KR20220086469A - Storage device, exposure apparatus and method of manufacturing article - Google Patents

Abstract

A storage device for accommodating a circular plate including a patterned surface on which a pattern is formed, a first air flow along a first surface opposite to the patterned surface of the original plate, and installed spaced apart from the patterned surface to protect the patterned surface a first supply unit for blowing and supplying gas so that at least one air flow of a second air flow along a second surface opposite to the side of the pattern surface of the protective member is formed, and the at least one formed by the first supply unit a second supply unit for blowing and supplying gas so as to form a third airflow that interferes with one airflow; has a member including a receiving surface for receiving, wherein the first supply unit is disposed inside a receiving space for accommodating the original plate with reference to a transport port for transporting the original plate, and the second supply unit includes: It provides a storage device, characterized in that it is disposed on the front side of the storage space with respect to the transfer port.

Description

Storage device, exposure device and manufacturing method of articles {STORAGE DEVICE, EXPOSURE APPARATUS AND METHOD OF MANUFACTURING ARTICLE}

The present invention relates to a storage device, an exposure device, and a method for manufacturing an article.

In the manufacturing process (lithography process) of a semiconductor element or liquid crystal display element, an exposure apparatus that projects a pattern of an original plate (mask or reticle) onto a substrate (wafer) on which a resist material is disposed, and transfers (forms) the pattern onto the substrate is used. . In the exposure apparatus, when the pattern of the original plate is projected onto the substrate, that is, during exposure of the substrate, if foreign materials or the like are present on the original plate, these foreign substances are transferred together with the pattern onto the substrate, causing defects (defects).

Therefore, in general, the original plate is provided with a protective member called a pellicle in order to prevent foreign matter from adhering to the pattern surface (the surface on which the pattern is formed) of the original plate. The pellicle has, for example, a film-like one made of a synthetic resin. The pellicle is supported by being offset by a predetermined distance from the pattern surface of the original plate via the pellicle support frame. Accordingly, since the foreign material adheres to the pellicle film offset by a predetermined distance from the pattern surface of the original plate, it does not focus on the substrate during exposure and only appears as illuminance unevenness. In this way, by providing the pellicle on the original plate, the influence of foreign substances during exposure can be reduced.

Further, in exposure apparatuses, in order to realize high resolution in response to miniaturization of semiconductor elements, shorter exposure wavelengths are progressing. At present, the exposure wavelength is mainly 248 nm for KrF excimer laser and 193 nm for ArF excimer laser belonging to the vacuum ultraviolet region. This becomes a problem. Specifically, first, due to a reaction between an acid and a base existing on the surface or in the atmosphere of the original plate, or a photochemical reaction of organic impurities, a substance serving as a cloudiness seed is formed on the original plate. Then, the seeds of cloudiness are aggregated by the interposition of moisture and irradiation of ultraviolet rays (energy of exposure), and they grow into clouds of a size that causes defects.

Regarding cloudiness of the original plate, from the storage environment and transport environment of the original plate, volatile impurities (mainly SO _x , NH ₃ , organic matter) that are the cause of clouding and moisture, which is a product of cloudiness (low humidity), are removed (low humidity) of the original plate. It has become an effective measure to comprehensively suppress the cloudiness of As an example of such a countermeasure, a technology for gas purging by supplying a gas such as clean dry air (CDA) to the surrounding environment of the original plate, that is, replacing the surrounding environment of the original plate with a purge gas, is disclosed in Japanese Unexamined Patent Publication No. 11-249286. and Japanese Patent No. 4585514.

In addition, the cloudiness of the original plate is also formed by moisture present in the pellicle film. However, even when the inside of the pellicle membrane is exposed to a low humidity environment, it takes time until the inside of the pellicle membrane is replaced with low humidity. Therefore, gas purge of the storage environment such as the storage of the original plate is effective for reducing the humidity in the pellicle film, and is effective for suppressing cloudiness of the original plate.

However, in the prior art, there is a problem that a large amount (large flow rate) of purge gas is required in order to reduce the humidity of the surrounding environment such as the storage environment of the original plate.

The present invention provides a storage device advantageous for reducing the humidity of the storage space of the original plate.

In order to achieve the above object, an accommodating device as an aspect of the present invention is a accommodating device for accommodating an original plate including a patterned surface on which a pattern is formed, and a first airflow along a first surface opposite to the patterned surface of the original plate. , and blowing the gas so that at least one air flow of the second air flow along the second surface opposite to the pattern surface side of the protective member installed spaced apart from the pattern surface and protecting the pattern surface is formed. A first supply unit for supplying, a second supply unit for blowing and supplying gas so that a third airflow interfering with the at least one airflow formed by the first supply unit is formed, and blowing out of the gas from the second supply unit a member intersecting the direction and including a receiving surface for receiving the third airflow formed by the second supply unit, wherein the first supply unit receives the original plate with reference to a conveying port for transporting the original plate is disposed inside the storage space, and the second supply unit is disposed on the front side of the storage space with respect to the transport port.

