TW202200392A - Peeling method of polymer film, manufacturing method of electronic device, and peeling device capable of easily peeling a polymer film from an inorganic substrate - Google Patents

Abstract

A peeling method of a polymer film comprises a step A of preparing a laminate in which a polymer film and an inorganic substrate are adhered to each other; a step B of forming a peeling portion between the polymer film and the inorganic substrate at the end part of the laminate; and a step C of peeling the polymer film from the inorganic substrate by providing a static pressure difference between a non-bonding surface of the polymer film where the inorganic substrate is not adhered thereto and the peeling portion after the step B.

Description

Stripping method of polymer film, manufacturing method of electronic device, and stripping device

The present invention relates to a method for peeling off a polymer film, a method for manufacturing an electronic device, and a peeling device.

In recent years, with the aim of reducing the weight, size/thinning, and flexibility of functional elements such as semiconductor elements, MEMS elements, and display elements, the development of technologies for forming these elements on polymer films has been actively pursued. That is to say, as a material for the base material of electronic parts such as information communication equipment (broadcasting equipment, mobile radio, portable communication equipment, etc.), radar, and high-speed information processing devices, conventionally used materials that have heat resistance and can also cope with The high frequency of the signal frequency band of information communication equipment (up to the GHz band) ceramics, but because ceramics are inflexible and difficult to thin, and the field of application is limited, so polymer films are recently used as substrates.

When forming functional elements such as semiconductor elements, MEMS elements, and display elements on the surface of a polymer film, ideally, it is processed by a so-called roll-to-roll process utilizing the flexibility of the polymer film. However, in industries such as the semiconductor industry, the MEMS industry, and the display industry, process technologies for rigid planar substrates such as wafer bases and glass substrate bases have been established so far. Therefore, in order to use the existing infrastructure to form functional elements on the polymer film, the polymer film is bonded to a rigid support including inorganic substances such as glass plates, ceramic plates, silicon wafers, metal plates, etc., The process of peeling from the support after forming the desired element thereon.

Conventionally, as a method of peeling a polymer film from a support, a method of reducing the adhesion between the polymer film and the support by irradiating laser light and then peeling is known (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Application Laid-Open No. 10-125931

[The problem to be solved by the invention]

However, in the method of Patent Document 1, in order to irradiate the entire surface of the support body with the laser light, there is a problem that a large-scale irradiation apparatus for irradiating the laser light is required. In addition, there is a problem in that the quality of the polymer film is affected, for example, by scorching on the polymer film due to the irradiation of laser light. In addition, there is concern that the leakage of laser light may irradiate circuits and devices formed on the surface of the polymer film, and components mounted on the polymer film, or that the shock wave heated by the laser may affect the quality. For mechanical peeling, there are also concerns about the deformation of the polymer film, damage to the polymer film itself due to stress, and damage to the circuits and devices formed on the surface of the polymer film, as well as the devices mounted on the polymer film. The quality of the components has an impact.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a method for peeling off a polymer film, a method for manufacturing an electronic device, and a peeling device, wherein the method for peeling off a polymer film can remove the polymer film from being formed on the polymer film. The quality of circuits and devices on the surface and components mounted on the polymer film are affected, and the polymer film is easily peeled off from the inorganic substrate. [means to solve the problem]

The inventors of the present invention have conducted careful research on a method for peeling off a polymer film, a method for manufacturing an electronic device, and a peeling device. As a result, it was found that by adopting the following configuration, the polymer film can be easily freed from the polymer film without affecting the quality of the polymer film, circuits and devices formed on the surface of the polymer film, and elements mounted on the polymer film. The inorganic substrate was peeled off, and the present invention was completed.

That is, the present invention provides the following. (1) A peeling method of a polymer film, comprising: Step A: Prepare a laminate formed by bonding the polymer film and the inorganic substrate, Step B: forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate, Step C: After the aforementioned Step B, by providing a static pressure difference between the non-bonding surface of the polymer film that is not bonded to the inorganic substrate and the peeling portion, the polymer film is peeled off from the inorganic substrate .

According to the above configuration, the polymer thin film is peeled off from the inorganic substrate by the static pressure difference between the non-bonding surface and the peeling portion, not mechanically, so that the quality of the polymer thin film can not be affected. , easily peeling off the polymer film from the inorganic substrate.

(2) In the configuration of the above (1), it is preferable that the above-mentioned step A is a step of preparing a functional element-attached laminate in which the functional element is provided on the polymer film of the laminate.

(3) In the constitution of the aforementioned (1) or the aforementioned (2), the aforementioned step C preferably includes: Step D-1: Arrange a roller on the non-bonding surface side of the polymer film, and push the polymer film toward the peeling part by the roller, Step D-2: Make the non-bonding surface side less than the atmospheric pressure, and on the other hand make the peeling part be the atmospheric pressure, thereby providing the static pressure difference, Step D-3: After Step D-1 and Step D-2, move the surface of the roller parallel to the non-bonding surface of the polymer film, and perform the peeling according to the movement of the roller.

According to the said structure, since the surface of a roller is moved parallel to the said non-bonding surface of a polymer film, and the said peeling is performed according to the movement of the said roller, the peeling speed can be controlled. As a result, the application of an excessive load to the polymer film can be suppressed.

(4) In the configuration of the above (3), it is preferable that a mesh-like sheet is arranged between the polymer film and the roll.

According to the above configuration, since the mesh-like sheet is arranged between the polymer film and the roll, the peeled polymer film can be held.

(5) In the constitution of the aforementioned (1) or the aforementioned (2), the aforementioned step C preferably includes: Step E-1: Make the above-mentioned non-bonding surface side be at atmospheric pressure or higher, on the other hand, make the above-mentioned peeling part be at atmospheric pressure, Step E-2: After the aforementioned Step E-1, the aforementioned peeling portion is made to have a higher pressure than the aforementioned pressure on the non-bonding surface side, thereby providing the aforementioned static pressure difference.

