KR20220013499A - Adhesive composition - Google Patents
Adhesive composition Download PDFInfo
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- KR20220013499A KR20220013499A KR1020220006939A KR20220006939A KR20220013499A KR 20220013499 A KR20220013499 A KR 20220013499A KR 1020220006939 A KR1020220006939 A KR 1020220006939A KR 20220006939 A KR20220006939 A KR 20220006939A KR 20220013499 A KR20220013499 A KR 20220013499A
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- KR
- South Korea
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- weight
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- 239000000203 mixture Substances 0.000 title claims abstract description 88
- 239000000853 adhesive Substances 0.000 title claims abstract description 66
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 66
- -1 thiouronium Chemical compound 0.000 claims abstract description 78
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 44
- 239000002216 antistatic agent Substances 0.000 claims abstract description 28
- 150000008040 ionic compounds Chemical class 0.000 claims abstract description 14
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 239000002313 adhesive film Substances 0.000 claims abstract description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims abstract description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 claims abstract description 6
- NQRYJNQNLNOLGT-UHFFFAOYSA-O Piperidinium(1+) Chemical compound C1CC[NH2+]CC1 NQRYJNQNLNOLGT-UHFFFAOYSA-O 0.000 claims abstract description 6
- WTKZEGDFNFYCGP-UHFFFAOYSA-O Pyrazolium Chemical compound C1=CN[NH+]=C1 WTKZEGDFNFYCGP-UHFFFAOYSA-O 0.000 claims abstract description 6
- RWRDLPDLKQPQOW-UHFFFAOYSA-O Pyrrolidinium ion Chemical compound C1CC[NH2+]C1 RWRDLPDLKQPQOW-UHFFFAOYSA-O 0.000 claims abstract description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 6
- ZRALSGWEFCBTJO-UHFFFAOYSA-O guanidinium Chemical compound NC(N)=[NH2+] ZRALSGWEFCBTJO-UHFFFAOYSA-O 0.000 claims abstract description 6
- 125000005462 imide group Chemical group 0.000 claims abstract description 6
- JUHDUIDUEUEQND-UHFFFAOYSA-N methylium Chemical compound [CH3+] JUHDUIDUEUEQND-UHFFFAOYSA-N 0.000 claims abstract description 6
- YNAVUWVOSKDBBP-UHFFFAOYSA-O morpholinium Chemical compound [H+].C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-O 0.000 claims abstract description 6
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 claims abstract description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 claims abstract description 6
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 102
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 82
- 239000010410 layer Substances 0.000 claims description 58
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 42
- 239000000178 monomer Substances 0.000 claims description 42
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 238000004132 cross linking Methods 0.000 claims description 26
- 239000013522 chelant Substances 0.000 claims description 21
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 239000003431 cross linking reagent Substances 0.000 claims description 20
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 19
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 19
- 229920001577 copolymer Polymers 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 15
- 229920002554 vinyl polymer Polymers 0.000 claims description 15
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000007983 Tris buffer Substances 0.000 claims description 8
- 239000012788 optical film Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 150000001450 anions Chemical class 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 5
- 150000001768 cations Chemical class 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 4
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 claims description 3
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 claims description 3
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 5
- 150000002500 ions Chemical class 0.000 abstract description 3
- GKNWQHIXXANPTN-UHFFFAOYSA-M 1,1,2,2,2-pentafluoroethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)F GKNWQHIXXANPTN-UHFFFAOYSA-M 0.000 abstract 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 16
- 229920002284 Cellulose triacetate Polymers 0.000 description 14
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 239000011241 protective layer Substances 0.000 description 13
- 150000002222 fluorine compounds Chemical class 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 239000012298 atmosphere Substances 0.000 description 10
- 239000004721 Polyphenylene oxide Substances 0.000 description 9
- 238000011109 contamination Methods 0.000 description 9
- 229920000570 polyether Polymers 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 238000004381 surface treatment Methods 0.000 description 9
- 230000003373 anti-fouling effect Effects 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 238000010998 test method Methods 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 125000002015 acyclic group Chemical group 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 150000002148 esters Chemical group 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229920006243 acrylic copolymer Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- VOQYJODKNTZYEA-UHFFFAOYSA-M 2-methyl-1-octylpyridin-1-ium trifluoromethanesulfonate Chemical compound FC(S(=O)(=O)[O-])(F)F.C(CCCCCCC)[N+]1=C(C=CC=C1)C VOQYJODKNTZYEA-UHFFFAOYSA-M 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001718 carbodiimides Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- XPBZJPYTVNYDNV-UHFFFAOYSA-M 1,1,2,2,2-pentafluoroethanesulfonate 1,2,3-trimethylimidazol-1-ium Chemical compound FC(C(S(=O)(=O)[O-])(F)F)(F)F.C[N+]1=C(N(C=C1)C)C XPBZJPYTVNYDNV-UHFFFAOYSA-M 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- KSOGGGZFEJTGPZ-UHFFFAOYSA-M 1-butyl-2,3-dimethylimidazol-3-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCC[N+]=1C=CN(C)C=1C KSOGGGZFEJTGPZ-UHFFFAOYSA-M 0.000 description 1
- QAHXJAJZOWWYEV-UHFFFAOYSA-M 1-hexyl-4-methylpyridin-1-ium 1,1,2,2,2-pentafluoroethanesulfonate Chemical compound FC(C(S(=O)(=O)[O-])(F)F)(F)F.C(CCCCC)[N+]1=CC=C(C=C1)C QAHXJAJZOWWYEV-UHFFFAOYSA-M 0.000 description 1
- PAAKYHOZGRVXDW-UHFFFAOYSA-M 1-octylpyridin-1-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCCCCCC[N+]1=CC=CC=C1 PAAKYHOZGRVXDW-UHFFFAOYSA-M 0.000 description 1
- CVBUKMMMRLOKQR-UHFFFAOYSA-N 1-phenylbutane-1,3-dione Chemical compound CC(=O)CC(=O)C1=CC=CC=C1 CVBUKMMMRLOKQR-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical class CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JSCDRVVVGGYHSN-UHFFFAOYSA-N 8-hydroxyoctyl prop-2-enoate Chemical compound OCCCCCCCCOC(=O)C=C JSCDRVVVGGYHSN-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical group OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- DQPBABKTKYNPMH-UHFFFAOYSA-M amino sulfate Chemical class NOS([O-])(=O)=O DQPBABKTKYNPMH-UHFFFAOYSA-M 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- KCHWKBCUPLJWJA-UHFFFAOYSA-N dodecyl 3-oxobutanoate Chemical compound CCCCCCCCCCCCOC(=O)CC(C)=O KCHWKBCUPLJWJA-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- PFPFCUBRZNXVTG-UHFFFAOYSA-N fluoroform 3-methyl-1-octylpyridin-1-ium Chemical compound FC(F)F.C(CCCCCCC)[N+]1=CC(=CC=C1)C PFPFCUBRZNXVTG-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BMOMBHKAYGMGCR-UHFFFAOYSA-N octadecyl 3-oxobutanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CC(C)=O BMOMBHKAYGMGCR-UHFFFAOYSA-N 0.000 description 1
- IKYDDBGYKFPTGF-UHFFFAOYSA-N octyl 3-oxobutanoate Chemical compound CCCCCCCCOC(=O)CC(C)=O IKYDDBGYKFPTGF-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 150000008054 sulfonate salts Chemical class 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/16—Antifouling paints; Underwater paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/017—Additives being an antistatic agent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Abstract
Description
본 발명은 대전 방지제를 함유하는 점착제 조성물 및 그것을 사용한 점착 필름, 표면 보호 필름에 관한 것이다. 보다 상세하게는, 저속 박리 속도 및 고속 박리 속도에 있어서, 밸런스가 잡힌 점착력을 갖는 등 우수한 점착 성능과 함께, 대전 방지 성능과 내오염 성능의 양립을 도모하는 것이 가능한 점착제 조성물 및 그것을 사용한 점착 필름, 표면 보호 필름을 제공하는 것에 관한 것이다.The present invention relates to a pressure-sensitive adhesive composition containing an antistatic agent, an adhesive film using the same, and a surface protection film. More specifically, in a low-speed peeling rate and a high-speed peeling rate, an adhesive composition capable of achieving both antistatic performance and stain resistance performance as well as excellent adhesive performance, such as having a well-balanced adhesive force, and an adhesive film using the same; It relates to providing a surface protection film.
종래부터, 액정 디스플레이를 구성하는 부재인 편광판 등의 광학 부재의 제조 공정에 있어서는, 광학 부재의 표면을 일시적으로 보호하기 위한 표면 보호 필름이 첩합된다. 이러한 표면 보호 필름은 광학 부재를 제조하는 공정에만 사용되고, 광학 부재를 액정 디스플레이에 장착하는 시점에 광학 부재로부터 박리하여 제거된다. 이러한 광학 부재의 표면을 보호하기 위한 표면 보호 필름은 광학 부재의 제조 공정에 있어서만 사용되기 때문에, 일반적으로 공정 필름으로 불리는 경우도 있다.Conventionally, in the manufacturing process of optical members, such as a polarizing plate which is a member which comprises a liquid crystal display, the surface protection film for protecting the surface of an optical member temporarily is pasted together. Such a surface protection film is used only in the process of manufacturing an optical member, and is peeled and removed from an optical member at the time of mounting an optical member to a liquid crystal display. Since the surface protection film for protecting the surface of such an optical member is used only in the manufacturing process of an optical member, generally it may call a process film.
이와 같이 광학 부재를 제조하는 공정에 있어서 사용되는 표면 보호 필름은 광학적으로 투명성을 갖는 폴리에틸렌테레프탈레이트(PET) 수지 필름의 한쪽 면에 점착제층이 형성되어 있다. 표면 보호 필름은 광학 부재에 첩합시킬 때까지 그 점착제층을 보호하기 위해, 이형 처리된 이형 필름이 점착제층의 표면에 첩합되어 있다.Thus, the surface protection film used in the process of manufacturing an optical member has an adhesive layer formed in one side of the polyethylene terephthalate (PET) resin film which has optical transparency. In order to protect the adhesive layer until a surface protection film is bonded together to an optical member, the release film by which the release process was carried out is bonded together by the surface of an adhesive layer.
그리고, 편광판 등의 광학 부재는 표면 보호 필름이 첩합된 상태로 액정 표시판의 표시 능력, 색상, 콘트라스트, 이물질 혼입 등의 광학적 평가를 수반하는 제품 검사를 받는다. 이 때문에, 표면 보호 필름에 대한 요구 성능으로는 점착제층에 기포나 이물질 및 점착제 조성물의 저분자량 성분이 부착되어 있지 않은 것, 즉 내오염 성능을 갖는 것이 요구되고 있다.And optical members, such as a polarizing plate, receive the product inspection accompanying optical evaluation, such as the display ability of a liquid crystal display board, hue, contrast, and foreign material mixing in the state to which the surface protection film was pasted up. For this reason, as a required performance for a surface protection film, that which does not adhere to a bubble, a foreign material, and the low molecular-weight component of an adhesive composition to an adhesive layer, ie, it is calculated|required that it has stain-resistance performance.
또한, 편광판 등의 광학 부재로부터 표면 보호 필름을 박리할 때, 점착제층과 피착체가 박리될 때 발생하는 정전기에 수반하여 생기는 박리 대전이 액정 디스플레이의 전기 제어 회로의 고장에 영향을 주는 것이 염려된다. 이 때문에, 표면 보호 필름의 점착제층은 우수한 대전 방지 성능을 갖는 것이 요구되고 있다.In addition, when peeling the surface protection film from an optical member such as a polarizing plate, there is a concern that peeling charging caused by static electricity generated when the pressure-sensitive adhesive layer and the adherend are peeled off affects the failure of the electric control circuit of the liquid crystal display. For this reason, it is calculated|required that the adhesive layer of a surface protection film has the outstanding antistatic performance.
나아가, 근래에는 편광판의 편광자 보호층(보호 필름으로 불리는 경우도 있다)으로서, 종래 사용되고 있는 트리아세틸셀룰로오스(TAC) 이외에 폴리메틸메타크릴레이트(PMMA) 등의 아크릴계 수지, 폴리에틸렌테레프탈레이트(PET) 등의 폴리에스테르계 수지, 고리형 올레핀계 폴리머, 폴리카보네이트 등의, 편광판의 표면 보호 필름을 박리할 때 박리 대전을 일으키기 쉬운 재료의 채용이 확대되고 있다. 이 때문에, 편광판의 표면 보호 필름용 점착제층에 요구되는 대전 방지 성능이 종래에 비해 우수한 것이 필요로 되고 있다.Furthermore, in recent years, as a polarizer protective layer (sometimes referred to as a protective film) of a polarizing plate, in addition to the conventionally used triacetyl cellulose (TAC), acrylic resins such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), etc. Adoption of materials which easily generate peeling electrification when peeling off the surface protection film of a polarizing plate, such as polyester-type resin, a cyclic olefin-type polymer, and polycarbonate, is expanding. For this reason, the thing excellent in the antistatic performance calculated|required of the adhesive layer for surface protection films of a polarizing plate compared with the past is required.
또한, 최종적으로 편광판 등의 광학 부재에서 표면 보호 필름을 박리할 때는 신속하게 박리할 수 있는 것이 요구되고 있다. 이른바, 고속 박리에 의해서도 신속하게 박리할 수 있도록, 점착력이 박리 속도에 의해 변화가 적은 것이 요구되고 있다.Moreover, when finally peeling a surface protection film from optical members, such as a polarizing plate, being able to peel quickly is calculated|required. It is calculated|required that there are few changes in adhesive force with a peeling rate so that what is called a high-speed peeling may also peel quickly.
이와 같이, 근래에는 표면 보호 필름을 구성하는 점착제층에 대해, (1) 저속 박리 속도 및 고속 박리 속도에 있어서 점착력의 밸런스를 갖는 것, (2) 내오염 성능을 갖는 것, (3) 우수한 대전 방지 성능을 갖는 것 등이 표면 보호 필름을 사용함에 있어서의 사용 용이성의 점에서 요구되고 있다.As such, in recent years, with respect to the pressure-sensitive adhesive layer constituting the surface protection film, (1) having a balance of adhesive force in a low-speed peeling rate and a high-speed peeling rate, (2) having a stain resistance performance, (3) excellent charging What has prevention performance, etc. are calculated|required from the point of the ease of use in using a surface protection film.
그러나, 표면 보호 필름을 구성하는 점착제층에 대한 요구 성능에 대해, 이들 (1)∼(3)의 개개의 요구 성능을 각각 만족시킬 수는 있더라도, 표면 보호 필름의 점착제층에 요구되는 (1)∼(3)의 요구 성능을 전부 동시에 만족시키는 것은 매우 곤란한 과제였다.However, with respect to the performance required for the pressure-sensitive adhesive layer constituting the surface protection film, (1) required for the pressure-sensitive adhesive layer of the surface protection film even if each of the performance requirements (1) to (3) can be satisfied. It was a very difficult subject to satisfy all the required performance of -(3) at the same time.
