KR20220145010A - Electonic device including flash module and lens assembly molding method - Google Patents

Abstract

Disclosed is an electronic device including a flash module which can improve the optical efficiency of a transmission lens. The electronic device comprises: a housing including an internal space; a display exposed through the front surface of the housing; and a flash module projecting a light to the outside of the housing through an opening formed on at least one between the front surface and the rear surface of the housing. The flash module includes: a light emitting element arranged in the internal space, and emitting a light; a transmission lens including an incident surface facing the light emitting element and an exit surface exposed through the opening, and allowing the light emitted by the light emitting element to penetrate the same toward the window along the optical axis from the incident surface toward the exit surface; and an opaque unit arranged to enclose the outer circumferential surface of the transmission lens and form a gap from the outer circumferential surface of the transmission lens around the optical axis, and made of an opaque material. Various other embodiments are possible.

Description

ELECTONIC DEVICE INCLUDING FLASH MODULE AND LENS ASSEMBLY MOLDING METHOD

Various embodiments of the present disclosure relate to an electronic device including a flash module and a method of forming a lens assembly.

The camera can be used with a flash module that illuminates the subject to enable shooting in dark environments. Recently, as a camera function is added to a mobile electronic device, a flash is applied to the electronic device along with the camera.

As interest in design of electronic devices increases, various techniques using an opaque material for blocking external exposure of internal parts or a design for securing aesthetics of internal parts exposed to the outside of the electronic device are being used. While applying a design design such as an opaque material to the flash module installed inside the electronic device, it may be required to secure sufficient light efficiency.

According to various embodiments, by absorbing the light that escapes to the outer circumferential surface through the opaque material covering the outer circumferential surface of the transparent lens, it is possible to effectively block the light scattering phenomenon.

According to various embodiments, by inducing total reflection through a reflective layer formed between the transparent lens and the opaque part for absorbing light, the optical efficiency of the lens may be improved.

The technical problems to be achieved through the various embodiments disclosed in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned are those of ordinary skill in the art to which the present invention belongs from the description below. This can be clearly understood.

According to an embodiment, an electronic device includes: a housing including an internal space; a display exposed through the front surface of the housing; and a flash module for projecting light to the outside of the housing through an opening formed on at least one of a front surface and a rear surface of the housing, wherein the flash module includes: a light emitting device disposed in the interior space and emitting light; a transmissive lens including an incident surface facing the light emitting element and an emitting surface exposed through the opening, and transmitting light emitted from the light emitting element toward the window along an optical axis from the incident surface toward the light emitting surface; and an opaque part formed of an opaque material to form a gap with an outer circumferential surface of the transmissive lens around the optical axis and to surround the outer circumferential surface of the transmissive lens.

The lens assembly of the flash module according to an embodiment includes an incident surface on which light is incident, an output surface on which light is emitted, and an outer peripheral surface formed between the incident surface and the output surface, and is perpendicular to the incident surface and the output surface. a transmissive lens that transmits light along one optical axis; and an opaque part connected to the transmissive lens to surround the periphery of the outer circumferential surface based on a cross section perpendicular to the optical axis, and formed of an opaque material, between the transmissive lens and the opaque part at the outer circumferential surface of the transmissive lens A gap for generating total reflection may be formed.

In a lens assembly molding method for molding a lens assembly including a transmissive lens and an opaque portion surrounding an outer circumferential surface of the transmissive lens according to an embodiment by double injection, in a state in which the first movable mold is coupled to a fixed mold, the first A first molding step of molding a transmission lens by inputting a first material having a light-transmitting property for molding; and after separating the first movable mold from the stationary mold, a second movable mold having a light absorption property for secondary molding after coupling a second movable mold to the stationary mold in a state where the transmission lens is fixed to the stationary mold and a second molding step of injecting a material to form an opaque part to complete the lens assembly, and in the second molding step, the opaque part is molded to be spaced apart from the outer circumferential surface of the transmissive lens by a predetermined distance, thereby forming an outer circumferential surface of the transmissive lens and A gap may be formed between the opaque portions.

According to various embodiments, by disposing an opaque part formed of an opaque material on the outer circumferential surface of the transmissive lens that transmits light, it is possible to remove light exiting in a direction other than the emitting surface.

According to various embodiments, by arranging an air layer or a reflective layer between the transmissive lens and the opaque part to induce total reflection on the outer circumferential surface of the transmissive lens, the optical efficiency of the transmissive lens may be improved.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
2 is a block diagram illustrating a camera module according to various embodiments.
3A and 3B are a front perspective view and a rear perspective view of an electronic device according to various embodiments of the present disclosure;
3C is an exploded perspective view of an electronic device illustrating a flash module according to various embodiments of the present disclosure;
4 is a cross-sectional view of the flash module taken along line AA of FIG. 3B .
5 is a cross-sectional view illustrating optical performance of a lens assembly according to an embodiment.
6 is a cross-sectional view of a lens assembly according to an exemplary embodiment.
7 is a cross-sectional view of a lens assembly according to an exemplary embodiment.
8 is a cross-sectional view of a flash module according to an exemplary embodiment.
9 is a cross-sectional view of a flash module according to an exemplary embodiment.
10 is a cross-sectional view of a flash module according to an embodiment.
11 is a flowchart illustrating a method of manufacturing a lens assembly according to an exemplary embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same components are assigned the same reference numerals regardless of the reference numerals, and the overlapping description thereof will be omitted.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as a part of another functionally related component (eg, camera module 180 or communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram 200 illustrating a camera module 180, in accordance with various embodiments. Referring to FIG. 2 , the camera module 180 includes a lens assembly 210 , a flash 220 , an image sensor 230 , an image stabilizer 240 , a memory 250 (eg, a buffer memory), or an image signal processor. (260). The lens assembly 210 may collect light emitted from a subject, which is an image to be captured. The lens assembly 210 may include one or more lenses. According to an embodiment, the camera module 180 may include a plurality of lens assemblies 210 . In this case, the camera module 180 may form, for example, a dual camera, a 360 degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 may have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may be a different lens assembly. It may have one or more lens properties that are different from the lens properties of . The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from the subject. According to an embodiment, the flash 220 may include one or more light emitting diodes (eg, a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp. The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to an embodiment, the image sensor 230 may include, for example, one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, the same It may include a plurality of image sensors having properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

