KR20220079008A - Substrate Fixing Device - Google Patents

Abstract

The present invention relates to a substrate fixing device for adsorbing and fixing a substrate in a planar state in a deposition process. fixed module; a chuck for adsorbing and fixing an upper surface of the substrate fixed to the substrate fixing module; a substrate sag compensating module for supporting a portion drooping by the weight of the substrate upward so that the substrate fixed to the substrate fixing module is adsorbed and fixed to the chuck while maintaining a flat surface; Disclosed is a substrate fixing device including a control unit for controlling the substrate sag compensation module.

Description

Substrate Fixing Device

The present invention relates to a substrate fixing device, and more particularly, to a substrate fixing device for adsorbing and fixing a substrate in a planar state in a deposition process.

In a semiconductor manufacturing process or a display manufacturing process, etc., a process of forming an organic thin film, etc. is included. In order to form such a thin film, a vacuum deposition method is mostly used.

The vacuum deposition method is a method of forming a thin film on one surface of a substrate by arranging an evaporation source such as a substrate to be deposited and a source containing a source material of the deposit in a chamber, and heating and vaporizing the evaporation source to evaporate and spray the source material.

The deposition apparatus 10 is used to perform the above-described vacuum deposition. As shown in FIG. 1 , the conventional general deposition apparatus 10 is an object to be deposited on the upper side of the chamber 20 forming a space in which deposition is performed. The substrate 11 is fixed, and the evaporation source source 40 of the substrate 11 is mounted.

In addition, a mask 15 is provided on the lower surface of the mounted substrate 11 . The substrate 11 and the mask 15 may be mounted with a fine and regular interval therebetween. Also, the substrate 11 and the mark are aligned by the aligner 30 .

In addition, the source 40 may be deposited on the substrate 11 by scattering the deposition material while being transferred in the horizontal direction from the lower side of the chamber 20 .

However, in recent years, the size of the display is progressing, and in order to increase the efficiency of production, a method of cutting and using a single original plate into a plurality of panels is used, and thus the size of the deposited substrate is gradually increasing.

However, when the substrate is fixed, it is adsorbed and fixed through a chuck provided on the upper side of the substrate in a state where the edge of the substrate is fixed. , in this case, the adsorption and fixing is not performed accurately, and the deposition is made in a state where the substrate is curved rather than flat, and there is a fear that a defect may occur.

The present invention is to solve the above problems, and it is an object to provide a substrate holding apparatus and a control method therefor in which deposition is performed in a state in which a large substrate is adsorbed and fixed while being in close contact with a chuck to form a flat surface.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, according to one aspect of the present invention, there is provided a substrate fixing module located above a vacuum chamber forming a space for depositing a substrate, and fixing the edge of the substrate loaded into the vacuum chamber; a chuck for adsorbing and fixing an upper surface of the substrate fixed to the substrate fixing module; a substrate sag compensating module for supporting a portion drooping by its own weight upward so that the substrate fixed to the substrate fixing module is adsorbed and fixed to the chuck while maintaining a flat surface; Disclosed is a substrate fixing device including a control unit for controlling the substrate sag compensation module.

The substrate fixing module includes: a fixing frame formed in a rectangular frame shape to support the edge portion of the substrate; It may include a; it is provided in a plurality of places on the inside of the fixing frame to press and fix the edge portion of the substrate.

The substrate sag compensating module may be provided on the outside of the rim of the fixed frame to support non-deposition regions in which deposition of the substrate is not performed while being raised and lowered.

The substrate sag compensation module may include: a lifting unit fixed to an upper side of the vacuum chamber; a rotating part provided at a lower side of the lifting unit to be raised and lowered by the lifting unit and rotated; While being rotated by the rotating part, the fork part that enters or departs from the lower region of the substrate and is raised by the lifting unit in the lower region of the substrate to support the lower surface of the substrate; may include

The lifting unit may include: a lifting actuator fixed to an upper side of the vacuum chamber and extending and contracting in a vertical direction; and a compensation module frame lifted by the lifting actuator, wherein the rotating part includes a rotation motor mounted on the compensation module frame, and the fork part is rotated by the rotation motor and extends downward from the rotation motor being a vertical member; a horizontal member extending in a horizontal direction from the vertical member; a connecting member for coupling the vertical member and the horizontal member; It may include; a tip provided on the horizontal member to support the lower surface of the substrate.

