KR20210150294A - Resin molded article for optical semiconductor encapsulation - Google Patents

Abstract

An objective of the present invention is to provide a resin-molded article for encapsulating optical semiconductors, which provides excellent heat resistance, temperature cycle resistance, and solder reflow resistance. According to the present invention, the resin-molded article satisfies 0.0005 <= E'_265℃ / E'_100℃ <= 0.0050, wherein E'_265℃ and E'_100℃ represent the storage modulus (Pa) at 265℃ and 100℃ of a cured body (size: width 5 mm × length 35 mm × thickness 1 mm) acquired by a method for manufacturing a cured body, respectively. The method for manufacturing a cured body heats and molds a resin-molded article at 150℃ for four minutes and heats the molded article at 150℃ for three hours, and thus the cured body is acquired.

Description

Resin molding for optical semiconductor sealing {RESIN MOLDED ARTICLE FOR OPTICAL SEMICONDUCTOR ENCAPSULATION}

This invention relates to the resin molding for optical semiconductor sealing.

The optical semiconductor element is sealed with a ceramic package or a plastic package, and is deviceized. Here, since the constituent materials of the ceramic package are relatively expensive and the mass productivity is inferior, the use of a plastic package has become mainstream. Among them, from the viewpoints of workability, mass productivity, and reliability, a technique of transfer mold molding of an epoxy resin composition obtained by tableting in advance into a tablet form is mainstream.

Patent Document 1 discloses a technique for granulating an epoxy resin composition into a tablet form.

Japanese Patent Laid-Open No. 2011-9394

In recent years, higher reliability is calculated|required by an optical semiconductor with high functionalization and high output of an electronic device. For example, when cracks, peeling, discoloration, etc. occur in the sealing material due to use in an environment where the temperature becomes high or the temperature is repeatedly changed from low to high temperature, or due to the solder reflow process in the manufacturing stage of the device There is a demand to reduce the damage to the optical semiconductor element resulting from them.

An object of this invention is to provide the resin molding for optical semiconductor sealing which provides the optical-semiconductor sealing material excellent in heat resistance, temperature cycle resistance, and solder reflow resistance.

This invention relates to the resin molding for optical semiconductor sealing which satisfy|fills the following relational formula (1).

0.0005≤E' _265℃ /E' _100℃ ≤0.0050 (1)

(Wherein, E′ _{265° C.} and E′ _{100° C.} represent the storage modulus (Pa) at 265° C. and 100° C. of the cured body (size: width 5 mm×length 35 mm×thickness 1 mm) obtained by the following method, respectively.)

(Manufacturing method of hardening body)

A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product.

The resin molding for optical semiconductor encapsulation preferably has a glass transition temperature of 130° C. or higher when a cured body (size: width 5 mm×length 35 mm×thickness 1 mm) is obtained by the above method, and also satisfies the following relational expression (2) do.

Y<160000X-1450000 (2)

(Wherein, X represents the glass transition temperature (°C) of the cured body, and Y represents the storage elastic modulus (Pa) at 265°C of the cured body.)

It is preferable that the said resin molding for optical semiconductor sealing satisfy|fills following relational formula (3) and (4).

Y<6300000 (130≤X<150) (3)

Y<160000X-17000000(150≤X≤190) (4)

(In each formula, X represents the glass transition temperature (°C) of the cured body obtained by the above method (size: width 5 mm×length 35 mm×thickness 1 mm), and Y represents the storage modulus (Pa) of the cured body at 265° C. indicate.)

It is preferable that the said resin molding for optical semiconductor sealing satisfy|fills following relational expression (5).

0.70<R _450nm <1.00 (5)

(wherein, R _{450 nm} is the ratio of the linear transmittance at a wavelength of 450 nm before and after implementation when solder reflow is performed three times at 265° C. on the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) (After/before implementation) is indicated.)

It is preferable that the said resin molding for optical semiconductor sealing satisfy|fills the following relational formulas (6) and (7).

0.80<R _400nm /R _450nm <1.00 (6)

0.10<R _300nm /R _450nm <0.50 (7)

(In each formula, R _{300 nm} , R _{400 nm} and R _{450 nm} are each of the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) when solder reflow is performed 3 times at 265°C, before and after implementation The ratio of the linear transmittance at wavelengths of 300 nm, 400 nm and 450 nm (after/before implementation) is shown.

It is preferable that the said resin molding for optical semiconductor encapsulation has a linear transmittance at a wavelength of 450 nm of 70% or more when a cured body (size: 50 mm in width x 50 mm in length x 1 mm in thickness) is obtained by the above method.

It is preferable that the said resin molding for optical semiconductor sealing contains a thermosetting resin, a hardening|curing agent, the reaction product of a thermosetting resin and a hardening|curing agent, and a hardening accelerator.

It is preferable that the said resin molding for optical semiconductor sealing also contains polyhydric alcohol, and the reaction product of polyhydric alcohol and a hardening|curing agent.

The resin molding for optical semiconductor encapsulation has a structure represented by a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a structure represented by the following formula (III) It is preferable to contain at least 1 sort(s) selected from the group which consists of compounds which have unit (III).

Formula (I):

(Wherein, A ¹ represents an organic group containing two or more ring structures. R ^1a represents a moiety containing a residue of an epoxy resin. R ^1b represents a hydrogen atom or a bond bonded to ^{R 1a.} )

Formula (II):

(Wherein, A ² represents an organic group. R ^2a represents a moiety containing a residue of an epoxy resin having two or more continuous ring structures (however, oxirane rings are excluded). R ^2b is a hydrogen atom , or R ^2a and represents a bond.)

Formula (III):

(In the formula, A ³ represents an organic group. R ^3a represents an organic group having a non-aromatic ring.)

This invention also relates to the optical-semiconductor sealing material obtained by shape|molding the said resin molding for optical-semiconductor sealing.

This invention also relates to an optical-semiconductor device provided with an optical-semiconductor element and the said optical-semiconductor sealing material which seals the said optical-semiconductor element.

According to the resin molding for optical semiconductor sealing of the present invention, an optical semiconductor sealing material excellent in heat resistance, temperature cycle resistance and solder reflow resistance is obtained. It is hard to generate|occur|produce a crack, peeling, discoloration, etc., and the damage to the optical semiconductor element resulting from them can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the evaluation package used by the Example and the comparative example.

Hereinafter, the present invention will be specifically described.

The resin molding for optical semiconductor sealing of this invention satisfy|fills the following relational expression (1).

