KR20220055470A - Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element, and optical semiconductor device - Google Patents

Abstract

The thermosetting resin composition for light reflection according to the present disclosure contains an epoxy resin, a curing agent, an inorganic filler and a white pigment, and the curing agent contains tetracarboxylic dianhydride having a melting point of 180 to 400°C.

Description

Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element, and optical semiconductor device

The present invention relates to a thermosetting resin composition for light reflection, a substrate for mounting an optical semiconductor element, and an optical semiconductor device.

An optical semiconductor device that combines an optical semiconductor element such as an LED (Light Emitting Diode) with a phosphor is highly energy efficient and has a long lifespan, so it is used in various applications such as outdoor displays, portable liquid crystal backlights, and in-vehicle applications. and its demand is growing. Accordingly, the high luminance of the LED device is progressing, and it is required to prevent the increase of the junction temperature due to the increase in the amount of heat generated by the element, or the deterioration of the optical semiconductor device due to the increase in direct light energy.

Patent Document 1 discloses a substrate for mounting an optical semiconductor element using a thermosetting resin composition having a high reflectance in a region from visible light to near-ultraviolet light after curing of the resin. Moreover, in patent document 2, the member for optical-semiconductor element mounting which reduced light leakage is disclosed.

Patent Document 1: Japanese Patent Application Laid-Open No. 2012-254633 Patent Document 2: Japanese Patent Application Laid-Open No. 2010-287837

In general, since the thermosetting resin composition is pulverized into a powder and then molded into a tablet, the thermosetting resin composition needs to have a degree of rigidity that can be pulverized around room temperature. Further, higher light reflectivity is required for a substrate for mounting an optical semiconductor element applied to fields such as outdoor lighting and vehicle-mounted headlights, and it is required to maintain optical properties even when used for a long time under high temperature. Therefore, it is calculated|required by the thermosetting resin composition for light reflection to form the hardened|cured material which has heat resistance which can maintain the light reflectance under high temperature for a long term.

Therefore, an object of this invention is to provide the thermosetting resin composition for light reflection which is excellent in grindability and heat resistance, the board|substrate for optical semiconductor element mounting using the same, and an optical semiconductor device.

The present invention relates to a light-reflecting thermosetting resin composition containing an epoxy resin, a curing agent, an inorganic filler and a white pigment, and the curing agent containing tetracarboxylic dianhydride having a melting point of 180 to 400°C.

The tetracarboxylic dianhydride may be at least one selected from the group consisting of tetracarboxylic dianhydride having two or more benzene rings and tetracarboxylic dianhydride having naphthalene rings. Moreover, the compound represented by following formula (1) may be sufficient as the tetracarboxylic dianhydride which has two or more benzene rings.

[Formula 1]

In the formula, R represents a single bond, an ether bond, a carbonyl group, a sulfonyl group, a methylene group, an isopropylidene group, a hexafluoroisopropylidene group, or a fluorene group.

The inorganic filler may also contain inorganic hollow particles having a central particle diameter of 1 to 25 µm. The white pigment may contain at least one selected from the group consisting of titanium oxide, zinc oxide, alumina, magnesium oxide, antimony oxide, and zirconium oxide.

Another aspect WHEREIN: This invention relates to the board|substrate for optical semiconductor element mounting provided with the hardened|cured material of the said thermosetting resin composition for light reflection. The board|substrate for optical-semiconductor element mounting which concerns on this invention has a recessed part comprised from a bottom surface and a wall surface, The bottom surface of the said recessed part may be a mounting part of an optical-semiconductor element. In this case, at least a part of the wall surface of the recess is a cured product of the thermosetting resin composition for light reflection. Moreover, the board|substrate for optical semiconductor element mounting which concerns on this invention is provided between the board|substrate, the 1st connection terminal and 2nd connection terminal provided on the said board|substrate, and the 1st connection terminal and the 2nd connection terminal, The said light reflection use You may provide the hardened|cured material of a thermosetting resin composition.

Another aspect WHEREIN: This invention relates to the optical-semiconductor device which has the said board|substrate for optical-semiconductor element mounting, and the optical-semiconductor element mounted in the said board|substrate for optical-semiconductor element mounting.

ADVANTAGE OF THE INVENTION According to this invention, the thermosetting resin composition for light reflection excellent in grindability and heat resistance, the board|substrate for optical-semiconductor element mounting using the same, and an optical-semiconductor device can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows one Embodiment of the board|substrate for optical-semiconductor element mounting.
It is a schematic diagram which shows one Embodiment of the process of manufacturing the board|substrate for optical-semiconductor element mounting.
It is a perspective view which shows one Embodiment of the state which mounted the optical-semiconductor element on the board|substrate for optical-semiconductor element mounting.
It is a schematic sectional drawing which shows one Embodiment of an optical semiconductor device.
It is a schematic sectional drawing which shows other embodiment of an optical semiconductor device.
6 is a schematic cross-sectional view showing another embodiment of an optical semiconductor device.
It is a schematic cross section which shows one Embodiment of a copper clad laminated board.
It is a schematic sectional drawing which shows an example of the optical-semiconductor device produced using the copper clad laminated board.
It is a schematic sectional drawing which shows other embodiment of an optical semiconductor device.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings as needed. However, this invention is not limited to the following embodiment. In addition, in the drawing, the same reference|symbol shall be attached|subjected to the same element, and overlapping description is abbreviate|omitted. In addition, the positional relationship, such as up, down, left and right, shall be based on the positional relationship shown in a figure unless otherwise indicated. In addition, the dimensional ratios in the drawings are not limited to the illustrated ratios.

