KR20220029857A - Compression molding apparatus - Google Patents

Abstract

The present invention relates to a compression molding apparatus having a minimized size, facilitating adjustment of a clamping pressure and a molding pressure as needed, and capable of measuring the molding pressure in a cavity. According to the present invention, the compression molding apparatus comprises: an upper mold having a substrate mounting part on which a molding substrate is mounted; a lower mold including a cavity block forming the bottom surface of a cavity accommodating molding powder to mold a circuit part of the molding substrate and a clamping block facing the upper mold to clamp the molding substrate of the upper mold and forming a side surface of the cavity; a master die including a moving block mounted to move up and down from the lower part of the cavity block and a molding driving part adjusting the lifting height of the moving block to press the cavity block; an elevation plate mounting the master die thereon; and a clamping driving part lifting the elevation plate to clamp the clamping block of the lower mold and the molding substrate.

Description

Compression molding equipment {COMPRESSION MOLDING APPARATUS}

The present invention relates to a compression molding apparatus. More particularly, the present invention relates to a compression molding apparatus capable of easily adjusting the clamping pressure and the molding pressure as necessary while minimizing the size, and measuring the molding pressure actually applied in a cavity during molding. .

The compression molding device performs molding by placing the substrate on the upper mold, applying the molding powder to the cavity of the lower mold, and then applying the clamping pressure to the cavity of the lower mold while clamping the upper and lower molds. is a device that In general, molding is performed to protect the semiconductor chip or circuit part bonded to the substrate from the external environment, and TTV (Total Thickness Variation) is used as an index to evaluate the molding quality during molding, and the specifications required for molding quality are gradually increasing. getting smaller TTV means the difference between the minimum and maximum values of the thickness of the entire molding part when the thickness is measured in the thickness direction of the molding part based on the back surface of the substrate.

It is important to secure the flatness of the molding apparatus in order to perform flat molding with a small TTV difference. A general molding apparatus molds at high temperature and high pressure, and each heater is provided inside the mold to control the temperature to match the substrate of the upper mold and the molding powder of the lower mold to a uniform temperature. The temperature emitted by the heater is different from the surface temperature due to a loss value in the process of transferring the temperature to the substrate and the molding powder. Since the different thermal expansion values affect the parallelism of the mold, it is difficult to clamp with a uniform force.

Accordingly, in order to provide a uniform clamping balance in the compression molding apparatus, a clamping pressure large enough to straighten the deformed mold is required. However, since the conventional compression molding apparatus operates together without separating the clamping pressure and the molding pressure, the clamping pressure and the molding pressure cannot be separately controlled, and when the clamping pressure is increased, the molding pressure is also proportionally increased. If the molding pressure is increased, the substrate or chip may be broken or deformed. In addition, there is a problem in that an expensive high-quality film must be used to prevent the release film from tearing when the molding pressure is increased. In addition, since it is difficult to distinguish between the clamping pressure and the molding pressure because the clamping pressure is applied even when the molding pressure is applied, it is impossible to accurately measure the respective pressures.

Even when using the concept of separating the clamping drive and the shaping drive in the compression molding device and having them provided together in the lower part of the lower mold, the overall size of the lower mold becomes too large because the clamping drive has to be increased to increase the clamping pressure, and the size of the mold In the case of reducing the clamping drive unit in consideration of

On the other hand, when a hydraulic servo motor or a hydraulic cylinder is used as the forming pressure driving unit, it is difficult to uniformly apply the forming pressure due to the inclination of the cylinder rod, and there is a problem in that it is difficult to accurately control the forming pressure.

The greater the clamping pressure during molding, the better the clamping balance can be secured. However, in order to mold the molding substrate and the molding powder, it is necessary to use the appropriate molding pressure not to damage the material to be molded, so that the molding pressure does not increase in proportion to the clamping pressure. It must be separated from the clamping pressure, and it is necessary to measure the forming pressure applied during actual forming in order to form with an appropriate forming pressure.

In addition, if too strong a clamping pressure is applied regardless of the size of the substrate or the characteristics of the material, it may affect the substrate and the material. need.

An object of the present invention is to provide a compression molding apparatus capable of easily adjusting the molding pressure as necessary while minimizing the size and measuring the molding pressure actually applied in a cavity during molding.

In addition, an object of the present invention is to solve the problem that the initial step of the cavity can be adjusted and that a large molding pressure can be applied to the cavity even with a small pressure of the driving device.

In addition, the present invention aims to solve the problem that the clamping pressure can be adjusted according to the size of the substrate or the characteristics of the material.

In order to solve the above problems, the present invention provides an upper mold having a substrate mounting unit on which a molding substrate is mounted; a cavity block forming a bottom surface of a cavity for accommodating molding powder for molding the circuit portion of the molding substrate; and a clamping block disposed opposite the upper mold to clamp the molding substrate of the upper mold and forming a side surface of the cavity; A lower mold provided; a master die having a moving block mounted so as to be elevating and lowering from the lower portion of the cavity block, and a forming driving unit for pressing the cavity block by adjusting the elevating height of the moving block; and a lifting plate for mounting the master die thereon. and a clamping driving unit for lifting and lowering the lifting plate in order to clamp the clamping block of the lower mold and the molding substrate, wherein the forming driving unit is provided under the moving block and the lifting height of the moving block according to the forward/backward operation Compression, characterized in that it consists of a sliding block having an inclined surface for adjusting the sliding block, a moving unit in contact with the inclined surface of the sliding block, and a driving device provided on one side of the sliding block for horizontally transporting the sliding block A molding device may be provided.

In addition, the molding driving unit may further include a load cell provided on one side of the driving device to measure the molding pressure applied to the cavity block.

And, the molding driving unit, an upper moving unit in contact with the upper surface of the sliding block; a lower moving unit in contact with a lower surface of the sliding block; and a sliding block having an inclined surface formed to be inclined so as to decrease in thickness from one side to the other, the sliding block being provided so as to be able to move forward and backward in a horizontal direction between the upper moving unit and the lower moving unit, wherein the sliding block moves forward. By raising the upper moving unit to raise the moving block, and lowering the upper moving unit to lower the moving block when moving backward, the height of the cavity block is adjusted, and the upper moving unit in contact with the sliding block and the At least one contact surface of the lower moving unit, the upper surface of the sliding block and the lower surface of the sliding block, a friction force reducing member for minimizing the frictional force with the sliding block may be formed.

Here, a roller or a Teflon member may be provided on an upper surface of the sliding block, a lower surface of the sliding block, and a contact surface of at least one of the upper moving unit and the lower moving unit.

In this case, the frictional force reducing member is a moving frame having a receiving groove therein; a roller frame provided in the receiving groove and on which a plurality of rollers are mounted; and an elastic member mounted between the moving frame and the roller frame, wherein the roller frame may be provided so as to be able to move up and down in the receiving groove of the moving frame by the elastic member.

In addition, the upper surface of the sliding block is a horizontal surface, the lower surface of the sliding block has an inclined surface formed to decrease in thickness as it goes away from the sliding drive device, and the inclined surface may form a predetermined angle (θ°) from the ground. .

Here, the predetermined angle (θ°) is less than 45°, and by changing the size of the predetermined angle, it may be possible to adjust the size of the molding pressure applied by the sliding block.

In addition, the predetermined angle (θ°) is less than 45°, the molding pressure applied from the driving device = the molding area x the pressure required for molding x tan(θ), and when the moving block is supported by the return spring, , molding pressure applied from the driving device = (molding area x pressure required for molding x tan(θ)) + (reaction force of the return spring x tan(θ)).

And, the driving device can adjust the strength of the molding pressure applied to the cavity block by adjusting the forward distance of the sliding block.

Here, the driving device adjusts the forward distance of the sliding block to set the initial thickness of the cavity before molding, and molds the upper mold and the lower mold to clamp the molding substrate and the clamping block. By further moving forward by a set distance, a preset molding pressure may be applied.

In this case, the shaping driving unit further includes an encoder for measuring the position value of the sliding block, and the moving distance of the sliding block can be known through the position value measured from the encoder.

In addition, the clamping driving unit is a toggle link type mold clamping mechanism, and when the upper mold and the lower mold are molded by the clamping driving unit and the molding substrate and the clamping block are clamped, the sliding block is moved forward by the molding driving unit Thus, a molding pressure may be applied to the cavity.

Here, the lower mold is provided with a lower balance block protruding from the outer periphery of the clamping block, and the upper mold is formed to protrude at a position corresponding to the lower balance block so that the upper mold and the lower mold are molded to form the upper mold. It may include a lower mold and an upper balance block coupled to the lower balance block when the molding substrate is clamped.

In addition, a plurality of substrate mounting parts are provided in the upper mold, and an upper balance block is formed to protrude between each of the substrate mounting parts, and a plurality of cavity blocks are provided in the lower mold to correspond to the number of molding substrates mounted on each substrate mounting part; Each of the clamping blocks is provided, and a lower balance block protrudingly formed at a position corresponding to the upper balance block and coupled to the upper balance block is further provided, wherein the master die has the number of molding substrates mounted on each substrate mounting unit. Correspondingly, a plurality of moving blocks is provided, and the molding driving unit is provided under each moving block to correspond to the number of the molding substrates to independently elevate the moving blocks.

