KR20210114884A - Deposition mask and method for manufacturing deposition mask - Google Patents

Abstract

The present invention is to provide a method for manufacturing a deposition mask with reduced deposition defects. A method for manufacturing a deposition mask manufactures a deposition mask comprising a mask frame having a void surrounded by a frame portion or a bar portion, a first plating layer overlapping the void in a plan view and provided in a region that does not overlap with the frame portion or the bar portion in a plan view, and a second plating layer bonding the mask frame and the first plating layer, wherein the first plating layer protrudes in a first direction from the mask frame. The deposition mask manufacturing method comprises a process of falling a projection protruding in the first direction from the second plating layer at a boundary between the second plating layer and the first plating layer.

Description

A deposition mask and a method for manufacturing a deposition mask

The present invention relates to a deposition mask. Moreover, this invention relates to the manufacturing method of a vapor deposition mask. In particular, the present invention relates to a method for manufacturing a deposition mask having a mask body in a thin film shape on a mask frame.

A liquid crystal display device and an organic EL (Electroluminescence) display device are mentioned as an example of a flat panel type display device. These display devices are structures in which thin films made of various materials such as insulators, semiconductors, and conductors are laminated on a substrate. By appropriately patterning and connecting these thin films, a function as a display device is realized.

The method of forming a thin film is classified broadly into a gas phase method, a liquid phase method, and a solid phase method. Meteorological methods are classified into physical meteorological methods and chemical meteorological methods. A vapor deposition method is known as a representative example of a physical vapor deposition method. The most convenient method among deposition methods is vacuum deposition. In the vacuum vapor deposition method, by heating a material in a high vacuum, the material is sublimated or evaporated to generate a vapor of the material (hereinafter, these are collectively referred to as vaporization). In the region for depositing this material (hereinafter, the vapor deposition region), the vaporized material is solidified and deposited, thereby obtaining a thin film of the material. A thin film is selectively formed in the deposition region, and vacuum deposition is performed using a mask (evaporation mask) in order to prevent material from being deposited in other regions (hereinafter, non-evaporated regions) (Patent Documents 1 and 2). Reference).

Japanese Patent Laid-Open No. 2009-87840 Japanese Patent Laid-Open No. 2013-209710

As for the vapor deposition mask, the mask frame for fixing the mask main body is joined to the mask main body in which the vapor deposition pattern was formed. In the process of bonding a mask main body and a mask frame, a burr (protrusion protruding from an edge part) generate|occur|produces on the vapor-deposited board|substrate side of a mask main body. When there are burrs, during deposition, the burrs scratch the substrate to be deposited. Moreover, a gap arises between a vapor deposition mask and a vapor deposition target board|substrate, and a vapor deposition pattern will fade. These phenomena are judged to be vapor deposition defect. Therefore, if the mask body has burrs, the yield of the product including the vapor-deposited substrate will fall. Therefore, cutting the burr of the mask body with a cutter or the like, and removing the burr from the mask body was performed.

However, when cutting a burr, it is necessary to perform it manually by an operator, confirming the position of a burr with a microscope. This operation was highly dependent on the skill level of the operator, and the operation time was different depending on the operator, and the operation time was long. Also, there was a problem in that the cut burrs were attached to the mask body as foreign substances.

In view of the above problem, one of the objects of the present invention is to provide a method for manufacturing a deposition mask in which deposition defects are reduced.

The manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention overlaps with the mask frame which has a space|gap surrounded by a frame part or a bar part, and a space|gap in planar view, and a frame part or a bar part A method of manufacturing a deposition mask comprising a first plating layer provided in a region that does not overlap in plan view, and a second plating layer bonding the mask frame and the first plating layer, wherein the first plating layer is provided to protrude from the mask frame in a first direction, , at the boundary between the second plating layer and the first plating layer, including a step of overturning the protrusion protruding from the second plating layer in the first direction.

1A is a plan view of a deposition mask according to an embodiment of the present invention.
1B is a cross-sectional view of a deposition mask according to an embodiment of the present invention.
It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
2C is a cross-sectional view showing a method for manufacturing a deposition mask according to an embodiment of the present invention.
It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
2E is a cross-sectional view showing a method for manufacturing a deposition mask according to an embodiment of the present invention.
2F is a cross-sectional view showing a method for manufacturing a deposition mask according to an embodiment of the present invention.
It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
It is sectional drawing which shows the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
It is a schematic diagram explaining the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
It is a schematic diagram explaining the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
It is a schematic diagram explaining the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.
It is a schematic diagram explaining the manufacturing method of the vapor deposition mask which concerns on one Embodiment of this invention.

