KR20210155196A - Cooling module with improved insulation efficiency - Google Patents

Abstract

The present invention relates to a cooling module with improved insulation efficiency. According to an embodiment of the present invention, a molding module or an insulating pad is disposed between a base plate provided with a heat dissipation member and a thermoelectric block provided with a heat generating element, thereby having the effect of increasing the heat dissipation effect of the heat generating element and preventing equipment failure due to electric short. In addition, according to the embodiment of the present invention, as a molding module is molded to the outside of a thermoelectric block and coupled to either side of a base plate, the gap generated by the separation of an insulator is minimized and the thermoelectric block and the close contact of the insulator and the thermoelectric block is maintained, thereby having the effect of maintaining insulation efficiency and heat dissipation efficiency for a long time.

Description

Cooling module with improved insulation efficiency {COOLING MODULE WITH IMPROVED INSULATION EFFICIENCY}

The present invention relates to a cooling module with improved insulation efficiency.

In general, in a heat dissipation system of a power electronic device, a cooling fan and a cooler (a heat sink and a heat pipe) are disposed inside a case of the power electronic device, and a heat generating element is disposed above the cooler to secure heat dissipation performance.

The heat generated by the power semiconductor is dissipated by the air-cooled heat dissipation structure, and the cooler is an important element of the heat dissipation system and is used to dissipate the heat generated by the heat generating element.

In general, an extruded-type cooler having a low manufacturing cost and excellent heat dissipation performance is mainly used for coolers such as heat sinks and heat pipes.

Therefore, due to practical restrictions such as manufacturing equipment and unit cost, a swaged-type or a bonded-type in which a pin and an upper and lower plate are separately manufactured and combined are also used.

On the other hand, in the case of the conventional heat dissipation system, there is no insulator between the cooler and the heating element, there is a problem that an electric short occurs.

Accordingly, recently, a heat dissipation system for preventing an electric short that may occur between the cooler and the heating element in advance by disposing an insulator between the cooler and the heating element has been developed.

However, in the case of the above-described heat dissipation system, there is a problem in that the insulation efficiency and heat dissipation efficiency are deteriorated as the insulator is spaced apart from the cooler and the heating element due to various internal and external factors, and foreign substances are introduced into the spaced gap.

Korean Utility Model No. 20-2018-0002605 'Heat dissipation system using modular cooling system'

Accordingly, the present invention has been devised in the background described above, and an object of the present invention is to dispose a molding module or an insulating pad between a base plate provided with a heat dissipation member and a thermoelectric block provided with a heat generating element, thereby providing a heat dissipation effect of the heat generating element The purpose of this is to prevent equipment failure due to electric short while increasing it.

In addition, an object of the present invention is to minimize the gap between the insulator and the thermoelectric block as the molding module is molded on the outside of the thermoelectric block and coupled to either side of the base plate while the insulator and the thermoelectric block are in close contact. The purpose is to maintain the insulation efficiency and heat dissipation efficiency for a long time by maintaining the

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve this problem, an embodiment of the present invention provides a base plate having a heat dissipation member on its lower side; a molding module having a lower surface coupled to an upper surface of the base plate and having an upper or upper and lower open receiving space; and a thermoelectric block accommodated in the accommodating space and transferring heat emitted from the heating element provided on the upper side to the lower side provided with the base plate.

According to an embodiment of the present invention, by disposing a molding module or an insulating pad between a base plate provided with a heat dissipation member and a thermoelectric block provided with a heat generating element, the heat dissipation effect of the heat generating element is enhanced while equipment failure due to electric short. has the effect of preventing in advance.

