KR20220033034A - Resin molded product for opto-semiconductor sealing - Google Patents

Abstract

The present invention provides a resin molding for optical semiconductor sealing, which provides an optical semiconductor sealing material with superior temperature cycle resistance. The resin molding for optical semiconductor sealing includes a compound of a structural unit (I) represented by chemical formula (I) and a compound of a structural unit (II) represented by chemical formula (II). In the chemical formula (I), A^1 represents an organic group, and R^1 represents an organic group having a non-aromatic ring. In the chemical formula (II), A^1 is the same as described above, R^(2a) represents a site containing a residue of an epoxy resin, and R^(2b) represents a hydrogen atom or a bonding key bond with R^(2a).

Description

Resin molding for optical semiconductor sealing {RESIN MOLDED PRODUCT FOR OPTO-SEMICONDUCTOR SEALING}

The present invention relates to a resin molding for optical semiconductor encapsulation.

The optical semiconductor element is sealed with a ceramic package or a plastic package, and is deviceized. Here, as for the ceramic package, the use of a plastic package is becoming mainstream from the point that a constituent material is comparatively expensive and the point which mass productivity is inferior. Among them, from the viewpoints of workability, mass productivity, and reliability, a technique of transfer mold molding of an epoxy resin composition obtained by tableting in advance into a tablet form has become mainstream.

Patent Document 1 discloses a technique for granulating an epoxy resin composition into a tablet form.

Japanese Patent Laid-Open No. 2011-9394

In recent years, higher reliability is calculated|required by the optical semiconductor with high functionalization and high output of an electronic device. For example, cracks, peeling, discoloration, etc. may occur in the sealing material due to use in an environment where the temperature is repeatedly changed from low to high temperature, and it is required to reduce damage to the optical semiconductor element resulting from them is becoming

An object of the present invention is to provide a resin molded article for optical semiconductor encapsulation that provides an optical semiconductor encapsulant excellent in temperature cycle resistance.

The present invention relates to a resin molding for optical semiconductor encapsulation comprising a compound having a structural unit (I) represented by the following formula (I), and a compound having a structural unit (II) represented by the following formula (II).

Formula (I):

(In the formula, A ¹ represents an organic group. R ¹ represents an organic group having a non-aromatic ring.)

Formula (II):

(Wherein, A ¹ is as described above, and R ^2a represents a moiety containing a residue of an epoxy resin. R ^2b represents a hydrogen atom or a bond bonded to R ^2a .)

It is preferable that the said resin molding for optical semiconductor sealing satisfy|fills following relational expression (1).

Y<370000X-3600000 (One)

(wherein X represents the glass transition temperature (°C) of the cured product (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the following method, Y is the storage elastic modulus at 265° C. of the cured product (Pa) indicates.)

(Manufacturing method of hardening body)

A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product.

It is preferable that the molar ratio of the structural unit (I) to the total of the structural unit (I) and (II) is 0.10 to 0.60.

It is preferable that the said resin molding for optical semiconductor encapsulation has a linear transmittance at a wavelength of 450 nm of 70% or more when a cured body (size: 50 mm in width x 50 mm in length x 1 mm in thickness) is obtained by the following method.

(Manufacturing method of hardening body)

A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product.

This invention also relates to the optical-semiconductor sealing material obtained by shape|molding the said resin molding for optical-semiconductor sealing.

This invention also relates to an optical-semiconductor device provided with an optical-semiconductor element and the said optical-semiconductor sealing material which seals the said optical-semiconductor element.

According to the resin molding for optical semiconductor encapsulation of the present invention, an optical semiconductor sealing material excellent in temperature cycle resistance is obtained. Therefore, cracks, peeling, discoloration, etc. It is hard to generate|occur|produce this, and the damage to the optical semiconductor element resulting from them can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the evaluation package used by the Example and the comparative example.

Hereinafter, the present invention will be specifically described.

The resin molding for optical semiconductor sealing of this invention contains the compound which has a structural unit (I) represented by following formula (I), and the compound which has structural unit (II) represented by following formula (II).

(In the formula, A ¹ represents an organic group. R ¹ represents an organic group having a non-aromatic ring.)

(Wherein, A ¹ is as described above, and R ^2a represents a moiety containing a residue of an epoxy resin. R ^2b represents a hydrogen atom or a bond bonded to R ^2a .)

