CN117795936A

CN117795936A - Electronic device comprising a foldable display

Info

Publication number: CN117795936A
Application number: CN202280053650.5A
Authority: CN
Inventors: 安正铁; 洪贤珠
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2021-10-18
Filing date: 2022-09-13
Publication date: 2024-03-29

Abstract

An electronic device according to an embodiment includes: a first housing and a second housing; a foldable display including a first region disposed on a front surface of the first housing and a second region disposed on a front surface of the second housing; a hinge structure connecting the first housing with the second housing such that the second housing is rotatable about a first axis relative to the first housing; and a metal plate disposed on a rear surface of the foldable display, wherein the metal plate may include: a first metal plate provided on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a second metal plate provided on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure. Various other embodiments are possible, identified by the specification.

Description

Electronic device comprising a foldable display

Technical Field

The present disclosure relates to electronic devices including foldable displays.

Background

In the case of an electronic device including a display, there is a limitation in that as the display becomes larger and larger, the size of a housing of the electronic device must be increased. Accordingly, display electronic devices capable of satisfying customer demands such as portability and convenience while overcoming limitations are being developed.

As a representative example, the electronic device may include a foldable display. For example, an electronic device including a foldable display may ensure portability by reducing the display by folding the housing of the electronic device and the display in half. In addition, an electronic device including a foldable display can provide convenience by providing a wide screen to a user through the unfolding of a case and a display.

Disclosure of Invention

Technical problem

An electronic device including a foldable display may provide a display that is folded or unfolded about a folding axis. In order to provide a folded or unfolded display, a crease lattice structure may be formed in a region adjacent to a folding axis of the foldable display (hereinafter, "folded portion"), and the folded portion of the foldable display may be formed thin.

However, since the lattice structure and the display are formed to be thin, the folded portion may be vulnerable to external impact. For example, when the electronic device receives an impact from the outside, a shear (shear) motion or torsion with respect to the folding axis may occur in the housing and the display. The foldable portion of the display may be damaged by shearing or twisting of the display.

To address this, the electronic device may further include a cover panel. However, when the electronic device includes a thick cover panel to ensure durability of the display, the thickness of the folded portion of the display may increase. As the thickness of the folded portion increases, the folding radius of the electronic device may be limited.

Also, in a state in which the electronic device is folded, the cover panel may be subjected to deformation stress. The deformation stress may cause creases in the cover panel or the display in a flat state of the electronic device. Thus, when a crease is generated on the display, the visibility of the electronic device may be impaired.

In addition, an additional adhesive layer for attaching the cover panel may be required, and thus the cost of manufacturing the electronic device may increase.

Aspects of the present disclosure are directed to solving at least the problems and/or disadvantages noted above and to providing at least the advantages described below. Accordingly, it is an aspect of the present disclosure to provide a foldable display having improved durability by reducing a shearing motion or torsion of a folding axis of the display regardless of external impact.

Solution scheme

According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes: a housing including a first housing and a second housing; a foldable display including a first region disposed on a front surface of the first housing and a second region disposed on a front surface of the second housing; a hinge structure connecting the first housing to the second housing such that the second housing is rotatable about a first axis relative to the first housing; and a metal plate disposed on a rear surface of the foldable display, wherein the metal plate includes: a first metal plate provided on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a second metal plate provided on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, the first metal plate including: a first recess recessed from a first outer periphery of the first metal plate adjacent to the first axis; and a first convex portion spaced apart from the first concave portion and extending from the first outer periphery, and the second metal plate includes: a second recess recessed from a second outer periphery of the second metal plate adjacent to the first axis and receiving the first protrusion when the housing is deployed; and a second protrusion extending from the second outer periphery and inserted into the first recess when the housing is unfolded.

According to another aspect of the present disclosure, an electronic device is provided. The electronic device includes: a housing including a first housing and a second housing; a foldable display including a first region disposed on a front surface of the first housing and a second region disposed on a front surface of the second housing; a hinge structure connecting the first housing to the second housing such that the second housing is rotatable about a first axis relative to the first housing, the hinge structure including a hinge gear enabling rotation of the second housing about the first axis and a hinge module connected to the hinge gear; and a metal plate disposed on a rear surface of the foldable display, wherein the metal plate includes: a first metal plate provided on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a second metal plate provided on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, the first metal plate including: a first recess recessed from a first outer periphery of the first metal plate adjacent to the first axis; and a first protrusion spaced apart from the first recess and extending from the first outer periphery, the second metal plate including: a second recess recessed from a second outer periphery of the second metal plate adjacent to the first axis and receiving the first protrusion when the housing is deployed; and a second protrusion extending from the second outer periphery and inserted into the first recess when the housing is unfolded, and the hinge module includes: a first hinge module provided on the rear surface of the first metal plate and including a first hinge module convex portion overlapping the first convex portion and a second hinge module concave portion overlapping the first concave portion when viewed from the front surface of the electronic device; and a second hinge module provided on the rear surface of the second metal plate and including a first hinge module convex portion overlapping the second convex portion and a second hinge module concave portion overlapping the second concave portion when viewed from the front surface of the electronic device.

Advantageous effects

According to various embodiments disclosed herein, the electronic device may include a metal plate formed on a rear surface of the display, and thus may reduce the possibility of shearing movement or torsion of the display. Accordingly, an electronic device with improved durability can be provided to a user.

Also, according to various embodiments, in the electronic device, the cover panel may be omitted or a cover panel of reduced thickness may be included, and thus the electronic device may include a display whose folded portion has a reduced thickness. Accordingly, the electronic device may include a display whose folding angle is not limited.

Also, according to various embodiments, an electronic device with improved visibility may be provided by reducing the generation of creases on the cover panel or display.

In addition, various effects identified herein, either directly or indirectly, may be provided.

Drawings

Fig. 1 illustrates a first state (e.g., a flat state) of an electronic device according to an embodiment of the present disclosure;

fig. 2 illustrates a second state (e.g., a folded state) of the electronic device according to an embodiment of the present disclosure;

FIG. 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure;

fig. 4 illustrates a front surface of a metal plate of an electronic device according to an embodiment of the present disclosure;

FIG. 5a is a cross-sectional view of an electronic device taken along line A-A' according to an embodiment of the present disclosure;

FIG. 5B is a cross-sectional view of the electronic device of FIG. 4, taken along line B-B', in accordance with an embodiment of the present disclosure;

FIG. 5C is a cross-sectional view of the electronic device of FIG. 4, taken along line C-C', in accordance with an embodiment of the present disclosure;

FIG. 6 is a cross-sectional view of the electronic device of FIG. 4, taken along line A-A', in accordance with an embodiment of the present disclosure;

fig. 7 illustrates a front surface of a metal plate of an electronic device according to an embodiment of the present disclosure;

FIG. 8 illustrates a front surface of a hinge plate of an electronic device according to an embodiment of the present disclosure;

fig. 9a shows a hinge structure of an electronic device according to an embodiment of the present disclosure;

FIG. 9b illustrates a hinge module of a hinge structure according to an embodiment of the present disclosure;

FIG. 10 illustrates a hinge bracket of an electronic device according to an embodiment of the present disclosure;

FIG. 11 illustrates a hinge bracket of an electronic device according to an embodiment of the present disclosure;

FIG. 12 illustrates a hinge bracket of an electronic device according to an embodiment of the present disclosure;

fig. 13 illustrates a protrusion of a metal plate according to an embodiment of the present disclosure;

fig. 14 illustrates a boss of an electronic device according to an embodiment of the present disclosure;

Fig. 15 illustrates a front surface of a metal plate of an electronic device according to an embodiment of the present disclosure;

fig. 16 illustrates a boss of an electronic device according to an embodiment of the present disclosure;

fig. 17 illustrates an electronic device in a network environment according to an embodiment of the present disclosure.

Throughout the drawings, like reference numerals will be understood to refer to like parts, components and structures.

Detailed Description

The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of the various embodiments of the disclosure as defined by the claims and their equivalents. It includes various specific details to aid in this understanding, but these should be considered exemplary only. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to written meanings, but are used only by the inventors to achieve a clear and consistent understanding of the disclosure. Accordingly, it should be apparent to those skilled in the art that the following descriptions of the various embodiments of the present disclosure are provided for illustration only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

Fig. 1 illustrates a first state (e.g., a flat state) of an electronic device according to an embodiment of the present disclosure.

Fig. 2 illustrates a second state (e.g., a folded state) of the electronic device according to an embodiment of the present disclosure.

Referring to fig. 1 and 2, in an embodiment, the electronic device 100 may include a case 110, a hinge cover 230 covering a foldable portion of the case 110, and a flexible or foldable main display 200 (hereinafter, simply referred to as "main display" 200) disposed in a space formed by the case 110. Herein, the surface on which the main display 200 is disposed is defined as a first surface or front surface 101 of the electronic device 100. Further, a surface opposite to the front surface 101 is defined as a second or rear surface 102 of the electronic device 100. In addition, a surface surrounding the space between the front surface 101 and the rear surface 102 is defined as a third surface or side surface 103 of the electronic device 100.

According to an embodiment, the housing 110 may comprise a collapsible housing. In an embodiment, the housing 110 may include a first housing 111, a second housing 112, a first rear cover 180, and a second rear cover 190. The housing 110 of the electronic device 100 is not limited to the form and combination shown in fig. 1 and 2, and may be implemented by other shapes or combinations of components. For example, in another embodiment, the first housing 111 and the first rear cover 180 may be integrally formed, and the second housing 112 and the second rear cover 190 may be integrally formed.

According to an embodiment, the flat state of the electronic device 100 may imply a flat state 100A or a first state 100A. For example, the state in which the first case 111 and the second case 112 are unfolded may correspond to the flat state 100A or the first state 100A. Also, the folded state of the electronic device 100 may suggest a folded state 100B or a second state (e.g., folded state 100B). For example, the state in which the second housing 112 is rotated and folded with respect to the first housing 111 may correspond to the folded state 100B or the second state 100B.

According to an embodiment, the angle or distance formed between the first case 111 and the second case 112 may vary depending on whether the electronic device 100 is in a flat state, a folded state, or an intermediate state.

In the illustrated embodiment, the first case 111 and the second case 112 are disposed on both sides about a folding axis (hereinafter, "first axis"), and may have shapes generally symmetrical to each other with respect to the first axis. However, the first case 111 and the second case 112 may have shapes that are asymmetric with each other in a partial region. For example, unlike the first housing 111, the second housing 112 may further include a Universal Serial Bus (USB) hole 151. In other words, the first case 111 and the second case 112 may include portions symmetrical in shape to each other and portions asymmetrical in shape to each other.

According to an embodiment, the main display 200 may be symmetrically disposed across the first case 111 and the second case 112.

In an embodiment, the first housing 111 and the second housing 112 may be at least partially formed of metal or a non-metallic material having a selected degree of hardness so as to support the main display 200.

In an embodiment, the first rear cover 180 may be disposed at one side of the first axis on the rear surface of the electronic device. For example, the first rear cover 180 may have a substantially rectangular outer periphery, and the outer periphery may be surrounded by the first case 111. Similarly, the second rear cover 190 may be disposed on the other side of the first axis on the rear surface of the electronic device, and its outer periphery may be surrounded by the second housing 112.

In the illustrated embodiment, the first and second rear covers 180 and 190 may have shapes that are substantially symmetrical to each other about the first axis. However, the first and second rear covers 180 and 190 do not necessarily have shapes symmetrical to each other, and in another embodiment, the electronic device 100 may include the first and second rear covers 180 and 190 having various shapes.

In an embodiment, the first rear cover 180, the second rear cover 190, the first case 111, and the second case 112 may form faces in which various components of the electronic device 100 (e.g., a printed circuit board or a battery) can be disposed. In embodiments, one or more components may be disposed on a rear surface of the electronic device 100, or may be visually exposed. For example, a portion of the sub display 220 may be visually exposed through the first rear region 231 of the first rear cover 180. According to another embodiment, the sub display 220 may be disposed on the entire first rear region 231 of the first rear cover 180.

In another embodiment, one or more components or sensors may be visually exposed through the second rear region 232 of the second rear cover 190. In various embodiments, the sensor may include a proximity sensor and/or a rear camera 280.

The main display 200 may be disposed in a space formed by the case 110. For example, the main display 200 may be disposed in a recess formed by the case 110, and may form a majority of the front surface 101 of the electronic device 100.

Accordingly, the front surface 101 of the electronic device 100 may include the main display 200 and a partial region of the first housing 111 and a partial region of the second housing 112, which are adjacent to the main display 200. Further, the rear surface 102 of the electronic device 100 may include the first rear cover 180, a partial region of the first case 111 adjacent to the first rear cover 180, the second rear cover 190, and a partial region of the second case 112 adjacent to the second rear cover 190.

The main display 200 may imply a display having at least a partial area that can be transformed into a flat surface or a curved surface. In an embodiment, the main display 200 may include a folding region 203, a first display region 201 disposed at one side (left side of the folding region 203 shown in fig. 1) with respect to the folding region 203, and a second display region 202 disposed at the other side (right side of the folding region 203 shown in fig. 1).

The division of the regions of the main display 200 shown in fig. 1 is exemplary, and the main display 200 may be divided into a plurality of (e.g., four or more or two) regions according to structures or functions. For example, in the embodiment shown in fig. 1, the area of the main display 200 may be divided by the folding area 203 or a first axis (folding axis) extending parallel to the y-axis, but in another embodiment, the area of the main display 200 may be divided based on another folding area (e.g., a folding area parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis).

In an embodiment, the first display area 201 and the second display area 202 have shapes that are over-symmetrical to each other about the folding area 203. However, unlike the first display region 201, the second display region 202 may include the camera hole 150, but may have a symmetrical shape to the first display region 201 in other regions. In other words, the first display region 201 and the second display region 202 may include portions having shapes symmetrical to each other and portions having shapes asymmetrical to each other.