EMBODIMENT OF THE INVENTION Hereinafter, each embodiment of this invention is demonstrated, referring drawings etc. However, this invention can be implemented in various aspects in the range which does not deviate from the summary, and it is limited to the description of embodiment illustrated below and is not interpreted.

In order to make description more clear, the drawing may be schematically displayed about the width|variety, thickness, shape, etc. of each part compared with an actual aspect. However, the examples shown in the drawings are merely examples and do not limit the interpretation of the present invention. In this specification and each drawing, the same code|symbol is attached|subjected to the structure similar to what was mentioned above about an existing drawing, and detailed description may be abbreviate|omitted suitably.

In the present invention, when a plurality of films are formed by etching or light irradiation with respect to any one film, the plurality of films may have different functions and roles. However, these plurality of films are derived from films formed as the same layer in the same process, and have the same layer structure and the same material. Accordingly, a plurality of these films is defined as being present in the same layer.

In this specification and claims, when simply expressing "on" when expressing an aspect in which another structure is disposed on a certain structure, unless otherwise specified, another structure is directly above the structure so as to be in contact with the structure, unless otherwise specified. It is defined as including both the case where it is arrange|positioned and the case where another structure is arrange|positioned above a certain structure and through another structure.

<First embodiment>

With reference to FIG. 1A and FIG. 1B, the structure of the vapor deposition mask 10 which concerns on one Embodiment of this invention is demonstrated.

1A is a plan view of a deposition mask 10 according to an embodiment of the present invention. 1B is a cross-sectional view of the deposition mask 10 according to the embodiment of the present invention. Specifically, FIG. 1B is a cross-sectional view of the deposition mask 10 cut along the line A-A' shown in FIG. 1 .

The deposition mask 10 includes a mask body 110 , a mask frame 120 , and a connection member 130 . The mask body 110 is connected to the mask frame 120 via the connection member 130 .

The mask frame 120 has an opening, and the mask body 110 is provided to overlap the opening of the mask frame 120 . In FIG. 1A, the mask frame 120 has 12 openings, and the mask body 110 is provided overlapping each opening part. In addition, the number of openings provided in the mask frame 120 is not limited to this. The number of openings provided in the mask frame 120 can be appropriately determined according to the size of the substrate to be deposited or the deposition pattern.

The mask body 110 is provided with a plurality of openings 113 penetrating the mask body 110 . Hereinafter, for convenience, the region in which the opening 113 is provided in the mask body 110 is referred to as the opening region 111 , and the region in which the opening 113 is not provided in the mask body is described as the non-opening region 112 . do. Although the boundary between the opening region 111 and the non-opening region 112 is not always clear, at least the non-opening region 112 is not provided with the opening 113, so that it can be distinguished.

At the time of vapor deposition, the deposition mask 10 and the deposition mask 10 so that the deposition region and the opening region 111 in the deposition target substrate overlap, and the non-evaporation region and the non-opening region 112 in the deposition target substrate overlap. The vapor-deposited substrate is aligned. Vapor of a vapor deposition material passes through the opening 113 of the opening area|region 111, and a vapor deposition material is deposited in the vapor deposition area|region of a vapor-deposited substrate.

When the deposition target substrate is a substrate of the display device, the openings 113 of the opening region 111 may be arranged in correspondence with the pixel arrangement of the display device. The arrangement of the openings 113 is, for example, matrix-like.

The mask frame 120 may support the mask body 110 . As described above, although the mask frame 120 includes an opening, in other words, the mask frame 120 may include a frame portion located outside and a bar portion located inside. The bar portion may impart rigidity to the frame portion and prevent the frame portion from being bent. A bar part may be comprised by combining a some member. For example, one member of the bar portion extends from one side of the frame portion toward the opposite side of the frame portion. In addition, it is preferable that the member of the bar part is provided in the longitudinal direction (the short side direction of the deposition mask 10 ) and the horizontal direction (the long side direction of the deposition mask 10 ). That is, it is preferable that the bar part has a well-shaped structure in which a member extending in the longitudinal direction and a member extending in the transverse direction intersect each other. However, the configuration of the bar portion is not limited to this. The member of the bar part may be provided only in the longitudinal direction or the transverse direction. In addition, the width of the frame part and the width of the bar part (or the member of the bar part) can be appropriately determined according to the size of the deposition mask 10 . In addition, in order to make the area|region of a vapor deposition pattern as wide as possible, it is preferable that the width|variety of a bar part is smaller than the width|variety of a frame part.

