KR20220000824A - Substrate conveyance device, substrate processing system, substrate conveying method, electronic device production method, program and storage medium - Google Patents

Abstract

The present invention relates to transport of substrates cut from a large substrate. An object of the present invention is to suppress deviations of transport positions by differences between cutting positions. A substrate transport device comprises: a transport means of transporting one substrate among a plurality of substrates obtained by dividing a large substrate to a transfer position in a processing device to transfer the substrate to a substrate support means provided on the corresponding processing device; and a control means of controlling the transport means. An acquisition means acquires substrate information on a portion of the substrate transported by the transport means in the large substrate before division. The control means transports the substrate to the transfer position by the transport means based on the substrate information acquired by the acquisition means.

Description

A substrate transport apparatus, a substrate processing system, a substrate transport method, a manufacturing method of an electronic device, a program, and a storage medium

The present invention relates to a substrate transport apparatus, a substrate processing system, a substrate transport method, a manufacturing method of an electronic device, a program, and a storage medium.

In the manufacture of organic electroluminescent displays etc., predetermined processing is performed with respect to a board|substrate, such as a film-forming process which forms a vapor deposition material into a film on a board|substrate. When such processing is performed, the substrate is transferred to various processing apparatuses such as a film forming apparatus by a transfer robot or the like. Patent Document 1 discloses that a transfer robot transfers a substrate to a taught transfer position.

Patent Document 1: Japanese Patent Laid-Open No. 2019-153775

The organic EL display is manufactured by forming a plurality of layers on a substrate by various film forming processes. At this time, depending on the circumstances of the production line, processing is performed on a large substrate (also called mother glass) up to a certain step, and then the large substrate is cut and divided into a plurality of smaller substrates, and division in subsequent steps In some cases, a process such as film formation is performed on one substrate. For example, in the manufacture of organic EL displays for smartphones, in the backplane process (TFT forming process, anode forming process, etc.), a film forming process is performed on a large substrate (about 1500 mm x about 1850 mm) of the 6th generation. . After that, this large substrate is cut in half to obtain a 6th generation half-cut substrate (approx. 1500 mm x approx. 925 mm), and in subsequent steps, film formation or the like is performed on this 6th generation half-cut substrate. .

In such a case, the board|substrates from which the cut-off position from a large board|substrate differs are carried in sequentially into the processing apparatus used for the process after a division|segmentation process. However, in the case of a substrate cut out from a large substrate, depending on which part of the large substrate is cut out (for example, depending on whether it is a part of the left half of the mother glass or a part of the right half), such as size and stiffness distribution There are cases where the characteristics of the substrate are different. If the characteristics of the substrate are different, there may be differences in the sliding method of the substrate when the substrate is transported in a state where the substrate is placed on a transfer robot or the like, resulting in variations in the position of the substrate when the substrate is loaded into the processing apparatus.

The present invention relates to conveyance of a substrate cut out from a large substrate, and to provide a technique for suppressing variations in conveyance positions due to differences in cutting positions.

According to the present invention,

conveying means for conveying the substrate cut out from the large substrate to a delivery position in the processing apparatus, and transferring the substrate to a substrate supporting means provided in the processing apparatus;

A substrate conveying apparatus comprising a control means for controlling the conveying means,

Acquisition means for acquiring substrate information regarding the site|part of the said large-sized board|substrate from which the said board|substrate was cut out,

and the control means causes the carrying means to transfer the substrate to the delivery position based on the substrate information acquired by the acquisition means.

ADVANTAGE OF THE INVENTION According to this invention, it is related with conveyance of the board|substrate cut out from a large size board|substrate, Comprising: The technique which suppresses the dispersion|variation in the conveyance position by the difference of a cutout position can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram of a part of the manufacturing line of an electronic device.
2 is a schematic diagram of a film forming apparatus according to an embodiment.
3(A) and (B) are explanatory views of a conveying apparatus according to an embodiment.
4 : is a figure which shows the example of a large size board|substrate and a cut board|substrate.
Fig. 5 is a diagram schematically showing the deviation of the substrate from the target position after the transfer robot transfers the substrate to the film formation chamber.
It is a flowchart which shows the processing example of the processing part of a conveyance apparatus, and the control apparatus of a film-forming apparatus.
7 is a flowchart showing a processing example of a processing unit of the conveying apparatus.
Fig. 8A is a diagram showing an example of information managed by a host device. Fig. 8B is a diagram showing an example of information managed by the storage unit.
Fig. 9(A) is an overall view of an organic EL display device, and Fig. 9(B) is a view showing a cross-sectional structure of one pixel.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. In addition, the following embodiment does not limit the invention which concerns on a claim. Although a plurality of features are described in the embodiment, not all of these plurality of features are necessarily essential to the invention, and a plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same reference numerals are attached to the same or the same structures, and overlapping descriptions are omitted.

<Electronic device manufacturing line>

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows a part of structure of the manufacturing line of the electronic device to which the film-forming apparatus of this invention is applicable. The manufacturing line of FIG. 1 is, for example, used for manufacturing a display panel of an organic EL display device for a smartphone, and the substrate 100 is sequentially transferred to the film forming block 301 , and the substrate 100 is transferred to the substrate 100 . EL film formation is performed.

The film formation block 301 includes a plurality of film formation chambers 303a to 303d in which film formation processing is performed on the substrate 100 around the transfer chamber 302 having an octagonal shape in plan view, before and after use. A mask storage room 305 in which a mask of In the transfer chamber 302 , a transfer robot 151 (transfer means) that transfers a substrate 100 included in a transfer apparatus 15 (a substrate transfer apparatus) to be described later installed therein is arranged. In other words, the film forming block 301 is a cluster type film forming unit in which a plurality of film forming chambers 303a to 303d are arranged to surround the transfer robot 151 . On the other hand, when the film forming chambers 303a to 303d are generically referred to, or when not distinguished, the film forming chamber 303 is denoted.

A buffer chamber 306 , a vortex chamber 307 , and a transfer chamber 308 are respectively disposed on the upstream side and downstream side of the film formation block 301 in the transfer direction (arrow direction) of the substrate 100 . During the manufacturing process, each chamber is maintained in a vacuum state. On the other hand, although only one film-forming block 301 is shown in FIG. 1, the manufacturing line which concerns on this embodiment has the some film-forming block 301, The some film-forming block 301 is a buffer chamber 306. ), the vortex chamber 307, has a configuration connected by a connecting device consisting of the delivery chamber (308). In addition, the structure of a connection device is not limited to this, For example, it may be comprised only with the buffer chamber 306 or the delivery chamber 308. As shown in FIG.

