KR20230044542A - Anisotropic conductive film - Google Patents

Abstract

It is a cationically polymerizable anisotropic conductive film using an alicyclic epoxy compound, and while securing an unchanging curing temperature and connection reliability, the anisotropic conductive film having a storage life superior to that of the past is a film forming component and cationically polymerizable A binder composition containing components, a cationic polymerization initiator, and conductive particles are included. This anisotropic conductive film uses a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator, and contains an alicyclic epoxy compound and a low-polarity oxetane compound as cationic polymerization components.

Description

Anisotropic conductive film {ANISOTROPIC CONDUCTIVE FILM}

The present invention relates to an anisotropic conductive film.

BACKGROUND ART [0002] Conventionally, anisotropic conductive films in which conductive particles are dispersed in an insulating binder composition containing a polymeric compound have been widely used when electronic components such as IC chips are mounted on wiring boards. In this anisotropic conductive film, an alicyclic epoxy compound having higher cationic polymerization reactivity than general-purpose glycidyl ether-based compounds is used as a polymerizable compound in order to realize low-temperature fast curing, and there is no inhibition of polymerization by oxygen, As a polymerization initiator exhibiting dark reactivity, it has been proposed to use a sulfonium salt-based thermal acid generator that generates protons by heat (Patent Documents 1 to 3). A conventional anisotropic conductive film containing such an alicyclic epoxy compound and a sulfonium salt-based thermal acid generator exhibits a relatively low (eg, about 100°C) curing temperature.

Japanese Unexamined Patent Publication (Hei) 9-176112 Japanese Unexamined Patent Publication No. 2008-308596 International Publication No. 2012/018123

However, the anisotropic conductive film as described above has a problem that the time from manufacture to actual use becomes longer due to internationalization of commercial transactions, etc., and there is also a problem that it may be stored in a warehouse where air conditioning is not maintained, and temporary adhesiveness and There is a concern about a decrease in storage stability (storage life) from the viewpoint of indentation and the like, and a decrease in connection reliability from the viewpoint of adhesion characteristics and the like.

An object of the present invention is to enable a cationically polymerizable anisotropic conductive film using an alicyclic epoxy compound to achieve superior storage life characteristics than before while ensuring the same curing temperature and connection reliability as before.

The present inventors use a low-polarity oxetane compound in a specific ratio in addition to an alicyclic epoxy compound as a cationically polymerizable compound, and also use a quaternary ammonium salt-based thermal acid generator instead of a sulfonium salt-based thermal acid generator as a cationic polymerization initiator. By using it, it was found that it is possible to realize a more excellent storage life property than before, while ensuring the same curing temperature and connection reliability as before, and came to complete the present invention.

That is, the present invention is an anisotropic conductive film containing a binder composition containing a component for film formation and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles,

An anisotropic conductive film in which the cationic polymerization initiator is a quaternary ammonium salt-based thermal acid generator and the cationic polymerizable component contains an alicyclic epoxy compound and a low-polarity oxetane compound.

In addition, the present invention provides a connection structure in which a first electronic component and a second electronic component are anisotropically conductively connected using the anisotropic conductive film described above.

The anisotropic conductive film of the present invention containing a binder composition containing a film-forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles uses a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator, As a cationically polymerizable component, an alicyclic epoxy compound and a low-polarity oxetane compound are contained. For this reason, it is possible to realize a more excellent storage life property than before while ensuring the same curing temperature and connection reliability as before.

Hereinafter, an example of the present invention will be described in detail.

<Anisotropic Conductive Film>

The anisotropic conductive film of the present invention contains a binder composition containing a component for film formation and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles.

(binder composition)

In the present invention, the binder composition containing and holding the conductive particles contains a component for film formation and a cationically polymerizable component.

(Ingredients for film formation)

The film-forming component is a component used to form an anisotropic conductive film into a film, and is a component having film-forming ability. Examples of such film-forming components include phenoxy resins, epoxy resins, unsaturated polyester resins, saturated polyester resins, urethane resins, butadiene resins, polyimide resins, polyamide resins, and polyolefin resins. can be combined Among these, a phenoxy resin can be preferably used from the viewpoint of film formability, workability, and connection reliability.

The blending ratio of the components for film formation in the binder composition is preferably 10 to 70% by mass, more preferably 20 to 50% by mass. Within this range, sufficient film-forming ability can be exhibited.

