KR20220076999A - Producing system of mask intergrated frame and producing method thereof - Google Patents

Abstract

The present invention relates to a system for manufacturing a frame-integrated mask and a method for manufacturing a frame-integrated mask. The frame-integrated mask manufacturing system according to the present invention is a frame-integrated mask manufacturing system used for manufacturing a frame-integrated mask, wherein a combination of the frame, the mask, and the template is immersed and a chemical treatment is performed to separate the mask and the template. a reaction unit in which a liquid is accommodated; in the assembly, a mask for forming an OLED pixel is attached to a frame having at least one mask cell region, and the other surface opposite to one surface of the mask for forming an OLED pixel attached to the frame is attached to the frame. It is formed by bonding to a mask support template with a temporary adhesive interposed therebetween, and the assembly is characterized in that it is installed so as to be immersed in the separation reaction solution with the frame positioned at the top and the template at the bottom.

Description

Frame-integrated mask manufacturing system and frame-integrated mask manufacturing method {PRODUCING SYSTEM OF MASK INTERGRATED FRAME AND PRODUCING METHOD THEREOF}

The present invention relates to a system for manufacturing a frame-integrated mask and a method for manufacturing a frame-integrated mask. More specifically, in the process of detaching the template after attaching the mask to the frame, the template is stably separated without damage to the mask, and the alignment between the masks on the frame can be clearly maintained on the frame-integrated mask. It relates to a manufacturing system and a method for manufacturing a frame-integrated mask.

As a technology for forming pixels in the OLED manufacturing process, the FMM (Fine Metal Mask) method is mainly used to deposit an organic material at a desired location by attaching a thin metal mask to the substrate.

In the conventional mask manufacturing method, a thin metal plate to be used as a mask is prepared, and after PR coating on the thin metal plate, patterning is performed, or after PR coating to have a pattern, a mask having a pattern is manufactured by etching. In the case of ultra-high-definition OLED, the current QHD image quality is 500-600 PPI (pixel per inch), with a pixel size of about 30-50 μm, and 4K UHD and 8K UHD high-definition are higher than this: ~860 PPI, ~1600 PPI, etc. has a resolution of Therefore, there is a need to develop a technology for precisely controlling the size of the mask pattern.

On the other hand, in the conventional OLED manufacturing process, a mask is manufactured in a stick shape, a plate shape, etc., and then the mask is welded and fixed to the OLED pixel deposition frame. For large-area OLED manufacturing, several masks can be fixed to the OLED pixel deposition frame, and in the process of fixing to the frame, tension is applied to make each mask flat. In the process of fixing several masks to one frame, there was a problem in that the masks were not well aligned with each other and between the mask cells. In addition, in the process of welding and fixing the mask to the frame, since the thickness of the mask film is too thin and has a large area, there is a problem in that the mask is sagged or twisted by a load.

As such, it is necessary to reduce the alignment error between cells by several μm in consideration of the pixel size of the ultra-high-definition OLED, and an error outside of this may lead to product failure, and thus the yield may be very low. Therefore, there is a need to develop a technology capable of preventing deformation such as sagging or twisting of the mask, and clarifying alignment, and a technology of fixing the mask to a frame.

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and a frame-integrated mask capable of stably separating the template without damage to the mask in the process of detaching the template after attaching the mask to the frame. An object of the present invention is to provide a manufacturing system and a method for manufacturing a frame-integrated mask.

Another object of the present invention is to provide a system for manufacturing a frame-integrated mask and a method for manufacturing a frame-integrated mask, in which deformation such as sagging or distortion of the mask is prevented and alignment between the masks on the frame can be clearly maintained. .

The above object of the present invention is a frame-integrated mask manufacturing system used for manufacturing a frame-integrated mask, wherein a combination of a frame, a mask, and a template is immersed, and a reaction solution containing a separation reaction solution for chemical treatment so that the mask and the template are separated The assembly includes a mask supporting template ( It is formed by bonding to the template) through a temporary adhesive, and the assembly is achieved by a frame-integrated mask manufacturing system that is installed so as to be immersed in the separation reaction solution with the frame positioned at the top and the template at the bottom.

It may include a lifting unit that is connected to the assembly to move up and down so that the assembly is immersed in the separation reaction solution of the reaction unit.

The temporary adhesive may be removed or the adhesive force between the mask and the template may be weakened by chemical treatment of the separation reaction solution.

