KR20230049518A - Housing of electronic device and method for manufacturing the same - Google Patents

Abstract

According to one embodiment, a manufacturing method of a housing of an electronic device may comprise: a process of forming a curve on a surface of a metal frame through a blasting method; and a process of depositing the metal frame in an alkaline etching solution comprising a phosphate. Therefore, the present invention is capable of realizing the metal frame having a soft texture and a matte particle-like surface of a microfiber.

Description

Housing of electronic device and manufacturing method thereof { HOUSING OF ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME }

Embodiments of the present disclosure relate to a housing of an electronic device and a manufacturing method thereof.

Due to the development of information and communication technology and semiconductor technology, the supply and use of various electronic devices are rapidly increasing. In particular, recent electronic devices are being developed to be portable and communicate. Also, electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and ultra-high-speed, large-capacity wireless communication becomes common, recently, a single electronic device such as a mobile communication terminal may be equipped with various functions. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, schedule management, and electronic wallet functions are integrated into one electronic device. These electronic devices are miniaturized so that users can conveniently carry them.

In manufacturing a housing that forms the exterior of an electronic device, by using a metal material, research is continuously being conducted to protect various circuit devices from the external environment while forming a beautiful appearance of the electronic device in terms of design.

Recently, aluminum metal has been widely used as an exterior material for various electronic device products such as portable electronic devices, PCs, and TVs. After the pretreatment step of forming the surface texture of the aluminum exterior material, surface treatment such as painting, plating, deposition, and anodizing may be performed to protect the surface of the metal and to realize textures having various appearances.

The process for realizing surface texture includes a blasting method in which various media (sand, ceramic, aluminum, etc.) are applied to the metal surface and sprayed at a constant pressure, and a physical polishing method in which abrasive stone and abrasive cloth are applied for processing. , there is a hairline method of processing in a certain direction using a metal brush or sandpaper.

According to this processing method, a glossy or rough surface can be obtained, and it can also be processed into a patterned texture.

There are various types of surface treatment methods for metals with textured surfaces. Among the surface treatment methods, the anodizing method is a surface treatment that has an oxide film with high adhesion to the base metal by oxygen generated while the metal is energized through the anode. way. The surface of the anodized metal treated as described above has high aesthetics due to the alive texture of the metal, and excellent corrosion resistance and wear resistance.

However, with the existing anodizing method, only a very high gloss or a rough metal texture in a semi-glossy state was realized, and a soft and matte appearance like microfiber could not be realized.

The present disclosure provides a housing of an electronic device having a smooth and matte surface texture and a manufacturing method thereof.

However, the problem to be solved in the present disclosure is not limited to the above-mentioned problem, and may be expanded in various ways without departing from the spirit and scope of the present disclosure.

According to an embodiment, a method of manufacturing a housing of an electronic device may include a process of forming curves on a surface of a metal frame through a blasting method and a process of immersing the metal frame in an alkaline etching solution containing phosphate. .

According to one embodiment, the housing of the electronic device includes a metal frame, a surface of the metal frame has a gloss value of 1 to 10 Gu (gloss unit), and a maximum height of a plurality of irregularities disposed on the surface is 0.1 to 2.3 μm, the maximum depth of the plurality of irregularities between the valleys is 0.1 to 1.8 μm, and the number of irregularities per unit area of 1 cm ² may be 90 to 200.

According to various embodiments of the present disclosure, a metal frame having a soft texture of microfibers and a surface of matte particles may be implemented.

In addition, according to various embodiments of the present disclosure, both the outer and inner surfaces of the metal frame may have a soft texture and matte particle feeling of microfibers.

In addition, various embodiments of the present disclosure may be applicable to a product group using metal other than the electronic device housing.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.
2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
4 is a diagram illustrating a housing of an electronic device according to various embodiments of the present disclosure.
5 is a diagram for explaining a method of manufacturing a housing of an electronic device according to an embodiment of the present disclosure.
6A is a view for explaining a process of immersing a metal frame on which a blasting process has been performed in an alkali etching solution including phosphate according to an embodiment of the present disclosure.
6B is a view for explaining a metal frame etched using an alkaline etching solution containing phosphate according to an embodiment of the present disclosure.
7 is a view for explaining a surface gloss measurement result of a metal frame according to a surface treatment method.
8 is a view for explaining surface observation results of a metal frame according to a surface treatment method of the present disclosure.
9 is a view for explaining the height of irregularities on the surface of a metal frame and the depth of a valley according to a surface treatment method.
10 is a view for explaining a difference in height of the surface of a metal frame according to a surface treatment method.
11A is a diagram for explaining particle distribution on the surface of a metal frame according to a surface treatment method.
11B is a diagram for explaining the number of particles per unit area of the surface of the metal frame according to the surface treatment method.
12 is a view for explaining the size of particles on the surface of the metal frame according to the surface treatment method.
FIG. 13 is a view for explaining the square root mean value of the peak density of the surface of the metal frame and the slope inclination value present on the surface according to the surface treatment method.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.