The lower mold may include a lower base frame provided under the clamping block and provided with a plurality of elastic members to which clamping pressure by a clamping driving unit is transmitted; a connection member provided on each of the elastic members to transmit the clamping pressure to the clamping block; and a spacer plate interposed between the lower base frame and the clamping block, the spacer plate having a groove penetrating through an upper portion of at least one of the plurality of connection members, and a spacer inserted into the groove, , it is possible to adjust the clamping pressure transmitted to the clamping block by changing the thickness of the spacer inserted into the groove.

Here, a plurality of the grooves are provided, and the spacer includes a spacer having the same thickness as that of the spacer plate and a spacer smaller than the thickness of the spacer plate, and as the size of the substrate to be molded increases, the thickness of the spacer plate and the The number of grooves into which the same spacer is inserted may increase, and a spacer having a thickness smaller than that of the spacer plate may be inserted into the remaining grooves, or a spacer may not be inserted.

In this case, a lower vacuum block is protruded from the outer periphery of the lower mold, and an upper vacuum block is protruded from the outer periphery of the upper mold at a position corresponding to the lower vacuum block, and the lower vacuum block and the upper vacuum A vacuum is formed in the upper mold and the lower mold in a state in which the blocks are combined, and the lower vacuum block includes a vacuum block plate; a lifting plate mounted to be liftable from an upper portion of the vacuum block plate and having a sealing member on a lower surface thereof; and an elastic member mounted between the vacuum block plate and the lifting plate.

In addition, the lower vacuum block has a plurality of through-holes formed inside the lifting plate, is inserted and mounted in the through-hole, is connected to the vacuum block plate, and is a guide for guiding the lifting and lowering of the lifting plate by the elastic member A pin is further provided, and the guide pin may be replaced with a guide pin of a different length so as to control the vacuum forming time inside the upper mold and the lower mold.

According to the compression molding apparatus according to the present invention, the molding driving part and the clamping driving part are separated into separate driving parts, but by arranging them at different heights, the clamping pressure can be increased without increasing the size of the lower mold, thereby securing the clamping balance. There are advantages.

In addition, according to the compression molding apparatus according to the present invention, the molding driving part constituting the lower mold is completely separated from the clamping driving part, and a molding pressure is applied to the cavity of the lower mold by using a sliding block that is driven forward and backward in the horizontal direction of the inclined surface structure. In addition, the depth of the cavity required during molding can be controlled by the forward and backward sliding distance of the sliding block.

In addition, according to the compression molding apparatus according to the present invention, since the depth of the cavity of the lower mold can be adjusted, it is possible to control the step difference and the molding pressure in the initial stage of the molding process, and a load cell is provided on one side of the sliding block to be applied into the actual cavity. It has the effect of being able to measure the pure molding pressure.

In addition, since the molding pressure measured in the load cell is received as a tan(θ) value through the inclined portion of the sliding block, the impact and load applied to the load cell can be reduced.

In addition, according to the compression molding apparatus according to the present invention, since the molding pressure is applied to the sliding block having an inclined surface structure, it is possible to sufficiently amplify the molding pressure applied to the cavity even with a small driving force for the sliding block.

In addition, according to the compression molding apparatus according to the present invention, in order to reduce friction between the upper surface or the lower surface of the sliding block having an inclined surface structure, a friction reducing member such as an elastic support roller or a Teflon member is formed in a structure supporting the sliding block. Smooth sliding is possible by minimizing frictional force during the forward and backward sliding motion of the sliding block.

In addition, according to the compression molding apparatus according to the present invention, even if the clamping pressure applied to the upper mold is increased, each balance block is provided in the upper mold and the lower mold to provide a uniform clamping balance and maintain the parallel state (balance) of the mold can

In addition, according to the compression molding apparatus according to the present invention, it is possible to selectively adjust the clamping pressure provided by the clamping drive unit through the elastic member according to the size of the molding substrate or the characteristics of the material.

In addition, the compression molding apparatus according to the present invention can control the vacuum forming time inside the mold by adjusting the length of the guide pin mounted on the vacuum block for forming the vacuum.

1 and 2 show a front view and a side view of the compression molding apparatus according to the present invention, in which the upper mold on which the molding substrate is mounted and the lower mold with the molding powder supplied to the cavity are spaced apart.
3 is a perspective view of a lower mold of the compression molding apparatus according to the present invention.
4 and 5 are front and side views of the compression molding apparatus shown in FIGS. 1 and 2 in a state in which the lower mold approaches the upper mold and is clamped (mold).
6 and 7 show that the inner end of the sliding block constituting the molding driving unit provided in the master die of the compression molding apparatus in the clamping state of the upper mold and the lower mold shown in FIGS. 4 and 5 is a moving unit provided in the master die. It shows a front view and a side view of a state in which a molding pressure is applied into the cavity in a state in which it is propelled through.
8 and 9 show a front view and a side view of a state in which the sliding block retracts and the molding pressure is released to the cavity of the lower mold after the molding process shown in FIGS. 6 and 7 is completed.
10 and 11 show a front view and a side view of a state in which the lower mold is separated from the upper mold and lowered after the compression molding process is completed.
12 is a cross-sectional view in three directions of an upper moving unit or a lower moving unit constituting the moving unit provided in the master die of the compression molding apparatus according to the present invention.
13 to 14 show a master die to which various types of sliding blocks are applied.
15 shows a cross-sectional structure of a lower mold capable of adjusting a clamping pressure according to the size of a molding substrate.
16 shows a plan view of a spacer plate with replaceable spacers for adjusting the clamping pressure under the clamping block;
17 shows the driving state of the lower mold in the clamping state or the molding forming state when a large-size molding substrate requiring a relatively large clamping pressure is applied.
18 shows the driving state of the lower mold in the clamping state or the molding forming state when a small-sized molding substrate requiring a relatively small clamping pressure is applied.
19 and 20 show the operation state of the vacuum block for vacuuming the inside of the mold in the molding process through the compression molding apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed subject matter may be thorough and complete, and the spirit of the invention may be sufficiently conveyed to those skilled in the art. Like reference numbers refer to like elements throughout.

1 and 2 show a compression molding apparatus according to the present invention in which the upper mold 100 on which the molding substrate ms is mounted and the lower mold 200A supplied with the molding powder to the cavity C are oppositely arranged and spaced apart from each other. (1) shows a front view and a side view, and FIG. 3 shows a perspective view of the lower mold 200A and the master die of the compression molding apparatus 1 according to the present invention.

The present invention is an upper mold 100 having a substrate mounting portion on which a molding substrate (ms) is mounted; A cavity block 210 forming a bottom surface of a cavity C for accommodating a molding powder mp for molding a circuit portion of a molding substrate mounted on the upper mold 100, and disposed opposite to the upper mold, the upper a lower mold (200A) having a clamping block (220) for clamping the molding substrate of the mold and forming a side surface of the cavity (C); A master die 200B having a moving block 250 mounted so as to be elevating and lowering from the lower portion of the cavity block, and a forming driving unit 400 for pressing the cavity block by adjusting the elevating height of the moving block; and a lifting plate 310 for mounting the master die thereon; There is provided a compression molding apparatus (1) including a clamping block of the lower mold and a clamping drive unit (300) for lifting and lowering the lifting plate to clamp the molding substrate.

In the compression molding apparatus of the present invention, the molding driving unit 400 is provided under the moving block and has a sliding block 410 having an inclined surface for adjusting the elevation height of the moving block according to the forward/backward operation. It may be composed of a moving unit in contact with the inclined surface of the block, and a driving device provided on one side of the sliding block 410 to horizontally transport the sliding block.

Conventionally, in order to provide the clamping pressure required for compression molding and the molding pressure for molding molding, a single clamping driving unit is used to adjust the stroke amount, or an elastic member is provided to combine the clamping pressure and the molding pressure in the clamping driving unit. It was not possible to separate the clamping pressure and the forming pressure using the method of application.

In order to separate the clamping pressure and the molding pressure, since the clamping driving unit 300 and the molding driving unit 400 are provided together on the same plane at the lower part of the lower mold of the compression molding apparatus 1, the required clamping pressure is In order to increase the size, there is a problem in that the size of the lower mold 200A is also increased in conjunction so as not to interfere with the position and interference of the molding driving part, and there is a restriction.

However, in the compression molding apparatus 1 according to the present invention, the molding driving unit 400 is provided under the lower mold 200A, and the clamping driving unit is provided at the lower portion of the molding driving unit 400, and the clamping driving unit 300 and By separating the forming driving unit 400 and arranging it in different layers, even if the clamping pressure increases, there is no spatial restriction on the position of the forming driving unit, thereby minimizing an increase in the size of the lower mold.

On the other hand, an upper mold 100 having a substrate mounting unit 110 on which a molding substrate ms is mounted is disposed on the upper portion of the compression molding apparatus 1 shown in FIG. 1 , and the molding powder mp is accommodated in the lower portion A lower mold 200A having a cavity C to be used may be disposed. In the present invention, the lower mold 200A includes a cavity block for forming a bottom surface of a cavity for accommodating molding powder to mold a circuit portion of a molding substrate, and a clamping block for clamping the molding substrate and forming a side surface of the cavity.