이러한 과제를 해결하기 위해, 예를 들면, (1) 저속 박리 속도 및 고속 박리 속도에 있어서 점착력의 밸런스를 갖는 것, (2) 내오염 성능을 갖는 것, (3) 우수한 대전 방지 성능을 갖는 것에 대해서는 각각 다음과 같은 제안이 알려져 있다.In order to solve these problems, for example, (1) having a balance of adhesive force in a low-speed peeling rate and a high-speed peeling rate, (2) having a stain resistance performance, (3) having an excellent antistatic performance For each, the following proposals are known.
(1) 저속 박리 속도 및 고속 박리 속도에 있어서 점착력의 밸런스를 갖는 것에 관해서는, 탄소수가 7 이하인 알킬기를 갖는 (메타)아크릴산알킬에스테르와 카르복실기 함유 공중합성 화합물의 공중합체를 주성분으로 하고, 이를 가교제로 가교 처리하여 이루어지는 아크릴계의 점착제층에서는, 장기간 접착했을 경우에 점착제의 피착체측으로의 이착이 발생하고, 또한 피착체에 대한 접착력의 경시 상승성이 크다는 문제가 있었다. 이를 회피하기 위해, 탄소수가 8∼10인 알킬기를 갖는 (메타)아크릴산알킬에스테르와 알코올성 수산기를 갖는 공중합성 화합물의 공중합체를 사용하고, 이를 가교제로 가교 처리한 점착제층을 형성한 것이 알려져 있다(특허문헌 1).(1) Regarding to have a balance of adhesive force in the low-speed peeling rate and the high-speed peeling rate, the main component is a copolymer of (meth)acrylic acid alkylester having an alkyl group having 7 or less carbon atoms and a carboxyl group-containing copolymerizable compound, and this is a crosslinking agent In an acrylic pressure-sensitive adhesive layer formed by crosslinking with a furnace, there was a problem in that, when adhered for a long period of time, the pressure-sensitive adhesive moved to the adherend side, and the synergism of the adhesive force to the adherend was large over time. In order to avoid this, it is known that a copolymer of a (meth)acrylic acid alkylester having an alkyl group having 8 to 10 carbon atoms and a copolymerizable compound having an alcoholic hydroxyl group is used, and an adhesive layer crosslinked with a crosslinking agent is formed ( Patent Document 1).
또한, 상기와 동일한 공중합체에 (메타)아크릴산알킬에스테르와 카르복실기 함유 공중합성 화합물의 공중합체를 소량 배합하고, 이를 가교제로 가교 처리한 점착제층을 형성한 것 등이 제안되어 있다. 그러나, 이들은 표면 장력이 낮아서 표면이 평활한 플라스틱판 등의 표면 보호용으로 사용하면, 가공시나 보존시의 가열에 의해 들뜸 등의 박리 현상을 발생시키는 문제나, 수작업 영역인 고속에서의 박리시의 재박리성이 열악하다는 문제도 있었다.In addition, a small amount of a copolymer of a (meth)acrylic acid alkylester and a carboxyl group-containing copolymerizable compound is blended in the same copolymer as described above, and a pressure-sensitive adhesive layer obtained by crosslinking this with a crosslinking agent is proposed. However, when they are used for surface protection such as plastic plates with a smooth surface due to their low surface tension, there is a problem in that they cause peeling phenomena such as lifting due to heating during processing or storage, or when peeling at high speed in the manual operation area. There also existed a problem that peelability was inferior.
이들 문제를 해결하기 위해, a) 탄소수가 8∼10인 알킬기를 갖는 (메타)아크릴산알킬에스테르를 주성분으로 하는 (메타)아크릴산알킬에스테르 100중량부에, b) 카르복실기 함유 공중합성 화합물 1∼15중량부와, c) 탄소수가 1∼5인 지방족 카르복실산의 비닐에스테르 3∼100중량부를 첨가하여 이루어지는 단량체 혼합물의 공중합체에, 상기 b) 성분의 카르복실기에 대해 당량 이상의 가교제를 배합한 점착제 조성물이 제안되어 있다(특허문헌 2).In order to solve these problems, a) 100 parts by weight of (meth)acrylic acid alkyl ester containing (meth)acrylic acid alkyl ester having an alkyl group having 8 to 10 carbon atoms as a main component, b) 1 to 15 weight part of carboxyl group-containing copolymerizable compound Part and c) a copolymer of a monomer mixture formed by adding 3 to 100 parts by weight of a vinyl ester of an aliphatic carboxylic acid having 1 to 5 carbon atoms, and a crosslinking agent equivalent to or more than the carboxyl group of the component b) is blended. It has been proposed (Patent Document 2).
특허문헌 2에 기재된 점착제 조성물에서는 가공시나 보존시에 있어서 들뜸 등의 박리 현상을 발생시키는 경우가 없고, 또한 접착력의 경시 상승이 작아 재박리성이 우수하며, 장기 보존, 특히 고온 분위기하에서 장기 보존해도 작은 힘으로 재박리할 수 있고, 그 때 피착체 상에 점착제 잔여물을 발생시키지 않으며, 또한 고속 박리를 행했을 때에도 작은 힘으로 재박리할 수 있다고 되어 있다.In the pressure-sensitive adhesive composition described in Patent Document 2, peeling phenomena such as lifting during processing or storage do not occur, and the increase in adhesive strength over time is small and excellent in re-peelability, and long-term storage, especially long-term storage under a high-temperature atmosphere It is said that it can peel again with a small force, and does not generate|occur|produce an adhesive residue on a to-be-adhered body at that time, and also when high-speed peeling is performed, it is said that it can peel again with a small force.
그러나, 특허문헌 2에 기재된 점착제 조성물에서는 실시예 1∼3에 있어서의 점착제층의 겔분율이 90%라는 점에서, 공중합체로부터 미중합 모노머 혹은 올리고머가 용출되기 쉽다. 또한, 특허문헌 2에는 대전 방지 성능 및 내오염 성능에 관한 기재는 없으며, 박리 대전을 일으키기 쉬운 재료를 피착체로 한 경우 우수한 대전 방지 성능 및 내오염 성능을 구비한 점착제층으로 하는 것이 곤란하다는 문제가 있었다.However, in the adhesive composition of patent document 2, since the gel fraction of the adhesive layer in Examples 1-3 is 90 %, an unpolymerized monomer or an oligomer elutes easily from a copolymer. In addition, there is no description regarding antistatic performance and stain resistance performance in Patent Document 2, and when a material that is prone to peeling and charging is used as an adherend, it is difficult to obtain a pressure-sensitive adhesive layer having excellent antistatic performance and stain resistance performance. there was.
또한, (2) 내오염 성능을 갖는 것에 대해서는, 0질량부 이상 0.5질량부 미만의 카르복실기 함유 모노머, 0.6∼9질량부의 히드록시기 함유 (메타)아크릴계 모노머 및 99.4∼90.5질량부의 (메타)아크릴산에스테르 모노머로 이루어지고, 중량 평균 분자량이 10만 이상 100만 미만인 (메타)아크릴계 공중합체 100질량부; 및 카르보디이미드계 가교제 0.1∼5질량부를 포함하는 점착제 조성물이 개시되어 있다(특허문헌 3).Further, (2) for those having stain resistance performance, 0 parts by mass or more and less than 0.5 parts by mass of a carboxyl group-containing monomer, 0.6 to 9 parts by mass of a hydroxyl group-containing (meth)acrylic monomer, and 99.4 to 90.5 parts by mass of a (meth)acrylic acid ester monomer. 100 parts by mass of a (meth)acrylic copolymer having a weight average molecular weight of 100,000 or more and less than 1,000,000; And a pressure-sensitive adhesive composition containing 0.1 to 5 parts by mass of a carbodiimide-based crosslinking agent is disclosed (Patent Document 3).
특허문헌 3에 기재된 점착제 조성물에서는 특정 조성의 (메타)아크릴계 공중합체의 가교제로서 카르보디이미드계 가교제를 사용하는 것을 특징으로 한다. 이로 인해, 점착제층에 오토클레이브 처리시의 압력 및 온도에 의한 수축에 추종할 수 있는 가교 구조를 형성할 수 있다. 이 때문에, 특허문헌 3에 기재된 점착제 조성물을 사용하여 형성된 점착제층은 고온·고압 조건하(오토클레이브 처리시)여도 발포를 억제·방지할 수 있고, 내오염 성능이 우수하며, 또한 투명성도 우수하다고 되어 있다.The pressure-sensitive adhesive composition described in Patent Document 3 is characterized in that a carbodiimide-based crosslinking agent is used as a crosslinking agent for a (meth)acrylic copolymer having a specific composition. For this reason, the crosslinked structure which can follow the shrinkage|contraction by the pressure and temperature at the time of an autoclave process can be formed in an adhesive layer. For this reason, the pressure-sensitive adhesive layer formed using the pressure-sensitive adhesive composition described in Patent Document 3 can suppress and prevent foaming even under high-temperature and high-pressure conditions (in autoclave treatment), and has excellent stain-resistance performance and excellent transparency. has been
그러나, 특허문헌 3에 기재된 점착제 조성물에서는 내오염 성능이 개량되어 있으나, 우수한 점착 성능과 함께 대전 방지 성능을 양립시키는 것은 실현시키지 못하였으며, 추가로 해결해야 할 과제로서 남아 있다.However, in the pressure-sensitive adhesive composition described in Patent Document 3, although the stain resistance performance is improved, it has not been realized to achieve both the excellent adhesion performance and the antistatic performance, and it remains as a problem to be further solved.
또한, (3) 우수한 대전 방지 성능을 갖는 것에 대해서는, 표면 보호 필름에 대전 방지성을 부여시키기 위한 방법으로서, 기재 필름에 대전 방지제를 혼입시키는 방법 등이 알려져 있다. 대전 방지제로는, 예를 들면, (a) 제4급 암모늄염, 피리디늄염, 제1∼3급 아미노기 등의 양이온성기를 갖는 각종 양이온성 대전 방지제, (b) 술폰산염기, 황산에스테르염기, 인산에스테르염기, 포스폰산염기 등의 음이온성기를 갖는 음이온성 대전 방지제, (c) 아미노산계, 아미노황산에스테르계 등의 양쪽성 대전 방지제, (d) 아미노알코올계, 글리세린계, 폴리에틸렌글리콜계 등의 비이온성 대전 방지제, (e) 상기와 같은 대전 방지제를 고분자량화한 고분자형 대전 방지제 등이 개시되어 있다(특허문헌 4).Moreover, (3) About what has the outstanding antistatic performance, the method of mixing an antistatic agent into a base film, etc. are known as a method for providing antistatic property to a surface protection film. Examples of the antistatic agent include (a) quaternary ammonium salts, pyridinium salts, and various cationic antistatic agents having a cationic group such as a primary to tertiary amino group, (b) a sulfonate group, a sulfate group, phosphoric acid Anionic antistatic agents having anionic groups such as ester bases and phosphonate groups, (c) amphoteric antistatic agents such as amino acids and aminosulfate esters, (d) aminoalcohols, glycerin, polyethylene glycol, etc. An on-type antistatic agent, (e) a high molecular weight antistatic agent as described above, etc. are disclosed (patent document 4).
그러나, 특허문헌 4에 기재된 표면 보호 필름에 있어서는 피착체에 대한 이물질 부착에 관련된 대전 방지 성능의 부여에 관한 기재는 있지만, 우수한 점착 성능과 함께 내오염 성능을 양립시키는 수단은 기재되어 있지 않으며, 추가로 해결해야 할 과제로서 남아 있다.However, in the surface protection film described in Patent Document 4, although there is a description regarding the provision of antistatic performance related to the adhesion of foreign substances to the adherend, there is no description of a means for reconciling stain resistance performance with excellent adhesion performance. remains as a challenge to be addressed.
또한, 근래에는 기재 필름에 대전 방지제를 함유시키거나, 혹은 기재 필름의 표면에 도포하지 않고 직접 점착제층에 대전 방지제를 함유시키는 것이 제안되어 있다. 예를 들면, 플루오로기 및 술포닐기를 갖는 음이온을 구비한 염이 폴리에테르기를 주쇄 중에 포함하는 폴리에테르에스테르계 가소제에 용해된 상태로 분산되어 있는 것을 특징으로 하는 제전성 점착제 조성물이 개시되어 있다(특허문헌 5).Moreover, in recent years, making a base film contain an antistatic agent, or making an adhesive layer contain an antistatic agent directly without apply|coating to the surface of a base film is proposed. For example, an antistatic pressure-sensitive adhesive composition is disclosed in which a salt having an anion having a fluoro group and a sulfonyl group is dispersed in a dissolved state in a polyether ester plasticizer containing a polyether group in the main chain. (Patent Document 5).
특허문헌 5에 기재된 점착제 조성물에서는 가소제로서 포화 또는 불포화 비고리형 탄화수소기를 갖는 모노 또는 디카르복실산과, 탄소수 1∼20의 비고리형 탄화수소기를 갖는 알코올로 형성되는 에스테르, 혹은, 상기 불포화 비고리형 탄화수소기 중의 불포화기가 에폭시화된 에스테르로 이루어지는 가소제를 사용하는 것이 개시되어 있다. 이러한 포화 또는 불포화 비고리형 탄화수소기를 갖는 모노 또는 디카르복실산은 점착제층에 사용되는 아크릴계 공중합체를 구성하는 아크릴 단량체의 탄소수와 근접한 탄소수를 가짐으로써, 제전성 점착제 조성물에 있어서의 상용성이 양호해지고, 가소제 아크릴계 제전성 점착제 조성물 중에 가소제가 바람직하게 유지되기 때문에, 블리드 아웃이 억제되다고 되어 있다.In the pressure-sensitive adhesive composition described in Patent Document 5, as a plasticizer, an ester formed of a mono or dicarboxylic acid having a saturated or unsaturated acyclic hydrocarbon group and an alcohol having an acyclic hydrocarbon group having 1 to 20 carbon atoms, or in the unsaturated acyclic hydrocarbon group The use of plasticizers comprising esters in which the unsaturated groups are epoxidized is disclosed. The mono- or dicarboxylic acid having such a saturated or unsaturated acyclic hydrocarbon group has a carbon number close to the carbon number of the acrylic monomer constituting the acrylic copolymer used in the pressure-sensitive adhesive layer, thereby improving compatibility in the antistatic pressure-sensitive adhesive composition, Plasticizer Since a plasticizer is preferably hold|maintained in an acrylic type antistatic adhesive composition, it is said that bleed-out is suppressed.
그러나, 특허문헌 5에 기재된 제전성 점착제 조성물에 있어서는 대전 방지 성능 및 블리드 아웃의 개량 기술의 개시는 있으나, 저속 박리 속도 및 고속 박리 속도에 있어서의 점착력의 밸런스 등 점착 성능이 우수한 것이 얻어지는 점의 기재는 없고, 우수한 점착 성능을 갖는 점착제 조성물을 얻는다는 과제가 남아 있다.However, in the antistatic pressure-sensitive adhesive composition described in Patent Document 5, although there is a disclosure of a technology for improving antistatic performance and bleed-out, excellent adhesion performance such as balance of adhesive force in low-speed peeling rates and high-speed peeling rates is obtained. There is no such thing, and the subject of obtaining the adhesive composition which has the outstanding adhesive performance remains.
