KR20220162792A - Polymer film peeling method, electronic device manufacturing method, and peeling device - Google Patents

Abstract

Step A of preparing a laminate in which the polymer film and the inorganic substrate are in close contact, Step B of forming a separation portion between the polymer film and the inorganic substrate at the end of the laminate, and after Step B, the inorganic substrate of the polymer film A polymer film peeling method including step C of peeling the polymer film from the inorganic substrate by providing a static pressure difference between the non-adhered surface and the peeling portion.

Description

Polymer film peeling method, electronic device manufacturing method, and peeling device

The present invention relates to a method for peeling a polymer film, a method for manufacturing an electronic device, and a peeling device.

BACKGROUND ART In recent years, for the purpose of reducing the weight of functional elements such as semiconductor elements, MEMS elements, and display elements, reducing the size and thickness, and increasing flexibility, technology development of forming these elements on polymer films has been actively conducted. That is, as materials for base materials of electronic parts such as information communication devices (broadcasting devices, mobile radios, portable communication devices, etc.), radars, high-speed information processing devices, etc., conventionally, they have heat resistance and high frequency signal bands of information communication devices. Although ceramics capable of responding to (reaching the GHz band) have been used, ceramics are not flexible and have the disadvantage of being difficult to thin and limiting their applicable fields. Recently, polymer films have been used as substrates.

In forming functional elements such as semiconductor elements, MEMS elements, and display elements on the surface of a polymer film, it is ideal to process them in a so-called roll-to-roll process that takes advantage of the flexibility that is a characteristic of polymer films. However, in industries such as the semiconductor industry, the MEMS industry, and the display industry, process technologies targeting rigid flat substrates such as wafer bases or glass substrate bases have been built up to now. Therefore, in order to form a functional element on a polymer film using the existing infrastructure, the polymer film is bonded to a rigid support containing an inorganic material such as a glass plate, a ceramic plate, a silicon wafer, a metal plate, and the like, and a desired element is placed thereon. A process of peeling from the support after formation is used.

Conventionally, as a method of peeling a polymer film from a support, a method of exfoliating by weakening the adhesive force between the polymer film and the support by irradiating laser light is known (eg, see Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 10-125931

However, in the method of Patent Literature 1, since the entire surface of the support is irradiated with laser light, there is a problem that a large-scale irradiation device for irradiating the laser light is required. In addition, since the laser light is irradiated, there is a problem that seizure or the like occurs on the polymer film, which affects the quality of the polymer film. In addition, there is a concern that circuits and devices formed on the surface of the polymer film and elements mounted on the polymer film may be irradiated by leaking laser light or that the quality may be affected by the generation of shock waves in laser heating. Regarding mechanical peeling, there has been concern about damage caused by stress to the polymer film itself due to deformation of the polymer film, and affecting the quality of circuits and devices formed on the surface of the polymer film and elements mounted on the polymer film.

The present invention has been made in view of the above-mentioned problems, and its object is to easily form a polymer film inorganically without affecting the quality of a polymer film, a circuit or device formed on the surface of the polymer film, and an element mounted on the polymer film. It is to provide a peeling method for a polymer film capable of peeling from a substrate, a method for manufacturing an electronic device, and a peeling device.

The present inventors conducted intensive research on a method for peeling a polymer film, a method for manufacturing an electronic device, and a peeling device. As a result, by adopting the following configuration, it is possible to easily peel the polymer film from the inorganic substrate without affecting the quality of the polymer film, circuits or devices formed on the surface of the polymer film, and elements mounted on the polymer film. Having discovered what is possible, we have come to complete the present invention.

That is, the present invention provides the following.

(1) Step A of preparing a laminate in which the polymer film and the inorganic substrate are in close contact;

Step B of forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;

After the step B, a step C of peeling the polymer film from the inorganic substrate by providing a static pressure difference between a non-adhesive surface of the polymer film that is not in close contact with the inorganic substrate and the peeling portion of the polymer film, peeling method.

According to the above configuration, since the polymer film is separated from the inorganic substrate by the static pressure difference between the non-stick surface and the peeling portion without mechanically peeling, the quality of the polymer film is not affected. It is possible to easily peel the polymer film from the inorganic substrate.

(2) In the configuration of (1) above,

It is preferable that the said process A is a process of preparing the laminated body which has a functional element in which the functional element was provided on the polymer film of the said laminated body.

(3) In the configuration of (1) or (2) above, the step C is,

Step D-1 of arranging a roller on the side of the non-adhesive surface of the polymer film and pressing the polymer film in the direction of the peeling portion with the roller;

Step D-2 of providing the static pressure difference by setting the non-adhesive surface side to atmospheric pressure while setting the peeling portion to atmospheric pressure;

After the step D-1 and the step D-2, a step D-3 of moving the surface of the roller parallel to the non-adhesive surface of the polymer film and advancing the peeling according to the movement of the roller It is desirable to do

According to the above configuration, the surface of the roller is moved in parallel to the non-adhesive surface of the polymer film, and the peeling is performed according to the movement of the roller, so that the peeling speed can be controlled. As a result, excessive load applied to the polymer film can be suppressed.

(4) In the configuration of (3) above, it is preferable that a mesh-like sheet is disposed between the polymer film and the roller.

According to the above configuration, since the mesh-like sheet is disposed between the polymer film and the roller, the polymer film after peeling can be maintained.

(5) In the configuration of the above (1) or the above (2), the step C is,

Step E-1 of setting the non-adhesive surface side to atmospheric pressure or higher and the peeling portion to atmospheric pressure;

After the said process E-1, it is preferable to include the process E-2 which provides the said static pressure difference by setting the said peeling part to a pressure higher than the pressure of the said non-adhesion surface side.

