KR20220120421A - Camera module and electronic device including the same - Google Patents

Abstract

An electronic device according to an embodiment of the present invention comprises: a housing; and a camera module in which a portion is disposed inside the housing. The camera module comprises: a camera housing; a sensor assembly including an image sensor and fixed to the camera housing; and a lens unit at least partially accommodated in a space formed by the camera housing and the sensor assembly, wherein all or part of the lens unit is configured to move relative to the camera housing and the sensor assembly. The lens unit comprises: a lens assembly comprising a lens; a first carrier to which the lens assembly is coupled; a second carrier in which the first carrier is movably accommodated in a direction perpendicular to the optical axis of the lens; a stopper coupled to the second carrier to cover at least a portion of the first carrier; and a first damping member at least partially disposed between the stopper and the first carrier. In addition to this, various embodiments identified through the specification are possible. Accordingly, it is possible to secure a driving force for improving an OIS correction angle.

Description

Camera module and electronic device including same

Various embodiments disclosed in this document relate to a camera module and an electronic device including the same.

A mobile electronic device such as a smart phone may include a camera module. A camera module may include lenses, a lens barrel surrounding the lenses, and an image sensor. The camera module may receive light reflected from an external subject. The light reflected from the subject may proceed to the inside of the lens barrel, and may pass through the lenses to proceed to the image sensor. The image sensor may convert the received optical signal into an associated electrical signal.

The camera module may support various functions. For example, the camera module provides functions related to image stabilization (eg optical image stabilization (OIS), digital image stabilization (DIS), electrical image stabilization (EIS)) and auto focus (eg auto focus (AF)). can support The camera module may be configured to provide an image stabilization function and an autofocus function by moving the lens relative to the image sensor. For example, the camera module may be configured to move a lens in a direction perpendicular to an optical axis with respect to the image sensor. The camera module may be configured to move the lens in the optical axis direction with respect to the image sensor.

For example, in the lens shift type OIS structure that moves the lens, the correction angle for image stabilization is limited to a specified angle (eg, about 1.5°) or less, so there may be a limit to correction in response to large shake or hand shake. . In addition, since the camera module is not provided with a separate damping member for reducing strong impact and/or large movement, there may be a limitation in reducing high-frequency noise.

According to embodiments disclosed herein, an object of the present disclosure is to provide a camera module in which a damping member is disposed between a fixed structure in which an image sensor is disposed and a movable structure in which a lens is disposed or inside the movable structure, and an electronic device including the same.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

An electronic device according to an embodiment disclosed in this document includes a housing and a camera module at least a part of which is disposed inside the housing, wherein the camera module includes: a camera housing; a sensor assembly including an image sensor, the sensor assembly being fixedly disposed on the camera housing; and a lens unit, at least a part of which is accommodated in a space formed by the camera housing and the sensor assembly, and the lens unit is configured to move in whole or in part with respect to the camera housing and the sensor assembly, wherein the lens unit comprises: A lens assembly including a lens, a first carrier to which the lens assembly is coupled, a second carrier in which the first carrier is movably accommodated in a direction perpendicular to the optical axis of the lens, at least a portion of the first carrier It may include a stopper coupled to the second carrier to cover a first damping member, at least a portion of which is disposed between the stopper and the first carrier.

A camera module according to an embodiment disclosed in this document includes: a fixing structure including a camera housing and an image sensor fixedly disposed on the camera housing; a lens unit, at least a part of which is accommodated in the camera housing, and configured to move in whole or in part with respect to the fixed structure; and a driving member for moving all or part of the lens unit, wherein the driving member includes a plurality of coils disposed on the camera housing and a plurality of magnets disposed on the lens unit. A lens assembly including a lens, an AF carrier movably disposed in the optical axis direction of the lens in the camera housing, and the lens assembly are coupled, and the AF carrier is movable in a direction perpendicular to the optical axis an OIS carrier disposed, wherein the plurality of coils include an AF coil disposed on a first sidewall of the camera housing and a plurality of OIS coils disposed on a second sidewall, a third sidewall, and a fourth sidewall of the camera housing, respectively including, wherein the plurality of magnets include an AF magnet disposed on the AF carrier to face the AF coil, and a plurality of OIS magnets disposed on the OIS carrier to face each of the plurality of OIS coils, the Each of the plurality of OIS magnets has a first region in which a surface facing the plurality of OIS coils has a first polarity, a second region having a second polarity different from the first polarity, and the first polarity and a third region, wherein each of the plurality of OIS coils has a first coil part facing the first region and another part facing the second region, and a part facing the second region. Another part may be configured to include a second coil facing the third region.

In the electronic device according to various embodiments of the present disclosure, since the camera module includes a damping member, it is possible to reduce noise (eg, vibration or shake in a high frequency band) during AF driving and OIS driving of the camera module, and shock can be alleviated.

In addition, in the electronic device according to various embodiments disclosed in this document, the OIS driving members of the camera module are formed to be widely disposed in a direction substantially perpendicular to the optical axis, thereby correcting OIS without increasing the height of the camera module. A driving force for improving the angle can be secured.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
2 is a block diagram illustrating a camera module according to various embodiments.
3A is a front perspective view of an electronic device according to an exemplary embodiment;
3B is a rear perspective view of an electronic device according to an exemplary embodiment;
3C is an exploded perspective view of an electronic device according to an exemplary embodiment;
4 is a perspective view of a camera module according to an embodiment.
5 is an exploded perspective view of a camera module according to an embodiment.
6A is an exploded perspective view of a camera module according to an embodiment.
6B is an exploded perspective view of a camera module according to an embodiment.
7A illustrates a camera housing and a sensor assembly of a camera module according to an exemplary embodiment.
7B illustrates a camera housing and a sensor assembly of a camera module according to an exemplary embodiment.
8 is an exploded perspective view of a lens unit of a camera module according to an exemplary embodiment.
9A is an exploded perspective view of a lens unit of a camera module according to an exemplary embodiment;
9B is an exploded perspective view of a lens unit of a camera module according to an exemplary embodiment.
10 illustrates a first carrier and a guide member of the lens unit according to an embodiment.
11 illustrates an image stabilization operation of a camera module according to an exemplary embodiment.
12 illustrates a first carrier and a stopper of a lens unit according to an embodiment.
13 illustrates a damping structure of a camera module according to an embodiment.
14 illustrates a first carrier and a stopper of a lens unit according to an embodiment.
15 illustrates a damping structure of a camera module according to an embodiment.
16 is a plan view of a camera module according to an exemplary embodiment.
17 is a cross-sectional view of a camera module according to an embodiment.
18 illustrates a frame of a camera module according to an embodiment.
19A is a plan view of a camera module according to an exemplary embodiment.
19B is a cross-sectional view of a camera module according to an embodiment.
20 is a cross-sectional view of a camera module according to an embodiment.
21 is a plan view of a camera module according to an embodiment.
22 is a cross-sectional view of a camera module according to an embodiment.
23 illustrates a frame and a second carrier of a camera module according to an embodiment.
24 illustrates a driving member of a camera module according to an exemplary embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that various modifications, equivalents, and/or alternatives of the embodiments of the present invention are included.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as a part of another functionally related component (eg, camera module 180 or communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram illustrating a camera module according to various embodiments.

Referring to the block diagram 200 of FIG. 2 , the camera module 180 includes a lens assembly 210 , a flash 220 , an image sensor 230 , an image stabilizer 240 , and a memory 250 (eg, a buffer memory). ), or an image signal processor 260 . The lens assembly 210 may collect light emitted from a subject, which is an image to be captured. The lens assembly 210 may include one or more lenses. According to an embodiment, the camera module 180 may include a plurality of lens assemblies 210 . In this case, the camera module 180 may form, for example, a dual camera, a 360 degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 may have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may be a different lens assembly. It may have one or more lens properties that are different from the lens properties of . The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from the subject. According to an embodiment, the flash 220 may include one or more light emitting diodes (eg, a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp. The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to an embodiment, the image sensor 230 may include, for example, one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, the same It may include a plurality of image sensors having properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

In response to the movement of the camera module 180 or the electronic device 101 including the same, the image stabilizer 240 moves at least one lens or the image sensor 230 included in the lens assembly 210 in a specific direction or Operation characteristics of the image sensor 230 may be controlled (eg, read-out timing may be adjusted, etc.). This makes it possible to compensate for at least some of the negative effects of the movement on the image being taken. According to an embodiment, the image stabilizer 240 uses a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180 to the camera module 180 or the electronic device 101 . ) can be detected. According to an embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer. The memory 250 may temporarily store at least a portion of the image acquired through the image sensor 230 for a next image processing operation. For example, when image acquisition is delayed according to the shutter or a plurality of images are acquired at high speed, the acquired original image (eg, a Bayer-patterned image or a high-resolution image) is stored in the memory 250 and , a copy image corresponding thereto (eg, a low-resolution image) may be previewed through the display module 160 . Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a portion of the original image stored in the memory 250 may be obtained and processed by, for example, the image signal processor 260 . According to an embodiment, the memory 250 may be configured as at least a part of the memory 130 or as a separate memory operated independently of the memory 130 .

The image signal processor 260 may perform one or more image processing on an image acquired through the image sensor 230 or an image stored in the memory 250 . The one or more image processes may include, for example, depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring), sharpening (sharpening), or softening (softening) Additionally or alternatively, the image signal processor 260 may include at least one of the components included in the camera module 180 (eg, an image sensor). 230), for example, exposure time control, readout timing control, etc. The image processed by the image signal processor 260 is stored back in the memory 250 for further processing. or may be provided as an external component of the camera module 180 (eg, the memory 130, the display module 160, the electronic device 102, the electronic device 104, or the server 108). According to an example, the image signal processor 260 may be configured as at least a part of the processor 120 or as a separate processor operated independently of the processor 120. The image signal processor 260 may be configured as the processor 120 and a separate processor, at least one image processed by the image signal processor 260 may be displayed through the display module 160 as it is by the processor 120 or after additional image processing.

According to an embodiment, the electronic device 101 may include a plurality of camera modules 180 each having different properties or functions. In this case, for example, at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least the other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera, and at least the other may be a rear camera.

3A is a front perspective view of an electronic device according to an exemplary embodiment; 3B is a rear perspective view of an electronic device according to an exemplary embodiment; 3C is an exploded perspective view of an electronic device according to an exemplary embodiment;

Referring to FIGS. 3A and 3B , the electronic device 300 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment has a first surface (or front surface) 310A, a second surface (or , a rear surface) 310B, and a housing 310 including a third surface (or side surface) 310C surrounding a space between the first surface 310A and the second surface 310B. .

In another embodiment, the housing 310 may refer to a structure that forms part of the first surface 310A, the second surface 310B, and the third surface 310C.

In one embodiment, the first side 310A may be formed by a front plate 302 (eg, a glass plate comprising various coating layers, or a polymer plate) at least a portion of which is substantially transparent. The second surface 310B may be formed by a substantially opaque back plate 311 . The back plate 311 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. can be The third surface 310C is coupled to the front plate 302 and the rear plate 311 , and may be formed by a side bezel structure (or side member) 318 including a metal and/or a polymer.

In another embodiment, the back plate 311 and the side bezel structure 318 may be integrally formed and may include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 302 may include two first regions 310D that extend seamlessly by bending in the direction of the rear plate 311 from a partial region of the first surface 310A. have. The first regions 310D may be located at both ends of a long edge of the front plate 302 .

In the illustrated embodiment, the rear plate 311 may include two second regions 310E that extend seamlessly from a partial region of the second surface 310B toward the front plate 302 . The second regions 310E may be included at both ends of the long edge of the back plate 311 .

In another embodiment, the front plate 302 (or the back plate 311 ) may include only one of the first regions 310D (or the second regions 310E). Also, in another embodiment, the front plate 302 (or the rear plate 311 ) may not include some of the first regions 310D (or the second regions 310E).

In an embodiment, when the side bezel structure 318 is viewed from the side of the electronic device 300 , the first areas 310D or the second areas 310E are not included in the lateral direction (eg: short side) may have a first thickness (or width), and may have a second thickness thinner than the first thickness in a lateral direction (eg, a long side) including the first areas 310D or second areas 310E. have.

In an embodiment, the electronic device 300 includes a display 301 (eg, the display module 160 of FIG. 1 ), audio modules 303 , 304 , and 307 (eg, the audio module 170 of FIG. 1 ); A sensor module (not shown) (eg, the sensor module 176 of FIG. 1 ), camera modules 305 , 312 , 313 (eg, the camera module 180 of FIG. 1 ), a key input device 317 (eg: It may include at least one of the input device 150 of FIG. 1 ), a light emitting device (not shown), and a connector hole 308 (eg, the connection terminal 178 of FIG. 1 ). In another embodiment, the electronic device 300 may omit at least one of the components (eg, the key input device 317 or a light emitting device (not shown)) or additionally include other components.

In one embodiment, the display 301 may be visually exposed through a substantial portion of the front plate 302 . For example, at least a portion of the display 301 may be visually exposed through the front plate 302 including the first areas 310D of the first side 310A and the third side 310C. The display 301 may be disposed on the rear surface of the front plate 302 .

In an embodiment, the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 . In another embodiment, in order to expand the area to which the display 301 is visually exposed, the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.

In one embodiment, the surface (or front plate 302 ) of the housing 310 may include a screen display area formed as the display 301 is visually exposed. For example, the screen display area may include a first surface 310A and side first areas 310D.

In another embodiment, the screen display areas 310A and 310D may include a sensing area (not shown) configured to obtain the user's biometric information. Here, the meaning of “the screen display regions 310A and 310D includes the sensing region” may be understood as that at least a portion of the sensing region may overlap the screen display regions 310A and 310D. For example, the sensing region (not shown) may display visual information by the display 301 like other regions of the screen display regions 310A and 310D, and additionally display the user's biometric information (eg, fingerprint). It may mean an area that can be acquired.

In an embodiment, the screen display areas 310A and 310D of the display 301 may include areas to which the first camera module 305 (eg, a punch hole camera) may be visually exposed. For example, at least a portion of an edge of the area to which the first camera module 305 is visually exposed may be surrounded by the screen display areas 310A and 310D. In various embodiments, the first camera module 305 may include a plurality of camera modules (eg, the camera module 180 of FIG. 1 ).

In various embodiments, the display 301 includes an audio module (not shown), a sensor module (not shown), a camera module (eg, the first camera module 305), on the rear surface of the screen display areas 310A and 310D; and at least one of a light emitting device (not shown) may be disposed. For example, the electronic device 300 may have a rear surface (eg, -z) of the first surface 310A (eg, a front surface) and/or a side surface 310C (eg, at least one surface of the first region 310D). on the axial facing side), the first camera module 305 (eg, an under display camera (UDC)) may be configured to face the first side 310A and/or side 310C. can For example, the first camera module 305 may be disposed under the display 301 and may not be visually exposed to the screen display areas 310A and 310D. In an embodiment, the display 301 may be formed as a transmissive region in which the region facing the first camera module 305 has a transmittance designated as a part of an region displaying content. For example, the transmissive region may be formed to have a transmittance ranging from about 5% to about 50%. Such a transmission region overlaps with an effective region (eg, angle of view region) of the first camera module 305 through which light for generating an image by being imaged by an image sensor (eg, the image sensor 230 of FIG. 2 ) passes. It may contain areas. For example, the transmissive area of the display 301 may include an area having lower pixel density and/or wiring density than the surrounding area.

In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.

In an embodiment, the audio modules 303 , 304 , and 307 may include microphone holes 303 , 304 and a speaker hole 307 .

In an embodiment, the microphone holes 303 and 304 include a first microphone hole 303 formed in a partial area of the third surface 310C and a second microphone hole 304 formed in a partial area of the second surface 310B. may include A microphone (not shown) for acquiring an external sound may be disposed inside the microphone holes 303 and 304 . The microphone may include a plurality of microphones to detect the direction of sound.

In an embodiment, the second microphone hole 304 formed in a partial region of the second surface 310B may be disposed adjacent to the camera modules 305 , 312 , and 313 . For example, the second microphone hole 304 may acquire a sound when the camera modules 305 , 312 , and 313 are executed, or acquire a sound when other functions are executed.

