KR20220125667A - Display structure including dielectric layer and electronic device including same - Google Patents

Abstract

A display structure, which can address the antenna performace degradation, according to one embodiment may comprise: a cover glass forming the outer surface of the display structure; a display panel arranged below the cover glass; a first dielectric layer of which at least a part has the first edge formed outside the edge of the display panel, and which is arranged below the display panel; a second dielectric layer arranged on a first surface of the first dielectric layer, which is adjacent to the display panel; and a third dielectric layer arranged on a second surface facing in a direction opposite to the first surface of the first dielectric layer. The second edge of the second dielectric layer and the third edge of the third dielectric layer are formed inside the first edge, wherein the second edge and the third edge correspond to the first edge of the first dielectric layer. The first dielectric layer has a first permittivity, and the second dielectric layer and the third dielectric layer may have a greater permittivity than the first permittivity. In addition, various embodiments identified through the specification are possible.

Description

A display structure including a dielectric layer and an electronic device including the same

Various embodiments disclosed herein relate to a display structure including a dielectric layer and an electronic device including the same.

As the processing performance of electronic devices, such as smart phones, increases dramatically, a large-area display is preferred in order to effectively provide various functions. At the same time, there is still a demand for miniaturization of electronic devices to improve portability. In order to satisfy this demand, a foldable electronic device has been released. A foldable electronic device that can be folded or unfolded around a connection part may provide portability and usability to a user.

Meanwhile, with the development of mobile communication technology, electronic devices including antennas have been widely spread. The electronic device may transmit and/or receive a radio frequency (RF) signal including a voice signal or data (eg, a message, photo, video, music file, or game) using an antenna.

In addition, in order to satisfy consumers' purchasing desires, efforts are being made to increase the rigidity of the electronic device, strengthen the design aspect, and at the same time make it slim. As part of such an effort, the electronic device is used as at least one antenna device for communication of the electronic device by supplying power to at least a part of the housing of the electronic device.

According to an embodiment, a foldable electronic device using at least a portion of a frame or a housing as an antenna radiator may include a metal layer for securing rigidity of the flexible display and protecting the display structure. However, as the metal layer occupies 50% or more of the weight of the display structure, the weight of the electronic device may be reduced by changing the material of the metal layer to a lightweight material.

However, when the metal layer is formed of such a lightweight material, the lightweight material may have a high dielectric constant. As a layer formed of a material having a high dielectric constant forms an outermost edge of the display structure, radiation performance of an antenna adjacent to the layer may be deteriorated.

An electronic device according to various embodiments of the present disclosure provides a device that maintains antenna performance while including a lightweight material.

In an electronic device according to an embodiment, a first side member forming a first side surface of the electronic device, a second side member forming a second side surface corresponding to the first side surface, and the first side member and the second side member A housing including a hinge structure for connecting the side members and convertible to a folding or unfolding state around the hinge structure, a rear cover forming a rear surface of the electronic device, disposed inside the housing, It may include a wireless communication circuit for transmitting and receiving a signal of a specified frequency by supplying power to at least a portion of the housing, and a display structure coupled to the housing, wherein the display structure includes a cover glass ( cover glass), a display panel disposed adjacent to one surface of the cover glass, a first dielectric layer disposed under the display panel, and a first edge of the first dielectric layer by a first distance from the first side surface spaced apart, a second dielectric layer disposed on a first side of the first dielectric layer adjacent the display panel, and a third dielectric layer disposed on a second side of the first dielectric layer adjacent the back cover, wherein the first a second edge of the second dielectric layer and a third edge of the third dielectric layer corresponding to the first edge of the dielectric layer are spaced apart from the first side by a second distance greater than the first distance; may have a first dielectric constant, and the second dielectric layer and the third dielectric layer may have a dielectric constant greater than the first dielectric constant.

A display structure according to an embodiment has a cover glass forming an outer surface of the display structure, a display panel disposed under the cover glass, and at least a first edge formed outside the edge of the display panel, a first dielectric layer disposed under the display panel, a second dielectric layer disposed on a first side of the first dielectric layer adjacent to the display panel, and a direction opposite to the first side of the first dielectric layer a third dielectric layer disposed on a second side, wherein a second edge of the second dielectric layer and a third edge of the third dielectric layer corresponding to the first edge of the first dielectric layer are the first edge The first dielectric layer may have a first dielectric constant, and the second dielectric layer and the third dielectric layer may have a higher dielectric constant than the first dielectric constant.

In the electronic device according to an embodiment, a first housing forming a first side surface of the electronic device, a second housing forming a second side surface corresponding to the first side surface, and the first housing and the second housing A housing that includes a hinge structure connecting a wireless communication circuit for transmitting and receiving, and a display structure coupled to the housing, wherein the display structure is coupled to the housing and forms at least a part of a front surface of the electronic device, a cover glass, one surface of the cover glass A display panel disposed adjacent to a display panel, at least a portion of which includes a first layer having a first edge formed outside an edge of the display panel, wherein the first layer is at least a portion formed inside from the first edge and a second region extending outwardly from the first region to form the first edge, wherein the first region has a first permittivity, and the second region is greater than the first permittivity. It may have a small second permittivity.

According to various embodiments of the present disclosure, deterioration of antenna performance due to application of a lightweight material to the metal layer may be improved.

In addition, according to various embodiments, damage or deformation that may be applied to the display structure may be reduced by applying a lightweight material to the metal layer and forming a stacked structure.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.
2A illustrates an electronic device in an unfolded state according to an exemplary embodiment.
2B illustrates an electronic device in a folded state according to an exemplary embodiment.
3 illustrates a cross-sectional view of a display taken along the B axis of FIG. 2A and a dielectric layer structure according to an embodiment;
4A illustrates a portion of a cross-sectional view of the display of FIG. 3 according to an embodiment.
4B illustrates a portion of a cross-sectional view of the display of FIG. 3 according to another embodiment.
5A illustrates an edge of a dielectric layer structure formed in a region corresponding to at least a partial region of a housing according to an exemplary embodiment.
5B illustrates a structure of a display when viewed from a direction perpendicular to the front of the electronic device, according to an exemplary embodiment.
6A illustrates a structure of a dielectric layer formed of different materials according to regions, according to an exemplary embodiment.
6B is a cross-sectional view illustrating a display structure and an electronic device mounted on a bracket according to an exemplary embodiment.
7 is a cross-sectional view of a display structure taken along the C-axis of FIG. 6B and a dielectric layer structure, according to an exemplary embodiment.
8 illustrates a first state of an electronic device according to another exemplary embodiment.
9 illustrates a second state of an electronic device according to another exemplary embodiment.
10 is an exploded perspective view of an electronic device according to another exemplary embodiment;
11 illustrates a cross-sectional view of a display and a dielectric layer structure according to another embodiment.
12 is a cross-sectional view of a display and a dielectric layer structure according to another embodiment.
13A illustrates a structure of a dielectric layer formed in a region corresponding to an edge of a display according to another exemplary embodiment.
13B illustrates a structure of a dielectric layer formed in an area corresponding to a partial area of a display according to another exemplary embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, and/or alternatives of the embodiments of the present invention are included.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190 ). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 . According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

2A illustrates an electronic device in an unfolded state according to an exemplary embodiment. 2B illustrates an electronic device in a folded state according to an exemplary embodiment.

2A and 2B together, in one embodiment, the electronic device 101 is disposed in a space formed by the foldable housing 200 (hereinafter, “housing” 200 for short) and the housing 200 . A flexible or foldable display 260 (hereinafter, abbreviated as “display” 260 ) may be included. In this document, the surface on which the display 260 is disposed is defined as the first surface or the front surface of the electronic device 101 . In addition, the opposite surface of the front surface is defined as the second surface or the rear surface of the electronic device 101 . Also, a surface surrounding the space between the front surface and the rear surface is defined as the third surface or the side surface of the electronic device 101 .

In an embodiment, the housing 200 may have a substantially rectangular shape in the unfolded state of FIG. 2A . For example, the housing 200 may have a specified width W and a specified length L1 that is longer than the specified width W. As another example, the housing 200 may have a specified width W and a specified length L1 that is substantially equal to or shorter than the specified width W. For example, the specified width W may be the width of the display 260 . In an embodiment, the housing 200 of the electronic device 101 has a long edge of the rectangle (eg, an edge facing the y-axis direction among edges of the housing 200 of the electronic device 101 in FIG. 2A ) and substantially It can be folded or unfolded based on the parallel folding axis (A).

In an embodiment, the housing 200 may include a first housing 201 , a second housing 202 , and a connection part 203 . The connection part 203 may be disposed between the first housing 201 and the second housing 202 . The connecting portion 203 may be coupled to the first housing 201 and the second housing 202 , and the first housing 201 and/or the second housing 202 may be coupled to the connecting portion 203 (or the folding shaft A )) can be rotated around

In an embodiment, the first housing 201 may include a first side member 2011 and a first rear cover 2013 . In one embodiment, the second housing 202 may include a second side member 2021 and a second rear cover 2023 .

In an embodiment, the first side member 2011 may extend along an edge of the first housing 201 and form at least a portion of a side surface of the electronic device 101 . The first side member 2011 may include at least one conductive portion formed of a conductive material (eg, metal). The conductive portion may act as an antenna radiator for transmitting and/or receiving RF signals. Similar to the first side member 2011, the second side member 2021 may form a portion of a side surface of the electronic device 101, and at least a portion of the second side member 2021 may be formed of a conductive material. It can act as an antenna radiator.

In an embodiment, the first side member 2011 and the second side member 2021 may be disposed on both sides about the folding axis A, and may have a substantially symmetrical shape with respect to the folding axis A. .

In an embodiment, the angle or distance between the first side member 2011 and the second side member 2021 may vary depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. can

In one embodiment, the housing 200 may form a recess for receiving the display 260 . The recess may correspond to the shape of the display 260 .

In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, and a proximity sensor.

In an embodiment, the first rear cover 2013 may be disposed on the first housing 201 on the rear surface of the electronic device 101 . The first back cover 2013 may have a substantially rectangular edge. Similar to the first back cover 2013 , the second back cover 2023 may be disposed in the second housing 202 at the rear surface of the electronic device 101 .

In one embodiment, the first rear cover 2013 and the second rear cover 2023 may have a substantially symmetrical shape with respect to the folding axis A. However, the first back cover 2013 and the second back cover 2023 do not necessarily have symmetrical shapes, and in another embodiment, the electronic device 101 includes the first back cover 2013 and the second back cover 2023 having various shapes. / or a second rear cover 2023 may be included. In another embodiment, the first back cover 2013 may be integrally formed with the first side member 2011 , and the second back cover 2023 may be integrally formed with the second side member 2021 . have.

In an embodiment, the first back cover 2013 , the second back cover 2023 , the first side member 2011 , and the second side member 2021 may include various components of the electronic device 101 (eg: A printed circuit board, or a battery) may form a space in which it may be disposed.