As shown in FIG. 1B , the connection member 130 is provided in the gap between the mask body 110 and the opening of the mask frame 120 , and is located on the side of the mask body 110 and the side of the opening of the mask frame 120 . touch That is, in a plan view, the mask body 110 and the mask frame 120 do not overlap. In addition, when viewed in a plan view, the mask body 110 and the mask frame 120 may overlap.

Since the connection member 130 only connects the mask body 110 and the mask frame 120 , the connection member 130 does not need to be provided on the entire surface of the side surface of the opening of the mask frame 120 . The connecting member 130 may be provided on at least a part of the side surface of the opening of the mask frame 120 . On the other hand, the thickness of the mask body 110 is very small compared to the thickness of the mask frame. For example, the thickness of the mask body 110 is 1 μm or more and 10 μm or less, and the thickness of the mask frame 120 is 10 μm or more and 2000 μm or less. Therefore, in order to increase the adhesive strength between the mask body 110 and the mask frame 120 , the connecting member 130 is preferably provided on the entire surface of the side surface of the mask body 110 .

Further, the connecting member 130 may be formed in a step shape between the mask body 110 and the mask frame 120 .

Between the connection members 130 , a groove 140 is provided in a region where the mask body 110 is not provided, that is, in a region overlapping the bar portion of the mask frame 120 . In other words, in FIG. 1B, the mask body 110 protrudes below the bottom surface of the mask frame 120, and as a result of the step between the mask frame 120 and the mask body 110, this groove portion ( 140) is formed. The groove portion 140 may be said to have a side surface of the groove portion 140 formed of the connection member 130 , and a bottom surface of the groove portion 140 formed of the mask frame 120 . The end of the side of the groove 140 has a protrusion 141 . The tip of the protrusion 141 is formed toward the bottom of the groove 140 . That is, the protrusion 141 is formed so as not to protrude outward from the surface (the lower surface in FIG. 1B ) of the mask body 110 . In addition, the size of the projection 141 is larger than 0 μm and less than 100 μm.

In the region where the groove portion 140 overlaps with the frame portion of the mask frame 120 , one side of the groove portion 140 is formed of the connecting member 130 , and the other side is released. (140) may be said to be not a home. However, in the formation of the projection 141 , it is the same as the above-described groove portion 140 . Therefore, in the following description, for convenience, the protrusion 141 formed in the region overlapping the frame portion of the mask frame 120 may be described as being formed in the groove portion 140 .

Although a method of forming the protrusion 141 will be described later, the protrusion 141 is formed by knocking down a burr generated by the connection between the mask body 110 and the mask frame 120 . Accordingly, in the deposition mask 10 , no burrs protrude from the deposition target substrate side of the mask body 110 .

According to the deposition mask 10 according to the present embodiment, the mask body 110 and the mask frame 120 are connected via a connecting member 130 . A groove portion 140 is formed between the connection members 130 , and a protrusion 141 is formed at an end of a side surface of the groove portion 140 . In addition, the distal end of the protrusion 141 is formed toward the bottom of the groove 140 , and does not protrude outward from the surface of the mask body 110 . That is, in the deposition mask 10 , the burr does not protrude from the deposition target substrate side of the mask body 110 . Therefore, in vapor deposition using the vapor deposition mask 10, a burr does not damage a vapor-deposited substrate at the time of vapor deposition, and a gap|interval does not arise between the vapor deposition mask 10 and a vapor-deposited substrate. Therefore, in vapor deposition using the vapor deposition mask 10, vapor deposition defect is reduced and the yield of a product improves.

<Second embodiment>

A method of manufacturing the deposition mask 10 according to an embodiment of the present invention will be described with reference to FIGS. 2A to 2G .

2A to 2G are cross-sectional views showing a method of manufacturing the deposition mask 10 according to the embodiment of the present invention.

First, as shown in FIG. 2A , a metal layer 220 is formed on a support substrate 210 , and a photoresist layer 230 having a predetermined pattern is formed on the metal layer 220 .

The supporting substrate 210 is a substrate supporting each layer in the manufacturing process of the deposition mask 10 . Therefore, the support substrate 210 is preferably a rigid substrate. In addition, it is preferable that the deposition mask 10 has a small coefficient of thermal expansion. In the manufacturing process of the vapor deposition mask 10, the support substrate 210 is heated. When the support substrate 210 is expanded or contracted by heat treatment, a position shift of the photoresist layer 230 formed on the support substrate 210 may occur or delamination that becomes a defect accompanying stress during the manufacturing process occurs. do. Therefore, also in order to stabilize the manufacturing process of the vapor deposition mask 10, it is preferable that the support substrate 210 is a rigid substrate with a small thermal expansion coefficient. As a material of the support substrate 210, it is stainless steel (SUS304, SUS430, etc.), 42 alloy, Invar, Super Invar, or stainless Invar, etc., for example.