According to the above-mentioned configuration, the pressure of the non-bonding surface side is set to be equal to or higher than the atmospheric pressure in advance, and then the pressure of the peeling part is higher than the pressure of the non-bonding surface side, thereby providing the static pressure difference, and the polymer film is separated. peeled off from the aforementioned inorganic substrate. Since the said non-bonding surface side is made into atmospheric pressure or more, the said polymer film after peeling can be hold|maintained.

(6) In the configuration of (1) above, a functional element is formed on the polymer film of the laminate, and the step C preferably includes: Step F-1: Disposing a porous soft body on the non-adhering surface side of the polymer film, while embedding the functional element into the porous soft body, the polymer film is transferred to the porous soft body by the porous soft body. The aforementioned peeling part is pushed in the direction, Step F-2: The above-mentioned static pressure difference is provided by making the said non-bonding surface side less than atmospheric pressure, and making the said peeling part be atmospheric pressure on the other hand.

According to the above configuration, since the static pressure difference is provided in a state where the functional element is embedded in the porous flexible body, and the polymer thin film is peeled off from the inorganic substrate, it is possible to suppress the friction at the place where the functional element is located. The polymer film exerts an excessive load.

(7) In the configurations of (1), (3) to (5) above, a functional element is formed on the polymer thin film of the laminate, and Before the aforementioned step C, it is preferable to include a step X: on the surface of the aforementioned polymer film on which the aforementioned functional elements are not arranged, a spacer having the same thickness as that of the aforementioned functional elements is arranged.

According to the said structure, the unevenness|corrugation on the polymer film can be reduced by the said spacer. As a result, at the time of peeling, it can be suppressed that an excessive load is applied to the polymer film where the functional element is located.

(8) In the configuration of the above (1), the above (3) to the above (5), a functional element is formed on the polymer thin film of the layered product, and Before the aforementioned step C, it is preferable to include a step Y: disposing the member for embedding on the aforementioned polymer film, and embedding the aforementioned functional element in the aforementioned member for embedding.

According to the above configuration, since the static pressure difference is provided in a state where the functional element is embedded by the embedding member, and the polymer thin film is peeled off from the inorganic substrate, it is possible to prevent the polymer thin film from being exposed to the polymer at the place where the functional element is located. Excessive load applied to the film.

(9) A manufacturing method of an electronic device, characterized by comprising: Step A-1: Prepare a functional element-attached laminate, which includes a laminate in which a polymer film and an inorganic substrate are bonded together, and the polymer film provided on the laminate. functional elements, Step B: disposing a peeling portion between the polymer film and the inorganic substrate at the end of the laminate, Step C: After the aforementioned Step B, by providing a static pressure difference between the non-bonding surface of the polymer film on the side that is not bonded to the inorganic substrate and the peeling portion, the polymer film is removed from the inorganic substrate. Substrate peeling.

According to the above configuration, the polymer thin film is peeled off from the inorganic substrate by the static pressure difference between the non-bonding surface and the peeling portion, not mechanically, so that the quality of the polymer thin film can not be affected. , easily peeling off the polymer film from the inorganic substrate. Since the polymer film provided with functional elements can be easily peeled off from the inorganic substrate, the peeled polymer film with functional elements can be used in electronic devices.

(10) A peeling device for peeling the polymer thin film from the inorganic substrate from a laminate formed by bonding a polymer thin film and an inorganic substrate, It is characterized by being provided with a static pressure difference forming means, the static pressure difference forming means being provided on the non-bonding surface of the polymer film on the side that is not bonded to the inorganic substrate and the height provided at the end of the laminate. A static pressure difference is provided between the molecular thin film and the peeled portion of the aforementioned inorganic substrate.

According to the above configuration, the polymer thin film is peeled off from the inorganic substrate by the static pressure difference between the non-bonding surface and the peeling portion formed by the static pressure difference forming means instead of mechanical peeling. Therefore, the polymer film can be easily peeled off from the inorganic substrate without affecting the quality of the polymer film. [Effect of invention]

According to the present invention, the polymer thin film can be easily peeled off from the inorganic substrate without affecting the quality of the polymer thin film.

[Form for carrying out the invention]

Embodiments of the present invention will be described below. Hereinafter, the peeling method of the polymer film will be described, and the manufacturing method of the electronic device and the peeling apparatus will also be described.

[Peeling method of polymer film] The peeling method of the polymer film of this embodiment includes: Step A: Prepare a laminate formed by bonding the polymer film and the inorganic substrate, Step B: forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate, Step C: After the aforementioned Step B, by providing a static pressure difference between the non-bonding surface of the polymer film that is not bonded to the inorganic substrate and the peeling portion, the polymer film is peeled off from the inorganic substrate .