In response to the movement of the camera module 180 or the electronic device 101 including the same, the image stabilizer 240 moves at least one lens or the image sensor 230 included in the lens assembly 210 in a specific direction or Operation characteristics of the image sensor 230 may be controlled (eg, read-out timing may be adjusted, etc.). This makes it possible to compensate for at least some of the negative effects of the movement on the image being taken. According to an embodiment, the image stabilizer 240, according to an embodiment, the image stabilizer 240 is a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180 . can be used to detect such a movement of the camera module 180 or the electronic device 101 . According to an embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer. The memory 250 may temporarily store at least a portion of the image acquired through the image sensor 230 for a next image processing operation. For example, when image acquisition is delayed according to the shutter or a plurality of images are acquired at high speed, the acquired original image (eg, a Bayer-patterned image or a high-resolution image) is stored in the memory 250 and , a copy image corresponding thereto (eg, a low-resolution image) may be previewed through the display module 160 . Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a portion of the original image stored in the memory 250 may be obtained and processed by, for example, the image signal processor 260 . According to an embodiment, the memory 250 may be configured as at least a part of the memory 130 or as a separate memory operated independently of the memory 130 .

The image signal processor 260 may perform one or more image processing on an image acquired through the image sensor 230 or an image stored in the memory 250 . The one or more image processes may include, for example, depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring), sharpening (sharpening), or softening (softening) Additionally or alternatively, the image signal processor 260 may include at least one of the components included in the camera module 180 (eg, an image sensor). 230), for example, exposure time control, readout timing control, etc. The image processed by the image signal processor 260 is stored back in the memory 250 for further processing. or may be provided as an external component of the camera module 180 (eg, the memory 130, the display module 160, the electronic device 102, the electronic device 104, or the server 108). According to an example, the image signal processor 260 may be configured as at least a part of the processor 120 or as a separate processor operated independently of the processor 120. The image signal processor 260 may be configured as the processor 120 and a separate processor, at least one image processed by the image signal processor 260 may be displayed through the display module 160 as it is by the processor 120 or after additional image processing.

According to an embodiment, the electronic device 101 may include a plurality of camera modules 180 each having different properties or functions. In this case, for example, at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least the other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera, and at least the other may be a rear camera .

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.

3A and 3B are a front perspective view and a rear perspective view of an electronic device according to various embodiments, and FIG. 3C is an exploded perspective view of an electronic device illustrating a flash module according to various embodiments.

3A, 3B and 3C , an electronic device 300 according to various embodiments includes a housing 310, a display 320, camera modules 341 and 342, a printed circuit board 350, and a battery ( 360 ), a flash module 330 , and a light sensor 390 .

In an embodiment, the housing 310 may form the exterior of the electronic device 300 . The housing 310 includes a front housing 311 (eg, a front cover glass) forming a front side (or a first side), and a rear housing 312 (eg a rear cover glass) forming a rear side (or a second side). , and a side housing 313 (eg, a bezel frame) surrounding the inner space 301 along a lateral edge between the front and rear surfaces.

Meanwhile, in FIG. 3A, the housing 310 is illustrated as being divided into three parts enclosing the front, rear, and side edges, respectively, but this is only an example, and for example, the side housing 313 is the front housing ( 311 ) or may be integrally formed with the rear housing 312 . Alternatively, the front housing 311 and the rear housing 312 may be coupled to each other to form an exterior of the electronic device 300 without a separate side housing 313 . Alternatively, the housing 310 may be formed of two housings 310 divided into different directions and numbers, for example, upward and downward. Unless otherwise stated, the front, rear, and side surfaces only refer to portions in which the housing 310 is positioned with respect to the electronic device 300 , respectively, and a detailed description thereof will be omitted.

The display 320 may display visual information (eg, text, image, and/or image) to the user. The display 320 may be exposed to the user through the front of the housing 310 , for example, the front housing 311 .

The camera modules 341 and 342 may be disposed on one or more of the front and rear surfaces of the electronic device 300 . For example, the camera modules 341 and 342 are one or more front camera modules 341 disposed on the front side of the electronic device 300 as shown in FIG. 3A and one or more front camera modules 341 disposed on the rear side of the electronic device 300 as shown in FIG. 3B. One or more rear camera modules 342 may be included. The camera modules 341 and 342 may include one or more camera lenses, an image sensor, and/or an image signal processor.

Printed circuit board 350 (eg, printed circuit board (PCB), printed board assembly (PBA), flexible PCB (FPCB), or rigid-flex PCB (RFPCB)) includes one or more electronic components (eg, a processor, memory, and / or interface) can be mounted. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In an embodiment, a light emitting device emitting light from the flash module 330 or a camera module may be mounted on the printed circuit board 350 .

Battery 360 may supply power to one or more components (eg, display 320 , flash module 330 , or printed circuit board 350 ). For example, at least a portion of battery 360 may include a printed circuit It may be disposed on substantially the same plane as the substrate 350. The battery 360 may be integrally disposed inside the electronic device 300 or may be detachably disposed on the electronic device 300 .

The flash module 330 may irradiate light to the outside of the electronic device 300 . The flash module 330 may project light to the outside of the housing 310 through an opening 303 formed in one or more of the front and rear surfaces of the housing 310 . In an embodiment, the flash module 330 may be disposed in the electronic device 300 to be positioned adjacent to the camera module. For example, as shown in FIG. 3B , the flash module 330 is disposed adjacent to the rear camera module 342 and emits light to the housing 310 to assist the camera module in the photographing operation of the rear camera module 342 . ) can be irradiated through the back side. However, this is only an example, and the flash module 330 may be disposed on the front side of the housing 310 to be adjacent to the front camera module 341 , and a plurality of flash modules are provided on the front and rear surfaces of the housing 310 , respectively. may be placed. Hereinafter, for convenience of description, it is assumed that the flash module 330 is disposed adjacent to the rear camera module as shown in FIG. 3C .

In an embodiment, the flash module 330 may include a light emitting device 380 and a lens assembly 370 . The light emitting device 380 may generate light. The light emitting device 380 may be mounted in the inner space 301 of the housing 310 , for example, the printed circuit board 350 . The lens assembly 370 may transmit the light emitted from the light emitting device 380 toward the window formed in the housing 310 by refracting it along the optical axis L.

