KR20240038638A - Electronic device including housing - Google Patents

Abstract

In an electronic device including a housing according to various embodiments of the present disclosure, the housing includes an aluminum substrate, a first region having a first thickness, and a second region having a second thickness thinner than the first thickness; , It may include a thermal spray coating layer formed on the aluminum substrate, an oxide layer formed on the spray coating layer or the aluminum substrate, and a vapor deposition layer formed on at least a portion of the thermal spray coating layer.

Description

Electronic device including housing {ELECTRONIC DEVICE INCLUDING HOUSING}

One embodiment of the present invention relates to an electronic device including a housing.

Thanks to the remarkable development of information and communication technology and semiconductor technology, the distribution and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed so that they can be carried and used for communication.

Additionally, electronic devices can output stored information as sound or video. As the degree of integration of electronic devices increases and high-speed, high-capacity wireless communication becomes more common, recently, various functions can be installed in a single electronic device such as a mobile communication terminal. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, schedule management, and electronic wallet functions are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can conveniently carry them.

Recently, as the miniaturization, thinness, and portability of portable electronic devices such as smart phones have been emphasized, research is continuously being conducted to make the appearance of electronic devices more attractive in terms of design.

In an electronic device including a housing according to an embodiment of the present disclosure, the housing includes an aluminum substrate, a first region having a first thickness, and a second region having a second thickness thinner than the first thickness; , It may include a thermal spray coating layer formed on the aluminum substrate, an oxide layer formed on the spray coating layer or the aluminum substrate, and a vapor deposition layer formed on at least a portion of the thermal spray coating layer.

In the method of manufacturing a housing for an electronic device according to an embodiment of the present disclosure, a first process of forming a thermal spray coating layer by thermal spray coating on an aluminum substrate, a second process of polishing the thermal spray coating layer, and at least one of the thermal spray coating layers. A portion is processed using a laser, and the sprayed coating layer is manufactured to include a first region having a first thickness and a second region having a second thickness thinner than the first thickness. A third process is oxidized through an anodic oxidation process. It may include a fourth process of forming a coating layer, a fifth process of forming a deposition coating layer through a deposition process, and a sixth process of processing at least a portion of the deposition coating layer through a laser.

1 is a block diagram of an electronic device in a network environment, according to an embodiment of the present disclosure.
Figure 2 is a front perspective view of an electronic device, according to an embodiment of the present disclosure.
3 is a rear perspective view of an electronic device, according to an embodiment of the present disclosure.
Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
Figure 5 is a cross-sectional view schematically showing a cross-section of a housing according to an embodiment of the present disclosure.
Figure 6 is a flowchart for explaining a method of manufacturing a housing according to an embodiment of the present disclosure.
Figure 7 is a diagram for explaining a first process step in the manufacturing method of a housing according to an embodiment of the present disclosure.
Figure 8 is a diagram for explaining a second process step in the manufacturing method of a housing according to an embodiment of the present disclosure.
Figure 9 is a diagram for explaining a third process step in the manufacturing method of a housing according to an embodiment of the present disclosure.
Figure 10a is a diagram showing the difference in brightness according to the difference in thickness of the thermal spray coating layer, according to an embodiment of the present disclosure.
Figure 10b is a diagram showing the difference in gloss according to the difference in laser processing thickness, according to an embodiment of the present disclosure.
FIG. 11 is a diagram for explaining a fourth process step in the housing manufacturing method according to an embodiment of the present disclosure.
FIG. 12 is a diagram for explaining the fifth process step in the housing manufacturing method according to an embodiment of the present disclosure.
Figure 13 is a diagram showing the final housing according to an embodiment of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 is a main processor 121 (e.g., a central processing unit or an application processor), or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit) that can operate independently or together with the main processor 121. (NPU; neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g. : Sound can be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 to an external electronic device (eg, the electronic device 102) directly or wirelessly. According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 is a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). can support the establishment of and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It can communicate with external electronic devices through telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. In this document, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are software (e.g., a program) that includes one or more instructions stored in a storage medium (e.g., internal memory or external memory) that can be read by a machine (e.g., an electronic device). It can be implemented as: For example, a processor (eg, processor) of a device (eg, electronic device) may call at least one instruction among one or more instructions stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Figure 2 is a front perspective view of the electronic device 101, according to an embodiment of the present disclosure. Figure 3 is a rear perspective view of the electronic device 101, according to an embodiment of the present disclosure.

2 and 3, the electronic device 101 according to one embodiment includes a first side (or front) 310A, a second side (or back) 310B, and a first side 310A and It may include a housing 310 including a side 310C surrounding the space between the second surfaces 310B. In another embodiment (not shown), housing 310 may refer to a structure that forms some of the first side 310A, second side 310B, and side surface 310C of FIG. 2 . According to one embodiment, the first surface 310A may be formed at least in part by a substantially transparent front plate 302 (eg, a glass plate including various coating layers, or a polymer plate). The second surface 310B may be formed by a substantially opaque back plate 311. The back plate 311 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be. The side 310C combines with the front plate 302 and the back plate 311 and may be formed by a side bezel structure (or “side member”) 318 comprising metal and/or polymer. In some embodiments, the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, a metallic material such as aluminum).

