KR20220132584A - Hollow particles, resin composition, and resin molded article and laminate using the resin composition - Google Patents

Abstract

Provided is a hollow particle that achieves low dielectric constant and weight reduction while ensuring durability. The hollow particle of this invention contains silica, has an aspect-ratio 2 or more, and is plate-shaped.

Description

Hollow particles, resin composition, and resin molded article and laminate using the resin composition

The present invention relates to hollow particles, a resin composition, and a resin molded article and laminate using the resin composition.

For example, in recent years, in the field of information and communication equipment, in order to cope with communication in a high frequency band, low dielectric constant and low dielectric loss tangent of electronic members (typically, resin members) are required. In order to realize this, for example, it has been proposed to contain air having a low relative dielectric constant in the member. Specifically, introducing air using hollow particles has been proposed (see, for example, Patent Document 1). Thus, by containing air, it can contribute also to weight reduction of a member.

On the other hand, it is also calculated|required to ensure durability (for example, mechanical strength, such as a bending elastic modulus, dimensional stability) of a member.

Japanese Patent Laid-Open No. 2007-56158

The present invention has been made in order to solve the above problems, and it is an object of the present invention to be able to achieve low dielectric constant and weight reduction while ensuring durability.

According to one aspect of the present invention, hollow particles are provided. These hollow particles contain silica, have an aspect ratio of 2 or more, and are plate-shaped.

In one embodiment, the long diameter of the said hollow particle is 0.1 micrometer or more and 10 micrometers or less.

In one embodiment, the thickness of the said hollow particle is 0.01 micrometer or more and 5 micrometers or less.

In one embodiment, the thickness of the shell of the said hollow particle is 10 nm or more and 100 nm or less.

In one embodiment, the hollowness ratio of the said hollow particle is 20 % or more and 95 % or less.

According to another aspect of the present invention, a resin composition is provided. This resin composition contains resin and the said hollow particle.

According to another aspect of the present invention, a resin molded article is provided. This resin molded body is formed from the said resin composition.

According to another aspect of the present invention, a laminate is provided. This laminated body has a resin layer formed from the said resin composition.

In one embodiment, the thickness of the said resin layer is 25 micrometers or less.

ADVANTAGE OF THE INVENTION According to this invention, low dielectric constant and weight reduction can be achieved, ensuring durability by using plate-shaped hollow particle.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram explaining a long diameter and thickness.
It is a schematic sectional drawing of the laminated body in one Embodiment of this invention.
Figure 3a is a TEM observation photograph (10000 times) of the hollow particles of Example 1.
Figure 3b is a TEM observation photograph (100000 times) of the hollow particles of Example 1.
4 is an SEM observation photograph (20,000 times) of the core particles used in Example 1.

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of this invention is described, this invention is not limited to these embodiment.

(Definition of Terms)

The definition of the term in this specification is as follows.

1. Long diameter of particle

It is a value measured by scanning electron microscope (SEM) or transmission electron microscope (TEM) observation, and is an average value of the long axis (for example, L in FIG. 1) of randomly selected primary particles. In addition, primary particles are the smallest particles observed by SEM or TEM, and are distinguished from aggregated particles (secondary particles).

2. Particle thickness

It is a value measured by SEM or TEM observation, and is an average value of the thickness (eg, T in FIG. 1 ) of randomly selected primary particles.

3. Aspect ratio (long diameter/thickness)

It is a value calculated by dividing the thickness of the particle by the long diameter of the particle.

4. particle size

A particle diameter is an average particle diameter in particle size distribution measurement.

A. Hollow Particles

The hollow particle in one Embodiment of this invention is typically formed from silica. Content of the silica of a hollow particle is 95 weight% or more, for example, Preferably it is 97 weight% or more, More preferably, it is 98 weight% or more.

