KR20230151415A - Implementing method for structural color and electronic device including structural color - Google Patents

Abstract

According to various embodiments of the present disclosure, a method of implementing structural color includes forming an oxide layer on at least a portion of the surface of a metal substrate, coloring the oxide layer with a designated color, and then sealing it. An operation, and an operation of etching at least a portion of the surface of the oxide film, wherein the etching operation may include an operation of immersing the metal substrate in a mixed solution of phosphoric acid and sulfuric acid. In addition, various embodiments are possible.

Description

Method for implementing structural color and electronic device including structural color {IMPLEMENTING METHOD FOR STRUCTURAL COLOR AND ELECTRONIC DEVICE INCLUDING STRUCTURAL COLOR}

Various embodiments of the present disclosure relate to electronic devices, for example, a method of implementing structural colors in external components and/or electronic devices including implemented structural colors.

Due to the development of information and communication technology and semiconductor technology, the spread and use of various electronic devices is rapidly increasing, and recent electronic devices provide an environment in which general users can carry and communicate. Additionally, electronic devices can output stored information as sound or video. As the degree of integration of electronic devices increases and high-speed, high-capacity wireless communication becomes more common, recently, various functions are being installed in a single electronic device such as a mobile communication terminal. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, schedule management, and electronic wallet functions are integrated into one electronic device. . These electronic devices are being miniaturized so that users can conveniently carry them. As the carrying and use of miniaturized or thin electronic devices such as smart phones becomes routine, user demands for the exterior design of electronic devices may become more sophisticated and diversified.

As user demands for the exterior design of electronic devices become more sophisticated and diversified, methods for implementing various colors or shapes are being proposed. For example, to improve aesthetics, various colors or patterns can be implemented using light interference effects (e.g., structural color). The light interference effect can be implemented by forming fine-sized patterns on the surface of a synthetic resin film or UV curing film. A film on which a fine pattern is formed can provide a decorative effect on the exterior of an electronic device by being attached to an exterior member such as an injection molded product or a glass plate.

The above information may be provided as background technology for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may apply as prior art with respect to the present disclosure.

By using metal as a material for exterior parts of electronic devices, such as housings or front or back plates, it is possible to provide mechanical rigidity to electronic devices while providing texture or decorative effects that are different from injection molded products or glass plates. However, it may be difficult to implement various visual effects, such as structural color, on the surface of a metal substrate, and when implementing visual effects using a synthetic resin film, the texture realized as the metal itself may be deteriorated.

Various embodiments of the present disclosure are intended to solve at least the above-mentioned problems and/or disadvantages and provide at least the advantages described later, including a method of implementing structural color on the surface of a metal material and/or implementing structural color on the exterior. Electronic devices can be provided.

Various embodiments of the present disclosure may provide a method of implementing a structural color on the surface of a metal material while providing the user with the texture of a metal material on the exterior, and/or an electronic device that implements the structural color on the exterior.

Various embodiments of the present disclosure can provide an electronic device that provides a decorative effect through a combination of the color of a metal material or an oxide film on its surface and the structural color.

Additional aspects according to various embodiments will be set forth throughout the detailed description that follows, and in part will be apparent from the description or may be understood through the examples of implementations presented.

According to various embodiments of the present disclosure, a method of implementing structural color includes forming an oxide layer on at least a portion of the surface of a metal substrate, coloring the oxide layer with a designated color, and then sealing it. An operation, and an operation of etching at least a portion of the surface of the oxide film, wherein the etching operation may include an operation of immersing the metal substrate in a mixed solution of phosphoric acid and sulfuric acid.

According to various embodiments of the present disclosure, an electronic device includes a first surface, a second surface facing in a direction opposite to the first surface, and at least partially surrounding a space between the first surface and the second surface. A housing including a side structure, a display disposed on the first side, and a back plate disposed on the second side, at least one of the side structure or the back plate according to an implementation method described above or below. It may include a metal substrate on which structural color is implemented.

According to various embodiments of the present disclosure, an electronic device includes a first surface, a second surface facing in a direction opposite to the first surface, and at least partially surrounding a space between the first surface and the second surface. A housing including a side structure, a display disposed on the first side, and a back plate disposed on the second side, wherein at least one of the housing or the back plate is a metal substrate and formed on a surface of the metal substrate. The oxide film includes an oxide film colored in a designated color, and irregularities formed on the surface of the oxide film, and the irregularities may be configured to reflect, refract, scatter or diffract light incident from the outside.