In this specification, the numerical range indicated using "-" represents the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the numerical range described in stages in this specification, the upper limit or lower limit of the numerical range of a predetermined step may be substituted with the upper limit or lower limit of the numerical range of another step. In the numerical range described herein, the upper limit or lower limit of the numerical range may be substituted with the value shown in Examples. "A or B" may include any one of A and B, and may include both. The materials illustrated in this specification can be used individually by 1 type or in combination of 2 or more type, unless otherwise indicated. In addition, in this specification, "(meth)acrylate" means at least one of an acrylate and the methacrylate corresponding to it.

[Thermosetting resin composition for light reflection]

The thermosetting resin composition for light reflection of this embodiment contains an epoxy resin, a hardening|curing agent, an inorganic filler, and a white pigment, and the hardening|curing agent contains the tetracarboxylic dianhydride whose melting|fusing point is 180-400 degreeC.

(epoxy resin)

As an epoxy resin, the epoxy resin generally used as an epoxy resin molding material for electronic component sealing can be used. By containing an epoxy resin, the thermosetting resin composition which concerns on this embodiment can form the hardened|cured material which has high thermal hardness and bending strength, and improved mechanical properties. As an epoxy resin, For example, the epoxy resin which epoxidized the novolak resin of phenols, such as a phenol novolak-type epoxy resin and an orthocresol novolak-type epoxy resin, and aldehydes; diglycidyl ethers such as bisphenol A, bisphenol F, bisphenol S, and alkyl-substituted bisphenol; glycidylamine-type epoxy resins obtained by reaction of polyamines such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and alicyclic epoxy resins. An epoxy resin may be used individually by 1 type or in combination of 2 or more type.

Since there is little coloring, an epoxy resin is diglycidyl isocyanurate, triglycidyl isocyanurate, bisphenol A epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, 1,2- The dicarboxylic acid diglycidyl ester derived from cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, or 1,4-cyclohexanedicarboxylic acid may also be included. For the same reason, diglycidyl esters of dicarboxylic acids such as phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, nadic acid and methylnadic acid are also suitable for the epoxy resin. You may also contain glycidyl esters, such as a nuclear-hydrogenated trimellitic acid and nuclear-hydrogenated pyromellitic acid, which have an alicyclic structure in which an aromatic ring was hydrogenated. An epoxy resin may also contain the polyorganosiloxane which has an epoxy group, manufactured by heating a silane compound in presence of an organic solvent, an organic base, and water, hydrolyzing and condensing.

The epoxy resin may use a commercial item. As 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, for example, the product names "Celoxide 2021", "Celoxide 2021A" and "Celoxide 2021P" of Daicel Co., Ltd.; The product names "ERL4221", "ERL4221D" and "ERL4221E" of Dow Chemical Nippon Co., Ltd. are available. As bis(3,4-epoxycyclohexylmethyl) adipate, the product name "ERL4299" of Dow Chemical Nippon Corporation and the product name "EXA-7015" of DIC Corporation can be obtained, for example. 1-epoxyethyl-3,4-epoxycyclohexane or limonene diepoxide, for example, Mitsubishi Chemical Co., Ltd. product names "jER YX8000", "jER YX8034" and "jER YL7170", Daicel Co., Ltd. product names “Celoxide 2081”, “Celoxide 3000”, “Epolid GT301”, “Epollide GT401” and “EHPE3150” are available. As trisglycidyl isocyanurate, the product name "TEPIC-S" of Nissan Chemical Industry Co., Ltd. can be obtained, for example.

(hardener)

The curing agent according to the present embodiment contains tetracarboxylic dianhydride having a melting point of 180 to 400°C (hereinafter, simply referred to as “tetracarboxylic dianhydride”). By using such a tetracarboxylic dianhydride as a hardening|curing agent, the heat resistance of a thermosetting resin composition can be improved. From the viewpoint of uniformly dispersing in the resin composition, the melting point of the tetracarboxylic dianhydride may be 200 to 380°C or 210 to 350°C.

From the viewpoint of further improving heat resistance, the tetracarboxylic dianhydride may have an aromatic ring or an alicyclic ring. The tetracarboxylic dianhydride having an aromatic ring may be at least one selected from the group consisting of tetracarboxylic dianhydride having two or more benzene rings and tetracarboxylic dianhydride having a naphthalene ring.

The compound represented by following formula (1) may be sufficient as the tetracarboxylic dianhydride which has two or more benzene rings.

[Formula 2]

In formula (1), R represents a single bond, an ether bond, a carbonyl group, a sulfonyl group, a hexafluoroisopropylidene group, or a fluorene group.

