CN113388805B - Vapor deposition mask and method for manufacturing vapor deposition mask - Google Patents

Abstract

The invention provides a method for manufacturing a vapor deposition mask and a vapor deposition mask capable of reducing vapor deposition defects. The vapor deposition mask manufacturing method of the present invention includes: a mask frame having a space surrounded by a frame portion or a barrier portion; a first plating layer formed in a region overlapping the gap in a plan view and not overlapping the frame or the barrier in a plan view; and a second plating layer that joins the mask frame and the first plating layer, the first plating layer being formed so as to protrude from the mask frame in a first direction, the vapor deposition mask manufacturing method comprising: and a step of pushing down a protrusion protruding from the second plating layer in the first direction at the boundary between the second plating layer and the first plating layer.

Description

Vapor deposition mask and method for manufacturing vapor deposition mask

Technical Field

The present invention relates to vapor deposition masks. The present invention also relates to a method for manufacturing the vapor deposition mask. The present invention particularly relates to a method for manufacturing a vapor deposition mask having a mask body in the form of a thin film on a mask frame.

Background

Examples of the flat panel display device include a liquid crystal display device and an organic EL (Electroluminescence) display device. These display devices are structures in which thin films containing various materials such as an insulator, a semiconductor, and a conductor are laminated on a substrate. By patterning and connecting these films appropriately, a function as a display device can be realized.

Methods for forming thin films can be broadly classified into gas phase methods, liquid phase methods, and solid phase methods. The gas phase method can be classified into a physical gas phase method and a chemical gas phase method. As a representative example of the physical vapor phase method, a vapor deposition method is known. The simplest of the vapor deposition methods is a vacuum vapor deposition method. The vacuum deposition method is a method in which a material is heated under high vacuum to sublimate or evaporate the material, thereby generating vapor of the material (hereinafter, these will be collectively referred to as vaporization). In a region for depositing the material (hereinafter referred to as a vapor deposition region), the vaporized material is solidified and deposited, thereby obtaining a thin film of the material. In order to selectively form a thin film in a vapor deposition region without depositing a material in a region other than the vapor deposition region (hereinafter, referred to as a non-vapor deposition region), vacuum vapor deposition is performed using a mask (vapor deposition mask) (see patent documents 1 and 2).

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2009-87840

Patent document 2: japanese patent application laid-open No. 2013-209710

Disclosure of Invention

Technical problem to be solved by the invention

In the vapor deposition mask, a mask frame for fixing the mask body is bonded to the mask body on which the vapor deposition pattern is formed. In the step of joining the mask body and the mask frame, burrs (protrusions extending from the ends) are generated on the vapor deposition substrate side of the mask body. If burrs are present, the burrs may damage the substrate to be vapor deposited during vapor deposition. Further, a gap is generated between the vapor deposition mask and the substrate to be vapor deposited, and the vapor deposition pattern becomes blurred. These phenomena were judged to be vapor deposition failure. Therefore, when burrs are present on the mask body, the yield of the product including the substrate to be vapor deposited is lowered. Therefore, conventionally, burrs of the mask body are cut by a cutter or the like, and the burrs are removed from the mask body.

However, in the case of cutting burrs, it is necessary to confirm the positions of the burrs by a microscope and to perform the cutting by a manual operation of an operator. Such an operation depends greatly on the proficiency of the operator, and the operation time varies depending on the operator, and is long. Further, there is a problem that the cut burrs adhere to the mask body as foreign matters.

The present invention has been made in view of the above-described problems, and one of the problems to be solved is to provide a method for manufacturing a vapor deposition mask capable of reducing vapor deposition defects.

Means for solving the technical problems

An embodiment of the present invention provides a method for manufacturing a vapor deposition mask, the vapor deposition mask including: a mask frame having a space surrounded by a frame portion or a barrier portion; a first plating layer formed in a region overlapping the gap in a plan view and not overlapping the frame or the barrier in a plan view; and a second plating layer that joins the mask frame and the first plating layer, the first plating layer being formed so as to protrude from the mask frame in a first direction, the vapor deposition mask manufacturing method comprising: and a step of pushing down a protrusion protruding from the second plating layer in the first direction at the boundary between the second plating layer and the first plating layer.

