CN114637168A - Storage device, exposure device, and article manufacturing method - Google Patents

Storage device, exposure device, and article manufacturing method Download PDF

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Publication number
CN114637168A
CN114637168A CN202111494648.5A CN202111494648A CN114637168A CN 114637168 A CN114637168 A CN 114637168A CN 202111494648 A CN202111494648 A CN 202111494648A CN 114637168 A CN114637168 A CN 114637168A
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China
Prior art keywords
gas
supply unit
original plate
flow
storage device
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CN202111494648.5A
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Chinese (zh)
Inventor
藤野康平
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Canon Inc
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Canon Inc
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Publication of CN114637168A publication Critical patent/CN114637168A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

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  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Library & Information Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a storage apparatus, an exposure apparatus and an article manufacturing method. The storage device stores an original plate including a pattern surface formed with a pattern, and has: a 1 st supply unit configured to blow and supply a gas so as to form at least one of a 1 st gas flow along a 1 st surface of the original plate opposite to the pattern surface and a 2 nd gas flow along a 2 nd surface of the protective member opposite to the pattern surface side, the protective member being provided separately from the pattern surface and protecting the pattern surface; a 2 nd supply unit configured to blow out and supply a gas so as to form a 3 rd gas flow interfering with at least one of the gas flows formed by the 1 st supply unit; and a member including a receiving surface intersecting a blowing direction of the gas blown out from the 2 nd supply unit and receiving the 3 rd gas flow formed by the 2 nd supply unit, wherein the 1 st supply unit is disposed on a depth side of a storage space for storing the original plate with reference to a transport port for transporting the original plate, and the 2 nd supply unit is disposed on a front side of the storage space with reference to the transport port.

Description

Storage device, exposure device, and article manufacturing method
Technical Field
The invention relates to a housing apparatus, an exposure apparatus, and an article manufacturing method.
Background
In a manufacturing process (photolithography) of a semiconductor element or a liquid crystal display element, an exposure apparatus is used which projects a pattern of an original plate (mask or reticle) onto a substrate (wafer) on which a resist material is arranged and transfers (forms) the pattern onto the substrate. In an exposure apparatus, when a pattern of an original plate is projected onto a substrate, that is, when the substrate is exposed, if foreign matter or the like is present on the original plate, the foreign matter is transferred to the substrate together with the pattern, which causes a defect (failure).
Therefore, in general, a protective member called a mask (Pellicle) is provided on the original plate in order to prevent foreign matter from adhering to the pattern surface (surface on which a pattern is formed) of the original plate. The mask is a film-like product made of, for example, a synthetic resin. The mask is supported by a mask support frame at a predetermined distance from the pattern surface of the original plate. Therefore, since the foreign matter adheres to the mask film which is shifted from the pattern surface of the original plate by a predetermined distance, the foreign matter does not form a focal point on the substrate during exposure, and appears as flare. By providing the mask on the original plate in this way, the influence of foreign matter during exposure can be reduced.
In addition, in an exposure apparatus, in order to realize high resolution in response to miniaturization of semiconductor devices, shortening of the exposure wavelength has been advanced. At present, 248nm of KrF excimer laser and 193nm of ArF excimer laser belonging to vacuum ultraviolet region are the mainstream as exposure wavelength, and blur of the original plate becomes a problem in an exposure apparatus using short wavelength (high energy) as a light source such as ArF excimer laser. Specifically, first, a substance causing blurring is formed on the original plate by a reaction between oxygen present on the surface of the original plate or in the atmosphere and an alkali or a photochemical reaction of an organic impurity. Further, the presence of moisture and irradiation of ultraviolet light (exposure energy) cause aggregation of blur, and grow into a size blur that causes defects.
Volatile impurities (mainly SO) as a cause of the blur are removed from the storage environment and the transportation environment of the original platex、NH3Organic matter) or water removal as a blur generating substance (low humidity) becomes an effective countermeasure to suppress the blur of the original plate as a whole. As an example of such measures, the following techniques are proposed in japanese patent laid-open nos. 11-249286 and 4585514: a gas such as Clean Dry Air (CDA) is supplied to the atmosphere surrounding the master to perform gas purging, that is, the atmosphere surrounding the master is replaced with a purge gas.
Further, the haze of the original plate is also caused by moisture existing in the mask film. However, even if the inside of the mask film is exposed to a low humidity environment, it takes time until the inside of the mask film is replaced with low humidity. Therefore, the method of purging the storage environment such as the storage room of the original plate by gas is effective for reducing the humidity inside the mask film, and is effective for suppressing the blurring of the original plate.
Disclosure of Invention
Problems to be solved by the invention
However, the conventional technique has a problem that a large amount (large flow rate) of purge gas is required to reduce the humidity of the surrounding environment such as the original storage environment.
The invention provides a storage device which is beneficial to reducing humidity of a storage space of an original plate.
