KR20220100745A - Method for inspecting display device and apparatus for inspecting display device - Google Patents

Abstract

Provided are an inspection method for a display device and an inspection device for a display device, capable of obtaining information on a defective pixel and repairing the defective pixel. The inspection method for a display device includes: a first inspection step of turning on a display device including a plurality of pixels, in which a plurality of light emitting elements are arranged, and obtaining lighting image information from the pixels; a step of checking whether a lighted pixel and an unlighted pixel exist among the plurality of pixels based on the lighting image information; a second inspection step of obtaining position information on the unlighted pixels in light emission information and obtaining heating image information from the unlighted pixels; and a repair step of obtaining defect information on the unlighted pixel from the light emission information obtained by the heating image information and the lighting image information, and repairing the unlighted pixels based on the defect information. The repair step includes: a step of removing a part of the light emitting elements arranged in the unlighted pixel; or a step of retransferring the light emitting element to the unlighted pixel.

Description

Inspection method of a display device and an inspection device of a display device

The present invention relates to a method of inspecting a display apparatus and an apparatus for inspecting a display apparatus. More particularly, it relates to a method of inspecting a display device including an inorganic light emitting device and repairing the same, and an apparatus therefor.

Display devices are increasing in importance with the development of multimedia. In response to this, various types of display devices such as an organic light emitting display (OLED) and a liquid crystal display (LCD) have been used.

A device for displaying an image of a display device includes a display panel such as an organic light emitting display panel or a liquid crystal display panel. Among them, the light emitting display panel may include a light emitting device. For example, in the case of a light emitting diode (LED), an organic light emitting diode using an organic material as a light emitting material and an inorganic light emitting diode using an inorganic material as a light emitting material. etc.

In the display device including the inorganic light emitting diode, whether the pixel is defective may be determined according to the electrical connection of the inorganic light emitting diode. When a plurality of inorganic light emitting diodes are disposed in one pixel, some of the diodes may cause the pixel to have light emitting failure, and when a repair process is performed locally in the corresponding pixel, the defective pixel may be compensated.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inspection apparatus capable of acquiring information on a bad pixel and repairing the pixel in a display device including an inorganic light emitting diode, and a method therefor.

The problems of the present invention are not limited to the problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

A method of inspecting a display device according to an embodiment of the present invention for solving the above problems is a first inspection step of turning on the display device including a plurality of pixels in which a plurality of light emitting elements are disposed, and obtaining lighting image information from the pixels , checking whether a lit pixel and an unlit pixel among the plurality of pixels exist from the lit image information, obtaining position information of the unlit pixel among the light emission information, and generating heat image information from the unlit pixels a second inspection step of obtaining a second inspection step, and a repair step of obtaining defective information of the unlit pixel from the light emitting information obtained from the lighting image information and the heat image information, and repairing the unlit pixels based on the failure information The repairing may include removing some of the light emitting devices disposed in the unlit pixel or re-transferring the light emitting device to the unlit pixel.

The first inspection step is performed with a first camera that acquires the lighting image information through light emitted from the pixels when the display device is turned on, and the second inspection step includes the pixels when the display device is turned on. It may be performed with a second camera that acquires the fever image information through heat generated from the fields.

The light emission information includes light emission amount information obtained from the lighting image information and heat generation amount information obtained from the heat image information, and the failure information relates to a type of a failure cause of the unlit pixel and a location of the failure cause may contain information.

The display device includes a first electrode and a second electrode disposed for each pixel, and a first connection electrode disposed on the first electrode and a second connection electrode disposed on the second electrode, wherein the light emitting element may be disposed on the first electrode and the second electrode and may be in contact with the first connection electrode and the second connection electrode.

The second inspection step may include acquiring position information of a defective light emitting device among the light emitting devices disposed in the unlit pixel from the heat generation image information.

The repairing step may include irradiating a laser to the defective light emitting device in the unlit pixel.

The second inspection step includes obtaining positional information of a point in which the first connection electrode and the second connection electrode disposed in the unlit pixel are short-circuited from the information from the heating image, wherein the heating value is higher than other portions can do.

The repairing step may include irradiating a laser to a point where the first connection electrode and the second connection electrode are short-circuited in the unlit pixel.

The second inspection step may include acquiring position information of unlit pixels in which the light emitting elements are not connected to the first electrode and the second electrode among the unlit pixels, and the repairing step includes the corresponding unlit pixels. The method may include retransferring the light emitting devices to a pixel.

classifying the lit pixels into a normally lit pixel and a badly lit pixel having a different emission amount from the normally lit pixel by obtaining the emission information of the lit pixels; The method may further include obtaining information, and repairing the defective lighting pixels based on the light emission information.

The classifying the normally lit pixels and the badly lit pixels may include designating the lit pixels, among the lit pixels, whose luminous amount falls within a reference set value range, as the normally lit pixels, and compares the normally lit pixels with the luminous amount. and designating the pixel as the defective lighting pixel.

The poorly lit pixel may include a first lit pixel having a higher emission amount than the normally lit pixel, and a second lit pixel having a lower emission amount than the normally lit pixel.

In the repairing of the defectively lit pixels, a process of removing some of the light emitting elements may be performed for the first lit pixel, and a process of retransferring the light emitting elements may be performed on the second lit pixel.

In the inspection apparatus of a display apparatus according to an embodiment of the present invention for solving the above problems, the inspection apparatus of a display apparatus including a plurality of pixels in which a plurality of light emitting elements are disposed, a plurality of image information from the pixels of the display apparatus performing a repair process on the pixels based on a camera device for obtaining a repair apparatus, wherein the processor obtains the light emission information for the lit pixel and the unlit pixel from the image information to obtain the failure information of the unlit pixel, and the repair apparatus is configured to: Perform a repair process.

The image information includes lighting image information based on the amount of light emitted when the pixels are turned on, and heat image information based on the amount of heat emitted when the pixels are turned on, and the camera device is configured to obtain the lighting image information. It may include a first camera, and a second camera that acquires the fever image information.

The light emission information includes light emission amount information of the pixel and heat amount information of the pixel, the processor classifies the lit pixel and the unlit pixel from the light emission amount information, and the non-illuminated pixel from the light emission amount information and the heat amount information The defect information of the pixel may be obtained.

The processor may distinguish the lit pixels into a normally lit pixel and a poorly lit pixel having a different luminous amount from the normally lit pixel based on the emission amount information of the lit pixels.

The defect information includes information about a type of a cause of the defect of the pixel and information on a location of the cause of the defect, and the repair apparatus removes some of the light emitting elements disposed in the pixel based on the defect information. a device; and a retransfer device that transfers the light emitting device to the pixel based on the failure information.

The display device includes a first electrode and a second electrode disposed for each pixel, and a first connection electrode disposed on the first electrode and a second connection electrode disposed on the second electrode, wherein the light emitting element may be disposed on the first electrode and the second electrode and may be in contact with the first connection electrode and the second connection electrode.

The laser device may remove a portion in which the first connection electrode and the second connection electrode are connected to each other in the unlit pixel.

The details of other embodiments are included in the detailed description and drawings.

The method of inspecting a display device according to an embodiment may obtain a plurality of image information from an inspection target, obtain light emission information and defect information therefrom, and select and perform a repair process corresponding to a specific defective pixel. The inspection method of the display apparatus has an advantage in that it can perform an appropriate repair process in response to various causes of defects in the display apparatus.

Effects according to the embodiments are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a schematic plan view illustrating a display device according to an exemplary embodiment.
2 is a plan view illustrating one pixel of a display device according to an exemplary embodiment.
FIG. 3 is a cross-sectional view taken along line Q1-Q1' of FIG. 2 .
4 is a schematic diagram illustrating a light emitting device disposed in a display device according to an exemplary embodiment.
5 is a schematic diagram illustrating an inspection apparatus of a display apparatus according to an exemplary embodiment.
6 is a flowchart illustrating a method of inspecting a display apparatus according to an exemplary embodiment.
7 and 8 are schematic diagrams illustrating a first inspection step using a camera device in a method of inspecting a display device according to an exemplary embodiment.
9 and 10 are schematic diagrams illustrating a second inspection step using a camera device in a method of inspecting a display device according to an exemplary embodiment.
11 is a schematic diagram illustrating a repair step using a repair apparatus in a method of inspecting a display apparatus according to an exemplary embodiment.
12 is a schematic diagram illustrating a second inspection step using a camera device in a method of inspecting a display device according to another exemplary embodiment.
13 is a schematic diagram illustrating a repair step using a repair apparatus in a method of inspecting a display apparatus according to another exemplary embodiment.
14 is a schematic diagram illustrating a repair step using a repair apparatus in a method of inspecting a display apparatus according to another exemplary embodiment.
15 is a flowchart illustrating a method of inspecting a display apparatus according to another exemplary embodiment.
16 and 17 are schematic diagrams illustrating a step of obtaining light emission information of lit pixels in the inspection method of the display device of FIG. 15 .
18 is a schematic diagram illustrating a repair step in the inspection method of the display device of FIG. 15 .

