KR20220071620A - Printed assembly circuit board assembly inspection device - Google Patents

Abstract

The present invention relates to a PCBA inspection device, which comprises: first and second probes for measuring an electrical signal by being in contact with both terminals of an electronic element of an inspected board; a first camera module for generating a first probe image by photographing a direction in which an end of the first probe faces; a second camera module for generating a second probe image by photographing a direction in which an end of the second probe faces; a first driving member for moving the first probe and the first camera module in a plurality of axial directions; a second driving member for moving the second probe and the second camera module in the axial directions; a control module for generating the entire board image including a front surface of a reference inspected board by combining the first probe images obtained by photographing each region of the reference inspected board by the first camera module, setting a position coordinate in each electric element included in the entire board image, and controlling each movement of the first and second driving members to move the first and second probes to the position coordinate; and a laser module attached to any one of the first and second probes to irradiate the electric element of the reference inspected board with a laser, and receiving the reflected laser to measure the height of each electric element on a board so as to generate height information. The control module sets a first inspection order in accordance with a movement path of the first and second probes to perform an inspection in order of the electric element adjacent to the electric element which is firstly inspected, and corrects the first inspection order on the basis of the height information to generate a second inspection order. Therefore, a defect of an electronic element can be automatically inspected.

Description

PCBA inspection device {PRINTED ASSEMBLY CIRCUIT BOARD ASSEMBLY INSPECTION DEVICE}

The present invention relates to a PCBA inspection apparatus.

An electronic device is generally operated by supplying power to a substrate on which an electronic device is mounted, and the electrical characteristics of the substrate may be inspected only after the manufacturing process is completed. An electronic device must be stably attached to the substrate, and since the electronic device is electrically coupled to the substrate by a soldering process, poor contact may occur during the process. In addition, if the electronic device is defective or does not have an appropriate capacity, the substrate may not operate normally.

In order to determine whether the substrate is defective, an inspection apparatus for measuring an electrical signal of each electronic device is used. In general, the inspection apparatus includes a stage for supporting the substrate, an aligner for fixing the substrate, and a probe. The inspection apparatus may determine whether the electronic element is defective by measuring an electrical signal by contacting the probe with an electrode of the electronic element.

An object of the present invention is to provide a PCBA inspection apparatus that automatically inspects whether an electronic element disposed on an entire inspection board is defective by measuring an electrical signal flowing through an electronic element through a contact probe.

The PCBA inspection apparatus according to an embodiment of the present invention includes first and second probes for measuring electrical signals in contact with both terminals of an electronic device of an inspection board, and a direction in which an end of the first probe is viewed, A first camera module for generating a first probe image, a second camera module for generating a second probe image by photographing a direction in which an end of the second probe faces, and the first probe and the first camera module A first driving member for moving the plurality of axial directions, a second driving member for moving the second probe and the second camera module in a plurality of axial directions, and the first camera module moving each region of the reference inspection substrate The first probe images taken are combined to generate an entire substrate image including the front surface of the reference inspection substrate, position coordinates are set for each electric element included in the entire substrate image, and the first and second probes are A control module for controlling the movement of each of the first and second driving members to move to positional coordinates, and a control module attached to any one of the first and second probes to irradiate a laser to the electrical element of the reference inspection board, and a laser module for generating height information by receiving a reflected laser and measuring the height of each of the electric elements on the substrate, wherein the control module performs the inspection in the order of the electric element adjacent to the electric element that started the test first. A second inspection order may be generated by setting a first inspection order according to movement paths of the first and second probes, and correcting the first inspection order based on the height information.

According to an embodiment, the control module measures an electrical signal because the contactable area in which the first and second probes in the reference inspection board can contact and measure an electrical signal based on the height information, and the contact is not possible It can be stored by dividing it into a non-contact area that cannot be accessed.

According to an embodiment, the control module analyzes the height information and when there is a first electric element higher than a reference height among the electronic elements, the first electric element is excluded from the test in the first inspection order to remove the first electric element. 2 You can create an inspection sequence.

According to an embodiment, the control module may generate the second inspection order by excluding the inspection of the second electric element located in a predetermined area corresponding to the height of the first electric element on the substrate.

According to an embodiment, the control module controls the first and second driving members so that the first and second probes move in a plurality of axial directions at a first height on the substrate when inspecting the substrate, and when inspecting the substrate, the first and second driving members A first height on the substrate of the first and second probes may be different from a second height on the substrate of the first and second probes during standby.

