KR20230040858A - A defect device automatic inspection apparatus using an ultrasonic probe and an inspection method using the same - Google Patents

Abstract

The present invention provides an ultrasonic inspection apparatus including high inspection accuracy and rapid inspection speed at the same time. The ultrasonic inspection apparatus detecting a defect of an object to be inspected through ultrasonic scanning includes: a loader magazine module including a loading unit moving the object to be inspected, wherein at least one object to be inspected is loaded in a predetermined arrangement state; a conveyor module receiving the object to be inspected by the loading unit positioned at a front end and transferring the object to be inspected in a first direction; an ultrasonic scanning module performing the ultrasonic scanning on the object to be inspected positioned on the conveyor module and including an ultrasonic probe array formed to correspond to the arrangement of the object to be inspected; and an unloader magazine module loading the object to be inspected on the conveyor module in the predetermined arrangement state by using an unloading unit arranged at a rear end of the conveyor module in the first direction.

Description

A defect device automatic inspection apparatus using an ultrasonic probe and an inspection method using the same}

The present invention relates to an automatic inspection device for defective devices using an ultrasonic probe and an inspection method using the same. More specifically, it relates to a system and method for inspecting whether or not a defect exists inside a packaged object without damaging it using an ultrasonic probe array.

A technology that acquires an internal image of an examination target by using a signal having a frequency in the ultrasonic wave range can detect internal defects without deforming the medical field or manufacturing results targeting internal organs or fetuses during pregnancy. It is widely used in the field of non-destructive testing (NDT).

Defect detection by ultrasonic inspection may also be performed on a semiconductor device having a complicated circuit pattern. Conventionally, ultrasonic inspection may be performed for purposes such as selecting only some of finished semiconductor devices and calculating a defect rate. However, in relation to autonomous driving technology that has recently been developed, standards for defect inspection of semiconductors for autonomous vehicles are gradually being strengthened in order to prevent vehicle accidents due to defective devices.

As a prior art, Korea Patent Publication No. 10-2014-0001138 'ultrasonic inspection device and ultrasound inspection method' is disclosed. The prior art discloses a structure capable of acquiring stable inspection images by forming an adjustable distance between a lens and a surface of a workpiece (meaning 'object under examination') through a holder and a height adjusting means.

However, since the prior art does not disclose a structure for simultaneously inspecting a plurality of objects, a problem in which a work speed is inevitably low occurs in a field requiring total inspection.

Therefore, in areas where a very high level of manufacturing quality is required, such as autonomous driving, 100% inspection of semiconductor devices, rather than selective inspection, is performed with high inspection precision so that potential defective elements of semiconductor devices can be detected in advance. It may be required to develop an improved ultrasonic inspection device that can reduce the time required for inspection.

Korean Patent Publication No. 10-2014-0001138

The technical problem to be solved by the present invention is to propose an ultrasonic inspection system having high inspection precision and high inspection speed at the same time and a method using the same. In particular, an optimized structure for simultaneously examining a plurality of subjects is proposed.

One embodiment of the present invention for solving the above problems is an ultrasonic inspection system for detecting defects in a subject through ultrasonic scanning, wherein at least one subject is loaded in a preset arrangement, and the subject is loaded in a preset arrangement. Loader magazine module provided with a loading unit for moving the; a conveyor module for receiving a test object and transporting the test object in a first direction by the loading unit located at the front end; an ultrasound scanning module that performs ultrasound scanning on a subject positioned on the conveyor module and includes an ultrasound probe array formed to correspond to the arrangement of the subject; An unloader magazine module for loading the test object on the conveyor module in a preset arrangement state through an unloading unit disposed at a rear end of the conveyor module in the first direction; The conveyor module includes: a transfer unit extending in the first direction and moving the object under test in the first direction; and a shuttle jig disposed on the transport unit and transporting the test object in the first direction in a seated state. The shuttle jig is formed to seat the subject in an M*N matrix arrangement (M and N are natural numbers), and the ultrasound probe array includes parallel ultrasound probes corresponding to the M rows. An ultrasonic inspection system arranged in a structure is provided.

In addition, the ultrasonic probe array may be formed of dual ultrasonic probes in which M is 2.

In addition, the ultrasound scanning module may include a first ultrasound probe array configured to ultrasound scan an upper surface of the object under examination; and a second ultrasound probe array for ultrasound scanning the lower surface of the subject. And, based on the first direction, between the first and second ultrasound probe arrays, inversion of flipping the object for which ultrasound scanning has been completed by the first ultrasound probe array in a preset manner module; Further, the second ultrasonic probe array may be formed to receive the object under examination in a vertically inverted state by the inversion module.