The resin molding for optical semiconductor encapsulation of the present invention contains a compound having the structural unit (I) to provide a cured product having a high glass transition temperature and a low elastic modulus at high temperature, so an optical semiconductor sealing material excellent in temperature cycle resistance is obtained Moreover, the optical semiconductor sealing material excellent also in solder reflow resistance, yellowing resistance, dimensional stability with respect to temperature change, shock absorption property, and impact resistance is obtained. Since such an optical semiconductor sealing material does not easily generate cracks, peeling, discoloration, etc. even by use in a high temperature environment or a solder reflow process, damage to the optical semiconductor element resulting therefrom can be reduced.

In general, when the glass transition temperature rises, the elastic modulus tends to also rise, but from a resin molded product containing a compound having the structural unit (I), a cured product having a high glass transition temperature and a lower elastic modulus on the high temperature side than the glass transition temperature. is obtained Although the reason is not clear, since the steric repulsion of the molecular chain represented by R ¹ is large, the glass transition temperature rises due to the increase in the rigidity of the main chain of the compound, and the elastic modulus is increased due to the increase in the free volume of the compound. This is presumed to decrease.

Since the resin molding for optical semiconductor sealing of this invention does not become too hard at the time of further heat-molding, it is excellent in handling property, a moldability, and releasability.

In formula (I), A ¹ represents an organic group. The organic group is a divalent organic group.

It is preferable that carbon number of the said organic group is 2 or more, It is more preferable that it is 6 or more, It is preferable that it is 20 or less, It is more preferable that it is 15 or less, It is still more preferable that it is 10 or less.

As said organic group, a hydrocarbon group is preferable, and hetero atoms, such as an oxygen atom, and unsaturated bonds, such as a double bond, may be included.

The said organic group may have a ring structure, and it is preferable to have a ring structure.

In formula (I), R< ¹ > represents the organic group which has a non-aromatic ring. The organic group is a divalent organic group.

It is preferable that carbon number of the said organic group is 3 or more, It is more preferable that it is 5 or more, It is still more preferable that it is 6 or more, It is preferable that it is 30 or less, It is more preferable that it is 20 or less.

As said organic group, a hydrocarbon group is preferable, and hetero atoms, such as an oxygen atom, and unsaturated bonds, such as a double bond, may be included.

It is more preferable that the said non-aromatic ring is a non-aromatic carbocyclic ring. Although the said non-aromatic ring may have an unsaturated bond, it is also preferable not to have an unsaturated bond. The said non-aromatic ring may be monocyclic or polycyclic may be sufficient as it.

A hydrocarbon ring having a crosslinked structure may be sufficient as the said non-aromatic ring. As the hydrocarbon ring having a crosslinked structure, a bicyclic or tricyclic hydrocarbon ring having a crosslinked structure is preferable, and a tricyclic hydrocarbon ring having a crosslinked structure is more preferable.

As said non-aromatic ring, a cyclohexane ring is especially preferable.

R< ¹ > may also contribute by removing two hydroxyl groups from the polyhydric alcohol which has a non-aromatic ring mentioned later.

In formula (II), R ^2a represents the site|part containing the residue of an epoxy resin. In this specification, the residue of an epoxy resin is the structure remove|excluding at least 1 epoxy group (oxirane ring) from an epoxy resin.

R ^2a may further include one or more unreacted epoxy groups, and may include a structure in which an epoxy group reacted with another compound (curing agent, curing accelerator, other additive, etc.).

In formula (II), R ^2b represents a hydrogen atom or a bond bonded to R ^2a . When R ^2b is a bond, it bonds with R ^2a to form a ring.

In the resin molding for optical semiconductor encapsulation of the present invention, it is preferable that the molar ratio (I/(I+II)) of the structural unit (I) to the total of the structural unit (I) and the structural unit (II) is 0.10 to 0.60 Do. The molar ratio is more preferably 0.15 or more, still more preferably 0.25 or more, more preferably 0.50 or less, and still more preferably 0.40 or less.

Thereby, the optical-semiconductor sealing material further excellent in temperature cycle resistance and solder reflow resistance is obtained.

Content of each structural unit can be calculated|required by NMR.

It is preferable that the resin molding for optical semiconductor sealing of this invention satisfy|fills following relational expression (1).

Y<370000X-3600000 (One)

(wherein X represents the glass transition temperature (°C) of the cured product (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the following method, Y is the storage elastic modulus at 265° C. of the cured product (Pa) indicates.)