As tetracarboxylic dianhydride which has an alicyclic ring, 1,2,3,4-cyclobutane tetracarboxylic dianhydride is mentioned, for example. As tetracarboxylic dianhydride having an aromatic ring, for example, 4,4'-biphthalic anhydride, 4,4'-carbonyldiphthalic anhydride, 4,4'-sulfonyldiphthalic anhydride, 4,4'-( Hexafluoroisopropylidene)diphthalic anhydride, 4,4'-oxydiphthalic anhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride, and 2,3,6,7-naphthalene and tetracarboxylic dianhydride.

The thermosetting resin composition which concerns on this embodiment WHEREIN: Content of the said tetracarboxylic dianhydride may be 1-50 mass parts, 5-30 mass parts, or 8-20 mass parts with respect to 100 mass parts of epoxy resins.

As the curing agent, a curing agent generally used as an epoxy resin molding material for sealing electronic components can be used in combination. Although such a hardening|curing agent will not be specifically limited if it reacts with an epoxy resin and a hardened|cured material is obtained, A hardening|curing agent with little coloring is preferable, and a colorless or pale yellow hardening|curing agent is more preferable. Examples of the curing agent include an acid anhydride curing agent having a melting point of less than 180° C., an isocyanuric acid derivative curing agent, and a phenol curing agent. You may use these hardening|curing agents individually by 1 type or in combination of 2 or more type.

Examples of the acid anhydride curing agent having a melting point of less than 180°C include phthalic anhydride, maleic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, and glutaric anhydride. , dimethyl glutaric anhydride, diethyl glutaric anhydride, succinic anhydride, methyl hexahydro phthalic anhydride, methyl tetrahydro phthalic anhydride, and tetracarboxylic dianhydride represented by the following formula (2).

[Formula 3]

In Formula (2), Rx represents a divalent organic group, and n represents the integer of 1-10. The divalent organic group may be a divalent saturated hydrocarbon group having a saturated hydrocarbon ring, and examples of the saturated hydrocarbon include cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, norbornene. , dicyclopentadiene, adamantane, hydrogenated naphthalene, and hydrogenated biphenyl.

As the isocyanuric acid derivative, 1,3,5-tris(1-carboxymethyl)isocyanurate, 1,3,5-tris(2-carboxyethyl)isocyanurate, 1,3,5- tris(3-carboxypropyl)isocyanurate and 1,3-bis(2-carboxyethyl)isocyanurate are mentioned.

Examples of the phenolic curing agent include phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol and aminophenol and/or α-naphthol, β-naphthol, dihydroxynaphthalene, etc. novolak-type phenol resins obtained by condensing or co-condensing naphthols with aldehydes such as formaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst; phenol/aralkyl resin synthesized from phenols and/or naphthols and dimethoxyparaxylene or bis(methoxymethyl)biphenyl; Aralkyl type phenol resins, such as a biphenylene type phenol aralkyl resin and a naphthol aralkyl resin; dicyclopentadiene type phenol resin synthesized by copolymerization of phenols and/or naphthols and dicyclopentadiene; triphenylmethane type phenol resin; terpene-modified phenolic resin; para-xylylene and/or meta-xylylene-modified phenolic resins; melamine-modified phenolic resin; And the phenol resin obtained by copolymerizing these 2 or more types is mentioned.

The thermosetting resin composition which concerns on this embodiment WHEREIN: Content of a hardening|curing agent may be 10-150 mass parts, 50-130 mass parts, or 60-120 mass parts with respect to 100 mass parts of epoxy resins.

The mixing ratio of the curing agent may be 0.5 to 2.0 equivalents, 0.6 to 1.5 equivalents, or 0.7 to 1.2 equivalents of active groups (acid anhydride group or hydroxyl group) in the curing agent capable of reacting with the epoxy group with respect to 1 equivalent of the epoxy group in the epoxy resin. When the said active group is 0.5 equivalent or more, the glass transition temperature of the hardened|cured material formed from a thermosetting resin composition will become high, and sufficient elastic modulus will become easy to be obtained. On the other hand, when the said active group is 2.0 equivalent or less, the intensity|strength after hardening becomes difficult to fall.

(white pigment)

The white pigment is used to impart a white color tone to a cured product (molded object) obtained from the thermosetting resin composition according to the present embodiment, and in particular, by making the color tone highly white, the light reflectance of the molded product can be improved. .

Examples of the white pigment include rare earth oxides such as yttrium oxide, titanium oxide, zinc oxide, aluminum oxide (alumina), magnesium oxide, antimony oxide, zinc sulfate, zirconium oxide, and zirconium oxide. These may be used individually by 1 type or in combination of 2 or more type. From the viewpoint of further improving light reflectivity, the white pigment preferably contains at least one selected from the group consisting of titanium oxide, zinc oxide, alumina, magnesium oxide, antimony oxide and zirconium oxide, titanium oxide and oxide It is more preferable that at least 1 sort(s) chosen from the group which consists of antimony and a zirconium oxide is included.

The central particle diameter of a white pigment may be 0.05-10 micrometers, 0.08-8 micrometers, or 0.1-5 micrometers may be sufficient as it. If the central particle diameter of a white pigment is 0.05 micrometer or more, dispersibility will become more favorable, and if it is less than 10 micrometers, the light reflection characteristic of hardened|cured material will become more favorable. In this specification, a central particle diameter can be calculated|required as a mass average value D50 (or a median diameter) in the particle size distribution measurement by a laser beam diffraction method.