According to the above configuration, the pressure difference is provided by setting the non-adhesive surface side to atmospheric pressure or higher, and then setting the peeling portion to a pressure higher than the pressure on the non-adhesive surface side, thereby removing the polymer film from the inorganic substrate. peel off Since the non-adhesive surface side is set to atmospheric pressure or higher, the polymer film after peeling can be maintained.

(6) In the configuration of (1) above,

A functional element is formed on the polymer film of the laminate,

The step C,

Step F-1 of arranging a porous flexible body on the non-adhesive surface side of the polymer film, and pressing the polymer film in the direction of the peeling portion with the porous flexible body while embedding the functional element in the porous flexible body; ,

It is preferable to include the step F-2 of providing the said static pressure difference by making the said non-adhesive surface side into atmospheric pressure below atmospheric pressure, and making the said peeling part into atmospheric pressure.

According to the above configuration, in a state where the functional element is embedded in the porous flexible body, the static pressure difference is provided, and the polymer film is separated from the inorganic substrate, so that the polymer film is located at the location where the functional element is located. Excessive load can be suppressed.

(7) In the configurations of (1) and (3) to (5) above,

A functional element is formed on the polymer film of the laminate,

Prior to the step C, it is preferable to include a step X of providing a spacer having a thickness equivalent to that of the functional element on the surface of the polymer film on which the functional element is not provided.

According to the above configuration, irregularities on the polymer film can be reduced by the spacer. As a result, when peeling, it is possible to suppress an excessive load applied to the polymer film at the location where the functional element is located.

(8) In the configurations of (1), (3) to (5) above,

A functional element is formed on the polymer film of the laminate,

It is preferable to include a step Y of arranging an embedding member on the polymer film and embedding the functional element in the embedding member before the step C.

According to the above configuration, in a state where the functional element is embedded by the embedding member, the static pressure difference is provided and the polymer film is peeled off from the inorganic substrate. Excessive load can be suppressed.

(9) Step A-1 of preparing a laminate having a laminate in which a polymer film and an inorganic substrate are in close contact with each other and a functional element having a functional element provided on the polymer film of the laminate;

Step B of providing a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;

Step C of peeling the polymer film from the inorganic substrate by providing a static pressure difference between the non-adhesive surface of the polymer film on the side not in close contact with the inorganic substrate and the peeling portion after the step B; A method for manufacturing an electronic device characterized by

According to the above configuration, since the polymer film is separated from the inorganic substrate by the static pressure difference between the non-stick surface and the peeling portion without mechanically peeling, the quality of the polymer film is not affected. It is possible to easily peel the polymer film from the inorganic substrate. Since the polymer film provided with functional elements can be easily peeled off from the inorganic substrate, the polymer film having the functional elements exfoliated can be used for electronic devices.

(10) A peeling device for peeling the polymer film from the inorganic substrate in a laminate in which the polymer film and the inorganic substrate are in close contact,

To provide a static pressure difference forming means for providing a static pressure difference between a non-adhesive surface of the polymer film on a side that is not in close contact with the inorganic substrate and a peeling portion of the polymer film and the inorganic substrate provided at an end of the laminate. Peeling device characterized by.

According to the above configuration, since the polymer film is separated from the inorganic substrate by the static pressure difference between the non-adhesive surface and the peeling portion formed by the static pressure difference forming means without mechanical peeling, the quality of the polymer film is improved. It is possible to easily peel the polymer film from the inorganic substrate without giving an influence on it.

According to the present invention, it becomes possible to easily peel the polymer film from the inorganic substrate without affecting the quality of the polymer film.

1 is a schematic cross-sectional view showing an example of a laminate.
2 is a schematic cross-sectional view of the peeling device according to the first embodiment.
3 is a schematic cross-sectional view of the peeling device according to the first embodiment.
4 is a schematic cross-sectional view of a modified example of the peeling device according to the first embodiment.
5 is a schematic sectional view of a peeling device according to a second embodiment.
6 is a schematic cross-sectional view showing an example of a laminate having functional elements.
Fig. 7 is a schematic cross-sectional view showing a state in which spacers are provided on a polymer film of a laminate having functional elements.
8 is a schematic cross-sectional view showing a state in which a member for embedding is disposed on a polymer film of a laminate having functional elements and the functional elements are embedded.
9 is a schematic sectional view of a peeling device according to a third embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described. Hereinafter, a method for peeling a polymer film will be described, and, among them, a method for manufacturing an electronic device and a peeling device will also be described.

[Method of peeling polymer film]

The peeling method of the polymer film according to the present embodiment,

Step A of preparing a laminate in which the polymer film and the inorganic substrate are in close contact;

Step B of providing a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;

and a step C of peeling the polymer film from the inorganic substrate by providing a static pressure difference between a non-adhesive surface of the polymer film that is not in close contact with the inorganic substrate and the peeling portion after the step B.

<Process A>

In the polymer film peeling method according to the present embodiment, first, a laminate in which the polymer film and the inorganic substrate are in close contact is prepared (Step A). 1 is a schematic cross-sectional view showing an example of a laminate. As shown in FIG. 1 , the laminate 10 includes an inorganic substrate 12 and a polymer film 14 . The inorganic substrate 12 and the polymer film 14 are in close contact. The inorganic substrate 12 and the polymer film 14 may be in close contact with each other via a silane coupling agent layer (not shown).

Further, in the present embodiment, a laminate can be obtained by adhering (laminating) a polymer film separately prepared in advance to an inorganic substrate. As a method of lamination, it is also possible to apply conventionally known adhesives, adhesive sheets, pressure-sensitive adhesives, pressure-sensitive adhesive sheets, etc., in addition to the lamination method using a silane coupling agent described later. In this case, the adhesive, the adhesive sheet, the pressure-sensitive adhesive, and the pressure-sensitive adhesive sheet may be applied first to the inorganic substrate side or to the polymer film side.