Another object or other aspect of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide a storage device advantageous for reducing the humidity of the storage space of the original plate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing the configuration of a storage device according to a first embodiment of the present invention.
It is a figure for demonstrating the relationship between the flow volume of a 1st airflow, the flow volume of a 2nd airflow, and the flow volume of a 3rd airflow.
Fig. 3 is a schematic diagram showing the configuration of a storage device according to the first embodiment of the present invention.
Fig. 4 is a schematic diagram showing the configuration of a storage device according to the first embodiment of the present invention.
Fig. 5 is a schematic diagram showing the configuration of a storage device according to the first embodiment of the present invention.
Fig. 6 is a schematic diagram showing the configuration of a storage device according to the first embodiment of the present invention.
7A and 7B are schematic diagrams showing the configuration of a storage device according to a second embodiment of the present invention.
Fig. 8 is a schematic diagram showing the configuration of a storage device according to a third embodiment of the present invention.
Fig. 9 is a schematic diagram showing the configuration of a storage device according to a fourth embodiment of the present invention.
Fig. 10 is a schematic diagram showing the configuration of an exposure apparatus as an aspect of the present invention.
Fig. 11 is a schematic diagram showing the configuration of a storage device in the prior art.
Fig. 12 is a schematic diagram showing the configuration of a storage device in the prior art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. At this time, the following embodiment does not limit the invention concerning a claim. Although the plurality of features are described in the embodiment, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. In addition, in the accompanying drawings, the same reference numerals are attached to the same or similar components, and repeated descriptions are omitted.

First, before explaining this embodiment, the prior art regarding the storage device (storage storage) which accommodates (stores) an original plate is demonstrated.

11 is a schematic diagram showing the configuration of the storage device 1000 disclosed in Patent Document 1. As shown in FIG. The storage device 1000 gas purges from one direction the storage space (environmental environment of the original plate 91) accommodating the original plate 91 including the patterned surface on which the pattern is formed. Specifically, the supply unit 94 is a protective surface 93 of a protective member (pellicle) that protects the periphery of the back surface 92 on the opposite side to the pattern surface of the original plate 91 and the pattern surface of the original plate 91. Gas purging of the storage space is performed by flowing the gas 95 (low-humidity gas) through a nozzle around the periphery. In this way, when the storage space of the disk 91 is purged with gas from one direction, as shown in FIG. 11 , a vortex 96 is generated on the downstream side with respect to the disk 91, and a high-humidity atmosphere around the disk 91 is generated. In order to entrain the , there is a problem that the storage space cannot be made low in humidity.

Fig. 12 is a schematic diagram showing the configuration of a storage device 2000 disclosed in Patent Document 2; The accommodating device 2000 gas purges the accommodating space 110 accommodating the disk 101 including the patterned surface on which the pattern is formed. Specifically, in the storage device 2000, the gas 104 (low-humidity gas) flows from the opening side of the storage space 110 of the disk 101 toward the inside, and the gas 104 is in the storage space 110 (of After purging the inner side), it flows to the opening side. At this time, the base 104 flows around the back surface 102 on the opposite side to the pattern surface of the original plate 101 and around the protective surface 103 of the protective member (pellicle) that protects the pattern surface of the original plate 101 . At this time, FIG. 12 shows the flow of the gas 104 flowing from the inside of the storage space 110 of the disk 101 to the opening side. Further, in the storage device 2000, the gas 106 (low-humidity gas) is provided in the upper side of the opening side (downstream side with respect to the disk 101) of the storage space 110 of the disk 101, downward, through the nozzle. A supply unit 105 for blowing air to form an air curtain is provided. Further, in the storage device 2000, an opening provided in the chamber 108 defining the storage space 110 of the disk 101 is closed, so that the storage space An opening/closing mechanism 109 having 110 as an enclosed space is provided.

In such a storage device 2000, when the storage space 110 is not purged with gas by the opening/closing mechanism 109 as a closed space, a vortex 107 is generated on the downstream side with respect to the disk 101, and the disk ( 101), since the surrounding high-humidity atmosphere is entrained, the storage space 110 cannot be made low in humidity. In order to reduce the humidity of the storage space 110 of the disc 101, the area in which the vortex 107 is generated must be narrowed to reduce entrainment of the surrounding high-humidity atmosphere. Therefore, it is considered to form an air curtain that blocks the flow of the gas 104 flowing around the back surface 102 of the disk 101 and around the protection surface 103 of the protection member by the supply unit 105 do. However, there is a problem that a large amount (large flow rate) of the gas 106 is required to form such an air curtain.