<Step A> In the peeling method of the polymer film of the present embodiment, first, a laminate in which the polymer film and the inorganic substrate are bonded together is prepared (step A). FIG. 1 is a schematic cross-sectional view showing an example of a laminated body. As shown in FIG. 1 , the laminate 10 includes an inorganic substrate 12 and a polymer thin film 14 . The inorganic substrate 12 is bonded to the polymer film 14 . The inorganic substrate 12 and the polymer thin film 14 can be bonded via a silane coupling agent layer (not shown). In addition, in this embodiment, a laminated body can be obtained by adhering (laminating) a polymer thin film separately produced in advance on an inorganic substrate. As the method of lamination, in addition to the lamination method using a silane coupling agent described later, known adhesives, adhesive sheets, adhesives, pressure-sensitive adhesive sheets, and the like can be applied. In addition, in this case, the adhesive agent, the adhesive sheet, the adhesive agent, and the adhesive sheet may be attached to the inorganic substrate side first, or may be attached to the polymer film side first. In addition, as another method for producing a layered product of a polymer thin film and an inorganic substrate, there may be mentioned a method of applying a polymer solution for forming a polymer thin film or a solution of a polymer precursor on the inorganic substrate, The polymer is thinned on the inorganic substrate by drying and, if necessary, a chemical reaction to obtain a layered product. A laminate of a polymer film and an inorganic substrate can be obtained by using a soluble polyimide solution as a polymer solution and a polyimide solution converted to polyimide through a chemical reaction as a polymer precursor. In addition, at this time, by subjecting the inorganic substrate to a surface treatment such as a silane coupling agent treatment, it is one of the aspects that the adhesion between the polymer thin film and the inorganic substrate is better controlled. In this case, in order to control the peeling strength between the inorganic substrate and the polymer film, a known easy-to-peel polymer layer (easy-peel layer) and a main polymer layer (polymer film) can be made into a two-layer structure or a main layer. (Polymer thin film) and inorganic thin film layer composed of two layers. Other established configurations for controlling peel force may also be used. In the case where the easily peelable polymer layer (easy peel layer) and the main polymer layer (polymer thin film) are composed of two layers, there are cases in which the easily peelable polymer layer (easy peel layer) and the inorganic substrate are formed by two layers. The adhesion force is stronger than the adhesion between the easily peelable polymer layer (easy peel layer) and the main polymer layer (polymer film), and the main polymer layer (polymer film) and the easily peeled polymer The design of peeling between layers (easy-peeling layer); the adhesion between the easy-peeling polymer layer (easy-peeling layer) and the main polymer layer (polymer film) is higher than that of the easy-peeling polymer layer (easy-peeling layer) The bonding force with the inorganic substrate is stronger, and the design of peeling between the easy-to-peel polymer layer (easy-to-peel layer) and the inorganic substrate. The adhesion between the easily peelable polymer layer (easy peel layer) and the inorganic substrate is stronger than the adhesion force between the easily peelable polymer layer (easy peel layer) and the main polymer layer (polymer film). In the case of the design of peeling between the main polymer layer (polymer film) and the easily peelable polymer layer (easy peeling layer), when the easily peelable polymer layer (easy peeling layer) is deposited on the inorganic substrate, it is equivalent to Inorganic substrate in the present invention. In the case of a two-layer structure with an inorganic thin film layer, an inorganic thin film layer is formed on an inorganic substrate, and then a solution or a solution of a polymer precursor is applied on the inorganic thin film layer on the inorganic substrate. A method for obtaining a layered product by thinning a polymer on an inorganic substrate by drying and, if necessary, a chemical reaction. In this case, peeling occurs between the inorganic thin film and the polymer layer on the inorganic substrate. In this case, the inorganic thin film deposited on the inorganic substrate corresponds to the inorganic substrate in the present invention. As a variation of the method of using a polymer solution or a polymer precursor solution, a polymer film in a semi-solid state (high-viscosity paste) containing a solvent is press-bonded on an inorganic substrate, followed by additional drying or chemical reaction as needed. A laminate of a polymer film and an inorganic substrate can also be obtained. More specifically, by coating the target polymer solution or polymer precursor solution on a support film such as polyethylene terephthalate, and semi-drying until the residual solvent content becomes 5-5 on a moisture basis. About 40 mass %, a semisolid thin film (sometimes also referred to as a green film or a gel film) having plastic deformability can be obtained. When the thus-obtained thin film in a semi-solid state is pressed onto an inorganic substrate and subjected to drying, heat treatment, and the like, a laminate of the polymer thin film and the inorganic substrate can be obtained. In the present embodiment, when a thermoplastic polymer is used, a laminate can be obtained by directly melt-extruding the polymer onto the inorganic substrate. Moreover, in the case of a thermoplastic polymer film, the inorganic substrate and the polymer film can be stacked together, heated to the melting point or softening temperature of the polymer in a pressurized state, and pressure-bonded to form a laminate.

The inorganic substrate 12 may be any plate-shaped one that can be used as a substrate made of an inorganic substance, and examples thereof include those mainly composed of glass plates, ceramic plates, semiconductor wafers, metals, and the like, and examples of these glass plates, Ceramic plates, semiconductor wafers, metal composites, those formed by laminating these, those formed by dispersing them, those containing fibers of these, and the like.

The thickness of the inorganic substrate 12 is not particularly limited, but from the viewpoint of handleability, it is preferably a thickness of 10 mm or less, more preferably 3 mm or less, and even more preferably 1.3 mm or less. The lower limit of the thickness is not particularly limited, but is preferably 0.05 mm or more, more preferably 0.3 mm or more, and even more preferably 0.5 mm or more.

The polymer film 14 is not particularly limited, and examples thereof include polyimide-based resins such as polyimide, polyimide, polyetherimide, and fluorinated polyimide (eg, aromatic polyimide). imide resin, alicyclic polyimide resin); polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene 2,6-naphthalate Isocopolymerized polyesters (such as fully aromatic polyesters, semi-aromatic polyesters); copolymerized (meth)acrylates represented by polymethyl methacrylate; polycarbonates; polyamides; Polyether tungsten; polyether ketone; cellulose acetate; nitrocellulose; aromatic polyamide; polyvinyl chloride; polyphenol; polyarylate; polyphenylene sulfide; The thickness of the polymer film 14 is not particularly limited, but from the viewpoint of handling properties, it is preferably 250 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. The lower limit of the thickness is not particularly limited, but is preferably 3 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more.