The optical sensor 390 may be disposed adjacent to the flash module 330 . The optical sensor 390 may receive light from the outside of the housing 310 . Through the information about the external light received by the optical sensor 390 , whether the flash module 330 operates (on/off) or the brightness or color of the light emitted by the light emitting device 380 may be adjusted. In an embodiment, the optical sensor 390 may include various types of sensors using light. For example, the optical sensor 390 may include a camera module, a spectrometer, a gesture sensor, an ultra-violet (UV) sensor, an RGB sensor, an illuminance sensor, or an IR (infra-red) sensor.

4 is a cross-sectional view of the flash module 330 taken along line A-A of FIG. 3B , and FIG. 5 is a cross-sectional view for explaining optical performance of the lens assembly 370 according to an embodiment.

Referring to FIG. 4 , the flash module 330 may irradiate light to the outside of the housing (eg, the housing 310 of FIG. 3A ) through the opening 303 . Hereinafter, for convenience of description, it is assumed that the flash module 330 irradiates light to the outside through the opening 303 formed in the rear housing 312 . The flash module 330 may include a light emitting device 380 and a lens assembly 370 .

In an embodiment, the light emitting device 380 may generate light. In an embodiment, the light emitting device 380 may include a wiring board 481 , a wiring electrode 482 , an LED chip 483 , a wavelength conversion film 484 , and a reflective structure 485 .

In an embodiment, the wiring board 481 may be connected to the printed circuit board 350 through a wiring electrode 482 including a first wiring electrode 4821 and a second wiring electrode 4822 . An LED chip 483 may be mounted on the wiring board 481 . The LED chip 483 may emit light through an applied current. For example, the LED chip 483 may be a blue LED chip 483 that emits blue light. In an embodiment, the LED chip 483 may emit light having a dominant wavelength in a range of about 440 nm to 460 nm.

In one embodiment, the wavelength conversion film 484 may be disposed to cover the light emitting area of the LED chip 483 . The wavelength conversion film 484 may convert a portion of light emitted from the LED chip 483 into light of a first wavelength different from the emission wavelength. In an embodiment, the wavelength conversion film 484 may include, for example, a resin layer or a ceramic phosphor film in which one or more wavelength conversion materials are dispersed. For example, the wavelength conversion material may include at least one of a phosphor and a quantum dot.

In an embodiment, the reflective structure 485 may surround the remaining area except for the light emitting area of the LED chip 483 , for example, a side surface of the LED chip 483 and a side surface of the wavelength conversion film 484 . The reflective structure 485 may block light emitted from the LED chip 483 from being directly irradiated to a region other than the opening 303 , for example, a light sensor disposed adjacently.

In an embodiment, the lens assembly 370 may irradiate the light emitted from the light emitting device 380 in the direction of the opening 303 along the optical axis L. The lens assembly 370 minimizes a phenomenon in which the light emitted from the light emitting device 380 is spread out of the optical axis L, thereby preventing a flare phenomenon or a debt spreading phenomenon, while securing high light transmission efficiency. In an embodiment, the lens assembly 370 may include a transmissive lens 371 and an opaque portion 372 .

The transmission lens 371 may transmit light. In an embodiment, the transmissive lens 371 may be formed of a light transmissive material. For example, the transmissive lens 371 may include an optical resin material such as epoxy or polymethyl methacrylate (PMMA).

In an embodiment, the transmission lens 371 may include an incident surface 371A through which light is incident and an exit surface 371B through which the incident light is emitted. In a state in which the transmission lens 371 is aligned, the incident surface 371A may face the light emitting device 380 and the exit surface 371B may be disposed to face the opening 303 . At least a portion of the exit surface 371B may be exposed to the outside through the opening 303 . The transmission lens 371 includes an optical axis L from the incident surface 371A to the exit surface 371B, and refracts the light incident on the incident surface 371A along the optical axis L to the exit surface 371B. It can penetrate through the opening 303. The optical axis L may connect the centers of the incident surface 371A and the exit surface 371B.

In an embodiment, the transmissive lens 371 may be disposed such that the optical axis L is positioned at the center of the light emission area of the light emitting device 380 . In other words, in the state in which the transmissive lens 371 is aligned, the optical axis L of the transmissive lens 371 may pass through the center of the light emission region of the light emitting device 380 .

In an embodiment, a Fresnel pattern 3710 for concentrating incident light toward the optical axis L may be formed on the transmission lens 371 . The Fresnel pattern 3710 may be formed on the incident surface 371A of the transmission lens 371 . The Fresnel pattern may be formed in various patterns capable of realizing a function of condensing light along the optical axis L. For example, the Fresnel pattern 3710 may be formed in a shape including a plurality of concentric circles centered on the optical axis L while the incident surface 371A is viewed. However, the pattern shape of the above-described Fresnel pattern 3710 is exemplary, and the Fresnel pattern 3710 may be formed in various shapes according to the shape of the transmission lens 371 or required optical performance. It is not limited. In one embodiment, based on the cross section of the transmissive lens 371 as shown in FIG. 4 , the Fresnel pattern 3710 may be formed so that the corner direction is inclined toward the optical axis L, and the Fresnel pattern 3710 is The light incident on the incident surface 371A through the light may be refracted so as to be collected toward the optical axis L.

In an embodiment, at least a portion of the transmission lens 371 may be inserted into the opening 303 , and the incident light may be directly emitted to the outside of the opening 303 . For example, the transmission lens 371 may include an insertion portion 3711 having an exit surface 371B formed at an end thereof, and at least a portion of which is inserted into the opening 303 . In this case, the transmissive lens 371 may be connected to the housing 310 in a structure in which the insertion part 3711 is fitted into the opening 303 . In an embodiment, the shape of the insertion part 3711 may be formed in a shape corresponding to the opening 303 based on a state in which the exit surface 371B is viewed. According to this structure, by reducing the gap between the opening 303 and the transmissive lens 371 , it is possible to minimize leaking through the gap between the transmissive lens 371 and the opening 303 .

