KR20230046912A - Exterior structure of electronic device and manufacturing method thereof - Google Patents

Abstract

An electronic device according to various embodiments of the present disclosure comprises a housing, at least part of the housing including: aluminum alloy; a first oxide film formed on the aluminum alloy; a second oxide film arranged between the aluminum alloy and the first oxide film; and electrolytic sealing formed on the first oxide film. The first oxide film is formed by a first anodizing process using a first voltage on the aluminum alloy. The second oxide film is formed by a second anodizing process using a second voltage on the aluminum alloy. The electrolytic sealing is formed by an electrolytic sealing process using a third voltage. A method for manufacturing a housing of an electronic device using aluminum alloy according to various embodiments of the present disclosure comprises: a first anodizing process of forming a first oxide film on the aluminum alloy; a second anodizing process of forming a second oxide film between the aluminum alloy and the first oxide film; and an electrolytic sealing process of forming electrolytic sealing formed on the first oxide film, wherein a first voltage is applied in the first anodizing process, a second voltage is applied in the second anodizing process, and a third voltage is applied in the electrolytic sealing process. Therefore, a white tone can be realized on the exterior appearance of an electronic device.

Description

Exterior structure of electronic device and manufacturing method thereof

Various embodiments of the present disclosure relate to an external structure of an electronic device and a manufacturing method thereof.

Thanks to the remarkable development of information and communication technology and semiconductor technology, the supply and use of various electronic devices are rapidly increasing. In particular, recent electronic devices are being developed to be portable and communicate.

Electronic devices, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, or car navigation systems, perform specific functions according to loaded programs. can mean a device. For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and ultra-high-speed, large-capacity wireless communication becomes common, recently, a single electronic device such as a mobile communication terminal may be equipped with various functions. For example, not only a communication function, but also an entertainment function such as a game, a multimedia function such as music/video playback, a communication and security function such as mobile banking, and/or a schedule management function or an electronic wallet function are integrated into a single electronic device. it is being aggregated. These electronic devices are miniaturized so that users can conveniently carry them.

Recently, aluminum metal has been widely used as an exterior material to improve the quality of the portable electronic device. In general, aluminum metal is a lightweight metal material applied to many fields. The aluminum alloy material may include aluminum as a main constituent and copper, magnesium, manganese, silicon, tin, or zinc as a main alloying element.

In order to use the aluminum alloy material as an exterior material, there are various surface treatment methods, and among them, an anodizing method is an aluminum oxide film in which an aluminum oxide film is formed by oxidizing the metal surface by oxygen generated from the anode by passing a metal through an anode. It is a surface treatment method using characteristics. When anodizing is performed on an aluminum alloy material, an oxide film (Al2O3) having a diameter of several nanometers is uniformly grown to several tens of micrometers, and the hardness of the produced oxide film is high, so that the wear resistance of aluminum can be improved. The surface of the anodized metal has high aesthetics because the unique texture of the metal is alive, and has excellent corrosion resistance because it can prevent corrosion.

Recently, demand for aluminum alloy exterior materials for portable electronic devices has increased in strength, wear resistance, corrosion resistance, or electrical insulation, as well as various textures and color implementations of exterior designs.

In the case of the existing anodizing method, there are limitations in realizing various colors or textures such as low chroma due to the unique luster of metal, and additional processes such as sanding or etching are required to realize texture, and cost Increase occurs and quality control is difficult. In particular, it may be difficult to implement a white tone.

According to various embodiments of the present disclosure, an external structure of an electronic device and a method for manufacturing the same include performing anodizing treatment using primary and secondary variable constant voltages and performing electrolytic sealing treatment when an oxide film is formed on the surface of an aluminum alloy material. By doing, it is intended to implement a white tone on the exterior of the electronic device.

However, the problem to be solved in the present disclosure is not limited to the above-mentioned problem, and may be expanded in various ways without departing from the spirit and scope of the present disclosure.

According to various embodiments of the present disclosure, an electronic device is a housing, wherein at least a portion of the housing is disposed between an aluminum alloy, a first oxide film formed on the aluminum alloy, and the aluminum alloy and the first oxide film. A housing including a second oxide film and an electrolytic sealing formed on the first oxide film, wherein the first oxide film is formed by a first anodizing process in which a first voltage is used for the aluminum alloy, , The second oxide film may be formed by a second anodizing process using a second voltage for the aluminum alloy, and the electrolytic sealing may be formed by an electrolytic sealing process using a third voltage.

According to various embodiments of the present disclosure, a method of manufacturing a housing of an electronic device using an aluminum alloy includes a first anodizing process of forming a first oxide film on the aluminum alloy, the aluminum alloy and the first oxide film. A second anodizing process of forming a second oxide film therebetween and an electrolytic sealing process of forming an electrolytic sealing formed on the first oxide film, wherein a first voltage is applied in the first anodizing process, A second voltage may be applied in the second anodizing process, and a third voltage may be applied in the electrolytic sealing process.

According to various embodiments of the present disclosure, an external structure of an electronic device and a method for manufacturing the same can implement a uniform white tone on the exterior of the electronic device, and when an oxide film is formed, the first and second variable constant voltage (voltage 1 As a method using ash change), there is no additional physical or chemical process, so there is no cost, and stable quality control can be possible while maintaining the advantages of the existing anodizing.