The template may be separated from the mask in a downward direction by gravity, or may be separated from the mask in a downward direction by an external force pulling in the downward direction.

When the binder is immersed in the separation reaction solution, air may not be trapped between the binder and the separation reaction solution.

Bubbles generated in the separation reaction solution may be discharged to the upper part of the reaction unit without being blocked by the assembly.

And, the above object of the present invention is a method for manufacturing a frame-integrated mask in a frame-integrated mask manufacturing system, comprising the steps of: (a) preparing a combination of a frame, a mask, and a template; (b) immersing the binder in a separation reaction solution for performing chemical treatment so that the mask and the template are separated; (c) taking out the assembly from the separation reaction solution, wherein the assembly includes: a mask for forming an OLED pixel is attached on a frame having at least one mask cell region, and the mask for forming an OLED pixel attached to the frame The other surface opposite to one surface is formed by being bonded to a mask support template with a temporary adhesive interposed therebetween, and in step (b), immersing the binder in the separation reaction solution with the frame positioned at the top and the template at the bottom. This is achieved by a method of manufacturing a frame-integrated mask.

In step (b), the temporary adhesive may be removed or the adhesive force between the mask and the template may be weakened by chemical treatment of the separation reaction solution.

The template may be separated from the mask in a downward direction by gravity, or may be separated from the mask in a downward direction by an external force pulling in the downward direction.

In step (b), when the binder is immersed in the separation reaction solution, air may not be trapped between the binder and the separation reaction solution.

Bubbles generated in the separation reaction solution may be discharged to the upper part of the reaction unit without being blocked by the assembly.

According to the present invention configured as described above, there is an effect that the template can be stably separated without damage to the mask in the process of detaching the template after attaching the mask to the frame.

In addition, according to the present invention, deformation such as sagging or distortion of the mask is prevented, and alignment between the masks on the frame can be clearly maintained.

1 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
2 is a schematic diagram illustrating a mask according to an embodiment of the present invention.
3 is a schematic diagram illustrating a process of manufacturing a mask support template by bonding a mask metal film on a template and forming a mask according to an embodiment of the present invention.
4 is a schematic diagram illustrating a state in which a template is loaded onto a frame and a mask corresponds to a cell region of the frame according to an embodiment of the present invention.
5 is a schematic diagram illustrating a process of separating the mask and the template after attaching the mask to the frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a state in which a mask is attached to a cell region of a frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a phenomenon that occurs when steps of FIGS. 4 to 5 are performed.
8 to 10 are schematic views showing a manufacturing process of the frame-integrated mask manufacturing system and the frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] Reference is made to the accompanying drawings, which show by way of illustration specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein with respect to one embodiment may be implemented in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description set forth below is not intended to be taken in a limiting sense, and the scope of the present invention, if properly described, is limited only by the appended claims, along with all scope equivalents as those claimed. In the drawings, like reference numerals refer to the same or similar functions in various aspects, and the length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily practice the present invention.

1 is a front view [FIG. 1 (a)] and a side cross-sectional view [FIG. 1 (b)] showing a frame-integrated mask according to an embodiment of the present invention.

In this specification, the configuration of the frame-integrated mask will be briefly described below, but it can be understood that the structure and manufacturing process of the frame-integrated mask are included in the contents of Korean Patent Application No. 2018-0016186 as a whole.

In the conventional stick mask, since a plurality of mask cells are included in one mask, there is a problem that the mask cells are not well aligned with each other despite fine adjustment of the tensile force applied to each axis of the stick mask. For example, the distance between the patterns of cells is different from each other, or the patterns P are skewed. A long stick mask is easily sagged or twisted by a load, and it is very difficult to check the alignment between each cell in real time through a microscope while adjusting the tensile force to flatten each mask cell. In the present invention, the mask 100 integrally formed with the frame 200 is prevented from being deformed such as sagging or twisting, and can be clearly aligned with the frame 200 .

Referring to FIG. 1 , the frame-integrated mask may include a plurality of masks 100 and one frame 200 . In other words, a plurality of masks 100 are attached to the frame 200 one by one. Below,

For convenience of explanation, a rectangular mask 100 will be used as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being attached to the frame 200 , and attached to the frame 200 . After this, the protrusion can be removed.