The shape of the hollow particles is plate-like. By employing the plate shape, the above-described durability, low dielectric constant, and weight reduction can be achieved at the same time. Moreover, it can fully respond also to size reduction (thin film reduction) of the member used. Furthermore, it is easy to achieve coexistence of a high hollow ratio and the intensity|strength of a hollow particle.

The aspect-ratio of the said hollow particle is 2 or more, Preferably it is 3 or more, More preferably, it is 4 or more. On the other hand, the aspect-ratio of a hollow particle is 100 or less, for example, Preferably it is 60 or less, More preferably, it is 50 or less. According to such an aspect-ratio, it can be excellent in processability at the time of producing the resin composition mentioned later, for example.

The long diameter of the hollow particles is preferably 0.1 µm or more, more preferably 0.2 µm or more. According to such a long diameter, the hollow ratio mentioned later can fully be satisfied. On the other hand, the long diameter of the hollow particles is preferably 10 µm or less, more preferably 5 µm or less. According to such a long diameter, it can greatly contribute to the said miniaturization (thin film reduction).

The thickness of the hollow particles is preferably 0.01 µm or more, more preferably 0.05 µm or more, and particularly preferably 0.1 µm or more. According to such a thickness, the hollow ratio mentioned later can fully be satisfied. On the other hand, the thickness of the hollow particles is preferably 5 µm or less, more preferably 3 µm or less, and particularly preferably 2 µm or less. According to such a thickness, it can contribute greatly to the said miniaturization (thin film reduction).

The thickness of the shell of the hollow particles is preferably 10 nm or more, more preferably 15 nm or more. According to this thickness, for example, when producing a resin composition to be described later, it is possible to effectively prevent the hollow particles from breaking. On the other hand, the thickness of the shell of the hollow particles is preferably 100 nm or less, more preferably 60 nm or less. According to such a thickness, it can fully satisfy the hollow factor mentioned later, and can contribute greatly to low dielectric constant and weight reduction. In addition, the thickness of a shell can be measured by TEM observation. For example, it is calculated|required by measuring the thickness of the shell of randomly selected hollow particle, and calculating the average value.

The hollowness of the hollow particles is preferably 20% or more, more preferably 30% or more, still more preferably 40% or more, and particularly preferably 50% or more. According to such a hollow ratio, for example, it can contribute greatly to low dielectric constant reduction and weight reduction. On the other hand, the hollowness ratio of a hollow particle becomes like this. Preferably it is 95 % or less, More preferably, it is 90 % or less. According to such a hollow ratio, for example, when producing a resin composition to be described later, it is possible to effectively prevent the hollow particles from breaking. In addition, the hollow ratio is computable from the volume of the core particle mentioned later, and the volume of a hollow particle.

The pore volume of the hollow particles is preferably 1.5 cm 3 /g or less, more preferably 1.0 cm 3 /g or less.

The particle diameter of the hollow particles is preferably 0.1 µm or more, more preferably 0.5 µm or more. On the other hand, the particle diameter of the hollow particles is preferably 10 µm or less, more preferably 5 µm or less.

The BET specific surface area of the hollow particles may be, for example, 10 m 2 /g or more, or 30 m 2 /g or more. On the other hand, the BET specific surface area of the hollow particles is preferably 250 m 2 /g or less, more preferably 200 m 2 /g or less.

In one embodiment, the said hollow particle is surface-treated by arbitrary appropriate surface treatment agents. As the surface treatment agent, for example, at least one selected from the group consisting of higher fatty acids, anionic surfactants, cationic surfactants, phosphoric acid esters, coupling agents, polyhydric alcohols and fatty acid esters, acrylic polymers, and silicone treatment agents used

Any suitable method may be employed as the method for producing the hollow particles. In one embodiment, the manufacturing method of a hollow particle includes covering a core particle with a shell-forming material to obtain a core-shell particle, and removing a core particle from a core-shell particle.