1 is a block diagram of an electronic device 101 in a network environment according to various embodiments of the present disclosure.
2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.
3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.
4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
5 is a flowchart of a process performed on an aluminum alloy material according to various embodiments of the present disclosure.
6 illustrates an anodizing process being performed on an aluminum alloy material according to various embodiments of the present disclosure.
7 is a diagram illustrating a relationship between a primary voltage and a secondary voltage in an anodizing process according to various embodiments of the present disclosure.
8 is a view showing an oxide film including a plurality of layers generated on the surface of an aluminum alloy material after an anodizing process according to various embodiments of the present disclosure.
9 is a view explaining that a haze effect appears on the surface of an aluminum alloy material after an anodizing process according to various embodiments of the present disclosure.
10 shows an aluminum alloy material according to the time for which a second constant voltage is applied.
11 shows a graph of the glossiness of an aluminum alloy material according to the time for which a secondary constant voltage is applied.
12 is a view showing the surface of an aluminum alloy material before and after applying a secondary constant voltage according to various embodiments of the present disclosure.
13 is an enlarged view of the surface of an aluminum alloy material according to the time for applying a second constant voltage according to various embodiments of the present disclosure.
FIG. 14 is a diagram showing the time for the haze effect to appear when a second constant voltage is applied according to a change in magnitude of the first constant voltage, according to various embodiments of the present disclosure.
15 is a diagram illustrating a change in thickness of a grain boundary when a second constant voltage is applied according to a change in magnitude of a first constant voltage, according to various embodiments of the present disclosure.
16A to 16C show cross-sectional schematics, cross-sectional views and perspective views of an aluminum alloy material subjected to an electrolytic sealing process.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that may operate independently of or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 uses less power than the main processor 121 or is set to be specialized for a designated function. It can be. The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, a legacy communication module). It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external electronic devices 102 , 104 , and 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited. A (eg, first) component is said to be "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

2 is a front perspective view of an electronic device 101 according to various embodiments of the present disclosure. 3 is a rear perspective view of an electronic device 101 according to various embodiments of the present disclosure.

Referring to FIGS. 2 and 3 , the electronic device 101 according to an embodiment has a front side 310A, a back side 310B, and a side surface 310C surrounding a space between the front side 310A and the back side 310B. It may include a housing 310 including a). According to another embodiment (not shown), the housing 310 may refer to a structure forming some of the front surface 310A of FIG. 2 , the rear surface 310B and the side surface 310C of FIG. 3 . According to one embodiment, at least a portion of front surface 310A may be formed by a substantially transparent front plate 302 (eg, a glass plate or polymer plate including various coating layers). The rear surface 310B may be formed by the rear plate 311 . The rear plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 310C may be formed by a side bezel structure (or "side member") 318 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer. According to one embodiment, the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, glass, a metal material such as aluminum, or ceramic). According to another embodiment, the front surface 310A and/or the front plate 302 may include a portion of the display 301 .

According to an embodiment, the electronic device 101 includes a display 301, audio modules 303, 307, and 314 (eg, the audio module 170 of FIG. 1), and a sensor module (eg, the sensor module of FIG. 1 ). 176), camera modules 305 and 306 (eg, camera module 180 of FIG. 1), a key input device 317 (eg, input module 150 of FIG. 1), and a connector hole 308, 309) (eg, the connection terminal 178 of FIG. 1). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the connector hole 309) or may additionally include other components. According to one embodiment, the display 301 may be visually exposed, for example, through a substantial portion of the front plate 302 .

According to one embodiment, the surface of the housing 310 (or the front plate 302) may include a screen display area formed as the display 301 is visually exposed. For example, the screen display area may include the front surface 310A.

According to another embodiment (not shown), the electronic device 101 includes a recess or opening formed in a part of a screen display area (eg, the front surface 310A) of the display 301, and the recess Alternatively, at least one of an audio module 314, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 aligned with the opening may be included. According to another embodiment (not shown), on the rear surface of the screen display area of the display 301, an audio module 314, a sensor module (not shown), a camera module 305, a fingerprint sensor (not shown), and light emitting It may include at least one or more of the elements (not shown).

According to another embodiment (not shown), the display 301 is combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic stylus pen. can be placed.

According to one embodiment, at least a part of the key input device 317 may be disposed on the side bezel structure 318 .

According to one embodiment, the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 . A microphone for acquiring external sound may be disposed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication. In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).

According to an embodiment, the sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module (not shown) includes, for example, a first sensor module (not shown) (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the front surface 310A of the housing 310 ( eg a fingerprint sensor). The sensor module (not shown) includes a third sensor module (not shown) (eg HRM sensor) and/or a fourth sensor module (not shown) (eg fingerprint sensor) disposed on the rear surface 310B of the housing 310. ) may be included. According to another embodiment (not shown), the fingerprint sensor may be disposed on the rear surface 310B as well as the front surface 310A (eg, the display 301) of the housing 310. The electronic device 101 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor (not shown) may be further included.

According to one embodiment, the camera modules 305 and 306 include, for example, a front camera module 305 disposed on the front side 310A of the electronic device 101 and a rear camera module disposed on the rear side 310B. 306 , and/or flash 304 . The camera modules 305 and 306 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 304 may include, for example, a light emitting diode or a xenon lamp. According to an embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .

According to one embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310 . According to another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included are soft keys and keys on the display 301. It can be implemented in other forms as well.

According to one embodiment, a light emitting device (not shown) may be disposed on, for example, the front surface 310A of the housing 310 . A light emitting element (not shown) may provide, for example, state information of the electronic device 101 in the form of light. According to another embodiment, a light emitting device (not shown) may provide, for example, a light source interlocked with the operation of the front camera module 305 . The light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.