A plurality of mask patterns P may be formed on each mask 100 , and one cell C may be formed on one mask 100 . One mask cell C may correspond to one display such as a smart phone.

The mask 100 may be made of a material such as invar, super invar, nickel (Ni), or nickel-cobalt (Ni-Co). The mask 100 may use a metal sheet produced by a rolling process or electroforming.

The frame 200 is formed so that a plurality of masks 100 can be attached thereto. The frame 200 is preferably made of a material such as Invar, Super Invar, Nickel, or Nickel-Cobalt having the same coefficient of thermal expansion as the mask in consideration of thermal deformation. The frame 200 may include an edge frame portion 210 having a substantially rectangular shape or a rectangular frame shape. The inside of the edge frame part 210 may have a hollow shape.

In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet unit 220 connected to the edge frame unit 210 . The mask cell sheet unit 220 may include an edge sheet unit 221 and first and second grid sheet units 223 and 225 . The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to partitioned portions of the same sheet, and they are integrally formed with each other.

The thickness of the edge frame portion 210 may be formed to a thickness of several mm to several cm thicker than the thickness of the mask cell sheet portion 220 . The mask cell sheet part 220 is thinner than the thickness of the edge frame part 210 , but may have a thickness of about 0.1 mm to 1 mm thicker than the mask 100 . The width of the first and second grid sheet parts 223 and 225 may be about 1 to 5 mm.

In the flat sheet, a plurality of mask cell regions CR: CR11 to CR56 may be provided except for regions occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 .

The frame 200 includes a plurality of mask cell regions CR, and each mask 100 may be attached such that one mask cell C corresponds to the mask cell region CR. The mask cell C corresponds to the mask cell region CR of the frame 200 , and a part or all of the dummy may be attached to the frame 200 (the mask cell sheet unit 220 ). Accordingly, the mask 100 and the frame 200 can form an integrated structure.

2 is a schematic diagram illustrating a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. The mask 100 may be manufactured from a metal sheet produced by a rolling process, electroplating, or the like, and one cell C may be formed in the mask 100 . The dummy DM corresponds to a portion of the mask film 110 (mask metal film 110 ) excluding the cell C, and includes only the mask film 110 or a predetermined dummy having a shape similar to the mask pattern P. The patterned mask layer 110 may be included. A part or all of the dummy DM may be attached to the frame 200 (the mask cell sheet unit 220 ) corresponding to the edge of the mask 100 .

The width of the mask pattern P may be formed to be smaller than 40 μm, and the thickness of the mask 100 may be formed to be about 5 to 20 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C: C11 to C56 corresponding to each of the mask cell regions CR: CR11 to CR56. ) may also be provided in plurality. In addition, a plurality of templates 50 supporting each of a plurality of masks 100 to be described later may be provided.

3 is a schematic diagram illustrating a process of manufacturing a mask support template by bonding a mask metal film 110 on a template 50 and forming a mask 100 according to an embodiment of the present invention.

Referring to FIG. 3A , a template 50 may be provided. The template 50 is a medium that can move the mask 100 in a supported state attached to one surface. The center of the template 50 may correspond to the mask cell C of the mask metal layer 110 , and may correspond to the dummy DM of the mask metal layer 110 at the edge. The size of the template 50 may be the same as or larger in area than the mask metal film 110 so that the mask metal film 110 can be supported as a whole, but on the mask cell sheet 220 having a narrow width, the template ( 50) In order to prevent mutual interference, it is preferable that the size of the mask metal layer 110 (or the mask 100 ) and the template 50 are the same.

The template 50 is preferably made of a transparent material so that vision can be easily observed in the process of aligning and adhering the mask 100 to the frame 200 . In addition, in the case of a transparent material, the laser may penetrate. As a transparent material, a material such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, or zirconia may be used. As an example, the template 50 may use a material of BOROFLOAT ^® 33 having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. In addition, BOROFLOAT ^® 33 has a coefficient of thermal expansion of about 3.3, which has a small difference in thermal expansion coefficient from that of the Invar mask metal film 110 , so that it is easy to control the mask metal film 110 .