As the core particle, any suitable particle may be employed as long as the hollow particle can be produced. Specifically, it is preferable that the shape of the core particle is plate-like. The aspect-ratio of a core particle becomes like this. Preferably it is 2 or more, More preferably, it is 3 or more. On the other hand, the aspect-ratio of a core particle becomes like this. Preferably it is 100 or less, More preferably, it is 70 or less.

The long diameter of the core particles is preferably 0.1 µm or more, and more preferably 0.2 µm or more. On the other hand, the major diameter of the core particles is preferably 10 µm or less, and more preferably 5 µm or less. The thickness of the core particles is preferably 0.01 µm or more, and more preferably 0.1 µm or more. On the other hand, the thickness of a core particle becomes like this. Preferably it is 5 micrometers or less, More preferably, it is 2 micrometers or less.

As a material for forming the core particles, for example, a material that can be dissolved in an acidic solution to be described later is used. In this case, as a material for forming the core particles, for example, hydroxides such as magnesium hydroxide, hydrotalcite, magnesium oxide, and calcium hydroxide, oxides of hydrotalcite, oxides such as zinc oxide and calcium oxide, and carbonate compounds such as calcium carbonate can be heard Among these, magnesium hydroxide and hydrotalcite are preferably used, and magnesium hydroxide is particularly preferably used. For example, it is because it can exist stably in an aqueous system. Moreover, when it dissolves in the acidic solution mentioned later, it is because gas (for example, carbon dioxide gas) does not generate|occur|produce, but it is because it can suppress that a defect arises in the hollow particle|grains obtained.

As said shell forming material, _the alkoxysilane represented by water glass ( _Na2O.nSiO2 ) _{and tetraethoxysilane (Si(OCH2CH3)4 ) is} used, for example.

The coating amount by the shell-forming material can be adjusted by any suitable method. For example, the coating amount is adjusted by controlling the pH value at the time of coating the core particles with a shell-forming material containing water glass. Specifically, the water glass may be stable in a high pH region (eg, pH 11 or higher). Therefore, for example, by lowering the pH value using a pH adjuster (eg, to pH 7 or less), water glass molecules can be condensed and silica can be efficiently deposited on the core particles. As the pH adjuster, an acidic solution is preferably used. Specifically, a solution of a strong acid such as hydrochloric acid, nitric acid or sulfuric acid and a solution of a weak acid such as ammonium nitrate or ammonium sulfate are preferably used. It is preferable that the addition amount of a pH adjuster sets it as 85 % - 98 % in the neutralization rate with respect to water glass, for example. When the neutralization rate is too high, not only silica is precipitated on the core particles, but there is a possibility that individual silica particles are also generated. Moreover, there exists a possibility of dissolving a core particle at the time of coating with a shell-forming material. Further, when the core particles are coated with the shell-forming material, the formation of the shell (specifically, the precipitation and formation rate of the shell) can be accelerated even by heating (for example, at 80°C to 90°C).

The removal of the said core particle is typically performed by dissolving a core particle in an acidic solution. As an acidic solution, hydrochloric acid, sulfuric acid, and nitric acid are used, for example. The melting temperature is, for example, 30°C to 90°C, preferably 50°C to 70°C. According to such a temperature, core particles can be efficiently dissolved while suppressing problems such as brittleness of the shell. In one embodiment, hydrochloric acid is used as an acidic solution from a viewpoint of reusing the substance (for example, salt) obtained by reacting with a core particle, for example.

Preferably, the method for producing the hollow particles further comprises calcining the shell (eg, under an atmospheric atmosphere). By performing the firing, for example, the hydrophobicity of the shell can be improved (specifically, the silanol group of the shell is changed to siloxane), and the dielectric properties of the obtained hollow particles can be improved. Firing can be performed at arbitrary appropriate timings. Preferably, it carries out after removing a core particle from a core-shell particle. The firing temperature is, for example, 300°C to 1300°C. The calcination time is, for example, 1 hour to 20 hours.