In the illustrated embodiment, the front plate 302 has two first regions 310D that are curved and extend seamlessly from the first surface 310A toward the rear plate 311. It can be included at both ends of the long edge of (302). In the illustrated embodiment (see FIG. 3), the rear plate 311 is curved from the second surface 310B toward the front plate 302 and has two second regions 310E extending seamlessly with long edges. It can be included at both ends. In some embodiments, the front plate 302 (or the rear plate 311) may include only one of the first areas 310D (or the second areas 310E). In another embodiment, some of the first areas 310D or the second areas 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 101, the side bezel structure 318 has a side bezel structure 318 that does not include the first regions 310D or the second regions 310E. It may have a first thickness (or width) and a second thickness that is thinner than the first thickness on the side surface including the first areas 310D or the second areas 310E.

According to one embodiment, the electronic device 101 includes a display 301, an audio module 303, 307, and 314, a sensor module 304, 316, and 319, a camera module 305, 312, and 313, and a key input. It may include at least one of the device 317, the light emitting element 306, and the connector holes 308 and 309. In some embodiments, the electronic device 101 may omit at least one of the components (eg, the key input device 317 or the light emitting device 306) or may additionally include another component.

According to one embodiment, the display 301 may be exposed, for example, through a significant portion of the front plate 302. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 that forms the first area 310D of the first surface 310A and the side surface 310C. In some embodiments, the edges of the display 301 may be formed to be substantially the same as the adjacent outer shape of the front plate 302. In another embodiment (not shown), in order to expand the area where the display 301 is exposed, the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be formed to be substantially the same.

In another embodiment (not shown), a recess or opening is formed in a portion of the screen display area of the display 301, and an audio module 314 and a sensor are aligned with the recess or opening. It may include at least one of a module 304, a camera module 305, and a light emitting device 306. In another embodiment (not shown), an audio module 314, a sensor module 304, a camera module 305, a fingerprint sensor 316, and a light emitting element 306 are located on the back of the screen display area of the display 301. ) may include at least one of the following. In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed. In some embodiments, at least a portion of the sensor modules 304, 319, and/or at least a portion of the key input device 317 are located in the first regions 310D and/or the second regions 310E. can be placed in the field.

According to one embodiment, the audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314. A microphone for acquiring external sound may be placed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for calls. In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (e.g., piezo speaker).

According to one embodiment, the sensor modules 304, 316, and 319 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 101 or the external environmental state. Sensor modules 304, 316, 319 may include, for example, a first sensor module 304 (e.g., a proximity sensor) and/or a second sensor module (e.g., a proximity sensor) disposed on the first side 310A of the housing 310. (not shown) (e.g., fingerprint sensor), and/or a third sensor module 319 (e.g., HRM sensor) and/or fourth sensor module 316 disposed on the second side 310B of the housing 310. ) (e.g., a fingerprint sensor) may be included. The fingerprint sensor may be disposed on the first side 310A (eg, display 301) as well as the second side 310B of the housing 310. The electronic device 101 includes sensor modules not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 304.

According to one embodiment, the camera modules 305, 312, and 313 include a first camera device 305 disposed on the first side 310A of the electronic device 101, and a second camera device 305 disposed on the second side 310B. It may include a second camera device 312 and/or a flash 313. The camera modules 305 and 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle and a telephoto lens) and image sensors may be placed on one side of the electronic device 101.

According to one embodiment, the key input device 317 may be disposed on the side 310C of the housing 310. In other embodiments, the electronic device 101 may not include some or all of the key input devices 317 mentioned above, and the key input devices 317 not included may be other than soft keys on the display 301. It can be implemented in the form In some embodiments, the key input device 317 may include a sensor module 316 disposed on the second side 310B of the housing 310.

According to one embodiment, the light emitting device 306 may be disposed on, for example, the first surface 310A of the housing 310. For example, the light emitting device 306 may provide status information of the electronic device 101 in the form of light. In another embodiment, the light emitting device 306 may provide a light source that is linked to the operation of the camera module 305, for example. The light emitting device 306 may include, for example, an LED, an IR LED, and a xenon lamp.

According to one embodiment, the connector holes 308 and 309 include a first connector hole 308 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, And/or may include a second connector hole (eg, earphone jack) 309 that can accommodate a connector for transmitting and receiving audio signals to and from an external electronic device.

Figure 4 is an exploded perspective view of the electronic device 101 according to an embodiment of the present disclosure.

Referring to FIG. 4, the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 4) includes a side bezel structure 331, a first support member 332 (e.g., a bracket), and a front plate. (320), display 330, printed circuit board 340, battery 350, second support member 360 (e.g. rear case), antenna 370, and rear plate 380. there is. In some embodiments, the electronic device 101 may omit at least one of the components (e.g., the first support member 332 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 4 or 5, and overlapping descriptions will be omitted below.

According to one embodiment, the first support member 332 may be disposed inside the electronic device 101 and connected to the side bezel structure 331, or may be formed integrally with the side bezel structure 331. The first support member 332 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material. The first support member 332 may have a display 330 coupled to one side and a printed circuit board 340 to the other side. The printed circuit board 340 may be equipped with a processor, memory, and/or interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. For example, the interface may electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.

According to one embodiment, the battery 350 is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed, for example, on substantially the same plane as the printed circuit board 340 . The battery 350 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.

According to one embodiment, the antenna 370 may be disposed between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna 370 may perform short-distance communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, an antenna structure may be formed by part or a combination of the side bezel structure 331 and/or the first support member 332.