The transfer robot 151 carries the substrate 100 into the transfer chamber 302 from the transfer chamber 308 on the upstream side, transfers the substrate 100 between the film formation chambers 303 , and the mask storage chamber 305 . The mask is transported between the film formation chamber 303 and the substrate 100 is transported from the transport chamber 302 to the buffer chamber 306 on the downstream side.

The buffer chamber 306 is a chamber for temporarily storing the substrate 100 according to the operation condition of the manufacturing line. In the buffer chamber 306, a plurality of substrates 100 can be stored in a horizontal state with the processing target surface (film deposition surface) of the substrate 100 facing downward in the gravitational direction, and a multi-stage structure substrate storage shelf (also referred to as a cassette). and a lifting mechanism for elevating the substrate storage shelf in order to align the stage for loading or unloading the substrate 100 to the transfer position. As a result, the plurality of substrates 100 can be temporarily accommodated in the buffer chamber 306 and retained therein.

The turning chamber 307 is provided with a device for changing the orientation of the substrate 100 . In the present embodiment, the turning chamber 307 rotates the direction of the substrate 100 by 180 degrees by a transfer robot (not shown) installed in the turning chamber 307 . The transfer robot installed in the turning chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and delivers it to the transfer chamber 308 , thereby entering the buffer chamber 306 and the transfer chamber. At 308, the front and rear ends of the substrate are switched. Thereby, since the direction when the substrate 100 is loaded into the film formation chamber 303 becomes the same direction in each film formation block 301 , the scan direction of the film formation with respect to the substrate 100 and the direction of the mask are set respectively. It can be matched in the film formation block 301 . By setting it as such a structure, the direction in which the mask is installed in the mask storage chamber 305 in each film-forming block 301 can be made to match, management of a mask can be simplified, and usability can be improved.

The control system of the manufacturing line includes, as a host computer, a host computer 300 for controlling the entire line, and control devices 14a to 14d, 309 and 310 for controlling each configuration, and these include a wired or wireless communication line 300a. communication is possible through The control devices 14a to 14d are provided corresponding to the film forming chambers 303a to 303d, and control the film forming apparatus 1 described later. On the other hand, when the control devices 14a to 14d are generically referred to, or when they are not distinguished, they are denoted as the control device 14 .

The control device 309 controls the transport robot 151 included in the transport device 15 . The control device 310 controls the device of the vortex chamber 307 . The host device 300 transmits instructions such as information regarding the substrate 100 and transfer timing to each control device 14 , 309 , 310 , and each control device 14 , 309 , 310 responds to the received instruction. Control each configuration based on

<Outline of film forming apparatus>

2 is a schematic diagram of a film forming apparatus 1 according to an embodiment of the present invention. The film forming apparatus 1 is an apparatus for forming a vapor deposition material on the substrate 100 , and forms a thin film of the vapor deposition material in a predetermined pattern using the mask 101 . Materials, such as glass, resin, and a metal, can be suitably selected as a material of the board|substrate 100 on which film-forming is performed in the film-forming apparatus 1, and what formed resin layers, such as polyimide, on glass is used preferably. As a vapor deposition material, they are substances, such as an organic material and an inorganic material (metal, metal oxide, etc.). The film forming apparatus 1 is applicable to, for example, a manufacturing apparatus for manufacturing an electronic device such as a display device (a flat panel display, etc.), a thin film solar cell, an organic photoelectric conversion element (organic thin film imaging element), an optical member, etc. , in particular, is applicable to a manufacturing apparatus for manufacturing an organic EL panel. In the following description, an example in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition is described, but the present invention is not limited thereto, and various film forming methods such as sputtering and CVD are applicable. On the other hand, in each figure, the arrow Z indicates the vertical direction (the direction of gravity), and the arrow X and the arrow Y indicate the horizontal direction orthogonal to each other.

The film forming apparatus 1 has a box-shaped vacuum chamber 3 . The internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown). In addition, in this specification, "vacuum" refers to a state filled with a gas having a pressure lower than atmospheric pressure, in other words, a reduced pressure state. In the internal space 3a of the vacuum chamber 3 , a substrate support unit 6 for supporting the substrate 100 in a horizontal posture, a mask stand 5 for supporting the mask 101 , a film forming unit 4 , and a plate The unit 9 is arranged. The mask 101 is a metal mask having an opening pattern corresponding to the thin film pattern formed on the substrate 100 , and is being fixed on the mask base 5 . As the mask 101, a mask having a structure in which a mask foil having a thickness of several μm to several tens of μm is welded to a frame-shaped mask frame can be used. Although the material of the mask 101 is not specifically limited, It is preferable to use metal with a small thermal expansion coefficient, such as an invar material. The film-forming process is performed in the state where the board|substrate 100 is mounted on the mask 101, and the board|substrate 100 and the mask 101 overlap with each other.

The plate unit 9 includes a cooling plate 10 that cools the substrate 100 during film formation, and a magnet plate 11 that attracts the mask 101 by magnetic force to bring the substrate 100 and the mask 101 into close contact. ) is provided. The plate unit 9 is installed so as to be able to move up and down in the Z direction by, for example, a lifting unit 13 provided with a ball screw mechanism or the like.

The film forming unit 4 is constituted by a heater, a shutter, an evaporation source driving mechanism, an evaporation rate monitor, and the like, and is an evaporation source for depositing a vapor deposition material on the substrate 100 . More specifically, in the present embodiment, the film forming unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in a row in the X direction, and vapor deposition material is emitted from each nozzle. The film-forming unit 4 is reciprocally moved in the Y-direction (a direction away from the connection part of the film-forming chamber 303 and the conveyance chamber 302) by an evaporation source moving mechanism (not shown).

Moreover, the film-forming apparatus 1 is equipped with the alignment apparatus 2 which aligns the board|substrate 100 and the mask 101. As shown in FIG. Schematically, the alignment device 2 detects the alignment marks formed on the substrate 100 and the mask 101 by the cameras (imaging devices) 7 and 8, and based on the detection result, the substrate 100 and The position relative to the mask 101 is adjusted. The cameras 7 and 8 are disposed above the upper wall of the vacuum chamber 3 , and can capture an image in the vacuum chamber 3 through a window (not shown) formed in the upper wall. The cameras 7 and 8 image the substrate alignment mark provided in the substrate 100 arranged in the vacuum chamber 3 and the mask alignment mark provided in the mask 101 . By processing the obtained image by an image processing means (not shown), the positional information of the substrate 100 and the mask 101 can be acquired. The cameras 7 and 8 can also be said to be positional information acquisition means for acquiring the positional information of the substrate 100 and the mask 101 .