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

Elements or layers are referred to as “on” of another element or layer, including cases in which another layer or other element is interposed immediately on or in the middle of another element. Likewise, those referred to as “Below”, “Left” and “Right” refer to cases where they are interposed immediately adjacent to other elements or interposed other layers or other materials in the middle. include Like reference numerals refer to like elements throughout.

Although the first, second, etc. are used to describe various elements, these elements are not limited by these terms, of course. These terms are only used to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the spirit of the present invention.

Hereinafter, embodiments will be described with reference to the accompanying drawings.

1 is a schematic plan view illustrating a display device according to an exemplary embodiment.

Referring to FIG. 1 , the display device 10 displays a moving image or a still image. The display device 10 may refer to any electronic device that provides a display screen. For example, televisions, laptops, monitors, billboards, Internet of Things, mobile phones, smart phones, tablet PCs (Personal Computers), electronic watches, smart watches, watch phones, head mounted displays, mobile communication terminals, An electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation system, a game machine, a digital camera, a camcorder, and the like may be included in the display device 10 .

The display device 10 is a display panel that displays a screen or an image, and examples of the display panel include an inorganic light emitting diode display panel, an organic light emitting display panel, a quantum dot light emitting display panel, a plasma display panel, a field emission display panel, and the like. . Hereinafter, a case in which an inorganic light emitting diode display panel is applied is exemplified as an example of the display panel, but the present invention is not limited thereto, and the same technical idea may be applied to other display panels if applicable.

2 is a plan view illustrating one pixel of a display device according to an exemplary embodiment. FIG. 3 is a cross-sectional view taken along line Q1-Q1' of FIG. 2 .

2 and 3 , the display device 10 of the display device 10 may include a plurality of pixels PX including a plurality of sub-pixels SXPn, where n is 1 to 3 . For example, one pixel PX may include a first sub-pixel SPX1 , a second sub-pixel SPX2 , and a third sub-pixel SPX3 .

Each of the sub-pixels SPXn of the display device 10 may include an emission area EMA and a non-emission area. The light emitting area EMA is an area where the light emitting device ED is disposed and light of a specific wavelength band is emitted, and the non-emission area is a non-emission area where the light emitting device ED is not disposed and the light emitted from the light emitting device ED does not reach. Therefore, it may be an area from which light is not emitted. In addition, each sub-pixel SPXn may further include a sub-area SA disposed in the non-emission area. The sub-area SA may be disposed on one side of the light-emitting area EMA in the first direction DR1 and may be disposed between the light-emitting areas EMA of the sub-pixels SPXn adjacent in the first direction DR1 . .

The second bank BNL2 may be disposed in a lattice pattern including portions extending in the first and second directions DR1 and DR2 in plan view. The second bank BNL2 is disposed across the boundary of each sub-pixel SPXn to distinguish neighboring sub-pixels SPXn. Also, the second bank BNL2 is disposed to surround the emission area EMA disposed in each sub-pixel SPXn to distinguish them.

The display device 10 may include a first substrate SUB, a semiconductor layer disposed on the first substrate SUB, a plurality of conductive layers, and a plurality of insulating layers. The semiconductor layer, the conductive layer, and the insulating layer may constitute the circuit layer CCL and the display element layer of the display device 10 , respectively.

The first substrate SUB may be an insulating substrate. The first substrate SUB may be made of an insulating material such as glass, quartz, or polymer resin. In addition, the first substrate SUB may be a rigid substrate, but may also be a flexible substrate capable of bending, folding, rolling, or the like.

The first conductive layer may be disposed on the first substrate SUB. The first conductive layer includes a lower metal layer BML, and the lower metal layer BML is disposed to overlap the active layer ACT1 of the first transistor T1. The lower metal layer BML may include a light-blocking material to prevent light from being incident on the active layer ACT1 of the first transistor.

The buffer layer BL may be disposed on the lower metal layer BML and the first substrate SUB. The buffer layer BL is formed on the first substrate SUB to protect the transistors of the pixel PX from moisture penetrating through the first substrate SUB, which is vulnerable to moisture permeation, and may perform a surface planarization function.

The semiconductor layer is disposed on the buffer layer BL. The semiconductor layer may include the active layer ACT1 of the first transistor T1 . The active layer ACT1 may be disposed to partially overlap the gate electrode G1 of a second conductive layer to be described later.

The first gate insulating layer GI is disposed on the semiconductor layer and the buffer layer BL. The first gate insulating layer GI may serve as a gate insulating layer of the first transistor T1 .

The second conductive layer is disposed on the first gate insulating layer GI. The second conductive layer may include the gate electrode G1 of the first transistor T1 . The gate electrode G1 may be disposed to overlap the channel region of the active layer ACT1 in the third direction DR3 , which is the thickness direction.

The first interlayer insulating layer IL1 is disposed on the second conductive layer. The first interlayer insulating layer IL1 may function as an insulating layer between the second conductive layer and other layers disposed thereon and may protect the second conductive layer.

The third conductive layer is disposed on the first interlayer insulating layer IL1. The third conductive layer may include a first voltage line VDL, a second voltage line VSL, and a plurality of electrode patterns CDP1 and CDP2.

The first voltage line VDL is applied with a high potential voltage (or a first power voltage) transferred to the first electrode RME1 , and the second voltage line VSL has a low voltage transferred to the second electrode RME2 . A potential voltage (or a second power supply voltage) may be applied. The first voltage line VDL may partially contact the active layer ACT1 of the first transistor T1 through a contact hole penetrating the first interlayer insulating layer IL1 and the first gate insulating layer GI. have. The first voltage line VDL may serve as the first drain electrode D1 of the first transistor T1 .

The first electrode pattern CDP1 may contact the active layer ACT1 of the first transistor T1 through a contact hole penetrating the first interlayer insulating layer IL1 and the first gate insulating layer GI. Also, the first electrode pattern CDP1 may contact the lower metal layer BML through another contact hole. The first electrode pattern CDP1 may serve as the first source electrode S1 of the first transistor T1 .

The second electrode pattern CDP2 may be electrically connected to the first transistor T1 through the first electrode pattern CDP1 . The first electrode pattern CDP1 and the second electrode pattern CDP2 may be connected to each other directly or through a pattern of another layer. The second electrode pattern CDP2 is also connected to the first electrode RME1 , and the first transistor T1 may transfer the first power voltage applied from the first voltage line VDL to the first electrode RME1 . .

The above-described buffer layer BL, the first gate insulating layer GI, and the first interlayer insulating layer IL1 may be formed of a plurality of inorganic layers alternately stacked. For example, the buffer layer BL, the first gate insulating layer GI, and the first interlayer insulating layer IL1 may include silicon oxide (Silicon Oxide, SiO _x ), silicon nitride (SiN _x ), and silicon acid. A nitride (Silicon Oxynitride, SiO _x N _y ) may be formed as a double layer in which an inorganic layer including at least one is stacked, or a multilayer in which these are alternately stacked.

The second conductive layer and the third conductive layer include molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed as a single layer or multiple layers made of any one or an alloy thereof. However, the present invention is not limited thereto.

The via layer VIA is disposed on the third conductive layer. The via layer VIA may include an organic insulating material, for example, an organic insulating material such as polyimide (PI), and may perform a surface planarization function.

On the via layer VIA, a plurality of electrodes RME; RME1 and RME2; a plurality of first banks BNL1 and a second bank BNL2; a plurality of light emitting devices ED and a plurality of connection electrodes CNE ; CNE1, CNE2) are arranged. In addition, a plurality of insulating layers PAS1 , PAS2 , and PAS3 may be disposed on the via layer VIA.

The plurality of first banks BNL1 may be directly disposed on the via layer VIA. The first banks BNL1 may have a shape extending in the first direction DR1 and may be spaced apart from each other in the second direction DR2 . A plurality of light emitting devices ED may be disposed between the first banks BNL1 spaced apart from each other.

The first bank BNL1 may have a structure in which at least a portion protrudes from the top surface of the via layer VIA. The protruding portion of the first bank BNL1 may have an inclined side surface, and light emitted from the light emitting device ED is reflected from the electrode RME disposed on the first bank BNL1 to form the via layer VIA. ) can be emitted in the upper direction.