Means for solving the problems
In order to achieve the above object, according to one aspect of the present invention, there is provided a storage apparatus for storing an original plate including a pattern surface on which a pattern is formed, the storage apparatus including: a 1 st supply unit that blows out and supplies air so as to form at least one of a 1 st air flow and a 2 nd air flow, the 1 st air flow being along a 1 st surface of the original plate on a side opposite to the pattern surface, the 2 nd air flow being along a 2 nd surface of a protective member on a side opposite to the pattern surface, the protective member being provided apart from the pattern surface and protecting the pattern surface; a 2 nd supply unit configured to blow out and supply a gas so as to form a 3 rd gas flow, the 3 rd gas flow interfering with the at least one gas flow formed by the 1 st supply unit; and a member including a receiving surface intersecting a blowing direction of the gas blown out from the 2 nd supply unit and receiving the 3 rd gas flow formed by the 2 nd supply unit, wherein the 1 st supply unit is disposed on a depth side of a storage space storing the original plate with reference to a transport port for transporting the original plate, and the 2 nd supply unit is disposed on a front side of the storage space with reference to the transport port.
In accordance with another aspect of the present invention, there is provided an exposure apparatus for exposing a substrate, comprising: a receiving part for receiving an original plate including a pattern surface formed with a pattern; a master holding section for holding the master transported from the storage section; and a projection optical system that projects the pattern of the original plate held by the original plate holding unit onto the substrate, wherein the housing unit includes: a 1 st supply unit configured to blow out and supply a gas so as to form at least one of a 1 st gas flow and a 2 nd gas flow, the 1 st gas flow being along a 1 st surface of the original plate on a side opposite to the pattern surface, the 2 nd gas flow being along a 2 nd surface of a protective member on a side opposite to the pattern surface, the protective member being provided apart from the pattern surface and protecting the pattern surface; a 2 nd supply unit configured to blow out and supply a gas so as to form a 3 rd gas flow, the 3 rd gas flow interfering with the at least one gas flow formed by the 1 st supply unit; and a member including a receiving surface intersecting a blowing direction of the gas blown out from the 2 nd supply unit and receiving the 3 rd gas flow formed by the 2 nd supply unit, wherein the 1 st supply unit is disposed on a depth side of a storage space storing the original plate with reference to a transport port for transporting the original plate, and the 2 nd supply unit is disposed on a front side of the storage space with reference to the transport port.
A method for manufacturing an article according to still another aspect of the present invention includes: exposing a substrate using the exposure apparatus; developing the exposed substrate; and a step of manufacturing an article from the developed substrate.
Further objects or other aspects of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, for example, a storage device advantageous for reducing humidity of a storage space for original plates can be provided.
Drawings
Fig. 1 is a schematic diagram showing a configuration of a storage device according to embodiment 1 of the present invention.
Fig. 2 is a diagram for explaining the relationship among the flow rate of the 1 st airflow, the flow rate of the 2 nd airflow, and the flow rate of the 3 rd airflow.
Fig. 3 is a schematic diagram showing the configuration of the storage device according to embodiment 1 of the present invention.
Fig. 4 is a schematic diagram showing the configuration of the storage device according to embodiment 1 of the present invention.
Fig. 5 is a schematic diagram showing the configuration of the storage device according to embodiment 1 of the present invention.
Fig. 6 is a schematic diagram showing the configuration of a storage device according to embodiment 1 of the present invention.
Fig. 7A and 7B are schematic views showing the configuration of the storage device according to embodiment 2 of the present invention.
Fig. 8 is a schematic diagram showing the structure of the storage device according to embodiment 3 of the present invention.
Fig. 9 is a schematic diagram showing the configuration of the storage device according to embodiment 4 of the present invention.
Fig. 10 is a schematic diagram showing a configuration of an exposure apparatus according to an aspect of the present invention.
Fig. 11 is a schematic diagram showing a configuration of a conventional storage device.
Fig. 12 is a schematic diagram showing a configuration of a conventional storage device.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the drawings. The following embodiments do not limit the invention according to the claims. A plurality of features are described in the embodiments, but not all of the features are essential technical features of the invention, and a plurality of the features may be arbitrarily combined. In the drawings, the same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted.
First, prior to the description of the present embodiment, a conventional technique relating to a storage apparatus (storage) that stores (stores) original plates will be described.
Fig. 11 is a schematic diagram showing a configuration of the storage apparatus 1000 disclosed in patent document 1. The housing apparatus 1000 performs gas purging from one direction of a housing space (the ambient environment of the original plate 91) housing the original plate 91 including the pattern surface formed with the pattern. Specifically, the supply section 94 performs gas purging of the storage space by flowing gas 95 (low-humidity gas) through a nozzle to the periphery of the back surface 92 of the original plate 91 on the side opposite to the pattern surface or the periphery of the protective surface 93 of a protective member (mask) that protects the pattern surface of the original plate 91. As described above, when the storage space of the original plate 91 is purged with gas from one direction, as shown in fig. 11, a vortex 96 is generated on the downstream side of the original plate 91, and the high-humidity atmosphere around the original plate 91 is entrained, so that there is a problem that the storage space cannot be reduced in humidity.