0.0005≤E' _265℃ /E' _100℃ ≤0.0050 (1)

(Wherein, E′ _{265° C.} and E′ _{100° C.} represent the storage modulus (Pa) at 265° C. and 100° C. of the cured body (size: width 5 mm×length 35 mm×thickness 1 mm) obtained by the following method, respectively.)

(Manufacturing method of hardening body)

A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product.

Since the resin molding satisfying the relational formula (1) provides a cured product having a high glass transition temperature and a low elastic modulus at high temperature, an optical semiconductor sealing material excellent in heat resistance, temperature cycle resistance and solder reflow resistance is obtained. Moreover, the optical semiconductor sealing material excellent also in yellowing resistance, dimensional stability with respect to temperature change, shock absorption, and impact resistance is obtained. Since such an optical semiconductor sealing material does not easily generate a crack, peeling, discoloration, etc. even by use in a high-temperature environment or a solder reflow process, the damage to the optical semiconductor element resulting from them can be reduced.

The said resin molding also does not become too hard at the time of heat molding, and is excellent in handling property, moldability, and releasability.

E' _265°C /E' _100°C is 0.0050 or less, but preferably 0.0030 or less, more preferably 0.0010 or less, and still more preferably 0.0008 or less.

When E' _{265 degreeC} /E' ₁₀₀ degreeC is less than 0.0005 or exceeds 0.0050, there exists a possibility that the heat resistance of the optical semiconductor sealing material obtained, temperature cycling resistance, and solder reflow resistance may fall.

E' _265°C and E' _100°C are dynamic viscoelasticity measurements at 265°C and 100°C using the cured product obtained by the above-described method, respectively (mode: tensile, scanning temperature: 0 to 270°C, frequency: 1Hz, temperature increase rate: 10°C/min).

The resin molding for optical semiconductor encapsulation of the present invention has a glass transition temperature (Tg) of 130° C. or higher when a cured body (size: width 5 mm×length 35 mm×thickness 1 mm) by the above method is 130° C. or more, and the following relational expression (2) It is desirable to satisfy

Y<160000X-1450000 (2)

(Wherein, X represents the glass transition temperature (°C) of the cured body, and Y represents the storage elastic modulus (Pa) at 265°C of the cured body.)

When such a resin molding is cured, a cured product having a high glass transition temperature and a low modulus of elasticity at high temperature is obtained. And the optical semiconductor sealing material further excellent in impact resistance is obtained.

Although it is preferable that the said glass transition temperature is 130 degreeC or more, it is more preferable that it is 140 degreeC or more, It is still more preferable that it is 145 degreeC or more, It is especially preferable that it is 155 degreeC or more. Moreover, it is preferable that it is 200 degrees C or less, as for a glass transition temperature, It is more preferable that it is 190 degrees C or less, It is more preferable that it is 180 degrees C or less.

When the glass transition temperature of the cured product is within the above range, an optical semiconductor encapsulant further excellent in heat resistance, temperature cycle resistance, yellowing resistance, dimensional stability against temperature change and shock absorption is obtained.

The glass transition temperature is measured by dynamic viscoelasticity (mode: tensile, scanning temperature: 0 to 270 ° C., frequency: 1 Hz, temperature increase rate) using the cured body (size: width 5 mm x length 35 mm x thickness 1 mm) obtained by the above method. : 10°C/min) to obtain a storage elastic modulus E' and a loss elastic modulus E'', a curve of tan δ (=E''/E') is obtained from these, and is calculated as the peak top temperature of tan δ.

It is preferable that the following relational formulas (3) and (4) are satisfied, and, as for the resin molding for optical semiconductor sealing of this invention, it is more preferable to satisfy the following relational expressions (3') and (4').

Y<6300000 (130≤X<150) (3)

Y<160000X-17000000(150≤X≤190) (4)

Y<1400000(130≤X<150) (3')

Y<160000X-22000000(150≤X≤190) (4')

(In each formula, X represents the glass transition temperature (°C) of the cured body obtained by the above method (size: width 5 mm×length 35 mm×thickness 1 mm), and Y represents the storage modulus (Pa) of the cured body at 265° C. indicate.)

Thereby, the optical semiconductor sealing material which was further excellent in heat resistance, temperature cycling resistance, solder reflow resistance, yellowing resistance, dimensional stability with respect to temperature change, shock absorption, and impact resistance is obtained.

_{The resin molding for optical semiconductor encapsulation of the present invention has a storage modulus at 265°C (E′ 265°C} ) of 1.5×10 ⁷ Pa when a cured body (size: width 5 mm×length 35 mm×thickness 1 mm) is obtained by the above method. It is preferable that it is less than or equal to, and it is more preferable that it is 1.0x10<^{7>Pa or less.}

It is preferable that the resin molding for optical semiconductor sealing of this invention satisfy|fills following relational expression (5).

0.70<R _450nm <1.00 (5)

(wherein, R _{450 nm} is the ratio of the linear transmittance at a wavelength of 450 nm before and after implementation when solder reflow is performed three times at 265° C. on the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) (After/before implementation) is indicated.)

R _450nm is more preferably not less than 0.80, and also more preferably not more than 0.95.

When R _{450 nm} is within the above range, a decrease in transmittance at a specific wavelength of the cured body after solder reflow is suppressed, so that an optical semiconductor sealing material further excellent in solder reflow resistance and yellowing resistance is obtained.

It is preferable that the resin molding for optical semiconductor sealing of this invention satisfy|fills the following relational expression (5').

0.60<R _400nm <0.90 (5')

(wherein, R _{400 nm} is the ratio of the linear transmittance at a wavelength of 400 nm before and after the implementation when solder reflow is performed three times at 265° C. on the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) (After/before implementation) is indicated.)

R _{400 nm} is more preferably 0.70 or more, and more preferably 0.85 or less.

When R _{400 nm} exists in the said range, since the transmittance|permeability fall at the specific wavelength of the hardening body after solder reflow implementation is suppressed, the optical semiconductor sealing material further excellent in solder reflow resistance and yellowing resistance is obtained.

It is preferable that the resin molding for optical semiconductor sealing of this invention satisfy|fills the following relational expression (5'').

0.10<R _300nm <0.50 (5'')

(wherein, R _{300 nm} is the ratio of the linear transmittance at a wavelength of 300 nm before and after implementation when solder reflow is performed three times at 265° C. to the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) (After/before implementation) is indicated.)

R _{300 nm} is more preferably 0.15 or more, and more preferably 0.40 or less.