The aforementioned silane coupling agent layer is physically or chemically interposed between the inorganic substrate 12 and the polymer film 14, and has the function of bonding the inorganic substrate and the polymer film. The silane coupling agent used in the present embodiment is not particularly limited, but preferably contains a coupling agent having an amine group. Preferable specific examples of the silane coupling agent include N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3- Aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-Triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxy Ethylpropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane Silane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxy propylpropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloyloxypropylmethyldimethoxysilane Silane, 3-methacryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropylmethyldiethoxysilane, 3-methacryloyloxypropyltriethoxy Silane, 3-propenyloxypropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl-3-aminopropyl trimethoxysilane hydrochloride, amine phenyl trimethoxy silane, amine phenethyl trimethoxy silane, 3-ureapropyl triethoxy silane, 3-chloropropyl trimethoxy silane, 3-mercapto Propylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3-isocyanatopropyltriethoxysilane, trimeriso Tris-(3-trimethoxysilylpropyl) cyanate, Chloromethylphenethyltrimethoxysilane, Chloromethyltrimethoxysilane, Aminophenyltrimethoxysilane, Aminophenethyltrimethoxysilane Silane, amine phenyl amine methyl phenethyl trimethoxy silane, etc. As the silane coupling agent, in addition to the above, n-propyltrimethoxysilane, butyltrichlorosilane, 2-cyanoethyltriethoxysilane, cyclohexyltrichlorosilane, and decyltrichlorosilane can also be used. , Diethoxydimethylsilane, Diethoxydimethylsilane, Dimethoxydimethylsilane, Dimethoxydiphenylsilane, Dimethoxymethylphenylsilane, Dodecyl Alkyltrichlorosilane, dodecyltrimethoxysilane, ethyltrichlorosilane, hexyltrimethoxysilane, octadecyltriethoxysilane, octadecyltrimethoxysilane, n-octyltrichlorosilane Chlorosilane, n-octyltriethoxysilane, n-octyltrimethoxysilane, triethoxyethylsilane, triethoxymethylsilane, trimethoxymethylsilane, trimethoxyphenylsilane, Amyltriethoxysilane, Amyltrichlorosilane, Triacetoxymethylsilane, Trichlorohexylsilane, Trichloromethylsilane, Trichlorooctadecylsilane, Trichloropropylsilane, Trichlorosilane tetradecylsilane, trimethoxypropylsilane, allyltrichlorosilane, allyltriethoxysilane, allyltrimethoxysilane, diethoxymethylvinylsilane, dimethoxysilane Methylvinylsilane, Trichlorovinylsilane, Triethoxyvinylsilane, Vinyl(2-methoxyethoxy)silane, Trichloro-2-cyanoethylsilane, Diethoxy (3-glycidoxypropyl)methylsilane, 3-glycidoxypropyl(dimethoxy)methylsilane, 3-glycidoxypropyltrimethoxysilane Wait.

Among the above-mentioned silane coupling agents, those having one silicon atom in one molecule are particularly preferred, and examples thereof include N-2-(aminoethyl)-3-aminopropylmethyldimethoxy Silane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane Oxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, 2-(3,4-epoxy ring Hexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltrimethoxysilane Ethoxysilane, amine phenyl trimethoxy silane, amine phenethyl trimethoxy silane, amine phenyl amine methyl phenethyl trimethoxy silane, etc. In the case where particularly high heat resistance is required in the process, it is desirable to connect Si and an amine group with an aromatic group. As the above-mentioned coupling agent, in addition to the above, 1-mercapto-2-propanol, methyl 3-mercaptopropionate, 3-mercapto-2-butanol, butyl 3-mercaptopropionate, 3-( Dimethoxymethylsilyl)-1-propanethiol, 4-(6-mercaptohexyl)benzyl alcohol, 11-amino-1-undecenethiol, 11-mercaptoundecylphosphine acid, 11-mercaptoundecyl trifluoroacetate, 2,2'-(ethylenedioxy)diethanethiol, 11-mercaptoundecyltris(ethylene glycol), (1-mercaptoundecyl) Alk-11-yl)tetrakis(ethylene glycol), 1-(methylcarboxy)undecan-11-yl)hexa(ethylene glycol), hydroxyundecyl disulfide, carboxyundecyl disulfide , hydroxyhexadecyl disulfide, carboxyhexadecyl disulfide, tetra(2-ethylhexyloxy) titanium, dioctyloxy bis(dioctyl glycolate) titanium, tributoxy mono Zirconium acetylacetonate, bis(ethyl acetate) zirconium acetylacetonate, zirconium tributoxy monostearate, acetyl alkoxyaluminum diisopropionate, 3-epoxypropyl Oxypropyltrimethoxysilane, 2,3-butanedithiol, 1-butanethiol, 2-butanethiol, cyclohexanethiol, cyclopentanethiol, 1-decanethiol, 1-dodecanethiol Thiol, 2-ethylhexyl 3-mercaptopropionate, ethyl 3-mercaptopropionate, 1-heptanethiol, 1-hexadecanethiol, hexanethiol, isoamylthiol, isobutanethiol, 3-Mercaptopropionic acid, 3-Mercaptopropionic acid-3-methoxybutyl ester, 2-methyl-1-butanethiol, 1-octadecanethiol, 1-octanethiol, 1-pentadecanthiol , 1-pentanethiol, 1-propanethiol, 1-tetradecanethiol, 1-undecanethiol, 1-(12-mercaptododecyl)imidazole, 1-(11-mercaptoundecyl) ) imidazole, 1-(10-mercaptodecyl) imidazole, 1-(16-mercaptohexadecyl) imidazole, 1-(17-mercaptoheptadecyl) imidazole, 1-(15-mercapto) dodecanoic acid , 1-(11-mercapto)undecanoic acid, 1-(10-mercapto)decanoic acid, etc.

As the coating method of the silane coupling agent (the formation method of the silane coupling agent layer), the method of coating the silane coupling agent solution on the inorganic substrate 12, the vapor deposition method, or the like can be used. In addition, the formation of the silane coupling agent layer may also be performed on the surface of the polymer thin film 14 .

The film thickness of the silane coupling agent layer is extremely thin even when compared with the inorganic substrate 12, the polymer thin film 14, etc., and is so thick that it is ignored from the viewpoint of mechanical design. thickness is sufficient.

After the silane coupling agent is applied, the adhesive force of the laminate can be expressed through the step of laminating the inorganic substrate 12 and the polymer film 14 and the step of heating. The method of bonding is not particularly limited, and there are lamination, pressing, and the like. Lamination and heating may be performed simultaneously or sequentially. The heating method is not particularly limited, and may be placed in an oven, thermally laminated, or hot-pressed.