In addition, as another method of producing a laminate of a polymer film and an inorganic substrate, a polymer solution for forming a polymer film or a solution of a polymer precursor is coated on an inorganic substrate, dried, and, if necessary, chemically reacted to the inorganic substrate. A method of obtaining a laminate by forming a polymer into a film on the top is exemplified. A laminate of a polymer film and an inorganic substrate can be obtained by using a soluble polyimide solution as a polymer solution and a polyamic acid solution that becomes polyimide through a chemical reaction as a polymer precursor. At that time, it is also one of the preferable aspects to control the adhesion between the polymer film and the inorganic substrate by subjecting the inorganic substrate to surface treatment such as treatment with a silane coupling agent. At this time, in order to control the peel strength between the inorganic substrate and the polymer film, a two-layer configuration of a base easily peelable polymer layer (easily peelable layer) and a main polymer layer (polymer film), or a main layer (polymer film) and an inorganic thin film layer It is good also as a two-layer structure of. In addition, you may apply the existing structure for controlling peeling force.

In the case of a two-layer configuration of an easily-peelable polymer layer (easily peelable layer) and a main polymer layer (polymer film), the adhesive strength between the easily-peelable polymer layer (easily peelable layer) and the inorganic substrate is the polymer layer (easily peelable) In the case of a design in which the adhesion is stronger than the adhesive force between the easy layer) and the main polymer layer (polymer film), and the separation between the main polymer layer (polymer film) and the easily peelable polymer layer (easy peel layer), and the easy peel The adhesive force between the polymer layer (easily peelable layer) and the main polymer layer (polymer film) is stronger than the adhesive force between the easily peelable polymer layer (easily peeled layer) and the inorganic substrate, and the easily peelable polymer layer (easily peeled layer) and the inorganic substrate There is a case of a design that peels between substrates.

The adhesive force between the easily peelable polymer layer (easily peelable layer) and the inorganic substrate is stronger than the adhesive force between the easily peelable polymer layer (easily peeled layer) and the main polymer layer (polymer film), and the main polymer layer (polymer film) In the case of a design in which peeling is performed between the polymer layer (easily peelable layer) and the polymer layer (easily peelable layer) that is easily peeled, the inorganic substrate in the present invention corresponds to an easily peelable polymer layer (easily peelable layer) deposited on the inorganic substrate. .

In the case of a two-layer configuration with an inorganic thin film layer, the inorganic thin film layer is formed on an inorganic substrate, and then a solution or a solution of a polymer precursor is applied to the inorganic substrate on the inorganic thin film layer, followed by drying and, if necessary, chemical reaction. and a method of obtaining a laminate by forming a polymer film on an inorganic substrate. In this case, a separation occurs between the inorganic thin film and the polymer layer on the inorganic substrate. In this case, the inorganic thin film deposited on the inorganic substrate corresponds to the inorganic substrate in the present invention.

As a modification of the method using a polymer solution or a polymer precursor solution, a polymer film in a semi-solid state (high viscosity paste type) containing a solvent is pressed onto an inorganic substrate, followed by additional drying or, if necessary, a chemical reaction to form a mixture between the polymer film and the inorganic substrate. A laminated body can also be obtained. More specifically, the desired polymer solution or polymer precursor solution is applied onto a support film such as polyethylene terephthalate, and semi-drying is performed until the remaining solvent content is about 5 to 40% by mass in a wet base, thereby reducing plastic deformation. It can be set as a semi-solid film having (sometimes called a green film or a gel film). A laminate of the polymer film and the inorganic substrate can be obtained by pressing the obtained semi-solid film to an inorganic substrate and subjecting to drying and heat treatment.

In the present embodiment, when a thermoplastic polymer is used, a laminate can be obtained by directly melting and extruding the polymer onto an inorganic substrate. Further, in the case of a thermoplastic polymer film, an inorganic substrate and a polymer film may be overlapped and heated to the melting point or softening temperature of the polymer in a pressurized state, thereby compressing both to form a laminate.

The inorganic substrate 12 may be a plate-shaped substrate that can be used as a substrate containing an inorganic substance, for example, a glass plate, a ceramic plate, a semiconductor wafer, a metal, or the like, and those glass plates, ceramic plates, or semiconductor wafers. , as a composite of metals, those in which these are laminated, those in which they are dispersed, those in which these fibers are contained, and the like.

The thickness of the inorganic substrate 12 is not particularly limited, but is preferably 10 mm or less, more preferably 3 mm or less, and still more preferably 1.3 mm or less from the viewpoint of handleability. The lower limit of the thickness is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.3 mm or more, still more preferably 0.5 mm or more.

Examples of the polymer film 14 include, but are not particularly limited to, polyimide-based resins such as polyimide, polyamideimide, polyetherimide, and fluorinated polyimide (eg, aromatic polyimide resin and alicyclic polyimide resin); co-polyesters such as polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, and polyethylene-2,6-naphthalate (eg, fully aromatic polyesters and semi-aromatic polyesters); copolymerization (meth)acrylates typified by polymethyl methacrylate; polycarbonate; polyamide; polysulfone; polyethersulfone; polyether ketone; cellulose acetate; cellulose nitrate; aromatic polyamide; polyvinyl chloride; polyphenols; polyarylate; polyphenylene sulfide; polyphenylene oxide; Films, such as polystyrene, can be illustrated.

The thickness of the polymer film 14 is not particularly limited, but is preferably 250 μm or less, more preferably 100 μm or less, and still more preferably 50 μm or less, from the viewpoint of handleability. The lower limit of the thickness is not particularly limited, but is preferably 3 μm or more, more preferably 5 μm or more, still more preferably 10 μm or more.