In addition, the inversion module may include a flipping unit disposed outside the transfer unit 112 and flipping the object under test so that the upper and lower sides are reversed; and a pick-up unit provided above the conveyor module to move the subject on the shuttle jig to the flipping unit and move the subject to be inspected upside down by the flipping unit to its original position on the shuttle jig; can include

In addition, the flipping part and the pickup part are formed to extend in the first direction and are configured in a form corresponding to the 1 * N matrix, and the pickup part moves the subject by the number of times corresponding to the M row. It reciprocates between the jig and the flipping unit, and the reciprocating direction may be a second direction perpendicular to the first direction.

In addition, the ultrasonic inspection system may include an alignment check module for determining whether the subject is in the right position on the shuttle jig; The alignment confirmation module further includes an index sensor provided below the shuttle jig and a detection hole formed at a preset position in each of the shuttle jig to check whether the object under test is in the correct position on the shuttle jig. 1 alignment unit; Including, the first alignment unit, by the conveyor module, may be based on the transfer speed control of the shuttle jig.

In addition, the alignment checking module may include a second aligning unit that checks whether an object under test is positioned on the shuttle jig by using a detection camera configured to recognize reference marks previously set on each of the shuttle jigs; The ultrasonic scanning module may be disposed at a rear end of the second aligning unit based on the first direction.

In addition, the alignment check module may include a third alignment unit configured to correct reference marks preset in each of the shuttle jigs based on image information generated by the ultrasonic probe array; may further include.

On the other hand, the present invention is a method using the above-described ultrasonic inspection system, (a1) using an index sensor provided at the lower side of the shuttle jig and a detection hole formed at a preset position in each of the shuttle jig, but controlling the transfer speed of the shuttle jig A first alignment step of determining whether or not the subject is in the right position based on; (a2) a second aligning step of checking whether the subject is in the right position by using a detection camera configured to recognize a preset reference mark on each of the shuttle jigs; and (a3) a third aligning step configured to calibrate preset reference marks on each of the shuttle jigs based on image information generated by the ultrasonic probe array. Including, it provides a method.

In addition, after the step (a2) and before the step (a3), (a21) adjusting the height of the ultrasonic probe array based on the result of the step (a2); (a22) performing ultrasound scanning on an upper surface of the object through a first ultrasound probe array of the ultrasound scanning module; (a23) performing primary drying on the test subject in a preset manner; (a24) inverting the top and bottom of the object through an inversion module; (a25) performing ultrasonic scanning on the lower surface of the object through a second ultrasonic probe array of the ultrasonic scanning module; and (a26) performing secondary drying on the test subject in a preset manner; Steps (a21) to (a26) may be sequentially performed through a conveyor module that transports the object in the first direction.

The effects of the present invention are as follows.

Since an ultrasound probe array having a specific structure composed of a plurality of probe elements can be used instead of a single ultrasound probe conventionally used for ultrasound inspection, a surface-based inspection by an array structure rather than a conventional line-based inspection can be performed. Therefore, the accuracy and speed of ultrasound examination can be improved.

In particular, when a direction in which an ultrasonic signal for defect inspection is irradiated is specified in order to reduce the influence of ultrasonic scattering due to a protruding shape of the detailed circuit pattern, it may be possible to detect a latent defect existing in the vicinity of the detailed circuit pattern.

1 is an overall conceptual diagram of an ultrasonic inspection system according to the present invention.
2 is a schematic overall perspective view of an ultrasound inspection system according to the present invention.
3 is a plan view of an ultrasonic inspection system according to the present invention.
4 is a schematic perspective view of a conveyor module of an ultrasonic inspection system according to the present invention, showing an alignment check module together.
5 is a schematic perspective view of an ultrasonic scanning module of an ultrasonic inspection system according to the present invention.
6 is a schematic perspective view of an inversion module of an ultrasonic inspection system according to the present invention.
7 is a perspective view schematically illustrating a hot chamber part of a drying module of an ultrasonic inspection system according to the present invention.
8 is a schematic diagram schematically showing an ultrasonic probe of an ultrasonic inspection system according to the present invention.
9 is a reference diagram for explaining a method of generating an image of an interface pattern of a subject using an ultrasonic probe array.
10 is a flow chart of a method for determining whether an object under examination is in a correct position on a shuttle jig according to the present invention.
11 is a schematic diagram of the entire process of the ultrasonic inspection system according to the present invention.
FIG. 12 is a flowchart for explaining the schematic diagram of FIG. 11 .
13 shows result data obtained by examining a subject using the ultrasonic inspection system according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following description is only for specifying the embodiments, and is not intended to limit or limit the scope of rights according to the present invention. What a person skilled in the art can easily infer from the detailed description and examples of the present invention should be construed as belonging to the scope of the present invention.

The terms used in the present invention have been described as general terms widely used in the technical field related to the present invention, but the meanings of the terms used in the present invention are the intentions of technicians working in the field, the emergence of new technologies, examination standards or precedents. etc. may vary. Some terms may be arbitrarily selected by the applicant, and in this case, the meanings of the arbitrarily selected terms will be described in detail. Terms used in the present invention should be interpreted as meanings reflecting the overall context of the specification, not just dictionary meanings.