상기와 같이, 표면 보호 필름을 구성하는 점착제층에 대해, (1) 저속 박리 속도 및 고속 박리 속도에 있어서 점착력의 밸런스를 갖는 것, (2) 내오염 성능을 갖는 것, (3) 우수한 대전 방지 성능을 갖는 것을 동시에 해결하는 종래 기술은 찾을 수 없다.As described above, with respect to the pressure-sensitive adhesive layer constituting the surface protection film, (1) having a balance of adhesive strength in low-speed peeling rate and high-speed peeling rate, (2) having stain resistance performance, (3) excellent antistatic No prior art can be found that simultaneously solves having performance.
또한, 종래부터 대전 방지 성능을 구비한 점착제 조성물을 사용하여 형성한 점착제층 및 그것을 사용한 표면 보호 필름에 있어서, 대전 방지 성능과 피착체에 대한 내오염 성능은 트레이드 오프의 관계이며, 대전 방지 성능을 유지한 채로 내오염 성능을 개선하는 것은 곤란했다.In addition, in the conventional pressure-sensitive adhesive layer formed using the pressure-sensitive adhesive composition having antistatic performance and the surface protection film using the same, the antistatic performance and the stain resistance performance to the adherend are in a trade-off relationship, and the antistatic performance is It was difficult to improve the stain resistance performance while maintaining it.
나아가 근래에는 표면 보호 필름이 첩합되는 피착체 재질의 종류가 증가하였으며, 또한, 피착체의 표면 처리도 다방면에 걸치기 때문에, 모든 피착체에 대해 내오염 성능과 대전 방지 성능을 동시에 발현시키는 것이 더욱 어려워지고 있다.Furthermore, in recent years, the type of adherend material to which the surface protection film is bonded has increased, and since the surface treatment of the adherend is also applied in various fields, it is more difficult to simultaneously express stain resistance and antistatic performance for all adherends. is losing
본 발명은 상기 사정을 감안하여 이루어진 것이며, 저속 박리 속도 및 고속 박리 속도에 있어서 밸런스가 잡힌 점착력을 갖는 등 우수한 점착 성능과 함께, 대전 방지 성능과 내오염 성능의 양립을 도모하는 것이 가능한 점착제 조성물 및 그것을 사용한 점착 필름, 표면 보호 필름을 제공하는 것을 과제로 한다.The present invention has been made in view of the above circumstances, and it is possible to achieve both antistatic performance and stain resistance performance as well as excellent adhesion performance such as having a balanced adhesive force in a low-speed peeling rate and a high-speed peeling rate, and an adhesive composition and It makes it a subject to provide the adhesion film and surface protection film using the same.
본 발명의 발명자들은 대전 방지제로서, 융점 25∼80℃의 트리플루오로메탄술포네이트 음이온 또는 펜타플루오로에탄술포네이트 음이온을 갖는 실온에서 고체상인 이온성 화합물을 함유하는 점착제 조성물이, 피착체에 대해 대전 방지 성능과 내오염 성능을 동시에 발현할 수 있다는 것을 알아내어, 본 발명을 완성하기에 이르렀다.The inventors of the present invention, as an antistatic agent, a pressure-sensitive adhesive composition containing an ionic compound that is solid at room temperature having a trifluoromethanesulfonate anion or a pentafluoroethanesulfonate anion having a melting point of 25 to 80° C. It has been found that antistatic performance and antifouling performance can be exhibited at the same time, and the present invention has been completed.
본 발명의 대전 방지제로서, 융점 25∼80℃의 피리디늄, 이미다졸륨, 포스포늄, 술포늄, 피롤리디늄, 구아니디늄, 암모늄, 이소우로늄, 티오우로늄, 피페리디늄, 피라졸륨, 메틸륨, 모르폴리늄으로 이루어지는 군으로부터 선택한 1종의 양이온, 및 트리플루오로메탄술포네이트 음이온 또는 펜타플루오로에탄술포네이트 음이온을 갖는 실온에서 고체상인 이온성 화합물을 함유하는 점착제 조성물 및 그것을 사용한 점착 필름, 표면 보호 필름은 우수한 점착 성능과 함께, 대전 방지 성능과 내오염 성능의 양립을 실현할 수 있으며, 종래 기술의 과제를 해결한 것이다.As an antistatic agent of the present invention, pyridinium, imidazolium, phosphonium, sulfonium, pyrrolidinium, guanidinium, ammonium, isouronium, thiouronium, piperidinium, pyrazolium having a melting point of 25 to 80°C A pressure-sensitive adhesive composition containing an ionic compound which is solid at room temperature having one cation selected from the group consisting of , methylium and morpholinium, and a trifluoromethanesulfonate anion or a pentafluoroethanesulfonate anion, and An adhesive film and a surface protection film can realize both antistatic performance and stain resistance performance together with excellent adhesive performance, and solve the problems of the prior art.
상기 과제를 해결하기 위해, 본 발명은 아크릴계 폴리머와, (F) 대전 방지제와, (C) 가교제를 함유하는 점착제 조성물로서, 상기 (F) 대전 방지제가 하기 화학식 (1)로 나타내는 융점 25∼80℃의 이온성 화합물이고,In order to solve the above problems, the present invention provides a pressure-sensitive adhesive composition comprising an acrylic polymer, (F) an antistatic agent, and (C) a crosslinking agent, wherein the (F) antistatic agent has a melting point of 25 to 80 represented by the following formula (1) It is an ionic compound at ℃,
K+·A- (1)K + A - (1)
[화학식 (1) 중, K+는 피리디늄, 이미다졸륨, 포스포늄, 술포늄, 피롤리디늄, 구아니디늄, 암모늄, 이소우로늄, 티오우로늄, 피페리디늄, 피라졸륨, 메틸륨, 모르폴리늄으로 이루어지는 군으로부터 선택한 1종의 양이온이며, A-는 이미드기를 함유하지 않는 트리플루오로메탄술포네이트 음이온, 펜타플루오로에탄술포네이트 음이온으로 이루어지는 군으로부터 선택되는 1종의 음이온이다][In formula (1), K + is pyridinium, imidazolium, phosphonium, sulfonium, pyrrolidinium, guanidinium, ammonium, isouronium, thiouronium, piperidinium, pyrazolium, methylium , is one kind of cation selected from the group consisting of morpholinium, and A - is one kind of anion selected from the group consisting of trifluoromethanesulfonate anion and pentafluoroethanesulfonate anion not containing an imide group ]
상기 아크릴계 폴리머가 유리 전이점 온도가 0℃ 이하인 아크릴계 폴리머이며, 상기 아크릴계 폴리머 100중량부에 대해, 상기 이온성 화합물을 0.01∼10중량부의 비율로 필수 성분으로서 함유하여 이루어지는 것을 특징으로 하는 점착제 조성물을 제공한다.The acrylic polymer is an acrylic polymer having a glass transition point temperature of 0° C. or less, and the ionic compound is contained as an essential component in a ratio of 0.01 to 10 parts by weight based on 100 parts by weight of the acrylic polymer. to provide.
상기 아크릴계 폴리머가 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부에 대해, (B-1) 수산기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상의 합계를 0.01∼10중량부, 및/또는, (B-2) 카르복실기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상의 합계를 0.01∼0.5중량부의 비율로 공중합시킨 공중합체의 아크릴계 폴리머이고, 상기 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부 중, 이소옥틸(메타)아크릴레이트, 이소노닐(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트로 이루어지는 군으로부터 선택한 적어도 1종을 50중량부 이상의 비율로 함유하여 이루어지며, 상기 아크릴계 폴리머의 100중량부에 대해, 상기 (C) 가교제로서 3관능 이상의 이소시아네이트 화합물을 0.1∼10중량부의 비율로 함유하여 이루어지고, 상기 점착제 조성물이 추가로 (D) 금속 킬레이트 화합물의 가교 촉진제와, (E) 케토엔올 호변이성체 화합물을 함유하여 이루어지는 것이 바람직하다.(B-1) At least one type of copolymerizable vinyl monomer containing a hydroxyl group with respect to a total of 100 parts by weight of at least one or more types of (meth)acrylic acid ester monomers having C1 to C18 alkyl group in the acrylic polymer (A) The total is 0.01 to 10 parts by weight, and/or (B-2) an acrylic polymer of a copolymer copolymerized in a ratio of 0.01 to 0.5 parts by weight of the sum of at least one type of copolymerizable vinyl monomer containing a carboxyl group, A) Isooctyl (meth) acrylate, isononyl (meth) acrylate, 2-ethylhexyl (meth) acryl in a total of 100 parts by weight of at least one or more types of (meth)acrylic acid ester monomers having C1 to C18 alkyl group It is made by containing at least one selected from the group consisting of lattice in a ratio of 50 parts by weight or more, and 0.1 to 10 parts by weight of the trifunctional or higher isocyanate compound as the crosslinking agent (C) with respect to 100 parts by weight of the acrylic polymer. It is preferable that the pressure-sensitive adhesive composition further contains (D) a crosslinking accelerator for a metal chelate compound and (E) a ketoenol tautomer compound.
상기 점착제 조성물을 가교시킨 점착제층의 표면 저항률이 1.0×10+12Ω/□ 이하이고, 상기 점착제층의 PMMA 기재 또는 TAC 기재의 표면에 불소 화합물을 함유하는 저굴절률층 형성용 수지 조성물을 사용하여 형성된 저굴절률층에 대한 박리 대전압, 및, PMMA 기재 또는 TAC 기재의 표면에 아무 처리도 되어 있지 않은 플레인층에 대한 박리 대전압이 모두 ±0.3㎸ 이하이며, 상기 점착제층이 편광자에 보호층을 적층하고, 보호층의 표면이 불소 화합물을 함유하는 조성물로 저반사 표면 처리된 편광판인 피착체에 첩합 후, 온도 60℃, 습도 90%RH의 분위기하에 48hr 방치하고, 상기 분위기하로부터 꺼내어 1일 후의 내오염 성능이 상기 피착체의 표면에 대해 「오염 없음」이고, 상기 점착제층의, 상기 PMMA 기재의 표면에 실시된 상기 저굴절률층에 대한 점착력이 저속 박리 속도 0.3m/min에서의 점착력이 0.04∼0.2N/25㎜이며, 또한, 고속 박리 속도 30m/min에서의 점착력이 2.0N/25㎜ 이하인 것이 바람직하다.The surface resistivity of the pressure-sensitive adhesive layer crosslinked with the pressure-sensitive adhesive composition is 1.0×10 +12 Ω/□ or less, and a resin composition for forming a low refractive index layer containing a fluorine compound on the surface of the PMMA substrate or the TAC substrate of the pressure-sensitive adhesive layer is formed using The peel electrification voltage for the low refractive index layer and the peel electrification voltage for the plane layer on which the surface of the PMMA substrate or TAC substrate is not treated are all ±0.3 kV or less, and the pressure-sensitive adhesive layer is laminated with a protective layer on the polarizer After bonding to an adherend, which is a polarizing plate whose surface has been treated with a low-reflection surface-treated composition with a composition containing a fluorine compound, the surface of the protective layer is left to stand for 48 hours under an atmosphere of a temperature of 60° C. and a humidity of 90% RH, taken out from the atmosphere and 1 day after The stain resistance performance is "no staining" with respect to the surface of the adherend, and the adhesive force of the pressure-sensitive adhesive layer to the low refractive index layer applied to the surface of the PMMA substrate is 0.04 at a low peel rate of 0.3 m/min. It is -0.2 N/25 mm, and it is preferable that the adhesive force in high-speed peeling speed 30 m/min is 2.0 N/25 mm or less.
상기 (B-1) 수산기를 함유하는 공중합성 비닐 모노머가 8-히드록시옥틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트, N-히드록시(메타)아크릴아미드, N-히드록시메틸(메타)아크릴아미드, N-히드록시에틸(메타)아크릴아미드로 이루어지는 화합물군 중에서 선택된 적어도 1종 이상이고,(B-1) The copolymerizable vinyl monomer containing a hydroxyl group is 8-hydroxyoctyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2- At least one selected from the group consisting of hydroxyethyl (meth) acrylate, N-hydroxy (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, and N-hydroxyethyl (meth) acrylamide ego,
상기 (B-2) 카르복실기를 함유하는 공중합성 비닐 모노머가 (메타)아크릴산, 카르복시에틸(메타)아크릴레이트, 카르복시펜틸(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸헥사히드로프탈산, 2-(메타)아크릴로일옥시프로필헥사히드로프탈산, 2-(메타)아크릴로일옥시에틸프탈산, 2-(메타)아크릴로일옥시에틸숙신산, 2-(메타)아크릴로일옥시에틸말레산, 카르복시폴리카프로락톤모노(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸테트라히드로프탈산으로 이루어지는 화합물군 중에서 선택된 적어도 1종 이상인 것이 바람직하다.(B-2) the copolymerizable vinyl monomer containing a carboxyl group is (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, 2- (meth)acryloyloxyethylhexahydrophthalic acid, 2-(meth)acryloyloxypropylhexahydrophthalic acid, 2-(meth)acryloyloxyethylphthalic acid, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl maleic acid , carboxypolycaprolactone mono(meth)acrylate, and 2-(meth)acryloyloxyethyltetrahydrophthalic acid are preferably at least one selected from the group consisting of compounds.
상기 점착제 조성물이 상기 아크릴계 폴리머의 100중량부에 대해, 상기 (D) 금속 킬레이트 화합물의 가교 촉진제를 0.001∼0.5중량부와, 상기 (E) 케토엔올 호변이성체 화합물을 0.1∼300중량부의 비율로 함유하여 이루어지고, 상기 (D) 금속 킬레이트 화합물의 가교 촉진제가 알루미늄 킬레이트 화합물, 티탄 킬레이트 화합물, 철 킬레이트 화합물로 이루어지는 군 중에서 선택된 적어도 1종 이상이며, 상기 (E)/상기 (D)의 중량부 비율이 70∼1000인 것이 바람직하다.In the pressure-sensitive adhesive composition, based on 100 parts by weight of the acrylic polymer, 0.001 to 0.5 parts by weight of the (D) metal chelate compound crosslinking accelerator and (E) 0.1 to 300 parts by weight of the ketoenol tautomer compound (D) the crosslinking accelerator of the metal chelate compound is at least one selected from the group consisting of an aluminum chelate compound, a titanium chelate compound, and an iron chelate compound, and (E) / part by weight of (D) It is preferable that the ratio is 70-1000.
또한, 본 발명은 수지 필름의 한쪽 면에 상기 점착제 조성물을 가교시킨 점착제층이 적층되어 있는 것을 특징으로 하는 점착 필름을 제공한다.In addition, the present invention provides a pressure-sensitive adhesive film, characterized in that the pressure-sensitive adhesive layer crosslinked the pressure-sensitive adhesive composition is laminated on one side of the resin film.