In addition, according to an embodiment of the present invention, as the molding module is molded to the outside of the thermoelectric block and coupled to either side of the base plate, the insulator and the thermoelectric block are in close contact while minimizing the gap that occurs due to the separation between the insulator and the thermoelectric block. By maintaining the current state, there is an effect that can maintain insulation efficiency and heat dissipation efficiency for a long time.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is an exploded perspective view of a cooling module with improved insulation efficiency according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of the thermoelectric block and the molding module of FIG. 1 .
3 is a longitudinal cross-sectional view of a cooling module with improved insulation efficiency according to an embodiment of the present invention.
4 to 7 are diagrams illustrating a method of manufacturing a cooling module having improved insulation efficiency according to an embodiment of the present invention in stages.
8 is an exploded perspective view of a cooling module with improved insulation efficiency according to another embodiment of the present invention.
9 is an exploded perspective view of the thermoelectric block and the molding module of FIG. 8 .
10 is a longitudinal cross-sectional view of a cooling module with improved insulation efficiency according to another embodiment of the present invention.
11 to 13 are views showing a method of manufacturing a cooling module with improved insulation efficiency according to another embodiment of the present invention in stages.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is formed between each component. It should be understood that elements may be "connected," "coupled," or "connected."

1 is an exploded perspective view of a cooling module with improved insulation efficiency according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the thermoelectric block and the molding module of FIG. 1 . 3 is a longitudinal cross-sectional view of a cooling module with improved insulation efficiency according to an embodiment of the present invention. 4 to 7 are diagrams illustrating a method of manufacturing a cooling module having improved insulation efficiency according to an embodiment of the present invention in stages. 8 is an exploded perspective view of a cooling module with improved insulation efficiency according to another embodiment of the present invention. 9 is an exploded perspective view of the thermoelectric block and the molding module of FIG. 8 . 10 is a longitudinal cross-sectional view of a cooling module with improved insulation efficiency according to another embodiment of the present invention. 11 to 13 are views showing a method of manufacturing a cooling module with improved insulation efficiency according to another embodiment of the present invention step by step.

As shown in these drawings, the cooling module 10 with improved insulation efficiency according to an embodiment of the present invention includes a base plate 101 having a heat dissipation member on its lower side; a molding module 105 having a lower surface coupled to an upper surface of the base plate 101 and having an upper opening accommodating space 103; and a thermoelectric block 107 accommodated in the accommodating space 103 and transferring heat emitted from the heating element provided on the upper side to the lower side provided with the base plate 101 .

Hereinafter, each configuration will be described in detail.

First, the base plate 101 is formed of a metal material, and the base plate 101 may be made of an aluminum alloy or the like.

In addition, a heat dissipation member is provided on the lower surface of the base plate 101 .

Here, the heat dissipation member may be, for example, a cooling device such as a heat pipe.

Then, the lower side of the molding module 105 is closely coupled to the upper side of the base plate 101 .

In addition, the molding module 105 is formed with a receiving space 103 with an open top, and the thermoelectric block 107 is accommodated in this receiving space 103 .

Here, the accommodation space 103 may be formed by being depressed from the upper side to the lower side of the molding module 105 so that the upper surface of the thermoelectric block 107 is exposed to the outside.

As such, the lower side of the molding module 105 is coupled to the base plate 101 and an accommodation space 103 in which the thermoelectric block 107 is accommodated is formed, thereby coupling the thermoelectric block 107 and the base plate 101 .

When describing the structure of the molding module 105 in more detail, the molding module 105 is formed to protrude in the inner direction of the accommodation space 103 along the upper edge to support the upper edge of the thermoelectric block 107 . The upper support jaw portion 201; includes.

As such, in the molding module 105 according to an embodiment of the present invention, the upper support jaw 201 supporting the upper edge of the thermoelectric block 107 is formed along the upper edge, and thus accommodated inside the accommodation space 103 . The thermoelectric block 107 may be supported so that the thermoelectric block 107 is not separated to the outside of the accommodation space 103 .

In addition, the molding module 105 is formed to protrude to the inside of the receiving space 103 in any one or more of the plurality of edges inside the corner coupling portion 203 coupled to the edge of the thermoelectric block 107; further includes .

The edge coupling part 203 is formed to protrude from the inner surface of the edge of the molding module 105 to be spaced apart from the bottom surface 109 of the molding module 105 by a predetermined distance.

That is, the edge coupling portion 203 may have an upper end connected to the upper support jaw portion 201 and a lower end spaced apart from the bottom surface 109 by a predetermined interval.