On the other hand, the template 50 has a mirror surface on one surface in contact with the mask metal film 110 so that an air gap does not occur between the interface with the mask metal film 110 (or the mask 100 ). can In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 having a surface roughness Ra of 100 nm or less, the template 50 may use a wafer. A wafer has a surface roughness (Ra) of about 10 nm, and since there are many products on the market and many surface treatment processes are known, it can be used as the template 50 . Since the surface roughness Ra of the template 50 is in the nm scale, there is no air gap or almost no air gap, and the generation of the weld bead WB by laser welding is easy to affect the alignment error of the mask pattern P may not give

The template 50 has a laser passing hole 51 in the template 50 so that the laser L irradiated from the top of the template 50 can reach the welding part (the area to be welded) of the mask 100 . can be formed. The laser passing hole 51 may be formed in the template 50 to correspond to the position and number of welds. Since a plurality of welding parts are disposed along a predetermined interval in the edge or dummy DM portion of the mask 100 , a plurality of laser passing holes 51 may be formed along a predetermined interval to correspond thereto. For example, since a plurality of welding parts are disposed along a predetermined interval on both sides (left/right) dummy DM portions of the mask 100 , the laser passing hole 51 also includes the template 50 on both sides (left/right). A plurality may be formed along a predetermined interval.

The laser passing hole 51 does not necessarily correspond to the position and number of the welding part. For example, welding may be performed by irradiating the laser L to only a portion of the laser passing holes 51 . In addition, some of the laser passing holes 51 that do not correspond to the welding part may be used instead of the alignment mark when aligning the mask 100 and the template 50 . If the material of the template 50 is transparent to the laser (L) light, the laser passing hole 51 may not be formed.

A temporary adhesive portion 55 may be formed on one surface of the template 50 . The temporary adhesive portion 55 is formed by temporarily adhering the mask 100 (or the mask metal film 110 ′) to one surface of the template 50 until the mask 100 is attached to the frame 200 . It can be supported on top.

The temporary adhesive part 55 may use an adhesive or an adhesive sheet that can be separated by applying heat, or an adhesive or an adhesive sheet that can be separated by UV irradiation.

For example, the temporary adhesive part 55 may use liquid wax. As the liquid wax, the same wax used in the polishing step of a semiconductor wafer or the like may be used, and the type is not particularly limited. The liquid wax is a resin component for controlling adhesion, impact resistance, and the like with respect to holding power, and may include materials such as acrylic, vinyl acetate, nylon, and various polymers and solvents. For example, the temporary adhesive part 55 may use acrylonitrile butadiene rubber (ABR) as a resin component and SKYLIQUID ABR-4016 containing n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary adhesive portion 55 using spin coating.

The temporary adhesive part 55, which is a liquid wax, has a lower viscosity at a temperature higher than 85°C to 100°C, increases in viscosity at a temperature lower than 85°C, and can be partially solidified like a solid, so that the mask metal film 110' and the template 50 ) can be fixedly attached.

Next, referring to FIG. 3B , the mask metal layer 110 may be adhered on the template 50 . After the liquid wax is heated to 85° C. or higher and the mask metal film 110 is brought into contact with the template 50, the mask metal film 110 and the template 50 are passed between rollers to perform adhesion.

According to an embodiment, baking is performed on the template 50 at about 120° C. for 60 seconds to vaporize the solvent in the temporary adhesive part 55, and immediately, a mask metal film lamination process may be performed. . Lamination can be performed by loading the mask metal film 110 on the template 50 having the temporary adhesive part 55 formed on one surface and passing it between the upper roll at about 100° C. and the lower roll at about 0° C. have. As a result, the mask metal layer 110 ′ may be in contact with the template 50 via the temporary adhesive portion 55 .

As another example, the temporary adhesive part 55 may use a thermal release tape. In the heat release tape, a core film such as a PET film is disposed in the center, a thermal release adhesive that can be thermally peeled is disposed on both sides of the core film, and a release film/release film is disposed on the outside of the adhesive layer. can Here, the pressure-sensitive adhesive layers disposed on both surfaces of the core film may have different temperatures at which they are peeled from each other.

On the other hand, the mask metal layer 110 may be used that has been subjected to etching, polishing, and grinding processes such as a thickness reduction process or a surface defect reduction process on one or both surfaces. Alternatively, (b) of FIG. 3 may be replaced with a state after the mask metal film 110 is adhered to the template 50 and a thickness reduction process or a surface defect reduction process is performed on one surface. Alternatively, in (b) of FIG. 3, first, after the mask metal film 110 is adhered to a support substrate (not shown, corresponding to a template), a thickness reduction process or a surface defect reduction process is performed on one surface, and the mask metal After the film 110 is adhered to the template 50, it may be replaced with a state after performing a process on the other surface.