The horizontal member may be detachably fixed to the connecting member.

The controller may control the substrate sag compensating module so that the substrate sag compensating module is in contact with the non-deposition region of the substrate to support the substrate.

According to another aspect of the present invention, there is provided a method for controlling a substrate holding apparatus for controlling the above-described substrate holding apparatus, the method comprising: a substrate loading step of loading a substrate into a vacuum chamber; a fixing step of fixing the loaded substrate to a substrate fixing module; an entry step of moving the substrate sag compensating module so that the tip of the substrate sag compensating module is positioned below the non-deposition region of the substrate according to the type of the substrate fixed to the substrate fixing module; a supporting step of lifting the tip of the substrate sag compensating module to lift and support the portion drooping by the weight of the substrate upward; an adsorption step in which a chuck provided on an upper side of the substrate adsorbs and fixes the substrate; Disclosed is a method of controlling a substrate holding apparatus comprising a; after the substrate is adsorbed, the substrate sag compensating module is separated from the lower side of the substrate to the outside.

According to the substrate fixing device of the present invention, the substrate can be deposited in a flat state by supporting the portion drooping due to its own weight from the lower side and adsorbing and fixing the substrate in a planar state, thereby reducing deposition quality and reducing deposition quality. can improve

In addition, since the fork portion of the substrate sag compensation module can be replaced according to the size and deposition type of the substrate, it is possible to respond to substrates of various sizes and deposition types.

Effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

The summary set forth above as well as the detailed description of the preferred embodiments of the present application set forth below may be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the invention, there are shown in the drawings preferred embodiments. It should be understood, however, that the present application is not limited to the precise arrangements and instrumentalities shown.
1 is a view showing a conventional deposition apparatus;
2 is a view showing a deposition apparatus equipped with a substrate fixing apparatus according to an embodiment of the present invention;
3 is a view showing a substrate fixing module and a substrate sag compensation module of the substrate fixing apparatus according to an embodiment of the present invention;
4 is a view showing a substrate loaded into a deposition apparatus;
5 is a view showing a substrate sag compensation module of the substrate fixing device according to an embodiment of the present invention;
6 is a view showing the radius of movement of the tip according to the rotation of the substrate sag compensation module;
7 is a view showing a connection member of the substrate sag compensation module;
8 is a flowchart illustrating an embodiment of a method for controlling a substrate fixing apparatus of the present invention.

Hereinafter, preferred embodiments of the present invention in which the object of the present invention can be specifically realized will be described with reference to the accompanying drawings. In describing the present embodiment, the same names and the same reference numerals are used for the same components, and an additional description thereof will be omitted.

Hereinafter, an embodiment of the substrate fixing apparatus 100 of the present invention will be described.

As shown in FIG. 2 , the substrate fixing apparatus 100 according to the present embodiment may include a substrate fixing module 110 , a chuck 140 , a substrate sag compensating module 120 , and a control unit 150 .

Meanwhile, the substrate fixing apparatus 100 according to the present embodiment is applied to a deposition apparatus 90 for depositing a deposition material on a substrate 11 , and the deposition apparatus 90 may include a vacuum chamber 20 . .

The vacuum chamber 20 may be loaded onto the substrate 11 to form a space in which deposition is performed, and may be configured to maintain a vacuum in the space in which deposition is performed. In addition, a vacuum pump for forming and maintaining a vacuum in the vacuum chamber 20 and a door for opening and closing the vacuum chamber 20 may be provided.

A substrate 11 serving as a deposition target may be positioned above the vacuum chamber 20 .

An aligner 30 for mounting the substrate 11 and the mask 15 is provided above the vacuum chamber 20 to fix the substrate 11 and the mask 15 in a mutually aligned state.

Meanwhile, a source 40 may be provided under the substrate 11 of the vacuum chamber 20 . The source 40 may contain a raw material to be deposited on the substrate 11 .

A substrate fixing module 110 and a chuck 140 may be provided above the vacuum chamber 20 to fix the substrate 11 loaded into the vacuum chamber 20 . The substrate fixing module 110 may be coupled to the aligner 30 .

The substrate fixing module 110 may include a fixing frame 112 and a fixing member 114 as shown in FIGS. 2 and 3 .