The silane coupling agent layer is physically or chemically interposed between the inorganic substrate 12 and the polymer film 14, and has a function of adhering the inorganic substrate and the polymer film.

Although the silane coupling agent used in this embodiment is not specifically limited, It is preferable that the coupling agent which has an amino group is included.

Specific preferred examples of the silane coupling agent include N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, and N-2-( Aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene )Propylamine, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltri Ethoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3 -Glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxy Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, N-( Vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, aminophenyltrimethoxysilane, aminophenethyltrimethoxysilane, 3-ureidpropyltriethoxysilane, 3-chloropropyltrimethoxy Silane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3-isocyanatepropyltriethoxysilane, tris-(3-trimethoxysilane) oxysilylpropyl) isocyanurate, chloromethylphenethyltrimethoxysilane, chloromethyltrimethoxysilane, aminophenyltrimethoxysilane, aminophenethyltrimethoxysilane, aminophenylaminomethylphenethyltrimethoxysilane, etc. can

Examples of the silane coupling agent include n-propyltrimethoxysilane, butyltrichlorosilane, 2-cyanoethyltriethoxysilane, cyclohexyltrichlorosilane, decyltrichlorosilane, and diacetoxydimethylsilane in addition to those described above. , diethoxydimethylsilane, dimethoxydimethylsilane, dimethoxydiphenylsilane, dimethoxymethylphenylsilane, dodecylchlorosilane, dodecyltrimethoxysilane, ethyltrichlorosilane, hexyltrimethoxysilane, octadecyltriethoxy Silane, octadecyltrimethoxysilane, n-octyltrichlorosilane, n-octyltriethoxysilane, n-octyltrimethoxysilane, triethoxyethylsilane, triethoxymethylsilane, trimethoxymethylsilane, Trimethoxyphenylsilane, pentyltriethoxysilane, pentyltrichlorosilane, triacetoxymethylsilane, trichlorohexylsilane, trichloromethylsilane, trichlorooctadecylsilane, trichloropropylsilane, trichlorotetradecylsilane, Trimethoxypropylsilane, allyltrichlorosilane, allyltriethoxysilane, allyltrimethoxysilane, diethoxymethylvinylsilane, dimethoxymethylvinylsilane, trichlorovinylsilane, triethoxyvinylsilane, vinyltris (2 -methoxyethoxy)silane, trichloro-2-cyanoethylsilane, diethoxy(3-glycidyloxypropyl)methylsilane, 3-glycidyloxypropyl(dimethoxy)methylsilane, 3-glycy Diloxypropyltrimethoxysilane etc. can also be used.

Among the above silane coupling agents, silane coupling agents having one silicon atom in one molecule are particularly preferred, such as N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(amino Ethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- Triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3 -Glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, aminophenyltrimethoxysilane, aminophenethyltrimethoxysilane, aminophenylaminomethylphenethyltrimethoxysilane, etc. are mentioned. When particularly high heat resistance is required in a process, it is preferable to connect Si and an amino group with an aromatic group.

As said coupling agent, in addition to the above, 1-mercapto-2-propanol, 3-mercapto methyl propionate, 3-mercapto-2-butanol, 3-mercapto butyl propionate, 3-(dimethoxymethylsilyl) -1-propanethiol, 4-(6-mercaptohexanoyl)benzyl alcohol, 11-amino-1-undecenethiol, 11-mercaptoundecylphosphonic acid, 11-mercaptoundecyltrifluoroacetic acid, 2 ,2'-(ethylenedioxy)diethanethiol, 11-mercaptoundecyltri(ethylene glycol), (1-mercaptoundecyl-11-yl)tetra(ethyleneglycol), 1-(methylcarboxy)undec -11-yl) hexa(ethylene glycol), hydroxyundecyl disulfide, carboxyundecyl disulfide, hydroxyhexadodecyl disulfide, carboxyhexadecyl disulfide, tetrakis(2-ethylhexyloxy)titanium, Titaniumdioctyloxybis(octylene glycolate), zirconium tributoxymonoacetylacetonate, zirconium monobutoxyacetylacetonate bis(ethylacetoacetate), zirconium tributoxymonostearate, acetoalkoxyaluminum diisopropylate , 3-glycidyloxypropyltrimethoxysilane, 2,3-butanedithiol, 1-butanethiol, 2-butanethiol, cyclohexanethiol, cyclopentanethiol, 1-decanethiol, 1-dodecanethiol, 3-mercaptopropionate-2-ethylhexyl, 3-mercaptopropionate ethyl, 1-heptanethiol, 1-hexadecanethiol, hexylmercaptan, isoamylmercaptan, isobutylmercaptan, 3-mercaptopropionic acid, 3 -Mercaptopropionic acid-3-methoxybutyl, 2-methyl-1-butanethiol, 1-octadecanethiol, 1-octanethiol, 1-pentadecanethiol, 1-pentanethiol, 1-propanethiol, 1-tetra Decanethiol, 1-undecanethiol, 1-(12-mercaptododecyl)imidazole, 1-(11-mercaptodecyl)imidazole, 1-(10-mercaptodecyl)imidazole, 1-( 16-mercaptohexadecyl)imidazole, 1-(17-mercaptoheptadecyl)imidazole, 1-(15-mercapto)dodecanoic acid, 1-(11-mercapto)undecanoic acid, 1-(10- Mercapto) decanoic acid or the like can also be used.

As a method of applying the silane coupling agent (method of forming the silane coupling agent layer), a method of applying a silane coupling agent solution to the inorganic substrate 12, a vapor deposition method, or the like can be used. Also, the silane coupling agent layer may be formed on the surface of the polymer film 14 .