(cationically polymerizable component)

The cationically polymerizable component is a component that cures the anisotropic conductive film, and contains an alicyclic epoxy compound and a low-polarity oxetane compound. The blending amount of the cationically polymerizable component in the binder composition is preferably 10 to 80% by mass, and more preferably 20 to 60% by mass. Within this range, a binder composition having a higher curing rate can be provided.

(alicyclic epoxy compound)

The reason for using an alicyclic epoxy compound is to impart good low-temperature fast curing properties to the anisotropic conductive film by utilizing its reactivity higher than that of general-purpose glycidyl ether type epoxy compounds. As such an alicyclic epoxy compound, those having two or more epoxy groups in the molecule are preferably mentioned. These may be liquid or solid. Specifically, diglycidyl hexahydrobisphenol A, 3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexene carboxylate, diepoxybicyclohexyl, etc. are mentioned. Among them, diglycidylhexahydrobisphenol A, particularly diepoxybicyclohexyl, can be preferably used because the light transmittance of the cured product can be secured and the curing property is also excellent.

(low polarity oxetane compound)

In the present invention, a low-polarity oxetane compound is used in combination with an alicyclic epoxy compound. The low-polarity oxetane compound is an oxetane compound having a dipole moment of 3.0 d or less, has a relatively low surface tension, can impart good leveling properties to the film of the anisotropic conductive film, and consequently improves the shelf life of the anisotropic conductive film. it becomes possible to do On the other hand, the low-polarity oxetane compound has an action of increasing the reaction start temperature and reaction end temperature measured with a differential scanning calorimeter (DSC) of an anisotropic conductive film derived from an alicyclic epoxy compound. As such a low-polarity oxetane compound, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-hydroxymethyloxetane, di[1-ethyl(3-oxetanyl)] methyl ether, 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl, and the like. Among them, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, particularly 4,4'-bis[(3-ethyl-3-oxetanyl), has a low surface tension and excellent wettability. methoxymethyl]biphenyl is preferred.

The mixing ratio of the alicyclic epoxy compound and the low-polarity oxetane compound is preferably 25:75 to 60:40, more preferably 45:55 to 60:40, and particularly preferably 50:50 to 55 based on mass. :45. If the blending amount of the low-polarity oxetane compound is increased beyond this range, the reaction start temperature and reaction end temperature tend to increase, and conversely, if it decreases, the storage life tends to decrease. Therefore, it is possible to control the reaction start temperature and reaction end temperature of the anisotropic conductive film by adjusting the mixing ratio of the alicyclic epoxy compound and the low-polarity oxetane compound, and also by adjusting the temperature increase rate during the reaction, the reaction time It is also possible to control

The binder composition, if necessary, other epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, novolak type epoxy resins, and modified epoxy resins thereof, silane coupling agents, fillers, softeners, accelerators, anti-aging agents, It may contain colorants (pigments, dyes), organic solvents, ion catchers, and the like. Moreover, a (meth)acrylate compound and a radical polymerization initiator can be contained as needed. Here, as a (meth)acrylate compound, the conventionally well-known (meth)acrylate monomer can be used. For example, a monofunctional (meth)acrylate-based monomer or a bifunctional or higher multifunctional (meth)acrylate-based monomer may be used. Here, (meth)acrylate includes acrylate and methacrylate. Moreover, as a radical polymerization initiator, well-known radical polymerization initiators, such as an organic peroxide and azobis buritonitrile, can be contained.

(conductive particle)

The anisotropic conductive film of the present invention contains conductive particles in the binder composition in order to enable anisotropic conductive connection. As the conductive particles, it can be appropriately selected and used from those used in conventionally known anisotropic conductive films. Examples thereof include metal particles such as nickel, cobalt, silver, copper, gold, and palladium, alloy particles such as solder, and metal-coated resin particles. You may use 2 or more types together.

The average particle size of the conductive particles is preferably 2.5 μm or more and 30 μm or less, more preferably 3 μm, in order to be able to cope with fluctuations in wiring height, to suppress an increase in conduction resistance, and to suppress occurrence of a short circuit. μm or more and 9 μm or less. The particle size of the conductive particles can be measured with a general particle size distribution analyzer, and the average particle diameter can also be obtained using the particle size distribution analyzer.

