KR20220120457A - 기판상의 복수의 영역의 배열을 구하는 방법, 노광 장치, 물품의 제조 방법, 비일시적 기억 매체, 및 정보처리장치 - Google Patents

기판상의 복수의 영역의 배열을 구하는 방법, 노광 장치, 물품의 제조 방법, 비일시적 기억 매체, 및 정보처리장치 Download PDF

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Publication number
KR20220120457A
KR20220120457A KR1020220009643A KR20220009643A KR20220120457A KR 20220120457 A KR20220120457 A KR 20220120457A KR 1020220009643 A KR1020220009643 A KR 1020220009643A KR 20220009643 A KR20220009643 A KR 20220009643A KR 20220120457 A KR20220120457 A KR 20220120457A
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KR
South Korea
Prior art keywords
distribution
substrate
parameter
regions
obtaining
Prior art date
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Abandoned
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KR1020220009643A
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English (en)
Korean (ko)
Inventor
아츠시 시게노부
Original Assignee
캐논 가부시끼가이샤
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Publication of KR20220120457A publication Critical patent/KR20220120457A/ko
Abandoned legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007Alignment other than original with workpiece
    • G03F9/7011Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046Strategy, e.g. mark, sensor or wavelength selection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019Calibration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092Signal processing
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10Complex mathematical operations
    • G06F17/16Matrix or vector computation, e.g. matrix-matrix or matrix-vector multiplication, matrix factorization
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10Complex mathematical operations
    • G06F17/18Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
    • H01L21/0274
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Databases & Information Systems (AREA)
  • Algebra (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Operations Research (AREA)
  • Probability & Statistics with Applications (AREA)
  • Computing Systems (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020220009643A 2021-02-22 2022-01-24 기판상의 복수의 영역의 배열을 구하는 방법, 노광 장치, 물품의 제조 방법, 비일시적 기억 매체, 및 정보처리장치 Abandoned KR20220120457A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-026641 2021-02-22
JP2021026641A JP7580297B2 (ja) 2021-02-22 2021-02-22 基板上の複数のショット領域の配列を求める方法、露光装置、物品の製造方法、プログラム及び情報処理装置

Publications (1)

Publication Number Publication Date
KR20220120457A true KR20220120457A (ko) 2022-08-30

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Application Number Title Priority Date Filing Date
KR1020220009643A Abandoned KR20220120457A (ko) 2021-02-22 2022-01-24 기판상의 복수의 영역의 배열을 구하는 방법, 노광 장치, 물품의 제조 방법, 비일시적 기억 매체, 및 정보처리장치

Country Status (5)

Country Link
US (1) US12130562B2 (https=)
JP (1) JP7580297B2 (https=)
KR (1) KR20220120457A (https=)
CN (1) CN114967377A (https=)
TW (1) TWI861463B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7545278B2 (ja) * 2020-09-25 2024-09-04 キヤノン株式会社 サンプルショット領域のセットを決定する方法、計測値を得る方法、情報処理装置、リソグラフィ装置、プログラム、および物品製造方法
JP7745407B2 (ja) * 2021-10-01 2025-09-29 キヤノン株式会社 基板上の複数のショット領域の配列を求める方法、露光方法、露光装置、物品の製造方法、プログラム及び情報処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0669017B2 (ja) 1985-10-08 1994-08-31 株式会社ニコン 位置合わせ方法
JPS6144429A (ja) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> 位置合わせ方法、及び位置合せ装置
JP3230271B2 (ja) 1991-08-30 2001-11-19 株式会社ニコン 位置合わせ方法、位置合わせ装置、露光方法及び露光装置
JP3289264B2 (ja) 1993-06-08 2002-06-04 株式会社ニコン 位置合わせ方法及び装置、露光方法及び装置、並びにデバイス製造方法
JP3002351B2 (ja) * 1993-02-25 2000-01-24 キヤノン株式会社 位置合わせ方法および装置
JP2004200632A (ja) 2002-10-22 2004-07-15 Nikon Corp 位置検出方法、露光方法及び露光装置、デバイス製造方法、並びにプログラム及び情報記録媒体
EP3435162A1 (en) 2017-07-28 2019-01-30 ASML Netherlands B.V. Metrology method and apparatus and computer program
EP3518040A1 (en) * 2018-01-30 2019-07-31 ASML Netherlands B.V. A measurement apparatus and a method for determining a substrate grid
EP3564754A1 (en) 2018-04-30 2019-11-06 ASML Netherlands B.V. Inspection tool, inspection method and computer program product
TWI723396B (zh) * 2018-05-24 2021-04-01 荷蘭商Asml荷蘭公司 判定基板之堆疊組態之方法

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Publication number Publication date
JP7580297B2 (ja) 2024-11-11
JP2022128227A (ja) 2022-09-01
TWI861463B (zh) 2024-11-11
US12130562B2 (en) 2024-10-29
US20220269187A1 (en) 2022-08-25
TW202234182A (zh) 2022-09-01
CN114967377A (zh) 2022-08-30

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