When R _{300 nm} exists in the said range, since the transmittance|permeability fall in the specific wavelength of the hardening body after solder reflow implementation is suppressed, the optical-semiconductor sealing material further excellent in solder reflow resistance and yellowing resistance is obtained.

It is preferable that the resin molding for optical semiconductor sealing of this invention satisfy|fills the following relational expressions (6) and (7).

0.80<R _400nm /R _450nm <1.00 (6)

0.10<R _300nm /R _450nm <0.50 (7)

(In each formula, R _{300 nm} , R _{400 nm} and R _{450 nm} are each of the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) when solder reflow is performed 3 times at 265°C, before and after implementation The ratio of the linear transmittance at wavelengths of 300 nm, 400 nm and 450 nm (after/before implementation) is shown.

As for _R400nm / _R450nm, it is more preferable that it is 0.95 or less.

As for _R300nm / _R450nm, it is more preferable that it is 0.20 or more, and it is more preferable that it is 0.40 or less.

When R _{400 nm} /R _{450 nm} and R _{300 nm} /R _{450 nm} are within the above ranges, the decrease in transmittance at a specific wavelength of the cured body after solder reflow is suppressed, so that an optical semiconductor sealing material with much superior solder reflow resistance and yellowing resistance is obtained lose

The linear transmittance in each wavelength is calculated|required by producing a hardened body by the method mentioned above, and measuring the transmission spectrum of the said hardening body before and after solder reflow implementation using a spectrophotometer.

The said solder reflow uses the said hardening body, and uses a reflow furnace, and is performed on condition of 265 degreeC of top peak and 10 second with respect to one time.

The resin molding for optical semiconductor encapsulation of the present invention preferably has a linear transmittance of 70% or more at a wavelength of 450 nm when a cured body (size: 50 mm width × 50 mm length × 1 mm thickness) by the above method is 70% or more, and is 90% or more It is more preferable, and it is still more preferable that it is 95 % or more.

Thereby, the optical-semiconductor sealing material excellent in the transmittance|permeability (transparency) of light is obtained.

The said linear transmittance is calculated|required by measuring the transmission spectrum in wavelength 450nm of the said hardening body using a spectrophotometer.

As a resin molding for optical semiconductor sealing of this invention, a tablet, a sheet|seat, etc. are mentioned.

Although the volume is not specifically limited when the resin molding for optical semiconductor sealing is a tablet, 1-100 cm<^3> is preferable, and 10-100 cm<^3> is more preferable.

It is preferable that the resin molding for optical semiconductor sealing of this invention contains the reaction material of a thermosetting resin and a hardening|curing agent. It is also preferable to include a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator. In addition to the above, it is also preferable to include a polyhydric alcohol and a reaction product of the polyhydric alcohol and a curing agent. The resin molding for optical semiconductor sealing of this invention should just be a state of what is called a B-stage (semi-hardened).

As a thermosetting resin, an epoxy resin is preferable. As an epoxy resin, a thing with little coloring is preferable.

As said epoxy resin, the epoxy resin which has two or more continuous ring structures (however, an oxirane ring is excluded.) is preferable from the point which can obtain easily the resin molding which satisfy|fills each relational expression mentioned above. Here, that two or more ring structures are continuous means that two or more ring structures are in direct contact, in other words, that there is no atom which does not constitute a ring between one ring structure and an adjacent ring structure. Two or more continuous ring structures WHEREIN: It is preferable that one ring structure and the adjacent ring structure share two or more atoms.

It is preferable that it is a non-aromatic ring, and, as for the said ring structure, it is more preferable that it is a non-aromatic carbocyclic ring. The said epoxy resin should just be an alicyclic epoxy resin.

Although the said ring structure may have an unsaturated bond, it is also preferable not to have an unsaturated bond.

The epoxy resin preferably has a hydrocarbon group having a crosslinked structure, more preferably a bicyclic or tricyclic hydrocarbon group having a crosslinked structure, and still more preferably has a bicyclic hydrocarbon group in which a crosslinked structure is provided on a 6-membered ring. .

The hydrocarbon group having the cross-linked structure has the following formula:

(In the formula, R ¹¹ represents an oxygen atom or an alkylene group. R ¹² to R ¹⁷ each independently represent a hydrogen atom or an alkyl group.) It is particularly preferably a group represented by.

Thereby, the resin molding which satisfy|fills each relational expression mentioned above can be obtained still more easily.

In the formula, R ¹¹ represents an oxygen atom or an alkylene group. It is preferable that carbon number of the said alkylene group is 1-5, It is more preferable that it is 1-3, It is still more preferable that it is 1-2, It is especially preferable that it is 1.

R ¹¹ is preferably an alkylene group.

In the formula, R ¹² to R ¹⁷ each independently represents a hydrogen atom or an alkyl group. R ¹² to the number of carbon atoms of the alkyl group as R ¹⁷ is preferably from 1 to 5, and more preferably from 1 to 3, more preferably from 1 to 2.

R ¹² to R ¹⁷ are preferably a hydrogen atom.

Although the following can be illustrated as said epoxy resin, It is not limited to these. In addition, when stereoisomers exist, each stereoisomer and a mixture of two or more stereoisomers shall be included in an illustration.

Epoxy resins other than the above can also be used. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanurate, heterocyclic containing epoxy resins, such as hydantoin epoxy resin, hydrogenated bisphenol A A type epoxy resin, an aliphatic type epoxy resin, a glycidyl ether type|mold epoxy resin, etc. are mentioned. You may use together with the epoxy resin which has the above-mentioned two or more continuous ring structure (however, an oxirane ring is excluded.).

Epoxy resins can be used individually by 1 type or in combination of 2 or more types.

As the curing agent, an acid anhydride having little color in the cured resin molded product during or after curing is suitable. Among them, from the viewpoint of easily obtaining a resin molded product satisfying each relational expression described above, the following formula (a):

(In formula, A<^1> represents the organic group containing two or more ring structures.) The acid anhydride (a) represented by it is preferable.

In formula (a), A ¹ is a (polycyclic) organic group containing two or more ring structures. The organic group is a divalent organic group.

The number of carbon atoms in the organic group is preferably 5 or more, more preferably 6 or more, still more preferably 7 or more, more preferably 20 or less, more preferably 15 or less, still more preferably 10 or less, and still more preferably 7 or less. Especially preferred.

As said organic group, a hydrocarbon group is preferable, and hetero atoms, such as an oxygen atom, and unsaturated bonds, such as a double bond, may be included.