The fixing frame 112 may be formed in a rectangular frame shape to support the edge portion of the substrate 11 .

The fixture 114 may be provided at a plurality of locations inside the support frame to press and fix the edge of the substrate 11 .

Accordingly, the substrate 11 loaded into the vacuum chamber 20 may be positioned within a rectangular frame of the fixing frame 112 , and the edge portion of the substrate 11 may be pressed and fixed by the fastener 114 .

The chuck 140 is positioned above the substrate 11 fixed to the substrate fixing module 110 , and may be provided to adsorb and fix the substrate 11 fixed to the substrate fixing module 110 . At this time, the chuck 140 adsorbs and fixes the upper surface of the substrate 11 using vacuum, so that the surface in contact with the substrate 11 forms a flat surface so that the substrate 11 is adsorbed in a planar state. can be formed.

On the other hand, since the edge of the substrate 11 fixed to the substrate fixing module 110 is fixed, in the case of the enlarged substrate 11, the center portion may be bent downward by its own weight to cause sagging.

A substrate sag compensation module 120 may be provided to support and planarize the sagging substrate 11 .

As shown in FIG. 3 , one or more substrate sag compensation modules 120 may be provided on the outside of the fixed frame 112 . In this embodiment, a total of four are symmetrically provided as an example, but the present invention is not limited to the number of the substrate sag compensation module 120, and a plurality such as six or eight may be provided as needed. .

The substrate sag compensating module 120 compensates for the portion drooping due to the weight of the substrate 11 so that the substrate 11 fixed to the substrate fixing module 110 is adsorbed and fixed to the chuck 140 while maintaining a flat surface. It may be provided to support upward from the lower side of the substrate 11 .

At this time, the substrate sag compensating module 120 may be provided on the outside of the rim of the fixed frame 112 to support any one of the non-deposition regions 14 of the substrate 11 while being lifted. have.

As shown in FIG. 4 , when a plurality of substrates 11 are recently produced in order to improve production efficiency, deposition is performed in a plurality of regions as much as the area of the substrate 11 to be produced on one large substrate 11 , and thereafter deposition A plurality of substrates 11 may be produced by cutting the formed region.

Accordingly, a deposition region 12 in which a deposition material is deposited and a non-deposition region 14 in which a deposition material is not deposited may be formed on the substrate 11 .

The substrate sag compensating module 120 supports the substrate 11 in contact with the lower surface of the substrate 11 from the lower side of the substrate 11 fixed to the substrate fixing module 110 , at this time the substrate When in contact with the portion on which the deposition is made in (11), a defect may occur in the portion on the surface of the region to be deposited and lead to a defect. (11) can be supported.

As shown in FIG. 5 , the substrate sag compensation module 120 as described above may include a lifting unit 122 , a rotating unit 124 , and a fork unit 126 .

The lifting unit 122 is fixed to the upper side of the vacuum chamber 20 and may be provided to be raised and lowered by expansion and contraction or sliding.

The rotating unit 124 is provided below the lifting unit 122 to be raised and lowered by the lifting unit 122 , and may be provided to rotate.

The fork part 126 is provided to enter or depart from the lower region of the substrate 11 while being rotated by the rotating unit 124 , and the lower region of the substrate 11 . may be provided to support the substrate 11 in contact with the lower surface of the substrate 11 while being raised by the lifting unit 122 in the .

As shown in FIG. 5 , the lifting unit 122 may include a lifting actuator 131 and a compensation module frame 132 .

The elevating actuator 131 is fixed to the upper side of the chamber and may have a structure such as a solenoid or a piston so as to be able to expand and contract in the vertical direction. Of course, the present invention is not limited thereto, and a pinion rotated by a motor and a rack structure that meshes with the pinion and extends in the vertical direction are raised and lowered according to the rotation of the pinion may be formed.

The compensation module frame 132 may be coupled to the elevating actuator 131 to be elevated by the elevating actuator 131 .

The rotating part 124 may include a rotating motor 133 . The rotation motor 133 may be mounted on the compensation module frame 132 .

In addition, the fork part 126 may include a vertical member 134 , a horizontal member 135 , and a connecting member 137 .

The vertical member 134 may extend downward from the rotation motor 133 and may be provided to be rotated by the rotation motor 133 .