According to one embodiment, the connector holes 308 and 309 are, for example, connectors (eg, USB connectors) for transmitting and receiving power and/or data to and from external electronic devices or audio signals to and from external electronic devices. a first connector hole 308 capable of receiving a connector (eg, earphone jack) for a storage device (eg, a subscriber identification module (SIM) card) and/or a second connector capable of receiving a storage device (eg, a subscriber identification module (SIM) card) A hole 309 may be included. According to one embodiment, the first connector hole 308 and/or the second connector hole 309 may be omitted.

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 4 , an electronic device 101 (eg, the electronic device 101 of FIGS. 2 and 3 ) includes a front plate 320 (eg, the front plate 302 of FIG. 2 ), a display 330 (eg display 301 of FIG. 2), first support member 332 (eg bracket), printed circuit board 340, battery 350, second support member 360 (eg rear case) , an antenna 370 and a back plate 380 (eg, the back plate 311 of FIG. 3). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the first support member 332 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and duplicate descriptions will be omitted below.

According to an embodiment, the first support member 332 may be disposed inside the electronic device 101 and connected to the side bezel structure 331 or integrally formed with the side bezel structure 331 . The first support member 332 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 332 may have the display 330 coupled to one surface and the printed circuit board 340 coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 340 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory. According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector. According to an embodiment, the battery 350 (eg, the battery 189 of FIG. 1 ) is a device for supplying power to at least one component (eg, the camera module 312) of the electronic device 101 . , for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 101 or may be disposed detachably from the electronic device 101 .

According to an embodiment, the second support member 360 (eg, a rear case) may be disposed between the printed circuit board 340 and the antenna 370 . For example, the second support member 360 may include one surface to which at least one of the printed circuit board 340 or the battery 350 is coupled and the other surface to which the antenna 370 is coupled.

According to one embodiment, the antenna 370 may be disposed between the rear plate 380 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. For example, the antenna 370 may include a coil for wireless charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 331 and/or the first support member 332 or a combination thereof.

According to various embodiments, the electronic device 101 may include a camera module (eg, the camera module 306 of FIG. 3 ) disposed in a housing (eg, the housing 310 of FIG. 2 ). According to an embodiment, the camera module 306 is disposed on the first support member 332 and is a rear camera capable of acquiring an image of a subject located at the rear of the electronic device 101 (eg, in the +Z direction). module (eg, camera module 312 of FIG. 3 ). According to an embodiment, at least a portion of the camera module 312 may be exposed to the outside of the electronic device 101 through the opening 382 formed in the rear plate 380 .

The electronic device 101 disclosed in FIGS. 2 to 4 has a bar-type or plate-type appearance, but the present disclosure is not limited thereto. For example, the illustrated electronic device may be a rollable electronic device or a foldable electronic device. A “rollable electronic device” means that a display (e.g., the display 330 of FIG. 3) can be bent and deformed, so that at least a portion thereof is rolled or rolled, or a housing (e.g., the display 330 of FIG. 2) can be bent or deformed. It may refer to an electronic device that can be housed inside the housing 310 . Depending on the needs of the user, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of the display to the outside. A “foldable electronic device” may mean an electronic device that can be folded so that two different areas of a display face each other or in directions opposite to each other. In general, in a portable state, in a foldable electronic device, a display is folded so that two different areas face each other or in opposite directions, and in actual use, a user unfolds the display so that the two different areas form a flat flat can In some embodiments, the electronic device 101 according to various embodiments disclosed in this document may include not only a portable electronic device such as a smart phone, but also various other electronic devices such as a notebook computer or a camera.

5 is a flowchart of a process performed on an aluminum alloy material according to various embodiments of the present disclosure.

Referring to FIG. 5 , according to various embodiments, at least a part of a housing (eg, the housing 310 of FIGS. 2 and 3 ) of an electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) is formed. An aluminum alloy material (eg, the aluminum alloy material 606 of FIG. 6 ) used as an exterior or interior material to be manufactured may be manufactured through the following processes.

According to various embodiments, the aluminum alloy material 606 includes a buffing and polishing process (S510), a pretreatment process (S520), a desmut process (S530), an anodizing process (S540), a coloring process (S550), and It may be manufactured through an electrolytic sealing process (S560). The above steps are not essential, and some steps may be omitted or other steps may be added.

According to various embodiments, the aluminum alloy material 606 may be machined into shape. A buffing and/or polishing process (S510) may be performed on the shaped aluminum alloy material 606. A polishing process may be performed by contacting the aluminum alloy material 606 with a rotating polishing device. According to an embodiment, a polishing cloth may be provided in the polishing equipment, and the polishing cloth may be pressed against the aluminum alloy material 606 while rotating to perform a polishing process. According to various embodiments, the buffing and/or polishing process ( S510 ) may be performed in a wet or dry manner. In the wet process, cutting oil may be supplied to the aluminum alloy material 606 to perform a buffing and/or polishing process (S510) with a urethane sponge or other material. In the dry process, an optical powder or an abrasive is supplied to the aluminum alloy material 606, and a buffing and/or polishing process (S510) may be performed with a white cloth or other material. A pretreatment process (S520) may be performed on the aluminum alloy material 606 after the buffing and/or polishing process.

According to various embodiments, a pretreatment process (S520) may be performed on the aluminum alloy material 606 on which the buffing and/or polishing process (S510) has been performed. The pretreatment process (S520) is to degrease and/or clean the aluminum alloy material 606, and oil (eg, cutting oil, polish residue) and/or impurities may be removed. In the pretreatment process (S520), acid degreasing (for example, pH 7.0 or less), alkali degreasing (pH 7.0 or more), or a solution containing a neutral system may be used, suitable for the characteristics and specifications of the aluminum alloy material 606. It can be applied by applying settling time and/or temperature conditions. A desmut process (S530) may be performed on the aluminum alloy material 606 on which the pretreatment process (S520) has been performed.

