device may suppress the shearing behavior or distortion of the display by including a metal plate formed on the rear surface of the display. Through this, an electronic device with improved durability may be provided to a user.

Also, according to various embodiments, the electronic device may reduce the thickness of the foldable portion of the display by omitting the cover panel or reducing the thickness of the cover panel. As a result, a display in which the folding angle is not limited can be provided.

Also, according to various embodiments of the present disclosure, an electronic device having improved visibility may be provided by reducing wrinkles on a cover panel or a display.

In addition to this, various effects identified directly or indirectly through this document may be provided.

1 is a diagram illustrating a first state (eg, an unfolded state) of an electronic device according to an embodiment.
2 is a diagram illustrating a second state (eg, a folded state) of an electronic device according to an embodiment.
3 is an exploded perspective view of an electronic device according to an exemplary embodiment;
4 is a view illustrating a front surface of a metal plate of an electronic device according to an exemplary embodiment.
5A is a cross-sectional view of an electronic device taken along line A-A', according to an exemplary embodiment.
FIG. 5B is a diagram illustrating a cross-section of the electronic device of FIG. 4 taken along line BB′ according to an embodiment.
5C is a cross-sectional view of the electronic device of FIG. 4 taken along line C-C′ according to an embodiment.
FIG. 6 is a cross-sectional view of the electronic device of FIG. 4 taken along line A-A' according to another embodiment.
7 is a view illustrating a front surface of a metal plate of an electronic device according to another embodiment.
8 is a view illustrating a front surface of a hinge plate of an electronic device according to an exemplary embodiment.
9A is a diagram illustrating a hinge structure of an electronic device according to an embodiment.
9B is a diagram illustrating a hinge module of a hinge structure according to an embodiment.
10 is a diagram illustrating a hinge bracket of an electronic device according to an embodiment.
11 is a diagram illustrating a hinge bracket of an electronic device according to an embodiment.
12 is a diagram illustrating a hinge bracket of an electronic device according to an embodiment.
13 is a view illustrating a protruding portion of a metal plate according to an exemplary embodiment.
14 is a diagram illustrating a protrusion of an electronic device according to another embodiment.
15 is a view illustrating a front surface of a metal plate of an electronic device according to an exemplary embodiment.
16 is a diagram illustrating a protrusion of an electronic device according to another embodiment.
17 is a diagram illustrating an electronic device in a network environment according to an embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the present invention to the specific embodiments, and includes various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

1 is a diagram illustrating a first state (eg, an unfolded state, 100A) of an electronic device according to an embodiment.

2 is a diagram illustrating a second state (eg, a folded state, 100B) of an electronic device according to an embodiment.

1 and 2, in one embodiment, the electronic device 100 is provided by a housing 110, a hinge cover 230 covering a foldable portion of the housing 110, and the housing 110. A flexible or foldable display 200 (hereinafter referred to as “main display” 200) disposed within the formed space may be included. In this document, the surface on which the main display 200 is disposed is defined as the first surface or the front surface 101 of the electronic device 100 . And, the surface opposite to the front surface 101 is defined as the second surface or the rear surface 102 of the electronic device 100 . In addition, a surface surrounding the space between the front surface 101 and the rear surface 102 is defined as a third surface or side surface 103 of the electronic device 100 .

According to one embodiment, the housing 110 may include a foldable housing. In one embodiment, the housing 110 may include a first housing 111 , a second housing 112 , a first rear cover 180 , and a second rear cover 190 . The housing 110 of the electronic device 100 is not limited to the shape and combination shown in FIGS. 1 and 2 , and may be implemented by other shapes or combinations and/or combinations of parts. For example, in another embodiment, the first housing 111 and the first rear cover 180 may be integrally formed, and the second housing 112 and the second rear cover 190 may be integrally formed. can

According to an embodiment, the unfolded state of the electronic device 100 may mean an unfolded state 100A or a first state 100A. For example, the unfolded state of the first housing 111 and the second housing 112 may correspond to the unfolded state 100A or the first state 100A. Also, the electronic device 100 may mean a folded state 100B or a second state 100B. For example, a folded state in which the second housing 1112 rotates relative to the first housing 111 may correspond to a folded state 100B or a second state 100B.

According to an embodiment, the first housing 111 and the second housing 112 form different angles or distances depending on whether the electronic device 100 is in an expanded state, a folded state, or an intermediate state. can

In the illustrated embodiment, the first housing 111 and the second housing 112 are disposed on both sides around a folding axis (hereinafter referred to as “first axis”), and have a generally symmetrical shape with respect to the first axis. can have However, the first housing 111 and the second housing 112 may have an asymmetrical shape in some areas. For example, the second housing 112 may further include a USB hole 151 unlike the first housing 111 . In other words, the first housing 111 and the second housing 112 may include a part having a shape symmetrical to each other and a part having a shape asymmetrical to each other.

According to one embodiment, the main display 200 may be symmetrically disposed across the first housing 111 and the second housing 112 .

In one embodiment, at least a portion of the first housing 111 and the second housing 112 may be formed of a metal material or a non-metal material having a rigidity of a size selected to support the main display 200 .

In one embodiment, the first rear cover 180 may be disposed on one side of the first shaft on the back of the electronic device. For example, the first rear cover 180 may have a substantially rectangular periphery, and the periphery may be covered by the first housing 111 . Similarly, the second rear cover 190 may be disposed on the other side of the first shaft on the rear surface of the electronic device, and its edge may be wrapped by the second housing 112 .

In the illustrated embodiment, the first rear cover 180 and the second rear cover 190 may have substantially symmetrical shapes around a first axis. However, the first rear cover 180 and the second rear cover 190 do not necessarily have symmetrical shapes, and in another embodiment, the electronic device 100 includes various shapes of the first rear cover 180 and A second rear cover 190 may be included.

In one embodiment, the first rear cover 180, the second rear cover 190, the first housing 111, and the second housing 112 are various parts (eg, printed circuit) of the electronic device 100 A space in which a substrate or a battery) can be disposed may be formed. In one embodiment, one or more components may be disposed or visually exposed on the rear surface of the electronic device 100 . For example, a portion of the sub display 220 may be visually exposed through the first rear area 181 of the first rear cover 180 . According to another embodiment, the sub display 220 may be disposed on the entire first rear area 231 of the first rear cover 180 .

In another embodiment, one or more parts or sensors may be visually exposed through the second rear area 232 of the second rear cover 190 . In various embodiments, the sensor may include a proximity sensor and/or a rear camera 280 .

The main display 200 may be disposed on a space formed by the housing 110 . For example, the main display 200 is seated on a recess formed by the housing 110 and may form most of the front surface 101 of the electronic device 100 .

Accordingly, the front surface 101 of the electronic device 100 may include the main display 200, a partial area of the first housing 111 adjacent to the main display 200, and a partial area of the second housing 112. . Further, the rear surface 102 of the electronic device 100 includes a first rear cover 180, a partial area of the first housing 111 adjacent to the first rear cover 180, a second rear cover 190, and a second A partial area of the second housing 112 adjacent to the rear cover 190 may be included.

The main display 200 may refer to a display in which at least a partial area may be transformed into a flat or curved surface. In one embodiment, the main display 200 includes a folding area 203 and a first display area 201 disposed on one side (the left side of the folding area 203 shown in FIG. 1) based on the folding area 203. and a second display area 202 disposed on the other side (right side of the folding area 203 shown in FIG. 1).

The division of regions of the main display 200 shown in FIG. 1 is exemplary, and the main display 200 may be divided into a plurality of (eg, four or more or two) regions according to a structure or function. For example, in the embodiment shown in FIG. 1, the area of the main display 200 may be divided by the folding area 203 extending parallel to the y-axis or the first axis (folding axis), but in another embodiment Areas of the main display 200 may be divided based on another folding area (eg, a folding area parallel to the x-axis) or another folding axis (eg, a folding axis parallel to the x-axis).

In one embodiment, the first display area 201 and the second display area 202 may have generally symmetrical shapes around the folding area 203 . However, unlike the first display area 201, the second display area 202 may include the camera hole 150, but may have a shape symmetrical to that of the first display area 201 in other areas. can In other words, the first display area 201 and the second display area 202 may include portions having symmetrical shapes and portions having shapes asymmetrical to each other.

According to an embodiment, the camera hole 150 may be visually exposed to the outside of the electronic device 100 . According to another embodiment, the camera hole 150 may be disposed below the main display 200 and not visually exposed.

Hereinafter, operations of the first housing 111 and the second housing 112 according to the state of the electronic device 100 (eg, a flat state 100A and a folded state 100B) and Each area of the main display 200 will be described.

In one embodiment, when the electronic device 100 is in a flat state 101A (eg, FIG. 1 ), the first housing 111 and the second housing 112 form an angle of 180 degrees and move in the same direction. can be placed facing up. The surface of the first display area 201 of the main display 200 and the surface of the second display area 202 form 180 degrees to each other and may face the same direction (eg, the front direction of the electronic device). The folding area 203 may form the same plane as the first display area 201 and the second display area 202 .

In one embodiment, when the electronic device 100 is in the folded state 100B (eg, FIG. 2 ), the first housing 111 and the second housing 112 may face each other. The surface of the first display area 201 of the main display 200 and the surface of the second display area 202 form a narrow angle (eg, between 0 degrees and 10 degrees) and may face each other. At least a portion of the folding region 203 may be formed of a curved surface having a predetermined curvature.

In one embodiment, when the electronic device 100 is in a folded state, the first housing 111 and the second housing 112 may be disposed at a certain angle to each other. The surface of the first display area 201 of the main display 200 and the surface of the second display area 202 may form an angle greater than that of the folded state and smaller than that of the unfolded state. At least a portion of the folding region 203 may be formed of a curved surface having a predetermined curvature, and the curvature at this time may be smaller than that in a folded state.

3 is an exploded perspective view of an electronic device according to an exemplary embodiment;

Referring to FIG. 3 , in one embodiment, the electronic device 100 includes a display unit 20, a bracket assembly 30, a board unit 400, a first housing 111, a second housing 112, and a first housing 111. It may include a first rear cover 180 and a second rear cover 190 . In this document, the display unit 20 may be referred to as a display module or a display assembly.

The display unit 20 may include a main display 200 and one or more plates or layers (not shown) on which the main display 200 is seated. In one embodiment, the plate may be disposed between the main display 200 and the bracket assembly 30 . The main display 200 may be disposed on at least a part of one side of the plate (eg, the upper side with respect to FIG. 3 ). The plate may be formed in a shape corresponding to that of the main display 200 .

The bracket assembly 30 includes a bracket 310 including a first bracket 311 and a second bracket 312, a hinge structure 300 disposed between the first bracket 311 and the second bracket 312, A hinge cover 330 covering the hinge structure 300 when viewed from the outside, and a wiring member 343 (eg, a flexible printed circuit board (FPC)) crossing the first bracket 311 and the second bracket 312 , flexible printed circuit).

According to one embodiment, the bracket assembly 30 may be formed within the housing 110 . For example, the first bracket 311 may be formed within the first housing 111 and the second bracket 312 may be formed within the second housing 112 .

Referring to FIG. 3 , the hinge cover 330 may be disposed between the first housing 111 and the second housing 112 to cover internal parts (eg, the hinge structure 300). can In one embodiment, the hinge cover 330, depending on the state (flat state 100A or folded state 100B) of the electronic device 100, the first housing 111 and It may be covered by a part of the second housing 112 or exposed to the outside.

For example, as shown in FIG. 2 , when the electronic device 100 is in an unfolded state 100A, the hinge cover 330 may not be exposed because it is covered by the first housing 111 and the second housing 112. there is. For example, as shown in FIG. 3 , when the electronic device 100 is in a folded state 100B (eg, a fully folded state), the hinge cover 330 includes the first housing 111 and the second 2 may be exposed to the outside between the housings 112. For example, when the first housing 111 and the second housing 112 are folded with a certain angle (intermediate state), the hinge cover 330 is the first housing 111 And between the second housing 112 may be partially exposed to the outside. However, in this case, the exposed area may be smaller than the completely folded state.

In one embodiment, the hinge cover 330 may include a curved surface.

In one embodiment, the bracket assembly 30 may be disposed between the main display 200 and the substrate unit 400 . For example, the first bracket 311 may be disposed between the first display area 201 of the main display 200 and the first substrate 401 . The second bracket 312 may be disposed between the second display area 202 of the main display 200 and the second substrate 402 .

In one embodiment, at least a portion of the wiring member 343 and the hinge structure 300 may be disposed inside the bracket assembly 30 . The wiring member 343 may be disposed in a direction (eg, an x-axis direction) crossing the first bracket 311 and the second bracket 312 . The wiring member 343 is disposed in a direction (eg, the x-axis direction) perpendicular to the folding axis (eg, the y-axis or the folding axis (first axis) of FIG. 2 ) of the folding area 203 of the electronic device 100. It can be.