In one embodiment, the speaker hole 307 may include an external speaker hole 307 and a receiver hole for a call (not shown). The external speaker hole 307 may be formed in a portion of the third surface 310C of the electronic device 300 . In another embodiment, the external speaker hole 307 may be implemented as a single hole with the microphone hole 303 . Although not shown, a receiver hole for a call (not shown) may be formed in another portion of the third surface 310C. For example, the receiver hole for a call is a part (eg, a part facing the -y-axis direction) of the third surface 310C on which the external speaker hole 307 is formed and another part of the third surface 310C (eg, : part facing the +y-axis direction). According to various embodiments, the receiver hole for a call is not formed on a part of the third surface 310C, but is formed by a space between the front plate 302 (or the display 301 ) and the side bezel structure 318 . may be formed.

In an embodiment, the electronic device 300 includes at least one speaker (not shown) configured to output sound to the outside of the housing 310 through an external speaker hole 307 or a receiver hole for a call (not shown). may include According to various embodiments, the speaker may include a piezo speaker in which the speaker hole 307 is omitted.

In an embodiment, the sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 300 or an external environmental state. For example, the sensor module may include a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may include at least one of a humidity sensor and an illuminance sensor.

In an embodiment, the camera modules 305 , 312 , and 313 include the first camera module 305 (eg, punch hole camera) exposed to the first surface 310A of the electronic device 300 , the second surface ( 310B) may include a second camera module 312 exposed to, and/or a flash 313 .

In an embodiment, the first camera module 305 may be visually exposed through a portion of the screen display areas 310A and 310D of the display 301 . For example, the first camera module 305 may be visually exposed to a portion of the screen display areas 310A and 310D through an opening (not shown) formed in a portion of the display 301 . As another example, the first camera module 305 (eg, an under-display camera) may be disposed on the rear surface of the display 301 and may not be visually exposed to the screen display areas 310A and 310D.

In an embodiment, the second camera module 312 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the second camera module 312 is not necessarily limited to including a plurality of cameras, and may include a single camera.

In an embodiment, the first camera module 305 and the second camera module 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .

In an embodiment, the key input device 317 may be disposed on the third surface 310C of the housing 310 (eg, the first regions 310D and/or the second regions 310E). have. In another embodiment, the electronic device 300 may not include some or all of the key input devices 317 , and the not included key input devices 317 may be in other forms, such as soft keys, on the display 301 . can be implemented as In another embodiment, the key input device may include a sensor module (not shown) that forms a sensing region (not shown) included in the screen display regions 310A and 310D.

In one embodiment, the connector hole 308 may receive a connector. The connector hole 308 may be disposed on the third surface 310C of the housing 310 . For example, the connector hole 308 may be disposed on the third surface 310C to be adjacent to at least a portion of the audio module (eg, the microphone hole 303 and the speaker hole 307 ). In another embodiment, the electronic device 300 includes a first connector hole 308 and/or an external electronic device that may receive a connector (eg, a USB connector) for transmitting/receiving power and/or data with an external electronic device. It may include a second connector hole (not shown) capable of accommodating a connector (eg, an earphone jack) for transmitting/receiving a device and an audio signal.

In an embodiment, the electronic device 300 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the first surface 310A of the housing 310 . The light emitting device (not shown) may provide state information of the electronic device 300 in the form of light. In another embodiment, the light emitting device (not shown) may provide a light source that is interlocked with the operation of the first camera module 305 . For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Referring to FIG. 3C , the electronic device 300 according to an embodiment includes a front plate 320 (eg, the front plate 302 of FIG. 3A ) and a display 330 (eg, the display 301 of FIG. 3A ). ), side member 340 (eg, side bezel structure 318 in FIG. 3A ), printed circuit board 350 , rear case 360 , battery 370 , back plate 380 (eg, in FIG. 3B ). a rear plate 311) and an antenna (not shown).

In various embodiments, the electronic device 300 may omit at least one of the components (eg, the rear case 360 ) or additionally include other components. Some of the components of the electronic device 300 illustrated in FIG. 3C may be the same as or similar to some of the components of the electronic device 300 illustrated in FIGS. 3A and 3B . Hereinafter, overlapping descriptions will be given omit

In an embodiment, the front plate 320 and the display 330 may be coupled to the side member 340 . For example, the front plate 320 and the display 330 may be disposed under the side member 340 with reference to FIG. 3C . The front plate 320 and the display 330 may be positioned in the +z-axis direction from the side member 340 . For example, the display 330 may be coupled under the side member 340 , and the front plate 320 may be coupled under the display 330 . The front plate 320 may form a part of the outer surface (or exterior) of the electronic device 300 . The display 330 may be disposed between the front plate 320 and the side member 340 to be positioned inside the electronic device 300 .

In an embodiment, the side member 340 may be disposed between the display 330 and the back plate 380 . For example, the side member 340 may be configured to surround a space between the back plate 380 and the display 330 .

In one embodiment, the side member 340 is inwardly from the frame structure 341 and the frame structure 341 that form a part of the side surface (eg, the third surface 310C of FIG. 3A ) of the electronic device 300 . an extending plate structure 342 .

In one embodiment, the plate structure 342 may be disposed inside the frame structure 341 to be surrounded by the frame structure 341 . The plate structure 342 may be connected to the frame structure 341 or may be formed integrally with the frame structure 341 . The plate structure 342 may be formed of a metal material and/or a non-metal (eg, polymer) material. In an embodiment, the plate structure 342 may support other components included in the electronic device 300 . For example, at least one of the display 330 , the printed circuit board 350 , the rear case 360 , and the battery 370 may be disposed on the plate structure 342 . For example, in the plate structure 342 , the display 330 is coupled to one side (eg, a side facing the +z-axis direction), and a side facing the opposite side of the one side (eg, a side facing the -z-axis direction). The printed circuit board 350 may be coupled thereto.

In an embodiment, the rear case 360 may be disposed between the rear plate 380 and the plate structure 342 . The rear case 360 may be coupled to the side member 340 to overlap at least a portion of the printed circuit board 350 . For example, the rear case 360 may face the plate structure 342 with the printed circuit board 350 interposed therebetween.

In one embodiment, printed circuit board 350 includes a processor (eg, processor 120 of FIG. 1 ), memory (eg, memory 130 of FIG. 1 ), and/or an interface (eg, interface of FIG. 1 ). (177)) can be equipped. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

In an embodiment, the battery 370 (eg, the battery 189 of FIG. 1 ) may supply power to at least one component of the electronic device 300 . For example, battery 370 may include a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. At least a portion of the battery 370 may be disposed substantially on the same plane as the printed circuit board 350 . The battery 370 may be integrally disposed inside the electronic device 300 , or may be disposed detachably from the electronic device 300 .

In an embodiment, an antenna (not shown) (eg, the antenna module 197 of FIG. 1 ) may be disposed between the rear plate 380 and the battery 370 . An antenna (not shown) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. An antenna (not shown) may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.

In one embodiment, the first camera module 305 is configured to allow the lens to receive external light through a portion of the front plate 320 (eg, the front surface 310A in FIG. 3A ) at least of the side member 340 . It may be disposed in some (eg, plate structure 342 ). For example, the lens of the first camera module 305 may be visually exposed as a partial area (eg, the camera area 337 ) of the front plate 320 .

In one embodiment, the second camera module 312 is configured to receive external light through the camera area 384 of the rear plate 380 of the electronic device 300 (eg, the rear surface 310B of FIG. 3B ). It may be disposed on the printed circuit board 350 so that the For example, the lens of the second camera module 312 may be visually exposed to the camera area 384 . In an embodiment, the second camera module 312 may be disposed in at least a portion of an internal space formed in the housing (eg, the housing 310 of FIGS. 3A and 3B ) of the electronic device 300 , and a connection member ( For example, it may be electrically connected to the printed circuit board 350 through a connector.

In an embodiment, the camera area 384 may be formed on the surface of the rear plate 380 (eg, the rear surface 310B of FIG. 3B ). In an embodiment, the camera area 384 may be formed to be at least partially transparent so that external light is incident to the lens of the second camera module 312 . In an embodiment, at least a portion of the camera area 384 may protrude from the surface of the rear plate 380 to a predetermined height. However, the present invention is not limited thereto, and the camera area 384 may form a substantially same plane as the surface of the rear plate 380 .

4 is a perspective view of a camera module according to an embodiment. 5 is an exploded perspective view of a camera module according to an embodiment.

4 and 5 , the camera module 400 (eg, the camera module 180 of FIGS. 1 and 2 or the camera modules 305 and 312 of FIG. 3C) according to an embodiment includes a camera housing ( 410 ), a lens unit 420 , and a sensor assembly 480 (eg, the image sensor 230 of FIG. 2 ).

In an embodiment, the camera housing 410 may provide an accommodation space in which at least a portion of the lens unit 420 is accommodated. The camera housing 410 may include a frame 413 and a cover 411 coupled to the frame 413 . For example, at least a portion of the lens unit 420 may be accommodated in the frame 413 , and the cover 411 is attached to the frame 413 to cover the frame 413 and at least a portion of the lens unit 420 . can be combined.

In an embodiment, the camera housing 410 together with the sensor assembly 480 may form at least a portion of the exterior or outer surface of the camera module 400 . The frame 413 may be fixedly disposed on one surface (eg, a surface facing the +z-axis direction) of the substrate 481 of the sensor assembly 480 , and the cover 411 covers the sidewall of the frame 413 . It may be coupled to the frame 413 . For example, the cover 411 may form at least a portion of the upper surface (eg, the surface facing the +z-axis direction) and the side surface (the surface facing the x-axis and y-axis direction) of the camera module 400, The sensor assembly 480 may form at least a portion of a lower surface (eg, a surface facing the -z-axis direction) of the camera module 400 . At least a portion of the frame 413 may be exposed to the outside of the camera module 400 through between the cover 411 and the sensor assembly 480 . The shapes of the cover 411 and the frame 413 are not limited to the illustrated embodiment.

In an embodiment, an opening 4111 for visually exposing at least a portion of the lens 425 to the outside of the camera module 400 may be formed in the cover 411 . A plurality of coils 470_c providing driving force for movement of the lens unit 420 may be disposed in the frame 413 . For example, the plurality of coils 470_c may generate a driving force by electromagnetic interaction with the plurality of magnets 470_m disposed on the lens unit 420 .

In an embodiment, at least a portion of the lens unit 420 may be accommodated in the camera housing 410 . The lens unit 420 may be configured to move within the camera housing 410 . For example, the lens unit 420 may be movable in one or more directions with respect to the relatively fixed camera housing 410 and the sensor assembly 480 . In various embodiments, the camera module 400 may move the entire lens unit 420 in the optical axis L direction of the lens 425 (eg, AF operation) for an auto-focus function, and perform an image stabilization function. For this purpose, at least a portion of the lens unit 420 may be moved in a direction substantially perpendicular to the optical axis L (eg, an OIS operation).

In an embodiment, the lens unit 420 may include a lens assembly 421 (eg, the lens assembly 210 of FIG. 2 ) and a lens carrier 422 . For example, the lens unit 420 may be understood as a lens structure or a lens moving unit including at least one lens 425 and components (eg, a carrier) for moving the lens 425 . The lens assembly 421 may include one or more lenses 425 and a lens barrel 423 surrounding the lenses 425 . The lens assembly 421 may be disposed on the lens carrier 422 . The lens carrier 422 may move the lens assembly 421 in the optical axis L direction of the lens 425 or may move in a direction substantially perpendicular to the optical axis L. The lens carrier 422 may be configured to partially move together with the lens assembly 421 in response to the movement direction of the lens assembly 421 or to be separated from the movement of the lens assembly 421 . A specific structure of the lens carrier 422 will be described in more detail below with reference to FIGS. 9A and 9B .

In an embodiment, a plurality of magnets 470_m providing a driving force for movement of the lens unit 420 may be disposed on the lens carrier 422 . For example, the plurality of magnets 470_m may generate a driving force by electromagnetic interaction with the plurality of coils 470_c disposed in the camera housing 410 (eg, the frame 413 ).

In an embodiment, the lens unit 420 may be disposed inside the camera housing 410 such that at least a portion of the lens assembly 421 is exposed through the opening 4111 formed in the cover 411 of the camera housing 410 . have. The lens 425 of the lens assembly 421 may be visually seen through the opening 4111 and may receive light from the outside of the camera housing 410 . For example, the lens 425 may be a portion of a surface (eg, the housing 310 of FIGS. 3A and 3B ) of a housing of an electronic device (eg, the electronic device 300 of FIGS. 3A-3C ). It may be configured to receive light from the outside of the electronic device through the camera area 384 of FIG. 3C .

In one embodiment, the sensor assembly 480 includes a substrate 481 , an infrared filter 483 disposed on the substrate 481 , and an image sensor (eg, the image sensor of FIGS. 6A, 6B, 7A and 7B ). 482)) may be included. The sensor assembly 480 may be fixedly disposed on the camera housing 410 as the substrate 481 is coupled to the frame 413 . For example, when the lens unit 420 moves, the sensor assembly 480 may be fixed to the camera housing 410 , and a relative position change may occur between the sensor assembly 480 and the lens unit 420 . .

In an embodiment, the sensor assembly 480 may further include a connection member 484 electrically connected to the substrate 481 . The connecting member 484 may extend from the substrate 481 . The connecting member 484 connects an electrical component (eg, the substrate 481 or the plurality of coils 470_c) included in the camera module 400 to the main board (eg, the printed circuit of FIG. 3C ) of the electronic device 300 . It may be electrically connected to the substrate 350). A connector 485 coupled to the main board 350 may be disposed on the connection member 484 . In various embodiments, the connecting member 484 may include a flexible printed circuit board (FPCB).

The camera module 400 according to the embodiments disclosed in this document is relative to the fixing part (or fixing structure) 401 fixed inside the housing 310 of the electronic device 300 and the fixing part 401 . It may be a structure including a moving unit (or a moving structure) capable of moving to For example, at least a portion of the moving unit may be disposed inside the fixed unit 401 to move relative to the fixed unit 401 . The fixing unit 401 may include a camera housing 410 and a sensor assembly 480 , and the moving unit may include a lens assembly 421 and a lens carrier 422 . For example, the moving unit may be referred to as a lens unit 420 . The camera module 400 may perform an autofocus function (AF) and an image stabilization function (OIS) by relatively moving the entire moving unit or a part of the moving unit with respect to the fixed unit 401 .

6A is an exploded perspective view of a camera module according to an embodiment. 6B is an exploded perspective view of a camera module according to an embodiment.

6A and 6B , the camera module 400 according to an embodiment may include a camera housing 410 , a lens unit 420 , a sensor assembly 480 , and a driving member 470 .

Some of the components of the camera module 400 illustrated in FIGS. 6A and 6B may be the same as or similar to some of the components of the camera module 400 illustrated in FIGS. 4 and 5 , and overlapping descriptions will be given below. omit

In an embodiment, the camera housing 410 may include a cover 411 and a frame 413 . The cover 411 and the frame 413 may form a predetermined space in which the lens unit 420 is disposed. An opening 4111 aligned with the lens assembly 421 in the optical axis L direction may be formed in the cover 411 . The frame 413 may surround the lens unit 420 and may be fixedly disposed on the substrate 481 of the sensor assembly 480 . For example, the frame 413 has a bottom surface (eg, a surface facing the -z-axis direction) opened so that light passing through the lens 425 of the lens assembly 421 can be incident on the image sensor 482 . can be formed in the form.

In an embodiment, the frame 413 may include a plurality of sidewalls 414 , 415 , 416 , and 417 surrounding the side surface of the lens unit 420 . A plurality of sidewalls 414 , 415 , 416 , and 417 of the frame 413 may be surrounded by a flexible substrate 479 . A plurality of coils 470_c disposed on the flexible substrate 479 may be positioned on the plurality of sidewalls 414 , 415 , 416 , and 417 of the frame 413 .

In one embodiment, the plurality of sidewalls 414, 415, 416, 417 includes a first sidewall 414 on which the AF coil 471 is disposed, a second sidewall 415 on which the first OIS coil 473 is disposed, It may include a third sidewall 416 on which the second OIS coil 475 is disposed, and a fourth sidewall 417 on which the third OIS coil 477 is disposed. For example, the first sidewall 414 and the second sidewall 415 may face each other, and the third sidewall 416 and the fourth sidewall 417 are the first sidewall 414 and the second sidewall 415 . ) can be connected to face each other. 6A and 6B, the first sidewall 414 is oriented in the +x-axis direction, the second sidewall 415 is oriented in the -x-axis direction, and the third sidewall 416 is oriented in the +y-axis direction, The fourth sidewall 417 may face the -y-axis direction.