In an embodiment, one or more components may be disposed or visually exposed on the rear surface of the electronic device 101 . For example, at least a portion of the sub-display 265 may be visually exposed through at least one area of the first rear cover 2013 . For example, the sub-display 265 may be visually exposed through the entire area of the first rear cover 2013 , but the exposed area of the sub-display 265 is not limited to the above-described example. As another example, the rear camera 280 may be visually exposed through at least one area of the second rear cover 2023 . As another example, the rear camera 280 may be disposed in an area on the rear side of the electronic device 101 .

The housing 200 of the electronic device 101 is not limited to the shape and combination shown in FIGS. 2A and 2B , and may be implemented by a combination and/or combination of other shapes or parts.

Referring to FIG. 2B , the connection part 203 may be implemented such that the first housing 201 and the second housing 202 are mutually rotatable. For example, the connection part 203 may include a hinge structure coupled to the first housing 201 and the second housing 202 . In one embodiment, the connecting portion 203 is disposed between the first side member 2011 and the second side member 2021, the hinge cover 230 for covering the inner part (eg, the hinge structure). may include In an embodiment, the hinge cover 230 includes a first side member 2011 and a second side member ( It may be covered by a portion of 2021 or exposed to the outside. For example, the hinge cover 230 may be in a state (a flat state or a folded state) of the electronic device 101 . Accordingly, the size of the area exposed to the outside may be changed.

For example, as shown in FIG. 2A , when the electronic device 101 is in an unfolded state, at least a portion of the hinge cover 230 is covered by the first side member 2011 and the second side member 2021 so as not to be exposed. it may not be For example, as shown in FIG. 2B , when the electronic device 101 is in a folded state, the hinge cover 230 may be exposed between the first side member 2011 and the second side member 2021 to the outside. . For example, when the first side member 2011 and the second side member 2021 are in an intermediate state that is folded with a certain angle, a portion of the hinge cover 230 may be It may be partially exposed to the outside between the side member 2011 and the second side member 2021 . However, in this case, the exposed area of the hinge cover 230 may be smaller than that in the fully folded state of FIG. 2B .

In an embodiment, the display 260 may be disposed on a space formed by the housing 200 . For example, the display 260 is seated on a recess formed by the housing 200 , and may form most of the front surface of the electronic device 101 . For example, the front surface of the electronic device 101 may include the display 260 and a partial area of the first side member 2011 and a partial area of the second side member 2021 adjacent to the display 260 . As another example, the rear surface of the electronic device 101 may include a first rear cover 2013 , a partial region of the first side member 2011 adjacent to the first rear cover 2013 , a second rear cover 2023 , and a second rear surface of the electronic device 101 . A partial region of the second side member 2021 adjacent to the rear cover 2023 may be included.

In an embodiment, the display 260 may include a flexible display in which at least a portion of the area can be deformed into a flat surface or a curved surface. In an embodiment, the display 260 may include a folding area 263 , a first area 261 , and a second area 262 . The folding area 263 may extend along the folding axis A, and the first area 261 is located on one side (eg, the left side of the folding area 263 shown in FIG. 2A ) with respect to the folding area 263 . may be disposed, and the second area 262 may be disposed on the other side (eg, the right side of the folding area 263 illustrated in FIG. 2A ). As another example, the first region 261 may be a region disposed in the first housing 201 , and the second region 262 may be a region disposed in the second housing 202 . The folding area 263 may be an area disposed on the connection part 203 .

The division of regions of the display 260 shown in FIGS. 2A and 2B is exemplary, and the display 260 may be divided into a plurality (eg, four or more or two) regions according to a structure or function. . For example, in the embodiment shown in FIG. 2A , the regions of the display 260 may be divided by the folding region 263 or the folding axis A, but in another embodiment, the display 260 may have a different folding region or other Regions may be divided based on the folding axis.

In an embodiment, the first region 261 and the second region 262 may have a symmetrical shape with respect to the folding region 263 . However, unlike the first region 261 , the second region 262 may include a cut notch according to the presence of the sensor region 234 , but in other regions, the first region 261 may include the first region 261 . The region 261 may have a symmetrical shape. For example, the first region 261 and the second region 262 may include a portion having a shape symmetric to each other and a portion having a shape asymmetric to each other.

Hereinafter, operations of the first side member 2011 and the second side member 2021 according to states of the electronic device 101 (eg, an unfolded state and a folded state) and respective regions of the display 260 will be described.

In an embodiment, when the electronic device 101 is in an unfolded state (eg, FIG. 2A ), the first side member 2011 and the second side member 2021 form an angle of about 280 degrees and face substantially the same direction. can be arranged to do so. The surface of the first area 261 of the display 260 and the surface of the second area 262 form about 280 degrees with each other, and may face substantially the same direction (eg, the front direction of the electronic device). For example, the folding area 263 may form the same plane as the first area 261 and the second area 262 .

In an embodiment, when the electronic device 101 is in a folded state (eg, FIG. 2B ), the first side member 2011 and the second side member 2021 may be disposed to face each other. The surface of the first area 261 and the surface of the second area 262 of the display 260 may face each other while forming a narrow angle (eg, between 0 degrees and 10 degrees). At least a portion of the folding area 263 may be formed of a curved surface having a predetermined curvature.

In an embodiment, when the electronic device 101 is in an intermediate state, the first side member 2011 and the second side member 2021 may be disposed at a certain angle. The surface of the first region 261 and the surface of the second region 262 of the display 260 may form an angle greater than that in the folded state and smaller than that in the unfolded state. At least a portion of the folding area 263 may be formed of a curved surface having a predetermined curvature, and the curvature at this time may be smaller than that in a folded state.

3 illustrates a cross-sectional view of a display taken along the B axis of FIG. 2A and a dielectric layer structure according to an embodiment;

Referring to FIG. 3 , a display 260 (or a display structure) according to an embodiment may include a plurality of layers. According to an embodiment, the display 260 is disposed under the cover glass 340 , the display panel 330 disposed adjacent to one surface of the cover glass 340 , and the display panel 330 . It may include a dielectric layer structure 311 to be formed and a first layer 320 disposed under the dielectric layer structure 311 . According to another embodiment (not shown), some of the above-described components (eg, the thermoplastic member 390 ) may be omitted, and other components may be added.

According to an embodiment, the display 260 may include an adhesive (eg, pressure sensitive adhesive (PSA)) for bonding the plurality of layers described above. According to another embodiment, the adhesive may include an optically clear adhesive (OCA), a heat-responsive adhesive, or a double-sided tape in addition to the PSA, but is not limited thereto.

According to an embodiment, the cover glass 340 includes a film layer 342 and a transparent plate 341 (eg, ultra-thin glass (UTG), which are at least partially exposed through the front surface of the electronic device 101 ). )) may be included. The film layer 342 and the transparent plate 341 according to an embodiment may be coupled by an adhesive. According to an embodiment, the film layer 342 and the transparent plate 341 may be ductile and may be folded or bent. For example, the film layer 342 may be referred to as a polarization film, but is not limited thereto.

According to an embodiment, the display panel 330 includes a panel 332 , a plastic film 333 disposed under the panel 332 , and a cover panel 331 disposed under the plastic film 333 . may include According to an embodiment, the polarizing film 333 may include an adhesive (eg, PSA) to attach the panel 332 and the cover panel 331 to each other. According to an embodiment, the plastic film 333 may be referred to as a polarization film.

According to an embodiment, the panel 332 may be implemented as a touch panel on which electrodes for receiving a touch input, a fingerprint recognition, or a pen input are disposed. According to an embodiment, the panel 332 may include an organic light emitting diode (OLED) panel, a liquid crystal display (LCD), or a quantum dot light-emitting diode (QLED) panel. For example, the display panel 330 may include a plurality of pixels for displaying an image, and one pixel may include a plurality of sub-pixels. For example, one pixel may include three-color red sub-pixels, green sub-pixels, and blue sub-pixels. As another example, one pixel may be formed in an RGBG pentile method including one red sub-pixel, two green sub-pixels, and one blue sub-pixel.

According to an embodiment, the display 260 may include a dielectric layer structure 311 disposed under the display panel 330 . According to an embodiment, at least a portion of the edge of the dielectric layer structure 311 may be formed outside the edge of the display panel 330 . A detailed description thereof will be given later.

According to an embodiment, the adhesive layer 381 is disposed between the display panel 330 and the dielectric layer structure 311 , so that the dielectric layer structure 311 may be attached under the display panel 330 . According to an embodiment, the adhesive layer 381 is arranged so that the shape of the adhesive layer 381 corresponds to the shape of the dielectric layer structure 311 , or the edge of the adhesive layer 381 is formed inside the edge of the dielectric layer structure 311 . can be According to another embodiment, the adhesive layer 381 may be disposed such that at least a portion of an edge of the adhesive layer 381 corresponds to an edge of the dielectric layer structure 311 .

According to an embodiment, the dielectric layer structure 311 may include a lattice pattern 370 in at least a partial region. For example, the dielectric layer structure 311 may include the lattice pattern 370 in a region adjacent to the folding axis (eg, the folding axis A of FIG. 2A ). According to an embodiment, since the dielectric layer structure 311 includes the lattice pattern 370 in a region adjacent to the folding axis, the electronic device 101 is in a folded state (eg, FIG. 2B ) or an unfolded state (eg, FIG. 2A ). When converted to , the dielectric layer structure 311 and the plurality of layers attached to the dielectric layer structure 311 may also be folded or unfolded according to each state.

According to an embodiment, the display 260 may further include a thermoplastic member 390 (eg, thermoplastic poly urethane (TPU)) disposed under the dielectric layer structure 311 . According to an embodiment, since the display 260 includes the thermoplastic member 390 , damage to the display panel 330 , the dielectric layer structure 311 , and/or the first layer 320 may be prevented. For example, since the display 260 includes the thermoplastic member 390 , bubbles generated between the plurality of layers disposed on the display 260 may be prevented. In addition, since the display 260 includes the thermoplastic member 390 , it is possible to prevent foreign substances from entering between the plurality of layers disposed on the display 260 .

According to an embodiment, the display 260 may include a first layer 320 disposed under the dielectric layer structure 311 . According to an embodiment, the first layer 320 may include at least one of a digitizer 321 and a metal plate 322 . For example, the first layer 320 may include a metal plate 322 disposed under the dielectric layer structure 311 .

According to an embodiment, the digitizer 321 and the metal plate 322 may be bonded by an adhesive. For example, an adhesive may be attached to the bottom of the digitizer 321 , and the metal plate 322 may be attached to the bottom of the digitizer 321 by an adhesive.

According to an embodiment, the first layer 320 may be formed by being cut off in a region corresponding to the folding axis (eg, the folding axis A of FIG. 2A ). According to an embodiment, as the first layer 320 is formed by being cut off in an area corresponding to the folding axis (eg, the folding axis A of FIG. 2A ), the electronic device 101 is in a folded state (eg, in FIG. 2A ). 2b) or when switched to an unfolded state (eg, FIG. 2A ), the first layer 320 may be folded or unfolded according to each state. According to another embodiment (not shown), the first layer 320 may be ductile and may be formed to cross the folding axis.