(Manufacturing method of hardening body)

A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product.

When such a resin molding is cured, a cured product having a higher glass transition temperature and a lower elastic modulus at high temperatures is obtained, so that an optical semiconductor sealing material further excellent in temperature cycle resistance is obtained.

The glass transition temperature (Tg) was measured by dynamic viscoelasticity (mode: tensile, scanning temperature: 0 to 270 ° C., frequency: 1 Hz) using the cured body (size: width 5 mm x length 35 mm x thickness 1 mm) obtained by the above method. , temperature increase rate: 10 ° C./min, distance between sample support points: 22.5 mm) to obtain storage elastic modulus E' and loss elastic modulus E". Find the peak top temperature of

The storage modulus at 265°C (E′ _265°C ) was measured by dynamic viscoelasticity at 265°C (mode: tensile, Scanning temperature: 0 to 270°C, frequency: 1 Hz, temperature increase rate: 10°C/min, distance between sample support points: 22.5 mm).

The resin molding for optical semiconductor encapsulation of the present invention preferably has a glass transition temperature (Tg) of 110° C. or higher when a cured body (size: width 5 mm×length 35 mm×thickness 1 mm) by the above method is 110° C. or higher, and 120° C. or higher It is more preferable, it is more preferable that it is 130 degreeC or more, It is especially preferable that it is 140 degreeC or more, and it is preferable that it is 200 degrees C or less.

When Tg at the time of setting it as a hardening body exists in the said range, the optical-semiconductor sealing material further excellent in temperature cycling resistance will be obtained.

The resin molding for optical semiconductor encapsulation of the present invention has a storage elastic modulus (E' _265°C ) at 265°C of 5.0×10 ⁷ when a cured body (size: width 5 mm×length 35 mm×thickness 1 mm) is obtained by the above method. It is preferably Pa or less, more preferably 2.0×10 ⁷ Pa or less, still more preferably 1.0×10 ⁷ Pa or less, and more preferably 1.0×10 ⁶ Pa or more.

When E' in the case of a hardening body is _{265 degreeC} in the said range, the optical-semiconductor sealing material which is further excellent in temperature cycling resistance and solder reflow resistance is obtained.

The resin molding for optical semiconductor encapsulation of the present invention has a storage elastic modulus (E' _25°C ) at 25°C of 5.0×10 ⁸ when a cured body (size: width 5 mm×length 35 mm×thickness 1 mm) is obtained by the above method. to 5.0×10 ⁹ Pa, more preferably 8.0×10 ⁸ to 4.0×10 ⁹ Pa, and still more preferably 1.0×10 ⁹ to 3.0×10 ⁹ Pa.

When E' ₂₅ degreeC in the case of a hardening body exists in the said range, the optical-semiconductor sealing material further excellent in temperature cycling resistance and solder reflow resistance is obtained.

E' _25°C is a measurement of dynamic viscoelasticity at 25°C (mode: tensile, scanning temperature: 0 to 270°C, frequency: It is calculated|required by 1 Hz, temperature increase rate: 10 degreeC/min, distance between sample support points: 22.5 mm).

The resin molding for optical semiconductor encapsulation of the present invention preferably has a linear transmittance of 70% or more at a wavelength of 450 nm when a cured body (size: 50 mm width × 50 mm length × 1 mm thickness) by the above method is 70% or more, and is 90% or more It is more preferable, and it is still more preferable that it is 95 % or more.

Thereby, the optical-semiconductor sealing material excellent in the transmittance|permeability (transparency) of light is obtained.

The said linear transmittance is calculated|required by measuring the transmission spectrum in wavelength 450nm of the said hardening body using a spectrophotometer.

It is preferable that the resin molding for optical semiconductor sealing of this invention contains an epoxy resin, an acid anhydride, a polyhydric alcohol, the reaction product of an epoxy resin and an acid anhydride, the reaction product of a polyhydric alcohol and an acid anhydride, and a hardening accelerator.

The compound having the structural unit (I) described above may be a reaction product of a polyhydric alcohol and an acid anhydride, and the compound having the structural unit (II) may be a reaction product of an epoxy resin and an acid anhydride.