According to various embodiments of the present disclosure, irregularities, for example, grooves having a depth of 0.5 μm or less and arranged at intervals of 1.6 μm or less are formed on the surface of a metal substrate or the surface of an oxide film through an etching operation using a mixed solution. This can be done, and the irregularities can substantially reflect, refract, scatter, and/or diffract incident light to create structural color. For example, a metal material can provide various types of visual decorative effects without substantially affecting the texture provided by the metal material. According to one embodiment, an electronic device can provide a decorative effect using structural color at least on the exterior by including exterior parts made of such metal. In another embodiment, when the surface or oxide film of the metal substrate is colored with a designated color, the structural color can be combined with the designated color to provide more diverse visual effects. In addition, various effects that can be directly or indirectly identified through this document may be provided.

The above-described or other aspects, configurations and/or advantages of various embodiments of the present disclosure may become clearer through the following detailed description with reference to the accompanying drawings.
1 is a flowchart illustrating a method of implementing structural color according to various embodiments of the present disclosure.
FIG. 2 is a diagram showing a metal substrate processed through the operation of forming the oxide film of FIG. 1.
FIG. 3 is a diagram showing a metal substrate processed through the coloring operation of FIG. 1.
FIG. 4 is a diagram showing a metal substrate processed through the sealing operation of FIG. 1.
FIG. 5 is a diagram showing a metal substrate processed through the etching operation of FIG. 1.
FIG. 6 is a schematic diagram showing a cross section of a metal substrate processed through the method of FIG. 1.
FIG. 7 is a block diagram illustrating an electronic device in a network environment according to various embodiments of the present disclosure.
Figure 8 is a perspective view showing the front of an electronic device according to various embodiments of the present disclosure.
FIG. 9 is a perspective view showing the rear of the electronic device shown in FIG. 8.
FIG. 10 is an exploded perspective view showing the electronic device shown in FIG. 8.
Throughout the accompanying drawings, similar parts, components and/or structures may be assigned similar reference numbers.

The following description in conjunction with the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and corresponding content. The example embodiments disclosed in the following description include numerous specific details to aid understanding, but are considered to be one of a variety of example embodiments. Therefore, it is obvious to a person skilled in the art that various changes and modifications to the various implementations described in this document can be made without departing from the scope and technical idea of the disclosure. Additionally, for clarity and conciseness, descriptions of well-known functions and configurations may be omitted.

The terms and words used in the following description and claims are not limited to a referential meaning and may be used to clearly and consistently describe various embodiments of the present disclosure. Accordingly, it is obvious to those skilled in the art that the following description of various implementations of public notices is provided for illustrative purposes and not for the purpose of limiting the scope of rights and public notices stipulating equivalents.

Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" shall be understood to include plural meanings. Thus, for example, “component surface” may be understood to include one or more of the surfaces of the component.

1 is a flowchart illustrating a method of implementing structural color according to various embodiments of the present disclosure.

Referring to FIG. 1, the method 10 for implementing structural color is to apply an oxide film (e.g., the oxide film 23 of FIGS. 2 to 6) on the surface of a metal substrate (e.g., the metal substrate 21 of FIGS. 2 to 5). )) may include an operation 13 of forming an oxide film 23, an operation 15 of coloring and then sealing the oxide film 23, and/or an operation 17 of etching, and, depending on the embodiment, forming the oxide film 23. An operation 11a of polishing the surface of the all-metal substrate 21 may be further included. In the illustrated embodiment, the operation 11 of preparing the metal substrate 21 is separately illustrated, but the structural color is implemented on the surface of the metal substrate 21, and a method of implementing the structural color according to various embodiments ( 10) may not include the operation 11 of preparing the metal substrate 21. The metal substrate 21 is a housing (e.g., the housing 210 in FIG. 8) or a support member (e.g., the electronic device 101, 200, or 300 in FIGS. 7 to 10) or a support member (e.g., the electronic device 101, 200, or 300 in FIGS. 7 to 10). 1 support member 311 and/or second support member 360), a side structure (e.g., the side structure 210c in FIG. 8 or the side structure 310 in FIG. 10) and/or a back plate (e.g., FIG. 9 Or it may be provided as at least one of the rear plates 211 and 380 of FIG. 10). In one embodiment, when structural color is implemented on at least a portion of the surface, the metal substrate 21 may be provided as an external component such as a side structure or a back plate.

According to one embodiment, the operation 11 of preparing the metal substrate 21 is an operation of manufacturing a metal material (e.g., aluminum, magnesium, or titanium) into a designed part shape, for example, by extrusion, pressing, die casting, and /Or the metal material can be processed or manufactured into a metal substrate 21 of a designed shape through a process such as cutting (e.g., computer numerical control machining). The metal substrate 21 may have a substantially flat shape, and may include at least a partially curved surface depending on the specifications and shape required for the actual product to be manufactured (e.g., the electronic devices 200 and 300 of FIGS. 8 to 10). , may include a hole, a recess, and/or a rib or partition.