The alignment apparatus 2 includes a substrate support unit 6 that supports a peripheral portion of the substrate 100 . The substrate support unit 6 is provided to be spaced apart from each other in the X direction, and includes a pair of base portions 62 extending in the Y direction, and a plurality of nail-shaped mounting portions protruding inward from the base portion 62 ( 61) is provided. On the other hand, the mounting part 61 may also be called a "receiving finger" or a "finger". The plurality of mounting portions 61 are arranged at intervals on each of the pair of base portions 62 . The part on the long side of the peripheral part of the board|substrate 100 is mounted on the mounting part 61 . The base portion 62 is suspended from the beam member 222 via a plurality of posts 64 .

As in the present embodiment, the base part 62 is spaced apart in the X direction and the base part 62 is not formed on the short side side of the substrate 100 as a pair. ), interference between the transfer robot 151 and the base 62 when transferring the substrate can be suppressed. Thereby, the efficiency of conveyance and delivery of the board|substrate 100 can be improved. However, the base 62 may have a rectangular frame shape surrounding the entire periphery of the substrate 100 . In addition, the base part 62 may be a rectangular frame shape with a cutout partly. By setting it as a rectangular frame shape with partial cutouts, interference between the transfer robot 151 and the base 62 when the transfer robot 151 transfers the substrate to the mounting unit 61 can be suppressed, and the substrate ( 100) can improve the efficiency of conveyance and delivery.

The substrate support unit 6 further includes a clamp unit 63 . The clamp unit 63 includes a plurality of clamp portions 66 . Each clamp part 66 is provided corresponding to each mounting part 61, and it is possible to hold|maintain the periphery of the board|substrate 100 with the clamp part 66 and the mounting part 61. As shown in FIG. As a supporting aspect of the board|substrate 100, in addition to the aspect which pinches|interposes and holds the periphery of the board|substrate 100 by the clamp part 66 and the mounting part 61 in this way, the mounting part 61 without providing the clamping part 66 is not provided. ), it is possible to adopt an aspect in which only the substrate 100 is placed.

Moreover, the alignment apparatus 2 is equipped with the board|substrate 100 by which the periphery was supported by the board|substrate support unit 6, and the adjustment unit 20 which adjusts the relative position of the mask 101. As shown in FIG. The adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 on the X-Y plane based on the detection results of the cameras 7 and 8 or the like. In this embodiment, the position of the mask 101 is fixed and the substrate 100 is displaced to adjust their relative positions. Alternatively, the mask 101 may be displaced and adjusted, or the substrate 100 and the mask ( 101) may be displaced.

In addition, the alignment apparatus 2 raises and lowers the substrate support unit 6 , so that the substrate 100 and the mask 101 supported by the periphery of the substrate support unit 6 in the thickness direction Z of the substrate 100 . direction) to approach and separate (separate) from each other. In other words, the approach separation unit 22 can bring the substrate 100 and the mask 101 closer to each other in the overlapping direction. As the approach separation unit 22, an electric actuator etc. employing a ball screw mechanism may be used, for example.

<Transfer device>

3(A) and 3(B) are explanatory views of the conveying apparatus 15, and FIG. 3(A) is a view showing a state when the substrate 100 is unloaded from the delivery chamber 308, FIG. 3(B) is a side view schematically showing the configuration of the conveying apparatus 15 . The transfer apparatus 15 includes a transfer robot 151 that transfers a substrate cut out from a large substrate to the processing apparatus. The transfer robot 151 is a horizontal articulated robot, and includes a main body 1511 , a first arm 1512 , a second arm 1513 , and a robot hand 1514 .

The main body 1511 constitutes a base portion of the transfer robot 151 , and is provided, for example, on the bottom surface of the transfer chamber 302 . More specifically, the body portion 1511 has a bottomed cylindrical case body 1511d having a flange portion 1511c, and an opening provided in a chamber wall 302a constituting the bottom surface of the transfer chamber 302 . It is fixed through the flange portion (1511c) to the. The body portion 1511 includes a lifting portion 151lb that supports one end of the first arm 1512 so as to be rotatable, and a lifting mechanism 1511a capable of raising and lowering the lifting portion 151lb. The lifting mechanism 1511a and the lifting portion 151lb are disposed inside the case body 1511d. The lifting mechanism 1511a may be constituted by, for example, a ball screw mechanism. In this case, the lifting mechanism 1511a includes a screw shaft, a ball nut configured to be screw-engaged with the screw shaft, and a motor for rotating the screw shaft (both not shown), and the screw shaft is rotated by the driving force of the motor. By doing so, the lifting unit 151lb connected by the ball nut and the bracket is raised and lowered.

The motor 1511e for rotating the 1st arm 1512 with respect to the main-body part 1511 is attached to the raising/lowering part 151lb. In addition, a hollow rotating shaft (not shown) to which the base end side of the first arm 1512 is fixed, and a cylindrical holding member (not shown) for rotatably supporting the hollow rotating shaft are provided in the lifting unit 151lb. be prepared When the motor 1511e rotates, the power of the motor 1511e is transmitted to the first arm 1512 through the hollow rotating shaft, and the first arm 1512 rotates. Further, the first arm 1512 is connected to the second arm at an end opposite to the end to which the base portion 1511 is connected. The second arm 1513 is provided with a motor 1513a as a driving source so that one end thereof is rotatable about an axis extending in the gravitational direction with respect to the first arm 1512 . Further, the second arm is connected to the robot hand 1514 at an end opposite to the end connected to the first arm 1512 .

The robot hand 1514 includes a hand base 1514a rotatably connected to the tip side of the second arm 1513 , and four hand forks 1514b on which the substrate 100 and the mask 101 are mounted. ) (tact department). The robot hand 1514 is rotatable about an axis extending in the gravitational direction with respect to the second arm 1513 using the motor 1514c as a driving source. Two hand forks 1514b among the four hand forks 1514b are arranged in parallel with each other at a predetermined distance. The two hand forks 1514b are being fixed to the hand base 1514a so as to protrude from one side in the horizontal direction from the hand base 1514a. The remaining two hand forks 1514b are fixed to the hand base 1514 so as to protrude from the hand base 1514 toward the opposite side to the two hand forks 1514b protruding from the hand base 1514a to one side in the horizontal direction. has been

In addition, the structure of the conveyance robot 151 mentioned above is an example, and a well-known technique can be employ|adopted suitably. For example, the transfer robot 151 may be a vertical articulated robot. In addition, the robot hand 1514 is not limited to the structure supported by the board|substrate 100 etc. being mounted, It holds the board|substrate 100 by holding the edge part of the board|substrate 100 or adsorb|sucking the board|substrate 100. may be

The control device 309 controls the entire transport device 15 . Incidentally, the control device 309 controls the transport robot 151 . The control device 309 includes a processing unit 3091 (control means), a storage unit 3092 , an input/output interface (I/O) 3093 , and a communication unit 3094 .