또한, 본 발명은 상기 점착 필름이 사용된 표면 보호 필름을 제공한다.In addition, the present invention provides a surface protection film using the adhesive film.
또한, 본 발명은 상기 점착 필름이 사용된 편광판용 표면 보호 필름을 제공한다.In addition, the present invention provides a surface protection film for a polarizing plate in which the adhesive film is used.
또한, 본 발명은 광학 필름의 적어도 한쪽 면에 상기 점착제 조성물을 가교시킨 점착제층이 적층되어 있는 점착제층이 형성된 광학 필름을 제공한다.In addition, the present invention provides an optical film having a pressure-sensitive adhesive layer formed on at least one side of the optical film, in which the pressure-sensitive adhesive layer obtained by crosslinking the pressure-sensitive adhesive composition is laminated.
또한, 본 발명은 상기 수지 필름의 한쪽 면의, 상기 점착제층이 형성된 측과는 반대면에 대전 방지 처리 및 방오 처리가 되어 있는 점착 필름을 제공한다.Furthermore, this invention provides the adhesive film by which the antistatic treatment and antifouling|stain-resistant process are given to the surface opposite to the side on which the said adhesive layer was formed of one side of the said resin film.
본 발명에 따른 점착제 조성물은 종래의 표면 보호 필름용 점착제 조성물과 비교하여 우수한 점착 성능 및 경시 열화되지 않으며 우수한 박리 대전 방지 성능을 갖는다.The pressure-sensitive adhesive composition according to the present invention has excellent adhesion performance and does not deteriorate over time, and has excellent antistatic peeling performance compared to the conventional pressure-sensitive adhesive composition for a surface protection film.
특히, 본 발명에 따른 표면 보호 필름은 피착체가 광학 필름의 표면에 적층된, 불소 화합물을 함유하는 방오층, 또는, 불소 화합물을 함유하는 저굴절률층 형성용 조성물을 사용하여 형성된 저굴절률층에 있어서, 종래 기술에 의한 표면 보호 필름에 비해, 우수한 점착 성능 및 경시 열화되지 않으며 우수한 박리 대전 방지 성능을 갖고 있고, 대전 방지 성능과 내오염 성능의 양립에 현저한 효과가 있다.In particular, the surface protection film according to the present invention is a low-refractive-index layer formed by using an antifouling layer containing a fluorine compound, or a composition for forming a low-refractive-index layer containing a fluorine compound, in which the adherend is laminated on the surface of the optical film. , compared to the surface protection film according to the prior art, has excellent adhesion performance and does not deteriorate over time, has excellent peeling antistatic performance, and has a remarkable effect in coexistence of antistatic performance and stain resistance performance.
즉, 본 발명에 따른 점착제 조성물 및 그것을 사용한 표면 보호 필름은 우수한 점착 성능 및 경시 열화되지 않으며 우수한 박리 대전 방지 성능을 갖추고 있기 때문에, 산업상 이용가치가 매우 크다.That is, since the pressure-sensitive adhesive composition according to the present invention and the surface protection film using the same have excellent adhesive performance, do not deteriorate over time, and have excellent peeling and antistatic performance, industrial use value is very high.
이하, 바람직한 실시형태에 기초하여 본 발명을 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated based on preferable embodiment.
본 실시형태의 점착제 조성물은 아크릴계 폴리머와, (F) 대전 방지제와, (C) 가교제를 함유하는 점착제 조성물로서, 상기 (F) 대전 방지제가 하기 화학식 (1)로 나타내는 융점 25∼80℃의 이온성 화합물이고,The pressure-sensitive adhesive composition of the present embodiment is an acrylic polymer, (F) antistatic agent, and (C) a pressure-sensitive adhesive composition containing a crosslinking agent, wherein the (F) antistatic agent is an ion having a melting point of 25 to 80 ° C. represented by the following formula (1) is a sex compound,
K+·A- (1)K + A - (1)
[화학식 (1) 중, K+는 피리디늄, 이미다졸륨, 포스포늄, 술포늄, 피롤리디늄, 구아니디늄, 암모늄, 이소우로늄, 티오우로늄, 피페리디늄, 피라졸륨, 메틸륨, 모르폴리늄으로 이루어지는 군으로부터 선택한 1종의 양이온이며, A-는 이미드기를 함유하지 않는 트리플루오로메탄술포네이트 음이온, 펜타플루오로에탄술포네이트 음이온으로 이루어지는 군으로부터 선택되는 1종의 음이온이다][In formula (1), K + is pyridinium, imidazolium, phosphonium, sulfonium, pyrrolidinium, guanidinium, ammonium, isouronium, thiouronium, piperidinium, pyrazolium, methylium , is one kind of cation selected from the group consisting of morpholinium, and A - is one kind of anion selected from the group consisting of trifluoromethanesulfonate anion and pentafluoroethanesulfonate anion not containing an imide group ]
상기 아크릴계 폴리머가 유리 전이점 온도가 0℃ 이하인 아크릴계 폴리머이며, 상기 아크릴계 폴리머 100중량부에 대해, 상기 이온성 화합물을 0.01∼10중량부의 비율로 필수 성분으로서 함유하여 이루어지는 것을 특징으로 한다.The acrylic polymer is an acrylic polymer having a glass transition point temperature of 0° C. or less, and the ionic compound is contained as an essential component in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the acrylic polymer.
본 실시형태의 점착제 조성물에 사용되는 아크릴계 폴리머는 점착제 조성물의 주제 폴리머이며, 유리 전이점 온도가 0℃ 이하인 아크릴계 폴리머이다. 또한, 아크릴계 폴리머는 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머를 주성분으로 하는 공중합체가 바람직하다.The acrylic polymer used for the adhesive composition of this embodiment is a main polymer of an adhesive composition, and is an acrylic polymer whose glass transition point temperature is 0 degrees C or less. Further, the acrylic polymer is preferably (A) a copolymer containing, as a main component, a (meth)acrylic acid ester monomer having C1 to C18 carbon atoms in the alkyl group.
(A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머로는, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, 이소부틸(메타)아크릴레이트, 펜틸(메타)아크릴레이트, 헥실(메타)아크릴레이트, 헵틸(메타)아크릴레이트, 옥틸(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 노닐(메타)아크릴레이트, 이소노닐(메타)아크릴레이트, 데실(메타)아크릴레이트, 운데실(메타)아크릴레이트, 도데실(메타)아크릴레이트, 트리데실(메타)아크릴레이트, 테트라데실(메타)아크릴레이트, 펜타데실(메타)아크릴레이트, 헥사데실(메타)아크릴레이트, 헵타데실(메타)아크릴레이트, 옥타데실(메타)아크릴레이트, 시클로펜틸(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트 등을 들 수 있다. 알킬(메타)아크릴레이트 모노머의 알킬기는 직쇄, 분기형, 고리형의 어느 것이어도 된다.(A) As the (meth)acrylic acid ester monomer having C1 to C18 alkyl group, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, isobutyl ( Meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate , nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl ( Meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, cyclopentyl (meth) acrylate, cyclohexyl (meth) Acrylates etc. are mentioned. The alkyl group of the alkyl (meth)acrylate monomer may be linear, branched or cyclic.
본 실시형태의 점착제 조성물에 사용되는 아크릴계 폴리머는 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부 중, 이소옥틸(메타)아크릴레이트, 이소노닐(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트로 이루어지는 군으로부터 선택한 적어도 1종을 50중량부 이상의 비율로 함유하여 이루어지는 것이 바람직하고, 60중량부 이상의 비율로 함유하는 것이 보다 바람직하며, 75중량부 이상의 비율로 함유하는 것이 특히 바람직하다.The acrylic polymer used in the pressure-sensitive adhesive composition of the present embodiment is (A) isooctyl (meth) acrylate, isononyl ( It is preferable to contain at least one selected from the group consisting of meth)acrylate and 2-ethylhexyl (meth)acrylate in a proportion of 50 parts by weight or more, more preferably 60 parts by weight or more, 75 It is especially preferable to contain it in the ratio of weight part or more.
본 실시형태의 점착제 조성물에 사용되는 아크릴계 폴리머는 (B-1) 수산기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상, 및/또는, (B-2) 카르복실기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상을 공중합시킨 공중합체의 아크릴계 폴리머인 것이 바람직하다. 상기 아크릴계 폴리머에는 (B-1) 수산기를 함유하는 공중합성 비닐 모노머, (B-2) 카르복실기를 함유하는 공중합성 비닐 모노머의 적어도 한쪽이 공중합되면 되고, 양쪽 모두가 공중합되어도 된다.The acrylic polymer used in the pressure-sensitive adhesive composition of the present embodiment is (B-1) at least one type of copolymerizable vinyl monomer containing a hydroxyl group, and/or (B-2) at least one copolymerizable vinyl monomer containing a carboxyl group. It is preferable that it is an acrylic polymer of the copolymer which copolymerized 1 or more types. At least one of (B-1) a copolymerizable vinyl monomer containing a hydroxyl group and a copolymerizable vinyl monomer containing a carboxyl group (B-2) may be copolymerized with the said acrylic polymer, and both may be copolymerized.
상기 아크릴계 폴리머가 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부에 대해, (B-1) 수산기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상의 합계를 0.01∼10중량부, 및/또는, (B-2) 카르복실기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상의 합계를 0.01∼0.5중량부의 비율로 공중합시킨 공중합체의 아크릴계 폴리머인 것이 바람직하다.(B-1) At least one type of copolymerizable vinyl monomer containing a hydroxyl group with respect to a total of 100 parts by weight of at least one or more types of (meth)acrylic acid ester monomers having C1 to C18 alkyl group in the acrylic polymer (A) It is preferable that the total is 0.01 to 10 parts by weight, and/or (B-2) an acrylic polymer of a copolymer obtained by copolymerizing the total of at least one type of copolymerizable vinyl monomer containing a carboxyl group in a proportion of 0.01 to 0.5 parts by weight. .
본 실시형태의 점착제 조성물에 사용되는 아크릴계 폴리머에는 (B-1) 수산기를 함유하는 공중합 가능한 모노머를 공중합시켜도 된다. (B-1) 수산기를 함유하는 공중합 가능한 모노머로는, 8-히드록시옥틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트, N-히드록시(메타)아크릴아미드, N-히드록시메틸(메타)아크릴아미드, N-히드록시에틸(메타)아크릴아미드 등으로 이루어지는 화합물군 중에서 선택된 적어도 1종 이상인 것이 바람직하다.(B-1) You may copolymerize the copolymerizable monomer containing a hydroxyl group with the acrylic polymer used for the adhesive composition of this embodiment. (B-1) As a copolymerizable monomer containing a hydroxyl group, 8-hydroxyoctyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2- At least one selected from the group consisting of hydroxyethyl (meth) acrylate, N-hydroxy (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-hydroxyethyl (meth) acrylamide, and the like more preferably.
(B-1) 수산기를 함유하는 공중합 가능한 모노머를 공중합시키는 경우에는 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부에 대해, (B-1) 수산기를 함유하는 공중합 가능한 모노머를 0.01∼10.0중량부의 비율로 함유하여 이루어지는 것이 바람직하고, 0.5∼7.0중량부의 비율로 함유하여 이루어지는 것이 보다 바람직하며, 1.0∼6.0중량부의 비율로 함유하여 이루어지는 것이 특히 바람직하다.(B-1) When copolymerizing a copolymerizable monomer containing a hydroxyl group, (A) with respect to a total of 100 parts by weight of at least one or more of the (meth)acrylic acid ester monomer having C1 to C18 alkyl group (B-1) It is preferably contained in a proportion of 0.01 to 10.0 parts by weight of a copolymerizable monomer containing a hydroxyl group, more preferably contained in a proportion of 0.5 to 7.0 parts by weight, and particularly preferably contained in a proportion of 1.0 to 6.0 parts by weight. do.
본 실시형태의 점착제 조성물에 사용되는 아크릴계 폴리머에는 (B-2) 카르복실기를 함유하는 공중합 가능한 모노머를 공중합시켜도 된다. (B-2) 카르복실기를 함유하는 공중합 가능한 모노머로는, (메타)아크릴산, 카르복시에틸(메타)아크릴레이트, 카르복시펜틸(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸헥사히드로프탈산, 2-(메타)아크릴로일옥시프로필헥사히드로프탈산, 2-(메타)아크릴로일옥시에틸프탈산, 2-(메타)아크릴로일옥시에틸숙신산, 2-(메타)아크릴로일옥시에틸말레산, 카르복시폴리카프로락톤모노(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸테트라히드로프탈산 등으로 이루어지는 화합물군 중에서 선택된 적어도 1종 이상인 것이 바람직하다.You may copolymerize the copolymerizable monomer containing (B-2) a carboxyl group with the acrylic polymer used for the adhesive composition of this embodiment. (B-2) As a copolymerizable monomer containing a carboxyl group, (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, 2- (meth)acryloyloxyethylhexahydrophthalic acid, 2-(meth)acryloyloxypropylhexahydrophthalic acid, 2-(meth)acryloyloxyethylphthalic acid, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl maleic acid , carboxypolycaprolactone mono(meth)acrylate, 2-(meth)acryloyloxyethyltetrahydrophthalic acid, and the like are preferably at least one selected from the group consisting of compounds.
(B-2) 카르복실기를 함유하는 공중합성 비닐 모노머를 공중합시키는 경우에는 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부에 대해, 0.01∼0.5중량부의 비율로 함유하여 이루어지는 것이 바람직하고, 0.01∼0.4중량부의 비율로 함유하여 이루어지는 것이 보다 바람직하며, 0.01∼0.3중량부의 비율로 함유하여 이루어지는 것이 특히 바람직하다.(B-2) When copolymerizing a copolymerizable vinyl monomer containing a carboxyl group, (A) 0.01 to 0.5 weight by weight based on 100 parts by weight of at least one total of at least one C1 to C18 (meth)acrylic acid ester monomer in the alkyl group It is preferable to contain in the ratio of parts, It is more preferable to contain in the ratio of 0.01-0.4 weight part, It is especially preferable to contain in the ratio of 0.01-0.3 weight part.
본 실시형태에 따른 점착제 조성물에 함유시키는 아크릴계 폴리머의 제조 방법은 특별히 한정되지 않으며, 용액 중합법, 유화 중합법 등, 적절히 공지의 중합 방법이 사용 가능하다. 아크릴계 폴리머의 공중합체의 중량 평균 분자량은 예를 들면, 50만∼300만을 들 수 있다. 아크릴계 폴리머의 산가는 0.1∼1.0인 것이 바람직하다. 이로 인해, 내오염 성능을 개선할 수 있다. 여기서 「산가」란, 산의 함유량을 나타내는 지표 중 하나이며, 카르복실기를 함유하는 폴리머 1g을 중화하는데 필요로 하는 수산화 칼륨의 ㎎수로 나타낸다.The manufacturing method of the acrylic polymer contained in the adhesive composition which concerns on this embodiment is not specifically limited, Well-known polymerization methods, such as a solution polymerization method and an emulsion polymerization method, can be used suitably. As for the weight average molecular weight of the copolymer of an acryl-type polymer, 500,000-3 million are mentioned, for example. It is preferable that the acid value of an acrylic polymer is 0.1-1.0. For this reason, stain-resistance performance can be improved. Here, "acid value" is one of the index|indexes which show content of an acid, and is represented by the mg number of potassium hydroxide required to neutralize 1 g of polymer containing a carboxyl group.