According to one embodiment, the polishing operation 11a is a process of increasing the gloss of the surface of the manufactured metal substrate 21, and the surface roughness of the metal substrate 21 can be lowered through physical or chemical polishing. In some embodiments, the polishing operation 11a may be omitted or replaced with a process to increase surface roughness to lower gloss (e.g., sand blasting). For example, the polishing operation 11a or the sandblasting process as a process for controlling the gloss or surface roughness on the surface of the metal substrate 21 may be selectively performed according to the specifications required for the actual product to be manufactured. In one embodiment, the surface roughness adjusted through the polishing operation 11a or the sandblasting process may be perceived by the user's sense of touch.

According to one embodiment, the operation 13 of forming the oxide film 23 is a process of increasing the reliability of the metal substrate 21 or the external component, and the oxide film 23 can be formed on the surface of the metal substrate 21. . For example, the oxide film 23 increases the strength (e.g., hardness) on the surface of the metal substrate 21 or prevents corrosion of the metal substrate due to the external environment, thereby improving the durability or reliability of the metal substrate 21. can increase. The operation 13 of forming the oxide film 23 is, for example, by applying electricity while the metal substrate 21 is immersed in an electrolyte solvent containing at least one of sulfuric acid, oxalic acid, oxalic acid, and/or chromic acid, An oxide film 23 can be grown on the surface of the metal substrate 21. Electricity may be applied at a voltage of approximately 5 to 50 V, and the operation 13 of forming the oxide film 23 may be performed at a temperature of approximately 5 to 30 degrees Celsius for approximately 10 minutes to approximately 180 minutes.

FIG. 2 is a diagram showing a metal substrate processed through the operation of forming the oxide film of FIG. 1.

Referring further to FIG. 2 , after the operation 13 of forming the oxide film 23 , the component 20 may include the oxide film 23 formed on the surface of the metal substrate 21 . The oxide film 23 may include, for example, a plurality of air pores 23a and may be easily colored. Here, 'easy to color' can be understood as meaning that it is easier to color the oxide film 23 than to color the surface of the material or metal substrate 21 on which the oxide film 23 is not formed.

Referring again to FIG. 1, the coloring and/or sealing operation 15 is a process of dyeing or coloring the surface of the metal substrate 21, for example, the oxide film 23, with a designated color, depending on the embodiment. It can be understood as a “coloring action.” For example, the sealing operation may be understood as a substantially coloring operation or part of the coloring process. According to one embodiment, the coloring operation 15 may include a dipping method or an electrolytic coloring method. The immersion method is a method of implementing color by immersing the metal substrate 21 (e.g., the part 20 in FIG. 2) in a solution in which the dye is added/dissolved and diffusing or adsorbing the dye onto the oxide film 23. , electrolytic coloring may be a method of developing color in a metal salt electrolyte solution by applying an electric current. In this embodiment, the metal substrate 21 (and/or the oxide film 23) is immersed in a solution containing an organic dye for approximately 1 to 10 minutes at a temperature of approximately 30 to 60 degrees Celsius to form the metal substrate 21, For example, the oxide film 23 can be colored. In one embodiment, organic dye may be added to the solution to have a concentration of approximately 1 to 10 g/l.

FIG. 3 is a diagram showing a metal substrate processed through the coloring operation of FIG. 1. FIG. 4 is a diagram showing a metal substrate processed through the sealing operation of FIG. 1.

Referring further to FIG. 3, the oxide film 23 may be colored by a coloring operation 15 or process. For example, the organic dye particles 23b diffuse or adsorb into the oxide film 23 or are accommodated into the pores 23a, thereby enabling a designated color to be realized on the surface of the metal substrate 21. In one embodiment, the pore-sealing operation is a process of preventing the organic dye particles 23b from leaving, for example, by sealing the pores 23a as illustrated in FIG. 4 to substantially seal the organic dye particles 23b. It can be maintained within the oxide film 23. For example, by performing a sealing operation, discoloration of the metal substrate 21 can be suppressed or prevented.

FIG. 5 is a diagram showing a metal substrate processed through the etching operation of FIG. 1. FIG. 6 is a schematic diagram showing a cross section of a metal substrate processed through the method of FIG. 1.