Further, when the conductive particles are metal-coated resin particles, the particle hardness (20% K value; compressive elastic deformation characteristic K ₂₀ ) of the resin core particles is preferably 100 to 1000 kgf/mm 2 , or higher, in order to obtain good connection reliability. Preferably it is 200 to 500 kgf/mm 2 . The compressive elastic deformation characteristic K ₂₀ can be measured at a measurement temperature of 20°C using, for example, a micro compression tester (MCT-W201, manufactured by Shimadzu Corporation).

The amount of conductive particles present in the anisotropic conductive film is preferably 50 or more and 100,000 or less, more preferably 200 per 1 square mm, in order to suppress a decrease in the conductive particle trapping efficiency and suppress occurrence of a short circuit. More than 70000 less than. This amount can be measured by observing the thin film of the material with an optical microscope. In addition, before the anisotropic conductive connection, since the conductive particles in the anisotropic conductive film are present in the binder composition, it may be difficult to observe them with an optical microscope. In such a case, you may observe the anisotropic conductive film after anisotropic conductive connection. In this case, the existing amount can be calculated in consideration of the change in film thickness before and after connection.

In addition, the amount of conductive particles present in the anisotropic conductive film can also be expressed in terms of mass. In this case, the amount of the anisotropic conductive film is preferably 1 part by mass or more and 30 parts by mass or less, more preferably 3 parts by mass or more and 10 parts by mass or less, in 100 parts by mass when the total mass of the anisotropic conductive film is 100 parts by mass. is the amount that goes

(cationic polymerization initiator)

The anisotropic conductive film of the present invention contains a quaternary ammonium salt-based thermal acid generator instead of a sulfonium salt-based thermal acid generator as a cationic polymerization initiator. This is to improve storage life. As such a quaternary ammonium salt-based thermal acid generator, a quaternary ammonium cation, hexafluoroantimonic acid anion, hexafluorophosphate anion, trifluoromethanesulfonic acid anion, perfluorobutanesulfonic acid anion, dinonylnaphthalenesulfonic acid anion, p -Salts with toluenesulfonic acid anion, dodecylbenzenesulfonic acid anion, or tetrakis(pentafluorophenyl)borate anion; and the like. Moreover, as a quaternary ammonium cation, the cation represented by NR1R2R3R4 ⁺ is mentioned. Here, R1, R2, R3, and R4 are straight-chain, branched-chain or cyclic alkyl or aryl groups having 1 to 12 carbon atoms, and may each have a hydroxyl group, a halogen, an alkoxyl group, an amino group, an ester group, or the like.

As a specific example of the quaternary ammonium salt-based thermal acid generator, King Industries, Inc. manufactured CXC-1612, CXC-1733, CXC-1738, TAG-2678, CXC-1614, TAG-2689, TAG-2690, TAG-2700, CXC-1802-60, CXC-1821 and the like. These can be obtained from Kusumoto Chemical Co., Ltd.

The layer thickness of the anisotropic conductive film of the present invention is preferably 3 to 50 μm, more preferably 5 to 20 μm.

(Manufacture of anisotropic conductive film)

The anisotropic conductive film of the present invention can be produced by dissolving conductive particles and a cationic polymerization initiator in the binder composition described above in an organic solvent such as toluene to form a paint, and forming the paint into a film using a known film forming method. there is.

Further, the anisotropic conductive film of the present invention may be a single layer, but in order to reduce the manufacturing cost by suppressing the amount of conductive particles used and to omit the underfill filling operation, without deteriorating the particle trapping property during anisotropic conductive connection, the insulating property A resin layer may be laminated. In that case, the anisotropic conductive film of the present invention has a two-layer configuration of a conductive particle-containing layer/insulating resin layer. Such an insulating resin layer can basically be formed from a composition obtained by blending a cationic polymerization initiator without containing conductive particles in a binder composition used as an anisotropic conductive film.

In the anisotropic conductive film of the present invention, from the viewpoint of controlling the reaction rate, it is preferable to adjust the reaction start temperature of the reaction peak measured with a differential scanning calorimeter to 60 to 80°C, and further adjust the reaction end temperature to 155 to 185°C. do. These adjustments can be performed by adjusting the blending ratio of the alicyclic epoxy compound and the low-polarity oxetane compound.