3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

Referring to FIGS. 2 and 3 , the electronic device 101 according to an embodiment has a front side 310A, a back side 310B, and a side surface 310C surrounding a space between the front side 310A and the back side 310B. It may include a housing 310 including a). In another embodiment (not shown), the housing 310 may refer to a structure forming some of the front face 310A of FIG. 2 , the rear face 310B and the side face 310C of FIG. 3 . According to one embodiment, the front surface 310A may be formed by a front plate 302 (eg, a glass plate or a polymer plate including various coating layers) that is substantially transparent at least in part. The rear surface 310B may be formed by the rear plate 311 . The rear plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 310C may be formed by a side bezel structure (or "side member") 318 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer. In some embodiments, the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, glass, a metal material such as aluminum, or ceramic).

In the illustrated embodiment, the front plate 302 includes two first edge regions 310D curved from the front surface 310A toward the rear plate 311 and extending seamlessly, the front plate ( 302) at both ends of the long edge. In the illustrated embodiment (see FIG. 3 ), the rear plate 311 has two second edge regions 310E that are curved from the rear surface 310B toward the front plate 302 and extend seamlessly at both ends of the long edges. can be included in In some embodiments, the front plate 302 (or the rear plate 311) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge regions 310D or the second edge regions 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 101, the side bezel structure 318 has a side that does not include the first edge areas 310D or the second edge areas 310E. A side surface may have a first thickness (or width), and a side surface including the first edge regions 310D or the second edge regions 310E may have a second thickness smaller than the first thickness.

According to an embodiment, the electronic device 101 includes a display 301, audio modules 303, 307, and 314 (eg, the audio module 170 of FIG. 1), and a sensor module (eg, the sensor module of FIG. 1 ). (176)), camera modules 305, 312, 313 (eg, camera module 180 of FIG. 1), a key input device 317 (eg, input module 150 of FIG. 1), and a connector hole ( 308 and 309) (eg, the connection terminal 178 of FIG. 1). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the connector hole 309) or may additionally include other components.

According to one embodiment, the display 301 may be visually exposed, for example, through a substantial portion of the front plate 302 . In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D. In some embodiments, a corner of the display 301 may be substantially identical to an adjacent outer shape of the front plate 302 . In another embodiment (not shown), in order to expand an exposed area of the display 301 , the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.

According to one embodiment, the surface of the housing 310 (or the front plate 302) may include a screen display area formed as the display 301 is visually exposed. For example, the screen display area may include a front surface 310A and first edge areas 310D.

In another embodiment (not shown), a recess or an opening is formed in a portion of a screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301, and the recess Alternatively, at least one of an audio module 314, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 aligned with the opening may be included. In another embodiment (not shown), on the rear surface of the screen display area of the display 301, an audio module 314, a sensor module (not shown), a camera module 305, a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more.

In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. can be placed.

In some embodiments, at least a part of the key input device 317 may be disposed in the first edge areas 310D and/or the second edge areas 310E.

According to one embodiment, the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 . A microphone for acquiring external sound may be disposed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication. In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker). The audio modules 303, 307, and 314 are not limited to the above structure, and may be variously designed according to the structure of the electronic device 101, such as mounting only some audio modules or adding new audio modules.

According to an embodiment, the sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module (not shown) includes, for example, a first sensor module (not shown) (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the front surface 310A of the housing 310 ( Example: a fingerprint sensor), and/or a third sensor module (not shown) (eg HRM sensor) and/or a fourth sensor module (not shown) (eg: fingerprint sensor). In some embodiments (not shown), the fingerprint sensor may be disposed on the rear surface 310B as well as the front surface 310A (eg, the display 301 ) of the housing 310 . The electronic device 101 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor (not shown) may be further included. The sensor module (not shown) is not limited to the above structure, and may be variously designed according to the structure of the electronic device 101 such that only some sensor modules are installed or new sensor modules are added.

According to one embodiment, the camera modules 305, 312, and 313 are, for example, a front camera module 305 disposed on the front side 310A of the electronic device 101, and a rear side disposed on the rear side 310B. A camera module 312 and/or a flash 313 may be included. The camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of electronic device 101 . The camera modules 305 , 312 , and 313 are not limited to the above structure, and may be variously designed according to the structure of the electronic device 101 such that only some camera modules are mounted or new camera modules are added.

According to an embodiment, the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having a different property (eg, angle of view) or function. For example, a plurality of camera modules 305 and 312 including lenses having different angles of view may be configured, and the electronic device 101 is a camera that is performed in the electronic device 101 based on a user's selection. It is possible to control the viewing angles of the modules 305 and 312 to be changed. For example, at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera and at least the other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 305 and 312 may be a front camera, and at least another one may be a rear camera. In addition, the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera). According to one embodiment, the IR camera may operate as at least a part of the sensor module. For example, the TOF camera may operate as at least a part of a sensor module (not shown) for detecting a distance to a subject.

According to one embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included are on the display 301, such as soft keys. It can be implemented in different forms. In some embodiments, the key input device may include a sensor module (not shown) disposed on the rear surface 310B of the housing 310 .

According to one embodiment, a light emitting device (not shown) may be disposed on, for example, the front surface 310A of the housing 310 . A light emitting element (not shown) may provide, for example, state information of the electronic device 101 in the form of light. In another embodiment, a light emitting device (not shown) may provide a light source that interlocks with the operation of the front camera module 305, for example. The light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.

According to one embodiment, the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device. 308, and/or a second connector hole (eg, earphone jack) 309 capable of accommodating a connector for transmitting and receiving an audio signal to and from an external electronic device. The connector holes 308 and 309 are not limited to the above structure, and may be variously designed according to the structure of the electronic device 101, such as mounting only some connector holes or adding new connector holes.