In an embodiment, the lens unit 420 may be configured such that the entire lens unit 420 or a part of the lens unit 420 moves within a space formed by the camera housing 410 and the sensor assembly 480 . .

In an embodiment, the lens unit 420 may include a lens assembly 421 , a lens carrier 422 , and a stopper 460 . The lens assembly 421 may include a lens barrel 423 and one or more lenses 425 disposed inside the lens barrel 423 . The lens barrel 423 may be formed to surround the lens 425 .

In one embodiment, at least a portion of the lens assembly 421 may be surrounded by the lens carrier 422 . The lens assembly 421 may be fixedly disposed on some components of the lens carrier 422 (eg, the first carrier 430 of FIGS. 9A and 9B ). For example, the lens barrel 423 of the lens assembly 421 may be coupled or mounted to some configuration of the lens carrier 422 .

In one embodiment, the stopper 460 may be coupled to the lens carrier 422 . For example, the stopper 460 may be coupled to be fixed to some configuration of the lens carrier 422 (eg, the second carrier 450 of FIGS. 9A and 9B ). A portion of the top surface of the stopper 460 may be opened so that at least a portion of the lens assembly 421 passes therethrough. For example, an opening in which the lens assembly 421 is positioned may be formed in the upper surface of the stopper 460 .

In an embodiment, a plurality of magnets 470_m may be disposed on the lens carrier 422 of the lens unit 420 . For example, the lens carrier 422 has an AF magnet 472 facing the AF coil 471 , a first OIS magnet 474 facing the first OIS coil 473 , and a second OIS coil 475 and A third OIS magnet 478 facing the second OIS magnet 476 and the third OIS coil 477 may be disposed. Based on the drawing, the AF magnet 472 is disposed on the +x-axis direction side of the lens unit 420 , and the first OIS magnet 474 is disposed on the -x-axis direction side surface of the lens unit 420 , and the second The OIS magnet 476 may be disposed on a side surface of the lens unit 420 in the +y-axis direction, and the third OIS magnet 478 may be disposed on a side surface of the lens unit 420 in the -y-axis direction.

In an embodiment, the lens unit 420 may move in the optical axis L direction inside the camera housing 410 . The camera module 400 may perform an autofocus function by moving the lens unit 420 in the optical axis L direction. For example, the lens unit 420 may move in the +L/-L direction with respect to the optical axis L by the interaction of the AF coil 471 and the AF magnet 472 . When the auto-focus function is performed, the entire lens unit 420 may move relative to the camera housing 410 and the sensor assembly 480 . Accordingly, a distance in the optical axis L direction between the lens 425 and the image sensor 482 may vary. The camera module 400 may adjust the focal length by moving the lens carrier 422 .

In an embodiment, the lens unit 420 may include a first ball 492 disposed between a side surface (eg, a surface facing the +x-axis direction) of the lens carrier 422 and the frame 413 . For example, a plurality of first balls 492 may be formed. The first ball 492 may be configured to roll between the lens carrier 422 and the frame 413 when the lens carrier 422 moves in the optical axis L direction. When there are a plurality of first balls 492 , the first balls 492 may be arranged in the optical axis L direction.

In an embodiment, the first recess 458 in which at least a portion of the first ball 492 is accommodated in the side (eg, the surface facing the +x-axis direction) of the lens carrier 422 in which the AF magnet 472 is disposed. ) can be formed. The first recess 458 may be formed to be elongated in the optical axis L direction. A second recess 418 facing the first recess 458 may be formed in the frame 413 . For example, a second recess 418 facing the first recess 458 may be formed inside the first sidewall 414 on which the AF coil 471 is disposed. The second recess 418 may extend long in the optical axis L direction, and together with the first recess 458 may form a space in which the first ball 492 is accommodated.

In one embodiment, the first ball 492 may be configured to roll in the space between the first recess 458 and the second recess 418 . For example, when the lens unit 420 (eg, the lens carrier 422 ) moves in the optical axis L direction, the first ball 492 is formed in the first recess 458 and the second recess 418 . ) while moving linearly in the direction of the optical axis (L) in the space between them, or may rotate in place.

In one embodiment, a predetermined attractive force by the magnet may be configured to act between the side of the lens carrier 422 on which the AF magnet 472 is disposed and the first sidewall 414 on which the AF coil 471 is disposed. . A yoke 491 may be disposed to face the AF coil 471 on a portion of the flexible substrate 479 on which the AF coil 471 is disposed. For example, the AF coil 471 may be disposed to face the AF magnet 472 with a portion of the flexible substrate 479 and the AF coil 471 interposed therebetween. The yoke 491 may form an attractive force with the AF magnet 472 . Accordingly, an attractive force acts between the first sidewall 414 on which the yoke 491 is disposed and the side (for example, the surface facing the +x-axis direction) of the lens carrier 422 on which the AF magnet 472 is disposed. It is possible to maintain a state spaced apart at a specified interval by 1 ball 492 . When the lens carrier 422 moves in the optical axis L direction with respect to the frame 413 by the attractive force, the first ball 492 is in close contact with the first recess 458 and the second recess 418 . can be rotated in

According to the embodiments disclosed in this document, when the autofocus function is performed on the lens unit 420, the entire lens unit 420 is a fixing unit 401 (eg, the camera housing 410 and the sensor assembly 480). with respect to the optical axis (L). When the image stabilization function is performed, the lens unit 420 includes a part of the lens carrier 422 (eg, the first carrier 430 or guide member 440 of FIGS. 9A and 9B ) and the lens assembly 421 ). may move in a direction substantially perpendicular to the optical axis L with respect to the fixing part 401 . For example, when the lens unit 420 performs an image stabilization function. Some configurations of lens carrier 422 may be configured to move in a direction substantially perpendicular to optical axis L relative to other configurations. A movement operation of the lens unit 420 in the image stabilization operation will be described below with reference to FIG. 11 .

In an embodiment, the sensor assembly 480 may include a substrate 481 , an image sensor 482 , and an infrared filter (IR filter) 483 . The sensor assembly 480 may be disposed under the frame 413 such that the image sensor 482 is aligned with the optical axis L of the lens 425 . The sensor assembly 480 may be fixed to the camera housing 410 . For example, the frame 413 may be fixedly disposed on the upper surface (eg, the surface facing the +z-axis direction) of the substrate 481 of the sensor assembly 480 . In the sensor assembly 480 , the image sensor 482 and the infrared filter 483 may be aligned with the lens assembly 421 under the lens unit 420 in the optical axis L direction. In various embodiments, the sensor assembly 480 may constitute a fixing unit 401 that is relatively fixed with respect to the movement of the lens unit 420 together with the camera housing 410 .

In an embodiment, the image sensor 482 may be disposed on the upper surface of the substrate 481 to be partially aligned with the optical axis L. The image sensor 482 may be electrically connected to the substrate 481 . For example, the image sensor 482 may be mounted on the upper surface of the substrate 481 . Image sensor 482 may be configured to receive light passing through lens 425 and generate an electrical signal based on the received light signal.

In an embodiment, as the image sensor 482 is fixed to the camera housing 410 , a position relative to the lens assembly 421 may change in response to the movement of the lens unit 420 . For example, the position of the image sensor 482 relative to the lens assembly 421 in the direction of the optical axis L may change during the AF operation. For example, the relative position of the image sensor 482 may change in a direction substantially perpendicular to the lens assembly 421 and the optical axis L in the OIS operation.

In an embodiment, the infrared filter 483 may be disposed between the image sensor 482 and the lens unit 420 (eg, the lens assembly 421 ). For example, the infrared filter 483 may be aligned with the image sensor 482 and the lens assembly 421 in the optical axis L direction. The infrared filter 483 may be configured to block light of an infrared band incident to the image sensor 482 . For example, the infrared filter 483 may include a reflective infrared filter that reflects infrared rays and an absorption infrared filter that absorbs infrared rays.

In an embodiment, the driving member 470 may include a flexible substrate 479 , a plurality of coils 470_c , and a plurality of magnets 470_m. The plurality of coils 470_c may include an AF coil 471 and an OIS coil 473 , 475 , and 477 , and the plurality of magnets 470_m may include an AF magnet 472 and an OIS magnet 474 , 476 , and 478 . may include

In an embodiment, a plurality of coils 470_c may be disposed on the flexible substrate 479 . The flexible substrate 479 has an AF coil 471 disposed on a first sidewall 414 of the frame 413 , a first OIS coil 473 disposed on a second sidewall 415 of the frame 413 , of the frame 413 such that the second OIS coil 475 is disposed on the third sidewall 416 of the frame 413 , and the third OIS coil 477 is disposed on the fourth sidewall 417 of the frame 413 . It may surround at least a part.

In an embodiment, the flexible substrate 479 may be electrically connected to the substrate 481 of the sensor assembly 480 . For example, the plurality of coils 470_c may be electrically connected to the main board (eg, the printed circuit board 350 of FIG. 3C ) of the electronic device 300 through the flexible substrate 479 and the substrate 481 . . For example, the flexible substrate 479 may be partially formed to be flexible. The flexible substrate 479 may include a flexible printed circuit board (FPCB). An electrical connection structure between the flexible substrate 479 and the substrate 481 will be described below with reference to FIGS. 7A and 7B .

In an embodiment, the plurality of coils 470_c may face the plurality of magnets 470_m disposed on the lens unit 420 . For example, the AF coil 471 faces the AF magnet 472 , the first OIS coil 473 faces the first OIS magnet 474 , and the second OIS coil 475 faces the second OIS magnet Facing 476 , the third OIS coil 477 may face the third OIS magnet 478 . The plurality of coils 470_c and the plurality of magnets 470_m corresponding thereto electromagnetically interact to provide a driving force to move the entire lens unit 420 or a part of the lens unit 420 . . For example, the AF coil 471 and the AF magnet 472 may generate a driving force for moving the entire lens unit 420 in the optical axis L direction. 6A and 6B , the first OIS coil 473 and the first OIS magnet 474 may generate a driving force for moving a part of the lens unit 420 in the +y/−y-axis direction. The second OIS coil 475 , the third OIS coil 477 , the second OIS magnet 476 , and the third OIS magnet 478 are for moving a part of the lens unit 420 in the +x/−x axis direction. driving force can be generated.

In an embodiment, an electrical signal may be applied to the plurality of coils 470_c. For example, the electrical signal may be applied from the main substrate 350 of the electronic device 300 through the connection member 484 , the substrate 481 , and the flexible substrate 479 . In various embodiments, the processor of the electronic device 300 (eg, the processor 120 of FIG. 1 ) may control the direction and/or intensity of current passing through the plurality of coils 470_c. An electromagnetic force (eg, Lorentz force) may be applied to the plurality of magnets 470_m corresponding to the plurality of coils 470_c in response to the direction of the current passing through the plurality of coils 470_c. For example, when a current flows through the AF coil 471 , an electromagnetic force may be applied to the AF magnet 472 . When a current flows in the first OIS coil 473 , an electromagnetic force may be applied to the first OIS magnet 474 . When a current flows in the second OIS coil 475 , an electromagnetic force may be applied to the second OIS magnet 476 . When a current flows in the third OIS coil 477 , an electromagnetic force may be applied to the third OIS magnet 478 . The camera module 400 may be configured such that all or part of the lens unit 420 relatively moves with respect to the frame 413 by the electromagnetic force.

According to the illustrated embodiment, in the driving member 470 , a plurality of coils 470_c are disposed on the camera housing 410 (eg, a fixing part), and a plurality of magnets 470_m are provided with a lens part 420 (eg, a fixed part). : the moving unit), but is not necessarily limited thereto. In another embodiment, the plurality of coils 470_c are disposed on the lens unit 420 , and the plurality of magnets 470_m are disposed on the camera housing ( 410) (eg, a fixing unit). For example, a plurality of magnets 470_m may be disposed on the frame 413 of the camera housing 410 . In addition, a yoke may be disposed on at least a portion of the lens unit 420 to face the plurality of coils 470_c. In this case, the camera module 400 further includes a separate additional connection member (eg, a substrate) for applying an electrical signal (eg, current) to the plurality of coils 470_c disposed on the lens unit 420 . can do.

7A illustrates a camera housing and a sensor assembly of a camera module according to an exemplary embodiment. 7B illustrates a camera housing and a sensor assembly of a camera module according to an exemplary embodiment.

7A and 7B may be views in which the cover 411 of the camera housing 410 and the infrared filter 483 of the sensor assembly 480 are omitted.

7A and 7B , the camera module 400 according to an embodiment includes a frame 413 , a flexible substrate 479 and a sensor assembly 480 coupled to the frame 413 , and a flexible substrate 479 . It may include a plurality of coils 470_c disposed in the .

Some components of the camera module 400 illustrated in FIGS. 7A and 7B may be the same as or similar to some of the components of the camera module 400 illustrated in FIGS. 4 to 6B , and overlapping descriptions will be omitted below. do.

In one embodiment, frame 413 may include a plurality of sidewalls 414 , 415 , 416 , 417 . The plurality of sidewalls 414, 415, 416, 417 includes a first sidewall 414 on which the AF coil 471 is disposed, a second sidewall 415 on which the first OIS coil 473 is disposed, and a second OIS coil ( It may include a third sidewall 416 on which 475 is disposed and a fourth sidewall 417 on which the third OIS coil 477 is disposed.

In an embodiment, the plurality of sidewalls 414 , 415 , 416 , and 417 may include an opening region such that the plurality of coils 470_c are positioned inside the frame 413 . A first opening region 4141 in which the AF coil 471 is positioned may be formed on the first sidewall 414 . A second opening region 4151 in which the first OIS coil 473 is positioned may be formed on the second sidewall 415 . A third opening region 4161 in which the second OIS coil 475 is positioned may be formed on the third sidewall 416 . A fourth opening region 4171 in which the third OIS coil 477 is positioned may be formed on the fourth sidewall 417 . For example, the plurality of coils 470_c may be positioned to face the inside of the frame 413 through an opening area corresponding to each of them.

In one embodiment, the flexible substrate 479 may extend to surround a portion of the first sidewall 414 , the second sidewall 415 , the third sidewall 416 , and the fourth sidewall 417 of the frame 413 . can The flexible substrate 479 may be formed in a shape corresponding to the frame 413 . For example, the flexible substrate 479 includes a first portion 479a on which the AF coil 471 is disposed, a second portion 479b on which the first OIS coil 473 is disposed, and the second OIS coil 475 . It may include a third portion 479c on which the third portion 479c is disposed and a fourth portion 479d on which the third OIS coil 477 is disposed. Referring to the drawings, in the flexible substrate 479 , a fourth portion 479d extends substantially vertically from the first portion 479a , and a second portion 479b extends substantially vertically from the fourth portion 479d . and the third portion 479c may be formed to extend substantially vertically from the second portion 479b.

In an embodiment, the flexible substrate 479 may be disposed to surround the sidewalls 414 , 415 , 416 , and 417 of the frame 413 . For example, the first portion 479a of the flexible substrate 479 may be coupled to the first sidewall 414 such that the AF coil 471 is positioned in the first opening region 4141 . The second portion 479b of the flexible substrate 479 may be coupled to the second sidewall 415 such that the first OIS coil 473 is positioned in the second opening region 4151 . The third portion 479c of the flexible substrate 479 may be coupled to the third sidewall 416 such that the second OIS coil 475 is positioned at the third opening region 4161 . The fourth portion 479d of the flexible substrate 479 may be coupled to the fourth sidewall 417 such that the third OIS coil 477 is positioned in the fourth opening region 4171 .

In an embodiment, the first portion 479a of the flexible substrate 479 may include an inner surface on which the AF coil 471 is disposed and an outer surface facing the opposite of the inner surface. Based on the drawings, the inner surface may be a surface facing the -x-axis direction, and the outer surface may be a surface facing the +x-axis direction. For example, when the flexible substrate 479 is coupled to the frame 413 , the outer surface of the first portion 479a may be disposed to face the outside of the frame 413 . A yoke 491 may be disposed on an outer surface of the first portion 479a. As described above with reference to FIGS. 6A and 6B , the yoke 491 may be configured to form an attractive force with the AF magnet 472 facing the AF coil 471 . The first side of the lens carrier 422 on which the AF magnet 472 is disposed (eg, the side facing the first sidewall 414) and the frame 413 on which the yoke 491 and the AF coil 471 are disposed. An attractive force may act between the sidewalls 414 .