Referring to FIGS. 5 and 6 together with FIG. 1 , the etching operation 17 involves creating a groove 25 on the surface of the metal substrate 21, for example, the surface of the oxide film 23, using an etchant. As an operation for forming structures, a structure that generates structural color (e.g., convex-convex or diffraction grating) may be created by an etching operation 17. For example, in the etching operation 17, grooves 25 with depths d1 and d2 of approximately 0.5 μm or less are arranged at intervals i1 and i2 of approximately 1.6 μm or less to form a surface of the oxide film 23. Irregularities may be formed on the surface, and the grooves 25 or the uneven structure may reflect, refract, scatter, or diffract the incident light IL. Depending on various factors such as the behavior of the etchant or the roughness of the surface of the oxide film 23, the depth or arrangement spacing of the grooves 25 may be at least partially irregular, and may substantially satisfy the previously mentioned values regarding the depth or spacing. . In one embodiment, light reflected, refracted, scattered, or diffracted on the surface of the oxide film 23 (hereinafter referred to as 'diffracted light (DL)') interferes with each other to create structural color. In some embodiments, a designated color (e.g., a color colored in an oxide layer) and a structural color may be combined to provide a decorative effect in the appearance of the component 20. For example, even if incident from the same path or direction, the diffraction angle of the diffracted light (DL) may vary depending on the wavelength of the light, and therefore the structural color may be perceived as a different color depending on the angle at which the user views the oxide film. , can provide various visual effects by combining with the color colored on the oxide film 23.

According to one embodiment, the etching operation 17 is performed by partially etching the surface of the oxide film 23 with a mixed acid of at least two types of acid solutions, thereby forming irregularities on the surface of the oxide film 23 (e.g., FIG. 5 Alternatively, grooves 25 in FIG. 6 may be formed. When etching with one type of acid solution, it may be difficult to create irregularities. For example, nitric acid can remove organic dyes and cause discoloration, and hydrochloric acid can cause excessive etching of the oxide film.

A method of implementing structural color according to one embodiment uses a solution of approximately 80 to 95% by weight of phosphoric acid and approximately 5 to 20% by weight of sulfuric acid as an etching solution, thereby creating fine etch marks of approximately 0.5㎛ or less in depth (d1, d2). An uneven structure in which the grooves 25 are arranged at close intervals (i1, i2) of approximately 1.6 ㎛ or less may be formed. This is because the surface of the oxide film 23 is etched by the sulfuric acid component, creating grooves 25 arranged at less than a specified interval (i1, i2), and the depth (d1, d2) of the grooves 25 is increased by etching by the phosphoric acid component. It can be adjusted. FIG. 6 is a schematic image of a cross-section (e.g., surface) of the oxide film 23 after the etching operation 17 taken with a scanning electron microscope. As illustrated in FIG. 6, the depth d1 of the grooves 25 is , d2) and the array spacing (i1, i2) may be dense enough to substantially function as a diffraction grating.

According to one embodiment, the temperature or etching time during etching may be adjusted to suppress excessive etching of the oxide film 23. For example, the colored, sealed oxide film 23 (and/or metal substrate 21) may be immersed in an etching solution (e.g., mixed acid) to partially etch the surface of the oxide film 23, and during etching. The temperature of the mixed acid can be maintained in the range of approximately 50 to 70 degrees Celsius, and the oxide film 23 can be deposited in the etching solution for approximately 10 to 120 seconds.

According to one embodiment, the metal substrate 21 or the component 20 may further include a coating layer 27 formed to cover the surface of the oxide film 23 (eg, a concavo-convex structure or a diffraction grating). The coating layer 27 is formed, for example, by applying and curing an ultraviolet curing resin. It is substantially transparent and can transmit incident light (IL) or diffraction light (DL), and has a concavo-convex structure or a diffraction grating from the external environment. It can be protected. For example, the coating layer 27 can prevent damage or wear of the uneven structure. This coating layer 27 may be omitted depending on the embodiment.

FIG. 7 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 7, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through the first network 198 (e.g., a short-range wireless communication network) or through the second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 is a main processor 121 (e.g., a central processing unit or an application processor), or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit) that can operate independently or together with the main processor 121. (NPU; neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g. : Sound can be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 to an external electronic device (eg, the electronic device 102) directly or wirelessly. According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 is a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). can support the establishment of and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It can communicate with external electronic devices through telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); and a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. there is.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments of the present disclosure may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the relevant context clearly indicates otherwise. In this document: “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”. Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are software (e.g., a program) that includes one or more instructions stored in a storage medium (e.g., internal memory or external memory) that can be read by a machine (e.g., an electronic device). It can be implemented as: For example, a processor (eg, processor) of a device (eg, electronic device) may call at least one instruction among one or more instructions stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

In the detailed description below, the length direction, width direction and/or thickness direction of the electronic device may be mentioned, with the length direction being the 'Y-axis direction', the width direction being the 'X-axis direction', and/or the thickness direction. can be defined as 'Z-axis direction'. In some embodiments, the direction in which a component is oriented may be referred to as 'yin/yang (-/+)' in addition to the Cartesian coordinate system illustrated in the drawing. For example, the front of an electronic device or housing can be defined as a 'side facing the +Z direction', and the back side can be defined as a 'side facing the -Z direction'. In some embodiments, the electronic device or housing side may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and/or an area facing the -Y direction. In another embodiment, 'X-axis direction' may mean including both '-X direction' and '+X direction'. Note that this is based on the Cartesian coordinate system described in the drawings for brevity of explanation, and that the description of directions or components does not limit the various embodiments of the present disclosure.