According to an embodiment of the present disclosure, an electronic device may include a plurality of antenna modules 390. For example, some of the plurality of antenna modules 390 may be implemented to transmit and receive radio waves with different characteristics (tentatively referred to as radio waves in A and B frequency bands) to implement MIMO. As another example, some of the plurality of antenna modules 390 simultaneously transmit and receive radio waves with the same characteristics (tentatively referred to as radio waves of A1 and A2 frequencies in the A frequency band) to implement diversity. It can be set to do so. As another example, some of the plurality of antenna modules 390 are configured to simultaneously transmit and receive radio waves with the same characteristics (tentatively referred to as radio waves of B1 and B2 frequencies in the B frequency band) to implement diversity. can be set. In one embodiment of the present invention, it may include two antenna modules, but in another embodiment of the present invention, the electronic device 101 may include four antenna modules to simultaneously implement MIMO and diversity. . In another embodiment, the electronic device 101 may include only one antenna module 390.

According to one embodiment, in consideration of the transmission and reception characteristics of radio waves, when one antenna module is disposed at the first position of the printed circuit board 340, the other antenna module is positioned at the first position of the printed circuit board 340. It may be placed in a second location separated from the location. As another example, one antenna module and another antenna module may be arranged considering the mutual separation distance according to diversity characteristics.

According to one embodiment, at least one antenna module 390 may include a wireless communication circuit that processes radio waves transmitted and received in an ultra-high frequency band (e.g., 6 GHz or higher, 300 GHz or lower). The conductive plate of the at least one antenna module 390 may be, for example, made of a patch-type radiation conductor or a conductive plate of a dipole structure extending in one direction, and a plurality of the conductive plates are arrayed to form an antenna array. can do. A chip (e.g., integrated circuit chip) on which part of the wireless communication circuit is implemented may be placed on one side of the area where the conductive plate is placed or on a side facing in the opposite direction to the side where the conductive plate is placed, and may be a printed circuit. It can be electrically connected to the conductive plate through a patterned wiring.

According to one embodiment, the electronic device 101 includes a housing 310, a support member (e.g., a first support member 332 and/or a second support member 360), a side bezel structure 331, and a front plate. At least one of 320 and/or back plate 380 may at least partially include a metallic material. For example, the electronic device 101 includes a housing 310, a support member (e.g., a first support member 332 and/or a second support member 360), a side bezel structure 331, and a front plate 320. ) and/or at least a portion of the back plate 380 may be manufactured by the housing manufacturing process 10 of FIG. 6, which will be described later. In the depicted embodiment, a housing 310, a support member (e.g., a first support member 332 and/or a second support member 360), a side bezel structure 331, a front plate 320, and/or The rear plate 380 may be at least partially visible from the outside of the electronic device 101 .

Figure 5 is a cross-sectional view schematically showing the cross-section of the housing 400 according to an embodiment of the present disclosure.

Referring to FIG. 5 , the housing 400 of the electronic device 101 may include an aluminum substrate 410, a thermal spray coating layer 420, an oxide layer 430, and a vapor deposition layer 440. Referring to FIG. 5 , the configuration of the housing 400 may be completely or partially the same as the configuration of the housing 310 of FIGS. 2 to 4 . The structure of Figure 5 may be selectively combined with the structure of Figures 2 to 4.

According to Figure 5, a spatial coordinate system defined by the Z axis is shown. Here, the Z-axis may represent the thickness direction of the housing 400.

According to one embodiment, the housing 400 of the electronic device may refer to a structure forming some of the first side 310A, the second side 310B, and the side surface 310C in FIGS. 2 and 3. there is. For example, the housing 400 of an electronic device may refer to a structure that forms part of the second side (or back side) 310B of FIG. 2 . According to one embodiment, the housing 400 may be formed by a substantially opaque back plate (eg, back plate 311 in FIG. 2). The back plate may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. . The back plate may be formed, for example, by metal (eg aluminum, stainless steel (STS), or magnesium). The back plate may be formed by aluminum metal, for example.

According to one embodiment, the housing 400 may include a metal substrate. The metal substrate may include, for example, a metal material such as aluminum, stainless steel, titanium, or magnesium.

According to a typical electronic device, the housing may be formed by a highly glossy metal material. The high-gloss metal material may be, for example, a metal such as titanium (Ti) or stainless steel (STS). Highly glossy metal materials such as titanium (Ti) and stainless steel (STS) have high rigidity and may be difficult to machine. High-gloss metal materials are heavy and difficult to process, which increases production costs and may limit the implementation of various exterior textures.

According to general electronic devices, high-gloss metal materials can be directly used and processed such as deposition or anodization to realize various exterior textures. For this purpose, materials can be processed, powder metallurgy using powder, or 3D printing technology can be used. However, when using a high-gloss metal material directly, the material price is high due to the nature of the material, and processing is difficult, resulting in high processing costs. When anodizing processing is performed, the film thickness is formed to be thin (e.g., within micro) due to aluminum (Al2O3), making it difficult to use for the exterior of electronic devices. When performing anodizing, the color of the surface may not be uniform due to differences in the thickness of the oxide film.

According to general electronic devices, high-gloss metal materials can be directly processed using tools to realize various exterior textures. However, the depth or thickness of the housing surface must depend on the shape of the tool and there may be limitations in length.

According to general electronic devices, chemical etching can be applied to the surface of a housing made of high-gloss metal to create various exterior textures. However, in this case, it is not possible to control depth depending on location, which may limit the implementation of colorful textures.

According to general electronic devices, surface texture can be realized through physical collision with the housing surface of a high-gloss metal material in order to realize various exterior textures. However, in this case, the shape of the surface may be limited.