On the other hand, the corner coupling portion 203 may be formed so that the round surface r1 is convexly formed in the corner portion formed with the upper support jaw portion 201 interposed therebetween.

The corner coupling portion 203 may be formed to protrude from each corner of the molding module 105 to the inside of the receiving space 103 to be coupled to the corner of the thermoelectric block 107 .

That is, as shown in the figure, the corner coupler 203 is formed inside each corner of the molding module 105 to provide four, and a round surface r1 is formed on each corner coupler 203 . can be

On the other hand, the molding module 105 has a coupling protrusion 205 that is formed to protrude downward from the edge coupling part 203 and is coupled to the edge of the thermoelectric block 107 , and a bottom surface 109 inside the receiving space 103 . It is formed to protrude along the edge of the thermoelectric block 107 and includes a lower support jaw portion 207 for supporting the lower edge.

The coupling protrusion 205 is formed to protrude downward from the upper side of each corner coupling part 203 and is coupled to the edge of the thermoelectric block 107 . It protrudes in a cylindrical shape from the lower side and is connected to the bottom surface 109 .

As such, in the molding module 105 according to an embodiment of the present invention, the corner coupling portion 203 coupled to the edge of the thermoelectric block 107 and the coupling protrusion 205 are formed, thereby firmly coupled to the thermoelectric block 107 . to support the thermoelectric block 107 .

On the other hand, the molding module 105 is a liquid insulating material (I) inside the molding space 401 in a state in which the thermoelectric block 107 is accommodated inside the molding space 401 having a shape corresponding to the molding module 105 . ) can be formed after being injected and hardened.

At this time, the molding module 105 is closely coupled to the outer surface of the thermoelectric block 107 as the liquid insulating material (I) hardens, and is closely coupled to the upper surface of the base plate 101 .

Here, the liquid insulating material (I) may be, for example, silicon.

This molding module 105 is characterized in that it blocks current movement between the base plate 101 and the thermoelectric block 107 while transferring the heat transferred to the thermoelectric block 107 to the base plate 101 .

Next, the thermoelectric block 107 according to an embodiment of the present invention is accommodated in the accommodation space 103 and coupled to the molding module 105 .

That is, the thermoelectric block 107 is accommodated in the accommodating space 103 so that the lower side thereof is in close contact with the bottom surface 109 of the molding module 105 , and the edge thereof is closely coupled to the inner surface of the molding module 105 .

On the other hand, the thermoelectric block 107 is provided with a heating element on the upper side.

That is, the thermoelectric block 107 performs a function of absorbing heat emitted by the heating element provided on the upper side and transferring the heat to the molding module 105 .

To describe the structure of the thermoelectric block 107 in more detail, the thermoelectric block 107 includes a first block 111 provided with a heating element on its upper side to absorb heat emitted from the heating element; and the upper surface is coupled or integrally formed with the lower surface of the first block 111, and the lower surface absorbs heat emitted from the heating element and transfers it to the molding module 105, but larger than the first block 111 and a second block 113 formed by an area.

The upper surface of the first block 111 is exposed to the outside of the accommodation space, and heat emitted from the heating element provided on the upper surface is transferred to the second block 113 .

The second block 113 has an upper surface coupled to or integrally formed with a lower surface of the first block 111 , and this second block 113 absorbs heat from the heating element transferred to the first block 111 . and delivered to the molding module 105 .

In addition, when the second block 113 is accommodated in the receiving space 103 , the lower edge of the second block 113 is seated and supported on the lower support jaw portion 207 of the molding module 105 .

In addition, the second block 113 may be formed to form a multi-stage structure with the first block 111 . More specifically, the second block 113 is formed with a larger area than the first block 111 so that the upper edge is formed. It is supported in close contact with the upper support jaw portion 201 of the molding module 105 .

On the other hand, as described above, the thermoelectric block 107 has a multi-stage structure in which the first block 111 and the second block 113 are formed, so that the upper support jaw portion 201 of the molding module 105 is mounted on the upper edge of the thermoelectric block 107 . A first supporting jaw forming space 405 to form is formed.