The processing unit 3091 is a processor typified by a CPU (Central Processing Unit), and controls the conveying apparatus 15 by executing the program stored in the storage unit 3092 . The storage unit 3092 is a storage device (storage means) such as ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), etc., in addition to the program executed by the processing unit 3091 , various controls remember information The I/O (Input/Output) 3093 is an interface for transmitting and receiving signals between the processing unit 3091 and an external device. The communication unit 3094 is a communication device that communicates with the host device 300 or other control devices 14 and 310 through the communication line 300a, and the processing unit 3091 is the host device 300 through the communication unit 3094. Receives information from, etc., or transmits information to the host device 300 or the like. Meanwhile, all or part of the control device 309 , 14 , 310 or the upper device 300 may be configured with a programmable logic controller (PLC), an application specific integrated circuit (ASIC), or a field programmable gate array (FPGA).

<substrate>

The board|substrate 100 of this embodiment is a cut board|substrate cut out from a large board|substrate. 4 : is a figure which shows the example of a large size board|substrate and a cut board|substrate. The large-sized substrate MG is a mother glass of the sixth generation full size (about 1500 mm × about 1850 mm), and has a rectangular shape. An orientation flat OF for specifying the direction of the large substrate MG is formed in a corner portion of a part of the large substrate MG.

On the other hand, here, only one of the four corners of the large substrate MG is cut out to show an example in which the orientation flat OF is formed, but the present invention is not limited thereto, and all four corners are cut off. Although it has come out, the orientation flat OF may be formed by one corner part being cut out large compared with the other. In this case, the part cut out in a shape different from the other corner part can be grasped|ascertained as the orientation flat OF.

As described above, for example, in the manufacture of organic EL displays for smartphones, the backplane process (TFT forming process, anode forming process, etc.) A film-forming process etc. are performed. Thereafter, this large substrate MG is cut in half (cutting process), and the substrate 100 of the sixth generation half-cut size (about 1500 mm × about 925 mm) obtained by cutting is manufactured according to the present embodiment It is carried in to the film-forming block 301 which performs organic layer film-forming in a line. The board|substrate 100 carried in to the film-forming block 301 is either of two types of divided board|substrates cut out from the large-sized board|substrate MG, and is the board|substrate 100A or the board|substrate 100B in this embodiment. Large board|substrate MG is cut|disconnected at the cutting line CTL of the position of the distance L from the reference side which is the one side, and board|substrate 100A and board|substrate 100B are obtained. In the manufacturing line illustrated in FIG. 1, the board|substrate 100A and the board|substrate 100B are mixed, are conveyed as the board|substrate 100, and various processes are performed.

Meanwhile, the large substrate MG is cut in half here, but the present invention is not limited thereto, and the large substrate MG may be cut and divided into a plurality of substrates having substantially the same size. For example, the large-sized substrate MG may be divided into four substrates 100 , and the large substrate MG may be loaded into the film forming block 301 .

The substrate 100A and the substrate 100B may have different characteristics of the substrate such as size and stiffness distribution. For example, the substrate 100A is a substrate whose short side is dimensioned as L, but the short side length of the substrate 100B is not measured, so that the substrate 100A and the substrate 100B have the short side length. There are other cases. Also, the substrate 100B has an orientation flat OF, but the substrate 100A does not have this. The magnitude of the residual stress in the cut surface may be different between the substrate 100A and the substrate 100B. In addition, the position of the cut surface is the right side in the board|substrate 100A, and the left side in the board|substrate 100B, and the site|part is different. Such a difference in the characteristics of the substrate may affect the behavior of the substrate 100 at the time of transferring the substrate.

5 : is a figure which shows typically the shift|offset|difference of the board|substrate 100 from the target position after the conveyance robot 151 conveys the board|substrate 100 to the film-forming chamber 303. As shown in FIG. In the present embodiment, the transfer robot 151 transfers the substrate in a state where the substrate 100 is placed on the hand fork 1514b of the robot hand 1514 . For this reason, at the time of conveyance, the board|substrate 100 may slide with respect to the hand fork 1514b. In this case, even if the transfer robot 151 itself transfers the substrate 100 at the same relative position with respect to the placement unit 61 in the film forming apparatus 1 , the substrate 100 placed on the placement unit 61 is the target. There is a case where it is shifted from the conveying position to be (difference amounts Ax and Ay). Incidentally, the tendency of the shift amounts Ax and Ay may be different between the substrate 100A and the substrate 100B due to the difference in the characteristics of the substrates described above. That is, the transfer position to the film forming apparatus 1 by the transfer robot 151 may be different between the substrate 100A and the substrate 100B. On the other hand, with respect to the board|substrate 100 mounted on the mounting part 61, alignment by the alignment apparatus 2 is performed after that. However, when a shift occurs in the transfer positions between the substrate 100A and the substrate 100B, it may take time for the alignment or the accuracy of the alignment may decrease.

Accordingly, in the present embodiment, as described below, transfer control of the substrate is performed according to the portion of the large substrate MG from which the substrate 100 is cut out.

<Example of control>

A control example of the conveying device 15 executed by the processing unit 3091 of the control device 309 and a control example of the film forming device 1 executed by the control device 14 will be described. 6 is a flowchart showing a processing example of the processing unit 3091 and the control device 14 , and FIG. 7 is a flowchart showing a processing example of the processing unit 3091 . This flowchart is started based on, for example, that the processing unit 3091 receives an instruction to transport the substrate 100 from the host device 300 .

In step S1 (hereinafter simply referred to as S1. The same applies to other steps), the processing unit 3091 acquires substrate information of the substrate 100 to be transferred in the future (acquisition step). In this embodiment, the board|substrate information contains information regarding the relative position of the board|substrate 100 in the large size board|substrate MG before division|segmentation. In other words, this information is site|part information regarding the site|part of the large-sized board|substrate MG from which the board|substrate 100 was cut out, and can also be called "cutting information" or "cut information." This processing unit 141 has a function as an acquisition means for acquiring substrate information regarding a portion of the substrate 100 in the large-sized substrate MG before division. In this embodiment, in FIG. 4, it corresponds to the left part of the cutting line CTL of the large-sized board|substrate MG, and cut A cuts the board|substrate 100A from which the cut position becomes the right side of the drawing, and cut|disconnected the large board|substrate MG. The board|substrate 100B corresponding to the part on the right side of the line CTL, and in which the cut position becomes the left side of the drawing, is called B-cut. The processing unit 3091 acquires, as substrate information, whether the substrate 100 to be conveyed is an A-cut or a B-cut.