In the semiconductor molding process, a molding target molding substrate (ms) is mounted on the substrate mounting part of the upper mold 100, a molding powder (mp) is applied to the cavity (C) of the lower mold 200A, and then the heated upper mold 100 ) and the heated lower mold 200A, the clamp block clamps the molding substrate (ms) firmly, and pressurizes it with a cavity block to melt the molding powder (mp) with high temperature and high pressure to melt the circuit part of the molding substrate (ms) It is a process of molding with a surrounding molding part.

In order to perform this molding process, first, a clamping process for clamping the upper mold 100 and the lower mold 200A on which the molding substrate ms are mounted, a vacuuming process for vacuuming the inside of the upper mold and the lower mold, and a cavity C ), a molding process of applying a molding pressure to the inside, etc. may be sequentially performed.

Among the respective processes, the clamping process is performed by the clamping driver 300 provided at the lower portion of the lower mold 200A, and the clamping driver may lift the lower mold toward the upper mold.

In the conventional compression molding device 1, the clamping driving unit 300 and the molding driving unit are disposed together on the same plane under the molding device to install a large-sized clamping driving unit 300 to increase the clamping pressure. However, in the compression molding apparatus 1 according to the present invention, the entire master die 200B applying a molding pressure in the cavity of the lower mold 200A and the lower mold is mounted on the clamping drive unit 300 so that it is mounted on the upper part. The size of the lower mold 200A can be properly maintained.

In the present invention, each component has been described by classifying it into a lower mold 200A and a master die 200B in order to facilitate description of functions and structures, but as shown in FIG. 3 , a lower mold 200A and a master die 200B ) can be called the lower mold together in a large sense.

The lower mold 200A may be lifted and driven by a clamping driving unit 300 provided under the lower mold 200A, and as shown in FIG. 2 , the clamping driving unit 300 is formed between the lower mold 200A and the lower mold. A lifting plate 310 on which the master die 200B disposed on the lower portion is stacked and mounted, and a lifting driving device 330 for lifting and lowering the lifting plate 310 may be provided. Here, various driving methods such as a toggle driving method and a hydraulic cylinder may be applied to lift and lower the lifting plate, and may be appropriately selected according to the characteristics of the molding apparatus such as a required clamp pressure.

The upper mold 100 has a substrate mounting unit 110 for mounting the molding substrate ms by a method such as vacuum adsorption, and is formed protruding around the substrate mounting unit 110 and provided by the clamping driver 300 . The upper balance block 130 for dispersing the pressure and maintaining and fixing the equilibrium state of the clamping is formed to protrude, and it is provided around the upper balance block 130 to vacuum the inside of the cavity C where the molding process is performed. A vacuum block 140 for this may be provided.

That is, the vacuum block is provided on the outer periphery of the upper mold, and the upper balance block and the substrate mounting part are disposed inside the vacuum block. When a plurality of substrate mounting units are provided in the present invention, the upper balance block is preferably formed to protrude between each of the substrate mounting units.

The lower mold 200A is a cavity block 210 to which molding powder (mp) is applied and forms a bottom surface of the cavity (C), and is provided around the cavity block 210 and is a molding mounted on the upper mold 100 . A clamping block 220 for clamping the edge of the substrate ms, is disposed around the clamping block 220, and the clamping driving unit 300 in the process of clamping the lower mold 200A to the upper mold 100 ), the lower balance block 230 and the lower balance block 230 that are coupled and supported with the upper balance block 130 of the upper mold 100 in order to distribute the clamping pressure provided in and to maintain and fix the clamping equilibrium state. ) provided around, coupled to and supported with the vacuum block 140 of the upper mold 100 and may include an upper vacuum block 240 and the like for vacuuming the inside of the mold.

That is, a vacuum block is provided on the outer periphery of the lower mold, and a lower balance block and a substrate mounting part are disposed inside the vacuum block. In the case of molding a plurality of substrates in the present invention, it is preferable that a plurality of cavities for molding each substrate are provided equal to the number of substrates, and the lower balance block is preferably formed to protrude between each clamping block. .

Since the upper mold and the lower mold are molded to each other to perform a molding process, they are disposed to face each other, the upper vacuum block and the lower vacuum block are disposed at positions opposite to each other, and the upper balance block and the lower balance block are opposite to each other It is preferable to be placed in

In addition, in the compression molding apparatus 1 according to the present invention, since the clamping pressure is applied by the clamping driving unit, and the molding forming pressure is applied by the molding driving unit, the lower mold 200A approaches the upper mold 100 side. Thus, after the upper mold and the lower mold are molded and the clamping process is completed, the molding driving unit 400 for providing a molding pressure for the molding process in the cavity C may be provided.

1 to 3 , the molding driving unit 400 is provided in the master die 200B, and may be configured to apply a molding pressure to the cavity block of the lower mold 200A.

The master die 200B includes a moving block mounted so as to be elevating and lowering from the lower portion of the cavity block, and a forming driving unit for pressing the cavity block by adjusting the elevating height of the moving block.

The molding driving unit 400 may lift and drive the cavity block 210 to compress the inside of the cavity C of the lower mold 200A, and adjust the elevation height of the moving block provided at the bottom of the cavity block. The molding pressure applied to the inside of the cavity can be adjusted. To this end, the forming driving unit includes a sliding block provided under the moving block and having an inclined surface for adjusting the elevation height of the moving block according to a forward and backward motion, a moving unit in contact with the inclined surface of the sliding block, and the sliding It is provided on one side of the block and may be configured as a driving device for horizontally transporting the sliding block.

Preferably, the shaping driving unit comprises: an upper moving unit in contact with the upper surface of the sliding block; a lower moving unit in contact with a lower surface of the sliding block; and a sliding block having an inclined surface formed to be inclined so as to decrease in thickness from one side to the other, the sliding block being provided so as to be able to move forward and backward in a horizontal direction between the upper moving unit and the lower moving unit, wherein the sliding block moves forward. By raising the upper moving unit to raise the moving block, and lowering the upper moving unit to lower the moving block when moving backward, the height of the cavity block is adjusted, and the upper moving unit in contact with the sliding block and the At least one contact surface of the lower moving unit, the upper surface of the sliding block and the lower surface of the sliding block, a friction force reducing member for minimizing the frictional force with the sliding block may be formed.

The sliding block is configured to move forward or backward in the inner horizontal direction of the master die 200B to press the cavity block of the lower mold to apply a molding pressure.

At this time, the strength of the molding pressure applied to the cavity block may be adjusted by adjusting the forward distance of the sliding block, and the initial thickness of the cavity before molding may be set, and then the predetermined molding pressure may be applied by further moving forward by a predetermined distance. You may.

The preset distance and forward distance adjustment may be performed by adjusting the motor value of the driving device, and an encoder for measuring the position value of the sliding block is provided and the movement distance, forward distance, etc. of the sliding block through the position value measured from the encoder may know

The molding driving unit 400 shown in FIGS. 1 to 3 propels the sliding block 410 to propel the moving block 250 and the cavity block 210 provided thereon to form the cavity (C) inside. pressure can be provided.

The molding driving unit 400 is a driving device that provides a driving force for horizontally transporting the sliding block 410 and is provided on one side of the driving device to measure the magnitude of the driving force, that is, the molding pressure applied to the cavity block. A load cell 420 may be provided.

Conventionally, since the clamping drive unit and the forming drive unit are provided on the same plane in the molding device, the forming pressure could not be measured alone. Even if the forming pressure is measured, the clamping pressure is reflected. This was impossible. In addition, in order to measure the molding pressure, it is necessary to measure the pressure applied to the cavity of the mold, but it is difficult to install the measuring device inside the mold. The burden is high, and frequent replacement is inevitably required due to breakdown or damage.

On the other hand, in the present invention, in determining the magnitude of the force (F) applied to the load cell, the size (F') of the molding load to be applied to the cavity is determined through the required molding pressure (P) and the cavity area (A). Then, the magnitude of the forming load (F') is multiplied by the tangent tan (θ) value according to the inner end angle (θ, radian) of the sliding block, and the force or load ( F) can be determined.

That is, the magnitude of the force to be provided to the sliding block 410 in the driving device may be determined by the following equation.

-under -

F = F' Х tan(θ)

Here, F is the horizontal force that can be measured with the load cell and provided to the sliding block, θ is the angle of the inner end of the sliding block, which is less than 45°, and F′ is the molding pressure required in the compression molding process within the cavity. am.

Therefore, the molding pressure applied from the driving device can be obtained through the molding area X the pressure required for molding X tan(θ).

If the moving block raised by the sliding block is supported by the return spring 253, it is enough to apply more molding pressure as much as the reaction force of the return spring. The return spring may be provided to facilitate the lowering of the raised cavity block after molding, and if the moving block is supported by the return spring, the reaction force of the return spring should also be considered when calculating the molding pressure.

Accordingly, the molding pressure applied from the driving device can be obtained through (molding area X pressure required for molding X tan(θ)) + (reaction force of the return spring X tan(θ)).