As a method for producing a layered product in which a polymer film and an inorganic substrate are bonded, the inorganic substrate and the polymer film may be separately produced and then bonded. In this case, a known silane coupling agent other than an easily peelable material may be used. Adhesives, adhesive sheets, adhesives, and adhesive sheets to attach. In this case, the adhesive agent, the adhesive sheet, the adhesive agent, and the adhesive sheet may be attached to the inorganic substrate side first, or may be attached to the polymer film side first. In addition, as another method for producing a laminate in which a polymer thin film and an inorganic substrate are bonded together, a varnish for forming a polymer thin film may be applied on the inorganic substrate and then dried. In this case, in order to control the peeling strength between the inorganic substrate and the polymer film, a known easy-to-peel varnish layer (easy-peel layer) and a main varnish layer (polymer film) may be formed in two layers, or the main layer ( The polymer film) and the inorganic film layer are composed of two layers.

<Step B> Next, a peeling portion 18 is formed between the polymer thin film 14 and the inorganic substrate 12 at the end of the laminate 10 (step B).

There is no particular limitation on the method of providing the peeling portion 18, and a method of rolling up from the end with tweezers or the like can be used; an incision is formed in the polymer film 14, an adhesive tape is attached to one side of the incision portion, and the adhesive tape is removed from the tape. A method of partially rolling up; a method of rolling up one side of the cut portion of the polymer film 14 after vacuum suction, and the like. As a method of forming a slit in the polymer film 14, there are a method of cutting the polymer film 14 with a cutting tool such as a knife, a method of cutting the polymer film 14 by scanning the layered body 10 with a laser, and a method of cutting the polymer film 14. However, the method is not particularly limited, such as a method of slicing the polymer film 14 by scanning the laminated body 10 with a water jet, and a method of slicing the polymer film 14 while slightly slicing the glass layer by a dicing device of a semiconductor wafer. For example, when the above method is used, methods such as superimposing ultrasonic waves on the cutting tool, adding back-and-forth motions, and up-and-down motions to improve the cutting performance can also be appropriately used. In addition, although not shown in the figure, in order to keep the peeling portion 18 in a peeled state without re-bonding, a film or sheet having no adhesiveness or adhesiveness may be sandwiched between the peeling portion 18 . In addition, a film or sheet having adhesiveness and adhesiveness on one side may be sandwiched by the peeling portion 18 . Moreover, a metal part (for example, a needle) may be pinched|interposed in the peeling part 18.

<Step C> After the aforementioned step B, the polymer film 14 is removed from the inorganic substrate 12 by providing a static pressure difference between the surface of the polymer film 14 on the side that is not bonded to the inorganic substrate 12 (the non-bonding surface 14 a ) and the peeling portion 18 . The substrate 12 is peeled off (step C).

A specific example of step C will be described below.

[1st Embodiment] Fig. 2 is a schematic cross-sectional view of the peeling device according to the first embodiment. As shown in FIG. 2 , the peeling apparatus 20 of the first embodiment includes a vacuum chamber 30 , a roller 32 , a vacuum pad 34 , a dummy film 36 , and a mesh sheet 38 .

The drum 32 is configured to be movable within the vacuum chamber 30 .

The vacuum chuck 34 can hold the layered body 10 by sucking it, and can be positioned above the vacuum chamber 30 in a state where the layered body 10 is sucked.

The dummy film 36 is disposed on the upper surface of the vacuum chamber 30 and has an opening corresponding to the size of the laminate 10 .

The mesh-shaped sheet 38 is disposed on the upper surface of the vacuum chamber 30 so as to cover the upper opening of the vacuum chamber 30 .

Step C of the first embodiment includes Step D-1, Step D-2, and Step D-3. The peeling apparatus 20 performs step D-1, step D-2, and step D-3 by operating as follows.

First, the peeling apparatus 20 is positioned above the vacuum chamber 30 by sucking the inorganic substrate 12 side of the laminate 10 with the vacuum chuck 34 . At this time, the layered body 10 is displaced so that it is located in the opening of the dummy thin film 36 . In addition, at this time, the polymer thin film 14 of the laminate 10 is brought into contact with the mesh sheet 38 .

Next, the peeling device 20 arranges the roller 32 on the non-bonding surface 14a side of the polymer film 14, and pushes the polymer film 14 toward the peeling part 18 (upward in FIG. 2) by the roller 32 (step D-1).

Next, the peeling device 20 uses the pump P to make the pressure in the vacuum chamber 30 lower than the atmospheric pressure. Here, the peeling portion 18 is at atmospheric pressure. Thereby, a static pressure difference is provided between the non-bonding surface 14 a of the polymer film 14 and the peeling portion 18 . That is, the static pressure difference is provided by making the non-bonding surface 14a side lower than the atmospheric pressure, while making the peeling part 18 the atmospheric pressure (step D-2). In addition, in this state, since the roller 32 presses the polymer film 14 in the direction of the peeling portion 18, peeling does not proceed.

Next, the peeling device 20 moves the surface of the drum 32 (contact surface with the polymer film 14 ) in parallel with the non-bonding surface 14 a of the polymer film 14 . Fig. 3 is a schematic cross-sectional view of the peeling device according to the first embodiment, showing a state in which the roller is moved. As shown in FIG. 3 , when the roller 32 is moved laterally (leftward in FIG. 3 ) from below the peeling portion 18 , peeling of the peeling portion 18 is sequentially performed from the portion separated by the pressing of the roller 32 . That is, the surface of the roller 32 is moved parallel to the non-bonding surface 14a of the polymer film 14, and peeling is performed according to the movement of the roller 32 (step D-3). Then, the entire polymer film 14 is peeled off from the inorganic substrate 12 by moving the roller 32 to just below the side opposite to the side where the peeling portion 18 is formed. In this way, in the peeling device 20, since the surface of the roller 32 is moved parallel to the non-bonding surface 14a of the polymer film 14, and peeling is performed according to the movement of the roller 32, the peeling speed can be controlled. As a result, the application of an excessive load to the polymer thin film 14 can be suppressed. By further changing the radius of the roller 32, the peeling angle of the polymer film 14 can be controlled. For example, when the radius of the roller 32 is reduced, the polymer film 14 is peeled off according to the radius of curvature, and when the radius of the roller 32 is increased, the polymer film 14 is peeled off according to the radius of curvature. By reducing the radius of the roller 32, the peeling device can be miniaturized, and by increasing the radius of the roller 32, the load applied to the functional elements formed on the polymer film 14 can be reduced. Moreover, as will be described later, by the support unit 33, the roller diameter of the roller 32 and the radius of curvature of the peeling can be separately defined. In addition, the vacuum chamber 30 and the vacuum pad 34 correspond to the static pressure difference formation means of this invention.

