TWI841869B - Storage device, exposure device and method for manufacturing article - Google Patents

Abstract

A storage device is provided for storing an original plate, wherein the original plate includes a pattern surface on which a pattern is formed, and comprises: a first supply portion, which blows out and supplies gas to form at least one of a first airflow and a second airflow, wherein the first airflow is along the first surface opposite to the pattern surface of the original plate, and the second airflow is along the second surface opposite to the pattern surface side of a protective member, wherein the protective member is arranged to be away from the pattern surface to protect the pattern surface; and a second supply portion, which blows out and supplies gas. The invention relates to a component comprising a receiving surface which intersects with the blowing direction of the gas blown out from the second supply portion and is used to receive the third airflow formed by the second supply portion; wherein the first supply portion is arranged at the depth side of the storage space for storing the original plate based on the transport port for transporting the original plate; and the second supply portion is arranged at the near front side of the storage space based on the transport port.

Description

Storage device, exposure device and method for manufacturing article

The present invention relates to a storage device, an exposure device and a method for manufacturing an article.

In the manufacturing process (lithography process) of semiconductor elements or liquid crystal display elements, an exposure device is used to project the pattern of the original plate (mask or reticle) onto a substrate (wafer) provided with an anti-etching material to transfer (form) the pattern on the substrate. In the exposure device, when the pattern of the original plate is projected onto the substrate, that is, when the substrate is exposed, if there is foreign matter on the original plate, the foreign matter will be transferred to the substrate together with the pattern and become a cause of defects (poor performance). Therefore, generally speaking, in order to prevent foreign matter from adhering to the pattern surface of the original plate (the surface on which the pattern is formed), a protective member called a plench is provided on the original plate. The plench is, for example, a film-like product made of a synthetic resin. The mask is supported by the mask support frame at a predetermined distance offset from the pattern surface of the original. As a result, foreign matter attached to the mask film offset at a predetermined distance from the pattern surface of the original cannot be focused on the substrate during exposure and only appears as a light spot. In this way, by setting a mask on the original, the influence of foreign matter during exposure can be reduced. In addition, in the exposure device, in order to achieve high resolution in response to the miniaturization of semiconductor devices, the exposure wavelength is being shortened. Currently, the mainstream exposure wavelengths are 248nm of KrF excimer lasers and 193nm of ArF excimer lasers belonging to the vacuum ultraviolet region. In exposure devices that use short wavelengths (high energy) such as ArF excimer lasers as light sources, blurring of the original becomes a problem. Specifically, first, the substances that cause blurring are formed on the original plate due to the reaction between oxygen and alkali existing on the surface of the original plate or in the ambient gas, or the photochemical reaction of organic impurities. In addition, the presence of water and the irradiation of ultraviolet rays (exposure energy) cause the blurring to condense and grow into blurring of a size that causes defects. To combat the blurring of the original plate, removing volatile impurities (mainly SO _x , NH ₃ , organic matter) that are the substances that cause blurring, or water that is the substance that generates blurring (lowering the humidity) from the storage environment and transportation environment of the original plate is an effective measure to suppress the blurring of the original plate as a whole. As an example of such a countermeasure, the following technology is proposed in Japanese Patent Gazette No. 11-249286 and Japanese Patent Gazette No. 4585514: Gas cleaning is performed by supplying a gas such as clean dry air (CDA) to the surrounding environment of the original, that is, the surrounding environment of the original is replaced by the cleaning gas. In addition, the blurring of the original is also caused by the moisture inside the mask film. However, even if the inside of the mask film is exposed to a low humidity environment, it takes time before the inside of the mask film is replaced with a low humidity. Therefore, a method of gas cleaning of the storage environment such as the storage room of the original is effective for lowering the humidity inside the mask film and is effective for suppressing the blurring of the original.

[Problem to be solved by the invention] However, in the prior art, there is a problem that a large amount (large flow rate) of cleaning gas is required to reduce the humidity of the surrounding environment such as the storage environment of the original. The present invention provides a storage device that is conducive to reducing the humidity of the storage space of the original. [Means for solving the problem] In order to achieve the above-mentioned purpose, as one aspect of the present invention, a storage device is provided, which stores an original plate, wherein the original plate includes a pattern surface formed with a pattern, and has: a first supply portion, which blows out and supplies gas to form at least one of a first airflow and a second airflow, wherein the first airflow is along the first surface opposite to the pattern surface of the original plate, and the second airflow is along the second surface opposite to the pattern surface side of the protective member, and the protective member is arranged to be away from the pattern surface to protect the pattern surface; a second supply portion A part that blows out and supplies gas to form a third airflow, the third airflow interfering with at least one of the airflows formed by the first supply part; and a component that includes a receiving surface that intersects with the blowing direction of the gas blown from the second supply part and is used to receive the third airflow formed by the second supply part; wherein the first supply part is arranged on the depth side of the storage space for storing the original plate based on the transport port for transporting the original plate; and the second supply part is arranged on the near front side of the storage space based on the transport port. Other objects or other aspects of the present invention will be apparent from the following embodiments described with reference to the attached drawings. [Effect of the invention] According to the present invention, for example, a storage device that is conducive to reducing the humidity of the storage space for the original plate can be provided.