(inorganic filler)

The thermosetting resin composition which concerns on this embodiment contains an inorganic filler from a viewpoint of improving a moldability. Examples of the inorganic filler include quartz, fumed silica, precipitated silica, silicic anhydride, fused silica, crystalline silica, ultrafine amorphous silica, barium sulfate, magnesium carbonate, barium carbonate, aluminum hydroxide, magnesium hydroxide, potassium titanate, calcium silicate, and inorganic hollow particles.

From the viewpoint of moldability, the inorganic filler may contain fused silica. From a viewpoint of improving the packing property with a white pigment, the central particle diameter of a fused silica may be 1-100 micrometers, 1-50 micrometers, or 1-40 micrometers may be sufficient.

From the viewpoint of further improving the pulverization property of the thermosetting resin composition, the inorganic filler may contain inorganic hollow particles having a central particle diameter of 1 to 25 µm. An inorganic hollow particle is a particle|grain which has a space|gap part inside. Since the inorganic hollow particle refracts and reflects incident light on the surface and the inner wall, when used together with a white pigment, a cured product with further improved light reflectivity and mechanical properties can be formed.

As an inorganic hollow particle, sodium silicate glass, aluminosilicate glass, borosilicate soda glass, and Shirasu (white sand) are mentioned, for example. From the viewpoint of heat resistance and pressure resistance, the outer shell of the inorganic hollow particles is made of at least one material selected from the group consisting of sodium silicate glass, aluminosilicate glass, soda borosilicate glass, shirasu, crosslinked styrene resin, and crosslinked acrylic resin. It is preferable to be made of at least one material selected from the group consisting of sodium silicate glass, aluminosilicate glass, soda borosilicate glass, and shirasu.

Since it is easy to disperse|distribute an inorganic hollow particle uniformly when preparing a thermosetting resin composition, 1 micrometer or more, 5 micrometers or more, or 10 micrometers or more may be sufficient as the central particle diameter of an inorganic hollow particle. Moreover, since it is easy to improve the light reflection characteristic of the hardened|cured material formed, the central particle diameter of an inorganic hollow particle may be 30 micrometers or less, 25 micrometers or less, or 22 micrometers or less.

From the viewpoint of improving the mechanical properties of the thermosetting resin composition, the thickness of the outer shell of the inorganic hollow particles may be 0.4 to 1.5 μm, 0.45 to 1.2 μm, 0.5 to 1.1 μm, or 0.55 to 1.0 μm.

From the viewpoint of improving light reflectivity, the bulk density of the inorganic hollow particles may be 0.20 to 0.38 g/cm ³ , 0.25 to 0.36 g/cm ³ , or 0.26 to 0.35 g/cm ³ . The bulk density is a density calculated by filling a container of a predetermined volume with inorganic hollow particles, and calculating the internal volume by volume.

Since the balance between light reflectivity and mechanical properties is excellent, the true density of the inorganic hollow particles may be 0.40 to 0.75 g/cm ³ , 0.45 to 0.70 g/cm ³ , or 0.50 to 0.65 g/cm ³ . . True density can be measured based on ASTM D2840.

From the viewpoint of improving the strength of the cured product of the thermosetting resin composition, the pressure strength of the inorganic hollow particles may be 100 MPa or more, 110 MPa or more, 125 MPa or more, or 150 MPa or more at 25°C. From the viewpoint of improving the moldability of the thermosetting resin composition, the pressure strength of the inorganic hollow particles may be 500 MPa or less, 300 MPa or less, or 200 MPa or less at 25°C. The pressure resistance strength can be measured based on ASTM D3102.

From the viewpoint of further improving the light reflectance, the content of the inorganic hollow particles is preferably 10-200 parts by mass, more preferably 30-180 parts by mass, more preferably 60-150 parts by mass, with respect to 100 parts by mass of the epoxy resin. desirable.

(curing accelerator)

The thermosetting resin composition according to the present embodiment may contain a curing accelerator in order to accelerate the curing reaction of the epoxy resin. Examples of the curing accelerator include an amine compound, an imidazole compound, an organophosphorus compound, an alkali metal compound, an alkaline earth metal compound, and a quaternary ammonium salt. It is preferable to use an amine compound, an imidazole compound, or an organophosphorus compound among these hardening accelerators. A hardening accelerator may be used individually by 1 type or in combination of 2 or more type.

Examples of the amine compound include 1,8-diaza-bicyclo[5.4.0]undecene-7, triethylenediamine, and tri-2,4,6-dimethylaminomethylphenol. Examples of the imidazole compound include 2-ethyl-4-methylimidazole. As the organophosphorus compound, for example, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium-o,o-diethylphosphodithioate, tetra-n-butylphosphonium -tetrafluoroborate and tetra-n-butylphosphonium-tetraphenylborate are mentioned.

0.01-8 mass parts, 0.1-5 mass parts, or 0.3-4 mass parts may be sufficient as content of the hardening accelerator in a thermosetting resin composition with respect to 100 mass parts of epoxy resins. When content of a hardening accelerator is 0.01 mass part or more, a sufficient hardening acceleration effect will be easy to be acquired, and it will become easy to suppress discoloration of hardened|cured material that it is 8 mass parts or less.