Fig. 12 is a schematic diagram showing a configuration of the storage device 2000 disclosed in patent document 2. The housing apparatus 2000 performs a gas purge of the housing space 110 housing the master 101 including the pattern surface formed with the pattern. Specifically, in the housing device 2000, the gas 104 (low-humidity gas) is flowed from the opening side of the housing space 110 of the original plate 101 toward the inside, and the gas 104 is purged from (the inside of) the housing space 110 and then flowed toward the opening side. At this time, the gas 104 flows around the back surface 102 of the original plate 101 on the side opposite to the pattern surface and around the protective surface 103 of a protective member (mask) for protecting the pattern surface of the original plate 101. Fig. 12 shows the flow of the gas 104 from the inside of the storage space 110 of the original plate 101 to the opening side. In the storage apparatus 2000, a supply portion 105 that forms an air curtain by blowing a gas 106 (low-humidity gas) downward through a nozzle is provided above an opening side (downstream side with respect to the original plate 101) of the storage space 110 of the original plate 101. Further, the storage apparatus 2000 is provided with an opening/closing mechanism 109 for closing an opening of a cavity 108 provided in a storage space 110 for defining the original plate 101 and for sealing the storage space 110.
In the storage apparatus 2000, when the storage space 110 is formed as a closed space by the opening/closing mechanism 109 without performing gas purging, the vortex 107 is generated on the downstream side of the original plate 101, and the high-humidity atmosphere gas around the original plate 101 is involved, so that the storage space 110 cannot be made low in humidity. In order to reduce the humidity of the storage space 110 of the original plate 101, it is necessary to narrow the area where the vortex 107 is generated to reduce the entrainment of the surrounding high-humidity atmosphere gas. Therefore, it is considered that the supply unit 105 forms an air curtain for blocking the flow of the gas 104 flowing around the back surface 102 of the original plate 101 and around the protective surface 103 of the protective member. However, there is a problem that a large amount (large flow rate) of the gas 106 is required to form such a gas curtain.
Hereinafter, in each embodiment, a storage apparatus advantageous for reducing the humidity of the storage space for the original plate will be described.
< embodiment 1 >)
Fig. 1 is a schematic diagram showing a configuration of a storage apparatus 1A according to embodiment 1 of the present invention. The storage apparatus 1A stores (stores) a master plate 11 including a pattern surface 14 formed with a pattern in a storage space AS defined by a storage chamber (not shown).
The original plate 11 is held in the storage space AS via a holding groove or a holding member provided in the storage cavity, for example. The original plate 11 is provided with a protective member 12 called a mask for preventing foreign matter from adhering to the pattern surface 14 of the original plate 11. The protective member 12 is supported via a support frame 12a at a predetermined distance (offset) from the pattern surface 14 of the master 11.
The storage apparatus 1A is provided with a 1 st supply unit 13 (nozzle) for performing gas purging from one direction of a storage space AS (an environment around the original plate 11) in which the original plate 11 is stored. The 1 st supply unit 13 supplies gas to the periphery of the back surface 15 (1 st surface) of the original plate 11 on the side opposite to the pattern surface 14 and the periphery of the protection surface 16 (2 nd surface) of the protection member 12 on the side opposite to the pattern surface 14, and replaces the storage space AS with the gas. Specifically, the 1 st supply unit 13 has a function of forming at least one of a 1 st air flow 17 along the back surface 15 of the original plate 11 (i.e., flowing around the back surface 15) and a 2 nd air flow 18 along the protective surface 16 of the protective member 12 (i.e., flowing around the protective surface 16). In the present embodiment, the 1 st supply unit 13 blows and supplies the gas to the housing space AS so AS to form both the 1 st gas flow 17 and the 2 nd gas flow 18. In this way, the 1 st supply part 13 forms an airflow (the 1 st airflow 17 and the 2 nd airflow 18) flowing from the depth side of the housing space AS to one direction of the front side of the housing space AS. The 1 st supply unit 13 may form the 1 st air flow 17 and the 2 nd air flow 18 by 1 nozzle, or may form the 1 st air flow 17 and the 2 nd air flow 18 by separate nozzles (2 nozzles). By forming the 1 st stream 17 and the 2 nd stream 18 by separate nozzles, the flow rate of the 1 st stream 17 and the flow rate of the 2 nd stream 18 can be controlled (set) independently.
In the storage device 1A, a 2 nd supply unit 21 is provided on an opening side of the storage cavity, specifically, above a side of a transfer port CP for transferring the original plate 11 between the storage device 1A and the outside. The 2 nd supply unit 21 forms an air curtain for blocking the conveyance port CP from the outside. Specifically, the 2 nd supply unit 21 blows out and supplies the gas so as to form the 3 rd gas flow 19 that interferes with at least one of the 1 st gas flow 17 and the 2 nd gas flow 18 formed by the 1 st supply unit 13. In the present embodiment, the 2 nd supply unit 21 blows out and supplies the gas downward so as to form the 3 rd gas flow 19 (intersecting) with which both the 1 st gas flow 17 and the 2 nd gas flow 18 formed by the 1 st supply unit 13 collide.