Meanwhile, the thickness reduction process or the surface defect reduction process may be performed only on the mask cell C portion. An insulating part (not shown) such as a photoresist is formed only in a region corresponding to the welding part WP of the mask metal film 110 , or the mask metal film 110 is adhered and supported on the template 50 . After forming an insulating part (not shown) such as a photoresist only in an area corresponding to the welding part WP of the metal film 110 , a process is performed on the mask cell C to make the welding part WP thick to form a mask. A step may be formed with the cell C, and at the same time, the surface of the mask cell C on which the mask pattern P will be formed may be made free from defects.

Alternatively, an insulating part (not shown) such as a photoresist may be further formed on the lower surface of the mask metal layer 110 , and the insulating part may be bonded to be interposed between the mask metal layer 110 and the temporary adhesive part 55 . . In step (c) of FIG. 3 , the etchant enters the interface between the mask metal film 110 and the temporary adhesive part 55 to damage the temporary adhesive part 55/template 50, and the etching error of the mask pattern P is corrected. It is to further form an insulating portion in order to prevent the occurrence. The insulating part may include at least one of a curable negative photoresist and a negative photoresist including an epoxy to have strong durability against the etchant. As an example, a process such as baking of the temporary adhesive part 55 and baking of the insulating part 25 (refer to FIG. 3(c)] using an epoxy-based SU-8 photoresist or black matrix photoresist It is preferable to make it harden together.

Next, referring to FIG. 3C , a patterned insulating portion 25 may be formed on the mask metal layer 110 . The insulating part 25 may be formed of a photoresist material using a printing method or the like.

Subsequently, the mask metal layer 110 may be etched. Methods such as dry etching and wet etching may be used without limitation, and as a result of the etching, a portion of the mask metal layer 110 exposed to the empty space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal layer 110 constitutes the mask pattern P, and the mask 100 in which the plurality of mask patterns P are formed may be manufactured.

At this time, since the mask metal layer 110 is in a state in which surface defects are removed, it is possible to etch a desired pattern shape in the etching process. Since a fine mask pattern P can be formed, there is an effect that the mask 100 that can be used in a high-resolution OLED pixel process can be manufactured.

Next, referring to FIG. 3D , the manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25 .

4 is a schematic diagram illustrating a state in which the template 50 is loaded onto the frame 200 and the mask 100 corresponds to the cell region CR of the frame 200 according to an embodiment of the present invention. One mask 100 may be sequentially applied/attached to each cell region CR, and a plurality of masks 100 may be simultaneously applied to all cell regions CR to form the mask 100 into the frame 200. ) may be attached to the A plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

The template 50 may be transferred by a vacuum chuck 90 or a predetermined gripping means. The mask 100 may be transferred by adsorbing the opposite surface of the template 50 to which the mask 100 is attached with the vacuum chuck 90 . After the vacuum chuck 90 adsorbs and flips the template 50 , even in the process of transferring the template 50 onto the frame 200 , the adhesive state and alignment state of the mask 100 are not affected.

Next, referring to FIG. 4 , the mask 100 may correspond to one mask cell region CR of the frame 200 . By loading the template 50 on the frame 200 (or the mask cell sheet unit 220 ), the mask 100 may correspond to the mask cell region CR. While controlling the position of the template 50/vacuum chuck 90, it is possible to check whether the mask 100 corresponds to the mask cell region CR through a microscope. Since the template 50 compresses the mask 100 , the mask 100 and the frame 200 may be in close contact.

Meanwhile, the lower support 70 may be further disposed under the frame 200 . The lower support 70 may press the opposite surface of the mask cell region CR to which the mask 100 contacts. At the same time, since the lower support 70 and the template 50 press the edge and the frame 200 (or the mask cell sheet part 220 ) of the mask 100 in opposite directions, the mask 100 is The alignment state can be maintained without being disturbed.

Then, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 by laser welding. A welding bead WB is generated in the welding part of the laser-welded mask, and the welding bead WB may have the same material as that of the mask 100/frame 200 and may be integrally connected.