According to an embodiment, the digitizer 321 is a device capable of detecting an input for an x-position and/or a y-position, and may detect a magnetic field type input device (eg, an electronic pen). For example, at least one processor (eg, the processor 120 of FIG. 1 ) may provide a current to the digitizer 321 , and the digitizer 321 may generate an electromagnetic field. When the electronic pen approaches the electromagnetic field of the digitizer 321, an electromagnetic induction phenomenon occurs and the resonance circuit of the electronic pen may generate a current. The resonance circuit of the electronic pen may form a magnetic field using the generated current. At least one processor may detect the position by scanning the strength of the magnetic field applied from the electronic pen to the digitizer 321 over the entire area. At least one processor may perform an operation based on the detected position.

According to an embodiment, the metal plate 322 may be referred to as a shielding layer. According to an embodiment, the metal plate 322 may be formed by applying magnetic metal powder (MMP) to the lower portion of the digitizer 321 . The metal plate 322 according to an embodiment may reduce noise by shielding magnetic force due to surrounding electronic components in addition to a signal input from the electronic pen.

According to an embodiment, the dielectric layer structure 311 may include a material for securing rigidity and a material for reducing weight. According to an embodiment, the dielectric layer structure 311 may have a structure in which a layer for securing rigidity and a layer formed of a lightweight material are stacked. According to an embodiment, since the dielectric layer structure 311 has rigidity, the flexible display 260 may secure rigidity. According to an embodiment, as at least a portion of the dielectric layer structure 311 is formed of a lightweight material, the weight of the flexible display 260 may be reduced.

According to an embodiment, the dielectric layer structure 311 includes a first dielectric layer 3111 , a second dielectric layer 3112 and a first dielectric layer 3111 disposed on one surface of the first dielectric layer 3111 adjacent to the display panel 330 . It may include a third dielectric layer 3113 disposed under the. According to another embodiment (not shown), one of the second dielectric layer 3112 and the third dielectric layer 3113 may be omitted.

According to an embodiment, the first dielectric layer 3111 may be formed of a lightweight material. According to an embodiment, the first dielectric layer 3111 may include a dielectric material having a dielectric constant less than or equal to a specified value. For example, the first dielectric layer 3111 may be formed of glass fiber reinforced plastic (GFRP) having a dielectric constant of 6 or less, but is not limited thereto.

According to an embodiment, at least a portion of the second dielectric layer 3112 and/or the third dielectric layer 3113 may be formed of a material having a stiffness greater than or equal to a specified value. For example, the second dielectric layer 3112 and the third dielectric layer 3113 may have greater stiffness than the first dielectric layer 3111 . According to an embodiment, since the second dielectric layer 3112 and the third dielectric layer 3113 are formed of carbon fiber reinforced plastic (CFRP) having high rigidity, the rigidity of the flexible display 260 may be secured.

According to an embodiment, at least a portion of the second dielectric layer 3112 and/or the third dielectric layer 3113 may include a dielectric material having a dielectric constant greater than or equal to a predetermined value. For example, the second dielectric layer 3112 and the third dielectric layer 3113 may be formed of CFRP having a dielectric constant of 200 or more, but is not limited thereto. As another example, the second dielectric layer 3112 and the third dielectric layer 3113 may have different dielectric constants.

According to an embodiment, the second edge 352 of the second dielectric layer 3112 and the third edge 353 of the third dielectric layer 3113 are inside the first edge 351 of the first dielectric layer 3111 . can be formed. According to an embodiment, the second edge 352 of the second dielectric layer 3112 and the third edge 353 of the third dielectric layer 3113 may be formed to correspond to each other. A detailed description thereof will be given later.

4A illustrates a portion of a cross-sectional view of the display of FIG. 3 according to an embodiment. 4B illustrates a portion of a cross-sectional view of the display of FIG. 3 according to another embodiment.

4A and 4B together, the display 260 according to an embodiment includes a plurality of layers, and the plurality of layers includes the first side 401 of the electronic device 101 (eg, the electronic device of FIG. 2A ). The device 101 may be disposed to be spaced apart from each other by a predetermined distance.

According to an embodiment, the display 260 includes a cover glass 340 forming at least a portion of the front surface of the electronic device, a display panel 330 disposed adjacent to one surface of the cover glass 340, and the display panel 330 . may include a dielectric layer structure 311 disposed under the dielectric layer structure 311 and a first layer 320 disposed under the dielectric layer structure 311 .

According to an embodiment, the dielectric layer structure 311 includes a first dielectric layer 3111, a second dielectric layer 3112 disposed on one surface of the first dielectric layer 3111 adjacent to the display panel 330, and the rear surface of the electronic device) ( Example: A third dielectric layer 3113 disposed on one surface of the first dielectric layer 3111 adjacent to the rear surface of the electronic device 101 of FIG. 2A may be included. The same or substantially the same components as those described above have the same reference numerals, and overlapping descriptions will be omitted.

According to an embodiment, the first side surface 401 may be referred to as a side surface of the electronic device formed by the first housing (eg, the first housing 201 of FIG. 2A ). According to an embodiment, the first housing may be referred to as a first side member.

According to an embodiment, the first dielectric layer 3111 may include a first edge 351 spaced apart from the first side surface 401 by a first distance D1 . For example, the first edge 351 of the first dielectric layer 3111 may be spaced apart from the first side surface 401 by a predetermined distance (eg: about 0.2 mm). According to an embodiment, as the first edge 351 is spaced apart from the first side surface 401 by the first distance D1 , it may be spaced apart from at least a portion of the first housing 201 by a predetermined distance or more.

Referring to FIG. 4A , the second dielectric layer 3112 according to an embodiment includes a second edge 352 spaced apart from the first side surface 401 by a second distance D2 greater than the first distance D1. can do. For example, the second edge 352 of the second dielectric layer 3112 may be spaced apart from the first side surface 401 by a predetermined distance (eg, about 1 mm), but is not limited thereto.

According to an embodiment, the third dielectric layer 3113 may include a third edge 353 spaced apart from the first side surface 401 by a second distance D2 greater than the first distance D1 . For example, the third edge 353 of the third dielectric layer 3113 may be spaced apart from the first side surface 401 by a predetermined distance (eg, about 1 mm), but is not limited thereto. For example, the second edge 352 and the third edge 353 may be spaced apart from the first side surface 401 by a second distance D2 .

According to another embodiment, the second edge 352 and the third edge 353 may be spaced apart from the first side surface 401 by a distance greater than the first distance D1 . A distance between the second edge 352 and the third edge 353 from the first side surface 401 may be different from each other.

According to an embodiment, the display panel 330 includes an edge 360 spaced apart from the first side surface 401 by a third distance D3 greater than the first distance D1 and smaller than the second distance D2. can do. For example, the edge 360 of the display panel 330 may be spaced apart from the first side 401 by about 0.5 mm, but is not limited thereto. According to another embodiment, the edge of the cover panel 331 may be formed to be spaced apart from the first side surface 401 by a distance greater than the third distance D3, but is not limited thereto.

According to an embodiment, at least a portion of the first edge 351 of the first dielectric layer 3111 may be formed on an outer side of the edge 360 of the display panel 330 . According to an exemplary embodiment, at least a portion of the second edge 352 of the second dielectric layer 3112 and at least a portion of the third edge 353 of the third dielectric layer 3113 are an edge 360 of the display panel 330 . may be formed on the inner side of

According to an embodiment, the first edge 351 of the first dielectric layer 3111 may form an outermost edge of the display 260 . According to an embodiment, the second edge 352 of the second dielectric layer 3112 and/or the third edge 353 of the third dielectric layer 3113 may form the innermost edge of the display 260 .

Referring to FIG. 4B , according to one embodiment, the display 260 extends outwardly from the second edge 352 of the second dielectric layer 3112 and/or the third edge 353 of the third dielectric layer 3113 . It may further include a dielectric 470 that is. According to one embodiment, the display 260 extends from the second edge 352 of the second dielectric layer 3112 and/or the third edge 353 of the third dielectric layer 3113, and the first side 401 and a dielectric 470 having an edge 354 spaced apart from it by a first distance D1.

According to an embodiment, the dielectric 470 may be formed of a dielectric material having a dielectric constant less than or equal to a specified value. According to an embodiment, the dielectric 470 may be formed of a dielectric material having a dielectric constant of about 6 or less, but is not limited thereto. For example, the dielectric 470 may include a resin having a dielectric constant of 2.54.

According to an embodiment, at least a portion of the edge 354 of the dielectric 470 may be spaced apart from the first side surface 401 by a first distance D1 . According to another embodiment (not shown), at least a portion of the edge 354 of the dielectric 470 may be separated from the first side surface 401 by a distance greater than the first distance D1 (eg, the third distance D3). It may be formed to be spaced apart.

According to an embodiment, the edge 354 of the dielectric 470 may be formed outside the edge 360 of the display panel 330 . According to another embodiment (not shown), at least a portion of the edge 354 of the dielectric 470 may be formed to correspond to the edge 360 of the display panel 330 .

According to an embodiment, the edge 354 of the dielectric 470 may be formed to correspond to the first edge 351 of the first dielectric layer 3111 . The edge 354 of the dielectric 470 according to an embodiment may form an outermost edge of the display 260 together with the first edge 351 of the first dielectric layer 3111 .

5A illustrates an edge of a dielectric layer structure formed in a region corresponding to at least a partial region of a housing according to an exemplary embodiment. 5B illustrates a structure of a display when viewed from a direction perpendicular to the front of the electronic device, according to an exemplary embodiment.

5A and 5B together, the first dielectric layer 3111 according to an embodiment may include a first edge 351 formed in a region corresponding to at least a partial region of the edge of the housing 200. . According to an embodiment, the second dielectric layer 3112 and the third dielectric layer 3112 may respectively have a second edge 352 and a third edge 351 corresponding to the first edge 351 of the first dielectric layer 3111 , respectively. 353) may be included.

According to an embodiment, when viewed from a direction perpendicular to the front surface of the electronic device 101 , at least a portion of the second dielectric layer 3112 and the third dielectric layer 3113 may be disposed to overlap. According to an embodiment, when viewed in a direction perpendicular to the front surface of the electronic device 101 , at least a portion of the second edge 352 and the third edge 353 may be disposed to overlap. For convenience of description, the description of the second dielectric layer 3112 and the second edge 352 below may be referred to as the description of the third dielectric layer 3113 and the third edge 353 , respectively.

Referring to FIG. 5A , a first housing 201 (or a first side member 2011 ) according to an exemplary embodiment includes a first portion 201A and a first portion extending substantially vertically from the first portion 201A. It may include a second portion 201B and a third portion 201C extending substantially perpendicular to the second portion 201B and substantially parallel to the first portion 201A.

According to one embodiment, the second housing 202 (or the second side member 2021) includes a fourth portion 202A, a fifth portion 202B extending substantially perpendicular from the fourth portion 202A. and a sixth portion 202C extending substantially perpendicular to the fifth portion 202B and substantially parallel to the fourth portion 202A.

According to an embodiment, the first edge 351 may be formed in a region corresponding to the first region 501 that does not operate as an antenna radiator among the first housing 201 and/or the second housing 202 . .