Figure 8 is a perspective view showing the front of the electronic device 200 according to various embodiments of the present disclosure. FIG. 9 is a perspective view showing the rear of the electronic device 200 shown in FIG. 8.

Referring to FIGS. 8 and 9, the electronic device 200 according to one embodiment includes a first side (or front) 210A, a second side (or back) 210B, and a first side 210A. and a housing 210 including a side 210C surrounding the space between the second surfaces 210B. In another embodiment (not shown), the housing may refer to a structure that forms part of the first side 210A, the second side 210B, and the side surfaces 210C. According to one embodiment, the first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate). The second surface 210B may be formed by a substantially opaque back plate 211. The back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be. The side 210C is joined to the front plate 202 and the back plate 211 and may be formed by a side structure (or “side structure”) 218 comprising metal and/or polymer. In some embodiments, back plate 211 and side structure 218 may be formed integrally and include the same material (eg, a metallic material such as aluminum).

In the illustrated embodiment, the front plate 202 has two first regions 210D that are curved and extend seamlessly from the first surface 210A toward the rear plate 211. It can be included at both ends of the long edge of (202). In the illustrated embodiment (see FIG. 9), the rear plate 211 is curved from the second surface 210B toward the front plate 202 and has two second regions 210E extending seamlessly with long edges. It can be included at both ends. In some embodiments, the front plate 202 (or the rear plate 211) may include only one of the first areas 210D (or the second areas 210E). In another embodiment, some of the first areas 210D or the second areas 210E may not be included. In the above embodiments, when viewed from the side of the electronic device 200, the side structure 218 has a side structure that does not include the first regions 210D or the second regions 210E. It may have a thickness (or width) of 1, and may have a second thickness thinner than the first thickness on the side including the first or second areas 210D or 210E.

According to one embodiment, the electronic device 200 includes a display 201, an audio module 203, 207, and 214, a sensor module 204, 216, and 219, a camera module 205, 212, and 213, and a key input. It may include at least one of the device 217, the light emitting element 206, and the connector holes 208 and 209. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the light emitting device 206) or may additionally include another component.

Display 201 may be exposed, for example, through a significant portion of front plate 202 . In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. In some embodiments, the edges of the display 201 may be formed to be substantially the same as the adjacent outer shape of the front plate 202. In another embodiment (not shown), in order to expand the area where the display 201 is exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

In another embodiment (not shown), a recess or opening is formed in a portion of the screen display area of the display 201, and an audio module 214 and a sensor are aligned with the recess or opening. It may include at least one of a module 204, a camera module 205, and a light emitting device 206. In another embodiment (not shown), an audio module 214, a sensor module 204, a camera module 205, a fingerprint sensor 216, and a light emitting element 206 are located on the back of the screen display area of the display 201. ) may include at least one of the following. In another embodiment (not shown), the display 201 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed. In some embodiments, at least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are located in the first regions 210D and/or the second regions 210E. can be placed in the field.

The audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be placed inside the microphone hole 203, and in some embodiments, a plurality of microphones may be placed to detect the direction of sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for calls. In some embodiments, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker holes 207 and 214 (e.g., piezo speaker).

The sensor modules 204, 216, and 219 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 200 or the external environmental state. The sensor modules 204, 216, 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (e.g., a proximity sensor) disposed on the first side 210A of the housing 210. (not shown) (e.g., fingerprint sensor), and/or a third sensor module 219 (e.g., HRM sensor) and/or fourth sensor module 216 disposed on the second side 210B of the housing 210. ) (e.g., a fingerprint sensor) may be included. The fingerprint sensor may be disposed on the first side 210A (eg, display 201) as well as the second side 210B of the housing 210. The electronic device 200 includes the sensor module 176 of FIG. 7, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may further include at least one of a temperature sensor, a humidity sensor, or an illumination sensor.

The camera modules 205, 212, and 213 include a first camera device 205 disposed on the first side 210A of the electronic device 200, and a second camera device 212 disposed on the second side 210B. ), and/or a flash 213. The camera devices 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 200.