In addition, in the present embodiment, the substrate information is managed by the host device 300 in association with other information of the substrate 100 . FIG. 8A shows an example of information managed by the host device 300 . In the present embodiment, the host device 300 includes identification information for identifying each substrate 100, substrate information of the substrate 100 (whether the substrate 100A or the substrate 100B), and conveyance path information. is remembered in correspondence. Then, when the host device 300 instructs the control device 309 or the like to process the substrate 100 , the identification information and the substrate information are transmitted to the control device 309 or the like of the instruction destination. That is, in S1 , the processing unit 3091 acquires the substrate information by receiving the information regarding the substrate 100 from the host device 300 via the communication unit 3094 . On the other hand, the host device 300 is, for example, a cutting device (substrate dividing device) for cutting the large substrate MG, another device disposed on the upstream side of the film forming device 1 in the production line, or outside the production line. You may acquire board|substrate information from the apparatus of , or an operator input of a manufacturing line may be received, and you may make it acquire board|substrate information by an operator's input.

In S2 , the processing unit 3091 sets the transfer position of the substrate 100 . In this embodiment, the conveying apparatus 15 memorize|stores in the memory|storage part 3092 the positional information regarding the delivery position for each film-forming apparatus 1 provided in each film-forming chamber 303 in the film-forming block 301 . The processing unit 3091 confirms the film forming apparatus 1 of the transfer destination based on the transfer path information acquired from the host apparatus 300 , and based on the positional information corresponding to the film forming apparatus 1 , Set the delivery location. The positional information regarding the transfer position may be, for example, coordinate information of a fixed coordinate system in the entire film forming block 301 or a fixed coordinate system in the film forming apparatus 1 , or may be a control parameter of the transfer robot 151 . The control parameter of the transport robot 151 may be, for example, an output current or an output voltage of each motor that drives each part of the transport robot 151, a target value of a rotary encoder that detects the rotation angle of each motor, etc. this may be

In S3 , the processing unit 3091 corrects the transfer position of the substrate 100 set in S2 based on the substrate information acquired in S1 . Fig. 8B is a diagram showing an example of information managed by the storage unit 3092. As shown in Figs. In the case of the present embodiment, the storage unit 3092 stores the transfer position offset amount as transfer position correction information for correcting the substrate information transfer position in association with the substrate information. The processing unit 3091 reads the transfer position offset amount corresponding to the substrate information acquired in S1 from the storage unit 3092, and corrects the transfer position of the substrate 100 according to the read offset amount. From a certain point of view, the processing unit 3091 sets a reference value of the delivery position of the transfer destination in S2, and offsets the delivery position from the reference value in S3 based on the substrate information. On the other hand, the offset amount may be, for example, a relative distance from the reference values in the X direction and the Y direction, or may be a control parameter of the transport robot 151 or the like.

On the other hand, the amount of offset for each substrate information is, for example, performed when the transfer robot 151 is installed on a manufacturing line, etc. During a teaching operation for teaching the transfer trajectory and transfer position of the substrate 100 . may be set to For example, the amount of deviation from the target position of the substrate 100 placed on the transfer robot 151 when the transfer robot 151 is moved to the transfer position in the film forming apparatus 1 during the teaching operation is calculated as the substrate. You may measure for every kind (A cut, B cut) of (100). And based on the measurement result, different offset amounts may be set for each board|substrate information so that the shift|offset|difference from a target position may be canceled for each type of board|substrate 100. As shown in FIG.

The amount of deviation from the target position of the substrate 100 when the transfer robot 151 is moved to the transfer position in the film forming apparatus 1, which is used when setting the transfer position correction information, is determined by the camera ( 7 or 8) may be used for measurement. For example, after moving the transfer robot 151 to the transfer position in the film forming apparatus 1 (after S1 to S5 ), the substrate alignment mark formed on the substrate 100 or the edge or corner portion of the substrate 100 is a camera It is detected by (7 or 8), and the positional information of the board|substrate 100 is acquired. And based on the acquired positional information and target position of the board|substrate 100, the shift amount between the position of the board|substrate 100 after actually conveying, and a target position is acquired. On the other hand, acquisition of the positional information of the substrate 100 after transfer to the transfer position may be performed while the substrate 100 is supported by the transfer robot 151 , or after transfer to the substrate support unit 6 is completed. You may carry out in the state supported by the board|substrate 100 by the board|substrate support unit 6 . Acquisition of the positional information of the board|substrate 100 after conveyance to a delivery position is by the camera 7 or 8 at the time of aligning the board|substrate 100 and the mask 101 by the alignment apparatus 2 in S6. You may serve also as measurement.

In this way, the amount of deviation from the target position of the substrate 100 when the transfer robot 151 is moved to the transfer position in the film forming apparatus 1 is measured using the camera 7 or 8 of the film forming apparatus 1 . By doing so, since it is not necessary to separately provide a measuring means for measuring the amount of deviation from the target position, the configuration of the apparatus can be simplified. In addition, since the offset amount can be updated not only during the teaching operation but also during the operation of the manufacturing line, it is possible to respond in a timely manner to variations in conveying misalignment due to changes in the environment or equipment over time, while maintaining conveying accuracy. can On the other hand, it was decided to update the offset amount based on the position information of the substrate 100 measured using the camera 7 or 8, but the present invention is not limited thereto. You may update it.

In S4, the processing unit 3091 performs a substrate transfer operation (control means). Specifically, the processing unit 3091 controls the transfer robot 151 to transfer the substrate 100 to the transfer positions set in S2 and S3 to place the substrate 100 . From a certain point of view, the processing unit 3091 causes the transfer robot 151 to transfer the substrate 100 to the transfer position based on the obtained substrate information in steps S2 to S4. In S5 , the processing unit 3091 transmits a transfer end notification to the effect that the substrate transfer operation has ended to the control device 14 and/or the host device 300 of the film forming apparatus 1 of the delivery destination. As mentioned above, the process on the side of the conveyance apparatus 15 is complete|finished.

When the control apparatus 14 of the film-forming apparatus 1 receives the conveyance end notification, it aligns the board|substrate 100 and the mask 101 by the alignment apparatus 2 in S6. In addition, although detailed description is abbreviate|omitted, a well-known technique is employable as a method of alignment.

In S7 , the control device 14 of the film forming apparatus 1 executes the film forming process after the alignment is finished. Here, a thin film is formed on the lower surface of the substrate 100 through the mask 101 by the film forming unit 4 . When the film-forming process is finished, in step S8 , the control device 14 transmits a film-forming end notification to the effect that the film-forming has been completed to the control device 309 of the conveying device 15 and/or the host device 300 . As described above, the process on the film-forming apparatus 1 side is finished.