According to an embodiment, the camera module 305 and/or sensor module (not shown) interact with the external environment through designated areas of the display 301 and the front plate 302 in the internal space of the electronic device 101. It can be placed so that it can be touched. For example, the designated area may be an area in the display 301 in which pixels are not arranged. As another example, the designated area may be an area where pixels are arranged in the display 301 . When viewed from the top of the display 301, at least a portion of the designated area may overlap the camera module 305 and/or the sensor module. As another example, some sensor modules may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.

The electronic device 101 disclosed in FIGS. 2 and 3 has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device may be a part of a rollable electronic device or a foldable electronic device. The term "rollable electronic device" means an electronic device capable of bending and deforming the display 301, so that at least a portion of the display 301 can be rolled or rolled and stored inside the housing 310. can do. Depending on the needs of the user, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of the display to the outside. A “foldable electronic device” may refer to an electronic device that can be folded so that two different areas of a display face each other or in directions opposite to each other. In general, in a foldable electronic device in a portable state, a display is folded so that two different areas face each other or in opposite directions, and in actual use, a user unfolds the display so that the two different areas form a substantially flat panel shape can In some embodiments, the electronic device 101 according to various embodiments disclosed in this document may be interpreted as including not only portable electronic devices such as smart phones, but also various other electronic devices such as notebook computers and home appliances. there is.

4 is a diagram illustrating a housing 310 of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to various embodiments of the present disclosure.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIG. 1 ) may include a housing 310 including at least a portion of an electrically conductive material. The housing 310 may be composed of a metallic (eg, aluminum) frame, for example, when combined with an electronic device, the outer surface 330 (or outer frame), which is a portion exposed to the outside, and the outer surface 330 It may include an inner surface 320 (or inner frame) facing the opposite direction of the. The housing 310 shown in FIG. 4 may have substantially the same configuration as the housing 310 described above in FIGS. 2 and 3 . For example, in the housing 310 described above in FIGS. 2 and 3, the front plate portion is omitted, and the side bezel structure and the rear plate may be combined. The appearance of the electronic device may be configured in various ways by adjusting the shape or dimension (eg, length, height, or area) of the housing. Hereinafter, contents overlapping with those described above in FIGS. 2 and 3 may be omitted.

At least a portion of the housing 310 may be formed with an electrically conductive material in order to add beauty to the exterior and/or to utilize the housing 310 as an antenna. As at least a portion of the housing 310 is formed to have an electrically conductive material, the rigidity of the electronic device can be increased.

According to various embodiments, the side member and/or the rear plate included in the housing 310 describe a portion of an electronic device, but are not limited thereto and may be implemented as a detachable structure from the housing 310 of the electronic device. may be For example, the side member and/or the rear plate may be combined with the electronic device to protect the electronic device from external impact or foreign matter.

According to various embodiments, the housing 310 may be referred to by various terms such as 'cover', 'case', 'envelope', 'exterior case', 'accessory case', or 'enclosure'. According to various embodiments, the side member and/or the rear plate included in the housing 310 are not limited to the embodiments mentioned in this document and may be formed in various shapes according to the shape of the electronic device.

According to one embodiment, the surface of the metal frame of the housing 310 may have a soft texture and matte particle feeling.

According to an embodiment, the present disclosure discloses a method of manufacturing a frame of a portable electronic device, but is not limited thereto, and the present invention can be applied to all product groups using metal as an exterior material.

According to an embodiment, the inner surface 320 and the outer surface 330 of the housing 310 may be formed to have the same surface texture and surface particle feeling.

According to an embodiment, an alkaline etching solution containing phosphate may be used to implement surface texture and particle feeling on the housing 310 . Hereinafter, a method of manufacturing the housing 310 using an alkaline etching solution containing phosphate will be described in detail.

5 is a diagram for explaining a method of manufacturing a housing of an electronic device according to an embodiment of the present disclosure.

According to an embodiment, referring to FIG. 5 , in operation 501, a method of manufacturing a housing of an electronic device may prepare an exterior material metal.

For example, a raw material for a housing including a metal frame may be provided. For example, an aluminum plate material used as an exterior or interior material of an electronic device can be used as a raw material of the housing. The aluminum plate may include, for example, 2xxx series alloys, 6xxx series alloys, and/or high-strength 7xxx series alloys, excluding pure aluminum. For example, an aluminum alloy material may include aluminum as a main constituent and copper, magnesium, manganese, silicon, tin, or zinc as a main alloying element.

Next, cutting and joining processes may be performed using the raw material of the housing including the metal frame. Through the cutting process, the housing can be manufactured in the desired shape. The member on which the cutting process is completed proceeds with a bonding process. Here, the bonding process may refer to all chemical and physical treatment processes for bonding the molten resin injected in the injection process to the metal. Metals to which bonding treatment has not been applied may be broken or separated due to lack of bondability with the injection resin, so the bonding process may have to be performed before the injection process. In addition, the resin and the metal may be bonded by injecting the molten resin into the metal frame through the injection process.

According to an embodiment, in operation 502, the method of manufacturing the housing of the electronic device may proceed with polishing the surface of the metal frame.