As said organic group, the hydrocarbon group which has a crosslinked structure is preferable, the bicyclic hydrocarbon group which has a crosslinked structure is more preferable, and the bicyclic hydrocarbon group which provided the crosslinked structure in the 6-membered ring is still more preferable.

A ¹ is the formula (A1):

(In the formula, R ² represents an oxygen atom or an alkylene group. R ³ represents a hydrocarbon group having 2 or more carbon atoms. R ⁴ to R ⁷ each independently represent a hydrogen atom or an alkyl group.) It is particularly preferably a group represented by.

Thereby, the resin molding which satisfy|fills each relational expression mentioned above can be obtained still more easily.

In formula (A1), R ² represents an oxygen atom or an alkylene group. It is preferable that carbon number of the said alkylene group is 1-5, It is more preferable that it is 1-3, It is still more preferable that it is 1-2, It is especially preferable that it is 1.

R ² is preferably an alkylene group.

In formula (A1), R<^3> represents a C2 or more hydrocarbon group. The hydrocarbon group is a divalent hydrocarbon group. Although carbon number of the said hydrocarbon group is 2 or more, it is more preferable that it is 2-5, It is still more preferable that it is 2-4, It is especially preferable that it is 2.

The hydrocarbon group as R ^{3 is -CX 1} ₂ -CX ² ₂ - (wherein, X ¹ and X ² are independently a hydrogen atom or an alkyl group) or -CX ¹ =CX ² - (wherein, X ¹ and X ^{2 )} is as described above) is preferred.

As for carbon number of the said alkyl group as X<^1> and X<^2> , it is preferable that it is 1-5, It is more preferable that it is 1-3, It is still more preferable that it is 1-2.

When ^two or more ^{X 1} or X 2 exist, these plurality of X ¹ or X ² may be the same or different.

X ¹ and X ² are preferably hydrogen atoms.

In the formula (A1), R ⁴ to R ⁷ each independently represent a hydrogen atom or an alkyl group. R ⁴ to the number of carbon atoms of the alkyl group as R ⁷ is preferably from 1 to 5, and more preferably from 1 to 3, more preferably from 1 to 2.

R ⁴ and R ⁵ is preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom.

R ⁶ and R ⁷ are preferably hydrogen atoms.

Although the following can be illustrated as group represented by Formula (A1), It is not limited to these. In addition, when stereoisomers exist, each stereoisomer and a mixture of two or more stereoisomers shall be included in an illustration.

As group represented by Formula (A1), the following are especially preferable.

Acid anhydrides other than the above can also be used. For example, phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, glutaric anhydride, etc. are mentioned. You may use together with the acid anhydride (a) mentioned above.

A curing agent can be used individually by 1 type or in combination of 2 or more types.

Although the compounding quantity of a hardening|curing agent is not specifically limited, For example, 20-200 mass parts is preferable with respect to 100 mass parts of thermosetting resins. If it is less than 20 parts by mass, the rate of curing becomes slow, and when it exceeds 200 parts by mass, there is an excessive amount for the curing reaction, so there is a risk of causing deterioration of various physical properties.

When the thermosetting resin is an epoxy resin and the curing agent is an acid anhydride, the equivalent ratio (A/E) of the equivalent (A) of the acid anhydride group and the equivalent (E) of the epoxy group is preferably 0.5 to 1.5, and 0.8 to 1.2 More preferably, it is most preferable that it is 0.9-1.0. When it is less than 0.5 or exceeds 1.5, reactivity may fall and the intensity|strength and heat resistance of hardened|cured material may be impaired.

When the resin molding for optical semiconductor sealing of this invention contains a hardening|curing agent, a part of hardening|curing agent may react with a thermosetting resin.

Examples of the curing accelerator include tertiary amines such as triethanolamine and dimethylbenzylamine, imidazoles such as 2-methylimidazole and 2-ethyl-4-methylimidazole, tetraphenylphosphonium/tetraphenylborate, and triphenyl organophosphorus compounds such as phosphine, diazabicycloalkene compounds such as 1,8-diazabicyclo[5.4.0]undecene-7 and 1,5-diazabicyclo[4.3.0]nonene-5 can be heard These may also be used independently or may use 2 or more types together.

Although the compounding quantity of a hardening accelerator is not specifically limited, For example, it can select suitably from the range of 0.1-5 mass parts with respect to 100 mass parts of thermosetting resin, 0.5-3 mass parts is preferable, and 1-2 mass parts is more preferable. If the compounding amount of the curing accelerator is too small, the curing rate is slowed and productivity is lowered. On the other hand, if the compounding amount of the curing accelerator is too large, the curing reaction speed is high, the control of the reaction state becomes difficult, and fluctuations in the reaction occur. there is a risk of making

When the resin molding for optical semiconductor sealing of this invention contains a hardening accelerator, a part of hardening accelerator may react with a thermosetting resin and/or a hardening|curing agent.

It is also preferable that the resin molding for optical semiconductor sealing of this invention contains polyhydric alcohol further. Thereby, the hardening body with a still lower elastic modulus can be provided, and the optical semiconductor sealing material which was further excellent in shock absorption and impact resistance is obtained.

The polyhydric alcohol may be a compound having two or more hydroxyl groups, but is preferably a diol (glycol).

As said polyhydric alcohol, the polyhydric alcohol which has a non-aromatic ring is preferable from the point which can obtain easily the resin molding which satisfy|fills each relational expression mentioned above. The polyhydric alcohol may be an alicyclic polyhydric alcohol. It is preferable that carbon number of the said polyhydric alcohol is 3 or more, It is more preferable that it is 5 or more, It is still more preferable that it is 6 or more, It is preferable that it is 30 or less, It is more preferable that it is 20 or less.

It is more preferable that the said non-aromatic ring is a non-aromatic carbocyclic ring. Although the said non-aromatic ring may have an unsaturated bond, it is also preferable not to have an unsaturated bond. The said non-aromatic ring may be monocyclic or polycyclic may be sufficient as it.

A hydrocarbon ring having a crosslinked structure may be sufficient as the said non-aromatic ring. As the hydrocarbon ring having a crosslinked structure, a bicyclic or tricyclic hydrocarbon ring having a crosslinked structure is preferable, and a tricyclic hydrocarbon ring having a crosslinked structure is more preferable.

As said non-aromatic ring, a cyclohexane ring is especially preferable.

Although the following can be illustrated as said polyhydric alcohol, It is not limited to these. In addition, when stereoisomers exist, each stereoisomer and a mixture of two or more stereoisomers shall be included in an illustration.