Drawings

Fig. 1A is a plan view of a vapor deposition mask according to an embodiment of the present invention.

Fig. 1B is a cross-sectional view of a vapor deposition mask according to an embodiment of the present invention.

Fig. 2A is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2B is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2C is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2D is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2E is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2F is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2G is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 2H is a cross-sectional view showing a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 3 is a schematic diagram illustrating a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 4 is a schematic diagram illustrating a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 5A is a schematic diagram illustrating a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Fig. 5B is a schematic diagram illustrating a method for manufacturing a vapor deposition mask according to an embodiment of the present invention.

Description of the reference numerals

10: Vapor deposition mask, 20: manufacturing apparatus, 110: mask body, 111: open area, 112: non-open areas, 113: opening, 120: mask frame, 130: connection part, 210: support substrate, 220: metal layer, 230: photoresist layer, 240: first plating layer, 250: adhesive layer, 260: mask frame, 260: mask frame, 280: film, 290: second plating layer, 300: rod body, 400: rotating body, 410: rotation part, 420: shaft portion, 500: pressing body, 510: a convex part.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. However, the present invention may be implemented in various forms within a scope not departing from the gist thereof, and is not to be construed as limited to the description of the embodiments illustrated below.

For the sake of clarity of the description, the drawings may schematically show the width, thickness, shape, and the like of each portion, as compared with the actual embodiment. The examples shown in the drawings are merely examples and are not intended to limit the invention. In the present specification and the drawings, the same components as those described above with respect to the drawings already appearing are denoted by the same reference numerals, and detailed description thereof is omitted as appropriate.

In the present invention, when a plurality of films are formed by etching or light irradiation of one film, the plurality of films may have different functions or roles. However, these films are derived from films formed as the same layer in the same step, have the same layer structure, and have the same material. Thus, it is defined that these multiple films are present in the same layer.

In the present specification and claims, when a mode in which another structure is arranged on a certain structure is expressed, the following two cases are defined as included unless otherwise specified in the description of "on … …: a case where another structure is disposed directly above the structure so as to be in contact with the structure; and a case where another structure is disposed above a certain structure with another structure interposed therebetween.

< First embodiment >, first embodiment

Referring to fig. 1A and 1B, the structure of a vapor deposition mask 10 according to an embodiment of the present invention will be described.

Fig. 1A is a plan view of a vapor deposition mask 10 according to an embodiment of the present invention. Fig. 1B is a cross-sectional view of a vapor deposition mask 10 according to an embodiment of the present invention. Specifically, fig. 1B is a cross-sectional view of the vapor deposition mask 10 cut along the line A-A' shown in fig. 1.

The vapor deposition mask 10 includes a mask body 110, a mask frame 120, and a connection member 130. The mask body 110 is connected to the mask frame 120 via a connection member 130.

The mask frame 120 has an opening, and the mask body 110 is provided so as to overlap the opening of the mask frame 120. In fig. 1A, the mask frame 120 has 12 openings, and the mask body 110 is provided so as to overlap each opening. The number of openings provided in the mask frame 120 is not limited thereto. The number of openings provided in the mask frame 120 may be appropriately determined according to the size of the substrate to be vapor-deposited and the vapor deposition pattern.

The mask body 110 is provided with a plurality of openings 113 penetrating the mask body 110. Hereinafter, for convenience of explanation, the region in which the opening 113 is provided in the mask body 110 will be referred to as an opening region 111, and the region in which the opening 113 is not provided in the mask body 110 will be referred to as a non-opening region 112. The boundary between the open region 111 and the non-open region 112 is not necessarily clear, but can be distinguished at least by the fact that the non-open region 112 is not provided with the opening 113.

In the vapor deposition, the vapor deposition mask 10 and the target substrate are aligned (aligned) so that the vapor deposition region of the target substrate to be vapor deposited overlaps the opening region 111 and the non-vapor deposition region and the non-opening region 112 on the target substrate to be vapor deposited overlap. Vapor of the vapor deposition material passes through the openings 113 of the opening region 111, and the vapor deposition material is deposited in the vapor deposition region of the substrate to be vapor deposited.