The plurality of electrodes RME are disposed in each sub-pixel SPXn in a shape extending in one direction. The plurality of electrodes RME may extend in the first direction DR1 and may be disposed over at least the emission area EMA and the sub area SA of the sub-pixel SPXn, and they may extend in the second direction DR2 from each other. They may be spaced apart.

The first electrode RME1 and the second electrode RME2 are disposed to extend in the first direction DR1 from the emission area EMA and cross the second bank BNL2 to the corresponding sub-pixel SPXn and the first direction DR1 . It may be partially disposed in the sub area SA of another sub pixel SPXn adjacent to DR1 . The first electrode RME1 and the second electrode RME2 of different sub-pixels SPXn may be spaced apart from each other based on the separation portion ROP located in the sub-area SA of any one sub-pixel SPXn. .

The first electrode RME1 and the second electrode RME2 may be respectively disposed on different first banks BNL1 . The plurality of electrodes RME may be disposed on at least an inclined side surface of the first bank BNL1 . Each of the electrodes RME may be disposed to cover at least one side surface of the first bank BNL1 to reflect light emitted from the light emitting device ED. Also, a distance between the plurality of electrodes RME in the second direction DR2 may be smaller than a distance between the first banks BNL1 . At least a portion of each of the electrodes RME may be directly disposed on the via layer VIA so that they may be disposed on the same plane.

The first electrode RME1 and the second electrode RME2 may be connected to the third conductive layer through the first electrode contact hole CTD and the second electrode contact hole CTS, respectively. The first electrode RME1 may contact the second electrode pattern CDP2 through the first electrode contact hole CTD penetrating the via layer VIA thereunder. The second electrode RME2 may contact the second voltage line VSL through the second electrode contact hole CTS penetrating the via layer VIA thereunder.

The plurality of electrodes RME may be electrically connected to the light emitting device ED. Each of the electrodes RME may be connected to the light emitting device ED through connection electrodes CNE (CNE1, CNE2), which will be described later, and may transmit an electric signal applied from a lower conductive layer to the light emitting device ED.

Each of the plurality of electrodes RME may include a conductive material having high reflectivity. For example, the electrode RME is a material with high reflectivity and includes a metal such as silver (Ag), copper (Cu), aluminum (Al), or the like, or includes aluminum (Al), nickel (Ni), lanthanum (La), etc. It may be an alloy containing. However, the present invention is not limited thereto, and each electrode RME may further include a transparent conductive material.

The first insulating layer PAS1 is disposed on the via layer VIA and the plurality of electrodes RME. The first insulating layer PAS1 is disposed to completely cover the plurality of electrodes RME, and may protect them and insulate them from each other. Also, the first insulating layer PAS1 may prevent the light emitting device ED disposed thereon from being damaged by direct contact with other members.

The second bank BNL2 may be disposed on the first insulating layer PAS1 . The second bank BNL2 may be disposed in a grid pattern including portions extending in the first direction DR1 and the second direction DR2 in a plan view, and may be disposed across the boundary of each sub-pixel SPXn. The neighboring sub-pixels SPXn may be distinguished. The second bank BNL2 may have a predetermined height, and in some embodiments, a top surface of the second bank BNL2 may be higher than that of the first bank BNL1 , and the thickness thereof may be greater than that of the first bank BNL1 . may be equal to or greater than

The plurality of light emitting devices ED may be disposed on the first insulating layer PAS1 . The plurality of light emitting devices ED may be disposed on electrodes RME spaced apart from each other in the second direction DR2 between the first banks BNL1 . The light emitting devices ED may be disposed to be spaced apart from each other along the first direction DR1 in which the respective electrodes RME extend, and may be aligned substantially parallel to each other. The light emitting devices ED are disposed so that both ends are disposed on different electrodes RME, and the direction in which each electrode RME extends and the direction in which the light emitting device ED extends are substantially perpendicular to each other. can

The light emitting devices ED may contact the connection electrodes CNE1 and CNE2 to be electrically connected to the electrode RME. The light emitting devices ED may be electrically connected to conductive layers under the electrode RME or via layer VIA through connection electrodes CNE.

The second insulating layer PAS2 may be disposed on the plurality of light emitting devices ED. For example, the second insulating layer PAS2 is disposed to partially cover the outer surface of the light emitting device ED, so that both sides or both ends of the light emitting device ED are not covered.

A plurality of connection electrodes CNE ( CNE1 , CNE2 ) and a third insulating layer PAS3 may be disposed on the second insulating layer PAS2 .

The plurality of connection electrodes CNE are disposed on the light emitting devices ED and the electrode RME. Also, the connection electrodes CNE are partially disposed on the second insulating layer PAS2 and may be insulated from each other by the other connection electrodes CNE and the second insulating layer PAS2 and the third insulating layer PAS3. . The plurality of connection electrodes CNE may contact the light emitting element ED and the electrodes RME, respectively.

Each of the connection electrodes CNE may be disposed to be spaced apart from each other in the second direction DR2 in a plan view. The first connection electrode CNE1 and the second connection electrode CNE2 may be spaced apart from each other by a predetermined distance so as not to be directly connected to each other. The first connection electrode CNE1 may have a shape extending in the first direction DR1 and may be disposed on the first electrode RME1 . The first connection electrode CNE1 may contact the first electrode RME1 and the first ends of the light emitting devices ED. The second connection electrode CNE2 may have a shape extending in the first direction DR1 and may be disposed on the second electrode RME2 . The second connection electrode CNE2 may contact the second electrode RME2 and second ends of the light emitting devices ED. The first connection electrode CNE1 and the second connection electrode CNE2 may transmit an electrical signal applied to the first electrode RME1 or the second electrode RME2 to any one end of the light emitting device ED.

The connection electrodes CNE may include a conductive material. For example, it may include ITO, IZO, ITZO, aluminum (Al), and the like. For example, the connection electrode CNE may include a transparent conductive material, and light emitted from the light emitting device ED may pass through the connection electrode CNE and travel toward the electrodes RME. However, the present invention is not limited thereto.

The third insulating layer PAS3 is disposed on the second connection electrode CNE2 and the second insulating layer PAS2 . The third insulating layer PAS3 is disposed entirely on the second insulating layer PAS2 to cover the second connection electrode CNE2 , and the first connection electrode CNE1 is disposed on the third insulating layer PAS3 . can be placed in The third insulating layer PAS3 may insulate the first connection electrode CNE1 from each other so that it does not directly contact the second connection electrode CNE2 .

In some embodiments, in the display device 10 , the third insulating layer PAS3 may be omitted. Accordingly, each of the plurality of connection electrodes CNE may be disposed directly on the second insulating layer PAS2 and may be disposed on substantially the same layer.

Although not shown in the drawings, another insulating layer may be further disposed on the third insulating layer PAS3 and the plurality of connection electrodes CNE. The insulating layer may serve to protect members disposed on the first substrate SUB from an external environment.

The above-described first insulating layer PAS1 , second insulating layer PAS2 , and third insulating layer PAS3 may include an inorganic insulating material or an organic insulating material. However, the present invention is not limited thereto.

4 is a schematic diagram illustrating a light emitting device disposed in a display device according to an exemplary embodiment.

Referring to FIG. 4 , the light emitting device ED may be a light emitting diode, and specifically, the light emitting device ED has a size of nanometers to micrometers. and may be an inorganic light emitting diode made of an inorganic material. The light emitting device ED may be aligned between the two electrodes in which polarities are formed when an electric field is formed in a specific direction between the two electrodes facing each other.

The light emitting device ED according to an embodiment may have a shape extending in one direction. The light emitting device ED may have a shape such as a cylinder, a rod, a wire, or a tube. However, the shape of the light emitting element (ED) is not limited thereto, and the light emitting element ( ED) may have various forms.

The light emitting device ED may include a semiconductor layer doped with an arbitrary conductivity type (eg, p-type or n-type) impurity. The semiconductor layer may emit an electric signal applied from an external power source to emit light in a specific wavelength band. The light emitting device ED may include a first semiconductor layer 31 , a second semiconductor layer 32 , a light emitting layer 36 , an electrode layer 37 , and an insulating layer 38 .

The first semiconductor layer 31 may be an n-type semiconductor. The first semiconductor layer 31 may include a semiconductor material having a chemical formula of AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). For example, the first semiconductor layer 31 may be any one or more of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with n-type. The n-type dopant doped in the first semiconductor layer 31 may be Si, Ge, Sn, or the like.