(Coupling agent)

In order to improve the adhesiveness of an inorganic filler and an epoxy resin to a thermosetting resin composition, you may add a coupling agent. Although it does not specifically limit as a coupling agent, For example, a silane coupling agent and a titanate type coupling agent are mentioned. As a silane coupling agent, an epoxysilane compound, an aminosilane compound, a cationic silane compound, a vinylsilane compound, an acrylsilane compound, and a mercaptosilane compound are mentioned, for example. Content of a coupling agent may be 5 mass % or less on the basis of whole quantity of a thermosetting resin composition.

You may add additives, such as antioxidant, a mold release agent, and an ion trapping agent, to the thermosetting resin composition which concerns on this embodiment as needed.

The thermosetting resin composition according to the present embodiment can be produced by uniformly dispersing and mixing the various components described above. The manufacturing means, conditions, etc. are not specifically limited. As a general method of producing a thermosetting resin composition, the method of kneading each component with a kneader, a roll, an extruder, a grinder, or the planetary mixer which combined rotation and revolution is mentioned. When kneading each component, it is preferable to carry out in a molten state from a viewpoint of improving a dispersibility.

The kneading conditions may be appropriately determined according to the type or blending amount of each component, for example, kneading at 15 to 100 ° C. for 5 to 40 minutes is preferable, and kneading at 20 to 100 ° C. for 10 to 30 minutes is more desirable. When the kneading temperature is 15°C or more, it becomes easy to knead each component, and dispersibility can be improved. When the kneading temperature is 100° C. or less, it is possible to suppress curing of the epoxy resin by progressing to a higher molecular weight during kneading. When the kneading time is 5 minutes or more, a sufficient dispersion effect is easily obtained. When the kneading time is 40 minutes or less, it is possible to suppress curing of the epoxy resin due to progress of high molecular weight during kneading.

The thermosetting resin composition according to the present embodiment is a substrate material for mounting an optical semiconductor element requiring high light reflectivity and heat resistance, an electrical insulation material, an optical semiconductor sealing material, an adhesive material, a paint material, an epoxy resin molding material for transfer molding, etc. useful for a variety of uses. Hereinafter, an example at the time of using the thermosetting resin composition which concerns on this embodiment as an epoxy resin molding material for transfer molding is demonstrated.

From the viewpoint of mechanical properties, the thermosetting resin composition according to the present embodiment has a bending strength of 70 MPa or more at 25 ° C. It is preferable, and it is more preferable that it is 75 MPa or more. When the bending strength is 70 MPa or more, the toughness is excellent.

From the viewpoint of improving the luminance of the optical semiconductor device, the initial light reflectance at a wavelength of 460 nm of the cured product of the thermosetting resin composition according to the present embodiment is preferably 91% or more, more preferably 92% or more, and 93% or more it is more preferable From the viewpoint of improving heat color resistance, the light reflectance at a wavelength of 460 nm after heat treatment of the cured product at 150° C. for 168 hours is preferably 88% or more, more preferably 89% or more, and more preferably 90% or more desirable.

[Substrate for mounting optical semiconductor elements]

The board|substrate for optical-semiconductor element mounting of this embodiment has the recessed part comprised from a bottom surface and a wall surface. The bottom surface of the concave portion is an optical semiconductor element mounting portion (optical semiconductor element mounting region), and the wall surface of the concave portion, that is, at least a part of the inner peripheral side surface of the concave portion, is made of a cured product of the thermosetting resin composition for light reflection of the present embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows one Embodiment of the board|substrate for optical-semiconductor element mounting. The substrate 110 for mounting an optical semiconductor element includes a metal wiring 105 (a first connection terminal and a second connection terminal) with Ni/Ag plating 104 formed thereon, and a metal wiring 105 (a first connection terminal and a second connection terminal). 2 connection terminals), a metal wiring 105 provided with an insulating resin molded body 103' provided between ) and has an optical semiconductor element mounting region (recessed portion) 200 formed of. The bottom surface of this recessed part 200 is composed of a metal wiring 105 with Ni/Ag plating 104 formed thereon and an insulating resin molded body 103', and the wall surface of the recessed part 200 is a reflector 103. is composed The reflector 103 and the insulating resin molded body 103' are molded bodies made of a cured product of the thermosetting resin composition for light reflection according to the present embodiment described above.

Although the manufacturing method of the board|substrate for optical semiconductor element mounting is not specifically limited, For example, it can manufacture by transfer molding using the thermosetting resin composition for light reflection. 2 : is schematic which shows one Embodiment of the process of manufacturing the board|substrate for optical-semiconductor element mounting. The substrate for mounting an optical semiconductor element is, for example, a step (Fig. 2 (a)), then, the metal wiring 105 is placed in a mold 151 having a predetermined shape, and a thermosetting resin composition for light reflection is injected from the resin injection port 150 of the mold 151, and a predetermined condition It can be manufactured through the process of transfer molding (FIG. 2(b)), and the process of removing the mold 151 (FIG. 2(c)). In this way, the optical semiconductor element mounting region (recessed portion) 200 is formed on the optical semiconductor element mounting substrate by being surrounded by the reflector 103 made of a cured product of the light reflecting thermosetting resin composition. Moreover, the bottom surface of the recessed part 200 is made of the metal wiring 105 used as a 1st connection terminal, the metal wiring 105 used as a 2nd connection terminal, and the hardened|cured material of the thermosetting resin composition for light reflection provided between them. It is comprised by the insulating resin molded body 103' which consists of Further, as conditions for the transfer molding, the mold temperature is 170 to 200°C, more preferably 170 to 190°C, the molding pressure is 0.5 to 20 MPa, more preferably 2 to 8 MPa, for 60 to 120 seconds, the aftercure temperature is 120°C 1 to 3 hours at -180°C are preferred.