This will be described in detail using numerical examples as an example.

If the molding area size of 77.5x240mm PCB is 70.3x236.7mm and the recommended molding pressure is 70kg/ccm2, A = 70.3x236.7 = 166.40 ccm2 and the required force is 166.40*70 = 11.648 ton. Here, when the angle of the sliding block is 4˚, the driving device may be driven with a force of 11.648Ton x TAN4 = 0.814Ton.

Here, if it is necessary to reflect the reaction force of the return spring and the weight of the structure, the force acting on the driving device can be calculated using the reaction force of the return spring and the weight of the structure.

For example, if four springs capable of lifting 20kg are used as return springs in the molding device, the reaction force of the return spring is 80kg, and assuming that the weight of the structure is 18kg, the force acting on the driving device is 0.814Ton obtained above. It becomes 0.821Ton by adding 0.007Ton.

The weight of the return spring and structure does not change if the parts are not changed, so whenever the molding pressure needs to be newly set (molding It can also be added to the calculated value of area x molding pressure x tan (θ).

On the other hand, in the present invention, the force (F) applied to the load cell is transmitted through the sliding block 410 so that a force smaller than the size (F') of the forming load can be applied to the load cell, so that a load cell with a small capacity can be used and overload. It is possible to prevent the deformation and damage of the load cell due to high temperature and pressure, and it is possible to prevent the deformation of the load cell due to high temperature and high pressure because the load cell can be installed outside the mold.

Similarly, since the molding pressure is applied through the sliding block having an inclination, even if a small molding pressure is applied from the driving device, a larger molding pressure can be applied to the actual cavity block, and the inclination angle of the sliding block is changed. Thus, the size of the molding pressure applied by the sliding block can be adjusted.

To explain this in more detail, the force acting on the sliding drive device and the molding pressure applied to the cavity by the sliding block and the moving unit vary depending on the slope, and the angle between the sliding block and the moving unit makes the drive device with a small output. It can be used to deliver a large molding pressure to the cavity. Therefore, if the actual forming load does not reach the target load due to the output limit of the driving device, the driving device should be replaced to have a larger output value. However, in the present invention, the sliding block and the moving block are driven by changing the inclination angle Target forming loads can be created without replacing the device.

As shown in FIG. 3 , the driving device includes a driving motor 430 , a driving belt 440 for transmitting the driving force of the driving motor 430 , and a sliding block for rotating driving force transmitted to the driving belt 440 . It may include a conversion unit 450 such as a ball screw that converts the forward and backward driving force of 410, but this is only an example and is not limited thereto as long as it is a configuration capable of driving the sliding block forward and backward. Similarly, the driving device of the forming driving unit is mounted on one side of the master die, but the present invention is not limited thereto and may be provided on the upper portion of the lifting plate.

In addition, the load cell 420 for measuring the driving force provided to the sliding block 410 from the driving device of the shaping driving unit 400 is one side of the sliding block, or one side of the driving device, or the driving device and the sliding block ( 410) may be provided between.

The load cell 420 may be configured to measure the driving force provided to the sliding block 410 to measure the molding pressure applied to the cavity C by the cavity block 210 .

In addition, the sliding block 410 is configured to be easily separated from the moving unit, so that it is possible to perform a grease or lubricating oil operation to prevent friction and noise.

4 and 5 show a front view and a side view of a state in which the lower mold 200A of the compression molding apparatus 1 according to the present invention shown in FIGS. 1 and 2 approaches the upper mold 100 and is clamped.

As described above, in the lower mold 200A, a clamping block 220 for clamping the molding substrate ms mounted on the upper mold 100 is provided around the cavity block 210 to form the side surface of the cavity. At the same time, when the upper mold and the lower mold are molded together, the clamping block 220 may clamp the edge of the molding substrate ms to the upper mold.

As described above, the clamping block 220 requires a clamping pressure to stably clamp the molding substrate ms, and the clamping pressure may be provided by the clamping driver 300 .

In addition, the clamping pressure provided by the clamping driving unit 300 is used as the supporting force of the molding substrate (ms) through the clamping block 220, and the deviation of this clamping pressure by region is the upper mold 100 and the lower mold 200A. ) and dispersed by the lower balance block 230 having a structure that is supported by each other during clamping, it is possible to maintain and fix the clamping equilibrium.

If the balance of the mold is not balanced on one side due to differences in thermal expansion of the mold, for example, if the upper or lower mold is tilted, the balance block of the upper mold and the balance block of the lower mold, which maintain a constant height, are 300), it is possible to maintain the balance and equilibrium of the mold by correcting the deformation of the mold while sustaining the strong force transmitted from it.

That is, the clamping block and the vacuum block maintain a deformed state by changing their height due to elasticity when the force of the clamp driving unit 300 is transmitted, but the balance block does not change in height between the clamp driving unit 300 and the balance block. The force acting from the clamp driving unit 300 can be fully received, so that the balance of the mold can be constantly maintained. Therefore, with strong clamping pressure, it is possible to overcome inclination and imbalance due to the difference in thermal expansion between the upper and lower molds. It is possible to maintain the parallel state of the mold according to the pressure.

In addition, after clamping is completed, the vacuum block 240 provided around the lower balance block 230 of the upper mold 100 and the lower mold 200A can vacuum the inner space of the cavity (C) in a mutually supported state. A negative pressure may be applied through a pneumatic line (not shown) connected to the inside of the lower mold 200A. For reference, during molding, the inside of the upper mold and the lower mold should be formed in a vacuum state in order to secure the molding quality. If air is left inside the mold, air bubbles and voids may occur during molding.

And, the compression molding apparatus 1 according to the present invention separates the clamping driving unit 300 and the forming driving unit 400 that provide the clamping pressure required in the clamping process and the forming pressure required in the forming process, and the clamping driving unit 300 ) is composed of a lift driving device provided in the lower part of the lower mold 200A, and the molding driving unit 400 provides a molding pressure for compressing the inside of the cavity C of the lower mold 200A. 200A) includes a sliding block 410 that is moved forward and backward in a horizontal direction inside the master die 200B so as to lift and drive the cavity block 210 provided in the cavity block 210, and can be configured to be mounted inside the master die 200B. .

In addition, the shaping driving unit 400 may include moving units 460 and 480 for converting the horizontal forward/backward driving of the sliding block 410 into the rising/lowering driving of the cavity block 210 .

In an embodiment of the present invention, the upper surface of the sliding block is a horizontal surface, and the lower surface is configured to have an inclined surface, and the inclined surface is formed to decrease in thickness as it goes away from the sliding driving device, but is not limited thereto.

The upper and lower surfaces of the sliding block may be configured to have an inclined surface, the upper surface may be configured to have an inclined surface, and the lower surface may be configured to have a horizontal surface, and may be configured to increase in thickness as the distance from the sliding drive device increases. Preferably, the drive device is connected The upper surface of the sliding block 410 is horizontal and the lower surface is inclined to change the direction of the force in the same direction as the upward direction when converting the force applied from the driving device to the upward driving of the cavity block 210, Since the force acts in the direction of motion of the block, there is an advantage in that the loss of the force applied from the driving device can be minimized.

In addition, the moving unit has an upper moving unit 460 in contact with the upper surface of the sliding block and a lower moving unit 480 in contact with the lower surface of the sliding block, but is not limited thereto.

If either side of the sliding block is a horizontal plane, the moving unit on the horizontal plane side may be omitted. For example, when the upper surface of the sliding block is a horizontal surface, it is also possible to omit the upper moving unit and the sliding block directly elevates the moving block.

On the other hand, the master die 200B is moved up and down in a limited range in order to transmit the lift drive of the moving unit 460 by the sliding block to the cavity block 210 and is elastically supported by the return spring 253 downward. It may be configured to further include a block 250 .

4 , the upper surface of the sliding block 410 may be horizontal, and the lower surface of the sliding block 410 may be inclined so that the thickness of the sliding block 410 decreases toward the inside.

The upper surface of the sliding block 410 to which the driving device is connected is horizontal and the lower surface is inclined to convert the force applied by the driving device to the upward driving of the cavity block 210. In the same direction as the upward direction, the direction of the force Since it can be changed, it is possible to minimize the loss of the force applied from the drive unit.

In addition, the moving units 460 and 480 have a lower surface of the sliding block 410 sliding when the sliding block 410 enters, and a lower moving unit 480 and the lower moving unit for elevating the sliding block 410 . It may be configured to include an upper moving unit 460 that is propelled up and down by the sliding block 410 lifted by the 480 .

That is, the upper moving unit 460 of the moving units 460 and 480 is raised when the sliding block 410 enters in the inner direction to raise the moving block 250 provided under the cavity block 210, The cavity block provided on the upper part of the moving block is raised, and the moving block 250 is lowered when retreating in the outward direction, thereby lowering the cavity block provided on the upper part of the moving block.

Ultimately, the cavity block can be raised and lowered by adjusting the forward distance of the sliding block, and the thickness of the cavity and the molding pressure applied to the cavity can be adjusted by adjusting the height of the cavity by raising and lowering the cavity block.