In the first support jaw forming space 405 , when the insulating material I is injected into the molding space 401 while the thermoelectric block 107 is coupled to the molding case part 403 , the insulating material I is hardened. The upper support jaw part 201 is formed as it goes down.

In addition, the second block 113 has a lower protrusion 209 protruding on its lower side in a smaller area than other regions. When the insulating material (I) is injected into the molding space 401 in a state in which the 107 is coupled to the molding case part 403, the insulating material (I) hardens and the lower support jaw part 207 is formed. A support jaw forming space 211 is formed.

On the other hand, the thermoelectric block 107 includes a corner coupling groove 115 that is formed with one or more depressions formed in the corner and is coupled to the inner surface of the molding module 105 .

Here, one or more edge coupling grooves 115 may be formed in the corners of the thermoelectric block 107 . In the drawings, an example in which the edge coupling grooves 115 are formed in each corner of the thermoelectric block 107 is shown.

That is, four corner coupling grooves 115 may be formed in each corner of the thermoelectric block 107 .

The corner coupling grooves 115 are recessed in the corners of the first block 111 and the second block 113 to be coupled to the corner coupling part 203 of the molding module 105 .

Here, the corner coupling groove 115 may be formed with a round surface r2 corresponding to the round surface r1 of the edge coupling part 203 concavely recessed on the side surface, where the round surface r2 is the edge coupling part. The round surface r1 of (203) is in close contact with the combined.

In addition, the thermoelectric block 107 includes one or more corner coupling holes 117 formed at the corners and coupled to the corners of the molding module 105 .

These edge coupling holes 117 may be formed at positions corresponding to the edge coupling grooves 115 in each corner of the thermoelectric block 107 to be connected to the edge coupling grooves 115 .

The corner coupling hole 117 is formed through a cylindrical shape to correspond to the coupling protrusion 205 and is coupled to the coupling protrusion 205 of the molding module 105 .

As such, according to an embodiment of the present invention, the edge coupling groove 115 and the edge coupling hole 117 of the thermoelectric block 107 are formed in the edge coupling part 203 and the coupling protrusion 205 of the molding module 105 . By being coupled, the thermoelectric block 107 and the molding module 105 can be more firmly coupled, and the thermoelectric block 107 is not easily separated from the molding module 105 while it is coupled to the molding module 105 . It works.

Hereinafter, a method of manufacturing the cooling module 10 with improved insulation efficiency according to an embodiment of the present invention will be described with reference to FIGS. 4 to 7 .

First, as shown in FIG. 4 , the thermoelectric block 107 is seated on the upper surface of the base plate 101 .

Then, the molded case part 403 having an open lower part and a molding space 401 having a shape corresponding to the molding module 105 is seated on the base plate 101, and the thermoelectric block 107 is located inside the molding space 401 . ) is accepted.

And, as shown in FIG. 5 , the thermoelectric block accommodated in the molding case part 403 and the molding space 401 by passing various coupling means through a plurality of coupling holes 601 formed on the upper surface of the molding part 401 . Assemble (107).

At this time, the lower surface of the thermoelectric block 107 is spaced apart from the upper surface of the base plate 101 by a predetermined interval so that the lower surface is completely covered by the molding module 105 .

Next, after assembling the molding case part 403 and the base plate 101 , the liquid insulating material I is injected into the molding space 401 through the plurality of injection holes 603 of the molding case part 403 . inject

As such, when the insulating material (I) is injected into the molding space (401), the insulating material (I) flows into the molding space (401) and surrounds the lower surface, the rim, and the upper surface of the thermoelectric block (107). , then the insulating material (I) is hardened to form the molding module (105).

More specifically, the insulating material (I) flowing into the first support jaw forming space 405 formed between the first block 111 and the second block 113 surrounds and supports the upper edge of the thermoelectric block 107 . The insulating material (I) formed by the upper support jaw part 201 and flowing into the second support jaw forming space 211 is formed into the lower support jaw part 207 to wrap and support the lower edge of the thermoelectric block 107 . .