Polyhydric alcohols other than the above can also be used. For example, Preferably carbon number is 2-10, More preferably, it is 2-6, More preferably, it is 2-5 diol. As said diol, ethylene glycol, propylene glycol, neopentyl glycol, pentanediol, butanediol etc. are mentioned, for example, Among these, neopentyl glycol is preferable. You may use together with the polyhydric alcohol which has the above-mentioned non-aromatic ring.

Polyhydric alcohol can be used individually by 1 type or in combination of 2 or more types.

Although the compounding quantity of polyhydric alcohol is not specifically limited, For example, it can select from the range of 5-200 mass parts with respect to 100 mass parts of thermosetting resins.

When the curing agent is an acid anhydride, the molar ratio (B/C) of the number of moles (B) of the polyhydric alcohol compound and the number of moles (C) of the acid anhydride is preferably 0.01 to 0.70, more preferably 0.05 to 0.60, and 0.10 to 0.50 is most preferred.

When there is too little compounding quantity of polyhydric alcohol, the elasticity modulus of the hardening body obtained may become high too much, on the other hand, when there is too much compounding quantity of polyhydric alcohol, the glass transition temperature and elasticity modulus of the hardening body obtained may become low too much.

When the resin molding for optical semiconductor sealing of this invention contains polyhydric alcohol, a part of polyhydric alcohol may react with a thermosetting resin and/or a hardening|curing agent.

The resin molding for optical semiconductor sealing of the present invention contains an epoxy resin, an acid anhydride, a polyhydric alcohol, a reaction product of an epoxy resin and an acid anhydride, a reaction product of a polyhydric alcohol and an acid anhydride, and a curing accelerator, and further includes the following (i) to ( It is preferable to satisfy at least one of iii).

(i) The said epoxy resin is an epoxy resin which has two or more continuous ring structures (however, an oxirane ring is excluded.).

(ii) The acid anhydride is an acid anhydride (a) represented by the formula (a).

(iii) The polyhydric alcohol is a polyhydric alcohol having a non-aromatic ring.

Such a resin molding provides a cured product having a high glass transition temperature and a low elastic modulus at high temperature, so that an optical semiconductor sealing material excellent in heat resistance, temperature cycle resistance and solder reflow resistance is obtained. Moreover, the optical semiconductor sealing material excellent also in yellowing resistance, dimensional stability with respect to temperature change, shock absorption, and impact resistance is obtained.

Generally, when the glass transition temperature increases, the elastic modulus also tends to increase, but by satisfying at least one of (i) to (iii) above, a cured product having a high glass transition temperature and a lower elastic modulus on the high temperature side than the glass transition temperature The provided resin molding is obtained. Although the reason is not clear, in a reaction product of an epoxy resin and an acid anhydride, or a reaction product of a polyhydric alcohol and an acid anhydride, since the steric repulsion between the side chains derived from the ring structure of the epoxy resin, the acid anhydride or the polyhydric alcohol is large, It is estimated that the glass transition temperature rises due to an increase in the rigidity of the main chain of the reactant, and the elastic modulus decreases due to an increase in the free volume of the reactant.

The resin molding for optical semiconductor encapsulation of the present invention is a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a following formula (III) It is preferable to include at least 1 sort(s) chosen from the group which consists of a compound which has the structural unit (III) shown.

Formula (I):

(Wherein, A ¹ represents an organic group containing two or more ring structures. R ^1a represents a moiety containing a residue of an epoxy resin. R ^1b represents a hydrogen atom or a bond bonded to ^{R 1a.} )

Formula (II):

(Wherein, A ² represents an organic group. R ^2a represents a moiety containing a residue of an epoxy resin having two or more continuous ring structures (however, oxirane rings are excluded). R ^2b is a hydrogen atom , or R ^2a and represents a bond.)

Formula (III):

(In the formula, A ³ represents an organic group. R ^3a represents an organic group having a non-aromatic ring.)

A resin molding containing such a compound provides a cured product having a high glass transition temperature and a low elastic modulus at high temperature, so that an optical semiconductor encapsulant excellent in heat resistance, temperature cycle resistance and solder reflow resistance can be obtained. Moreover, the optical semiconductor sealing material excellent also in yellowing resistance, dimensional stability with respect to temperature change, shock absorption, and impact resistance is obtained.

The compound having the structural unit (I) may be a reaction product of the epoxy resin and the acid anhydride (a) described above. The epoxy resin for forming the structural unit (I) may be an epoxy resin having two or more continuous ring structures (however, except for an oxirane ring) described above, or may be an epoxy resin other than that.

In formula (I), A ¹ represents the organic group containing two or more ring structures. A ¹ in the formula (I) are the same as A ¹ in the above-described formula (a).

In formula (I), R ^1a represents the site|part containing the residue of an epoxy resin. In the present specification, the residue of the epoxy resin is a structure in which at least one epoxy group (oxirane ring) is removed from the epoxy resin.

R ^1a may also include one or more unreacted epoxy groups, and may include a structure in which an epoxy group reacts with another compound (curing agent, curing accelerator, other additive, etc.).

In formula (I), R ^1b represents a hydrogen atom or a bond bonded to ^{R 1a .} When R ^1b is a bond, it ^{bonds with R 1a} to form a ring.

In the compound having the structural unit (I), the number of atoms in the main chain between ^{adjacent A 1 is preferably 6 to 17.} The number of atoms is more preferably 13 or less, and still more preferably 9 or less. 10 or more may be sufficient as the said atom number further, and 14 or more may be sufficient as it.

The number of atoms in the main chain between the adjacent A ¹ is the number of atoms present on the shortest path along the bond ^{from one A 1} to the nearest other A ^{1 . An atom constituting A 1} , an oxygen atom of a carbonyl group, ^{and atoms constituting R 1a} and R ^1b are not included in the atoms in the main chain.

When the ^{number of atoms in the main chain between adjacent A 1} is within the above range, the rigidity and free volume of the main chain of the compound are further increased, so that a cured product having a higher glass transition temperature and a lower elastic modulus at high temperature can be provided. An optical semiconductor encapsulant having further excellent heat resistance, temperature cycle resistance, solder reflow resistance, yellowing resistance, dimensional stability against temperature change, shock absorption and impact resistance is obtained.

The compound having the structural unit (II) may be a reaction product of an epoxy resin having two or more continuous ring structures (however, oxirane ring is excluded) as described above and an acid anhydride. The acid anhydride for forming the structural unit (II) may be the acid anhydride (a) described above, but may be an acid anhydride other than that.