According to an embodiment, the control module may analyze the height information to select an electric element having the highest height among the electric elements, and determine the first height by adding a reference inspection height to the highest height.

According to the PCBA inspection apparatus according to the embodiment of the present invention, by automatically determining whether the electronic device is defective based on the electrical signal measured from the probe, it is possible to accurately select an error due to the defect or damage of the substrate.

1 is a schematic block diagram of a PCBA inspection apparatus according to an embodiment of the present invention.
2A and 2B are conceptual views of a PCBA inspection apparatus according to an embodiment of the present invention.
3 is a view for explaining an entire substrate image according to an embodiment of the present invention.
4 is a view for explaining a method for a control module to set position coordinates according to an embodiment of the present invention.
FIG. 5 is a view for explaining a method for a laser module to measure a height of an electric device on a substrate according to an embodiment of the present invention.
6 is a view for explaining a method for the control module to set the height of the first and second probes on a substrate according to an embodiment of the present invention.
7A and 7B are diagrams for explaining a method for a control module to set an inspection order of electrical elements according to an embodiment of the present invention.

Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are only exemplified for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention are It may be implemented in various forms and is not limited to the embodiments described herein. In the embodiments described in this specification, a 'module' or 'unit' means a functional part that performs at least one function or operation, and may be implemented as hardware or software, or a combination of hardware and software.

1 is a schematic block diagram of a PCBA inspection apparatus according to an embodiment of the present invention, and FIGS. 2A and 2B are conceptual views of a PCBA inspection apparatus according to an embodiment of the present invention.

1, 2A, and 2B, the PCBA (Printed Circuit Board Assembly) inspection apparatus 100 according to an embodiment of the present invention is a type of PCBA inspection substrate (SUB) in contact with the probe of the electrical element As an inspection device for measuring electrical characteristics, it may be implemented as a flying probe tester.

The PCBA inspection apparatus 100 includes a control module 102 , a first probe 104 , a second probe 106 , an aligner 108 , a display module 110 , a first driving member 112 , and a second driving unit. It includes a member 114 , a first camera module 116 , a second camera module 118 , a laser module 120 , and a power supply module 122 .

The control module 102 may read the board design data including the design information of the reference inspection substrate SUB_RF to determine the position information of the electrical elements disposed on the inspection substrate SUB, based on the substrate design data. Positions to be contacted by the first and second probes 104 and 106 may be set as an x-coordinate value and a y-coordinate value. Accordingly, the electrical elements disposed on the inspection substrate SUB have different x-coordinates and y-coordinates according to positions. On the other hand, the substrate design data may include not only the position information of the electric element, but also the reference position coordinates set based on the origin coordinates, the body region of each electric element, the type, the name, and the like.

However, if the board design data is not provided separately, the PCBA inspection apparatus 100 may include a region in which an electric element is directly disposed on the substrate image displayed on the display unit 110 through an input means from a user, that is, a body region of the electric element; Terminal positions to which the first and second probes 104 and 106 are to be contacted and the type and name of each electrical element may be directly input. In this case, the control module 102 may calculate the body region and the terminal position as the x-coordinate value and the y-coordinate value and store the calculated position as the contact point of the first and second probes 104 and 106 .

After setting the positional coordinates of each electric element, the control module 102 may use the set positional coordinates for inspection of the first inspection substrate SUB1 having the same structure as the reference inspection substrate SUB_RF. Here, the reference inspection substrate SUB_RF refers to the inspection substrate SUB that provides a reference for inspecting whether a plurality of first inspection substrates SUB1 having the same structure are defective.

In order to equally apply the positional coordinates set based on the reference inspection substrate SUB_RF to the first inspection substrate SUB1 , the reference inspection substrate SUB_RF and the first inspection substrate SUB1 are positioned at the same position on the aligner 108 . should be anchored in

Specifically, the PCBA inspection apparatus 100 converts and stores the positions of each electric element, wiring, etc. into x-coordinates and y-coordinates based on the reference inspection substrate SUB_RF, and stores the first and second positions of the PCBA inspection apparatus 100 . The second probes 104 and 106 inspect the first inspection substrate SUB1 using the coordinate information generated based on the reference inspection substrate SUB_RF. If the first inspection substrate SUB1 When seated at a position on the aligner 108 different from that of SUB_RF), the first and second probes 104 and 106 cannot contact the desired position.