On the other hand, the processing unit 3091 that has received the film-forming end notification refers to the transfer route information managed by the host device 300 , and the next transfer destination of the substrate 100 is in another film-forming chamber 303 in the film-forming block 301 . In the case of the film-forming apparatus 1, you may repeat a process again from S1. In addition, even when the next transfer destination is the buffer chamber 306 , the processing unit 3091 may change the transfer position of the substrate 100 based on the substrate information.

7 : is a flowchart which shows the specific example of the delivery position correction shown in S3.

In S31, the processing part 3091 confirms the board|substrate information acquired in S1, and if it is A cut, it progresses to S32, and if it is B cut, it progresses to S33. In S32 , the processing unit 3091 acquires the offset amounts (Δx=x1, Δy=y1) based on the relationship between the substrate information and the transfer position offset amount shown in FIG. 8B . In S33 , the processing unit 3091 acquires the offset amount (Δx=x2, Δy=y2) based on the relationship between the substrate information and the transfer position offset amount shown in FIG. 8B . In S34, the processing unit 3091 corrects the delivery position set in S2 based on the offset amount acquired in S32 or S33. Thereby, the transfer position is changed in the case where the substrate 100 is an A cut and a B cut.

On the other hand, the relationship between x1 and x2 and the relationship between y1 and y2 are not particularly limited. For example, the offset amounts (Δx, Δy) may be different in cut A and cut B (x2≠x1, y2≠y1). In addition, either one of the offset amounts (Δx, Δy) may be different between the A cut and the B cut. For example, x2≠x1 and y2=y1 may be sufficient, or x2=x1 and y2≠y1 may be sufficient.

Alternatively, the offset amounts (Δx, Δy) of the cut A and the cut B may be the same (x2 = x1 and y2 = y1) in some cases. That is, in the present embodiment, the storage unit 3092 stores the offset amount corresponding to the cut A and the offset amount corresponding to the cut B, respectively, but these values may be the same in some cases. In other words, the storage unit 3092 distinguishes and stores the transfer position offset amount in correspondence with the substrate information, and when transferring the substrate 100, selects any one of a plurality of stored transfer position offset amounts according to the substrate information. When used, the specific value of the transmission position offset amount is not particularly limited. On the other hand, for example, when processing a certain substrate, even if the transfer position offset amount is the same in the case where the substrate 100 is A cut and B cut, after processing several substrates, the transfer position offset amount is the same as described above. Since it may be reset or updated, it may not always be the same value.

As described above, in the present embodiment, the processing unit 3091 transfers the substrate 100 to the transfer position to the transfer robot 151 based on the substrate information. Thereby, regarding the conveyance of the board|substrate cut out from the large size board|substrate, the dispersion|variation in the conveyance position by the difference of the cut-out position can be suppressed. Incidentally, in the present embodiment, different transfer positions are set in the substrate 100A and the substrate 100B in which the cut-out positions from the large substrate differ. Therefore, even in the case where the characteristics of the substrate differ depending on the cutting position from the large substrate and the difference in these characteristics affects the behavior of the substrate 100 at the time of conveying the substrate, the deviation of the conveying position can be suppressed. have.

In addition, in this embodiment, in performing position adjustment of the board|substrate 100 with respect to the mounting part 61 of the board|substrate support unit 6, not the board|substrate support unit 6, but the conveyance robot 151 is operated. . Accordingly, the position adjustment of the substrate 100 with respect to the mounting unit 61 is performed while maintaining the relative positional relationship between the film forming unit 4 and the substrate supporting unit 6 . Therefore, after the board|substrate 100 is mounted on the mounting part 61, since it is not necessary to perform position adjustment of the film-forming unit 4 and the board|substrate support unit 6 every time, working time can be shortened.

<Method for manufacturing electronic device>

Next, an example of the manufacturing method of an electronic device is demonstrated. Hereinafter, the structure and manufacturing method of an organic electroluminescent display are illustrated as an example of an electronic device. In the case of this example, the film-forming block 301 illustrated in FIG. 1 is provided on a manufacturing line, for example in three places.

First, an organic EL display device to be manufactured will be described. Fig. 9(A) is an overall view of the organic EL display device 50, and Fig. 9(B) is a view showing a cross-sectional structure of one pixel.

As shown in Fig. 9A, in the display area 51 of the organic EL display device 50, a plurality of pixels 52 including a plurality of light emitting elements are arranged in a matrix shape. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

In addition, the pixel here refers to the minimum unit which enables display of a desired color in the display area 51 . In the case of a color organic EL display device, the pixel 52 is constituted by a combination of a plurality of sub-pixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B that emit light different from each other. has been The pixel 52 is often constituted by a combination of three types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 may include at least one type of sub-pixel, preferably includes two or more types of sub-pixels, and more preferably includes three or more types of sub-pixels. As the sub-pixel constituting the pixel 52 , for example, a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element. may be

Fig. 9(B) is a schematic partial cross-sectional view taken along line A-B of Fig. 9(A). The pixel 52 is, on the substrate 53 , a first electrode (anode) 54 , a hole transport layer 55 , a red layer 56R, a green layer 56G, or a blue layer 56B. It has a plurality of sub-pixels composed of one, an electron transport layer 57 , and an organic EL element including a second electrode (cathode) 58 . Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to the organic layer. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in a pattern corresponding to a light emitting element (which may be described as an organic EL element) emitting red, green, and blue, respectively.

In addition, the 1st electrode 54 is formed separately for each light emitting element. The hole transport layer 55 , the electron transport layer 57 , and the second electrode 58 may be formed in common over the plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 9B , the red layer 56R, the green layer 56G, and the blue layer 56B are formed on the hole transport layer 55 as a common layer over a plurality of sub-pixel regions. Each region may be formed separately, and further, the electron transport layer 57 and the second electrode 58 may be formed thereon as a common layer over a plurality of sub-pixel regions.

On the other hand, in order to prevent a short circuit between the adjacent first electrodes 54 , an insulating layer 59 is provided between the first electrodes 54 . Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 60 for protecting the organic EL element by moisture or oxygen is provided.

Although the hole transport layer 55 and the electron transport layer 57 are shown as one layer in FIG. 9B , depending on the structure of the organic EL display device, it may be formed of a plurality of layers having a hole blocking layer or an electron blocking layer. do. In addition, between the first electrode 54 and the hole transport layer 55, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is provided. may be formed. Similarly, an electron injection layer may be formed also between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed as a single light emitting layer or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transporting layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transporting layer or a hole blocking layer. By providing the layer below or above the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R is shown here, the same structure may be employ|adopted also for the green layer 56G and the blue layer 56B. In addition, the number of layers may be two or more. Furthermore, layers of different materials such as the light emitting layer and the electron blocking layer may be laminated, or layers of the same material may be laminated, for example, by laminating two or more light emitting layers.