According to one embodiment of the present invention, the housing 400 may include an aluminum substrate 410. The housing 400 may include aluminum instead of high-gloss metal such as titanium or stainless steel, which is difficult to process and has limited post-processing. The aluminum substrate 410 is generally used in the housing 400 of electronic devices, and may have a low specific gravity. The aluminum substrate 410 can be easily processed and post-processed such as deposition or anodization.

According to one embodiment, the housing 400 includes a thermal spray coating layer 420, an oxide film layer 430, and a vapor deposition film layer ( 440) may further be included.

According to one embodiment, the spray coating layer 420 may be disposed on the aluminum substrate 410. According to one embodiment, the thermal spray coating layer 420 may be composed of a plurality of regions with different thicknesses to implement a desired design shape. According to one embodiment, the thermal spray coating layer 420 includes a first region 421 having a first thickness t1 and a second region 422 having a second thickness t2 thinner than the first thickness t1. It can be included. For example, the first thickness t1 may be approximately 5 μm or more and 15 μm or less. For example, the first thickness t1 may be approximately 10㎛. For example, the second thickness t2 may be approximately 5 μm or less. For example, the second thickness t2 may be approximately 3 μm or less. According to one embodiment, the thickness difference between the first area 421 and the second area 422 may be, for example, approximately 1 μm or more and 5 μm or less. According to one embodiment, a thermal spray coating layer 420 may be formed on the aluminum substrate 410. In general electronic devices, the thermal spraying process is used to shield the surface or prevent oxidation when rust or cracks occur and strength is weakened. According to one embodiment of the present invention, a thermal spray coating layer 420 is formed on the housing 400 to create an external surface similar to titanium or stainless steel. The thermal spray coating layer 420 is formed on the housing 400 to achieve a gloss similar to titanium or stainless steel.

According to one embodiment, the oxide film layer 430 may be disposed on the spray coating layer 420 or the aluminum substrate 410. According to one embodiment, the oxide film layer 430 may be formed on the aluminum substrate 410. According to one embodiment, the thickness t3 of the oxide film layer 430 may be, for example, approximately 7 μm or more and 10 μm or less. The thickness t3 of the oxide film layer 430 may be, for example, approximately 8 μm. According to one embodiment, an oxide film layer 430 is formed on the housing 400 to create a new texture and color with depth.

According to one embodiment, the deposition coating layer 440 may be formed on the spray coating layer 420. The deposition coating layer 440 may be formed on at least a portion of the spray coating layer 420 . The deposition coating layer 440 may be formed on the first region 421 of the thermal spray coating layer 420. According to one embodiment, the deposition film layer 440 may be formed on the oxide film layer 430. According to one embodiment, the thickness T4 of the deposition coating layer 440 may be formed to be thin. For example, the thickness t4 of the deposition coating layer 440 may be approximately 2 μm or less. The thickness t4 of the deposition coating layer 440 may be, for example, approximately 1 μm. According to one embodiment, corrosion of the thermal spray coating layer 420 can be prevented by forming a vapor deposition layer 440 on the thermal spray coating layer 420. According to one embodiment, a desired color can be realized by forming a vapor deposition layer 440 on the spray coating layer 420. According to one embodiment, as the deposition coating layer 440 is formed on a portion of the housing 400, various designs and pattern shapes can be implemented.

FIG. 6 is a flowchart for explaining a manufacturing method of the housing 400 according to an embodiment of the present disclosure. FIG. 7 is a diagram for explaining the first process (S10) step in the manufacturing method of the housing 400 according to an embodiment of the present disclosure. FIG. 8 is a diagram for explaining the second process (S20) step in the manufacturing method of the housing 400 according to an embodiment of the present disclosure. FIG. 9 is a diagram for explaining the third process (S30) step in the manufacturing method of the housing 400 according to an embodiment of the present disclosure. FIG. 10A is a diagram showing the difference in brightness according to the difference in thickness of the thermal spray coating layer 420, according to an embodiment of the present disclosure. Figure 10b is a diagram showing the difference in gloss according to the difference in laser processing thickness, according to an embodiment of the present disclosure. FIG. 11 is a diagram for explaining the fourth process (S40) step of the manufacturing method of the housing 400 according to an embodiment of the present disclosure. FIG. 12 is a diagram for explaining the fifth process (S50) step of the manufacturing method of the housing 400 according to an embodiment of the present disclosure. FIG. 13 is a diagram for explaining the sixth process step (S60) in the manufacturing method of the housing 400 according to an embodiment of the present disclosure.

6 to 13 , the housing 400 of the electronic device 101 may include an aluminum substrate 410, a thermal spray coating layer 420, an oxide layer 430, and a vapor deposition layer 440. 6 to 13, the configuration of the housing 400, the aluminum substrate 410, the sprayed coating layer 420, the oxide layer 430, and the deposition layer 440 are the same as those of the housing 400 of FIG. 5, All or part of the configuration of the aluminum substrate 410, the sprayed coating layer 420, the oxide layer 430, and the vapor deposition layer 440 may be the same. The structures of FIGS. 6 to 13 may be selectively combined with the structure of FIG. 5 .

According to Figures 6 to 13, a spatial coordinate system defined by the Z axis is shown. Here, the Z-axis may represent the thickness direction of the housing 400.