According to an embodiment, the second edge 352 may be formed in an area corresponding to at least a partial area of the first portion 201A and/or the third portion 201C of the first housing 201 .

According to an embodiment, the second edge 352 is fed from the wireless communication circuit 510 of the first housing 201 and/or the second housing 202 (eg, the wireless communication module 192 of FIG. 1 ). The second region 502 may be formed in a corresponding region. According to an embodiment, the second edge 352 is supplied from the wireless communication circuit 510 of the first housing 201 and/or the second housing 202 to the second region 502 operating as an antenna radiator. It may be formed in a corresponding area. According to an embodiment, the second edge 352 is a specified distance ( D2) (eg, 1 mm) may be formed spaced apart.

According to an embodiment, the second edge 352 is a first point 511 spaced apart from the folding axis A by a predetermined distance d on the first portion 201A of the first housing 201 . Up to a second point 512 on portion 201A may be formed. According to an embodiment, the second edge 352 is a third point 513 spaced apart from the folding axis A by a predetermined distance d on the third portion 201C of the first housing 201 . Up to a fourth point 514 on portion 201C may be formed.

According to an embodiment, the second edge 352 is a corner where the first part 201A and the second part 201B of the first housing 201 meet, and the second part 201B and the third part 201C. In a region corresponding to the region excluding the meeting edge, the electronic device 101 may be formed to be spaced apart by a specified distance D2 (eg, about 1 mm) from the side surface of the electronic device 101 .

According to an embodiment, the second edge 352 is in a region corresponding to a partial region of the fourth part 202A, the fifth part 202B, and/or the sixth part 202C of the second housing 202 . can be formed. According to an embodiment, the second edge 352 is a fourth portion from a fifth point 515 spaced apart from the folding axis A by a predetermined distance d on the fourth portion 202A of the second housing 202 . Up to a sixth point 516 on portion 202A may be formed. According to an embodiment, the second edge 352 is a sixth point 517 spaced apart from the folding axis A by a predetermined distance d on the sixth portion 202C of the second housing 202 . Up to an eighth point 518 on portion 202C may be formed. According to an embodiment, the second edge 352 may be formed in an area corresponding to at least a partial area of the fifth portion 202B. According to an embodiment, the second edge 352 is a corner where the fourth part 202A and the fifth part 202B of the second housing 202 meet, and the fifth part 202B and the sixth part 202C. In a region corresponding to the region excluding the meeting edge, the electronic device 101 may be formed to be spaced apart by a specified distance D2 (eg, about 1 mm) from the side surface of the electronic device 101 .

Referring to FIG. 5B , the first edge 351 of the first dielectric layer 3111 and the second edge 352 of the second dielectric layer 3112 according to an embodiment have a shape corresponding to the edge of the display 260 . can be formed.

According to an embodiment, when viewed in a direction perpendicular to the front surface of the electronic device 101 , the second edge 352 of the second dielectric layer 3112 is formed inside the first edge 351 of the first dielectric layer 3111 . can be placed.

According to an embodiment, the first dielectric layer 3111 and the second dielectric layer 3112 may include the lattice pattern 370 in at least some regions. According to an embodiment, the first dielectric layer 3111 and the second dielectric layer 3112 may include a lattice pattern 370 in a partial region adjacent to the folding axis A. According to an embodiment, since the first dielectric layer 3111 and the second dielectric layer 3112 include the lattice pattern 370 in a partial region adjacent to the folding axis A, the electronic device 101 is placed in a folded state (eg: 2B ) or an unfolded state (eg, FIG. 2A ), the display 260 and the dielectric layer structure 311 may be folded or unfolded.

According to an embodiment, at least a portion of the first dielectric layer 3111 and the second dielectric layer 3112 may have a shape corresponding to the front surface of the electronic device 101 and may be formed to cross the folding axis A. According to another embodiment, the first dielectric layer 3111 may be segmented based on the folding axis A. A detailed description thereof will be given later.

6A illustrates a structure of a dielectric layer formed of different materials according to regions, according to an exemplary embodiment. 6B is a cross-sectional view illustrating a display structure and an electronic device mounted on a bracket according to an exemplary embodiment.

6A and 6B together, the electronic device 101 according to an embodiment includes a bracket 630 on which a display structure (eg, the display 260 of FIG. 3 ) is mounted, and at least a partial area of the display. Silver may be disposed to correspond to the bracket (630). According to an embodiment, the display may include a plurality of dielectric layers (eg, the dielectric layer structure 311 of FIG. 3 ) formed of a material that is divided according to regions when viewed from a direction perpendicular to the front surface of the electronic device 101 . can

The electronic device 101 according to an embodiment may include a bracket 630 and a display structure mounted on the bracket 630 . According to an embodiment, the bracket 630 may be formed through ejaculation. According to an embodiment, the bracket 630 may be formed inside the housing (eg, the housing 200 of FIG. 2A ) through injection.

According to an embodiment, the first dielectric layer (eg, the first dielectric layer 3111 of FIG. 3 ) has a first region 611 formed inside from the first edge (eg, the first edge 351 of FIG. 3 ). and a second region 612 extending outwardly from the first region 611 to form a first edge. According to an embodiment, the first dielectric layer includes a second region 612 adjacent to a side surface of the electronic device 101 and a first region formed adjacent to the center of the electronic device 101 inside the second region 612 . It may include a region 611 .

According to an embodiment, the first region 611 may be formed of a material having high thermal conductivity. For example, the first region 611 may be formed of at least one of a soft graphite resin or a heat-conducting flexible composite resin, but is not limited thereto. According to an embodiment, the first region 611 is formed of a material having high thermal conductivity, so that heat generated from electronic components inside the electronic device 101 is disposed in a housing or a separate space inside the electronic device 101 . can be transmitted as

According to an embodiment, the second region 612 may be formed of a material having a dielectric constant less than or equal to a specified value. For example, the second region 612 may include glass fiber reinforced plastic (GFRP) having a dielectric constant of about 6 or less, but is not limited thereto.

Referring to a cross-sectional view of the electronic device 101 cut along the C-axis according to an embodiment, the second region 612 may be disposed to be formed in a region corresponding to the bracket 630 . According to an embodiment, at least a portion of the second region 612 of the first dielectric layer may be disposed in a region corresponding to the bracket 630 .

According to an embodiment, the second dielectric layer (eg, the second dielectric layer 3112 of FIG. 3 ) may be disposed in the third region 613 having a predetermined distance d from the folding axis A. .

According to an embodiment, the electronic device 101 may include a hinge structure 640 (eg, the connection part 203 of FIG. 2A ). According to an embodiment, when viewed from a direction perpendicular to the front surface of the electronic device 101, at least a portion of the third region 613 having a distance d from the folding axis A has a hinge structure ( 640) may overlap an area in which it is disposed. According to an embodiment, at least a portion of the second dielectric layer and/or the third dielectric layer (eg, the third dielectric layer 3113 of FIG. 3 ) may be disposed in the third region 613 .

For example, the width W _H of the region where the hinge structure 640 is disposed may be less than or equal to twice the predetermined distance d from the folding axis A at which the third region 613 is formed.

However, the relationship between the width W _H of the region where the hinge structure 640 is disposed and the predetermined distance d at which the third region 613 is formed based on the folding axis A is limited to the above-mentioned equation it is not A detailed description thereof will be given later.

7 is a cross-sectional view of a display structure taken along the C-axis of FIG. 6B and a dielectric layer structure, according to an exemplary embodiment.

Referring to FIG. 7 , a display 260 according to an exemplary embodiment includes a cover glass 340 forming at least a portion of the front surface of the electronic device 101 and a display panel disposed adjacent to one surface of the cover glass 340 . 330 , a dielectric layer structure 311 disposed under the display panel 330 , and a first layer 320 disposed under the dielectric layer structure 311 may be included. The same reference numerals are used for the same or substantially the same components as those described above, and overlapping descriptions are omitted.

According to an embodiment, the dielectric layer structure 311 may include a lattice pattern 370 in at least a portion of the region. According to an embodiment, the grid pattern 370 may be disposed adjacent to the folding axis A. According to an embodiment, the grid pattern 370 may be disposed to have a third width W3. According to an embodiment, the grid pattern 370 may be disposed adjacent to the folding axis A and have a third width W3 .

According to an embodiment, the first dielectric layer 3111 may be formed to be separated by a first width W1 about the lattice pattern 370 or the folding axis A. According to an embodiment, the first dielectric layer 3111 may be formed across at least a portion of the first region 611 and the second region 612 . According to an embodiment, the first dielectric layer 3111 may form at least a portion of the first region 611 and the second region 612 . For example, the first dielectric layer 3111 may include GFRP having a dielectric constant less than or equal to a specified value (eg, 6), and may form a first region 611 and a second region 612 .

According to an embodiment, the second dielectric layer 3112 and/or the third dielectric layer 3113 may form at least a portion of the first region 611 and the third region 613 . For example, the second dielectric layer 3112 and the third dielectric layer 3112 may have a dielectric constant of about 200 or more, and may form the third region 613 .

According to an embodiment, when viewed from a direction perpendicular to the front surface of the electronic device 101 , the second dielectric layer 3112 may be disposed to at least partially overlap the first dielectric layer 3111 in the first region 611 . have. According to another embodiment, when viewed from a direction perpendicular to the front surface of the electronic device 101 , the second dielectric layer 3112 may be disposed to at least partially overlap the first dielectric layer 3111 in the third region 613 . have.

According to an embodiment, the cover panel 331 and/or the thermoplastic member (TPU) may include a groove in at least a portion of the region. According to an embodiment, the cover panel 331 and/or the thermoplastic member TPU may include a groove having a second width W2 in at least a portion of the region. However, the widths of the grooves of the cover panel 331 and the thermoplastic member may not be the same.

According to an embodiment, the cover panel 331 and/or the thermoplastic member (TPU) may include grooves in at least a portion of the region, so that the electronic device 101 is in a folded state (eg, FIG. 2B ) or an unfolded state (eg, FIG. 2B ). : When switching to FIG. 2A ), the cover panel 331 and/or the thermoplastic member (TPU) can be easily folded or unfolded.

According to an embodiment, the above-described relationship between the first width W1 , the second width W2 , and the third width W3 may be referred to according to the following equation.

However, the relationship between the first width W1, the second width W2, and the third width W3 is not limited to the above-described equation, and the first width W1, the second width W2, and the second width W3 are not limited thereto. At least two or more of the three widths W3 may be formed to be the same.

According to another exemplary embodiment (not shown), when the thermoplastic member TPU is formed in an area adjacent to the folding area 263 , W2 may be larger than W1 .

According to an embodiment, the display 260 may further include a dielectric 470 extending outwardly from the second dielectric layer 3112 and/or the third dielectric layer 3113 .

According to an embodiment, the dielectric 470 may be formed of a dielectric material having a dielectric constant less than or equal to a specified value. According to an embodiment, the dielectric 470 may be formed of a dielectric material having a dielectric constant of about 6 or less, but is not limited thereto. For example, the dielectric 470 may include a resin having a dielectric constant of 2.54.