The key input device 217 may be disposed on the side 210C of the housing 210. In other embodiments, the electronic device 200 may not include some or all of the key input devices 217 mentioned above, and the key input devices 217 not included may be other than soft keys on the display 201. It can be implemented in the form In some embodiments, the key input device may include a sensor module 216 disposed on the second side 210B of the housing 210.

For example, the light emitting device 206 may be disposed on the first side 210A of the housing 210. For example, the light emitting device 206 may provide status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device 206 may provide a light source that is linked to the operation of the camera module 205, for example. The light emitting device 206 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 208 and 209 are a first connector hole 208 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 209 that can accommodate a connector for transmitting and receiving audio signals.

FIG. 10 is an exploded perspective view of the electronic device 300 shown in FIG. 8.

Referring to FIG. 10, the electronic device 300 includes a side structure 310, a first support member 311 (e.g., bracket), a front plate 320, a display 330, a printed circuit board 340, It may include a battery 350, a second support member 360 (eg, rear case), an antenna 370, and a rear plate 380. In some embodiments, the electronic device 300 may omit at least one of the components (e.g., the first support member 311 or the second support member 360) or may additionally include another component. . At least one of the components of the electronic device 300 may be the same or similar to at least one of the components of the electronic device 200 of FIG. 8 or FIG. 9, and overlapping descriptions will be omitted below.

The first support member 311 may be disposed inside the electronic device 300 and connected to the side structure 310, or may be formed integrally with the side structure 310. The first support member 311 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material. The first support member 311 may have a display 330 coupled to one side and a printed circuit board 340 coupled to the other side. The printed circuit board 340 may be equipped with a processor, memory, and/or interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed, for example, on substantially the same plane as the printed circuit board 340 . The battery 350 may be placed integrally within the electronic device 300, or may be placed to be detachable from the electronic device 300.

The antenna 370 may be disposed between the rear plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna 370 may perform short-distance communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, an antenna structure may be formed by a portion or a combination of the side structure 310 and/or the first support member 311.

According to one embodiment, the electronic devices 200 and 300 include a housing (e.g., the housing 210 in FIG. 8) and a support member (e.g., the first support member 311 and/or the second support member (e.g., in FIG. 10) 360)), a side structure (e.g., the side structure 210c of FIG. 8, the side structure 218, or the side structure 310 of FIG. 10), and/or a back plate (e.g., the back plate 211 of FIG. 9 or FIG. 10). , 380)), at least one of which may at least partially include a metallic material. For example, at least a portion of the housing 210, the support members 311 and 360, the side structure 310, and the rear plate 211 and 380 may be formed using the structural color implementation method 10 described with reference to FIGS. 1 to 7. It may include a metal substrate 21 manufactured by . In the illustrated embodiment, the housing 210, side structure 310, and/or back plate 380 may be at least partially visible to the outside of the electronic device 200, 300, including the housing 210, At least one of the side structure 310 and/or the back plate 380 may include the metal substrate 21 and/or the oxide film 23 of FIGS. 2 to 6 . For example, in the exterior of the electronic devices 200 and 300, the color colored in the oxide film 23 and the structural color implemented by the uneven structure on the surface of the oxide film 23 can be combined to provide various decorative effects. there is.

In some embodiments, components fabricated by method 10 of FIG. 1, such as housing 210, side structures 218, 310, and/or back plate 380, may be used in electronic devices 200, 300. Even if the area is not visible from the outside, it may have a color that is a combination of the color colored in the oxide film 23 and the structural color. In some embodiments, when the side structures 218, 310 are components fabricated by method 10 of FIG. 1 and the first support member 311 is formed integrally with the side structure 310, the first support member 311 Like the side structure 310, 310 may have a color that is a combination of the color colored in the oxide film 23 and the structural color.

As described above, according to various embodiments of the present disclosure, a method for implementing structural color (e.g., method 10 of FIG. 1) uses a metal substrate (e.g., the metal substrate of FIGS. 2 to 5). (21)) An operation to form an oxide layer (e.g., the oxide layer 23 in FIGS. 2 to 6) on at least a portion of the surface (e.g., the operation indicated by '13' in FIG. 1), in a designated color. After coloring the oxide film, an operation of sealing it (e.g., an operation indicated by '15' in FIG. 1), and an operation of etching at least a portion of the surface of the oxide film (e.g., an operation indicated by '17' in FIG. 1). The etching operation may include immersing the metal substrate in a mixed solution of phosphoric acid and sulfuric acid.

According to one embodiment, the mixed solution of phosphoric acid and sulfuric acid may include 80 to 95% by weight of phosphoric acid and 5 to 20% by weight of sulfuric acid.