When the substrate to be vapor deposited is a substrate of a display device, the openings 113 of the opening region 111 may be arranged in correspondence with the arrangement of pixels of the display device. The openings 113 are arranged in a matrix, for example.

The mask frame 120 can support the mask body 110. As described above, the mask frame 120 includes the opening portion, but in other words, the mask frame 120 may be said to include the frame portion located on the outside and the barrier portion located on the inside. The spacer portion can provide rigidity to the frame portion and prevent the frame portion from warping. The barrier portion may be formed by combining a plurality of members. For example, 1 part of the barrier portion extends from one side of the frame portion to the opposite side. The members of the barrier portion are preferably provided in the longitudinal direction (short side direction of the vapor deposition mask 10) and the transverse direction (long side direction of the vapor deposition mask 10). That is, it is preferable that the barrier portion has a cross-shaped structure in which a member extending in the longitudinal direction and a member extending in the transverse direction intersect. However, the structure of the barrier portion is not limited thereto. The components of the barrier may be arranged only longitudinally or transversely. The width of the frame portion and the width of the barrier portion (or the member of the barrier portion) may be appropriately determined according to the size of the vapor deposition mask 10. In order to expand the region of the vapor deposition pattern as much as possible, the width of the barrier portion is preferably smaller than the width of the frame portion.

As shown in fig. 1B, the connection member 130 is provided in a gap between the mask body 110 and the opening of the mask frame 120, and contacts the side surface of the mask body 110 and the side surface of the opening of the mask frame 120. That is, the mask body 110 and the mask frame 120 do not overlap in a plan view. In addition, the mask body 110 and the mask frame 120 may overlap in a plan view.

The connection member 130 may connect the mask body 110 and the mask frame 120, and therefore, the connection member 130 may not be provided on the entire side surface of the opening of the mask frame 120. The connection member 130 may be provided on at least a part of the side surface of the opening of the mask frame 120. On the other hand, the thickness of the mask body 110 is very small compared to the thickness of the mask frame 120. For example, the mask body 110 has a thickness of 1 μm or more and 10 μm or less, and the mask frame 120 has a thickness of 10 μm or more and 2000 μm or less. Therefore, in order to increase the adhesive strength between the mask body 110 and the mask frame 120, the connecting member 130 is preferably provided on the entire side surface of the mask body 110.

In addition, the connection part 130 may be formed in a step shape between the mask body 110 and the mask frame 120.

Between the connection members 130, grooves 140 are provided in regions where the mask body 110 is not provided, that is, regions overlapping with the barrier portions of the mask frame 120. In other words, in fig. 1B, the mask body 110 protrudes downward from the bottom surface of the mask frame 120, and the groove 140 is formed as a result of the step between the mask frame 120 and the mask body 110. In the groove 140, the side surface of the groove 140 may be formed by the connection member 130, and the bottom surface of the groove 140 may be formed by the mask frame 120. The side end of the groove 140 has a protrusion 141. The front end of the protrusion 141 is formed toward the bottom surface of the groove 140. That is, the protrusion 141 is formed so as not to protrude outward from the surface (lower surface in fig. 1B) of the mask body 110. The size of the protrusion 141 is greater than 0 μm and less than 100 μm.

In the region where the groove 140 overlaps the frame portion of the mask frame 120, one side surface of the groove 140 is formed by the connection member 130, and the other side surface is open (open), and if the structure is strictly divided, the groove 140 may be said to be not a groove. However, the formation of the protrusions 141 is similar to the groove 140 described above. Therefore, in the following, for convenience of explanation, the projection 141 formed in the region overlapping with the frame portion of the mask frame 120 may be referred to as a groove 140.

The protrusions 141 may be formed by pushing down burrs generated by connection of the mask body 110 and the mask frame 120, and a method of forming the protrusions 141 will be described later. Therefore, in the vapor deposition mask 10, the burrs do not protrude toward the substrate to be vapor deposited of the mask body 110.