Terms such as 'consisting' or 'comprising' used in the present invention should not be construed as necessarily including all of the components or steps described in the specification, and if some components or steps are not included, and when additional components or steps are further included, it should also be construed as intended from the term.

Terms to be described later are terms defined in consideration of functions in the present invention, and may vary according to intentions or customs of users, operators, and designers. Therefore, the definition should be made based on the contents throughout this specification.

As used herein, 'subject' includes a semiconductor device to be inspected, includes all objects that can be inspected using ultrasonic irradiation, and is also referred to as a work. In the present application, description is made on the premise that the object under test is planar, but the shape of the object under test is not limited thereto.

Also, 'first direction' as used herein refers to an extension direction of conveyor modules (rails and belts). That is, the extending direction of the conveyor module is used herein to mean the conveying direction of the subject. Also, 'second direction' means the width direction of the conveyor module. Based on the horizontal direction, the first direction and the second direction mean directions perpendicular to each other.

In the term 'matrix' used herein, for convenience of explanation, the first direction means 'column' and the second direction means 'row'.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. A detailed description of matters widely known to those skilled in the art will be omitted.

Overall composition of the ultrasonic inspection system

1 is an overall conceptual view of an ultrasonic inspection system according to the present invention, FIG. 2 is a schematic overall perspective view of the ultrasonic inspection system according to the present invention, and FIG. 3 is a plan view of the ultrasonic inspection system according to the present invention.

1 to 3, the ultrasonic inspection system according to the present invention includes a loader magazine module 101, a conveyor module 110, an ultrasonic scanning module 120, a reversal module 130, and an unloader magazine. (unloader magazine) module 102.

The loader magazine module 101 is loaded with at least one test object in a magazine state in a preset arrangement, and is provided with a loading unit 111 for moving the test object. Specifically, the loading unit 111 may transport an object to be examined within an ultrasound examination system. The loading unit 111 may move the object loaded in the form of a magazine on the front side of the ultrasonic inspection system to the conveyor module 110 .

Here, the conveyor module 110 performs the function of 'ultrasonic inspection stage', and the object under examination is moved to the shuttle jig 113 on the conveyor module 110 by the loading unit 111 for ultrasonic inspection. At this time, the loading unit 111 may transport the object to a location for DMC engraving and barcode inspection. As in the illustrated example, the loading unit 111 may be configured in a push-and-pull structure, and the magazine may be located at the front end of the conveyor module 110 in a predetermined unit.

In FIG. 2 , the magazine is composed of 5 rows, and the loading unit 111 is configured to transfer the stacked magazines through a guide unit set in advance and then seat them on the conveyor module 110 . As an example, assuming that the loading unit 111 of the ultrasound examination system according to the present invention takes 8 seconds to move a unit subject, and the shuttle jig 113 has a structure capable of seating 8 subjects, the shuttle In placing the test subject on the jig 113, it takes a short time of 64 seconds in total.

The loading unit 111 may be implemented in the form of a robot arm, or may be implemented in another type of mechanical structure having an element carrying function, but is not limited to the form shown in the drawings in advance. specify

The conveyor module 110 receives a test object through the loading unit 111 and performs a function of transporting the test object in a first direction.

The conveyor module 110 is composed of a transfer unit 112, a shuttle jig 113 and a driving unit 114. The transfer unit 112 supports the shuttle jig 113 to be movable and serves to guide the movement of the shuttle jig 113 . To this end, the transfer unit 112 extends in the first direction, and the transfer unit 112 is connected to the driving unit 114 to receive power from the driving unit 114 . By the operation of the driving unit 114, the transfer unit 112 continuously moves in the first direction, but stops at each preset individual section to perform an ultrasonic test.

Regarding the above section, the conveyor module 110 according to the present invention is largely divided into the following five sections (or areas).

The 'first period' is a period in which the loader magazine module 101 operates.

The 'second period' is a period in which ultrasound scanning is performed by the first ultrasound probe array 121 .

The 'third period' is a period in which the subject is flipped by the inversion module 130 .

The 'fourth period' is a period in which ultrasound scanning is performed by the second ultrasound probe array 122 .

The 'fifth period' is a period in which the unloader magazine module 101 operates.

Here, the first to fifth sections are sequentially formed along the first direction, and the processor 160 is interlocked with the driving unit 114 to control the operation of the driving unit 114 according to preset conditions. . For example, while ultrasound scanning is being performed by the first ultrasound probe array 121 in the second section, the driving unit 114 does not operate, thereby maintaining the stationary state of the transfer unit 112. After the ultrasonic inspection is completed on the upper surface of the subject by the first ultrasound probe array 121 and image information is acquired, the processor 160 is configured to transmit an operation signal to the driving unit 114 .