Hereinafter, in each embodiment, the storage device advantageous for reducing the humidity of the storage space of the original plate is demonstrated.

<First embodiment>

Fig. 1 is a schematic diagram showing the configuration of a storage device 1A according to a first embodiment of the present invention. In the storage space AS defined by the storage chamber (not shown), the storage device 1A accommodates (stores) the original plate 11 including the patterned surface 14 on which the pattern is formed.

The disk 11 is hold|maintained in the storage space AS via the holding groove and holding member provided in the storage chamber, for example. In order to prevent foreign matter from adhering to the pattern surface 14 of the original plate 11 , a protective member 12 called a pellicle is provided on the original plate 11 . The protection member 12 is supported while being spaced apart (offset) by a predetermined distance from the pattern surface 14 of the disk 11 via the support frame 12a.

In the storage device 1A, a first supply unit 13 (nozzle) is provided for purging the storage space AS (the surrounding environment of the disk 11) in which the disk 11 is accommodated from one direction. The first supply part 13 is on the side opposite to the periphery of the back surface 15 (first surface) on the opposite side to the pattern surface 14 of the original plate 11 and to the side opposite to the pattern surface 14 of the protection member 12 . gas is supplied around the protective surface 16 (second surface) of the Specifically, the first supply unit 13 includes a first airflow 17 along the rear surface 15 of the disk 11 (that is, flowing around the rear surface 15 ), and the protective member 12 . It has a function of forming at least one airflow of the second airflow 18 along the protection surface 16 (that is, flowing around the protection surface 16). In this embodiment, the 1st supply part 13 blows and supplies gas with respect to storage space AS so that the airflow of both the 1st airflow 17 and the 2nd airflow 18 is formed. In this way, the first supply unit 13 forms one-way airflows (the first airflow 17 and the second airflow 18) from the inside of the storage space AS toward the front side of the storage space AS. At this time, the 1st supply part 13 may form the 1st airflow 17 and the 2nd airflow 18 by one nozzle, and each nozzle of the 1st airflow 17 and the 2nd airflow 18 is different. (two nozzles) may be formed. By forming each of the first airflow 17 and the second airflow 18 with different nozzles, it becomes possible to individually control (install) the flow rate of the first airflow 17 and the flow rate of the second airflow 18 . .

Further, in the storage device 1A, on the side of the opening provided in the storage chamber, specifically, above the transport port CP for transporting the disc 11 between the storage device 1A and the outside, a second supply unit ( 21) is installed. The second supply unit 21 forms an air curtain for blocking the transfer port CP and the outside. Specifically, in the second supply unit 21 , a third air flow 19 interfering with at least one of the first air flow 17 and the second air flow 18 formed by the first supply unit 13 is formed. As much as possible, the gas is supplied by blowing. In the present embodiment, the second supply unit 21 includes a third airflow (intersecting) which collides with (intersects) the airflows of both the first airflow 17 and the second airflow 18 formed by the first supply part 13 . 19) is formed, and the gas is supplied by blowing downwards.

As shown in Fig. 1, in the storage device 1A, the first supply unit 13 is disposed inside the storage space AS with the conveyance port CP as a reference, and the second supply unit 21 serves the conveyance port CP. It is arranged on the front side of the storage space AS as a reference. In addition, based on the disc 11 accommodated in the storage space AS, the first supply unit 13 is disposed on one side (-Y direction) of the disc 11, and the second supply unit 21 is It is arrange|positioned on the other side (+Y direction) of the disk 11. With this arrangement, in the storage device 1A, it is possible to gas purge the storage space AS from one direction.

As gas (purge gas) supplied from the 1st supply part 13 and the 2nd supply part 21, clean dry air (CDA) is mentioned, for example. CDA is a gas whose ratio of containing moisture (water vapor), which is a clouding material of the original plate 11, extremely low compared to normal air, and whose humidity is 1% or less in the present embodiment. In addition, the gas supplied from the 1st supply part 13 and the _2nd supply part 21 may be an inert gas with a small ratio containing water|moisture content, for example, nitrogen (N2). By purging the storage space AS with the CDA having a humidity of 1% or less, it is possible to reduce the humidity of the surrounding environment of the original plate 11 to a low humidity of, for example, 1.5% or less, thereby reducing the occurrence of cloudiness of the original plate 11 can be suppressed

At this time, the gas supplied from the first supply unit 13 and the gas supplied from the second supply unit 21 may be different from each other as long as the humidity of the surrounding environment of the disk 11 can be lowered to the target humidity. In other words, the gas forming the third air stream 19 may be a different gas from the gas forming the first air stream 17 and the second air stream 18 . However, it is preferable that the gas supplied from the first supply unit 13 and the gas supplied from the second supply unit 21 are the same from the viewpoint of complexity of the device configuration.