In one embodiment of the present invention, the hollow particles are used as a function-imparting agent for a resin material. Hereinafter, a resin composition including the hollow particles will be described.

B. Resin composition

The resin composition in one Embodiment of this invention contains resin and the said hollow particle.

Any suitable resin may be selected as the resin according to, for example, the use of the obtained resin composition. For example, a thermoplastic resin may be sufficient as resin, and a thermosetting resin may be sufficient as it. Specific examples of the resin include epoxy resins, polyimide resins, polyamide resins, polyamideimide resins, polyetheretherketone resins, polyester resins, polyhydroxypolyether resins, polyolefin resins, fluororesins, liquid crystal polymers, and modified polyimides. can be heard These can be used individually or in combination of 2 or more types.

The content rate of the said hollow particle in the said resin composition becomes like this. Preferably it is 0.1 weight% or more, More preferably, it is 0.5 weight% or more. On the other hand, the said content becomes like this. Preferably it is 90 weight% or less, More preferably, it is 85 weight% or less.

The resin composition WHEREIN: It is preferable to contain 0.5 weight part or more of hollow particles with respect to 100 weight part of resin, More preferably, it is 1 weight part or more. On the other hand, it is preferable to contain 300 parts by weight or less of hollow particles with respect to 100 parts by weight of the resin, and more preferably 200 parts by weight or less.

The volume ratio of the hollow particles in the resin composition is preferably 0.1% or more, and more preferably 0.5% or more. On the other hand, the volume ratio of the hollow particle in a resin composition becomes like this. Preferably it is 70 % or less, More preferably, it is 60 % or less. For example, it is because processability at the time of producing a resin composition may be excellent.

The resin composition may include optional components. Examples of the optional component include a curing agent (specifically, the curing agent for the resin), a stress reducing agent, a colorant, an adhesion enhancer, a mold release agent, a flow regulator, a defoaming agent, a solvent, and a filler. These can be used individually or in combination of 2 or more types. In one embodiment, the resin composition contains a hardening|curing agent. Content of a hardening|curing agent is 1 weight part - 150 weight part with respect to 100 weight part of resin.

Any suitable method can be employ|adopted as a manufacturing method of the said resin composition. Specifically, a resin composition is obtained by dispersing the hollow particles in the resin by any appropriate dispersing method. As a dispersion method, dispersion|distribution by various stirrers, such as a homo mixer, a disper, and a ball mill, dispersion|distribution by a rotation revolution mixer, dispersion|distribution by shear force using three rolls, dispersion|distribution by ultrasonic treatment are mentioned, for example.

The resin composition is typically a resin molded article molded into a desired shape. For example, it becomes a resin molded object molded into a desired shape using a mold. At the time of molding the resin molded body, the resin composition may be subjected to any appropriate treatment (eg, curing treatment).

In one embodiment of this invention, the said resin composition turns into a resin layer contained in a laminated body. Hereinafter, the laminated body which has a resin layer formed from the said resin composition is demonstrated.

C. Laminate

It is a schematic sectional drawing of the laminated body in one Embodiment of this invention. The laminate 10 has a resin layer 11 and a metal foil 12 . The resin layer 11 is formed from the said resin composition. Specifically, the resin layer 11 contains the resin and the hollow particles. In the resin layer 11 , it is preferable that the in-plane direction of the plate-shaped hollow particles is oriented in the in-plane direction of the resin layer 11 . It is because it can contribute to thinning of a resin layer. Although not shown, the laminate 10 may include other layers. For example, the base material (representatively a resin film) laminated|stacked on one side (the side where the metal foil 12 is not arrange|positioned) of the resin layer 11 is mentioned. The laminate 10 is typically used as a wiring circuit board.

The thickness of the said resin layer is 5 micrometers or more, for example, Preferably it is 10 micrometers or more. On the other hand, the thickness of a resin layer is 100 micrometers or less, for example, Preferably it is 50 micrometers or less, More preferably, it is 25 micrometers or less. According to such a thickness, for example, it can fully respond to the miniaturization of an electronic member in recent years.