The film thickness of the silane coupling agent layer is very thin compared to the inorganic substrate 12, the polymer film 14, etc., and is negligible from the point of view of mechanical design. In principle, the minimum, monomolecular layer order thickness It is enough to have

After the application of the silane coupling agent, the adhesive force of the laminate can be developed by a step of bringing the inorganic substrate 12 and the polymer film 14 into close contact and a step of heating. The method for adhering is not particularly limited, but there are lamination, press, and the like. Adhesion and heating may be performed simultaneously or sequentially. The heating method is not particularly limited, but may include heating in an oven, heating lamination, heating press, and the like.

As a method for producing a laminate in which the polymer film and the inorganic substrate are in close contact, the inorganic substrate and the polymer film may be separately produced and then adhered. At this time, an easily peelable adhesive other than a known silane coupling agent, an adhesive sheet, You may adhere using an adhesive sheet. In this case, the adhesive, the adhesive sheet, the pressure-sensitive adhesive, and the pressure-sensitive adhesive sheet may be applied to the inorganic substrate first or to the polymer film. As another method for producing a laminate in which the polymer film and the inorganic substrate are in close contact, a varnish for forming the polymer film may be applied onto the inorganic substrate and then dried. At this time, in order to control the peel strength between the inorganic substrate and the polymer film, a two-layer configuration of a base varnish layer (easily peelable layer) and a main varnish layer (polymer film), or a main layer (polymer film) and inorganic It is good also as a two-layer structure of a thin film layer.

<Process B>

Next, at the end of the layered product 10, a peeling portion 18 is formed between the polymer film 14 and the inorganic substrate 12 (Step B).

The method of providing the peeling portion 18 is not particularly limited, but is a method of peeling off from the end with tweezers or the like, making a cut in the polymer film 14 and adhering an adhesive tape to one side of the cut portion, and then removing the tape portion. A peeling method, a method of vacuum adsorbing one side of a cutout portion of the polymer film 14 and then peeling it off from that portion can be employed.

As a method of making an incision in the polymer film 14, a method of cutting the polymer film 14 with a cutting tool such as a blade, or cutting the polymer film 14 by relatively scanning the laminate 10 with a laser method, a method of cutting the polymer film 14 by relatively scanning the laminate 10 with a water jet, a method of cutting the polymer film 14 while slightly incising the glass layer by a dicing device of a semiconductor chip, and the like. However, the method is not particularly limited. For example, in adopting the above-described method, a method such as superimposing ultrasonic waves on a cutting tool or adding a reciprocating motion or an up-and-down motion to improve cutting performance may be appropriately employed.

In addition, although not shown, in order to maintain a peeled state so that the peeling part 18 does not come into close contact again, a film or sheet having no adhesiveness or adhesiveness may be sandwiched between the peeling part 18. In addition, a film or sheet having adhesiveness and adhesiveness on one side may be sandwiched between the peeling portion 18. Also, a metal part (for example, a needle) may be inserted into the peeling portion 18 .

<Process C>

After step B, the polymer film 14 ) is separated from the inorganic substrate 12 (step C).

Hereinafter, the specific example of process C is demonstrated.

[First Embodiment]

2 is a schematic cross-sectional view of the peeling device according to the first embodiment. As shown in FIG. 2 , the peeling device 20 according to the first embodiment includes a vacuum chamber 30, a roller 32, a vacuum chuck 34, a dummy film 36, and a mesh sheet. (38) is provided.

The roller 32 is disposed so as to be movable within the vacuum chamber 30 .

The vacuum chuck 34 can adsorb and hold the laminate 10 , and can position the laminate 10 above the vacuum chamber 30 in an adsorbed state.

The dummy film 36 is disposed in the opening of the upper surface of the vacuum chamber 30 and has an opening corresponding to the size of the laminate 10 .

The mesh-like sheet 38 is disposed on the upper surface of the vacuum chamber 30 so as to cover the opening on the upper surface of the vacuum chamber 30 .

Step C according to the first embodiment includes step D-1, step D-2 and step D-3. The peeling apparatus 20 performs process D-1, process D-2, and process D-3 by operating as follows.

First, the peeling device 20 adsorbs the inorganic substrate 12 side of the layered product 10 with the vacuum chuck 34 and places it above the vacuum chamber 30 . At this time, the stacked body 10 is placed in the opening of the dummy film 36 . Also, at this time, the polymer film 14 of the laminate 10 is brought into contact with the mesh-like sheet 38 .

Next, in the peeling device 20, a roller 32 is placed on the side of the non-adhesive surface 14a of the polymer film 14, and the polymer film 14 is removed from the peeling portion 18 by the roller 32. It is pressed in the direction (upward in Fig. 2) (Step D-1).

Next, the peeling device 20 makes the inside of the vacuum chamber 30 less than atmospheric pressure by the pump P. Here, the peeling portion 18 is at atmospheric pressure. This provides a static pressure difference between the non-adhesive surface 14a of the polymer film 14 and the peeling portion 18 . That is, a static pressure difference is provided by making the non-adhesive surface 14a side less than atmospheric pressure, and making the peeling part 18 atmospheric pressure (process D-2).

In this state, since the roller 32 is pressing the polymer film 14 in the direction of the peeling portion 18, peeling does not proceed.

Next, the peeling device 20 moves the surface of the roller 32 (the contact surface with the polymer film 14) in parallel with the non-adhesive surface 14a of the polymer film 14. Fig. 3 is a schematic sectional view of the peeling device according to the first embodiment, showing a state in which the roller is being moved. As shown in FIG. 3 , when the roller 32 is moved from the bottom of the peeling portion 18 in the horizontal direction (leftward direction in FIG. 3 ), the peeling portion ( The peeling of 18) proceeds. That is, the surface of the roller 32 is moved in parallel to the non-adhesive surface 14a of the polymer film 14, and peeling proceeds according to the movement of the roller 32 (Step D-3). After that, the entire polymer film 14 is peeled from the inorganic substrate 12 by moving the roller 32 to the right below the opposite side of the side where the peeling portion 18 was formed.