<connection structure>

The anisotropic conductive film of the present invention is preferably applied to anisotropic conductive connection between a first electronic component such as an IC chip, an IC module, and an FPC, and a second electronic component such as a plastic substrate, a glass substrate, a rigid substrate, a ceramic substrate, and an FPC. can do. With such an anisotropic conductive film of the present invention, a connection structure in which the first electronic component and the second electronic component are anisotropically conductively connected is also part of the present invention. In addition, as a connection method of electronic components using an anisotropic conductive film, a known method can be used.

Example

Hereinafter, the present invention will be described in more detail with examples.

<Example 1>

(Formation of conductive particle-containing layer)

60 parts by mass of phenoxy resin (YP-50, Shin-Nittetsu Smiking Chemical Co., Ltd.), 10 parts by mass of diepoxybicyclohexyl (Celoxide 8000, Daicel Co., Ltd.) as an alicyclic epoxy compound, low polarity Oxetane compound (OXBP, Ube Industries Co., Ltd.) 20 parts by mass, thermal cationic polymerization initiator (quaternary ammonium salt-based thermal acid generator, trade name CXC-1612, Kusumoto Chemical Co., Ltd.) 2 parts by mass and average particle size 3 50 parts by mass of micrometer conductive particles (Ni/Au plated resin particles, AUL704, Sekisui Chemical Industries, Ltd.) were added to toluene to prepare a liquid mixture so that the solid content was 50% by mass.

The obtained liquid mixture was applied onto a polyethylene terephthalate release film (PET release film) having a thickness of 50 μm to a dry thickness of 6 μm, and dried in an oven at 60° C. for 5 minutes to form a layer containing conductive particles.

(Formation of insulating resin layer)

Except for not using conductive particles, the same raw materials as those used in forming the conductive particle-containing layer were added to toluene to prepare a liquid mixture so that the solid content was 50% by mass.

The obtained liquid mixture was applied onto a PET release film having a thickness of 50 μm to a dry thickness of 12 μm, and dried in an oven at 60° C. for 5 minutes to form an insulating resin layer.

(Production of anisotropic conductive film)

An insulating resin layer was laminated on the conductive particle-containing layer at 60°C and 5 MPa to obtain an anisotropic conductive film sandwiched by a pair of PET release films having a thickness of 50 µm.

<Examples 2 to 4>

An alicyclic epoxy compound (Celoxide 8000, Daicel Co., Ltd.) and 4,4'-bis[(3-ethyl-3-oxetanyl) as a low-polarity oxetane compound in the conductive particle-containing layer and the insulating resin layer An anisotropic conductive film was obtained in the same manner as in Example 1, except that the compounding amount (ratio) of methoxymethyl]biphenyl (OXBP, Ube Industries Co., Ltd.) was changed as shown in Table 1.

<Comparative Examples 1 to 4>

Examples except that the thermal cationic polymerization initiator in the conductive particle-containing layer and the insulating resin layer was replaced with a sulfonium salt-based thermal acid generator (SI-60L, Sanshin Chemical Industry Co., Ltd.) as shown in Table 1. An anisotropic conductive film was produced in the same manner as 1 to 4.

<Examples 5 to 13, Comparative Example 5>

Table 1 shows the compounding amounts (ratio) of an alicyclic epoxy compound (Celoxide 8000, Daicel Co., Ltd.) and a low-polarity oxetane compound (OXBP, Ube Industries Co., Ltd.) in the conductive particle-containing layer and the insulating resin layer. An anisotropic conductive film was produced in the same manner as in Example 1 except for changing as shown.

<<Rating>>

About the anisotropic conductive film obtained in each Example and Comparative Example, "storage life characteristic", "curing temperature", "adhesion characteristic", and "reaction time" were tested or measured and evaluated as described below.

<Storage life characteristics>

The anisotropic conductive film sandwiched by a pair of PET peeling films was put into a constant temperature and humidity room set at a humidity of 40% and a temperature of 25 ° C. or 30 ° C., and sampling was performed every 24 hours after injection, and the following temporary adhesion evaluation and Compression evaluation was performed, and storage life characteristics were comprehensively evaluated from the evaluation results. The obtained results are shown in Table 1.

(Evaluation of temporary adhesion)

The PET peeling film on the conductive particle-containing layer side of the anisotropic conductive film was peeled off, and the anisotropic conductive film was adhered to the unprocessed glass on the conductive particle-containing layer side to prepare a laminate of the unprocessed glass and the anisotropic conductive film. This laminate was placed so that the unprocessed glass side was in contact with a hot plate set at 45°C, and pressure was applied by hand from the anisotropic conductive film side, and then cooled to room temperature. After cooling, the PET release film on the insulating resin layer side was peeled off from the laminate, and it was confirmed whether or not only the PET release film was peeled without the anisotropic conductive film being separated from the unprocessed glass.