In an embodiment, the transmissive lens 371 may include a flange 3712 extending in a circumferential direction (eg, in a plane direction substantially perpendicular to the optical axis L) about the optical axis L. In one embodiment, the flange 3712 may be formed to extend in the circumferential direction of the insertion portion 3711 based on the state viewed from the exit surface 371B. In an embodiment, the transmissive lens 371 may have a larger area than the opening 303 so as to cover the inside of the opening 303 through the flange 3712 . For example, when the opening 303 is formed in a circular shape as shown in FIG. 3C , the flange 3712 may be formed in a circular shape having a larger diameter than the opening 303 . According to this structure, in the state that the insertion part 3711 of the transmission lens 371 is inserted into the opening 303, the gap between the opening 303 and the insertion part 3711 is the housing (3712) through the flange (3712). Since it is covered from the inside of the 310 , the inflow of foreign substances into the internal space (eg, the internal space 301 of FIG. 3A ) through the opening 303 may be blocked.

In one embodiment, with the insertion portion 3711 inserted into the opening 303 , the transmissive lens 371 may be fixed to the housing 310 through the flange 3712 . For example, the flange 3712 may be fixed to the portion of the housing 310 in which the opening 303 is formed through the connecting member 374 .

In an embodiment, the opaque part 372 may absorb light emitted to the periphery of the transmissive lens 371 outside the optical axis L. In one embodiment, the opaque portion 372 is so as to surround the outer peripheral surface 371C of the transmission lens 371 around the optical axis L, that is, the outer surface area between the incident surface 371A and the output surface 371B. It may be connected to the transmissive lens 371 . For example, the opaque part 372 may be connected to the transmissive lens 371 so as to surround the outer peripheral surface 371C of the insertion part 3711 as shown in FIG. 4 . In an embodiment, the opaque portion 372 may be formed of an opaque material, for example, a material including a resin, thereby absorbing light emitted through the outer circumferential surface 371C of the transmission lens 371 . According to this structure, the opaque part 372 is light that is deviating from the optical axis L toward the exit surface 371B of the transmission lens 371, that is, the light emitted through the outer peripheral surface 371C of the transmission lens 371. By absorbing the light, it is possible to block the light from spreading to the peripheral region of the transmissive lens 371 .

In an embodiment, the opaque portion 372 may not substantially step with the exit surface 371B of the transmission lens 371 with respect to a cross section including the optical axis L. In other words, the end of the opaque portion 372 facing the opening 303 may be positioned on substantially the same plane as the exit surface 371B of the transmission lens 371 . According to such a structure, the opaque portion 372 covers the circumference of the outer peripheral surface 371C adjacent to the emission surface 371B of the transmission lens 371 and does not protrude from the emission surface 371B, thereby risking damage due to external impact. can lower In addition, since the transmissive lens 371 and the opaque part 372 are positioned at the same height when observed from the outside, a visual aesthetic sense felt by the user can be secured. In an embodiment, the opaque part 372 may be integrally connected to the outer peripheral surface 371C of the transmission lens 371 . For example, the opaque part 372 and the transmissive lens 371 may be integrally formed through double-shot injection molding. However, this is only an example, and the transmissive lens 371 and the opaque part 372 may be separately manufactured and then connected through an assembly method.

In an embodiment, the opaque part 372 may be connected to form a gap 373 between the transmissive lens 371 and the outer peripheral surface 371C. In other words, an empty space formed along the outer peripheral surface 371C of the transmissive lens 371 may be formed between the opaque portion 372 and the transmissive lens 371 . In an embodiment, an air layer may be formed in the gap 373 formed between the opaque portion 372 and the transmissive lens 371 . The air layer may have a refractive index of about 1.0 based on a wavelength of about 589 nm. In one embodiment, since the air layer has a lower refractive index than the transmission lens 371, light passing through the outer circumferential surface 371C of the transmission lens 371 to the air layer is totally reflected inside the transmission lens 371 according to the angle of incidence ( total reflection).

In an embodiment, based on the cross section of FIG. 4 , the gap 373 may be formed to have a constant width along the optical axis L. In one embodiment, the gap 373 may be formed to have a width sufficient to sufficiently generate total reflection through the air layer. For example, the gap 373 may be formed to have a width three times or more than a wavelength of light (eg, visible light of about 589 nm). In addition, the gap may be formed to have a width of at least a tool tolerance (eg, about 100 μm, 0.1T) generated during the manufacturing process.

5, the optical performance of the lens assembly 370 according to an embodiment will be described.

In one embodiment, a portion (a1, a2) of the light incident through the incident surface 371A of the transmissive lens 371 is directed toward the outer circumferential surface 371C of the transmissive lens 371, and a part (a3) of the remaining light is the transmissive lens. It can face the exit surface 371B of (371). The light a3 directed to the exit surface 371B of the transmission lens 371 may be emitted to an opening (eg, the opening 303 of FIG. 4 ) through the exit surface 371B.

On the other hand, light directed to the outer circumferential surface 371C of the transmission lens 371 passes through the outer circumferential surface 371C of the transmission lens 371 or the outer circumferential surface of the transmission lens 371 according to an incident angle formed with a normal line perpendicular to the outer circumferential surface 371C. (371C) can be reflected. When the refractive index of the transmissive lens 371 is n, the critical angle θ _c at which total reflection occurs on the outer peripheral surface 371C of the transmissive lens 371 may be determined according to Equation 1 below.

Equation 1

, n(굴절률) =

Critical angle (θ _c ) = arcsin

, n (index of refraction) =

c (phase velocity of light) = (3 x 10 ⁸ m/s)

Vph = phase velocity within the material

Hereinafter, a1 of FIG. 5 exemplifies a case in which the incident angle α1 with respect to the outer peripheral surface 371C of the transmissive lens 371 is greater than the critical angle θ _c , and a2 of FIG. 371C) is exemplified when the incident angle α2 is smaller than the critical angle θ _c . In this case, a1 is totally reflected from the outer circumferential surface 371C of the transmissive lens 371 and directed to the inside of the transmissive lens 371, and a2 passes through the outer circumferential surface 371C of the transmissive lens 371 and is absorbed by the opaque portion 372 can be As a result, the light incident on the transmissive lens 371 is emitted through the emitting surface 371B (eg, a3), passes through the outer peripheral surface 371C of the transmissive lens 371, and is absorbed by the opaque portion 372 ( For example: a2), or total reflection (eg, a1) on the outer peripheral surface 371C of the transmissive lens 371 may be directed to the inside of the transmissive lens 371 . In this case, a portion of the light (eg, a1 ) totally reflected into the transmission lens 371 may be emitted through the emitting surface 371B.