The second semiconductor layer 32 is disposed on the first semiconductor layer 31 with the light emitting layer 36 interposed therebetween. The second semiconductor layer 32 may be a p-type semiconductor, and the second semiconductor layer 32 is composed of AlxGayIn1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1). and a semiconductor material having a chemical formula. For example, the second semiconductor layer 32 may be any one or more of AlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with p-type. The p-type dopant doped in the second semiconductor layer 32 may be Mg, Zn, Ca, Se, Ba, or the like.

Meanwhile, although the drawing shows that the first semiconductor layer 31 and the second semiconductor layer 32 are configured as one layer, the present invention is not limited thereto. Depending on the material of the light emitting layer 36, the first semiconductor layer 31 and the second semiconductor layer 32 may further include a larger number of layers, for example, a clad layer or a TSBR (Tensile strain barrier reducing) layer. may be

The light emitting layer 36 is disposed between the first semiconductor layer 31 and the second semiconductor layer 32 . The light emitting layer 36 may include a material having a single or multiple quantum well structure. When the light emitting layer 36 includes a material having a multi-quantum well structure, it may have a structure in which a plurality of quantum layers and a well layer are alternately stacked. The light emitting layer 36 may emit light by combining electron-hole pairs according to an electric signal applied through the first semiconductor layer 31 and the second semiconductor layer 32 . The emission layer 36 may include a material such as AlGaN or AlGaInN. In particular, when the emission layer 36 has a multi-quantum well structure in which quantum layers and well layers are alternately stacked, the quantum layer may include a material such as AlGaN or AlGaInN, and the well layer may include a material such as GaN or AlInN.

The light emitting layer 36 may have a structure in which a type of semiconductor material having a large band gap energy and a semiconductor material having a small band gap energy are alternately stacked with each other, and groups 3 to 5 are different according to the wavelength band of the emitted light. It may also include semiconductor materials. The light emitted by the light emitting layer 36 is not limited to light of a blue wavelength band, and in some cases, light of a red and green wavelength band may be emitted.

The electrode layer 37 may be an ohmic connection electrode. However, the present invention is not limited thereto, and may be a Schottky connection electrode. The light emitting device ED may include at least one electrode layer 37 . The light emitting device ED may include one or more electrode layers 37 , but the present invention is not limited thereto and the electrode layers 37 may be omitted.

The electrode layer 37 may reduce resistance between the light emitting element ED and the electrode or the connection electrode when the light emitting element ED is electrically connected to an electrode or a connection electrode in the display device 10 . The electrode layer 37 may include a conductive metal. For example, the electrode layer 37 may include at least one of aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), ITO, IZO, and ITZO.

The insulating film 38 is disposed to surround the outer surfaces of the plurality of semiconductor layers and the electrode layers described above. For example, the insulating layer 38 may be disposed to surround at least the outer surface of the light emitting layer 36 , and both ends of the light emitting device ED in the longitudinal direction may be exposed. In addition, the insulating layer 38 may be formed to have a round top surface in cross-section in a region adjacent to at least one end of the light emitting device ED.

The insulating layer 38 is formed of materials having insulating properties, for example, silicon oxide (SiO _x ), silicon nitride (SiN _x ), silicon oxynitride (SiO _x N _y ), aluminum nitride (AlN _x ), aluminum oxide ( AlO _x ) and the like. Although the drawing illustrates that the insulating film 38 is formed as a single layer, the present invention is not limited thereto, and in some embodiments, the insulating film 38 may be formed in a multi-layered structure in which a plurality of layers are stacked.

The insulating layer 38 may function to protect the members. The insulating layer 38 may prevent an electrical short that may occur in the light emitting layer 36 when it is in direct contact with an electrode through which an electrical signal is transmitted to the light emitting device ED. In addition, the insulating layer 38 may prevent a decrease in the luminous efficiency of the light emitting device ED.

In addition, the outer surface of the insulating film 38 may be surface-treated. The light emitting device ED may be sprayed onto the electrode in a state of being dispersed in a predetermined ink to be aligned. Here, in order to maintain the light emitting device ED in a dispersed state without agglomeration with other light emitting devices ED adjacent in the ink, the surface of the insulating layer 38 may be treated with hydrophobicity or hydrophilicity.

The display device 10 may include a plurality of light emitting devices ED disposed in each pixel PX, and may emit light through an electrical connection between the light emitting device ED and the electrode RME. In order for each pixel PX of the display device 10 to smoothly display light, whether the light emitting elements ED are defective, and the light emitting element ED, the connection electrode CNE, and the electrical connection of the electrode RME are defective. Whether or not it needs to be checked. The apparatus for inspecting a display device according to an exemplary embodiment may include devices capable of repairing the light emitting devices EDs or a problem occurring in the electrical connection of the light emitting devices ED and the corresponding pixels.

5 is a schematic diagram illustrating an inspection apparatus of a display apparatus according to an exemplary embodiment.

Referring to FIG. 5 , the inspection apparatus 100 of the display apparatus includes a camera apparatus 110 , a controller 120 , a processor 130 , and a repair apparatus 150 . The examination apparatus 100 of the display apparatus obtains a plurality of images or light emission information related to light emission of the display apparatus 10 from the display apparatus 10 to be examined by using the camera apparatus 110 , and the obtained information It is possible to check whether the display device 10 is defective. In addition, after determining the location of the defect and the type of the defect from the defect of the display device 10 , the defect may be supplemented or removed through the repair apparatus 150 .

The camera device 110 may acquire a plurality of image information from the display device 10 to be examined. The camera device 110 may acquire various types of image information required to inspect the display device 10 including various types of cameras. For example, the camera device 110 may obtain lighting image information based on light emission of the pixels PX when the display device 10 is driven. The plurality of pixels PX may include a lit pixel and some unlit pixels, and the camera device 110 may obtain image information in which some pixels are in an unlit state while the pixels PX are lit. The image information is provided to the processor 130 , and for example, the camera device 110 is a camera that obtains image information related to lighting of the pixels PX, a visible light camera that captures visible light, a time-of- Flight) camera, and may include any one of a light field (Light Field) camera.

Also, the camera device 110 may acquire heat image information based on heat generated by the pixels PX when the display device 10 is driven. When each pixel PX of the display device 10 normally emits light and when it emits abnormal light, heat generated by each pixel PX may be different. The camera device 110 may further include a camera of a different type from a camera that checks whether the light is turned on, and further obtains calorific value information from the pixel PX of the display device 10 . The test apparatus 100 of the display apparatus may obtain image information related to whether the camera device 110 is turned on or not, and image information related to heat generation, respectively. As an example, the camera device 110 is a camera that acquires image information regarding heat generation of the pixels PX, and may include either a thermal imaging camera or an infrared camera.

The controller 120 may be connected to the camera device 110 to determine the type of camera that captures the display device 10 . The controller 120 may select a camera suitable for acquiring image information from the display device 10 in the camera device 110 according to a command input from the processor 130 . As will be described later, in the inspection process of the display device 10 , the display device 10 is photographed using a different type of camera according to each step. , and information related to the pixel PX to be photographed may be transmitted from the processor 130 , and based on this, the photographing of the camera device 110 may be assisted.

The processor 130 may instruct the camera device 110 to acquire various types of image information in order to obtain various information about the pixels PX of the display device 10 . For example, when it is desired to obtain information related to whether lighting is performed from the display apparatus 10 , the processor 130 uses a camera capable of obtaining lighting information of the pixels PX from the camera apparatus 110 to the display apparatus (10) may be ordered to be photographed. Alternatively, when it is desired to obtain heat-related information from the display device 10 , the processor 130 uses a camera capable of obtaining heat information of the pixels PX from the camera device 110 to the display device 10 . can be ordered to be photographed. A command input from the processor 130 may be provided to the camera device 110 or the controller 120 connected thereto.

Also, according to an exemplary embodiment, the processor 130 determines the light emission information of the pixels PX of the display device 10 from the image information obtained from the camera device 10 , and defectiveness of the pixels PX based on the light emission information. Information may be obtained and an operation of the repair apparatus 150 may be commanded based on the information on the defective pixels. When the processor 130 obtains light emission information of each pixel PX from the image information obtained by the camera device 110 , the processor 130 may determine whether the corresponding pixel PX is a bad pixel from the light emission information. The processor 130 may receive a plurality of image information from the camera device 110 , analyze the image information, and extract light emission information of each pixel PX. Normal pixels and defective pixels may be classified from the extracted emission information, and a repair process may be commanded to the repair apparatus 150 according to the defective types of the defective pixels.