[Optical semiconductor device]

The optical-semiconductor device which concerns on this embodiment has the said board|substrate for optical-semiconductor element mounting, and the optical-semiconductor element mounted in the said board|substrate for optical-semiconductor element mounting. As a more specific example, the optical semiconductor element having the optical semiconductor element mounting substrate, the optical semiconductor element provided in the concave portion of the optical semiconductor element mounting substrate, and a phosphor-containing sealing resin portion filling the concave portion to seal the optical semiconductor element. device can be mentioned.

3 : is a perspective view which shows one Embodiment of the state which mounted the optical-semiconductor element 100 on the board|substrate 110 for optical-semiconductor element mounting. As shown in FIG. 3 , the optical semiconductor element 100 is mounted at a predetermined position in the optical semiconductor element mounting region (recessed portion) 200 of the optical semiconductor element mounting substrate 110, and the metal wiring 105 and It is electrically connected by a bonding wire 102 . 4 and 5 are schematic cross-sectional views showing one embodiment of an optical semiconductor device. As shown in Figs. 4 and 5, the optical semiconductor device includes an optical semiconductor element mounting substrate 110 and an optical semiconductor element mounting substrate 110 provided at a predetermined position in the recess 200 of the optical semiconductor element mounting substrate 110. 100) and a sealing resin portion made of a transparent sealing resin 101 containing a phosphor 106 for filling the recessed portion 200 and sealing the optical semiconductor element, the optical semiconductor element 100 and Ni/ Metal wiring 105 on which Ag plating 104 is formed is electrically connected by bonding wire 102 or solder bump 107 .

6 : is also a schematic sectional drawing which shows one Embodiment of an optical semiconductor device. In the optical semiconductor device shown in FIG. 6, the LED element 300 is arrange|positioned via the die-bonding material 306 in the predetermined position on the lead 304 in which the reflector 303 was formed, and the LED element 300 and A lead 304 is electrically connected by a bonding wire 301 , and the LED element 300 is sealed by a transparent sealing resin 302 containing a phosphor 305 .

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to this. For example, the thermosetting resin composition for light reflection of this embodiment can be used as a light reflection coating agent. As this embodiment, a copper clad laminated board, the board|substrate for optical-semiconductor element mounting, and an optical-semiconductor element are demonstrated.

A copper clad laminate according to the present embodiment includes a light reflection resin layer formed using the above-described thermosetting resin composition for light reflection, and a copper foil laminated on the light reflection resin layer.

Fig. 7 is a schematic cross-sectional view showing a preferred embodiment of a copper-clad laminate. As shown in FIG. 7 , a copper clad laminate 400 is laminated on a substrate 401 , a light reflection resin layer 402 laminated on the substrate 401 , and on the light reflection resin layer 402 . A copper foil 403 is provided. Here, the light reflection resin layer 402 is formed using the above-mentioned thermosetting resin composition for light reflection.

As the base material 401, a base material used for a copper clad laminate can be used without particular limitation, and examples thereof include a resin laminated board such as an epoxy resin laminated board, a substrate for mounting an optical semiconductor, and the like.

The copper-clad laminate 400 is, for example, coated with the light-reflecting thermosetting resin composition of the present embodiment on the surface of the base material 401, overlapping copper foils 403, and cured by heat and pressure to light the thermosetting resin composition. It can be produced by forming the reflective resin layer 402 .

As a coating method of the thermosetting resin composition to the base material 401, application|coating methods, such as a printing method, the die-coating method, the curtain-coating method, the spray-coating method, and the roll-coating method, can be used, for example. At this time, you may make the thermosetting resin composition contain a solvent so that application|coating may become easy. In addition, when using a solvent, it is preferable to set as the whole quantity excluding a solvent about what was based on the whole quantity of the thermosetting resin composition in the compounding ratio of each component mentioned above.

Although it does not specifically limit as conditions for heat-pressing, For example, it is preferable to heat-press under the conditions for 130-180 degreeC, 0.5-4 MPa, and 30-600 minutes.

The printed wiring board for optical members, such as for LED mounting, can be produced using the said copper clad laminated board. Further, in the copper clad laminate 400 shown in FIG. 7 , a light reflective resin layer 402 and a copper foil 403 are laminated on one side of a base material 401 . A light reflective resin layer 402 and a copper foil 403 may be laminated on each other. Moreover, the copper clad laminated board may be comprised only with the light reflection resin layer 402 and the copper foil 403 without using the base material 401. In this case, the light reflective resin layer 402 serves as a base material. In this case, for example, glass cloth or the like can be impregnated with the present thermosetting resin composition and cured as the light reflection resin layer 402 .