The metal layer 220 may function as a base metal for an electric pole (or electrolytic plating) to be described later. The material of the metal layer 220 is, for example, nickel (Ni) or a nickel alloy. The metal layer 220 may be formed by sputtering or the like.

The deposition mask 10 may be manufactured using electroless plating instead of electroplating. In this case, an insulating layer may be used instead of the metal layer 220 .

The photoresist layer 230 may function as a model of an electric pole to be described later. The photoresist layer 230 is formed by disposing one or a plurality of photosensitive dry film resists on the metal layer 220 to have a predetermined film thickness, and thermocompression bonding. The photosensitive dry film resist may be either of a positive type or a negative type. In addition, below, a photosensitive dry film demonstrates as a thing of a negative type.

The photoresist layer 230 has a predetermined pattern for forming the deposition pattern of the deposition mask 10 . A predetermined pattern of the photoresist layer 230 may be formed by photolithography. That is, a predetermined pattern can be formed by making a mask adhere|attach dry film resist, exposing a dry film by irradiating an ultraviolet-ray, and dissolving and removing an unexposed part.

Next, as shown in FIG. 2B , the first plating layer 240 is formed using the photoresist layer 230 as a mask. The first plating layer 240 corresponds to the mask body 110 of the deposition mask 10 . The first plating layer 240 may be formed by electroforming. Specifically, the metal layer 220 and the photoresist layer 230 are put into electroforming in which the photoresist layer 230 is dry bathed under predetermined conditions, and from the surface of the metal layer 220 not covered with the photoresist layer 230, the photoresist A metal plating is formed up to the level of layer 230 . The material of the first plating layer 240 is, for example, nickel (Ni) or a nickel (Ni)-cobalt (Co) alloy.

Next, as shown in FIG. 2C, the photoresist layer 230 is peeled off (removed). The photoresist layer 230 may be peeled off with, for example, an amine-based stripper. By peeling the photoresist layer 230 , the first plating layer 240 having a deposition pattern is formed.

In addition, before the photoresist layer 230 is peeled off, the first plating layer 240 formed by the electric pole may be polished. By polishing the first plating layer 240 , the surface of the first plating layer 240 may be planarized.

Next, as shown in FIG. 2D , the mask frame 260 provided with the adhesive layer 250 is disposed on the first plating layer 240 . That is, the first plating layer 240 and the mask frame 260 are adhered with the adhesive layer 250 interposed therebetween. In addition, in the process herein, it is not necessary to completely adhere the first plating layer 240 and the mask frame 260 . Therefore, the adhesive layer 250 does not need to be completely cured.

The mask frame 260 has an opening. The mask frame 260 is bonded so as not to overlap with the opening of the deposition pattern of the first plating layer 240 . In other words, the opening of the mask frame 260 overlaps the opening of the deposition pattern of the first plating layer 240 .

Since the adhesive layer 250 is removed in a subsequent process, it is preferable that it is a material that is easy to remove. As the material of the adhesive layer 250, for example, vinyl acetate resin, ethylene vinyl acetate resin, epoxy resin, cyanoacrylate resin, or acrylic resin can be used. In addition, as a material of the adhesive layer 250, a dry film resist can also be used. When a dry film resist is used as the material of the adhesive layer 250, the dry film resist may be lightly exposed. By exposing dry film resist, it becomes easy to remove dry film resist in a subsequent process.

In addition, in a subsequent process, in order to protect the deposition pattern of the first plating layer 240 (eg, to protect the opening of the deposition pattern from being blocked by particles generated by the process), the first plating layer 240 ), you may provide a dry film resist in the area|region of the vapor deposition pattern.

Next, as shown in FIG. 2E , a film is placed above the mask frame 260 so as to cover the support substrate 210 , the metal layer 220 , the first plating layer 240 , the adhesive layer 250 , and the mask frame 260 . (280) is placed. Then, the air between the support substrate 210 and the film 280 is exhausted (vacuum exhausted), and the pressure on the lower side of the film 280 is lowered. Due to the pressure difference between the upper side and the lower side of the film 280 , the film 280 may be pulled toward the supporting substrate 210 . When the pressure on the lower side of the film 280 is further reduced, the film 280 presses the mask frame 260 . Under pressure from the film 280 , the mask frame 260 is more strongly adhered to the first plating layer 240 via the adhesive layer 250 . This process is a process called so-called vacuum compression.