According to various embodiments, a desmut process (S530) may be performed on the aluminum alloy material 606 on which the pretreatment process (S520) has been performed. Metal impurities remaining in the aluminum alloy material 606 may be removed through the dismut process ( S530 ), and the surface of the aluminum alloy material 606 may be adjusted. In the dismut process (S530), a solution containing sulfuric acid and/or nitric acid may be used, the concentration of the solution may be from about 5 g/L to about 800 g/L, the temperature of the solution may be room temperature or higher, and aluminum The immersion time of the alloy material 606 may be about 5 seconds to 30 minutes. Conditions in the dismut process (S530) are not limited to the above conditions. An anodizing process (S540) may be performed on the aluminum alloy material 606 on which the dismut process (S530) has been performed.

According to various embodiments, an anodizing process (S540) may be performed on the aluminum alloy material 606 on which the dismut process (S530) has been performed. An oxide film may be formed on the surface of the aluminum alloy material 606 through an anodizing (anodic oxidation) process (S540). In the anodizing process (S540), an electrolyte containing at least one or all of sulfuric acid, oxalic acid, phosphoric acid, or chromic acid may be used. An anodizing process (S540) may be performed by precipitating the aluminum alloy material 606 in an electrolyte solution and providing a predetermined voltage and temperature. The anodizing process (S540) may include a first anodizing process and a second anodizing process. The anodizing process (S540) will be described later in detail along with descriptions of FIGS. 6 to 9 .

According to various embodiments, a coloring process (S550) may be performed on the aluminum alloy material 606 on which the anodizing process (S540) has been performed. Various colors may be implemented in the aluminum alloy material 606 through the coloring process (S550). For example, the coloring process (S550) may be performed by a water-based method in which the aluminum alloy material 606 is immersed in a solution in which an organic dye is dissolved. The temperature of the solution is about 30 ℃ to 60 ℃, the concentration of the dye concentration can be adjusted by adding to the range of about 0.1g / L to 10g / L, if necessary. The coloring process (S550) may be omitted if necessary. An electrolytic sealing process (S560) may be performed on the aluminum alloy material 606 on which the coloring process (S550) has been performed.

According to various embodiments, an electrolytic sealing process (S560) may be performed on the aluminum alloy material 606 on which the anodizing process (S540) and/or the coloring process (S550) has been performed. The electrolytic sealing process (S560) may include a process of washing the aluminum alloy material 606 with water. In the hot water washing process, water of about 80° C. or higher may be used. In the electrolytic sealing process (S560), a solution in which TiO2 is mixed with an acrylic resin as a base may be used. The Celsius temperature of the solution may be about 0 ° C to about 30 ° C, the DC voltage applied to the solution may be about 40 V to about 150 V, and the DC voltage applied time may be about 1 minute to about 3 minutes. According to one embodiment, the DC voltage may be about 100V. After the electrolytic sealing process (S560) is performed, a sealing process or a drying process may be performed. The temperature in the drying process may be about 150 °C to about 200 °C. The electrolytic sealing (for example, the electrolytic sealing 620 of FIG. 16A ) formed on the aluminum alloy material 606 by performing the electrolytic sealing process (S560) will be described later along with the description of FIG. 16 .

Hereinafter, a specific method for imparting a haze effect by forming an oxide film structure including a plurality of layers according to an anodizing process using a variable voltage according to various embodiments of the present disclosure will be described.

6 illustrates an anodizing process being performed on an aluminum alloy material according to various embodiments of the present disclosure. 7 is a diagram illustrating a relationship between a primary voltage and a secondary voltage in an anodizing process according to various embodiments of the present disclosure. 8 is a view showing an oxide film including a plurality of layers generated on the surface of an aluminum alloy material after an anodizing process according to various embodiments of the present disclosure. 9 is a view explaining that a haze effect appears on the surface of an aluminum alloy material after an anodizing process according to various embodiments of the present disclosure.

6 to 9, the anodizing apparatus 600 fills the electrolyte container 601 with the electrolyte solution 602 and then inserts the first electrode 604 and the second electrode 605 into the negative electrode of the battery 603 ( -pole) so that at least a part is immersed in the electrolyte 602 and connected to the positive electrode (+ pole) of the battery 603 between the first electrode 604 and the second electrode 605 (606 ) may be configured to be entirely submerged in the electrolyte solution 602. A first constant voltage and a second constant voltage may be sequentially applied through the battery 603 to perform an anodizing process (eg, an anodizing process ( S540 ) of FIG. 5 ) on the aluminum alloy material 606 . The anodizing process (S540) may include a first anodizing process and a second anodizing process. A process in which a first constant voltage is applied may be defined as a first anodizing process, and a process in which a second constant voltage is applied may be defined as a second anodizing process.

According to an embodiment, a first oxide film 610 may be formed on the surface of the aluminum alloy material 606 through the first constant voltage. According to one embodiment, a plurality of film pores 611 may be formed between the plurality of first oxide films 610 . According to one embodiment, after the first constant voltage is applied, the second oxide layer 612 may be formed on the surface of the aluminum alloy material 606 by the second constant voltage. According to one embodiment, the second oxide film 612 may be formed directly on the surface of the aluminum alloy material 606 . For example, the second oxide film 612 may be disposed between the first oxide film 610 and the surface of the aluminum alloy material 606 . According to an embodiment, light may be reflected by the first oxide film 610 and the second oxide film 612 formed by the anodizing process (S540) of the anodizing apparatus 600. According to an exemplary embodiment, a haze effect may be implemented due to the first light 701 diffusely reflected from the surface of the first oxide film 610 and the second light 702 reflected by the second oxide film 612. can For example, the second light 702 may be reflected by the second oxide film 612 and diffusely reflected from the film pores 611 of the first oxide film 610 to implement a haze effect. According to an embodiment, a pastel color may be implemented in the aluminum alloy material 606 by the plurality of film pores 611 colored by a coloring process (eg, the coloring process (S550 of FIG. 5)).