According to this structure, the lens assembly 370 absorbs the light emitted to the outer circumferential surface 371C of the transmissive lens 371 through the opaque portion 372 to prevent smearing or flare, while the opaque portion 372) And by emitting a part of the light directed to the outer peripheral surface 371C of the transmission lens 371 through the gap 373 formed between the transmission lens 371 to the opening 303 through the exit surface 371B to reduce the light loss can

6 is a cross-sectional view of a lens assembly 670 according to an exemplary embodiment.

Referring to FIG. 6 , the lens assembly 670 according to an embodiment may include a transmissive lens 671 and an opaque part 672 .

In an embodiment, the transmissive lens 671 may be formed of a transmissive material, and may include an incident surface 671A through which light is incident along the optical axis L, and an exit surface 671B through which light is emitted. In one embodiment, the transmission lens 671 may include an insertion portion 6711 on which the exit surface 671B is formed and a flange 6712 extending in the circumferential direction of the insertion portion 6711 with respect to the optical axis L. can

In an embodiment, the opaque part 672 may be connected to the transmissive lens 671 to surround the outer peripheral surface 671C of the transmissive lens around the optical axis L. The opaque portion 672 may be formed of an opaque material to absorb light emitted through the outer peripheral surface 671C of the transmission lens 671 . In one embodiment, the opaque portion 672 is spaced apart from the outer circumferential surface 671C of the transmissive lens 671 with respect to the cross-section including the optical axis L and extends in a direction substantially parallel to the optical axis L. A portion 6721, a second portion 6722 extending from the first portion 6721 toward the optical axis L so that the end is in contact with the outer peripheral surface 671C of the transmission lens 671, and the first portion 6721 and a third portion 6723 connected to and covering at least a portion of the flange 6712 .

In an embodiment, a gap 673 for forming an air layer may be formed between the opaque portion 672 and the transmissive lens 671 . For example, a gap 673 may be formed between the first portion 6721 of the opaque portion 672 and the outer peripheral surface 671C of the transmissive lens 671 . The air layer formed in the gap 673 may totally reflect a portion of the light traveling to the air layer through the outer circumferential surface 671C of the transmission lens 671 .

In an embodiment, the second portion 6722 may cover the gap 673 so that it is not exposed to the outside. For example, when the lens assembly 670 is exposed to the outside through an opening of the electronic device (eg, the opening 303 in FIG. 3C ), the opaque portion 672 may pass through the second portion 6722 through the gap 673 . ) to prevent the gap 673 from being exposed through the opening.

According to this structure, since the gap 673 is covered through the second part 6722 of the opaque part 672, moisture or moisture into the space between the transmissive lens 671 and the opaque part 672 through the opening, It can prevent foreign substances from entering.

In an embodiment, the opaque portion 672 may effectively block light passing through the outer peripheral surface 671C of the transmissive lens 671 . For example, when light passing through the transmission lens 671 is irradiated to the outer peripheral surface 671C of the transmission lens 671 toward the air layer, light having an incident angle β ₃ or greater than the critical angle (eg, light b3) is transmitted Lights (eg, lights b1 and b2 ) that are totally reflected on the outer peripheral surface 671C of the lens 671 and have the near-rectangle angles β _{1 and} β ₂ less than or equal to the critical angle are opaque through the outer peripheral surface 671C of the transmission lens 671 . may be directed to section 672 . For example, the opaque portion 672 transmits light (eg, b1) toward the space between the first portion 6721 and the transmissive lens 671 as well as light (eg, b2) directed to the first portion 6721 . By absorbing through the second portion 6722 , light passing through the outer peripheral surface 671C of the transmission lens 671 can be effectively absorbed.

7 is a cross-sectional view of a lens assembly 770 according to an exemplary embodiment.

Referring to FIG. 7 , the lens assembly 770 according to an embodiment may include a transmissive lens 771 , an opaque portion 772 , and a reflective layer 775 .

In an embodiment, the transmissive lens 771 may be formed of a transmissive material, and may include an incident surface 771A through which light is incident along the optical axis L, and an exit surface 771B through which light is emitted.

In an embodiment, the opaque part 772 may be connected to the transmissive lens 771 so as to surround the outer peripheral surface 771C of the transmissive lens 771 about the optical axis L. The opaque portion 772 may be formed of an opaque material to absorb light emitted through the outer peripheral surface 771C of the transmission lens 771 . In this case, the opaque part 772 may be spaced apart from the outer peripheral surface 771C of the transmissive lens 771 by a predetermined distance to form a gap between the opaque part 772 and the transmissive lens 771 .

In an embodiment, the reflective layer 775 may be attached to the outer peripheral surface 771C of the transmissive lens 771 so as to be positioned in a gap formed between the transmissive lens 771 and the opaque portion 772 . The reflective layer 775 may occupy the entire gap as shown in FIG. 7 , but alternatively, it may be attached to the outer circumferential surface 771C of the transmissive lens 771 to form a predetermined gap between the reflective layer 772 and the opaque portion 772 . have. In an embodiment, the reflective layer 775 may be formed of a transmissive material having a lower refractive index than that of the transmissive lens 771 . For example, the reflective layer 775 may have a refractive index of about 1.0 or more and 1.5 or less.

According to this structure, the reflective layer 775 totally reflects a part of the light directed to the outer peripheral surface 771C of the transmissive lens 771 and returns it to the inside of the transmissive lens 771, thereby improving the optical performance of the lens assembly 770. can do it In addition, by filling the gap between the transmissive lens 771 and the opaque portion 772 , it is possible to prevent the shape of the lens assembly 770 from being deformed due to the gap.

In one embodiment, when the transmission lens 771 has a refractive index of n _a and the reflective layer 775 has a refractive index of n _b , the critical angle θ _c at which total reflection occurs at the outer peripheral surface 771C of the transmission lens 771 . ) may be determined according to Equation 2 below.

Equation 2

Critical angle (θ _c ) = arcsin

n _a = refractive index of the transmissive lens

n _b = refractive index of the reflective layer

In FIG. 7 , of the light directed to the outer peripheral surface 771C of the transmissive lens 771 to which the reflective layer 775 is attached, the light having an incident angle θ ₁ less than or equal to the critical angle θ _c (eg, light c1) is the transmissive lens Light passing through 771 and the reflective layer 775 and absorbed by the opaque portion 772 and having an incident angle θ ₂ greater than or equal to the critical angle θ _c (eg, light c2) is transmitted through the outer circumferential surface 771C of the transmission lens 771 ) and may return to the transmissive lens 771 . Accordingly, the lens assembly 770 may improve light efficiency while removing a smearing phenomenon or a flare phenomenon.