According to one embodiment, the material on which the injection process is completed may be processed into a desired final shape through a machining process. Here, the machining process may include a polishing process (wet or dry polishing) and a dia-cut process that may be involved in the final external shape of the exterior material in addition to a simple cutting process.

According to an embodiment, the polishing process is performed to achieve high gloss on the surface of a metal frame to be applied to an electronic device, and the polishing method may include a physical polishing (dry/wet polishing) process and/or an electrolytic polishing process. In the polishing process, an electrolytic polishing process may be performed after a physical polishing process is performed. As another example, a physical polishing process may be performed after the electrolytic polishing process. As another example, an alternative of a physical polishing process and an electrolytic polishing process may be performed.

According to an embodiment, the physical polishing may be performed by contacting the rotating polishing equipment to the surface of the metal frame. The physical polishing process may be selectively used in a wet polishing method in which the surface of the metal frame is polished in a wet state or in a dry polishing method in which the surface of the metal frame is polished in a dry state. An electro polishing process may smooth and/or polish the surface of the metal frame by using an anode dissolution phenomenon.

According to an embodiment, in operation 503, the method of manufacturing a housing of an electronic device may include a process of forming surface curvature/gloss after a polishing process (eg, a physical polishing process and/or an electrolytic polishing process). there is. According to an embodiment, the surface curve/gloss forming process may be performed after a physical polishing process or an electrolytic polishing process. For example, the formation of curves/gloss on the surface may mean that irregularities are formed on the surface.

According to an embodiment, the surface waviness/gloss forming process may be performed after the physical polishing process and the electrolysis process are sequentially performed, or may be performed without performing the polishing process.

According to an embodiment, the surface curvature/gloss forming process is performed to implement curvature (eg, roughness) on the surface of a metal frame to be applied to an electronic device, and may include a method of physically applying force such as sandblasting. According to an embodiment, the surface curvature/gloss formation process may include all processes involved in design appearance, such as barrel polishing and hairline method.

According to an embodiment, other processes may be additionally included in addition to the above processes, or some of the above processes may be omitted.

For example, foreign substances such as cutting oil generated in the above-described machining process and light powder generated in the polishing process may be removed through a degreasing process. According to an embodiment, the degreasing process may remove foreign substances present on the surface of the metal frame and at the same time remove an oxide film of metal oxidized in the air. For example, types of degreasing may include an organic solvent method using benzene and/or ethylene, a surfactant method using neutral detergent and/or synthetic detergent, and an acid degreasing method using sulfuric acid and/or nitric acid. there is.

According to an embodiment, in operation 504, a method of manufacturing a housing of an electronic device may implement a texture on a surface of a metal frame by using an alkali etching solution including a phosphate (eg, a chelating agent). For example, a curved metal frame may be immersed in an alkaline etching solution containing phosphate, and a smooth and matte texture may be implemented on the surface of the metal frame.

This is because the phosphate added to the alkaline etching solution acts as a metal ion blockade. When the surface of the metal frame is etched, the phosphate prevents precipitation and reattachment of impurities, induces a uniform reaction on the surface, and forms a soft particle feeling. can According to an embodiment, a reaction of a surface of a metal frame performed in a process of depositing a curved metal frame in an alkali etching solution containing phosphate will be described with reference to FIGS. 6A and 6B.

According to one embodiment, the concentration of the alkaline etching solution may be 1-50%. If the concentration of the alkaline etching solution is less than 1%, the effect of etching is low, and if it is 50% or more, etching cannot be controlled even when phosphate is included in the etching solution, and rough texture may be etched.

According to one embodiment, the alkaline etching solution may include at least one of sodium hydroxide (NaOH), potassium hydroxide (KOH), lithium hydroxide (LiOH), sodium carbonate (Na ₂ CO ₃ ), or sodium phosphate (Na ₃ PO ₄ ). can

According to an embodiment, one alkali etching solution may be used alone, two or more alkali etching solutions may be mixed and used, two or more alkali etching solutions may be used sequentially, or other compounds may be used as the alkali etching solution. An alkaline etching solution with this addition may be used.

According to one embodiment, the concentration of phosphate may be 1 to 50%. When the concentration of phosphate is less than 1%, the effect of preventing precipitation and reattachment of impurities is insignificant, and when the concentration of phosphate is 50% or more, the reaction between the metal frame surface and the alkaline etching solution is suppressed, so that etching is not performed well. You may not be able to get the texture you want.

Preferably, the concentration of phosphate may be between 1 and 30%. When the concentration of the phosphate is within 30%, the control of the etching reaction can be facilitated to obtain a desired texture. For example, if the concentration of phosphate is within 30%, a metal frame having a surface with a desired texture can be obtained by immersing at about 30° C. for about 15 minutes.

According to one embodiment, the phosphate is sodium tripolyphosphate (Na ₅ P ₃ O ₁₀ ), potassium triphosphate (K ₃ PO ₄ ), sodium pyrophosphate (Na ₄ P ₂ O ₇ nH ₂ O) or polyphosphoric acid It may include at least one of potassium (K ₅ P ₃ O ₁₀ ).

내지 80

의 온도에서 수행될 수 있다.According to one embodiment, the process of immersing the curved metal frame in an alkali etching solution containing phosphate is 30

to 80

can be performed at a temperature of

According to one embodiment, the process of depositing the curved metal frame in the alkali etching solution containing phosphate may be performed for 10 seconds to 20 minutes.