As the epoxy resin, a thing with little coloring is preferable, for example, bisphenol A epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanurate, hydantoin epoxy, etc. A heterocyclic-containing epoxy resin, a hydrogenated bisphenol A epoxy resin, an aliphatic type epoxy resin, a glycidyl ether type epoxy resin, etc. are mentioned. An epoxy resin can be used individually by 1 type or in combination of 2 or more types.

As an acid anhydride, for example, phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, anhydride glutaric acid etc. are mentioned. An acid anhydride can be used individually by 1 type or in combination of 2 or more types.

Although the compounding quantity of an acid anhydride is not specifically limited, For example, 20-200 mass parts is preferable with respect to 100 mass parts of epoxy resins. When it is less than 20 parts by mass, the curing rate becomes slow, and when it exceeds 200 parts by mass, there is an excessive amount for the curing reaction, so there is a risk of causing deterioration of various physical properties.

In addition, the equivalent ratio (A/E) of the equivalent (A) of the acid anhydride group and the equivalent (E) of the epoxy group is preferably 0.5 to 1.5, more preferably 0.8 to 1.2, and most preferably 0.9 to 1.0 . When it is less than 0.5 or exceeds 1.5, reactivity may fall and the intensity|strength and heat resistance of hardened|cured material may be impaired.

The polyhydric alcohol may be a compound having two or more hydroxyl groups, but is preferably a diol (glycol).

As said polyhydric alcohol, the polyhydric alcohol which has a non-aromatic ring is preferable at the point which can obtain the structural unit (I) mentioned above easily. The polyhydric alcohol may be an alicyclic polyhydric alcohol. It is preferable that carbon number of the said polyhydric alcohol is 3 or more, It is more preferable that it is 5 or more, It is still more preferable that it is 6 or more, It is preferable that it is 30 or less, It is more preferable that it is 20 or less.

As said non-aromatic ring, the thing similar to the non-aromatic ring which the organic group as R< ¹ > in Formula (I) mentioned above has is mentioned.

Although the following can be illustrated as said polyhydric alcohol, It is not limited to these. In addition, when stereoisomers exist, each stereoisomer and the mixture of two or more stereoisomers shall be included in an illustration.

Polyhydric alcohol can be used individually by 1 type or in combination of 2 or more types.

Although the compounding quantity of polyhydric alcohol is not specifically limited, For example, it can select suitably from the range of 5-200 mass parts with respect to 100 mass parts of epoxy resins.

Further, the molar ratio (B/C) of the number of moles (B) of the polyhydric alcohol compound and the number of moles (C) of the acid anhydride is preferably 0.01 to 0.70, more preferably 0.05 to 0.60, and most preferably 0.10 to 0.50. Do.

When there is too little compounding quantity of polyhydric alcohol, the elasticity modulus of the hardening body obtained may become high too much, on the other hand, when there is too much compounding quantity of polyhydric alcohol, the glass transition temperature and elasticity modulus of the hardening body obtained may become low too much.

Examples of the curing accelerator include tertiary amines such as triethanolamine and dimethylbenzylamine, imidazoles such as 2-methylimidazole and 2-ethyl-4-methylimidazole, tetraphenylphosphonium/tetraphenylborate, and triphenyl organophosphorus compounds such as phosphine, diazabicycloalkene compounds such as 1,8-diazabicyclo[5.4.0]undecene-7 and 1,5-diazabicyclo[4.3.0]nonene-5 can be heard These may also be used independently and may use 2 or more types together.

Although the compounding quantity of a hardening accelerator is not specifically limited, For example, it can select suitably from the range of 0.1-5 mass parts with respect to 100 mass parts of epoxy resins, 0.5-3 mass parts is preferable, and 1-2 mass parts is more preferable. . When the compounding amount of the curing accelerator is too small, the curing rate becomes slow and productivity is lowered. On the other hand, when the compounding amount of the curing accelerator is too large, the curing reaction rate is high, the control of the reaction state becomes difficult, and there is a risk of causing fluctuations in the reaction there is

When the resin molding for optical semiconductor sealing of this invention contains a hardening accelerator, a part of hardening accelerator may react with an epoxy resin and/or an acid anhydride.

In the resin molded article for optical semiconductor encapsulation of the present invention, in addition to each of the above components, if necessary, additives such as color inhibitors, lubricants, modifiers, deterioration inhibitors, mold release agents, phosphors that change the wavelength of light, and inorganic/organic fillers that diffuse light are used. . In addition, fillers, such as a silica powder, can be mix|blended as long as it does not impair transmission of light.