8 is a cross-sectional view of a flash module according to an exemplary embodiment.

Referring to FIG. 8 , the flash module 830 according to an embodiment may be exposed to the outside through the opening 803 of the housing 812 (eg, the rear housing 312 of FIG. 3B ). The flash module 830 may include a light emitting device 880 that emits light and a lens assembly 870 .

In an embodiment, the lens assembly 870 may project the light emitted by the light emitting device 880 in the direction of the opening 803 . The lens assembly 870 may include a transmissive lens 871 and an opaque portion 872 .

The transmission lens 871 includes an incident surface 871A facing the light emitting element 880 and through which light is incident, and an exit surface 871B exposed through the opening 803 and through which light is emitted, and the incident surface 871A. Light may be transmitted along the optical axis L toward the exit surface 871B. In one embodiment, the transmissive lens 871 is inserted into the opening 803 and extends in the circumferential direction about the optical axis L, the insertion portion 8711 having the exit surface 871B formed at the end of the housing 812 A flange 8712 for being fixed to, and a lower protrusion 8713 protruding toward the light emitting element 880 and having an incident surface 871A formed at an end thereof, and a downward direction from the flange 8712 (eg, the lower side of FIG. 8 ) direction) extending support portion 8714 .

The opaque portion 872 may surround the outer circumferential surface 871C of the transmissive lens 871 while forming a gap 873 with the outer circumferential surface 871C of the transmissive lens 871 about the optical axis L. For example, the opaque portion 872 may surround the outer peripheral surface 871C of the insertion portion 8711 of the transmission lens 871 . According to this structure, since the opaque portion 872 fills the gap between the opening 803 and the transmission lens 871 in a state where the insertion portion 8711 is inserted into the opening 803, the emission surface 871B ) and the opaque portion 872 may block light from leaking through the gap between the opening 803 .

9 is a cross-sectional view of a flash module according to an exemplary embodiment.

Referring to FIG. 9 , the flash module 930 according to an embodiment may be exposed to the outside through the opening 903 of the housing 912 (eg, the rear housing 912 of FIG. 3C ). The flash module 930 may include a light emitting device 980 that emits light and a lens assembly 970 .

In one embodiment, the lens assembly 970 may include a transmissive lens 971 and an opaque portion 972 . The transmission lens 971 may include an incident surface 971A facing the light emitting device 980 and an exit surface 971B facing the opening. The transmissive lens 971 may transmit the light incident on the incident surface along the optical axis L and output it through the exit surface 971B. In one embodiment, the transmissive lens 971 is inserted into the opening 903, an insertion portion 9711 having an exit surface 971B formed at an end thereof, extending in the circumferential direction about the optical axis L and the housing 912 ) may include a flange 9712 for being fixed to, and a lower protruding portion 9713 protruding in the direction of the light emitting device 980 and having an incident surface formed at an end thereof. In an embodiment, the lower protrusion 9713 may include a Fresnel pattern 9710 formed on the incident surface 971A. In this case, the Fresnel pattern 9710 may focus the light passing through the central region of the transmission lens 971 in the optical axis (L) direction.

In an embodiment, the opaque portion 972 may at least partially surround the outer peripheral surface of the transmissive lens 971 about the optical axis L. In one embodiment, the opaque portion 972 is a first opaque portion 972A disposed to surround the outer circumferential surface 971C of the insertion portion 9711, and the outer circumferential surface 971D of the lower protruding portion 9713 It may include a second opaque part 972B and a third opaque part 972C that connects the first opaque part 972A and the second opaque part 972B and is disposed along an outer circumferential surface of the flange 9712 . The first opaque part 972A and the second opaque part 972B may surround the outer peripheral surfaces 971C and 971D of the transmissive lens 971 with the flange 9712 interposed therebetween. For example, the first opaque portion 972A absorbs light passing through the outer circumferential surface 971C of the insertion portion 9711 , and the second opaque portion 972B absorbs the outer circumferential surface 971D of the lower protruding portion 9713 . It can absorb the light passing through it. Accordingly, the opaque portions 972A and 972B cover the entire area of the outer peripheral surfaces 971C and 971D of the transmissive lens 971 through which light is emitted, thereby effectively blocking the light spreading phenomenon.

In one embodiment, each of the first opaque portion 972A and the second opaque portion 972B is between the insertion portion 9711 of the transmissive lens 971 and the outer peripheral surfaces 971C and 971D of the lower protruding portion 9713 . It is possible to form gaps 973C and 973D for the air layer to be formed. According to this structure, a portion of the light passing through the outer peripheral surfaces 971C and 971D of the transmissive lens 971 is totally reflected on the entire path along which light travels through the transmissive lens 971 and returned to the inside of the transmissive lens 971. Therefore, the optical performance can be secured more effectively.

10 is a cross-sectional view of a flash module according to an embodiment.

Referring to FIG. 10 , a flash module 1030 according to an embodiment may include a light emitting device 1080 emitting light and a lens assembly 1070 .

The lens assembly 1070 may include a transmissive lens 1071 and an opaque portion 1072 . The transmission lens 1071 may include an incident surface 1071A facing the light emitting element 1080 and an exit surface 1071B facing the opening. The transmissive lens 1071 may transmit the light incident on the incident surface 1071A along the optical axis L and output it through the exit surface 1071B. In one embodiment, the transmissive lens 1071 is seated in the opening and protrudes toward the light emitting device from the flange portion 10711 and the flange portion 10711 having the exit surface formed at the end and the incident surface 1071A is formed at the end. It may include a lower protrusion 10712 . In an embodiment, based on a cross-section including the optical axis L, the lower protrusion 10712 may be formed to have a smaller cross-sectional area than the flange portion 10711 . According to this structure, the transmissive lens 1071 may be connected to the housing in such a way that it is fitted into the opening from the outside of the housing.

In one embodiment, the opaque portion 1072 may surround the outer peripheral surface of the transmission lens 1071 about the optical axis (L). The opaque portion 1072 may include a first opaque portion 1072A surrounding the outer circumferential surface 1071C of the flange portion 10711 and a second opaque portion 1072B surrounding the outer circumferential surface 1071C of the lower protrusion 10712. have. Each of the first opaque portion 1072A and the second opaque portion 1072B may absorb light passing through the outer peripheral surface 1071C of the flange portion 10711 and the lower protrusion 10712 .