Accordingly, the control module 102 is configured to reflect the position difference between the reference inspection substrate SUB_RF and the aligner 108 of the first inspection substrate SUB1 when the first inspection substrate SUB1 is inspected. It is possible to correct the coordinate information set based on SUB_RF).

To this end, the control module 102 stores a probe image obtained by photographing the first inspection substrate SUB1 disposed on the aligner 108 with respect to the reference position coordinates as a position coordinate image, and stores the reference coordinate image and the position coordinate image. By comparing the images, the position coordinates set in the electrical elements of the first inspection substrate SUB1 may be corrected.

In addition, the control module 102 controls the movement of the first and second driving members 112 and 114 according to the inspection order of the electrical elements to control the first and second probes 104 and 106 to the inspection substrate SUB. may be in contact with, and a test signal may be applied to the electrical device through the first and second probes 104 and 106 . The control module 102 may analyze an electric signal output from the electric element in response to the inspection signal, and determine whether the electric element is defective based on the analysis result.

The first and second probes 104 and 106 may receive an electrical signal by directly contacting a terminal of the electrical device. Each of the first and second probes 104 and 106 may include an elastic member therein to absorb shock by an elastic action when in contact with the electrical device to prevent damage to the electrical device. The first probe 104 is fixedly mounted to the first driving member 112 , and the second probe 106 is fixedly mounted to the first driving member 112 . According to an embodiment, the first and second probes may be implemented as flying probes.

The aligner 108 may fix the inspection substrate SUB for inspection, and by adjusting the coupling member of the aligner 108, the fixed bonding may be performed according to the size of the inspection substrate SUB.

The first camera module 116 may photograph the direction in which the end of the first probe 104 is facing, and may photograph in detail the shape of the terminal of the electrical element in contact with the first probe 104 . Since the first camera module 116 is fixedly mounted on one side of the first driving member 112 together with the first probe 104 , a photographing area is changed in response to the movement of the first driving member 112 . That is, the area to be photographed is changed in response to the movement path of the first probe 104 .

The second camera module 118 may photograph the direction in which the end of the second probe 106 is facing, and may photograph in detail the shape of the terminal of the electrical element with which the second probe 106 is in contact. Since the second camera module 118 is fixedly mounted on one side of the first driving member 112 together with the second probe 106 , the area to be photographed is changed in response to the movement of the first driving member 112 . That is, the area to be photographed is changed in response to the movement path of the second probe 106 .

Here, the photographed image of the inspection substrate SUB generated by the first camera module 116 is referred to as a first probe image, and the photographed image of the inspection substrate SUB generated by the second camera module 118 is the second 2 This is called a probe image.

In addition, the reference coordinate image is an image obtained by photographing the reference inspection substrate SUB_RF in which the first camera module 116 or the second camera module 118 is disposed on the aligner 108 with respect to the reference position coordinate, and is controlled The module 102 may store a probe image obtained by photographing the reference position coordinates by the first camera module 116 or the second camera module 118 as a reference coordinate image.

When the reference inspection substrate SUB_RF is fixedly disposed on the aligner 108 , one of the first and second camera modules 116 and 118 captures each region of the reference inspection substrate SUB_RF and divides the substrate. You can create images. The control module 102 may generate an entire substrate image by combining the divided substrate images, and the entire substrate image includes all electrical elements disposed on one surface of the inspection substrate SUB. Here, the divided substrate images may be generated to have the same area and shape as each other in order to prevent errors such as distortion and asymmetry of the image.

According to an embodiment, the control module 102 may extract and store the reference coordinate image from the entire substrate image obtained by photographing the reference inspection substrate SUB_RF for coordinate correction during the inspection of the first inspection substrate SUB1 .

Each of the first and second driving members 112 and 114 is arranged in the x-axis direction, y to position each of the first and second probes 104 and 106 at the determined position coordinates according to the control by the control module 102 , respectively. It can be moved in the axial direction and the z-axis direction. Since the height of the inspection substrate SUB is fixed by the aligner 108, the movement path in the z-axis direction can maintain a constant value every time an electric element is inspected.