According to various embodiments, the electrolyte 602 used in the anodizing apparatus 600 may include at least one or all of sulfuric acid, oxalic acid, phosphoric acid, or chromic acid. For example, a sulfuric acid solution having a concentration of about 150 g/L to about 300 g/L may be used as the electrolyte solution 602 .

According to various embodiments, the anodizing process (S540) by the anodizing apparatus 600 may be performed at a temperature of about 30°C or less. For example, the anodizing process (S540) may be performed at a temperature ranging from about 0 °C to about 25 °C.

According to various embodiments, the first constant voltage may be applied within a range that satisfies a predetermined condition according to a desired thickness of the first oxide layer 610 . For example, the first constant voltage may be applied in a range of about 10V to about 30V for about 5 minutes to about 40 minutes to form a first oxide layer 610 having a thickness of about 5 μm to about 20 μm.

According to various embodiments, after the first constant voltage is applied, the second constant voltage may be applied at a voltage lower than the first constant voltage. For example, the secondary constant voltage may be applied within a range of about 1V to about 10V. According to an embodiment, as the time for which the second constant voltage is applied increases, the second oxide film 612 is formed, so that a haze effect may be implemented on the surface of the aluminum alloy material 606 . A current at the secondary constant voltage may be about 4A or less.

10 is a diagram illustrating that a haze effect is implemented depending on the time for applying a second constant voltage according to various embodiments of the present disclosure. 11 is a view showing that the glossiness of the surface of an aluminum alloy material changes according to the time for which a second constant voltage is applied according to various embodiments of the present disclosure.

10 and 11 show an aluminum alloy material having a primary constant voltage of about 13V and a secondary constant voltage of about 7V.

10 shows an aluminum alloy material according to the time for which a second constant voltage is applied. 11 shows a graph of the glossiness of an aluminum alloy material according to the time for which a secondary constant voltage is applied. It may mean that the time for which the secondary constant voltage is applied increases as the progress from the 1-1st material 1001 to the 1-10th material 1010 increases. For example, the 1-1st material 1001 is a state in which the secondary constant voltage is applied for about 10 minutes, the 1-2nd material 1002 is in a state in which the secondary constant voltage is applied for about 20 minutes, and the 1-10th material ( 1010) may mean a state in which the secondary constant voltage is applied for about 100 minutes.

Referring to FIG. 10, as a result of applying a secondary constant voltage, browning and/or surface changes occur on the surface of the aluminum alloy material from the 1-1 material 1001 to the 1-3 material 1003 corresponding to the initial state And it can be confirmed that the haze effect is implemented from the 1-4 materials 1004 onwards. It can be seen that as the time for applying the secondary constant voltage from the first to fourth materials 1004 in which the haze effect is implemented increases, the phenomenon in which the haze effect is expressed becomes clearer. For example, if the time for which the second constant voltage is applied is about 40 minutes or more, and as the time for which the second constant voltage is applied increases, the haze effect may be more clearly expressed.

Referring to FIG. 11, as a result of applying a secondary constant voltage, the initial gloss of the 1-1 material 1001 corresponding to the initial state is 100 GU, and the 1-2 material 1002 in which browning and / or surface change has occurred ) and 1-3 materials (1003), the glossiness decreased to about 50% of the initial glossiness, and after the 4th state, it increased to about 60% to 80% of the initial glossiness compared to the 2nd and 3rd states It can be confirmed that a stable appearance is implemented.

12 is a view showing the surface of an aluminum alloy material before and after applying a secondary constant voltage according to various embodiments of the present disclosure. In detail, FIG. 12 (a) shows the surface of the aluminum alloy material in its initial state before applying the secondary constant voltage, and FIG. 12 (b) shows the aluminum alloy material in a state in which the haze effect is implemented by applying the secondary constant voltage shows the surface of

13 is an enlarged view of the surface of an aluminum alloy material according to the time for applying a second constant voltage according to various embodiments of the present disclosure. The 1-1 materials 1001 to 1-10 materials 1010 shown in FIG. 13 are the same as the 1-1 materials 1001 to 1-10 materials 1010 shown in FIGS. 10 and 11 or similar. Therefore, description of the same configuration may be omitted.

13 shows a case where the first constant voltage is about 13V and the second constant voltage is about 7V.

13 shows an enlarged state according to the time for which the second constant voltage is applied, and it means that the time for which the second constant voltage is applied increases as the progress goes from the 1-1st material 1001 to the 1-10th material 1010. can For example, the 1-1st material 1001 shows a state in which the secondary constant voltage is applied for about 10 minutes, and the 1-2nd material 1002 shows a state in which the secondary constant voltage is applied for about 20 minutes. Material -10 1010 shows a state in which the second constant voltage is applied for about 100 minutes.

Referring to FIG. 12, on the surface of the aluminum alloy material, the distinction between grains 801 is not clear in the initial state before the secondary static voltage is applied, and grain boundaries 802, which are boundaries between grains, While does not exist, in a state where the haze effect is implemented by applying the secondary constant voltage, it can be confirmed that the grain boundaries 801 are clearly distinguished and the grain boundaries 802 clearly exist.