In an embodiment, the flexible substrate 479 may be electrically connected to the substrate 481 of the sensor assembly 480 while being coupled to the sidewalls 414 , 415 , 416 , and 417 of the frame 413 . At least a portion of the flexible substrate 479 may be in electrical contact with the substrate 481 . For example, a first contact region 4791 for electrical contact with the substrate 481 may be formed in a portion of the flexible substrate 479 . The first contact region 4791 may be a conductive region including a conductive material.

In an embodiment, the sensor assembly 480 may be disposed under the frame 413 (eg, in the -z-axis direction). For example, the sensor assembly 480 may include an image sensor 482 and a substrate 481 (eg, a circuit board for a sensor) on which the image sensor 482 is disposed, the upper surface of the substrate 481 ( For example, in the +z-axis direction), the frame 413 may be fixedly disposed. The image sensor 482 may be surrounded by a flexible substrate 479 and a frame 413 . For example, when the upper surface of the substrate 481 is viewed from above, the image sensor 482 may be located inside the flexible substrate 479 and the frame 413 . In various embodiments, the frame 413 may be attached to the substrate 481 using an adhesive member (not shown).

In an embodiment, the substrate 481 of the sensor assembly 480 may be electrically connected to the flexible substrate 479 on which the plurality of coils 470_c are disposed. A second contact area (not shown) corresponding to the first contact area 4791 of the flexible substrate 479 may be formed on at least a portion of the substrate 481 . The substrate 481 may be electrically connected to the flexible substrate 479 as the second contact region contacts the first contact region 4791 of the flexible substrate 479 . For example, the second contact region may be a conductive region including a conductive material.

In one embodiment, the first contact area 4791 and the second contact area (not shown) may be in contact with each other by placing the frame 413 to which the flexible substrate 479 is coupled is disposed on the upper surface of the substrate 481 , , thus, the flexible substrate 479 and the substrate 481 may be electrically connected. The board 481 may be electrically connected to the main board 350 of the electronic device 300 through the connection member 484 and/or the connector 485 , and the flexible board 479 is the main board 481 through the board 481 . It may be electrically connected to the substrate 350 . However, the electrical connection between the flexible substrate 479 and the substrate 481 is not limited to being implemented by direct contact between the first contact area 4791 and the second contact area. In various embodiments, the camera module 400 may further include a configuration (eg, a conductive wire or cable) electrically connecting the first contact area 4791 and the second contact area.

7A and 7B , the first contact area 4791 may be formed on the fourth portion 479d of the flexible substrate 479 , and the second contact area is an upper portion of the substrate 481 . It may be formed at a position corresponding to the first contact area 4791 on a surface (eg, a surface facing the +z-axis direction). Each of the first contact area 4791 and the second contact area may be formed in plurality. However, the number and/or positions of the first contact area 4791 and the second contact area are not limited to the illustrated embodiment.

8 is an exploded perspective view of a lens unit of a camera module according to an exemplary embodiment. 9A is an exploded perspective view of a lens unit of a camera module according to an exemplary embodiment; 9B is an exploded perspective view of a lens unit of a camera module according to an exemplary embodiment. 10 illustrates a first carrier and a guide member of the lens unit according to an embodiment.

8, 9A and 9B , the lens unit 420 of the camera module 400 according to an embodiment may include a lens assembly 421, a lens carrier 422, and a stopper 460. have.

Some components of the camera module 400 shown in FIGS. 8, 9A and 9B may be the same as or similar to some of the components of the camera module 400 shown in FIGS. 4 to 7B , hereinafter, overlapping A description will be omitted.

In one embodiment, the lens assembly 421 may be coupled to the first carrier 430 of the lens carrier 422 . For example, the lens assembly 421 may be coupled to the first carrier 430 such that at least a portion thereof is received in the first opening 434 of the first carrier 430 . The lens assembly 421 may be fixedly disposed on the first carrier 430 , and may move together with the first carrier 430 .

In an embodiment, the lens carrier 422 may include a first carrier 430 , a second carrier 450 , and a guide member 440 . The lens carrier 422 may be configured to be aligned with the first carrier 430 , the second carrier 450 , and the guide member 440 in the optical axis (L) direction. The first carrier 430 , the guide member 440 , and the second carrier 450 may be arranged in the optical axis (L) direction. For example, the first carrier 430 may be disposed on the guide member 440 , and the guide member 440 may be disposed on the second carrier 450 .

In an embodiment, the second carrier 450 of the lens carriers 422 may be understood as an AF carrier for AF driving, and the first carrier 430 and the guide member 440 are OIS carriers for OIS driving. can be understood

In an embodiment, the first carrier 430 may be coupled to the lens assembly 421 . For example, the lens assembly 421 may be coupled to the first opening 434 of the first carrier 430 so that the first carrier 430 moves together with the lens assembly 421 . The first opening 434 may be aligned with the lens assembly 421 in the optical axis L direction.

In one embodiment, the first carrier 430 together with the lens assembly 421 has a first shift axis S1 substantially perpendicular to the optical axis L (eg, the first shift axis S1 in FIG. 11 ). and the second shift axis S2 (eg, the second shift axis S2 of FIG. 11 ). The first carrier 430 may be disposed to be movable in the direction of the second shift axis S2 with respect to the guide member 440 . For example, the first carrier 430 may move in the direction of the second shift axis S2 with respect to the guide member 440 and the second carrier 450 . The first carrier 430 may be configured to move in the direction of the first shift axis S1 together with the guide member 440 . For example, when the guide member 440 moves in the direction of the first shift axis S1 with respect to the second carrier 450 , the first carrier 430 may move together with the guide member 440 .

In one embodiment, the first carrier 430 has a second OIS magnet 476 and a third OIS magnet 478 that provide a driving force for moving the first carrier 430 in the second shift axis S2 direction. This can be placed The second OIS magnet 476 and the third OIS magnet 478 are disposed on the side of the first carrier 430 facing the first shift axis S1 direction substantially perpendicular to the second shift axis S2. can be The second OIS magnet 476 and the third OIS magnet 478 may be disposed on the first carrier 430 to face each other in opposite directions.

In an embodiment, the first carrier 430 may include a seating portion on which the magnet is mounted. For example, a first magnet seating portion 431 on which the second OIS magnet 476 is seated is formed on a side surface of the first carrier 430 in the +y-axis direction, and in the -y-axis direction of the first carrier 430 . A second magnet seating portion 432 on which the third OIS magnet 478 is seated may be formed on the side surface. A second OIS magnet 476 may be fixedly disposed on the first magnet seating portion 431 , and a third OIS magnet 478 may be fixedly disposed on the second magnet seating portion 432 . The second OIS magnet 476 and the third OIS magnet 478 include a second OIS coil (eg, the second OIS coil 475 of FIGS. 6A to 7B ) and a third OIS coil (eg, FIGS. 6A to 7B ). of the third OIS coil 477 ) and electromagnetically interacts to generate a driving force for moving the first carrier 430 in the direction of the second shift axis S2 . The second OIS magnet 476 and the third OIS magnet 478 may be formed such that regions having different polarities are arranged along the second shift axis S2 direction. For example, the second OIS magnet 476 and the third OIS magnet 478 may each have at least three polarities. The shapes of the second OIS magnet 476 and the third OIS magnet 478 will be described below with reference to FIG. 24 .

In an embodiment, the guide member 440 may be disposed between the first carrier 430 and the second carrier 450 . The guide member 440 may be movably disposed with respect to each of the first carrier 430 and the second carrier 450 . For example, the guide member 440 may be disposed on the second carrier 450 to be relatively movable in the direction of the first shift axis S1 with respect to the second carrier 450 , and the first carrier 430 . ) may be disposed under the first carrier 430 to allow relative movement in the direction of the second shift axis S2.

In an embodiment, the guide member 440 moves with respect to the second carrier 450 together with the first carrier 430 or does not move with the first carrier 430 when the image stabilization function is performed. can be relatively fixed. For example, the guide member 440 may move in the direction of the first shift axis S1 together with the first carrier 430 . The guide member 440 may not move together with the first carrier 430 when the first carrier 430 moves in the direction of the second shift axis S2 . According to the embodiments disclosed in this document, when the lens assembly 421 is moved in the first shift axis S1 direction for image stabilization, the guide member 440 may move together with the first carrier 430, When the lens assembly 421 is moved in the direction of the second shift axis S2 for image stabilization, the guide member 440 may not move together with the first carrier 430 .

In an embodiment, a first OIS magnet 474 that provides a driving force for moving the guide member 440 in the direction of the first shift axis S1 may be disposed on the guide member 440 . The first OIS magnet 474 may be disposed on the guide member 440 to face the AF magnet 472 and the opposite direction, and to be positioned perpendicular to the second OIS magnet 476 and the third OIS magnet 478 .

In an embodiment, the guide member 440 may include a third magnet seating part 441 on which the first OIS magnet 474 is mounted. For example, the third magnet seating portion 441 may extend from the edge portion of the -x-axis direction of the second carrier 450 toward the first carrier 430 at a designated height. The first OIS magnet 474 may be fixedly disposed on the third magnet seating part 441 . The first OIS magnet 474 electromagnetically interacts with the first OIS coil (eg, the first OIS coil 473 of FIGS. 6A to 7B ) to move the guide member 440 to the first shift axis S1 . A driving force for moving in the direction may be generated. The first OIS magnet 474 may be formed such that regions having different polarities are arranged along the first shift axis S1 direction. For example, the first OIS magnet 474 may have at least three polarities. The shape of the first OIS magnet 474 will be described below with reference to FIG. 24 .

In an embodiment, a second opening 442 aligned with the lens assembly 421 in the optical axis L direction may be formed in the guide member 440 . The second opening 442 may be aligned with the first opening 434 in the optical axis L direction.

According to the embodiments disclosed in this document, the camera module 400 performs an image stabilization function by moving the lens assembly 421 in the first shift axis S1 direction and/or the second shift axis S2 direction (eg, : Lens shift OIS) is possible. For example, movement in the first shift axis S1 direction of the lens assembly 421 may be performed by movement of the guide member 440 , and movement in the second shift axis S2 direction of the lens assembly 421 may be This may be performed by movement of the first carrier 430 . The camera module 400 may compensate for the shake by relatively moving the lens assembly 421 with respect to an image sensor (eg, the image sensor 482 of FIGS. 6A to 7B ).

In an embodiment, the second carrier 450 may accommodate at least a portion of the lens assembly 421 , the first carrier 430 , and the guide member 440 therein. A guide member 440 may be disposed on the second carrier 450 to be movable in the direction of the first shift axis S1 .

In an embodiment, the second carrier 450 may move the lens assembly 421 , the first carrier 430 , and the guide member 440 in the optical axis L direction. For example, the second carrier 450 may be configured to move in the optical axis (L) direction with respect to the frame 413 of the camera housing 410 . When the second carrier 450 moves in the optical axis L direction inside the frame 413 , the lens assembly 421 , the first carrier 430 , and the guide member 440 move together with the second carrier 450 . It can move in the direction of the optical axis (L). As described above with reference to FIGS. 6A and 6B , as the second carrier 450 moves in the optical axis L direction, the image sensor 482 and the lens assembly 421 fixed to the lower portion of the frame 413 . The distance between them can be changed, and the focal length can be adjusted.

In an embodiment, the second carrier 450 may include a plurality of sidewalls 451 , 452 , 453 , and 454 surrounding at least a portion of the first carrier 430 and the guide member 440 . The plurality of sidewalls 451 , 452 , 453 , 454 is a fifth sidewall 451 on which the AF magnet 472 and the first ball 492 are disposed, the first OIS magnet 474 is the second carrier 450 outside A sixth sidewall 452 on which a fifth opening region 4521 is formed so as to be exposed to the The sidewall 453 and the third OIS magnet 478 may include an eighth sidewall 454 in which a seventh opening region 4541 is formed to be exposed to the outside of the second carrier 450 . Based on the drawing, the fifth sidewall 451 faces the +x-axis direction, the sixth sidewall 452 faces the -x-axis direction, the seventh sidewall 453 faces the +y-axis direction, and the eighth sidewall ( 454) may face the -y-axis direction.

In an embodiment, the AF magnet 472 may be fixedly disposed on the fifth sidewall 451 of the second carrier 450 . The AF magnet 472 electromagnetically interacts with the AF coil (eg, the AF coil 471 of FIGS. 6A to 7B ) to generate a driving force for moving the second carrier 450 in the optical axis (L) direction. can cause The AF magnet 472 may be formed such that two polar regions having different polarities are arranged along the optical axis L direction.

In an embodiment, a third opening 455 aligned with the lens assembly 421 in the optical axis L direction may be formed in the second carrier 450 . The third opening 455 may be aligned with the first opening 434 and the second opening 442 in the optical axis L direction. For example, the lens assembly 421 may face the image sensor 482 through the first opening 434 , the second opening 442 , and the third opening 455 . Light passing through the lens assembly 421 may be incident on the image sensor 482 through the first opening 434 , the second opening 442 , and the third opening 455 .

In an embodiment, the stopper 460 may be coupled to the second carrier 450 . The stopper 460 may prevent the first carrier 430 and the guide member 440 from being separated from the inside of the second carrier 450 when the guide member 440 moves. For example, the stopper 460 may be coupled to the second carrier 450 to overlap a portion of the first carrier 430 .

In one embodiment, the stopper 460 includes a base portion 461 in which an opening 4611 is formed, an extension portion 462 extending vertically from the base portion 461 toward the second carrier 450, and a base portion ( It may include an elastic portion 463 disposed at the corner portion of 461 . The base portion 461 may overlap the first carrier 430 , the guide member 440 , and the second carrier 450 in the optical axis L direction. The extended portion 462 may be coupled to the sidewalls 451 , 452 , 453 , 454 of the second carrier 450 . For example, a locking groove 464 may be formed in the extension portion 462 , and the locking protrusion formed on the seventh sidewall 453 and the eighth sidewall 454 of the second carrier 450 in the locking groove 464 . 457 may be engaged. However, the coupling structure of the stopper 460 is not limited thereto.

According to the embodiments disclosed in this document, the stopper 460 may form a damping structure together with the first carrier 430 . The damping structure formed by the stopper 460 and the first carrier 430 absorbs shock and prevents shaking and vibration when the first carrier 430 and/or the second carrier 450 moves in the image stabilization operation. can be reduced. A damping structure between the stopper 460 and the first carrier 430 will be described below with reference to FIGS. 12 to 15 .

Hereinafter, a ball guide structure for guiding the movement of the first carrier 430 and the guide member 440 will be described with reference to FIGS. 9A, 9B and 10 . for example. 10 (a) is a perspective view of the first carrier 430 and the guide member 440 viewed from the +z-axis direction, FIG. 10 (b) is the first carrier 430 and the guide member 440 - It may be a perspective view viewed from the z-axis direction.

9A, 9B and 10 , the lens unit 420 includes one or more second balls 493 and the guide member 440 disposed between the first carrier 430 and the guide member 440 . one or more third balls 494 disposed between the carriers 450 . For example, the second ball 493 may be referred to as a first guide ball that guides the movement of the second shift axis S2 of the first carrier 430 , and the third ball 494 is the guide member 440 . It may be referred to as a second guide ball for guiding the movement of the first shift axis S1.

In one embodiment, the second ball 493 is disposed between the first carrier 430 and the guide member 440 , the second shift axis S2 of the first carrier 430 with respect to the guide member 440 . It can guide movement. A third recess 433 in which at least a portion of the second ball 493 is accommodated may be formed in the first carrier 430 . A fourth recess 443 aligned with the third recess 433 in the optical axis L direction may be formed in the guide member 440 . For example, the third recess 433 may be formed on the lower surface of the first carrier 430 to face the -z-axis direction, and the fourth recess 443 is guided to face the +z-axis direction. It may be formed on the upper surface of the member 440 . The third recess 433 and the fourth recess 443 may form a space (eg, a first receiving groove) in which the second ball 493 is accommodated. For example, the third recess 433 and the fourth recess 443 may be formed in a number corresponding to the number of the second balls 493 . The third recess 433 and the fourth recess 443 may be formed to extend by a predetermined length in the second shift axis S2 direction.

In an embodiment, the second ball 493 may be configured to roll in a space (eg, a first receiving groove) between the third recess 433 and the fourth recess 443 . For example, when the first carrier 430 moves in the direction of the second shift axis S2 with respect to the guide member 440 , the second ball 493 moves into the third recess 433 and the fourth recess ( S2 ). 443) while linearly moving in the direction of the second shift axis S2 in the space between them, or may rotate in place.