As a coloring inhibitor, a phenol type compound, an amine type compound, an organic sulfur type compound, a phosphine type compound, etc. are mentioned.

Examples of the lubricant include waxes and talc such as stearic acid, magnesium stearate, and calcium stearate. In addition, when mix|blending the said lubricating agent, although the compounding quantity is set suitably according to molding conditions, it is suitable to set to 0.1-0.4 mass % of the whole resin molding, for example.

Examples of the phosphor for changing the wavelength of light and inorganic/organic fillers for diffusing light include silica powder such as quartz glass powder, talc, fused silica powder and crystalline silica powder, alumina, silicon nitride, aluminum nitride, silicon carbide, and the like. In addition, when mix|blending a fluorescent substance or an inorganic/organic filler, the compounding quantity is set suitably according to molding conditions. Specifically, in the case of a fluorescent substance, the compounding quantity of a fluorescent substance can be set suitably from 1 mass % - 60 mass % of the whole resin molding. On the other hand, in the case of a light-scattering filler (organic/inorganic), the light-scattering filler can be suitably set from 0.5 mass % to 25 mass % of the whole resin molding.

A tablet, a sheet, etc. are mentioned as resin molding for optical semiconductor sealing of this invention.

Although the volume is not specifically limited when the resin molding for optical semiconductor sealing is a tablet, 1-100 cm<3> is preferable and 10-100 cm<3> is more preferable.

Since the resin molding for optical semiconductor sealing of this invention is used for resin sealing of optical semiconductor elements, such as a light receiving element, it is preferable from an optical point of view that it is transparent. Here, "transparency" means that the transmittance|permeability in 400 nm of the hardening body of the said molded object is 90 % or more. In addition, the transmittance|permeability in the case of containing additives, such as a fluorescent substance which changes the wavelength of light and an inorganic/organic filler which diffuses the above-mentioned, means the transmittance|permeability of the resin part excluding an additive.

The resin molding for optical semiconductor sealing of this invention is, for example,

A step of kneading an epoxy resin, an acid anhydride, a polyhydric alcohol and a curing accelerator to obtain a curable resin composition;

A step of heat-treating the curable resin composition;

A step of granulating the curable resin composition to obtain a granular curable resin composition;

The step of molding the granular curable resin composition

It can manufacture suitably by the manufacturing method containing

Although the method of kneading is not specifically limited, For example, the method of using an extruder, etc. are mentioned. The kneading temperature is not particularly limited, either, and may be appropriately changed according to the properties of the epoxy resin.

The shape of the curable resin composition obtained by kneading|mixing is not specifically limited, A film form, a sheet form, a granular form, a block form, etc. are mentioned.

The curable resin composition obtained by kneading|mixing heat-processes and obtains the resin composition for optical semiconductor sealing of B-stage shape (semi-hardened image). The heat treatment temperature and heat treatment time are not particularly limited, and may be appropriately changed according to the characteristics of the epoxy resin.

The heat-treated resin composition is granulated to obtain a granular curable resin composition. It may be pulverized using a ball mill, turbo mill, or the like before granulation. Although the granulation method is not specifically limited, The method of using a dry compression granulator, etc. are mentioned. Although the average particle diameter of the granular material obtained by granulation is not specifically limited, 1-5000 micrometers is preferable, and 100-2000 micrometers is more preferable. When it exceeds 5000 micrometers, there exists a tendency for a compression rate to fall.

The obtained granular curable resin composition is shape|molded, and a molded object is obtained. A tablet and a sheet|seat are mentioned as a molded object, and tablet molding which obtains a tablet, extrusion molding, etc. which obtain a sheet are mentioned as a shaping|molding method. Since the obtained molded object can provide the hardened|cured material with a high glass transition temperature and a low elastic modulus as mentioned above, it can provide the optical semiconductor sealing material excellent in heat resistance and solder reflow resistance.

When the molding is a tablet, the conditions for tableting the tablet are appropriately adjusted depending on the composition, average particle diameter, particle size distribution, etc. of the granular curable resin composition, but generally, the compression ratio at the time of tablet molding is 90 to 96%. It is appropriate to set That is, when the value of the compressibility is less than 90%, the density of the tablet is low and there is a risk of cracking easily. Conversely, when the value of the compressibility is larger than 96%, cracks occur during tableting, and notch or bend at the time of release is caused. because there is a risk of it happening.