In addition, the lower moving unit 480 of the moving units 460 and 480 is supported by an inclined lower surface of the sliding block 410 when the sliding block 410 enters in an inward direction and has an inclined upper surface to enable horizontal movement. can be configured.

That is, as shown in FIG. 4, the upper surface inclination of the lower moving unit 480 and the lower surface inclination of the sliding block 410 are configured to be the same, and the upper surface of the sliding block 410 is configured to be parallel, When the sliding block 410 enters between the upper moving unit 460 and the lower moving unit 480 , the upper surface of the sliding block 410 pushes the lower portion of the upper moving unit 460 to move the upper moving unit 460 . It has a structure for raising the unit 460 .

When the sliding block advances, the upper moving unit 460 is raised to raise the moving block 250, and the moving block 250 presses the cavity block to increase the forming pressure in the cavity (C) to perform the forming process. can

In the present invention, a friction reducing member may be used to smoothly move forward and backward of the sliding block. That is, the upper surface of the sliding block, the lower surface of the sliding block, the lower surface of the upper moving unit in contact with the upper surface of the sliding block, and the upper surface of the lower moving unit in contact with the lower surface of the sliding block, rollers, Teflon, Preferably, a friction reducing member such as lubricant or coating is provided, and more preferably, a roller or a Teflon member may be provided.

In addition, a roller as shown in FIGS. 4 and 5 may be used as the friction reducing member.

4 and 5, the friction reducing member is a moving frame having a receiving groove therein; a roller frame provided in the receiving groove to which a plurality of rollers are mounted; and an elastic member mounted between the moving frame and the roller frame, wherein the roller frame may be provided so as to be able to move up and down in the receiving groove of the moving frame by the elastic member.

The same friction reducing member may be used for the upper moving unit and the lower moving unit. The upper moving unit 460 and the lower moving unit 480 include an upper moving frame 461 and a lower moving frame 481, respectively, and the upper moving unit 460 or the lower moving unit 480 is The support surface of the sliding block 410 may include a plurality of rollers 463 and 483 elastically supported by each of the moving frames 461 and 481 .

The upper moving frame 461 of the upper moving unit 460 is mounted so that a plurality of rollers 463 are elastically supported downward to be exposed, and the lower moving frame 481 of the lower moving unit 480 includes a plurality of rollers. 483 may be mounted so that it is elastically supported in an upward direction and exposed. As shown in FIG. 5, the upper moving frame 461 and the lower moving frame 481 have a cross-sectional shape in the width direction of “ㅠ”, and a plurality of rollers 463 and 483 and an elastic member in the inner space. (465, 485) may be configured to form a receiving space to be accommodated.

Accordingly, in the process of the sliding block 410 entering, the upper and lower surfaces of the sliding block 410 are guided by a plurality of rollers 465 and 485 to smoothly slide in the front and rear directions, and the sliding block 410 When the upper moving unit does not contact the moving block, the moving block 250 is not propelled upward, and the upper moving unit raised by the sliding block must contact the moving block to propel the moving block upward. can

As shown in the enlarged view of FIG. 5 , the sliding block 410 is disposed between the upper moving unit 460 and the lower moving unit 480 , and each of the rollers of the upper moving unit 460 and the lower moving unit 480 . The sliding block 410, the upper moving frame 461, and the sliding block 410 and the lower moving frame 481 may each be maintained in a non-contact state.

That is, as shown in FIG. 5 , in a state in which the upper moving unit 460 does not come into contact with the moving block, the horizontal thrust of the sliding block 410 is moved upward by the upper moving unit 460 . It has not been delivered to block 250 . At this time, the guide bar 251 formed on the outer peripheral surface of the moving block 250 is a return spring 252 interposed between the first lower base frame 201 and the second lower base frame 203 constituting the master die 200B. It is elastically supported downward by the lower mold and can be maintained in a supported state on the stopper 203s of the second lower base frame 203 constituting the lower mold. In this state, when the sliding block advances further and the upper moving unit comes into contact with the moving block and transmits a force upward, the return spring 252 is compressed and a pressing force is applied to the cavity block side.

In addition, the cavity block 210 is also provided with a guide bar on an outer circumferential surface, a guide groove may be provided on the inner circumferential surface of the clamping block 220 , and the guide bar of the cavity block 210 also has an inner circumferential surface of the clamping block 220 . may be in a state supported by the lower end of the guide bar of

6 and 7 show the molding driving unit 400 provided in the master die 200B of the compression molding apparatus 1 in a state in which the upper mold 100 and the lower mold 200A shown in FIGS. 4 and 5 are matched. In a state in which the inner end of the sliding block 410 constituting the is propelled between the upper moving unit 460 and the lower moving unit 480 provided in the master die 200B, the molding pressure is applied in the cavity (C). shows a front view and a side view of

That is, during the forward operation of the sliding block, the sliding block is provided to be slidable with a minimized frictional force by the roller, and when the sliding block reaches a set forward distance, the upper and lower surfaces of the sliding block 410 are respectively the upper moving unit 460 ) and the rollers provided in the lower moving unit 480 may be in contact with the upper moving frame 461 and the lower moving frame 481 .

The longitudinal cross-sectional shape of the upper moving frame 461 and the lower moving frame 481 is configured in a “П” shape and can be supported on the upper and lower surfaces of the sliding block, as shown in the enlarged view of FIG. 7 . , the upper and lower surfaces of the sliding block 410 are in direct contact with the upper moving frame 461 and the lower moving frame 481, respectively, so that the upper moving frame 461 and the upper moving frame 461 are upper moving blocks 250 and the cavity block 210 may be driven upward to apply a molding pressure in the cavity C to perform a molding process.

In this case, as shown in FIGS. 6 and 7, the guide bar 251 formed on the outer peripheral surface of the moving block 250 is spaced apart from the stopper 203s of the second lower base frame 203, and the cavity block ( The guide bar of 210 may also be spaced apart from the lower end of the guide groove of the clamping block 220 .

8 and 9 are front and side views of a state in which the sliding block 410 is retracted and the molding pressure is removed from the cavity C of the lower mold 200A in a state in which the molding process shown in FIGS. 6 and 7 is completed. shows

6 and 7, the inner end of the sliding block 410 passes through the moving units 460 and 480, the driving force of the sliding block 410 is converted into the upward driving force of the cavity block 210, The sliding block ( As shown in FIGS. 8 and 9, the upper and lower surfaces of the sliding block 410 release the contact state of both ends of the moving frames 461 and 481 constituting the moving units 460 and 480 by moving backward 410).

And, in this state, the pneumatic pressure applied to the vacuum blocks 140 and 240 of the upper mold 100 and the lower mold 200A can be released together so that the upper mold 100 and the lower mold 200A can be separated. there is.

10 and 11 show a front view and a side view of a state in which the clamping driver lowers the lifting plate to lower the lower mold and the master die after the compression molding process is completed to separate the lower mold 200A from the upper mold 100 .

As shown in FIGS. 8 and 9 , in the state in which the upper mold 100 and the lower mold 200A are clamped, the forming pressure is first removed, and then the clamping drive unit 300 as shown in FIGS. 10 and 11 . The compression molding process can be completed by lowering the lift driving device 330 of the to separate the upper mold 100 and the lower mold 200A to release the clamping state.

12 is a three-direction sectional view of the upper moving unit 460 provided in the lower mold 200A of the compression molding apparatus 1 according to the present invention.

As described above, the upper moving unit 460 includes a moving frame 461 serving as a housing having an accommodating groove therein, and a roller frame provided in the accommodating groove and having a plurality of rollers 463 mounted therein. It may include an elastic member mounted between the 462 and the moving frame and the roller frame.

12 , the plurality of rollers 463 are not directly fastened to the moving frame, but are shaft-coupled to the roller frame 462 , and an elastic member between the moving frame 461 and the roller frame 462 . (465) may be interposed. The roller frame can be moved up and down in the receiving groove of the moving frame by the elastic member.

Accordingly, the plurality of the rollers are mounted on the roller frame and elastically supported by an elastic member, and may support the forward/backward operation of the sliding block 410 .

The sliding block 410 is smoothly moved with a minimized frictional resistance by the rollers of the roller frame 462 when performing forward or backward movement, and when applying molding pressure to the cavity block, the moving frame 461 surface It becomes possible to transmit molding pressure to the cavity block in the state in which it is in contact with the

That is, when moving, frictional force is minimized through line contact, and when forming pressure is applied, the forming pressure can be transmitted evenly over the entire surface by switching from the line contact state to the surface contact state. It has the effect of preventing damage to the old rollers.

The moving frame 461 may have a cross-sectional shape in the width direction of “ㅠ”, and the roller frame 462 and the elastic member 465 with rollers mounted therein can be accommodated in the lower central accommodating space, and the length The directional end has a closed structure in the form of “П”.

Therefore, when the sliding block 410 enters between the upper moving unit 460 and the lower moving unit 480, resistance is minimized and sliding is possible by the elastically supported roller, and the inner end of the sliding block 410 is moved to the upper moving unit. When the unit 460 and the lower moving unit 480 pass through the ends of both moving frames, the upper and lower surfaces of the sliding block 410 are at the ends of the moving frames of the upper moving unit 460 and the lower moving unit 480. It may have a structure in which the driving force of the sliding block 410 is transmitted by being supported.