At this time, the bottom surface 109 of the molding module 105 is coupled to the base plate 101 to couple the thermoelectric block 107 to the base plate 101 .

As such, when the molding module 105 is formed while the insulating material I injected into the molding space 401 is solidified, the molding case is formed from the base plate 101 and the thermoelectric block 107 as shown in FIG. 7 . After separating and removing the part 403, the cooling module 10 with improved insulation efficiency according to an embodiment of the present invention is completed.

As such, according to one embodiment of the present invention, the molding module 105 is coupled to the base plate 101 and is integrated with the thermoelectric block 107 while surrounding the bottom surface, the rim, and the upper rim of the thermoelectric block 107 . As a result, the gap between the insulator and the thermoelectric block 107 can be minimized, so that the insulation efficiency and heat dissipation efficiency can be maintained for a long time.

Meanwhile, referring to FIG. 8 , the cooling module 20 with improved insulation efficiency according to another embodiment of the present invention includes a base plate 801 having a heat dissipation member on its lower side; a molding module 809 having a lower surface coupled to an upper surface of the base plate 801 and having an upper and lower opening accommodation space 807; and a thermoelectric block 805 accommodated in the accommodating space 807 and transferring heat emitted from the heating element provided on the upper side to the lower side provided with the base plate 801 .

In addition, in the cooling module 20 with improved insulation efficiency according to another embodiment of the present invention, the lower side is coupled to the upper side of the base plate 801 , and the upper side is coupled to the lower side of the thermoelectric block 805 , but , an insulating pad 803 that blocks current movement between the base plate 801 and the thermoelectric block 805 while transferring the heat transferred to the thermoelectric block 805 to the base plate 801; do.

First, the base plate 801 is configured the same as the base plate 101 according to an embodiment of the present invention.

Subsequently, the thermoelectric block 805 is accommodated in the lower side of the receiving space 807 and the lower side is in close contact with the upper side of the insulating pad 803 to dissipate heat emitted from the heating element provided on the upper side to the insulating pad 803 . carry out the function of forwarding.

The upper edge of the thermoelectric block 805 is supported by the molding module 809 and fixed to the upper side of the base plate 801 .

To describe the structure of the thermoelectric block 805 in more detail, the thermoelectric block 805 includes a first block 811 provided with a heating element on the upper side to absorb heat emitted from the heating element; and the upper surface is coupled or integrally formed with the lower surface of the first block 811, and the lower surface absorbs heat emitted from the heating element and transfers it to the insulating pad 803, but larger than the first block 811 and a second block 813 formed by an area.

The upper surface of the first block 811 is exposed to the outside of the accommodation space 807 , and heat emitted from the heating element provided on the upper surface is transferred to the second block 813 .

The second block 813 has an upper surface coupled to or integrally formed with a lower surface of the first block 811 , and the drawings show an example in which the second block 813 is integrally formed with the first block 811 . did

When the second block 813 is accommodated in the accommodating space 803 , the lower edge of the second block 813 is seated and supported on the lower support jaw portion 901 of the molding module 809 .

In addition, the second block 813 may be formed in a multi-stage structure with the first block 811 . More specifically, the second block 813 has a larger area than the first block 811 so that the upper edge is formed. The molded insulation module 809 is supported in close contact with the upper support jaw portion 903 .

On the other hand, as described above, the thermoelectric block 805 has a multi-stage structure in which the first block 811 and the second block 813 have a multi-stage structure, so that the upper support jaw portion 903 of the molding module 809 is formed on the upper edge of the thermoelectric block 805 . A first supporting jaw forming space 815 is formed.

When the insulating material I is injected into the molding space 1103 in the state where the thermoelectric block 805 is coupled to the molding case unit 1101 in the first support protrusion forming space 815, the insulating material I is hardened. The upper support jaw portion 903 is formed while being lowered.