(squeeze evaluation)

An anisotropic conductive film was sandwiched between the test IC chip and the test substrate so that an insulating resin layer was disposed on the IC chip side, and heating and pressurization (120°C, 60 MPa, 5 seconds) was performed to prepare a connected object for evaluation. The state of the indentation of the fabricated connected object was confirmed, and it was confirmed that the indentation remained without thinning or disappearing.

(Evaluation of storage life characteristics)

In the evaluation of temporary adhesion, the time point at which the anisotropic conductive film was peeled off from the unprocessed glass was defined as the storage life. In addition, in the temporary adhesion evaluation, even when the anisotropic conductive film was not peeled off from the unprocessed glass, in the crimping evaluation, the point at which the indentation became thin (disappeared) was defined as the storage life.

<curing temperature>

Between the test IC chip and the test substrate, an anisotropic conductive film is sandwiched so that an insulating resin layer is disposed on the IC chip side, and heating and pressing (80 ° C, 90 ° C, 100 ° C, 110 ° C, or 120 ° C, 60 MPa, 5 seconds) ), and a connection for evaluation was obtained. The reaction rate of the anisotropic conductive film in this connection was measured so as to be described below, and the curing temperature was determined from the measurement result. The obtained results are shown in Table 1.

(response rate measurement)

The IC chip of the connected object for evaluation was picked up and peeled off, and the cured anisotropic conductive film was exposed, and the anisotropic conductive film was sampled. The obtained sample was dissolved in acetonitrile to a concentration of 0.1 g/mL. Separately, the anisotropic conductive film before curing was dissolved in acetonitrile so as to have the same concentration, and the peak intensity of each monomer was confirmed using HPLC-MS (WaterS Co.) under the following conditions. The reaction rate at each temperature was determined from the decrease in peak intensity after curing, and the temperature at which the reaction rate was 80% or more was determined as the curing temperature.

Solvent: mixed solvent obtained by mixing 40 parts by mass of acetonitrile with 60 parts by mass of a mixed solution of water/acetonitrile (90/10)

flux: 0.4mL/min

Column: 10 cm, 40 °C

Injection volume: 5 μL

Analytical wave: 210-410 nm

<Adhesion characteristics>

Between the test IC chip and the test substrate, an anisotropic conductive film was sandwiched so that an insulating resin layer was disposed on the IC chip side, and heating and pressurization (120° C., 60 MPa, 5 seconds) was performed to obtain a connected object for evaluation. About this connected thing, the pressure cooker test (PCT) was implemented using Etaksa, model EHS-411M. Specifically, the obtained connected objects for evaluation were put into a constant temperature and humidity chamber set under the conditions of 121°C, 2 atm, and a saturated steam atmosphere, and the following adhesion evaluation was performed every 24 hours. The obtained results are shown in Table 1.

(adherence evaluation)

The external appearance of the connected object put into the PCT test was confirmed, and it was visually observed whether peeling occurred between the layers of the anisotropic conductive film and the IC chip or substrate.

by rank

○: When peeling is not observed even after PCT for 48 hours after IC compression

△: After IC compression, peeling was not observed in the 24-hour PCT test, but peeling was observed in the 48-hour PCT test.

x: When peeling is already observed after IC compression and before PCT is performed, or when peeling is observed in 24-hour PCT

<reaction time>

A sample of about 5 mg cut out from the obtained anisotropic conductive film was stored in an aluminum PAN (TA Instruments Inc.), set in a DSC measuring device (Q2000, TA Instruments Inc.), and 30 ° C. to 250 ° C., 10 ° C. Differential Scanning Calorimetry (DSC) measurements were performed at a heating rate of /min. From the obtained DSC chart, the temperature at the time when the exothermic peak rose was read as the reaction start temperature, and the temperature at the time when the exothermic peak changed to the base line was read as the reaction end temperature. In addition, reaction time was computed according to the following formula. The obtained results are shown in Table 1.