In this way, in the peeling device 20, the surface of the roller 32 moves in parallel with the non-adhesive surface 14a of the polymer film 14, and peeling proceeds according to the movement of the roller 32, The peeling speed can be controlled. As a result, excessive load applied to the polymer film 14 can be suppressed.

Further, by changing the radius of the roller 32, the peeling angle of the polymer film 14 can be controlled. For example, when the radius of the roller 32 is reduced, the polymer film 14 is separated at the corresponding radius of curvature, and when the radius of the roller 32 is increased, the polymer film 14 is separated at the corresponding radius of curvature. By reducing the radius of the roller 32, the peeling device can be miniaturized, and by increasing the radius of the roller 32, the load applied to the functional element formed on the polymer film 14 can be reduced. In addition, as mentioned later, the curvature radius of peeling can be prescribed|regulated independently of the roller diameter of the roller 32 by the support part 33.

In addition, the vacuum chamber 30 and the vacuum chuck 34 correspond to the static pressure difference forming means of the present invention.

The radius of the roller is 40 mm or more and 1000 mm or less, more preferably 60 mm or more and 100 mm or less.

As the material of the roller, a material having a certain degree of elasticity is preferable, and for example, silicone rubber, fluororubber, urethane rubber, ethylene propylene rubber and the like can be used.

The rebound elastic modulus (JIS K 6255: 2013) of the roller material is preferably 3 to 60%.

The rubber hardness of the roller material is preferably 50 to 90, and it is preferable that it is non-adhesive and antistatic or conductive.

Here, in this embodiment, the mesh-like sheet 38 is disposed between the polymer film 14 and the roller 32 . Since the mesh-like sheet 38 is disposed between the polymer film 14 and the roller 32, the polymer film 14 after peeling can be maintained. As the mesh-type sheet 38, it is only necessary to have air permeability and a certain level of strength, and for example, a known screen mesh or the like can be used.

In addition, in this embodiment, although the case where the mesh type sheet 38 was used was demonstrated, in the peeling apparatus 20, it is good also as a structure which does not arrange|position a mesh type sheet. In this case, the peeled polymer film 14 may be extracted from the inside of the vacuum chamber 30 each time.

The material of the mesh-like sheet is preferably a material that is elastically deformed appropriately, specifically, a mesh-like sheet in the range of mesh count #80 or more and #600 or less using polyester filament, nylon filament, stainless wire, etc. it is desirable Moreover, antistatic or conductive ones are preferable.

4 is a schematic cross-sectional view of a modified example of the peeling device according to the first embodiment. As shown in FIG. 4, the peeling apparatus 22 is the apparatus which added the support part 33 with respect to the peeling apparatus 20 demonstrated above.

The support part 33 is connected to the roller 32 and moves in conjunction with the movement of the roller 32 . The support part 33 is arrange|positioned so that the upper surface may become the same height as the surface of the roller 32 (contact surface with the polymer film 14).

The peeling device 22 performs the same operation as the peeling device 20 described above. However, since the support part 33 is provided in the peeling device 22, the polymer film 14 after peeling can be supported. Therefore, it is possible to prevent the peeled portion of the polymer film 14 from being severely damaged.

It is preferable to control the separation angle between the polymer film (on which the functional element is formed) and the inorganic substrate to be 1 degree or more and 30 degrees or less. More preferably, it is 1 degree or more and 10 degrees or less. By setting it within the said range, it becomes possible to peel efficiently, without giving damage to a functional element.

In addition, the peeling angle in this specification depends on the mesh thickness, the film thickness, and the radius of the roller. By selecting an appropriate mesh thickness and roller radius according to the film thickness to be peeled off, the peeling angle can be made to fall within a predetermined range.

In this embodiment, since the polymer film and the inorganic substrate after peeling are not pressed with a roller, they are substantially parallel and separated by several millimeters. Therefore, the once peeled polymer film does not come into contact with the inorganic substrate again while vacuum adsorbed.

As mentioned above, process C (process C including process D-1, process D-2, and process D-3) concerning 1st Embodiment was demonstrated.

[Second Embodiment]

5 is a schematic sectional view of a peeling device according to a second embodiment. As shown in FIG. 6 , the peeling device 40 according to the second embodiment includes a vacuum chuck 34 and a diaphragm 42 .

The vacuum chuck 34 can adsorb and hold the laminate 10, and can position the laminate 10 above the diaphragm 42 in an adsorbed state.

The diaphragm 42 is an elastic thin film, and can press the laminate 10 with a surface. Specifically, a pressure device (not shown) is provided below the diaphragm 42, and the surface of the diaphragm 42 (elastic thin film) is pressed against the layered body 10 by the pressure by the pressure device. As will be described later, since the diaphragm 42 is an elastic thin film, even if the functional element 18 is provided on the polymer film 14, it is substantially uniform along the surface of the polymer film 14 and the functional element 18. The laminated body 10 can be pressed. In this embodiment, the case of using the diaphragm 42 will be described, but it is not limited to the diaphragm as long as the layered body 10 can be pressed by the surface.

Step C according to the second embodiment includes step E-1 and step E-2. The peeling apparatus 40 performs process E-1 and process E-2 by operating as follows.

First, the peeling device 40 adsorbs the inorganic substrate 12 side of the laminate 10 with the vacuum chuck 34 and places it above the diaphragm 42 .