According to the vapor deposition mask 10 of the present embodiment, the mask body 110 and the mask frame 120 are connected via the connecting member 130. A groove 140 is formed between the connection members 130, and a protrusion 141 is formed at an end of a side surface of the groove 140. The front ends of the protrusions 141 are formed to face the bottom surface of the groove 140, and do not protrude outward from the surface of the mask body 110. That is, in the vapor deposition mask 10, burrs do not protrude toward the substrate to be vapor deposited of the mask body 110. Therefore, in vapor deposition using the vapor deposition mask 10, burrs do not damage the substrate to be vapor deposited during vapor deposition, and a gap does not occur between the vapor deposition mask 10 and the substrate to be vapor deposited. Therefore, in vapor deposition using the vapor deposition mask 10, vapor deposition defects are reduced, and the yield of products is improved.

< Second embodiment >

A method for manufacturing the vapor deposition mask 10 according to an embodiment of the present invention will be described with reference to fig. 2A to 2G.

Fig. 2A to 2G are cross-sectional views showing a method for manufacturing the vapor deposition mask 10 according to an embodiment of the present invention.

First, as shown in fig. 2A, a metal layer 220 is formed on a support substrate 210, and a photoresist layer 230 having a predetermined pattern is formed on the metal layer 220.

The support substrate 210 is a substrate for supporting each layer in the process of manufacturing the vapor deposition mask 10. Therefore, the support substrate 210 is preferably a rigid substrate. In addition, the vapor deposition mask 10 preferably has a small thermal expansion coefficient. In the process of manufacturing the vapor deposition mask 10, the support substrate 210 is heated. When the support substrate 210 expands or contracts due to the heat treatment, a positional shift of the photoresist layer 230 formed on the support substrate 210 occurs, or a peeling-off, which is a defect due to stress in the manufacturing process, occurs. Therefore, in order to stabilize the manufacturing process of the vapor deposition mask 10, the support substrate 210 is preferably a rigid substrate having a small thermal expansion coefficient. The material of the support substrate 210 is, for example, stainless steel (SUS 304, SUS430, or the like), 42 alloy, invar, super invar, stainless invar, or the like.

The metal layer 220 can function as a base metal for electroforming (or electrolytic plating) described later. The material of the metal layer 220 is, for example, nickel (Ni) or a nickel alloy. The metal layer 220 may be formed by sputtering or the like.

The vapor deposition mask 10 may be manufactured using an electroless plating layer instead of electroforming. In this case, an insulating layer may be used instead of the metal layer 220.

The photoresist layer 230 can function as an electroformed master mold described later. The photoresist layer 230 may be formed by disposing 1 or more photosensitive dry film resists on the metal layer 220 to have a predetermined film thickness and performing thermocompression bonding. The photosensitive dry film resist may be either positive or negative. Next, explanation will be given assuming that the photosensitive dry film resist is negative type.

The photoresist layer 230 has a predetermined pattern for forming a vapor deposition pattern of the vapor deposition mask 10. The predetermined pattern of the photoresist layer 230 may be formed by photolithography. That is, the predetermined pattern can be formed by adhering (sticking) the mask to the dry film resist, irradiating ultraviolet rays to expose the dry film, and dissolving and removing the unexposed portion.

Next, as shown in fig. 2B, a first plating layer 240 is formed using the photoresist layer 230 as a mask. The first plating layer 240 corresponds to the mask body 110 of the vapor deposition mask 10. The first plating layer 240 may be formed by electroforming. Specifically, the metal layer 220 and the photoresist layer 230 are placed in an electroforming tank formed under predetermined conditions, and a metal plating layer is formed from the surface of the metal layer 220 not covered by the photoresist layer 230 to the height of the photoresist layer 230. The material of the first plating layer 240 is, for example, nickel (Ni) or a nickel (Ni) -cobalt (Co) alloy.

Next, as shown in fig. 2C, the photoresist layer 230 is stripped (removed). The photoresist layer 230 can be stripped, for example, using an amine-based stripping solution. By peeling the photoresist layer 230, a first plating layer 240 having an evaporation pattern is formed.