Referring to FIG. 13 , it can be confirmed that in the 1-1 material 1001 corresponding to the initial state while the secondary constant voltage is applied, the distinction between crystal grains is not clear and there is no grain boundary, which is a boundary between crystal grains. In the 1-2 material 1002 and 1-3 material 1003 in which browning and/or surface changes have occurred, it is possible to distinguish between crystal grains and grain boundaries exist, but as time passes, it is difficult to distinguish between crystal grains again and the grain boundaries You can see that it's gone. From material 1-4 (1004), where the haze effect begins to be realized, it is possible to partially distinguish between crystal grains, and grain boundaries exist. It can be seen that the haze effect is implemented by the diffused reflection of light.

14 and [Table 1] show the time at which the haze effect appears when a second constant voltage is applied according to a change in magnitude of the first constant voltage according to various embodiments of the present disclosure.

14a shows a case in which the magnitude of the first constant voltage is about 13V and the magnitude of the second constant voltage is about 7V in [Table 1], and FIG. It shows the case where the magnitude of the constant voltage is about 7V.

1st constant voltage 2nd constant voltage Haze effect occurrence time Miguhyeon ~ Galbyeon Section Haze realization section 13V 7V 0-30 minutes 40 to 120 minutes 14V 7V 0-30 minutes 40 to 120 minutes 15V 7V 0-40 minutes 50 to 120 minutes 17V 7V 0-50 minutes 60 to 120 minutes 18V 7V 0-60 minutes 70 to 120 minutes

Hereinafter, various embodiments will be described with reference to [Table 1]. According to an embodiment, when the secondary constant voltage is about 7V and the primary constant voltage is about 13V and 14V, a section in which browning occurs in the initial state is up to about 30 minutes, and it can be confirmed that the haze effect occurs after 40 minutes.

According to one embodiment, when the first constant voltage is about 15V, the period in which the browning phenomenon occurs in the initial state is up to about 40 minutes, and it can be confirmed that the haze effect occurs after 50 minutes.

According to an embodiment, when the first constant voltage is about 17V, the period in which the browning phenomenon occurs in the initial state is up to about 50 minutes, and it can be confirmed that the haze effect occurs after 60 minutes.

According to an embodiment, when the first constant voltage is about 18V, the period in which the browning phenomenon occurs in the initial state is up to about 60 minutes, and it can be confirmed that the haze effect occurs after 70 minutes. Accordingly, it can be confirmed that as the first constant voltage increases, the time for applying the second constant voltage to implement the haze effect increases.

Referring to FIGS. 14A and 14B, after the haze effect is implemented, the same numbers in (a) and (b) (eg, 2-1 material 1401a and 3-1 material 1401b or 2-5 Comparing the haze effect between material 1405a and material 3-5 (1405b), the haze effect appears stronger in the third material (1401b to 1412b) having a higher primary static voltage than in the second material (1401a to 1410a). can confirm. Here, the meaning that the haze effect appears more intensely may mean that the glossiness is lower. Accordingly, it can be confirmed that the degree of gloss can be controlled through the magnitude of the first constant voltage.

15 illustrates a change in the thickness of a grain boundary when a second constant voltage is applied according to a change in magnitude of a first constant voltage, according to various embodiments of the present disclosure.

[Table 2] shows changes in the thickness of grain boundaries when a second constant voltage is applied according to a change in magnitude of the first constant voltage according to various embodiments of the present disclosure.

FIG. 15a shows the case where only the first voltage is applied in [Table 2], FIG. 15b shows the case where the magnitude of the first constant voltage is about 13V and the magnitude of the second constant voltage is about 7V in [Table 2], and FIG. 15c shows [ In Table 2, the magnitude of the first constant voltage is about 15V and the magnitude of the second constant voltage is about 7V. Indicates the case of about 7V.

division Grain boundary measurement result single voltage not measurable 1st constant voltage: 13V 2nd constant voltage: 7V 0.57 μm 1st constant voltage: 15V 2nd constant voltage: 7V 0.71 μm 1st constant voltage: 17V 2nd constant voltage: 7V 0.97 μm

Referring to FIG. 15 and [Table 2], according to an embodiment, when only one constant voltage (single voltage) is applied, the distinction between grains is not clear and grain boundaries (eg, grain boundary 802 in FIG. 12) do not exist. According to an embodiment, when the first static voltage is about 13V, it can be confirmed that the first thickness d1 of the grain boundary 802 is about 0.57 μm.

According to an embodiment, when the first constant voltage is about 15V, it can be confirmed that the second thickness d2 of the grain boundary 802 is about 0.71 μm.

According to an embodiment, when the first constant voltage is about 17V, it can be confirmed that the third thickness d3 of the grain boundary 802 is about 0.97 μm.

Through the above results, it can be confirmed that the thickness of the grain boundary 802 increases as the primary static voltage increases, and diffuse reflection is further generated on the surface of the aluminum alloy material, so that the haze effect may appear more intense.

[Table 3] shows the effect according to the magnitude and time of applying the first constant voltage and the second constant voltage according to various embodiments of the present disclosure.

Voltage hour 1st constant voltage Decide to thicken the haze
(Gloss Control) Determination of target thickness
(Satisfying corrosion resistance, light resistance, etc.) 2nd constant voltage Haze expression
(specific voltage range) Haze expression
(Need to meet authorization time)

Referring to [Table 3], the magnitude of the voltage of the first constant voltage determines the intensity of the haze effect to control the glossiness, and the time for applying the first constant voltage determines the thickness of the first oxide film to improve corrosion resistance, and/or light fastness. The magnitude of the voltage of the secondary constant voltage must satisfy a specific voltage range in order to express the haze effect, and the application time of the secondary constant voltage needs to satisfy an application time equal to or greater than a predetermined value in order to express the haze effect.

