KR20220063653A - Vacuum Pressure Oven - Google Patents

Abstract

The present invention relates to an oven used to manufacture a semiconductor package and, more specifically, to an oven for manufacturing a semiconductor package which cures a die attach film tape in a state where the inside of a chamber is vacuumed and pressurized, thereby preventing air bubbles from being generated inside an adhesive portion during a curing process.

Description

Pressurized vacuum oven for semiconductor packaging production {Vacuum Pressure Oven}

The present invention relates to an oven used for manufacturing a semiconductor package, and more particularly, by curing a die attach film tape in a vacuum and pressurized state inside the chamber, bubbles are formed inside the adhesive area during the curing process. It relates to an oven for manufacturing a semiconductor package that is prevented from occurring.

Recently, various display devices to which an organic light emitting display (OLED) is applied are being put to practical use.

The screens of these display devices are exposed to the outside, and in particular, in the case of a display device having a touch function, since it is necessary to touch the screen using a finger or a pen, there is a problem in that it is vulnerable to scratches and impacts.

To this end, the conventional display device incorporates a window cover for protecting the screen. Recently, a display device having flexibility by using a flexible material such as plastic as a substrate is being developed. When a cover window is laminated on such a display device, a deviation occurs in the radius of curvature depending on the position of the cover window. There was a problem in that lamination defects, bubble defects, or defects on the surface of the panel occurred.

In addition, when laminating the cover window and the display panel, due to the area where the curvature deviation occurs in the curved portion of the cover window, poor fastening and bubble defects occur during the lamination process, or the edge of the cover window and the display panel come into contact In the process, the panel surface may be damaged, leading to product failure. In particular, as the radius of the curved portion of the cover window decreases, the area in which the curvature deviation occurs increases, and thus the defect rate also increases. That is, there is a problem in that a part of the transparent adhesive film applied during the lamination process is swept away in the bent region, resulting in product defects or adhesion defects such as bubbles being generated between the display panel and the cover window.

Accordingly, the present invention has been devised to solve the above problems, and an object of the present invention is to provide a vacuum pressurizing oven capable of eliminating the problem of air bubbles being generated in the process of laminating a cover window and a display panel.

In order to achieve the above object, the vacuum pressure oven of the present invention includes a chamber for curing the panel and cover window products charged therein by receiving hot air through a heating device, a door for opening and closing the chamber, and the oven body. It is characterized in that it is configured to include a pressure and vacuum generator for providing pressure and vacuum to the inside of the chamber at the same time.

In the present invention configured as described above, since curing is performed in a state where the inside of the chamber is formed under vacuum and high pressure, the air trapped between the panel and the cover window adhesive surface does not expand despite rising to a high temperature during the curing process. Since microbubbles are not generated on the surface, there is an effect of obtaining a display device product having excellent adhesive strength.

상기는 가압 진공오븐의 구성 그림으로 압력제어와 진공제어를 분리하였다.

The above is the configuration diagram of a pressurized vacuum oven, and pressure control and vacuum control are separated.

A heating device for curing the adhesive film on the panel and cover window products loaded in the chamber by blowing hot air into the chamber while generating heat at a temperature of 50° C. to 200° C. is provided in the oven body. The heating device is composed of a heater and a blower fan installed at the rear of the chamber to supply hot air into the chamber. In this case, a through hole for circulating hot air by the heating device is formed in the rear surface of the chamber. A pressure generating device for providing pressure to the interior of the chamber is provided at a lower portion of the oven body. In addition, it is configured to control the pressure and vacuum in the chamber by mounting a vacuum pump.

100: vacuum pressure oven body
101: chamber
102: pressure device
103: vacuum device

Claims (1)

an oven body configured with vacuum and pressure in the oven chamber at the same time;
A pressurized vacuum oven for semiconductor package manufacturing, characterized in that it is mounted inside the oven body and comprises a vacuum pump device for forming a vacuum in the chamber and a pressure generator for providing pressure.

Images