8 : is a schematic sectional drawing which shows an example of the optical-semiconductor device produced using the copper clad laminated board. As shown in FIG. 8, the optical-semiconductor device 500 is a surface mount type light emitting diode provided with the optical-semiconductor element 410 and the transparent sealing resin 404 provided so that the optical-semiconductor element 410 might be sealed. In the optical semiconductor device 500 , the optical semiconductor element 410 is bonded to the copper foil 403 via an adhesive layer 408 , and is electrically connected to the copper foil 403 by a bonding wire 409 . has been

As another embodiment of the substrate for mounting an optical semiconductor element, using the above-described thermosetting resin composition for light reflection, a substrate for mounting an optical semiconductor element having a light reflection resin layer formed between a plurality of conductor members (connecting terminals) on a substrate can be heard Moreover, another embodiment of an optical-semiconductor device mounts an optical-semiconductor element on said board|substrate for optical-semiconductor element mounting, and is formed.

9 : is a schematic sectional drawing which shows suitable one Embodiment of an optical semiconductor device. As shown in FIG. 9 , the optical semiconductor device 600 includes a base material 601 , a plurality of conductor members 602 formed on the surface of the base material 601 , and a plurality of conductor members (connection terminals) 602 . The optical semiconductor element 610 is mounted on the optical semiconductor element mounting substrate having the light reflection resin layer 603 formed between the light reflection thermosetting resin composition, and the optical semiconductor element 610 is transparent so as to be sealed. It is a surface mount type light emitting diode in which the sealing resin 604 was provided. In the optical semiconductor device 600 , the optical semiconductor element 610 is adhered to the conductor member 602 via an adhesive layer 608 , and is electrically connected to the conductor member 602 by a bonding wire 609 . has been

Although the base material used for the board|substrate for optical semiconductor element mounting can be used especially without restriction|limiting as the base material 601, For example, resin laminated boards, such as an epoxy resin laminated board, are mentioned.

The conductor member 602 functions as a connection terminal, and can be formed by a well-known method, such as the method of photo-etching copper foil, for example.

In the substrate for mounting an optical semiconductor element, the light reflecting thermosetting resin composition for light reflection is applied between a plurality of conductor members 602 on a base 601 and heat-cured to form a light reflecting resin layer 603 made of a light reflecting thermosetting resin composition. It can be produced by forming.

As a coating method of the thermosetting resin composition for light reflection to the base material 601, coating methods, such as a printing method, the die-coating method, the curtain coating method, the spray-coating method, and the roll-coating method, can be used, for example. At this time, the thermosetting resin composition for light reflection may contain a solvent so that application|coating may become easy. In addition, when using a solvent, it is preferable to set the thing excluding a solvent as a whole quantity about what was based on the resin composition whole quantity by the compounding ratio of each component mentioned above.

Although it does not specifically limit as heating conditions at the time of heat-hardening the coating film of the thermosetting resin composition for light reflection, For example, you may heat on 130-180 degreeC and the conditions for 30-600 minutes.

Thereafter, the resin component that has adhered to the surface of the conductor member 602 excessively is removed by buffing or the like to expose the circuit made of the conductor member 602 to obtain a substrate for mounting an optical semiconductor element. Further, in order to secure the adhesion between the light reflection resin layer 603 and the conductor member 602, the conductor member 602 is subjected to a roughening treatment such as oxidation-reduction treatment and CZ treatment (manufactured by MEC Corporation). also be

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to this.

Example

Hereinafter, the present invention will be described in detail by way of Examples, but the present invention is not limited thereto.

[Production of thermosetting resin composition for light reflection]

In order to produce the thermosetting resin composition of an Example and a comparative example, the following components were prepared.

(epoxy resin)

Product name "TEPIC-S" manufactured by Nissan Chemical Industry Co., Ltd. (trisglycidyl isocyanurate, epoxy equivalent: 100)

(hardener)

Tetracarboxylic dianhydride of formula (2) (Rx: cyclohexane ring, melting point: 40 ° C.)

Brand name "Ricaside HH" manufactured by New Japan Rica Co., Ltd. (hexahydrophthalic anhydride, melting point: 35°C)

Brand name "Ricaside TH" manufactured by Shin-Nippon Rica Co., Ltd. (1,2,3,6-tetrahydrophthalic anhydride, melting point: 101°C)

Manak Co., Ltd. trade name "ODPA" (4,4'-oxydiphthalic anhydride, melting point: 229°C)

(curing accelerator)

Nippon Chemical Industry Co., Ltd. trade name "PX-4PB" (tetrabutylphosphonium tetraphenylborate)

(Coupling agent)

Epoxysilane compound (3-glycidoxypropyl trimethoxysilane)

(Release agent)

Nichiyu Co., Ltd. product name "ZNST" (zinc stearate)

(additive)

Product name of ADEKA Co., Ltd. "ADEKA STAB AO-60" (hindered phenolic antioxidant)

Product name of ADEKA Co., Ltd. "ADEKA STAB PEP-36A" (phosphite-based antioxidant)

Gelest's brand name "DBL-C32" (silicone-based additive)

(inorganic hollow particles)

3M Japan Co., Ltd. product name "iM30K" (central particle size: 18 µm, shell layer thickness: 0.61 µm, bulk density: 0.33 g/cm ³ , pressure strength: 186 MPa)