16A to 16C show cross-sectional schematics, cross-sectional views and perspective views of an aluminum alloy material subjected to an electrolytic sealing process.

The aluminum alloy material 606, the first oxide film 610, the film pores 611, and the second oxide film 612 shown in FIGS. 16A to 16C are the aluminum alloy material 606 shown in FIG. 8, The first oxide film 610, the film pores 611, and the second oxide film 612 may be the same as or similar to each other. Therefore, description of the same configuration may be omitted.

According to various embodiments, a second oxide film 612 may be disposed on the surface of the aluminum alloy material 606 on which an anodizing process (eg, the anodizing process (S540) of FIG. 5) has been performed, and the second oxide film ( 612) may have a first oxide film 610 and film pores 611 formed thereon. According to one embodiment, the second oxide film 612 may be disposed between the first oxide film 610 and the aluminum alloy material 606 . The electrolytic sealing 620 formed by the electrolytic sealing process (eg, the electrolytic sealing process S560 of FIG. 5 ) may be disposed on one surface of the first oxide layer 610 . According to an embodiment, the first oxide film 610 may be disposed between the electrolytic sealing 620 and the second oxide film 612 .

According to various embodiments, the electrolytic sealing 620 may be formed by an electrolytic sealing process (S560). A thickness d4 of the second oxide film 612 may be about 1 μm, and a thickness d5 of the first oxide film 610 may be about 10 μm. The thickness d6 of the electrolytic sealing 620 may be from about 5 μm to about 30 μm. Referring to FIG. 16B , according to an embodiment, the thickness d6 of the electrolytic sealing 620 may be about 10 μm.

In this way, as the electrolytic sealing 620 is formed, the user can implement a white tone in the aluminum alloy material 606 . Referring to FIG. 16C , an aluminum alloy material 606 having a white tone can be confirmed.

An electronic device (eg, the electronic device 101 of FIG. 2 ) according to various embodiments of the present disclosure is a housing (eg, the housing 310 of FIG. 2 ), and at least a portion of the housing is made of an aluminum alloy (eg, the housing 310 of FIG. 2 ). The aluminum alloy material 606 of FIG. 16A), the first oxide film formed on the aluminum alloy (eg, the first oxide film 610 of FIG. 16A), the first oxide film disposed between the aluminum alloy and the first oxide film 2 a housing including an oxide film (eg, the second oxide film 612 in FIG. 16A) and an electrolytic sealing formed on the first oxide film (eg, the electrolytic seal 620 in FIG. 16A); , The first oxide film is formed by a first anodizing process (eg, an anodizing process (S540) of FIG. 5) in which a first voltage is used for the aluminum alloy, and the second oxide film is formed on the aluminum alloy 2 is formed by a second anodizing process (eg, the anodizing process (S540) of FIG. 5) using a voltage, and the electrolytic sealing is formed by an electrolytic sealing process (eg, the electrolytic sealing process of FIG. 5) using a third voltage ( It may be formed by S560)).

According to various embodiments, the thickness of the electrolytic sealing may be 30 μm or less.

According to various embodiments, an acrylic resin and titanium dioxide (TiO 2 ) may be mixed in a solution used in the electrolytic sealing process.

According to various embodiments, a Celsius temperature in the electrolytic sealing process may be 0 degrees to 30 degrees.

According to various embodiments, the third voltage is direct current, and the voltage may be 40V to 150V.

According to various embodiments, the third voltage may be applied for 3 minutes or less.

According to various embodiments, the thickness of the first oxide layer may be 10 μm or less, and the thickness of the second oxide layer may be 1 μm or less.

According to various embodiments of the present disclosure, a housing (eg, the housing of FIG. 2 ) of an electronic device (eg, the electronic device 101 of FIG. 2 ) using an aluminum alloy (eg, the aluminum alloy material 606 of FIG. 16A ) (310)) is a first anodizing process (eg, an anodizing process of FIG. 5 (S540) for forming a first oxide film (eg, the first oxide film 610 of FIG. 16A) on the aluminum alloy. )), a second anodizing process for forming a second oxide film (eg, the second oxide film 612 of FIG. 16A) between the aluminum alloy and the first oxide film (eg, an anodizing process (S540) of FIG. 5) ) and an electrolytic sealing process (eg, electrolytic sealing process (S560) of FIG. 5) of forming an electrolytic sealing (eg, electrolytic sealing 620 of FIG. 16A) formed on the first oxide film, A first voltage may be applied in the first anodizing process, a second voltage may be applied in the second anodizing process, and a third voltage may be applied in the electrolytic sealing process.

According to various embodiments, the thickness of the electrolytic sealing may be 30 μm or less.

According to various embodiments, the solution used in the electrolytic sealing process may be a mixture of acrylic resin and titanium dioxide (TiO 2 ).

According to various embodiments, a Celsius temperature in the electrolytic sealing process may be 0 degrees to 30 degrees.

According to various embodiments, the third voltage is direct current, and the voltage may be 40V to 150V.

According to various embodiments, the third voltage may be applied for 3 minutes or less.

According to various embodiments, in the first anodizing process, the thickness of the first oxide film is formed to be less than 10um, and in the second anodizing process, the thickness of the second oxide film may be formed to be less than 1um.

According to various embodiments, a drying process of drying the aluminum alloy may be further included, and a Celsius temperature in the drying process may be 150 degrees to 200 degrees.