Moreover, the wall member 20 is provided in 1A of storage apparatuses opposing the 2nd supply part 21. As shown in FIG. The wall member 20 intersects the blowing direction BD of the gas blown out from the second supply unit 21 , and includes a receiving surface 20a for receiving a third air stream 19 formed by the second supply unit 21 . is the absence of Specifically, the receiving surface 20a is 0 mm or more outside the protection surface 16 in the Y direction (direction along the protection surface 16) with respect to the protection surface 16 of the protection member 12 . The wall member 20 is configured to extend in a range of 300 mm or less. The wall member 20 may be comprised as a part of the storage chamber which prescribes|regulates the storage space AS, and may be comprised separately from the storage chamber.

Also in the storage device 1A, as described above, the vortex 22 is generated on the downstream side with respect to the disk 11 due to the first air flow 17 and the second air flow 18 . However, in the present embodiment, by sandwiching the first air flow 17 and the second air flow 18 with the third air flow 19 and the wall member 20 formed by the second supply unit 21, the vortex 22 ) can be narrowed down. Therefore, entrainment of the high-humidity atmosphere around the disk 11 can be reduced, and the storage space AS can be made low in humidity. In addition, the distance in the Z direction (direction orthogonal to the pattern surface 14 of the disk 11) between the second supply part 21 and the wall member 20 is short from the viewpoint of narrowing the generation region of the vortex 22 . side is preferable Specifically, the wall member 20 should just be arrange|positioned so that the distance between the receiving surface 20a and the gas outlet of the 2nd supply part 21 may become 10 mm or more and 500 mm or less in Z direction.

Here, with reference to FIG. 2, the relationship between the flow volume Q1 of the 1st airflow 17, the flow volume Q2 of the 2nd airflow 18, and the flow volume Q3 of the 3rd airflow 19 is demonstrated. In Fig. 2, the flow rate Q3 of the third air flow 19 is the sum of the flow rate Q1 of the first air flow 17 and the flow rate Q2 of the second air flow 18 (the ratio of the first air flow 17 and the second air flow 18) total flow rate) or more, ie, when Q3≥Q1+Q2, the gas flow in the periphery of the disk 11 is shown. In this case, as shown in Fig. 2, as the third airflow 19 hits the receiving surface 20a of the wall member 20, the airflow 19a, a part of which flows to the side of the disk 11 (reverse flow), is Occurs. As a result, the high-humidity atmosphere around the disk 11 is entrained, and an airflow 81 is generated in which the high-humidity gas is directed toward the disk 11, which is disadvantageous in reducing the humidity of the storage space AS, which is the environment around the disk 11. will do Accordingly, the flow rate Q3 of the third airflow 19 is the sum of the flow rate Q1 of the first airflow 17 and the flow rate Q2 of the second airflow 18 (the total of the first airflow 17 and the second airflow 18 ). flow rate), that is, Q3<Q1+Q2 is preferable.

In addition, as shown in Fig. 3, the storage device 1A is configured to accommodate a plurality of the disks 11 by providing a plurality of storage spaces AS, that is, by stacking the storage shelves of the disk 11 in a plurality of stages. It is also possible to At this time, although two storage shelves are stacked in Fig. 3, the number of storage shelves is not limited, and three or more storage shelves may be stacked. Fig. 3 is a diagram showing the configuration of a storage device 1A capable of accommodating a plurality of disks 11. As shown in Figs. In this case, the second supply unit 21 and the wall member 20 are provided for each of the plurality of storage spaces AS (the plurality of disks 11 ). At this time, like the storage device 1A shown in FIG. 3 , a second supply unit 21 for forming a third airflow 19 in the storage space AS at the lower end in the wall member 20 installed in the storage space AS at the upper end. may be installed. On the other hand, the first supply unit 13 does not need to be provided for each of the plurality of storage spaces AS, and as shown in Fig. 3 , the first supply unit 13 is provided to each of the plurality of storage spaces AS. You may form the 1st airflow 17 and the 2nd airflow 18 in. In this case, compared to the case where the first supply unit 13 is provided for each of the plurality of storage spaces AS, it is advantageous in terms of the device configuration.