As mentioned above, the substrate unit 400 may include a first substrate 401 disposed on the side of the first bracket 311 and a second substrate 402 disposed on the side of the second bracket 312. can The first substrate 401 and the second substrate 402 include a bracket assembly 30, a first housing 111, a second housing 112, a first rear cover 180 and a second rear cover 190. ) can be placed inside the space formed by According to an embodiment, components for realizing various functions of the electronic device 100 may be mounted on the first board 401 and the second board 402 .

According to one embodiment, the first substrate 401 may be formed of a plurality of substrates.

According to an embodiment, the first substrate 401 may be formed in a form in which a plurality of substrates are separated. For example, the first board 401 may be formed by being separated into a first printed circuit board 403 and a second printed circuit board 404 . The first housing 111 and the second housing 112 may be assembled to each other to be coupled to both sides of the bracket assembly 30 while the display unit 20 is coupled to the bracket assembly 30 . As will be described later, the first housing 111 and the second housing 112 can be coupled to the bracket assembly 30 by sliding on both sides of the bracket assembly 30 .

In one embodiment, the first housing 111 may include a first rotation support surface 113, and the second housing 112 may include a second rotation support surface corresponding to the first rotation support surface 113 ( 114) may be included. The first rotation support surface 113 and the second rotation support surface 114 may include a curved surface corresponding to the curved surface included in the hinge cover 330 .

In one embodiment, the first rotation support surface 113 and the second rotation support surface 114, when the electronic device 100 is in an unfolded state (100A) (eg, the electronic device of FIG. 1), the hinge cover 330 is covered so that the hinge cover 330 is not exposed or minimally exposed to the back of the electronic device 100 . Meanwhile, the first rotation support surface 113 and the second rotation support surface 114 are attached to the hinge cover 330 when the electronic device 100 is in a folded state 100B (eg, the electronic device of FIG. 2 ). The hinge cover 330 may be maximally exposed to the rear surface of the electronic device 100 by rotating along the included curved surface.

According to an embodiment, the electronic device 100 may further include a first battery 451, a second battery 452, and a speaker module 453.

According to an embodiment, the first battery 451 and the second battery 452 may be mounted inside the housing 110 of the electronic device 100 and not exposed to the outside. For example, the first battery 451 may be mounted inside the first housing 111 . Also, the second battery 452 may be mounted inside the second housing 112 .

According to one embodiment, the first battery 451 and the second battery 452 are a wiring member 343 (eg, a flexible printed circuit board) disposed between the first housing 111 and the second housing 112. can be electrically connected by

According to one embodiment, the speaker module 453 may be disposed inside the first housing 111 . For example, the speaker module 453 may be disposed in a region adjacent to the first battery 451 inside the first housing 111 . According to an embodiment, the speaker module 453 may not be exposed to the outside of the electronic device 100 . According to one embodiment, the speaker module 453 may be mounted on the second printed circuit board 404 of the first board 401 .

4 is a view illustrating a front surface of a metal plate of an electronic device according to an exemplary embodiment.

Referring to FIG. 4 , the electronic device 100 may include a bracket 310 and a metal plate 410 formed in a housing 110 and a hinge structure 300 . According to an embodiment, the electronic device 100 may further include a main display ( 200 in FIG. 3 ).

According to one embodiment, the bracket 310 may include a first bracket 311 and a second bracket 312 . In one example, the first bracket 311 may be formed within the first housing 111 and the second bracket 312 may be formed within the second housing 112 .

According to one embodiment, the first bracket 311 and the second bracket 312 may be connected by a hinge structure 300 . For example, the hinge structure 300 may be disposed between the first bracket 311 and the second bracket 312 to physically connect the first bracket 311 and the second bracket 312 .

According to an embodiment, the bracket 310 may include a front part 313 and a side part 314 facing the front of the electronic device 100 .

According to one embodiment, a metal plate 410 may be disposed on the front portion 313 of the bracket 310. For example, the metal plate 410 may be attached to a waterproof tape 500 disposed on the front portion 313 of the bracket 310 and described below. Also, according to an embodiment, the main display 200 may be disposed on the metal plate 410 . In other words, according to an embodiment, the front portion 313 of the bracket 310 may support the metal plate 410 and the main display 200 .

According to one embodiment, the side portion 314 of the bracket 310 may be surrounded by the housing 110. For example, the side portion 314 of the first bracket 311 may be surrounded by the first housing 111, and the side portion 314 of the second bracket 312 may be surrounded by the second housing 112.

According to one embodiment, the housing 110 may surround and form a part of the main display 200 disposed on the front portion 313 of the bracket 310 .

According to an embodiment, unlike a bar-type electronic device in which a housing and a display are attached and fixed, the housing 110 of the electronic device 100 including the foldable main display 200 and The main display 200 may be attached and not fixed. For example, the housing 110 surrounding a part of the main display 200 may surround the main display 200 while being spaced apart from the side of the main display 200 by a predetermined distance.

According to an embodiment, since the housing 110 is spaced apart from the side of the main display 200 by a predetermined distance, the foldable main display 200 may not collide with the housing 110 when folded. In other words, according to an embodiment, although the foldable main display 200 may slip toward the housing 110 when folded, the main display 200 does not collide with the housing 110. may not be

According to an embodiment, since the main display 200 is not attached to the housing 110, a shearing behavior may occur in the main display 200 due to an external impact.

According to an embodiment, the shearing behavior may be reduced by a protrusion 420 of a metal plate 410 disposed under the main display 200 and described later.

According to one embodiment, a waterproof structure may be formed in the bracket 130. In one example, a waterproof tape 550 may be attached to the bracket 310 to form a waterproof structure.

For example, the first waterproof tape 551 may be attached to the inside of the first bracket 311 and the second waterproof tape 552 may be attached to the inside of the second bracket 312 .

According to an embodiment, the first bracket 311 and the first metal plate 411 disposed on the front surface of the first bracket 311 come into close contact with each other by means of the first waterproof tape 551, thereby forming a waterproof structure. there is. In addition, according to an embodiment, the second bracket 312 and the second metal plate 412 disposed on the front surface of the second bracket 312 come into close contact with each other by the second waterproof tape 552 to form a waterproof structure. can

According to an embodiment, the first waterproof tape 551 of the first bracket 311 and the second waterproof tape 552 of the second bracket 312 may not be formed symmetrically with respect to the first axis. For example, the first waterproof tape 551 and the second waterproof tape 552 may be differently disposed according to positions of components mounted inside the first bracket 311 and the second bracket 312 .

According to one embodiment, the metal plate 410 may be disposed on the rear surface of the main display 200 . For example, the metal plate 410 may be disposed between the main display 200 and the bracket 310 .

According to one embodiment, the metal plate 410 may include a first metal plate 411 and a second metal plate 412 .

According to an embodiment, the first metal plate 411 may be disposed on the rear surface of the first display area 201 of the main display 200 . In other words, according to an embodiment, the first metal plate 411 may be disposed on the first housing 111 . For example, the first metal plate 411 may cover at least a portion of the first housing 111 .

According to an embodiment, the second metal plate 412 may be disposed on the rear surface of the second display area 202 of the main display 200 . In other words, according to an embodiment, the second metal plate 412 may be disposed on the second housing 112 . For example, the second metal plate 412 may cover at least a portion of the second housing 112 .

According to one embodiment, the first metal plate 411 and the second metal plate 412 may cover a portion of the hinge structure 300 . For example, when viewed from the front surface 101 of the electronic device 100, the first metal plate 411 may cover a portion of the hinge structure 300 adjacent to the first housing 111, and the second metal plate 411 may The plate 412 may cover a portion of the hinge structure 300 adjacent to the second housing 112 .

According to one embodiment, the metal plate 410 may include a plurality of edges 440 . For example, the first metal plate 411 may include a first edge 441 and the second metal plate 412 may include a second edge 442 .

According to an embodiment, the first edge 441 of the first metal plate 411 and the second edge 442 of the second metal plate 412 may correspond to edges adjacent to the first axis.

According to an embodiment, the first edge 441 and the second edge 442 correspond to edges extending along a direction (eg, +y direction or -y direction) toward the first axis of the electronic device 100. It can be.

According to an embodiment, the first edge 441 and the second edge 442 may correspond to edges facing each other when the electronic device 100 is in an unfolded state 100A. According to an embodiment, a first axis may be formed between the first edge 441 and the second edge 442 .

According to one embodiment, the metal plate 410 may include at least one protrusion 420 and at least one recess 430 . According to an embodiment, the at least one protrusion 420 and the at least one recess 430 may be a first edge 441 of the first metal plate 411 or a second edge of the second metal plate 412 ( 442) can be formed.

For example, the first recess 431 and the first protrusion 421 may be formed at the first edge 441 of the first metal plate 411 , and the second edge of the second metal plate 412 may be formed. A second recess 432 and a second protrusion 422 may be formed in 442 .

According to an embodiment, the first protrusion 421 of the first metal plate 411 may extend from the first edge 441 of the first metal plate 411 . In one example, the first protrusion 421 may be formed to extend from one area of the first edge 441 of the first metal plate 411 . For example, the first protrusion 421 may be formed in a region of the first metal plate 411 adjacent to the first end of the first edge 441 .

In other words, according to an embodiment, the first protrusion 421 may be formed in a region of the first edge 441 adjacent to the third edge 443 .

According to an embodiment, the first protrusion 421 may protrude in a second direction (eg, +x direction) perpendicular to the first axis. For example, in the unfolded state 100A, the first protrusion 421 may protrude and extend toward the second metal plate 412 in a second direction (eg, a +x direction).

According to an embodiment, the second protrusion 422 of the second metal plate 412 may extend from the second edge 442 of the second metal plate 412 . For example, the second protrusion 422 may protrude toward a third direction (eg, -x direction) opposite to the second direction (eg, +x direction). For example, in the unfolded state 100A, the second protrusion 422 may protrude and extend toward the first metal plate 411 in a third direction (eg, -x direction).

According to an embodiment, the first recess 431 of the first metal plate 411 may be recessed from the first edge 441 . In one example, the first recess 431 may be formed by being depressed in a region of the first edge 441 adjacent to the second end of the first edge 441 . In other words, for example, the first recess 431 may be formed by being depressed in a region of the first edge 441 adjacent to the fourth edge 444 .

According to an embodiment, the first recess 431 may be formed to be depressed in the third direction (eg, -x direction).

According to one embodiment, the second recess 432 of the second metal plate 412 may be recessed from the second edge 442 . In one example, the second recess 432 may be formed by being depressed in a region of the second edge 442 adjacent to the first end of the second edge 442 . In other words, for example, the second recess 432 may be formed by being depressed in a region of the second edge 442 adjacent to the fifth edge 445 .

According to an embodiment, the second recess 432 may be recessed in the second direction (eg, +x direction). In other words, according to an embodiment, when the electronic device 100 is in the unfolded first state 100A, the first recess 431 may be depressed in a direction opposite to that of the second metal plate 412, The second recess 432 may be depressed in a direction opposite to that of the first metal plate 411 .

Referring to FIG. 4 , according to an embodiment, the first protrusion 421 may be formed to be spaced apart from the first recess 431, and the second protrusion 422 may be spaced apart from the second recess 432. can be formed

For example, the first protrusion 421 may be formed in a region of the first edge 441 adjacent to the third edge 443 of the first metal plate 411, and the first recess 431 may be It may be formed in one area of the first edge 441 adjacent to the fourth edge 444 of the first metal plate 411 .

Also, for example, the second protrusion 422 may be formed in a region of the second edge 442 adjacent to the sixth edge 446 of the second metal plate 412, and the second recess 432 may be formed in one area of the second edge 442 adjacent to the fifth edge 445 of the second metal plate 412 .

According to an embodiment, the third edge 443 of the first metal plate 411 and the fifth edge 445 of the second metal plate 412 may correspond to the top edge of the electronic device 100 . Also, according to an embodiment, the fourth edge 444 of the first metal plate 411 and the sixth edge 446 of the second metal plate 412 may correspond to the lower edge of the electronic device 100. there is.

According to an embodiment, when the electronic device 100 is in an unfolded state 100A, the first protrusion 421 may be recessed into the second recess 432, and the second protrusion 422 may be recessed into the first recess 432. It may be sunk into the seth 431 .

According to an embodiment, the first recess 431 and the second recess 432 may form a space capable of accommodating the second protrusion 422 and the first protrusion 421 .

According to an embodiment, as the second protrusion 422 and the first protrusion 421 are introduced into the space, the electronic device 100 is in an unfolded state 100A, the first metal plate 411 and the second metal plate (412) can be combined.

According to an embodiment, the protrusion 420 is accommodated in the corresponding recess 430 and the first metal plate 411 and the second metal plate 412 are coupled, thereby reducing the metal plate 410 by an external impact. The shear behavior or twist in the first axial direction (eg, +y direction or -y direction) of the metal plate 410 is not formed or the first metal plate 411 and the second metal plate 412 are not coupled. may be less than if it were not.