In one embodiment, the third ball 494 is disposed between the second carrier 450 and the guide member 440 , the first shift axis S1 of the guide member 440 with respect to the second carrier 450 . It can guide movement. A fifth recess 444 in which at least a portion of the third ball 494 is accommodated may be formed in the guide member 440 . A sixth recess 459 aligned with the fifth recess 444 in the optical axis L direction may be formed in the second carrier 450 . For example, the fifth recess 444 may be formed on the lower surface of the guide member 440 to face the -z-axis direction, and the sixth recess 459 may be formed to face the second in the +z-axis direction. It may be formed on the upper surface of the carrier 450 . The fifth recess 444 and the sixth recess 459 may form a space (eg, a second receiving groove) in which the third ball 494 is accommodated. For example, the fifth recess 444 and the sixth recess 459 may be formed in a number corresponding to the number of the third balls 494 . The fifth recess 444 and the sixth recess 459 may be formed to extend by a predetermined length in the direction of the first shift axis S1 .

In an embodiment, the third ball 494 may be configured to roll in a space (eg, a second receiving groove) between the fifth recess 444 and the sixth recess 459 . For example, when the guide member 440 moves in the direction of the first shift axis S1 with respect to the second carrier 450 , the third ball 494 moves into the fifth recess 444 and the sixth recess ( S1 ). 459) while linearly moving in the direction of the first shift axis S1 in the space between them, or may rotate in place.

11 illustrates an image stabilization function of a camera module according to an embodiment.

11 may be a view in which the cover 411 , the lens assembly 421 , and the sensor assembly 480 are omitted.

Referring to FIG. 11 , the camera module 400 according to an embodiment may include a frame 413 and a lens unit 420 at least partially disposed inside the frame 413 .

In an embodiment, the lens unit 420 may include a lens carrier 422 and a stopper 460 . The lens carrier 422 may include a first carrier 430 , a guide member 440 , and a second carrier 450 . Although not shown, a lens assembly 421 may be fixedly disposed on the first carrier 430 of the lens carrier 422 (eg, see FIG. 8 ), and an image sensor 482 is included at a lower portion of the frame 413 . The sensor assembly 480 may be fixedly disposed (eg, see FIG. 5 ).

The camera module 400 according to an embodiment, the first carrier 430 and / or the guide member 440 to the optical axis (L) with respect to the relatively fixed frame 413 and the second carrier 450 . It may be configured to move in a substantially vertical direction. Accordingly, the camera module 400 moves the lens assembly 421 (eg, the lens 425) relative to the image sensor 482 in response to the shaking of the electronic device 300 or the camera module 400 on the optical axis L ) can be corrected by moving in a direction substantially perpendicular to the

Hereinafter, when the image stabilization function is performed, each component of the lens carrier 422 having different degrees of freedom (eg, the first carrier 430 , the guide member 440 , the second carrier 450 ) A relatively moving operation will be described.

In an embodiment, the camera module 400 moves the first carrier 430 to which the lens assembly 421 is coupled in at least one direction of the first shift axis S1 and the second shift axis S2 to obtain an image. It can perform stabilization function. The first shift axis S1 and the second shift axis S2 may be substantially perpendicular to the optical axis L. The first shift axis S1 and the second shift axis S2 may be perpendicular to each other. For example, based on the drawing, the optical axis L may be parallel to the z-axis, the first shift axis S1 may be parallel to the y-axis, and the second shift axis S2 may be parallel to the x-axis.

In an embodiment, the camera module 400 may perform the first OIS driving for moving the lens assembly 421 in the first shift axis S1 direction.

In an embodiment, the camera module 400 may be configured such that the first carrier 430 moves in the first shift axis S1 direction with respect to the second carrier 450 together with the guide member 440 . For example, the first carrier 430 may move together with the guide member 440 when the guide member 440 moves in the direction of the first shift axis S1 with respect to the second carrier 450 . Although not shown, the camera module 400 is a first OIS magnet disposed on the guide member 440 (eg, the first OIS magnet 474 of FIGS. 9A and 9B ) and a first disposed on the frame 413 ). The guide member 440 may be relatively moved with respect to the second carrier 450 using an OIS coil (eg, the first OIS coil 473 of FIGS. 9A and 9B ).

In an exemplary embodiment, when the guide member 440 moves in the direction of the first shift axis S1 together with the first carrier 430 , the third ball 494 moves between the second carrier 450 and the guide member 440 . ) may guide the movement of the guide member 440 while rotating and / or moving between. When the guide member 440 and the first carrier 430 move together, the second ball 493 may not rotate and/or move between the guide member 440 and the first carrier 430 .

In an embodiment, the camera module 400 may perform the second OIS driving to move the lens assembly 421 in the second shift axis S2 direction.

In an embodiment, the camera module 400 may be configured such that the first carrier 430 moves in the second shift axis S2 direction with respect to the guide member 440 and the second carrier 450 . For example, when the first carrier 430 moves in the second shift axis S2 direction, the guide member 440 does not move together with the first carrier 430 in the second shift axis S2 direction, It may be separated from the movement of the first carrier 430 . Although not shown, the camera module 400 includes a second OIS magnet and a third OIS magnet disposed on the first carrier 430 (eg, the second OIS magnet 476 and the third OIS magnet of FIGS. 9A and 9B ). 478) and the second OIS coil and the third OIS coil (eg, the second OIS coil 475 and the third OIS coil 477 of FIGS. 9A and 9B) disposed on the frame 413). 1 The carrier 430 may be moved relative to the guide member 440 .

In one embodiment, the guide member 440 may have one axis of freedom to move in the direction of the first shift axis S1 with respect to the second carrier 450 , and the first carrier 430 may have the second carrier 450 . ) may have two degrees of freedom to move in the first shift axis S1 direction and the second shift axis S2 direction. As the first carrier 430 can move in two axial directions perpendicular to each other, when the first carrier 430 moves in the second shift axis S2 direction in the OIS operation, the A movement in the direction of the first shift axis S1 may be generated together. For example, as the distance that the first carrier 430 moves in the first shift axis S1 direction increases, the first carrier 430 determined using the magnetic flux density of a magnet disposed on the first carrier 430 is A predetermined error may occur in the second shift axis S2 direction position information.

The camera module 400 according to the embodiments disclosed in this document includes two driving magnets (eg, a second OIS magnet 476 and a third OIS magnet 478) disposed on both sides of the first carrier 430 ). By using the first carrier 430 to move in the direction of the second shift axis S2, the movement of the first carrier 430 can be more precisely controlled. In addition, according to various embodiments, the occurrence of an error may be reduced by detecting the position information in the direction of the second shift axis S2 of the first carrier 430 based on the sum of the magnetic flux densities of each of the two magnets.

In one embodiment, when the first carrier 430 moves in the direction of the second shift axis S2 with respect to the guide member 440 , the second ball 493 is formed between the first carrier 430 and the guide member 440 . ) may guide the movement of the first carrier 430 while rotating and / or moving between. When the first carrier 430 moves relative to the guide member 440 , the third ball 494 may not rotate and/or move between the guide member 440 and the second carrier 450 . Accordingly, when the first carrier 430 moves, the guide member 440 may be relatively fixed together with the second carrier 450 .

In one embodiment, the lens carrier 422 includes a second ball 493 and a third ball 494, so that the first carrier 430, the guide member 440 and the second carrier (440) having different degrees of freedom. 450) can provide rolling friction between them. For example, the third ball 494 includes the guide member 440 by being seated on the upper portion (eg, in the +z-axis direction) of the second carrier 450 , thereby forming the guide member 440 and the second carrier 450 . Each can be kept in contact. The second ball 493 may maintain contact with the first carrier 430 and the guide member 440 by the first carrier 430 being seated on the upper portion of the guide member 440 , respectively.

12 illustrates a first carrier and a stopper of a lens unit according to an embodiment. 13 illustrates a damping structure of a camera module according to an embodiment.

13 may be a view in which the cover 411 , the lens assembly 421 , and the sensor assembly 480 are omitted.

12 and 13 , the camera module 400 according to an embodiment includes a frame 413 , a first carrier 430 , a guide member 440 , a second carrier 450 , and a stopper 460 . may include.

In an embodiment, the camera module 400 may be configured such that a damping structure is formed in the lens unit 420 . For example, when the first carrier 430 and/or the guide member 440 moves inside the second carrier 450, the lens unit 420 reduces shaking and/or vibration of a high frequency band, and reduces the impact. A damping structure (eg, the first protrusion 465 and the first damping member 495 ) may be formed between the first carrier 430 and the stopper 460 to absorb it. For example, the high frequency band may be a frequency band of about 20 Hz or more, but is not limited thereto. In various embodiments, the shaking in the high frequency band may mean a shaking having a higher frequency than a shaking (eg, about 10 Hz) caused by hand shaking that occurs when a user takes a picture using the camera module 400 .

In an embodiment, the first carrier 430 may include a first receiving portion 435 in which the first damping member 495 is disposed. The first receiving portion 435 may be formed at a corner portion of the first carrier 430 . For example, the first accommodating portion 435 may be formed by recessing a partial region of a corner portion of the first carrier 430 in the optical axis (L) direction. The first accommodating part 435 may be formed in plurality.

In an embodiment, a first damping member 495 may be disposed inside the first accommodating part 435 . For example, the first damping member 495 may be formed of a material having predetermined viscoelasticity and/or fluidity, and may be filled in the first accommodating part 435 . In various embodiments, the first damping member 495 may be formed by filling the first accommodating part 435 with a liquid material having a predetermined viscosity and then curing (eg, UV curing or thermal curing). In various embodiments, the first damping member 495 may include a resin material (eg, silicone) in the form of gel or sol. However, the material and method of forming the first damping member 495 are not limited to the above-described example.

In an embodiment, the stopper 460 may include a first protrusion 465 at least a portion of which is disposed inside the first damping member 495 . The first protrusion 465 may be aligned with the first receiving portion 435 of the first carrier 430 in the optical axis (L) direction. The first protrusion 465 may extend from the base portion 461 toward the first carrier 430 . For example, the first protrusion 465 may extend from an inner edge of the base portion 461 surrounding the opening 4611 toward the first carrier 430 . The first protrusion 465 and the first accommodating part 435 may overlap in the optical axis L direction. For example, when the stopper 460 is coupled to the second carrier 450 , at least a portion of the first protrusion 465 may be configured to be positioned inside the first receiving portion 435 . The number of the first protrusions 465 may correspond to the number of the first accommodating parts 435 and the first damping members 495 .

In an embodiment, at least a portion of the first protrusion 465 is disposed inside the first damping member 495, and the first carrier 430 and the stopper ( 460) can reduce excessive movement and vibration between the For example, the first protrusion 465 may be fitted into the first damping member 495 , or at least a portion of the first protrusion 465 may be bonded to the first damping member 495 with a predetermined strength. In various embodiments, the coupling of the first protrusion 465 and the first damping member 495 may be performed in a state in which a portion of the first protrusion 465 is immersed in the liquid material filled in the first accommodating part 435 . It can be implemented by curing the

According to the embodiments disclosed in this document, the first carrier 430 is movable between the second carrier 450 and the stopper 460 in the first shift axis S1 direction and the second shift axis S2 direction. can For example, the first carrier 430 may move in the direction of the first shift axis S1 together with the guide member 440 and may move in the direction of the second shift axis S2 separately from the guide member 440 . . As the first damping member 495 is formed of a material having viscoelasticity, the first carrier 430 is configured to be movable with respect to the stopper 460 when the OIS is driven, and high-frequency noise (eg: vibration or shaking having a frequency of about 20 Hz or higher), and external shocks can be mitigated. For example, the first damping member 495 may include the lens unit 420 ( For example, vibration of the first carrier 430 and/or the guide member 440 may be suppressed. However, the high-frequency noise is not limited to the above-described example.

14 illustrates a first carrier and a stopper of a lens unit according to an embodiment. 15 illustrates a damping structure of a camera module according to an embodiment.

15 may be a view in which the cover 411, the lens assembly 421, and the sensor assembly 480 are omitted.

14 and 15 , the camera module 400 according to an embodiment includes a frame 413 , a first carrier 430 , a guide member 440 , a second carrier 450 , and a stopper 460 . may include.

14 and 15 may be diagrams of an embodiment in which the structure of the stopper 460 is changed compared to the camera module 400 shown in FIGS. 12 and 13 . For example, the stopper 460 of FIGS. 14 and 15 and the stopper 460 of FIGS. 12 and 13 may have different positions of the first protrusions. Hereinafter, overlapping descriptions will be omitted, and the changed parts will be mainly described.

In one embodiment, the stopper 460 has a base portion 461 having an opening 4611 formed therein, an extension portion 462 extending vertically from an outer rim of the base portion 461 and adjacent to the opening 4611 . It may include an elastic portion 463 disposed at a corner portion of the base portion 461 to do so. The elastic part 463 may be disposed to penetrate the base part 461 in the optical axis L direction (eg, the z-axis direction). The elastic portion 463 may include a material having elasticity, for example, elastomer or rubber.

In one embodiment, the elastic portion 463 may be aligned with the first receiving portion 435 in the optical axis (L) direction. For example, the elastic portion 463 may be disposed on the base portion 461 to overlap the first receiving portion 435 in the optical axis (L) direction. The elastic portion 463 may be formed in a number corresponding to the number of the first accommodating portion 435 and the first damping member 495 .

In an embodiment, the elastic portion 463 may include a head portion 463a and a first protrusion portion 463b extending from the head portion 463a. At least a portion of the first protrusion 463b may be accommodated in the first damping member 495 . For example, when the stopper 460 is coupled to the second carrier 450 , at least a portion of the first protrusion 463b may be configured to be positioned inside the first receiving portion 435 .

In one embodiment, as the first protrusion 463b is formed of a material having elasticity, when movement occurs between the first carrier 430 and the stopper 460 , the shape is in a state accommodated in the first damping member 495 . It can move as it changes. For example, even if the movement of the first carrier 430 is large or an external impact is strongly applied, the first protrusion 463b may be flexibly deformed to provide a damping function.

In an embodiment, the head part 463a may provide a cushioning function between the cover 411 and the stopper 460 of the camera housing 410 . For example, when the lens unit 420 moves in the optical axis (L) direction inside the camera housing 410 , the head portion 463a of the elastic portion 463 comes into contact with the cover 411 to absorb shock or can be alleviated

16 is a plan view of a camera module according to an exemplary embodiment. 17 is a cross-sectional view of a camera module according to an embodiment.

FIG. 17 shows a cross-section A-A' of the camera module 400 shown in FIG. 16 .

16 and 17 may be views in which the cover 411 of the camera module 400 is omitted.

16 and 17 , the camera module 400 according to an embodiment may include a frame 413 and a lens unit 420 disposed inside the frame 413 . The lens unit 420 may include a lens assembly 421 , a first carrier 430 , a guide member 440 , a second carrier 450 , and a stopper 460 .

16 and 17 show a damping structure of the lens unit 420 as one surface of the stopper 460 comes into contact with the first damping member 495 compared to the lens unit 420 shown in FIGS. 12 to 15 . It may be a drawing for an embodiment in which is formed. Hereinafter, overlapping descriptions will be omitted, and the changed parts will be mainly described.

In an embodiment, the lens assembly 421 may be configured to move the first carrier 430 and/or the guide member 440 in a space between the stopper 460 and the second carrier 450 . The first carrier 430 and the guide member 440 may be disposed between the stopper 460 and the second carrier 450 . The guide member 440 may be disposed between the first carrier 430 and the second carrier 450 .

In an embodiment, a first damping member 495 may be disposed in the first accommodating part 435 of the first carrier 430 . The first damping member 495 may be positioned between the first carrier 430 and the stopper 460 . For example, the first damping member 495 may overlap at least a portion of the stopper 460 in the optical axis L direction.

In one embodiment, the stopper 460 may be coupled to the second carrier 450 to overlap at least a portion of the first carrier 430 in the optical axis (L) direction. At least a portion of the lens assembly 421 may be accommodated in the opening 4611 of the stopper 460 . For example, the opening 4611 may pass through the first surface 461a and the second surface 461b of the stopper 460 in the optical axis L direction. The first surface 461a of the stopper 460 is a surface facing the first carrier 430 (eg, a surface facing the -z-axis direction), and the second surface 461b is opposite to the first surface 461a. It may be a face facing (eg, a face facing the +z-axis direction).