In addition, the second block 813 has a lower protrusion 905 protruding on the lower side in a smaller area than other regions. When the insulating material (I) is injected into the molding space 1103 in a state in which the 805 is coupled to the molding case unit 1101, the insulating material (I) is hardened and the lower support jaw unit 901 is formed. A support jaw forming space 907 is formed.

On the other hand, the thermoelectric block 805 is formed with one or more depressions in the corner, the corner coupling groove 817 coupled to the inner surface of the molding module 809; and one or more corner coupling holes 819 formed at the corners and coupled to the corners of the molding module 809 .

Here, one or more edge coupling grooves 817 may be formed at the corners of the thermoelectric block 805 . More specifically, the edge coupling grooves 817 are formed at the corners of the first block 811 and the second block 813 . It is formed to be recessed and is coupled to the edge coupling portion 909 of the molding module 809 .

Here, the corner coupling groove 817 may be formed so that the round surface r4 and the corresponding round surface r3 of the edge coupling portion 909 to be described later are concavely recessed on the side surface, where the round surface r3 is the corner It is coupled in close contact with the round surface r4 of the coupling portion 909 .

In addition, the corner coupling hole 819 may be formed at a position corresponding to the corner coupling groove 817 in each corner of the thermoelectric block 805 to be connected to the edge coupling groove 817 .

The corner coupling hole 819 is formed through a cylindrical shape to correspond to the coupling protrusion 911 of the molding module 809 and is coupled to the coupling protrusion 911 .

As such, according to an embodiment of the present invention, the edge coupling groove 817 and the edge coupling hole 819 of the thermoelectric block 805 are formed in the edge coupling part 909 and the coupling protrusion 911 of the molding module 809. By being coupled, there is an effect that the thermoelectric block 805 and the molding module 809 can be more firmly coupled.

Subsequently, the upper and lower portions of the molding module 809 are opened to form an accommodating space 807 in which the thermoelectric block 505 and the insulating pad 803 are accommodated.

The lower side of the molding module 809 is coupled to the upper side of the base plate 801 to fix the thermoelectric block 805 and the insulating pad 803 to the base plate 801 .

When describing the structure of the molding module 809 in more detail, the molding module 809 is formed to protrude in the inner direction of the accommodation space 807 along the upper edge to support the upper edge of the thermoelectric block 805 . It includes an upper support jaw portion (903).

Here, the upper support jaw part 903 is closely contacted with the upper edge of the second block 813 to support the thermoelectric block 805 so that the thermoelectric block 805 does not separate from the accommodating space 807 .

In addition, the molding module 809 is formed to protrude to the inside of the receiving space 807 at any one or more of the plurality of corners inside the corner coupling portion 909 coupled to the corner of the thermoelectric block 805; a coupling protrusion 911 which is formed to protrude downward from the edge coupling part 909 and is coupled to the edge of the thermoelectric block 805; and a lower support jaw portion 901 protruding along the inner edge of the accommodating space 807 to support the lower edge of the thermoelectric block 805 .

The edge coupling portion 909 is formed to protrude from the inner surface of the edge of the molding module 809 to be spaced apart from the insulating pad 803 by a predetermined distance.

That is, the edge coupling portion 909 may be formed such that an upper end thereof is connected to the upper support jaw portion 903 and a lower end thereof is spaced apart from the insulating pad 803 by a predetermined distance.

These edge coupling portions 909 are formed to protrude from each edge of the molding module 809 to the inside of the receiving space 807 and are coupled to each edge coupling groove 817 of the thermoelectric block 805, for example.

On the other hand, the corner coupling portion 909 may be formed so that the round surface r4 is convexly formed in the corner portion formed with the upper supporting jaw portion 903 interposed therebetween.

That is, as shown, the corner coupling portion 909 is formed inside each corner of the molding module 809 and may be provided in four pieces, and a round surface r4 is formed in each corner coupling portion 909 . can be

The coupling protrusion 911 is formed to protrude downward from the upper side of each corner coupling part 909 and coupled to the edge of the thermoelectric block 805, such coupling protrusion 911 is an example of the edge coupling part 909. It may protrude in a cylindrical shape from the lower surface to be in close contact with the upper surface of the insulating pad 803 .