Any suitable metal may be used as the metal forming the metal foil. For example, copper, aluminum, nickel, chromium, and gold are mentioned. These can be used individually or in combination of 2 or more types. The thickness of metal foil is 2 micrometers - 35 micrometers, for example.

Any suitable method may be employed as a method for manufacturing the laminate. For example, the said resin composition is coated on the said base material, a coating layer is formed, the said metal foil is laminated|stacked on this coating layer, and a laminated body is obtained. As another specific example, the said resin composition is coated on the said metal foil, a coating layer is formed, and a laminated body is obtained. Typically, at any suitable timing, the coating layer is subjected to a treatment such as heating or light irradiation to cure the coating layer. In the case of coating, you may melt|dissolve the said resin composition in arbitrary suitable solvents, and you may use it.

Example

Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited by these Examples. In addition, unless otherwise specified, the measuring method of each characteristic is as follows.

1. Long diameter of particle

The major axis was calculated by SEM observation or TEM observation. Specifically, the major axis of 100 primary particles randomly selected from the SEM photograph or the TEM photograph of the particles was measured, and the arithmetic average (average major axis) of the measured values was obtained. In addition, the magnification of SEM observation of core particles was set to 20000 times, and the magnification of TEM observation of hollow particles was made into 10000 times.

2. Thickness

The thickness of the particle and the thickness of the shell of the particle were calculated by SEM observation or TEM observation. Specifically, the thickness of 100 primary particles randomly selected from the SEM photograph or the TEM photograph of the particles was measured, and the arithmetic mean (average thickness) of the obtained measured values was obtained. In addition, the magnification of SEM observation of a core particle was 50000 times, and the magnification of TEM observation of a hollow particle was made into 10000 times and 10000 times.

3. Aspect Ratio

The aspect ratio was computed by SEM observation or TEM observation. Specifically, the aspect ratio was calculated by dividing the average long diameter of the particles by the average thickness of the particles.

4. Hollow rate

It was calculated from the volume of the core particle and the volume of the hollow particle. Specifically, it was calculated as (volume per core particle)/(volume per 1 hollow particle) x 100. Incidentally, the volume per particle of the core particles and the hollow particles was calculated by approximating the actual shape to the volume in the circumference, taking the long diameter as the diameter of the circle, and the thickness as the height of the circumference.

5. particle size

The particle diameter (average secondary particle diameter) was measured by a dynamic light scattering method using "ELSZ-2" manufactured by Otsuka Electronics (analysis conditions were scattering intensity distribution). The sample for a measurement was prepared by adding 0.05 g of particle|grains to 70 mL of water, and performing ultrasonication for 3 minutes at 300 microA.

6. Pore volume

It measured by "BELsorp-max" of Microtrac Bell Corporation. Specifically, it measured by the constant-capacity gas adsorption method using nitrogen gas, and the pore volume was calculated|required by the analysis by the BJH method.

7. BET specific surface area

It measured with "BELsorp-mini" of Microtrac Bell Corporation. Specifically, it measured by the constant-capacity gas adsorption method using nitrogen gas, and the specific surface area was calculated|required by the analysis by the BET multi-point method.

[Example 1]

The plate-shaped magnesium hydroxide particles having a long diameter of 0.8 µm, a thickness of 0.2 µm, and an aspect ratio of 4 were adjusted to a solid content concentration of 60 g/L using ion-exchanged water to obtain a slurry of magnesium hydroxide.

Next, 6.7 L of the obtained magnesium hydroxide slurry was heated to 80°C while stirring, and 268 ml of 0.57 mol/L No. 3 water glass (Na ₂ O.3.14SiO ₂ , manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.) was added to this over 10 minutes. added. After that, also, 1340 ml of water glass No. 3 and 3.25 L of 0.5N hydrochloric acid were started to be added simultaneously. Here, No. 3 water glass was added over 50 minutes and hydrochloric acid was added over 60 minutes. The slurry thus obtained was aged for 30 minutes, then dehydrated and washed with water to obtain a core-shell particle precursor cake.