According to one embodiment, when referring to FIG. 6, the manufacturing method of the housing 400 includes a first process (S10) of thermal spray coating on the aluminum substrate 410, A second process (S20) of polishing the thermal spray coating layer 420 formed on the thermal spray coating layer 420, a third process (S30) of processing at least a portion of the thermal spray coating layer 420 using a laser, and oxidation through an anodic oxidation process. A fourth process (S40) of forming the coating layer 430, a fifth process (S50) of forming the deposition coating layer 440 through a deposition process, and processing at least a portion of the deposition coating layer 440 using a laser. It may include a sixth process (S60). However, in the manufacturing method of the housing 400, at least one of the processes may be omitted or one or more other processes may be added.

According to one embodiment, the housing 400 may use an aluminum (Al) substrate. Aluminum metal can be widely used in exterior materials for electronic devices.

According to one embodiment, when referring to FIGS. 6 and 7, the first process (S10) of forming the spray coating layer 420 on the aluminum substrate 410 through thermal spray coating may be performed. . Thermal spray coating may be performed on the surface of the aluminum substrate 410. For example, plasma thermal spray coating may be performed on the surface of the aluminum substrate 410. The first process (S10) uses gas, plasma, or a laser to obtain specific properties by injecting powder or wire-type spraying material into a spraying device that generates a high-temperature heat source, colliding with and laminating the base material surface at high speed, and thermalizing. This may be a process of forming the coating layer 420. Recently, for example, it has been widely used as thermal barrier coating in the aviation field. The spray material for plasma thermal spray coating may be, for example, metal, non-metal, or ceramic. In the first process (S10), a coating material in the form of a powder or rod having specific properties required for the surface is melted or semi-melted using various heat sources such as plasma in an air or vacuum atmosphere, and then sprayed at high speed to form a thermal spray coating layer 420. It may be a surface processing method to form a . The coating material may be, for example, titanium dioxide (TiO2) in powder form. For example, the surface of the aluminum substrate 410 may be coated with titanium dioxide (TiO2) thermal spray powder.

According to one embodiment, the thickness (t1-1) of the thermal spray coating layer 420 formed through the first process (S10) may be, for example, approximately 200 ㎛ or more and 500 ㎛ or less. Considering processing time and/or processing cost, the thickness of the thermal spray coating layer 420 formed through thermal spray coating may preferably be, for example, approximately 400 μm or less.

According to one embodiment, a thermal spray coating layer 420 may be formed on the aluminum substrate 410. In general electronic devices, the thermal spraying process is used to shield the surface or prevent oxidation when rust or cracks occur and strength is weakened. According to one embodiment of the present invention, a thermal spray coating layer 420 is formed on the housing 400 to create an external surface similar to titanium or stainless steel. The thermal spray coating layer 420 is formed on the housing 400 to achieve a gloss similar to titanium or stainless steel.

According to one embodiment, when referring to FIGS. 6 and 8 , a second process (S20) of polishing the thermal spray coating layer 420 formed on the aluminum substrate 410 may be performed. According to one embodiment, the second process (polishing process) (S20) may be performed to smoothly polish the surface of the spray coating layer 420. The surface of the thermal spray coating layer 420 can be finished through the second process (polishing process) (S20). The second process (polishing process) (S20) is to polish the surface using an abrasive, or, if the thickness of the abrasive is thick, process the surface of the thermal spray coating layer 420 using a cutting tool and then process the surface with an abrasive. You can.

According to one embodiment, the thickness (t1-2) of the thermal spray coating layer 420 processed through the second process (S20) may be, for example, approximately 10 μm or more and 30 μm or less. The thickness (t1-2) of the spray coating layer 420 processed through the second process (S20) may be, for example, approximately 20㎛. However, in the manufacturing method of the housing 400, the second process (S20) may be omitted depending on implementation conditions and design methods.

According to one embodiment, when referring to FIGS. 6 and 9 , a third process (laser process) (S30) of processing at least a portion of the spray coating layer 420 using a laser may be performed. The third process (laser process) (S30) may be performed to implement a desired design shape on the polished housing 400. In order to implement a desired design shape on the housing 400, at least a portion of the thermal spray coating layer 420 may be locally processed with a laser to form a plurality of regions with different thicknesses. Differences in thickness cause differences in color brightness, allowing the desired design shape to be realized.

According to one embodiment, after the third process (laser process) (S30), the thermal spray coating layer 420 includes a first region 421 having a first thickness t1 and a second thickness thinner than the first thickness t1 ( It may include a second area 422 having t2). For example, the first thickness t1 may be approximately 5 μm or more and 15 μm or less. For example, the first thickness t1 may be approximately 10㎛. For example, the second thickness t2 may be approximately 5 μm or less. For example, the second thickness t2 may be approximately 3 μm or less. Laser equipment may differ depending on the cutting thickness. For example, if the cutting thickness is less than 1㎛, UV Laser can be used. For example, if the cutting thickness is approximately 1㎛ or more to 5㎛, IR Laser can be used. According to one embodiment, the thickness difference between the first area 421 and the second area 422 may be, for example, approximately 1 μm or more and 5 μm or less.

According to one embodiment, the second thickness t2 may include 0㎛. The thermal spray coating layer 420 may consist only of a first region 421 having a first thickness t1 formed on at least a portion of the aluminum substrate 410.

According to one embodiment, referring to FIG. 10A, this is a photo comparing the difference in brightness according to the difference in cutting thickness between the first area 421 and the second area 422. Figure 10a (a) shows the brightness difference when the thickness difference between the first thickness t1 of the first area 421 and the second thickness t2 of the second area 422 is approximately 1 μm or less. Figure 10a(b) shows the brightness difference when the thickness difference between the first thickness t1 of the first area 421 and the second thickness t2 of the second area 422 is approximately 1㎛ or more and 3㎛ or less. indicated. Figure 10a(c) shows the brightness difference when the cutting thickness difference between the first thickness t1 of the first area 421 and the second thickness t2 of the second area 422 is 3㎛ or more and 5㎛ or less. indicated. As you go from (a) to (c), you can see that the thickness difference is large and the brightness difference is large and clear.