In the formula (II), A ² represents an organic group. The organic group is a divalent organic group.

It is preferable that carbon number of the said organic group is 2 or more, It is more preferable that it is 6 or more, It is preferable that it is 20 or less, It is more preferable that it is 15 or less, It is still more preferable that it is 10 or less.

As said organic group, a hydrocarbon group is preferable, and hetero atoms, such as an oxygen atom, and unsaturated bonds, such as a double bond, may be included.

The said organic group may have a ring structure, and it is preferable to have a ring structure.

In formula (II), R ^2a represents a moiety containing a residue of an epoxy resin having two or more continuous ring structures (however, oxirane rings are excluded.). About the epoxy resin which has two or more continuous ring structures (however, an oxirane ring is excluded.), it is as above-mentioned.

R ^2a may also include one or more unreacted epoxy groups, and may include a structure in which an epoxy group reacts with another compound (curing agent, curing accelerator, other additive, etc.).

In formula (II), R ^2b represents a hydrogen atom or a bond bonded to ^{R 2a .} When R ^2b is a bond, it ^{bonds with R 2a} to form a ring. R ^2b is preferably a bond bonded to R ^2a.

The compound having the structural unit (III) may be a reaction product of a polyhydric alcohol having a non-aromatic ring and an acid anhydride. The acid anhydride for forming the structural unit (III) may be the acid anhydride (a) described above, or may be an acid anhydride other than that.

In formula (III), A ³ represents an organic group. Examples of the organic group as A ^3, may be mentioned the same organic groups as the above-mentioned A ^2.

In formula (III), R ^3a represents an organic group having a non-aromatic ring. The organic group is a divalent organic group. It is preferable that carbon number of the said organic group is 3 or more, It is more preferable that it is 5 or more, It is still more preferable that it is 6 or more, It is preferable that it is 30 or less, It is more preferable that it is 20 or less.

As said organic group, a hydrocarbon group is preferable, and hetero atoms, such as an oxygen atom, and unsaturated bonds, such as a double bond, may be included.

As a non-aromatic ring which the said organic group has, the thing similar to the non-aromatic ring in the polyhydric alcohol which has a non-aromatic ring mentioned above is mentioned.

R ^3a may be a group obtained by removing two hydroxyl groups from the polyhydric alcohol having a non-aromatic ring described above.

When the resin molding for optical semiconductor sealing of this invention contains the compound which has a structural unit (III), it is preferable to also include the compound which has a structural unit (IV) represented by following formula (IV).

Formula (IV):

(Wherein, A ³ is as described above. R ^4a represents a moiety containing a residue of an epoxy resin. R ^4b represents a hydrogen atom or a bond bonding to ^{R 4a.)}

The compound having the structural unit (IV) may be a reaction product of an epoxy resin and an acid anhydride. The epoxy resin for forming the structural unit (IV) may be an epoxy resin having two or more continuous ring structures (however, except for an oxirane ring) described above, or may be an epoxy resin other than that. In addition, although the acid anhydride (a) mentioned above may be sufficient as the acid anhydride for forming structural unit (IV), other acid anhydrides may be sufficient as it.

In formula (IV), R ^4a represents the site|part containing the residue of an epoxy resin. R ^4a may also include one or more unreacted epoxy groups, and may include a structure in which an epoxy group reacts with another compound (curing agent, curing accelerator, other additive, etc.).

In formula (IV), R ^4b represents a hydrogen atom or a bond bonded to ^{R 4a .} When R ^4b is a bond, it ^{bonds with R 4a} to form a ring.

In the resin molded article for optical semiconductor encapsulation of the present invention, in addition to each of the above components, if necessary, additives such as a color inhibitor, a lubricant, a modifier, a deterioration inhibitor, a mold release agent, a phosphor for changing the wavelength of light, and an inorganic/organic filler for diffusing are used. . In addition, fillers, such as a silica powder, can be mix|blended as long as it is the grade which does not impair the transmission of light.

As a coloring inhibitor, a phenol type compound, an amine type compound, an organic sulfur type compound, a phosphine type compound, etc. are mentioned.

Examples of the lubricant include waxes and talc such as stearic acid, magnesium stearate, and calcium stearate. In addition, when mix|blending the said lubricant, although the compounding quantity is suitably set according to molding conditions, it is suitable to set to 0.1-0.4 mass % of the whole resin molding, for example.

Examples of the phosphor for changing the wavelength of light and inorganic/organic fillers for diffusing light include silica powder such as quartz glass powder, talc, fused silica powder and crystalline silica powder, alumina, silicon nitride, aluminum nitride, silicon carbide, and the like. In addition, when mix|blending a fluorescent substance or an inorganic/organic filler, the compounding quantity is set suitably according to molding conditions. Specifically, in the case of a fluorescent substance, the compounding quantity of a fluorescent substance can be suitably set from the range of 1 mass % - 60 mass % of the whole resin molding. On the other hand, in the case of the filler (organic/inorganic) which diffuses light, the compounding quantity of the filler which diffuses light can be set suitably from 0.5 mass % - 25 mass % of the whole resin molding.

Since the resin molding for optical semiconductor sealing of this invention is used for resin sealing of optical semiconductor elements, such as a light receiving element, a transparent thing is preferable from an optical viewpoint. Here, "transparency" means that the transmittance|permeability in 400 nm of the hardened|cured material of the said molded object is 90 % or more. In addition, the transmittance|permeability in the case of containing additives, such as a fluorescent substance which changes the wavelength of light and an inorganic/organic filler which diffuses the above-mentioned, means the transmittance|permeability of the resin part excluding an additive.

The resin molding for optical semiconductor sealing of this invention is, for example,

A step of kneading a thermosetting resin, a curing agent and a curing accelerator and, if necessary, a polyhydric alcohol to obtain a curable resin composition;

A step of heat-treating the curable resin composition;

A step of granulating the curable resin composition to obtain a granular curable resin composition;

The step of molding the granular curable resin composition

It can manufacture suitably by the manufacturing method containing

Although the method of kneading is not specifically limited, For example, the method of using an extruder, etc. are mentioned. The kneading temperature is not particularly limited, either, and can be appropriately changed depending on the properties of the thermosetting resin.

The shape of the curable resin composition obtained by kneading|mixing is not specifically limited, A film form, a sheet form, a granular form, a block form, etc. are mentioned.