The shuttle jig 113 is coupled to the transfer unit 112 and provides a space in which the subject can be stably seated. That is, the test subject is configured to move in the first direction while seated on the shuttle jig 113 . At this time, the shuttle jig 113 is formed to seat the subject in an M*N matrix arrangement (M and N are natural numbers). 2 to 4 show an exemplary structure in which M=2 and N=4. That is, one unit of the shuttle jig 113 can transfer a total of 8 objects at the same time.

As described above, the shuttle jig 113 simultaneously transports a plurality of objects under test, and the driving unit 114 operates based on the arrangement of the shuttle jig 113. Instead of moving continuously, the shuttle jig is moved discontinuously so that ultrasonic inspection (or scanning) is performed row by row. That is, it can be moved in the first direction by a scanning unit.

The ultrasonic scanning module 120 is a component that performs ultrasonic scanning on an object mounted on the shuttle jig 113 moving on the conveyor module 110 .

The ultrasonic scanning module 120 includes ultrasonic probe arrays 121 and 122 . The ultrasonic probe arrays 121 and 122 may irradiate the object under test with a test signal having a frequency in the ultrasonic range, and accordingly measure an echo signal reflected from the boundary surface of each layer of the object under test. The ultrasonic probe arrays 121 and 122 may be composed of a plurality of probe elements 124d rather than a single probe, and thus perform 'plane-based' scanning rather than 'line-based' scanning. can do.

In the ultrasonic scanning process, ultrasonic signals and echo signals may be transmitted through an ultrasonic transmission medium. For example, when an ultrasonic signal and an echo signal are transmitted through an ultrasonic transmission medium such as water, the attenuation in the high frequency region may be reduced compared to the case where the ultrasonic signal and the echo signal are transmitted through air, so that a more smooth defect inspection can be performed. . In addition to the exemplified water, other appropriate types of materials capable of preventing signal attenuation may be used as a medium for transmitting ultrasound.

The shape of the ultrasonic probe arrays 121 and 122 is formed to correspond to the shape of the shuttle jig 113, so that the ultrasonic inspection efficiency can be maximized. Although the ultrasonic probe arrays 121 and 122 may be configured in the same manner as the arrangement of the shuttle jig 113 described above, considering that ultrasonic probes are expensive, the ultrasonic probe arrays 121 and 122 are ultrasonic probes 121a. , 122a) is preferably arranged in a parallel structure corresponding to the above M row.

Referring to FIG. 5 , the ultrasonic probe arrays 121 and 122 are formed of dual ultrasonic probes with M=2, and thus can perform ultrasonic scanning of two units of the subject at the same time. At this time, the driver 114 is configured to move the shuttle jig 113 by a distance corresponding to the ultrasonic scanning interval. Of course, the ultrasonic probe arrays 121 and 122 may be formed in a structure in which ultrasonic scanning is performed while the shuttle jig 113 is moved in the first direction by the driving unit 114 in a fixed state, but on the contrary, ultrasonic The probe arrays 121 and 122 may be combined with a separate driving device to perform ultrasonic scanning while the ultrasonic probe arrays 121 and 122 move in a first direction or in a direction opposite to the first direction. This can be optimally designed according to the designer's choice.

Meanwhile, the semiconductor substrate of the object under test may have an upper surface semiconductor pattern formed on an upper surface of the substrate and a lower surface semiconductor pattern formed on a lower surface of the substrate. Illustratively, according to the semiconductor packaging design, substantial detailed circuit patterns among the upper and lower surfaces may be formed on one surface, and an additional pattern such as a heat dissipation structure may be formed on the other surface.

Considering this point, the ultrasonic scanning module 120 may be designed in various ways. For example, the ultrasonic scanning module 120 may be designed in a simultaneous up-and-down measurement method, and as a result, a top image of the top semiconductor pattern and a bottom image of the bottom semiconductor pattern may be generated.

However, when ultrasonic scanning of the upper and lower surfaces is simultaneously performed by an ultrasonic probe array and an additional ultrasonic probe array in the vertical simultaneous measurement method, the overall image is blurred due to the effect of ultrasonic scattering due to the three-dimensional structure of the detailed circuit pattern. Since there is a problem in obtaining, it is more preferable to design the top and bottom separate measurement method rather than the top and bottom simultaneous measurement method. Hereinafter, the description will be made on the premise of the 'upper and lower separate measurement method'.

Unlike the case of the above-mentioned simultaneous up and down measurement method, the 'upper and lower separate measurement method' performs ultrasonic scanning on the upper surface semiconductor pattern to generate an upper surface image, and then ultrasonic scanning is performed on the lower surface semiconductor pattern. is the way it is created.

In relation to the top and bottom separate measurement method, in the ultrasonic scanning process, after the ultrasonic scanning of the upper surface is performed by the ultrasonic probe arrays 121 and 122, an additional ultrasonic probe additionally provided to irradiate the ultrasonic signal for defect inspection on the lower surface Additional ultrasound scanning of the lower surface may be performed by the array.