In addition, in FIG. 1, the wall member 20 exists only in the part opposing the 2nd supply part 21. As shown in FIG. However, as shown in Fig. 4, the wall member 20 may extend to the side of the first supply unit 13 rather than the back surface 15 of the disk 11 or the protection surface 16 of the protection member 12. . In this case, the second airflow 18 formed by the second supply portion 21 is rectified in the wall member 20 . Similarly, from the viewpoint of rectification of the first airflow 17, the second supply unit 21 is connected to the back surface 15 of the disk 11 or the protection surface 16 of the protection member 12, as shown in FIG. You may extend to the side of the 1st supply part 13 rather than that.

Fig. 5 is an XY plan view of the storage device 1A shown in Fig. 1 . As shown in Fig. 5, the first air flow 17 preferably flows in a wider range than the back surface 15 of the disk 11 in the X direction. Similarly, in the X direction, it is preferable that the second air flow 18 flows in a wider range than the protection surface 16 of the protection member 12 . Therefore, in the X direction, the first supply unit 13 has the first airflow 17 and the second airflow in a wider range than the back surface 15 of the disk 11 or the protection surface 16 of the protection member 12 . What is necessary is just to supply by blowing out gas so that (18) may be formed. Moreover, it is preferable that the 3rd airflow 19 flows in the X direction in the range wider than the 1st airflow 17 and the 2nd airflow 18. As shown in FIG. Therefore, in the X direction, the second supply unit 21 may supply the gas by blowing so that the third air flow 19 is formed in a wider range than the first air flow 17 and the second air flow 18 .

It is preferable that the 2nd supply part 21 (gas|gas ejection port) is arrange|positioned in the vicinity of the disk 11 in a Y direction. This is, when the second supply unit 21 is disposed at a position away from the disk 11, the position where the third air flow 19 and the first air flow 17 and the second air flow 18 interfere (intersect) is the disk This is because, away from (11), the generation region of the vortex 22 expands in the +Y direction, and it takes time to reduce the humidity of the storage space AS.

In addition, as described above, the third air flow 19 cooperates with the wall member 20 to insert the first air flow 17 and the second air flow 18 from the downstream side with respect to the disk 11 . . Therefore, as shown in Fig. 6, the second supply unit 21 and the wall member 20 do not need to face each other in the Z direction, and the gas blown out from the second supply unit 21 in the ejection direction BD and the receiving surface What is necessary is just to arrange|position the 2nd supply part 21 and the wall member 20 so that 20a may intersect. Even if the second supply unit 21 and the wall member 20 are shifted in the Y direction, it is sufficient that the blowing direction BD of the gas blown out from the second supply unit 21 and the receiving surface 20a of the wall member 20 intersect each other. .

<Second embodiment>

A storage device 1B according to a second embodiment of the present invention will be described with reference to Figs. 7A and 7B. Fig. 7A is a schematic diagram showing the configuration of a storage device 1B according to a second embodiment of the present invention, and Fig. 7B is an XY plan view of the storage device 1B shown in Fig. 7A. The storage device 1B accommodates (stores) the original plate 11 including the pattern surface 14 on which the pattern is formed in the storage space AS defined by the storage chamber (not shown). The storage device 1B has the same configuration as the storage device 1A, but the configuration of the wall member 20 is different from that of the storage device 1A.

The wall member 20 includes the convex part 41 which protrudes toward the 2nd supply part 21 side in the receiving surface 20a in this embodiment. The convex part 41 is provided so that it may oppose the 2nd supply part 21, and may cross|intersect the ejection direction BD of the gas blown out from the 2nd supply part 21. As shown in FIG. By providing the convex part 41 on the receiving surface 20a of the wall member 20, the distance in the Z direction between the 2nd supply part 21 and the wall member 20 can be narrowed. In addition, the surface of the convex part 41 on the second supply part 21 side is at a position (+) where the surface on the side of the second supply part 21 side is higher than the protective surface 16 of the protective member 12 in the Z direction. Z direction).

As described in the first embodiment, the generation area of the eddy 42 can be narrowed by the third air flow 19 and the wall member 20 formed by the second supply unit 21, but in this embodiment and Similarly, by providing the convex portion 41, the vortex 42 generation region can be further narrowed. Therefore, entrainment of the high-humidity atmosphere around the disk 11 can be reduced, and the storage space AS can be made low in humidity. In this way, the convex portion 41 is effective for reducing the humidity of the surrounding environment of the disk 11 .