According to an embodiment, the camera aperture 150 may be visually exposed outside the electronic device 100. According to another embodiment, the camera aperture 150 may be disposed below the main display 200 and thus may not be visually exposed.

Hereinafter, the operations of the first and second housings 111 and 112 will be described according to the state of the electronic device 100 (e.g., the flat state 100A and the folded state 100B) and each region of the main display 200.

In an embodiment, when the electronic device 100 is in the flat state 100A (e.g., fig. 1), the first case 111 and the second case 112 may be disposed to face in the same direction when forming an angle of 180 degrees. The surface of the first display region 201 and the surface of the second display region 202 of the main display 200 may face the same direction (e.g., the direction in which the front surface of the electronic device faces) when forming an angle of 180 degrees with each other. The folding area 203 may form the same plane as the first display area 201 and the second display area 202.

In an embodiment, when the electronic device 100 is in the folded state 100B (e.g., fig. 2), the first case 111 and the second case 112 may be disposed to face each other. The surface of the first display region 201 and the surface of the second display region 202 of the main display 200 may face each other when forming a narrow angle (e.g., between 0 degrees and 10 degrees). At least a portion of the folding region 203 may be formed as a curved surface having a predetermined curvature.

In an embodiment, the first case 111 and the second case 112 may be disposed at a certain angle with respect to each other when the electronic device 100 is in the intermediate state. The surface of the first display region 201 and the surface of the second display region 202 of the main display 200 may form an angle that is larger than that in the folded state and smaller than that in the flat state. At least a portion of the folded region 203 may be formed as a curved surface having a predetermined curvature, and the curvature in this case may be smaller than that in the folded state.

Fig. 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 3, in an embodiment, the electronic device 100 may include a display unit 20, a bracket assembly 30, a substrate 400, a first case 111, a second case 112, a first rear cover 180, and a second rear cover 190. The display unit 20 may be referred to herein as a display module or a display assembly.

The display unit 20 may include a main display 200 and at least one board or layer (not shown) on which the main display 200 is disposed. In an embodiment, a board may be disposed between the main display 200 and the stand assembly 30. The main display 200 may be disposed on at least a portion of one surface of the board (e.g., the top surface with reference to fig. 3). The board may be formed in a shape corresponding to the main display 200.

The bracket assembly 30 may include: a bracket 310 including a first bracket 311 and a second bracket 312; a hinge structure 300 disposed between the first bracket 311 and the second bracket 312; a hinge cover 330 covering the hinge structure 300 when viewed from the outside; and a wiring member 343 (e.g., a Flexible Printed Circuit (FPC) or a Flexible Printed Circuit Board (FPCB)) that spans the first bracket 311 and the second bracket 312.

According to an embodiment, the bracket assembly 30 may be formed in the housing 110. For example, the first bracket 311 may be formed in the first case 111, and the second bracket 312 may be formed in the second case 112.

Referring to fig. 3, a hinge cover 330 may be disposed between the first and second cases 111 and 112, and may be configured to cover an internal part (e.g., the hinge structure 300). In an embodiment, the hinge cover 330 may be covered by a portion of each of the first and second cases 111 and 112 or exposed to the outside depending on the state of the electronic device 100 (the flat state 100A or the folded state 100B).

For example, as shown in fig. 2, when the electronic device 100 is in the flat state 100A, the hinge cover 330 may be covered by the first case 111 and the second case 112, and thus may not be exposed. For example, as shown in fig. 3, when the electronic device 100 is in the folded state 100B (e.g., a fully folded state), the hinge cover 330 may be exposed to the outside between the first case 111 and the second case 112. For example, in the case of an intermediate state in which the first case 111 and the second case 112 are folded at a certain angle, the hinge cover 330 may be partially exposed to the outside between the first case 111 and the second case 112. However, in this case, the exposed area may be smaller than in the fully folded state.

In an embodiment, the hinge cover 330 may include a curved surface.

In an embodiment, the stand assembly 30 may be disposed between the main display 200 and the baseboard 400. For example, the first stand 311 may be disposed between the first display region 201 of the main display 200 and the first substrate 401. The second stand 312 may be disposed between the second display region 202 of the main display 200 and the second substrate 402.

In an embodiment, the routing member 343 and the hinge structure 300 can be at least partially disposed in the bracket assembly 30. The wiring member 343 may be disposed in a direction (for example, x-axis direction) crossing the first bracket 311 and the second bracket 312. The wiring member 343 may be disposed in a direction (e.g., an x-axis direction) perpendicular to the folding region 203 of the folding axis (e.g., the y-axis or folding axis (first axis) in fig. 2) of the electronic device 100.

As described above, the substrate 400 may include a first substrate 401 disposed at one side of the first bracket 311 and a second substrate 402 disposed at one side of the second bracket 312. The first and second substrates 401 and 402 may be disposed in a space formed by the bracket assembly 30, the first case 111, the second case 112, the first rear cover 180, and the second rear cover 190. According to an embodiment, components for implementing various functions of the electronic device 100 may be mounted on the first substrate 401 and the second substrate 402.

According to an embodiment, the first substrate 401 may be formed of a plurality of substrates.

According to an embodiment, the first substrate 401 may be formed in a shape in which a plurality of substrates are separated. For example, the first substrate 401 may be formed while being separated into the first printed circuit board 403 and the second printed circuit board 404. The first and second cases 111 and 112 may be assembled to be coupled to both sides of the bracket assembly 30 while the display unit 20 is coupled to the bracket assembly 30. As will be described later, the first and second housings 111 and 112 may be coupled with the bracket assembly 30 by sliding from both sides of the bracket assembly 30.

In an embodiment, the first housing 111 may include a first rotation support surface 113, and the second housing 112 may include a second rotation support surface 114 corresponding to the first rotation support surface 113. Each of the first and second rotation support surfaces 113 and 114 may include a curved surface corresponding to a curved surface included in the hinge cover 330.

In an embodiment, when the electronic device 100 is in the flat state 100A (e.g., the electronic device in fig. 1), the first and second rotation support surfaces 113 and 114 may cover the hinge cover 330, and thus the hinge cover 330 may not be exposed to the rear surface of the electronic device 100 or may be minimally exposed to the rear surface of the electronic device 100. On the other hand, when the electronic device 100 is in the folded state 100B (e.g., the electronic device in fig. 2), the first and second rotation support surfaces 113 and 114 may rotate along the curved surface included in the hinge cover 330, and thus the hinge cover 330 may be maximally exposed to the rear surface of the electronic device 100.

According to an embodiment, the electronic device 100 may further include a first battery 451, a second battery 452, and a speaker module 453.

According to an embodiment, the first battery 451 and the second battery 452 may be installed in the case 110 of the electronic device 100, and may not be exposed to the outside. For example, the first battery 451 may be installed in the first housing 111. In addition, the second battery 452 may be installed in the second housing 112.

According to an embodiment, the first and second batteries 451 and 452 may be electrically connected to each other through a wiring member 343 (e.g., a flexible printed circuit board) disposed between the first and second housings 111 and 112.

According to an embodiment, the speaker module 453 may be disposed in the first housing 111. For example, the speaker module 453 may be disposed in a region adjacent to the first battery 451 inside the first case 111. According to an embodiment, the speaker module 453 may not be exposed outside the electronic device 100. According to an embodiment, the speaker module 453 may be mounted on the second printed circuit board 404 of the first substrate 401.

Fig. 4 illustrates a front surface of a metal plate of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 4, the electronic device 100 may include a hinge structure 300, and a bracket 310 and a metal plate 410 formed in a case 110. According to an embodiment, the electronic device 100 may further comprise a main display (200 in fig. 3).

According to an embodiment, the bracket 310 may include a first bracket 311 and a second bracket 312. In an example, the first bracket 311 may be formed in the first case 111, and the second bracket 312 may be formed in the second case 112.

According to an embodiment, the first bracket 311 and the second bracket 312 may be connected to each other by the hinge structure 300. For example, the hinge structure 300 may be disposed between the first bracket 311 and the second bracket 312 to physically connect the first bracket 311 to the second bracket 312.

According to an embodiment, the stand 310 may include a side 314 and a front 313 facing the front surface of the electronic device 100.

According to an embodiment, the metal plate 410 may be disposed on the front 313 of the bracket 310. For example, the metal plate 410 may be attached to a waterproof tape 550 which is provided on the front 313 of the bracket 310 and which will be described later. Further, according to an embodiment, the main display 200 may be disposed on the metal plate 410. In other words, according to an embodiment, the front 313 of the stand 310 may support the metal plate 410 and the main display 200.

According to an embodiment, the side 314 of the bracket 310 may be surrounded by the housing 110. For example, the side 314 of the first bracket 311 may be surrounded by the first housing 111, and the side 314 of the second bracket 312 may be surrounded by the second housing 112.

According to an embodiment, the housing 110 may be formed around a portion of the main display 200 disposed on the front 313 of the stand 310.

According to an embodiment, unlike a bar-type (bar-type) electronic device in which a case and a display are attached and fixed to each other, the case 110 of the electronic device 100 including the foldable main display 200 and the main display 200 may not be attached and fixed to each other. For example, the case 110 surrounding a portion of the main display 200 may surround the main display 200 while being spaced apart from a side surface of the main display 200 by a predetermined distance.

According to the embodiment, since the case 110 is formed to be spaced apart from the side surface of the main display 200 by a predetermined distance, the foldable main display 200 may not collide with the case 110 when folded. In other words, according to an embodiment, although the foldable main display 200 may slide toward the case 110 when folded, the main display 200 may not collide with the case 110.

According to an embodiment, since the main display 200 is not attached to the case 110, a shearing motion due to an external impact may occur in the main display 200.

According to an embodiment, the shearing motion may be reduced by the protrusion 420 of the metal plate 410, which will be described later, disposed under the main display 200.

According to an embodiment, a waterproof structure may be formed in the bracket 310. In an example, waterproof tape 550 may be attached to bracket 310 to form a waterproof structure.

For example, a first waterproof tape 551 may be attached to the interior of the first bracket 311, and a second waterproof tape 552 may be attached to the interior of the second bracket 312.

According to an embodiment, the first bracket 311 and the first metal plate 411 disposed on the front surface of the first bracket 311 may be in close contact with each other by the first waterproof tape 551, thereby forming a waterproof structure. Further, according to the embodiment, the second bracket 312 and the second metal plate 412 provided on the front surface of the second bracket 312 pass through the second waterproof tape 552, thereby forming a waterproof structure.

According to an embodiment, the first waterproof tape 551 of the first bracket 311 and the second waterproof tape 552 of the second bracket 312 may not be formed to be symmetrical to each other with respect to the first axis. For example, the first waterproof tape 551 and the second waterproof tape 552 may be differently disposed according to the positions of the components embedded in the first bracket 311 and the second bracket 312.

According to an embodiment, the metal plate 410 may be disposed on the rear surface of the main display 200. For example, the metal plate 410 may be disposed between the main display 200 and the stand 310.

According to an embodiment, the metal plate 410 may include a first metal plate 411 and a second metal plate 412.

According to an embodiment, the first metal plate 411 may be disposed on the rear surface of the first display region 201 of the main display 200. In other words, according to an embodiment, the first metal plate 411 may be disposed on the first case 111. For example, the first metal plate 411 may cover at least a portion of the first case 111.

According to an embodiment, the second metal plate 412 may be disposed on the rear surface of the second display area 202 of the main display 200. In other words, according to an embodiment, the second metal plate 412 may be disposed on the second case 112. For example, the second metal plate 412 may cover at least a portion of the second housing 112.

According to an embodiment, the first and second metal plates 411 and 412 may cover a portion of the hinge structure 300. For example, the first metal plate 411 may cover a portion of the hinge structure 300 adjacent to the first case 111 when viewed from the front surface 101 of the electronic device 100, and the second metal plate 412 may cover a portion of the hinge structure 300 adjacent to the second case 112.

According to an embodiment, the metal plate 410 may include a plurality of outer circumferences 440. For example, the first metal plate 411 may include a first outer periphery 441, and the second metal plate 412 may include a second outer periphery 442.

According to an embodiment, the first outer periphery 441 of the first metal plate 411 and the second outer periphery 442 of the second metal plate 412 may correspond to outer peripheries adjacent to the first axis.

According to an embodiment, the first and second outer circumferences 441 and 442 may correspond to outer circumferences extending in a direction (e.g., a +y direction or a-y direction) toward the first axis of the electronic device 100.

According to an embodiment, the first and second outer circumferences 441 and 442 may correspond to outer circumferences facing each other when the electronic device 100 is in the flat state 100A. According to an embodiment, the first axis may be formed between the first outer circumference 441 and the second outer circumference 442.

According to an embodiment, the metal plate 410 may include at least one protrusion 420 and at least one recess 430. According to an embodiment, the at least one protrusion 420 and the at least one recess 430 may be formed in the first outer circumference 441 of the first metal plate 411 or the second outer circumference 442 of the second metal plate 412.

For example, the first concave portion 431 and the first convex portion 421 may be formed in the first outer periphery 441 of the first metal plate 411, and the second concave portion 432 and the second convex portion 422 may be formed in the second outer periphery 442 of the second metal plate 412.

According to an embodiment, the first protruding portion 421 of the first metal plate 411 may be formed to extend from the first outer periphery 441 of the first metal plate 411. In an example, the first protruding portion 421 may be formed to extend from a region of the first outer circumference 441 of the first metal plate 411. For example, the first protruding portion 421 may be formed in a region of the first metal plate 411 adjacent to the first end of the first outer circumference 441.

In other words, according to the embodiment, the first protruding portion 421 may be formed in a region of the first outer circumference 441 adjacent to the third outer circumference 443.

According to an embodiment, the first protrusion 421 may protrude in a second direction (e.g., a +x direction) perpendicular to the first axis. For example, in the flat state 100A, the first protruding portion 421 may protrude and extend toward the second metal plate 412 in the second direction (e.g., the +x direction).