In an embodiment, the opaque portion 1072 may be disposed to form gaps 1073A and 1073B for forming an air layer between the flange portion 10711 and the outer peripheral surface 1071C of the lower protrusion 10712 . Accordingly, total reflection may occur in the entire outer peripheral surface of the transmissive lens 1071 through which light is projected.

Hereinafter, a method of forming a lens assembly according to an embodiment will be described. In describing the method of manufacturing the lens assembly, the same terms as those described above may be understood to mean the same configuration unless otherwise specified.

11 is a flowchart illustrating a method of forming a lens assembly according to an exemplary embodiment.

Referring to FIG. 11 , in the lens assembly molding method according to an embodiment, a lens assembly including a transmissive lens and an opaque portion surrounding an outer circumferential surface of the transmissive lens may be molded by double injection. The lens assembly molding method according to an embodiment may include a first molding step (11A) of molding a transmissive lens, and a second molding step (11B) of completing the lens assembly. Meanwhile, in this document, the name of "~ step" does not limit the order of the process, and the name of "~ step" may be understood as "~ process" or "~ operation".

In the first molding step 11A, in a state in which the first movable mold is coupled to the fixed mold, the transmission lens may be molded by injecting a first material having a light-transmitting property for primary molding. The first material may be, for example, a material comprising an epoxy or PMMA material. In the first molding step 11A, the first movable mold may be used to secure a space for molding the opaque part in the fixed mold.

The second molding step 11B may be performed after the transmission lens is molded. In the second molding step, after separating the first movable mold from the stationary mold, the second movable mold is coupled to the stationary mold in a state where the transmission lens is fixed to the stationary mold, and then a second material having light absorption properties for secondary molding can be added to form an opaque part. The second material may be, for example, a material including resin. In the second molding step, the opaque part may be integrally connected to the outer surface of the transmissive lens through injection.

In the second molding step (11B), the opaque part may be formed to form a gap spaced apart from the outer peripheral surface of the transmissive lens by a predetermined distance and to be connected to the transmissive lens. Accordingly, a gap for locating the air layer may be formed between the opaque portion and the outer peripheral surface of the transmissive lens.

The electronic device 300 according to various embodiments may include a housing 310 including an internal space 301 ; a display 320 exposed through the front surface of the housing 310; and a flash module 330 for projecting light to the outside of the housing 310 through an opening 303 formed in at least one of the front and rear surfaces of the housing 310, wherein the flash module 330 comprises: a light emitting device 380 disposed in the inner space and emitting light; The optical axis ( a transmissive lens 371 for transmitting the light emitted from the light emitting device 380 along L) toward the window; and forming a gap 373 with the outer circumferential surface 371C of the transmissive lens 371 around the optical axis L, and is disposed to surround the outer circumferential surface 371C of the transmissive lens 371, opaque It may include an opaque portion 372 formed of a material.

In various embodiments, an air layer is formed in the gap 373 , and a portion of the light projected to the outer circumferential surface 371C of the transmission lens 371 toward the air layer is inside the transmission lens 371 . can be total reflection.

In various embodiments, the light emitted to the outer peripheral surface 371C of the transmission lens 371 toward the air layer may be absorbed by the opaque part 372 .

In various embodiments, the flash module 330 is attached to the outer circumferential surface 771C of the transmissive lens 771 to be positioned in the gap 773 , and has a refractive index lower than that of the transmissive lens 771 . The branch may include a reflective layer 775 formed of a material.

In various embodiments, the reflective layer 775 may have a refractive index of 1.0 or more and 1.5 or less.

In various embodiments, the transmissive lens 371 is inserted into the opening, and includes an insertion portion 3711 having the exit surface 671B formed at an end thereof, and the opaque portion 372 is the insertion portion 3711 . ) can surround the outer periphery of

In various embodiments, the transmission lens 371 further includes a flange 3712 extending in a circumferential direction about the optical axis L, and the housing 312 (eg, a rear surface) through the flange 3712 . housing) can be fixed.

In various embodiments, a diameter of the flange 3712 may be greater than a diameter of the opening 303 based on a state viewed in a direction parallel to the optical axis L.

In various embodiments, based on a cross-section including the optical axis L, the opaque portion 672 is spaced apart from the outer peripheral surface 671C of the transmission lens 671 such that the gap 673 is formed and is on the optical axis a first portion 6721 extending in a parallel direction; and a second portion 6722 extending from the first portion 6721 toward the optical axis so that an end thereof is in contact with the outer circumferential surface of the transmissive lens and covering the gap 673 so as not to be exposed through the opening. can

In various embodiments, a Fresnel pattern 3710 for condensing light along the optical axis may be formed on the incident surface 371A of the transmissive lens 371 .

In various embodiments, the Fresnel pattern 3710 may be formed in the form of a plurality of concentric circles centered on the optical axis.

In various embodiments, the transmissive lens 371 may include an epoxy, PMMA, or optical resin material, and the opaque part may include a resin material.

In various embodiments, the transmissive lens 371 and the opaque part 372 may be integrally formed through double-shot injection molding.

In various embodiments, the electronic device 300 is mounted on at least one of the front and rear surfaces of the housing and further includes camera modules 341 and 342 exposed to the outside of the housing 310, and the camera module ( 341 and 342 may be exposed to the outside through the housing portion adjacent to the opening 303 .

The lens assembly 370 of the flash module according to various embodiments is formed between an incident surface 371A on which light is incident, an output surface 371B on which light is emitted, and between the incident surface 371A and the output surface 371B. a transmissive lens 371 including an outer peripheral surface 371C and transmitting light along an optical axis L perpendicular to the incident surface 371A and the output surface 371B; and an opaque part 372 connected to the transmissive lens 371 to surround the periphery of the outer circumferential surface 371C with respect to a cross section perpendicular to the optical axis L, and formed of an opaque material, wherein the transmissive A gap 373 (gap) for generating total reflection on the outer peripheral surface 371C of the transmissive lens 371 may be formed between the lens 371 and the opaque part 372 .

In various embodiments, an air layer may be formed in the gap 373 .