Next, an example of a manufacturing method of the organic EL display device will be specifically described. Here, it is assumed that the red layer 56R consists of two layers, the lower layer 56R1 and the upper layer 56R2, and the green layer 56G and the blue layer 56B are formed of a single light emitting layer.

First, a substrate 53 on which a circuit (not shown) for driving an organic EL display device and a first electrode 54 are formed is prepared. Meanwhile, the material of the substrate 53 is not particularly limited, and may be made of glass, plastic, metal, or the like. In this embodiment, as the board|substrate 53, the board|substrate by which the film of polyimide was laminated|stacked on the glass substrate is used.

A resin layer such as acryl or polyimide is coated with bar coat or spin coat on the substrate 53 on which the first electrode 54 is formed, and the resin layer is applied to the portion where the first electrode 54 is formed by lithography. An insulating layer 59 is formed by patterning to form an opening. This opening corresponds to the light emitting region in which the light emitting element actually emits light. On the other hand, in this embodiment, processing is performed with respect to a large substrate until formation of the insulating layer 59, and the division|segmentation process of dividing the board|substrate 53 is performed after formation of the insulating layer 59. As shown in FIG.

The substrate 53 on which the insulating layer 59 has been patterned is carried into the first film formation chamber 303 , and a hole transport layer 55 is formed as a common layer on the first electrode 54 of the display area. The hole transport layer 55 is formed into a film using a mask in which an opening is formed for each display region 51 that will eventually become a panel portion of each organic EL display device.

Next, the substrate 53 on which the hole transport layer 55 has been formed is loaded into the second film formation chamber 303 . A portion (region for forming a red sub-pixel) in which the substrate 53 and the mask are aligned, the substrate is placed on the mask, and the element emitting the red color of the substrate 53 is disposed on the hole transport layer 55 Then, a red layer 56R is formed. Here, the mask used in the second film formation chamber is a high-precision mask in which openings are formed only in a plurality of regions serving as red sub-pixels among a plurality of regions on the substrate 53 serving as sub-pixels of the organic EL display device. . Accordingly, the red layer 56R including the red light emitting layer is formed only in the region serving as the red subpixel among the regions serving as the plurality of subpixels on the substrate 53 . In other words, the red layer 56R is not formed in a region serving as a blue subpixel or a region serving as a green subpixel among regions serving as a plurality of subpixels on the substrate 53 , but is selectively formed in a region serving as a red subpixel is filmed

Similar to the film formation of the red layer 56R, the green layer 56G is formed in the third film formation chamber 303 , and further, the blue layer 56B is formed in the fourth film formation chamber 303 . After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth deposition chamber 303 . The electron transport layer 57 is formed as a layer common to the three-color layers 56R, 56G, and 56B.

The substrate on which the electron transport layer 57 has been formed is moved to the sixth film formation chamber 303 , and the second electrode 58 is formed into a film. In the present embodiment, each layer is formed by vacuum vapor deposition in the first to sixth film formation chambers 303 . However, the present invention is not limited thereto, and for example, the film formation of the second electrode 58 in the sixth film formation chamber 303 may be formed by sputtering. Thereafter, the substrate on which up to the second electrode 58 has been formed is moved to a sealing device to form a protective layer 60 by plasma CVD (sealing step), and the organic EL display device 50 is completed. In addition, although it was assumed here that the protective layer 60 was formed by the CVD method, it is not limited to this, You may form by the ALD method or the inkjet method.

Here, the film formation in the 1st film-forming chamber 303 - the 6th film-forming chamber 303 is formed into a film using the mask in which the opening corresponding to the pattern of each layer to be formed was formed. At the time of film-forming, after performing relative position adjustment (alignment) of the board|substrate 53 and a mask, the board|substrate 53 is mounted on a mask, and film-forming is performed. Here, the alignment process performed in each film-forming chamber is performed like the alignment process mentioned above.

<Other embodiment>

In the above embodiment, the conveying apparatus 15 conveyed the substrate 100 to the film forming apparatus 1 . However, when the conveying apparatus 15 conveys the board|substrate 100 to the processing apparatus which performs processes other than film formation, you may carry out the above-mentioned process (S1 - S5). As a processing apparatus which performs processing other than film-forming, the sealing apparatus etc. which were mentioned above are mentioned.

In addition, in the above embodiment, the host device 300 stores the identification information, the substrate information, and the transport route information of each substrate 100 in correspondence, and the storage unit 3092 of the transport device 15 transfers the substrate information and the information. The position offset amount is stored in correspondence. However, the host device 300 may collectively manage these information.

In addition, the offset amount of the transfer position may be provided for each film-forming apparatus 1 in the film-forming block 301, respectively. That is, the offset amount may be set based on the substrate information and the film forming apparatus 1 . However, a configuration in which the offset amount corresponds only to the substrate information and the same offset amount is used in each film forming apparatus 1 is also employable if the substrate information is the same.

In addition, in the said embodiment, after setting the reference value of the delivery position, the processing part 3091 was offsetting the delivery position based on board|substrate information. However, information in which positional information of a plurality of transfer positions is respectively associated with a plurality of pieces of substrate information (cuts A and B in the above embodiment) may be stored in the storage unit 3092 . In other words, you may store the positional information of the transfer position corrected in advance in consideration of the transfer deviation resulting from the cutting position of the substrate in association with the information in the storage unit 3092 . In addition, the processing unit 3091 may read the position information corresponding to the acquired substrate information, and control the transfer robot 151 so that the substrate 100 is transferred at the transfer position according to the read position information. That is, the information associated with the substrate information is not limited to the amount of offset from the reference value of the transfer position, but positional information of the transfer position itself, for example, a fixed coordinate system in the entire film forming block 301 or the film forming apparatus 1 . It may be coordinate information of a fixed coordinate system in .

In addition, in the above embodiment, the processing unit 3091 acquired the substrate information from the host device 300 through communication (S1). However, the acquisition of the substrate information by the processing unit 3091 may be another aspect. For example, the conveyance apparatus 15 may be equipped with detection apparatuses, such as a camera which can detect the presence or absence of the orientation flat OF, and the processing part 3091 may acquire board|substrate information based on the detection result. In addition, for example, the processing part 3091 may acquire board|substrate information by attaching identifiers, such as a barcode which shows board|substrate information, to each board|substrate 100, and reading an identifier.