According to an embodiment, the second convex portion 422 of the second metal plate 412 may be formed to extend from the second outer periphery 442 of the second metal plate 412. For example, the second protrusion 422 may protrude in a third direction (e.g., -x direction) opposite to the second direction (e.g., +x direction). For example, in the flat state 100A, the second convex portion 422 may protrude and extend toward the first metal plate 411 in a third direction (e.g., -x direction).

According to an embodiment, the first recess 431 of the first metal plate 411 may be recessed from the first outer periphery 441. In an example, the first recess 431 may be formed to be recessed in a region of the first outer circumference 441 adjacent to the second end of the first outer circumference 441. In other words, for example, the first recess 431 may be formed to be recessed in a region of the first outer circumference 441 adjacent to the fourth outer circumference 444.

According to an embodiment, the first recess 431 may be formed to be recessed in a third direction (e.g., -x direction).

According to an embodiment, the second recess 432 of the second metal plate 412 may be recessed from the second outer periphery 442. In an example, the second recess 432 may be formed to be recessed in a region of the second metal plate 412 adjacent to the first end of the second outer periphery 442. In other words, for example, the second concave portion 432 may be formed to be formed in a region of the second outer periphery 442 adjacent to the fifth outer periphery 445.

According to an embodiment, the second recess 432 may be recessed in the second direction (e.g., the +x direction). In other words, according to the embodiment, in the first state 100A in which the electronic device 100 is unfolded, the first recess 431 may be recessed in a direction opposite to the direction of the second metal plate 412, and the second recess 432 may be recessed in a direction opposite to the direction of the first metal plate 411.

Referring to fig. 4, the first protrusion 421 according to the embodiment may be formed to be spaced apart from the first recess 431, and the second protrusion 422 may be formed to be spaced apart from the second recess 432.

For example, the first protruding portion 421 may be formed in a region of the first outer circumference 441 adjacent to the third outer circumference 443 of the first metal plate 411, and the first recessed portion 431 may be formed in a region of the first outer circumference 441 adjacent to the fourth outer circumference 444 of the first metal plate 411.

Further, for example, the second convex portion 422 may be formed in a region of the second outer periphery 442 adjacent to the sixth outer periphery 446 of the second metal plate 412, and the second concave portion 432 may be formed in a region of the second outer periphery 442 adjacent to the fifth outer periphery 445 of the second metal plate 412.

According to an embodiment, the third outer periphery 443 of the first metal plate 411 and the fifth outer periphery 445 of the second metal plate 412 may correspond to top outer peripheries of the electronic apparatus 100. Further, according to an embodiment, the fourth outer periphery 444 of the first metal plate 411 and the sixth outer periphery 446 of the second metal plate 412 may correspond to the bottom outer periphery of the electronic device 100.

According to an embodiment, when the electronic device 100 is in the flat state 100A, the first protrusion 421 may be recessed into the second recess 432, and the second protrusion 422 may be recessed into the first recess 431.

According to an embodiment, the first recess 431 and the second recess 432 may form a space capable of receiving the second protrusion 422 and the first protrusion 421.

According to an embodiment, when the second protrusion 422 and the first protrusion 421 are inserted into the space, the first metal plate 411 and the second metal plate 412 may be coupled to each other when the electronic device 100 is in the flat state 100A.

According to the embodiment, the first and second metal plates 411 and 412 may be coupled to each other by receiving the convex portions 420 in the corresponding concave portions 430, whereby a shearing motion or torsion of the metal plates 410 in the first axis direction (e.g., +y direction or-y direction) due to an external impact may be reduced as compared to a case where the metal plates 410 are not formed or a case where the first and second metal plates 411 and 412 are not coupled to each other.

According to the embodiment, since the shearing movement or torsion of the metal plate 410 is reduced, the shearing movement or torsion of the main display 200 disposed on the metal plate 410 in the first axis direction can also be reduced.

According to the embodiment, since the shearing motion or torsion of the main display 200 is reduced, the main display 200 can be prevented from being damaged by external impact. Accordingly, the electronic device 100 can ensure durability.

Specific embodiments related to the convex portion 420 and the concave portion 430 of the metal plate 410 will be described later with reference to fig. 5a to 5c and fig. 6.

Fig. 5a is a cross-sectional view of an electronic device, taken along line A-A', in accordance with an embodiment of the present disclosure.

According to an embodiment, the electronic device 100 may include a main display 200, a metal plate 410, a stand 310, and/or a hinge structure 300. According to an embodiment, the electronic device 100 may further include a waterproof tape 550.

According to an embodiment, the main display 200 (or main display structure) may comprise a plurality of layers. According to an embodiment, the main display 200 may include a cover glass 510, a display panel 520 disposed adjacent to one surface of the cover glass 510, and/or a dielectric layer structure 530 located under the display panel 520.

However, according to the embodiment, the main display 200 is not limited to the above-mentioned structure. For example, some elements (e.g., thermoplastic material 540) may be omitted, and other elements may be added.

According to an embodiment, the main display 200 may further include an adhesive for bonding the above-mentioned plurality of layers. According to an embodiment, the adhesive may include a Pressure Sensitive Adhesive (PSA), but is not limited thereto. For example, the adhesive may include an Optically Clear Adhesive (OCA), a heat reactive adhesive, and/or a double-sided tape in addition to the PSA.

According to an embodiment, the cover glass 510 may include a film layer 511 and/or a transparent plate 512. In an embodiment, at least a portion of the film layer 511 may be exposed to the outside through the front surface 101 of the electronic device 100. The transparent plate 512 may correspond to ultra-thin tempered glass, but is not limited thereto.

According to an embodiment, the film layer 511 and the transparent plate 512 may be bonded to each other by an adhesive. According to an embodiment, the film layer 511 and the transparent plate 512 are flexible and thus may be folded or bent. For example, the film layer 511 may be referred to as a polarizing film, but is not limited thereto.

According to an embodiment, the main display 200 may include a display panel 520 disposed under the cover glass 510. According to an embodiment, the display panel 520 may be attached to the cover glass 510 by the first adhesive layer 561.

According to an embodiment, the display panel 520 may include a panel 521 and/or a plastic film 522 disposed under the panel 521. According to an embodiment, the panel 521 may be attached to the transparent plate 512 by an adhesive (e.g., PSA).

According to an embodiment, the plastic film 522 may be referred to as a polarizing film.

According to an embodiment, the panel 521 may be implemented as a touch panel in which electrodes for receiving touch input, fingerprint recognition, or pen input are provided. According to an embodiment, the panel 521 may include an Organic Light Emitting Diode (OLED) panel, a Liquid Crystal Display (LCD), or a quantum dot light emitting diode (QLED) panel. For example, the display panel 520 may include a plurality of pixels for displaying an image, and one pixel may include a plurality of sub-pixels. For example, one pixel may include three color sub-pixels, i.e., a red sub-pixel, a green sub-pixel, and a blue sub-pixel. In another example, one pixel may be formed in an RGBG PenTile type including one red sub-pixel, two green sub-pixels, and one blue sub-pixel.

According to an embodiment, the main display 200 may include a dielectric layer structure 530 disposed under the display panel 520. According to an embodiment, the dielectric layer structure 530 may be attached to the display panel 520 by a second adhesive layer 562 (e.g., PSA). According to an embodiment, an adhesive layer may be formed in a region corresponding to the dielectric layer structure 530. According to another embodiment, the adhesive layer 562 may be disposed to be formed in a region inside an edge of the dielectric layer structure 530.

According to an embodiment, at least a portion of the dielectric layer structure 530 may include a lattice pattern. For example, the dielectric layer structure 530 may include a lattice pattern formed in a region adjacent to the first axis. According to an embodiment, the dielectric layer structure 530 includes a lattice pattern, so that when the electronic device 100 is folded (e.g., the second state 100B) or unfolded (e.g., the first state 100A), the dielectric layer structure 530 and the layers attached to the dielectric layer structure 530 (e.g., the cover glass 510 and/or the metal plate 410) may also be folded or unfolded.

According to an embodiment, the dielectric layer structure 530 may include a lightweight material and a material for ensuring hardness. According to an embodiment, the dielectric layer structure 530 may have a structure in which a layer for ensuring hardness and a layer formed of a lightweight material are stacked. According to an embodiment, the main display 200 may secure rigidity due to the above-described materials included in the dielectric layer structure 530. According to an embodiment, since at least a portion of the dielectric layer structure 530 is formed of a lightweight material, the weight of the main display 200 may be reduced.

According to an embodiment, the main display 200 may further comprise a thermoplastic material 540 (e.g., thermoplastic Polyurethane (TPU)) disposed under the dielectric layer structure 530. According to an embodiment, the main display 200 may further include a thermoplastic material 540, thereby preventing damage to the display panel 520, the dielectric layer structure 530, and the metal plate 410. For example, the main display 200 may further include a thermoplastic material 540, thereby preventing bubbles from being generated between the layers disposed in the main display 200.

According to an embodiment, the metal plate 410 may be disposed under the main display 200. For example, the metal plate 410 may be disposed under the dielectric layer structure 530 and/or the thermoplastic material 540 of the main display 200.

According to an embodiment, the metal plate 410 may be formed to be cut in a region corresponding to the first axis. For example, the first metal plate 411 and the second metal plate 412 may be provided separately with respect to the first axis. According to an embodiment, the first and second metal plates 411 and 412 may be provided to be cut off with respect to the first axis, and thus the metal plate 410 may be folded or unfolded according to each state when the electronic device 100 is folded or unfolded.

According to another embodiment, a portion of the metal plate 410 may include flexibility and thus may be formed across the fold axis. For example, regarding flexibility, a region of the metal plate 410 corresponding to the first axis may be formed to be flexible, while the remaining region may be formed of a metal member.

According to an embodiment, the metal plate 410 may be referred to as a shielding layer. The metal plate 410 according to the embodiment may reduce noise by shielding magnetic force generated due to surrounding electronic parts in addition to signals input from the electronic pen.

According to an embodiment, the metal plate 410 may be formed of a metal member. For example, the metal plate 410 may be formed of a copper alloy, but is not limited thereto. For example, the metal plate 410 may be formed of stainless steel (SUS).

Referring to fig. 4 and 5a, the first metal plate 411 according to an embodiment may include a first protrusion 421. According to an embodiment, the first protruding portion 421 of the first metal plate 411 may be formed, and thus, when viewed on a first plane (e.g., xz plane), a first length L1 of the first metal plate 411 in a second axis (e.g., x axis) direction may be formed to be longer than a second length L2 of the second metal plate 412 in the second axis direction.

Referring to fig. 5a, according to an embodiment, the first protrusion 421 may be formed. The first metal plate 411 may be formed to protrude in a second direction (e.g., +x direction) with respect to the first axis when viewed on a first plane (e.g., xz plane). Further, according to the embodiment, the second metal plate 412 has a second concave portion (432 in fig. 4) for receiving the first convex portion 421. The second metal plates 412 may be formed to be spaced apart in a second direction (e.g., a +x direction) and can be formed to be spaced apart when viewed from a first plane (e.g., an xz plane).

The length of the second metal plate 412 to the first metal plate 411 has been described with respect to only the first protruding portion 421, but the present disclosure is not limited thereto.

For example, when the second convex portion 422 of the second metal plate 412 is formed, the second length L2 of the second metal plate 412 may be formed longer than the first length L1 of the first metal plate 411. Further, according to the embodiment, the second convex portions 422 of the second metal plate 412 are formed, and thus the first metal plate 411 may be formed to be spaced apart in a third direction (e.g., -x direction) with respect to the first axis.

According to an embodiment, the convex portion 420 and the concave portion 430 are formed on the metal plate 410, and thus the first metal plate 411 and the second metal plate 412 may be coupled to each other when the electronic device 100 is in the flat state 100A (first state).

In other words, according to an embodiment, when the electronic device 100 is in the flat state 100A (first state), each of the protrusions 420 may be inserted into the corresponding recess 430, and thus the first and second metal plates 411 and 412 may be coupled to each other and fixed in the first axis direction (e.g., the +y direction or the-y direction).

According to an embodiment, the first and second metal plates 411 and 412 may be coupled to each other, and thus, a shearing motion or torsion of the metal plate 410 in the first axis direction (e.g., the +y direction or the-y direction) due to an external impact may be reduced.

According to the embodiment, since the shearing movement or torsion of the metal plate 410 is reduced, the shearing movement or torsion of the main display 200 disposed on the metal plate 410 in the first axis direction (e.g., the +y direction or the-y direction) can also be reduced. Accordingly, durability of the main display 200 can be improved.

Therefore, according to the embodiment, the durability of the main display 200 is improved by the structure of the metal plate 410, and thus, in the main display 200, a cover panel may be omitted or a thin cover panel may be included. Since the cover panel may be omitted or a thin cover panel may be included, the production cost and the production cycle of the electronic device 100 may be saved.

Further, according to the embodiment, creases in the folded portion of the main display 200 may be reduced due to the thin cover panel, and thus the visibility of the main display 200 of the electronic device 100 may be improved.

According to an embodiment, the bracket 310 may be disposed under the metal plate 410. For example, the first bracket 311 may be disposed under the first metal plate 411, and the second bracket 312 may be disposed under the second metal plate 412.

According to an embodiment, the stand 310 may be disposed under the cover glass 510 or the display panel 520 and extend to a side surface thereof. For example, the stand 310 may be formed to surround a portion of a side surface of the cover glass 510 or the display panel 520.

According to an embodiment, the stand 310 may extend to be spaced apart from the side surface of the cover glass 510 or the display panel 520 by a predetermined gap. In other words, the stand 310 may be formed to be spaced apart from the side surface of the main display 200 by a predetermined gap.

According to the embodiment, since the stand 310 forms a predetermined gap with the side surface of the cover glass 510 or the display panel 520, it is possible to prevent collision between the side surface of the main display 200 and the stand 310 when the electronic device 100 is folded. In other words, when the electronic device 100 is folded, the main display 200 may be slid laterally, and may not collide with the stand 310 even when the main display 200 is slid.