In addition, the lower support jaw portion 901 is supported by the lower edge of the second block 813 being seated, and is in close contact with the upper edge of the insulating pad 803 to support the insulating pad 803 .

As such, in the molding module 809 according to an embodiment of the present invention, the corner coupling part 909 and the coupling protrusion 911 coupled to the edge of the thermoelectric block 805 are formed, thereby firmly coupled to the thermoelectric block 805 . to support the thermoelectric block 805 .

Meanwhile, the molding module 809 may be formed by injecting a liquid insulating material I into the molding space 1103 having a shape corresponding to that of the molding module 809 and then hardening.

On the other hand, the molding module 809 is a molding space 1103 in a state in which the thermoelectric block 805 and the insulating pad 803 are accommodated inside the molding space 1103 having a shape corresponding to the molding module 809. After the liquid insulating material (I) is injected, it may be hardened and formed.

At this time, the molding module 809 is closely coupled to the outer surface of the thermoelectric module 805 while the liquid insulating material I is solidified, and is closely coupled to the upper surface of the base plate 801 .

Here, the liquid insulating material (I) may be, for example, silicon.

Hereinafter, a method of manufacturing the cooling module 20 with improved insulation efficiency according to another embodiment of the present invention will be described with reference to FIGS. 11 to 13 .

First, as shown in FIG. 11 , the insulating pad 803 is seated on the upper surface of the base plate 801 , and then the thermoelectric block 805 is seated on the upper surface of the insulating pad 803 .

Then, the lower part is opened and the molding case part 1101 in which the molding space 1103 of the shape corresponding to the molding module 809 is formed is seated on the base plate 801, and the insulating pad 803 inside the molding space 1103 is placed. ) and the thermoelectric block 805 are accommodated.

And, as shown in FIG. 12 , various coupling means are penetrated through a plurality of coupling holes 1201 formed on the upper surface of the molding case part 1101 , and the thermoelectrics accommodated in the molding case part 1101 and the molding space 1103 . Assemble the block 805 .

Next, after assembling the molding case part 1101 and the base plate 801, the liquid insulating material (I) is injected into the molding space 1103 through the plurality of injection holes 1203 of the molding case part 1101. inject

As such, when the insulating material (I) is injected into the molding space (1103), the insulating material (I) flows into the molding space (1103) and surrounds the edges of the thermoelectric block (805) and the insulating pad (803), Thereafter, the insulating material (I) is hardened to form the molding module (809).

More specifically, the insulating material (I) introduced into the first support jaw forming space 815 formed between the first block 811 and the second block 813 surrounds and supports the upper edge of the thermoelectric block 805 . The insulating material (I) formed by the upper supporting jaw portion 903 and flowing into the second supporting jaw forming space 907 is formed as a lower supporting jaw portion 901 to surround and support the lower edge of the thermoelectric block 805 .

As such, when the molding module 809 is formed while the insulating material I injected into the molding space 1103 is solidified, the molding case is formed from the base plate 801 and the thermoelectric block 805 as shown in FIG. 13 . After separating and removing the part 1101, the cooling module 20 with improved insulation efficiency according to another embodiment of the present invention is completed.

As such, according to another embodiment of the present invention, while the molding module 809 is closely coupled to the upper surface of the base plate 801 , the thermoelectric block 805 is wrapped around the rim and the upper rim of the thermoelectric block 805 . As the insulator and the thermoelectric block 805 are formed integrally with each other, it is possible to minimize the gap that occurs because the insulator and the thermoelectric block 805 are spaced apart, so that the insulation efficiency and the heat dissipation efficiency can be maintained for a long time.

As described above, according to the embodiment of the present invention, the molding module 105 or the insulating pad 803 is disposed between the base plates 101 and 801 provided with the heat dissipation member and the thermoelectric blocks 107 and 805 provided with the heating element. By being disposed, there is an effect that can prevent equipment failure due to electric short while increasing the heat dissipation effect of the heating element.