According to an embodiment, in operation 505, a method of manufacturing a housing of an electronic device may include an anodizing process. In detail, the anodizing process may include a cleaning operation, an anodizing film formation operation (or anodizing operation), and/or a coloring operation (dyeing).

According to an embodiment, the cleaning operation may include a degreasing process, a chemical polishing process, and a de-smut process. The degreasing process may be performed to clean foreign substances present on the metal surface. At this time, in the degreasing process, acidic or neutral degreasing liquid may be selectively applied according to the process environment and the target material. The chemical polishing process may be performed to planarize the surface of a material whose surface is unevenly treated to reduce diffuse reflection and improve surface gloss. In the chemical polishing process, surface irregularities may be leveled with an acidic solution such as phosphoric acid, sulfuric acid, or nitric acid. The demut process may be performed to remove residues (eg, smut and other foreign matter) on the surface of the material generated from the degreasing process and the chemical polishing process.

Next, an anodizing may be performed on the surface of the metal packaging material to form an anodized film. The operation of forming an anodic oxide film is performed by using at least one or all of electrolyte solutions including sulfuric acid, oxalic acid, phosphoric acid, chromic acid, organic acid (citric acid, acetic acid, propionic acid, tartaric acid), or boric acid. It is possible to prepare a device for accommodating an electrolyte solution containing, and put a housing including a metal frame into the electrolyte solution and provide a predetermined voltage and temperature. In the operation of forming an anodic oxide film, a reaction with oxygen occurs while a voltage is applied to a metal material, and an oxide film having a high density can be formed. For example, the operating voltage can be applied within a range of about 5 to 40V, and the process time may take about 10 minutes to about 2 hours. Process temperature may be all applicable within the range of about 5 ~ 30 ℃.

A coloring operation may be performed after the anodizing operation. The coloring operation may be a process of developing color in an anodized oxide film. For example, as a type of coloring operation, there is a dipping method, an electrolytic coloring method, or an oil painting method. The dipping method is a method of immersing a product in a solution in which a dye is dissolved to realize color from the diffused and adsorbed dye, and the electrolytic coloring method is a method of generating color by applying an electric current after electrolyzing a metal salt electrolyte using a rectifier. can The oil-based method may be a coloring method in which an oxide film is subjected to photosensitization, dried, and then oil-based dye is applied with a brush. Here, dyes of the immersion method include both organic dyes and inorganic dyes, and may be named as an aqueous method in that the dyes of the immersion method are mainly dissolved in water.

According to an embodiment, in operation 506, a method for manufacturing a housing of an electronic device may perform a surface protection treatment that is a post-processing operation of an anodizing process. For example, surface protection treatment may include sealing and post-sealing. The sealing treatment may include both a treatment method including a metal salt and a treatment method using a non-metal salt made of an organic material. This may include hydration sealing treatment using water and steam. The post-sealing treatment may include an elution process for removing metal salts or a hot water washing process for cleaning foreign substances. These post-processing steps may be performed to secure the external stability and reliability of anodized and colored materials. In general, the colored housing may have one color.

According to an embodiment, the surface of the metal frame on which the immersion process is performed in an alkaline etching solution containing phosphate may have a gloss value of 1 to 10 gloss units (Gu). Gloss measurement results according to an embodiment will be described below with reference to FIGS. 7 and 8 .

According to an embodiment, the surface of the metal frame on which the immersion process is performed in an alkaline etching solution containing phosphate has a maximum height of 0.1 to 2.3 μm among a plurality of irregularities disposed on the surface, and a maximum depth of the valleys between the plurality of irregularities. may be 0.1 to 1.8 μm. A result of measuring the height of the irregularities according to an embodiment will be described with reference to FIGS. 9 and 10 below.

According to one embodiment, the surface of the metal frame on which the immersion process is performed in an alkaline etching solution containing phosphate may have 90 to 200 irregularities per unit area of 1 cm ² . According to an embodiment, the number of irregularities per unit area will be described with reference to FIGS. 11A and 11B. According to an embodiment, the average size of irregularities will be described below with reference to FIG. 12 .

According to one embodiment, the surface of the metal frame subjected to the immersion process in an alkaline etching solution containing phosphate has a number of peaks per unit area of 1 mm ² of 37000 to 50000, and the square root of the slope value of the slope of the peak The average value may be between 2500 and 4000. According to an embodiment, the number of peaks and the slope value of the slope of the peak will be described below with reference to FIG. 13 .

According to an embodiment, the surface of the metal frame on which the immersion process is performed in an alkali etching solution containing phosphate may have the same texture as an outer surface and an inner surface.

6A is a view for explaining a process of immersing a metal frame on which a blasting process has been performed in an alkali etching solution including phosphate according to an embodiment of the present disclosure.

According to an embodiment, referring to FIG. 6A , a method of manufacturing a housing of an electronic device includes a process of immersing a metal frame 610 having curved surfaces in an alkaline etching solution 620 containing phosphate through a blasting method. can include

According to an embodiment, etching may be performed on the curved surface of the metal frame by an alkali etching solution. According to an embodiment, the phosphate contained in the alkaline etching solution serves to block metal ions, thereby preventing precipitation and reattachment of impurities. As a result, a uniform reaction is induced on the surface of the metal frame to form a soft particle feeling as shown in FIG. 6B.