Reaction time (minutes) = (reaction end temperature (°C)-reaction start temperature (°C))/10 [°C/minute]

<<Consideration of evaluation results>>

From the results of Table 1 (Compare Example 1 and Comparative Example 1, Example 2 and Comparative Example 2, Example 3 and Comparative Example 3, Example 4 and Comparative Example 4), sulfonium salt system If a quaternary ammonium salt-based thermal acid generator is used instead of the thermal acid generator, even if there is a change in the mixing ratio between the alicyclic epoxy compound and the low polarity oxetane compound, the curing temperature and adhesion characteristics, which are evaluation indicators of connection reliability, will not change. It was found that the storage life can be greatly improved without

In addition, from the comparison of Examples 1, 5 to 7 and Comparative Example 5, as the blending ratio of the low-polarity oxetane compound to the alicyclic epoxy compound increases, the storage life tends to improve, but the alicyclic epoxy compound is relatively It was found that when the compounding amount of the compound is decreased, the adhesion property tends to decrease. Conversely, from the comparison of Examples 8 to 13, it was found that the storage life tended to decrease as the blending ratio of the low-polarity oxetane compound to the alicyclic epoxy compound decreased.

Further, from the comparison of the DSC measurement results in Example 1, Examples 5 to 13, and Comparative Example 5, it can be seen that as the compounding amount of the low-polarity oxetane compound increases, the reaction start temperature and reaction end temperature tend to increase. there was.

The cationically polymerizable anisotropic conductive film of the present invention using an alicyclic epoxy compound has a curing temperature equivalent to that of a conventional anisotropic conductive film using a sulfonium salt-based thermal acid generator and connection reliability, while providing superior storage life than before. Since it can be realized, it is useful for anisotropic conductive connection of electronic components such as IC chips to wiring boards.

Claims (12)

An anisotropic conductive film containing a binder composition containing a component for film formation and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles,
The cationic polymerization initiator is a quaternary ammonium salt-based thermal acid generator, the cationically polymerizable component contains an alicyclic epoxy compound and a low-polarity oxetane compound, and the blending ratio of the alicyclic epoxy compound and the low-polarity oxetane compound is based on mass 1:8 to 2:1,
An anisotropic conductive film having a reaction start temperature of 65°C or more and less than 100°C, and a reaction end temperature of 150°C or more and less than 230°C, as measured by a differential scanning calorimeter. The anisotropic conductive film according to claim 1, wherein the reaction start temperature of the reaction peak measured by differential scanning calorimetry is 65°C or more and 90°C or less, and the reaction end temperature is 150°C or more and 200°C or less. The quaternary ammonium salt-based thermal acid generator according to claim 1, wherein the quaternary ammonium cation, hexafluoroantimonic acid anion, hexafluorophosphate anion, trifluoromethanesulfonic acid anion, perfluorobutanesulfonic acid anion, dinonylnaphthalene An anisotropic conductive film that is a salt with a sulfonic acid anion, p-toluenesulfonic acid anion, dodecylbenzenesulfonic acid anion or tetrakis(pentafluorophenyl)borate anion. The anisotropic conductive film according to claim 3, wherein the quaternary ammonium cation is a cation represented by NR1R2R3R4 ⁺ , and R1, R2, R3 and R4 are linear, branched or cyclic alkyl groups having 1 to 12 carbon atoms or aryl groups. The method of claim 1, wherein the alicyclic epoxy compound is diglycidylhexahydrobisphenol A or diepoxybicyclohexyl, and the low polarity oxetane compound is 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane or An anisotropic conductive film that is 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl. The anisotropic conductive film according to claim 1, wherein the film forming component is a phenoxy resin. The anisotropic conductive film according to claim 1, wherein the reaction start temperature of the reaction peak measured by differential scanning calorimetry is 68°C or more and 72°C or less, and the reaction end temperature is 158°C or more and 180°C or less. The anisotropic conductive film according to claim 1, further comprising an insulating resin layer. The anisotropic conductive film according to claim 1, wherein the conductive particles are metal particles, alloy particles, or metal-coated resin particles. The anisotropic conductive film according to claim 1, wherein the conductive particles are a combination of two or more types of conductive particles. A connection structure in which a first electronic component and a second electronic component are anisotropically conductively connected with the anisotropic conductive film according to any one of claims 1 to 10. A method for manufacturing a bonded structure comprising anisotropically conductively connecting a first electronic component and a second electronic component using the anisotropic conductive film according to any one of claims 1 to 10.