The radius of the roller is 40 mm or more and 1000 mm or less, more preferably 60 mm or more and 100 mm or less. As the material of the aforementioned roller, preferably a material with a certain degree of elasticity can be used, for example, silicone rubber, fluorine rubber, urethane rubber, ethylene propylene rubber, and the like. The modulus of resilience (JIS K 6255:2013) of the aforementioned roller material is preferably 3 to 60%. The rubber hardness of the aforementioned roller material is preferably 50-90, preferably non-adhesive and antistatic or conductive.

Here, in the present embodiment, the mesh-like sheet 38 is arranged between the polymer film 14 and the drum 32 . Since the mesh-like sheet 38 is arranged between the polymer film 14 and the drum 32, the peeled polymer film 14 can be held. As the mesh-like sheet 38, what is necessary is just to have air permeability and a certain degree of strength, and for example, a well-known mesh etc. can be used. In addition, in this embodiment, although the case where the mesh-shaped sheet|seat 38 is used is demonstrated, in the peeling apparatus 20, you may make it the structure which does not arrange|position the mesh-shaped sheet|seat. In this case, it is sufficient to take out the peeled polymer film 14 from the vacuum chamber 30 every time.

As the material of the mesh-like sheet, a material with appropriate elastic deformation is preferable, and specifically, a mesh-like sheet having a mesh number in the range of #80 to #600, such as polyester yarn, nylon yarn, and stainless steel wire, is preferably used. . Moreover, antistatic or electroconductive ones are preferable.

4 is a schematic cross-sectional view of a modification of the peeling device of the first embodiment. As shown in FIG. 4 , the peeling device 22 is a device in which a support unit 33 is added to the peeling device 20 described above.

The support assembly 33 is connected to the drum 32 and moves in a chain with the movement of the drum 32 . The support member 33 is arrange|positioned so that the upper surface may become the same height as the surface of the roller 32 (contact surface with the polymer film 14).

The peeling device 22 performs the same operation as the peeling device 20 described above. However, in the peeling apparatus 22, since the support unit 33 is provided, the polymer film 14 after peeling can be supported. Therefore, the peeled portion of the polymer film 14 can be prevented from sagging significantly.

The peeling angle between the polymer thin film and the inorganic substrate (where the functional element is formed) is preferably controlled to be 1 degree or more and 30 degrees or less. More preferably, it is 1 degree or more and 10 degrees or less. By being within the aforementioned range, it is possible to efficiently perform peeling without causing damage to the functional element. In addition, the peel angle in this specification depends on the screen thickness, the film thickness, and the radius of the drum. By selecting the appropriate screen thickness and drum radius according to the thickness of the peeled film, the peeling angle can be converged within the specified range. In the present embodiment, since the peeled polymer film and the inorganic substrate are not pressed by a roller, they are separated by several millimeters substantially parallel to each other. Therefore, the polymer thin film that has been peeled off does not come into contact with the inorganic substrate that is still held by the vacuum suction.

In the above, step C (step C including step D-1, step D-2, and step D-3) of the first embodiment has been described.

[Second Embodiment] Fig. 5 is a schematic cross-sectional view of a peeling device according to a second embodiment. As shown in FIG. 5 , the peeling apparatus 40 of the second embodiment includes a vacuum pad 34 and a diaphragm 42 .

The vacuum chuck 34 can hold the laminated body 10 by suction, and can be positioned above the diaphragm 42 in a state where the laminated body 10 is suctioned.

The diaphragm 42 is an elastic film, and can press the laminated body 10 with its surface. Specifically, a pressurizing device (not shown) is provided on the lower side of the diaphragm 42 , and the surface of the diaphragm 42 (elastic film) facing the laminate 10 is pressed by the pressurizing device. As described later, since the diaphragm 42 is an elastic film, even if the functional element 18 is provided on the polymer film 14 , the laminate 10 can be pressed almost uniformly along the surfaces of the polymer film 14 and the functional element 18 . In addition, in this embodiment, although the case where the diaphragm 42 is used is demonstrated, as long as the laminated body 10 can be pressed by the surface, it is not limited to a diaphragm.

Step C of the second embodiment includes Step E-1 and Step E-2. The peeling apparatus 40 performs step E-1 and step E-2 by operating as follows.

First, the peeling device 40 uses the vacuum chuck 34 to suck the inorganic substrate 12 side of the laminate 10 so as to be positioned above the separator 42 .

Next, the peeling device 40 operates the separator 42 to press the laminate 10, and the non-bonding surface 14a side of the polymer film 14 is made to be equal to or higher than the atmospheric pressure. In addition, the peeling portion 18 is at atmospheric pressure. That is, the non-bonding surface 14a side is set to atmospheric pressure or more, while the peeling part 18 is set to atmospheric pressure (step E-1). In addition, in this state, since the separator 42 presses the polymer film 14 in the direction of the peeling portion 18, peeling does not proceed.

Next, the peeling device 40 provides a static pressure difference ( Step E-2). For example, the whole peeling apparatus 40 is arrange|positioned in the high pressure chamber in advance, and the high pressure chamber is pressurized, and the peeling part 18 can be set to the pressure higher than the pressure of the non-bonding surface 14a side. Thereby, peeling is sequentially developed from the peeling portion 18 , and the polymer thin film 14 is peeled off from the inorganic substrate 12 . In the peeling apparatus 40, since the non-bonding surface 14a side is set to the atmospheric pressure or more, the polymer film 14 after peeling can be held. In addition, the vacuum pad 34 and the diaphragm 42 correspond to the static pressure difference formation means of this invention.