The display unit 110 may display the entire substrate image, and display the first probe image and the second probe image together on a partial region of the entire substrate image to provide the user with the terminal state of the electrical device in real time.

The laser module 120 may irradiate a laser on the inspection substrate SUB, and by measuring the first time that the laser is reflected on the inspection substrate SUB and returns, and the second time that the laser is reflected and returned from the center of the electric element, height information of each electric element can be generated, and the height of each electric element can be used by the control module 102 to determine the inspection order of each electric element

The power supply unit 122 may provide rated power to the inspection substrate SUB when the inspection substrate SUB performs an inspection in the power input mode according to the second inspection method.

The input means 124 may refer to a series of means capable of receiving input information from a user, such as a mouse, a keyboard, and a touch panel, and providing it to the control module 102 .

FIG. 3 is a view for explaining an entire board image according to an embodiment of the present invention, and FIG. 4 is a view for explaining a method for setting position coordinates by a control module according to an embodiment of the present invention.

Referring to FIG. 3 , in the PCBA inspection apparatus 100 according to an embodiment of the present invention, when the reference inspection substrate SUB_RF is fixedly disposed on the aligner 108 , first and second camera modules 116 and 118 . Divided substrate images DI may be generated by photographing each region of the reference inspection substrate SUB_RF using any one module.

The divided substrate images DI may be generated to have the same area and shape to prevent errors such as distortion and asymmetry of the image, and the control module 102 controls the reference inspection substrate ( SUB_RF) may be set, and divided substrate images DI may be generated by moving any one of the first and second camera modules 116 and 118 to the center of each of the photographing areas.

The control module 102 may generate an entire substrate image IM_REF by summing the divided substrate images DI, and the entire substrate image IM_REF includes all electrical elements disposed on one surface of the reference inspection substrate SUB_RF. , each electrical element may be set with position coordinates.

The entire substrate image IM_REF may be displayed on the display unit 110 and used to inspect the first inspection substrate SUB1 , and the first and second probes 104 and 106 check the positions of the electrical elements inspected in real time. By displaying as , it is possible to provide a function of confirming the electric device currently being inspected to the user.

Referring to FIG. 4 , the control module 102 may set position coordinates at each position of the entire substrate image IM_REF. Based on the origin coordinate Po, the control module 102 sets position coordinates at regular intervals along the x-axis and y-axis. can

The origin coordinate Po may be set as a vertex of the upper left corner of the entire substrate image IM_REF, but is not limited thereto, and may be set at a position other than the center position of the entire substrate image IM_REF.

In addition, in FIG. 4, a rectangular first vertex Po is set as the origin coordinates (0,0) based on the rectangular-shaped entire substrate image IM_REF, and the second vertex Pn is set as the endpoint coordinates (n,m). ), the entire substrate image IM_REF may be implemented as a polygon including a circle, a semicircle, and a curved surface, and in this case, the origin coordinate Po may be set at an arbitrary position by the user.

After setting the position coordinates at each position in the entire board image IM_REF, the control module 102 determines the position coordinates corresponding to the body region and the terminal position when the body region and the terminal position of the electric device are input by the user. can be set.

5 is a view for explaining a method for the laser module according to an embodiment of the present invention to measure the height of the electrical device on the substrate.

Referring to FIG. 5 , the laser module 120 may irradiate a laser onto the inspection substrate SUB, and the laser irradiation position may be determined based on the positional coordinates of the electrical elements set by the control module 102 .

First, the laser module 120 irradiates the laser onto the inspection substrate SUB, then measures the reflected and returned time, multiplies the measured time by the laser speed, and the first distance between the laser module 120 and the inspection substrate SUB. (D1) can be calculated.

Then, the laser module 120 irradiates a laser to the center of each of the electric elements (ED1, ED2, ED3, and ED4) using the position coordinates of the electric element, and multiplies the laser speed by the time the laser returns from the electric element. , it is possible to calculate the distance between the laser module 120 and the electrical element.

For example, the laser module 120 may be located at the center of the first electric element ED1 in response to the control of the control module 102 , and may irradiate a laser to the center of the first electric element ED1 . The laser module 120 may calculate the distance between the laser module 120 and the first electrical element ED1 by measuring the time when the irradiated laser is reflected from the first electric element ED1 and returned.