5 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 5 , after the mask 100 is attached to the frame 200 , the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55 . have. Since the mask 100 remains attached to the frame 200 , only the template 50 can be lifted. For example, when heat of a temperature higher than 85° C. to 100° C. is applied (ET), the viscosity of the temporary adhesive part 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 ) and the template 50 may be separated. As another example, the mask 100 and the template 50 can be separated by dissolving or removing the temporary adhesive part 55 by immersing (CM) the temporary adhesive part 55 in a chemical substance such as IPA, acetone, or ethanol. have. As another example, when ultrasound is applied (US) or UV is applied (UV), the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

6 is a schematic diagram illustrating a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention. 6 shows a state in which all the masks 100 are attached to the cell region CR of the frame 200 . After attaching the masks 100 one by one, the templates 50 may be separated, but after all the masks 100 are attached, all the templates 50 may be separated.

One mask 100 may be attached on one cell region CR of the frame 200 . Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when it is attached to the mask cell sheet portion 220 while a tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is applied to the mask. It acts on the cell sheet part 220 and the mask cell region CR and may deform them. Therefore, it is necessary to attach the mask 100 to the mask cell sheet 220 without applying a tensile force to the mask 100 . In the present invention, the mask 100 corresponds to the mask cell region CR of the frame 200 only by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200 . Since the process is completed, no tensile force may be applied to the mask 100 in this process.

In the case of the present invention, since it is only necessary to match one cell C of the mask 100 and check the alignment state, the manufacturing time is higher than the conventional method in which a plurality of cells are simultaneously matched and the alignment state is checked. can be significantly reduced.

Meanwhile, as described above in step (b) of FIG. 3 , when the mask metal layer 110 is adhered to the template 50 by a lamination process, a temperature of about 100° C. may be applied to the mask metal layer 110 . . Accordingly, the mask metal layer 110 may be adhered to the template 50 in a state in which a partial tensile tension is applied. After that, when the mask 100 is attached to the frame 200 and the template 50 is separated from the mask 100 , the mask 100 may be contracted by a predetermined amount.

When the template 50 and the masks 100 are separated after each mask 100 is attached on the corresponding mask cell region CR, a tension is applied to the plurality of masks 100 to contract in opposite directions. Therefore, the force is canceled so that deformation does not occur in the mask cell sheet part 220 . For example, the first grid sheet part 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area moves to the right of the mask 100 attached to the CR11 cell area. The tension acting and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be offset. Thus, there is an advantage that the frame 200 (or the mask cell sheet part 220 ) due to tension is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized.

7 is a schematic diagram illustrating a phenomenon that occurs when the steps of FIGS. 4 to 5 are performed.

After loading the mask support template 50 to the frame 200 as shown in FIG. 4 , the mask 100 may be attached to the frame 200 by welding. And, as shown in FIG. 5 , the template 50 may be separated from the mask 100 . As described above, the template 50 can be separated from the mask 100 by weakening the adhesive force of the temporary adhesive part 55 or by removing the temporary adhesive part 55. In particular, chemical treatment ( CM) method can be mainly used. For example, by immersing (CM) the temporary adhesive part 55 (both the template 50 and the mask 100) in a chemical substance such as IPA, acetone, or ethanol, the temporary adhesive part 55 is dissolved, removed, etc. (100) and the template (50) can be separated.

For this, the frame-integrated mask manufacturing system 1000 as shown in FIG. 7 is used. The frame-integrated mask manufacturing system 1000 includes a combination in which the template 50, the mask 100, and the frame 200 are connected, and the assembly is immersed in a chemical treatment (CM) to separate the mask 100 and the template 50. ) may include a reaction unit 110 in which the separation reaction solution 1200 is accommodated.

The separation reaction solution 1200 is not limited as long as it is a material capable of dissolving and removing the temporary adhesive part 55, and the reaction part 1100 accommodates the separation reaction solution 1200 and at the same time the template 50, the mask 100 ) and the frame 200 is not limited in shape, material, etc., if the combined body has a size to be immersed.

As shown in (a) of FIG. 7 , after the steps of FIGS. 4 and 5 , the binder is immersed in the separation reaction solution 1200 of the reaction unit 1100 to dissolve and remove the temporary adhesive unit 55 . can do. However, since the mask 100 is densely attached to the frame 200 and the mask cell region CR of the frame 200 , the upper portion thereof is substantially the same as a closed state. Although the mask pattern P is formed on the mask 100 , since the size is about several tens of μm, there is a limit in allowing gases and bubbles to freely pass therethrough.