AS shown in fig. 1, in the storage apparatus 1A, the 1 st supply unit 13 is disposed on the depth side of the storage space AS with reference to the conveyance port CP, and the 2 nd supply unit 21 is disposed on the front side of the storage space AS with reference to the conveyance port CP. In addition, with reference to the original plate 11 stored in the storage space AS, the 1 st supply unit 13 is disposed on one side (-Y direction) of the original plate 11, and the 2 nd supply unit 13 is disposed on the other side (+ Y direction) of the original plate 11. With such a configuration, in the storage apparatus 1A, the storage space AS can be gas purged from one direction.
Examples of the gas (purge gas) supplied from the 1 st supply part 13 and the 2 nd supply part 21 include Clean Dry Air (CDA). The CDA contains water (water vapor) as a haze generating substance of the original plate 11 at a very low ratio as compared with normal air, and is a gas having a humidity of 1% or less in the present embodiment. The gas supplied from the 1 st supply part 13 and the 2 nd supply part 21 may be an inert gas containing a small proportion of moisture, such as nitrogen (N) gas2). By controlling the humidity to be below 1%The CDA of (2) can purge the storage space AS to reduce the humidity of the ambient environment of the original plate 11 to, for example, a low humidity of 1.5% or less, thereby suppressing occurrence of fogging of the original plate 11.
If the humidity of the environment around the original plate 11 can be set to the target humidity or less, the gas supplied from the 1 st supply unit 13 may be different from the gas supplied from the 2 nd supply unit 21. In other words, the gas forming the 3 rd gas flow 19 may be a gas other than the gases forming the 1 st gas flow 17 and the 2 nd gas flow 18. However, from the viewpoint of complexity of the apparatus configuration, it is preferable that the gas supplied from the 1 st supply unit 13 and the gas supplied from the 2 nd supply unit 21 are the same gas.
Further, in the storage device 1A, a wall member 20 is provided so as to face the 2 nd supply portion 21. The wall member 20 is a member including a receiving surface 20a that intersects the blowing direction BD of the gas blown out from the 2 nd supply unit 21 and receives the 3 rd gas flow 19 formed by the 2 nd supply unit 21. Specifically, the wall member 20 is configured such that the receiving surface 20a extends in the Y direction (direction along the protective surface 16) with respect to the protective surface 16 of the protective member 12 in a range of 0mm to 300mm from the protective surface 16 to the outside. The wall member 20 may be configured AS a part of the housing cavity defining the housing space AS, or may be configured separately from the housing cavity.
As described above, in the housing device 1A, the vortex 22 is generated on the downstream side of the original plate 11 by the 1 st air flow 17 and the 2 nd air flow 18. However, in the present embodiment, the region (generation region) where the vortex flow 22 is generated can be narrowed by sandwiching the 1 st air flow 17 and the 2 nd air flow 18 between the 3 rd air flow 19 formed by the 2 nd supply part 21 and the wall member 20. Therefore, the entrainment of the high-humidity atmosphere around the original plate 11 can be reduced, and the humidity of the storage space AS can be reduced. In addition, from the viewpoint of narrowing the generation area of the vortex 22, it is preferable that the distance in the Z direction (direction perpendicular to the pattern surface 14 of the original plate 11) between the 2 nd supply part 21 and the wall member 20 is short. Specifically, the wall member 20 may be disposed such that the distance between the receiving surface 20a and the gas outlet of the 2 nd supply unit 21 in the Z direction is 10mm to 500 mm.
Now, with reference to fig. 2, the relationship among the flow rate Q1 of the 1 st stream 17, the flow rate Q2 of the 2 nd stream 18, and the flow rate Q3 of the 3 rd stream 19 will be described. FIG. 2 shows the flow of gas around the original plate 11 when the flow rate Q3 of the 3 rd gas flow 19 is equal to or higher than the sum of the flow rates Q1 of the 1 st gas flow 17 and the flow rate Q2 of the 2 nd gas flow 18 (the total flow rate of the 1 st gas flow 17 and the 2 nd gas flow 18), that is, when Q3 is equal to or greater than Q1+ Q2. In this case, as shown in fig. 2, the 3 rd air stream 19 collides with the receiving surface 20a of the wall member 20, and a part of the air stream 19a flows toward the original plate 11 side (counter-flow air stream) is generated. Accordingly, the high-humidity atmosphere gas around the original plate 11 is entrained, and the gas flow 81 in which the high-humidity gas flows toward the original plate 11 side is generated, which is disadvantageous in lowering the humidity of the storage space AS, which is the surrounding environment of the original plate 11. Thus, it is preferred that the flow rate Q3 of stream 3, 19, be less than the sum of the flow rates Q1 of stream 1, 17, and the flow rate Q2 of stream 2, 18 (the total flow rates of stream 1, 17, and stream 2, 18), i.e., Q3 < Q1+ Q2.