According to the embodiment, a description has been made of an example in which the stand 310 is formed on the side surface of the main display 200, but the description is not limited thereto. For example, the case 110 may be formed on a side surface of the main display 200 with a predetermined gap.

In an embodiment, another element may be added between the bracket 310 and the metal plate 410. For example, a waterproof tape 550 may be further added between the bracket 310 and the metal plate 410.

According to an embodiment, the bracket 310 may be disposed in two directions around the hinge structure 300. For example, the first bracket 311 may be disposed in a third direction (e.g., -x direction) with respect to the hinge structure 300, and the second bracket 312 may be disposed in a second direction (e.g., + x direction) with respect to the hinge structure 300.

According to an embodiment, the metal plate 410 may be attached to the bracket 310 by an adhesive portion. According to an embodiment, the adhesive portion may correspond to a waterproof member (hereinafter, "waterproof tape 550"), but is not limited thereto. For example, the adhesive portion may correspond to a waterproof adhesive (bond).

According to an embodiment, a waterproof tape 550 may be disposed between the metal plate 410 and the bracket 310. For example, the first waterproof tape 551 may be disposed between the first metal plate 411 and the first bracket 311, and the second waterproof tape 552 may be disposed between the second metal plate 412 and the second bracket 312. In other words, the first waterproof tape 551 may be disposed under the first metal plate 411, and the second waterproof tape 552 may be disposed under the second metal plate 412.

According to an embodiment, the waterproof tape 550 may be disposed in a first region adjacent to the first axis and in a second region spaced apart from the first region and adjacent to the ends of the bracket 310 and the metal plate 410. In other words, according to an embodiment, a portion of the waterproof tape 550 may be disposed adjacent to the hinge structure 300, and another portion of the waterproof tape 550 may be disposed to be spaced apart from the hinge structure 300.

For example, a first waterproof tape 551 disposed under the first metal plate 411 may be disposed in a first region adjacent to the first axis and in a second region spaced apart from the first region and adjacent to an end of the first metal plate 411. Further, for example, the second waterproof tape 552 disposed under the second metal plate 412 may be disposed in a first region adjacent to the first axis and in a second region spaced apart from the first region and adjacent to an end of the second metal plate 412.

According to an embodiment, since the waterproof tape 550 is provided, the waterproof tape 550 may perform a waterproof function of the electronic device 100, and may fix the main display 200 and/or the metal plate 410 to the stand 310.

According to an embodiment, since the waterproof tape 550 is also formed in the first region adjacent to the first axis, a greater shearing motion of the main display 200 may occur than when the waterproof tape 550 is formed only in the second region spaced apart from the first axis.

Further, according to the embodiment, when the first casing 111 and the second casing 112 may be separately formed under the main display 200, a larger shearing motion of the main display 200 may occur than when the first casing 111 and the second casing 112 are formed as a single casing.

According to an embodiment, an increase in the shearing motion of the main display 200 due to the separate case 110 and the waterproof tape 550 may be reduced by forming the convex part 420 and the concave part 430 on the metal plate 410.

In other words, the first and second metal plates 411 and 412 may be coupled to each other by inserting each protrusion 420 into the corresponding recess 430, whereby a shearing motion or torsion of the metal plate 410 in the first axis direction (e.g., the +y direction or the-y direction) due to an external impact may be reduced.

According to an embodiment, since the shearing movement or torsion of the metal plate 410 in the first axis direction is reduced, the shearing movement or torsion of the main display 200 may be reduced.

According to an embodiment, the hinge structure 300 may be disposed in a region corresponding to the first axis. In other words, according to an embodiment, the hinge structure 300 may be provided at the folded portion. According to an embodiment, the first axis may mean a central axis of the hinge structure 300, but is not limited thereto. For example, the first axis may be an axis partially spaced from the center of the hinge structure 300 in the second direction (e.g., + x direction) or the third direction (e.g., -x direction).

According to an embodiment, since the first axis corresponds to an axis of one region of the hinge structure 300, the electronic device 100 may be folded or unfolded about the first axis by the hinge structure 300. In other words, the second housing 112 may rotate about the first axis with respect to the first housing 111 of the electronic device 100 through the hinge structure 300.

Specific embodiments of the hinge structure 300 will be described later with reference to fig. 8, 9a, 9b and 10 to 13.

Fig. 5B is a cross-sectional view of the electronic device of fig. 4, taken along line B-B', in accordance with an embodiment of the present disclosure.

According to an embodiment, unlike the electronic device 100 of fig. 5a having a cross section A-A', the electronic device 100 of fig. 5b may further comprise a lower material 570.

According to an embodiment, the section B-B' in fig. 5B corresponds to the central area through which the wiring member (343 in fig. 3) of the hinge structure 300 passes. Thus, unlike the metal plate 410 in section A-A' in fig. 5a, the metal plate 410 in fig. 5b may not include the convex portion 420 and the concave portion 430.

According to an embodiment, the waterproof tape 550 and the lower material 570 may be further disposed between the metal plate 410 and the bracket 310. For example, the waterproof tape 550 may be disposed in a first region adjacent to the first axis and in a second region spaced apart from the first region and adjacent to the ends of the bracket 310 and the metal plate 410.

Further, according to an embodiment, the lower material 570 may be disposed in a region closer to the first axis than the first region.

According to an embodiment, the lower material 570 may be disposed under the metal plate 410. According to an embodiment, the lower material 570 may include a first lower material 571 and a second lower material 572, the first lower material 571 may be disposed under the first metal plate 411, and the second lower material 572 may be disposed under the second metal plate 412.

According to an embodiment, the first lower material 571 may correspond to a shielding sheet, and the shielding sheet may be formed in a partial region under the metal plate 410 corresponding to the hinge structure 300.

According to an embodiment, the lower material 570 has been described as being able to correspond to a shielding sheet, but is not limited thereto. For example, the lower material 570 may correspond to graphite or a mat (cushion).

Fig. 5C is a cross-sectional view of the electronic device of fig. 4 along line C-C' in accordance with an embodiment of the present disclosure.

According to an embodiment, the protrusion 420 on the metal plate 410 in fig. 5c may be formed in a direction opposite to the direction of the protrusion 420 on the metal plate 410 in fig. 5 a. For example, the convex portion 420 of the second metal plate 412 in fig. 5c may be formed along a third direction (e.g., -x direction).

According to an embodiment, unlike the electronic device 100 of fig. 5B having the cross section B-B', the electronic device 100 of fig. 5c may comprise only one first lower material 571.

According to an embodiment, the lower material 570 and the waterproof tape 550 may be formed under the first metal plate 411, but under the second metal plate 412, the lower material 570 may be omitted and only the waterproof tape 550 may be formed. For example, the first lower material 571 and the first waterproof tape 551 may be disposed under the first metal plate 411, and the second waterproof tape 552 may be disposed under the second metal plate 412.

According to an embodiment, since the first lower material 571 is disposed under the first metal plate 411, the first waterproof tape 551 on the section C-C' may be formed as one line. According to an embodiment, since the lower material 570 is omitted under the second metal plate 412, the second waterproof tape 552 may be formed as one or more lines.

According to an embodiment, the first waterproof tape 551 disposed under the first metal plate 411 may be formed thicker than the second waterproof tape 552 disposed under the second metal plate 412. According to the embodiment, since the first waterproof tape 551 is formed thicker than the second waterproof tape 552, although the first waterproof tape 551 of one line is formed under the first metal plate 411, the first metal plate 411 may be fixed on the first bracket 311 with substantially the same adhesive force as the second metal plate 412.

According to an embodiment, the lower material 570 in fig. 5c may be substantially the same as the lower material 570 in fig. 5 b.

Referring to fig. 5a, 5b and 5c, the cover panel, damping layer and/or digitizer are not shown, but the electronic device 100 may also include a cover panel, damping layer and/or digitizer.

Embodiments including a cover plate, a damping layer, and/or a digitizer will be described in detail later with reference to fig. 6.

Fig. 6 is a cross-sectional view of the electronic device of fig. 4 along line A-A' in accordance with an embodiment of the present disclosure.

Referring to fig. 6, the main display 200 in fig. 6 may correspond to the main display 200 in fig. 5a to 5c further including a damping layer 630, a cover panel 610, and/or a digitizer 620 added to the main display 200.

According to an embodiment, the damping layer 630 may be formed under the cover glass 510. In an example, the damping layer 630 may be disposed between the cover glass 510 and the display panel 520. According to an embodiment, the damping layer 630 may be attached to the cover glass 510 through the first adhesive layer 561, and may be attached to the panel 521 of the display panel 520 through the second adhesive layer 651 (PSA 2).

According to an embodiment, the cover panel 610 may be disposed under the display panel 520. According to an embodiment, the cover panel 610 may be attached to the dielectric layer structure 530 by an adhesive (e.g., PSA).

According to an embodiment, the cover panel 610 may be disposed above the first axis. For example, the cover panel 610 may be formed in a region corresponding to the dielectric layer structure 530, but is not limited thereto. For example, the cover panel 610 may be disposed to be formed in a region inside the outer circumference of the dielectric layer structure 530.

According to an embodiment, one region of the cover panel 610 corresponding to the first axis may be formed to have a smaller thickness than another region of the cover panel 610 spaced apart from the first axis in one direction (e.g., the z-direction). According to an embodiment, one region of the cover panel 610 corresponding to the first axis is formed thin, and thus the main display 200 may be folded or unfolded.

The cover panel 610 may increase the rigidity of the main display 200. For example, when a shear motion or torsion occurs at the bottom of the main display 200, the cover panel 610 may prevent the shear motion or torsion at the bottom from propagating to the display panel 520. According to the embodiment, the shearing movement or torsion of the display panel 520 is prevented, and thus the rigidity of the main display 200 can be improved.

According to an embodiment, the electronic device 100 in fig. 6 may include a cover panel 610 of reduced thickness compared to an electronic device that does not include the protrusions 420 and the recesses 430.

For example, referring to fig. 4 and 5a to 5c, the first and second metal plates 411 and 412 may be coupled to each other by the convex and concave portions 420 and 430 in the first state 100A, and thus a shearing motion or torsion of the metal plate 410 in the first axis direction (e.g., the +y direction or the-y direction) due to an external impact may be reduced.

According to an embodiment, the shearing motion or torsion is reduced due to the metal plate 410 having the convex portion 420 and the concave portion 430, and thus the electronic device 100 may further include the cover panel 610 having a reduced thickness as compared to an electronic device not including the convex portion 420 and the concave portion 430.

According to an embodiment, due to the reduction in thickness of the cover panel 610, costs and time for producing the electronic device 100 may be saved, and the electronic device 100 may include the main display 200 having improved creases.

According to an embodiment, unlike the thermoplastic material 540 in fig. 5a, the thermoplastic material 540 in fig. 6 may be formed under a partial region of the dielectric layer structure 530 corresponding to the first axis. In an example, the thermoplastic material 540 may be disposed under the lattice pattern of the dielectric layer structure 530.

According to an embodiment, the digitizer 620 may be disposed under the dielectric layer structure 530 or the thermoplastic material 540. For example, the digitizer 620 can be attached to the dielectric layer structure 530 through a third adhesive layer 652.

According to an embodiment, one region of the digitizer 620 corresponding to the first axis may be cut away. For example, a first region of the digitizer 620 may be disposed on the first metal plate 411, and a second region of the digitizer 620 may be disposed on the second metal plate 412.

According to an embodiment, since the digitizer 620 is formed to be separated in a region corresponding to the first axis, the digitizer 620 can be folded or unfolded without damage when the electronic device 100 is folded or unfolded.

According to an embodiment, digitizer 620 is a device capable of sensing input in an x-position and/or a y-position, and may detect a magnetic field type input device (e.g., an electronic pen). For example, at least one processor (e.g., processor 1720 in fig. 17) can provide current to digitizer 620, and digitizer 620 can generate a magnetic field. When the electronic pen approaches the electromagnetic field of digitizer 620, electromagnetic induction phenomena may occur and the resonant circuit of the electronic pen may generate a current. The resonant circuit of the electronic pen may use the generated current to form a magnetic field. The at least one processor can detect the position by scanning the strength of a magnetic field applied from the electronic pen to the digitizer 620 throughout the entire area. The at least one processor may perform operations based on the detected position.

According to an embodiment, a shielding sheet 640 (e.g., a copper sheet (Cu sheet)) may be formed under the digitizer 620. According to an embodiment, the shielding sheet 640 may be formed in an area corresponding to the digitizer 620. For example, since the digitizer 620 is formed to be separated in a region corresponding to the first axis, the shielding sheet 640 may be formed to be separated in a region corresponding to the first axis.

According to an embodiment, the shielding sheet 640 may be attached to the metal plate 410 through the fourth adhesive layer 653.

According to an embodiment, the metal plate 410 in fig. 6 may be substantially the same as the metal plate 410 in fig. 4 and 5a to 5 c.

Fig. 7 illustrates a front surface of a metal plate of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 7, the electronic device 100 in fig. 7 may correspond to the electronic device 100 in which the waterproof tape 550 in fig. 5a to 5c or fig. 6 is omitted.

According to an embodiment, the dielectric layer structure 530 may be attached to the support 310 by a fourth adhesive layer 720. According to an embodiment, a fourth adhesive layer 720 may be disposed on the outer circumference of the dielectric layer structure 530 and the support 310. For example, the fourth adhesive layer 720 may be disposed on the bracket 310 in an area spaced apart from the first axis.

According to an embodiment, since the fourth adhesive layer 720 is disposed to be spaced apart from the first axis, a space may be formed between the dielectric layer structure 530, the bracket 310, and the hinge structure 300. In other words, according to an embodiment, since the fourth adhesive layer 720 is disposed to be spaced apart from the first axis, the thermoplastic material 740, the metal plate 710, and the pad member 730 may be disposed in a space surrounded by the fourth adhesive layer 720, the dielectric layer structure 530, the bracket 310, and the hinge structure 300.

According to an embodiment, the thermoplastic material 740, the metal plate 410, and/or the pad member 730 may be disposed in the space.