In addition, in this embodiment, as shown in FIG. 7B, the side wall 43 is provided with respect to the disk 11 in the X direction. Referring to Fig. 7B, the first air flow 17 formed by the first supply section 13 generally diffuses in the X direction. However, in this embodiment, since the side wall 43 is provided, the diffusion to the X direction of the 1st air flow 17 can be suppressed. Therefore, in this embodiment, it becomes possible to flow the 1st airflow 17 in a range narrower than the back surface 15 of the disk 11 in the X direction. Similarly, in the X direction, it becomes possible to flow the 2nd airflow 18 in the range narrower than the protection surface 16 of the protection member 12. As shown in FIG. On the other hand, it is preferable that the 3rd airflow 19 flows in the X direction in a wider range than the 1st airflow 17 and the 2nd airflow 18. As shown in FIG.

<Third embodiment>

Referring to Fig. 8, a storage device 1C according to a third embodiment of the present invention will be described. Fig. 8 is a schematic diagram showing the configuration of a storage device 1C according to a third embodiment of the present invention. In the storage space AS defined by the storage chamber (not shown), the storage device 1C accommodates (stores) the original plate 11 including the pattern surface 14 on which the pattern is formed. The storage device 1C has the same configuration as the storage device 1A, but further has a third supply unit 51 as compared with the storage device 1A. At this time, in this embodiment, the 1st supply part 13 blows and supplies gas so that only the 1st airflow 17 may be formed.

The 3rd supply part 51 is provided facing the protection surface 16 of the protection member 12, and blows gas toward the protection surface 16, and supplies it. Thereby, as shown in FIG. 8, an airflow 52 is formed in the storage space AS of the disk 11. As shown in FIG.

The gas (purge gas) supplied from the third supply unit 51 has an extremely low ratio of containing moisture (water vapor), which is a clouding material of the original plate 11 , compared to normal air, and in this embodiment, its A gas with a humidity of less than 1%. The gas supplied from the third supply unit 51 may be different from or the same as the gas supplied from the first supply unit 13 and the gas supplied from the second supply unit 21 .

As described in the first embodiment, the generation area of the eddy 53 can be narrowed by the third airflow 19 and the wall member 20 formed by the second supply unit 21, but in this embodiment and Similarly, by forming the airflow 52 , it is possible to further narrow the generation area of the eddy 53 . Therefore, entrainment of the high-humidity atmosphere around the disk 11 can be reduced, and the storage space AS can be made low in humidity. In this way, blowing gas from the third supply unit 51 against the protection surface 16 of the protection member 12 to form an airflow 52 is effective for reducing the humidity of the surrounding environment of the disk 11 .

At this time, although the 3rd supply part 51 is provided in the wall member 20 in this embodiment, it is not limited to this. For example, the 3rd supply part 51 should just be comprised so that gas can blow toward the whole area|region of the protection surface 16 of the protection member 12, and, separately from the wall member 20, the 3rd supply part (51) may be provided. In addition, as for the shape of the gas outlet of the 3rd supply part 51, arbitrary shapes, such as a slit shape and a circular shape, can be selected.

<Fourth embodiment>

Referring to Fig. 9, a storage device 1D according to a fourth embodiment of the present invention will be described. Fig. 9 is a schematic diagram showing the configuration of a storage device 1D according to a fourth embodiment of the present invention. In the storage space AS defined by the storage chamber (not shown), the storage device 1D accommodates (stores) the original plate 11 including the pattern surface 14 on which the pattern is formed. The storage device 1D has the same configuration as the storage device 1A, but further has a fourth supply unit 61 as compared with the storage device 1A.

The fourth supply unit 61 is provided in the wall member 20 opposite to the second supply unit 21 . The fourth supply part 61 interferes with the first airflow 17 or the second airflow 18 formed by the first supply part 13 , and furthermore, the third airflow 19 formed by the second supply part 21 . ), the gas is blown and supplied so that a fourth air flow 62 opposite to the air flow 62 is formed. At this time, it is preferable that the 4th airflow 62 flows in the range of about the same extent as the 3rd airflow 19 in the X direction.

The gas (purge gas) supplied from the fourth supply unit 61 has an extremely low ratio of containing moisture (water vapor), which is a clouding material of the original plate 11 , compared to normal air, and in this embodiment, its A gas with a humidity of less than 1%. The gas supplied from the fourth supply unit 61 may be different from or the same as the gas supplied from the first supply unit 13 and the gas supplied from the second supply unit 21 .

Since the 4th airflow 62 is formed so that it may interfere (or collide) with the 1st airflow 17 and the 2nd airflow 18 in this embodiment, the effect similar to 3rd Embodiment can be acquired. Specifically, by the third airflow 19 and the wall member 20 formed by the second supply unit 21 , the eddy 63 can be narrowed, but as in the present embodiment, the fourth airflow By forming (62), it is possible to further narrow the generation region of the eddy (63). Therefore, entrainment of the high-humidity atmosphere around the disk 11 can be reduced, and the storage space AS can be made low in humidity. In this way, blowing gas from the fourth supply unit 61 to form the fourth air flow 62 opposite to the third air flow 19 is effective for reducing the humidity of the surrounding environment of the disk 11 .

Here, the relationship between the flow volume Q1 of the 1st airflow 17, the flow volume Q2 of the 2nd airflow 18, the flow volume Q3 of the 3rd airflow 19, and the flow volume Q4 of the 4th airflow 62 is demonstrated. do. For example, the sum (total flow rate) of the flow rate Q3 of the third air flow 19 and the flow rate Q4 of the fourth air flow 62 is the flow rate Q1 of the first air flow 17 and the flow rate Q2 of the second air flow 18 . Consider the case where the sum of (total flow rate) or more, that is, Q3+Q4≥Q1+Q2. In this case, when the third airflow 19 and the fourth airflow 62 collide, an airflow in which a part of it flows toward the disk 11 (reverse flow) is generated. Accordingly, the high-humidity atmosphere around the disk 11 is entrained, and an airflow is generated in which the high-humidity gas is directed toward the disk 11, which is disadvantageous in reducing the humidity of the storage space AS, which is the surrounding environment of the disk 11. . Therefore, the sum of the flow rate Q3 of the third air flow 19 and the flow rate Q4 of the fourth air flow 62 is less than the sum of the flow rate Q1 of the first air flow 17 and the flow rate Q2 of the second air flow 18, That is, it is preferable that Q3+Q4<Q1+Q2.

In this way, according to the first, second, third, and fourth embodiments, a large amount (large flow rate) of gas (purge gas) is not required, and the surrounding environment of the disk 11 is It is possible to provide a storage device advantageous for reducing the humidity of the storage space AS. At this time, it is possible to combine 1st Embodiment, 2nd Embodiment, 3rd Embodiment, and 4th Embodiment suitably.

Hereinafter, an exposure apparatus to which the storage device 1A is applied as a storage unit for accommodating the original plate will be described with reference to FIG. 10 . At this time, although the housing apparatus 1A is applied to the exposure apparatus here, it is also possible to apply the storage apparatus 1B, 1C or 1D to the exposure apparatus. Fig. 10 is a schematic diagram showing the configuration of an exposure apparatus 505 as one aspect of the present invention.

The exposure apparatus 505 is a lithographic apparatus employed in a lithography process that is a manufacturing process of a device such as a semiconductor element or a liquid crystal display element, and forms a pattern on a substrate. The exposure apparatus 505 exposes the substrate via the original plate, and transfers the pattern of the original plate onto the substrate. The exposure apparatus 505 can employ a step-and-scan method, a step-and-repeat method, and other exposure methods.

As shown in Fig. 10, the exposure apparatus 505 includes an illumination optical system 501, an original plate stage 502 (original plate holder) that moves while holding an original plate, a projection optical system 503, and a substrate by holding the substrate. It has a moving substrate stage 504 and a storage device 1A.

The illumination optical system 501 illuminates the original plate 11 held by the original plate stage 502 with light from a light source. The illumination optical system 501 includes a lens, a mirror, an optical integrator, an iris, and the like. In this case, for the light source, for example, an ArF excimer laser having a wavelength of about 193 nm, a KrF excimer laser having a wavelength of about 248 nm, an F ₂ laser having a wavelength of about 157 nm, a laser such as a YAG laser can be used. The number of lasers used for the light source is not limited. When a laser is used as the light source, the illumination optical system 501 may include a shaping optical system that shapes laser light (parallel light) into a desired shape or an incoherent optical system that incoherently converts coherent laser light into a desired shape. . In addition, a light source is not limited to a laser, You may use lamps, such as one or several mercury lamp and a xenon lamp.

The projection optical system 503 projects the pattern of the original plate 11 onto the substrate held by the substrate stage 504 . As the projection optical system 503, an optical system composed of only a plurality of lens elements, or an optical system (catadioptric optical system) including a plurality of lens elements and at least one concave mirror can be used. In addition, as the projection optical system 503, an optical system including a plurality of lens elements and a diffractive optical element such as a kinoform, an all-mirror optical system, or the like may be used.

The storage apparatus 1A accommodates (stores) the original plate 11 carried into the exposure apparatus 505 from the outside of the exposure apparatus 505 and conveyed to the original plate stage 502 . As described above, the storage device 1A can reduce the humidity of the storage space AS as the surrounding environment of the disk 11 without requiring a large amount of gas (purge gas). Accordingly, the original plate 11 conveyed from the storage device 1A to the original plate stage 502 and held on the original plate stage 502 is suppressed from blurring during exposure. Accordingly, the exposure apparatus 505 can manufacture a higher-quality device at a lower cost than in the prior art in a lithography process, which is a manufacturing process of a device such as a semiconductor element or a liquid crystal display element.

The manufacturing method of the article in the embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.), for example. This manufacturing method includes, using the exposure apparatus 505 , a process of exposing a substrate coated with a photosensitive agent (forming a pattern on the substrate), and a process of developing the exposed substrate (processing the substrate). In addition, such a manufacturing method may include other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The manufacturing method of the article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to the prior art. At this time, the manufacturing method of the article mentioned above may be performed using a lithographic apparatus, such as an implant apparatus and a drawing apparatus.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are attached to clarify the scope of the invention.

Claims (14)

A storage device for accommodating a disc including a patterned surface on which a pattern is formed,
A first airflow along a first surface opposite to the pattern surface of the original plate, and a second surface opposite to the pattern surface side of a protective member installed spaced apart from the pattern surface and protecting the pattern surface A first supply unit for blowing and supplying gas so that at least one air flow of the second air flow along the
a second supply unit for blowing and supplying the gas so that a third air flow that interferes with the at least one air flow formed by the first supply unit is formed;
and a member that intersects in a direction in which gas blown out from the second supply unit and includes a receiving surface for receiving the third air stream formed by the second supply unit;
The first supply unit is disposed on the inside of the receiving space for accommodating the original plate with reference to the transport port for transporting the original plate,
The second supply unit is a storage device, characterized in that it is disposed on the front side of the storage space with respect to the transport port.
The method of claim 1,
The storage device according to claim 1, wherein the first supply unit blows and supplies the gas so that an airflow in one direction from the inside of the storage space toward the front side of the storage space is formed as the at least one airflow.
The method of claim 1,
and the second supply unit blows and supplies the gas so as to form an airflow that collides with the at least one airflow formed by the first supply unit as the third airflow.
The method of claim 1,
The member is arranged so that the receiving surface is positioned below the second surface in a direction orthogonal to the pattern surface.
The method of claim 1,
The member is arranged so that a distance between the receiving surface and the gas outlet of the second supply unit in a direction orthogonal to the pattern surface is 10 mm or more and 500 mm or less.
The method of claim 1,
The receiving surface of the protective member, in a direction along the second surface, with respect to the second surface of the protection member, the storage device, characterized in that extending outward from the second surface in a range of 0 mm or more and 300 mm or less.
The method of claim 1,
The first supply unit supplies by blowing gas so that the first airflow and the second airflow are formed,
and a flow rate of the third air flow is smaller than a sum of the flow rate of the first air flow and the flow rate of the second air flow.
The method of claim 1,
The receiving surface, the storage device, characterized in that it includes a convex portion protruding toward the second supply unit.
The method of claim 1,
The first supply unit supplies by blowing gas so that only the first air flow is formed,
and a third supply unit provided to face the second surface of the protection member and supplying the gas by blowing toward the second surface.
The method of claim 1,
It is provided on the member, and the gas is blown so as to interfere with the at least one airflow formed by the first supply unit and form a fourth airflow opposite to the third airflow formed by the second supply unit. A storage device, characterized in that it further has a fourth supply unit.
The method of claim 1,
The storage device accommodates a plurality of the disks,
The second supply unit and the member are provided for each of the discs.
The method of claim 1,
The gas is a storage device, characterized in that it contains a gas with a humidity of 1% or less.
An exposure apparatus for exposing a substrate, comprising:
A receiving unit for accommodating a disc including a patterned surface on which a pattern is formed;
a disc holding part for holding the disc conveyed from the accommodating part;
and a projection optical system for projecting the pattern of the original plate held by the original plate holder onto the substrate;
The storage unit,
A first airflow along a first surface opposite to the pattern surface of the original plate, and a second surface opposite to the pattern surface side of a protective member installed spaced apart from the pattern surface and protecting the pattern surface A first supply unit for blowing and supplying gas so that at least one air flow of the second air flow along the
a second supply unit for blowing and supplying the gas so that a third air flow that interferes with the at least one air flow formed by the first supply unit is formed;
and a member that intersects in a direction in which gas blown out from the second supply unit and includes a receiving surface for receiving the third air stream formed by the second supply unit;
The first supply unit is disposed on the inside of the receiving space for accommodating the original plate with reference to the transport port for transporting the original plate,
The exposure apparatus according to claim 1, wherein the second supply unit is disposed on the front side of the accommodation space with respect to the conveyance port.
A step of exposing the substrate using the exposure apparatus according to claim 13;
developing the exposed substrate;
A method for manufacturing an article, comprising a step of manufacturing the article from the developed substrate.

Images