The vacuum degree on the lower side of the film 280 is -50 kPa or less, preferably -70 kPa or less, and more preferably -90 kPa in the gauge pressure with atmospheric pressure being 0 kPa.

After vacuum compression, the film 280 is removed.

Next, as shown in FIG. 2F, the 2nd plating layer 290 which connects the 1st plating layer 240 and the mask frame 260 is formed. The second plating layer 290 may be formed by an electric pole that conducts electricity to the metal layer 220 or the first plating layer 240 . The second plating layer 290 corresponds to the connection member 130 of the deposition mask 10 . The second plating layer 290 is in contact with the metal layer 220 , the first plating layer 240 , the adhesive layer 250 , and the mask frame 260 . Specifically, the second plating layer 290 is formed to be in contact with a portion of the groove portion of the first plating layer 240 and the side surface of the mask frame 260 (the side surface of the frame portion and the bar portion of the deposition mask 10 ).

The second plating layer 290 may be formed in the same manner as the first plating layer 240 .

The second plating layer 290 is not provided in a region corresponding to the opening region 111 of the first plating layer 240 . On the region corresponding to the opening region 111 of the first plating layer 240 , for example, a dry film resist is formed, and plating is prevented in the region corresponding to the opening region 111 of the first plating layer 240 . can The dry film resist may be peeled off after the formation of the second plating layer 290 .

Next, as shown in FIG. 2G , the mask body 110 , the mask frame 120 , and the connection member 130 are formed by peeling the support substrate 210 , the metal layer 220 , and the adhesive layer 250 . When the adhesive layer 250 is peeled off, a part of the first plating layer 240 that has been bonded to the adhesive layer 250 (the region overlapping the mask frame 260 in the first plating layer 240) is also peeled off, and the groove portion 140 is also peeled off. is formed In addition, the side surface and the bottom surface of the groove portion 140 are each composed of the second plating layer 290 and the mask frame 260 . That is, as shown in FIG. 2G, the mask body 110 is not provided below the mask frame 120, but the groove part 140 is formed. In addition, the support substrate 210, the metal layer 220, and the adhesive layer 250 may peel all the board|substrates and layers at once, and may peel each of the board|substrate and a layer individually.

A burr 142 is formed at the end of the side surface of the groove 140 . The burr 142 is preferably not formed, but when the second plating layer 290 is fused with the first plating layer 240 and the adhesive layer 250 is peeled off, the burr 142 may be generated. Also, when the second plating layer 290 enters the gap between the metal layer 220 and the first plating layer 240 , and the adhesive layer 250 is peeled off, the burrs 142 may be generated. Since the burr 142 is formed when the adhesive layer 250 is peeled off, the burr 142 protrudes toward the deposition target side of the mask body 110 . In addition, the first plating layer 240 and the second plating layer 290 is directed away from the boundary. Hereinafter, the direction in which the burr 142 protrudes toward the vapor-deposited substrate may be described as the first direction.

Next, as shown in FIG. 2H, the rod body 300 is pressed against the burr 142, and the rod body 300 is moved along the edge part of the side surface of the groove part 140 (in the depth direction of FIG. 2H). The burr 142 is knocked down to be received into the groove 140 by the rod body 300 . That is, the burr 142 becomes the protrusion 141 formed toward the bottom of the groove 140 . In other words, it can be said that the burr 142 does not protrude outside the extension line of the surface of the mask body 110 .

According to the manufacturing method as described above, the deposition mask 10 in which the projection 141 is formed in the groove 140 on the deposition target side of the mask body 110 can be manufactured. Referring to FIG. 3 , the formation of the protrusions 141 of the deposition mask 10 will be described in more detail.

3 : is a schematic diagram which shows the manufacturing method of the vapor deposition mask 10 which concerns on one Embodiment of this invention. Specifically, FIG. 3 is a plan view of the mask body 110 of the deposition mask 10 viewed from the vapor deposition target side.

3 , in the groove portion 140 overlapping the mask frame 120 , a burr 142 protrudes from the connection member 130 . In other words, it may be said that the burr 142 is formed at the end of the side surface of the groove 140 . The rod body 300 has a predetermined angle and is pressed to the end of the side surface of the groove 140 . Then, while pressing the rod body 300 to the end of the side of the groove portion 140, it moves along the end of the side of the groove portion (140). The movement of the rod body 300 may be done once or may be plural times. In addition, the rod body 300 may be moved only in one direction, or may be reciprocated along the end of the side surface of the groove portion 140 .