According to one embodiment, referring to FIG. 10B, this is a photograph comparing the difference in glossiness (value) according to the difference in laser processing thickness of the first area 421 and the second area 422. The first thickness t1 of the first region 421 in (a) and (b) of FIG. 10B may be the same. The glossiness of the first area 421 in (a) and (b) of FIG. 10B may be 0.8. The second thickness t2 of the second region 422 in (a) and (b) of FIGS. 10B may be different, and a difference in gloss may appear accordingly. The second thickness t2 of the second region 422 may be relatively thicker in (b) than in (a). The glossiness of the second area 422 in (a) may be 25. The glossiness of the second area 422 in (b) of FIG. 10B may be 17. The difference between the glossiness of the second area 422 and the first area 421 may be greater in (a) of FIG. 10B where the thickness difference is relatively large than in (b) where the thickness difference is relatively small.

According to one embodiment, referring to FIG. 11 , the fourth process (S40) of forming the oxide film layer 430 through an anodizing process may be performed. Through the fourth process (S40), new textures and deep colors can be realized. According to one embodiment, the oxide film layer 430 may be formed on the spray coating layer 420 and/or the aluminum substrate 410. According to one embodiment, the oxide film layer 430 may be formed on the aluminum substrate 410. According to one embodiment, anodizing may be performed on the first region 421 of the thermal spray coating layer 420 and the second region 422 whose thickness is different from the first region 421. For manufacturing convenience, anodizing may be performed on the oxide film layer 430 and the aluminum substrate 410, but the oxide film layer 430 formed on the aluminum substrate 410 is actually meaningful. Anodizing refers to anodizing, and can be a process of electrochemically creating an oxide film on the metal to be plated using an anode. For example, it can be widely used for post-processing of aluminum surfaces. The anodizing process can be largely divided into a pre-treatment step, anodizing step, coloring step, and post-treatment step. However, each step of the anodizing process may be omitted as needed.

According to one embodiment, the pretreatment step may include processes such as a degreasing process and a dismut process. The degreasing process can be performed to remove contaminants such as stains on the product. The degreasing process can selectively apply acidic or neutral degreasing liquid depending on the situation. The dismut process may be performed to remove smut and foreign substances on the surface of the material generated from the degreasing process.

According to one embodiment, after the pretreatment step, the surface of the aluminum substrate 410 may be anodized. In the anodizing step, a voltage is applied to the aluminum substrate 410 to cause a reaction with oxygen, forming a high-density oxide film. The anodizing film can grow vertically depending on the shape of the raw material. For example, in the case of high-gloss surfaces, the film can also grow flat.

According to one embodiment, after anodizing treatment, a coloring process may be performed. The coloring process may be a process of developing color on the anodized oxide film. The coloring process may include processes such as dipping, electrolytic coloring, and/or oil-based coloring. The immersion method may be a method of implementing color from the diffused and adsorbed dye by immersing the product in a solution in which the dye is dissolved. Electrolytic coloring may be a method of producing color by applying electric current in a metal salt electrolyte solution. The oil-based method may be a coloring method in which the oxide film is photosensitive, dried, and then oil-based dye is applied with a brush. Types of dyes in the immersion method may include both organic dyes and inorganic dyes, and the dyes in the immersion method are mainly dissolved in water, so it can also be called an aqueous method. The desired color can be achieved through the coloring process.

According to one embodiment, a post-processing step may be performed after the coloring process. In the post-processing step, film sealing treatment and sealing post-processing can be performed. The sealing treatment may include a treatment method including a metal salt, a non-metal salt treatment method made of organic matter, and a hydration sealing treatment method using water and water vapor. Post-sealing treatment may include an elution process to remove metal salts and a hot water washing process to wash foreign substances. Post-treatment steps can be carried out to ensure the appearance stability and reliability of anodized and colored materials.

According to one embodiment, the thickness t3 of the oxide film layer 430 formed through the fourth process (S40) may be, for example, approximately 7 μm or more and 10 μm or less. The thickness t3 of the oxide film layer 430 may be, for example, approximately 8 μm.

According to one embodiment, when referring to FIG. 12, a fifth process (S50) of forming the deposition coating layer 440 through a deposition process may be performed. The deposition process is a process of heating and/or evaporating metal in a vacuum and coating the vapor as a thin film on the surface of an object. In general, the deposition process can be used to form coatings for lenses, electronic components, or semiconductors. The deposition process may broadly include physical vapor deposition (PVD) deposition and chemical vapor deposition (CVD) deposition. PVD deposition may be a deposition method that does not involve a chemical reaction. PVD deposition, which may be physical vapor deposition, is a technology in which a material such as a thin film to be deposited is deposited on a base material by evaporation or sputtering in a vacuum. It can be deposited by heating it with heat in a vacuum, or the deposited material can be heated and evaporated using an electron beam instead of heat. CVD deposition is a method of depositing using gas particles or molecules formed through a chemical reaction.