Accordingly, as shown in (b) of FIG. 7 , when the binder is immersed in the separation reaction solution 1200, the gas cannot escape to the outside and may be trapped between the lower empty space V of the binder and the separation reaction solution 1200. have. It's like air is trapped when you put a cup or gourd upside down in water. The trapped gas may be the main cause of generating large bubbles BB in the separation reaction solution 1200 in the lower part of the assembly.

In addition to this, as shown in (c) of FIG. 7 , the gas generated by the chemical reaction of the temporary adhesive part 55 and the separation reaction solution 1200 also generates small reaction bubbles RB.

The air bubbles BB and RB are clogged by the binder, so that they cannot easily escape in the upper direction of the separation reaction solution 1200 , and may cause stains on the mask 100 . In addition, when the air bubbles BB and RB penetrate between the mask patterns P of the mask 100 to leave stains, the shape of the mask pattern P is also adversely affected.

On the other hand, referring further to (b) and (c) of FIG. 7 , the template 50 can be lifted upward to separate it from the mask 100 in a state in which the adhesive force of the temporary adhesive part 55 is weakened, but the adhesive force is not sufficient. If it is not weakened, a part of the mask 100' is lifted while still attached to the template 50, and the alignment position is misaligned as excessive tension is applied to the mask 100', or in severe cases, the mask 100' ) may cause tearing.

In order to solve the above problem, the frame-integrated mask manufacturing system 1000 of the present invention is a template 50, the mask 100, and the frame 200 are connected in the assembly, the frame 200 is the upper part, the template 50 is It is characterized in that it is installed so as to be immersed in the separation reaction solution 1200 in a state located in the lower part.

8 to 10 are schematic views showing a manufacturing process of the frame-integrated mask manufacturing system and the frame-integrated mask according to an embodiment of the present invention.

Referring to FIG. 8 , in the system 1000 for manufacturing the frame-integrated mask, the assembly in a state in which the frame 200 is located at the upper portion and the template 50 is located at the lower portion may be installed. The assembly may be supported and installed by a predetermined support means (not shown) inside the frame-integrated mask manufacturing system 1000, and the assembly may be gradually immersed in the separation reaction solution 1200 and moved up and down so that it can be taken out after the process. It may further include a lifting unit (not shown).

On the other hand, after the process of FIGS. 4 and 5 , as shown in FIG. 8 , a flip means (not shown) for flipping the frame 200 so that the upper part and the template 50 are positioned at the lower part may be further included.

Then, referring to FIG. 9 , the binder is immersed in the separation reaction solution 1200 , and the template 50 -> temporary adhesive part 55 -> mask 100 -> frame 200 may be gradually immersed in the order. . Accordingly, the empty space V of the assembly shown in FIG. As a result, while the binder is immersed in the separation reaction solution 1200, a situation in which the gas is trapped does not occur. That is, there is an effect that large bubbles BB as shown in FIG. 7 ( b ) do not occur in the separation reaction solution 1200 .

Next, referring to FIG. 10 , the binder is immersed in the separation reaction solution 1200 so that the temporary adhesive part 55 and the separation reaction solution 1200 generate small reaction bubbles (RB) in the gas generated by the chemical reaction. However, the amount of this reaction bubble (RB) is significantly less than the amount of gas [bubble (BB)] trapped by the binder as shown in FIG. 7(b), and the generated reaction bubble (RB) is also trapped in the binder It may be discharged to the upper part of the reaction unit 1100 (or the separated reaction solution 1200) without it. Accordingly, there is an effect of preventing the occurrence of unevenness due to the bubbles BB and RB in the mask 100 or the penetration of the bubbles BB and RB into the mask pattern P to adversely affect the mask 100 .

In addition, when the temporary adhesive part 55 is dissolved or removed by the separation reaction solution 1200 , the template 50 may be separated in the lower direction of the separation reaction solution 1200 by the force of gravity (G). Therefore, the template 50 can be separated naturally at a point in time when the adhesive force between the mask 100 and the template 50 is weaker than the force to separate by gravity G, so do not apply tension to the mask 100 during the separation process. will not On the other hand, it is also possible to separate the template 50 by applying a weak external force corresponding to the gravity G (a weak external force that does not require the use of the vacuum chuck 90) in the downward direction.