On the other hand, in the above embodiment, it can be said that the film forming apparatus 1 in the film forming chamber 303 has one substrate stage including a substrate supporting unit 6 and a mask stand 5 and the like. (1) may have two or more substrate stages. As a result, while the film forming unit 4 is forming a film on the substrate 100 on one substrate stage, the substrate 100 is loaded into the other substrate stage, and alignment by the alignment device 2 can be performed. and work efficiency can be improved. Incidentally, in such a configuration, the storage unit 3092 may store the offset amount based on the substrate information for each substrate stage. The processing unit 3091 may control the transfer robot 151 so that the transfer position is changed based on the substrate information and the substrate stage on which the substrate 100 is placed.

In the above embodiment, it is assumed that the substrate information and the identification information of the substrate 100 are related and managed by the host device 300 , but the identification information of the substrate 100 itself may include the substrate information. For example, the character string etc. which comprise identification information may contain the part which shows board|substrate information. In this case, the processing unit 3111 may acquire the substrate information from the identification information of the substrate 100 received from the host device 300 .

The present invention provides a program for realizing one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in a computer of the system or apparatus read and execute the program. It can also be realized by processing. In addition, it can be realized by a circuit (for example, an ASIC) that realizes one or more functions.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.

1: film forming device
15: transport device (substrate transport device)
151: transfer robot (transport means)
3091: processing unit (acquisition means, control means)
3092: memory unit (memory means)
100: substrate
101: mask

Claims (19)

a conveying means for conveying any one of the plurality of substrates obtained by dividing the large substrate to a delivery position in the processing apparatus, and transferring the substrate to a substrate supporting means provided in the processing apparatus;
A substrate conveying apparatus comprising a control means for controlling the conveying means,
acquiring means for acquiring substrate information regarding a portion of the substrate transported by the transport means in the large-sized substrate before division;
and said control means causes said conveying means to convey said board|substrate to the said delivery position based on the said board|substrate information acquired by said acquisition means. According to claim 1,
and storage means for storing correction information for correcting the transfer position in association with the substrate information. 3. The method of claim 2,
The said control means correct|amends the said delivery position from a reference position based on the said board|substrate information acquired by the said acquisition means, and the said correction|amendment information memorize|stored in the said memory|storage means in association with the said board|substrate information, and the said conveyance means A substrate transfer apparatus, characterized in that for controlling the. 4. The method of claim 3,
The correction information is an offset amount,
The control means is
reading the offset amount according to the substrate information acquired by the acquisition means from the storage means;
The substrate conveying apparatus according to claim 1, wherein the conveying means is controlled so that the conveying position is offset from the reference position according to the read offset amount. According to claim 1,
The substrate transport apparatus further comprising a storage means for storing a plurality of pieces of information on the transfer positions in association with a plurality of pieces of information on the substrate, respectively. 6. The method of claim 5,
The control means is
reading the information of the transfer position corresponding to the substrate information acquired by the acquiring means from the storage means;
The substrate transport apparatus according to claim 1, wherein the transport means is controlled so that the substrate is transferred at the transfer position according to the read information on the transfer position. a conveying means for conveying any one of the plurality of substrates obtained by dividing the large substrate to a delivery position in the processing apparatus, and transferring the substrate to a substrate supporting means provided in the processing apparatus;
A substrate transfer apparatus comprising a control means for controlling the transfer means,
acquiring means for acquiring substrate information regarding a portion of the substrate transported by the transport means in the large-sized substrate before division;
wherein said control means causes said conveying means to convey said board|substrate to the said delivery position which differs according to the said board|substrate information acquired by said acquisition means. 8. The method according to any one of claims 1 to 7,
The said processing apparatus is a vapor deposition apparatus, The board|substrate conveyance apparatus characterized by the above-mentioned. a processing apparatus comprising a substrate supporting means for supporting any one of a plurality of substrates obtained by dividing a large-sized substrate and processing the substrate supported by the substrate supporting means;
conveying means for conveying the substrate to a delivery position in the processing apparatus and conveying the substrate to the substrate supporting means;
A substrate processing system comprising control means for controlling the conveying means, the substrate processing system comprising:
acquiring means for acquiring substrate information regarding a portion of the substrate transported by the transport means in the large-sized substrate before division;
The control means causes the carrying means to transfer the substrate to the delivery position based on the substrate information acquired by the acquisition means. 10. The method of claim 9,
and storage means for storing correction information for correcting the transfer position in association with the substrate information. 11. The method of claim 10,
The processing apparatus further includes positional information acquisition means for acquiring positional information of the substrate in the processing apparatus;
and updating means for updating the correction information stored in the storage means based on the positional information of the substrate acquired by the positional information acquiring means. 10. The method of claim 9,
The substrate processing system further comprising storage means for storing positional information of a plurality of the transfer positions in association with a plurality of the substrate information, respectively. 11. The method of claim 10,
The processing apparatus further includes positional information acquisition means for acquiring positional information of the substrate in the processing apparatus;
and updating means for updating the information of the transfer position stored in the storage means based on the positional information of the substrate acquired by the positional information acquiring means. a processing apparatus comprising a substrate supporting means for supporting any one of a plurality of substrates obtained by dividing a large-sized substrate and processing the substrate supported by the substrate supporting means;
conveying means for conveying the substrate to a delivery position in the processing apparatus and conveying the substrate to the substrate supporting means;
A substrate processing system comprising control means for controlling the conveying means, the substrate processing system comprising:
acquiring means for acquiring substrate information regarding a relative position of the substrate conveyed by the conveying means in the large substrate before division;
The control means causes the carrying means to transfer the substrate to the different delivery position in accordance with the substrate information acquired by the acquisition means. A substrate transport method comprising: transporting one of a plurality of substrates obtained by dividing a large substrate to a transfer position in a processing apparatus, and transferring the substrate to a substrate supporting means provided in the processing apparatus;
an acquisition step of acquiring substrate information regarding a portion of the substrate on the large substrate before division;
In the transfer step, the substrate is transferred to the transfer position based on the substrate information acquired in the acquisition step. A substrate transport method comprising: transporting one of a plurality of substrates obtained by dividing a large substrate to a transfer position in a processing apparatus, and transferring the substrate to a substrate supporting means provided in the processing apparatus;
an acquisition step of acquiring substrate information regarding a portion of the substrate on the large substrate before division;
In the conveying process, the board|substrate is conveyed to the said delivery position different according to the said board|substrate information acquired in the said acquisition process, The board|substrate conveying method characterized by the above-mentioned. A transport step of transporting a substrate by the substrate transport method according to claim 15 or 16;
and a film forming step of forming a film on the substrate transferred to the film forming apparatus which is the processing apparatus by the conveying step. A program stored in a storage medium for causing a computer to execute each step of the substrate transport method according to claim 15 or 16. A computer-readable storage medium storing a program for causing a computer to execute each step of the substrate transport method according to claim 15 or 16.

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