In addition, the control module 102 may determine the difference between the first distance D1 and the distance between the laser module 120 and the electric element as the height of the electric element on the substrate. For example, the control module 102 may determine the third distance D3 , which is the difference between the first distance D1 and the second distance D2 , as the height of the first electrical element ED1 on the substrate.

In this way, the control module 102 can determine the on-board height of all electrical elements in the test board SUB.

6 is a view for explaining a method for the control module to set the height of the first and second probes on a substrate according to an embodiment of the present invention.

Referring to FIG. 6 , the control module 102 controls the first and second driving members 112 and 114 such that the first and second probes 104 and 106 move in a plurality of axial directions when inspecting the substrate. However, when the first and second probes 104 and 106 move in a plurality of axial directions, a constant height is maintained on the substrate.

The first height Ds of the first and second probes 104 and 106 positioned on the substrate during inspection of the substrate may be determined by the control module 102 , and the control module 102 is configured to be connected to the laser module 120 . The first height Ds may be determined by determining the height of each electric element on the basis of the height information generated by the method, and selecting an electric element having the highest height Dh among the electric elements.

In this case, the control module 102 may determine the first height Ds by adding the reference inspection height Dm to the height on the substrate of the electric device having the highest height Dh, and the reference inspection height Dm is 10 mm It may be set to any one of values from 40 mm to 40 mm.

For example, when the third electric element among the electric elements has a height of 50 mm as an electric element having the highest height Dh, and the reference inspection height Dm is set to about 10 mm, the control module 102 is the first and a first height Ds of the second probes 104 and 106 may be determined to be 60 mm.

According to an embodiment, when the first and second probes 104 and 106 stand by without performing a separate test, the second, which is the height of the first and second probes 104 and 106 on the substrate, during standby. The height may be set to be different from the first height Ds. That is, the second height may be set higher than the first height Ds.

On the other hand, when the first and second driving members 112 and 114 are moved to inspect the electric element, if the height of the electric element is equal to or greater than the reference height, the first and second driving members 112 and 114 are the corresponding electric elements. It may become jammed or clogged in the body of the device, making it impossible to perform the test properly.

Accordingly, the control module 102 may analyze the height information and, if an electric element having a reference height or higher among the electronic elements exists, may exclude the inspection of the electric element from the inspection order. For example, if the height of the third electric element ED3 on the substrate is equal to or greater than the reference height, the control module 102 may exclude the inspection of the third electric element ED3 from the inspection order.

In addition, the control module 102 analyzes the height information, and when there is an electric element higher than the reference height among the electronic elements, the inspection of electric elements located in a certain area corresponding to the height on the substrate of the electric element can be excluded. have. For example, if the height of the third electric element ED3 on the substrate is equal to or greater than the reference height, the control module 102 controls the third electric element ED3 and the adjacent second electric element ED2 and the fourth electric element ED4. Inspections can be excluded from the inspection sequence.

According to an embodiment, the control module 102 may include a contactable area in which the first and second probes 104 and 106 in the inspection substrate SUB come into contact to measure an electrical signal based on the height information, and the contact This is impossible, so it can be classified as an inaccessible area where electrical signals cannot be measured. Accordingly, the control module 102 may exclude the inspection of the electrical element located in the non-contactable region from the inspection order.

7A and 7B are diagrams for explaining a method for a control module to set an inspection order of electrical elements according to an embodiment of the present invention.

Referring to FIG. 7A , the first movement path PA1 of the first and second probes 104 and 106 according to the first inspection order set by the control module 102 is shown on the entire substrate image IM_REF. have. The control module 102 may set the electrical element closest to the reference origin PO' as the inspection start position, and determine the first inspection order so that the inspection proceeds in the order of the electric element adjacent to the inspection start position. The first movement path PA1 refers to the center position of the first and second probes 104 and 106 on the substrate, and the first and second probes 104 and 106 move along the first movement path PA1 . can be moved along.

For example, if the closest electric element to the reference origin PO' is the first electric element ED1, the control module 102 sets the inspection start position to the first electric element ED1, and the electric element to be inspected The first movement path PA1 to the second electrical element ED2 may be set by determining the first inspection order in an adjacent order.

Referring to FIG. 7B , the second movement path PA2 of the first and second probes 104 and 106 is shown in the entire substrate image IM_REF according to the second inspection order set by the control module 102 . have.