8 illustrates a first state of an electronic device according to another exemplary embodiment. 9 illustrates a second state of an electronic device according to another exemplary embodiment.

8 and 9 , in an embodiment, the electronic device 800 includes a housing 810 , a hinge cover 930 covering a foldable portion of the housing 810 , and the housing 810 . It may include a flexible or foldable display 900 (hereinafter, abbreviated as “main display” 900 ) disposed in the formed space. In this document, the surface on which the main display 900 is disposed is defined as the first surface or the front surface 801 of the electronic device 800 . And, a surface opposite to the front surface 801 is defined as the second surface or the rear surface 802 of the electronic device 800 . Also, a surface surrounding the space between the front surface 801 and the rear surface 802 is defined as a third surface or a side surface 803 of the electronic device 800 .

According to an embodiment, the housing 810 may include a foldable housing. In an embodiment, the housing 810 may include a first housing 811 , a second housing 812 , a first rear cover 880 , and a second rear cover 890 . The housing 810 of the electronic device 800 is not limited to the shape and combination shown in FIGS. 8 and 9 , and may be implemented by a combination and/or combination of other shapes or parts. For example, in another embodiment, the first housing 811 and the first rear cover 880 may be integrally formed, and the second housing 812 and the second rear cover 890 may be integrally formed. can

According to an embodiment, the unfolded state of the electronic device 800 may mean an unfolded state 800A or a first state 800A. For example, the unfolded state of the first housing 811 and the second housing 812 may correspond to the unfolded state 800A or the first state 800A. Also, the electronic device 800 may refer to a folded state 800B or a second state 800B. For example, the folded state in which the second housing 812 is rotated with respect to the first housing 811 may correspond to the folded state 800B or the second state 800B.

According to an embodiment, the angle or distance between the first housing 811 and the second housing 812 may vary depending on whether the electronic device 800 is in an unfolded state, a folded state, or an intermediate state. can

In the illustrated embodiment, the first housing 811 and the second housing 812 are disposed on both sides about the folding axis (hereinafter, “C axis”), and may have an overall symmetrical shape with respect to the C axis. have. However, the first housing 811 and the second housing 812 may have an asymmetric shape in some regions. For example, the second housing 812 may further include a USB hole 851 , unlike the first housing 811 . In other words, the first housing 811 and the second housing 812 may include a portion having a shape symmetric to each other and a portion having a shape asymmetric to each other.

According to an embodiment, the main display 900 may be symmetrically disposed across the first housing 811 and the second housing 812 .

In an embodiment, at least a portion of the first housing 811 and the second housing 812 may be formed of a metal material or a non-metal material having a rigidity of a size selected to support the main display 900 .

In an embodiment, the first rear cover 880 may be disposed on one side of the C-axis on the rear surface of the electronic device. For example, the first back cover 880 may have a substantially rectangular periphery, and the periphery may be surrounded by the first housing 811 . Similarly, the second rear cover 890 may be disposed on the other side of the C axis of the rear surface of the electronic device, and an edge thereof may be surrounded by the second housing 812 .

In the illustrated embodiment, the first rear cover 880 and the second rear cover 890 may have a substantially symmetrical shape about the C axis. However, the first back cover 880 and the second back cover 890 do not necessarily have symmetrical shapes, and in another embodiment, the electronic device 800 includes the first back cover 880 and the A second rear cover 890 may be included.

In an embodiment, the first back cover 880 , the second back cover 890 , the first housing 811 , and the second housing 812 are various components (eg, a printed circuit) of the electronic device 800 . A space in which a substrate, or a battery) may be disposed may be formed. In an embodiment, one or more components may be disposed or visually exposed on the rear surface of the electronic device 800 . For example, a portion of the sub-display 920 may be visually exposed through the first rear area 181 of the first rear cover 880 . According to another embodiment, the sub-display 920 may be disposed on the entire first rear area 931 of the first rear cover 880 .

In another embodiment, one or more components or sensors may be visually exposed through the second back area 932 of the second back cover 890 . In various embodiments, the sensor may include a proximity sensor and/or a rear camera 980 .

The main display 900 may be disposed in a space formed by the housing 810 . For example, the main display 900 is seated in a recess formed by the housing 810 and may form most of the front surface 801 of the electronic device 800 .

Accordingly, the front surface 801 of the electronic device 800 may include the main display 900 and a partial area of the first housing 811 adjacent to the main display 900 and a partial area of the second housing 812 . . In addition, the rear surface 802 of the electronic device 800 includes a first rear cover 880 , a partial region of the first housing 811 adjacent to the first rear cover 880 , a second rear cover 890 , and a second rear surface 802 . A portion of the second housing 812 adjacent to the back cover 890 may be included.

The main display 900 may refer to a display in which at least a partial area can be transformed into a flat surface or a curved surface. In an embodiment, the main display 900 includes the folding area 903 and the first display area 901 disposed on one side (the left side of the folding area 903 shown in FIG. 8 ) with respect to the folding area 903 . and a second display area 902 disposed on the other side (the right side of the folding area 903 shown in FIG. 8 ).

The division of regions of the main display 900 illustrated in FIG. 8 is exemplary, and the main display 900 may be divided into a plurality (eg, four or more or two) regions according to a structure or function. For example, in the embodiment shown in FIG. 8 , the region of the main display 900 may be divided by the folding region 903 extending parallel to the y-axis or the C-axis (folding axis). The display 900 may be divided into regions based on another folding region (eg, a folding region parallel to the x-axis) or another folding axis (eg, a folding axis parallel to the x-axis).

In an embodiment, the first display area 901 and the second display area 902 may have an overall symmetrical shape with respect to the folding area 903 . However, unlike the first display area 901 , the second display area 902 may include a camera hole 850 , but in other areas, it may have a symmetrical shape to the first display area 901 . can In other words, the first display area 901 and the second display area 902 may include a portion having a shape symmetrical to each other and a portion having a shape asymmetric to each other.

According to an embodiment, the camera hole 850 may be visually exposed to the outside of the electronic device 800 . According to another embodiment, the camera hole 850 may be disposed under the main display 900 and may not be visually exposed.

Hereinafter, the operation of the first housing 811 and the second housing 812 according to the state of the electronic device 800 (eg, a flat state 800A and a folded state 800B); Each area of the main display 900 will be described.

In an embodiment, when the electronic device 800 is in a flat state 800A (eg, FIG. 8 ), the first housing 811 and the second housing 812 form an angle of 180 degrees and are in the same direction. It can be arranged to face. The surface of the first display area 901 and the surface of the second display area 902 of the main display 900 may form 180 degrees with each other and may face the same direction (eg, the front direction of the electronic device). The folding area 903 may form the same plane as the first display area 901 and the second display area 902 .

In an embodiment, when the electronic device 800 is in the folded state 800B (eg, FIG. 9 ), the first housing 811 and the second housing 812 may be disposed to face each other. The surface of the first display area 901 of the main display 900 and the surface of the second display area 902 may face each other while forming a narrow angle (eg, between 0 degrees and 10 degrees). At least a portion of the folding area 903 may be formed of a curved surface having a predetermined curvature.

In an embodiment, when the electronic device 800 is in an intermediate state, the first housing 811 and the second housing 812 may be disposed at a certain angle to each other. The surface of the first display area 901 and the surface of the second display area 902 of the main display 900 may form an angle larger than the folded state and smaller than the unfolded state. At least a portion of the folding area 903 may be formed of a curved surface having a predetermined curvature, and the curvature at this time may be smaller than that in a folded state.

10 is an exploded perspective view of an electronic device according to another exemplary embodiment;

Referring to FIG. 10 , in an embodiment, the electronic device 800 includes a display unit 90 , a bracket assembly 30 , a substrate unit 400 , a first housing 811 , a second housing 812 , and a second housing 812 . It may include a first rear cover 880 and a second rear cover 890 . In this document, the display unit 90 may be referred to as a display module or a display assembly.

The display unit 90 may include a main display 900 and one or more plates or layers (not shown) on which the main display 900 is mounted. In an embodiment, the plate may be disposed between the main display 900 and the bracket assembly 30 . The main display 900 may be disposed on at least a portion of one surface of the plate (eg, an upper surface with reference to FIG. 12 ). The plate may be formed in a shape corresponding to the main display 900 .

The bracket assembly 30 includes a bracket 1010 including a first bracket 1011 and a second bracket 1012, a hinge structure 1000 disposed between the first bracket 1011 and the second bracket 1012, A hinge housing 830 that covers the hinge structure 1000 when viewed from the outside, and a wiring member 1043 that crosses the first bracket 1011 and the second bracket 1012 (eg, a flexible printed circuit board (FPC)) , flexible printed circuit).

Referring to FIG. 10 , the hinge housing 830 is disposed between the first housing 811 and the second housing 812 to cover internal components (eg, the hinge structure 1000 ). can In an embodiment, the hinge housing 830 includes the first housing 811 and the It may be covered by a portion of the second housing 812 or may be exposed to the outside.

For example, as shown in FIG. 8 , when the electronic device 800 is in the unfolded state 800A, the hinge housing 830 may not be exposed because it is covered by the first housing 811 and the second housing 812 . have. For example, as shown in FIG. 9 , when the electronic device 800 is in a folded state 800B (eg, a fully folded state), the hinge housing 830 includes the first housing 811 and the second housing 811 . It may be exposed to the outside between the two housings 812 . For example, when the first housing 811 and the second housing 812 are in an intermediate state that is folded with a certain angle, the hinge housing 830 is the first housing 811 . And the second housing 812 may be partially exposed to the outside. However, in this case, the exposed area may be smaller than in the fully folded state. In an embodiment, the hinge housing 830 may include a curved surface.

In an embodiment, the bracket assembly 30 may be disposed between the main display 900 and the substrate unit 1100 . For example, the first bracket 1011 may be disposed between the first display area 901 of the main display 900 and the first substrate 1101 . The second bracket 1012 may be disposed between the second display area 902 of the main display 900 and the second substrate 402 .

In an embodiment, at least a portion of the wiring member 1043 and the hinge structure 1000 may be disposed inside the bracket assembly 30 . The wiring member 1043 may be disposed in a direction (eg, an x-axis direction) crossing the first bracket 1011 and the second bracket 1012 . The wiring member 1043 may be disposed in a direction (eg, the x-axis direction) perpendicular to the folding axis (eg, the y-axis or the folding axis (C-axis) of FIG. 9 ) of the folding region 903 of the electronic device 800 . can

As mentioned above, the substrate unit 1100 may include a first substrate 1101 disposed on the first bracket 1011 side and a second substrate 402 disposed on the second bracket 1012 side. can The first substrate 1101 and the second substrate 402 include a bracket assembly 30 , a first housing 811 , a second housing 812 , a first rear cover 180 , and a second rear cover 190 . ) can be disposed inside the space formed by Components for implementing various functions of the electronic device 800 may be mounted on the first substrate 1101 and the second substrate 1102 .