Below, the implementation method is described in detail with reference to the attached drawings. In addition, the following implementation method does not limit the invention within the scope of the patent application. A plurality of features are recorded in the implementation method, but not all of these features are necessary technical features of the invention, and a plurality of features may be arbitrarily combined. Furthermore, in the attached drawings, the same reference numbers are given to the same or similar structures, and repeated descriptions are omitted. First, before describing the present implementation method, the prior art regarding a storage device (storage room) for storing (keeping) original plates is described. Figure 11 is a schematic diagram showing the structure of a storage device 1000 disclosed in patent document 1. The storage device 1000 performs gas cleaning from one direction on a storage space (the surrounding environment of the original plate 91) that stores an original plate 91 including a pattern surface on which a pattern is formed. Specifically, the supply unit 94 causes the gas 95 (low-humidity gas) to flow to the vicinity of the back surface 92 of the original plate 91 opposite to the pattern surface or to the vicinity of the protective surface 93 of the protective member (mask) protecting the pattern surface of the original plate 91 through the nozzle, thereby performing gas cleaning of the storage space. In this way, if the storage space of the original plate 91 is gas cleaned from one direction, as shown in FIG. 11 , a vortex 96 is generated on the downstream side relative to the original plate 91, and the high-humidity ambient gas around the original plate 91 is drawn in, so there is a problem that the storage space cannot be made low-humidity. FIG. 12 is a schematic diagram showing the structure of the storage device 2000 disclosed in Patent Document 2. The storage device 2000 performs gas cleaning on the storage space 110 that stores the original plate 101 including the pattern surface formed with the pattern. Specifically, in the storage device 2000, the gas 104 (low-humidity gas) is made to flow from the opening side of the storage space 110 of the original plate 101 to the inside, and the gas 104 flows to the opening side after cleaning (purging) the storage space 110 (the inside). At this time, the gas 104 flows around the back side 102 of the original plate 101 opposite to the pattern surface and around the protective surface 103 of the protective member (mask) that protects the pattern surface of the original plate 101. In addition, FIG. 12 shows the flow of the gas 104 from the inner side of the storage space 110 of the original plate 101 to the opening side. In addition, in the storage device 2000, a supply unit 105 is provided above the opening side (relative to the downstream side of the original plate 101) of the storage space 110 of the original plate 101, which blows out the gas 106 (low-humidity gas) downward through the nozzle to form an air curtain. Furthermore, in the storage device 2000, an opening and closing mechanism 109 is provided to close the opening of the cavity 108 provided in the storage space 110 of the original plate 101 and make the storage space 110 a closed space. In such a storage device 2000, when the storage space 110 is formed into a closed space by the opening and closing mechanism 109 without performing gas cleaning, a vortex 107 is generated on the downstream side relative to the original plate 101, and the high-humidity ambient gas around the original plate 101 is drawn in, so that the storage space 110 cannot be made low-humidity. In order to make the storage space 110 of the original plate 101 low-humidity, the area where the vortex 107 is generated must be narrowed to reduce the entrainment of the surrounding high-humidity ambient gas. Therefore, it is considered to use the supply unit 105 to form an air curtain that blocks the flow of the gas 104 flowing around the back side 102 of the original plate 101 and around the protective surface 103 of the protective member. However, there is a problem that a large amount (large flow rate) of gas 106 is required to form such an air curtain. Below, in each embodiment, a storage device that is conducive to lowering the humidity of the storage space of the original plate is described. <First embodiment> Figure 1 is a schematic diagram showing the structure of a storage device 1A in the first embodiment of the present invention. The storage device 1A stores (stores) an original plate 11 including a pattern surface 14 formed with a pattern in a storage space AS defined by a storage cavity (not shown). The original plate 11 is retained in the storage space AS, for example, via a retaining groove or a retaining member provided in the storage cavity. On the original plate 11, in order to prevent foreign matter from adhering to the pattern surface 14 of the original plate 11, a protective member 12 called a mask is provided. The protective member 12 is supported by a support frame 12a at a predetermined distance from the pattern surface 14 of the original plate 11. In the storage device 1A, a first supply unit 13 (nozzle) is provided to perform gas cleaning from one direction to the storage space AS (the surrounding environment of the original plate 11) storing the original plate 11. The first supply unit 13 supplies gas to the surrounding of the back surface 15 (first surface) of the original plate 11 opposite to the pattern surface 14 and the surrounding of the protective surface 16 (second surface) of the protective member 12 opposite to the pattern surface 14, and replaces the storage space AS with the gas. Specifically, the first supply unit 13 has a function of forming at least one of the first airflow 17 along the back surface 15 of the original plate 11 (i.e., flowing around the back surface 15) and the second airflow 18 along the protective surface 16 of the protective member 12 (i.e., flowing around the protective surface 16). In the present embodiment, the first supply unit 13 blows and supplies gas relative to the storage space AS in a manner of forming both the first airflow 17 and the second airflow 18. In this way, the first supply unit 13 forms airflows (the first airflow 17 and the second airflow 18) in one direction from the deep side of the storage space AS to the near side of the