Next, the peeling device 40 operates the diaphragm 42 to press the laminate 10 so that the non-adhesive surface 14a side of the polymer film 14 is at atmospheric pressure or higher. Moreover, the peeling part 18 is atmospheric pressure. That is, while the non-adhering surface 14a side is set to atmospheric pressure or higher, the peeling portion 18 is set to atmospheric pressure (step E-1).

In this state, since the diaphragm 42 is pressing the polymer film 14 in the direction of the peeling portion 18, peeling does not proceed.

Next, the peeling device 40 sets the peeling portion 18 to a pressure higher than the pressure on the non-adhesive surface 14a side, thereby separating the non-adhesive surface 14a of the polymer film 14 and the peeling portion 18. A static pressure difference is provided between them (step E-2). For example, the peeling part 18 is made into the pressure higher than the pressure of the non-adhesive surface 14a side by arrange|positioning the whole peeling apparatus 40 in a high-pressure chamber, and pressurizing the inside of a high-pressure chamber. As a result, peeling gradually spreads from the peeling portion 18, and the polymer film 14 is peeled from the inorganic substrate 12.

In the peeling device 40, since the non-adhesive surface 14a side is set to atmospheric pressure or higher, the polymer film 14 after peeling can be maintained.

In addition, the vacuum chuck 34 and the diaphragm 42 correspond to the static pressure difference forming means of the present invention.

In the above, process C (process C including process E-1 and process E-2) concerning 2nd Embodiment was demonstrated.

In the first embodiment and the second embodiment described above, the polymer film 14 is separated from the inorganic substrate 12 using the laminate 10 in which the inorganic substrate 12 and the polymer film 14 are in close contact. case has been described.

However, in the present invention, the present invention is not limited to this example, and the polymer film having functional elements may be separated from the inorganic substrate by using a laminate having functional elements in which functional elements are provided on the polymer film of the laminate. In this case, instead of step A of preparing the laminate 10, step A-1 of preparing the laminate 11 having functional elements may be performed.

6 is a schematic cross-sectional view showing an example of a laminate having functional elements. As shown in FIG. 6 , the laminate 11 having functional elements includes the laminate 10 (a laminate in which the inorganic substrate 12 and the polymer film 14 are in close contact), and the polymer of the laminate 10 It has a functional element 16 provided on the film 14.

When the polymer film 14 having the functional elements is separated from the inorganic substrate 12 using the multilayer body 11 having the functional elements, it is preferable to use a spacer described below. That is, step X of providing a spacer 62 having a thickness approximately equal to that of the functional element 16 on the surface of the polymer film 14 on which the functional element 16 is not provided before the step C described above. It is preferable to do

Fig. 7 is a schematic cross-sectional view showing a state in which spacers are provided on a polymer film of a laminate having functional elements. In FIG. 7 , a spacer 62 having a thickness equivalent to that of the functional element 16 is provided on the surface of the polymer film 14 on which the functional element 16 is not provided.

In the first embodiment and the second embodiment, when the spacer 62 is used, that is, when the step X is performed before the step C, irregularities on the polymer film 14 can be reduced by the spacer 62 . As a result, at the time of peeling, excessive load applied to the polymer film 14 at the location where the functional element 16 is located can be suppressed.

In the case of peeling the polymer film 14 having the functional elements from the inorganic substrate 12 using the laminate 11 having the functional elements, it is also preferable to use a member for embedding described below. That is, it is preferable to arrange the embedding member 64 on the polymer film 14 before the step C, and perform the step Y of embedding the functional element 16 in the embedding member 64.

As the embedding member 64, a resin composition capable of plastic deformation may be applied to a hard sheet, or a resin composition capable of plastic deformation may be adhered to a hard sheet. Moreover, it may have adhesiveness, and the embedding member itself may have a role as a protective layer of a functional element.

8 is a schematic cross-sectional view showing a state in which a member for embedding is disposed on a polymer film of a laminate having functional elements and the functional elements are embedded. In FIG. 8 , the embedding member 64 is disposed on the polymer film 14 and the functional element 16 is embedded in the embedding member 64 . A hard sheet 66 is disposed on the upper surface of the embedding member 64 (surface opposite to the functional element 16).

In the first and second embodiments, when the embedding member 64 is used, that is, when the step Y is performed before the step C, the functional element 16 is embedded by the embedding member 64. , since a static pressure difference is provided and the polymer film 14 is separated from the inorganic substrate 12, excessive load applied to the polymer film 14 at the location where the functional element 16 is located can be suppressed. .

[Third Embodiment]

In the third embodiment, a case where the polymer film 14 having the functional element 16 is separated from the layered body 11 having the functional element is described.

9 is a schematic sectional view of a peeling device according to a third embodiment. As shown in FIG. 9 , the peeling device 50 according to the third embodiment includes a vacuum chamber 30, a vacuum chuck 34, a dummy film 36, and a porous flexible body 52. .

Since the vacuum chamber 30, the vacuum chuck 34, and the dummy film 36 have already been described in the section of the first embodiment, a description thereof is omitted.

When the porous flexible body 52 is disposed in the vacuum chamber 30 and the layered body 11 having functional elements is disposed thereon, it is possible to embed the functional elements 16 therein. The porous flexible body 52 is not particularly limited as long as it is porous and has flexibility. As the material of the porous flexible body 52, any of a polymer porous body, a metal porous body, and a ceramic porous body can be used. As the polymeric porous material, low density polyethylene, high density polyethylene, ultra high density polyethylene, polypropylene, polymethacrylic, polyvinyl chloride, fluororesin, etc. are used. As a metal porous body, Cu, SUS, titanium, etc. are used. As the ceramic porous body, alumina, aluminum nitride, silicon nitride, zirconia and the like are used.