According to an embodiment, as the shear behavior or twist of the metal plate 410 decreases, the shear behavior or twist of the main display 200 disposed on the metal plate 410 in the first axial direction may also decrease. can

According to an embodiment, by reducing the shearing behavior or distortion of the main display 200, it is possible to prevent the main display 200 from being damaged by an external impact. Through this, the electronic device 100 can secure durability.

A specific embodiment related to the protrusion 420 and the recess 430 of the metal plate 410 will be described later with reference to FIGS. 5A to 6 .

5A is a cross-sectional view of an electronic device taken along line A-A', according to an exemplary embodiment.

According to an embodiment, the electronic device 100 may include a main display 200, a metal plate 410, a bracket 310, and/or a hinge structure 300. According to an embodiment, the electronic device 100 may further include a waterproof tape 550.

According to an embodiment, the main display 200 (or main display structure) may include a plurality of layers. According to an embodiment, the main display 200 includes a cover glass 510, a display panel 520 disposed adjacent to one surface of the cover glass 510, and/or a display panel 520 below the display panel 520. It may include a dielectric layer structure 530 disposed on.

However, according to one embodiment, the main display 200 is not limited to the above structure. For example, some components (eg, the thermoplastic material 540) may be omitted and other components may be added.

According to one embodiment, the main display 200 may further include an adhesive for bonding the plurality of layers described above. According to one embodiment, the adhesive may include pressure sensitive adhesive (PSA), but is not limited thereto. For example, the adhesive may include optically clear adhesive (OCA), thermally reactive adhesive, and/or double-sided tape in addition to PSA.

According to one embodiment, the cover glass 510 may include a film layer 511 and/or a transparent plate 512 . In one embodiment, at least a portion of the film layer 511 may be exposed to the outside through the front surface 101 of the electronic device 100 . The transparent plate 512 may correspond to ultra-thin tempered glass, but is not limited thereto.

According to one embodiment, the film layer 511 and the transparent plate 512 may be bonded by an adhesive. According to one embodiment, the film layer 511 and the transparent plate 512 have ductility and may be folded or bent. For example, the film layer 511 may be referred to as a polarization film, but is not limited thereto.

According to one embodiment, the main display 200 may include a display panel 520 disposed under the cover glass 510 . According to an embodiment, the display panel 520 may be attached to the cover glass 510 by the first adhesive layer 561 .

According to an embodiment, the display panel 520 may include a panel 521 and/or a plastic film 522 disposed under the panel 521 . According to an embodiment, the panel 521 may be attached to the transparent plate 512 by an adhesive (eg, PSA).

According to one embodiment, the plastic film 522 may be referred to as a polarization film.

According to an embodiment, the panel 521 may be implemented as a touch panel on which electrodes for receiving touch input, fingerprint recognition, or pen input are disposed. According to an embodiment, the panel 521 may include an organic light emitting diodes (OLED) panel, a liquid crystal display (LCD), or a quantum, dot, light-emitting diodes (QLED) panel. For example, the display panel 520 includes a plurality of pixels for displaying an image, and one pixel may include a plurality of sub-pixels. For example, one pixel may include three colors of red sub-pixels, green sub-pixels, and blue sub-pixels. For another example, one pixel may be formed in an RGBG pentile method including one red subpixel, two green subpixels, and one blue subpixel.

According to an embodiment, the main display 200 may include a dielectric layer structure 530 disposed below the display panel 520 . According to an embodiment, the dielectric layer structure 530 may be attached to the display panel 520 by the second adhesive layer 562 (eg, PSA). According to an embodiment, the adhesive layer may be formed in a region corresponding to the dielectric layer structure 530 . According to another embodiment, the adhesive layer 531 may be disposed to be formed on an inner region of an edge of the dielectric layer structure 530 .

According to an embodiment, at least a portion of the dielectric layer structure 530 may include a lattice pattern. For example, the dielectric layer structure 530 may include a grid pattern formed in a region adjacent to the first axis. According to an embodiment, since the dielectric layer structure 530 includes a lattice pattern, as the electronic device 100 is folded (eg, the second state 100B) or unfolded (eg, the first state 100A), The dielectric layer structure 530 and the layers attached to the dielectric layer structure 530 (eg, the cover glass 510 and/or the metal plate 410) may also be folded or unfolded.

According to an embodiment, the dielectric layer structure 530 may include a material for securing rigidity and a material for reducing weight. According to an embodiment, the dielectric layer structure 530 may have a structure in which a layer for securing rigidity and a layer formed of a lightweight material are stacked. According to an embodiment, due to the materials included in the dielectric layer structure 530, the main display 200 can secure rigidity. According to an embodiment, as at least a portion of the dielectric layer structure 530 is formed of a lightweight material, the weight of the main display 200 may be reduced.

According to an embodiment, the main display 200 may further include a thermoplastic material 540 (eg, thermoplastic polyurethane (TPU)) disposed below the dielectric layer structure 530 . According to an embodiment, since the main display 200 further includes the thermoplastic material 540, damage applied to the display panel 520, the dielectric layer structure 530, and the metal plate 410 can be prevented. For example, since the main display 200 further includes the thermoplastic material 540 , bubbles generated between a plurality of layers disposed on the main display 200 may be prevented.

According to one embodiment, the metal plate 410 may be disposed below the main display 200 . For example, the metal plate 410 may be disposed below the dielectric layer structure 530 and/or the thermoplastic material 540 of the main display 200 .

According to an embodiment, the metal plate 410 may be formed by being disconnected from a region corresponding to the first axis. For example, the first metal plate 411 and the second metal plate 412 may be separately disposed based on the first axis. According to an embodiment, the first metal plate 411 and the second metal plate 412 are disconnected and disposed with respect to the first axis, so that when the electronic device 100 is folded or unfolded, the metal plate ( 410) can be folded or unfolded.

According to another embodiment, a portion of the metal plate 410 may be formed transverse to the folding axis by including ductility. For example, a region corresponding to the first axis of the flexible metal plate 410 may be formed as flexible, and the remaining region may be formed as a metal member.

According to one embodiment, the metal plate 410 may be referred to as a shielding layer. The metal plate 410 according to an embodiment may reduce noise by shielding magnetic force due to peripheral electronic components in addition to signals input from the electronic pen.

According to one embodiment, the metal plate 410 may be formed of a metal member. For example, the metal plate 410 may be formed of a copper alloy, but is not limited thereto. For example, the metal plate 410 may be formed of stainless use steel (SUS).

Referring to FIGS. 4 and 5A , according to an exemplary embodiment, the first metal plate 411 may include a first protrusion 421 . According to an embodiment, the first protrusion 421 of the first metal plate 411 is formed, so that when viewed on a first plane (eg, xz plane), the second axis (eg, xz plane) of the first metal plate 411 is formed. : The first length L1 in the x-axis direction may be longer than the second length L2 of the second metal plate 412 in the second axial direction.

Referring to FIG. 5A , according to an embodiment, as the first protrusion 421 is formed, the first metal plate 411 has a first axis relative to the first axis when viewed from a first plane (eg, an xz plane). It may be formed by protruding in two directions (eg, +x direction). In addition, according to an embodiment, the second metal plate 412 is provided with a second recess (432 in FIG. 4 ) accommodating the first protrusion 421 , so that the second metal plate 412 is formed in a first plane (eg, an xz plane). When viewed, it may be formed spaced apart in a second direction (eg, +x direction) based on the first axis.

However, the length of the second metal plate 412 relative to the first metal plate 411 has been described only for the first protrusion 421, but is not limited thereto.

For example, as the second protrusion 422 of the second metal plate 412 is formed, the second length L2 of the second metal plate 412 is the first length of the first metal plate 411 ( L1) may be formed longer. Also, according to an embodiment, as the second protrusion 422 of the second metal plate 412 is formed, the first metal plate 411 moves in a third direction (eg, -x direction) based on the first axis. It can be formed spaced apart.

According to an embodiment, the protrusion 420 and the recess 430 are formed on the metal plate 410, so that when the electronic device 100 is in an unfolded state (100A, first state), the first metal plate ( 411) and the second metal plate 412 may be coupled.

In other words, according to an embodiment, when the electronic device 100 is in an unfolded state (100A, first state), each of the protrusions 420 is drawn into the corresponding recess 430, so that the first metal plate ( 411) and the second metal plate 412 may be coupled and fixed in the first axis direction (eg, +y direction or -y direction).

According to an embodiment, as the first metal plate 411 and the second metal plate 412 are coupled, the first axial direction (eg, +y direction or -y direction) of the metal plate 410 by external impact direction) or torsion may be reduced.

According to an embodiment, as the shear behavior or twist of the metal plate 410 decreases, the first axis direction (eg, +y direction or -y direction) of the main display 200 disposed on the metal plate 410 ), the shear behavior or torsion may also be reduced. Accordingly, durability of the main display 200 may be increased.

Accordingly, according to an embodiment, as the durability of the main display 200 increases due to the structure of the metal plate 410, the main display 200 may omit the cover panel or include a cover panel having a thin thickness. . By omitting the cover panel or including the thin cover panel, the production cost and production time of the electronic device 100 can be reduced.

Also, according to an embodiment, the visibility of the main display 200 of the electronic device 100 may be improved by reducing wrinkles of the folding portion of the main display 200 due to the thin cover panel.

According to one embodiment, the bracket 310 may be disposed below the metal plate 410 . For example, the first bracket 311 may be disposed below the first metal plate 411 and the second bracket 312 may be disposed below the second metal plate 412 .

According to one embodiment, the bracket 310 may be disposed under the cover glass 510 or the display panel 520 and extend to the side. For example, the bracket 310 may be formed to surround a portion of a side surface of the cover glass 510 or the display panel 520 .

According to one embodiment, the bracket 310 may extend apart from the side surface of the cover glass 510 or the display panel 520 with a predetermined gap. In other words, the bracket 310 may be formed to be spaced apart from the side of the main display 200 with a predetermined gap.

According to an embodiment, as the bracket 310 forms a certain gap with the side surface of the cover glass 510 or the display panel 520, when the electronic device 100 is folded, the side surface of the main display 200 and the bracket The collision of (310) can be prevented. In other words, when the electronic device 100 is folded, the main display 200 may slip to the side and may not collide with the bracket 310 despite the main display 200 slipping.

According to one embodiment, the formation of the bracket 310 on the side of the main display 200 has been described as an example, but is not limited thereto. For example, the housing 110 may be formed with a predetermined gap on the side of the main display 200 .

In one embodiment, another configuration may be added between the bracket 310 and the metal plate 410. For example, a waterproof tape 550 may be further added between the bracket 310 and the metal plate 410 .

According to one embodiment, the brackets 310 may be disposed in both directions around the hinge structure 300 . For example, the first bracket 311 may be disposed in a third direction (eg, -x direction) with respect to the hinge structure 300, and the second bracket 312 may be disposed with respect to the hinge structure 300. It may be disposed in the second direction (eg, +x direction).

According to one embodiment, the metal plate 410 may be attached on the bracket 310 by an adhesive part. According to one embodiment, the adhesive portion may correspond to a waterproof member (hereinafter, “waterproof tape 550”), but is not limited thereto. For example, the bonding portion may correspond to a waterproof bond.

According to one embodiment, the waterproof tape 550 may be disposed between the metal plate 410 and the bracket 310. For example, the first waterproof tape 551 may be disposed between the first metal plate 411 and the first bracket 311, and the second waterproof tape 552 may be disposed between the second metal plate 412 and the first bracket 311. 2 may be disposed between the brackets (312). In other words, the first waterproof tape 551 may be disposed below the first metal plate 411 , and the second waterproof tape 552 may be disposed below the second metal plate 412 .

According to one embodiment, the waterproof tape 550 may be disposed in a first area adjacent to the first axis and in a second area spaced apart from the first area and adjacent to the ends of the bracket 310 and the metal plate 410. . In other words, according to one embodiment, a portion of the waterproof tape 550 may be adjacent to the hinge structure 300 and another portion of the waterproof tape 550 may be disposed spaced apart from the hinge structure 300 .

For example, the first waterproof tape 551 disposed under the first metal plate 411 includes a first area adjacent to the first axis and spaced apart from the first area and adjacent to the end of the first metal plate 411. It can be placed in the second area. In addition, for example, the first waterproof tape 551 disposed under the second metal plate 412 may include a first area adjacent to the first axis and spaced apart from the first area and an end of the first metal plate 411. It may be disposed in the second area adjacent to.

According to an embodiment, the waterproof tape 550 is disposed so that the waterproof function of the electronic device 100 as well as the main display 200 and/or the metal plate 410 is protected on the bracket 310. can be fixed.