The predetermined angle for pressing the rod body 300 is 0.1° or more and 45° or less with respect to the surface of the mask body 110, preferably 1° or more and 30° or less, and more preferably 5° or more and 20° or less. am. If the predetermined angle is within the above range, the burr 142 may be knocked down into the groove portion 140 .

Since the burr 142 is formed not only in the vertical direction of the deposition mask 10 but also in the horizontal direction, the rod body 300 is moved in the vertical and horizontal directions of the deposition mask 10 , and the burr 142 is formed. ) is knocked down to be accommodated into the groove 140 , to form a protrusion 141 on the inside of the groove 140 . The tip of the protrusion 141 is formed toward the bottom of the groove 140 .

The material of the rod body 300 is preferably a material harder (a material having a higher hardness) than that of the second plating layer 290 (that is, the connection member 130 ). The material of the rod body 300 is, for example, a cemented carbide such as tungsten carbide (WC). An example of the rod body 300 is a cemented carbide spatula.

Pressing and moving of the rod body 300 can be performed by automatic control. Using the sensor, the distance between the rod body 300 and the mask body 110 may be measured, and the position, distance, and angle of the rod body 300 with respect to the mask body 110 may be adjusted. In addition, by using a camera or a sensor, the light reflected from the burr 142 different from the connecting member 130 is imaged or detected, and the rod 300 is inserted into the groove portion 140 so that the reflected light from the burr 142 is changed. It can be moved along the end of the side. That is, it can be determined that the protrusion 141 is formed based on the change in the reflected light from the protrusion 141 .

According to the manufacturing method of the deposition mask 10 according to the present embodiment, the burr 142 is inserted into the groove portion ( 140) fall into acceptance. The burr 142 becomes a protrusion 141 formed toward the bottom of the groove 140 . That is, the burr 142 is not cut and left on the deposition mask 10 as the projection 141 . Since the cut burrs 142 are not scattered as foreign substances and are not carelessly attached to other places of the mask body 110 , the manufacturing yield of the deposition mask 10 is improved. In addition, the distal end of the protrusion 141 is formed toward the bottom of the groove 140 , and does not protrude outward from the surface of the mask body 110 . Therefore, the vapor deposition mask 10 does not scratch a vapor-deposited board|substrate, and it can reduce the vapor deposition defect of a product.

<Modification 1>

With reference to FIG. 4, the modified example of the manufacturing method of the vapor deposition mask 10 which concerns on one Embodiment of this invention is demonstrated. In manufacturing the deposition mask 10 , the rotating body 400 can be used in addition to the rod body 300 .

4 : is a schematic diagram explaining the manufacturing method of the vapor deposition mask 10 which concerns on one Embodiment of this invention. Specifically, FIG. 3 is a plan view of the deposition mask 10 looking at the deposition target substrate side of the mask body 110 .

As shown in FIG. 4 , the rotating body 400 includes a rotating part 410 and a shaft part 420 . The rotating part 410 may rotate with the shaft part 420 as a central axis. The rotating body 400 is pressed against the end of the side of the groove 140 so that the surface of the rotating unit 410 is parallel to the surface of the mask body 110 . Subsequently, the rotating body 400 is moved along the end of the side surface of the groove unit 140 while rotating the rotating unit 410 . The movement of the rotating body 400 may be performed once or plural times. In addition, the rotating body 400 may be moved only in one direction, or may be reciprocated along the end of the side surface of the groove portion 140 .

When the rotating body 400 is moved so that the surface of the rotating unit 410 is parallel to the surface of the mask body 110 , the burr 142 may be overturned and the surface of the connecting member 130 may be planarized. have.

The rotating body 400 may have a predetermined angle and may be moved by pressing it against the end of the side surface of the groove portion 140 . In addition, the rotating body 400 is moved by pressing against the end of the side of the groove 140 so that the surface of the rotating unit 410 is parallel to the surface of the mask body 110 , and then has a predetermined angle. It can also be moved by pressing on the end of the side.

Since the burr 142 is formed not only in the vertical direction of the deposition mask 10 but also in the horizontal direction, the burr 142 is moved by moving the rotating body 400 in the vertical and horizontal directions of the deposition mask 10 . Falls to be accommodated into the groove 140 , and forms a protrusion 141 in the groove 140 . The tip of the protrusion 141 is formed toward the bottom of the groove 140 .