6B is a view for explaining a metal frame etched using an alkaline etching solution containing phosphate according to an embodiment of the present disclosure.

According to an embodiment, referring to FIG. 6B , the etched metal frame 611 may include irregularities 612 and 613 whose corners are softened due to a uniform etching reaction of the surface.

According to one embodiment, the maximum height 614 of the irregularities of the etched metal frame 611 may be 0.1 to 2.3 μm. For example, the maximum height 614 of the irregularities may be 2.115 μm. According to an embodiment, the maximum height 614 of irregularities is the largest among heights measured from the center of each irregularity by randomly selecting a set number (eg, 10) of irregularities on the surface of the metal frame 611 after etching. can mean value.

According to one embodiment, the maximum depth 615 of the valley of the etched metal frame 611 may be 0.1 to 1.8 μm. For example, the maximum depth 615 of the valley may be 1.515 μm. According to an embodiment, the maximum depth 615 of the valley is the largest among the depths measured from the center of each unevenness by randomly selecting a set number (eg, 10) of irregularities on the surface of the metal frame 611 after etching. can mean value.

As described above, as the edges of the irregularities become softer and the maximum height of the irregularities and the maximum depth of the valleys decrease, the surface of the metal frame can have a soft texture like microfiber and a matte particle feel.

7 is a view for explaining a surface gloss measurement result of a metal frame according to a surface treatment method. According to one embodiment, FIG. 7 is a measurement of the gloss of a metal frame having a high gloss surface, a sanded metal frame, and a surface of a metal frame etched with an alkaline etching solution containing a phosphate according to the present disclosure.

According to an embodiment, since the gloss value appears differently depending on the surface color, all three metal frames were processed with uncolored (silver) metal frames under the same conditions, and the same points of each metal frame were measured 5 times and averaged. value was calculated.

According to one embodiment, referring to FIG. 7 , the gloss measurement result 710 of the high-gloss metal frame is 228 Gu (Gloss unit), and the gloss measurement result 720 of the sanded metal frame is 28.4 Gu, according to the present disclosure. It can be confirmed that the gloss measurement result 730 of the metal frame is 8.2 Gu. According to one embodiment, Gu is a unit representing the gloss ratio of the surface by light reflection, and the higher the value, the higher the gloss.

This is a level at which the difference in gloss can be confirmed with the naked eye, and it can be confirmed that the metal frame according to the present disclosure has a matte particle feeling.

As shown in FIG. 7 , the reason for the low luster and matte texture of the metal frame according to the present disclosure can be confirmed through the shape of the surface as shown in FIG. 8 .

8 is a view for explaining surface observation results of a metal frame according to a surface treatment method of the present disclosure.

As a comparative example, referring to FIG. 8(a) , it can be seen that the high-gloss metal frame has a flat surface.

As a comparative example, referring to FIG. 8(b) , in the case of the sanded metal frame, it can be seen that partially protruding curves and flat surfaces coexist.

According to an embodiment, referring to FIG. 8(c) , in the case of the metal frame according to the present disclosure, it can be seen that uniform and high-density irregularities are formed on the surface. Referring to this, it can be confirmed that the surface of the metal frame according to the present disclosure has a low gloss and has a soft texture and a matte particle feeling.

9 is a view for explaining the height of irregularities on the surface of a metal frame and the depth of a valley according to a surface treatment method. For example, FIG. 9(a) may show the maximum height Rv of the irregularities, and FIG. 9(b) may show the maximum depth Rp of the valley. According to an embodiment, the maximum height of irregularities and the maximum depth of valleys may mean surface roughness of a metal.

According to a comparative example, referring to FIG. 9(a) , the maximum height 910 of irregularities on the surface of the sanded metal frame is 2.358 μm, and the maximum height 920 of irregularities of the metal frame according to the present disclosure is 2.115 μm. μm can be confirmed.

According to the comparative example, referring to FIG. 9(b) , the maximum depth 930 of the valleys of the surface of the sanded metal frame is 1.953 μm, and the maximum depth 940 of the valleys of the metal frame according to the present disclosure is 1.515 μm. μm can be confirmed.

As such, referring to FIGS. 9(a) and 9(b), compared to the surface roughness of the sanded metal frame according to the comparative example, the surface of the metal frame according to the present disclosure is relatively smooth and smooth. You can check the texture of the feeling.

For this reason, according to the present disclosure, a new texture such as microfiber may be implemented by forming soft irregularities on the surface of the metal frame.

10 is a view for explaining a difference in height of the surface of a metal frame according to a surface treatment method. For example, FIG. 10 (a) shows the difference in height of irregularities on the surface of the metal frame sanded according to the comparative example, and FIG. 10 (b) shows the difference in height between the irregularities on the surface of the metal frame according to the present disclosure. it is shown

According to a comparative example, referring to FIG. 10 (a), the height difference of the irregularities of the surface of the sanded metal frame was 4.3 μm, 3.1 μm, 4.0 μm, and 1.9 μm, which showed an average height difference of 3.1 μm. , Referring to FIG. 10 (b), it can be seen that the height difference of the irregularities of the surface of the metal frame according to the present disclosure is 3.7 μm, 2.7 μm, 1.7 μm, and 1.8 μm, indicating a low height difference of an average of 2.4 μm.