In an embodiment, the first surface 461a of the stopper 460 may partially contact the first damping member 495 . For example, the stopper 460 may be disposed such that at least a portion of the first surface 461a is in close contact with the first damping member 495 . The first damping member 495 may provide a damping function by being in close contact with the first surface 461a of the stopper 460 .

In an embodiment, a hole 466 overlapping the first damping member 495 may be formed in the stopper 460 . For example, the hole 466 may overlap a portion of the first damping member 495 in the optical axis L direction. 16 , when the second surface 461b of the stopper 460 is viewed from above, at least a portion of the first damping member 495 may be exposed through the hole 466 .

According to the embodiment illustrated in FIG. 17A , the first damping member 495 may contact a partial region of the first surface 461a adjacent to the hole 466 . The first damping member 495 may reduce excessive movement and vibration of the first carrier 430 by contacting the first surface 461a and absorb external shock. In various embodiments, the first damping member 495 may be formed by filling the first accommodating part 435 with a viscous liquid material and then curing it while in contact with a portion of the first surface 461a. . Accordingly, the first damping member 495 may be bonded to the first surface 461a of the stopper 460 with a predetermined strength.

According to the embodiment shown in FIG. 17B , at least a portion of the first damping member 495 may be accommodated in the hole 466 . The first damping member 495 is in contact with the first surface 461a and is filled in the hole 466 , thereby reducing excessive movement and vibration of the first carrier 430 and absorbing external shock. . In various embodiments, the first damping member 495 may be formed by curing a viscous liquid material in a state in which the first accommodating part 435 and the hole 466 are filled. Accordingly, the first damping member 495 may be bonded to the first surface 461a of the stopper 460 and the inner surface of the hole 466 with a predetermined strength.

In various embodiments, the camera module 400 includes a damping member (eg, the second damping member 496 of FIG. 18 ) disposed between the frame 413 of the camera housing 410 and the stopper 460 of the lens unit 420 . )) may be further included. For example, the damping structure (eg, the first damping member 495 ) described with reference to FIGS. 12 to 17 is a structure provided inside the lens unit 420 and corresponds to the image stabilization function of the first carrier 430 . ) and/or the guide member 440 may exert a damping effect on the moving motion. The damping structure (eg, the second damping member 496 ) provided between the camera housing 410 and the lens unit 420 corresponds to the autofocus function of the second carrier 450 (or the entire lens unit 420 ). ) can exert a damping effect on the movement of the optical axis (L) in the direction.

Hereinafter, a damping structure provided between the camera housing 410 and the lens unit 420 will be described with reference to FIGS. 18 to 23 .

18 illustrates a frame of a camera module according to an embodiment.

Referring to FIG. 18 , the camera module 400 according to an embodiment includes a frame 413 , a flexible substrate 479 disposed to surround the frame 413 , and a flexible substrate 479 to face the inside of the frame 413 . ) and a damping member (eg, a second damping member 496 and a third damping member 497) disposed on the sidewalls 414 and 417 of the frame 413 ). can

In an embodiment, the frame 413 includes a first sidewall 414 on which the AF coil 471 is disposed, a second sidewall 415 facing the first sidewall 414, a first sidewall 414 and a second It may include a third sidewall 416 and a fourth sidewall 417 connecting both ends of the sidewall 415 , respectively. The third sidewall 416 may face the fourth sidewall 417 , and a third OIS coil 477 may be disposed on the fourth sidewall 417 .

In an embodiment, the flexible substrate 479 may include a first portion 479a on which the AF coil 471 is disposed, a fourth portion 479d vertically extending from the first portion 479a, and a fourth portion 479d. It may include a second part 479b extending vertically from the , and a third part 479c extending vertically from the second part 479b. The first sensor 499a may be disposed in the first portion 479a to be surrounded by the AF coil 471 . A third OIS coil 477 and a third sensor 499c may be disposed in the fourth portion 479d.

In an embodiment, a third damping member 497 may be disposed on the first sidewall 414 of the frame 413 , and a second damping member 496 may be disposed on the third sidewall 416 and the fourth sidewall 417 . can be placed.

In an embodiment, the frame 413 may have a second receiving part 419 in which the second damping member 496 is disposed on the third sidewall 416 and the fourth sidewall 417 . The second accommodating part 419 may be formed by depression of a portion of inner surfaces of the third sidewall 416 and the fourth sidewall 417 .

In an embodiment, a plurality of second accommodating parts 419 may be formed on each of the third sidewall 416 and the fourth sidewall 417 . For example, the second accommodating part 419 may include a 2-1 accommodating part 419b formed on the third sidewall 416 and a 2-2 th accommodating part 419a formed on the fourth sidewall 417 . may include The second accommodating part 419 may be formed to be positioned on both sides with respect to the coils disposed on the third sidewall 416 and the fourth sidewall 417 . For example, the 2-2 accommodating portions 419a formed on the fourth sidewall 417 may be configured to be positioned on both sides of the third OIS coil 477 as the center. The 2-1 accommodating part 419b and the 2-2 th accommodating part 419a may be symmetrical. For example, in the second accommodating part 419 , the 2-1 accommodating part 419b and the 2-2 accommodating part 419a are symmetrical with respect to the first sidewall 414 and the second sidewall 415 . can be configured to achieve. However, the number and/or location of the second accommodating part 419 is not limited to the illustrated embodiment.

In an embodiment, the second damping member 496 may be fixedly disposed in the second receiving part 419 . For example, a portion of the second damping member 496 may be accommodated in the second accommodating part 419 to face the inside of the frame 413 . The second damping member 496 may be formed of the same or similar material/method as the first damping member 495 described with reference to FIGS. 12 to 17 .

In an embodiment, the third damping member 497 may be positioned on the first sidewall 414 of the frame 413 . The third damping member 497 may be disposed inside the AF coil 471 positioned on the first sidewall 414 . For example, the third damping member 497 may be accommodated in the AF coil 471 such that at least a part thereof is surrounded by the AF coil 471 . Like the second damping member 496 , the third damping member 497 may be formed of the same or similar material/method as the first damping member 495 described with reference to FIGS. 12 to 17 .

In an embodiment, the third damping member 497 may overlap the first sensor 499a positioned inside the AF coil 471 . The third damping member 497 may be bonded to the first portion 479a of the flexible substrate 479 and the AF coil 471 with a predetermined strength. For example, in the third damping member 497 , in a state in which the AF coil 471 and the first sensor 499a are mounted on the first portion 479a of the flexible substrate 479 , the liquid material having viscosity is AF After being filled in the coil 471, it may be formed by curing. However, the method of forming the third damping member 497 is not limited to the above-described example.

19A is a plan view of a camera module according to an exemplary embodiment. 19B is a cross-sectional view of a camera module according to an embodiment.

19B shows a cross-section B-B' of the camera module 400 shown in FIG. 19A.

19A may be a view in which the cover 411 of the camera housing 410 is omitted. 19B may be a view in which the sensor assembly 480 of the camera module 400 is omitted.

19A and 19B , the camera module 400 according to an embodiment includes a camera housing 410 , a lens unit 420 , and a second damping member 496 (eg, the second damping member ( 496)) may be included.

In an embodiment, the camera housing 410 may include a cover 411 and a frame 413 forming a space in which the lens unit 420 is accommodated. A second damping member 496 may be disposed on a portion of the sidewall of the frame 413 .

In an embodiment, at least a portion of the lens unit 420 may be accommodated in the camera housing 410 . The lens unit 420 may be movable in the optical axis (L) direction inside the camera housing 410 . For example, the lens unit 420 moves in the optical axis (L) direction with respect to the optical axis (L) frame 413 through the ball guide structure in which the second carrier 450 includes the first ball 492 . can be configured to The lens assembly 421 , the first carrier 430 , the guide member 440 , and the stopper 460 may move together with the second carrier 450 .

In an embodiment, the second damping member 496 may be disposed between the frame 413 of the camera housing 410 and the stopper 460 of the lens unit 420 . The second damping member 496 may be fixedly disposed on the third sidewall 416 and the fourth sidewall 417 of the frame 413 . The second damping member 496 may be in contact with the lens unit 420 accommodated in the frame 413 . For example, the second damping member 496 may contact a portion of the stopper 460 of the lens unit 420 .

In an embodiment, at least a portion of the second damping member 496 may be accommodated in the second accommodating part 419 . The second damping member 496 may be positioned between the second accommodating portion 419 formed on the third sidewall 416 and the fourth sidewall 417 and the extended portion 462 of the stopper 460 . For example, the extended portion 462 may be spaced apart from the third sidewall 416 and the fourth sidewall 417 at a specified distance, and the second damping member 496 may be spaced apart from the extended portion 462 and the third sidewall 417. 416 ) (or the second accommodating part 419 ) and between the extended part 462 and the fourth sidewall 417 (or the second accommodating part 419 ). The second damping member 496 may be formed to have a predetermined thickness so that both surfaces of the second damping member 496 are in close contact with the second accommodating portion 419 and the extended portion 462 .

According to the embodiments disclosed in this document, the second damping member 496 may provide a damping function between the camera housing 410 and the lens unit 420 . For example, the second damping member 496 reduces high-frequency noise and shake generated during an operation (eg, AF driving) in which the lens unit 420 moves in the optical axis L direction with respect to the camera housing 410 . And it is possible to alleviate the impact applied from the outside.

20 is a cross-sectional view of a camera module according to an embodiment.

FIG. 20 shows a cross-section C-C' of the camera module 400 shown in FIG. 19A .

Referring to FIG. 20 , the camera module 400 according to an embodiment includes a camera housing 410 , a lens unit 420 , and a third damping member 497 (eg, the third damping member 497 of FIG. 18 ). ) may be included.

In an embodiment, the camera housing 410 may include a cover 411 and a frame 413 .

In an embodiment, the frame 413 may include a first sidewall 414 on which the first portion 479a of the flexible substrate 479 is disposed. A first opening region 4141 in which the AF coil 471 is positioned may be formed on the first sidewall 414 . The AF coil 471 disposed on the first portion 479a of the flexible substrate 479 may face the AF magnet 472 disposed inside the frame 413 through the first opening area 4141 .

In an embodiment, the lens unit 420 may include a lens assembly 421 , a first carrier 430 , a guide member 440 , a second carrier 450 , and a stopper 460 .

In an embodiment, the AF magnet 472 may be disposed on the second carrier 450 . For example, among the sidewalls of the second carrier 450, a fifth sidewall 451 facing the first sidewall 414 of the camera housing 410 (eg, frame 413) has an AF magnet 472. This can be placed For example, the AF magnet 472 may face the AF coil 471 positioned on the first sidewall 414 (eg, the first opening area 4141 ) of the frame 413 . The AF magnet 472 and the AF coil 471 may be disposed to be spaced apart from each other. For example, the lens unit 420 and the frame 413 may be spaced apart at regular intervals to secure a space for relative movement. Referring to FIG. 19A together, the fifth sidewall 451 of the second carrier 450 and the first sidewall 414 of the frame 413 are spaced apart at regular intervals by a first ball 492 disposed therebetween. can be The AF magnet 472 and the AF coil 471 may be disposed to be spaced apart from each other in a space between the first sidewall 414 and the fifth sidewall 451 .

In an embodiment, the third damping member 497 may be disposed inside the AF coil 471 and may be in contact with the AF magnet 472 . The third damping member 497 may be in close contact with the AF magnet 472 while being disposed in close contact with the first portion 479a of the flexible substrate 479 and the AF coil 471 . As described with reference to FIG. 18 , the third damping member 497 may be bonded to the first portion 479a and the AF coil 471 with a predetermined strength.

According to the embodiments disclosed in this document, the third damping member 497 may provide a damping function between the camera housing 410 and the lens unit 420 . For example, the third damping member 497 comes into contact with the AF magnet 472 that moves in the optical axis L direction with respect to the AF coil 471 , so that the lens unit 420 moves the light with respect to the camera housing 410 . It is possible to reduce high-frequency noise and shake generated in an operation that moves in the axis (L) direction (eg, AF driving), and to alleviate an external shock.

21 is a plan view of a camera module according to an embodiment. 22 is a cross-sectional view of a camera module according to an embodiment.

22A shows a cross-section D-D' of the camera module 400 shown in FIG. 21 . 22B shows a cross-section E-E′ of the camera module 400 shown in FIG. 21 .

21 and 22 , the camera module 400 according to an exemplary embodiment includes a camera housing 410 , a lens unit 420 , and a second damping member 496 (eg, the second damping member of FIG. 18 ). (496)).

In an embodiment, the second damping member 496 may be disposed on the frame 413 of the camera housing 410 . For example, the second damping member 496 may be disposed on the third sidewall 416 and the fourth sidewall 417 of the frame 413 . At least a portion of the second protrusion 436 formed on the lens unit 420 may be accommodated in the second damping member 496 .

In an embodiment, the lens unit 420 may include a lens assembly 421 , a first carrier 430 , a guide member 440 , a second carrier 450 , and a stopper 460 .

In an embodiment, the first carrier 430 of the lens unit 420 may include a second protrusion 436 at least a portion of which is disposed inside the second damping member 496 . The second protrusion 436 may extend in a direction substantially perpendicular to the optical axis L from a portion of the first carrier 430 . For example, the second protrusion 436 may extend substantially parallel to the first sidewall 414 and the second sidewall 415 .

In an embodiment, the second protrusion 436 is formed from an edge (eg, an edge in the y-axis direction) facing the third sidewall 416 and the fourth sidewall 417 among the edges of the first carrier 430 . It may extend toward the third sidewall 416 and the fourth sidewall 417 . For example, the second protrusion 436 may include a 2-1 protrusion 436a extending from a first edge (eg, an edge oriented in the +y-axis direction) toward the third sidewall 416 of the first carrier 430 . ) and a second-second protrusion 436b extending from the second edge (eg, the edge in the -y-axis direction) toward the fourth sidewall 417 . The number of the second protrusions 436 may correspond to the number of the second damping members 496 . However, the number of the second protrusions 436 is not limited to the illustrated embodiment.

In one embodiment, the second protrusion 436 may extend from the first carrier 430 across the second carrier 450 to the second damping member 496 . For example, when the first carrier 430 is viewed from above with reference to FIG. 21 , the second protrusion 436 may overlap a portion of the second carrier 450 in the optical axis L direction.

In an embodiment, the second protrusion 436 may extend toward the second damping member 496 through at least a portion of the stopper 460 . For example, the second protrusion 436 may pass through the extension portion 462 of the stopper 460 (eg, the extension portion 462 of FIG. 19B ) in contact with the second damping member 496 . A through hole 468 into which at least a portion of the second protrusion 436 is inserted may be formed in the extension portion 462 . The second protrusion 436 may extend through the through hole 468 so that at least a portion thereof is disposed inside the second damping member 496 . According to various embodiments, the through hole 468 may be referred to as a locking groove (eg, the locking groove 464 of FIG. 8 ) for engaging the locking protrusion (eg, the locking protrusion 457 of FIG. 8 ). For example, the locking groove 464 may be formed to a predetermined size so that at least a portion of the second protrusion 436 is inserted, and the locking protrusion 457 is engaged with the locking groove 464 , and the second protrusion 436 may extend to the second damping member 496 through the locking groove 464 .

In one embodiment, at least a portion of the second protrusion 436 is disposed inside the second damping member 496 so that the first carrier 430 moves in the optical axis L direction with respect to the frame 413 , A damping function is provided in response to movement of the first carrier 430 in a first shift axis S1 direction and a second shift axis S2 direction substantially perpendicular to the optical axis L with respect to the frame 413 . can do. For example, the second protrusion 436 may be fitted into the second damping member 496 , or at least a portion of the second protrusion 436 may be bonded to the second damping member 496 with a predetermined strength.

According to the embodiments disclosed in this document, the second damping member 496 interacts with the second protrusion 436, so that the lens unit 420 (eg, the first carrier 430) moves to the camera housing 410 ( For example: in an operation moving in the optical axis L direction with respect to the frame 413 (eg, driving AF) and/or moving in a direction substantially perpendicular to the optical axis L (eg driving OIS) It is possible to reduce the generated high-frequency noise and shake, and to alleviate the shock applied from the outside.

23 illustrates a frame and a second carrier of a camera module according to an embodiment.

Referring to FIG. 23 , the camera module 400 according to an embodiment may include a frame 413 , a first carrier 430 , a second carrier 450 , and a fourth damping member 498 .