The curable resin composition obtained by kneading|mixing heat-processes and obtains the resin composition for optical semiconductor sealing of B-stage shape (semi-hardened image). The heat treatment temperature and heat treatment time are not particularly limited, and can be appropriately changed depending on the properties of the thermosetting resin.

The heat-treated resin composition is granulated to obtain a granular curable resin composition. Prior to granulation, it may be pulverized using a ball mill, turbo mill, or the like. Although the granulation method is not specifically limited, The method of using a dry compression granulator, etc. are mentioned. Although the average particle diameter of the granular material obtained by granulation is not specifically limited, 1-5000 micrometers is preferable, and 100-2000 micrometers is more preferable. When it exceeds 5000 micrometers, there exists a tendency for a compression rate to fall.

The obtained granular curable resin composition is shape|molded, and a molded object is obtained. A tablet and a sheet|seat are mentioned as a molded object, and tablet molding which obtains a tablet, extrusion molding, etc. which obtain a sheet are mentioned as a shaping|molding method. As described above, since the obtained molded article satisfies the specific relational expression, a cured product having a high glass transition temperature and a low elastic modulus can be provided, and an optical semiconductor sealing material excellent in heat resistance, temperature cycle resistance and solder reflow resistance. can provide

When the molded product is a tablet, the conditions for tableting the tablet are appropriately adjusted according to the composition of the granular curable resin composition, average particle diameter, particle size distribution, etc., but generally the compression ratio at the time of tablet molding is set to 90 to 96%. it is appropriate to That is, when the value of the compression ratio is less than 90%, the density of the tablet is low and there is a risk of cracking easily. Conversely, when the value of the compression ratio is greater than 96%, cracks occur during tableting, and notch or bend at the time of release. because there is a risk of it happening.

The resin molding for optical semiconductor sealing of this invention can seal an optical semiconductor element by molding methods, such as transfer mold molding. The optical semiconductor sealing material obtained by shape|molding the resin molding for optical semiconductor sealing of this invention is also one of this invention. Since the optical semiconductor sealing material of this invention is obtained from the resin molding of this invention, it is excellent in heat resistance, temperature cycling resistance, and solder reflow resistance. In addition, it is excellent in yellowing resistance, dimensional stability against temperature change, shock absorption, and impact resistance. Therefore, there are few cracks and peeling also by use in the environment used as high temperature, and a solder reflow process, and the damage to the optical semiconductor element sealed can be reduced.

In this specification, an optical-semiconductor sealing material is a member which forms so that the optical-semiconductor element which comprises an optical-semiconductor device may be covered, and seals the said element.

An optical-semiconductor device provided with an optical-semiconductor element and the optical-semiconductor sealing material of this invention which seals the said optical-semiconductor element is also one of this invention. Since the optical-semiconductor device of this invention is equipped with the optical-semiconductor sealing material of this invention, even when it operates in the environment used as high temperature, there are few cracks and peeling of a sealing material, and there is little damage to an optical-semiconductor element.

The resin molding for optical semiconductor sealing of this invention can be used especially suitably for the sealing of vehicle-mounted optical semiconductors in many cases used in the environment used as high temperature, and is provided to a solder reflow process in many cases.

Example

Next, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples only.

The materials used are shown below.

Epoxy resin A: triglycidyl isocyanurate (TEPIC-S manufactured by Nissan Chemical Co., Ltd., epoxy equivalent 100)

Epoxy resin B: Bisphenol A type epoxy resin (JER-1002W manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 650)

Epoxy resin C: Epoxy resin represented by the following formula (DE-102 manufactured by JXTG, epoxy equivalent 111)

Epoxy resin D: Epoxy resin represented by the following formula (DE-103 manufactured by JXTG, epoxy equivalent 174)

Acid anhydride A: A mixture of bicyclo[2.2.1]heptane-2,3-dicarboxylic acid anhydride and 5-methylbicyclo[2.2.1]heptane-2,3-dicarboxylic acid anhydride represented by the following formula (Ricaside HNA-100 manufactured by New Japan Rica Co., Ltd., acid anhydride equivalent weight 179)

Acid anhydride B: cis-5-norbornene-exo-2,3-dicarboxylic acid anhydride represented by the following formula

Acid anhydride C: Hexahydrophthalic anhydride (Ricaside HH manufactured by New Japan Rica Corporation)

Diol additive A: neopentyl glycol (manufactured by Mitsubishi Gas Chemical)

Diol additive B: Hydrogenated bisphenol A (Licarbinol HB manufactured by New Japan Rica Co., Ltd.)

Cure accelerator: 2-ethyl-4-methylimidazole

Examples 1 to 16 and Comparative Examples 1 to 2

Each component shown in Tables 1 and 2 was cooled after melt-mixing at 50-140 degreeC in the ratio shown in the same table, and the epoxy resin composition was obtained. The resin tablet for optical semiconductor sealing was produced by performing reactivity adjustment at 40-80 degreeC, grinding|pulverizing and tablet-molding the obtained epoxy resin composition at 40-80 degreeC.

Using the tablets produced in each Example and Comparative Example, various physical properties were measured by the method shown below, and solder reflow resistance and heat hardness were evaluated. The results are shown in Tables 1 and 2.

<Production of test piece (hardening body)>

Using the tablet produced as described above, by molding in a dedicated mold (curing conditions: 150 ° C. x 4 minutes heating), a cured product for a test piece having a size according to the measurement method was produced. By heating this at 150 degreeC for 3 hours, hardening was complete|finished completely, and the test piece was obtained.

<Storage modulus E'>

RSA-II manufactured by RHEOMETRIC SCIENTIFIC using the test piece prepared above (size: width 5 mm x length 35 mm x thickness 1 mm), tensile mode, frequency 1 Hz, scanning temperature 0 to 270 ° C., temperature increase rate 10 ° C./min. Under the measurement conditions of , the storage modulus E' of the test piece was obtained, and the storage modulus of the cured body was derived at the measurement temperatures of 265°C and 100°C.

<Glass transition temperature (Tg)>

RSA-II manufactured by RHEOMETRIC SCIENTIFIC, under the measurement conditions of a tensile mode, a frequency of 1 Hz, a scanning temperature of 0 to 270°C, and a temperature increase rate of 10°C/min. ), the storage modulus E' and the loss modulus E'' were obtained, and the curve of tan δ (=E''/E') was obtained from these, and was calculated|required as the peak top temperature of tan δ.