In addition, according to an embodiment of the present invention, as the molding modules 105 and 809 are molded to the outside of the thermoelectric blocks 107 and 805 and coupled to either side of the base plates 101 and 801, the insulator and the thermoelectric blocks 107 and 805 are spaced apart. There is an effect that can maintain insulation efficiency and heat dissipation efficiency for a long time by maintaining a state in which the insulator and the thermoelectric blocks 107 and 805 are in close contact while minimizing the gap generated.

In the above, even though all the components constituting the embodiment of the present invention are described as being combined or operated in combination, the present invention is not necessarily limited to this embodiment. That is, within the scope of the object of the present invention, all the components may operate by selectively combining one or more.

In addition, terms such as "include", "comprise" or "have" described above mean that the corresponding component may be embedded unless otherwise stated, so excluding other components is not recommended. It should be construed as being able to further include other components. All terms including technical and scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs, unless otherwise defined. Terms commonly used, such as those defined in the dictionary, should be interpreted as being consistent with the meaning of the context of the related art, and are not interpreted in an ideal or excessively formal meaning unless explicitly defined in the present invention.

The above description is merely illustrative of the technical idea of the present invention, and various modifications and variations will be possible without departing from the essential characteristics of the present invention by those skilled in the art to which the present invention pertains.

Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these implementations. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10, 20: Cooling module with improved insulation efficiency
101: base plate
103: accommodation space
105: molding module
107: thermoelectric block
109: bottom surface
111: first block
113: second block
115: corner coupling groove
117: corner coupling hole
201: upper support jaw
203: edge coupling part
205: coupling protrusion
207: lower support jaw
209: lower protrusion
211: second support jaw formation space
401: molding space
403: molding case part
405: first support jaw forming space
601: coupling hole
603: injection hole
801: base plate
803: insulation pad
805: thermoelectric block
807: accommodation space
809: molding module
811: first block
813: second block
815: first support jaw forming space
817: corner coupling groove
819: corner coupling hole
901: lower support jaw
903: upper support jaw
905: lower protrusion
907: second support jaw formation space
909: edge coupling part
911: coupling protrusion
1101: molding case part
1103: molding space
1201: coupling hole
1203: injection hole

Claims (7)

a base plate provided with a heat dissipation member on a lower side thereof;
a molding module having a lower side coupled to an upper side of the base plate and having an upper or upper and lower open receiving space; and
a thermoelectric block accommodated in the accommodating space and transferring heat emitted from the heating element provided on the upper side to the lower side provided with the base plate;
A cooling module with improved insulation efficiency, comprising:
According to claim 1,
The molding module is
The cooling module with improved insulation efficiency, characterized in that the accommodating space having an open upper part is formed, and the heat is transferred from the thermoelectric block to the base plate, and current movement is blocked between the base plate and the thermoelectric block.
3. The method of claim 2,
The thermoelectric block is
a first block provided with the heating element on an upper surface to absorb the heat; and
a second block having an upper surface coupled to or integrally formed with a lower surface of the first block, the lower surface absorbing the heat and transferring the heat to the molding module, the second block having a larger area than the first block;
A cooling module with improved insulation efficiency, comprising:
According to claim 1,
The thermoelectric block is
One or more recesses are formed in the corners, the corner coupling groove is coupled to the inner surface of the molding module;
A cooling module with improved insulation efficiency, comprising:
According to claim 1,
The molding module is
an upper support jaw that is formed to protrude in the inner direction of the accommodating space along the upper edge to support the upper edge of the thermoelectric block;
A cooling module with improved insulation efficiency, comprising:
According to claim 1,
The molding module is
a corner coupling portion protruding from one or more of the plurality of corners to the inner side of the receiving space and coupled to the corner of the thermoelectric block;
A cooling module with improved insulation efficiency, comprising:
According to claim 1,
The lower side is coupled to the upper side of the base plate, and the upper side is coupled to the lower side of the thermoelectric block, and while transferring the heat transferred to the thermoelectric block to the base plate, current moves between the base plate and the thermoelectric block. Insulation pad to block the;
Insulation efficiency is improved cooling module, characterized in that it further comprises.

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