According to an embodiment, the thermoplastic material 740 may be disposed under the dielectric layer structure 530. According to an embodiment, the metal plate 710 may be disposed under the thermoplastic material 740.

According to an embodiment, the metal plate 710 in fig. 7 may correspond to substantially the same plate as the metal plate 410 in fig. 4. That is, the description of the metal plate 410 in fig. 4 may be applied to the metal plate 710 in fig. 7.

According to an embodiment, the thermoplastic material 740 and the metal plate 710 in fig. 7 may correspond to substantially the same thermoplastic material and metal plate as the thermoplastic material 540 and the metal plate 410 in fig. 4, 5a to 5c and 6 mentioned above.

For example, the metal plate 710 in fig. 7 may include convex and concave portions, and thus the metal plate 710 and the main display 200 may be prevented from shearing movement or torsion in the first axis direction (e.g., +y direction or-y direction) due to external impact.

According to an embodiment, the pad member 730 may be disposed under the metal plate 710. For example, each pad member 730 may be disposed between the metal plate 710 and the hinge structure 300 and between the metal plate 710 and the bracket 310.

According to an embodiment, the pad member 730 may be formed to be cut out in a region corresponding to the first axis. According to an embodiment, since the pad member 730 is formed to be cut out in a region corresponding to the first axis, the pad member 730 may be folded or unfolded around the first axis.

According to the embodiment, since the pad member 730 is disposed under the metal plate 710, the electronic device 100 can prevent the metal plate 710 from colliding with the hinge structure 300 when the electronic device 100 is folded or unfolded.

According to an embodiment, the cover glass 510 may further include a polarizing plate 750. For example, the polarizing plate 750 may be disposed between the transparent plate 512 and the panel 525. According to an embodiment, the polarizing plate 750 may be attached to the transparent plate 512 by an adhesive layer (e.g., PSA 1).

Fig. 8 illustrates a front surface of a hinge plate of an electronic device according to an embodiment of the present disclosure.

According to an embodiment, the electronic device 100 may include a housing 110 forming an exterior of the electronic device 100, a bracket 310 disposed in the housing 110 and having a plurality of electronic components disposed therein, and a hinge structure 300 for rotating the housing 110 of the electronic device 100.

According to an embodiment, the hinge structure 300 may be disposed in a region corresponding to the first axis (e.g., the folding axis). For example, the central axis of the hinge structure 300 may correspond to the first axis, but is not limited thereto. For example, the hinge structure 300 may be folded or unfolded about a first axis. Accordingly, the electronic device 100 may switch between the folded state 100B and the flat state 100A.

According to an embodiment, the hinge structure 300 may be connected to the first and second housings 111 and 112. For example, the hinge structure 300 may connect the first housing 111 to the second housing 112 such that the second housing 112 is rotatable about the first axis relative to the first housing 111.

According to an embodiment, the hinge structure 300 may be connected to a first bracket 311 fixed in the first housing 111 and a second bracket 312 fixed in the second housing 112. For example, the hinge structure 300 may be connected to the first bracket 311 in the first housing 111 and the second bracket 312 in the second housing 112, so the hinge structure 300 may enable the second bracket 312 to rotate about the first axis relative to the first bracket 311.

According to an embodiment, the bracket 310 including the first bracket 311 and the second bracket 312 may be disposed at both sides with respect to the hinge structure 300 in the housing 110. For example, the first bracket 311 may be disposed in a third direction (e.g., -x direction) with respect to the hinge structure 300, and the second bracket 312 may be disposed in a second direction (e.g., + x direction). According to an embodiment, the first battery 451 and/or the speaker module 453 may be disposed in the first bracket 311, and the second battery 452 may be disposed in the second bracket 312.

According to an embodiment, the bracket 310 may be physically connected to the hinge structure 300 mentioned above. Thus, according to an embodiment, the bracket 310 may be rotated about the first axis by the hinge structure 300. For example, via the hinge structure 300, the second bracket 312 may rotate about the first axis relative to the first bracket 311.

Fig. 9a shows a hinge structure of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 9a, the hinge structure 300 of the electronic device 100 may include a hinge module 920 connected to each of the first and second cases 111 and 112, at least one hinge gear 910 rotated such that the electronic device 100 can be folded or unfolded, a hinge plate 960 at least partially covering the hinge module 920 and the hinge gear 910, a hinge cover 330 supporting at least one element of the hinge structure 300, and/or a set screw 990 for coupling the hinge gear 910 and the hinge module 920 to the hinge cover 330.

According to an embodiment, the hinge cover 330 may support the hinge module 920 and the hinge gear 910. For example, at least a portion of the hinge module 920 and at least a portion of the hinge gear 910 may be disposed on the hinge cover 330, and the hinge cover 330 may support the hinge module 920 and the hinge gear 910.

According to an embodiment, one surface of the hinge cover 330 may be exposed to the outside when the electronic device 100 is in the second state 100B. For example, when the second housing 112 is folded with respect to the first housing 111, one surface of the hinge cover 330 may be exposed to the outside between the first housing 111 and the second housing 112.

According to an embodiment, at least a portion of the hinge cover 330 may be formed of a conductive member. For example, the hinge cover 330 may be formed of a metal member (stainless steel). However, the present disclosure is not limited thereto, and a portion of the hinge cover 330 may include a non-conductive member.

According to an embodiment, the at least one hinge gear 910 may correspond to an element for determining an angle at which the electronic device 100 is folded or unfolded.

According to an embodiment, at least one hinge gear 910 may be disposed in a region corresponding to the first axis. According to an embodiment, the electronic device 100 may be switched to the folded state 100B and the flat state 100A by rotation of the hinge gear 910.

According to an embodiment, the at least one hinge gear 910 may be formed to be vertically symmetrical to each other with respect to the second axis. For example, the first hinge gear 911 may be disposed along an upper end direction (e.g., a +y direction) of the electronic device 100 from a second axis of the electronic device 100. For example, the first hinge gear 911 may be disposed in a region adjacent to the camera hole (150 in fig. 1) on the first axis.

In another example, the second hinge gear 912 may be disposed along a lower end direction (e.g., -y direction) of the electronic device 100 from a second axis of the electronic device 100. For example, the second hinge gear 912 may be disposed in an area adjacent to a USB hole (e.g., USB hole 151 in fig. 1) on the first axis.

According to an embodiment, the first hinge gear 911 and the second hinge gear 912 may be fixed to the hinge cover 330 by a set screw 990.

According to an embodiment, the hinge plate 960 may correspond to a plate disposed on surfaces of the hinge gear 910, the hinge module 920, and the hinge cover 330. For example, a portion of hinge plate 960 may be disposed on hinge gear 910. In addition, a portion of the hinge plate 960 may be disposed on substantially the same plane (e.g., xy plane) as the hinge gear 910, but is not limited thereto. For example, a portion of hinge plate 960 may be disposed on hinge gear 910 while forming a plurality of layers.

According to an embodiment, a hinge plate 960 may be provided on the front surfaces of the hinge gear 910 and the hinge cover 330, thereby protecting the hinge gear 910 and/or the hinge cover 330.

According to an embodiment, the hinge module 920 may be connected to the hinge gear 910. For example, a portion of the hinge module 920 may be physically connected to the hinge gear 910 and thus may be folded or unfolded about the first axis.

Fig. 9b shows a hinge module of a hinge structure according to an embodiment of the present disclosure.

Referring to fig. 9b, fig. 9b only shows the hinge module 920 of the hinge structure 300.

According to an embodiment, the hinge module 920 may include a first hinge module 921, a second hinge module 922, a third hinge module 923, and a fourth hinge module 924.

According to an embodiment, the first hinge module 921 and the second hinge module 922 may be disposed in an upper end region of the electronic device 100. For example, the first hinge module 921 and the second hinge module 922 may be disposed in an area adjacent to the camera hole (150 in fig. 1) of the electronic device 100 on the first axis.

According to an embodiment, the third hinge module 923 and the fourth hinge module 924 may be disposed in a lower end region of the electronic device 100. For example, the third hinge module 923 and the fourth hinge module 924 may be disposed in an area adjacent to the USB hole (151 in fig. 1) of the electronic device 100 on the first axis.

According to an embodiment, the hinge module 920 may be formed to be horizontally symmetrical with respect to the first axis. For example, the first hinge module 921 and the third hinge module 923 may be disposed in a second direction (e.g., a +x direction) with respect to the first axis. According to an embodiment, the second hinge module 922 and the fourth hinge module 924 may be disposed in a third direction (e.g., -x direction) with respect to the first axis.

In other words, according to an embodiment, the first hinge module 921 and the second hinge module 922 may be formed to be horizontally symmetrical to each other with respect to the first axis, and the third hinge module 923 and the fourth hinge module 924 may be formed to be horizontally symmetrical to each other with respect to the first axis.

According to an embodiment, the hinge module 920 may be formed to be vertically symmetrical with respect to the second axis.

Further, according to an embodiment, the third hinge module 923 and the fourth hinge module 924 may be formed to be symmetrical to the first hinge module 921 and the second hinge module 922 with respect to the second axis.

The hinge module 920 has been described as symmetrical with respect to the first and second axes, but the present disclosure is not limited thereto. For example, a portion of the first hinge module 921 may be formed to be asymmetric with a portion of the second hinge module 922 with respect to the first axis. For example, a first hinge module protrusion 941 may be formed on the first hinge module 921, and a second hinge module recess 952 may be formed on the second hinge module 922.

Further, according to an embodiment, a portion of the first hinge module 921 may be formed to be asymmetric with a portion of the third hinge module 923 with respect to the second axis. For example, the first hinge module protrusion 941 may be formed on a portion of the first hinge module 921, and the first hinge module recess 951 may be formed on a portion of the third hinge module 923.

According to an embodiment, a portion of the hinge module 920 may be connected to the housing 110 of the electronic device 100. For example, the first hinge module 921 and the third hinge module 923 may be connected to the first housing 111 or the first bracket 311 fixed in the first housing 111.

The connection relationship between the hinge module 920 and the housing 110 is described only with respect to the first hinge module 921, but is not limited thereto. For example, a portion of the second hinge module 922 may be connected to the first hinge gear 911, and another portion of the second hinge module 922 may be connected to the second housing 112 or the second bracket 312.

According to an embodiment, the connection relationship between the hinge module 920 and the housing 110 may also be applied to the third hinge module 923 and the fourth hinge module 924.

According to an embodiment, since the hinge gear 910 is connected to the hinge module 920, the hinge module 920 may rotate about a first axis as the hinge gear 910 rotates about the first axis.

According to an embodiment, the hinge module 920 may include at least one hinge module protrusion 940 and at least one hinge module recess 950. For example, the first hinge module 921 may include a first hinge module protrusion 941 extending toward the second hinge module 922 when the electronic device 100 is in the flat state 100A. According to an embodiment, the second hinge module 922 may include a second hinge module recess 952 that receives the first hinge module protrusion 941 and is recessed in a direction opposite to a direction in which the first hinge module 921 is located when the electronic device 100 is in the flat state 100A.

According to the embodiment, the hinge module 920 having the hinge module protrusions 940 and the hinge module recesses 950 formed therein has been described as the first hinge module 921 and the second hinge module 922, but is not limited thereto. For example, the third hinge module 923 may include a first hinge module recess 951 and the fourth hinge module 924 may include a second hinge module projection 942.

According to an embodiment, the hinge module 920 may overlap a portion of the metal plate 410 when viewed from the front surface 101 of the electronic device 100. For example, the first hinge module 921 may include a first hinge module protrusion 941 overlapping the first protrusion 421 of the first metal plate 411 when viewed from the front surface 101 of the electronic device 100. For example, the second hinge module 922 may include a second hinge module recess 952 that overlaps the second recess 432 of the second metal plate 412 when viewed from the front surface 101 of the electronic device 100.

According to an embodiment, the third hinge module 923 may include a first hinge module recess 951 overlapping the first recess 431 of the first metal plate 411 when viewed from the front surface 101 of the electronic device 100. According to an embodiment, the fourth hinge module 924 may include a second hinge module protrusion 942 that overlaps the second protrusion 422 of the second metal plate 412 when viewed from the front surface 101 of the electronic device 100.

According to an embodiment, the hinge module protrusion 940 and the hinge module recess 950 may be formed in the number and shape corresponding to the number and shape of the protrusions 420 and recesses 430 of the metal plate 410. For example, when the first and/or third protrusions 421 and 423 are formed on the first metal plate 411, the first and/or third hinge module protrusions 941 and/or (not shown) may be formed on the first and/or third hinge modules 921 and 923.

According to the embodiment, by further forming the hinge module protrusion 940 and the hinge module recess 950, a shearing motion or torsion of the metal plate 410 and the hinge module 920 in the first axis direction (e.g., the +y direction or the-y direction) due to an external impact can be reduced.

According to an embodiment, since the shearing movement or torsion of the metal plate 410 and the hinge module 920 is reduced, the transfer of the shearing movement or torsion to the main display 200 on the metal plate 410 may be reduced. According to an embodiment, the electronic device 100 may prevent the main display 200 from being damaged due to a reduction in shear motion or torsion to the main display 200.

Further, according to the embodiment, since durability of the main display 200 is ensured, the cover panel (610 in fig. 6) may be omitted in the electronic device 100. According to the embodiment, since the cover panel 610 is omitted, costs and time for producing the electronic device 100 can be saved.

Fig. 10 illustrates a hinge bracket of an electronic device according to an embodiment of the present disclosure.

According to an embodiment, the hinge structure 300 may further include a hinge bracket 1010. According to an embodiment, the hinge bracket 1010 may be disposed on a rear surface of the hinge module 920 when the electronic device 100 is in the flat state 100A.

For example, when the electronic device 100 is in the flat state 100A, the hinge bracket 1010 may be disposed on the rear surfaces of the first and second hinge modules 921 and 922 and/or the rear surfaces of the third and fourth hinge modules 923 and 924.