The horizontal member 135 may extend from the vertical member 134 in a horizontal direction.

The connecting member 137 may couple the vertical member 134 and the horizontal member 135 to each other.

In addition, a tip 136 that contacts the lower surface of the substrate 11 and supports the lower surface of the substrate 11 may be provided at an end of the horizontal member 135 . The tip 136 may be formed of a material such as ceramic so as not to scratch or scratch the surface of the substrate 11 while in contact with the glass substrate 11 .

In addition, since the tip 136 is detachable from the horizontal member 135 , it may be provided to be replaced in a shape suitable for the substrate 11 .

Accordingly, as shown in FIG. 6 , the fork part 126 enters or leaves the lower region of the substrate 11 while being rotated by the rotating part 124 material, and is raised by the lifting part 122 . while supporting the lower side of the substrate 11 .

At this time, as shown in FIG. 7 , the horizontal member 135 may be provided to be detachably attached to the connection member 137 .

In order for the horizontal member 135 to be detachably coupled to the connection member 137 , an insertion groove 138 is formed in the connection member 137 , and the horizontal member 135 inserted into the insertion groove 138 . ) may be provided with a bolt 139 for fixing. Of course, the present invention is not limited thereto and may be fixed by various methods such as a magnetic type.

Accordingly, a horizontal member 135 of an appropriate length according to the size and deposition type of the substrate 11 loaded into the vacuum chamber 20 is mounted on the connecting member 137 to provide substrates 11 of various sizes and deposition types. can be applied to

On the other hand, the control unit 150 for controlling the elevation and rotation of the substrate sag compensation module 120 may be provided. The control unit 150 receives information on the size and deposition type of the substrate 11 to be loaded, so that the tip 136 of the substrate sag compensating module 120 is placed in the non-deposition region 14 of the substrate 11 . It is possible to control the substrate sag compensation module 120 to be positioned.

Accordingly, the control unit 150 controls the substrate sag compensating module 120 to place the substrate sag compensating module 120 in the non-deposition region 14 of the substrate 11 fixed to the substrate fixing module 110 . After controlling the tip 136 to be positioned, the tip 136 may be raised so that the portion struck by the weight of the substrate 11 is lifted to form a flat surface. In this case, a flat surface may be formed while the substrate 11 is in close contact with the chuck 140 . In a state in which the substrate 11 is flat as described above, the chuck 140 adsorbs and fixes the substrate 11, and when the adsorption and fixation of the substrate 11 is completed, the substrate sag compensating module 120 descends. After being rotated, it may be separated from the lower region of the substrate 11 . This is to exclude deposition from being disturbed by the substrate sag compensating module 120 .

Hereinafter, a control method for controlling the above-described substrate fixing apparatus 100 will be described.

As shown in FIG. 8, the control method of the substrate fixing apparatus according to this embodiment includes a substrate loading step (S110), a fixing step (S120), an entry step (S130), a supporting step (S140), and an adsorption step (S150). , it may include a leaving step (S160).

The substrate loading step ( S110 ) is a step in which the substrate 11 is loaded into the vacuum chamber 20 . In addition, the fixing step (S120) is a step in which the substrate 11 loaded into the vacuum chamber 20 in the substrate loading step (S110) is fixed to the substrate fixing module 110 .

The entry step (S130) is the tip of the substrate sag compensation module 120 under the non-deposition region 14 of the substrate 11 according to the type of the substrate 11 fixed to the substrate fixing module 110 . It is a step of moving the substrate sag compensating module 120 so that the 136 is positioned.

Here, the type of the substrate 11 may refer to information on the size of the substrate 11 , the deposition type of the substrate 11 , and the shape, size, and position of the non-deposition region 14 .

In the supporting step (S140), in the entry step (S130), the substrate sag compensating module 120 in a state where the tip 136 is positioned below the non-deposition region 14 of the substrate 11 is raised upward. This is a step of forming a planar state of the substrate 11 by lifting and supporting the portion drooping by the weight of the substrate 11 upward.

The adsorption step (S150) is a step of adsorbing and fixing the substrate 11, which has become in a planar state through the support step (S140), through the chuck 140.

The separation step ( S160 ) is a step in which the substrate sag compensating module 120 departs from the lower region of the substrate 11 to the outside after the substrate 11 is adsorbed.