According to an embodiment, as the waterproof tape 550 is also formed in the first region adjacent to the first axis, the shear behavior of the main display 200 is such that the waterproof tape 550 is applied only to the second region spaced apart from the first axis. If formed, it may occur larger.

Also, according to one embodiment, as the first housing 111 and the second housing 112 are formed separately from under the main display 200, the shear behavior of the main display 200 is formed as a single housing. may occur in larger cases.

According to an embodiment, the increase in the shear behavior of the main display 200 by the separated housing 110 and the waterproof tape 550 is caused by the protrusion 420 and the recess 430 on the metal plate 410. formation can be reduced.

In other words, as each protrusion 420 is inserted into the corresponding recess 430 and the first metal plate 411 and the second metal plate 412 are coupled, the metal plate 410 caused by an external impact Shear behavior or twist in the first axis direction (eg, +y direction or -y direction) of may be reduced.

According to an embodiment, as the shearing behavior or twisting of the metal plate 410 in the first axis direction decreases, the shearing behavior or twisting of the main display 200 may decrease.

According to one embodiment, the hinge structure 300 may be disposed in an area corresponding to the first axis. In other words, according to one embodiment, the hinge structure 300 may be disposed on the folding portion. According to one embodiment, the first axis may refer to a central axis of the hinge structure 300, but is not limited thereto. For example, the first axis may be an axis partially spaced from the center of the hinge structure 300 in a second direction (eg, +x direction) or a third direction (eg, -x direction).

According to an embodiment, since the first axis corresponds to an axis of one region of the hinge structure 300, the electronic device 100 may be folded or unfolded by the hinge structure 300 around the first axis. In other words, the second housing 112 may rotate with respect to the first housing 111 of the electronic device 100 by the hinge structure 300 around the first axis.

Specific embodiments of the hinge structure 300 will be described later with reference to FIGS. 8 to 13 .

FIG. 5B is a diagram illustrating a cross-section of the electronic device of FIG. 4 taken along line BB′ according to an embodiment.

According to an embodiment, the electronic device 100 of FIG. 5B may further include a lower material 571 unlike the electronic device 100 of the AA' section of FIG. 5A.

According to one embodiment, plane B-B' in FIG. 5B corresponds to the center area of the hinge structure 300 through which the wiring member (343 in FIG. 3 ) passes, and thus, plane A-A' in FIG. 5A Unlike the metal plate 410 , the metal plate 410 of FIG. 5B may not include the protrusion 420 and the recess 430 .

According to one embodiment, a waterproof tape 550 and a lower material 571 may be further disposed between the metal plate 410 and the bracket 310 . For example, the waterproof tape 550 may be disposed in a first area adjacent to the first axis and in a second area spaced apart from the first area and adjacent to ends of the bracket 310 and the metal plate 410 .

Also, according to one embodiment, the lower material 571 may be disposed in an area more adjacent to the first axis than the first area.

According to one embodiment, the lower material 571 may be disposed below the metal plate 410 . According to an embodiment, the lower material 570 may include a first lower material 571 and a second lower material 572, and the first lower material 571 is below the first metal plate 411. and the second lower material 572 may be disposed below the second metal plate 412 .

According to one embodiment, the lower material 571 may correspond to a shielding sheet, and the shielding sheet may be formed in a partial area under the metal plate 410 corresponding to the hinge structure 300 .

According to one embodiment, the lower material 571 has been described as being applicable to a shielding sheet, but is not limited thereto. For example, the lower material 571 may correspond to graphite or cushion.

5C is a cross-sectional view of the electronic device of FIG. 4 taken along line C-C′ according to an embodiment.

According to an embodiment, the protrusion 420 on the metal plate 410 of FIG. 5C may be formed in a direction opposite to that of the protrusion 420 on the metal plate 410 of FIG. 5A. For example, the protrusion 420 of the second metal plate 412 of FIG. 5C may be formed toward a third direction (eg, -x direction).

According to an embodiment, the electronic device 100 of FIG. 5C may include only one lower material 571 unlike the electronic device 100 of FIG. 5B having a BB′ cross section.

According to an embodiment, a lower material 570 and a waterproof tape 550 may be formed below the first metal plate 411, but the lower material 570 is omitted below the second metal plate 412. and only the waterproof tape 550 may be formed. For example, a first lower material 571 and a first waterproof tape 551 may be disposed below the first metal plate 411, and a second waterproof tape ( 552) may be placed.

According to one embodiment, as the first lower material 571 is formed under the first metal plate 411, the first waterproof tape 551 at the C-C' cross section may be formed in one line. there is. According to one embodiment, as the lower material 570 is omitted under the second metal plate 412, the second waterproof tape 552 may be formed in one or more lines.

According to an embodiment, the first waterproof tape 551 disposed below the first metal plate 411 is thicker than the second waterproof tape 552 disposed below the second metal plate 412. It can be. According to one embodiment, as the thickness of the first waterproof tape 551 is thicker than the thickness of the second waterproof tape 552, one line of the first waterproof tape ( 551), the first metal plate 411 may be fixed on the first bracket 311 with substantially the same adhesive strength as that of the second metal plate 412.

According to one embodiment, the lower material 570 of FIG. 5c may be substantially the same as the lower material 570 of FIG. 5b.

Referring to FIGS. 5A, 5B, and 5C , although a cover panel, a damping layer, and/or a digitizer are not shown, the electronic device 100 includes a cover panel, a damping layer, and/or A digitizer may be further included.

An embodiment including a cover panel, a damping layer, and/or a digitizer will be described later in detail with reference to FIG. 6 .

FIG. 6 is a cross-sectional view of the electronic device of FIG. 4 taken along line A-A' according to another embodiment.

Referring to FIG. 6 , the main display 200 of FIG. 6 further includes a damping layer 630, a cover panel 610, and/or a digitizer 620 in the fifth main display 200. may apply to

According to one embodiment, a damping layer 630 may be formed under the cover glass 510 . In one example, the damping layer 630 may be disposed between the cover glass 510 and the display panel 520 . According to an embodiment, the damping layer 630 may be attached to the cover glass 510 by the first adhesive layer 561, and the panel 521 of the display panel 520 by the second adhesive layer 651 (PSA2). ) can be attached.

According to one embodiment, the cover panel 610 may be disposed below the display panel 520 . According to an embodiment, the cover panel 610 may be attached to the dielectric layer structure 530 by an adhesive (eg, PSA).

According to one embodiment, the cover panel 610 may be disposed across the first axis. For example, the cover panel 610 may be formed in a region corresponding to the dielectric layer structure 530, but is not limited thereto. For example, the cover panel 610 may be disposed to be formed on an inner region of an edge of the dielectric layer structure 530 .

According to an embodiment, one area of the cover panel 610 corresponding to the first axis has a thinner thickness in one direction (eg, z direction) than another area of the cover panel 610 spaced apart from the first axis. can be formed According to an embodiment, the thickness of one area of the cover panel 610 corresponding to the first axis is formed thin, so that the main display 200 can be folded or unfolded.

The cover panel 610 may increase the rigidity of the main display 200 . For example, when shearing or distortion occurs in the lower portion of the main display 200 , the cover panel 610 may block propagation of the shearing or distortion to the display panel 520 . According to an embodiment, shearing or distortion of the display panel 520 is prevented, thereby increasing the rigidity of the main display 200 .

According to an embodiment, the electronic device 100 of FIG. 6 may include a cover panel 610 whose thickness is reduced compared to an electronic device that does not include the protrusion 420 and the recess 430 .

For example, referring to FIGS. 4 to 5C , the first metal plate 411 and the second metal plate 412 are coupled to each other in the first state 100A by the protrusion 420 and the recess 430. , Shearing behavior or distortion of the metal plate 410 in the first axial direction (eg, +y direction or -y direction) due to external impact may be reduced.

According to an embodiment, since the shearing behavior or distortion is reduced by the metal plate 410 having the protrusion 420 and the recess 430, the electronic device 100 has the protrusion 420 and the recess 430. It may further include a cover panel 610 whose thickness is reduced compared to the electronic device that does not include it.

According to an embodiment, by reducing the thickness of the cover panel 610, cost and time for producing the electronic device 100 can be saved, and the electronic device 100 has a wrinkle-improved main display 200. can include

According to an embodiment, unlike the thermoplastic material 540 of FIG. 5A , the thermoplastic material 540 of FIG. 6 may be formed under a portion of the dielectric layer structure 530 corresponding to the first axis. In one example, the thermoplastic material 540 may be disposed under the lattice pattern of the dielectric layer structure 530 .

According to one embodiment, the digitizer 620 may be disposed under the dielectric layer structure 530 or the thermoplastic material 540 . For example, digitizer 620 may be attached to dielectric layer structure 530 by third adhesive layer 652 .

According to an embodiment, a region of the digitizer 620 corresponding to the first axis may be formed by being disconnected. For example, the first area of the digitizer 620 may be disposed on the first metal plate 411 and the second area of the digitizer 620 may be disposed on the second metal plate 412 .

According to an embodiment, since the digitizer 620 is formed separately in an area corresponding to the first axis, when the electronic device 100 is folded or unfolded, the digitizer 620 can be folded or unfolded without damage.

According to an embodiment, the digitizer 620 is a device capable of detecting an input for an x position and/or a y position, and may detect a magnetic field type input device (eg, an electronic pen). For example, at least one processor (eg, the processor 1720 of FIG. 17 ) may provide current to the digitizer 620 , and the digitizer 620 may generate an electromagnetic field. When the electronic pen approaches the electromagnetic field of the digitizer 620, an electromagnetic induction phenomenon occurs and a resonant circuit of the electronic pen may generate current. The resonant circuit of the electronic pen may form a magnetic field using the generated current. At least one processor may detect the location by scanning the strength of the magnetic field applied from the electronic pen to the digitizer 620 over the entire area. At least one processor may perform an operation based on the detected location.

According to one embodiment, a shielding sheet 640 (eg, copper sheet, Cu sheet) may be formed under the digitizer 620 . According to one embodiment, the shielding sheet 640 may be formed in an area corresponding to the digitizer 620 . For example, as the digitizer 620 is formed separately in an area corresponding to the first axis, the shielding sheet 640 may be formed separately in an area corresponding to the first axis.

According to one embodiment, the shielding sheet 640 may be attached to the metal plate 410 by the fourth adhesive layer 654 .

According to an embodiment, the metal plate 410 of FIG. 6 may be substantially the same as the metal plate 410 of FIGS. 4 to 5C.

7 is a view illustrating a front surface of a metal plate of an electronic device according to another embodiment.

Referring to FIG. 7 , the electronic device 100 of FIG. 7 may correspond to the electronic device 100 in which the waterproof tape 550 of FIG. 5 or 6 is omitted.

According to one embodiment, the dielectric layer structure 530 may be attached to the bracket 310 by the fourth adhesive layer 720 . According to one embodiment, the fourth adhesive layer 720 may be disposed on the edges of the dielectric layer structure 530 and the bracket 310 . For example, the fourth adhesive layer 720 may be disposed on a region on the bracket 310 spaced apart from the first axis.

According to an embodiment, since the fourth adhesive layer 720 is spaced apart from the first axis, a space may be formed between the dielectric layer structure 530, the bracket 310, and the hinge structure 300. In other words, according to an embodiment, the fourth adhesive layer 720 is spaced apart from the first axis, so that the fourth adhesive layer 720, the dielectric layer structure 530, the bracket 310, and the hinge structure 300 are surrounded. The thermoplastic material 540, the metal plate 410, and the cushion member 730 may be disposed in the space.

According to one embodiment, a thermoplastic material 540, a metal plate 410, and/or a cushion member 730 may be disposed in the space.

According to an embodiment, the thermoplastic material 540 may be disposed under the dielectric layer structure 530 . According to an embodiment, a metal plate 710 may be disposed below the thermoplastic material 540 .

According to an embodiment, the metal plate 710 of FIG. 7 may correspond to substantially the same plate as the metal plate 410 of FIG. 4 . That is, the description of the metal plate 410 of FIG. 4 may also be applied to the metal plate 710 of FIG. 7 .

According to one embodiment, the thermoplastic material 740 and the metal plate 710 of FIG. 7 are substantially the same as the thermoplastic material 540 and the metal plate 410 of FIGS. 4 to 6, and It may correspond to a metal plate.

For example, the metal plate 410 of FIG. 7 includes a protrusion and a recess, so that the metal plate 410 and the main display 200 due to external impact are moved in the first axis direction (eg, +y direction or -y direction). y-direction), shearing behavior or twisting can be prevented.

According to an embodiment, a cushion member 730 may be disposed below the metal plate 410 . For example, each cushion member 730 may be disposed between the metal plate 410 , the hinge structure 300 and the bracket 310 .

According to one embodiment, the cushion member 730 may be formed by being disconnected from a region corresponding to the first axis. According to an embodiment, since the cushion member 730 is formed by being disconnected in an area corresponding to the first axis, the cushion member 730 may be folded or unfolded based on the first axis.