The resin molding for optical semiconductor sealing of this invention can seal an optical semiconductor element by molding methods, such as transfer mold molding. The optical semiconductor sealing material obtained by shape|molding the resin molding for optical semiconductor sealing of this invention is also one of this invention. Since the optical semiconductor sealing material of this invention is obtained from the resin molding of this invention, it is excellent in temperature cycling resistance. Moreover, it is excellent also in solder reflow resistance, yellowing resistance, dimensional stability with respect to temperature change, shock absorption, and impact resistance. Therefore, there are few cracks or peelings even by use in an environment in which the temperature is repeatedly changed from low to high temperature or by a solder reflow process, and damage to the optical semiconductor element to be sealed can be reduced.

In this specification, an optical-semiconductor sealing material is a member which forms so that the optical-semiconductor element which comprises an optical-semiconductor device may be covered, and seals the said element.

An optical-semiconductor device provided with an optical-semiconductor element and the optical-semiconductor sealing material of this invention which seals the said optical-semiconductor element is also one of this invention. Since the optical semiconductor device of the present invention is provided with the optical semiconductor sealing material of the present invention, even when operated under an environment in which the temperature is repeatedly changed from low to high temperature, cracks and peeling of the sealing material are small, and damage to the optical semiconductor element is reduced little.

The resin molding for optical semiconductor encapsulation of the present invention is often used under an environment in which the temperature is repeatedly changed from low to high temperature, and is particularly suitable for sealing in-vehicle optical semiconductors which are often provided in a solder reflow process can be used

<Example>

Next, the present invention will be described in more detail with reference to Examples, but the present invention is not limited only to these Examples.

The materials used are shown below.

Epoxy resin A: Bisphenol A type epoxy resin (JER-1002W manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 650)

Epoxy resin B: triglycidyl isocyanurate (TEPIC-S manufactured by Nissan Chemical Co., Ltd., epoxy equivalent 100)

Acid anhydride: Hexahydrophthalic anhydride (Ricaside HH manufactured by New Japan Rica Co., Ltd.)

Diol additive A: 1,4-cyclohexanedimethanol

Diol additive B: 1,4-cyclohexanediol

Diol Additive C: Hydrogenated Bisphenol A

Diol additive D: 1,6-hexanediol

Diol Additive E: Neopentylglycol

Cure Accelerator: Dimethylbenzylamine

Examples 1 to 6 and Comparative Examples 1 to 4

Each component shown in Table 1 was cooled after melt-mixing at 50-140 degreeC in the ratio shown in the same table, and the epoxy resin composition was obtained. The resin tablet for optical semiconductor sealing was produced by performing reactivity adjustment at 40-80 degreeC, grind|pulverizing the obtained epoxy resin composition at 40-80 degreeC, and tablet-molding.

Using the tablets produced in Examples and Comparative Examples, various physical properties were measured by the following methods, and temperature cycle resistance, solder reflow resistance, and transparency were evaluated. A result is shown in Table 1.

<Molar ratio of structural units>

The content of the structural unit A derived from the reaction product of the diol additive and the acid anhydride and the structural unit B derived from the reaction product of the epoxy resin and the acid anhydride was determined by NMR, The molar ratio (A/(A+B)) was calculated.

<Production of test piece (hardening body)>

A cured product for a test piece having a size according to the measurement method was produced by molding (curing condition: 150°C x 4 minutes heating) using a dedicated mold using the tablet produced as described above. By heating this at 150 degreeC for 3 hours, hardening was complete|finished completely, and the test piece was obtained.

<Storage modulus E'>

Using the test piece prepared above (size: width 5 mm x length 35 mm x thickness 1 mm), by RSA-II manufactured by RHEOMETRIC SCIENTIFIC, tensile mode, frequency 1 Hz, scanning temperature 0 to 270 ° C, temperature increase rate 10 ° C/min , the storage elastic modulus E' of the test piece was obtained under the measurement conditions of the distance between the sample supporting points of 22.5 mm, and the storage elastic modulus of the cured body was derived at a measurement temperature of 265°C.