AS shown in fig. 3, the storage device 1A may be configured to store a plurality of original plates 11 by providing a plurality of storage spaces AS, that is, a storage rack in which a plurality of original plates 11 are stacked. In fig. 3, 2 storage shelves are stacked, but the number of storage shelves is not limited to the number of layers, and 3 or more storage shelves may be stacked. Fig. 3 is a diagram showing a configuration of the storage apparatus 1A capable of storing a plurality of original plates 11. In this case, the 2 nd supply part 21 and the wall member 20 are provided for each of the plurality of storage spaces AS (the plurality of original plates 11). In this case, AS in the storage apparatus 1A shown in fig. 3, the wall member 20 provided in the storage space AS on the upper stage may be provided with the 2 nd supply portion 21 for forming the 3 rd airflow 19 in the storage space AS on the lower stage. On the other hand, the 1 st supply unit 13 does not need to be provided for each of the plurality of storage spaces AS, and the 1 st airflow 17 and the 2 nd airflow 18 in each of the plurality of storage spaces AS may be formed by 1 of the 1 st supply units 13 AS shown in fig. 3. In this case, the apparatus configuration is more advantageous than the case where the 1 st supply unit 13 is provided for each of the plurality of storage spaces AS.
In fig. 1, the wall member 20 is present only in a portion facing the 2 nd supply portion 21. However, as shown in fig. 4, the wall member 20 may extend toward the 1 st supply unit 13 side from the back surface 15 of the original plate 11 or the protective surface 16 of the protective member 12. In this case, the 2 nd air flow 18 formed by the 2 nd supply part 21 is rectified by the wall member 20. Similarly, from the viewpoint of rectifying the 1 st air flow 17, the 2 nd supply unit 21 may be extended toward the 1 st supply unit 13 side with respect to the rear surface 15 of the original plate 11 or the protective surface 16 of the protective member 12 as shown in fig. 4.
Fig. 5 is an XY plan view of the storage device 1A shown in fig. 1. Preferably, the 1 st air stream 17 flows in the X direction over a wider range than the back surface 15 of the original plate 11 as shown in fig. 5. Also, it is preferable that the 2 nd airflow 18 flows in the X direction over a wider range than the protection surface 16 of the protection member 12. Therefore, the 1 st supply unit 13 can blow and supply the gas so that the 1 st gas flow 17 and the 2 nd gas flow 18 are formed in a wider range than the back surface 15 of the original plate 11 or the protective surface 16 of the protective member 12 in the X direction. Further, it is preferable that the 3 rd air flow 19 flows in a wider range than the 1 st air flow 17 and the 2 nd air flow 18 in the X direction. Therefore, the 2 nd supply unit 21 can blow out and supply the gas so as to form the 3 rd stream 19 in a wider range than the 1 st stream 17 and the 2 nd stream 18 in the X direction.
Preferably, (the gas outlet of) the 2 nd supply unit 21 is arranged in the vicinity of the original plate 11 in the Y direction. This is because, when the 2 nd supply unit 21 is disposed at a position away from the original plate 11, the position where the 3 rd air stream 19 interferes with (intersects with) the 1 st air stream 17 and the 2 nd air stream 18 is away from the original plate 11, the generation area of the vortex 22 is enlarged in the + Y direction, and time is required for lowering the humidity of the housing space AS.
As described above, the 3 rd air stream 19 may sandwich the 1 st air stream 17 and the 2 nd air stream 18 downstream of the original plate 11 in cooperation with the wall member 20. Therefore, as shown in fig. 6, it is not necessary to face the 2 nd supply unit 21 and the wall member 20 in the Z direction, and the 2 nd supply unit 21 and the wall member 20 may be arranged so that the blowing direction BD of the gas blown out from the 2 nd supply unit 21 intersects the receiving surface 20 a. Even if the 2 nd supply unit 21 and the wall member 20 are shifted in the Y direction, the blowing direction BD of the gas blown out from the 2 nd supply unit 21 may intersect the receiving surface 20a of the wall member 20.
< embodiment 2 >
A storage apparatus 1B according to embodiment 2 of the present invention will be described with reference to fig. 7A and 7B. Fig. 7A is a schematic view showing the configuration of a housing apparatus 1B according to embodiment 2 of the present invention, and fig. 7B is an XY plan view of the housing apparatus 1B shown in fig. 7A. The storage apparatus 1B stores (stores) the original plate 11 including the pattern surface 14 formed with the pattern in a storage space AS defined by a storage cavity (not shown). The storage apparatus 1B has the same configuration as the storage apparatus 1A, but the wall member 20 has a different configuration from the storage apparatus 1A.
In the present embodiment, the wall member 20 includes a convex portion 41 protruding toward the 2 nd supply portion 21 side in the receiving surface 20 a. The projection 41 is provided so as to face the 2 nd supply unit 21 and intersect the blowing direction BD of the gas blown out from the 2 nd supply unit 21. By providing the projection 41 on the receiving surface 20a of the wall member 20, the distance in the Z direction between the 2 nd supply portion 21 and the wall member 20 can be reduced. Further, the surface of the convex portion 41 on the 2 nd supply portion 21 side may be formed such that the surface on the 2 nd supply portion 21 side is located higher than the protection surface 16 of the protection member 12 in the Z direction (+ Z direction).
As described in embodiment 1, the generation region of the vortex 42 can be narrowed by the 3 rd air flow 19 and the wall member 20 formed by the 2 nd supply part 21, but the generation region of the vortex 42 can be further narrowed by providing the convex part 41 as in the present embodiment. Therefore, the entrainment of the high-humidity atmosphere around the original plate 11 can be reduced, and the humidity of the storage space AS can be reduced. Thus, the convex portion 41 is effective for reducing the humidity of the surrounding environment of the original plate 11.