For this reason, referring to the height difference between the irregularities of the surface of the metal frame according to the present disclosure, it can be confirmed that a soft texture is formed by forming a lower curve compared to the conventional sanded metal frame.

11A is a diagram for explaining particle distribution on the surface of a metal frame according to a surface treatment method. For example, FIG. 11A(a) shows a particle distribution on the surface of a sanded metal frame according to a comparative example, and FIG. 11A(b) shows a particle distribution on the surface of a metal frame according to the present disclosure. For example, the particle distribution may represent a distribution of irregularities.

According to a comparative example, referring to FIG. 11a (a), as the particles on the surface of the sanded metal frame are non-uniform in size and large, the number of particles per unit area (1 cm ² ) is small, and the distribution of particles is small. It can be seen that the inhomogeneity of

According to one embodiment, referring to FIG. 11a (b), as the particles on the surface of the metal frame according to the present disclosure are formed in a uniform size and small, the number of particles per unit area is large and the distribution of the particles is uniform can confirm.

11B is a diagram for explaining the number of particles per unit area of the surface of the metal frame according to the surface treatment method.

According to a comparative example, referring to FIG. 11B , the number of particles 1110 per unit area (1 cm ² ) of the sanded metal frame is 60 to 80, and it can be seen that an average of 70 particles are distributed in the unit area.

According to an embodiment, the number of particles 1120 per unit area of the metal frame according to the present disclosure is 90 to 110, and it can be seen that an average of 100 particles is distributed in a unit area.

Referring to this, it can be seen that the metal frame according to the present disclosure has a large number of particles more uniformly distributed in the same area than the existing sanded metal frame, and thus, according to the present disclosure, it is possible to implement a metal frame having a smooth texture. .

12 is a view for explaining the size of particles on the surface of the metal frame according to the surface treatment method. For example, FIG. 12(a) shows the grain size of the surface of the metal frame sanded according to the comparative example, and FIG. 12(b) shows the grain size of the surface of the metal frame according to the present disclosure. .

According to a comparative example, referring to FIG. 12 (a), it can be seen that large particles and small particles are distributed between 73 and 234 μm in particle size on the surface of the sanded metal frame.

According to an embodiment, referring to FIG. 12 (b), since the particle size of the surface of the metal frame according to the present disclosure is distributed between 76 and 142 μm, it can be confirmed that it has a uniform particle feeling. .

As such, the surface of the metal frame according to the present disclosure may provide a matte particle feeling because a large number of small and uniform particles are distributed in the same area.

FIG. 13 is a view for explaining the square root mean value of the peak density of the surface of the metal frame and the slope inclination value present on the surface according to the surface treatment method. For example, FIG. 13 (a) shows the peak density of the surface of the metal frame according to the surface treatment method, and FIG. 13 (b) shows the slope slope value present on the surface of the metal frame according to the surface treatment method It represents the square root mean value. For example, a peak may refer to fine irregularities included in each unevenness of the surface of the metal frame.

According to an embodiment, density of peaks (SPD) may mean the number of peaks per unit area (1 mm ² ).

According to an embodiment, the root mean square gradient_square average of differential data (SPQ) for the slope slope value is the average value of the square root of the slope slope value included in the unit area (1 mm ² ), in case of flat , the value is 0, and as the value increases, it may mean that there are many slopes or bends within a unit area.

According to an embodiment, the square root mean value of the peak density and the slope slope value may indicate a degree of mattness of the surface of the metal frame.

According to one embodiment, referring to FIG. 13 (a), the peak density 1310 per unit area (1 mm ² ) of the sanded metal frame according to the comparative example is 36570, and the unit of the metal frame according to the present disclosure It can be seen that the peak density 1320 per area is 41395.

According to one embodiment, referring to FIG. 13(b) , the average square root value 1330 of the slope inclination value per unit area of the sanded metal frame according to the comparative example is 2217, and the metal frame according to the present disclosure It can be seen that the average square root value 1340 of the slope inclination values per unit area is 3603.

Referring to this, it can be confirmed that the surface of the metal frame according to the present disclosure implements a matte texture by distributing particles having many peaks and a high gradient value within the same area.

According to an embodiment, a method of manufacturing a housing (eg, the housing 310 of FIG. 3 ) of an electronic device (eg, the electronic device 101 of FIG. 1 ) forms curves on a surface of a metal frame through a blasting method. It may include a step of immersing the metal frame in an alkali etching solution containing a process and a phosphate.

According to one embodiment, the concentration of the phosphate may be 1 to 50%.

According to one embodiment, the concentration of the phosphate may be 1 to 30%.

According to one embodiment, the concentration of the alkaline etching solution may be 1-50%.

According to one embodiment, the alkaline etching solution may include at least one of NaOH, KOH, or LiOH.

According to one embodiment, the phosphate may include at least one of sodium tripolyphosphate, potassium triphosphate, sodium pyrophosphate, or potassium polyphosphate.

According to one embodiment, the deposition process may be performed at a temperature of 30 °C to 80 °C.

According to one embodiment, the deposition process may be performed for 10 seconds to 20 minutes.

According to an embodiment, the surface of the metal frame on which the deposition process is performed may have a gloss value of 1 to 10 gloss units (Gu).