Next, the obtained core-shell particle precursor cake was adjusted to a solid content concentration of 60 g/L with ion-exchanged water, heated to 80° C. while stirring, and 268 ml of 0.57 mol/L water glass No. 3 was added thereto over 10 minutes. . After that, 670 ml of water glass No. 3 and 1.9 L of 0.5N hydrochloric acid were also started to be added simultaneously. Here, No. 3 water glass was added over 25 minutes and hydrochloric acid was added over 35 minutes. The slurry thus obtained was aged for 30 minutes, then dehydrated and washed with water to obtain a cake of core-shell particles.

Here, as measured by the ATR method for the core-shell particles obtained using FT-IR ("FT/IR-4100" manufactured by JASCO), not only the peak derived from OH of 3500 to 3800 cm ^-1 of magnesium hydroxide, A peak derived from Si-O-Si in the vicinity of 1000 to 1300 cm ^-1 was confirmed.

Next, 21.6 L of 0.7N hydrochloric acid is added to the obtained core-shell particles, resuspended under stirring at room temperature, adjusted so that the solid content concentration of the core-shell particles is 25 g/L, and then this is heated to 60° C., and 1 hour It was aged to dissolve the core particles to obtain a slurry of hollow silica.

The obtained hollow silica slurry was dehydrated and washed with water to make a hollow silica cake, and the hollow silica cake was dried at 60° C. for 28 hours to obtain hollow silica particles (long diameter: 0.86 µm, thickness: 0.26 µm, aspect ratio: 3.3, shell thickness: 30 nm, porosity: 66%, particle size: 0.95 µm, pore volume: 0.67 cm 3 /g, BET specific surface area: 123 m 2 /g) was obtained.

As measured by the ATR method for the obtained hollow silica particles using FT-IR ("FT/IR-4100" manufactured by JASCO), a peak derived from OH in the vicinity of 3500 to 3800 cm ^-1 of the magnesium hydroxide particles was not confirmed. , only peaks derived from Si—O—Si in the vicinity of 1000 to 1300 cm ⁻¹ were confirmed. Further, when the hollow silica particles were analyzed by X-ray diffraction ("EMPYRIAN" manufactured by PANalytical), the peak of magnesium hydroxide was not confirmed, but amorphous silica. Moreover, from the weight of the obtained hollow silica particle, the ratio of the silica in the said core-shell particle was 26 weight%.

[Example 2]

In the same manner as in Example 1, except that the concentration of hydrochloric acid was changed from 0.5N to 0.52N at the time of forming the core-shell particles, hollow particles (major diameter: 0.88 µm, thickness: 0.28 µm, aspect ratio: 3.1, shell thickness: 40 nm, porosity: 59%, particle size: 1.20 µm, pore volume: 0.50 cm 3 /g, BET specific surface area: 81 m 2 /g) were obtained.

[Example 3]

Instead of plate-shaped magnesium hydroxide particles having a long diameter of 0.8 µm, a thickness of 0.2 µm, and an aspect ratio of 4, plate-shaped hydrotalcite having a long diameter of 0.2 µm, a thickness of 0.07 µm, and an aspect ratio of 2.9 (“DHT4” manufactured by Kyowa Chemical Industry Co., Ltd.) ) was used, and the concentration of hydrochloric acid was changed from 0.5 N to 0.49 N at the time of formation of the core-shell particles, and in the same manner as in Example 1, hollow particles (major diameter: 0.246 µm, thickness: 0.116 µm, aspect ratio: 2.1, shell thickness: 23 nm, porosity: 53%, particle size: 0.94 µm, pore volume: 0.85 cm 3 /g, BET specific surface area: 135 m 2 /g) were obtained.