In the present embodiment, as shown in fig. 7B, the side wall 43 is provided in the X direction with respect to the original plate 11. Referring to fig. 7B, the 1 st air flow 17 formed by the 1 st supply part 13 generally spreads in the X direction. However, in the present embodiment, since the side wall 43 is provided, the diffusion of the 1 st airflow 17 in the X direction can be suppressed. Therefore, in the present embodiment, the 1 st air stream 17 can be made to flow in the X direction in a narrower range than the back surface 15 of the original plate 11. Similarly, the 2 nd airflow 18 can be made to flow in the X direction in a range narrower than the protection surface 16 of the protection member 12. On the other hand, it is preferable that the 3 rd air flow 19 flows in a wider range than the 1 st air flow 17 and the 2 nd air flow 18 in the X direction.
< embodiment 3 >
A storage apparatus 1C according to embodiment 3 of the present invention will be described with reference to fig. 8. Fig. 8 is a schematic diagram showing the configuration of a storage apparatus 1C according to embodiment 3 of the present invention. The storage apparatus 1C stores (stores) the original plate 11 including the pattern surface 14 formed with the pattern in a storage space AS defined by a storage cavity (not shown). The storage device 1C has the same configuration as the storage device 1A, but further includes a 3 rd supply unit 51 as compared with the storage device 1A. In the present embodiment, the 1 st supply unit 13 blows out and supplies the gas so as to form only the 1 st flow 17.
The 3 rd supply unit 51 is provided to face the protection surface 16 of the protection member 12, and blows and supplies gas to the protection surface 16. Thereby, AS shown in fig. 8, an air flow 52 is formed in the storage space AS of the original plate 11.
The gas (purge gas) supplied from the 3 rd supply part 51 has a very low proportion of moisture (water vapor) that is a blur generating substance of the original plate 11, compared to normal air, and has a humidity of 1% or less in the present embodiment. The gas supplied from the 3 rd supply part 51 may be different from or the same as the gas supplied from the 1 st supply part 13 or the gas supplied from the 2 nd supply part 21.
As described in embodiment 1, the generation region of the vortex 53 can be narrowed by the 3 rd air flow 19 and the wall member 20 formed by the 2 nd supply part 21, but the generation region of the vortex 53 can be further narrowed by forming the air flow 52 as in the present embodiment. Therefore, the entrainment of the high-humidity atmosphere around the original plate 11 can be reduced, and the humidity of the storage space AS can be reduced. In this way, the system of blowing the gas from the 3 rd supply part 51 to form the gas flow 52 against the protective surface 16 of the protective member 12 is effective for reducing the humidity of the environment around the original plate 11.
In the present embodiment, the 3 rd supply portion 51 is provided in the wall member 20, but is not limited thereto. For example, the 3 rd supply part 51 may be configured to blow gas over the entire protection surface 16 of the protection member 12, and the 3 rd supply part 51 may be provided separately from the wall member 20. The shape of the gas outlet of the 3 rd supply unit 51 may be selected from any shape such as a slit shape or a circular shape.
< embodiment 4 >
A storage apparatus 1D according to embodiment 4 of the present invention will be described with reference to fig. 9. Fig. 9 is a schematic diagram showing the configuration of a storage apparatus 1D according to embodiment 4 of the present invention. The storage apparatus 1D stores (stores) the original plate 11 including the pattern surface 14 formed with the pattern in a storage space AS defined by a storage cavity (not shown). The storage device 1D has the same configuration as the storage device 1A, but further includes a 4 th supply unit 61 as compared with the storage device 1A.
The 4 th supply part 61 is provided on the wall member 20 so as to face the 2 nd supply part 21. The 4 th supply unit 61 blows out and supplies the gas so as to form a 4 th flow 62, and the 4 th flow 62 interferes with the 1 st flow 17 and the 2 nd flow 18 formed by the 1 st supply unit 13 and opposes the 3 rd flow 19 formed by the 2 nd supply unit 21. Further, it is preferable that the 4 th air flow 62 flows in the X direction in a range substantially equal to the 3 rd air flow 19.
The gas (purge gas) supplied from the 4 th supply part 61 has a very low proportion of moisture (water vapor) as a haze generating substance of the original plate 11, compared to normal air, and has a humidity of 1% or less in the present embodiment. The gas supplied from the 4 th supply part 61 may be different from or the same as the gas supplied from the 1 st supply part 13 or the gas supplied from the 2 nd supply part 21.
In the present embodiment, the 4 th air flow 62 is formed so as to interfere (collide) with the 1 st air flow 17 and the 2 nd air flow 18, and therefore, the same effect as that of the 3 rd embodiment can be obtained. Specifically, the 3 rd air flow 19 and the wall member 20 formed by the 2 nd supply part 21 can narrow the generation area of the vortex 63, but the 4 th air flow 62 can be formed to further narrow the generation area of the vortex 63 as in the present embodiment. Therefore, the entrainment of the high-humidity atmosphere around the original plate 11 can be reduced, and the humidity of the storage space AS can be reduced. In this way, the formation of the 4 th gas flow 62 which is blown out from the 4 th supply part 61 and is opposed to the 3 rd gas flow 19 is effective for reducing the humidity of the environment around the original plate 11.