본 실시형태에 따른 점착제 조성물은 (F) 대전 방지제를 함유한다. 본 실시형태의 (F) 대전 방지제는 하기 화학식 (1)로 나타내는 융점 25∼80℃의 이온성 화합물이다.The pressure-sensitive adhesive composition according to the present embodiment contains (F) an antistatic agent. The antistatic agent (F) of the present embodiment is an ionic compound having a melting point of 25 to 80°C represented by the following general formula (1).
K+·A- (1)K + A - (1)
[화학식 (1) 중, K+는 피리디늄, 이미다졸륨, 포스포늄, 술포늄, 피롤리디늄, 구아니디늄, 암모늄, 이소우로늄, 티오우로늄, 피페리디늄, 피라졸륨, 메틸륨, 모르폴리늄으로 이루어지는 군으로부터 선택한 1종의 양이온이며, A-는 이미드기를 함유하지 않는 트리플루오로메탄술포네이트 음이온, 펜타플루오로에탄술포네이트 음이온으로 이루어지는 군으로부터 선택되는 1종의 음이온이다][In formula (1), K + is pyridinium, imidazolium, phosphonium, sulfonium, pyrrolidinium, guanidinium, ammonium, isouronium, thiouronium, piperidinium, pyrazolium, methylium , is one kind of cation selected from the group consisting of morpholinium, and A - is one kind of anion selected from the group consisting of trifluoromethanesulfonate anion and pentafluoroethanesulfonate anion not containing an imide group ]
상기 이온성 화합물은 상온에서 고체인 것이 바람직하다. 상온은 예를 들면, 25℃ 미만의 온도이며, 구체적으로는, 23℃에서 고체인 이온성 화합물인 것이 바람직하다. 본 실시형태에 따른 점착제 조성물은 아크릴계 폴리머 100중량부에 대해, 상기 이온성 화합물을 0.01∼10중량부의 비율로 필수 성분으로서 함유하여 이루어진다.The ionic compound is preferably a solid at room temperature. The normal temperature is, for example, a temperature of less than 25°C, and specifically, it is preferable that the ionic compound is a solid at 23°C. The pressure-sensitive adhesive composition according to the present embodiment contains the ionic compound as an essential component in an amount of 0.01 to 10 parts by weight with respect to 100 parts by weight of the acrylic polymer.
(F) 대전 방지제의 구체예로는, 예를 들면, 1-옥틸-2-메틸피리디늄트리플루오로메탄술포네이트염, 1,2,3-트리메틸이미다졸륨 펜타플루오로에탄술포네이트염, 1-부틸-2,3-디메틸이미다졸륨 트리플루오로메탄술포네이트염, 1-헥실-4-메틸피리디늄 펜타플루오로에탄술포네이트염, 1-옥틸-3-메틸피리디늄 트리플루오로메탄술포네이트염, n-옥틸피리디늄 트리플루오로메탄술포네이트염 등을 들 수 있다.(F) Specific examples of the antistatic agent include 1-octyl-2-methylpyridinium trifluoromethanesulfonate salt, 1,2,3-trimethylimidazolium pentafluoroethanesulfonate salt, 1-Butyl-2,3-dimethylimidazolium trifluoromethanesulfonate salt, 1-hexyl-4-methylpyridinium pentafluoroethanesulfonate salt, 1-octyl-3-methylpyridinium trifluoromethane A sulfonate salt, n-octylpyridinium trifluoromethanesulfonate salt, etc. are mentioned.
본 실시형태에 따른 점착제 조성물은 또한 (C) 가교제로서 3관능 이상의 이소시아네이트 화합물을 함유한다. 3관능 이상의 이소시아네이트 화합물로는, 예를 들면, 헥사메틸렌디이소시아네이트, 이소포론디이소시아네이트, 디페닐메탄디이소시아네이트, 톨릴렌디이소시아네이트, 자일릴렌디이소시아네이트 등의 디이소시아네이트류의 뷰렛 변성체나 이소시아누레이트 변성체, 트리메틸올프로판이나, 글리세린 등의 3가 이상의 폴리올과의 어덕트체 등을 들 수 있다. (C) 가교제인 3관능 이상의 이소시아네이트 화합물의 비율로는, 예를 들면, 아크릴계 폴리머의 100중량부에 대해 0.1∼10중량부의 비율로 함유하는 것이 바람직하고, 0.1∼6중량부의 비율로 함유하는 것이 보다 바람직하다.The pressure-sensitive adhesive composition according to the present embodiment further contains (C) an isocyanate compound having a trifunctional or higher function as a crosslinking agent. As a trifunctional or more than trifunctional isocyanate compound, For example, a biuret-modified body of diisocyanates, such as hexamethylene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, tolylene diisocyanate, and xylylene diisocyanate, and an isocyanurate-modified body. Sieves, trimethylolpropane, and adducts with trivalent or higher polyols, such as glycerol, etc. are mentioned. (C) As a ratio of the trifunctional or more than trifunctional isocyanate compound which is a crosslinking agent, it is preferable to contain in the ratio of 0.1-10 weight part with respect to 100 weight part of acrylic polymer, for example, Containing in the ratio of 0.1-6 weight part more preferably.
본 실시형태에 따른 점착제 조성물은 (E) 케토엔올 호변이성체 화합물을 함유해도 된다. (E) 케토엔올 호변이성체 화합물로는, 아세토초산메틸, 아세토초산에틸, 아세토초산옥틸, 아세토초산올레일, 아세토초산라우릴, 아세토초산스테아릴 등의 β-케토에스테르나, 아세틸아세톤, 2,4-헥산디온, 벤조일아세톤 등의 β-디케톤을 들 수 있다. 이들은 폴리이소시아네이트 화합물을 가교제로 하는 점착제 조성물에 있어서, 가교제가 갖는 이소시아네이트기를 블록함으로써, 가교제의 배합 후에 있어서의 점착제 조성물의 과도한 점도 상승이나 겔화를 억제하고, 점착제 조성물의 포트 라이프를 연장할 수 있다. (E) 케토엔올 호변이성체 화합물은 특히 아세틸아세톤, 아세토초산에틸로 이루어지는 화합물군 중에서 선택된 적어도 1종 이상인 것이 바람직하다. 상기 아크릴계 폴리머의 100중량부에 대해, (E) 케토엔올 호변이성체 화합물을 0.1∼300중량부의 비율로 함유하는 것이 바람직하다.The pressure-sensitive adhesive composition according to the present embodiment may contain (E) a ketoenol tautomer compound. (E) Ketoenol tautomer compounds include methyl acetoacetate, ethyl acetoacetate, octyl acetoacetate, oleyl acetoacetate, lauryl acetoacetate, β-ketoester such as stearyl acetoacetate, acetylacetone, 2 and β-diketones such as ,4-hexanedione and benzoylacetone. In the adhesive composition which uses a polyisocyanate compound as a crosslinking agent, by blocking the isocyanate group which a crosslinking agent has, excessive viscosity rise and gelation of the adhesive composition after mixing|blending of a crosslinking agent are suppressed, and the pot life of an adhesive composition can be extended. (E) The ketoenol tautomer compound is preferably at least one selected from the group consisting of acetylacetone and ethyl acetoacetate. It is preferable to contain the (E) ketoenol tautomer compound in a ratio of 0.1 to 300 parts by weight with respect to 100 parts by weight of the acrylic polymer.
본 실시형태에 따른 점착제 조성물은 (D) 금속 킬레이트 화합물의 가교 촉진제를 함유해도 된다. (D) 금속 킬레이트 화합물의 가교 촉진제는 폴리이소시아네이트 화합물을 가교제로 하는 경우에, 상기 공중합체와 가교제의 반응(가교 반응)에 대해 촉매로서 기능하는 물질이면 된다. (D) 금속 킬레이트 화합물의 가교 촉진제는 중심 금속 원자 M에 1 이상의 다좌 배위자 L이 결합한 화합물이다. 금속 킬레이트 화합물은 금속 원자 M에 결합하는 1 이상의 단좌 배위자 X를 가져도 되고, 갖지 않아도 된다. 금속 킬레이트 화합물의 구체예로는, 트리스(2,4-펜탄디오네이트)철(III), 철 트리스아세틸아세토네이트, 티타늄 트리스아세틸아세토네이트, 루테늄 트리스아세틸아세토네이트, 아연 비스아세틸아세토네이트, 알루미늄 트리스아세틸아세토네이트, 지르코늄 테트라키스아세틸아세토네이트, 트리스(2,4-헥산디오네이트)철(III), 비스(2,4-헥산디오네이트)아연, 트리스(2,4-헥산디오네이트)티탄, 트리스(2,4-헥산디오네이트)알루미늄, 테트라키스(2,4-헥산디오네이트)지르코늄 등을 들 수 있다.The adhesive composition which concerns on this embodiment may contain the crosslinking accelerator of (D) a metal chelate compound. (D) The crosslinking accelerator of the metal chelate compound may be any substance that functions as a catalyst for the reaction (crosslinking reaction) of the copolymer and the crosslinking agent when a polyisocyanate compound is used as a crosslinking agent. (D) The crosslinking accelerator of the metal chelate compound is a compound in which one or more polydentate ligands L are bonded to a central metal atom M. The metal chelate compound may or may not have one or more monodentate ligands X bonded to the metal atom M. Specific examples of the metal chelate compound include tris(2,4-pentanedionate)iron(III), iron trisacetylacetonate, titanium trisacetylacetonate, ruthenium trisacetylacetonate, zinc bisacetylacetonate, aluminum tris Acetylacetonate, zirconium tetrakisacetylacetonate, tris(2,4-hexanedionate)iron(III), bis(2,4-hexanedionate)zinc, tris(2,4-hexanedionate)titanium, Tris(2,4-hexanedionate)aluminum, tetrakis(2,4-hexanedionate)zirconium, etc. are mentioned.
(D) 금속 킬레이트 화합물의 가교 촉진제로는, 알루미늄 킬레이트 화합물, 티탄 킬레이트 화합물, 철 킬레이트 화합물로 이루어지는 군 중에서 선택된 적어도 1종 이상의 금속 킬레이트 화합물인 것이 바람직하다. 상기 아크릴계 폴리머의 100중량부에 대해, (D) 금속 킬레이트 화합물의 가교 촉진제를 0.001∼0.5중량부의 비율로 함유하는 것이 바람직하다.(D) The crosslinking accelerator of the metal chelate compound is preferably at least one metal chelate compound selected from the group consisting of an aluminum chelate compound, a titanium chelate compound, and an iron chelate compound. It is preferable to contain the crosslinking accelerator of (D) a metal chelate compound in the ratio of 0.001-0.5 weight part with respect to 100 weight part of said acrylic polymers.
(E) 케토엔올 호변이성체 화합물은 (D) 금속 킬레이트 화합물의 가교 촉진제와는 반대로 가교를 억제하는 효과를 갖는다는 점에서, (E) 케토엔올 호변이성체 화합물과 (D) 금속 킬레이트 화합물의 가교 촉진제의 비율을 적절히 설정하는 것이 바람직하다. 점착제 조성물의 포트 라이프를 길게 하고, 저장 안정성을 향상시키려면, (E)/(D)의 중량부 비율이 70∼1000인 것이 바람직하고, 70∼700인 것이 보다 바람직하며, 70∼300인 것이 특히 바람직하다. 여기서, (E)/(D)의 중량부 비율이란, (E)의 중량부를 (D)의 중량부로 나누어 얻어진 몫의 값이다.(E) the ketoenol tautomer compound has an effect of inhibiting crosslinking as opposed to the crosslinking accelerator of (D) the metal chelate compound, It is preferable to appropriately set the ratio of the crosslinking accelerator. In order to lengthen the pot life of an adhesive composition and to improve storage stability, it is preferable that the weight part ratio of (E)/(D) is 70-1000, It is more preferable that it is 70-700, It is 70-300 Especially preferred. Here, the weight part ratio of (E)/(D) is the value of the quotient obtained by dividing the weight part of (E) by the weight part of (D).
본 실시형태에 따른 점착제 조성물은 임의 성분으로서, (H) 폴리에테르 변성 실록산 화합물을 함유해도 된다. (H) 폴리에테르 변성 실록산 화합물은 폴리에테르기를 갖는 실록산 화합물이고, 통상의 실록산 단위〔-SiR1 2-O-〕외에, 폴리에테르기를 갖는 실록산 단위〔-SiR1(R2O(R3O)nR4)-O-〕를 갖는다. 여기서, R1은 1종 또는 2종 이상의 알킬기 또는 아릴기, R2 및 R3은 1종 또는 2종 이상의 알킬렌기, R4는 1종 또는 2종 이상의 알킬기나 아실기 등(말단기)을 나타낸다. 폴리에테르기로는, 폴리옥시에틸렌기〔(C2H4O)n〕나 폴리옥시프로필렌기〔(C3H6O)n〕등의 폴리옥시알킬렌기를 들 수 있다. 폴리에테르기를 갖는 실록산 단위에 있어서, 폴리에테르기의 말단이 OH기(상기 화학식에 있어서 R4=H)여도 된다.The pressure-sensitive adhesive composition according to the present embodiment may contain (H) a polyether-modified siloxane compound as an optional component. (H) The polyether-modified siloxane compound is a siloxane compound having a polyether group, and in addition to the normal siloxane unit [-SiR 1 2 -O-], a siloxane unit having a polyether group [-SiR 1 (R 2 O(R 3 O) ) n R 4 )-O-]. Here, R 1 is one or more alkyl or aryl groups, R 2 and R 3 are one or two or more alkylene groups, R 4 is one or more alkyl or acyl groups (terminal groups) indicates. Examples of the polyether group include polyoxyalkylene groups such as polyoxyethylene group [(C 2 H 4 O) n ] and polyoxypropylene group [(C 3 H 6 O) n ]. In the siloxane unit having a polyether group, the terminal of the polyether group may be an OH group (R 4 =H in the above formula).
(H) 폴리에테르 변성 실록산 화합물은 HLB값이 6∼12인 폴리에테르 변성 실록산 화합물인 것이 바람직하다. 또한, 상기 아크릴계 폴리머의 100중량부에 대해, (H) 폴리에테르 변성 실록산 화합물이 0.01∼0.5중량부 포함되는 것이 바람직하고, 0.02∼0.35중량부 포함되는 것이 보다 바람직하며, 0.02∼0.25중량부 포함되는 것이 특히 바람직하다. HLB값이란, 예를 들면 JIS K3211(계면활성제 용어) 등으로 규정하는 친수 친유 밸런스(친수성 친유성비)이다.(H) The polyether-modified siloxane compound is preferably a polyether-modified siloxane compound having an HLB value of 6 to 12. In addition, with respect to 100 parts by weight of the acrylic polymer, (H) polyether-modified siloxane compound is preferably contained in an amount of 0.01 to 0.5 parts by weight, more preferably 0.02 to 0.35 parts by weight, and 0.02 to 0.25 parts by weight. It is particularly preferable to be An HLB value is a hydrophilic-lipophilic balance (hydrophilic-lipophilic ratio) prescribed|regulated, for example by JISK3211 (surfactant term) etc.