According to one embodiment, the fifth process (S50) may be performed as a sputtering PVD deposition process in which particles with high energy collide with the deposition base material. The sputtering PVD deposition process can be carried out in a vacuum. Connect the anode (+) to the deposition substrate, and connect the cathode (-) to the sample (target) substrate. Afterwards, inert gas (e.g. argon (Ar)) is filled and high voltage is applied. At this time, electrons are emitted from the cathode and accelerated toward the anode, causing the electrons to collide with the inert gas. Upon collision, the inert gas (Ar) is ionized (Ar+) and collides with the sample substrate, which is the cathode (-). As the sample substrate collides with the ionized inert group (Ar+), atoms present on the sample substrate pop out, and these atoms may be deposited on the substrate to form a thin film. For example, the sample substrate may be a metal substrate such as titanium (Ti), silicon (Si), or aluminum (Al).

According to one embodiment, the deposition coating layer 440 may be formed on the spray coating layer 420. The deposition coating layer 440 may be formed on at least a portion of the spray coating layer 420 . The deposition coating layer 440 may be formed on the first region 421 of the thermal spray coating layer 420. According to one embodiment, the deposition film layer 440 may be formed on the oxide film layer 430. According to one embodiment, corrosion of the thermal spray coating layer 420 can be prevented by forming a vapor deposition layer 440 on the thermal spray coating layer 420. According to one embodiment, a desired color can be realized by forming a vapor deposition layer 440 on the spray coating layer 420.

According to one embodiment, the thickness t4 of the deposition coating layer 440 formed through the fourth process (S40) may be formed to be thin. The thickness t4 of the deposition coating layer 440 formed through the fourth process (S40) may be, for example, approximately 2 μm or less. The thickness t4 of the deposition coating layer 440 may be, for example, approximately 1 μm.

According to one embodiment, when referring to FIG. 13, a sixth process (S60) of processing at least a portion of the deposition coating layer 440 using a laser may be performed. According to one embodiment, the sixth process (S60) may remove the deposition coating layer 440 formed on the second region 422 of the spray coating layer 420. Laser equipment may differ depending on the cutting thickness. For example, if the cutting thickness is less than approximately 1㎛, UV Laser can be used. For example, if the cutting thickness is approximately 1㎛ or more to 5㎛, IR Laser can be used. According to one embodiment, the laser process of the sixth process (S60) may use a UV laser. According to one embodiment, the thickness cut by the sixth process (S60) may be approximately 3㎛ or less. The thickness cut by the sixth process (S60) may be approximately 1㎛ or more and 2㎛ or less. The laser process can use UV Laser. According to one embodiment, the oxide film layer 430 may not be removed through the sixth process (S60). According to one embodiment, various designs and pattern shapes can be implemented through the sixth process (S60).

According to one embodiment, the processing depth of the final housing 400 may be, for example, approximately 5 μm or more and 30 μm or less. However, the processing depth of the final housing 400 may vary in depth as needed. Various textures are possible by adjusting the processing depth and width.

The housing 400 of the electronic device may include, for example, a metal material such as aluminum, stainless steel, titanium, or magnesium. Among these, the housing 400 containing high-rigidity, difficult-to-cut materials such as titanium and stainless steel may be capable of realizing a high-gloss surface. However, high-rigidity, difficult-to-cut materials such as titanium and stainless steel are heavy, difficult to process, which increases costs, and may have limitations in realizing exterior texture.

The housing 400 of an electronic device according to an embodiment of the present disclosure may be a method for solving conventional problems and implementing a new and differentiated exterior design by including an aluminum material and forming various exterior post-processing functions. there is.

According to an embodiment of the present disclosure, the housing 400 containing an aluminum material is processed to form a surface similar to a difficult-to-cut metal material such as titanium or stainless steel, and a new design is created through post-processing such as polishing and laser processing. Texture can be implemented.

According to an embodiment of the present disclosure, the housing 400 may include aluminum instead of titanium or stainless steel, which are difficult to process and have limited post-processing among metal materials. Aluminum material can be processed into a housing 400 with a texture and/or gloss similar to titanium or stainless steel. By using aluminum, post-processing technologies that could not be implemented when using difficult-to-cut materials such as titanium and stainless steel can be applied.

However, the problems to be solved by the present disclosure are not limited to the above-mentioned problems, and may be determined in various ways without departing from the spirit and scope of the present disclosure.

In an electronic device including a housing (400 in FIG. 5) according to various embodiments of the present disclosure, the housing includes an aluminum substrate (410 in FIG. 5) and a first region having a first thickness (t1 in FIG. 5). and a second region having a second thickness (t2 in FIG. 5) that is thinner than the first thickness, and a thermal spray coating layer (420 in FIG. 5) formed on the aluminum substrate, the spray coating layer, or an oxide film layer formed on the aluminum substrate. (430 in FIG. 5), and a vapor deposition layer (440 in FIG. 5) formed on at least a portion of the sprayed coating layer.

According to one embodiment, the deposition coating layer may be formed on the first region of the thermal spray coating layer.

According to one embodiment, the deposition film layer may be formed on at least a portion of the oxide film layer.

According to one embodiment, the difference between the first thickness and the second thickness may be 1 μm or more and 5 μm or less.

According to one embodiment, the greater the difference between the first thickness and the second thickness, the greater the difference in brightness between the first region and the second region.

According to one embodiment, the thickness of the oxide film layer may be 7 μm or more and 10 μm or less.

According to one embodiment, the thickness of the deposition coating layer may be 2㎛ or less.

According to one embodiment, the electronic device includes a front on which a display is disposed, a rear facing in a direction opposite to the front, and a side disposed between the front and the rear, and the housing is the rear and the side of the electronic device. You can.

According to one embodiment, it may further include a battery mounted inside the housing.