In an embodiment, a fourth damping member 498 may be disposed on the first sidewall 414 of the frame 413 . For example, a third accommodating part 4142 in which the fourth damping member 498 is disposed may be formed on the first sidewall 414 of the frame 413 . The third accommodating part 4142 may be formed by recessing a portion of an inner surface of the first sidewall 414 . For example, the third accommodating part 4142 may be formed in a region adjacent to the second recess 418 formed in the first sidewall 414 .

In an embodiment, the second carrier 450 may include a fourth protrusion 4511 , at least a portion of which is disposed inside the fourth damping member 498 . The fourth protrusion 4511 may extend from a portion of the second carrier 450 toward the first sidewall 414 of the frame 413 . For example, the fourth protrusion 4511 may protrude from the fifth sidewall 451 of the second carrier 450 facing the first sidewall 414 toward the first sidewall 414 by a predetermined length. . The fourth protrusion 4511 may be aligned with the third accommodating part 4142 formed on the first sidewall 414 in a direction substantially perpendicular to the optical axis L. For example, when the first sidewall 414 and the fifth sidewall 451 are viewed, the fourth protrusion 4511 may overlap the third accommodating portion 4142 . For example, the fourth protrusion 4511 may be fitted into the fourth damping member 498 , or at least a portion of the fourth protrusion 4511 may be bonded to the fourth damping member 498 with a predetermined strength.

In an embodiment, the fourth damping member 498 may be disposed between the frame 413 of the camera housing 410 and the second carrier 450 . The fourth damping member 498 may be fixedly disposed on the first sidewall 414 of the frame 413 . For example, the fourth damping member 498 may be accommodated in the third receiving portion 4142 formed in the first sidewall 414 . The fourth damping member 498 may be in close contact with the fourth protrusion 4511 of the second carrier 450 . The fourth damping member 498 may be formed of the same or similar material/method as the first damping member 495 described with reference to FIGS. 12 to 17 .

According to the embodiments disclosed in this document, the fourth damping member 498 may provide a damping function between the frame 413 of the camera housing 410 and the second carrier 450 of the lens unit 420 . For example, as the fourth damping member 498 interacts with the third protrusion 4511 , the second carrier 450 moves in the optical axis L direction with respect to the frame 413 (eg, AF). driving), it is possible to reduce high-frequency noise and vibration, and to mitigate the impact applied from the outside.

In various embodiments, damping members included in the camera module 400 (eg, the first damping member 495 , the second damping member 496 , the third damping member 497 , and/or the fourth damping member ( 498)) may have a first viscosity (or viscosity) in a cured state, wherein the first viscosity is a plurality of balls (eg, the first ball 492 , the second ball 493 and/or the second ball 493 ). 3 ball 494 ) is formed with recesses (eg, first recess 458 , second recess 418 , third recess 433 , fourth recess 443 , fifth recess (eg) 444) and/or the sixth recess 459) may be substantially equal to, or greater than, the second viscosity (or viscosity) of the material (eg, grease) that provides a rolling friction force for rolling within the sixth recess 459). have.

In various embodiments, damping members included in the camera module 400 (eg, the first damping member 495 , the second damping member 496 , the third damping member 497 , and/or the fourth damping member ( 498)) may be formed to have a specified viscosity (or viscosity). For example, the viscosity of the damping members 495 , 496 , 497 , and 498 may be about 75000 to 95000 mPa*s or less, but is not limited thereto.

In various embodiments, damping members included in the camera module 400 (eg, the first damping member 495 , the second damping member 496 , the third damping member 497 , and/or the fourth damping member ( 498)), at least a portion may be formed using a UV curable resin composition. Some of the damping members 495 , 496 , 497 , and 498 may be cured under conditions of a specified UV intensity and/or UV energy amount (UV radiation dose). For example, the amount of UV energy for curing some of the damping members 495 , 496 , 497 , and 498 may be about 4000 to 5400 mJ/cm 2 , but is not limited thereto. For example, the UV intensity irradiated to harden some of the damping members 495 , 496 , 497 , and 498 may be about 400 mW/cm 2 , but is not limited thereto. The amount of UV energy may be a value obtained by multiplying UV intensity by irradiation time (eg, UV energy amount (mJ/cm²) = UV intensity (mW/cm²) * irradiation time (sec)). For example, some of the damping members 495 , 496 , 497 , and 498 may be cured by irradiating 400 mW/cm 2 of UV for about 10 to 13.5 seconds (sec). However, the properties and/or curing conditions of the damping members 495 , 496 , 497 , and 498 are not limited to the above-described examples. According to various embodiments, the damping members 495 , 496 , 497 , and 498 may be formed using a thermosetting composition, and in consideration of the applicability of the manufacturing process and increase in yield, UV curing and thermal curing are performed. It may also be formed using a combined hybrid curing method.

24 illustrates a driving member of a camera module according to an exemplary embodiment.

Referring to FIG. 24 , the driving member 470 of the camera module 400 according to an embodiment may include a plurality of coils 470_c and a plurality of magnets 470_m disposed to face each other.

In an embodiment, at least one of the plurality of coils 470_c and the plurality of magnets 470_m is disposed on a fixing structure (eg, the camera housing 410 ). The other one may be disposed on a moving structure (eg, the lens unit 420 ) that moves relative to the fixed structure. 6A and 6B together, the plurality of coils 470_c may be disposed on the frame 413 of the camera housing 410 , and the plurality of magnets 470_m may be formed in the lens unit to face the plurality of coils 470_c. It may be disposed on the lens carrier 422 of 420 . However, the positions of the plurality of coils 470_c and the plurality of magnets 470_m are not limited to the above-described example and may be interchanged.

In an embodiment, the plurality of coils 470_c may include an AF coil 471 , a first OIS coil 473 , a second OIS coil 475 , and a third OIS coil 477 . The plurality of magnets 470_m may include an AF magnet 472, a first OIS magnet 474, a second OIS magnet 476, and a third OIS magnet 478 corresponding to the plurality of coils 470_c, respectively. have.

In one embodiment, the AF magnet 472 and the AF coil 471 direct the lens (eg, the second carrier 450 in FIGS. 9A and 9B ) to the optical axis L in relation to the autofocus function (eg, : in the direction parallel to the z-axis). For example, when a current is applied to the AF coil 471 , a magnetic force (eg, Lorentz force) may be applied to the AF coil 471 in a +z-axis direction or a -z-axis direction according to the direction of the current. As the AF coil 471 is relatively fixedly disposed, a force may act on the AF magnet 472 in a direction opposite to the direction of the Lorentz force. Accordingly, the AF magnet 472 may move in the z-axis direction with respect to the AF coil 471 .

In one embodiment, the first OIS magnet 474 and the first OIS coil 473 move the lens (eg, the guide member 440 of FIGS. 9A and 9B ) in relation to the image stabilization function to the optical axis (L). It may be moved in a direction (eg, a direction parallel to the y-axis) in a first shift axis perpendicular to (eg, the first shift axis S1 of FIG. 11 ). For example, when a current is applied to the first OIS coil 473 , a magnetic force (eg, Lorentz force) is applied to the first OIS coil 473 in the +y-axis direction or the -y-axis direction according to the direction of the current. can be As the first OIS coil 473 is relatively fixedly disposed, a force may act on the first OIS magnet 474 in a direction opposite to the direction of the Lorentz force. Accordingly, the first OIS magnet 474 may move in the y-axis direction with respect to the first OIS coil 473 .

In one embodiment, the second OIS magnet 476 , the second OIS coil 475 , the third OIS magnet 478 , and the third OIS coil 477 are connected to the lens (eg, FIG. 9A ) in relation to the image stabilization function function. and a second shift axis (eg, the second shift axis S2 of FIG. 11 ) perpendicular to the optical axis L and the first shift axis S1 (eg, the first carrier 430 of FIG. 9B ). in a direction parallel to the x-axis). For example, when a current is applied to the second OIS coil 475 and the third OIS coil 477 , the second OIS coil 475 and the third OIS coil 477 are applied in the +x-axis direction according to the direction of the current. Alternatively, a magnetic force (eg, Lorentz force) directed in the -x-axis direction may be applied. As the second OIS coil 475 and the third OIS coil 477 are relatively fixedly arranged, a force may be applied to the second OIS magnet 476 and the third OIS magnet 478 in a direction opposite to the direction of the Lorentz force. can Accordingly, the second OIS magnet 476 and the third OIS magnet 478 may move in the x-axis direction with respect to the second OIS coil 475 and the third OIS coil 477 , respectively.

In an embodiment, the camera module 400 may include sensors for detecting the relative positions between the plurality of coils 470_c and the plurality of magnets 470_m. The sensors may include a first sensor (eg, the first sensor 499a of FIG. 18 ), a second sensor 499b , and a third sensor 499c . The first sensor 499a may detect a change in position between the AF magnet 472 and the AF coil 471 . The second sensor 499b may detect a change in position between the first OIS magnet 474 and the first OIS coil 473 . The third sensor 499c may detect a change in position between the third OIS magnet 478 and the third OIS coil 477 .

According to the embodiments disclosed in this document, the camera module 400 includes at least two or more coils each of the OIS coils 473, 475, and 477 in order to improve a correction angle and/or correction performance in relation to an image stabilization function. can be configured to include. Accordingly, it may be possible to secure sufficient electromagnetic force to implement the movement of the lens assembly 421 . For example, the first OIS coil 473 may include a first coil 473a and a second coil 473b disposed to face the first OIS magnet 474 . The second OIS coil 475 may include a third coil 475a and a fourth coil 475b disposed to face the second OIS magnet 476 . The third OIS coil 477 may include a fifth coil 477a and a sixth coil 477b disposed to face the third OIS magnet 478 . However, the number of coils included in the OIS coils 473 , 475 and 477 is not limited to two, and may include three or more.

Hereinafter, arrangement of the OIS magnets 474 , 476 , 478 and OIS coils 473 , 475 and 477 having four polarizations will be described with reference to FIG. 24A . Although described based on the first OIS magnet 474 and the first OIS coil 473 , the contents to be described below are the second OIS magnet 476 , the second OIS coil 475 , and the third OIS magnet 478 . and the third OIS coil 477 may be equally applied.

In an embodiment, the first OIS magnet 474 may have four polarized surfaces facing the first OIS coil 473 . The opposite surface of the first OIS magnet 474 may be formed such that the N pole and the S pole are arranged in a direction parallel to the movement direction of the first OIS magnet 474 (eg, the y-axis direction). For example, the opposing surface may include a first region 4741 having a first polarity (eg, an N pole), a second region 4742 having a second polarity (eg, an S pole) different from the first polarity, and a first It may include a third region 4743 having a polarity and a fourth region 4744 having a second polarity. The first region 4741 to the fourth region 4744 may be arranged along the y-axis direction. However, the arrangement order of the N and S poles may be changed.

In an embodiment, the first OIS coil 473 may be configured such that the first coil 473a and the second coil 473b face a region having a first polarity and a region having a second polarity, respectively. . For example, the first coil 473a and the second coil 473b may overlap the opposite surface of the first OIS magnet 474 in the x-axis direction. When viewed in the x-axis direction, the first coil 473a may be disposed such that a portion overlaps the first area 4741 and the other portion overlaps the second area 4742 . When viewed in the x-axis direction, the second coil 473b may be disposed such that a portion overlaps the third region 4743 and the other portion overlaps the fourth region 4744 .

In an embodiment, the camera module 400 may include a second sensor 499b for detecting a relative position between the first OIS coil 473 and the first OIS magnet 474 . For example, the second sensor 499b may include a hall sensor configured to sense a magnetic field. The second sensor 499b may be disposed between the first coil 473a and the second coil 473b to face the opposite surface of the first OIS magnet 474 . The second sensor 499b may be disposed to partially overlap the region having the first polarity and the region having the second polarity. For example, when viewed in the x-axis direction, the second sensor 499b may overlap the second region 4742 and the third region 4743 . However, the position of the second sensor 499b is not limited to the illustrated embodiment. According to various embodiments, the second sensor 499b is positioned inside the first coil 473a to overlap the first region 4741 and the second region 4742 , or the third region 4743 and the fourth region It may be positioned inside the second coil 473b to overlap with the 4744 .

Hereinafter, the arrangement of the OIS magnets 474 , 476 , and 478 having three polarizations and the OIS coils 473 , 475 and 477 will be described with reference to FIG. 24B . Although described based on the first OIS magnet 474 and the first OIS coil 473 , the contents to be described below are the second OIS magnet 476 , the second OIS coil 475 , and the third OIS magnet 478 . and the third OIS coil 477 may be equally applied. For example, in the camera module 400, as the correction angle (eg, about 3° or more) for correcting shake caused by a large hand shake increases, the stroke of the lens shift for the image stabilization function becomes longer. and the driving force may be reduced by the damping structure for reducing high-frequency shaking and vibration. Accordingly, the camera module 400 may use a magnet having three or more polarizations in order to secure a driving force required for lens shift and smoothly process a signal for a moving distance.

In an embodiment, the first OIS magnet 474 may be formed in a polarized shape with three opposing surfaces facing the first OIS coil 473 . For example, the opposing surface may have a first region 4741 having a first polarity (eg, an N pole), a second region 4742 having a second polarity different from the first polarity (eg, an S pole), and a first A third region 4743 having a polarity may be included. In an embodiment, the second sensor 499b is disposed in an area overlapping the first area 4741 and the second area 4742 to detect a signal according to the movement of the first OIS magnet 474 in the y-axis direction. can For example, the signal detected by the second sensor 499b may be a magnetic flux density of the first OIS magnet 474 , and the first OIS magnet 474 may have the second sensor 499b. As it moves in the y-axis direction with respect to , the magnetic flux density detected by the second sensor 499b may vary. The camera module 400 is the y-axis of the first OIS magnet 474 (or the guide member 440 on which the first OIS magnet 474 is disposed) using the magnetic flux density detected by the second sensor 499b. It is possible to determine location information or movement information of a direction. However, the detection signal detected by the second sensor 499b is not limited to the magnetic flux density.

In an embodiment, the second sensor 499b may detect a relative position between the first OIS coil 473 and the first OIS magnet 474 based on the sensed signal. For example, based on a third signal corrected using a first signal detected from an area corresponding to the first area 4741 and a second signal detected from an area corresponding to the second area 4742 , the first The position of the OIS magnet 474 in the y-axis direction may be detected. For example, the third signal may be determined by dividing a value obtained by adding the first signal and the second signal by a difference value between the first signal and the second signal as shown in Equation 1 below. The contents related to Equation 1 below may be equally applied to the third sensor 499c and the third OIS magnet 478 .

According to various embodiments (not shown), a plurality of second sensors 499b may be disposed. For example, the second sensor 499b may include a second-first sensor positioned inside the first coil 473a and a second-second sensor positioned inside the second coil 473b. The camera module 400 includes a first OIS coil 473 and a first OIS based on signals sensed from each of the plurality of second sensors 499b (eg, a 2-1 sensor and a 2-2 sensor). The relative positions between the magnets 474 may be detected.

According to various embodiments, the camera module 400 may further include a fourth sensor (not shown) capable of detecting a change in position between the second OIS magnet 476 and the second OIS coil 475 . For example, the camera module 400 may include a signal detected by the third sensor 499c (eg, magnetic flux density of the third OIS magnet 478) and a signal detected by the fourth sensor (eg, the second OIS). x of the first carrier (eg, the first carrier 430 of FIGS. 8 to 11 ) on which the second OIS magnet 476 and the third OIS magnet 478 are disposed based on the magnetic flux density of the magnet 476 ) It is possible to more accurately detect axial movement information or position information.

In an embodiment, the first coil 473a and the second coil 473b may overlap the opposite surface of the first OIS magnet 474 in the x-axis direction. When viewed in the x-axis direction, the first coil 473a may be disposed such that a portion overlaps the first area 4741 and the other portion overlaps the second area 4742 . When viewed in the x-axis direction, the second coil 473b may be disposed such that a portion overlaps the second region 4742 and the other portion overlaps the third region 4743 .

In an embodiment, the second sensor 499b may be disposed inside the first coil 473a or the second coil 473b to face the opposite surface of the first OIS magnet 474 . For example, when viewed in the x-axis direction, the second sensor 499b may be positioned inside the first coil 473a to overlap the first region 4741 and the second region 4742 . However, the position of the second sensor 499b is not limited to the illustrated embodiment. According to various embodiments, the second sensor 499b may be positioned inside the second coil 473b to overlap the second region 4742 and the third region 4743 .