폴리에테르 변성 실록산 화합물은 예를 들면, 수소화규소기를 갖는 폴리오르가노실록산 주쇄에 대해, 불포화 결합 및 폴리옥시알킬렌기를 갖는 유기 화합물을 히드로실릴화 반응에 의해 그래프트시킴으로써 얻을 수 있다. 구체적으로는, 디메틸실록산·메틸(폴리옥시에틸렌)실록산 공중합체, 디메틸실록산·메틸(폴리옥시에틸렌)실록산·메틸(폴리옥시프로필렌)실록산 공중합체, 디메틸실록산·메틸(폴리옥시프로필렌)실록산 중합체 등을 들 수 있다.The polyether-modified siloxane compound can be obtained by, for example, grafting an organic compound having an unsaturated bond and a polyoxyalkylene group to a polyorganosiloxane main chain having a silicon hydride group by hydrosilylation reaction. Specifically, dimethylsiloxane/methyl (polyoxyethylene) siloxane copolymer, dimethylsiloxane/methyl (polyoxyethylene) siloxane/methyl (polyoxypropylene) siloxane copolymer, dimethylsiloxane/methyl (polyoxypropylene) siloxane polymer, etc. can be heard
(H) 폴리에테르 변성 실록산 화합물을 점착제 조성물에 배합함으로써, 점착제층의 점착력 및 리워크 성능을 개선할 수 있다. (H) 폴리에테르 변성 실록산 화합물의 중량 평균 분자량은 10000 이하인 것이 바람직하다. 아크릴계 폴리머와의 상용성의 관점에서는 HLB값이 낮고, 분자량이 낮은 편이 상용성은 양호하지만, 분자량이 낮은 폴리에테르 변성 실록산 화합물이면, HLB값이 비교적 높고, 폴리머와의 상용성이 약간 낮아도 우수한 대전 방지성이 얻어진다.(H) By mix|blending a polyether modified siloxane compound with an adhesive composition, the adhesive force of an adhesive layer and rework performance can be improved. (H) It is preferable that the weight average molecular weight of a polyether modified siloxane compound is 10000 or less. From the viewpoint of compatibility with the acrylic polymer, the lower the HLB value and the lower the molecular weight, the better the compatibility. However, in the case of a polyether-modified siloxane compound having a low molecular weight, the HLB value is relatively high and the compatibility with the polymer is slightly low, but excellent antistatic properties this is obtained
본 실시형태의 점착제 조성물은 상술한 첨가제에 한정하지 않고, 계면활성제, 경화 촉진제, 가소제, 충전제, 경화 지연제, 가공 보조제, 노화 방지제, 산화 방지제 등의 공지의 첨가제가 적당하게 배합되어도 된다. 이들은 단독으로, 혹은 2종 이상을 함께 사용할 수 있다.The pressure-sensitive adhesive composition of the present embodiment is not limited to the additives described above, and well-known additives such as surfactants, curing accelerators, plasticizers, fillers, curing retarders, processing aids, antioxidants, and antioxidants may be appropriately blended. These can be used individually or in combination of 2 or more types.
본 실시형태의 점착제 조성물은 편광판의 편광자 보호층에 첩합되는 표면 보호 필름용 점착제 조성물로서 바람직하다. 여기서, 편광판의 편광자 보호층이 TAC계 필름, PMMA계 필름, PET계 필름으로 이루어지는 군으로부터 선택된 1종을 들 수 있다. 여기서, TAC는 트리아세틸셀룰로오스, PMMA는 폴리메틸메타크릴레이트, PET는 폴리에틸렌테레프탈레이트의 약칭이다.The adhesive composition of this embodiment is suitable as an adhesive composition for surface protection films bonded by the polarizer protective layer of a polarizing plate. Here, the polarizer protective layer of the polarizing plate may be one selected from the group consisting of a TAC-based film, a PMMA-based film, and a PET-based film. Here, TAC is an abbreviation of triacetyl cellulose, PMMA is polymethyl methacrylate, and PET is an abbreviation of polyethylene terephthalate.
또한, 편광판의 편광자 보호층의 표면에 실시되어 있는 표면 처리가 미처리, AG 처리, LR 처리, AR 처리, AG-LR 처리, AG-AR 처리로 이루어지는 군으로부터 선택된 1종이어도 된다. 여기서, AG란 안티 글레어(Anti Glare), LR이란 로우 리플렉션(Low Reflection), AR이란 안티 리플렉션(Anti Reflection)이다.Further, the surface treatment applied to the surface of the polarizer protective layer of the polarizing plate may be one selected from the group consisting of untreated, AG treatment, LR treatment, AR treatment, AG-LR treatment, and AG-AR treatment. Here, AG is anti-glare, LR is low reflection, and AR is anti-reflection.
본 실시형태의 점착제 조성물을 가교시킨 점착제층은 점착제층의 표면 저항률이 1.0×10+12Ω/□ 이하인 것이 바람직하고, 5.0×10+11Ω/□ 이하인 것이 보다 바람직하며, 1.0×10+11Ω/□ 이하인 것이 특히 바람직하다. 표면 저항률이 크면, 점착제층을 피착체로부터 박리할 때 발생한 정전기를 빠져나가게 하는 성능이 열악하다. 이 때문에, 표면 저항률을 충분히 작게 함으로써, 점착제층을 피착체로부터 박리할 때 발생하는 정전기에 수반하여 생기는 박리 대전압이 저감되고, 피착체에 영향을 주는 것을 억제할 수 있다.The pressure-sensitive adhesive layer in which the pressure-sensitive adhesive composition of the present embodiment is crosslinked has a surface resistivity of preferably 1.0×10 +12 Ω/□ or less, more preferably 5.0×10 +11 Ω/□ or less, and 1.0×10 +11 Ω/□ or less. It is especially preferable that it is the following. When the surface resistivity is large, the performance for dissipating static electricity generated when the pressure-sensitive adhesive layer is peeled from the adherend is poor. For this reason, by making the surface resistivity sufficiently small, the peeling electrification voltage which arises accompanying static electricity which arises when peeling an adhesive layer from a to-be-adhered body is reduced, and it can suppress that it affects a to-be-adhered body.
본 실시형태의 점착제 조성물을 가교시킨 점착제층은 불소 화합물을 함유하는 저굴절률층 형성용 수지 조성물을 사용하여 형성된 저굴절률층에 대한, 점착제층의 박리 대전압이 ±0.3㎸ 이하, 즉 ―0.3∼+0.3㎸의 범위 내인 것이 바람직하다. 저굴절률층 형성용 조성물에 사용되는 불소 화합물로는, 불소화 올레핀류, 불소화 비닐에테르류, 불소화 알킬(메타)아크릴레이트 등의 1종 또는 2종 이상의 중합물인 함불소 공중합체, 불소화 알킬기 함유 실란 화합물 등의 축합물을 들 수 있다. 함불소 공중합체는 불소화된 모노머를 비롯하여, 올레핀류, 비닐에테르류, (메타)아크릴레이트 등의 불소화되어 있지 않은 모노머가 공중합되어 있어도 된다. 저굴절률층은 고굴절률층 등과 조합하여 반사 방지층을 구성해도 된다.The pressure-sensitive adhesive layer in which the pressure-sensitive adhesive composition of the present embodiment is crosslinked has a peeling electrification voltage of the pressure-sensitive adhesive layer of ±0.3 kV or less, i.e., -0.3 to It is preferable to exist in the range of +0.3 kV. Examples of the fluorine compound used in the composition for forming a low refractive index layer include a fluorinated copolymer which is one or two or more polymers such as fluorinated olefins, fluorinated vinyl ethers, and fluorinated alkyl (meth) acrylates, and fluorinated alkyl group-containing silane compounds. Condensates, such as these are mentioned. The fluorinated copolymer may be copolymerized with fluorinated monomers and non-fluorinated monomers such as olefins, vinyl ethers and (meth)acrylates. The low-refractive-index layer may be combined with a high-refractive-index layer or the like to constitute an antireflection layer.
저굴절률층에 대한 박리 대전압을 측정할 때, 표면에 저굴절률층을 형성하기 위한 기재로는, PMMA 기재 및 TAC 기재를 들 수 있다. 또한, 본 실시형태의 점착제 조성물을 가교시킨 점착제층은 PMMA 기재 또는 TAC 기재의 표면에 아무 처리도 되어 있지 않은 플레인층에 대한 박리 대전압이 ±0.3㎸ 이하, 즉, ―0.3∼+0.3㎸의 범위 내인 것이 바람직하다.When measuring the peel electrification voltage with respect to a low-refractive-index layer, as a base material for forming a low-refractive-index layer on the surface, a PMMA base material and a TAC base material are mentioned. In addition, the pressure-sensitive adhesive layer in which the pressure-sensitive adhesive composition of the present embodiment is crosslinked has a peel electrification voltage of ±0.3 kV or less, that is, −0.3 to +0.3 kV, with respect to the plane layer on which the surface of the PMMA substrate or the TAC substrate is not subjected to any treatment. It is preferable to be within the range of
점착제층은 피착체에 첩합한 후, 온도 60℃, 습도 90%RH의 분위기하에 48hr 방치하고, 상기 분위기하로부터 꺼내어 1일 후의 내오염 성능이 상기 피착체의 표면에 대해 「오염 없음」인 것이 바람직하다. 피착체로는 편광자에 보호층을 적층하고, 보호층의 표면이 불소 화합물을 함유하는 조성물로 저반사 표면 처리된 편광판을 들 수 있다. 저반사 표면 처리에 사용되는 불소 화합물을 함유하는 조성물은 상술한 불소 화합물을 함유하는 저굴절률층 형성용 수지 조성물과 동일해도 되고 상이해도 된다. 보호층으로는 PMMA 기재 및 TAC 기재 등을 들 수 있다.After the pressure-sensitive adhesive layer is bonded to the adherend, it is left for 48 hours in an atmosphere of a temperature of 60° C. and a humidity of 90% RH, and the contamination resistance performance after one day after being taken out from the atmosphere is “no contamination” with respect to the surface of the adherend. desirable. Examples of the adherend include a polarizing plate in which a protective layer is laminated on a polarizer and the surface of the protective layer is treated with a composition containing a fluorine compound to have a low reflection surface. The composition containing the fluorine compound used for low-reflection surface treatment may be the same as or different from the resin composition for low-refractive-index layer formation containing the fluorine compound mentioned above. Examples of the protective layer include a PMMA substrate and a TAC substrate.
본 실시형태의 점착제 조성물을 가교시켜 이루어지는 점착제층의 상기 PMMA 기재의 표면에 실시된 상기 저굴절률층에 대한 점착력은 저속 박리 속도 0.3m/min에서의 점착력이 0.04∼0.2N/25㎜이고, 고속 박리 속도 30m/min에서의 점착력이 2.0N/25㎜ 이하인 것이 바람직하며, 고속 박리 속도 30m/min에서의 점착력이 0.2∼1.6N/25㎜인 것이 보다 바람직하다. 이로 인해, 점착력이 박리 속도에 의해서도 변화가 적은 성능이 얻어지고, 고속 박리에 의해서도 신속하게 박리하는 것이 가능해진다. 또한, 재접착을 위해 일단 표면 보호 필름을 박리할 때도, 과대한 힘을 필요로 하지 않고, 피착체로부터 박리하기 용이하다.The adhesive force of the adhesive layer formed by crosslinking the pressure-sensitive adhesive composition of the present embodiment to the low refractive index layer applied to the surface of the PMMA substrate is 0.04 to 0.2 N/25 mm at a low-speed peeling rate of 0.3 m/min, and high-speed It is preferable that the adhesive force in 30 m/min of peeling rates is 2.0 N/25 mm or less, and it is more preferable that the adhesive force in 30 m/min of high-speed peeling rates is 0.2-1.6 N/25 mm. For this reason, the performance with little change in adhesive force also with peeling speed is acquired, and it becomes possible to peel quickly also by high-speed peeling. Moreover, even when peeling the surface protection film once for re-adhesiveness, it does not require excessive force and it is easy to peel from a to-be-adhered body.
본 실시형태의 점착제 조성물을 가교하여 이루어지는 점착제층의 겔분율은 95∼100%인 것이 바람직하고, 97∼100%인 것이 보다 바람직하다. 이와 같이 점착제층의 겔분율이 높음으로써, 저속 박리 속도에 있어서 점착력이 과대해지지 않고, 공중합체로부터의 미중합 모노머 혹은 올리고머의 용출이 저감되며, 리워크성이나 고온·고습도에 있어서의 내구성이 개선되어 피착체의 오염을 억제할 수 있다.It is preferable that it is 95-100 %, and, as for the gel fraction of the adhesive layer formed by bridge|crosslinking the adhesive composition of this embodiment, it is more preferable that it is 97-100 %. As described above, since the gel fraction of the pressure-sensitive adhesive layer is high, the adhesive force is not excessive at a low peel rate, the elution of unpolymerized monomers or oligomers from the copolymer is reduced, and the reworkability and durability at high temperature and high humidity are improved. contamination of the adherend can be suppressed.
본 실시형태의 점착 필름은 본 실시형태의 점착제 조성물을 가교하여 이루어지는 점착제층을 수지 필름의 한쪽 면 또는 양면에 형성하여 이루어지는 것이다. 또한, 본 실시형태의 표면 보호 필름은 본 실시형태의 점착제 조성물을 가교하여 이루어지는 점착제층을 수지 필름의 한쪽 면에 형성하여 이루어지는 표면 보호 필름이다. 본 실시형태의 점착제 조성물은 우수한 대전 방지 성능을 구비하고, 저속 박리 속도 및 고속 박리 속도에 있어서 점착력의 밸런스가 우수하며, 또한 내오염 성능을 갖는다. 이 때문에, 편광판의 표면 보호 필름의 용도로서 바람직하게 사용할 수 있다.The adhesive film of this embodiment forms the adhesive layer formed by bridge|crosslinking the adhesive composition of this embodiment on one side or both surfaces of a resin film. Moreover, the surface protection film of this embodiment is a surface protection film formed by forming in one surface of a resin film the adhesive layer formed by bridge|crosslinking the adhesive composition of this embodiment. The adhesive composition of this embodiment is equipped with the outstanding antistatic performance, it is excellent in the balance of adhesive force in a low-speed peeling rate and a high-speed peeling rate, and has stain-resistance performance. For this reason, it can use suitably as a use of the surface protection film of a polarizing plate.
점착제층의 기재 필름이나, 점착면을 보호하는 이형 필름(세퍼레이터)으로는 폴리에스테르 필름 등의 수지 필름 등을 사용할 수 있다.A resin film, such as a polyester film, etc. can be used as the base film of an adhesive layer, and the release film (separator) which protects an adhesive surface.