The present invention provides structures of the ultrasonic scanning module 120 and the inversion module 130 optimized for the vertical separate measurement method.

The ultrasound scanning module 120 is composed of a first ultrasound probe array 121 that ultrasound scans the upper surface of the subject and a second ultrasound probe array 122 that ultrasound scans the lower surface of the subject. Here, 'upper surface' and 'lower surface' are defined based on the state of the subject before entering the ultrasonic scanning module 120, and may be divided into 'one surface' and 'other surface'.

The first ultrasonic probe array 121 will be described in detail.

8 (a) and (b) show an exemplary structure of the ultrasonic probe array, and (c) shows an operating method of the ultrasonic probe array. As shown, since the ultrasonic probe array has an array structure, it may have higher precision and scan speed compared to a single probe structure.

The ultrasonic probe arrays 121 and 122 may include a plurality of probe elements 121d arranged in a row at a constant pitch, and the size of each of the plurality of probe elements 121d and the plurality of probe elements ( 121d) may be determined according to a scanning time required for each sheet of the subject.

The plurality of probe elements 121d may be configured in the form of an oscillator to generate ultrasonic signals for defect inspection using a method such as phased array ultrasonics. A scanning speed may vary according to a pitch indicating an arrangement interval of the plurality of probe elements 121d and a size of each probe element 121d. When other factors are equal, as the pitch increases, the scanning speed may increase but the scanning resolution may decrease.

When a total inspection of a large number of devices is required, as in the case of power module devices for autonomous vehicles, there may be cases in which requirements for the time required for each device, that is, the scanning speed, are set. At this time, detailed specifications of the ultrasonic probe array, such as a pitch between probe elements or a size of each probe element, may be changed to meet the required scanning speed.

Referring to (c) of FIG. 8, the ultrasound probe arrays 121 and 122 may perform ultrasound scanning on the subject. For a device having a constant size, for example, 190 mm * 140 mm, plane scanning may be performed by one line at each scan interval.

9 is a reference diagram for explaining a method of generating an image of an interface pattern of a subject using an ultrasonic probe array.

Referring to FIG. 9 , an ultrasound scanning process 210 and an echo generation process 220 are illustrated in relation to a method of generating an image of an interface pattern of a subject using an ultrasound probe array.

In relation to the ultrasound scanning process 210, ultrasound scanning of the subject by the ultrasound probe arrays 121 and 122 may be performed through an ultrasound transmission medium. Specifically, the ultrasonic signal for defect inspection may be irradiated to the upper surface semiconductor pattern through an ultrasonic transmission medium filled between the ultrasonic probe array and the object to be inspected in order to prevent attenuation of the ultrasonic signal for defect inspection generated in the high frequency region, The medium for transmitting ultrasound may be a liquid, and the liquid may be water or a mixture having other properties that facilitate ultrasound transmission.

Ultrasonic signals for defect inspection by the ultrasonic probe arrays 121 and 122 may be irradiated to the object to be inspected through the medium and reflected at the interface between materials. As an example, the object under test may have a three-layer structure of an upper surface semiconductor pattern, a semiconductor substrate, and a lower surface semiconductor pattern, and ultrasonic signal reflection may occur at an interlayer interface or a medium-device interface.

As in the echo generation process 220, the reflected ultrasonic signal, that is, the ultrasonic echo signal, may reflect the properties of the interface material. As shown, ultrasonic echo signals having different characteristics may be generated for each type of boundary surface, and in particular, when a defect exists inside the object under test, a corresponding ultrasonic echo signal may be generated at the boundary of the corresponding defect.

Accordingly, the processor 160 may generate an interface pattern image indicating whether there is no abnormality in the interface pattern or internal defects such as cracks or peeling by analyzing the ultrasound echo signal from the object under test.

The inversion module 130 is positioned between the first and second ultrasonic probe arrays 121 and 122 in the first direction. Subjects whose ultrasound scanning has been completed by the first ultrasound probe array 121 are inverted vertically by the inversion module 130 and are provided to the second ultrasound probe array 122 in an inverted state. Through this series of processes, the upper and lower separate measurement methods can be effectively applied.

Referring to FIG. 6 , the reversal module 130 is configured to flip the object for which the first ultrasonic scanning (meaning upper surface scanning) has been completed by the first ultrasonic probe array 121 . As described above, the subject moves while being mounted on the shuttle jig 113, and ultrasonic scanning of one unit of the shuttle jig 113 is all completed and the shuttle jig 113 enters the third section. When this is completed, the inversion module 130 operates.

Specifically, the inversion module 130 is composed of a flipping unit 131 and a pickup unit 132.

The flipping unit 131 is disposed outside the transfer unit 112 and is configured to flip the object under test so that the upper and lower sides are reversed. It includes a supporter 131a and a rotating body 131b for supporting the object moved in the second direction from the pick-up unit 132 . However, the structure shown in FIG. 6 is an exemplary structure of the flipping unit 131, and any structure can be employed as long as it can stably rotate the object under test.