3M Japan Co., Ltd. product name "S60HS" (center particle size: 30 μm, shell layer thickness: 1.46 μm, bulk density: 0.38 g/cm ³ , pressure strength: 124 MPa)

(silica)

Trade name "FP-950" manufactured by Denka Corporation (fused silica)

Made by Admatex Co., Ltd., trade name "SO-25R" (fused silica)

Brand name "Pylohobic 702" manufactured by Fuji Silysia Chemical Co., Ltd. (hydrophobic fine powder silica)

(white pigment)

Titanium oxide (center particle diameter 0.2 μm)

According to the compounding ratio (part by mass) shown in Table 1, each component was mix|blended, and after fully kneading|mixing with a mixer, it melt-kneaded for 15 minutes at 40 degreeC with the mixing roll, and obtained the kneaded material. The thermosetting resin composition of an Example and a comparative example was produced by cooling and grinding|pulverizing a kneaded material, respectively.

[evaluation]

(light reflectance)

After transfer-molding the thermosetting resin composition under the conditions of a molding die temperature of 180° C., a molding pressure of 6.9 MPa and a curing time of 90 seconds, the thermosetting resin composition was post-cured at 150° C. for 2 hours to prepare a 3.0 mm-thick test piece. The light reflectance of the test piece in wavelength 460nm was measured using the integrating spherical spectrophotometer V-750 type (made by Nippon Bunko Corporation). Next, the light reflectance after heat-processing the test piece on a 150 degreeC hotplate for 168 hours was measured.

(grindability)

phi 3 (diameter: 3 mm) was selected for the screen mesh, and the thermosetting resin composition was grind|pulverized at room temperature using the grinding|pulverization apparatus (made by Dalton, product name: P-5). The thermosetting resin composition was intermittently supplied at a speed|rate of 100 g/min, and the following reference|standard evaluated grindability.

A: A good powder is obtained.

B: Although the component affixed to an apparatus is seen, a powder is obtained without a problem.

C: It is excessively soft and cannot be pulverized.

[Table 1]

From Table 1, it can be confirmed that the thermosetting resin composition for light reflection of Examples has excellent grindability and can form a cured product (molded body) with high heat resistance.

100… Optical semiconductor device
101… sealing resin
102... bonding wire
103… reflector
103'… Insulation resin molded body
104… Ni/Ag plating
105… metal wiring
106… phosphor
107... solder bump
110… Substrate for mounting optical semiconductor devices
150… resin inlet
151… mold
200… Optical semiconductor device mounting area
300… LED element
301… bonding wire
302... sealing resin
303… reflector
304… lead
305… phosphor
306… die bond material
400… copper clad laminate
401... write
402... light reflective resin layer
403... copper foil
404... sealing resin
408... adhesive layer
409... bonding wire
410... Optical semiconductor device
500, 600… Optical semiconductor device
601… write
602… no conductor
603… light reflective resin layer
604... sealing resin
608… adhesive layer
609... bonding wire
610… Optical semiconductor device

Claims (9)

containing an epoxy resin, a curing agent, an inorganic filler and a white pigment;
The thermosetting resin composition for light reflection, wherein the curing agent contains tetracarboxylic dianhydride having a melting point of 180 to 400°C. The method according to claim 1,
The thermosetting resin composition, wherein the tetracarboxylic dianhydride is at least one selected from the group consisting of tetracarboxylic dianhydride having two or more benzene rings and tetracarboxylic dianhydride having naphthalene rings. 3. The method according to claim 2,
The thermosetting resin composition whose tetracarboxylic dianhydride which has the said benzene ring 2 or more is a compound represented by following formula (1).
[Formula 1]

(In the formula, R represents a single bond, an ether bond, a carbonyl group, a sulfonyl group, a hexafluoroisopropylidene group, or a fluorene group.) 4. The method according to any one of claims 1 to 3,
The thermosetting resin composition in which the said inorganic filler contains the inorganic hollow particle whose center particle diameter is 1-25 micrometers. 5. The method according to any one of claims 1 to 4,
The thermosetting resin composition in which the said white pigment contains at least 1 sort(s) selected from the group which consists of titanium oxide, zinc oxide, alumina, magnesium oxide, antimony oxide, and zirconium oxide. The board|substrate for optical semiconductor element mounting provided with the hardened|cured material of the thermosetting resin composition for light reflection in any one of Claims 1-5. has a concave portion composed of a bottom surface and a wall surface, wherein the bottom surface of the concave portion is a mounting portion for an optical semiconductor element;
The board|substrate for optical-semiconductor element mounting in which at least a part of the said wall surface of the said recessed part consists of hardened|cured material of the thermosetting resin composition for light reflection in any one of Claims 1-5. a substrate, and a first connection terminal and a second connection terminal provided on the substrate;
The board|substrate for optical semiconductor element mounting which has hardened|cured material of the thermosetting resin composition for light reflection in any one of Claims 1-5 between a said 1st connection terminal and a said 2nd connection terminal. The optical-semiconductor device which has the board|substrate for optical-semiconductor element mounting in any one of Claims 6-8, and the optical-semiconductor element mounted in the said board|substrate for optical-semiconductor element mounting.

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