In addition, the first plating layer 240 formed by electroforming may be polished before stripping the photoresist layer 230. By polishing the first plating layer 240, the surface of the first plating layer 240 can be planarized.

Next, as shown in fig. 2D, a mask frame 260 having an adhesive layer 250 formed thereon is disposed on the first plating layer 240. That is, the first plating layer 240 and the mask frame 260 are bonded via the adhesive layer 250. In this step, the first plating layer 240 and the mask frame 260 do not need to be completely bonded. Therefore, the adhesive layer 250 may not be completely cured.

The mask frame 260 has an opening. The mask frame 260 is aligned and bonded so as not to overlap with the openings of the vapor deposition pattern of the first plating layer 240. In other words, the openings of the mask frame 260 overlap with the openings of the evaporation pattern of the first plating layer 240.

The adhesive layer 250 is removed in a subsequent step, and thus, a material that is easy to remove is preferable. As a material of the adhesive layer 250, for example, a vinyl acetate resin, an ethylene-vinyl acetate resin, an epoxy resin, a cyanoacrylate resin, an acrylic resin, or the like can be used. As a material of the adhesive layer 250, a dry film resist may be used. In the case of using a dry film resist as a material of the adhesive layer 250, the dry film resist may be lightly exposed in advance. The dry film resist is easily removed in a subsequent step by exposing the dry film resist in advance.

In the subsequent step, a dry film resist may be provided in the region of the vapor deposition pattern of the first plating layer 240 in order to protect the vapor deposition pattern of the first plating layer 240 (for example, to protect the openings of the vapor deposition pattern from clogging by particles generated in the step).

Next, as shown in fig. 2E, a thin film 280 is disposed above the mask frame 260 so as to cover the support substrate 210, the metal layer 220, the first plating layer 240, the adhesive layer 250, and the mask frame 260. Next, the air between the support substrate 210 and the thin film 280 is exhausted (vacuum-exhausted), and the pressure on the lower side of the thin film 280 is reduced. The membrane 280 is adsorbed on the support substrate 210 side by a pressure difference between the upper side and the lower side of the membrane 280. If the pressure of the lower side of the membrane 280 is further reduced, the membrane 280 presses the mask frame 260. The mask frame 260 is pressed from the film 280, and is strongly adhered to the first plating layer 240 via the adhesive layer 250. This step is called vacuum pressure bonding.

The vacuum degree of the lower side of the film 280 is-50 kPa or less, preferably-70 kPa or less, and more preferably-90 kPa or less, in the gauge pressure where the atmospheric pressure is 0 kPa.

After vacuum crimping, the film 280 is removed.

Next, as shown in fig. 2F, a second plating layer 290 connecting the first plating layer 240 and the mask frame 260 is formed. The second plating layer 290 may be formed by electroforming to energize the metal layer 220 or the first plating layer 240. The second plating layer 290 corresponds to the connection part 130 of the vapor deposition mask 10. The second plating layer 290 is connected to the metal layer 220, the first plating layer 240, the adhesive layer 250, and the mask frame 260. Specifically, the second plating layer 290 is formed so as to contact a part of the groove portion of the first plating layer 240 and the side surface of the mask frame 260 (the side surface of the frame portion and the barrier portion of the vapor deposition mask 10).

The second plating layer 290 may be formed using the same method as the first plating layer 240.

The second plating layer 290 is not provided in the region of the first plating layer 240 corresponding to the opening region 111. For example, a dry film resist is formed on the region of the first plating layer 240 corresponding to the opening region 111, whereby plating can be prevented from being performed on the region of the first plating layer 240 corresponding to the opening region 111. The dry film resist may be stripped after the second plating 290 is formed.