The relationship between the flow rate Q1 of the 1 st stream 17, the flow rate Q2 of the 2 nd stream 18, the flow rate Q3 of the 3 rd stream 19, and the flow rate Q4 of the 4 th stream 62 will be described. For example, consider the case where the sum (total flow rate) of the flow rates Q3 and Q4 of the 3 rd and 4 th streams 19 and 62 is equal to or greater than the sum (total flow rate) of the flow rates Q1 and Q2 of the 1 st and 2 nd streams 17 and 18, that is, the case where Q3+ Q4 is equal to or greater than Q1+ Q2. In this case, the 3 rd air stream 19 collides with the 4 th air stream 62 to generate a (counter) air stream, a part of which flows toward the original plate 11 side. This causes high-humidity atmosphere gas around the original plate 11 to be entrained, and a gas flow in which high-humidity gas flows toward the original plate 11 side is generated, which is disadvantageous in reducing the humidity of the storage space AS, which is the surrounding environment of the original plate 11. Thus, it is preferred that the sum of the flow rates Q3 of stream 3, 19 and Q4 of stream 4, 62 be less than the sum of the flow rates Q1 of stream 1, 17, and Q2 of stream 2, 18, i.e., Q3+ Q4 < Q1+ Q2.
AS described above, according to the embodiments 1, 2, 3, and 4, the storage device advantageous for reducing the humidity of the storage space AS which is the surrounding environment of the original plate 11 can be provided without requiring a large amount (large flow rate) of gas (purge gas). In addition, embodiment 1, embodiment 2, embodiment 3, and embodiment 4 can be appropriately combined.
An exposure apparatus in which the storage apparatus 1A is applied as a storage unit for storing original plates will be described below with reference to fig. 10. Here, the housing apparatus 1A is applied to the exposure apparatus, but the housing apparatus 1B, 1C, or 1D may be applied to the exposure apparatus. Fig. 10 is a schematic diagram showing a configuration of an exposure apparatus 505 according to an aspect of the present invention.
The exposure apparatus 505 is a lithography apparatus used in a lithography process as a process for manufacturing devices such as semiconductor devices and liquid crystal display devices, and forms a pattern on a substrate. The exposure device 505 exposes the substrate via the master, and transfers the pattern of the master onto the substrate. The exposure device 505 may adopt a step-and-scan method, a distributed repetition method, or other exposure methods.
As shown in fig. 10, the exposure apparatus 505 includes: an illumination optical system 501; an original plate stage 502 (original plate holding section) that holds and moves an original plate; a projection optical system 503; a substrate stage 504 that holds and moves a substrate; and a storage device 1A.
The illumination optical system 501 illuminates the original plate 11 held by the original plate stage 502 with light from a light source. The illumination optical system 501 includes lenses, mirrors, optical integrators, diaphragms, and the like. As the light source, for example, ArF excimer laser having a wavelength of about 193nm, KrF excimer laser having a wavelength of about 248nm, F excimer laser having a wavelength of about 157nm can be used2Lasers such as lasers, YAG lasers, and the like. The number of lasers used for the light source is not limited. Where a laser is used as the light source, the illumination optical system 501 may include a shaping optical system that shapes laser light (parallel light) into a desired shape or an incoherent optical system that incoherent coherent laser light. The light source is not limited to a laser, and 1 or more lamps such as a mercury lamp and a xenon lamp may be used.
The projection optical system 503 projects the pattern of the original plate 11 onto the substrate held by the substrate stage 504. The projection optical system 503 can use an optical system composed of only a plurality of lens elements, an optical system (catadioptric optical system) including a plurality of lens elements and at least 1 concave mirror. In addition, as the projection optical system 503, an optical system including a plurality of lens elements and 1 diffractive optical element such as a diffractive imaging element, a total reflection mirror type optical system, or the like can be used.
The storage apparatus 1A stores (stores) the original plate 11 that is carried into the exposure apparatus 505 from outside the exposure apparatus 505 and is transported to the original plate stage 502. AS described above, the storage apparatus 1A does not require a large amount (large flow rate) of gas (purge gas), and can reduce the humidity of the storage space AS which is the surrounding environment of the original plate 11. Therefore, the original plate 11 transported from the storage apparatus 1A to the original plate stage 502 and held by the original plate stage 502 can be prevented from blurring during exposure. Thus, the exposure apparatus 505 can manufacture a high-quality device at a lower cost than the conventional one in the photolithography step in the manufacturing process of a device such as a semiconductor device or a liquid crystal display device.
The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing an article such as a device (a semiconductor element, a magnetic storage medium, a liquid crystal display element, or the like). The manufacturing method comprises the following steps: a step of exposing the substrate coated with the photosensitive agent (forming a pattern on the substrate) by using an exposure device 505; and a step of developing the exposed substrate (processing the substrate). The manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, sealing, and the like). The method for manufacturing an article according to the present embodiment is advantageous over conventional methods in at least one of the performance, quality, production efficiency, and production cost of the article. The above-described article manufacturing method may be performed using a lithography apparatus such as an imprint apparatus or a drawing apparatus.