According to various embodiments, a hot water washing process of washing the aluminum alloy before the electrolytic sealing process may be further included, and water having a temperature of 80 degrees Celsius may be used in the hot water washing process.

According to various embodiments, a polishing process of buffing and polishing the aluminum alloy (eg, the buffing and polishing process (S510) of FIG. 5), and a pretreatment process of degreasing and cleaning the aluminum alloy after the polishing process (eg, FIG. 5 pretreatment process (S520)), and after the pretreatment process, a dismut process of removing metal impurities remaining in the aluminum alloy and adjusting the surface of the aluminum alloy (eg, a dismut process (S530) of FIG. 5) Further, an anodizing process (eg, an anodizing process (S540) of FIG. 5) may be performed on the aluminum alloy after the dismut process.

According to various embodiments, the polishing process may be performed by at least one of a dry method or a wet method. In the dismut process, a solution containing sulfuric acid or nitric acid at 5 g/L to 800 g/L is used, and the aluminum The deposition time of the alloy may be 5 seconds to 30 minutes.

According to various embodiments, the first voltage may be 13V to 17V, and the second voltage may be 7V.

According to various embodiments, the time during which the first voltage is applied may be 5 minutes to 40 minutes, and the time during which the second voltage is applied may be between 30 minutes and 120 minutes.

In the above, the detailed description of this document has been described with respect to specific embodiments, but it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

S510: buffing and polishing process
S520: pretreatment process
S530: Dismut Process
S540: anodizing process
S550: coloring process
S560: Electrolytic sealing process
606: aluminum alloy material
610: first oxide film
611: film pores
612: second oxide film
620: electrolytic sealing

Claims (20)

In electronic devices,
A housing, at least a portion of the housing,
aluminum alloy;
a first oxide film formed on the aluminum alloy;
a second oxide film disposed between the aluminum alloy and the first oxide film; and
A housing including an electrolytic sealing formed on the first oxide film;
The first oxide film is formed by a first anodizing process in which a first voltage is used for the aluminum alloy,
The second oxide film is formed by a second anodizing process in which a second voltage is used for the aluminum alloy,
The electrolytic sealing is an electronic device formed by an electrolytic sealing process in which a third voltage is used. According to claim 1,
The electronic device wherein the thickness of the electrolytic sealing is 30 um or less. According to claim 1,
An electronic device in which acrylic resin and titanium dioxide (TiO2) are mixed in a solution used in the electrolytic sealing process. According to claim 3,
The electronic device wherein the degree Celsius in the electrolytic sealing process is 0 degrees to 30 degrees. According to claim 1,
The third voltage is direct current, and the voltage is 40V to 150V. According to claim 1,
The third voltage is applied for 3 minutes or less. According to claim 1,
The thickness of the first oxide layer is 10 μm or less, and the thickness of the second oxide layer is 1 μm or less. A method for manufacturing a housing of an electronic device using an aluminum alloy,
a first anodizing process of forming a first oxide film on the aluminum alloy;
a second anodizing process of forming a second oxide film between the aluminum alloy and the first oxide film; and
An electrolytic sealing process of forming an electrolytic sealing formed on the first oxide film,
A first voltage is applied in the first anodizing process,
A second voltage is applied in the second anodizing process,
A method of manufacturing a housing of an electronic device to which a third voltage is applied in the electrolytic sealing process. According to claim 8,
The method of manufacturing a housing of an electronic device in which the thickness of the electrolytic sealing is 30 μm or less. According to claim 8,
The method of manufacturing a housing of an electronic device in which the solution used in the electrolytic sealing process is a mixture of acrylic resin and titanium dioxide (TiO 2 ). According to claim 10,
The method of manufacturing a housing of an electronic device in which the temperature in the electrolytic sealing process is 0 to 30 degrees Celsius. According to claim 8,
The method of manufacturing a housing of an electronic device in which the third voltage is direct current and the voltage is 40V to 150V. According to claim 8,
The method of manufacturing a housing of an electronic device in which the third voltage is applied for 3 minutes or less. According to claim 8,
In the first anodizing process, the thickness of the first oxide film is formed to 10 um or less,
In the second anodizing process, the thickness of the second oxide film is formed to be 1 μm or less. According to claim 8,
A method of manufacturing a housing of an electronic device, further comprising a drying process of drying the aluminum alloy, wherein the temperature in the drying process is 150 to 200 degrees Celsius. According to claim 8,
The method of manufacturing a housing of an electronic device further comprising a hot water washing process of washing the aluminum alloy before the electrolytic sealing process, wherein water having a temperature of 80 degrees Celsius is used in the hot water washing process. According to claim 8,
a polishing process of buffing and polishing the aluminum alloy;
After the polishing step, a pretreatment step of degreasing and cleaning the aluminum alloy; and
After the pretreatment step, further comprising a dismut process of removing metallic impurities remaining in the aluminum alloy and adjusting the surface of the aluminum alloy,
A method of manufacturing a housing of an electronic device in which an anodizing process is performed on the aluminum alloy after the dismut process. According to claim 17,
The polishing process may be performed by at least one method of dry or wet,
In the dismut process, a solution containing sulfuric acid or nitric acid of 5 g / L to 800 g / L is used, and the deposition time of the aluminum alloy is 5 seconds to 30 minutes. According to claim 8,
The method of manufacturing a housing of an electronic device in which the first voltage is 13V to 17V and the second voltage is 7V. According to claim 8,
The time for which the first voltage is applied is 5 minutes to 40 minutes,
The method of manufacturing a housing of an electronic device, wherein the time for which the second voltage is applied is 30 minutes to 120 minutes.

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