According to an embodiment, when the hinge module 920 and/or the metal plate 410 is rotated about the first axis by the hinge gear 910, the hinge bracket 1010 may have a guide hole 1020, and the guide hole 1020 performs guiding such that the hinge module protrusion 940 of the hinge module 920 and the protrusion 420 of the metal plate 410 can be inserted into the guide hole and rotated in a predetermined direction.

For example, in fig. 10 the metal plate 410 and/or the hinge module 920 may rotate in a third direction (e.g., clockwise) or a fourth direction (e.g., counter-clockwise). According to an embodiment, when the metal plate 410 and/or the hinge module 920 is rotated in the third direction, the protrusion 420 or the hinge module protrusion 940 may be inserted into the guide hole 1020 and may be rotated in the third direction. For example, when the first metal plate 411 and/or the third hinge module 923 rotates in the third direction, the guide hole 1020 may guide the first boss 421 and/or the first hinge module boss 941 inserted into the guide hole 1020 to rotate in unison in the third direction.

It has been described that the metal plate 410 and/or the hinge module 920 rotates in the third direction, but the present disclosure is not limited thereto. The metal plate 410 and/or the hinge module 920 may rotate in a fourth direction. According to an embodiment, when the metal plate 410 and/or the hinge module 920 are rotated in the fourth direction, the guide hole 1020 may guide the protrusion 420 and/or the hinge module protrusion 940 inserted into the guide hole 1020 to be rotated in unison in the fourth direction.

According to the embodiment, since the hinge bracket 1010 having the guide hole 1020 is included, the boss 420 and the hinge module boss 940 can be prevented from colliding with other electronic parts when the electronic device 100 is switched from the first state 100A to the second state 100B.

A specific embodiment regarding the guide hole 1020 and the boss 420 of the hinge bracket 1010 will be described in detail later with reference to fig. 11 and 12.

Fig. 11 illustrates a hinge bracket of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 11, a relationship between the guide hole 1020 and the hinge module protrusion 940 may be identified when the electronic device 100 according to the embodiment is in the first state 100A and the second state 100B.

According to an embodiment, the hinge module 920 may be disposed on a front surface of the hinge bracket 1010. For example, when the electronic device 100 is in the first state 100A, the hinge module 920 may be disposed to face the hinge bracket 1010. Further, according to an embodiment, when the electronic device 100 is in the second state 100B, the hinge module 920 may be disposed perpendicular to the hinge bracket 1010 or toward the first direction (e.g., the-z direction in fig. 11). Further, according to an embodiment, the third hinge module 923 may be disposed to face the second direction (e.g., +x direction), and the fourth hinge module 924 may be disposed to face the third direction (e.g., -x direction).

According to an embodiment, when the electronic device 100 is switched from the first state 100A to the second state 100B, the hinge module 920 may rotate about the first axis while the angle formed between the hinge module 920 and the hinge bracket 1010 gradually increases.

According to an embodiment, the third hinge module 923 may further include a third hinge module protrusion 943, and the fourth hinge module 924 may further include a fourth hinge module recess 954 for receiving the third hinge module protrusion 943.

According to an embodiment, when the electronic device 100 is in the first state 100A, the third hinge module protrusion 943 of the third hinge module 923 may be received in the fourth hinge module recess 954 of the fourth hinge module 924. Further, when the electronic device 100 is in the second state 100B, the third hinge module boss 943 of the third hinge module 923 may be inserted into the guide hole 1020 formed in the hinge bracket 1010.

According to an embodiment, when the electronic device 100 is switched from the first state 100A to the second state 100B, the third hinge module protrusion 943 of the third hinge module 923 may move in a third direction (clockwise direction). According to an embodiment, in the course of the third hinge module boss 943 moving in the third direction (clockwise direction), the third hinge module boss 943 may be inserted into the guide hole 1020 of the hinge bracket 1010 and may move uniformly in the third direction along the guide hole 1020.

According to an embodiment, in the second state 100B, the third hinge module boss 943 may remain inserted into the guide hole 1020.

According to the embodiment, the electronic device 100 can prevent the boss 420 and the hinge module boss 940 from colliding with other electronic components when the electronic device 100 is switched from the first state 100A to the second state 100B due to the guide hole 1020.

Further, according to an embodiment, when the electronic device 100 is in the second state 100B, the protrusion 420 and the hinge module protrusion 940 may be received in the guide hole 1020, and the electronic device 100 may prevent the metal plate 410 from shaking in the first axis direction (e.g., the +y direction or the-y direction) in the second state 100B.

According to an embodiment, a portion of the first hinge region 1110 adjacent to the third hinge module protrusion 943 of the hinge module 920 may be formed thicker than the second hinge region 1120 spaced apart from the third hinge module protrusion 943 of the hinge module 920. For example, a portion of the first hinge region 1110 of the hinge module 920 may have a first thickness and the second hinge region 1120 may have a second thickness. According to an embodiment, the first thickness may be greater than the second thickness.

According to the embodiment, the first thickness of the first hinge region 1110 of the hinge module 920 is formed to be greater than the second thickness of the second hinge region 1120 of the hinge module 920, and thus the third hinge module protrusion 943 of the electronic device 100 can be prevented from being damaged.

Fig. 12 illustrates a hinge bracket of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 12, when the electronic device 100 is switched from the flat state 100A to the folded state 100B, the protrusion 420 of the metal plate 410 and/or the hinge module protrusion 940 of the hinge module 920 may be received in the guide hole 1020.

According to an embodiment, when the hinge gear 910 rotates, the third hinge module 923 and the fourth hinge module 924 may rotate about the first axis.

Referring to fig. 12, according to an embodiment, when the third hinge module 923 and the fourth hinge module 924 rotate about the first axis, an angle formed by the third hinge module 923 and the fourth hinge module 924 may be 180 degrees to 0 degrees. For example, the angle formed by the third hinge module 923 and the fourth hinge module 924 may be 120 degrees, 90 degrees, or 45 degrees, but is not limited thereto. For example, the angle formed by the third hinge module 923 and the fourth hinge module 924 may be 30 degrees.

According to an embodiment, when the angle formed by the third hinge module 923 and the fourth hinge module 924 is changed from 180 degrees to 0 degrees, the third hinge module protrusion 943 of the third hinge module 923 may be inserted into the guide hole 1020 of the hinge bracket 1010.

According to an embodiment, in the flat state 100A (first state) or 180 degrees, the third hinge module protrusion 943 of the third hinge module 923 may be received in the second hinge module recess 952 of the fourth hinge module 924.

According to an embodiment, when the flat state 100A (first state) or 180 degrees is changed to the folded state 100B or 0 degrees, the third hinge module protrusion 943 of the third hinge module 923 may be inserted into the guide hole 1020 of the hinge bracket 1010 and may be rotated uniformly in the rotation direction. In other words, according to the embodiment, the guide hole 1020 of the hinge bracket 1010 may guide the third hinge module boss 943 to rotate in unison in the rotational direction.

According to an embodiment, in the folded state 100B (second state) or 0 degrees, the third hinge module 923 and the fourth hinge module 924 may be disposed to face each other, and the third hinge module protrusion 943 of the third hinge module 923 may be inserted into the guide hole 1020 of the hinge bracket 1010.

According to an embodiment, in fig. 12, the hinge module boss 940 received in the guide hole 1020 of the hinge bracket 1010 has been described as a third hinge module boss 943. However, this is merely an example for convenience, and the present disclosure is not limited to the third hinge module boss 943. For example, when the electronic device 100 is switched from the flat state 100A to the folded state 100B, at least one hinge module protrusion 940 formed on the first hinge module 921, the second hinge module 922, and/or the fourth hinge module 924 may be received in the guide hole 1020 of the hinge bracket 1010.

Further, according to the embodiment, an example in which the hinge module protrusion 940 of the hinge module 920 is received in the guide hole 1020 has been described. However, the present disclosure is not limited thereto, and the protrusion 420 of the metal plate 410 may be received in the guide hole 1020.

Fig. 13 illustrates a protrusion of a metal plate according to an embodiment of the present disclosure.

Referring to fig. 13, the convex portion 420 of the metal plate 410 may have a first height (H) and a first width (W).

According to an embodiment, the first height (H) of the protrusion 420 may imply a length extending in a first axis direction (e.g., a +y direction or a-y direction). According to an embodiment, the first width (W) of the protrusion 420 may imply a length extending in the second axial direction (e.g., the +x direction or the-x direction).

According to an embodiment, the first height (H) of the protrusion 420 may be formed to be longer than the first width (W) of the protrusion 420.

According to the embodiment, when the first height (H) is formed to be longer than or equal to the first width (W), the convex part 420 may not be separated from the metal plate 410 even when an impact is applied from the outside. In other words, according to the embodiment, the first height (H) is formed to be longer than or equal to the first width (W), and thus the durability of the convex part 420 may be improved.

According to the embodiment, the protrusion 420 having the first height (H) equal to or longer than the first width (W) may ensure more improved durability than the protrusion having the first height (H) shorter than the first width (W).

Fig. 14 illustrates a boss of an electronic device according to another embodiment of the present disclosure.

Referring to fig. 14, the convex part 420 of the metal plate 410 may be formed in various shapes. According to an embodiment, the protrusion 420 may be formed in a rectangular shape, but is not limited thereto. For example, the convex part 420 may be formed in a semicircular shape or a triangular shape.

Alternatively, according to an embodiment, the convex part 420 may be formed in a trapezoid shape. For example, the protrusion 420 may extend from a point on the outer periphery 440 of the metal plate 410. According to an embodiment, the boss 420 may include a first edge 1431 extending from the periphery 440, a second edge 1432 opposite the first edge 1431 relative to the second axis, and/or a third edge 1433 for connecting the first edge 1431 to the second edge 1432.

According to an embodiment, the first edge 1431 may extend from a point of the outer perimeter 440 towards the second axis. According to an embodiment, the first edge 1431 may be symmetrical with the second edge 1432 with respect to the second axis. According to an embodiment, the third edge 1433 may correspond to an edge parallel to the outer periphery 440 of the metal plate 410.

According to an embodiment, the first and second edges 1431, 1432 of the protrusion 420 may form a predetermined angle with respect to the first axis, may extend toward the second axis, and may be connected to the third edge 1433. In other words, the first and second edges 1431 and 1432 may extend at a predetermined slope, and may be connected to the third edge 1433.

According to an embodiment, the first and second edges 1431 and 1432 of the protrusion 420 have a slope and are connected to the third edge 1433, and thus the boundary surface of the recess 430 for receiving the protrusion 420 may be formed with a slope as well. For example, a fourth edge 1434 of the recess 430 facing the first edge 1431 of the protrusion 420 and a fifth edge 1435 of the recess 430 facing the second edge 1432 may be formed at a slope corresponding to the slope of the first edge 1431 and the second edge 1432.

According to the embodiment, the first, second, fourth, and fifth edges 1431, 1432, 1434, and 1435 are formed at a predetermined slope, and thus the durability of the protrusion 420 may be improved.

Fig. 15 illustrates a front surface of a metal plate of an electronic device according to an embodiment of the present disclosure.

Referring to fig. 15, the metal plate 410 may include a first plurality of regions 1500, and the hinge structure 300 may include a second plurality of regions 1510.

According to an embodiment, the first plurality of regions 1500 may suggest regions of the metal plate 410 in which the protrusions 420 and the recesses 430 are formed. Further, according to an embodiment, the second plurality of regions 1510 may be regions in which multiple elements of the hinge structure 300 (e.g., the hinge gears 910 in fig. 9a and 9 b) are located.

According to an embodiment, the electronic device 100 may include a hinge structure 300 disposed in a region corresponding to the first axis, and a Flexible Printed Circuit Board (FPCB) 343 passing through the hinge structure 300.

According to an embodiment, the second plurality of regions 1510 of the hinge structure 300 may include a screw fastening region 1520 to which a screw connecting the hinge structure 300 to the bracket 310 is fastened, a central region 1530 through which the FPCB 343 of the electronic device 100 passes, and/or a hinge gear region 1540 in which the hinge gear 910 is disposed.

According to an embodiment, the FPCB 343 may electrically connect a first electronic component (not shown) disposed in the first case 111 to a second electronic component disposed in the second case 112. For example, the FPCB 343 may pass through the central region 1530 of the hinge structure 300 to electrically connect the first electronic component disposed in the first housing 111 to the second electronic component disposed in the second housing 112. According to an embodiment, the central region 1530 of the hinge structure 300 may correspond to a region corresponding to the second axis, but is not limited thereto.

According to an embodiment, the hinge gear region 1540 may include a first hinge gear region 1541 in which the first hinge gear 911 is disposed and a second hinge gear region 1542 in which the second hinge gear 912 is disposed.

According to an embodiment, the first hinge gear area 1541 may be formed in one area of the hinge structure 300 positioned in a first direction (e.g., a +y direction) with respect to the second axis. According to an embodiment, the second hinge gear area 1542 may be formed in one area of the hinge structure 300 positioned in a second direction (e.g., -y direction) opposite to the first direction with respect to the second axis.

According to an embodiment, the first hinge gear region 1541 may be formed to be symmetrical with the second hinge gear region 1542 with respect to the second axis, but is not limited thereto.

According to an embodiment, the screw fastening region 1520 may include: a first screw fastening region 1521 adjacent to the first hinge gear region 1541 and having a screw fastened thereto; a second screw fastening region 1522 having a screw fastened between the first screw fastening region 1521 and the central region 1530; a third screw tightening region 1523 having a screw tightened between the fourth screw tightening region 1524 and the central region 1530; and/or a fourth screw-securing region 1524 adjacent to the second hinge gear region 1542 and having a screw secured thereto.

According to an embodiment, the first screw fastening region 1521 and/or the second screw fastening region 1522 may be formed in one region of the hinge structure 300 positioned in a first direction (e.g., a +y direction) with respect to the second axis. According to an embodiment, the third screw fastening region 1523 and/or the fourth screw fastening region 1524 may be formed in one region of the hinge structure 300 positioned in a second direction (e.g., -y direction) relative to the second axis.