Although the embodiment shown in FIG. 12 has been described using the upper moving unit 460, the structure of the upper moving unit 460 shown in FIG. 12 is also applicable to the lower moving unit 480, and the lower moving unit 460 is also applicable. The thickness of the moving frame constituting the unit 480 may be increased toward the inside to have a symmetrical slope with the sliding block.

In order to minimize the friction force of the moving unit in contact with the sliding block, the molding driving unit of the present invention has a friction reducing member on at least one of the upper moving unit, the lower moving unit, the upper surface of the sliding block, and the lower surface of the sliding block in contact with the sliding block. It is preferable to be provided.

At this time, it is preferable to provide a roller or a Teflon member on the contact surface, and the friction reducing member of the molding driving unit can be adopted and applied in various ways.

For example, FIG. 13 shows a front view of the lower mold 200A to which the moving units 460 and 480 of different types are applied.

Specifically, the upper moving unit 460 among the moving units 460 and 480 shown in the embodiment shown in FIG. 13A is the same as the moving unit of the form shown in FIG. 12, but the lower moving unit 480. Instead of the silver roller and the elastic member, a Teflon member 486 made of Teflon material for reducing friction is provided in the receiving space inside the moving frame and has the same function as the elastically supported roller, that is, the friction reduction function when the sliding block 410 is driven forward and backward. Even molding pressure transmission can be performed.

Since the Teflon member 486 has a property of expanding by heat in nature, when it is inserted into the moving frame in consideration of expansion by the heater inside the mold, it can be moved from the moving frame to the sliding block 410 in the direction. It protrudes about a millimeter to reduce friction when the sliding block 410 moves, and the longitudinal end of the moving frame is the sliding block in a state where the sliding block 410 passes between the upper moving unit 460 and the lower moving unit 480 . 410 may be supported.

The embodiment shown in FIG. 13(b) is the same as the embodiment shown in FIG. 12 in that both the upper moving unit 460 and the lower moving unit 480 are provided with a plurality of rollers 483' in the moving frame. However, there is a difference in that a separate elastic member is not provided between the moving frames 461 and 481 and the plurality of rollers.

Therefore, in the embodiment shown in FIG. 13(b), a separate roller frame is omitted in the moving frame constituting the moving units 460 and 480, and each roller may be directly connected to the moving frame.

Even if a separate elastic member is not interposed, when the sliding block 410 enters between the upper moving unit 460 and the lower moving unit 480, the upper and lower surfaces of the sliding block 410 are respectively the upper moving unit 460 and the lower unit. It is the same that the moving unit 480 can be driven in a state in which friction is minimized by the rollers 483 ′ provided in the moving unit 480 .

14 shows an embodiment in which Teflon members 466 and 486 are provided as friction force reducing members in the upper moving unit 460 and the lower moving unit 480 constituting the moving units 460 and 480 .

Specifically, FIG. 14 (a) is a cross-sectional view of the lower mold 200A provided with Teflon members 466 and 486 as friction-reducing members in the upper moving unit 460 and the lower moving unit 480, FIG. (b) and 14 (c) show a plan view and a cross-sectional view of the lower moving unit 480 provided with a Teflon member as a friction reducing member.

Each of the upper moving unit 460 and the lower moving unit 480 has an accommodating space therein, and in the embodiment shown in FIG. 14 , Teflon members 466 and 486 are provided in the accommodating space to form a sliding block 410 ), the friction between the upper and lower surfaces can be minimized.

In the above-described embodiments, as a friction reducing member, at least one of the moving units 460 and 480 of the upper moving unit 460 and the lower moving unit 480 is configured to include a roller, but the upper moving unit 460 and the lower moving unit 480 are provided. Even if the rollers are omitted in all of the units 480 and the Teflon members 466 and 486 are applied, friction generated when the sliding block 410 enters can be sufficiently reduced. In addition, it is also possible to use other friction reducing members.

In addition, in the above-described embodiments, the moving unit is provided with a friction force reducing member, but is not limited thereto, and both the moving unit and the sliding block may include a friction reducing member, and only the sliding block is provided with a friction reducing member it could be It may be appropriately provided as needed.

15 shows the cross-sectional structure of the lower mold 200A in which the clamping pressure can be adjusted according to the size of the molding substrate ms, and FIG. 16 is a spacer 221 for adjusting the clamping pressure at the lower part of the clamping block 220. shows a top view of a spacer plate 225 into which is replaceably inserted.

The compression molding apparatus 1 according to the present invention drives the clamping driving unit 300 that is positionally or structurally separated from the molding driving unit, and is placed on the molding substrate (ms) placed on the upper mold 100. The lower mold 200A. The clamping process may be performed by applying a clamping pressure to the clamping block 220 of the upper mold and the lower mold to form a clamping process.

When it is difficult to control the clamping pressure itself by the clamping drive unit 300, the compression molding apparatus 1 according to the present invention has a clamping pressure adjusting unit 222 to adjust the clamping pressure applied according to the size of the substrate or the characteristics of the material. ) can be provided.

To this end, the lower mold of the present invention includes lower base frames 201 and 203 provided under the clamping block and provided with a plurality of elastic members 223 to which the clamping pressure by the clamping driver is transmitted; a connection member 224 provided on the upper portion of each elastic member to transmit the clamping pressure to the clamping block 220; and a spacer plate 225 interposed between the lower base frame and the clamping block 220 and having a groove penetrating through the upper portion of at least one of the plurality of connection members, and a spacer 221 inserted into the groove. ) may be further included.

The clamping pressure adjusting unit 222 selectively applies or blocks the elastic force by the plurality of elastic members to apply or block the clamping pressure applied by the clamping driving unit to the clamping block 220. The clamping pressure can be adjusted. .

To this end, the spacer is used to transmit clamping pressure to the clamping block by inserting a spacer with a thickness equal to the thickness of the spacer plate into the groove, by inserting a spacer smaller than the thickness of the spacer plate into the groove, or by not inserting a spacer into the groove. It is possible to reduce or block the clamping pressure on the

More specifically, as shown in FIG. 15 , the clamping pressure adjusting unit 222 transmits the elastic force of the elastic member mounted on the lower base frame according to whether it is in contact with the bottom surface of the clamping block 220 and the The lower mold 200A may include a replaceable spacer 221 and an elastic member 223 for applying an elastic force to the spacer 221 .

A plurality of the elastic members 223 are provided on the lower base frame, a connecting member 224 is provided on the upper portion of each elastic member, and a spacer plate is positioned between the connecting member and the clamping block. A through groove of the spacer plate is positioned on an upper portion of at least some of the plurality of connecting members.

A spacer may be inserted into the groove of the spacer plate, and the clamping pressure may be adjusted by changing the thickness of the inserted spacer. Here, the spacer plate serves as a medium for transferring the clamping pressure applied from the clamping driver to the clamping block. If a spacer having the same thickness as that of the spacer plate is used, the inserted spacer can perform the same function as the spacer plate.

That is, if a spacer having the same thickness as that of the spacer plate is used, the clamping pressure transmitted from the clamping driver through the elastic member pushes not only the spacer plate in contact with the connecting member but also the spacer, so that it can be completely transmitted to the clamping block.

However, if a spacer is not inserted into the groove of the spacer plate or a spacer having a thickness smaller than the thickness of the spacer plate is inserted, there is no medium to transmit force in the groove of the spacer plate or the length is short, so the clamping pressure is not completely transmitted to the clamping block, Since the clamping pressure is transmitted to the clamping block only by the connecting member in contact with the lower portion of the spacer plate without grooves, a lower clamping pressure is inevitably transmitted.

Accordingly, the clamping pressure transmitted to the clamping block can be adjusted only by adjusting the thickness of the spacer inserted into the groove.

The connecting member 224 is mounted on the elastic member 223 to transfer the elastic force of the elastic member 223 to the spacer 221 provided on the upper portion of the connecting member, but the connecting member ( Whether the plurality of spacers 221 or the connecting members 224 contact each other on the lower surface of the clamping block 220 may be controlled by adjusting the thickness of the 224 .

However, in terms of replacement or maintenance, if the thickness of the spacer inserted into the groove of the spacer plate is adjusted, the clamping pressure can be adjusted much more simply and easily. Of course, various methods for adjusting the clamping pressure transmitted by the elastic member by using the elastic member for adjusting the clamping pressure may be applied.

On the other hand, a connecting member is provided on the upper portion of each elastic member to transmit the clamping pressure to the clamping block. Among the connecting members, some connecting members are in contact with the bottom surface of the spacer plate, and the remaining connecting members are in the groove bottom of the spacer plate. It may be provided in a form in contact with the bottom surface of the spacer inserted into the groove.

In this case, the clamping pressure can be adjusted by changing the thickness of the spacer, and a spacer having the same thickness as the thickness of the spacer plate or a spacer smaller than the thickness of the spacer plate may be used. If a spacer with the same thickness as the spacer plate is used, the clamping pressure by the elastic member can be transmitted to the clamping block side without loss. It may be transmitted or not transmitted to the clamping block side.