Step C according to the third embodiment includes step F-1 and step F-2. The peeling apparatus 50 performs the process F-1 and the process F-2 by operating as follows.

First, the peeling device 50 adsorbs the inorganic substrate 12 side of the layered body 11 having functional elements with the vacuum chuck 34 and places it above the vacuum chamber 30 . At this time, the stacked body 10 is placed in the opening of the dummy film 36 .

Next, the peeling device 50 embeds the functional element 16 in the porous flexible body 52 disposed in the vacuum chamber 30, and the polymer film 14 is separated by the porous flexible body 52. It presses in the (18) direction (process F-1).

Next, the peeling device 50 makes the inside of the vacuum chamber 30 less than atmospheric pressure by the pump P. Here, the peeling portion 18 is at atmospheric pressure. This provides a static pressure difference between the non-adhesive surface 14a of the polymer film 14 and the peeling portion 18 . That is, while making the non-adhesive surface 14a side less than atmospheric pressure, by making the peeling part 18 atmospheric pressure, a static pressure difference is provided (process F-2). As a result, peeling gradually spreads from the peeling portion 18, and the polymer film 14 having the functional element 16 is peeled off from the inorganic substrate 12.

In the peeling device 50, in a state where the functional element 16 is embedded in the porous flexible body 52, a static pressure difference is provided to peel the polymer film 14 from the inorganic substrate 12, so the functional element ( 16), it is possible to suppress an excessive load applied to the polymer film 14 at the location.

In addition, the vacuum chamber 30 and the vacuum chuck 34 correspond to the static pressure difference forming means of the present invention.

The polymer film 14 having the functional element 16 peeled off in step C can be used as an electronic device, particularly a flexible electronic device. That is, the method including the step A-1, the step B and the step C is also a method of manufacturing an electronic device.

As mentioned above, although the embodiment of the present invention has been described, the present invention is not limited to the above examples, and it is possible to make appropriate design changes within a range satisfying the configuration of the present invention.

10 laminate
Laminate with 11 functional elements
12 inorganic substrate
14 polymer film
14a Secret Encounter
16 functional elements
18 peeling part
20, 22, 40, 50 peeling device
30 vacuum chamber
32 roller
33 support parts
34 vacuum chuck
36 dummy film
38 mesh type seat
42 diaphragm
52 porous flexible body
62 spacer
64 Material for landfill
66 hard seat

Claims (10)

Step A of preparing a laminate in which the polymer film and the inorganic substrate are in close contact;
Step B of forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;
After step B, a step C of peeling the polymer film from the inorganic substrate by providing a static pressure difference between a non-adhesive surface of the polymer film that is not in close contact with the inorganic substrate and the peeling portion, characterized in that A peeling method of a polymer film to be. The method of peeling a polymer film according to claim 1, wherein the step A is a step of preparing a laminate having functional elements in which functional elements are provided on the polymer film of the laminate. The step C according to claim 1 or 2,
Step D-1 of arranging a roller on the side of the non-adhesive surface of the polymer film and pressing the polymer film in the direction of the peeling portion with the roller;
Step D-2 of providing the static pressure difference by setting the non-adhesive surface side to atmospheric pressure while setting the peeling portion to atmospheric pressure;
After the step D-1 and the step D-2, a step D-3 of moving the surface of the roller parallel to the non-adhesive surface of the polymer film and advancing the peeling according to the movement of the roller A peeling method of a polymer film, characterized in that for doing. The method of claim 3, wherein a mesh-like sheet is disposed between the polymer film and the roller. The step C according to claim 1 or 2,
Step E-1 of setting the non-adhesive surface side to atmospheric pressure or higher and the peeling portion to atmospheric pressure;
A peeling method for a polymer film characterized by including a step E-2 of providing the static pressure difference by setting the peeling portion to a pressure higher than the pressure on the non-adhesive surface side after the step E-1. The method according to claim 1, wherein a functional element is formed on the polymer film of the laminate,
The step C,
Step F-1 of arranging a porous flexible body on the non-adhesive surface side of the polymer film, and pressing the polymer film in the direction of the peeling portion with the porous flexible body while embedding the functional element in the porous flexible body; ,
A peeling method for a polymer film characterized by including a step F-2 of providing the positive pressure difference by setting the non-adhesive surface side to an atmospheric pressure lower than atmospheric pressure and setting the peeling portion to atmospheric pressure. The method according to any one of claims 1 and 3 to 5, wherein a functional element is formed on the polymer film of the laminate,
Step X of providing a spacer having a thickness equivalent to that of the functional element on the surface of the polymer film on which the functional element is not provided, prior to the step C. Way. The method according to any one of claims 1 and 3 to 5, wherein a functional element is formed on the polymer film of the laminate,
A method for peeling a polymer film characterized by comprising a step Y of disposing an embedding member on the polymer film and embedding the functional element in the embedding member prior to the step C. Step A-1 of preparing a laminate having a laminate in which a polymer film and an inorganic substrate are in close contact with each other and a functional element having a functional element provided on the polymer film of the laminate;
Step B of providing a peeling portion between the polymer film and the inorganic substrate at the end of the laminate;
Step C of peeling the polymer film from the inorganic substrate by providing a static pressure difference between the non-adhesive surface of the polymer film on the side not in close contact with the inorganic substrate and the peeling portion after the step B; A method for manufacturing an electronic device characterized by A peeling device for peeling the polymer film from the inorganic substrate from a laminate in which the polymer film and the inorganic substrate are in close contact,
To provide a static pressure difference forming means for providing a static pressure difference between a non-adhesive surface of the polymer film on a side that is not in close contact with the inorganic substrate and a peeling portion of the polymer film and the inorganic substrate provided at an end of the laminate. Peeling device characterized by.

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