According to an embodiment, the first and fourth screw fastening regions 1521 and 1524 may be formed to be symmetrical to each other with respect to the second axis, and the second and third screw fastening regions 1522 and 1523 may be formed to be symmetrical to each other with respect to the second axis. However, the present disclosure is not limited thereto.

According to an embodiment, the protrusions 420 and recesses 430 in fig. 4 may be formed in the first plurality of regions 1500 of the metal plate 410.

According to an embodiment, the first plurality of regions 1500 formed on the metal plate 410 may be formed to be spaced apart from the second plurality of regions 1510 formed in the hinge structure 300.

According to an embodiment, the first plurality of regions 1500 may include a first region 1501 and a seventh region 1507 formed between the hinge gear region 1540 of the hinge structure 300 and the side surface 103 of the electronic device 100. For example, the first region 1501 may be spaced apart from the first hinge gear region 1541 and formed between the first hinge gear region 1541 and the side surface 103 of the electronic device 100. According to an embodiment, the seventh region 1507 may be spaced apart from the second hinge gear region 1542 and formed between the second hinge gear region 1542 and the side surface of the housing 110.

In other words, according to an embodiment, the first region 1501 and/or the seventh region 1507 may be formed in a region adjacent to the outer circumference of the metal plate 410.

According to an embodiment, the first plurality of regions 1500 of the metal plate 410 may further include a second region 1502 formed between the first hinge gear region 1541 and the first screw fastening region 1521, a third region 1503 formed between the first screw fastening region 1521 and the second screw fastening region 1522, a fourth region 1504 formed between the second screw fastening region 1522 and the central region 1530, a fifth region 1505 formed between the third screw fastening region 1523 and the fourth screw fastening region 1524, and/or a sixth region 1506 formed between the fourth screw fastening region 1524 and the second hinge gear region 1542.

For example, a first hinge gear region 1541 may be formed between the first region 1501 and the second region 1502, and a second hinge gear region 1542 may be formed between the sixth region 1506 and the seventh region 1507.

According to an embodiment, the convex part 420 and the concave part 430 in fig. 4 may be formed in at least one of the first region 1501 to the seventh region 1507. For example, the convex portion 420 and the concave portion 430 may be formed in the first region 1501, the second region 1502, and/or the third region 1503. In another example, the convex portion 420 and the concave portion 430 may be formed in the first region 1501 and the seventh region 1507.

According to the embodiment, at least one protrusion 420 and recess 430 are formed in the first plurality of regions 1500 of the metal plate 410, and thus, a shearing motion or torsion of the metal plate 410 in the first axis direction (e.g., +y direction or-y direction) due to an external impact can be reduced as compared to a case where the protrusion 420 and recess 430 are formed in a single region.

According to the embodiment, the shearing movement or torsion of the metal plate 410 is reduced, and thus the shearing movement or torsion of the main display 200 disposed on the metal plate 410 can also be reduced. According to the embodiment, the shearing motion or torsion of the main display 200 is reduced, and thus damage to the region of the main display 200 corresponding to the first axis can be prevented.

Fig. 16 illustrates a boss of an electronic device according to another embodiment of the present disclosure.

Referring to fig. 16, a plurality of protrusions 420 and a plurality of recesses 430 may be formed on the metal plate 410.

Referring to fig. 1601 according to an embodiment, the first metal plate 411 may include a first protrusion 421 and a first recess 431, and the second metal plate 412 may include a second protrusion 422 and a second recess 432.

The protrusion 420 and the recess 430 in fig. 1601 may be substantially the same as the protrusion 420 and the recess 430 in fig. 4.

Referring to the drawing 1602 according to the embodiment, the first metal plate 411 may further include a third concave portion 433 adjacent to the first convex portion 421 and recessed from the first outer periphery 441, and a third convex portion 423 adjacent to the first concave portion 431 and extending from the first outer periphery 441. Further, according to an embodiment, the second metal plate 412 may further include a fourth protrusion 424 extending from the second outer circumference 442 and inserted into the third recess 433, and a fourth recess 434 recessed from the second outer circumference 442 and having the third protrusion 423 inserted therein when the case 110 is unfolded.

However, the number of the convex portions 420 and the concave portions 430 formed on the metal plate 410 is not limited thereto. For example, the first metal plate 411 may further include a fifth convex portion (not shown), and the second metal plate 412 may further include a sixth convex portion (not shown).

According to an embodiment, a plurality of protrusions and a plurality of recesses may be formed in at least one of the first plurality of regions 1500 in fig. 15. For example, the first convex portion 421, the second concave portion 432, the fourth convex portion 424, and the third concave portion 433 may be formed in the first region 1501, and the third convex portion 423, the fourth concave portion 434, the first concave portion 431, and the second convex portion 422 may be formed in the seventh region 1507.

According to the embodiment, the regions in which the plurality of convex portions and the plurality of concave portions are formed have been described as the first region 1501 and the seventh region 1507, but the present disclosure is not limited thereto. For example, the convex portion 420 and the concave portion 430 may be further formed in the second region 1502.

According to the embodiment, the plurality of convex portions 420 and the plurality of concave portions 430 are formed, and thus, compared to the case where a single convex portion 420 and a single concave portion 430 are formed therein, the shearing movement or torsion of the metal plate 410 due to the external impact in the first axis direction can be reduced.

According to the embodiment, the shearing movement or torsion of the metal plate 410 is reduced, and thus the shearing movement or torsion of the main display 200 disposed on the metal plate 410 in the first axis direction can be reduced.

Fig. 17 is a block diagram illustrating an electronic device 1701 in a network environment 1700 according to an embodiment of the disclosure. Referring to fig. 17, an electronic device 1701 in a network environment 1700 may communicate with the electronic device 1702 via a first network 1798 (e.g., a short-range wireless communication network) or with at least one of the electronic device 1704 or a server 1708 via a second network 1799 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1701 may communicate with the electronic device 1704 via the server 1708. According to an embodiment, the electronic device 1701 may include a processor 1720, a memory 1730, an input module 1750, a sound output module 1755, a display module 1760, an audio module 1770, a sensor module 1776, an interface 1777, a connection 1778, a haptic module 1779, a camera module 1780, a power management module 1788, a battery 1789, a communication module 1790, a Subscriber Identity Module (SIM) 1796, or an antenna module 1797. In some embodiments, at least one of the above-described components (e.g., the connection end 1778) may be omitted from the electronic device 1701, or one or more other components may be added to the electronic device 1701. In some embodiments, some of the components described above (e.g., the sensor module 1776, the camera module 1780, or the antenna module 1797) may be implemented as a single component (e.g., the display module 1760).

The processor 1720 may run, for example, software (e.g., program 1740) to control at least one other component (e.g., hardware component or software component) of the electronic device 1701 coupled to the processor 1720 and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 1720 may store commands or data received from another component (e.g., the sensor module 1776 or the communication module 1790) in the volatile memory 1732, process the commands or data stored in the volatile memory 1732, and store the resulting data in the non-volatile memory 1734. According to an embodiment, the processor 1720 may include a main processor 1721 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) or an auxiliary processor 1723 (e.g., a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), an Image Signal Processor (ISP), a sensor hub processor or a Communication Processor (CP)) that is operatively independent of or combined with the main processor 1721. For example, when the electronic device 1701 includes a main processor 1721 and a secondary processor 1723, the secondary processor 1723 may be adapted to consume less power than the main processor 1721 or to be dedicated to a particular function. The auxiliary processor 1723 may be implemented separately from the main processor 1721 or as part of the main processor 1721.

The auxiliary processor 1723 (rather than the main processor 1721) may control at least some of the functions or states associated with at least one of the components of the electronic device 1701 (e.g., the display module 1760, the sensor module 1776, or the communication module 1790) while the main processor 1721 is in an inactive (e.g., sleep) state, or the auxiliary processor 1723 may control at least some of the functions or states associated with at least one of the components of the electronic device 1701 (e.g., the display module 1760, the sensor module 1776, or the communication module 1790) with the main processor 1721 while the main processor 1721 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 1723 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 1780 or the communication module 1790) functionally related to the auxiliary processor 1723. According to an embodiment, the auxiliary processor 1723 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. Such learning may be performed, for example, by the electronics 1701 where the artificial intelligence model is executed or via a separate server (e.g., server 1708). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a Deep Neural Network (DNN), a Convolutional Neural Network (CNN), a Recurrent Neural Network (RNN), a boltzmann machine limited (RBM), a Deep Belief Network (DBN), a bi-directional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include software structures in addition to hardware structures.

The memory 1730 may store various data used by at least one component of the electronic device 1701 (e.g., the processor 1720 or the sensor module 1776). The various data may include, for example, software (e.g., program 1740) and input data or output data for commands associated therewith. Memory 1730 may include volatile memory 1732 or nonvolatile memory 1734.

The program 1740 may be stored as software in the memory 1730, and the program 1740 may include, for example, an Operating System (OS) 1742, middleware 1744, or applications 1746.

The input module 1750 may receive commands or data from outside of the electronic device 1701 (e.g., a user) to be used by another component of the electronic device 1701 (e.g., the processor 1720). The input module 1750 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons) or a digital pen (e.g., a stylus).

The sound output module 1755 may output sound signals to the outside of the electronic apparatus 1701. The sound output module 1755 may include, for example, a speaker or a receiver. Speakers may be used for general purposes such as playing multimedia or playing a record. The receiver may be used to receive an incoming call. Depending on the embodiment, the receiver may be implemented separate from the speaker or as part of the speaker.

The display module 1760 may visually provide information to the outside (e.g., user) of the electronic device 1701. The display module 1760 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, the display module 1760 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by a touch.

The audio module 1770 may convert sound into electrical signals and vice versa. According to an embodiment, the audio module 1770 may obtain sound via the input module 1750, or output sound via the sound output module 1755 or headphones of an external electronic device (e.g., electronic device 1702) coupled directly (e.g., wired) or wirelessly with the electronic device 1701.

The sensor module 1776 may detect an operational state (e.g., power or temperature) of the electronic device 1701 or an environmental state (e.g., a state of a user) external to the electronic device 1701 and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1776 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 1777 may support one or more particular protocols that will be used to couple (e.g., wire-line) the electronic device 1701 with an external electronic device (e.g., the electronic device 1702) or wirelessly. According to an embodiment, the interface 1777 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 1778 may include a connector via which the electronic device 1701 may be physically connected with an external electronic device (e.g., electronic device 1702). According to an embodiment, the connection end 1778 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 1779 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 1779 may include, for example, a motor, a piezoelectric element, or an electrostimulator.

The camera module 1780 may capture still images or moving images. According to an embodiment, the camera module 1780 may include one or more lenses, image sensors, image signal processors, or flash lamps.

The power management module 1788 may manage power to the electronic device 1701. According to an embodiment, the power management module 1788 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

The battery 1789 may power at least one component of the electronic device 1701. According to an embodiment, the battery 1789 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 1790 may support establishing a direct (e.g., wired) communication channel or wireless communication between the electronic device 1701 and an external electronic device (e.g., electronic device 1702, electronic device 1704, or server 1708)A communication channel, and performing communication via the established communication channel. The communication module 1790 may include one or more communication processors that are capable of operating independently of the processor 1720 (e.g., an Application Processor (AP)) and support direct (e.g., wired) or wireless communication. According to an embodiment, the communication module 1790 may include a wireless communication module 1792 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 1794 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of the communication modules may be via a first network 1798 (e.g., a short-range communication network such as bluetooth ^TM The Wi-Fi direct or infrared data association (IrDA)) or a second network 1799 (e.g., a long-range communication network, such as a conventional cellular network, a fifth generation (5G) network, a next generation communication network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN)), with an external electronic device. These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separate from each other. The wireless communication module 1792 may identify and authenticate the electronic device 1701 in a communication network, such as the first network 1798 or the second network 1799, using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1796.

The wireless communication module 1792 may support a 5G network after a fourth generation (4G) network as well as next generation communication technologies (e.g., new wireless (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), large-scale machine type communication (mctc), or Ultra Reliable Low Latency Communication (URLLC). The wireless communication module 1792 may support a high frequency band (e.g., millimeter wave (mmWave) band) to achieve, for example, high data transmission rates. The wireless communication module 1792 may support various techniques for ensuring performance over high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 1792 may support various requirements specified in the electronic device 1701, an external electronic device (e.g., electronic device 1704), or a network system (e.g., second network 1799). According to an embodiment, the wireless communication module 1792 may support a peak data rate (e.g., 20 gigabytes per second (Gbps) or greater) for implementing an eMBB, a lost coverage (e.g., 164dB or less) for implementing an emtc, or a U-plane delay (e.g., 0.5ms or less, or 1ms or less round trip for each of the Downlink (DL) and Uplink (UL)) for implementing a URLLC.

The antenna module 1797 may transmit signals or power to the outside of the electronic device 1701 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 1701 (e.g., an external electronic device). According to an embodiment, the antenna module 1797 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate, such as a Printed Circuit Board (PCB). According to an embodiment, the antenna module 1797 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna of the plurality of antennas suitable for a communication scheme used in a communication network, such as the first network 1798 or the second network 1799, may be selected by, for example, the communication module 1790 (e.g., the wireless communication module 1792). Signals or power may then be transmitted or received between the communication module 1790 and the external electronic device via the selected at least one antenna. According to an embodiment, another component other than the radiating element, such as a Radio Frequency Integrated Circuit (RFIC), may additionally be formed as part of the antenna module 1797. According to various embodiments, antenna module 1797 may form a millimeter wave antenna module. According to an embodiment, a millimeter wave antenna module may include a printed circuit board, an RFIC disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., a millimeter wave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

At least some of the above components may be coupled to each other and communicatively communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., bus, general Purpose Input Output (GPIO), serial Peripheral Interface (SPI), or Mobile Industrial Processor Interface (MIPI)).