It is preferable that the material of the rotating part 410 of the rotating body 400 is a harder material (material with high hardness) than the material of the 2nd plating layer 290 (that is, the connection member 130). The material of the rotating part 410 is, for example, cemented carbide such as tungsten carbide (WC). An example of the rotating body 400 is a cemented carbide roller.

Pressing and moving of the rotating body 400 can be performed by automatic control. The position alignment of the groove part 140 and the rotating body 400 is performed using a camera. Using the sensor, it is detected that the rotating body 400 is in contact with the burr 142 (or the connecting member 130), and the rotating body 400 is moved to the bur 142 (or connected) until a predetermined pressure is reached. member 130). If necessary, the angle of the rotating body 400 is adjusted. In addition, using a camera or a sensor, the rotating body 400 is moved to the groove portion 140 so that the reflected light from the bur 142 different from the connecting member 130 is imaged or detected, and the reflected light from the bur 142 is changed. It can be moved along the end of the side. That is, it can be determined that the protrusion 141 is formed based on the change in the reflected light from the protrusion 141 .

Also in the manufacturing method of the deposition mask 10 using the rotating body 400 according to the present modification, the protrusions 141 can be formed in the groove 140 . In addition, the tip of the protrusion 141 may face the bottom of the groove 140 , and the protrusion 141 does not protrude outward from the surface of the mask body 110 . Therefore, the vapor deposition mask 10 does not scratch a vapor-deposited board|substrate, and it can reduce the vapor deposition defect of a product. In addition, since the surface of the connection member 130 may be planarized by the rotating body 400 , the deposition defect of the product may be further reduced.

<Modification 2>

A further modified example of the manufacturing method of the vapor deposition mask 10 which concerns on one Embodiment of this invention is demonstrated with reference to FIG.5A and FIG.5B. In the method of manufacturing the deposition mask 10 , in addition to the rod body 300 and the rotating body 400 , the pressing body 500 can be used.

Each of FIG. 5A and FIG. 5B is sectional drawing explaining the manufacturing method of the vapor deposition mask 10 which concerns on one Embodiment of this invention. Specifically, Fig. 5A is a cross-sectional view of the deposition mask 10 and the pressing body 500 before the pressing body 500 is pressed, and Fig. 5B is the deposition mask 10 and the pressing body 500 after the pressing body 500 is pressed. 500) is a cross section.

As shown in FIG. 5A , the pressing body 500 includes a convex portion 510 . The convex portions 510 of the pressing body 500 are provided so as to correspond to the pattern of the groove portions 140 . As for the convex part 510, the side surface of the convex part 510 may have an inclined surface so that a part of convex part 510 may fit in the groove part 140. As shown in FIG. In this case, since the burr 142 is knocked down according to the inclination of the side surface of the convex part 510 , the tip of the protrusion 141 formed in the groove part 140 faces the bottom surface of the groove part 140 . The cross-sectional shape of the convex portion 510 has, for example, a trapezoidal shape or a horseshoe shape. The convex part 510 shown in FIG. 5A is an example of a trapezoid, and the width of the upper bottom of the convex part 510 is larger than the width of the groove part 140, and the width of the lower bottom of the convex part 510 is the groove part 140. smaller than the width of

As shown in FIG. 5B , the pressing body 500 is pressed against the end of the side surface of the groove portion 140 so that the surface of the pressing body 500 is parallel to the surface of the mask body 110 . Then, a predetermined pressure is applied to the pressing body 500 . Since the width of the bottom of the convex part 510 is smaller than the width of the groove part 140 , a part of the convex part 510 enters the groove part 140 . As a result, the convex portion 510 presses the burr 142 from above, and the protrusion 141 is formed in the groove portion 140 . In addition, since the width of the upper bottom of the convex part 510 is larger than the width of the groove part 140 , the convex part 510 also stops before the bottom of the convex part 510 hits the bottom of the groove part 140 , that is, the mask frame 120 . can

It is preferable that the material of at least the convex part 510 of the pressing body 500 is a harder material (material with high hardness) than the material of the 2nd plating layer 290 (that is, the connection member 130). The material of the convex portion 510 is, for example, a cemented carbide such as tungsten carbide (WC). An example of the pressing body 500 is a cemented carbide die.

The size of the pressing body 500 may not be the same as the size of the deposition mask 10 . A pressing body 500 provided with a convex portion 510 corresponding to a pattern of a portion of the groove portion 140 (eg, one elongated convex portion 510 corresponding to one elongated groove portion 140 is provided. The pressing body 500 may be used. In this case, by repeating pressing by the pressing body 500 while changing the position of the groove portion 140 , the burr 142 can be overturned and the protrusion 141 can be formed.