After the separation process of the mask 100 and the template 50 is completed, the frame-integrated masks 100 and 200 are taken out to the upper part of the separation reaction solution 1200 by driving a lifting unit (not shown), followed by a cleaning process and a drying process can be performed. Thereafter, the OLED pixel process may be performed by attaching the frame-integrated masks 100 and 200 to the target substrate on which the OLED pixel is to be formed.

As described above, in the present invention, when the mask 100 and the template 50 are separated, the mask 100 is not affected and the frame 200 and the attached state can be completely maintained. Accordingly, there is an effect that the mask is prevented from being deformed, such as sagging or distorted, and the alignment between the masks on the frame can be clearly maintained.

Although the present invention has been illustrated and described with reference to preferred embodiments as described above, it is not limited to the above-described embodiments and is not limited to the above-described embodiments, and various methods can be made by those of ordinary skill in the art to which the invention pertains without departing from the spirit of the present invention. Transformation and change are possible. Such modifications and variations are intended to fall within the scope of the present invention and the appended claims.

50: template
51: laser passing hole
55: temporary adhesive
100: mask
110: mask film, mask metal film
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: frame-integrated mask manufacturing system
1100: reaction unit
1200: separation reaction solution
BB, RB: Bubbles
C: cell, mask cell
CR: mask cell area
DM: dummy, mask dummy
L: laser
P: mask pattern
WB: Weld Bead
WP: weld

Claims (11)

A frame-integrated mask manufacturing system used to manufacture a frame-integrated mask, comprising:
a reaction unit immersed in a combination of the frame, the mask and the template, and a reaction unit containing a separation reaction solution for performing chemical treatment so that the mask and the template are separated;
including,
In the assembly, a mask for forming an OLED pixel is attached on a frame having at least one mask cell region, and the other surface opposite to one surface of the mask for forming an OLED pixel attached to the frame is temporarily attached to a mask support template. It is formed by bonding and interposing
The assembly is installed so that the frame is immersed in the separation reaction solution with the upper part and the template positioned at the lower part, a frame-integrated mask manufacturing system. According to claim 1,
A frame-integrated mask manufacturing system including a lifting unit connected to the assembly and moving up and down so that the assembly is immersed in the separation reaction solution of the reaction unit. According to claim 1,
A frame-integrated mask manufacturing system in which the temporary adhesive is removed or the adhesive force between the mask and the template is weakened by chemical treatment of the separation reaction solution. 4. The method of claim 3,
The template is
separated from the mask downward by gravity, or
A frame-integrated mask manufacturing system that is separated from the mask in a downward direction by an external force pulling in the downward direction. According to claim 1,
When the binder is immersed in the separation reaction solution, air is not trapped between the assembly and the separation reaction solution, a frame-integrated mask manufacturing system. According to claim 1,
A system for manufacturing a frame-integrated mask, wherein the bubbles generated in the separated reaction solution can be discharged to the upper part of the reaction unit without being blocked by the assembly. A method for manufacturing a frame-integrated mask in a frame-integrated mask manufacturing system, comprising:
(a) preparing a combination of a frame, a mask and a template;
(b) immersing the binder in a separation reaction solution for performing chemical treatment so that the mask and the template are separated;
(c) taking out the binder from the separation reaction solution;
including,
In the assembly, a mask for forming an OLED pixel is attached on a frame having at least one mask cell region, and the other surface opposite to one surface of the mask for forming an OLED pixel attached to the frame is temporarily attached to a mask support template. It is formed by bonding and interposing
In step (b), the frame is immersed in the separation reaction solution in a state where the upper part of the frame and the lower part of the template are positioned, a method of manufacturing a frame-integrated mask. 8. The method of claim 7,
In step (b), the temporary adhesive portion is removed by the chemical treatment of the separation reaction solution, or the adhesive force between the mask and the template is weakened, a method of manufacturing a frame-integrated mask. 9. The method of claim 8,
The template is
separated from the mask downward by gravity, or
A method of manufacturing a frame-integrated mask that is separated from the mask in a downward direction by an external force pulling downward. 8. The method of claim 7,
In step (b), when the binder is immersed in the separation reaction solution, air is not trapped between the binder and the separation reaction solution, a method of manufacturing a frame-integrated mask. 8. The method of claim 7,
A method of manufacturing a frame-integrated mask, wherein the bubbles generated in the separated reaction solution are discharged to the upper part of the reaction unit without being blocked by the assembly.

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