In various embodiments, the lens assembly 370 is applied to the outer circumferential surface of the transmissive lens 771 to be positioned in the gap 773, and a reflective layer formed of a material having a lower refractive index than the transmissive lens (reflection ratio) ( 775) may be further included.

In various embodiments, the opaque part 672 may include a first portion 6721 extending along the optical axis direction L while being spaced apart from the outer circumferential surface of the transmission lens 671; and a second portion 6722 extending from the first portion toward the optical axis direction so that the end portion is in contact with the outer peripheral surface of the transmission lens, and based on a state viewed from the exit surface 671C direction, the second Portion 6721 may cover the gap 673 .

In various embodiments, based on a cross section including the optical axis L, the opaque part 372 may be connected to the emitting surface 371B of the transmission lens 371 so as not to be substantially stepped.

In the lens assembly molding method for molding a lens assembly including a transmissive lens and an opaque part surrounding an outer circumferential surface of the transmissive lens according to various embodiments by double injection, in a state in which a first movable mold is coupled to a fixed mold, the first A first molding step of molding a transmission lens by inputting a first material having a light-transmitting property for molding; and after separating the first movable mold from the stationary mold, a second movable mold having a light absorption property for secondary molding after coupling a second movable mold to the stationary mold in a state where the transmission lens is fixed to the stationary mold and a second molding step of injecting a material to form an opaque part to complete the lens assembly, and in the second molding step, the opaque part is molded to be spaced apart from the outer circumferential surface of the transmissive lens by a predetermined distance, thereby forming an outer circumferential surface of the transmissive lens and A gap may be formed between the opaque portions.

Claims (20)

In an electronic device,
a housing including an interior space;
a display exposed through the front surface of the housing; and
A flash module for projecting light to the outside of the housing through an opening formed in at least one of the front and rear surfaces of the housing,
The flash module is
a light emitting device disposed in the inner space and emitting light;
a transmissive lens including an incident surface facing the light emitting element and an emitting surface exposed through the opening, and transmitting light emitted from the light emitting element along an optical axis from the incident surface toward the light emitting surface toward the opening; and
and an opaque part formed of an opaque material to form a gap with an outer circumferential surface of the transmissive lens with respect to the optical axis and to surround the outer circumferential surface of the transmissive lens. According to claim 1,
An air layer is formed in the gap,
A portion of the light projected to the outer circumferential surface of the transmissive lens toward the air layer is totally reflected inwardly of the transmissive lens. 3. The method of claim 2,
The light emitted to the outer circumferential surface of the transmissive lens toward the air layer is absorbed by the opaque portion. According to claim 1,
The flash module is
and a reflective layer attached to an outer circumferential surface of the transmissive lens to be positioned in the gap and formed of a material having a lower refractive index than that of the transmissive lens. 5. The method of claim 4,
The reflective layer has a refractive index of 1.0 or more and 1.5 or less, the electronic device. According to claim 1,
The transmissive lens is inserted into the opening, and includes an insertion portion at which the exit surface is formed at the end,
and the opaque portion surrounds an outer circumferential surface of the insertion portion. 7. The method of claim 6,
The transmissive lens further comprises a flange extending in a circumferential direction about the optical axis,
and secured to the housing via the flange. 8. The method of claim 7,
Based on the state viewed in the direction parallel to the optical axis,
and a diameter of the flange is greater than a diameter of the opening. According to claim 1,
Based on the cross section including the optical axis,
The opaque part,
a first portion spaced apart from the outer circumferential surface of the transmissive lens to form the gap and extending in a direction parallel to the optical axis; and
and a second portion extending from the first portion toward the optical axis so that an end thereof is in contact with an outer circumferential surface of the transmissive lens and covering the gap so as not to be exposed through the opening. According to claim 1,
A Fresnel pattern for condensing light along the optical axis is formed on an incident surface of the transmissive lens. 11. The method of claim 10,
The Fresnel pattern is formed in the form of a plurality of concentric circles centered on the optical axis. According to claim 1,
The transmissive lens includes an epoxy, PMMA or optical resin material,
The opaque portion includes a resin material, the electronic device. According to claim 1,
and the transmissive lens and the opaque portion are integrally formed through double-shot injection moulding. According to claim 1,
It is mounted on one or more of the front or rear of the housing, further comprising a camera module exposed to the outside of the housing,
The camera module is exposed to the outside through the housing portion adjacent to the opening. In the lens assembly of the flash module,
a transmissive lens including an incident surface to which light is incident, an output surface from which light is emitted, and an outer peripheral surface formed between the incident surface and the outgoing surface, and transmits light along an optical axis perpendicular to the incident surface and the output surface; and
Based on the cross-section perpendicular to the optical axis, connected to the transmission lens so as to surround the periphery of the outer circumferential surface, comprising an opaque portion formed of an opaque material,
A gap (gap) for generating a total reflection (total reflection) on an outer circumferential surface of the transmissive lens is formed between the transmissive lens and the opaque part, the lens assembly. 16. The method of claim 15,
An air layer is formed in the gap. 16. The method of claim 15,
The lens assembly further comprising a reflective layer applied to the outer circumferential surface of the transmissive lens to be positioned in the gap, and formed of a material having a lower refractive index than that of the transmissive lens. 16. The method of claim 15,
The opaque part,
a first portion extending along the optical axis direction while being spaced apart from the outer circumferential surface of the transmissive lens; and
and a second part extending from the first part toward the optical axis direction so that the end is in contact with the outer peripheral surface of the transmissive lens,
Based on a state in which the exit surface is viewed, the second portion covers the gap. 16. The method of claim 15,
Based on the cross section including the optical axis,
The opaque part is connected to the exit surface of the transmission lens so as not to be substantially stepped. In the lens assembly molding method of molding a lens assembly including a transmissive lens and an opaque part surrounding the outer circumferential surface of the transmissive lens by double injection,
A first molding step of molding a transmissive lens by injecting a first material having a light-transmitting property for primary molding in a state in which the first movable mold is coupled to the fixed mold; and
After separating the first movable mold from the stationary mold, a second material having a light absorption property for secondary molding after coupling the second movable mold to the stationary mold in a state where the transmission lens is fixed to the stationary mold Including a second molding step of molding the opaque part by inputting to complete the lens assembly,
In the second molding step, the opaque part is molded to be spaced apart from the outer peripheral surface of the transmissive lens by a predetermined distance, thereby forming a gap between the outer peripheral surface of the transmissive lens and the opaque part.

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