The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the claims are included to disclose the scope of the invention.

Claims (14)

1. A storage device for storing an original plate including a pattern surface formed with a pattern, characterized in that,
the storage device includes:
a 1 st supply unit configured to blow out and supply a gas so as to form at least one of a 1 st gas flow and a 2 nd gas flow, the 1 st gas flow being along a 1 st surface of the original plate on a side opposite to the pattern surface, the 2 nd gas flow being along a 2 nd surface of a protective member on a side opposite to the pattern surface, the protective member being provided apart from the pattern surface and protecting the pattern surface;
a 2 nd supply unit that blows out and supplies a gas so as to form a 3 rd gas flow, the 3 rd gas flow interfering with the at least one gas flow formed by the 1 st supply unit; and
a member including a receiving surface intersecting a blowing direction of the gas blown out from the 2 nd supply unit and receiving the 3 rd gas flow formed by the 2 nd supply unit,
the 1 st supply part is arranged at the depth side of the containing space for containing the original plate by taking a conveying opening for conveying the original plate as a reference,
the 2 nd supply unit is disposed in front of the storage space with reference to the conveyance port.
2. The storage device of claim 1,
the 1 st supply unit blows out and supplies the gas so as to form, as the at least one gas flow, a gas flow in one direction from the depth side of the storage space toward the front side of the storage space.
3. The storage device of claim 1,
the 2 nd supply unit blows out and supplies gas so as to form a gas flow as the 3 rd gas flow, which collides with the at least one gas flow formed by the 1 st supply unit.
4. The storage device of claim 1,
the member is disposed such that the receiving surface is located below the 2 nd surface in a direction perpendicular to the pattern surface.
5. The storage device of claim 1,
the member is disposed such that a distance between the receiving surface and the gas outlet of the 2 nd supply unit in a direction perpendicular to the pattern surface is 10mm to 500 mm.
6. The storage device of claim 1,
the receiving surface extends in a direction along the 2 nd surface of the protective member in a range of 0mm to 300mm from the 2 nd surface toward the outside.
7. The storage device of claim 1,
the 1 st supply unit blows out and supplies gas so as to form the 1 st flow and the 2 nd flow,
the flow rate of the 3 rd air flow is smaller than the sum of the flow rate of the 1 st air flow and the flow rate of the 2 nd air flow.
8. The storage device of claim 1,
the receiving surface includes a convex portion protruding toward the 2 nd supply portion.
9. The storage device of claim 1,
the 1 st supply unit blows out and supplies gas so as to form only the 1 st gas flow,
the storage device further includes a 3 rd supply unit which is provided to face the 2 nd surface of the protection member, and blows out and supplies gas toward the 2 nd surface.
10. The storage device of claim 1,
the storage device further includes a 4 th supply unit that is provided in the member, blows out and supplies a gas so as to form a 4 th flow, and the 4 th flow interferes with the at least one flow formed by the 1 st supply unit and is opposed to the 3 rd flow formed by the 2 nd supply unit.
11. The storage device of claim 1,
the storage device stores a plurality of original plates,
the 2 nd supply unit and the member are provided for the original plate, respectively.
12. The storage device of claim 1,
the gas includes a gas having a humidity of 1% or less.
13. An exposure apparatus for exposing a substrate,
the exposure apparatus includes:
a receiving part for receiving an original plate including a pattern surface formed with a pattern;
a master holding section for holding the master transported from the storage section; and
a projection optical system for projecting the pattern of the original plate held by the original plate holding unit onto the substrate,
the storage part comprises:
a 1 st supply unit that blows out and supplies air so as to form at least one of a 1 st air flow and a 2 nd air flow, the 1 st air flow being along a 1 st surface of the original plate on a side opposite to the pattern surface, the 2 nd air flow being along a 2 nd surface of a protective member on a side opposite to the pattern surface, the protective member being provided apart from the pattern surface and protecting the pattern surface;
a 2 nd supply unit configured to blow out and supply a gas so as to form a 3 rd gas flow, the 3 rd gas flow interfering with the at least one gas flow formed by the 1 st supply unit; and
a member including a receiving surface intersecting a blowing direction of the gas blown out from the 2 nd supply unit and receiving the 3 rd gas flow formed by the 2 nd supply unit,
the 1 st supply part is arranged at the depth side of the containing space for containing the original plate by taking a conveying opening for conveying the original plate as a reference,
the 2 nd supply unit is disposed in front of the storage space with reference to the conveyance port.
14. A method for manufacturing an article, comprising:
exposing a substrate using the exposure apparatus according to claim 13;
developing the exposed substrate; and
and a step of manufacturing an article from the developed substrate.
CN202111494648.5A 2020-12-16 2021-12-09 Storage device, exposure device, and article manufacturing method Pending CN114637168A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020208629A JP2022095352A (en) 2020-12-16 2020-12-16 Storage device, exposure device, and article manufacturing method
JP2020-208629 2020-12-16

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CN114637168A true CN114637168A (en) 2022-06-17

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TW202225858A (en) 2022-07-01
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