Next, as shown in fig. 2G, the support substrate 210, the metal layer 220, and the adhesive layer 250 are peeled off to form the mask body 110, the mask frame 120, and the connection member 130. By peeling the adhesive layer 250, a part of the first plating layer 240 adhered to the adhesive layer 250 (a region overlapping the mask frame 260 in the first plating layer 240) is also peeled off, thereby forming the groove 140. The side surfaces and the bottom surface of the groove 140 are respectively formed of the second plating layer 290 and the mask frame 260. That is, as shown in fig. 2G, the mask body 110 is not formed under the mask frame 120, and the groove 140 is formed. The support substrate 210, the metal layer 220, and the adhesive layer 250 may be peeled off all the substrates and layers at once, or may be peeled off each of the substrates and layers.

Burrs 142 are formed at the ends of the side surfaces of the groove 140. It is preferable that the burr 142 is not formed, but when the second plating layer 290 is welded to the first plating layer 240 and the adhesive layer 250 is peeled off, the burr 142 may be generated. In addition, burrs 142 may be generated when the second plating layer 290 enters the gap between the metal layer 220 and the first plating layer 240 and the adhesive layer 250 is peeled off. Since the burr 142 is formed when the adhesive layer 250 is peeled off, the burr 142 protrudes toward the substrate to be vapor-deposited of the mask body 110. And, toward a direction away from the boundary of the first plating layer 240 and the second plating layer 290. Hereinafter, a direction in which the burr 142 protrudes toward the deposition target substrate is sometimes referred to as a first direction.

Next, as shown in fig. 2H, the rod 300 is abutted against the burr 142, and the rod 300 is moved along the end portion (in the depth direction of fig. 2H) of the side surface of the groove 140. The burr 142 is pushed down by the rod 300 so as to be received in the groove 140. That is, the burr 142 is a protrusion 141 formed so as to go toward the bottom surface of the groove 140. In other words, it can be said that the burr 142 does not protrude outward from the extension line of the surface of the mask body 110.

By the above-described manufacturing method, the vapor deposition mask 10 in which the protrusions 141 are formed in the groove 140 of the mask body 110 on the substrate side to be vapor deposited can be manufactured. The formation of the protrusions 141 of the vapor deposition mask 10 will be described in more detail with reference to fig. 3.

Fig. 3 is a schematic diagram showing a method for manufacturing the vapor deposition mask 10 according to an embodiment of the present invention. Specifically, fig. 3 is a plan view of the vapor deposition mask 10 from the vapor deposition substrate side of the mask body 110.

As shown in fig. 3, burrs 142 protrude from the connection member 130 at the groove 140 overlapping the mask frame 120. In other words, it can be said that the burrs 142 are formed at the end portions of the side surfaces of the groove 140. The rod 300 abuts against the end of the side surface of the groove 140 at a predetermined angle. Next, the rod 300 is moved along the end of the side surface of the groove 140 while being abutted against the end of the side surface of the groove 140. The movement of the stick 300 may be 1 time or a plurality of times. The rod 300 may be moved only in one direction, or the rod 300 may be reciprocated along the end of the side surface of the groove 140.

The predetermined angle of abutment against the bar 300 is 0.1 ° or more and 45 ° or less, preferably 1 ° or more and 30 ° or less, and more preferably 5 ° or more and 20 ° or less, with respect to the surface of the mask body 110. When the predetermined angle is within the above range, the burr 142 can be pushed down into the groove 140.

Since the burrs 142 are formed not only in the longitudinal direction of the vapor deposition mask 10 but also in the lateral direction of the vapor deposition mask 10, the rod 300 is moved in the longitudinal and lateral directions of the vapor deposition mask 10, and the burrs 142 are pushed down so as to be received in the groove 140, thereby forming the protrusions 141 in the groove 140. The front end of the protrusion 141 is formed toward the bottom surface of the groove 140.

The material of the rod 300 is preferably a material harder than the material of the second plating 290 (i.e., the connection member 130) (a material having a higher hardness than the material of the second plating 290 (i.e., the connection member 130)). The material of the rod 300 is, for example, cemented carbide such as tungsten carbide (WC). As an example of the rod 300, a superhard scraper is illustrated.