According to an embodiment, commands or data may be sent or received between the electronic device 1701 and the external electronic device 1704 via a server 1708 coupled to the second network 1799. Each of the electronic device 1702 or the electronic device 1704 may be the same type of device as the electronic device 1701 or a different type of device from the electronic device 1701. According to an embodiment, all or some of the operations to be performed at the electronic device 1701 may be performed at one or more of the external electronic device 1702, the external electronic device 1704, or the server 1708. For example, if the electronic device 1701 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 1701 may request that the one or more external electronic devices perform at least part of the function or service instead of or in addition to the function or service, or the electronic device 1701 may request that the one or more external electronic devices perform at least part of the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the function or service or perform another function or another service related to the request and transmit the result of the performing to the electronic device 1701. The electronics 1701 may provide the result as at least a partial answer to the request with or without further processing of the result. For this purpose, for example, cloud computing technology, distributed computing technology, mobile Edge Computing (MEC) technology, or client-server computing technology may be used. The electronic device 1701 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1704 may include an internet of things (IoT) device. The server 1708 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 1704 or the server 1708 may be included in a second network 1799. The electronic device 1701 may be applied to smart services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

According to various embodiments, an electronic device may include: a housing including a first housing and a second housing; a foldable display including a first region disposed on a front surface of the first housing and a second region disposed on a front surface of the second housing; a hinge structure connecting the first housing to the second housing such that the second housing is rotatable about a first axis relative to the first housing; and a metal plate disposed on a rear surface of the foldable display, wherein the metal plate includes: a first metal plate provided on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a second metal plate provided on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, the first metal plate including: a first recess recessed from a first outer periphery of the first metal plate adjacent to the first axis; and a first convex portion spaced apart from the first concave portion and extending from the first outer periphery, and the second metal plate includes: a second recess recessed from a second outer periphery of the second metal plate adjacent to the first axis and receiving the first protrusion when the housing is deployed; and a second protrusion extending from the second outer periphery and inserted into the first recess when the housing is unfolded.

According to an embodiment, the first protrusion may have a first height extending in a direction of the first axis and a first width extending in a direction of the second axis perpendicular to the first axis, and the first height may be longer than the first width.

According to an embodiment, the first metal plate may further include: a third recess adjacent to the first convex portion of the first metal plate and recessed from the first outer periphery of the first metal plate; and a third protrusion adjacent to the first recess of the first metal plate and extending from the first outer periphery.

According to an embodiment, the second metal plate may further include: a fourth protrusion extending from the second outer periphery of the second metal plate and inserted into the third recess of the first metal plate when the housing is unfolded; and a fourth recess recessed from the second outer periphery and receiving the third protrusion of the first metal plate when the housing is unfolded.

According to an embodiment, the hinge structure may further comprise: and a hinge bracket provided on a rear surface of the hinge module of the hinge structure when the housing is unfolded, wherein the hinge bracket is formed with a guide hole into which the first protrusion of the first metal plate and the second protrusion of the second metal plate are inserted when the housing is folded.

According to an embodiment, the electronic device may further include: a Flexible Printed Circuit Board (FPCB) electrically connecting the first electronic part disposed in the first case to the second electronic part disposed in the second case, the hinge structure may include a central region through which the FPCB passes, and the first protrusion of the first metal plate and the second recess of the second metal plate may be disposed to be spaced apart from each other in the central region.

According to an embodiment, the first convex portion of the first metal plate may be formed in a first region adjacent to a first end portion of the first outer circumference, and the first concave portion of the first metal plate may be formed in a second region adjacent to a second end portion of the first outer circumference opposite to the first end portion.

According to an embodiment, the hinge structure may include: a hinge gear enabling the second housing to rotate about the first axis, the first metal plate may further include: a third protrusion different from the first protrusion and extending from the first outer periphery; and a third recess different from the first recess and recessed from the first outer periphery, the second metal plate may further include: a fourth protrusion received in the third recess; and a fourth recess that is different from the second recess and that receives the third protrusion, and the third protrusion and the fourth recess may be formed in a third region spaced apart from the hinge gear and the first region.

According to an embodiment, the hinge gear may be disposed between the first region and the third region.

According to an embodiment, the first protrusion may include: a first edge extending from a point of a first outer periphery of the first metal plate toward a second axis perpendicular to the first axis; a second edge symmetrical to the first edge with respect to the second axis; and a third edge connecting one end of the first edge to one end of the second edge, wherein the first edge and the second edge form a predetermined angle with respect to the first axis and extend toward the second axis.

According to an embodiment, the first convex portion may be formed in a rectangular shape.

According to an embodiment, the first protrusion of the first metal plate may be perpendicular to a first direction facing the first axis, and may extend in a second direction in which the second metal plate is located when the housing is unfolded.

According to an embodiment, the electronic device may further: and a waterproof member disposed between the hinge structure and the metal plate.

According to an embodiment, the foldable display may further comprise a cover panel.

According to an embodiment, the electronic device may further: a digitizer disposed between the foldable display and the metal plate.

According to various embodiments, an electronic device may include: a housing including a first housing and a second housing; a foldable display including a first region disposed on a front surface of the first housing and a second region disposed on a front surface of the second housing; a hinge structure connecting the first housing to the second housing such that the second housing is rotatable about a first axis relative to the first housing, the hinge structure including a hinge gear enabling rotation of the second housing about the first axis and a hinge module connected to the hinge gear; and a metal plate disposed on a rear surface of the foldable display, wherein the metal plate includes: a first metal plate provided on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and a second metal plate provided on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, the first metal plate including: a first recess recessed from a first outer periphery of the first metal plate adjacent to the first axis; and a first protrusion spaced apart from the first recess and extending from the first outer periphery, the second metal plate including: a second recess recessed from a second outer periphery of the second metal plate adjacent to the first axis and receiving the first protrusion when the housing is deployed; and a second protrusion extending from the second outer periphery and inserted into the first recess when the housing is unfolded, and the hinge module includes: a first hinge module provided on the rear surface of the first metal plate and including a first hinge module convex portion overlapping the first convex portion and a second hinge module concave portion overlapping the first concave portion when viewed from the front surface of the electronic device; and a second hinge module provided on the rear surface of the second metal plate and including a first hinge module convex portion overlapping the second convex portion and a second hinge module concave portion overlapping the second concave portion when viewed from the front surface of the electronic device.

According to an embodiment, the hinge structure further comprises: and a hinge bracket provided on a rear surface of the hinge module of the hinge structure when the case is unfolded, and which may be formed with a guide hole into which the first protrusion of the first metal plate and the second protrusion of the second metal plate are inserted when the case is folded.

According to an embodiment, the first convex portion of the first metal plate is formed in a first region adjacent to a first end portion of the first edge, and the first concave portion of the first metal plate may be formed in a second region adjacent to a second end portion of the first edge opposite to the first end portion.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to the embodiments of the present disclosure, the electronic device is not limited to those described above.

It should be understood that the various embodiments of the disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather include various modifications, equivalents or alternatives to the respective embodiments. For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to an item may include one or more things unless the context clearly indicates otherwise. As used herein, each of the phrases such as "a or B", "at least one of a and B", "at least one of a or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any or all possible combinations of items listed with a corresponding one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to simply distinguish one element from another element and not to limit the element in other respects (e.g., importance or order). It will be understood that if the term "operatively" or "communicatively" is used or the term "operatively" or "communicatively" is not used, then if an element (e.g., a first element) is referred to as being "coupled to," "connected to," or "connected to" another element (e.g., a second element), it means that the element can be directly (e.g., wired) coupled to, wirelessly connected to, or coupled to the other element via a third element.

As used in connection with various embodiments of the present disclosure, the term "module" may include an element implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

The various embodiments set forth herein may be implemented as software (e.g., program 1740) comprising one or more instructions stored in a storage medium (e.g., internal memory 1736 or external memory 1738) readable by a machine (e.g., electronic device 1701). For example, under control of a processor (e.g., processor 1720) of a machine (e.g., electronic device 1701), the processor may invoke and execute at least one of the one or more instructions stored in the storage medium with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the at least one instruction invoked. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein the term "non-transitory" merely means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disk read only memory (CD-ROM), or may be distributed via an application store (e.g., playStore ^TM ) The computer program product may be distributed (e.g., downloaded or uploaded) online, or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). At least a portion of the computer program product may be temporarily generated if distributed online, or at least a portion of the computer program product may be stored at least temporarily in a machine readable storage medium, such as a memory of a manufacturer's server, an application store's server, or a forwarding server.

According to various embodiments, each of the above-described components (e.g., a module or a program) may include a single entity or a plurality of entities, and some of the plurality of entities may be separately provided in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. According to various embodiments, operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device, the electronic device comprising:

a housing comprising a first housing and a second housing;

a foldable display including a first region disposed on a front surface of the first housing and a second region disposed on a front surface of the second housing;

a hinge structure connecting the first housing to the second housing such that the second housing is rotatable about a first axis relative to the first housing; and

a metal plate disposed on a rear surface of the foldable display,

wherein the metal plate comprises:

a first metal plate provided on a rear surface of the first region and covering at least a portion of the first housing and a portion of the hinge structure; and

A second metal plate provided on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure,

wherein the first metal plate includes:

a first recess recessed from a first outer periphery of the first metal plate adjacent to the first axis; and

a first protrusion spaced apart from the first recess and extending from the first periphery, an

Wherein the second metal plate includes:

a second recess recessed from a second periphery of the second metal plate adjacent the first axis and receiving the first protrusion in response to the housing being deployed; and

a second protrusion extending from the second outer periphery and inserted into the first recess in response to the housing being deployed.

2. The electronic device according to claim 1,

wherein the first protrusion has a first height extending in the direction of the first axis and a first width extending in the direction of a second axis perpendicular to the first axis, an

Wherein the first height is longer than the first width.

3. The electronic device of claim 1, wherein the first metal plate further comprises:

a third recess adjacent to the first convex portion of the first metal plate and recessed from the first outer periphery of the first metal plate; and

a third protrusion adjacent to the first recess of the first metal plate and extending from the first outer periphery.

4. The electronic device of claim 3, the second metal plate further comprising:

a fourth protrusion extending from the second outer periphery of the second metal plate and inserted into the third recess of the first metal plate in response to the housing being expanded; and

a fourth recess recessed at the second periphery and receiving the third protrusion of the first metal plate in response to the housing being deployed.

5. The electronic device according to claim 1,

wherein the hinge structure further comprises a hinge bracket disposed on a rear surface of a hinge assembly of the hinge structure in response to the housing being unfolded, and

wherein the hinge bracket is formed with a guide hole into which the first protrusion of the first metal plate and the second protrusion of the second metal plate are inserted in response to the housing being folded.

6. The electronic device of claim 1, the electronic device further comprising:

a Flexible Printed Circuit Board (FPCB) electrically connecting the first electronic component provided in the first housing to the second electronic component provided in the second housing,

wherein the hinge structure includes a central region through which the FPCB passes, an

Wherein the first convex portion of the first metal plate and the second concave portion of the second metal plate are disposed to be spaced apart from each other in the central region.

7. The electronic device according to claim 1,

wherein the first convex portion of the first metal plate is formed in a first region adjacent to a first end portion of the first outer periphery, and

wherein the first recess of the first metal plate is formed in a second region adjacent to a second end of the first outer periphery opposite the first end.

8. The electronic device according to claim 7,

wherein the hinge structure includes a hinge gear enabling the second housing to rotate about the first axis,

wherein the first metal plate further comprises:

a third protrusion different from the first protrusion and extending from the first outer periphery; and

A third recess different from the first recess and recessed at the first outer periphery,

wherein the second metal plate further comprises:

a fourth protrusion received in the third recess; and

a fourth recess different from the second recess and receiving the third protrusion, and

wherein the third convex portion and the fourth concave portion are formed in a third region spaced apart from the hinge gear and the first region.

9. The electronic device of claim 8, wherein the hinge gear is disposed between the first region and the third region.

10. The electronic device of claim 1, wherein the first protrusion comprises:

a first edge extending from a point of the first outer periphery of the first metal plate toward a second axis perpendicular to the first axis;

a second edge, the second edge being symmetrical with the first edge with respect to the second axis; and

a third edge connecting one end of the first edge to one end of the second edge,

wherein the first edge and the second edge form a predetermined angle with respect to the first axis and extend toward the second axis.

11. The electronic device according to claim 1, wherein the first convex portion is formed in a rectangular shape.

12. The electronic device of claim 1, wherein the first protrusion of the first metal plate is perpendicular to a first direction facing the first axis and extends in a second direction in which the second metal plate is positioned in response to the housing being deployed.

13. The electronic device of claim 1, the electronic device further comprising:

and a waterproof member disposed between the hinge structure and the metal plate.

14. The electronic device of claim 1, wherein the foldable display further comprises a cover panel.

15. An electronic device, the electronic device comprising:

a housing comprising a first housing and a second housing;

a hinge structure connecting the first housing to the second housing such that the second housing is rotatable about a first axis relative to the first housing,

Wherein the hinge structure comprises a hinge gear enabling the second housing to rotate about the first axis and a hinge module assembly connected to the hinge gear; and

a metal plate disposed on a rear surface of the foldable display, wherein the metal plate comprises:

a second metal plate provided on a rear surface of the second region and covering at least a portion of the second housing and a portion of the hinge structure, wherein the first metal plate includes:

a first protrusion spaced apart from the first recess and extending from the first periphery,

wherein the second metal plate includes:

A second protrusion extending from the second periphery and inserted into the first recess in response to the housing being deployed, an

Wherein the hinge module assembly comprises:

a first hinge module assembly disposed on a rear surface of the first metal plate and including a first hinge module assembly protrusion overlapping the first protrusion and a second hinge module assembly recess overlapping the first recess when viewed from a front surface of the electronic device; and

a second hinge module assembly disposed on a rear surface of the second metal plate and including a first hinge module assembly protrusion overlapping the second protrusion and a second hinge module assembly recess overlapping the second recess when viewed from the front surface of the electronic device.