<Linear transmittance>

First, the inside of the quartz cell was filled with liquid paraffin manufactured by Wako Pure Chemical Industries, Ltd., and the baseline was measured using a spectrophotometer V-670 manufactured by Bunko Corporation, Japan. Thereafter, the test pieces prepared above (size: width 50 mm × length 50 mm × thickness 1 mm) before and after performing the following solder reflow were immersed in liquid paraffin in a quartz cell, and each wavelength (wavelength 300 nm, wavelength 400 nm, wavelength 450 nm) The light transmittance was measured.

<Solder Reflow>

The test piece was passed through a reflow furnace (top peak 265°C x 10 seconds) three times.

<Production of evaluation package>

As shown in Fig. 1, to cover the end of the reliability evaluation frame (Ag) manufactured by Hirai Semitsu Kogyo Co., Ltd., using the tablet prepared above, it was molded into a size: width 5 mm × length 6 mm × thickness 2 mm (curing conditions: 150°C for 4 minutes). By heating this at 150 degreeC for 3 hours, hardening was complete|finished completely, and the evaluation package was obtained. For each Example and Comparative Example, 20 packages were produced.

<Solder reflow resistance>

The package was passed through a reflow furnace (top peak 265°C x 10 seconds) three times. Next, the package was immersed in red ink manufactured by Taiyo Bussan, and the pressure was reduced for 10 minutes. After that, the package was taken out, and the ink penetration was visually observed to determine the package into which the ink had penetrated as defective in peeling. The number of packages with poor peeling among the 20 packages was counted, and solder reflow resistance was evaluated based on the following criteria.

○: 0 to 5

×: 6 or more

<Temperature Cycle Test (TCT)>

The package was exposed to high temperature (130° C.) and low temperature (-40° C.) for 15 minutes each. Return to each temperature was completed within 5 minutes. By setting this as 1 cycle, the temperature cycle test of 1000 cycles was performed with respect to the said package. Thereafter, the package was taken out, the presence or absence of cracks was observed, the number of cracked packages among 20 packages was counted, and the following criteria were evaluated.

○ to 5

×: 6 or more

<Hardness at ten o'clock>

With respect to the test piece prepared above (size: width 50mm × length 50mm × thickness 3mm) at 200 ℃ to measure the hardness of the Shore A hardness tester, and evaluated according to the following criteria.

○: Heat hardness less than 70

×: heat hardness 70 or more

This invention relates to the resin molding for optical-semiconductor sealing used for sealing of an optical-semiconductor element, an optical-semiconductor sealing material, and an optical-semiconductor device, It can utilize for manufacture of an optical-semiconductor device.

Claims (11)

A resin molding for optical semiconductor encapsulation that satisfies the following relational expression (1).
0.0005≤E' _265℃ /E' _100℃ ≤0.0050 (1)
(Wherein, E′ _{265° C.} and E′ _{100° C.} represent the storage modulus (Pa) at 265° C. and 100° C. of the cured body (size: width 5 mm×length 35 mm×thickness 1 mm) obtained by the following method, respectively.)
(Manufacturing method of hardening body)
A resin molding is heated and molded at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product. The resin for optical semiconductor encapsulation according to claim 1, wherein the glass transition temperature is 130° C. or higher when a cured body (size: width 5 mm×length 35 mm×thickness 1 mm) is obtained by the above method, and also satisfies the following relational expression (2) molding.
Y<160000X-1450000 (2)
(Wherein, X represents the glass transition temperature (°C) of the cured body, and Y represents the storage elastic modulus (Pa) at 265°C of the cured body.) The resin molding for optical semiconductor encapsulation according to claim 1 or 2, which satisfies the following relational expressions (3) and (4).
Y<6300000(130≤X<150) (3)
Y<160000X-17000000(150≤X≤190) (4)
(In each formula, X represents the glass transition temperature (°C) of the cured body obtained by the above method (size: width 5 mm×length 35 mm×thickness 1 mm), and Y represents the storage modulus (Pa) of the cured body at 265° C. indicate.) The resin molded product for optical semiconductor encapsulation according to any one of claims 1 to 3, which satisfies the following relational expression (5).
0.70<R _450nm <1.00 (5)
(wherein, R _{450 nm} is the ratio of the linear transmittance at a wavelength of 450 nm before and after implementation when solder reflow is performed three times at 265° C. on the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) (After/before implementation) is indicated.) The resin molded article for optical semiconductor encapsulation according to any one of claims 1 to 4, which satisfies the following relational expressions (6) and (7).
0.80<R _400nm /R _450nm <1.00 (6)
0.10<R _300nm /R _450nm <0.50 (7)
(In each formula, R _{300 nm} , R _{400 nm} and R _{450 nm} are each of the cured body obtained by the above method (size: width 50 mm × length 50 mm × thickness 1 mm) when solder reflow is performed 3 times at 265°C, before and after implementation The ratio of the linear transmittance at wavelengths of 300 nm, 400 nm and 450 nm (after/before implementation) is shown. The optical semiconductor encapsulation according to any one of claims 1 to 5, wherein the linear transmittance at a wavelength of 450 nm is 70% or more when a cured body (size: 50 mm width × 50 mm length × 1 mm thickness) is obtained by the above method. resin molding. The resin molding for optical semiconductor encapsulation in any one of Claims 1-6 containing a thermosetting resin, a hardening|curing agent, the reaction product of a thermosetting resin and a hardening|curing agent, and a hardening accelerator. The resin molding for optical semiconductor encapsulation according to claim 7, further comprising a polyhydric alcohol and a reaction product of the polyhydric alcohol and a curing agent. The compound according to any one of claims 1 to 8, having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and the following formula ( The resin molding for optical semiconductor encapsulation containing at least 1 sort(s) selected from the group which consists of a compound which has a structural unit (III) represented by III).
Formula (I):

(Wherein, A ¹ represents an organic group containing two or more ring structures. R ^1a represents a moiety containing a residue of an epoxy resin. R ^1b represents a hydrogen atom or a bond bonded to ^{R 1a.} )
Formula (II):

(Wherein, A ² represents an organic group. R ^2a represents a moiety containing a residue of an epoxy resin having two or more continuous ring structures (however, oxirane rings are excluded). R ^2b is a hydrogen atom , or R ^2a and represents a bond.)
Formula (III):

(In the formula, A ³ represents an organic group. R ^3a represents an organic group having a non-aromatic ring.) The optical-semiconductor sealing material obtained by shape|molding the resin molding for optical-semiconductor sealing in any one of Claims 1-9. An optical-semiconductor device provided with the optical-semiconductor element and the optical-semiconductor sealing material of Claim 10 which seals the said optical-semiconductor element.

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