The spacer 221 may be inserted and mounted in at least some of the plurality of grooves formed on the spacer plate 225 supporting the lower portion of the clamping block 220 . Accordingly, when the size of the molding substrate ms is large, in order to provide sufficient clamping pressure, the number of grooves into which the spacer is inserted having the same thickness as the thickness of the spacer plate may be increased, and the remaining grooves have a greater thickness than the thickness of the spacer plate. It is an empty groove into which a spacer of a small thickness is inserted or into which a spacer is not inserted.

Conversely, when the size of the molding substrate ms is small, in order to prevent excessive clamping pressure from being applied to the clamping block, the clamping pressure can be adjusted by replacing the spacer inserted in the groove with a spacer smaller than the thickness of the spacer plate.

As the size of the molding substrate ms decreases, the number of grooves into which spacers smaller than the thickness of the spacer plate are inserted increases. At this time, spacers having the same thickness as the thickness of the spacer plate are inserted into the remaining grooves.

As described above, the number of clamping blocks 220 whose bottom surfaces are in contact with the spacer 221 and the connecting member 224 can be changed by adjusting the thickness of the connecting member 224 . Since the spacer 221 may be mounted only in some of the plurality of grooves formed on the spacer plate 225 , the inside of the groove in which the spacer 221 is not mounted is connected to the connecting member 224 without a separate spacer 221 . may extend to the lower surface of the clamping block 220 to transmit the elastic force of the elastic member 223 to the lower surface of the clamping block 220 .

17 shows the driving state of the lower mold 200A in a clamping state or a molding forming state when a molding substrate ms requiring a relatively large clamping pressure is applied, and FIG. 18 shows a relatively small clamping pressure required. It shows the driving state of the lower mold 200A in the clamping state or the molding molding state when the molding substrate ms to be used is applied.

As described above, depending on the size of the molding substrate (ms) or the characteristics of the material to be molded, the lifting driving device 330 constituting the clamping driving unit 300 rises to form a clamping block ( 220), the clamping pressure applied at the time of clamping the edge of the molding substrate (ms) can be adjusted.

In the embodiment shown in FIG. 17( a ), when a relatively large clamping pressure is required because the size of the molding substrate ms is relatively large, all the spacers 221 are in contact with the lower surface of the clamping block 220 . It is installed and the maximum clamping pressure provided by the clamping driving unit 300 may be provided, and in the embodiment shown in FIG. 18(a), the size of the molding substrate ms is small and a relatively small clamping pressure is required. It is installed to be spaced apart from the lower surface of the clamping block so that the 221 does not come into contact with the lower surface of the clamping block 220 so that a clamping pressure of an appropriate size can be transmitted in the clamped state.

And, as shown in Fig. 17 (b), when the sliding block 410 is propelled and the molding process is performed after the clamping process is completed, all the elastic members mounted in the lower base constituting the master die 200B ( 223 ) and the connecting member 224 are independent of the operation of the molding driving unit 400 , and are compressed according to the driving of the clamping driving unit to elastically support both the connecting member 224 and the spacer 221 .

However, as shown in FIG. 18(b) , when the spacer 221 is mounted so as not to contact the lower surface of the clamping block 220 to adjust the clamping pressure, it is independent of the operation of the forming driving unit 400 and the clamping driving unit Even if the clamping block and the substrate are clamped according to the driving of the elastic member 223a disposed under the spacer 221 that does not come into contact with the clamping block 220, the elastic member 223a is not in contact with the lower surface of the clamping block 220, so that it is not elastically deformed. , it can be seen that only the elastic member 223b under the connecting member on which the spacer is not mounted is compressed after being in contact with the lower surface of the clamping block 220 to transmit the elastic support force to the connecting member 224 .

Although FIG. 17(a) shows a large substrate and FIG. 18(a) shows a small substrate as an example, in FIG. By installing it spaced apart from the lower surface of the clamping block, it is possible to transmit a clamping pressure greater than the clamping pressure applied in FIG. 18(a), but smaller than that of FIG. 17(a).

19 and 20 show the inside of the upper mold and the lower mold in the molding process through the compression molding apparatus 1 according to the present invention, preferably a vacuum block 240 for vacuuming the cavity C in which the molding is performed. shows the operating state.

As described above, a vacuum block (140, 240) that surrounds the outer periphery of the balance block (130, 230) and forms a vacuum by sealing the upper mold (100) and the lower mold (200A) in the clamping or molding process can be provided

At this time, the vacuum block protruding from the outer periphery of the lower mold is the lower vacuum block, and the upper vacuum block is protruding from the outer periphery of the upper mold at a position corresponding to the lower vacuum block. When vacuum is applied to the inside of the mold through a vacuum line (not shown) in a state in which the upper vacuum block and the lower vacuum block are combined, the upper vacuum block and the lower vacuum block seal the inside of the mold to form a vacuum.

To this end, at least one of the upper vacuum block and the lower vacuum block may be provided with a sealing member.

Preferably, the lower vacuum block is mounted between the vacuum block plate 246 and the vacuum block plate 246 and the lifting plate 241 having a sealing member on the lower surface and the vacuum block plate and the lifting plate. An elastic member 243 to be mounted may be provided.

In this case, the lower vacuum block may further include a guide pin having a plurality of through-holes formed inside the lifting plate, being inserted and mounted in the through-hole, connected to the vacuum block plate, and guiding the lifting and lowering of the lifting plate by an elastic member. Here, the guide pins may be provided interchangeably with guide pins of different lengths to adjust the vacuum forming time inside the upper and lower molds.

In detail, in the process of forming the lower mold 200A and the upper mold 100, the upper vacuum block 140 of the upper mold 100 and the lifting plate 241 of the lower mold 200A are After being contacted first, it is elastically supported by the elastic force by the elastic member 243, and the lower mold further rises by the clamping pressure driving part, so that in the process of combining the lower balance block and the upper balance block, the lifting plate 241 of the lower mold ) and the vacuum block plate 246 can be configured to be in contact.

The guide pin 242 can be used as a switch for full-scale pneumatic application through a pneumatic line by determining the contact point between the elevating plate 241 of the lower mold 200A and the vacuum block plate 246, and the Depending on the length, the full-scale pneumatic application time in the clamping process can be adjusted.

Here, the full-scale pneumatic application time is not the time when the pump is driven to form a vacuum inside the mold, but the state in which the vacuum block of the upper mold and the lower mold contact and block the inflow of external air, that is, when the pneumatic is operated in a closed state. It means time, and the operation of the pump starts before contact with the vacuum block to shorten the vacuum formation time.

The inside of the cavity (C) may be configured to be sealed when clamping is completed, and the pneumatic line is preliminarily in the process of approaching the lower mold 200A to the upper mold 100 by the driving of the clamping driving unit 300 . By applying pneumatic pressure, the lower mold 200A can be quickly raised until the lifting plate 241 of the lower mold 200A comes into contact with the vacuum block 140 of the upper mold 100, and then the lower balance block and Until the upper balance block is combined, the lower mold 200A can be raised slowly, and the air inside the cavity can be stably discharged by controlling the rising speed of the lower mold to form a vacuum state.

In this case, the guide pin 242 interposed between the lifting plate 241 and the vacuum block plate 246 of the lower mold according to the type of the molding powder (mp) accommodated in the cavity, the characteristics of the material to be molded, etc. After changing to a guide pin 242 having a different length, the vacuum block of the upper mold 100 and the lifting plate 241 of the lower mold 200A come into contact with the lifting plate 241 of the lower mold and the vacuum block It may be possible to adjust the contact time interval at which the plate 246 is contacted.

That is, before the vacuum block of the upper mold 100 and the lifting plate 241 of the lower mold 200A come into contact, the upper mold 100 and the lower mold 200A are spaced apart from each other, so it is not in a sealed state. Even if an air flow is generated by pneumatic pressure in the direction of the lower mold 200A, it does not significantly affect the air flow in the cavity, but the vacuum block of the upper mold 100 and the lifting plate 241 of the lower mold 200A From the point of contact, the upper mold 100 and the lower mold 200A are sealed, and air flow is generated inside the cavity by the pneumatic pressure generated in the direction of the lower mold.

In the present invention, after the vacuum block of the upper mold and the vacuum block of the lower mold come into contact, the substrate of the upper mold and the clamping block of the lower mold are clamped, and then the upper balance block and the lower balance block are combined. After the block and the vacuum block of the lower mold come into contact with each other, the lifting plate descends until the upper balance block and the lower balance block are combined to be in contact with the vacuum block plate.

At this time, the gap between the substrate of the upper mold and the clamping block can affect the air flow inside the cavity, and the smaller the gap, the faster the air flow rate, so the molding powder in the cavity can splash out of the cavity. It is necessary to determine the initial separation distance between the substrate mounting unit 110 and the clamping block 220 according to the characteristics of the molding powder, the type of material, and the like.

In addition, the lower mold 200A can be quickly raised until the lifting plate 241 of the lower mold 200A is in contact with the vacuum block 140 of the upper mold, and the lifting plate 241 and the vacuum block of the lower mold can be quickly raised. Until the plate 246 comes into contact, the rising speed of the lower mold 200A is controlled relatively slowly to secure sufficient time for evacuating the cavity C of a large area.