The support 131a is formed in a shape corresponding to the shuttle jig 113, and is configured to invert the upper and lower surfaces of the test object in a state in which a 2*4 object is accommodated. The rotating body 131b includes a rotating shaft and is disposed in a direction parallel to the first direction in order to minimize pickup efficiency and a movement line of the pickup unit 132 .

The pick-up unit 132 is provided on the upper side of the conveyor module 110, moves the subject on the shuttle jig 113 to the flipping unit 131, and flips the subject upside down by the flipping unit 131. It serves to move to the original position on the shuttle jig 113. That is, the pick-up unit 132 couples the test object on the shuttle jig 113 in a predetermined manner, lifts it upward, moves in the second direction, and moves to the support body 131a of the flipping unit 131. Move the subject to the top. The pick-up unit 132 may be configured to take out the objects loaded in the first row of the shuttle jig 113 . In the case of the shuttle jig 113 accommodating 2*4 objects, it is necessary to withdraw the objects in the first row and then the objects in the second row.

An exemplary operation of the inversion module 130 is described. First, the pick-up unit 132 takes out 4 columns (meaning 4) of objects located in 1 row of the shuttle jig 113, and then moves them onto the support 131a of the flipping unit 131 (meaning movement in the second direction). Then, the pick-up unit 132 again moves upwards on the conveyor module 110 to take out four rows of objects located in the second row of the shuttle jig 113, and then moves them onto the support 131a. At this time, the four columns of objects located in the second row may be moved to a position parallel to the first row already moved to the support 131a.

Next, the first row of objects arranged on the support 131a is inverted, and then the second row of objects is inverted, thereby inverting the upper and lower surfaces of all the objects under examination. Finally, the pick-up unit 132 moves the objects arranged in a 2*4 pattern on the support 131a onto the shuttle jig 113 again, thereby completing preparations for entering the second ultrasound probe array 122 .

The second ultrasonic probe array 122 may perform ultrasonic scanning again on the subject whose upper and lower surfaces are reversed, thereby completing the separate upper and lower measurement method. Since the process performed in the second ultrasound probe array 122 is the same as that of the first ultrasound probe array 121 described above, duplicate descriptions will be omitted.

The shuttle jig 113, which has been ultrasonically scanned by the second ultrasonic probe array 122, enters the fifth section by the transfer unit 112. The fifth section refers to the rear end of the transfer unit 112, and the object under examination for which the upper and lower surfaces have been ultrasonically scanned is loaded again in a preset arrangement by the unloading unit 115 of the unloader magazine module 101. At this time, it can be loaded in the form of a magazine.

Referring to FIG. 5 , the ultrasound scanning module 120 according to the present invention supplies a medium for transmitting ultrasound in a waterfall manner, and thus, the medium for transmitting ultrasound needs to be dried. To this end, air drying units 151 and 152 are provided at the rear end of the first and second ultrasonic probe arrays 122 to spray air to the test subject in an air knife manner.

At this time, the air drying units 151 and 152 are provided on the conveyor module 110, are located adjacent to the upper side of the object to be inspected, and are formed to have a predetermined inclination toward the lower side, and the air flows downward along the inclination. configured to be sprayed. By blowing air through the air drying units 151 and 152, the medium for ultrasonic transmission remaining in the subject may be dried.

Meanwhile, in the fifth section, an additional drying process is performed. A hot chamber unit 153 is provided on the outside of the conveyor module 110, and objects positioned on the shuttle jig are not directly loaded in the form of a magazine by the unloading unit 115, but in the hot chamber unit 153. After the drying process is performed, it may be configured to be loaded in a magazine form.

Here, the unloading unit 115 may be configured in the form of a robot arm, is hollow, and a seating jig 153c is provided inside the hot chamber unit 153 forming an airtight structure through the cover 153c. . After the unloading unit 115 moves the inspected object of the shuttle jig 113 onto the seating jig 153c, the hot chamber unit 153 is operated to perform drying. As with the shuttle jig 113, the arrangement of the seating jig 153c is also preferably configured to seat the subject in an M*N matrix arrangement.

Alignment confirmation module of ultrasonic inspection system

The ultrasonic inspection system according to the present invention includes an alignment check module 140. The alignment confirmation module 140 is composed of first to third alignment units 141 , 142 , and 143 . This will be described with reference to FIG. 4 .

The first alignment unit 141 is provided on the shuttle jig 113 through the index sensor 141a provided at the lower side of the shuttle jig 113 and the detection hole 113a formed at a preset position in each of the shuttle jig 113. It is configured to check whether the sample is in the correct position. The index position can be maintained through the two-step speed control of the drive unit 114 . Here, the driving unit 114 is composed of a servo motor and can control index moving. Accordingly, the shuttle jig 113 can be moved only by a predetermined distance.