According to one embodiment, the etching operation may be performed for 10 to 120 seconds at a temperature of 50 to 70 degrees Celsius.

According to one embodiment, the etching operation is performed by forming irregularities (e.g., grooves 25 in FIG. 5 or FIG. 6) that reflect, refract, scatter or diffract incident light on the surface of the colored and sealed oxide film. ) can be created.

According to one embodiment, the etching operation is performed by forming grooves with a depth of 0.5 ㎛ or less (e.g., depths indicated as 'd1' and 'd2' in FIG. 6) of 1.6 ㎛ or less on the surface of the colored and sealed oxide film. It can be formed at an interval (e.g., the interval indicated by 'i1' and 'i2' in FIG. 6).

According to one embodiment, the above method may further include an operation of polishing the surface of the metal substrate (e.g., an operation indicated by '11a' in FIG. 1) before forming the oxide film. there is.

According to one embodiment, the operation of forming the oxide film may include applying electricity while the metal substrate is immersed in an electrolyte solvent containing at least one of sulfuric acid, oxalic acid, oxalic acid, and chromic acid.

According to one embodiment, the operation of forming the oxide film may be performed for 10 to 180 minutes while applying electricity at a voltage of 5 to 50 V.

According to one embodiment, the operation of forming the oxide film may be performed at 5 to 30 degrees Celsius.

According to one embodiment, the coloring operation may be performed for 1 to 10 minutes by immersing the metal substrate in a coloring solution to which an organic dye is added at a concentration of 1 to 10 g/l.

According to one embodiment, the coloring operation may be performed in an environment of 30 to 60 degrees Celsius.

According to one embodiment, the etching operation is performed by immersing the metal substrate in a mixed solution of 80 to 95% by weight of phosphoric acid and 5 to 20% by weight of sulfuric acid to form grooves with a depth of 0.5 μm or less on the surface of the oxide film. They can be formed at intervals of 1.6㎛ or less.

According to one embodiment, the etching operation may be performed for 10 to 120 seconds at a temperature of 50 to 70 degrees Celsius.

According to one embodiment, the grooves may be configured to implement structural color (eg, see FIG. 5) by reflecting, refracting, scattering, or diffracting incident light on the surface of the oxide film.

According to various embodiments of the present disclosure, an electronic device (e.g., the electronic devices 200 and 300 of FIGS. 8 to 10) has a first side (e.g., the first side 210A of FIG. 8), and the first side (210A of FIG. 8). A second side facing in the opposite direction of the first side (e.g., the second side 210B in FIG. 8) and a side structure that at least partially surrounds the space between the first side and the second side (e.g., FIG. 8) or a housing (e.g., the housing 210 of FIG. 8) including the side structures 218 and 310 of FIG. 10, and a display disposed on the first side (e.g., the display 201 and 330 of FIG. 8 or 10). )), comprising a rear plate disposed on the second side (e.g., the rear plate 211, 380 of FIG. 9 or 10), and at least one of the side structure or the rear plate is formed according to the method described above. It may include a metal substrate on which structural color is implemented (e.g., the component 20 or the metal substrate 21 of FIG. 5).

According to various embodiments of the present disclosure, an electronic device (e.g., the electronic devices 200 and 300 of FIGS. 8 to 10) has a first side (e.g., the first side 210A of FIG. 8), and the first side (210A of FIG. 8). A second side facing in the opposite direction of the first side (e.g., the second side 210B in FIG. 8) and a side structure that at least partially surrounds the space between the first side and the second side (e.g., FIG. 8) or a housing (e.g., the housing 210 of FIG. 8) including the side structures 218 and 310 of FIG. 10, and a display disposed on the first side (e.g., the display 201 and 330 of FIG. 8 or 10). )), and a back plate (e.g., the back plate 211, 380 of FIG. 9 or 10) disposed on the second side, and at least one of the housing or the back plate is a metal substrate (e.g., FIG. Component 20 or metal substrate 21 in 5), an oxide film formed on the surface of the metal substrate (e.g., oxide film 23 in Figure 5 or Figure 6), the oxide film colored in a designated color, and the oxide film It includes irregularities (eg, grooves 25 in FIG. 5 or 6) formed on the surface, and the irregularities may be configured to reflect, refract, scatter, or diffract light incident from the outside.

According to one embodiment, the irregularities have a depth of 0.5㎛ or less (e.g., the depth indicated by 'd1, 'd2' in FIG. 6) and are spaced at intervals of 1.6㎛ or less (e.g., 'i1, 'i2' in FIG. 6). It may include grooves arranged at intervals indicated by '.

According to one embodiment, the housing and the rear plate may be formed integrally.

According to one embodiment, the oxide film may be colored with an organic dye.