According to an embodiment, the cushion member 730 is disposed below the metal plate 410, so that the electronic device 100 is connected to the metal plate 410 and the hinge structure ( 300) can be prevented from colliding.

According to an embodiment, the cover glass 510 may further include a polarizer 750. For example, the polarizer 750 may be disposed between the transparent plate 512 and the panel 525 . According to an embodiment, the polarizer 750 may be attached to the transparent plate 512 by an adhesive layer (eg, PSA).

8 is a view illustrating a front surface of a hinge plate of an electronic device according to an exemplary embodiment.

According to an embodiment, the electronic device 100 includes a housing 110 constituting the exterior of the electronic device 100, a bracket 310 disposed in the housing 110 and mounting a plurality of electronic components, and the electronic device 100 ) It may include a hinge structure 300 for rotating the housing 110.

According to an embodiment, the hinge structure 300 may be disposed in an area corresponding to a first axis (eg, a folding axis). For example, the central axis of the hinge structure 300 may correspond to the first axis, but is not limited thereto. For example, the hinge structure 300 may be folded or unfolded around a first axis. Through this, the electronic device 100 may switch between a folded state 100B and an unfolded state 100A.

According to one embodiment, the hinge structure 300 may be connected to the first housing 111 and the second housing 112 . For example, the hinge structure 300 may connect the first housing 111 and the second housing 112 such that the second housing 112 is rotatable about a first shaft with respect to the first housing 111 .

According to one embodiment, the hinge structure 300 may be connected to a first bracket 311 fixed in the first housing 111 and a second bracket 312 fixed in the second housing 112 . For example, as the hinge structure 300 is connected to the first bracket 311 in the first housing 111 and the second bracket 312 in the second housing 112, the hinge structure 300 is connected to the first bracket With respect to (311), the second bracket 312 may be rotatable around the first axis.

According to one embodiment, the bracket 310 including the first bracket 311 and the second bracket 312 may be disposed on both sides of the hinge structure 300 within the housing 110 . For example, the first bracket 311 is disposed in a third direction (eg, -x direction) with respect to the hinge structure 300, and the second bracket 312 is disposed in a second direction (eg, +x direction) can be placed in According to an embodiment, a first battery 451 and/or a speaker module 453 may be disposed in the first bracket 311, and a second battery 452 may be mounted in the second bracket 312. It can be.

According to one embodiment, the bracket 310 may be physically connected to the hinge structure 300 described above. Therefore, according to one embodiment, the bracket 310 by the hinge structure 300 can be rotated based on the first axis. For example, the second bracket 312 may be rotatable about the first axis with respect to the first bracket 311 by the hinge structure 300 .

9A is a diagram illustrating a hinge structure of an electronic device according to an embodiment.

Referring to FIG. 9A , the hinge structure 300 of the electronic device 100 includes a hinge module 920 connected to the first housing 111 and the second housing 112, and the electronic device 100 can be folded or unfolded. At least one hinge gear 910 that rotates so as to rotate, a hinge plate 960 covering at least a portion of the hinge module 920 and the hinge gear 910, and supporting at least one component of the hinge structure 300 A fixing screw 990 coupling the hinge cover 330 and/or the hinge gear 910 and the hinge module 920 and the hinge cover 330 may be included.

According to one embodiment, the hinge cover 330 may support the hinge module 920 and the hinge gear 910 . For example, at least a portion of the hinge module 920 and at least a portion of the hinge gear 910 are disposed on the hinge cover 330, so that the hinge cover 330 includes the hinge module 920 and the hinge gear 910. can support

According to an embodiment, one surface of the hinge cover 330 may be exposed to the outside when the electronic device 100 is in the second state 100B. For example, when the second housing 112 is folded with respect to the first housing 111, one surface of the hinge cover 330 is exposed to the outside between the first housing 111 and the second housing 112. can

According to an embodiment, at least a portion of the hinge cover 330 may be formed of a conductive member. For example, the hinge cover 330 may be formed of a metal member (stainless use steel). However, it is not limited thereto, and a part of the hinge cover 330 may include a non-conductive member.

According to an embodiment, at least one hinge gear 910 may correspond to a component that determines an angle at which the electronic device 100 is folded or unfolded.

According to an embodiment, at least one hinge gear 910 may be disposed in an area corresponding to the first axis. According to an embodiment, by rotating the hinge gear 910, the electronic device 100 may switch between a folded state 100B and an unfolded state 100A.

According to an embodiment, at least one hinge gear 910 may be formed symmetrically up and down with respect to the second axis. For example, the first hinge gear 911 may be disposed in a direction from the second axis of the electronic device 100 to the top of the electronic device 100 (eg, +y direction). For example, the first hinge gear 911 may be disposed in a region on the first axis adjacent to the camera hole ( 150 in FIG. 1 ).

As another example, the second hinge gear 912 may be disposed in a direction from the second axis of the electronic device 100 to the bottom of the electronic device 100 (eg, -y direction). For example, the second hinge gear 912 may be disposed in a region on the first axis adjacent to the USB hole (eg, 151 in FIG. 1 ).

According to one embodiment, the first hinge gear 911 and the second hinge gear 912 may be fixed on the hinge cover 330 by a fixing screw 990 .

According to one embodiment, the hinge plate 960 may correspond to a plate disposed on front surfaces of the hinge gear 910 , the hinge module 920 , and the hinge cover 330 . For example, a portion of hinge plate 960 may be disposed on hinge gear 910 . In addition, a portion of the hinge plate 960 may be disposed on substantially the same plane as the hinge gear 910 (eg, an xy plane), but is not limited thereto. For example, a portion of the hinge plate 960 may be disposed on the hinge gear 910 forming a plurality of layers.

According to an embodiment, the hinge plate 960 may be disposed in front of the hinge gear 910 and the hinge cover 330 to protect the hinge gear 910 and/or the hinge cover 330 .

According to one embodiment, the hinge module 920 may be connected to the hinge gear 910. For example, a part of the hinge module 920 may be folded or unfolded around the first axis by being physically connected to the hinge gear 910 .

9B is a diagram illustrating a hinge module of a hinge structure according to an embodiment.

According to one embodiment, FIG. 9B is a view showing only the hinge module 920 of the hinge structure 300 .

According to an embodiment, the hinge module 920 may include a first hinge module 921 , a second hinge module 922 , a third hinge module 923 , and a fourth hinge module 924 .

According to an embodiment, the first hinge module 921 and the second hinge module 922 may be disposed in an upper area of the electronic device 100 . For example, the first hinge module 921 and the second hinge module 922 may be disposed in one area on the first axis adjacent to the camera hole ( 150 in FIG. 1 ) of the electronic device 100 .

According to an embodiment, the third hinge module 923 and the fourth hinge module 924 may be disposed in a lower area of the electronic device 100 . For example, the third hinge module 923 and the fourth hinge module 924 may be disposed in one area on the first axis adjacent to the USB hole ( 151 in FIG. 1 ) of the electronic device 100 .

According to one embodiment, the hinge module 920 may be formed left-right symmetrically with respect to the first axis. For example, the first hinge module 921 and the third hinge module 923 may be disposed in a second direction (eg, +x direction) with respect to the first axis. According to an embodiment, the second hinge module 922 and the fourth hinge module 924 may be disposed in a third direction (eg, -x direction) with respect to the first axis.

In other words, according to an embodiment, the first hinge module 921 and the second hinge module 922 may be formed symmetrically with respect to the first axis, and the third hinge module 923 and the fourth hinge module 924 may be formed left-right symmetrically with respect to the first axis.

According to one embodiment, the hinge module 920 may be formed vertically symmetrically with respect to the second axis.

Also, according to an embodiment, the third hinge module 923 and the fourth hinge module 924 may be formed symmetrically with the first hinge module 921 and the second hinge module 922 with respect to the second axis. there is.

Although the hinge module 920 has been described as being symmetrical about the first axis and the second axis, it is not limited thereto. For example, a portion of the first hinge module 921 and a portion of the second hinge module 922 may be formed asymmetrically with respect to the first axis. For example, the first hinge module protrusion 941 may be formed in the first hinge module 921 , and the second hinge module recess 952 may be formed in the second hinge module 922 .

Also, according to an embodiment, a part of the first hinge module 921 may be formed asymmetrically with a part of the third hinge module 923 based on the second axis. For example, the first hinge module protrusion 941 may be formed on a part of the first hinge module 921, and the first hinge module recess 951 may be formed on a part of the second hinge module 922. .

According to an embodiment, a part of the hinge module 920 may be connected to the housing 110 of the electronic device 100. For example, the first hinge module 921 and the third hinge module 923 may be connected to the first housing 111 or the first bracket 311 fixed within the first housing 111 .

The connection relationship between the hinge module 920 and the housing 110 has been described only for the first hinge module 921, but is not limited thereto. For example, a part of the second hinge module 922 is connected to the first hinge gear 911, and another part of the second hinge module 922 is connected to the second housing 112 or the second bracket 312. can be connected

According to an embodiment, the connection relationship between the hinge module 920 and the housing 110 may also be applied to the third hinge module 923 and the fourth hinge module 924 .

According to an embodiment, since the hinge gear 910 and the hinge module 920 are connected, as the hinge gear 910 rotates based on the first axis, the hinge module 920 can rotate based on the first axis. .

According to one embodiment, the hinge module 920 may include at least one hinge module protrusion 940 and at least one hinge module recess 950 . For example, the first hinge module 921 may include a first hinge module protrusion 941 extending toward the second hinge module 922 when the electronic device 100 is in the unfolded state 100A. According to an embodiment, the second hinge module 922 is depressed in a direction opposite to the direction in which the first hinge module 921 is located when the electronic device 100 is in an unfolded state (100A), and the first hinge module protrusion and a second hinge module recess 952 for receiving 941 .

According to an embodiment, the hinge module 920 in which the hinge module protrusion 940 and the hinge module recess 950 are formed has been described as the first hinge module 921 and the second hinge module 922, but is not limited thereto. don't For example, the third hinge module 923 may include a first hinge module recess 951 and the fourth hinge module 924 may include a second hinge module protrusion 942 .

According to an embodiment, when viewed from the front surface 101 of the electronic device 100, the hinge module 920 may overlap a portion of the metal plate 410. For example, the first hinge module 921 is a first hinge module protrusion 941 overlapping the first protrusion 421 of the first metal plate 411 when viewed from the front surface 101 of the electronic device 100. ) may be included. For example, the second hinge module 922 may include a second hinge module recess overlapping the second recess 432 of the second metal plate 412 when viewed from the front surface 101 of the electronic device 100 ( 952) may be included.

According to an embodiment, the third hinge module 923 overlaps the first recess 431 of the first metal plate 411 when viewed from the front surface 101 of the electronic device 100. Seth 951 may be included. According to an embodiment, the fourth hinge module 924 is a second hinge module protrusion overlapping the second protrusion 422 of the second metal plate 412 when viewed from the front surface 101 of the electronic device 100 ( 942) may be included.

According to an embodiment, the hinge module protrusion 940 and the hinge module recess 950 may be formed in numbers and shapes corresponding to those of the protrusion 420 and the recess 430 of the metal plate 410 . For example, when the first protrusion 421 and/or the third protrusion 423 are formed on the first metal plate 411, the first hinge module 921 and/or the third hinge module 923 have A first hinge module protrusion 941 and/or a third hinge module protrusion (not shown) may be formed.

According to an embodiment, the hinge module protrusion 940 and the hinge module recess 950 are further formed so that the metal plate 410 and the hinge module 920 due to external impact are moved in the first axial direction (eg, + The shear behavior or twisting in the y direction or -y direction) can be reduced.

According to an embodiment, as the shear behavior or twist of the metal plate 410 and the hinge module 920 decreases, transfer of the shear behavior or twist to the main display 200 on the metal plate 410 may decrease. there is. According to an embodiment, as shearing or twisting of the main display 200 is reduced, the electronic device 100 can prevent the main display 200 from being damaged.

Also, according to an embodiment, as the durability of the main display 200 is secured, the cover panel ( 610 in FIG. 5 ) may be omitted from the electronic device 100 . According to one embodiment, as the cover panel 610 is omitted, cost and time for producing the electronic device 100 can be saved.

10 is a diagram illustrating a hinge bracket of an electronic device according to an embodiment.

According to one embodiment, the hinge structure 300 may further include a hinge bracket 1010. According to an embodiment, the hinge bracket 1010 may be disposed on the rear surface of the hinge module 920 when the electronic device 100 is in an unfolded state 100A.

For example, when the electronic device 100 is in the unfolded state (100A), the hinge bracket 1010 is the back surface of the first hinge module 921 and the second hinge module 922 and/or the third hinge module 923 ) and the rear surface of the fourth hinge module 924.