The index sensors 141a may be formed as a pair to be spaced apart from each other in the first direction, and the distance between the pair of index sensors 141a may correspond to the distance between the objects to be inspected.

The second aligning unit 142 uses a detection camera 142a configured to recognize a preset reference mark on each shuttle jig 113 to check whether the subject is in the correct position on the shuttle jig 113. is configured to FIG. 4 shows a shuttle jig 113 of a 2*4 matrix, which has a structure in which a total of 8 objects can be mounted. After marking the reference mark corresponding to the shape of the subject in advance in each of the eight spaces, the reference mark is recognized using the detection camera 142a while the subject is mounted on the shuttle jig 113. When the subject is out of the reference mark marked in advance, it is determined that the subject is not in the correct position, and the position may be rearranged.

The second alignment unit 142 is preferably provided before the shuttle jig 113 enters the ultrasound scanning module 120 and before the first ultrasound probe array 121, and the accuracy of ultrasound scanning can be maximized. .

The third aligning unit 143 is formed to correct reference marks preset in each shuttle jig 113 based on image information generated by the ultrasonic probe arrays 121 and 122 . The information obtained from the ultrasonic probe arrays 121 and 122 is transmitted to the processor 160, and image information is generated. Since the reference mark is also confirmed in the image information, the position of the reference mark itself is displayed in the correct position. to check if it has been done. If the position of the reference mark is not in the correct position, the position of the reference mark displayed on the shuttle jig 113 may be corrected.

Preferably, the first to third alignment units 141, 142, and 143 are sequentially performed. Referring to FIG. 10 , a flow chart of a method of determining whether an object under test is positioned on a shuttle jig using the first to third alignment units 141 , 142 , and 143 is shown.

The method includes steps S110 to S130.

Step S110 uses the index sensor 141a provided at the lower side of the shuttle jig 113 and the detection hole 113a formed at a preset position in each of the shuttle jig 113, but transfers the shuttle jig 113 This is the first alignment step of determining whether the subject is in the right position based on speed control.

Step S120 is a second alignment step of checking whether the subject is in the right position by using the detection camera 142a configured to recognize the reference mark preset on each of the shuttle jigs 113.

Step S130 is a third alignment step formed to correct reference marks preset on each of the shuttle jigs 113 based on the image information generated by the ultrasonic probe arrays 121 and 122.

Referring to FIGS. 11 and 12, the entire alignment process of the ultrasonic inspection system according to the present invention will be described.

The drive unit 114 includes a servo motor 141b and a rotary encoder 141c that control index moving. The drive unit 114 is connected to the transfer unit 112 in the form of a conveyor belt, and a tension control unit 105 for controlling the tension of the drive unit 114 is provided on the other side of the drive unit 114.

* A belt tension maintaining unit (ROSTA) 104 is positioned between the driving unit 114 and the tension adjusting unit 105, and adjusts the tension of the conveying unit 112 by moving the roller in the vertical direction.

The side where the driving unit 114 is located is called the front end, and the side where the tension adjusting unit 105 is located is called the rear end. A first alignment unit 141 is provided at the front end, and a second alignment unit 142 is provided at the rear end of the first alignment unit 141 . When the correct position of the subject is confirmed by the second aligning unit 142, the shuttle jig 113 is configured to enter the ultrasound scanning module 120. At this time, the ultrasonic scanning module 120 is configured to check the height between the ultrasonic probe arrays 121 and 122 and the object under test, and then control the height of each object under test.

Finally, the processor 160 is configured to correct the reference mark displayed on the shuttle jig 113 based on the image information generated by the ultrasonic scanning module 120, which is referred to as the third alignment unit 143.

Referring to FIG. 12, a process performed between the above-described second aligning step (S120) and third aligning step (S130) will be described.

The process includes steps S121 to S126.

Step S121 is a step of adjusting the height of the ultrasonic probe array based on the result of step S120. In the ultrasound scanning module 120, it means that after checking the height between the ultrasound probe arrays 121 and 122 and the subject, the height of each subject is adjusted.

In step S122, ultrasonic scanning is performed on the upper surface of the subject through the first ultrasonic probe array 121 of the ultrasonic scanning module 120.

Step S123 is a step in which primary drying is performed on the test subject in a preset manner, and is performed through the air drying units 151 and 152 in an exemplary structure of the present invention.

Step S124 is a step of inverting the top and bottom of the subject through the inversion module 130 .

In step S125, ultrasonic scanning is performed on the lower surface of the subject through the second ultrasonic probe array 122 of the ultrasonic scanning module 120.

Step S126 is a step in which secondary drying is performed on the inspected object in a preset manner, and the inspected object is dried by the air drying units 151 and 152 described above.

Meanwhile, the ultrasound examination system according to the present invention includes a processor 160. The processor 160 controls components of the ultrasound examination system and simultaneously performs calculation processing to generate image information based on information transmitted from the ultrasound scanning module 120 .