In the above, step C (step C including step E-1 and step E-2) of the second embodiment has been described.

In the above-described first and second embodiments, the case where the polymer thin film 14 is peeled off from the inorganic substrate 12 is described using the laminate 10 in which the inorganic substrate 12 and the polymer thin film 14 are bonded together. However, the present invention is not limited to this example, and a functional element-attached laminate in which the functional element is provided on the polymer film of the laminate may be used, and the functional element-attached polymer film may be peeled off from the inorganic substrate. In this case, instead of the step A of preparing the layered body 10 , the step A-1 of preparing the layered body 11 with the functional element may be performed.

6 is a schematic cross-sectional view showing an example of a functional element-attached laminate. As shown in FIG. 6 , the functional element-attached laminate 11 includes a laminate 10 (a laminate in which an inorganic substrate 12 and a polymer film 14 are bonded together) and a functional element provided on the polymer film 14 of the laminate 10 . 16.

When the functional element-attached polymer thin film 14 is peeled off from the inorganic substrate 12 using the functional element-attached laminate 11 , it is preferable to use the spacer described below. That is, before the aforementioned step C, preferably step X is performed: on the surface of the polymer film 14 where the functional elements 16 are not provided, a spacer 62 having the same thickness as that of the functional elements 16 is provided.

7 is a schematic cross-sectional view showing a state in which a spacer is provided on the polymer film of the functional element-attached laminate. In FIG. 7 , on the surface of the polymer film 14 on which the functional element 16 is not provided, a spacer 62 having a thickness similar to that of the functional element 16 is provided.

In the first embodiment and the second embodiment, when the spacer 62 is used, that is, when the step X is performed before the step C, the unevenness on the polymer film 14 can be reduced by the spacer 62 . As a result, at the time of peeling, it can be suppressed that an excessive load is applied to the polymer film 14 where the functional element 16 is located.

When the functional element-attached polymer thin film 14 is peeled off from the inorganic substrate 12 using the functional element-attached laminate 11 , it is also preferable to use the embedding member described below. That is, it is preferable to perform step Y before the aforementioned step C: the member 64 for embedding is arranged on the aforementioned polymer film 14 , and the functional element 16 is embedded in the member 64 for embedding.

The inserting member 64 may be one in which a plastically deformable resin composition is applied to a rigid sheet, or one in which a plastically deformable resin composition is attached to the rigid sheet. Moreover, it may have adhesiveness, and the member for embedding itself may have a function as a protective layer of a functional element.

8 is a schematic cross-sectional view showing a state in which an embedding member is arranged on a polymer film of a functional element-attached laminate, and a functional element is embedded. In FIG. 8 , the fitting member 64 is arranged on the polymer film 14 , and the functional element 16 is fitted into the fitting member 64 . A rigid sheet 66 is arranged on the upper surface of the fitting member 64 (the surface on the opposite side to the functional element 16 ).

In the first embodiment and the second embodiment, in the case of using the fitting member 64, that is, when step Y is performed before step C, the static pressure is applied in the state where the functional element 16 is fitted by the fitting member 64. Otherwise, since the polymer thin film 14 is peeled off from the inorganic substrate 12 , it can be suppressed that an excessive load is applied to the polymer thin film 14 where the functional element 16 is located.

[third embodiment] In 3rd Embodiment, the case where the polymer film 14 with the functional element 16 is peeled from the laminated body 11 with the functional element is demonstrated.

Fig. 9 is a schematic cross-sectional view of a peeling device according to a third embodiment. As shown in FIG. 9 , the peeling apparatus 50 of the third embodiment includes a vacuum chamber 30 , a vacuum pad 34 , a dummy film 36 , and a porous flexible body 52 .

Since the vacuum chamber 30 , the vacuum pads 34 , and the dummy film 36 have already been described in the items of the first embodiment, the description here is omitted.

The porous soft body 52 is arranged in the vacuum chamber 30, and can be inserted into the functional element 16 when the functional element-attached layered body 11 is arranged on the upper side. The porous soft body 52 is not particularly limited as long as it is porous and has flexibility. As the material of the porous flexible body 52, any one of a polymer porous body, a metal porous body, and a ceramic porous body can be used. As the polymeric porous body, low-density polyethylene, high-density polyethylene, ultra-high-density polyethylene, polypropylene, polymethacrylic acid, polyvinyl chloride, fluororesin, and the like can be used. As the metallic porous body, Cu, SUS, titanium, or the like can be used. As the ceramic porous body, alumina, aluminum nitride, silicon nitride, zirconia, or the like can be used.

Step C of the third embodiment includes Step F-1 and Step F-2. The peeling apparatus 50 performs step F-1 and step F-2 by operating as follows.

First, the peeling device 50 is positioned above the vacuum chamber 30 by sucking the inorganic substrate 12 side of the functional element-attached laminate 11 with the vacuum chuck 34 . At this time, the layered body 10 is displaced so that it is located in the opening of the dummy thin film 36 .

Next, the peeling device 50 inserts the functional element 16 into the porous soft body 52 arranged in the vacuum chamber 30, and simultaneously pushes the polymer film 14 toward the peeling part 18 by the porous soft body 52 (step F). -1).

Next, the peeling device 50 uses the pump P to make the pressure in the vacuum chamber 30 lower than the atmospheric pressure. Here, the peeling portion 18 is at atmospheric pressure. Thereby, a static pressure difference is provided between the non-adhering surface 14 a of the polymer film 14 and the peeling portion 18 . That is, the static pressure difference is provided by making the non-bonding surface 14a side lower than the atmospheric pressure, while making the peeling part 18 the atmospheric pressure (step F-2). Thereby, peeling is carried out sequentially from the peeling portion 18 , and the polymer thin film 14 with the functional element 16 is peeled off from the inorganic substrate 12 .