In an embodiment, the light emission information obtainable from the processor 130 includes position information of the pixels PX, information on the light emission amount and light emission of the pixel PX extractable from the lighting image information (hereinafter referred to as light emission information) , and information on the amount of heat generated by the pixel PX and whether heat is generated (hereinafter referred to as heat amount information), which can be extracted from the heat image information. The light emission amount information and the heat generation amount information may be information necessary for determining a bad pixel of the corresponding pixel PX, and the location information of the pixels PX may be information necessary for performing a repair process on the corresponding pixel PX.

Also, the defect information obtainable from the processor 130 may include information on the cause of the defect in the bad pixel and information on the location of the cause of the defect. The defect information obtained by the processor 130 is information necessary for selecting a repair process suitable for the corresponding defective pixel, and a repair process suitable for the repair process may be performed based on information extracted from the defect information.

As an algorithm for obtaining the light emission information and the defect information, the processor 130 includes an algorithm for determining a bad pixel from the image information obtained from the camera device 110 , an algorithm for determining whether the corresponding bad pixel is a repairable pixel, and a corresponding defect It may include an algorithm for extracting position information of pixels, an algorithm for determining a repair process suitable for the defective pixel, and the like.

For example, the algorithm for determining the bad pixel may be an algorithm for determining whether the corresponding pixel is a pixel PX in need of repair from light emission information obtained from the camera device 110 . Based on the light emission information extracted from the lighting image information and the heat image information of the pixel PX obtained from the camera device 110, if the information does not meet the reference value, the pixel PX is determined as defective, and In this case, it may be determined that the corresponding pixel PX is normal. The processor 130 may store reference data of luminance information and calorific value information for determining that each pixel PX of the display device 10 is a normal pixel, and the acquired information is used in the algorithm for determining the bad pixel. A bad pixel may be determined by comparing the reference data with the reference data.

However, the present invention is not limited thereto. The processor 130 may obtain image information in a state in which reference data is not input before the examination of the display apparatus 10 , and may generate reference data from the obtained image information. In this case, since the processor 130 executes an algorithm for generating reference data from a plurality of image information at the same time as the image information is acquired, and forms reference data corresponding to each of the display devices 10 to be inspected, There is an advantage in that it is easy to cope with the performance difference.

An algorithm for determining whether the corresponding bad pixel is a repairable pixel may be performed based on emission information of pixels selected as the bad pixel. Whether repair is possible by a process performed by the repair apparatus 150 may be determined based on emission information of the defective pixels. When it is determined that repair is possible by the processor 130 , a repair process corresponding thereto may be determined together. Otherwise, a failure determination may be determined with respect to the display device 10 to be inspected.

The algorithm for extracting the location information of the corresponding bad pixels may be an algorithm for acquiring information on the positions of the selected bad pixels and the point where the defect occurs in the corresponding pixel. As described above, the display device 10 to be inspected includes a plurality of pixels PX arranged in the first direction DR1 and the second direction DR2 , and a plurality of light emitting devices even within one pixel PX. It may be divided into a plurality of sub-pixels SPXn including EDs and electrodes RME. The algorithm for extracting the location information of the bad pixels collects the coordinate values of the bad pixels among the plurality of pixels PX arranged in the row direction and the column direction, and information on the point at which the defect occurred in the corresponding pixel PX. can be obtained

An algorithm for determining a repair process suitable for the bad pixel may be an algorithm for determining a repair process suitable for the bad pixel based on defect information of the bad pixel. The processor 130 may extract defect information on a bad pixel from the acquired image information, and check the type of a defect that has occurred in the corresponding pixel from the bad information. For example, when the light emitting device ED of the corresponding pixel PX is a bad light emitting device, the electrical connection between the light emitting devices ED is not smooth, or the number of the light emitting devices ED is Various types of defects may be determined, such as when there is a difference from other pixels PX. According to the type of the defective pixel determined by the processor 130 , the repair apparatus 150 may perform a corresponding repair process on the corresponding pixel PX. A description of the plurality of algorithms performed by the processor 130 will be described later with reference to other drawings.

The repair apparatus 150 may repair defective pixels of the display apparatus 10 according to a command received from the processor 130 . The repair apparatus 150 may perform a process of removing a cause of a defect in the pixel PX and a process of supplementing the pixel PX when the pixel PX does not have a required amount of light emission. For example, when the corresponding pixel PX is determined to be a bad pixel by the corresponding light emitting device ED including the light emitting device ED having a short circuit or defective electrical connection, the repair device 150 may A process of removing the short-circuited or defective light emitting device ED may be performed. Alternatively, when the corresponding pixel PX has insufficient light emission compared to the normal pixel, the corresponding pixel PX is determined as a bad pixel due to the insufficient number of the light emitting elements ED, and the repair apparatus 150 emits light to the corresponding bad pixel. A process of re-transferring the devices ED may be performed. As described above, the repair process performed by the repair apparatus 150 may vary depending on the cause of the defect of the defective pixel based on information obtained from the camera apparatus 110 and the processor 130 .

Hereinafter, a method for inspecting a display apparatus and an operation of the inspection apparatus according to an exemplary embodiment will be described with further reference to other drawings.

6 is a flowchart illustrating a method of inspecting a display apparatus according to an exemplary embodiment.

Referring to FIG. 6 , in a method of inspecting a display device according to an embodiment, a first inspection step ( S10 ) of the display device 10 using the camera device 110 , and whether unlit pixels exist in the display device 10 . It may include a step of checking whether or not (S20), and a step (S30) of repairing unlit pixels. The repair step (S30) for the unlit pixel includes the step of obtaining position information of the unlit pixel (S31), the second inspection step (S33) of the unlit pixel using the camera device 110, and the repair device 150 for the unlit pixel. A pixel repair step S35 may be included.

The inspection method of the display apparatus may be performed by the inspection apparatus 100 of the display apparatus described above with reference to FIG. 5 . The first inspection step S10 of the display device 10 and the second inspection step S33 of unlit pixels are performed by different cameras (‘111’ in FIG. 7 and ‘113’ in FIG. 9 ) included in the camera device 110 . ') can be done. In the images acquired in the first inspection step ( S10 ), it is possible to check whether there is an unlit pixel, thereby confirming the light emission failure of the display apparatus 10 . The images acquired in the second inspection step (S33) can identify the cause of a defect in the unlit pixel, and the processor 130 performs the defect through the information obtained in the first inspection step (S10) and the second inspection step (S33). The cause may be determined and the repair apparatus 150 may be instructed to perform a repair process. Hereinafter, the operation and algorithm of the inspection apparatus 100 of the display apparatus 10 performed in each step will be described in detail.

7 and 8 are schematic diagrams illustrating a first inspection step using a camera device in a method of inspecting a display device according to an exemplary embodiment.

7 and 8 , the inspection method of the display device includes obtaining lighting image information from pixels PX when the display device 10 is turned on by using the first camera 111 of the camera device 110 . A first inspection step (S10) is included. The first camera 111 of the camera device 110 may be an optical camera device that checks whether the light is lit through the light emitted from each pixel PX.

When each pixel PX of the display device 10 is turned on, the pixels PX may be divided into a normal pixel PXA, which is a normally lit pixel, and an unlit pixel PXB, which is not lit. In the normal pixel PXA, the light emitting devices ED may be pixels including the normal light emitting layer 36 and electrically connected to the electrodes RME1 and RME2 so that each of the light emitting devices ED smoothly emit light. On the other hand, in the unlit pixel PXB, the light emitting devices ED may include an abnormal or damaged light emitting layer 36 , or may not be electrically connected to the electrodes RME1 and RME2 .

The first camera 111 may acquire lighting image information in which the normal pixels PXA and the unlit pixels PXB exist by photographing the entire display area DPA of the display apparatus 10 . In the lit image information, the normal pixel PXA and the unlit pixel PXB may be located in a mixture, and the first camera 111 separates the normal pixel PXA and the unlit pixel PXB and displays them without shooting. The lighting image information may be acquired by photographing the entire pixel PX disposed in the area DPA at once.

The lighting image information obtained by the camera device 110 is transmitted to the processor 130 of the inspection device 100 of the display device. The processor 130 checks whether the unlit pixel PXB exists from the lit image information obtained in the first inspection step S10 ( S20 ). Unlike FIGS. 7 and 8 , if the unlit pixel PXB does not exist in the obtained lit image information, the inspection of the corresponding display device 10 is terminated. However, if there is an unlit pixel PXB among the pixels PX in the display area DPA, the repair step S30 of the unlit pixel PXB may be performed.

9 and 10 are schematic diagrams illustrating a second inspection step using a camera device in a method of inspecting a display device according to an exemplary embodiment.