According to an embodiment, the first substrate 1101 may be formed of a plurality of substrates. According to an embodiment, the first substrate 1101 may be formed in a form in which a plurality of substrates are separated. For example, the first substrate 1101 may be formed by being separated into the first printed circuit board 1103 and the second printed circuit board 1104 . The first housing 811 and the second housing 812 may be assembled to each other to be coupled to both sides of the bracket assembly 30 while the display unit 90 is coupled to the bracket assembly 30 . As will be described later, the first housing 811 and the second housing 812 may be coupled to the bracket assembly 30 by sliding from both sides of the bracket assembly 30 .

In an embodiment, the first housing 811 may include a first rotational support surface 813 , and the second housing 812 has a second rotational support surface corresponding to the first rotational support surface 813 ( 814) may be included. The first rotation support surface 813 and the second rotation support surface 814 may include curved surfaces corresponding to the curved surfaces included in the hinge housing 830 .

In an embodiment, the first rotational support surface 813 and the second rotational support surface 814 may be disposed in the hinge housing when the electronic device 800 is in an unfolded state 800A (eg, the electronic device of FIG. 8 ). By covering the 830 , the hinge housing 830 may not be exposed to the rear surface of the electronic device 800 or may be minimally exposed. Meanwhile, the first rotation support surface 813 and the second rotation support surface 814 are disposed on the hinge housing 830 when the electronic device 800 is in a folded state 800B (eg, the electronic device of FIG. 9 ). By rotating along the included curved surface, the hinge housing 830 may be maximally exposed to the rear surface of the electronic device 800 .

According to an embodiment, the electronic device 800 may further include a first battery 1151 , a second battery 1152 , and a speaker module 1153 .

According to an embodiment, the first battery 1151 and the second battery 1152 may be mounted inside the housing 810 of the electronic device 800 and may not be exposed to the outside. For example, the first battery 1151 may be mounted inside the first housing 811 . Also, the second battery 1152 may be mounted inside the second housing 812 .

According to an embodiment, the first battery 1151 and the second battery 1152 include a wiring member 1043 (eg, a flexible printed circuit board) disposed between the first housing 811 and the second housing 812 . can be electrically connected by

According to an embodiment, the speaker module 1153 may be disposed inside the first housing 811 . For example, the speaker module 1153 may be disposed in an area adjacent to the first battery 1151 inside the first housing 811 . According to an embodiment, the speaker module 1153 may not be exposed to the outside of the electronic device 800 . According to an embodiment, the speaker module 1153 may be mounted on the second printed circuit board 1104 of the first board 1101 .

11 illustrates a cross-sectional view of a display and a dielectric layer structure according to another embodiment.

Referring to FIG. 11 , a display 900 (or a display structure) of FIG. 11 may be referred to as a display 260 (or a display structure) of FIG. 3 . Also, each of the components (eg, the display panel 1030 ) forming the display 900 of FIG. 11 may be referred to as components forming the display 260 of FIG. 3 . Accordingly, overlapping descriptions of substantially the same components will be omitted.

According to an embodiment, the dielectric layer structure 1110 may include a material for securing rigidity and a lightweight material. According to an embodiment, the dielectric layer structure 1110 may have a structure in which a layer for securing rigidity and a layer formed of a lightweight material are stacked. According to an embodiment, since the dielectric layer structure 1110 has rigidity, the flexible display 900 may secure rigidity. According to an embodiment, as at least a portion of the dielectric layer structure 1110 is formed of a lightweight material, the weight of the flexible display 900 may be reduced.

According to an embodiment, the dielectric layer structure 1110 includes a first dielectric layer 1111 , a second dielectric layer 1112 and a first dielectric layer 1111 disposed on one surface of the first dielectric layer 1111 adjacent to the display panel 1030 . It may include a third dielectric layer 1113 disposed under the. According to another embodiment (not shown), one of the second dielectric layer 1112 and the third dielectric layer 1113 may be omitted.

According to an embodiment, the first dielectric layer 1111 may be formed of a lightweight material. According to an embodiment, the first dielectric layer 1111 may include a dielectric material having a dielectric constant less than or equal to a specified value. For example, the first dielectric layer 1111 may be formed of glass fiber reinforced plastic (GFRP) having a dielectric constant of 6 or less, but is not limited thereto.

According to an embodiment, at least a portion of the second dielectric layer 1112 and/or the third dielectric layer 1113 may be formed of a material having a stiffness greater than or equal to a specified value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 may have greater stiffness than the first dielectric layer 1111 . According to an embodiment, since the second dielectric layer 1112 and the third dielectric layer 1113 are formed of carbon fiber reinforced plastic (CFRP) having high rigidity, the rigidity of the flexible display 900 may be secured.

According to an embodiment, at least a portion of the second dielectric layer 1112 and/or the third dielectric layer 1113 may include a dielectric material having a dielectric constant greater than or equal to a specified value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 may be formed of CFRP having a dielectric constant of 200 or more, but is not limited thereto. As another example, the second dielectric layer 1112 and the third dielectric layer 1113 may have different dielectric constants.

According to an embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 may be formed inside the first edge of the first dielectric layer 1111 . According to an embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 may be formed to correspond to each other.

According to an embodiment, the dielectric layer structure 1110 may further include a dielectric 1270 extending outward from the second edge of the second dielectric layer 1112 and/or the third edge of the third dielectric layer 1113 . . For example, the dielectric layer structure 1110 extends from the second edge of the second dielectric layer 1112 and/or the third edge of the third dielectric layer 1113 , and extends from the first side of the housing 810 (eg, FIG. 4B ). may include a dielectric 1270 having an edge spaced apart from the first side surface 401) by a first distance (eg, D1).

According to an embodiment, the first dielectric layer 1111 may include a plurality of sub-layers. The first dielectric layer 1111 according to an embodiment may include a plurality of sub-layers having structures oriented in different directions. For example, the first dielectric layer 1111 may include a plurality of sub-layers having a structure oriented in a direction substantially perpendicular to each other between sub-layers adjacent to each other.

According to an embodiment, the first dielectric layer 1111 is disposed adjacent to the second dielectric layer 1112 and faces a back cover (eg, the first back cover 880 or the second back cover 890 in FIG. 8 ). A first sub-layer 1111-1 having a structure oriented in the first direction may be included.

According to an embodiment, the first dielectric layer 1111 is disposed under the first sub-layer 1111-1, and the second sub-layer 1111 has a structure oriented in a second direction substantially perpendicular to the first direction. -2) may be included. In this case, the second direction may be referred to as a direction toward a side member (eg, the first side member 2011 or the second side member 2021 of FIG. 2A ) inside the housing 810 .

According to an embodiment, the first dielectric layer 1111 may include a third sub-layer 1111-3 disposed under the second sub-layer 1111-2 and having a structure oriented in the first direction.

According to an embodiment, the second dielectric layer 1112 and/or the third dielectric layer 1113 may have a structure oriented in the second direction.

12 is a cross-sectional view of a display and a dielectric layer structure according to another embodiment.

Referring to FIG. 12 , the display 900 (or display structure) of FIG. 12 according to an embodiment may be referred to as the display 260 of FIG. 3 or the display 900 of FIG. 11 . Also, each of the components (eg, the display panel 1030 ) forming the display 900 of FIG. 12 may be referred to as components forming the display 260 of FIG. 3 or the display 900 of FIG. 11 . Accordingly, overlapping descriptions of substantially the same components will be omitted.

According to an embodiment, the dielectric layer structure 1110 includes a first dielectric layer 1111 , a second dielectric layer 1112 and a first dielectric layer 1111 disposed on one surface of the first dielectric layer 1111 adjacent to the display panel 1030 . It may include a third dielectric layer 1113 disposed under the. According to another embodiment (not shown), one of the second dielectric layer 1112 and the third dielectric layer 1113 may be omitted.

According to an embodiment, the first dielectric layer 1111 may be formed of a lightweight material. According to an embodiment, the first dielectric layer 1111 may include a dielectric material having a dielectric constant less than or equal to a specified value. For example, the first dielectric layer 1111 may be formed of glass fiber reinforced plastic (GFRP) having a dielectric constant of 6 or less, but is not limited thereto.

According to an embodiment, at least a portion of the second dielectric layer 1112 and/or the third dielectric layer 1113 may be formed of a material having a stiffness greater than or equal to a specified value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 may have greater stiffness than the first dielectric layer 1111 . According to an embodiment, since the second dielectric layer 1112 and the third dielectric layer 1113 are formed of carbon fiber reinforced plastic (CFRP) having high rigidity, the rigidity of the flexible display 900 may be secured.

According to an embodiment, at least a portion of the second dielectric layer 1112 and/or the third dielectric layer 1113 may include a dielectric material having a dielectric constant greater than or equal to a specified value. For example, the second dielectric layer 1112 and the third dielectric layer 1113 may be formed of CFRP having a dielectric constant of 200 or more, but is not limited thereto. As another example, the second dielectric layer 1112 and the third dielectric layer 1113 may have different dielectric constants.

According to an embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 may be formed inside the first edge of the first dielectric layer 1111 . According to an embodiment, the second edge of the second dielectric layer 1112 and the third edge of the third dielectric layer 1113 may be formed to correspond to each other.

According to an embodiment, the dielectric layer structure 1110 may further include a dielectric 1270 extending outward from the second edge of the second dielectric layer 1112 and/or the third edge of the third dielectric layer 1113 . . For example, the dielectric layer structure 1110 extends from the second edge of the second dielectric layer 1112 and/or the third edge of the third dielectric layer 1113 , and extends from the first side of the housing 810 (eg, FIG. 4B ). may include a dielectric 1270 having an edge spaced apart from the first side surface 401 by a first distance (eg, the first distance D1 of FIG. 4B ).

According to an embodiment, the first dielectric layer 1111 may have a woven structure 1210 . According to an embodiment, at least a partial region of the first dielectric layer 1111 may have a woven structure 1210 . According to an embodiment, the first dielectric layer 1111 may be referred to as a dielectric layer in which a dielectric is woven in a weave manner. For example, the first dielectric layer 1111 may have a woven structure 1210 in which a plurality of dielectrics cross each other. According to an embodiment, since the first dielectric layer 1111 is formed as a single-layer woven structure 1210 , the thickness and weight of the dielectric layer structure 1110 may be minimized.

According to an embodiment, the dielectric layer structure 1110 includes a coating layer 1220 disposed on one surface of the second dielectric layer 1112 adjacent to the display panel 1030 and/or one surface of the third dielectric layer 1113 adjacent to the rear cover. may include According to one embodiment, the dielectric layer structure 1110 includes a coating layer 1220 disposed on one side of the second dielectric layer 1112 and/or one side of the third dielectric layer 1113 , such that the surface quality of the dielectric layer structure 1110 . This can be improved.

13A illustrates a structure of a dielectric layer formed in a region corresponding to an edge of a display according to another exemplary embodiment. 13B illustrates a structure of a dielectric layer formed in an area corresponding to a partial area of a display according to another exemplary embodiment.

13A and 13B together, the second dielectric layer 1112 and the third dielectric layer 1113 according to an exemplary embodiment are formed in a region corresponding to at least a portion of the edge of the housing 810 at the edge of the housing 810 and It may be formed to be spaced apart by a predetermined distance (eg, D1). The second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment may be formed to be adjacent to the edge of the housing 810 in a region corresponding to at least a portion of the edge of the housing 810 .