According to one embodiment, when the hinge module 920 and/or the metal plate 410 is rotated about the first axis by the hinge gear 910, the hinge bracket 1010 is the hinge module of the hinge module 920. A guide hall 1020 for guiding the protruding portion 940 and the protruding portion 420 of the metal plate 410 to rotate in a certain direction may be formed.

For example, the metal plate 410 and/or the hinge module 920 may rotate in a third direction (eg, clockwise direction) or a fourth direction (eg, counterclockwise direction) of FIG. 10 . According to an embodiment, when the metal plate 410 and/or the hinge module 920 rotates in the third direction, the protruding portion 420 or the hinge module protruding portion 940 is drawn into the guide hole 1020 to form the third direction. It can rotate in a certain direction. For example, when the first metal plate 411 and/or the third hinge module 923 rotates in the third direction, the guide hole 1020 is the first protrusion 421 drawn into the guide hole 1020. And/or the first hinge module protrusion 941 may be guided to rotate constantly in the third direction.

Although the metal plate 410 and/or the hinge module 920 has been described as rotating in the third direction, it is not limited thereto and the metal plate 410 and/or the hinge module 920 may rotate in the fourth direction. . According to an embodiment, as the metal plate 410 and/or the hinge module 920 rotates in the fourth direction, the guide hole 1020 extends through the protrusion 420 and/or the hinge drawn into the guide hole 1020. The module protrusion 940 may be guided to rotate constantly in the fourth direction.

According to an embodiment, by including the hinge bracket 1010 in which the guide hole 1020 is formed, the electronic device 100, when switching from the first state 100A to the second state 100B, protrudes 420 and It is possible to prevent the hinge module protrusion 940 from colliding with other electronic components.

A specific embodiment of the guide hole 1020 and the protrusion 420 of the hinge bracket 1010 will be described later in detail with reference to FIGS. 11 and 12 .

11 is a diagram illustrating a hinge bracket of an electronic device according to an embodiment.

Referring to FIG. 11 , when the electronic device 100 according to an embodiment is in a first state 100A and a second state 100B, a relationship between the guide hole 1020 and the hinge module protrusion 940 may be confirmed. .

According to one embodiment, the hinge module 920 may be disposed on the front side of the hinge bracket 1010. For example, when the electronic device 100 is in the first state 100A, the hinge module 920 may be disposed facing the hinge bracket 1010 . Also, according to an embodiment, when the electronic device 100 is in the second state 100B, the hinge module 920 is disposed perpendicular to the hinge bracket 1010 or toward the second direction (eg, -z direction). It can be. In addition, according to one embodiment, the third hinge module 923 faces the second direction (eg, +x direction) and the fourth hinge module 924 faces the third direction (eg, -x direction) can be placed.

According to an embodiment, when the electronic device 100 is converted from the first state 100A to the second state 100B, the angle between the hinge module 920 and the hinge bracket 1010 gradually increases and It can rotate based on 1 axis.

According to an embodiment, the third hinge module 923 may further include a third hinge module protrusion 943, and the fourth hinge module 924 may include a fourth hinge module 924 accommodating the third hinge module protrusion 943. It may further include a hinge module recess 954.

According to an embodiment, when the electronic device 100 is in the first state 100A, the third hinge module protrusion 943 of the third hinge module 923 is the fourth hinge module of the fourth hinge module 924. It may be received in recess 954 . In addition, when the electronic device 100 is in the second state 100B, the third hinge module protrusion 943 of the third hinge module 923 may enter the guide hole 1020 formed in the hinge bracket 1010. there is.

According to an embodiment, when the electronic device 100 is converted from the first state 100A to the second state 100B, the third hinge module protrusion 943 of the third hinge module 923 extends in the third direction. (clockwise). According to an embodiment, while the third hinge module protrusion 943 moves in the third direction (clockwise direction), the third hinge module protrusion 943 enters the guide hole 1020 of the hinge bracket 1010. and can move uniformly in the third direction along the guide hole 1020.

According to an embodiment, in the second state 100A, the third hinge module protrusion 943 may remain inserted into the guide hole 1020 .

According to an embodiment, since the guide hole 1020 is formed, when the electronic device 100 switches from the first state 100A to the second state 100B, the electronic device 100 includes the protruding portion 420 and It is possible to prevent the hinge module protrusion 940 from colliding with other electronic components.

Also, according to an embodiment, when the electronic device 100 is in the second state 100B, the protruding portion 420 and the hinge module protruding portion 940 are accommodated in the guide hole 1020, so that the electronic device 100 is made of metal. It is possible to prevent the plate 410 from shaking in the first axial direction (eg, +y direction or -y direction) in the second state 100B.

According to an embodiment, a portion of the first hinge area 1110 adjacent to the third hinge module protrusion 943 of the hinge module 920 is spaced apart from the third hinge module protrusion 943 of the hinge module 920. 2 may be formed thicker than the hinge region 1120 . For example, a portion of the first hinge region 1110 of the hinge module 920 may have a first thickness, and the second hinge region 1120 may have a second thickness. According to one embodiment, the first thickness may be greater than the second thickness.

According to an embodiment, a first thickness of a part of the first hinge region 1110 of the hinge module 920 is formed to be thicker than a second thickness of the second hinge region 1120 of the hinge module 920, thereby providing an electronic device. Damage to the third hinge module protrusion 943 of 100 can be prevented.

12 is a diagram illustrating a hinge bracket of an electronic device according to an embodiment.

Referring to FIG. 12 , as the electronic device 100 is converted from the unfolded state 100A to the folded state 100B, the protrusion 420 of the metal plate 410 accommodated in the guide hole 1020 and/or the hinge The hinge module protrusion 940 of the module 920 may be accommodated in the guide hole 1020 .

According to an embodiment, as the hinge gear 910 rotates, the third hinge module 923 and the fourth hinge module 924 may rotate based on the first axis.

Referring to FIG. 12 according to an embodiment, as the third hinge module 923 and the fourth hinge module 924 rotate about the first axis, the third hinge module 923 and the fourth hinge module 924 The angle formed by this may be formed from 180 degrees to 0 degrees. For example, the angle formed by the third hinge module 923 and the fourth hinge module 924 may be 120 degrees, 90 degrees, or 45 degrees, but is not limited thereto. For example, an angle between the third hinge module 923 and the fourth hinge module 924 may be 30 degrees.

According to an embodiment, as the angle formed by the third hinge module 923 and the fourth hinge module 924 changes from 180 degrees to 0 degrees, the third hinge module protrusion 943 of the third hinge module 923 It may be inserted into the guide hole 1020 of the hinge bracket 1010.

According to one embodiment, in the unfolded state (100A, the first state) or 180 degrees, the third hinge module protrusion 943 of the third hinge module 923 extends to the second hinge module of the fourth hinge module 924. Can be accommodated in seth 952.

According to one embodiment, as it changes from an unfolded state (100A, first state) or 180 degrees to a folded state (100B) or 0 degrees, the third hinge module protrusion 943 of the third hinge module 923 is hinge bracket It can be introduced into the guide hole 1020 of 1010 and rotated constantly in the direction of rotation. In other words, according to an embodiment, the guide hole 1020 of the hinge bracket 1010 may guide the third hinge module protrusion 943 to rotate constantly in the direction in which it rotates.

According to one embodiment, in the folded state (100B, the second state) or at 0 degrees, the third hinge module 923 and the fourth hinge module 924 may be disposed facing each other, and the third hinge module 923 The third hinge module protrusion 943 may be inserted into the guide hole 1020 of the hinge bracket 1010 .

According to one embodiment, the hinge module protrusion 940 accommodated in the guide hole 1020 of the hinge bracket 1010 has been described as the third hinge module protrusion 943 in FIG. 12 , but this is only an example for convenience. It is not limited to the third hinge module protrusion 943 . For example, the at least one hinge module protrusion 940 formed on the first hinge module 921, the second hinge module 922, and/or the fourth hinge module protrusion 944 may cause the electronic device 100 to unfold. It can be accommodated in the guide hole 1020 of the hinge bracket 1010 as it is converted from the state 100A to the folded state 100B.

In addition, according to one embodiment, it has been described as an example that the hinge module protrusion 940 of the hinge module 920 is accommodated in the guide hole 1020, but is not limited thereto, and the protrusion 420 of the metal plate 410 May be accommodated in the guide hole (1020).

13 is a view illustrating a protruding portion of a metal plate according to an exemplary embodiment.

Referring to FIG. 13 , the protrusion 420 of the metal plate 410 may have a first height H and a first width W.

According to an embodiment, the first height H of the protrusion 420 may mean a length extending in the first axial direction (eg, +y direction or -y direction). According to an embodiment, the first height H of the protrusion 420 may mean a length extending in the second axial direction (eg, +x direction or -x direction).

According to an embodiment, the first height H of the protrusion 420 may be longer than the first width W of the protrusion 420 .

According to an embodiment, when the first height H is equal to or longer than the first width W, the protruding portion 420 may not be separated from the metal plate 410 even when an external impact is received. In other words, according to an embodiment, since the first height H is equal to or longer than the first width W, durability of the protrusion 420 may be increased.

According to an embodiment, the protrusion 420 having a first height H equal to or longer than the first width W has stronger durability than a protrusion having a first height H shorter than the first width W. can be secured

14 is a diagram illustrating a protrusion of an electronic device according to another embodiment.

Referring to FIG. 14 , the protrusion 420 of the metal plate 410 may be formed in various shapes. According to one embodiment, the protrusion 420 may be formed in a rectangular-shaped shape, but is not limited thereto. For example, the protrusion 420 may be formed in a semicircle-shaped or triangle-shaped shape.

Alternatively, according to one embodiment, the protrusion 420 may be formed in a trapezoidal-shape. For example, the protrusion 420 may extend from one point of the edge 440 of the metal plate 410 . According to one embodiment, the protrusion 420 includes a first corner 1431 extending from a point of the edge 440, a second corner 1432 opposite to the first corner 1431 and a second axis, and/or a third edge 1433 connecting the first edge 1431 and the second edge 1432 .

According to an embodiment, the first edge 1431 may extend from a point of the edge 440 toward the second axis. According to an embodiment, the first edge 1431 may be formed symmetrically with the second edge 1432 based on the second axis. According to an embodiment, the third corner 1433 may correspond to a corner parallel to the edge 440 of the metal plate 410 .

According to one embodiment, the first edge 1431 and the second edge 1432 of the protrusion 420 form a constant angle with respect to the first axis, extend toward the second axis, and may be connected to the third edge 1433. . In other words, the first edge 1431 and the second edge 1432 may extend with a certain slope and be connected to the third edge 1433 .

According to one embodiment, as the first edge 1431 and the second edge 1432 of the protrusion 420 are connected to the third edge 1433 with an inclination, the recess 430 in which the protrusion 420 is accommodated. ) may also be formed with a gradient. For example, the fourth edge 1434 of the recess 430 facing the first edge 1431 of the protrusion 420 and the fifth edge of the recess 430 facing the second edge 1432 ( 1435) may be formed with a slope corresponding to the slope of the first corner 1431 and the second corner 1432.

According to one embodiment, since the first edge 1431, the second edge 1432, the fourth edge 1434, and the fifth edge 1435 are formed with a constant inclination, the durability of the protrusion 420 is increased. can do.

15 is a view illustrating a front surface of a metal plate of an electronic device according to an embodiment.

Referring to FIG. 15 , the metal plate 410 may include a plurality of first regions 1500 and the hinge structure 300 may include a plurality of second regions 1510 .

According to an embodiment, the plurality of first regions 1500 may refer to regions in which the protrusion 420 and the recess 430 are formed on the metal plate 410 . Also, according to an embodiment, the plurality of second regions 1510 may refer to regions in which a plurality of components of the hinge structure 300 (eg, hinge gears (910 in FIG. 9 )) are formed.

According to an embodiment, the electronic device 100 may include a hinge structure 300 disposed in an area corresponding to the first axis and an FPCB 343 passing through the hinge structure 300 .

According to an embodiment, the second plurality of areas 1510 of the hinge structure 300 include a screw fastening area 1520 where a screw connecting the hinge structure 300 and the bracket 310 is fastened, and the electronic device 100 It may include a central area 1530 through which the FPCB 343 passes, and/or a hinge gear area 1540 where the hinge gear 910 is disposed.

According to an embodiment, the FPCB 343 electrically connects a first electronic component (not shown) disposed inside the first housing 111 and a second electronic component disposed inside the second housing 112. can For example, the FPCB 343 passes through the center area 1530 of the hinge structure 300 and connects the first electronic component disposed inside the first housing 111 and the second housing 112. A second electronic component disposed therein may be electrically connected. According to one embodiment, the central area 1530 of the hinge structure 300 may correspond to an area corresponding to the second axis, but is not limited thereto.