According to an embodiment, the surface of the metal frame on which the depositing process is performed has a maximum height of 0.1 to 2.3 μm among a plurality of irregularities disposed on the surface, and a maximum depth of the valleys between the plurality of irregularities of 0.1 to 1.8 μm. can

According to one embodiment, the surface of the metal frame on which the deposition process is performed may have 90 to 200 irregularities per unit area of 1 cm ² .

According to one embodiment, the surface of the metal frame on which the deposition process is performed has a peak number of 37000 to 50000 per unit area of 1 mm ² , and an average value of the square root of the slope of the peak slope is 2500 to 4000 can be

According to one embodiment, the metal frame on which the depositing process is performed may have the same texture on an outer surface and an inner surface.

According to one embodiment, the housing of the electronic device includes a metal frame, a surface of the metal frame has a gloss value of 1 to 10 Gu (gloss unit), and a maximum height of a plurality of irregularities disposed on the surface is 0.1 to 2.3 μm, the maximum depth of the plurality of irregularities between the valleys is 0.1 to 1.8 μm, and the number of irregularities per unit area of 1 cm ² may be 90 to 200.

According to one embodiment, the surface of the metal frame, the number of peaks per unit area of 1mm ² is 37000 to 50000, the average value of the square root of the slope of the slope of the peak may be 2500 to 4000.

According to one embodiment, an outer surface and an inner surface of the metal frame may have the same texture.

According to one embodiment, the metal frame may be immersed in an alkaline etching solution containing phosphate.

According to one embodiment, the concentration of the phosphate may be 1 to 50%.

According to one embodiment, the alkaline etching solution may include at least one of NaOH, KOH, or LiOH.

According to one embodiment, the phosphate may include at least one of sodium tripolyphosphate, potassium triphosphate, sodium pyrophosphate, or potassium polyphosphate.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Claims (20)

A method for manufacturing a housing of an electronic device,
A process of forming curves on the surface of a metal frame through a blasting method; and
A method of manufacturing a housing of an electronic device comprising: immersing the metal frame in an alkaline etching solution containing phosphate.
According to claim 1,
The method of manufacturing a housing of an electronic device wherein the concentration of the phosphate is 1 to 50%.
According to claim 2,
The method of manufacturing a housing of an electronic device wherein the concentration of the phosphate is 1 to 30%.
According to claim 1,
The method of manufacturing a housing of an electronic device wherein the concentration of the alkali etching solution is 1-50%.
According to claim 1,
The alkaline etching solution,
A method of manufacturing a housing of an electronic device comprising at least one of NaOH, KOH or LiOH.
According to claim 1,
The phosphate is
A method of manufacturing a housing of an electronic device comprising at least one of sodium tripolyphosphate, potassium triphosphate, sodium pyrophosphate, or potassium polyphosphate.
According to claim 1,
The deposition process is
A method of manufacturing a housing of an electronic device performed at a temperature of 30 ° C to 80 ° C.
According to claim 1,
The deposition process is
A method of manufacturing a housing of an electronic device performed for 10 seconds to 20 minutes.
According to claim 1,
The surface of the metal frame on which the deposition process was performed,
A method of manufacturing a housing of an electronic device having a gloss value of 1 to 10 gloss units (Gu).
According to claim 1,
The surface of the metal frame on which the deposition process was performed,
A method of manufacturing a housing of an electronic device, wherein a maximum height of a plurality of irregularities disposed on a surface is 0.1 to 2.3 μm, and a maximum depth of a valley between the plurality of irregularities is 0.1 to 1.8 μm.
According to claim 1,
The surface of the metal frame on which the deposition process was performed,
A method of manufacturing a housing of an electronic device in which the number of irregularities per unit area of 1 cm ² is 90 to 200.
According to claim 1,
The surface of the metal frame on which the deposition process was performed,
A method of manufacturing a housing of an electronic device, wherein the number of peaks per unit area of 1 mm ² is 37000 to 50000, and the average value of the square root of the slope of the peak is 2500 to 4000.
According to claim 1,
The metal frame on which the deposition process is performed,
A method of manufacturing a housing of an electronic device having an outer surface and an inner surface having the same texture.
In the housing of the electronic device,
including a metal frame;
The surface of the metal frame,
It has a gloss value of 1 to 10 Gu (gloss unit),
The maximum height of the plurality of irregularities disposed on the surface is 0.1 to 2.3 μm, the maximum depth of the plurality of irregularities between the valleys is 0.1 to 1.8 μm,
An electronic device housing having 90 to 200 irregularities per unit area of 1 cm ² .
According to claim 14,
The surface of the metal frame,
The housing of an electronic device, wherein the number of peaks per unit area of 1 mm ² is 37000 to 50000, and the average value of the square root of the slope of the peak is 2500 to 4000.
According to claim 14,
The metal frame,
A housing for an electronic device that has the same textured exterior and interior surfaces.
According to claim 14,
The metal frame,
A housing of an electronic device, wherein a process of immersing in an alkali etching solution containing phosphate has been performed.
According to claim 17,
The housing of the electronic device, wherein the concentration of the phosphate is 1 to 50%.
According to claim 17,
The alkaline etching solution,
A housing of an electronic device comprising at least one of NaOH, KOH or LiOH.
According to claim 17,
The phosphate is
A housing of an electronic device comprising at least one of sodium tripolyphosphate, potassium triphosphate, sodium pyrophosphate or potassium polyphosphate.

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