According to an embodiment, the first housing 811 (or the first side member 801 ) includes a first portion 1301A and a second portion 1301B extending substantially vertically from the first portion 1301A. and a third portion 1301C extending substantially perpendicular to the second portion 1301B and substantially parallel to the first portion 1301A.

According to one embodiment, the second housing 812 (or the second side member 802 ) includes a fourth portion 1302A, a fifth portion 1302B extending substantially perpendicular from the fourth portion 1302A. and a sixth portion 1302C extending substantially perpendicular to the fifth portion 1302B and substantially parallel to the fourth portion 1302A.

Referring to FIG. 13A , the second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment may be formed to be adjacent to the edge of the housing 810 in a region corresponding to the edge of the housing 810 . According to an embodiment, the second dielectric layer 1112 and the third dielectric layer 1113 are spaced apart from the edge of the housing 810 by a predetermined distance (eg, D1) in an area excluding an area corresponding to the edge of the housing 810 . It can be formed to be

For example, the second dielectric layer 1112 and/or the third dielectric layer 1113 according to an embodiment correspond to an edge where the first portion 1301A and the second portion 1301B of the first housing 811 meet. It may be formed so as to be adjacent to the edge of the first housing 811 in the region to be used. For example, the second dielectric layer 1112 and/or the third dielectric layer 1113 according to an embodiment correspond to an edge where the second portion 1301B and the third portion 1301C of the first housing 811 meet. It may be formed so as to be adjacent to the edge of the first housing 811 in the region to be used. For example, the second dielectric layer 1112 and/or the third dielectric layer 1113 is a region except for a region corresponding to a corner where the first part 1301A and the second part 1301B of the first housing 811 meet. may be formed to be spaced apart from the edge of the first housing 811 by a predetermined distance (eg, D1) or more. For example, the second dielectric layer 1112 and/or the third dielectric layer 1113 is a region excluding a region corresponding to a corner where the second part 1301B and the third part 1301C of the first housing 811 meet. may be formed to be spaced apart from the edge of the first housing 811 by a predetermined distance (eg, D1) or more.

According to an embodiment, the second dielectric layer 1112 and/or the third dielectric layer 1113 may be formed on the second housing 812 to correspond to a shape formed on the first housing 811 .

Referring to FIG. 13B , the second dielectric layer 1112 and the third dielectric layer 1113 according to an embodiment may be formed to be adjacent to the edge of the housing 810 in a region corresponding to at least a portion of the housing 810 . . According to an embodiment, the second dielectric layer 1112 and the third dielectric layer 1113 are formed by a predetermined distance (eg, D1) from the edge of the housing 810 in an area excluding an area corresponding to at least a portion of the housing 810 . It may be formed to be spaced apart.

For example, the second dielectric layer 1112 and/or the third dielectric layer 1113 may have a first distance d1 from an edge that meets the first portion 1301A of the second portion 1301B of the first housing 811 . It may be formed so as to be adjacent to the edge of the first housing 811 in a region corresponding to an area from a point spaced apart by a distance from a point spaced apart by the distance d1 from an edge meeting the third portion 1301C to a point spaced apart by the first distance d1. For example, the second dielectric layer 1112 and/or the third dielectric layer 1113 may have a first distance d1 from an edge that meets the first portion 1301A of the second portion 1301B of the first housing 811 . It may be formed to be spaced apart from the edge of the first housing 811 by a predetermined distance (eg, D1) or more to a point spaced apart by as much as possible. For example, the second dielectric layer 1112 and/or the third dielectric layer 1113 may have a first distance d1 from an edge where they meet the third portion 1301C of the second portion 1301B of the first housing 811 . It may be formed to be spaced apart from the edge of the first housing 811 by a predetermined distance (eg, D1) or more to a point spaced apart by as much as possible.

For another example, the second dielectric layer 1112 and/or the third dielectric layer 1113 may be located at a third distance d3 from the edge where the fourth portion 1302A of the fifth portion 1302B of the second housing 812 meets. . . The second dielectric layer 1112 and/or the third dielectric layer 1113 is a point spaced apart by a second distance d2 from an edge that meets the sixth portion 1302C of the fifth portion 1302B of the second housing 812 . It may be formed to be spaced apart from the edge of the second housing 812 by a predetermined distance (eg, D1) or more. The second dielectric layer 1112 and/or the third dielectric layer 1113 is a point spaced apart by a third distance d3 from an edge that meets the fourth portion 1302A of the fifth portion 1302B of the second housing 812 . It may be formed to be spaced apart from the edge of the second housing 812 by a predetermined distance (eg, D1) or more.

The electronic device 101 according to an embodiment forms a first side 401 member forming the first side surface 401 of the electronic device 101 and a second side surface corresponding to the first side surface 401 . A housing that includes a second side member and a hinge structure connecting the first side member and the second side member, and is convertible to a folding or unfolding state around the hinge structure, A rear cover forming a rear surface of the electronic device 101, disposed inside the housing, a wireless communication circuit for transmitting and receiving a signal of a specified frequency by supplying power to at least a portion of the housing, and a display structure coupled to the housing The display structure may include a cover glass 340 forming at least a portion of the front surface of the electronic device 101, a display panel 330 disposed adjacent to one surface of the cover glass 340, A first dielectric layer 3111 disposed under the display panel 330 , a first edge 351 of the first dielectric layer 3111 is a first distance D1 from the first side surface 401 . a second dielectric layer 3112 disposed on a first surface of the first dielectric layer 3111 adjacent to the display panel 330, and a second surface of the first dielectric layer 3111 adjacent to the rear cover. a second edge 352 and the third of the second dielectric layer 3112, corresponding to the first edge 351 of the first dielectric layer 3111, including a third dielectric layer 3113 disposed on A third edge 353 of the dielectric layer 3113 is spaced apart from the first side surface 401 by a second distance D2 greater than the first distance D1, the first dielectric layer 3111 has a first permittivity , and the second dielectric layer 3112 and the third dielectric layer 3113 may have a higher dielectric constant than the first dielectric constant.

The display structure according to an embodiment may further include a dielectric 470 extending outwardly from the second edge 352 and/or the third edge 353 , and the edge of the dielectric 470 is formed from the second edge 352 and/or the third edge 353 . It may be spaced apart from the first side 401 by the first distance D1.

According to an embodiment, the first dielectric constant of the first dielectric layer 3111 may be 6 or less, and the second dielectric layer 3112 and the third dielectric layer 3113 may have a dielectric constant of 150 or more.

According to an embodiment, the edges of the cover glass 340 and the display panel 330 may be formed by a third distance D3 greater than the first distance D1 and smaller than the second distance D2. It may be spaced apart from the side 401 .

According to an embodiment, a first layer 320 disposed under the third dielectric layer 3113 may be included, and the first layer 320 may include at least one of a digitizer and a metal plate. have.

According to an embodiment, the first dielectric layer 3111 may include glass fiber reinforced plastic (GFRP).

According to an embodiment, the second dielectric layer 3112 and/or the third dielectric layer 3113 may include carbon fiber reinforced plastic (CFRP).

According to an embodiment, when viewed from a direction perpendicular to the front surface of the electronic device 101 , the edge of the display panel 330 may be disposed between the first edge 351 and the second edge 352 . can

According to an embodiment, at least one of the first dielectric layer 3111, the second dielectric layer 3112, and the third dielectric layer 3113 has a lattice pattern in at least a portion of the region adjacent to the hinge structure. can have

According to an embodiment, a first edge 351 of the first dielectric layer 3111 , a second edge 352 of the second dielectric layer 3112 , and a third edge 353 of the third dielectric layer 3113 . may be formed in an area of the housing corresponding to an area operating as an antenna radiator by being supplied with power from the wireless communication circuit.

A display structure according to an embodiment includes a cover glass 340 forming an outer surface of the display structure, a display panel 330 disposed under the cover glass 340 , and at least a portion of the display panel 330 . A first dielectric layer 3111 having a first edge 351 formed outside the edge and disposed under the display panel 330 , and the first dielectric layer 3111 adjacent to the display panel 330 . ) may include a second dielectric layer 3112 disposed on a first surface, and a third dielectric layer 3113 disposed on a second surface of the first dielectric layer 3111 facing in a direction opposite to the first surface, and , the second edge 352 of the second dielectric layer 3112 and the third edge 353 of the third dielectric layer 3113 corresponding to the first edge 351 of the first dielectric layer 3111 are Formed inside the first edge 351 , the first dielectric layer 3111 has a first dielectric constant, and the second dielectric layer 3112 and the third dielectric layer 3113 have a higher dielectric constant than the first dielectric constant. can have

According to an embodiment, the display structure further comprises a dielectric 470 extending outwardly from the second edge 352 and/or the third edge 353 , the dielectric 470 being the first edge It may have an edge corresponding to (351).

According to an embodiment, the first dielectric layer 3111 includes glass fiber reinforced plastic (GFRP), and the second dielectric layer 3112 and the third dielectric layer 3113 include carbon fiber reinforced plastic (CFRP). can do.

According to an embodiment, the display structure includes a first layer 320 disposed under a third dielectric layer 3113, wherein the first layer 320 includes at least one of a digitizer or a metal plate. can do.

Edges of the cover glass 340 and the display panel 330 according to an embodiment may be formed inside the first edge 351 and outside the second edge 352 .

In the electronic device 101 according to an embodiment, a first housing forming a first side surface 401 of the electronic device 101, and a second housing forming a second side surface corresponding to the first side surface 401 of the electronic device 101 A housing comprising two housings and a hinge structure connecting the first housing and the second housing, the housing convertible into a folding or unfolding state around the hinge structure, disposed inside the housing, a wireless communication circuit for transmitting and receiving a signal of a specified frequency by supplying power to at least a portion of the housing; and a display structure coupled to the housing, wherein the display structure is coupled to the housing and at least a portion of a front surface of the electronic device (101) A cover glass 340 (cover glass) forming a first layer (320) having an edge (351), the first layer (320) comprising: a first region at least partially formed inward from the first edge (351), and in the first region a second region extending outwardly to form the first edge 351 , the first region having a first permittivity, and the second region having a second permittivity smaller than the first permittivity .

According to an embodiment, the first region may be formed of at least one of a soft graphite resin or a heat-conducting flexible composite resin.

According to an embodiment, the second region may include glass fiber reinforced plastic (GFRP).

According to an embodiment, the electronic device 101 may further include a bracket on which the display structure is mounted, and at least a portion of the second area may be disposed to correspond to the bracket.

According to an embodiment, the display structure may include a second layer disposed below the first layer 320 , and the second layer may include at least one of a digitizer or a metal plate.

The electronic device 101 according to an embodiment includes a first side member forming a first side surface of the electronic device 101 , a second side member forming a second side surface corresponding to the first side surface, and the second side member forming the first side surface of the electronic device 101 . A housing 810 including a hinge structure connecting the first side member and the second side member, the housing 810 being convertible to a folding or unfolding state around the hinge structure, and a rear surface of the electronic device 101 A rear cover that forms a, is disposed inside the housing 810, and includes a wireless communication circuit for transmitting and receiving a signal of a specified frequency by feeding at least a portion of the housing 810, and a display structure coupled to the housing 810 can do.