The control module 102 may determine the height on the substrate of each electrical element based on the height information generated by the laser module 120, and correct the first inspection order based on the height information to determine the second inspection order can create

When the first and second driving members 112 and 114 are moved to inspect the electric element, if the height of the electric element is higher than the reference height, the first and second driving members 112 and 114 of the electric element It can become jammed or blocked in the body, preventing the test from being performed properly. Accordingly, the control module 102 may analyze the height information and, if an electric element having a reference height or higher among the electronic elements exists, may exclude the inspection of the electric element from the inspection order.

For example, if the heights on the substrate of the fourth and fifth electric elements ED4 and ED5 are equal to or greater than the reference height, the control module 102 performs inspection of the fourth and fifth electric elements ED4 and ED5 in the inspection order. can be excluded.

In addition, the control module 102 analyzes the height information, and when an electric element higher than a reference height exists among the electronic elements, the inspection of electric elements located in a certain area corresponding to the height on the substrate of the electric element can also be excluded. have.

For example, if the height on the substrate of the fourth and fifth electric elements ED4 and ED5 is greater than or equal to the reference height, the control module 102 controls the fourth and fifth electric elements ED4 and ED5 and the third electric element ED3 adjacent to the third electric element ED3. ) can be excluded from the inspection sequence.

As such, the control module 102 may determine the second inspection order by excluding some electrical elements from the first inspection order, and the second movement path PA2 may be set to correspond to the second inspection order.

The control module 102 may set the electrical element closest to the reference origin PO' as the inspection start position, and determine the first inspection order so that the inspection proceeds in the order of the electric element adjacent to the inspection start position. The first movement path PA1 refers to the center position of the first and second probes 104 and 106 on the substrate, and the first and second probes 104 and 106 move along the first movement path PA1 . can be moved along.

Although the embodiments of the present invention have been described above, it is understood that those of ordinary skill in the art to which the present invention pertains may make various modifications without departing from the scope of the claims of the present invention.

100: PCBA inspection device
102: control module
104: first probe
106: second probe
108: aligner
110: display unit
112: first driving member
114: second driving member
116: first camera module
118: second camera module
120: laser module
122: power unit

Claims (6)

first and second probes contacting both terminals of the electronic device of the test board to measure electrical signals;
a first camera module for generating a first probe image by photographing a direction in which an end of the first probe faces;
a second camera module for generating a second probe image by photographing a direction in which an end of the second probe faces;
a first driving member for moving the first probe and the first camera module in a plurality of axial directions;
a second driving member for moving the second probe and the second camera module in a plurality of axial directions;
The first camera module generates an entire substrate image including the front surface of the reference inspection substrate by adding first probe images obtained by photographing each region of the reference inspection substrate, and position coordinates on each electrical element included in the entire substrate image a control module configured to control movement of each of the first and second driving members so that the first and second probes move to the position coordinates; and
A laser attached to any one of the first and second probes, irradiating a laser to the electric element of the reference inspection substrate, receiving the reflected laser, measuring the height of each electric element on the substrate, and generating height information contains a module;
The control module sets the first inspection order according to the movement path of the first and second probes so that the inspection is performed in the order of the electrical element adjacent to the electric element that started the inspection for the first time, and the first inspection based on the height information A PCBA inspection device for generating a second inspection sequence by correcting the sequence. The method of claim 1,
The control module includes a contactable area in which the first and second probes in the reference inspection board contact and measure an electrical signal based on the height information, and a contact impossible area in which the electrical signal cannot be measured because the contact is not possible. A PCBA inspection device that divides and stores into areas. The method of claim 1,
The control module analyzes the height information to generate the second inspection order by excluding the inspection of the first electric element from the first inspection order when there is a first electric element higher than a reference height among the electronic elements. PCBA inspection equipment. 4. The method of claim 3,
The control module is a PCBA inspection device for generating the second inspection order by excluding the inspection of the second electric element located in a predetermined area corresponding to the height of the first electric element on the substrate. The method of claim 1,
The control module controls the first and second driving members so that the first and second probes are moved in a plurality of axial directions at a first height on the substrate when inspecting the substrate;
A PCBA inspection apparatus different from a first height of the first and second probes on the substrate when inspecting the substrate and a second height of the first and second probes on the substrate during standby. 6. The method of claim 5,
The control module analyzes the height information to select an electric element having the highest height among the electric elements, and to determine the first height by adding a reference inspection height to the highest height.

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