According to the embodiments disclosed in this document, the camera module 400 has the OIS magnets 474 , 476 , and 478 elongated in a direction substantially perpendicular to the optical axis L (eg, the x-axis direction or the y-axis direction). The thickness of the camera module 400 (eg, z The electromagnetic force for increasing the OIS correction angle can be secured without increasing the axial height). For example, the camera module 400 according to the embodiments disclosed in this document may provide an improved OIS function by expanding the correction angle, which was limited to about ±1°, to about ±3°.

The electronic device 300 according to an embodiment disclosed in this document includes a housing 310 and a camera module 400 at least a portion of which is disposed inside the housing, wherein the camera module includes a camera housing 410 . ; a sensor assembly (480) including an image sensor (482), the sensor assembly (480) being fixedly disposed on the camera housing; and a lens unit 420, at least a part of which is accommodated in a space formed by the camera housing and the sensor assembly, the lens unit being configured to move in whole or in part with respect to the camera housing and the sensor assembly; The lens unit includes a lens assembly 421 including a lens 425 , a first carrier 430 to which the lens assembly is coupled, and the first carrier therein is moved in a direction perpendicular to the optical axis L of the lens. A second carrier 450 that is possibly received, a stopper 460 coupled to the second carrier so as to cover at least a portion of the first carrier and a first damping at least a portion disposed between the stopper and the first carrier. member 495 may be included.

In various embodiments, the second carrier is disposed inside the camera housing to be movable in the optical axis direction with respect to the camera housing, and the first carrier and the lens assembly together with the second carrier It can be configured to move in a direction.

In various embodiments, the first carrier may include a first shift axis S1 direction perpendicular to the optical axis or perpendicular to each of the optical axis and the first shift axis with respect to the second carrier and the camera housing. The lens assembly may be configured to move in the second shift axis S2 direction, and the lens assembly may be configured to move in the first shift axis direction or the second shift axis direction together with the first carrier.

In various embodiments, a first accommodating part 435 in which the first damping member is accommodated may be formed on one surface of the first carrier facing the stopper.

In various embodiments, the first damping member may be formed by curing a liquid material having a predetermined viscosity filled in the first accommodating part.

In various embodiments, the stopper includes first protrusions 465 and 463b, at least a portion of which is disposed inside the first damping member, and the first protrusion extends from at least a portion of the stopper toward the first receiving portion. can be

In various embodiments, the stopper further includes a base portion 461 having an opening 4611 formed to surround the lens assembly, and the first protrusion 465 is an inner edge of the base portion surrounding the opening. can be extended from

In various embodiments, the stopper includes a first surface 461a facing the first carrier and a second surface 461b facing opposite to the first surface, and at least a portion of the first surface is formed on the first surface. 1 may be in contact with the damping member.

In various embodiments, a hole 466 overlapping the first damping member in the optical axis direction is formed in a partial region of the stopper, and the first damping member is formed in a partial region of the first surface adjacent to the hole. However, at least a portion may be accommodated in the hole.

In various embodiments, the camera housing includes a frame 413 surrounding the lens unit in a lateral direction and a cover 411 coupled to the frame to cover a portion of the lens unit, and the second carrier of the lens unit. may be disposed within the frame to be movable in the optical axis direction.

In various embodiments, the camera module may further include a second damping member 496 disposed between the frame and the stopper.

In various embodiments, the frame includes a plurality of sidewalls 414 , 415 , 416 , and 417 oriented in a direction perpendicular to the optical axis to surround the lens unit, and at least some of the plurality of sidewalls have the second A second accommodating part 419 in which the second damping member is accommodated may be formed.

In various embodiments, the stopper includes a base portion 461 in which an opening 4611 is formed to surround the lens assembly and an extension portion 462 extending from the base portion in the optical axis direction, 2 A damping member may be in contact with the extending portion.

In various embodiments, the first carrier comprises a second protrusion 436 at least partially disposed within the second damping member, the second protrusion being the extending portion of the stopper from an edge of the first carrier It may extend toward the second damping member through at least a portion of the.

In various embodiments, the camera module further includes a driving member 470 for moving all or part of the lens unit, and the driving member is configured to move the second carrier in the optical axis direction with respect to the frame. An AF coil 471 and an AF magnet 472 for (474, 476, 478).

In various embodiments, the AF coil is disposed on the first sidewall 414 of the frame, the AF magnet is disposed on the second carrier to face the AF coil, and the camera module is in contact with the AF magnet The frame may further include a third damping member 497 disposed on the first sidewall of the frame, wherein at least a portion of the third damping member may be accommodated in the AF coil.

In various embodiments, the lens unit further includes a guide member 440 disposed between the first carrier and the second carrier, wherein the guide member is movable to the second carrier in the first shift axis direction. The first carrier may be arranged to be movable in the second shift axis direction on the guide member, and configured to move in the first shift axis direction with respect to the second carrier together with the guide member.

In various embodiments, the lens unit is disposed between the first carrier and the guide member, a first guide ball 493 for guiding the movement of the first carrier with respect to the guide member, and the guide member and the second carrier and a second guide ball 494 disposed therebetween to guide the movement of the guide member with respect to the second carrier, wherein the first carrier and the guide member are rotatably accommodated in the first guide ball The first ball receiving grooves 433 and 443 may be formed, and the guide member and the second carrier may form second ball receiving grooves 444 and 459 in which the second guide ball is rotatably received.

In various embodiments, the first damping member may include a material having a viscosity of 75000 mPa*s or more and 95000 mPa*s or less.

The camera module 400 according to an embodiment disclosed in this document includes a fixing structure 401 including a camera housing 410 and an image sensor 482 fixedly disposed on the camera housing; at least a part of the lens unit 420 accommodated in the camera housing and configured to move in whole or in part with respect to the fixed structure; and a driving member 470 for moving all or part of the lens unit, the driving member including a plurality of coils 470_c disposed on the camera housing and a plurality of magnets 470_m disposed on the lens unit including; the lens unit, the lens assembly 421 including a lens 425, the AF carrier 450 movably disposed in the optical axis (L) direction of the lens in the camera housing, and the The lens assembly is coupled and includes an OIS carrier (430, 440) movably disposed inside the AF carrier in a direction perpendicular to the optical axis, wherein the plurality of coils include a first sidewall (414) of the camera housing. ) and a plurality of OIS coils 473, 475, and 477 respectively disposed on the second sidewall 415, third sidewall 416, and fourth sidewall 417 of the camera housing. Including, wherein the plurality of magnets, AF magnet 472 disposed on the AF carrier to face the AF coil, a plurality of OIS magnets disposed on the OIS carrier to face each of the plurality of OIS coils ( 474, 476, and 478), wherein each of the plurality of OIS magnets includes a first region 4741 having a first polarity opposite to the surface facing the plurality of OIS coils, and a first polarity different from the first polarity. is configured to include a second region 4742 having two polarities and a third region 4743 having the first polarity, wherein each of the plurality of OIS coils has a portion facing the first region and another portion It may be configured to include a first coil 473a facing the second region and a second coil 473b having a portion facing the second region and another portion facing the third region.

In various embodiments, the OIS carrier includes a guide member 440 that is movably disposed in a first shift axis S1 direction perpendicular to the optical axis with respect to the AF carrier, and the optical axis and the guide member with respect to the guide member. a first carrier 430 movably disposed in a second shift axis direction perpendicular to the first shift axis, wherein the plurality of OIS magnets include a first OIS magnet 474 disposed on the guide member; a first OIS magnet 476 and a third OIS magnet 478 disposed on the first carrier, wherein the plurality of OIS coils are disposed on the second sidewall to face the first OIS magnet OIS coil 473, a second OIS coil 475 disposed on the third sidewall to face the second OIS magnet, and a third OIS coil 477 disposed on the fourth sidewall to face the third OIS magnet ), wherein the first carrier and the guide member are configured to move in the first shift axis direction with respect to the AF carrier by interaction of the first OIS coil and the first OIS magnet, The carrier may be configured to move in a second shift axis direction with respect to the guide member by an interaction between the second OIS coil and the second OIS magnet or an interaction between the third OIS coil and the third OIS magnet. .

In various embodiments, the camera module further includes a plurality of sensor modules (499b, 499c) for detecting a change in position between the plurality of OIS coils and the plurality of OIS magnets; Each of the sensor modules may be disposed to overlap the first area and the second area or overlap the second area and the third area when the opposite surface is viewed.

In various embodiments, each of the plurality of sensor modules is disposed such that a part faces the first area and another part faces the second area, and the positions of the plurality of OIS magnets correspond to the first area Detected based on a third signal determined using a first signal sensed from a region corresponding to the region of interest and a second signal sensed from an region corresponding to the second region, wherein the third signal is the first signal and the second signal It may be determined by dividing a value obtained by adding ? by a difference value between the first signal and the second signal.

The electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of the present document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^™ ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Claims (23)

In an electronic device,
A housing and at least a part of the camera module is disposed inside the housing,
The camera module,
camera housing;
a sensor assembly including an image sensor, the sensor assembly being fixedly disposed on the camera housing; and
a lens part at least partially accommodated in a space formed by the camera housing and the sensor assembly, the lens part being configured to move in whole or in part with respect to the camera housing and the sensor assembly;
The lens unit,
a lens assembly comprising a lens;
a first carrier to which the lens assembly is coupled;
a second carrier in which the first carrier is movably accommodated therein in a direction perpendicular to the optical axis of the lens;
a stopper coupled to the second carrier so as to cover at least a portion of the first carrier; and
and a first damping member, at least a portion of which is disposed between the stopper and the first carrier. The method according to claim 1,
The second carrier is disposed inside the camera housing to be movable in the optical axis direction with respect to the camera housing,
and the first carrier and the lens assembly are configured to move in the optical axis direction together with the second carrier. The method according to claim 1,
The first carrier moves in a first shift axis direction perpendicular to the optical axis or a second shift axis direction perpendicular to each of the optical axis and the first shift axis with respect to the second carrier and the camera housing. composed,
and the lens assembly is configured to move in the first shift axis direction or the second shift axis direction together with the first carrier. The method according to claim 1,
The electronic device of claim 1, wherein the first carrier has a first accommodating portion accommodating the first damping member on one surface facing the stopper. 5. The method according to claim 4,
The first damping member is formed by curing a liquid material having a predetermined viscosity filled in the first accommodating part. 5. The method according to claim 4,
the stopper includes a first protrusion, at least a portion of which is disposed inside the first damping member;
and the first protrusion extends from at least a portion of the stopper toward the first accommodating portion. 7. The method of claim 6,
The stopper further includes a base portion in which an opening is formed to surround the lens assembly,
and the first protrusion extends from an inner rim of the base portion surrounding the opening. The method according to claim 1,
The stopper includes a first side facing the first carrier and a second side facing the opposite of the first side,
at least a partial region of the first surface is in contact with the first damping member. 9. The method of claim 8,
A hole overlapping the first damping member in the optical axis direction is formed in a partial region of the stopper;
The first damping member is in contact with a partial region of the first surface adjacent to the hole, and at least a part of the first damping member is accommodated in the hole. The method according to claim 1,
The camera housing is
A frame surrounding the lens unit in the lateral direction and a cover coupled to the frame to cover a portion of the lens unit,
The second carrier of the lens unit is disposed inside the frame to be movable in the optical axis direction. 11. The method of claim 10,
The camera module further includes a second damping member disposed between the frame and the stopper. 12. The method of claim 11,
The frame includes a plurality of sidewalls oriented in a direction perpendicular to the optical axis to surround the lens unit,
A second accommodating part in which the second damping member is accommodated is formed in at least some of the plurality of sidewalls. 13. The method of claim 12,
The stopper includes a base portion having an opening to surround the lens assembly and an extension portion extending from the base portion in the optical axis direction,
and the second damping member is in contact with the extended portion. 14. The method of claim 13,
the first carrier comprises a second protrusion, at least a portion of which is disposed inside the second damping member;
and the second protrusion extends from an edge of the first carrier through at least a portion of the extending portion of the stopper toward the second damping member. 11. The method of claim 10,
The camera module further includes a driving member for moving all or part of the lens unit,
The driving member is
an AF coil and an AF magnet for moving the second carrier in the optical axis direction with respect to the frame; and
and an OIS coil and an OIS magnet for moving the first carrier in a direction perpendicular to the optical axis with respect to the frame and the second carrier. 16. The method of claim 15,
The AF coil is disposed on a first sidewall of the frame,
The AF magnet is disposed on the second carrier to face the AF coil,
The camera module further includes a third damping member disposed on the first sidewall of the frame to contact the AF magnet,
At least a portion of the third damping member is accommodated in the AF coil. 4. The method of claim 3,
The lens unit further comprises a guide member disposed between the first carrier and the second carrier,
The guide member is arranged to be movable in the first shift axis direction on the second carrier,
wherein the first carrier is movably disposed on the guide member in the second shift axis direction and configured to move in the first shift axis direction with respect to the second carrier together with the guide member. electronic device. 18. The method of claim 17,
the lens unit
a first guide ball disposed between the first carrier and the guide member and guiding the movement of the first carrier with respect to the guide member; and
It is disposed between the guide member and the second carrier, further comprising a second guide ball for guiding the movement of the guide member with respect to the second carrier,
The first carrier and the guide member form a first receiving groove in which the first guide ball is rotatably accommodated,
The guide member and the second carrier form a second receiving groove in which the second guide ball is rotatably accommodated, the electronic device. The method according to claim 1,
and the first damping member includes a material having a viscosity of 75000 mPa*s or more and 95000 mPa*s or less. In the camera module,
a fixing structure including a camera housing and an image sensor fixedly disposed on the camera housing;
a lens unit, at least a part of which is accommodated in the camera housing, and configured to move in whole or in part with respect to the fixed structure; and
A driving member for moving all or part of the lens unit, the driving member including a plurality of coils disposed on the camera housing and a plurality of magnets disposed on the lens unit;
The lens unit,
a lens assembly comprising a lens;
an AF carrier disposed inside the camera housing to be movable in the optical axis direction of the lens; and
The lens assembly is coupled and includes an OIS carrier movably disposed in the AF carrier in a direction perpendicular to the optical axis,
The plurality of coils include an AF coil disposed on a first sidewall of the camera housing and a plurality of OIS coils disposed on a second sidewall, a third sidewall, and a fourth sidewall of the camera housing, respectively,
The plurality of magnets include an AF magnet disposed on the AF carrier to face the AF coil, and a plurality of OIS magnets disposed on the OIS carrier to face each of the plurality of OIS coils,
Each of the plurality of OIS magnets has a first region having a first polarity opposite a surface facing the plurality of OIS coils, a second region having a second polarity different from the first polarity, and the first polarity. is configured to include a third region having
Each of the plurality of OIS coils includes a first coil part facing the first region and part facing the second region, a part facing the second region and another part facing the third region. A camera module configured to include a second coil to see. 21. The method of claim 20,
The OIS carrier,
a guide member movably disposed in a first shift axis direction perpendicular to the optical axis with respect to the AF carrier and movable in a second shift axis direction perpendicular to the optical axis and the first shift axis with respect to the guide member Including a first carrier arranged to
The plurality of OIS magnets include a first OIS magnet disposed on the guide member, a second OIS magnet disposed on the first carrier, and a third OIS magnet disposed on the first carrier,
The plurality of OIS coils may include a first OIS coil disposed on the second sidewall to face the first OIS magnet, a second OIS coil disposed on the third sidewall to face the second OIS magnet, and the third and a third OIS coil disposed on the fourth sidewall to face the OIS magnet,
the first carrier and the guide member are configured to move in the first shift axis direction with respect to the AF carrier by interaction of the first OIS coil and the first OIS magnet;
The first carrier is configured to move in a second shift axis direction with respect to the guide member by an interaction between the second OIS coil and the second OIS magnet or an interaction between the third OIS coil and the third OIS magnet. Being a camera module. 21. The method of claim 20,
The camera module,
Further comprising; a plurality of sensor modules for detecting a change in position between the plurality of OIS coils and the plurality of OIS magnets;
Each of the plurality of sensor modules is arranged to overlap the first area and the second area or overlap the second area and the third area when the opposite surface is viewed. 23. The method of claim 22,
Each of the plurality of sensor modules is disposed so that a part faces the first area and the other part faces the second area,
The positions of the plurality of OIS magnets are detected based on a third signal determined using a first signal detected from an area corresponding to the first area and a second signal detected from an area corresponding to the second area,
The third signal is determined by dividing a value obtained by adding the first signal and the second signal by a difference value between the first signal and the second signal.

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