storage space AS. In addition, the first supply unit 13 may form the first airflow 17 and the second airflow 18 by one nozzle, or may form the first airflow 17 and the second airflow 18 by separate nozzles (two nozzles). By forming the first airflow 17 and the second airflow 18 by separate nozzles, the flow rate of the first airflow 17 and the flow rate of the second airflow 18 can be controlled (set) individually. In addition, in the storage device 1A, a second supply unit 21 is provided on the opening side of the storage chamber, specifically, above the side of the transfer port CP for transferring the original plate 11 between the storage device 1A and the outside. The second supply unit 21 forms an air curtain for shielding the transfer port CP from the outside. Specifically, the second supply unit 21 blows out and supplies gas in a manner to form a third airflow 19 that interferes with at least one of the first airflow 17 and the second airflow 18 formed by the first supply unit 13. In the present embodiment, the second supply unit 21 blows out and supplies gas downward in a manner to form a third airflow 19 that collides with (intersects) both of the first airflow 17 and the second airflow 18 formed by the first supply unit 13. As shown in FIG. 1 , in the storage device 1A, the first supply unit 13 is arranged on the deep side of the storage space AS with the transfer port CP as a reference, and the second supply unit 21 is arranged on the near front side of the storage space AS with the transfer port CP as a reference. In addition, if the original plate 11 stored in the storage space AS is used as a reference, the first supply section 13 is arranged on one side of the original plate 11 (-Y direction), and the second supply section 13 is arranged on the other side of the original plate 11 (+Y direction). Through such a configuration, in the storage device 1A, the storage space AS can be gas-cleaned from one direction. As the gas (cleaning gas) supplied from the first supply section 13 and the second supply section 21, for example, clean dry air (CDA) can be listed. Compared with ordinary air, CDA contains a very low proportion of moisture (water vapor) that is a blurring product of the original plate 11, and in the present embodiment, the humidity is less than 1%. In addition, the gas supplied from the first supply section 13 and the second supply section 21 may also be an inactive gas containing a small proportion of moisture, such as nitrogen ( _N2 ). By cleaning the storage space AS with CDA having a humidity of 1% or less, the humidity of the surrounding environment of the original plate 11 can be formed to a low humidity of, for example, 1.5% or less, and the blurring of the original plate 11 can be suppressed. In addition, if the humidity of the surrounding environment of the original plate 11 can be set below the target humidity, the gas supplied from the first supply section 13 and the gas supplied from the second supply section 21 may be different. In other words, the gas forming the third airflow 19 may be a gas other than the gas forming the first airflow 17 and the second airflow 18. However, from the perspective of complicating the device structure, it is preferred that the gas supplied from the first supply section 13 and the gas supplied from the second supply section 21 are the same gas. Furthermore, in the storage device 1A, a wall member 20 is provided facing the second supply section 21. The wall member 20 is a member including a receiving surface 20a that intersects with the blowing direction BD of the gas blown out from the second supply section 21 and is used to receive the third airflow 19 formed by the second supply section 21. Specifically, the wall member 20 is configured in such a manner that the receiving surface 20a extends from the protective surface 16 to the outside within a range of more than 0 mm and less than 300 mm in the Y direction (along the direction of the protective surface 16) relative to the protective surface 16 of the protective member 12. The wall member 20 may be configured as a part of the storage cavity that defines the storage space AS, or may be configured separately from the storage cavity. In the storage device 1A, as described above, the vortex 22 is generated on the downstream side relative to the original plate 11 by the first airflow 17 and the second airflow 18. However, in the present embodiment, the region (generation region) where the vortex 22 is generated can be narrowed by sandwiching the first airflow 17 and the second airflow 18 with the third airflow 19 formed by the second supply section 21 and the wall member 20. Therefore, the infiltration of the high-humidity ambient gas around the original plate 11 can be reduced, and the storage space AS can be made low-humidity. In addition, from the viewpoint of narrowing the generation region of the vortex 22, it is preferred that the distance between the second supply section 21 and the wall member 20 in the Z direction (the direction orthogonal to the pattern surface 14 of the original plate 11) is short. Specifically, the wall member 20 can be arranged so that the distance between the receiving surface 20a and the gas blowing outlet of the second supply part 21 in the Z direction is greater than 10 mm and less than 500 mm. Here, referring to FIG. 2 , the relationship between the flow rate Q1 of the first airflow 17, the flow rate Q2 of the second airflow 18, and the flow rate Q3 of the third airflow 19 is explained. FIG. 2 shows the flow of gas at the periphery of the original plate 11 when the flow rate Q3 of the third airflow 19 is greater than the sum of the flow rate Q1 of the first airflow 17 and the flow rate Q2 of the second airflow 18 (the total flow rate of the first airflow 17 and the second airflow 18), that is, when Q3 ≥ Q1 + Q2. In this case, as shown in FIG. 2 , the third airflow 19 collides with the receiving surface 20a of the wall member 20, and a part of the airflow 19a flows toward the original plate 11 (countercurrent). As a result, the high-humidity ambient gas around the original plate 11 is drawn in, and the airflow 81 of the high-humidity gas flowing toward the original plate 11 is generated, which is disadvantageous for the low humidity of the storage space AS, which is the surrounding environment of the original plate 11. Therefore, it is preferable that the flow rate Q3 of the