수지 필름의 한쪽 면의 상기 점착제층이 형성된 측과는 반대면에 대전 방지 처리 및 방오 처리가 되어 있어도 된다. 대전 방지 처리로는, 대전 방지제의 도포나 혼입 등을 들 수 있다. 방오 처리로는, 실리콘계, 불소계의 이형제나 코트제, 실리카 미립자 등에 의한 처리를 들 수 있다. 이형 필름에는 점착제층의 점착면과 맞춰지는 측의 면에 실리콘계, 불소계, 장쇄 알킬계의 이형제 등에 의해 이형 처리가 실시되어도 된다.Antistatic treatment and antifouling treatment may be given to the surface opposite to the side in which the said adhesive layer of one side of a resin film was formed. As antistatic treatment, application|coating, mixing, etc. of an antistatic agent are mentioned. As an antifouling|stain-resistant treatment, the process by a silicone type, a fluorine type mold release agent, a coating agent, silica microparticles|fine-particles, etc. is mentioned. The release film may be subjected to a release treatment with a silicone-based, fluorine-based, or long-chain alkyl-based mold release agent or the like on the surface on the side aligned with the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer.
또한, 광학 필름의 적어도 한쪽 면에 본 실시형태의 점착제 조성물을 가교시킨 점착제층을 적층함으로써, 점착제층이 형성된 광학 필름을 얻을 수 있다. 광학 필름으로는, 편광 필름, 위상차 필름, 반사 방지 필름, 방현(안티 글레어) 필름, 자외선 흡수 필름, 적외선 흡수 필름, 광학 보상 필름, 휘도 향상 필름 등을 들 수 있다. 광학 부재가 적용되는 기기로는, 액정 패널, 유기 EL 패널, 터치 패널 등을 들 수 있다.Moreover, the optical film with an adhesive layer can be obtained by laminating|stacking the adhesive layer which bridge|crosslinked the adhesive composition of this embodiment on at least one surface of an optical film. As an optical film, a polarizing film, retardation film, an antireflection film, an anti-glare (anti-glare) film, an ultraviolet-ray absorption film, an infrared-absorbing film, an optical compensation film, a brightness improvement film, etc. are mentioned. As an apparatus to which an optical member is applied, a liquid crystal panel, organic electroluminescent panel, a touch panel, etc. are mentioned.
편광판용 표면 보호 필름 등의 광학용 표면 보호 필름 및 점착 필름의 경우, 기재 필름 및 점착제층은 충분한 투명성을 갖는 것이 바람직하다.In the case of a surface protection film for optics, such as a surface protection film for polarizing plates, and an adhesive film, it is preferable that a base film and an adhesive layer have sufficient transparency.
실시예Example
이하, 실시예를 들어 본 발명을 구체적으로 설명한다.Hereinafter, the present invention will be described in detail with reference to Examples.
<아크릴계 폴리머의 제조><Production of acrylic polymer>
[실시예 1][Example 1]
교반기, 온도계, 환류 냉각기 및 질소 도입관을 구비한 반응 장치에 질소 가스를 도입하고, 반응 장치 내의 공기를 질소 가스로 치환했다. 그 후, 반응 장치에 2-에틸헥실아크릴레이트 100중량부, 8-히드록시옥틸아크릴레이트 6.0중량부, 아크릴산 0.1중량부와 함께, 용제(초산에틸)를 첨가했다. 그 후, 중합 개시제로서 아조비스이소부티로니트릴 0.1중량부를 2시간에 걸쳐 적하시키고, 65℃에서 6시간 반응시켜, 실시예 1에 사용되는 아크릴계 폴리머를 얻었다.Nitrogen gas was introduced into a reaction apparatus equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen introduction tube, and the air in the reaction apparatus was replaced with nitrogen gas. Then, the solvent (ethyl acetate) was added to the reaction apparatus with 100 weight part of 2-ethylhexyl acrylates, 6.0 weight part of 8-hydroxyoctyl acrylate, and 0.1 weight part of acrylic acid. Then, 0.1 weight part of azobisisobutyronitrile as a polymerization initiator was dripped over 2 hours, it was made to react at 65 degreeC for 6 hours, and the acrylic polymer used for Example 1 was obtained.
[실시예 2∼6 및 비교예 1∼3][Examples 2 to 6 and Comparative Examples 1 to 3]
모노머의 조성을 각각 표 1의 (A), (B-1), (B-2)의 기재와 동일하게 한 것 이외에는 상기 실시예 1에 사용되는 아크릴계 폴리머 용액과 동일하게 하여, 실시예 2∼6 및 비교예 1∼3에 사용되는 아크릴계 폴리머 용액을 얻었다.Examples 2 to 6 were carried out in the same manner as in the acrylic polymer solution used in Example 1, except that the monomer composition was the same as described in Table 1 (A), (B-1) and (B-2), respectively. And acrylic polymer solutions used in Comparative Examples 1 to 3 were obtained.
<점착제 조성물 및 표면 보호 필름의 제조><Preparation of adhesive composition and surface protection film>
[실시예 1][Example 1]
상기와 같이 제조한 실시예 1의 아크릴계 폴리머 용액에 대해, 가교제(코로네이트 HX) 2.5중량부, 대전 방지제(1-옥틸-2-메틸피리디늄 트리플루오로메탄술포네이트염) 1.5중량부, 가교 촉매(티타늄 트리스아세틸아세토네이트) 0.1중량부, 아세틸아세톤 8.5중량부를 첨가해 교반 혼합하여, 실시예 1의 점착제 조성물을 얻었다. 이 점착제 조성물을 이형 필름(실리콘 수지 코트된 PET 필름) 위에 도포 후, 90℃에서 건조시킴으로써 용제를 제거하고, 두께가 20㎛인 점착제층을 얻었다. 그 후, 기재 필름(한쪽 면에 대전 방지 및 방오 처리된 PET 필름)의, 대전 방지 및 방오 처리된 면과는 반대의 면에 이형 필름이 형성된 점착제층을 전사시켜, 「기재 필름/점착제층/이형 필름」의 적층 구성을 갖는 실시예 1의 표면 보호 필름을 얻었다.With respect to the acrylic polymer solution of Example 1 prepared as above, 2.5 parts by weight of a crosslinking agent (Coronate HX), 1.5 parts by weight of an antistatic agent (1-octyl-2-methylpyridinium trifluoromethanesulfonate salt), crosslinking 0.1 parts by weight of a catalyst (titanium trisacetylacetonate) and 8.5 parts by weight of acetylacetone were added, stirred and mixed, and the pressure-sensitive adhesive composition of Example 1 was obtained. After apply|coating this adhesive composition on the release film (silicone resin-coated PET film), the solvent was removed by drying at 90 degreeC, and the 20-micrometer-thick adhesive layer was obtained. Thereafter, the adhesive layer with the release film formed on the opposite side to the antistatic and antifouling side of the base film (PET film with antistatic and antifouling treatment on one side) is transferred, and “base film / adhesive layer / The surface protection film of Example 1 which has the laminated constitution of "release film" was obtained.
[실시예 2∼6 및 비교예 1∼3][Examples 2 to 6 and Comparative Examples 1 to 3]
첨가제의 조성을 각각 표 1의 (C)∼(F)의 기재와 같이 한 것 이외에는 상기 실시예 1의 표면 보호 필름과 동일하게 하여, 실시예 2∼6 및 비교예 1∼3의 표면 보호 필름을 얻었다.The surface protection films of Examples 2 to 6 and Comparative Examples 1 to 3 were prepared in the same manner as in the surface protection film of Example 1, except that the composition of the additive was as described in (C) to (F) of Table 1, respectively. got it
표 1에 있어서, 각 성분의 중량부는 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 합계를 100중량부로 하여 구했다.In Table 1, the weight part of each component was calculated|required as 100 weight part of the sum total of the C1-C18 (meth)acrylic acid ester monomer of (A) alkyl group.
여기서, 표 1에 있어서, (C)∼(F)의 각 란에서는 아크릴계 폴리머를 100중량부로 하여, 각 성분의 함유 비율(중량부)을 괄호( ) 안의 수치로 나타냈다.Here, in Table 1, in each column of (C)-(F), 100 weight part of acrylic polymer was made into, and the content ratio (weight part) of each component was shown with the numerical value in parentheses ( ).
또한, 표 1에 사용된 각 성분의 약기호의 화합물명을 표 2에 나타낸다. 여기서, 코로네이트(등록상표) HX, HL 및 L은 도소 주식회사의 상품명이고, 타케네이트(등록상표) D-140N, D-127N, D-110N은 미츠이 화학 주식회사의 상품명이다.In addition, the compound names of the abbreviations of each component used in Table 1 are shown in Table 2. Here, Coronate (registered trademark) HX, HL and L are trade names of Tosoh Corporation, and Takenate (registered trademark) D-140N, D-127N, and D-110N are trade names of Mitsui Chemicals Corporation.
(F) 대전 방지제 중, F-1∼F-6 및 F-9는 융점이 25℃ 이상 80℃ 이하이고, 상온에서 고체인 이온성 화합물이다. F-7 및 F-8은 융점이 80℃ 초과이고, 상온에서 고체인 이온성 화합물이다.(F) Among the antistatic agents, F-1 to F-6 and F-9 are ionic compounds having a melting point of 25°C or more and 80°C or less, and are solid at room temperature. F-7 and F-8 are ionic compounds that have a melting point greater than 80° C. and are solid at room temperature.
<시험 방법 및 평가><Test method and evaluation>
실시예 1∼6 및 비교예 1∼3에 있어서의 표면 보호 필름을 각각 온도 23℃, 습도 50%RH의 분위기하에서 7일간 에이징한 후, 이하의 시험 방법에 의해 평가했다.After aging the surface protection films in Examples 1-6 and Comparative Examples 1-3 in the atmosphere of a temperature of 23 degreeC, and a humidity of 50 %RH, respectively for 7 days, the following test method evaluated.
<점착력의 시험 방법><Test method of adhesion>
이형 필름을 박리하여 점착제층을 표출시킨 표면 보호 필름을 점착제층을 개재하여 편광판의 표면에 첩합하고, 1일 방치한 후, 50℃, 5기압, 20분간 오토클레이브 처리하여, 실온에서 추가로 12시간 방치한 것을 점착력의 측정 시료로 했다. 얻어진 측정 시료를 180°방향으로 인장 시험기를 사용하여 저속도(0.3m/min) 또는 고속도(30m/min)에 있어서 박리하여 측정한 박리 강도를 점착력으로 했다.After peeling the release film and exposing the pressure-sensitive adhesive layer, the surface protection film was bonded to the surface of the polarizing plate through the pressure-sensitive adhesive layer, left for 1 day, and then autoclaved at 50° C., 5 atmospheres, 20 minutes, and further 12 at room temperature. What was left to stand for time was made into the measurement sample of adhesive force. The obtained measurement sample was peeled at a low speed (0.3 m/min) or high speed (30 m/min) using a tensile tester in a 180 degree direction, and the measured peeling strength was made into adhesive force.
여기서, 상기 편광판의 편광자 보호층은 트리아세틸셀룰로오스(TAC), 폴리메틸메타크릴레이트(PMMA), 폴리에틸렌테레프탈레이트(PET)로 이루어지는 군으로부터 선택한 1종이다.Here, the polarizer protective layer of the polarizing plate is one selected from the group consisting of triacetyl cellulose (TAC), polymethyl methacrylate (PMMA), and polyethylene terephthalate (PET).
또한, LR 편광판 및 AG-LR 편광판은 상기 편광판의 편광자 보호층의 표면이 불소 화합물을 함유하는 조성물로 저반사 표면 처리가 실시되어 있다.In the LR polarizing plate and the AG-LR polarizing plate, the surface of the polarizer protective layer of the polarizing plate is subjected to a low-reflection surface treatment with a composition containing a fluorine compound.
<표면 저항률의 시험 방법><Test method of surface resistivity>
표면 보호 필름을 에이징한 후, 편광판에 첩합하기 전에, 이형 필름을 박리하여 점착제층을 표출하고, 저항률계 하이레스타 UP-HT450(미츠비시 화학 애널리테크 제조)을 사용하여 점착제층의 표면 저항률을 측정했다.After aging the surface protection film, before bonding to the polarizing plate, the release film is peeled to expose the pressure-sensitive adhesive layer, and the surface resistivity of the pressure-sensitive adhesive layer is measured using a resistivity meter Hirestar UP-HT450 (manufactured by Mitsubishi Chemical Analytech). did.
<박리 대전압의 시험 방법><Test method of peeling electrification voltage>
이형 필름을 박리하여 점착제층을 표출시킨 표면 보호 필름을 피착면에 불소 화합물을 함유하는 저굴절률층 형성용 조성물을 사용하여 형성된 저굴절률층을 갖는 편광판에 첩합했다. 표면 보호 필름을 30m/min의 인장 속도로 180°박리했을 때, 피착체가 대전하여 발생하는 전압(대전압)을 고정밀도 정전기 센서 SK-035, SK-200(주식회사 키엔스 제조)을 사용하여 측정하고, 측정값의 최대값을 박리 대전압으로 했다.The surface protection film in which the release film was peeled and the adhesive layer was exposed was bonded to the polarizing plate which has the low-refractive-index layer formed using the composition for low-refractive-index layer formation containing a fluorine compound on the to-be-adhered surface. When the surface protection film is peeled 180° at a tensile speed of 30 m/min, the voltage (charged voltage) generated by the charging of the adherend is measured using high-precision electrostatic sensors SK-035, SK-200 (manufactured by Keyence Co., Ltd.) , the maximum value of the measured values was taken as the peel electrification voltage.
<내오염 성능의 시험 방법><Test method of stain resistance performance>
유리판의 한쪽 면 상에 저반사(LR) 표면 처리를 실시한 편광판을 첩합기를 사용해, 점착제층(양면 점착 테이프)을 개재하여 첩합했다. 그 후, 상기 편광판의 표면에 표면 보호 필름을 첩합기를 사용하여 첩합했다. 피착체에 첩합 후, 온도 60℃, 습도 90%RH의 분위기하에 48hr 방치하고, 상기 분위기하로부터 꺼내어 1일 후에 표면 보호 필름을 박리하여, 편광판 표면의 오염 상태를 육안으로 관찰했다. 내오염 성능의 판단 기준은 상기 편광판의 표면에 대해 오염 없음의 경우를 「○」, 약간 오염이 있는 경우를 「△」, 오염 있음의 경우를 「×」로 평가했다.The polarizing plate which gave the low reflection (LR) surface treatment on one surface of the glass plate was bonded together through the adhesive layer (double-sided adhesive tape) using the bonding machine. Then, the surface protection film was bonded together on the surface of the said polarizing plate using the bonding machine. After bonding to an adherend, it was left to stand for 48 hours in the atmosphere of the temperature of 60 degreeC, and 90%RH of humidity, it took out from the said atmosphere, the surface protection film was peeled after 1 day, and the contamination state on the surface of a polarizing plate was observed visually. As for the judgment criteria of stain resistance performance, the case where there was no stain|pollution|contamination on the surface of the said polarizing plate was evaluated as "○", the case where there was a little stain|pollution|contamination by "Δ", and the case where there was stain|pollution|contamination was evaluated as "x".