Next, referring to FIGS. 9 and 10 , in the repair step ( S30 ) of the unlit pixel PXB, after obtaining ( S31 ) the location information of the unlit pixel PXB among the plurality of pixels PX, A second inspection step S33 of inspecting the unlit pixels PXB using the second camera 113 of the camera device 110 is performed.

The step ( S31 ) of obtaining the location information of the unlit pixel PXB may be performed by the processor 130 in the test apparatus 100 of the display apparatus. The processor 130 may obtain position information, which is one of light emission information of the unlit pixel PXB, from the lit image information provided from the camera device 110 . For example, in the display area DPA in which the plurality of pixels PX are arranged in the first direction DR1 and the second direction DR2 , the location information of the unlit pixel PXB is obtained as a coordinate value of a Cartesian coordinate system. can be However, the type of location information of the unlit pixel PXB is not limited thereto.

When the processor 130 obtains the location information of the unlit pixels PXB, the processor 130 may transmit a command for performing the second inspection step S33 to the camera device 110 and the controller 120 . The command transmitted from the processor 130 is received by the controller 120 to operate the second camera 113 of the camera device 110 . The controller 120 may receive the location information of the unlit pixels PXB together from the processor 130 , and the second camera 113 captures and adds the unlit pixels PXB corresponding to the received location information. Image information can be obtained.

According to an embodiment, the second inspection step ( S33 ) using the second camera 113 is a step of acquiring heat image information obtained by measuring heat generated in the pixel PX when the unlit pixel PXB is turned on. can be The second camera 113 of the camera device 110 may be a thermal imaging camera device capable of imaging heat generated from the unlit pixel PXB.

Each pixel PX of the display device 10 includes a plurality of light emitting devices ED, and in the unlit pixel PXB, the light emitting device ED itself is defective or shorted by some of the light emitting devices ED. may be in a state of When the unlit pixel PXB is turned on, light is not emitted from the light emitting devices ED, whereas in the light emitting device ED, which is a cause of failure, or the short circuit point, the amount of heat generated is greater than that of other parts due to excessive current flow. can The second camera 113 may detect heat generated in the unlit pixel PXB and acquire heat image information for identifying a point where an excessive current flows.

The processor 130 may obtain light emission information of the plurality of pixels PX based on the lighting image information obtained in the first inspection step S10 and the heat image information obtained in the second inspection step S33, and , among the unlit pixels PXB, defect information based on the light emission information may be checked. The processor 130 may obtain the type of the failure cause and location information of the failure cause as the failure information of the unlit pixel PXB. As illustrated in FIG. 10 , when more heat is generated at the point where the second light emitting device ED2 is positioned compared to the point where the first light emitting device ED1 is positioned in the unlit pixel PXB, the unlit pixel PXB ) may be caused by a second light emitting device ED2 or a problem occurring at a point where the second light emitting device ED2 is disposed. The processor 130 may acquire information on the location of the cause of the failure from the heat image information and the type of the cause of the failure therefrom.

When the processor 130 obtains information on the location and type of the cause of the defect from the heat image information, the processor 130 may select a repair process suitable for it, and transmit a command for performing the repair process to the repair apparatus 150 .

11 is a schematic diagram illustrating a repair step using a repair apparatus in a method of inspecting a display apparatus according to an exemplary embodiment.

Next, referring to FIG. 11 , the repair apparatus 150 performs a step S35 of repairing the unlit pixel PXB through the repair information received from the processor 130 . The repair device 150 may include a laser device 151 that physically removes a cause of the failure of the unlit pixel PXB, and in the step S35 of repairing the unlit pixel PXB, the laser device 151 . can physically remove the cause of the defect by irradiating the laser to the location of the cause of the defect. For example, when the defective cause of the unlit pixel PXB is caused by a defective light emitting device, the laser device 151 may destroy or remove the defective light emitting device by irradiating a laser beam. The processor 130 may acquire the cause of the defect and the location information of the cause of the defect, and the repair device 150 may be configured with a defective light emitting element, which is a defective cause of the unlit pixel PXB, based on the information provided by the processor 130 . A laser can be irradiated to that position. As the repair apparatus 150 performs the repair process selected by the processor 130 , the cause of the failure of the unlit pixel PXB may be removed, and the unlit pixel PXB becomes the lit pixel PXA according to the removal of the defective cause. can be

Meanwhile, in FIG. 11 , the laser device 151 of the repair device 150 performs the defective second light emitting device ED2 while exemplifying the case where the cause of the failure of the unlit pixel PXB is the failure of the light emitting element ED. The removal process is shown. However, the cause of the failure of the unlit pixel PXB may be due to a member other than the light emitting device ED. As described above, in the display apparatus 10 , the plurality of light emitting elements ED may be electrically connected to the electrode RME through the connection electrodes CNE. Although the connection electrodes CNE are spaced apart from each other, if different connection electrodes CNE are partially connected due to a process error, the corresponding point may be electrically shorted, which may cause a defect. In this case, the inspection apparatus 100 of the display apparatus acquires information on a point where the connection electrodes CNE are electrically short-circuited in the repair step S30 of the unlit pixel PXB, and performs a repair process for the short-circuited point. This can be done.

12 is a schematic diagram illustrating a second inspection step using a camera device in a method of inspecting a display device according to another exemplary embodiment. 13 is a schematic diagram illustrating a repair step using a repair apparatus in a method of inspecting a display apparatus according to another exemplary embodiment.

12 and 13 , in the first inspection step S10 , the light emitting devices ED of the lit pixel PXA may emit light, but the light emitting devices ED of the unlit pixel PXB may not emit light. . In the lighting pixel PXA, the first connection electrode CNE1 and the second connection electrode CNE2 are disposed on the first electrode RME1 and the second electrode RME2 so as not to be directly connected to each other. On the other hand, in the unlit pixel PXB, as portions of the first connection electrode CNE1-1 and the second connection electrode CNE2-1 directly contact each other and are connected to each other, the first connection electrode CNE1-1 and the second connection electrode CNE1-1 are connected to each other. The two connection electrodes CNE2-1 may be electrically shorted. Electrical signals applied to the first electrode RME1 and the second electrode RME2 may flow only through points where the connection electrodes CNE1-1 and CNE2-1 are shorted, and the light emitting devices ED may not emit light. . The inspection apparatus 100 of the display apparatus according to an embodiment detects a defect in which the connection electrodes CNE1-1 and CNE2-1 of the unlit pixel PXB are short-circuited through the camera apparatus 110 and the processor 130 . Defect information may be acquired, and the repair apparatus 150 may perform a repair process of removing a short circuit defect of the connection electrodes CNE1-1 and CNE2-1 from the defect information.

According to an embodiment, when the cause of the failure of the unlit pixel PXB is a short circuit of the connection electrodes CNE1-1 and CNE2-1, in the second inspection step S33, the connection electrode ( CNE1-1, CNE2-1) may acquire thermal image information for a short-circuited point. At a point where the connection electrodes CNE1-1 and CNE2-1 of the unlit pixel PXB are short-circuited, a large amount of current may flow, and the amount of heat generated may be higher than at other locations. The processor 130 compares the amount of heat generated by the other light emitting devices ED from the heat image information with the amount of heat generated at the point where the connection electrodes CNE1-1 and CNE2-1 are shorted, and the unlit pixel PXB It is possible to obtain the point that the cause of the failure is a short circuit of the connection electrodes CNE1-1 and CNE2-1 and the location information of the corresponding short circuit.

The processor 130 may select a repair process corresponding thereto from the acquired defect information and transmit a command to the repair apparatus 150 . The repair apparatus 150 may check a point where the connection electrodes CNE1-1 and CNE2-1 are short-circuited, and may irradiate a laser using the laser apparatus 151 . When the point where the connection electrodes CNE1-1 and CNE2-1 are short-circuited is removed by laser irradiation, the connection electrodes CNE1-1 and CNE2-1 may be connected to the light emitting device ED without being shorted. , a cause of defects in the unlit pixel PXB may be removed.

14 is a schematic diagram illustrating a repair step using a repair apparatus in a method of inspecting a display apparatus according to another exemplary embodiment.

Referring to FIG. 14 , the repair step S35 performed in the inspection method of the display device may include a process of retransferring the light emitting devices ED to the unlit pixel PXB and electrically connecting the light emitting devices ED to the electrode RME. can The inspection apparatus 100 of the display apparatus may further include a retransfer apparatus 153 for retransferring the light emitting elements ED by the repair apparatus 150 , and emit light in response to a defective cause of the unlit pixel PXB. A process of re-transferring the devices ED may be performed.