At this time, since the contact time between the lifting plate of the lower mold and the vacuum block plate can be adjusted through the length of the guide pin, the vacuum forming time inside the upper mold and the lower mold can be adjusted through the length of the guide pin.

Accordingly, as shown in FIG. 19 , when the guide pin 242 is short, the substrate mounting unit 110 and the clamping block 220 are in contact with the vacuum block of the upper mold 100 and the lifting plate of the lower mold 200A. ) is small and in the embodiment shown in FIG. 20, the guide pin 242 is longer than the embodiment shown in FIG. 19, so the vacuum block of the upper mold 100 and the upper vacuum block of the lower mold 200A At the point of contact, the gap formed between the substrate mounting unit 110 and the clamping block 220 may be large.

In addition, since the volume formed by the vacuum block 140 of the upper mold and the lifting plate 241 of the lower mold 200A varies depending on the length of the guide pin 242, the guide pin ( 242) is longer than the short case, and the internal pressure change is relatively small, so it is possible to prevent the powder from coming out of the cavity.

For example, after the vacuum block of the upper mold 100 and the lifting plate 241 of the lower mold 200A come into contact with each other, depending on the type of particle of the molding powder mp or the area of the cavity C, etc. By varying the contact time interval between the elevating plate 241 and the vacuum block plate 246 of the lower mold, the blowout of the molding powder can be minimized and sufficient time can be secured for vacuuming the cavity C of a large area. .

Although the present specification has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the claims described below. will be able to carry out Therefore, if the modified implementation basically includes the elements of the claims of the present invention, all of them should be considered to be included in the technical scope of the present invention.

1: Compression molding device
100: upper mold
200A: lower mold
200B: master die
300: clamping drive unit
400: molding driving unit
410: sliding block
420: load cell

Claims (18)

an upper mold having a substrate mounting unit on which a molding substrate is mounted;
a cavity block forming a bottom surface of a cavity for accommodating molding powder for molding the circuit portion of the molding substrate; and a clamping block disposed opposite the upper mold to clamp the molding substrate of the upper mold and forming a side surface of the cavity; a lower mold provided with;
a master die having a moving block mounted so as to be elevating and lowering from the lower part of the cavity block, and a forming driving unit for pressing the cavity block by adjusting the elevating height of the moving block; and
a lifting plate for mounting the master die thereon; and a clamping driving unit for lifting and lowering the lifting plate to clamp the clamping block of the lower mold and the molding substrate;
The molding driving unit
a sliding block provided under the moving block and having an inclined surface for adjusting the elevation height of the moving block according to a forward/backward operation;
a moving unit in contact with the inclined surface of the sliding block; and
Compression molding apparatus provided on one side of the sliding block and comprising a driving device for horizontally transporting the sliding block. According to claim 1,
The molding driving unit is provided on one side of the driving device, the compression molding apparatus characterized in that it further comprises a load cell for measuring the molding pressure applied to the cavity block. According to claim 1,
The molding driving unit,
an upper moving unit in contact with the upper surface of the sliding block;
a lower moving unit in contact with a lower surface of the sliding block; and
A sliding block having an inclined surface formed to be inclined so that the thickness decreases from one side to the other side, and provided to be movable forward and backward in a horizontal direction between the upper moving unit and the lower moving unit,
The sliding block raises the upper moving unit when moving forward to raise the moving block, and lowers the upper moving unit to lower the moving block when moving backward, thereby adjusting the height of the cavity block.
At least one of the upper moving unit and the lower moving unit in contact with the sliding block, the upper surface of the sliding block and the lower surface of the sliding block, a friction reducing member for minimizing the frictional force with the sliding block is formed Compression molding equipment. 4. The method of claim 3,
A compression molding apparatus, characterized in that a roller or a Teflon member is provided on a contact surface of at least one of the upper surface of the sliding block, the lower surface of the sliding block, the upper moving unit, and the lower moving unit. 5. The method of claim 4,
The friction reducing member is
a moving frame having a receiving groove therein;
a roller frame provided in the receiving groove and on which a plurality of rollers are mounted; and
and an elastic member mounted between the moving frame and the roller frame,
Compression molding apparatus, characterized in that the roller frame is provided to be elevating inside the receiving groove of the moving frame by the elastic member. According to claim 1,
The upper surface of the sliding block is a horizontal surface,
The lower surface of the sliding block has an inclined surface formed to decrease in thickness as it goes away from the sliding drive device,
Compression molding apparatus, characterized in that the inclined surface forms a predetermined angle (θ°) from the ground. 7. The method of claim 6,
The predetermined angle (θ°) is less than 45°,
Compression molding apparatus, characterized in that it is possible to adjust the size of the molding pressure applied by the sliding block by changing the size of the predetermined angle. 7. The method of claim 6,
The predetermined angle (θ°) is less than 45°,
Molding pressure applied from the driving device = molding area x pressure required for molding x tan(θ),
When the moving block is supported by a return spring,
The compression molding apparatus, characterized in that = (molding area x pressure required for molding x tan(θ)) + (reaction force of the return spring x tan(θ)) applied from the driving device. According to claim 1,
The driving device adjusts the forward distance of the sliding block to adjust the intensity of the molding pressure applied to the cavity block. According to claim 1,
The driving device sets the initial thickness of the cavity before molding by adjusting the forward distance of the sliding block,
Compression molding apparatus, characterized in that when the upper mold and the lower mold are molded and the molding substrate and the clamping block are clamped, the sliding block is further moved forward by a set distance to apply a preset molding pressure. 11. The method of claim 1 or 10,
The molding driving unit further comprises an encoder for measuring the position value of the sliding block,
Compression molding apparatus, characterized in that it is possible to know the moving distance of the sliding block through the position value measured from the encoder. According to claim 1,
The clamping drive unit is a toggle link type mold clamping mechanism,
When the upper mold and the lower mold are molded by the clamping driving unit and the molding substrate and the clamping block are clamped, the sliding block is moved forward by the molding driving unit to apply a molding pressure to the cavity. molding device. According to claim 1,
The lower mold includes a lower balance block protruding from the outer periphery of the clamping block,
The upper mold is formed to protrude at a position corresponding to the lower balance block, and the upper mold and the lower mold are molded to form an upper balance block that is coupled to the lower balance block when the lower mold and the molding substrate are clamped. Compression molding device, characterized in that. According to claim 1,
A plurality of substrate mounting parts are provided in the upper mold, and an upper balance block is formed to protrude between each of the substrate mounting parts,
A plurality of cavity blocks and clamping blocks are provided in the lower mold to correspond to the number of molding substrates mounted on each substrate mounting unit, and the lower mold is formed to protrude at a position corresponding to the upper balance block and is coupled to the upper balance block. A balance block is further provided,
The master die is provided with a plurality of moving blocks to correspond to the number of molding substrates mounted on each substrate mounting unit,
The molding driving unit is provided at the lower portion of each moving block to correspond to the number of the molding substrates to independently elevate the moving block. According to claim 1,
The lower mold is
a lower base frame provided under the clamping block and provided with a plurality of elastic members to which clamping pressure by a clamping driving unit is transmitted;
a connection member provided on each of the elastic members to transmit the clamping pressure to the clamping block; and
Further comprising: a spacer plate interposed between the lower base frame and the clamping block, the spacer plate having a groove penetratingly formed in an upper portion of at least one of the plurality of connection members, and a spacer inserted into the groove,
The compression molding apparatus according to claim 1, wherein the clamping pressure transmitted to the clamping block is adjusted by changing the thickness of the spacer inserted into the groove. 16. The method of claim 15,
The groove is provided in plurality,
The spacer includes a spacer having a thickness equal to that of the spacer plate and a spacer smaller than a thickness of the spacer plate,
As the size of the substrate to be molded increases, the number of grooves into which a spacer equal to the thickness of the spacer plate is inserted increases;
A compression molding apparatus, characterized in that a spacer having a thickness smaller than that of the spacer plate is inserted into the remaining grooves or no spacer is inserted. According to claim 1,
A lower vacuum block is protruded from the outer periphery of the lower mold, and an upper vacuum block is protruded from the outer periphery of the upper mold at a position corresponding to the lower vacuum block, and the lower vacuum block and the upper vacuum block are combined. A vacuum is formed inside the upper mold and the lower mold in a state of
The lower vacuum block
vacuum block plate;
a lifting plate mounted to be liftable from an upper portion of the vacuum block plate and having a sealing member on a lower surface thereof; and
Compression molding apparatus comprising an elastic member mounted between the vacuum block plate and the lifting plate. 18. The method of claim 17,
The lower vacuum block
A plurality of through-holes are formed in the inside of the lifting plate,
It is inserted into the through hole and connected to the vacuum block plate, further comprising a guide pin for guiding the lifting and lowering of the lifting plate by the elastic member,
The guide pin is a compression molding apparatus, characterized in that it is provided so as to be replaceable with guide pins of different lengths to adjust the vacuum forming time inside the upper mold and the lower mold.

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