According to an embodiment, the hinge gear area 1540 includes a first hinge gear area 1541 where the first hinge gear 911 is disposed and a second hinge gear area 1542 where the second hinge gear 912 is disposed. can include

According to an embodiment, the first hinge gear region 1541 may be formed in one region of the hinge structure 300 positioned in a first direction (eg, +y direction) with respect to the second axis. According to one embodiment, the second hinge gear area 1542 is formed in one area of the hinge structure 300 located in a second direction (eg, -y direction) opposite to the first direction with respect to the second axis. It can be.

According to one embodiment, the first hinge gear region 1511 may be formed symmetrically with the second hinge gear region 1512 with respect to the second axis, but is not limited thereto.

According to an embodiment, the screw fastening area 1520 is adjacent to the first hinge gear area 1511 and includes a first screw fastening area 1521 where a screw is fastened, a first screw fastening area 1521 and a central area 1530. ) A second screw fastening region 1522 in which screws are fastened between, a third screw fastening region 1523 in which screws are fastened between the fourth screw fastening region 1524 and the central region 1530, and/or the second screw fastening region 1522. A fourth screw fastening area 1524 adjacent to the hinge gear area 1512 and into which a screw is fastened may be included.

According to one embodiment, the first screw fastening region 1521 and/or the second screw fastening region 1522 are of the hinge structure 300 positioned in a first direction (eg, +y direction) based on the second axis. It can be formed in one area. According to one embodiment, the third screw fastening region 1523 and/or the fourth screw fastening region 1524 are of the hinge structure 300 positioned in a second direction (eg, -y direction) with respect to the second axis. It can be formed in one area.

According to an embodiment, the first screw fastening region 1521 and the fourth screw fastening region 1524 may be formed symmetrically with respect to the second axis, and the second screw fastening region 1522 and the third screw fastening region 1522 may be formed symmetrically with respect to the second axis. 1523 may be formed symmetrically with respect to the second axis, but is not limited thereto.

According to an embodiment, the protrusion 420 and the recess 430 of FIG. 4 may be formed in the first plurality of regions 1500 of the metal plate 410 .

According to an embodiment, the plurality of first regions 1500 formed on the metal plate 410 may be formed to be spaced apart from the plurality of second regions 1510 formed on the hinge structure 300 .

According to an embodiment, the first plurality of regions 1500 includes a first region 1501 formed between the hinge gear region 1540 of the hinge structure 300 and the side surface 103 of the electronic device 100 and the second region 1501. 7 areas 1507 may be included. For example, the first region 1501 may be spaced apart from the first hinge gear region 1511 and formed between the first hinge gear region 1511 and the side surface 103 of the electronic device 100 . According to an embodiment, the seventh region 1507 is spaced apart from the second hinge gear region 1512 and may be formed between the second hinge gear region 1512 and the side surface of the housing 110 .

In other words, according to an embodiment, the first region 1501 and/or the seventh region 1507 may be formed in an area adjacent to an edge of the metal plate 410 .

According to an embodiment, the plurality of first regions 1500 of the metal plate 410 include a second region 1502 formed between the first hinge gear region 1541 and the first screw fastening region 1521, A third region 1503 formed between the first screw fastening region 1521 and the second screw fastening region 1522, and a fourth region 1504 formed between the second screw fastening region 1522 and the central region 1530. ), a fifth region 1505 formed between the third screw fastening region 1523 and the fourth screw fastening region 1524, and/or the fourth screw fastening region 1520 and the second hinge gear region 1542 A sixth region 1506 formed therebetween may be further included.

For example, the first hinge gear region 1541 may be formed between the first region 1501 and the second region 1502, and the second hinge gear region 1542 may be formed between the sixth region 1506 and the second region 1506. 7 may be formed between regions 1507 .

According to an embodiment, the protrusion 420 and the recess 430 of FIG. 4 may be formed in at least one of the first to seventh areas 1501 to 1507 . For example, the protrusion 420 and the recess 430 may be formed in the first region 1501 , the second region 1502 , and/or the third region 1503 . For another example, the protrusion 420 and the recess 430 may be formed in the first region 1501 and the seventh region 1507 .

According to an embodiment, at least one protrusion 420 and a recess 430 are formed in the first plurality of regions 1500 of the metal plate 410 to prevent the metal plate 410 from being damaged by an external impact. Shearing behavior or twist in one axial direction (eg, +y direction or -y direction) may be reduced compared to the case where the protrusion 420 and the recess 430 are formed in a single region.

According to an embodiment, as the shearing behavior or twisting of the metal plate 410 is reduced, the shearing behavior or twisting of the main display 200 disposed on the metal plate 410 may also be reduced. According to an embodiment, as the shearing behavior or twist of the main display 200 is reduced, damage to the area corresponding to the first axis of the main display 200 can be prevented.

16 is a diagram illustrating a protrusion of an electronic device according to another embodiment.

Referring to FIG. 16 , a plurality of protrusions 420 and a plurality of recesses 430 may be formed in the metal plate 410 .

Referring to FIG. 1601 according to an embodiment, the first metal plate 411 may include a first protrusion 421 and a first recess 431, and the second metal plate 412 may include the second protrusion 421. 422 and a second recess 432 .

Protrusion 420 and recess 430 of FIG. 1601 may be substantially the same as protrusion 420 and recess 430 of FIG. 4 .

Referring to FIG. 1602 according to an embodiment, the first metal plate 411 includes a third recess 433 and a first recess 431 adjacent to the first protrusion 421 and depressed from the first edge 441 . ) and may further include a third protrusion 423 extending from the first edge 441 . In addition, according to an embodiment, the second metal plate 412 extends from the second edge 442 and enters the fourth protrusion 424 introduced into the third recess 433 and the second edge 442. and a fourth recess 434 into which the third protrusion 423 is inserted when the housing 110 is unfolded.

However, the number of protrusions 420 and recesses 430 formed on the metal plate 410 is not limited thereto. For example, the first metal plate 411 may further include a fifth protrusion (not shown), and the second metal plate 412 may further include a sixth protrusion (not shown).

According to an embodiment, the plurality of protrusions and the plurality of recesses may be formed in at least one of the plurality of first regions 1500 of FIG. 15 . For example, the first protrusion 421, the second recess 432, the fourth protrusion 424, and the third recess 433 are formed in the first region 1501, and the seventh region 1507 ) may be formed with a third protrusion 423 , a fourth recess 434 , a first recess 431 , and a second protrusion 422 .

According to an embodiment, the regions where the plurality of protrusions and the plurality of recesses are formed have been described as the first region 1501 and the seventh region 1507, but are not limited thereto. For example, a protrusion 420 and a recess 430 may be further formed in the second region 1502 .

According to an embodiment, as the plurality of protrusions 420 and the plurality of recesses 430 are formed, the shear behavior or twist of the metal plate 410 in the first axial direction due to external impact is caused by the protrusion 420. ) and the recess 430 may be less than when formed singly.

According to an embodiment, as the shearing behavior or twisting of the metal plate 410 decreases, the shearing behavior or twisting of the main display 200 disposed on the metal plate 410 in the first axial direction decreases. can

17 is a diagram illustrating an electronic device in a network environment according to an embodiment.

17 is a block diagram of an electronic device 1701 (electronic device 100 of FIG. 1 ) in a network environment 1700 according to various embodiments. Referring to FIG. 17 , in a network environment 1700, an electronic device 1701 communicates with an electronic device 1702 through a first network 1798 (eg, a short-distance wireless communication network) or through a second network 1799. It may communicate with the electronic device 1704 or the server 1708 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1701 may communicate with the electronic device 1704 through the server 1708. According to an embodiment, the electronic device 1701 includes a processor 1720, a memory 1730, an input module 1750, a sound output module 1755, a display module 1760, an audio module 1770, a sensor module ( 1776), interface 1777, connection terminal 1778, haptic module 1779, camera module 1780, power management module 1788, battery 1789, communication module 1790, subscriber identification module 1796 , or an antenna module 1797. In some embodiments, in the electronic device 1701, at least one of these components (eg, the connection terminal 1778) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 1776, camera module 1780, or antenna module 1797) are integrated into a single component (eg, display module 1760). It can be.

The processor 1720, for example, executes software (eg, the program 1740) to cause at least one other component (eg, hardware or software component) of the electronic device 1701 connected to the processor 1720. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 1720 transfers commands or data received from other components (e.g., sensor module 1776 or communication module 1790) to volatile memory 1732. , processing commands or data stored in the volatile memory 1732 , and storing resultant data in the non-volatile memory 1734 . According to an embodiment, the processor 1720 may include a main processor 1721 (eg, a central processing unit or an application processor) or a secondary processor 1723 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 1701 includes a main processor 1721 and a co-processor 1723, the co-processor 1723 may use less power than the main processor 1721 or be set to be specialized for a designated function. can The auxiliary processor 1723 may be implemented separately from or as part of the main processor 1721 .

The secondary processor 1723 may, for example, take the place of the main processor 1721 while the main processor 1721 is inactive (eg, sleep), or when the main processor 1721 is active (eg, running an application). ) state, together with the main processor 1721, at least one of the components of the electronic device 1701 (eg, the display module 1760, the sensor module 1776, or the communication module 1790) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 1723 (eg, an image signal processor or a communication processor) may be implemented as part of other functionally related components (eg, the camera module 1780 or the communication module 1790). there is. According to an embodiment, the auxiliary processor 1723 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 1701 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 1708). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 1730 may store various data used by at least one component (eg, the processor 1720 or the sensor module 1776) of the electronic device 1701 . The data may include, for example, input data or output data for software (eg, the program 1740) and commands related thereto. The memory 1730 may include a volatile memory 1732 or a non-volatile memory 1734 .

The program 1740 may be stored as software in the memory 1730, and may include, for example, an operating system 1742, middleware 1744, or an application 1746.

The input module 1750 may receive a command or data to be used by a component (eg, the processor 1720) of the electronic device 1701 from an outside of the electronic device 1701 (eg, a user). The input module 1750 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 1755 may output sound signals to the outside of the electronic device 1701 . The sound output module 1755 may include, for example, a speaker or receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 1760 can visually provide information to the outside of the electronic device 1701 (eg, a user). The display module 1760 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 1760 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 1770 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 1770 acquires sound through the input module 1750, the sound output module 1755, or an external electronic device connected directly or wirelessly to the electronic device 1701 (eg: Sound may be output through the electronic device 1702 (eg, a speaker or a headphone).

The sensor module 1776 detects an operating state (eg, power or temperature) of the electronic device 1701 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 1776 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 1777 may support one or more specified protocols that may be used to directly or wirelessly connect the electronic device 1701 to an external electronic device (eg, the electronic device 1702). According to one embodiment, the interface 1777 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1778 may include a connector through which the electronic device 1701 may be physically connected to an external electronic device (eg, the electronic device 1702). According to one embodiment, the connection terminal 1778 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1779 may convert electrical signals into mechanical stimuli (eg, vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 1779 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1780 may capture still images and moving images. According to one embodiment, the camera module 1780 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1788 may manage power supplied to the electronic device 1701 . According to one embodiment, the power management module 1788 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 1789 may supply power to at least one component of the electronic device 1701 . According to one embodiment, the battery 1789 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 1790 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1701 and an external electronic device (eg, the electronic device 1702, the electronic device 1704, or the server 1708). Establishment and communication through the established communication channel may be supported. The communication module 1790 may include one or more communication processors that operate independently of the processor 1720 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 1790 is a wireless communication module 1792 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1794 (eg, a cellular communication module). : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 1798 (eg, a short-range communication network such as Bluetooth, wireless fidelity direct, or infrared data association (IrDA)) or a second network 1799 (eg, It may communicate with the external electronic device 1704 through a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 1792 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1796 within a communication network such as the first network 1798 or the second network 1799. The electronic device 1701 may be identified or authenticated.

The wireless communication module 1792 may support a 5G network after a 4G network and a next-generation communication technology, such as NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 1792 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 1792 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beamforming, or large scale antenna may be supported. The wireless communication module 1792 may support various requirements defined for the electronic device 1701, an external electronic device (eg, the electronic device 1704), or a network system (eg, the second network 1799). According to an embodiment, the wireless communication module 1792 is configured to achieve peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or realizing URLLC. U-plane latency (eg, downlink (DL) and uplink (UL) 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 1797 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 1797 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to an embodiment, the antenna module 1797 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 1798 or the second network 1799 is selected from the plurality of antennas by, for example, the communication module 1790. can be chosen A signal or power may be transmitted or received between the communication module 1790 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 1797 in addition to the radiator. According to various embodiments, the antenna module 1797 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. there is.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 1701 and the external electronic device 1704 through the server 1708 connected to the second network 1799. Each of the external electronic devices 1702 or 1704 may be the same as or different from the electronic device 1701 . According to an embodiment, all or part of operations executed in the electronic device 1701 may be executed in one or more external electronic devices 1702 , 1704 , or 1708 . For example, when the electronic device 1701 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 1701 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 1701 . The electronic device 1701 may provide the result as at least part of a response to the request as it is or after additional processing. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 1701 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1704 may include an internet of things (IoT) device. Server 1708 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 1704 or server 1708 may be included in the second network 1799. The electronic device 1701 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

According to various embodiments, an electronic device includes a housing including a first housing and a second housing, a folder including a first area disposed in front of the first housing, and a second area disposed in front of the second housing. A hinge structure connecting the first housing and the second housing so that the second housing is rotatable about a first axis with respect to the first housing, and a metal plate disposed on a rear surface of the foldable display. a first metal plate disposed on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a second metal plate disposed on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, wherein the first metal plate is adjacent to the first axis; a first recess recessed from a first edge of and a first protrusion spaced apart from the first recess and extending from the first edge, wherein the second metal plate is adjacent to the first axis; a second recess recessed from a second edge of a second metal plate and receiving the first protrusion when the housing is unfolded; and a second recess extending from the second edge and receiving the first recess when the housing is unfolded. A second protrusion drawn into the set may be included.