According to one embodiment, a visual decorative effect may be provided in the exterior of the electronic device as described above by combining the color of the oxide film and the structural color caused by reflected, refracted, scattered, or diffracted light.

According to one embodiment, the irregularities may be formed by etching at least a portion of the surface of the oxide film using a mixed solution of phosphoric acid and sulfuric acid.

Although the present disclosure has been described by way of example with respect to various embodiments, it should be understood that the various embodiments are for illustrative purposes only and not intended to limit the present invention. It will be apparent to those skilled in the art that various changes may be made in the format and detailed structure of the present disclosure, including the appended claims and their equivalents, without departing from the overall scope of the present disclosure.

10: How to implement structural color
11: Operation of preparing a metal substrate
13: Operation of forming an oxide film
15: Operation of coloring and sealing the oxide film
17: Etching operation
21: metal substrate 23: oxide film
23a: pore (air pore) 23b: dye particle
25: Home(s)

Claims (20)

In a method of implementing structural color,
An operation of forming an oxide layer on at least a portion of the surface of a metal substrate;
An operation of coloring the oxide film with a designated color and then sealing it; and
An operation of etching at least a portion of the surface of the oxide film,
The etching operation includes immersing the metal substrate in a mixed solution of phosphoric acid and sulfuric acid.
The method of claim 1, wherein the mixed solution of phosphoric acid and sulfuric acid contains 80 to 95% by weight of phosphoric acid and 5 to 20% by weight of sulfuric acid.
The method of claim 1, wherein the etching operation is performed for 10 to 120 seconds at a temperature of 50 to 70 degrees Celsius.
The method of claim 1, wherein the etching operation generates irregularities that reflect, refract, scatter or diffract incident light on the surface of the colored and sealed oxide film.
The method of claim 1, wherein the etching operation forms grooves with a depth of 0.5 μm or less at intervals of 1.6 μm or less on the surface of the colored and sealed oxide film.
According to claim 1,
The method further includes polishing the surface of the metal substrate before forming the oxide film.
The method of claim 1, wherein the forming the oxide film includes applying electricity to the metal substrate while immersing the metal substrate in an electrolyte solvent containing at least one of sulfuric acid, oxalic acid, oxalic acid, and chromic acid.
The method of claim 7, wherein the operation of forming the oxide film is performed for 10 to 180 minutes while applying electricity at a voltage of 5 to 50 V.
The method of claim 8, wherein the operation of forming the oxide film is performed at 5 to 30 degrees Celsius.
The method of claim 1, wherein the coloring operation is performed for 1 to 10 minutes by immersing the metal substrate in a coloring solution to which an organic dye is added at a concentration of 1 to 10 g/l.
The method of claim 10, wherein the coloring operation is performed in an environment of 30 to 60 degrees Celsius.
The method of claim 1, wherein the etching operation is performed by immersing the metal substrate in a mixed solution of 80 to 95% by weight of phosphoric acid and 5 to 20% by weight of sulfuric acid to form grooves with a depth of 0.5 μm or less on the surface of the oxide film. A method of forming fields at intervals of 1.6㎛ or less.
The method of claim 12, wherein the etching operation is performed for 10 to 120 seconds at a temperature of 50 to 70 degrees Celsius.
The method of claim 12, wherein the grooves are configured to implement structural color by reflecting, refracting, scattering or diffracting incident light at the surface of the oxide film.
In electronic devices,
a housing including a first face, a second face facing in a direction opposite to the first face, and a side structure at least partially surrounding a space between the first face and the second face;
a display disposed on the first side;
Comprising a back plate disposed on the second side,
At least one of the side structure or the back plate includes a metal substrate having a structural color according to the method of any one of claims 1 to 14.
In electronic devices,
a housing including a first face, a second face facing in a direction opposite to the first face, and a side structure at least partially surrounding a space between the first face and the second face;
a display disposed on the first side;
Comprising a back plate disposed on the second side,
At least one of the housing or the rear plate,
metal substrate;
An oxide film formed on the surface of the metal substrate, the oxide film colored in a designated color; and
Includes irregularities formed on the surface of the oxide film,
The irregularities are configured to reflect, refract, scatter or diffract light incident from the outside.
The electronic device of claim 16, wherein the irregularities include grooves having a depth of 0.5 μm or less and arranged at intervals of 1.6 μm or less.
The electronic device of claim 16, wherein the housing and the rear plate are formed integrally.
The electronic device of claim 16, wherein the oxide film is colored with an organic dye.
The electronic device of claim 19, wherein the irregularities are formed by etching at least a portion of the surface of the oxide film using a mixed solution of phosphoric acid and sulfuric acid.

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