In the display structure according to an embodiment, a display panel, a first dielectric layer 1111 disposed under the display panel, and having a first dielectric constant, a first edge of the first dielectric layer 1111 is the first spaced apart from one side by a first distance, a second dielectric layer 1112 disposed on a first surface of the first dielectric layer 1111 adjacent to the display panel, and the first dielectric layer 1111 adjacent to the rear cover a structure including a third dielectric layer 1113 disposed on a second surface, wherein the first dielectric layer 1111 is disposed adjacent to the second dielectric layer 1112 and oriented in a first direction toward the rear cover A first sub-layer 111-1 having 111-2), and a third sub-layer 111-3 disposed under the second sub-layer 111-2 and having a structure oriented in the first direction, wherein the first dielectric constant is greater than the first dielectric constant. The second dielectric layer 1112 having a dielectric constant and the third dielectric layer 1113 having a higher dielectric constant than the first dielectric constant may have a structure oriented in the second direction.

According to an embodiment, the display structure further includes a dielectric 1270 extending outward from a second edge of the second dielectric layer 1112 and/or a third edge of the third dielectric layer 1113, An edge of the dielectric 1270 may be spaced apart from the first side by the first distance.

The electronic device 101 according to an embodiment includes a first side member forming a first side surface of the electronic device 101 , a second side member forming a second side surface corresponding to the first side surface, and the second side member forming the first side surface of the electronic device 101 . A housing 810 including a hinge structure connecting the first side member and the second side member, the housing 810 being convertible to a folding or unfolding state around the hinge structure, and a rear surface of the electronic device 101 A rear cover that forms a, is disposed inside the housing 810, and includes a wireless communication circuit for transmitting and receiving a signal of a specified frequency by feeding at least a portion of the housing 810, and a display structure coupled to the housing 810 and the display structure includes a display panel, a first dielectric layer 1111 disposed under the display panel, and a first edge of the first dielectric layer 1111 is spaced apart from the first side by a first distance a second dielectric layer 1112 disposed on a first surface of the first dielectric layer 1111 adjacent to the display panel and having a second edge corresponding to the first edge, and the first dielectric layer 1112 adjacent to the rear cover a third dielectric layer 1113 disposed on the second side of the dielectric layer 1111 and having a third edge corresponding to the first edge, the first dielectric layer 1111 having a woven structure can have

According to an embodiment, the display structure further includes a coating layer 1220 disposed on one surface of the second dielectric layer 1112 adjacent to the display panel and/or one surface of the third dielectric layer 1113 adjacent to the rear cover. may include

According to an embodiment, the display structure further includes a dielectric 1270 extending outwardly from the second edge and/or the third edge, and an edge of the dielectric 1270 extends from the first side. They may be spaced apart by a first distance.

Claims (25)

In an electronic device,
a first side member forming a first side surface of the electronic device, a second side member forming a second side surface corresponding to the first side surface, and a hinge structure connecting the first side member and the second side member; a housing convertible to a folding or unfolding state around the hinge structure;
a rear cover forming a rear surface of the electronic device;
a wireless communication circuit disposed inside the housing and transmitting and receiving a signal of a specified frequency by supplying power to at least a portion of the housing; and
a display structure coupled to the housing, the display structure comprising:
a cover glass forming at least a portion of a front surface of the electronic device;
a display panel disposed adjacent to one surface of the cover glass;
a first dielectric layer disposed under the display panel, a first edge of the first dielectric layer being spaced apart from the first side by a first distance;
a second dielectric layer disposed on a first side of the first dielectric layer adjacent to the display panel; and
a second edge of the second dielectric layer and a third dielectric layer disposed on a second side of the first dielectric layer adjacent the back cover, the second edge of the second dielectric layer corresponding to the first edge of the first dielectric layer; a third edge is spaced apart from the first side by a second distance greater than the first distance;
wherein the first dielectric layer has a first dielectric constant, and the second dielectric layer and the third dielectric layer have a dielectric constant greater than the first dielectric constant. The method according to claim 1,
The display structure further comprises a dielectric extending outwardly from the second edge and/or the third edge,
and an edge of the dielectric is spaced apart from the first side by the first distance. The method according to claim 1,
The first dielectric constant of the first dielectric layer is 6 or less,
and the second dielectric layer and the third dielectric layer have a dielectric constant of 150 or greater. The method according to claim 1,
and edges of the cover glass and the display panel are spaced apart from the first side by a third distance greater than the first distance and smaller than the second distance. The method according to claim 1,
a first layer disposed under the third dielectric layer;
and the first layer comprises at least one of a digitizer or a metal plate. The method according to claim 1,
The first dielectric layer comprises glass fiber reinforced plastic (GFRP). The method according to claim 1,
wherein the second dielectric layer and/or the third dielectric layer comprises carbon fiber reinforced plastic (CFRP). The method according to claim 1,
an edge of the display panel is disposed between the first edge and the second edge when viewed from a direction perpendicular to the front surface of the electronic device. The method according to claim 1,
and at least one of the first dielectric layer, the second dielectric layer, and the third dielectric layer has a lattice pattern in at least a portion of the region adjacent to the hinge structure. The method according to claim 1,
The first edge of the first dielectric layer, the second edge of the second dielectric layer, and the third edge of the third dielectric layer are formed in a region of the housing corresponding to a region that operates as an antenna radiator by being fed from the wireless communication circuit. being an electronic device. In the display structure,
a cover glass forming an outer surface of the display structure;
a display panel disposed under the cover glass;
a first dielectric layer disposed under the display panel, at least a portion of the first dielectric layer having a first edge formed outside the edge of the display panel;
a second dielectric layer disposed on a first side of the first dielectric layer adjacent to the display panel; and
a second edge of the second dielectric layer and a third dielectric layer disposed on a second surface of the first dielectric layer facing in a direction opposite to the first surface, corresponding to the first edge of the first dielectric layer; a third edge of the third dielectric layer is formed inside the first edge;
wherein the first dielectric layer has a first dielectric constant, and the second dielectric layer and the third dielectric layer have a dielectric constant greater than the first dielectric constant. 12. The method of claim 11,
the display structure further comprises a dielectric extending outwardly from the second edge and/or the third edge;
wherein the dielectric has an edge corresponding to the first edge. 12. The method of claim 11,
The first dielectric layer comprises glass fiber reinforced plastic (GFRP),
wherein the second dielectric layer and the third dielectric layer include carbon fiber reinforced plastic (CFRP). 12. The method of claim 11,
a first layer disposed under the third dielectric layer;
wherein the first layer comprises at least one of a digitizer or a metal plate. 12. The method of claim 11,
and edges of the cover glass and the display panel are formed inside the first edge and outside the second edge. In an electronic device,
a first housing forming a first side surface of the electronic device, a second housing forming a second side surface corresponding to the first side surface, and a hinge structure connecting the first housing and the second housing; a housing convertible into a folding or unfolding state based on a hinge structure;
a wireless communication circuit disposed inside the housing and transmitting and receiving a signal of a specified frequency by supplying power to at least a portion of the housing; and
a display structure coupled to the housing, the display structure comprising:
a cover glass coupled to the housing and forming at least a portion of a front surface of the electronic device;
a display panel disposed adjacent to one surface of the cover glass;
At least a portion of the display panel comprises a first layer having a first edge formed outside the edge,
The first layer comprises:
a first region at least a portion of which is formed inwardly from the first edge, and
a second region extending outwardly from the first region to form the first edge;
The electronic device of claim 1, wherein the first region has a first permittivity, and the second region has a second permittivity that is less than the first permittivity. 17. The method of claim 16,
The electronic device, wherein the first region is formed of at least one of a soft graphite resin or a heat-conducting flexible composite resin. 17. The method of claim 16,
The second region includes glass fiber reinforced plastic (GFRP). 17. The method of claim 16,
The electronic device further includes a bracket on which the display structure is mounted,
At least a portion of the second area is disposed to correspond to the bracket. 17. The method of claim 16,
a second layer disposed below the first layer;
and the second layer comprises at least one of a digitizer or a metal plate. In an electronic device,
a first side member forming a first side surface of the electronic device, a second side member forming a second side surface corresponding to the first side surface, and a hinge structure connecting the first side member and the second side member; a housing convertible to a folding or unfolding state around the hinge structure;
a rear cover forming a rear surface of the electronic device;
a wireless communication circuit disposed inside the housing and transmitting and receiving a signal of a specified frequency by supplying power to at least a portion of the housing; and
a display structure coupled to the housing, the display structure comprising:
display panel,
a first dielectric layer disposed under the display panel, the first dielectric layer having a first dielectric constant, a first edge of the first dielectric layer being spaced apart from the first side by a first distance;
a second dielectric layer disposed on a first side of the first dielectric layer adjacent to the display panel; and
a third dielectric layer disposed on a second side of the first dielectric layer adjacent the back cover;
The first dielectric layer comprises:
a first sub-layer disposed adjacent to the second dielectric layer and having a structure oriented in a first direction toward the rear cover;
a second sub-layer disposed under the first sub-layer and having a structure oriented in a second direction substantially perpendicular to the first direction; and
a third sub-layer disposed under the second sub-layer and having a structure oriented in the first direction;
The electronic device of claim 1, wherein the second dielectric layer having a dielectric constant greater than the first dielectric constant and the third dielectric layer having a dielectric constant greater than the first dielectric constant have a structure oriented in the second direction. 22. The method of claim 21,
the display structure further comprises a dielectric extending outwardly from a second edge of the second dielectric layer and/or a third edge of the third dielectric layer;
and an edge of the dielectric is spaced apart from the first side by the first distance. In an electronic device,
a first side member forming a first side surface of the electronic device, a second side member forming a second side surface corresponding to the first side surface, and a hinge structure connecting the first side member and the second side member; a housing convertible to a folding or unfolding state around the hinge structure;
a rear cover forming a rear surface of the electronic device;
a wireless communication circuit disposed inside the housing and transmitting and receiving a signal of a specified frequency by supplying power to at least a portion of the housing; and
a display structure coupled to the housing, the display structure comprising:
display panel,
a first dielectric layer disposed under the display panel, a first edge of the first dielectric layer being spaced apart from the first side by a first distance;
a second dielectric layer disposed on a first surface of the first dielectric layer adjacent to the display panel and having a second edge corresponding to the first edge; and
a third dielectric layer disposed on a second surface of the first dielectric layer adjacent to the back cover and having a third edge corresponding to the first edge;
wherein the first dielectric layer has a woven structure. 24. The method of claim 23,
The display structure further includes a coating layer disposed on one surface of the second dielectric layer adjacent to the display panel and/or one surface of the third dielectric layer adjacent to the rear cover. 24. The method of claim 23,
The display structure further comprises a dielectric extending outwardly from the second edge and/or the third edge,
and an edge of the dielectric is spaced apart from the first side by the first distance.

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