11 and 13 , a process of removing the short-circuit point of the light emitting device ED or the connection electrodes CNE may be performed using the laser device 151 of the repair device 150 . However, the cause of the failure of the unlit pixel PXB is not limited thereto, and in some cases, only the light emitting devices ED_U having either one of both ends not connected to the electrode RME are disposed, so that the normally connected light emitting devices are disposed. (ED) may not be lit because they do not exist. In this case, the repair device 150 retransfers the light emitting devices ED to the corresponding unlit pixel PXB using the retransfer device 153 of the light emitting devices ED, and forms new connection electrodes CNE. Thus, a process of connecting the re-transferred light emitting devices ED_T to the electrode RME may be performed. For example, the retransfer apparatus 153 of the light emitting devices ED may be an inkjet printing method, an electrostatic head transfer method, a bonding stamp transfer method, a deposition method, or a pick and place method retransfer apparatus. . In addition, although not shown in the drawings, the repair device 150 may include a device for additionally patterning the connection electrodes CNE, and the newly re-transferred light emitting devices ED_T are additionally patterned connection electrodes CNE. The electrodes may be electrically connected to the electrode RME.

As described above, the inspection apparatus 100 of the display apparatus may obtain a plurality of image information through the camera apparatus 110, and may obtain information about a defect from the image information obtained by the processor 130, The repair apparatus 150 may perform a repair process based on the defect information obtained from the processor 130 . According to an embodiment, in the method of inspecting a display device, it is determined whether the display device 10 including the light emitting devices ED is defective using the inspection device 100 of the display device, and based on the type of the defect and corresponding information. An appropriate repair process may be performed.

15 is a flowchart illustrating a method of inspecting a display apparatus according to another exemplary embodiment.

Referring to FIG. 15 , in the method of inspecting a display device according to an exemplary embodiment, in addition to the repair step S30 for the unlit pixels PXB, the repair step of the bad pixels based on the emission information of the lit pixels PXA ( S40) may be further included. In the first inspection step ( S10 ), when lit image information for the lit pixel PXA and the unlit pixel PXB is obtained using the first camera 111 , the lit pixel PXA and the unlit pixel PXB , and a repair step S30 for the unlit pixel PXB may be performed. In the repairing step S30 of the unlit pixel PXB, the repairing step S30 may be performed for the purpose of emitting light by removing causes of defects in the non-emitting pixel.

However, in contrast to this, some pixels among the lit pixels PXA may not have a desired amount of light emission, and although the corresponding pixels are the lit pixels PXA, there may be pixels that require a repair step S40 . The method of inspecting a display apparatus according to an exemplary embodiment may further include a repair step for the lit pixels PXA to have a uniform amount of light emitted as a repair step S40 of the lit pixels PXA.

16 and 17 are schematic diagrams illustrating a step of obtaining light emission information of lit pixels in the inspection method of the display device of FIG. 15 . 18 is a schematic diagram illustrating a repair step in the inspection method of the display device of FIG. 15 .

Referring to FIGS. 16 to 18 in addition to FIG. 15 , a method of inspecting a display device according to an exemplary embodiment is a repair step S40 for the lit pixels PXA, in which light emission information of the lit pixels PXA is obtained. The method may include a step S41 , a step S43 of obtaining bad pixel information through emission information, and a step S45 of repairing the bad pixels using the repair apparatus 150 . The repairing step S40 for the lit pixels PXA may be a step of distinguishing lit pixels having a certain level of emission from among the lit pixels PXA and lit pixels that do not, and uniformly adjusting their emission amount. have.

First, in the step S41 of obtaining light emission information of the lit pixels PXA, light emission amount information is obtained as light emission information of the lit pixels PXA from the lit image information of the lit pixels PXA obtained by using the camera device 110 . It may be an acquisition step.

The display device 10 to be inspected may require that the plurality of pixels PX have a certain level of light emission in order to be determined as a good product. The predetermined level of light emission may be measured as the amount of light emitted from each pixel PX or may be measured as the total amount of light emitted from the plurality of pixels PX. However, if the amount of light emitted from each pixel PX all has the above-described predetermined level of light emission, the display device 10 may have a uniform amount of light irrespective of a location in the display area DPA.

For example, the plurality of lit pixels PXA may be divided into a first lit pixel PXA1 , a second lit pixel PXA2 , and a third lit pixel PXA3 based on emission amount information. When the lit pixel PXA satisfying the emission amount required for each pixel PX in the display device 10 is the second lit pixel PXA2 , the first lit pixel PXA1 is the second lit pixel PXA2 . The light-emitting pixel may be a light-emitting pixel having a larger light emission amount, and the third light-emitting pixel PXA3 may be a light-emitting pixel having a smaller light emission amount than the second light-emitting pixel PXA3 . The second lit pixel PXA2 may be a normally lit pixel having a certain level of light emission, and the first lit pixel PXA1 and the third lit pixel PXA3 may be classified as relatively poorly lit pixels. The step of obtaining the light emission information of the lit pixels PXA may be a step of obtaining information on the amount of light emitted by each of the lit pixels PXA, and classifying the normally lit pixels and the badly lit pixels therefrom.

Meanwhile, the amount of light required for each pixel PX to be classified as the normally lit pixel PXA in the display device 10 may be a value set when the display device 10 is manufactured. When the amount of light required for each pixel PX is set when the display device 10 is manufactured, manufacturing process conditions for each pixel PX may be adjusted accordingly. For example, when the amount of light required for each pixel PX is determined, the number of light emitting devices ED required for the corresponding pixel PX and the intensity of the driving current may be calculated, and the display device 10 may be manufactured. In this case, it may be performed in the manufacturing process according to set conditions. In the step (S41) of obtaining the emission information of the lit pixels of the inspection method of the display device, a normally lit pixel (eg, a second lit pixel) and a poorly lit pixel (eg, a first and a third lit pixel) are determined based on the set value. can be classified.

However, the method of setting the amount of light required for each pixel PX in the display device 10 is not limited thereto. In the inspection method of the display device, the standard of the amount of light that becomes a normally lit pixel among the lit pixels PXA is not based on a previously set value, but a setting value extracted from luminescence information of the lit pixels PXA of the display device 10 have. The lit pixel PXA that becomes a normally lit pixel in the operation S41 of obtaining the emission information of the lit pixels PXA may be determined by a value calculated from the luminescence information.

Subsequently, after obtaining the light emission information of the lit pixels PXA ( S41 ), a step S43 of obtaining light emission information of the poorly lit pixels through the light emission information may be performed. As described above, when the normally lit pixels and the badly lit pixels are classified by obtaining the emission information of the lit pixels PXA, the step of acquiring additional information on the badly lit pixels to be repaired may be performed. According to an embodiment, the step of obtaining information on the poorly lit pixels ( S43 ) may include obtaining location information and the bad information of the badly lit pixels based on emission information of the badly lit pixels.

16 and 17 , the plurality of lit pixels PXA are inspected with the camera device 110 to obtain location information of the first lit pixel PXA1 and the third lit pixel PXA3 that are badly lit pixels. acquire When location information of the first lit pixel PXA1 and the third lit pixel PXA3, which are the badly lit pixels, is obtained, defective information such as information on the cause of the defect and the location of the defective cause can be obtained from the badly lit pixel. have. For example, the failure information of the defective lighting pixels may be obtained from lighting image information obtained by using the first camera 111 of the camera device 110 . The lighting image information obtained by using the first camera 111 is an image obtained by an optical method, and light emission amount information of each lighting pixel PXA may be obtained. Normal lighting pixels may be arranged around the poorly lit pixels, and points in which the luminous amount is different can be easily distinguished based on the luminous amount of a specific position in image information obtained by an optical method. It is possible to determine whether the pixel is a badly lit pixel by comparing the light emission amount of other surrounding pixels based on the light emission amount of the normally lit pixel.

Similarly, the cause of the failure of the badly lit pixels may also be identified through comparison with the normal lit pixels. For example, when the second lit pixel PXA2, which is a normally lit pixel, includes a predetermined number of light emitting elements ED and has a desired amount of light emission, the first lit pixel PXA1 and the third lit pixel PXA1 as a bad lit pixel The PXA3 may not have a desired level of light emission by including a different number of light emitting devices ED. A case in which the first lit pixel PXA1 includes a greater number of light emitting devices ED and a large amount of light emission, and a case in which the third lit pixel PXA3 includes a smaller number of light emitting devices ED and a small amount of light emission can be A cause of the failure of the first lit pixel PXA1 and the third lit pixel PXA3 obtained through comparison with the second lit pixel PXA2 may be a difference in the number of the light emitting elements ED.