Pressing and moving of the pressing body 500 can be performed by automatic control. The position alignment of the groove part 140 and the pressing body 500 is performed using a camera. Then, using a sensor, it is detected that the pressing body 500 has come into contact with the burr 142 (or the connecting member 130), and the pressing body 500 is moved to the burr 142 until a predetermined pressure is reached. (or the connecting member 130). In addition, using a camera or a sensor, image or detect the reflected light from the bur 142 different from the connecting member 130, and the pressing body 500 is inserted into the groove 140 so that the reflected light from the bur 142 is sufficiently changed. can be moved along the end of the side of the That is, it can be determined that the protrusion 141 is formed based on the change in the reflected light from the protrusion 141 .

Also in the method of manufacturing a deposition mask using the pressing body 500 according to the present modification, the projections 141 can be formed in the grooves 140 . In addition, the front end of the protrusion 141 may face the bottom of the groove 140 , and the protrusion 141 does not protrude outward from the surface of the mask body 110 . Therefore, the vapor deposition mask 10 does not scratch a vapor-deposited board|substrate, and it can reduce the vapor deposition defect of a product. In addition, since the surface of the connection member 130 can be planarized by the pressing body 500 , it is possible to further reduce product deposition defects.

Each of the above-described embodiments as an embodiment of the present invention can be implemented in combination as appropriate, as long as they do not contradict each other. In addition, based on each embodiment, those skilled in the art to add, delete, or change the design as appropriate, or to add, omit, or change the conditions of the process as long as the gist of the present invention is provided. fall within the scope of the invention.

Even if it is an effect which is different from the effect which is brought about by the aspect of each embodiment mentioned above, about what is clear from the description of this specification, or what can be easily predicted by a person skilled in the art, it is naturally interpreted as being brought about by this invention. do.

10: deposition mask, 20: manufacturing apparatus, 110: mask body, 111: opening region, 112: non-opening region, 113: opening, 120: mask frame, 130: connection member, 210: support substrate, 220: metal layer, 230 : photoresist layer, 240: first plating layer, 250: adhesive layer, 260: mask frame, 260: mask frame, 280: film, 290: second plating layer, 300: rod, 400: rotating body, 410: rotating part, 420 : shaft part, 500: press body, 510: convex part

Claims (8)

a mask frame having a void surrounded by a frame portion or a bar portion, a first plating layer provided in a region overlapping the void and the void in plan view and not overlapping with the frame portion or the bar portion in plan view, the mask frame; A method for manufacturing a deposition mask having a second plating layer bonding the first plating layer, wherein the first plating layer is provided to protrude from the mask frame in a first direction,
and dropping a protrusion protruding from the second plating layer in the first direction at a boundary between the second plating layer and the first plating layer. The method according to claim 1, wherein the step of overturning the projection includes pressing the rod against the projection,
The material of the rod body is a material having a hardness higher than that of the second plating layer. The method according to claim 1, wherein the step of knocking down the projection includes pressing a rotating body against the projection,
A material for a portion of the rotating body in contact with the projection is a material having a hardness higher than that of the second plating layer. The process according to claim 1, wherein the step of overturning the projection includes pressing a pressing body including a convex portion having an inclined surface against the projection,
The material of the said convex part is a material higher in hardness than the said 2nd plating layer, The manufacturing method of the vapor deposition mask. The method of claim 1 , wherein the tip of the protrusion faces a direction spaced apart from a boundary between the first plating layer and the second plating layer. The method for manufacturing a deposition mask according to claim 1, wherein the projections protrude in the first direction from the surface of the first plating layer and an extension line of the surface. The method for manufacturing a deposition mask according to any one of claims 1 to 6, wherein it is determined that the projection is formed based on a change in light reflected from the projection. a mask frame having an air gap surrounded by a frame portion or a bar portion;
a first plating layer provided in a region that overlaps with the gap in plan view and does not overlap with the frame portion or the bar portion in plan view;
a second plating layer bonding the mask frame and the first plating layer;
The first plating layer is provided to protrude from the mask frame in a first direction,
In the boundary between the second plating layer and the first plating layer, a protrusion is provided at an end of the second plating layer,
The distal end of the projection faces in a direction away from the boundary between the second plating layer and the first plating layer, and does not protrude outside the surface of the first plating layer and the extension line of the surface.

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