According to one embodiment, the first protrusion has a first height extending in the first axis direction and a first width extending in a second axis direction perpendicular to the first axis, wherein the first height is the first Can be longer than 1 wide.

According to an embodiment, the first metal plate may include a third recess adjacent to the first protrusion of the first metal plate and recessed from the first edge of the first metal plate; A third protrusion adjacent to the first recess and extending from the first edge may be further included.

According to an embodiment, the second metal plate may include a fourth protrusion extending from the second edge of the second metal plate and inserted into the third recess of the first metal plate when the housing is unfolded; and A fourth recess inserted from the second edge and accommodating the third protrusion of the first metal plate when the housing is unfolded may further include a fourth recess.

According to one embodiment, the hinge structure further includes a hinge bracket disposed on a rear surface of the hinge module of the hinge structure when the housing is unfolded, and the hinge bracket is when the housing is folded. A guide hole into which the first protrusion of the first metal plate and the second protrusion of the second metal plate are inserted may be formed.

According to an embodiment, the device further includes a flexible printed circuit board (FPCB) electrically connecting a first electronic component disposed inside the first housing and a second electronic component disposed inside the second housing, The hinge structure may include a center area through which the FPCB passes, and the first protrusion of the first metal plate and the second recess of the second metal plate may be spaced apart from each other in the center area. can

According to an embodiment, the first protrusion of the first metal plate is formed in a first region adjacent to a first end of the first edge, and the first recess of the first metal plate is opposite to the first end. It may be formed in a second region adjacent to the second end of the first edge.

According to one embodiment, the hinge structure includes a hinge gear that enables the second housing to rotate about the first axis, and the first metal plate is distinguished from the first protrusion and the first The second metal plate further includes a third protrusion extending from one edge and a third recess distinct from the first recess and extending from the first edge, wherein the second metal plate includes a fourth protrusion received in the third recess and a third region that is distinct from the second recess and further includes a fourth recess accommodating the third projection, wherein the third projection and the fourth recess are spaced apart from the hinge gear and the first region; can be formed in

According to an embodiment, the hinge gear may be disposed between the first area and the third area.

According to an embodiment, the first protrusion is a first corner extending from a point of the first edge of the first metal plate toward a second axis perpendicular to the first axis, and the first protrusion is based on the second axis. A second edge symmetrical to the first edge, and a third edge connecting one end of the first edge and one end of the second edge, wherein the first edge and the second edge have a constant angle with respect to the first axis. and may extend toward the second axis.

According to one embodiment, the first protrusion may be formed in a rectangular shape.

According to an embodiment, the first protrusion of the first metal plate may extend in a first direction perpendicular to the first axis and in a second direction in which the second metal plate is located when the housing is unfolded.

According to one embodiment, a waterproof member disposed between the hinge structure and the metal plate may be further included.

According to an embodiment, the foldable display may further include a cover panel.

According to an embodiment, a digitizer disposed between the foldable display and the metal plate may be further included.

According to various embodiments of the present disclosure, an electronic device includes a housing including a first housing and a second housing, a folder including a first area disposed in front of the first housing, and a second area disposed in front of the second housing. a display, a hinge structure connecting the first housing and the second housing so that the second housing is rotatable with respect to the first housing around a first axis, the hinge structure comprising the second housing around the first axis A housing includes a rotatable hinge gear and a hinge module connected to the hinge gear, and a metal plate disposed on a rear surface of the foldable display, the metal plate comprising: a first metal plate disposed on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a first metal plate disposed on a rear surface of the second region and covering at least a portion of the second housing and the hinge. A second metal plate covering a part of the structure, the first metal plate having a first recess recessed from a first edge of the first metal plate adjacent to the first axis, and spaced apart from the first recess and a first protrusion extending from the first edge, wherein the second metal plate is recessed from a second edge of the second metal plate adjacent to the first shaft and the housing is unfolded (folding), the first protrusion. a second recess accommodating the first protrusion, and a second protrusion extending from the second edge and being inserted into the first recess when the housing is unfolded, wherein the hinge module is configured to extend from the second edge of the first metal plate. a first hinge module disposed on a rear surface and including a first hinge module protrusion overlapping the first protrusion and a second hinge module recess overlapping the first recess when viewed from the front of the electronic device; and the second metal a second hinge module disposed on a rear surface of the plate and including a first hinge module protrusion overlapping the second protrusion and a second hinge module recess overlapping the second recess when viewed from the front of the electronic device; can do.

According to one embodiment, the first protrusion has a first height extending in the first axis direction and a first width extending in a second axis direction perpendicular to the first axis, wherein the first height is the first Can be longer than 1 wide.

According to an embodiment, the first metal plate may include a third recess adjacent to the first protrusion of the first metal plate and recessed from the first edge of the first metal plate; A third protrusion adjacent to the first recess and extending from the first edge may be further included.

According to one embodiment, the hinge structure further includes a hinge bracket disposed on a rear surface of the hinge module of the hinge structure when the housing is unfolded, and the hinge bracket is when the housing is folded. A guide hole into which the first protrusion of the first metal plate and the second protrusion of the second metal plate are inserted may be formed.

According to an embodiment, the first protrusion of the first metal plate is formed in a first region adjacent to a first end of the first edge, and the first recess of the first metal plate is opposite to the first end. It may be formed in a second region adjacent to the second end of the first edge.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of this document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited. A (eg, first) component is said to be “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or via a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic blocks, components, or circuits. can be used A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document describe one or more instructions stored in a storage medium (eg, internal memory 1736 or external memory 1738) readable by a machine (eg, electronic device 1701). It may be implemented as software (eg, the program 1740) including them. For example, a processor (eg, the processor 1720) of a device (eg, the electronic device 1701) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a machine-readable storage medium (e.g. CD-ROM (compact disc read only memory)), or through an application store (e.g. Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components. . According to various embodiments, one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Additionally or alternatively, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by modules, programs, or other components are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Claims (20)

In electronic devices,
a housing including a first housing and a second housing;
a foldable display including a first area disposed on the front surface of the first housing and a second area disposed on the front surface of the second housing;
a hinge structure connecting the first housing and the second housing such that the second housing is rotatable with respect to the first housing about a first axis; and
A metal plate disposed on a rear surface of the foldable display,
The metal plate is:
a first metal plate disposed on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and
A second metal plate disposed on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure;
The first metal plate may include a first recess depressed from a first edge of the first metal plate adjacent to the first axis, and a first protrusion spaced apart from the first recess and extending from the first edge. including,
The second metal plate is recessed from a second edge of the second metal plate adjacent to the first shaft and includes a second recess for accommodating the first protrusion when the housing is unfolded, and the second edge and a second protrusion that extends from and enters the first recess when the housing is unfolded. The method of claim 1,
The first protrusion has a first height extending in the first axis direction and a first width extending in a second axis direction perpendicular to the first axis,
The first height is greater than the first width, the electronic device. The method of claim 1,
The first metal plate is:
a third recess adjacent to the first projection of the first metal plate and recessed from the first edge of the first metal plate; and
and a third protrusion adjacent to the first recess of the first metal plate and extending from the first edge. The method of claim 3,
The second metal plate is:
a fourth protrusion extending from the second edge of the second metal plate and inserted into the third recess of the first metal plate when the housing is unfolded; and
and a fourth recess retracted from the second edge and accommodating the third protrusion of the first metal plate when the housing is unfolded. The method of claim 1,
The hinge structure further includes a hinge bracket disposed on a rear surface of the hinge module of the hinge structure when the housing is unfolded,
The hinge bracket forms a guide hole into which the first protrusion of the first metal plate and the second protrusion of the second metal plate are inserted when the housing is folded. The method of claim 1,
a flexible printed circuit board (FPCB) electrically connecting a first electronic component disposed inside the first housing and a second electronic component disposed inside the second housing;
The hinge structure includes a center area through which the FPCB passes,
The electronic device of claim 1 , wherein the first protrusion of the first metal plate and the second recess of the second metal plate are spaced apart from each other in the central area. In claim 1,
The first protrusion of the first metal plate is formed in a first region adjacent to a first end of the first edge,
The electronic device of claim 1 , wherein the first recess of the first metal plate is formed in a second region adjacent to a second end of the first edge opposite to the first end. The method of claim 7,
The hinge structure includes a hinge gear that allows the second housing to rotate about the first axis,
the first metal plate further comprises a third protrusion distinct from the first protrusion and extending from the first edge and a third recess distinct from the first recess and extending from the first edge;
The second metal plate further includes a fourth protrusion accommodated in the third recess and a fourth recess distinct from the second recess and accommodating the third protrusion;
The third protrusion and the fourth recess are formed in a third area formed to be spaced apart from the hinge gear and the first area. The method of claim 8,
The hinge gear is disposed between the first region and the third region. The method of claim 1,
The first protrusion may include a first edge extending from a point of the first edge of the first metal plate toward a second axis perpendicular to the first axis, and a first edge symmetrical to the first edge with respect to the second axis. 2 corners, and a third corner connecting one end of the first corner and one end of the second corner,
The first edge and the second edge form a constant angle with respect to the first axis and extend toward the second axis. The method of claim 1,
The electronic device, wherein the first protrusion is formed in a rectangular shape. The method of claim 1,
The electronic device of claim 1 , wherein the first protrusion of the first metal plate is perpendicular to a first direction toward the first axis and extends in a second direction in which the second metal plate is located when the housing is unfolded. The method of claim 1,
The electronic device further comprises a waterproof member disposed between the hinge structure and the metal plate. The method of claim 1,
The foldable display further includes a cover panel. The method of claim 1,
The electronic device further comprises a digitizer disposed between the foldable display and the metal plate. In electronic devices,
a housing including a first housing and a second housing;
a foldable display including a first area disposed on the front surface of the first housing and a second area disposed on the front surface of the second housing;
A hinge structure connecting the first housing and the second housing so that the second housing is rotatable about a first axis with respect to the first housing, wherein the hinge structure rotates the second housing around the first axis Includes a hinge gear enabling and a hinge module connected to the hinge gear; and
A metal plate disposed on a rear surface of the foldable display,
The metal plate is:
a first metal plate disposed on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and
A second metal plate disposed on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure;
The first metal plate includes a first recess recessed from a first edge of the first metal plate adjacent to the first shaft, and a first protrusion spaced apart from the first recess and extending from the first edge; ,
The second metal plate is recessed from a second edge of the second metal plate adjacent to the first shaft and includes a second recess for accommodating the first protrusion when the housing is unfolded, and the second edge And a second protrusion that extends from and enters the first recess when the housing is unfolded,
The hinge module
a first hinge disposed on a rear surface of the first metal plate and including a first hinge module protrusion overlapping the first protrusion and a second hinge module recess overlapping the first recess when viewed from the front of the electronic device; module, and
a second hinge module recess disposed on a rear surface of the second metal plate and including a first hinge module protrusion overlapping the second protrusion and a second hinge module recess overlapping the second recess when viewed from the front of the electronic device; An electronic device comprising a hinge module. The method of claim 16
The first protrusion has a first height extending in the first axis direction and a first width extending in a second axis direction perpendicular to the first axis,
The first height is greater than the first width, the electronic device. The method of claim 16
The first metal plate is:
a third recess adjacent to the first projection of the first metal plate and recessed from the first edge of the first metal plate; and
and a third protrusion adjacent to the first recess of the first metal plate and extending from the first edge. The method of claim 16
The hinge structure further includes a hinge bracket disposed on a rear surface of the hinge module of the hinge structure when the housing is unfolded,
The hinge bracket forms a guide hole into which the first protrusion of the first metal plate and the second protrusion of the second metal plate are inserted when the housing is folded. The method of claim 16
The first protrusion of the first metal plate is formed in a first region adjacent to a first end of the first edge,
The electronic device of claim 1 , wherein the first recess of the first metal plate is formed in a second region adjacent to a second end of the first edge opposite to the first end.

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