In the separation step ( S160 ), the substrate sag compensating module 120 is lowered and then rotates to be separated from the lower region of the substrate 11 . This is to exclude deposition from being disturbed by the substrate sag compensation module 120 .

As described above, the preferred embodiments according to the present invention have been described, and the fact that the present invention can be embodied in other specific forms without departing from the spirit or scope of the present invention in addition to the above-described embodiments is understood by those of ordinary skill in the art. It is obvious to them. Therefore, the above-described embodiments are to be regarded as illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.

11: substrate 12: deposition area
14: non-deposition area 15: mask
20: vacuum chamber 30: aligner
40: source 90: deposition device
100: substrate fixing device 110: substrate fixing module
112: fixed frame 114: fixture
120: substrate sag compensation module 122: elevating unit
124: rotating part 126: fork part
131: lifting actuator 132: compensation module frame
133: rotation motor 134: vertical member
135: horizontal member 136: tip
137: connection member 138: insertion groove
139: bolt 140: chuck
150: control unit S110: substrate loading step
S120: fixing step S130: entering step
S140: support step S150: adsorption step
S160: Departure stage

Claims (8)

a substrate fixing module located above a vacuum chamber forming a space for depositing a substrate, and fixing an edge of a substrate loaded into the vacuum chamber;
a chuck for adsorbing and fixing an upper surface of the substrate fixed to the substrate fixing module;
a substrate sag compensating module for supporting a portion drooping by its own weight upward so that the substrate fixed to the substrate fixing module is adsorbed and fixed to the chuck while maintaining a flat surface;
a control unit for controlling the substrate sag compensation module;
A substrate holding device comprising a. According to claim 1,
The substrate fixing module includes: a fixing frame formed in a rectangular frame shape to support the edge portion of the substrate;
a fastener provided at a plurality of places inside the fixing frame to press and fix the edge of the substrate;
A substrate holding device comprising a. 3. The method of claim 2,
The substrate sag compensation module,
A substrate fixing device provided on the outside of the frame of the fixing frame to support a non-deposition region in which the deposition of the substrate is not performed while being raised and lowered, respectively. 4. The method of claim 3,
The substrate sag compensation module,
a lifting unit fixed to an upper side of the vacuum chamber;
a rotating part provided at a lower side of the lifting unit to be raised and lowered by the lifting unit and rotated;
a fork portion that enters or departs from the lower region of the substrate while being rotated by the rotating unit, and is raised by the lifting unit in the lower region of the substrate to support the lower surface of the substrate;
A substrate holding device comprising a. 5. The method of claim 4,
The lifting unit,
a lifting actuator fixed to the upper side of the vacuum chamber and extending and contracting in the vertical direction;
Compensation module frame lifted by the lift actuator;
including,
The rotating part,
a rotation motor mounted on the compensation module frame;
includes,
The fork part,
a vertical member rotated by the rotary motor and extending downwardly from the rotary motor;
a horizontal member extending in a horizontal direction from the vertical member;
a connecting member for coupling the vertical member and the horizontal member;
a tip provided on the horizontal member and supporting a lower surface of the substrate;
A substrate holding device comprising a. 6. The method of claim 5,
The horizontal member is a substrate holding device that is detachably fixed to the connecting member. According to claim 1,
The control unit is
A substrate fixing device for controlling the substrate sag compensating module so that the substrate sag compensating module is in contact with the non-deposition region of the substrate to support the substrate. In the control method of the substrate holding device for controlling the substrate holding device of any one of claims 1 to 7,
A substrate loading step in which the substrate is loaded into the vacuum chamber;
a fixing step of fixing the loaded substrate to a substrate fixing module;
an entry step of moving the substrate sag compensating module so that the tip of the substrate sag compensating module is positioned below the non-deposition area of the corresponding substrate according to the type of the substrate fixed to the substrate fixing module;
a support step of lifting the tip of the substrate sag compensation module to lift and support the portion drooping by the weight of the substrate upward;
an adsorption step in which a chuck provided on an upper side of the substrate adsorbs and fixes the substrate;
a separation step in which the substrate sag compensating module departs from the lower side of the substrate to the outside after the substrate is adsorbed;
A control method of a substrate fixing device comprising a.

Images