<Glass transition temperature (Tg)>

The test piece (size: width) prepared above under the measurement conditions of a tensile mode, a frequency of 1 Hz, a scanning temperature of 0 to 270 ° C., a temperature increase rate of 10 ° C./min, and a distance between the sample support points of 22.5 mm by RSA-II manufactured by RHEOMETRIC SCIENTIFIC. The storage modulus E' and the loss modulus E" of 5 mm x length 35 mm x thickness 1 mm were obtained, the curve of tan δ (=E"/E') was calculated|required from these, and the peak top temperature of tan δ was calculated|required.

Moreover, the value of 370000X-3600000 at the time of making a glass transition temperature X was also calculated|required.

<Linear transmittance>

First, the inside of the quartz cell was filled with liquid paraffin manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., and the baseline was measured using a spectrophotometer V-670 manufactured by Nippon Bunko Corporation. Thereafter, the prepared test piece (size: width 50 mm × length 50 mm × thickness 1 mm) was immersed in liquid paraffin in a quartz cell, and the light transmittance at a wavelength of 450 nm was measured. In addition, the following criteria evaluated.

○: linear transmittance of 70% or more

x: linear transmittance less than 70%

<Production of evaluation package>

As shown in Fig. 1, the tablet prepared above was used to cover the end of the reliability evaluation frame (Ag) manufactured by Hirai Semitsu Kogyo Co., Ltd., and molded into a size: width 5 mm x length 6 mm x thickness 2 mm (curing conditions) : heated at 150°C for 4 minutes). By heating this at 150 degreeC for 3 hours, hardening was complete|finished completely, and the evaluation package was obtained. For each Example and Comparative Example, 20 packages were produced.

<Temperature Cycle Test (TCT)>

The package was exposed to high temperature (130° C.) and low temperature (-40° C.) for 15 minutes each. Return to each temperature was completed within 5 minutes. By setting this as 1 cycle, the temperature cycle test of 1000 cycles was performed with respect to the said package. Then, the package was taken out, the presence or absence of a crack was observed, the number of the package in which the crack generate|occur|produced among 20 packages was counted, and the following reference|standard evaluated.

○: 0 to 5

△: 6 to 10 pieces

×: 11 or more

<Solder Reflow>

The package was passed through reflow (top peak 265 DEG C x 10 seconds) three times.

<Solder reflow resistance>

The package subjected to the solder reflow was immersed in red ink manufactured by Taiyo Bussan Co., Ltd., and the pressure was reduced for 10 minutes, after which the package was taken out. . The number of packages defective in peeling among the 20 packages was counted, and solder reflow resistance was evaluated based on the following criteria.

○: 0 to 5

×: 6 or more

TECHNICAL FIELD This invention relates to the resin molding for optical-semiconductor sealing used for sealing of an optical-semiconductor element, an optical-semiconductor sealing material, and an optical-semiconductor device, It can utilize for manufacture of an optical-semiconductor device.

Claims (6)

A resin molding for optical semiconductor encapsulation comprising a compound having a structural unit (I) represented by the following formula (I), and a compound having a structural unit (II) represented by the following formula (II).
Formula (I):

(In the formula, A ¹ represents an organic group. R ¹ represents an organic group having a non-aromatic ring.)
Formula (II):

(Wherein, A ¹ is as described above, and R ^2a represents a moiety containing a residue of an epoxy resin. R ^2b represents a hydrogen atom or a bond bonded to R ^2a .) The resin molding for optical semiconductor encapsulation according to claim 1, which satisfies the following relational expression (1).
Y<370000X-3600000 (1)
(wherein X represents the glass transition temperature (°C) of the cured product (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the following method, Y is the storage elastic modulus at 265° C. of the cured product (Pa) indicates.)
(Manufacturing method of hardening body)
A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product. The resin molding for optical semiconductor encapsulation according to claim 1 or 2, wherein the molar ratio of the structural unit (I) to the total of the structural unit (I) and the structural unit (II) is 0.10 to 0.60. The optical semiconductor encapsulation according to any one of claims 1 to 3, wherein the linear transmittance at a wavelength of 450 nm is 70% or more when a cured body (size: 50 mm in width x 50 mm in length x 1 mm in thickness) is obtained by the following method. For resin moldings.
(Manufacturing method of hardening body)
A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product. The optical-semiconductor sealing material obtained by shape|molding the resin molding for optical-semiconductor sealing in any one of Claims 1-4. An optical-semiconductor device provided with the optical-semiconductor element and the optical-semiconductor sealing material of Claim 5 which seals the said optical-semiconductor element.

Images