According to one embodiment, it may further include a display.

According to one embodiment, the housing may have a gloss similar to a high-gloss metal material.

In the method of manufacturing a housing for an electronic device according to various embodiments of the present disclosure, a first process of forming a thermal spray coating layer by thermal spray coating on an aluminum substrate, a second process of polishing the thermal spray coating layer, and at least one of the thermal spray coating layers. A portion is processed using a laser, and the sprayed coating layer is manufactured to include a first region having a first thickness and a second region having a second thickness thinner than the first thickness. A third process is oxidized through an anodic oxidation process. It may include a fourth process of forming a coating layer, a fifth process of forming a deposition coating layer through a deposition process, and a sixth process of processing at least a portion of the deposition coating layer through a laser.

According to one embodiment, the deposition coating layer may be formed on the first region of the thermal spray coating layer.

According to one embodiment, the difference between the first thickness and the second thickness may be 1 μm or more and 5 μm or less.

According to one embodiment, the greater the difference between the first thickness and the second thickness, the greater the difference in brightness between the first region and the second region.

According to one embodiment, the thickness of the oxide film layer may be 7 μm or more and 10 μm or less.

According to one embodiment, the thickness of the deposition coating layer may be 2㎛ or less.

According to one embodiment, the electronic device includes a front on which a display is disposed, a rear facing in a direction opposite to the front, and a side disposed between the front and the rear, and the housing is the rear and the side of the electronic device. You can.

According to one embodiment, it may further include a display.

101: Electronic devices
400: housing
410: Aluminum substrate
420: thermal spray coating layer
421: first area
422: Second area
T1: first thickness
T2: second thickness
430: Oxide layer
440: Deposited film layer

Claims (20)

In an electronic device including a housing,
The housing (400 in FIG. 5) is,
Aluminum substrate (410 in FIG. 5);
It includes a first area (412 in FIG. 5) having a first thickness (t1 in FIG. 5) and a second area (422 in FIG. 5) having a second thickness (t2 in FIG. 5) that is thinner than the first thickness. , a thermal spray coating layer formed on the aluminum substrate (420 in FIG. 5);
an oxide layer formed on the sprayed coating layer or the aluminum substrate (430 in FIG. 5); and
An electronic device including a vapor deposition layer (440 in FIG. 5) formed on at least a portion of the sprayed coating layer.
According to claim 1,
The electronic device wherein the deposition coating layer is formed on the first region of the spray coating layer.
According to any one of claims 1 and 2,
The electronic device wherein the deposition film layer is formed on at least a portion of the oxide film layer.
According to any one of claims 1 to 3,
The difference between the first thickness and the second thickness is 1 μm or more and 5 μm or less.
According to any one of claims 1 to 4,
The greater the difference between the first thickness and the second thickness, the greater the difference in brightness between the first and second regions.
According to any one of claims 1 to 5,
An electronic device wherein the thickness of the oxide film layer is 7 μm or more and 10 μm or less.
The method according to any one of claims 1 to 6,
An electronic device wherein the thickness of the deposited film layer is 2㎛ or less.
The method according to any one of claims 1 to 7,
The electronic device includes a front side on which a display is placed, a back side facing in a direction opposite to the front side, and a side side disposed between the front side and the back side,
The housing is the rear and side surfaces of the electronic device.
The method according to any one of claims 1 to 8,
An electronic device further comprising a battery mounted inside the housing.
The method according to any one of claims 1 to 9,
An electronic device further comprising: a display.
The method according to any one of claims 1 to 10,
The housing is an electronic device having a gloss similar to that of a high-gloss metal material.
In a method of manufacturing a housing for an electronic device,
A first process of forming a thermal spray coating layer by thermal spray coating on an aluminum substrate;
A second process of polishing the sprayed coating layer;
a third process in which at least a portion of the thermal spray coating layer is processed using a laser, so that the thermal spray coating layer includes a first region having a first thickness and a second region having a second thickness thinner than the first thickness;
A fourth process of forming an oxide film layer through an anodizing process;
A fifth process of forming a deposition film layer through a deposition process; and
A method of manufacturing a housing for an electronic device comprising a sixth process of processing at least a portion of the deposition layer using a laser.
According to claim 12,
The method of manufacturing a housing for an electronic device, wherein the deposition coating layer is formed on the first region of the spray coating layer.
According to any one of claims 12 and 13,
A method of manufacturing a housing for an electronic device, wherein the deposited film layer is formed on at least a portion of the oxide film layer.
According to any one of claims 12 to 14,
A method of manufacturing a housing for an electronic device, wherein the difference between the first thickness and the second thickness is 1 μm or more and 5 μm or less.
According to any one of claims 12 to 15,
A method of manufacturing a housing for an electronic device, where the greater the difference between the first thickness and the second thickness, the greater the difference in brightness between the first region and the second region.
According to any one of claims 12 to 16,
A method of manufacturing a housing for an electronic device, wherein the thickness of the oxide film layer is 7 μm or more and 10 μm or less.
According to any one of claims 12 to 17,
A method of manufacturing a housing for an electronic device wherein the thickness of the deposited coating layer is 2㎛ or less.
According to any one of claims 12 to 18,
The electronic device includes a front side on which a display is placed, a back side facing in a direction opposite to the front side, and a side side disposed between the front side and the back side,
A method of manufacturing a housing for an electronic device, wherein the housing is the rear and side surfaces of the electronic device.
The method according to any one of claims 12 to 19,
A method of manufacturing a housing for an electronic device further comprising a display.

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