In the peeling device 50, the polymer thin film 14 is peeled off from the inorganic substrate 12 by applying a static pressure difference in a state where the functional element 16 is embedded in the porous flexible body 52, so that the polymer film 14 can be suppressed from being exposed to the polymer at the place where the functional element 16 is located. Membrane 14 exerts an excessive load. In addition, the vacuum chamber 30 and the vacuum pad 34 correspond to the static pressure difference formation means of this invention.

The polymer film 14 with the functional element 16 peeled off by the aforementioned step C can be used as an electronic device, especially a flexible electronic device. That is, the method including the aforementioned step A-1, the aforementioned step B, and the aforementioned step C is also a manufacturing method of an electronic device.

As mentioned above, although embodiment of this invention was described, this invention is not limited to the above-mentioned example, In the range which satisfies the structure of this invention, an appropriate design change is possible.

10: Laminate 11: Laminates with functional elements 12: Inorganic substrate 14: Polymer film 14a: Non-bonding surface 16: Functional elements 18: Peel off the part 20, 22, 40, 50: Stripping device 30: Vacuum Chamber 32: Roller 33: Support components 34: Vacuum suction cup 36: Dummy Film 38: Mesh flakes 42: Diaphragm 52: Porous Soft Body 62: Spacer 64: Embedding components 66: hard flakes

FIG. 1 is a schematic cross-sectional view showing an example of a laminated body. Fig. 2 is a schematic cross-sectional view of the peeling device according to the first embodiment. Fig. 3 is a schematic cross-sectional view of the peeling device according to the first embodiment. 4 is a schematic cross-sectional view of a modification of the peeling device of the first embodiment. Fig. 5 is a schematic cross-sectional view of a peeling device according to a second embodiment. 6 is a schematic cross-sectional view showing an example of a functional element-attached laminate. 7 is a schematic cross-sectional view showing a state in which a spacer is provided on the polymer film of the functional element-attached laminate. 8 is a schematic cross-sectional view showing a state in which an embedding member is arranged on a polymer film of a functional element-attached laminate, and a functional element is embedded. Fig. 9 is a schematic cross-sectional view of a peeling device according to a third embodiment.

12: Inorganic substrate

14: Polymer film

14a: Non-bonding surface

18: Peel off the part

20: Stripping device

30: Vacuum Chamber

32: Roller

34: Vacuum suction cup

36: dummy film

38: Mesh flakes

Claims (10)

A method for peeling off a polymer film, which is characterized by comprising: Step A: Prepare a laminate formed by bonding the polymer film and the inorganic substrate, Step B: forming a peeling portion between the polymer film and the inorganic substrate at the end of the laminate, Step C: After Step B, by providing a static pressure difference between the non-bonding surface of the polymer film that is not bonded to the inorganic substrate and the peeling portion, the polymer film is peeled off from the inorganic substrate . The peeling method of a polymer film according to claim 1, wherein the step A is a step of preparing a functional element-attached laminate in which the functional element is provided on the polymer film of the laminate. The peeling method of the polymer film as claimed in claim 1 or 2, wherein the step C comprises: Step D-1: A roller is arranged on the non-bonding surface side of the polymer film, and the polymer film is pressed toward the peeling part by the roller, Step D-2: make the non-adhering surface side less than atmospheric pressure, and on the other hand make the peeling part be atmospheric pressure, thereby providing the static pressure difference, Step D-3: After the step D-1 and the step D-2, the surface of the roller is moved parallel to the non-bonding surface of the polymer film, and the peeling is performed according to the movement of the roller. The peeling method of a polymer film according to claim 3, wherein a mesh-like sheet is arranged between the polymer film and the roller. The peeling method of the polymer film as claimed in claim 1 or 2, wherein the step C comprises: Step E-1: Make the non-bonding surface side the atmospheric pressure or higher, while making the peeling part the atmospheric pressure, Step E-2: After the step E-1, the peeling portion is made to have a higher pressure than the pressure on the non-adhering surface side, thereby providing the static pressure difference. The method for peeling off a polymer film according to claim 1, wherein a functional element is formed on the polymer film of the laminate, and This step C includes: Step F-1: Disposing a porous soft body on the non-adhering surface side of the polymer film, while embedding the functional element into the porous soft body, the polymer film is transferred to the porous soft body through the porous soft body. The peeling part is pushed in the direction, Step F-2: The static pressure difference is provided by making the non-adhering surface side less than atmospheric pressure, and making the peeling part at atmospheric pressure on the other hand. The method for peeling off a polymer film according to claim 1, wherein a functional element is formed on the polymer film of the laminate, and Before the step C, a step X is included: on the surface of the polymer film on which the functional element is not provided, a spacer having a thickness equal to that of the functional element is provided. The method for peeling off a polymer film according to claim 1, wherein a functional element is formed on the polymer film of the laminate, and Before the step C, a step Y is included: disposing a member for embedding on the polymer film, and embedding the functional element in the member for embedding. A method of manufacturing an electronic device, comprising: Step A-1: Prepare a functional element-attached laminate, the functional element-attached laminate has a laminate formed by laminating a polymer film and an inorganic substrate, and the laminate provided on the polymer film. functional elements, Step B: at the end of the laminate, a peeling part is provided between the polymer film and the inorganic substrate, Step C: After the step B, by providing a static pressure difference between the non-bonding surface of the polymer film on the side that is not bonded to the inorganic substrate and the peeling portion, the polymer film is removed from the inorganic substrate. Substrate peeling. A peeling device, which is a layered product formed by laminating a polymer film and an inorganic substrate, and peeling the polymer film from the inorganic substrate, It is characterized by having static pressure difference forming means, the static pressure difference forming means is between the non-bonding surface of the polymer film on the side that is not bonded to the inorganic substrate and the height provided at the end of the laminate. A static pressure difference is provided between the molecular thin film and the exfoliated portion of the inorganic substrate.

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