표 3에 실시예 1∼6 및 비교예 1∼3에 있어서의 표면 보호 필름에 대한 평가 결과를 나타낸다. 「표면 저항률」은 「m×10+n」를 「mE+n」으로 하는 방식(다만, m은 임의의 실수값, n은 양의 정수)에 의해 표기했다.In Table 3, the evaluation result about the surface protection film in Examples 1-6 and Comparative Examples 1-3 is shown. "Surface resistivity" was expressed by the method (however, m is an arbitrary real value, and n is a positive integer) in which "mx10+ n " is "mE+n".
「박리 대전압」의 란은 시험에서 사용한 편광판의 편광자 보호층의 재질(TAC 또는 PMMA) 및 표면 처리(Plain 또는 AG-LR)를 나타낸다. 「표면 처리」의 Plain은 미처리를 의미한다. 「내오염 성능」의 란에도 동일하게 하여, 시험에서 사용한 편광판의 편광자 보호층의 재질(PMMA) 및 표면 처리(AG-LR)를 나타냈다.The column of "Peel electrification voltage" shows the material (TAC or PMMA) and surface treatment (Plain or AG-LR) of the polarizer protective layer of the polarizing plate used in the test. Plain of "surface treatment" means untreated. It carried out similarly also to the column of "pollution resistance performance", and the material (PMMA) and surface treatment (AG-LR) of the polarizer protective layer of the polarizing plate used by the test were shown.
실시예 1∼6의 표면 보호 필름은 피착체인 편광판에 대한 저속 박리 속도 0.3m/min에서의 점착력이 0.04∼0.2N/25㎜이고, 고속 박리 속도 30m/min에서의 점착력이 2.0N/25㎜ 이하이며, 점착 성능이 우수했다.The surface protection films of Examples 1 to 6 had an adhesive force of 0.04 to 0.2 N/25 mm at a low peel rate of 0.3 m/min to a polarizing plate as an adherend, and an adhesive force of 2.0 N/25 mm at a high peel rate of 30 m/min. It was the following and was excellent in adhesive performance.
또한, 실시예 1∼6의 표면 보호 필름은 점착제층의 표면 저항률이 1.0×10+12Ω/□ 이하이고, 불소 화합물을 함유하는 저굴절률층 형성용 조성물을 사용하여 형성된 저굴절률층에 대한, 점착제층의 박리 대전압이 ―0.3∼+0.3㎸의 범위 내이며, 대전 방지 성능이 우수했다.In addition, the surface protection films of Examples 1 to 6 have a surface resistivity of the pressure-sensitive adhesive layer of 1.0×10 +12 Ω/□ or less, and a low-refractive-index layer formed using a composition for forming a low-refractive-index layer containing a fluorine compound. The peeling electrification voltage of the layer was in the range of -0.3 to +0.3 kV, and the antistatic performance was excellent.
또한, 실시예 1∼6의 표면 보호 필름은 저굴절률층을 갖지 않는 미처리의 PMMA 기재 및 TAC 기재에 대해서도, 점착제층의 박리 대전압이 ―0.3∼+0.3㎸의 범위 내이며, 대전 방지 성능이 우수했다.Further, the surface protection films of Examples 1 to 6 had a peeling electrification voltage of the pressure-sensitive adhesive layer in the range of -0.3 to +0.3 kV, even for untreated PMMA substrates and TAC substrates not having a low refractive index layer, and antistatic performance This was excellent.
나아가, 실시예 1∼6의 표면 보호 필름은 피착체에 첩합 후, 온도 60℃, 습도 90%RH의 분위기하에 48hr 방치하고, 상기 분위기하로부터 꺼내어 1일 후에도 피착체인 저반사 표면 처리를 실시한 편광판에 대한 오염이 없고, 내오염 성능도 우수했다.Further, the surface protection films of Examples 1 to 6 were adhered to an adherend, left to stand for 48 hours in an atmosphere of a temperature of 60° C. and a humidity of 90% RH, and taken out from the atmosphere, and a polarizing plate subjected to a low-reflection surface treatment as an adherend even after 1 day. There was no contamination, and the contamination resistance performance was excellent.
즉, 실시예 1∼6의 표면 보호 필름에 대한 표 3에 나타난 평가 결과에서 본 발명의 과제를 해결할 수 있음이 실증되었다.That is, the evaluation results shown in Table 3 for the surface protection films of Examples 1 to 6 demonstrate that the subject of the present invention can be solved.
비교예 1의 표면 보호 필름에서는 융점이 80℃ 초과인 대전 방지제를 함유하고 있다. 이 때문에, 비교예 1의 표면 보호 필름은 점착제층의 점착력이 크고, 박리 대전압이 높으며, 내오염 성능도 열악했다.The surface protection film of Comparative Example 1 contains an antistatic agent having a melting point of more than 80°C. For this reason, the surface protection film of the comparative example 1 had the large adhesive force of an adhesive layer, the peeling electrification voltage was high, and the stain resistance performance was also inferior.
또한, 비교예 2의 표면 보호 필름은 융점이 80℃ 초과인 대전 방지제를 함유하고 있다. 이 때문에, 비교예 2의 표면 보호 필름은 점착제층의 점착력이 크고, 박리 대전압이 높으며, 내오염 성능도 열악했다.Moreover, the surface protection film of Comparative Example 2 contains the antistatic agent whose melting|fusing point is more than 80 degreeC. For this reason, the surface protection film of the comparative example 2 had the large adhesive force of an adhesive layer, the peeling electrification voltage was high, and the stain resistance performance was also inferior.
또한, 비교예 3의 표면 보호 필름은 융점이 25∼80℃이지만, 음이온이 이미드기를 갖는 대전 방지제를 함유하고 있다. 이 때문에, 비교예 3의 표면 보호 필름은 PMMA 기재에 대해 박리 대전압이 높고, 내오염 성능도 열악했다.Moreover, although melting|fusing point of the surface protection film of the comparative example 3 is 25-80 degreeC, the anion contains the antistatic agent which has an imide group. For this reason, the surface protection film of the comparative example 3 had a high peeling electrification voltage with respect to a PMMA base material, and its stain resistance performance was also inferior.
이와 같이, 비교예 1∼3의 표면 보호 필름에서는 본 발명의 과제를 해결할 수 없었다.Thus, in the surface protection film of Comparative Examples 1-3, the subject of this invention could not be solved.
Claims (7)
상기 (F) 대전 방지제가 하기 화학식 (1)로 나타내는 융점 25∼80℃의 온도 23℃에서 고체인 이온성 화합물이고,
K+·A- (1)
[화학식 (1) 중, K+는 피리디늄, 이미다졸륨, 포스포늄, 술포늄, 피롤리디늄, 구아니디늄, 암모늄, 이소우로늄, 티오우로늄, 피페리디늄, 피라졸륨, 메틸륨, 모르폴리늄으로 이루어지는 군으로부터 선택된 1종의 양이온이며, A-는 이미드기를 함유하지 않는 트리플루오로메탄술포네이트 음이온, 펜타플루오로에탄술포네이트 음이온으로 이루어지는 군으로부터 선택되는 1종의 음이온이다]
상기 아크릴계 폴리머가
(A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부에 대해, (B-1) 수산기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상의 합계를 0.01∼10중량부, 및/또는, (B-2) 카르복실기를 함유하는 공중합성 비닐 모노머의 적어도 1종 이상의 합계를 0.01∼0.5중량부의 비율로 공중합시킨 공중합체의 아크릴계 폴리머이며,
상기 (A) 알킬기의 탄소수 C1∼18인 (메타)아크릴산에스테르 모노머의 적어도 1종 이상의 합계 100중량부 중, 이소옥틸(메타)아크릴레이트, 이소노닐(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트로 이루어지는 군으로부터 선택된 적어도 1종을 50중량부 이상의 비율로 함유하여 이루어지고,
상기 아크릴계 폴리머 100중량부에 대해, 상기 이온성 화합물을 0.01∼10중량부의 비율로 필수 성분으로서 함유하여 이루어지며,
상기 (D) 금속 킬레이트 화합물의 가교 촉진제가 트리스(2,4-펜탄디오네이트)철(III), 티타늄 트리스아세틸아세토네이트, 알루미늄 트리스아세틸아세토네이트, 트리스(2,4-헥산디오네이트)티탄, 및 트리스(2,4-헥산디오네이트)알루미늄으로 이루어지는 군에서 선택되는 1종 이상이고,
상기 점착제 조성물을 가교시켜 이루어지는 점착제층의, 폴리메틸메타크릴레이트 기재의 표면에 실시된 저굴절률층에 대한 점착력은, 저속 박리 속도 0.3m/min에서의 점착력이 0.04∼0.2N/25㎜이고, 또한 고속 박리 속도 30m/min에서의 점착력이 2.0N/25㎜ 이하인 것을 특징으로 하는 점착제 조성물.A pressure-sensitive adhesive composition comprising an acrylic polymer, (F) an antistatic agent, (C) a crosslinking agent, and (D) a crosslinking accelerator for a metal chelate compound,
(F) the antistatic agent is an ionic compound that is a solid at a temperature of 23 ° C with a melting point of 25 to 80 ° C represented by the following formula (1),
K + A - (1)
[In formula (1), K + is pyridinium, imidazolium, phosphonium, sulfonium, pyrrolidinium, guanidinium, ammonium, isouronium, thiouronium, piperidinium, pyrazolium, methylium , is one kind of cation selected from the group consisting of morpholinium, and A - is one kind of anion selected from the group consisting of trifluoromethanesulfonate anion and pentafluoroethanesulfonate anion not containing an imide group ]
The acrylic polymer is
(A) With respect to a total of 100 parts by weight of at least one or more types of (meth)acrylic acid ester monomers having C1 to C18 alkyl group, (B-1) 0.01 to at least one type of copolymerizable vinyl monomer containing a hydroxyl group 10 parts by weight, and/or (B-2) an acrylic polymer of a copolymer copolymerized in a ratio of 0.01 to 0.5 parts by weight of the total of at least one type of copolymerizable vinyl monomer containing a carboxyl group,
Isooctyl (meth)acrylate, isononyl (meth)acrylate, 2-ethylhexyl (meth) in a total of 100 parts by weight of at least one or more types of (meth)acrylic acid ester monomers having C1 to C18 alkyl group (A) ) is made by containing at least one selected from the group consisting of acrylates in a proportion of 50 parts by weight or more,
Based on 100 parts by weight of the acrylic polymer, the ionic compound is contained as an essential component in a ratio of 0.01 to 10 parts by weight,
(D) the crosslinking accelerator of the metal chelate compound is tris(2,4-pentanedionate)iron(III), titanium trisacetylacetonate, aluminum trisacetylacetonate, tris(2,4-hexanedionate)titanium, and tris (2,4-hexanedionate) at least one selected from the group consisting of aluminum,
The adhesive force of the adhesive layer formed by crosslinking the adhesive composition to the low refractive index layer applied to the surface of the polymethyl methacrylate substrate is 0.04 to 0.2 N/25 mm, and the adhesive force at a low peeling rate of 0.3 m/min is, Further, the adhesive composition at a high-speed peeling rate of 30 m/min is 2.0 N/25 mm or less.
상기 아크릴계 폴리머의 100중량부에 대해, 상기 (C) 가교제로서 3관능 이상의 이소시아네이트 화합물을 0.1∼10중량부의 비율로 함유하여 이루어지고,
상기 점착제 조성물이 추가로 (E) 케토엔올 호변이성체 화합물을 함유하여 이루어지는 것을 특징으로 하는 점착제 조성물.The method of claim 1,
With respect to 100 parts by weight of the acrylic polymer, the (C) cross-linking agent is made by containing a trifunctional or more isocyanate compound in a ratio of 0.1 to 10 parts by weight,
The pressure-sensitive adhesive composition further comprises (E) a ketoenol tautomer compound.
상기 (B-1) 수산기를 함유하는 공중합성 비닐 모노머가 8-히드록시옥틸(메타)아크릴레이트, 6-히드록시헥실(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트, N-히드록시(메타)아크릴아미드, N-히드록시메틸(메타)아크릴아미드, N-히드록시에틸(메타)아크릴아미드로 이루어지는 화합물군 중에서 선택된 적어도 1종 이상이고,
상기 (B-2) 카르복실기를 함유하는 공중합성 비닐 모노머가 (메타)아크릴산, 카르복시에틸(메타)아크릴레이트, 카르복시펜틸(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸헥사히드로프탈산, 2-(메타)아크릴로일옥시프로필헥사히드로프탈산, 2-(메타)아크릴로일옥시에틸프탈산, 2-(메타)아크릴로일옥시에틸숙신산, 2-(메타)아크릴로일옥시에틸말레산, 카르복시폴리카프로락톤모노(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸테트라히드로프탈산으로 이루어지는 화합물군 중에서 선택된 적어도 1종 이상인 것을 특징으로 하는 점착제 조성물.3. The method of claim 1 or 2,
(B-1) The copolymerizable vinyl monomer containing a hydroxyl group is 8-hydroxyoctyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2- At least one selected from the group consisting of hydroxyethyl (meth) acrylate, N-hydroxy (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, and N-hydroxyethyl (meth) acrylamide ego,
(B-2) the copolymerizable vinyl monomer containing a carboxyl group is (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, 2- (meth)acryloyloxyethylhexahydrophthalic acid, 2-(meth)acryloyloxypropylhexahydrophthalic acid, 2-(meth)acryloyloxyethylphthalic acid, 2-(meth)acryloyloxyethyl succinic acid, 2-(meth)acryloyloxyethyl maleic acid , carboxypolycaprolactone mono(meth)acrylate, and 2-(meth)acryloyloxyethyltetrahydrophthalic acid. A pressure-sensitive adhesive composition, characterized in that at least one selected from the group consisting of compounds.
상기 점착제 조성물이 상기 아크릴계 폴리머의 100중량부에 대해, 상기 (D) 금속 킬레이트 화합물의 가교 촉진제를 0.001∼0.5중량부와, 상기 (E) 케토엔올 호변이성체 화합물을 0.1∼300중량부의 비율로 함유하여 이루어지고,
상기 (E)/상기 (D)의 중량부 비율이 70∼1000인 것을 특징으로 하는 점착제 조성물.3. The method of claim 2,
In the pressure-sensitive adhesive composition, based on 100 parts by weight of the acrylic polymer, 0.001 to 0.5 parts by weight of the (D) metal chelate compound crosslinking accelerator and (E) 0.1 to 300 parts by weight of the ketoenol tautomer compound It is made by containing
The pressure-sensitive adhesive composition, characterized in that the ratio by weight of (E) / (D) is 70 to 1000.
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KR20230148954A (en) | 2022-04-19 | 2023-10-26 | 주식회사 애스크와이 | Adhesive film having different adhesive sections and method of manufacturing the same |
KR20230149364A (en) | 2022-04-19 | 2023-10-27 | 주식회사 애스크와이 | Adhesive composition having variable adhesive property, variable adhesive layer and display device including the same |
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