The abutment and movement of the wand 300 may be performed by automatic control. The distance of the stick 300 from the mask body 110 may be measured using a sensor, and the position, distance, and angle of the stick 300 with respect to the mask body 110 may be adjusted. In addition, a camera or a sensor may be used to capture or detect reflected light from the burr 142 different from the connection member 130 and move the rod 300 along the end of the side surface of the groove 140 so that the reflected light from the burr 142 varies. That is, it can be determined that the protrusion 141 is formed based on the change in reflected light from the protrusion 141.

According to the method of manufacturing the vapor deposition mask 10 of the present embodiment, the burrs 142 generated by the peeling of the adhesive layer 250 are not cut, but the burrs 142 are pushed down so as to be accommodated in the groove 140 by using the rod 300. The burr 142 is a protrusion 141 formed so as to be removed from the bottom surface of the groove 140. That is, the burr 142 is left as the protrusion 141 on the vapor deposition mask 10 without cutting the burr 142. The burrs 142 cut off do not scatter as foreign matter and adhere to other portions of the mask body 110 unintentionally, and therefore, the manufacturing yield of the vapor deposition mask 10 is improved. The front ends of the protrusions 141 are formed to face the bottom surface of the groove 140, and do not protrude outward from the surface of the mask body 110. Therefore, the vapor deposition mask 10 does not damage the vapor deposition target substrate, and vapor deposition failure of the product can be reduced.

Modification 1 >

A modified example of the method for manufacturing the vapor deposition mask 10 according to an embodiment of the present invention will be described with reference to fig. 4. In the manufacture of the vapor deposition mask 10, the rotary body 400 may be used in addition to the rod 300.

Fig. 4 is a schematic diagram illustrating a method for manufacturing the vapor deposition mask 10 according to an embodiment of the present invention. Specifically, fig. 4 is a plan view of the vapor deposition mask 10 from the vapor deposition substrate side of the mask body 110.

As shown in fig. 4, the rotary body 400 includes a rotary portion 410 and a shaft portion 420. The rotation section 410 is rotatable about the shaft section 420. The rotator 400 is abutted against the end of the side surface of the groove 140 in such a manner that the surface of the rotation part 410 is parallel to the surface of the mask body 110. Next, the rotating body 400 is moved along the end of the side surface of the groove 140 while rotating the rotating portion 410. The movement of the rotary body 400 may be 1 time or a plurality of times. The rotator 400 may be moved only in one direction, or the rotator 400 may be reciprocated along the end of the side surface of the groove 140.

When the rotary body 400 is moved so that the surface of the rotary portion 410 is parallel to the surface of the mask body 110, the burrs 142 can be pushed down, and the surface of the connection member 130 can be planarized.

The rotator 400 may be moved by being abutted against the end of the side surface of the groove 140 at a predetermined angle. In addition, after the rotary body 400 is moved while being abutted against the end of the side surface of the groove 140 so that the surface of the rotary portion 410 is parallel to the surface of the mask body 110, the rotary body 400 may be moved while being abutted against the end of the side surface of the groove 140 at a predetermined angle.

Since the burrs 142 are formed not only in the longitudinal direction of the vapor deposition mask 10 but also in the lateral direction of the vapor deposition mask 10, the rotator 400 is moved in the longitudinal and lateral directions of the vapor deposition mask 10, and the burrs 142 are pushed down so as to be received in the groove 140, thereby forming the protrusions 141 in the groove 140. The front end of the protrusion 141 is formed toward the bottom surface of the groove 140.

The material of the rotation part 410 of the rotation body 400 is preferably a material harder than the material of the second plating layer 290 (i.e., the connection member 130) (a material having a higher hardness than the material of the second plating layer 290 (i.e., the connection member 130)). The material of the rotary part 410 is, for example, cemented carbide such as tungsten carbide (WC). As an example of the rotary body 400, a super hard roller is given.