third airflow 19 is less than the sum of the flow rate Q1 of the first airflow 17 and the flow rate Q2 of the second airflow 18 (the total flow rate of the first airflow 17 and the second airflow 18), that is, Q3<Q1+Q2. In addition, the storage device 1A can also be configured to store multiple originals 11 by providing multiple layers of storage spaces AS, that is, storage racks on which multiple layers of originals 11 are stacked, as shown in FIG3. In addition, in FIG3, two layers of storage racks are stacked, but the number of layers of the storage racks is not limited, and more than three layers of storage racks can also be stacked. FIG3 is a diagram showing the structure of the storage device 1A that can store multiple originals 11. In this case, the second supply part 21 and the wall member 20 are respectively provided for the multiple storage spaces AS (multiple originals 11). At this time, as in the storage device 1A shown in FIG3, the second supply part 21 for forming the third airflow 19 in the storage space AS on the lower layer can be provided on the wall member 20 of the storage space AS on the upper layer. On the other hand, the first supply section 13 does not need to be provided for each of the plurality of storage spaces AS, and as shown in FIG3 , the first airflow 17 and the second airflow 18 in each of the plurality of storage spaces AS may be formed by one first supply section 13. In this case, it is advantageous in terms of the device structure compared to the case where the first supply section 13 is provided for each of the plurality of storage spaces AS. In addition, in FIG1 , the wall member 20 exists only in the portion facing the second supply section 21. However, the wall member 20 may extend toward the first supply section 13 side relative to the back surface 15 of the original plate 11 or the protective surface 16 of the protective member 12 as shown in FIG4 . In this case, the second airflow 18 formed by the second supply section 21 is rectified through the wall member 20. Similarly, from the viewpoint of rectifying the first airflow 17, the second supply section 21 may be extended toward the first supply section 13 side relative to the back side 15 of the original plate 11 or the protective surface 16 of the protective member 12 as shown in FIG4. FIG5 is an XY plane view of the storage device 1A shown in FIG1. Preferably, the first airflow 17 flows in a range wider than the back side 15 of the original plate 11 in the X direction as shown in FIG5. Similarly, preferably, the second airflow 18 flows in a range wider than the protective surface 16 of the protective member 12 in the X direction. Therefore, the first supply section 13 may blow out and supply gas in such a manner that the first airflow 17 and the second airflow 18 are formed in a range wider than the back side 15 of the original plate 11 or the protective surface 16 of the protective member 12 in the X direction. In addition, it is preferred that the third airflow 19 flows in a wider range than the first airflow 17 and the second airflow 18 in the X direction. Therefore, the second supply section 21 can blow out and supply gas in a manner to form the third airflow 19 in a wider range than the first airflow 17 and the second airflow 18 in the X direction. It is preferred that the second supply section 21 (the gas blowing outlet) is arranged near the original plate 11 in the Y direction. The reason is that if the second supply section 21 is arranged at a position away from the original plate 11, the third airflow 19 interferes with (intersects with) the first airflow 17 and the second airflow 18 and is away from the original plate 11, the generation area of the vortex 22 expands in the +Y direction, and it takes time to lower the humidity of the storage space AS. In addition, as described above, the third airflow 19 only needs to sandwich the first airflow 17 and the second airflow 18 on the downstream side relative to the original plate 11 in cooperation with the wall member 20. Therefore, as shown in Figure 6, there is no need to make the second supply part 21 and the wall member 20 face each other in the Z direction. It is sufficient to configure the second supply part 21 and the wall member 20 in such a way that the blowing direction BD of the gas blown out from the second supply part 21 intersects with the receiving surface 20a. Even if the second supply part 21 and the wall member 20 are offset in the Y direction, it is sufficient that the blowing direction BD of the gas blown out from the second supply part 21 intersects with the receiving surface 20a of the wall member 20. <Second embodiment> The storage device 1B in the second embodiment of the present invention is described with reference to Figures 7A and 7B. Figure 7A is a schematic diagram showing the structure of the storage device 1B in the second embodiment of the present invention, and Figure 7B is an XY plane view of the storage device 1B shown in Figure 7A. The storage device 1B stores (keeps) the original plate 11 including the pattern surface 14 formed with the pattern in the storage space AS defined by the storage cavity (not shown). The storage device 1B has the same structure as the storage device 1A, but the structure of the wall member 20 is different from that of the storage device 1A. In the present embodiment, the wall member 20 includes a protrusion 41 protruding toward the second supply part 21 side on the receiving surface 20a. The protrusion 41 is opposite to the second supply part 21 and is arranged in a manner intersecting with the blowing direction BD of the gas blown out from the second supply part 21. By providing the protrusion 41 on the receiving surface 20a of the wall member 20, the distance in the Z direction between the second supply portion 21 and the wall member 20 can be shortened. In addition, the surface of the protrusion 41 on the second supply portion 21 side can be formed so that the surface on the second supply portion 21 side is located at a position higher than the protective surface 16 of the protective member 12 in the Z direction (+Z direction). As described in the first embodiment, the third airflow 19 formed by the second supply portion 21 and the wall member 20 can be used to narrow the generation area of the vortex 42, but the generation area of the vortex 42 can be further narrowed by providing the protrusion 41 as in the present embodiment. Therefore, the involvement of the high-humidity ambient gas around the original plate 11 can be reduced, and the storage space AS can be made low-humidity. In this way, the convex portion 41 is effective in lowering the humidity of the surrounding environment of the original plate 11. In addition, in the present embodiment, as shown in FIG. 7B , a side wall 43 is provided in the X direction relative to the original plate 11. Referring to FIG. 7B , the first airflow 17 formed by the first supply portion 13 generally diffuses in the X direction. However, in the present embodiment, since the side wall 43 is provided, the diffusion of the first airflow 17 in the X direction can be suppressed. Therefore, in the present embodiment, the first airflow 17 can be made to flow in the X direction in a range narrower than the back side 15 of the original plate 11. Similarly, the second airflow 18 can be made to flow in the X direction in a range narrower than the protective surface 16 of the protective member 12. On the other hand, it is preferred that the third airflow 19 flows in the X direction in a range wider than the first airflow 17 and the second airflow 18. <Third embodiment> Referring to FIG. 8 , a storage device 1C in the third embodiment of the present invention is described. FIG. 8 is a schematic diagram showing the structure of the storage device 1C in the third embodiment of the present invention. The storage device 1C stores (stores) an original plate 11 including a pattern surface 14 on which a pattern is formed in a storage space AS defined by a storage cavity (not shown). The storage device 1C has the same structure as the storage device 1A, but compared with the storage device 1A, it also has a third supply section 51. In addition, in the present embodiment, the first supply section 13 blows out and supplies gas in a manner that only the first airflow 17 is formed. The third supply section 51 is arranged to face the protective surface 16 of the protective member 12, and blows out and supplies gas toward the protective surface 16. Thus, as shown in FIG8 , an airflow 52 is formed in the storage space AS for the original plate 11. The gas (cleaning gas) supplied from the third supply section 51 contains water (water vapor) as a blurring generating substance of the original plate 11 at a very low ratio compared to ordinary air, and is a gas having a humidity of 1% or less in the present embodiment. In addition, the gas supplied from the third supply section 51 may be different from or the same as the gas supplied from the first supply section 13 or the gas supplied from the second supply section 21. As described in the first embodiment, the generation area of the vortex 53 can be narrowed by utilizing the third airflow 19 and the wall member 20 formed by the second supply section 21, but the generation area of the vortex 53 can be further narrowed by forming the airflow 52 as in the present embodiment. Therefore, the involvement of high-humidity ambient gas around the original plate 11 can be reduced, and the storage space AS can be made low-humidity. In this way, the method of blowing gas from the third supply part 51 relative to the protective surface 16 of the protective member 12 to form the airflow 52 is effective for lowering the humidity of the surrounding environment of the original plate 11. In addition, in the present embodiment, the third supply part 51 is provided on the wall member 20, but is not limited to this. For example, the third supply part 51 only needs to be configured to blow gas toward the entire area of the protective surface 16 of the protective member 12, or the third supply part 51 can be provided separately from the wall member 20. In addition, the shape of the gas blowing outlet of the third supply part 51 can be selected in any shape such as a slit shape or a circular shape. <Fourth embodiment> A storage device 1D in the fourth embodiment of the present invention is described with reference to FIG9. FIG9 is a schematic diagram showing the structure of the storage device 1D in the fourth embodiment of the present invention. The storage device 1D stores (keeps) an original plate 11 including a pattern surface 14 on which a pattern is formed in a storage space AS defined by a storage cavity (not shown). The storage device 1D has the same structure as the storage device 1A, but compared with the storage device 1A, it also has a fourth supply section 61. The fourth supply section 61 is arranged on the wall member 20 facing the second supply section 21. The fourth supply section 61 supplies gas by blowing out so as to form a fourth airflow 62, and the fourth airflow 62 interferes with the first airflow 17 and the second airflow 18 formed by the first supply section 13 and faces the third airflow 19 formed by the second supply section 21. In addition, it is preferable that the fourth airflow 62 flows in the X direction within a range equivalent to that of the third airflow 19. The gas (cleaning gas) supplied from the fourth supply section 61 contains water (water vapor) as a blurring generating substance of the original plate 11 at a very low ratio compared to ordinary air, and in the present embodiment, the gas has a humidity of 1% or less. In addition, the gas supplied from the fourth supply section 61 may be different from or the same as the gas supplied from the first supply section 13 or the gas supplied from the second supply section 21. In the present embodiment, since the fourth airflow 62 is formed in a manner that interferes with (collides with) the first airflow 17 and the second airflow 18, the same effect as the third embodiment can be obtained. Specifically, the third airflow 19 formed by the second supply section 21 and the wall member 20 can be used to narrow the generation area of the vortex 63, but the generation area of the vortex 63 can be further narrowed by forming the fourth airflow 62 as in the present embodiment. Therefore, the involvement of high-humidity ambient gas around the original plate 11 can be reduced, and the storage space AS can be made low-humidity. In this way, the method of forming the fourth airflow 62 that blows out gas from the fourth supply section 61 and faces the third airflow 19 is effective for lowering the humidity of the surrounding environment of the original plate 11. Here, the relationship between the flow rate Q1 of the first airflow 17, the flow rate Q2 of the second airflow 18, the flow rate Q3 of the third airflow 19, and the flow rate Q4 of the fourth airflow 62 is described. For example, consider the case where the sum of the flow rates Q3 of the third airflow 19 and Q4 of the fourth airflow 62 (total flow rate) is greater than the sum of the flow rates Q1 of the first airflow 17 and Q2 of the second airflow 18 (total flow rate), that is, the case where Q3+Q4≥Q1+Q2. In this case, the third airflow 19 collides with the fourth airflow 62, and a portion of the airflow flows toward the original plate 11 (countercurrent) is generated. As a result, the high-humidity ambient air around the original plate 11 is drawn in, generating an airflow of high-humidity gas flowing toward the original plate 11, which is disadvantageous for lowering the humidity of the storage space AS as the surrounding environment of the original plate 11. Therefore, it is preferred that the sum of the flow rate Q3 of the third airflow 19 and the flow rate Q4 of the fourth airflow 62 is less than the sum of the flow rate Q1 of the first airflow 17 and the flow rate Q2 of the second airflow 18, that is, Q3+Q4＜Q1+Q2. In this way, according to the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment, a storage device that is advantageous for lowering the humidity of the storage space AS as the surrounding environment of the original plate 11 can be provided without requiring a large amount (large flow) of gas (cleaning gas). In addition, the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment can be appropriately combined. Below, referring to FIG. 10, an exposure device using the storage device 1A as a storage portion for storing the original plate is described. In addition, here, the storage device 1A is applied to the exposure device, but the storage device 1B, 1C or 1D can also be applied to the exposure device. FIG. 10 is a schematic diagram showing the structure of an exposure device 505 as one aspect of the present invention. The exposure device 505 is a photolithography device that is used in a photolithography process as a manufacturing process of devices such as semiconductor elements or liquid crystal display elements to form a pattern on a substrate. The exposure device 505 exposes the substrate through the original plate and transfers the pattern of the original plate to the substrate. The exposure device 505 can adopt a step-and-scan method, a distributed repetition method, or other exposure methods. As shown in FIG10 , the exposure device 505 includes an illumination optical system 501, an original plate carrier 502 (original plate holding unit) for holding and moving the original plate, a projection optical system 503, a substrate carrier 504 for holding and moving the substrate, and a storage device 1A. The illumination optical system 501 illuminates the original plate 11 held by the original plate carrier 502 using light from a light source. The illumination optical system 501 includes a lens, a reflection mirror, an optical integrator, an aperture, and the like. In addition, for the light source, for example, an ArF excimer laser with a wavelength of about 193 nm, a KrF excimer laser with a wavelength of about 248 nm, an _F2 laser with a wavelength of about 157 nm, a YAG laser, and the like can be used. The number of lasers used in the light source is not limited. When a laser is used as the light source, the illumination optical system 501 may include a shaping optical system that shapes the laser (parallel light) into a desired shape or an incoherent optical system that makes coherent lasers incoherent. In addition, the light source is not limited to a laser, and one or more lamps such as mercury lamps or xenon lamps may also be used. The projection optical system 503 projects the pattern of the original plate 11 onto the substrate held by the substrate carrier 504. The projection optical system 503 can use an optical system consisting only of a plurality of lens elements, an optical system including a plurality of lens elements and at least one concave reflector (reflective refractive optical system). In addition, the projection optical system 503 can use an optical system including a plurality of lens elements and a diffraction optical element such as a diffraction imaging element, or a total reflection mirror type optical system. The storage device 1A stores (stores) the original plate 11 that is carried into the exposure device 505 from the outside of the exposure device 505 and transported to the original plate carrier 502. As described above, the storage device 1A does not require a large amount (large flow) of gas (cleaning gas), and can make the storage space AS, which is the surrounding environment of the original plate 11, low in humidity. Therefore, the original plate 11 that is transported from the storage device 1A to the original plate carrier 502 and held by the original plate carrier 502 can suppress the occurrence of blur during exposure. As a result, the exposure device 505 can produce high-quality devices at a lower cost than before in the photolithography process of the manufacturing process of devices such as semiconductor devices or liquid crystal display devices. The article manufacturing method in the embodiment of the present invention is suitable for manufacturing devices (semiconductor devices, magnetic storage media, liquid crystal display devices, etc.), etc. The manufacturing method includes: using an exposure device 505 to expose a substrate coated with a photosensitive agent (forming a pattern on the substrate), and developing the exposed substrate (processing the substrate). In addition, the manufacturing method can include other well-known processes (oxidation, film formation, evaporation, doping, planarization, etching, anti-etching agent stripping, cutting, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over the previous methods in at least one of the performance, quality, production efficiency and production cost of the article. In addition, the above-mentioned article manufacturing method can also be carried out using a photolithography device such as an imprinting device or a drawing device. The present invention is not limited to the above-mentioned embodiment, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the claim items are attached for the purpose of disclosing the scope of the invention.

11: Original plate 12: Protective member 13: First supply unit (nozzle) 14: Pattern surface 15: Back side (first side) 16: Protective surface (second side) 17: First airflow 18: Second airflow 19: Third airflow 20: Wall member 21: Second supply unit 22: Vortex 41: Convex portion 42: Vortex 43: Side wall 51: Third supply unit 52: Airflow 53: Vortex 61: Fourth supply unit 62: Fourth airflow 63: Vortex 81: Airflow 91: Original plate 92: Back side 93: Protective surface 94: Supply unit 95: Gas (low-humidity gas) 96: Vortex 101: Original plate 102: Back 103: Protective surface 104: Gas (low-humidity gas) 105: Supply unit 106: Gas (low-humidity gas) 107: Vortex 108: Cavity 109: Opening and closing mechanism 110: Storage space 501: Illumination optical system 502: Original plate carrier 503: Projection optical system 504: Substrate carrier 505: Exposure device 1000: Storage device 2000: Storage device 12a: Support frame 19a: Airflow 1A: Storage device 1B: Storage device 1C: Storage device 1D: Storage device 20a: receiving surface AS: storage space BD: gas blowing direction CP: transport port

[FIG. 1] is a schematic diagram showing the structure of the storage device in the first embodiment of the present invention. [FIG. 2] is a diagram for explaining the relationship between the flow rate of the first airflow, the flow rate of the second airflow, and the flow rate of the third airflow. [FIG. 3] is a schematic diagram showing the structure of the storage device in the first embodiment of the present invention. [FIG. 4] is a schematic diagram showing the structure of the storage device in the first embodiment of the present invention. [FIG. 5] is a schematic diagram showing the structure of the storage device in the first embodiment of the present invention. [FIG. 6] is a schematic diagram showing the structure of the storage device in the first embodiment of the present invention. [FIG. 7A] and [FIG. 7B] are schematic diagrams showing the structure of the storage device in the second embodiment of the present invention. [FIG. 8] is a schematic diagram showing the structure of the storage device in the third embodiment of the present invention. [Figure 9] is a schematic diagram showing the structure of the storage device in the fourth embodiment of the present invention. [Figure 10] is a schematic diagram showing the structure of the exposure device as one aspect of the present invention. [Figure 11] is a schematic diagram showing the structure of the storage device in the prior art. [Figure 12] is a schematic diagram showing the structure of the storage device in the prior art.

1A: Storage device

11: Original version

12: Protective components

12a: Support frame

13: 1st supply section (nozzle)

14: Pattern side

15: Back side (side 1)

16: Protective surface (2nd side)

17: The 1st airflow

18: Second airflow

19: The third airflow

20: Wall components

20a: Acceptance surface

21: Second supply department

22: Eddy current

AS: Storage space

BD: Gas blowing direction

CP: Port of transportation

Claims (14)

A storage device for storing an original plate, wherein the original plate includes a pattern surface formed with a pattern, and comprises: A first supply section, which blows out and supplies gas to form at least one of the first and second airflows, wherein the first airflow is along the first surface opposite to the pattern surface of the original plate, and the second airflow is along the second surface opposite to the pattern surface side of the protective member, wherein the protective member is arranged to protect the pattern surface away from the pattern surface; A second supply section, which blows out and supplies gas to form a third airflow, wherein the third airflow interferes with the at least one airflow formed by the first supply section; and A member, which includes a receiving surface intersecting with the blowing direction of the gas blown from the second supply section and used to receive the third airflow formed by the second supply section; Wherein, The first supply unit is arranged at the depth side of the storage space for storing the original plate based on the transport port for transporting the original plate; The second supply unit is arranged at the front side of the storage space based on the transport port. A storage device as claimed in claim 1, wherein the first supply unit blows out and supplies gas to form an airflow in one direction from the depth side of the storage space toward the front side of the storage space as the at least one airflow. A storage device as claimed in claim 1, wherein the second supply section blows out and supplies gas to form an airflow that collides with at least one of the airflows formed by the first supply section, as the third airflow. A storage device as claimed in claim 1, wherein the aforementioned component is configured so that the aforementioned receiving surface is located below the aforementioned second surface in a direction orthogonal to the aforementioned pattern surface. A storage device as claimed in claim 1, wherein the component is arranged so that the distance between the receiving surface and the gas blowing outlet of the second supply portion in a direction orthogonal to the pattern surface is greater than 10 mm and less than 500 mm. A storage device as claimed in claim 1, wherein the receiving surface extends in a range of 0 mm or more and 300 mm or less from the second surface to the outside in a direction along the second surface relative to the second surface of the protective member. A storage device as claimed in claim 1, wherein: the first supply section blows out and supplies gas to form the first airflow and the second airflow; the flow rate of the third airflow is less than the sum of the flow rate of the first airflow and the flow rate of the second airflow. A storage device as claimed in claim 1, wherein the receiving surface includes: a convex portion protruding toward the second supply portion. A storage device as claimed in claim 1, wherein, the first supply portion blows out and supplies gas to form only the first airflow; the storage device also has a third supply portion, which is arranged to be opposite to the second surface of the protective member and blows out and supplies gas toward the second surface. The storage device of claim 1, further comprising: A fourth supply unit, which is disposed on the aforementioned component and blows out and supplies gas to form a fourth airflow, wherein the fourth airflow interferes with at least one of the aforementioned airflows formed by the aforementioned first supply unit and is opposite to the aforementioned third airflow formed by the aforementioned second supply unit. As in claim 1, the storage device stores a plurality of the aforementioned original plates; the aforementioned second supply section and the aforementioned component are respectively provided with respect to the aforementioned original plates. A storage device as claimed in claim 1, wherein the gas contains a gas with a humidity of less than 1%. An exposure device for exposing a substrate comprises: a storage section for storing an original plate, wherein the original plate includes a pattern surface on which a pattern is formed; an original plate holding section for holding the original plate transported from the storage section; and a projection optical system for projecting the pattern of the original plate held by the original plate holding section onto the substrate; wherein, the storage section comprises: a first supply section for blowing out and supplying gas to form at least one of a first airflow and a second airflow, wherein the first airflow is along a first surface opposite to the pattern surface of the original plate, and the second airflow is along a second surface opposite to the pattern surface side of a protective member, wherein the protective member is arranged to protect the pattern surface away from the pattern surface; A second supply section, which blows out and supplies gas to form a third airflow, wherein the third airflow interferes with at least one of the airflows formed by the first supply section; and a component, which includes a receiving surface that intersects with the blowing direction of the gas blown from the second supply section and is used to receive the third airflow formed by the second supply section; wherein, the first supply section is arranged at the depth side of the storage space for storing the original plate based on the transport port for transporting the original plate; the second supply section is arranged at the near front side of the storage space based on the transport port. A method for manufacturing an article, comprising: a step of exposing a substrate using the exposure device of claim 13; a step of developing the exposed substrate; and a step of manufacturing an article from the developed substrate.

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