However, in the drawings, only the step of obtaining position information of the defective lighting pixels or obtaining the cause of the failure by using the first camera 111 is exemplified, but the present invention is not limited thereto. Similar to the step of determining the cause of the failure of the unlit pixels PXB, the second camera 113 of the camera device 110 may be utilized in the step of determining the cause of the failure of the defective lighting pixels.

Subsequently, after obtaining bad information on the badly lit pixels ( S43 ), a step of repairing the badly lit pixels using the repair apparatus 150 based on the information ( S45 ) may be performed. In this step, a repair process may be performed on each of the badly lit pixels in response to the cause of the failure of the badly lit pixels.

Similar to the repair step of the unlit pixel PXB, a repair process using the laser device 151 may be performed in the repair step of the badly lit pixel. For example, when a larger number of light emitting devices ED are disposed as compared to the normally lit pixel, such as the first lit pixel PXA1 , a repair for lowering the amount of light emission through a process of removing some of the light emitting devices ED The process may be performed. In one embodiment, in the repairing step S45 of the badly lit pixel, a process of removing some of the light emitting devices ED disposed in the badly lit pixel using the laser device 151 of the repair device 150 is performed. can In the first lit pixel PXA1 , some light emitting devices ED are removed or destroyed by the laser irradiated from the laser device 151 , and the light emitting amount is reduced as the remaining light emitting devices ED emit light. have.

On the other hand, when a smaller number of light emitting devices ED are disposed as compared to the normally lit pixels, such as the third lit pixel PXA3 , a repair process for increasing the amount of light emission through a process of further disposing the light emitting devices ED is performed. can be In an exemplary embodiment, in the repairing step S45 of the badly lit pixel, the light emitting devices ED are retransferred to the badly lit pixel using the retransfer device 153 of the repair device 150 , and the electrode RME and A process of electrically connecting may be performed. In the third lighting pixel PXA3 , some of the light emitting devices ED are retransferred onto the electrodes RME through the retransfer device 153 , and the corresponding light emitting devices ED are transferred to the electrodes through the new connection electrode CNE. (RME) may be electrically connected. In the corresponding pixel, as additional light emitting devices ED are disposed, a correction may be performed to increase the amount of light emission.

Through the above process, when the light emission amount of the poorly lighted pixels among the lighted pixels PXA is corrected, the lighted pixels PXA of the display device 10 may have a more uniform light emission than the original manufacturing state, and The luminous quality can be improved.

Meanwhile, in the present embodiment, as the inspection method of the display apparatus performs the repair step S40 of the lit pixels PXA in addition to the repair step S30 of the unlit pixels PXB, the unlit pixels PXB are repaired. When step S30 is performed, step S20 of additionally checking whether the unlit pixel PXB exists may be performed. Even if the unlit pixels PXB are repaired, the corresponding pixels PX may not all become normally lit pixels. Therefore, the repairing step S40 of the lit pixels PXA is also performed on the repaired unlit pixels PXB. can be Accordingly, after the repairing of the unlit pixels PXB is performed, a step S20 of checking whether the unlit pixels exist again is performed, and in some cases, the repairing of the lit pixels PXA ( S40 ) can be performed.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. you will be able to understand Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

10: display device
100: inspection device of the display device
110: camera device
120: controller
130: processor
150: repair device

Claims (20)

a first inspection step of turning on a display device including a plurality of pixels in which a plurality of light emitting elements are disposed, and obtaining lighting image information from the pixels;
checking whether a lit pixel and an unlit pixel exist among the plurality of pixels from the lit image information;
a second inspection step of obtaining position information of the unlit pixels among the light emission information and obtaining heat image information from the unlit pixels; and
a repair step of obtaining defective information of the unlit pixels from the light emitting information obtained from the lighting image information and the heat image information, and repairing the unlit pixels based on the failure information,
The repairing step may include removing some of the light emitting devices disposed in the unlit pixel, or retransferring the light emitting device to the unlit pixel. The method of claim 1,
The first inspection step is performed with a first camera that acquires the lighting image information through the light emitted from the pixels when the display device is turned on,
The second inspection step is performed by a second camera for acquiring the heat image information through heat generated in the pixels when the display device is turned on. The method of claim 1,
The light emission information includes light emission amount information obtained from the lighting image information, and heat amount information obtained from the heat generation image information,
The defect information includes information on a type of a cause of the failure of the unlit pixel and information on a location of the cause of the failure. The method of claim 1,
The display device includes a first electrode and a second electrode disposed on each pixel, and a first connection electrode disposed on the first electrode and a second connection electrode disposed on the second electrode,
The light emitting element is disposed on the first electrode and the second electrode and is in contact with the first connection electrode and the second connection electrode. 5. The method of claim 4,
The second inspection step includes acquiring position information of a defective light emitting element among the light emitting elements disposed in the unlit pixel from the heat image information. 6. The method of claim 5,
The repairing step includes irradiating a laser from the unlit pixel to the defective light emitting device. 5. The method of claim 4,
The second inspection step includes acquiring position information of a point where the heating value is higher than that of other parts in the short circuit of the first connection electrode and the second connection electrode disposed in the unlit pixel from the information from the heating image A method of inspecting a display device. 8. The method of claim 7,
The repairing step includes irradiating a laser to a point where the first connection electrode and the second connection electrode are short-circuited in the unlit pixel. 5. The method of claim 4,
The second inspection step includes obtaining position information of an unlit pixel among the unlit pixels in which the light emitting elements are not connected to the first electrode and the second electrode,
The repairing step includes the step of retransferring the light emitting elements to the corresponding unlit pixel. 4. The method of claim 3,
obtaining the light emission information of the lighted pixels and classifying the lighted pixels into a normally lighted pixel and a bad lighted pixel having a different light emission amount from the normally lighted pixel;
obtaining position information of the badly lit pixels and the light emission information of the badly lit pixels; and
and repairing the defective lighting pixels based on the light emission information. 11. The method of claim 10,
The classifying the normally lit pixel and the badly lit pixel may include: designating the lit pixels, among the lit pixels, whose emission amount is within a range of a reference set value, as the normally lit pixels;
and comparing the light emission amount with the normally lit pixel and designating the pixel as the badly lit pixel. 11. The method of claim 10,
The poorly lit pixel is a first lit pixel having a higher light emission amount than the normally lit pixel; and
A method of inspecting a display device including a second lit pixel having a lower emission amount than the normal lit pixel. 13. The method of claim 12,
In the step of repairing the defective lighting pixels, the first lighting pixel is subjected to a process of removing some of the light emitting elements,
The method of inspecting a display device in which the second lit pixel is subjected to a process of retransferring the light emitting elements. In the inspection apparatus of a display device including a plurality of pixels on which a plurality of light emitting elements are disposed,
a camera device for acquiring a plurality of image information from the pixels of the display device;
a processor for obtaining light emission information of the pixels and defect information of the pixels from the obtained image information; and
and a repair apparatus for performing a repair process on the pixels based on the defect information obtained from the processor;
the processor obtains the light emission information for a lit pixel and an unlit pixel from the image information to obtain the failure information of the unlit pixel,
The repair apparatus is an inspection apparatus of a display apparatus that performs the repair process on the unlit pixels. 15. The method of claim 14,
The image information includes lighting image information based on the amount of light emitted when the pixels are turned on, and
and heat image information based on the amount of heat emitted when the pixels are turned on,
The camera device is an inspection apparatus of a display device including a first camera for acquiring the lighting image information, and a second camera for acquiring the heat image information. 16. The method of claim 15,
The light emission information includes light emission amount information of the pixel and heat generation amount information of the pixel,
The processor classifies the lit pixel and the unlit pixel from the light emission amount information, and obtains the failure information of the unlit pixel from the light emission amount information and the calorific value information. 17. The method of claim 16,
The processor converts the lit pixels to the normally lit pixels based on the light emission amount information of the lit pixels, and
An inspection apparatus of a display device for distinguishing between the normally lit pixels and the badly lit pixels having a different light emission amount. 16. The method of claim 15,
The defect information includes information on a type of a cause of the defect of the pixel and a location of the cause of the defect,
The repair device may include a laser device configured to remove some of the light emitting devices disposed in the pixel based on the failure information, and
and a retransfer device for transferring the light emitting element to the pixel based on the defect information. 19. The method of claim 18,
The display device includes a first electrode and a second electrode disposed for each pixel, and
a first connection electrode disposed on the first electrode and a second connection electrode disposed on the second electrode;
The light emitting element is disposed on the first electrode and the second electrode and is in contact with the first connection electrode and the second connection electrode. 20. The method of claim 19,
The laser device is an inspection device for a display device that removes a portion in which the first connection electrode and the second connection electrode are connected to each other from the unlit pixel.

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