The processor 160 may generate an internal image of the object to be examined by utilizing an echo signal reflected from the object to be inspected. The processor 160 may be implemented in the form of a CPU, GPU, AP, or a combination thereof having an arithmetic processing function, and may be provided with DRAM, flash memory, SSD, or other various types of memory as needed.

Referring to FIG. 13 , when an internal image of the object under examination, that is, an interface pattern image is generated, it is possible to determine what kind of manufacturing defects the object under test has. For example, it can be determined whether manufacturing defects such as direct bonded copper (DBC) cracks, solder voids, EMC (epoxy mold compound) peeling, spacer distortion, DMC voids, and ceramic pattern peeling exist from the interface pattern image.

Specifically, (a) of FIG. 13 shows a state in which DBC cracks have occurred, (b) shows a state in which solder voids have occurred, and (c) shows a state in which EMC peeling has occurred. And, (d) can confirm the twisted state of the spacer.

The above embodiment in the present invention is an example, and the present invention is not limited thereto. Anything that has substantially the same configuration as the technical concept described in the claims of the present invention and achieves the same effect is included in the technical scope of the present invention.

101: loader magazine module
102: unloader magazine module
110: conveyor module
120: ultrasonic scanning module
130: inversion module
140: alignment confirmation module
160: processor

Claims (10)

An ultrasonic inspection device that detects defects in an object through ultrasonic scanning,
a conveyor module for transporting the object under test in a first direction;
an ultrasonic scanning module performing ultrasonic scanning on an object positioned on the conveyor module;
The conveyor module,
a transfer unit extending in the first direction and moving the object under examination in the first direction; and
a shuttle jig disposed on the transfer unit and transporting the object in the first direction while the subject is seated in an M*N matrix arrangement (M and N are natural numbers); Including,
The ultrasonic probe array,
Ultrasonic probes are arranged in a parallel structure corresponding to the M row,
ultrasound examination device. The method of claim 1,
The ultrasonic probe array,
Formed as a dual ultrasound probe, where M is 2,
ultrasound examination device. The method of claim 1,
The ultrasonic inspection device,
an alignment check module for determining whether the subject is in the right position on the shuttle jig; Including more,
The alignment confirmation module,
a first aligning unit that checks whether an object under test is positioned on the shuttle jig through an index sensor provided below the shuttle jig and a detection hole formed at a preset position in each of the shuttle jig; including,
The first alignment part,
Based on the control of the transfer speed of the shuttle jig by the conveyor module,
ultrasound examination device. The method of claim 3,
The alignment confirmation module,
a second aligning unit that checks whether an object under test is positioned on the shuttle jig by using a detection camera configured to recognize a preset reference mark on each shuttle jig; Including more,
The ultrasonic scanning module,
Based on the first direction, disposed at the rear end of the second alignment unit,
ultrasound examination device. The method of claim 4,
The alignment confirmation module,
a third aligning unit configured to calibrate preset reference marks on each of the shuttle jigs based on image information generated by the ultrasonic probe array; Including more,
ultrasound examination device. The method of claim 5,
The index sensors of the first alignment unit are formed as a pair so as to be spaced apart from each other by the distance between the inspected objects in a first direction,
The first aligning part, the second aligning part, and the third aligning part are sequentially arranged based on the first direction,
ultrasound examination device. The method of claim 1,
The ultrasonic scanning module,
Including an ultrasonic probe array formed to correspond to the arrangement of the subject
ultrasound examination device. A method using the ultrasonic inspection apparatus according to claim 1,
(a1) A first alignment that determines whether the subject is in the correct position based on the transfer speed control of the shuttle jig using an index sensor provided at the lower side of the shuttle jig and a detection hole formed at a preset position in each of the shuttle jig step;
(a2) a second aligning step of checking whether the subject is in the right position by using a detection camera configured to recognize a preset reference mark on each of the shuttle jigs; and
(a3) a third alignment step configured to correct reference marks preset in each of the shuttle jigs based on image information generated by the ultrasonic probe array; including,
method. The method of claim 8,
After the step (a2) and before the step (a3),
(a21) adjusting the height of the ultrasonic probe array based on the result of step (a2);
(a22) performing ultrasound scanning on an upper surface of the object through a first ultrasound probe array of the ultrasound scanning module;
(a23) performing primary drying on the test subject in a preset manner;
(a24) inverting the top and bottom of the object through an inversion module;
(a25) performing ultrasonic scanning on the lower surface of the object through a second ultrasonic probe array of the ultrasonic scanning module; and
(a26) performing secondary drying on the test subject in a preset manner; Including,
In the steps (a21) to (a26),
Sequentially performed through a conveyor module that transports the subject in the first direction,
method. The method of claim 9,
The primary drying of the step (a23) or the secondary drying of the step (a26) is performed by an air drying unit provided at the rear of the first ultrasonic probe array and the second ultrasonic probe array, respectively.
method.

Images