<TEM observation>

The results of observation with a transmission electron microscope ("JEM-2100PLUS" manufactured by Nippon Electronics Co., Ltd.) of the hollow particles of Example 1 are shown in FIG. 3 . From Fig. 3, it was confirmed that the shell (silica layer) was a plate-shaped hollow particle having a thickness of 30 nm. Moreover, although the SEM photograph of the magnesium hydroxide particle used as a core particle is shown in FIG. 4, it was confirmed from FIG. 3 and FIG. 4 that it is the hollow particle which maintained the plate-shaped shape of the core particle.

<Resin composition>

(1) mixing by sonication

1 g of bisphenol F-type epoxy resin (“JER806” manufactured by Mitsubishi Chemical Corporation), 0.38 g of a curing agent (“LV11” manufactured by Mitsubishi Chemical Corporation), and 0.04 g of the hollow particle silica particles obtained in Example 1 were mixed, A resin composition 1 was obtained. Mixing was performed by performing ultrasonic treatment with "NS-200-60" manufactured by Nippon Seiki Co., Ltd. for 1 minute.

(2) mixing by homogenizer

5 g of bisphenol F-type epoxy resin (“JER806” manufactured by Mitsubishi Chemical Corporation), 1.9 g of a curing agent (“LV11” manufactured by Mitsubishi Chemical Corporation) and 0.2 g of the hollow particle silica particles obtained in Example 1 were mixed, A resin composition 2 was obtained. Mixing was performed on condition of 8000 rpm and 5 minutes using the handy homogenizer ("T10 Basic" manufactured by IKA Japan Co., Ltd.).

(3) Mixing by rotating and revolving mixer

5 g of bisphenol F-type epoxy resin (“JER806” manufactured by Mitsubishi Chemical Corporation), 2.5 g of a curing agent (“LV11” manufactured by Mitsubishi Chemical Corporation), and 0.875 g of the hollow particle silica particles obtained in Example 1 were mixed, A resin composition 3 was obtained. Mixing was performed under conditions of 1700 rpm and 3 minutes using a rotation revolution mixer ("Kakuhunter SK-300SVII" manufactured by Shashin Chemical Co., Ltd.).

<Resin molded article>

The resin compositions 1 to 3 were each poured into a mold made of a silicone resin having a thickness of 2 mm, and cured at 80° C. for 3 hours to obtain resin molded bodies 1 to 3.

The obtained molded body was cut with a cross section polisher ("IB-09010CP" manufactured by JEOL), and the cross section was observed with SEM ("JSM-7600F" manufactured by JEOL). In any of the resin molded bodies 1 to 3, hollow particles destruction has not been confirmed. In addition, in any of the resin molded articles 1 to 3, the penetration of the resin into the hollow particles was not confirmed.

<Industrial Applicability>

The hollow particle of this invention can be used suitably for an electronic material typically. In addition, for example, it can be used for a heat insulating material, a sound insulation material, a shock-absorbing material, a stress-absorbing material, an optical material, and a lightweight material.

L: Janggyeong
T: thickness
10: laminate
11: resin layer
12: metal foil

Claims (9)

A hollow particle comprising silica, having an aspect ratio of 2 or more, and having a plate shape. The hollow particle according to claim 1, wherein the major axis is 0.1 µm or more and 10 µm or less. The hollow particle of Claim 1 or 2 whose thickness is 0.01 micrometer or more and 5 micrometers or less. The hollow particle according to any one of claims 1 to 3, wherein the shell has a thickness of 10 nm or more and 100 nm or less. The hollow particle according to any one of claims 1 to 4, wherein the hollow particle is 20% or more and 95% or less. resin, and
The hollow particle according to any one of claims 1 to 5
Including, a resin composition. A resin molded body formed from the resin composition according to claim 6 . The laminated body which has a resin layer formed from the resin composition of Claim 6. The laminate according to claim 8, wherein the resin layer has a thickness of 25 µm or less.

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