The abutment and movement of the rotary body 400 may be performed by automatic control. The alignment of the groove 140 and the rotator 400 may be performed using a camera. A sensor is used to detect that the rotary body 400 is in contact with the burr 142 (or the connection member 130) and to press the rotary body 400 against the burr 142 (or the connection member 130) until a prescribed pressure is reached. The angle of the rotary body 400 may be adjusted as needed. In addition, a camera or a sensor may be used to capture or detect reflected light from the burr 142 different from the connection member 130 and move the rotary body 400 along the end of the side surface of the groove 140 so that the reflected light from the burr 142 varies. That is, it can be determined that the protrusion 141 is formed based on the change in reflected light from the protrusion 141.

In the method for manufacturing vapor deposition mask 10 using rotary body 400 according to this modification, protrusions 141 can be formed in groove 140. Further, the tip of the protrusion 141 may be directed to the bottom surface of the groove 140, and the protrusion 141 may not protrude outward from the surface of the mask body 110. Therefore, the vapor deposition mask 10 does not damage the vapor deposition target substrate, and vapor deposition failure of the product can be reduced. Further, the surface of the connection member 130 can be planarized by the rotary body 400, so that vapor deposition failure of the product can be further reduced.

Modification 2 >

A further modification of the method for manufacturing the vapor deposition mask 10 according to the embodiment of the present invention will be described with reference to fig. 5A and 5B. In the method for manufacturing vapor deposition mask 10, pressing member 500 may be used in addition to rod 300 and rotary body 400.

Fig. 5A and 5B are cross-sectional views illustrating a method for manufacturing the vapor deposition mask 10 according to an embodiment of the present invention. Specifically, fig. 5A is a cross-sectional view of the vapor deposition mask 10 and the pressing body 500 before the pressing body 500 is abutted against, and fig. 5B is a cross-sectional view of the vapor deposition mask 10 and the pressing body 500 after the pressing body 500 is abutted against.

As shown in fig. 5A, the pressing body 500 includes a convex portion 510. The convex portions 510 of the pressing body 500 are provided in correspondence with the pattern of the groove 140. As for the convex portion 510, it may be: the sides of the protrusion 510 have inclined surfaces so that a portion of the protrusion 510 can enter the groove 140. In this case, the side surface of the protruding portion 510 pushes down the burr 142 in an inclined manner, and thus the tip of the protrusion 141 formed in the groove 140 faces the bottom surface of the groove 140. The cross-sectional shape of the convex portion 510 is, for example, trapezoidal, horseshoe-shaped, or the like. In the example of the trapezoid shape of the convex portion 510 shown in fig. 5A, the width of the upper bottom of the convex portion 510 is larger than the width of the groove 140, and the width of the lower bottom of the convex portion 510 is smaller than the width of the groove 140.

As shown in fig. 5B, the pressing body 500 is abutted against the end of the side surface of the groove 140 in such a manner that the surface of the pressing body 500 is parallel to the surface of the mask body 110. Next, a predetermined pressure is applied to the pressing body 500. The width of the lower bottom of the protrusion 510 is smaller than the width of the groove 140, and thus, a portion of the protrusion 510 enters the groove 140. Thus, the protruding portion 510 presses the burr 142 from above, and the protrusion 141 is formed in the groove 140. Further, since the width of the upper bottom of the convex portion 510 is larger than the width of the groove 140, the convex portion 510 can be stopped before the lower bottom hits the bottom of the groove 140, that is, the mask frame 120.

It is preferable that the material of at least the convex portion 510 of the pressing body 500 is a harder material (a material having a higher hardness than the material of the second plating layer 290 (i.e., the connection member 130)) than the material of the second plating layer 290 (i.e., the connection member 130). The material of the protruding portion 510 is, for example, cemented carbide such as tungsten carbide (WC). As an example of the pressing body 500, a superhard die is used.

The size of the pressing member 500 may be the same as the size of the vapor deposition mask 10. The pressing body 500 may be provided with the convex portion 510 corresponding to the pattern of a part of the groove 140 (for example, the pressing body 500 provided with 1 convex portion 510 corresponding to 1 groove 140). In this case, the pressing body 500 is repeatedly used to press the burrs 142 while changing the position of the groove 140, whereby the protrusions 141 can be formed.

The abutment and movement of the pressing body 500 may be performed by automatic control. A camera may be used to align the groove 140 with the pressing body 500. