KR101914882B1 - Align system with substrate tightening plate for stabilizing substrate - Google Patents

Align system with substrate tightening plate for stabilizing substrate Download PDF

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KR101914882B1
KR101914882B1 KR1020170165241A KR20170165241A KR101914882B1 KR 101914882 B1 KR101914882 B1 KR 101914882B1 KR 1020170165241 A KR1020170165241 A KR 1020170165241A KR 20170165241 A KR20170165241 A KR 20170165241A KR 101914882 B1 KR101914882 B1 KR 101914882B1
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substrate
mask
plate
alignment
present
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KR20170139473A (en
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김정용
전옥철
최상규
정하경
최규황
박광수
황성용
정광호
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주식회사 야스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

본 발명의 목적은 대면적 기판을 마스크에 얼라인 하는 과정에서, 기판의 진동을 방지하고 기판 처짐 현상을 제거할 수 있는 얼라인 시스템을 제공하고자 하는 것이다.
상기 목적에 따라 본 발명은, 기판과 마스크를 정렬시키기 위해, 기판 아래 편에 마스크를 배치한 상태에서, 기판 로딩 핀에 의해 인수된 기판을 기판 위에서 눌러주는 밀착 판을 포함한 얼라인 시스템을 제공한다.
즉, 본 발명은, 대면적 기판을 밀착 판의 자중으로 눌러 기판을 펴지게 함으로써 기판 처짐 현상을 방지하고, 나아가 로딩 핀에 의해 지지 되어 있는 기판이 진동하는 현상도 방지한다.
본 발명에서, 로딩 핀에 지지 된 기판은 밀착 판에 의해 가압 된 상태에서 기판 아래 편에 놓여 있는 마스크를 UVW 스테이지에 연동시켜 센터링 동작을 하여 기판-마스크 얼라인을 실시하거나, 밀착 판에 의해 가압 된 상태의 기판을 지지하는 로딩 핀이 설치된 로딩핀 유닛을 UVW 스테이지에 연동시켜 기판을 움직여 기판-마스크 얼라인을 실시할 수 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide an alignment system capable of preventing vibration of a substrate and eliminating a substrate deflection phenomenon in a process of aligning a large area substrate with a mask.
According to the above object, the present invention provides an aligning system including an adhering plate for pressing a substrate taken over by a substrate loading pin, with a mask placed below the substrate, for aligning the substrate with the mask .
In other words, the present invention prevents the substrate from being sagged by spreading the substrate by pushing the large-area substrate with its own weight, and further prevents the substrate supported by the loading pins from being vibrated.
In the present invention, the substrate supported on the loading pins is subjected to substrate-mask alignment by interposing a mask placed on the lower side of the substrate with the UVW stage in a state of being pressed by the adherence plate, performing a centering operation, A loading pin unit provided with a loading pin for supporting a substrate in a state in which the substrate is held can be interlocked with the UVW stage to perform substrate-mask alignment by moving the substrate.

Description

기판을 안정화시키는 밀착판을 구비한 기판 얼라인 시스템{ALIGN SYSTEM WITH SUBSTRATE TIGHTENING PLATE FOR STABILIZING SUBSTRATE}BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate aligning system having an adhesive plate for stabilizing a substrate,

본 발명은 기판에 박막을 증착하여 각종 반도체 소자, 디스플레이 패널 등을 제조함에 있어서, 기판과 박막 소자 패턴을 포함한 마스크를 서로 정밀하게 일치시키는 얼라인 공정에 필요한 장치에 관한 것이다. The present invention relates to an apparatus for aligning a substrate and a mask including a thin film element pattern precisely in the process of depositing a thin film on a substrate to manufacture various semiconductor devices, display panels and the like.

디스플레이 패널 등을 만들기 위해 유리기판에 박막 소자를 증착한다. 생산성 향상 등을 이유로 기판은 점점 더 대면적화되고 있다. 대면적 기판을 패턴이 형성된 마스크에 얹어 진공 챔버 안에서 증발원으로 박막 소자를 증착하는 것이다. 이때, 대면적 기판은 마스크와 정확하게 정렬되어야 하는데, 이러한 얼라인 공정은 기판이 대면적일수록 여러 가지 어려움이 따른다. 대면적 기판을 안정되게 들어올리는 것이 쉽지 않고, 마스크와 정확하게 얼라인 시키는 것도 쉽지 않다. 대면적이면서 두께가 얇은 유리기판은 핸들링하는 동안 심하게 진동하기 때문에 얼라인 자체가 정확도를 확보하기 어렵다. 또한, 기판이 정지된 상태에 있는 경우에도 중력에 의해 중심부가 처지는 현상이 나타난다. 기판이 처진 상태에서 마스크와 얼라인된 경우도 상당히 큰 오차를 지니게 되어 쉐도 효과를 받아 박막 소자 형성 및 이후 제조단계에서 모두 품질의 악화를 가져올 수 있다. A thin film device is deposited on a glass substrate to make a display panel or the like. Substrates are becoming more and more common due to productivity improvements. A large-area substrate is placed on a mask having a pattern formed therein, and a thin film device is evaporated by an evaporation source in a vacuum chamber. At this time, the large-area substrate must be accurately aligned with the mask, and such alignment process has various difficulties as the substrate is large-sized. It is not easy to lift the large-area substrate stably and it is not easy to accurately align the mask with the mask. A large-area, thin-walled glass substrate is severely vibrated during handling, making it difficult to ensure accuracy of the alignment. Further, even when the substrate is in a stationary state, a phenomenon in which the central portion is sagged by gravity appears. Even when the substrate is aligned with the mask while it is in the sagittal state, it has a considerable error, resulting in a shading effect, which can lead to deterioration in quality both in the formation of the thin film element and in the subsequent manufacturing steps.

대한민국 등록특허 10-1479943호는 기판 처짐에 의한 얼라인 부정확 문제를 해결하기 위해 기판이 처진 중심부에서 얼라인을 실시하는 방법을 제안한다. 그러나 이러한 방법은 실제 기판 얼라인을 위해 기판을 움직여야 하는 경우, 기판의 심한 진동 현상에 의한 부정확과 취약성을 해결할 수 없다. Korean Patent Registration No. 10-1479943 proposes a method of aligning a substrate in a center portion of a substrate in order to solve an alignment inaccuracy due to substrate deflection. However, this method can not solve the inaccuracies and vulnerabilities due to the severe vibration phenomenon of the substrate when moving the substrate for the actual substrate alignment.

따라서 본 발명의 목적은 대면적 기판을 마스크에 얼라인 하는 과정에서, 기판의 진동을 방지하고 기판 처짐 현상을 제거할 수 있는 얼라인 시스템을 제공하고자 하는 것이다. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an alignment system capable of preventing vibration of a substrate and eliminating substrate deflection during alignment of a large-area substrate with a mask.

상기 목적에 따라 본 발명은, 기판과 마스크를 정렬시키기 위해, 기판 아래 편에 마스크를 배치한 상태에서, 기판 로딩 핀에 의해 인수된 기판을 기판 위에서 눌러주는 밀착 판을 포함한 얼라인 시스템을 제공한다. According to the above object, the present invention provides an aligning system including an adhering plate for pressing a substrate taken over by a substrate loading pin, with a mask placed below the substrate, in order to align the substrate with the mask .

즉, 본 발명은, 대면적 기판을 밀착 판의 자중으로 눌러 기판을 펴지게 함으로써 기판 처짐 현상을 방지하고, 나아가 로딩 핀에 의해 지지 되어 있는 기판이 진동하는 현상도 방지한다. In other words, the present invention prevents the substrate from being sagged by spreading the substrate by pushing the large-area substrate with its own weight, and further prevents the substrate supported by the loading pins from being vibrated.

본 발명에서, 로딩 핀에 지지 된 기판은 밀착 판에 의해 가압 된 상태에서 기판 아래 편에 놓여 있는 마스크를 UVW 스테이지에 연동시켜 센터링 동작을 하여 기판-마스크 얼라인을 실시하거나, 밀착 판에 의해 가압 된 상태의 기판을 지지하는 로딩 핀이 설치된 로딩핀 유닛을 UVW 스테이지에 연동시켜 기판을 움직여 기판-마스크 얼라인을 실시할 수 있다.In the present invention, the substrate supported on the loading pins is subjected to substrate-mask alignment by interposing a mask placed on the lower side of the substrate with the UVW stage in a state in which the substrate is pressed by the adherence plate, A loading pin unit provided with a loading pin for supporting a substrate in a state in which the substrate is held can be interlocked with the UVW stage to perform substrate-mask alignment by moving the substrate.

상기에서, 밀착 판은 두 개의 플레이트로 구성되고, 상부 플레이트와 하부 플레이트는 서로 연결되어 있되, 서로 간격을 두고 연결 부재에 의해 연결되고, 상부 플레이트는 밀착 판을 구동할 수 있는 구동부에 연결되어, 기판이 로딩 핀으로 로딩 되면, 밀착 판 구동부가 밀착 판을 하강시켜, 밀착판의 하부 플레이트가 기판 윗면에 닿아 하부 플레이트의 자중으로 기판을 밀착 가압하여 기판 처짐 현상과 기판 떨림 현상을 제거한다. The upper plate and the lower plate are connected to each other by a connecting member at a distance from each other. The upper plate is connected to a driving unit capable of driving the closing plate, When the substrate is loaded with the loading pins, the contact plate driving unit lowers the contact plate, and the lower plate of the contact plate contacts the upper surface of the substrate, thereby pressing and pressing the substrate with the weight of the lower plate.

상기에서, 마스크는 기판과 합착 된 후, 기판을 클램프로 고정하여, 기판을 이송하는 트레이의 기능을 겸하는 트레이 겸용 마스크로 구성될 수 있다. In the above, the mask may be composed of a mask serving as a tray which also serves as a tray for holding the substrate by clamping it after being bonded to the substrate, and for transporting the substrate.

또한, 상기에서, 기판-마스크 얼라인 공정은 다소 긴 시간이 걸리므로, 전체 공정의 택 타임을 줄이기 위해, 마스크를 얼라인 챔버로 반입하는 셔틀을 듀얼형으로 구성하여(대한민국 특허출원 제10-2015-0033366호: '챔버와 얼라인 챔버가 통합된 증착 시스템' 참조), 하나의 셔틀이 두 개의 마스크를 나란히 실어나르며, 하나의 기판이 얼라인 된 직후, 대기중이던 나머지 기판이 즉시 얼라인 공정에 들어갈 수 있게 한다. Since the substrate-mask aligning process takes a long time, the shuttle for bringing the mask into the alignment chamber is configured as a dual type (Korean Patent Application No. 10- &Quot; 2015-0033366 " A deposition system incorporating chamber and alignment chambers "), one shuttle carries two masks side by side, and immediately after one substrate is aligned, .

본 발명에 따르면, 밀착 판이 자중으로 기판을 눌러 기판이 처지지 않게 하여 주며, 얼라인 과정에서 기판이 떨리는 현상도 제거하여 준다. 그에 따라 기판과 마스크의 얼라인이 안정되게 이루어지고 얼라인의 정확도가 크게 향상된다. According to the present invention, the contact plate pushes the substrate by its own weight, thereby preventing the substrate from being sagged, and also eliminates the phenomenon of the substrate being shaken during the alignment process. As a result, the alignment of the substrate and the mask is stabilized and the accuracy of the alignment is greatly improved.

또한, 본 발명에 따르면, 기판이 합착되는 마스크가 트레이를 겸하기 때문에 별도의 기판 이송용 척 플레이트를 요하지 않아 장비가 간소화되고, 척 플레이트가 차지하는 공간으로 인해 챔버 높이를 높게 구성해야 했지만, 마스크 겸용 트레이만으로 기판이 운반되기 때문에 챔버의 천장이 낮아질 수 있어, 결과적으로 챔버 진공화에 드는 에너지가 절약된다. In addition, according to the present invention, since the mask on which the substrates are attached doubles as a tray, no additional substrate transfer chuck plate is required, and the equipment is simplified and the chamber height is required to be high due to the space occupied by the chuck plate. Since the substrate is transported only by the tray, the ceiling of the chamber can be lowered, resulting in energy savings in chamber evacuation.

또한, 본 발명에 따르면, 기판-마스크 얼라인 시, 기판이 위에 있고 마스크가 기판 아래에 있는 상태로 합착 되어 증착을 위해 기판-마스크를 뒤집는 플립 동작을 요하지 않아 설비와 택 타임이 모두 절감된다. Further, according to the present invention, both substrate and mask time are reduced because substrate-mask alignment does not require a flip operation in which the substrate is on and the mask is placed under the substrate and inverts the substrate-mask for deposition.

도 1은 본 발명에 대한 실시예를 설명하기 위한 단면 구성도이다.
도 2는 본 발명의 밀착판(200) 구성을 설명하는 단면도이다.
도 3은 본 발명의 변형 실시예를 설명하기 위한 단면 구성도이다. 1 is a cross-sectional view for explaining an embodiment of the present invention.
2 is a cross-sectional view illustrating the structure of the contact plate 200 of the present invention.
3 is a cross-sectional view illustrating a modified embodiment of the present invention.

이하, 첨부도면을 참조하여 본 발명의 바람직한 실시예에 대해 상세히 설명한다. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 얼라인 챔버 내에서 기판(100)이 로봇에 의해 반입된 상태를 보여준다. 얼라인 챔버 내에는 기판(100)을 인수하는 로딩 핀(650)이 설치된 로딩 핀 유닛(600)이 있고, 얼라인 동작을 실행하는 UVW 스테이지(500)가 마스크(트레이) 센터링 유닛(550)과 연결되어 있다. 셔틀(400)은 듀얼 형으로 되어 있어 두 개의 마스크(300)를 나란히 탑재하여 챔버 내로 반입한다. 이는 하나의 마스크(300)에 먼저 기판(100)을 얼라인 하고, 나머지 하나의 마스크는 로딩되어 대기 상태로 있다가 얼라인이 완료된 기판-마스크가 반출되는 동시에 대기하던 마스크가 얼라인을 시작할 수 있어 택 타임을 줄이는 데 기여한다. 듀얼형 셔틀은 대한민국 특허출원 제10-2015-0033366호: '챔버와 얼라인 챔버가 통합된 증착 시스템'에 그 구성과 동작이 잘 나와 있어 본 발명에 참조 되고 편입될 수 있다. 듀얼형 셔틀은 얼라인 시간이 길어 전체 증착시스템의 택 타임을 증가시키는 것을 해결하기 위한 구성이다. 즉, 듀얼형 셔틀은 한번에 두 장의 마스크 또는 기판을 탑재할 수 있는 구성으로 되어, 듀얼형 셔틀의 한편에 탑재된 마스크에 기판이 얼라인 되는 동안, 다른 편에 마스크를 새로 인수받고, 먼저 얼라인되는 기판이 얼라인을 마치면 한 구간을 이동하여 얼라인된 기판은 반출하고 다른 편에 탑재된 마스크를 얼라이너에 놓이게 한다.Fig. 1 shows a state in which the substrate 100 is carried by the robot in the alignment chamber. In the alignment chamber, there is a loading pin unit 600 provided with a loading pin 650 for taking over the substrate 100, and a UVW stage 500 for performing the aligning operation is provided in the mask centering unit 550 It is connected. The shuttle 400 has a dual shape, and two masks 300 are mounted side by side and brought into the chamber. This is because the substrate 100 is first aligned on one mask 300 and the remaining one mask is loaded and in a standby state. Then, the substrate-mask on which the alignment is completed is taken out, and at the same time, Which contributes to reducing the time to take. The dual type shuttle can be referred to and incorporated into the present invention as well as its configuration and operation well known in Korean Patent Application No. 10-2015-0033366, 'A deposition system incorporating chamber and alignment chamber'. The dual type shuttle is a configuration for solving the problem of increasing the tack time of the entire deposition system because of a long alignment time. In other words, the dual-type shuttle has a configuration in which two masks or substrates can be mounted at one time. While the substrate is aligned with the mask mounted on one of the dual-type shuttles, the mask is newly acquired on the other side, Once the substrate is finished aligning, move one section to remove the aligned substrate and place the mask on the other side of the aligner.

또한, 본 실시예에서 적용하는 마스크(300)는 기판(100)을 고정할 수 있는 클램프(350)를 구비하여 기판을 운반할 수 있는 트레이 겸용 마스크이다. 따라서 기판-마스크를 별도의 척킹 장치로 척킹하여 운반할 필요가 없어 척 플레이트를 구성하지 않기 때문에 얼라인 챔버의 높이를 높게 할 필요가 없다. 이는 챔버 부피가 줄게 되고 그만큼 진공화하는 데 드는 에너지를 절약하게 된다. In addition, the mask 300 applied in the present embodiment is a tray-combined mask capable of carrying a substrate with a clamp 350 for fixing the substrate 100. Therefore, it is not necessary to chuck the substrate-mask with a separate chucking device to carry it, and there is no need to increase the height of the aligning chamber because the chuck plate is not constituted. This reduces the chamber volume and saves the energy required to vacuum it.

본 발명의 가장 중요한 특징은 밀착 판(200)이 얼라인 챔버 내에 배치된다는 것이다. 밀착 판(200)은 밀착판 구동부(250)에 의해 업/다운 동작이 실시될 수 있다. 또한, 밀착 판(200) 자체는 두 개의 별도 플레이트로 구성되는데, 상부 플레이트(201)와 하부 플레이트(202)는 서로 간격을 두고 연결 부재(900)에 의해 연결된다. 연결 부재(900)는 도 2에 나타내었고, 대한민국 특허출원 제10-2015-0030179호에 더욱 잘 나와 있어 본 발명에 참조 되고 편입될 수 있다. 예를 들면, 걸쇠, 볼트/너트, 고리와 같은 연결 부재(900)가 상부 플레이트와 하부 플레이트를 연결하되, 서로 틈새를 두고 연결한다. 본 실시예는 머리부(910)로부터 연장된 기둥형 연장부(920)를 갖는 고정부재와 위치를 안정되게 잡도록 부쉬(950)를 사용하여 부싱한 연결 부재(900)를 적용하였다. The most important feature of the present invention is that the contact plate 200 is disposed in the alignment chamber. The close plate 200 can be subjected to an up / down operation by the close plate drive unit 250. The upper plate 201 and the lower plate 202 are connected to each other by a connecting member 900 at a distance from each other. The connecting member 900 is shown in FIG. 2 and is further described in Korean Patent Application No. 10-2015-0030179, which is incorporated herein by reference. For example, a connecting member 900 such as a latch, a bolt / nut, and a collar connects the upper plate and the lower plate with a gap therebetween. This embodiment applies a fixing member having a columnar extension portion 920 extending from the head portion 910 and a connecting member 900 that is bushed using the bushing 950 so as to stably hold the position.

이러한 구성은 밀착판 구동부(250)에 의해 두 개의 플레이트 모두 업/다운 동작은 함께 실시되게 하고, 하부 플레이트가 기판(100) 윗면에 밀착되었을 때, 오로지 하부 플레이트의 자중으로 기판(100)을 누르게 한다. When the lower plate is brought into close contact with the upper surface of the substrate 100, the substrate 100 is pressed by the weight of the lower plate only by the tightening plate driving unit 250, do.

이러한 구성을 통해 기판-마스크 얼라인은 다음과 같이 실시된다.Through this configuration, the substrate-mask alignment is performed as follows.

먼저 마스크(300)가 셔틀에 의해 반입되며, 이때 마스크(300)는 페이스 업 상태로, 클램프가 배치된 페이스가 위를 보고 있다. First, the mask 300 is carried in by the shuttle, with the mask 300 facing up, with the face on which the clamp is placed above.

기판(100)은 로봇이 반입하여 주며, 기판(100)이 챔버 내로 들어오면, 로딩 핀(600)이 상승하여 기판(100)을 지지하여 인수하고 로봇은 챔버 밖으로 나간다. 이때 클램프(350)가 오픈 될 수 있다. 마스크(300)는 마스크(트레이) 센터링 유닛(550)이 지지하고 셔틀은 챔버 외부로 나간다. When the substrate 100 enters the chamber, the loading pin 600 rises to support the substrate 100, and the robot moves out of the chamber. At this time, the clamp 350 can be opened. The mask 300 is supported by a mask (tray) centering unit 550 and the shuttle exits the chamber.

그리고, 밀착 판(200)이 밀착 판 구동부(250)에 의해 내려와 기판(100) 윗면에 접하게 된다. 상술한 것처럼 밀착판(200)의 하부 플레이트가 그 자중으로 기판(100)을 눌러, 기판(100)이 아래로 처지는 현상을 방지한다. 로딩 핀(350)들에 의해 지지 된 기판(100)은 작은 업/다운과 같은 동작에 대해서도 심하게 떨리는 현상이 있으나, 밀착판(200)의 자중으로 가압 되면, 그러한 진동이 거의 일어나지 않는다. 가압 된 기판을 로딩 핀이 약간 상승시키고 얼라인 동작을 하게 된다. 이때, 밀착판, 가압 된 기판 및 로딩 핀이 얼라인 위치로 동시에 하강하여 얼라인 동작을 하게 된다. 따라서 기판-마스크(300)의 얼라인이 안정되고 정확하게 이루어질 수 있다. The contact plate 200 is brought down by the contact plate driving unit 250 and comes into contact with the upper surface of the substrate 100. As described above, the lower plate of the tightening plate 200 presses the substrate 100 by its own weight, thereby preventing the substrate 100 from being sagged downward. Although the substrate 100 supported by the loading pins 350 has a phenomenon of trembling also for operation such as small up / down, when the pressing force is applied by the self-weight of the contact plate 200, such vibration hardly occurs. The loading pin slightly lifts and aligns the pressurized substrate. At this time, the contact plate, the pressurized substrate, and the loading pin are simultaneously lowered to the alignment position to perform the alignment operation. Thus, the alignment of the substrate-mask 300 can be stabilized and accurately performed.

얼라인은 다음과 같이 두 가지 방식으로 실시될 수 있다. Alignment can be done in two ways:

1. 얼라인은 UVW 스테이지(500)가 트레이 센터링 유닛(550)으로 마스크(300)를 지지하고 센터링하여 실시된다. 얼라인 된 후, 로딩 핀이 하강하여 기판(100)을 마스크(300)에 합착시키며, 밀착판(200)도 함께 하강하여 밀착상태를 유지한 상태에서 클램프(350)가 클로즈 되어 기판(100)이 마스크(300)에 고정된다. 이때, 밀착판의 밀착 상태를 유지하여 클램핑 시 기판이 틀어지지 않게 된다. 밀착 판(200)은 상승되어 기판에서 이격 되고, 트레이 센터링 유닛(550)도 하강하고, 셔틀이 기판-마스크 합착체를 탑재하고 얼라인 상태를 비젼으로 점검한 다음, 셔틀이 기판-마스크 합착체를 운반하여 얼라인 챔버로부터 반출한다. 1. The alignment is carried out by the UVW stage 500 supporting and centering the mask 300 with the tray centering unit 550. The clamping plate 350 is closed and the substrate 100 is held in the close contact state while the loading pin is lowered and the substrate 100 is attached to the mask 300, Is fixed to the mask 300. At this time, the close contact state of the adhered plate is maintained, and the substrate is not tilted during clamping. The contact plate 200 is lifted and spaced apart from the substrate, the tray centering unit 550 is also lowered, the shuttle mounts the substrate-mask assembly, checks the alignment with vision, And is taken out of the alignment chamber.

2. 상기 실시예를 변형하여 UVW 스테이지(500)가 로딩 핀 유닛(600)에 연결되어 기판(100)이 밀착판(200)에 밀착된 상태에서 얼라인 동작이 실시될 수 있다(도 3 참조). 2. Modification of the above embodiment allows the UVW stage 500 to be connected to the loading pin unit 600 so that the aligning operation can be performed while the substrate 100 is in close contact with the adhering plate 200 ).

얼라인된 후, 로딩 핀이 하강하여 밀착판(200)과 함께 하강 된 기판(100)을 마스크(300)에 합착시키며, 밀착판(200)은 상승 되어 기판에서 이격 되고, 셔틀이 기판-마스크 합착체를 탑재하고 얼라인 상태를 비젼으로 점검한 다음, 셔틀이 기판-마스크 합착체를 운반하여 얼라인 챔버로부터 반출한다.The loading pin is lowered and the substrate 100 lowered together with the adhesive plate 200 is attached to the mask 300. The adhesive plate 200 is lifted to be spaced apart from the substrate, After mounting the cement and checking the alignment by vision, the shuttle carries the substrate-mask assembly and leaves the alignment chamber.

위와 같이 공정을 1, 2 두 가지로 한 이유는 1번으로 공정 진행시 보다 2번 공정 진행은 기판에 데미지를 주거나 스크래치가 발생할 위험이 줄어들기 때문이다.The reason why the process is performed as 1 or 2 is because the process of 2 times is less damaging to the substrate and the risk of scratching is reduced.

본 발명의 권리는 위에서 설명된 실시예에 한정되지 않고 청구범위에 기재된 바에 의해 정의되며, 본 발명의 분야에서 통상의 지식을 가진 자가 청구범위에 기재된 권리범위 내에서 다양한 변형과 개작을 할 수 있다는 것은 자명하다.It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. It is self-evident.

100: 기판
200: 밀착 판
201: 상부 플레이트
202: 하부 플레이트
250: 밀착 판 구동부
300: 마스크
350: 클램프
400: 셔틀
500: UVW 스테이지
550: 마스크 센터링 유닛
600: 로딩 핀 유닛
900: 연결 부재
910: 머리부
920: 연장부
950: 부쉬100: substrate
200:
201: upper plate
202: Lower plate
250:
300: mask
350: Clamp
400: Shuttle
500: UVW stage
550: Mask centering unit
600: Loading pin unit
900: connecting member
910: Head
920: Extension
950: Bush

Claims (2)

기판과 마스크를 얼라인하기 위한 얼라인 챔버 내에 배치되어 기판을 눌러주는 밀착 판으로서, 상기 밀착판은 두 개의 플레이트로 구성되고, 상승 및 하강 동작이 가능하도록 밀착 판 구동부에 연결되고, 상부 플레이트와 하부 플레이트는 서로 연결되어 있되, 서로 간격을 두고 연결 부재에 의해 연결되고, 상부 플레이트와 하부 플레이트는 상승 및 하강 동작을 함께 수행하되, 하부 플레이트가 기판 윗면에 밀착되었을 때, 하부 플레이트의 자중만으로 기판을 밀착 가압하여 기판 처짐 현상과 기판 떨림 현상을 제거하는 것을 특징으로 하는 밀착 판.A contact plate which is disposed in an alignment chamber for aligning a substrate and a mask and which presses the substrate, wherein the contact plate is composed of two plates, connected to the close plate driving unit so as to be movable up and down, The lower plate is connected to the upper plate and the lower plate by a connecting member, and the upper plate and the lower plate are simultaneously moved up and down. When the lower plate is brought into close contact with the upper surface of the substrate, To thereby eliminate the substrate deflection phenomenon and the substrate shake phenomenon. 제1항에 있어서, 상부 플레이트는 상기 밀착 판 구동부에 연결되는 것을 특징으로 하는 밀착 판.
The tightening plate according to claim 1, wherein the upper plate is connected to the urging plate driving part.
KR1020170165241A 2017-12-04 2017-12-04 Align system with substrate tightening plate for stabilizing substrate KR101914882B1 (en)

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JP2006176809A (en) * 2004-12-21 2006-07-06 Ulvac Japan Ltd Method for aligning mask with substrate, method for vapor-depositing organic thin film, and aligning device

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Publication number Priority date Publication date Assignee Title
JP2006176809A (en) * 2004-12-21 2006-07-06 Ulvac Japan Ltd Method for aligning mask with substrate, method for vapor-depositing organic thin film, and aligning device

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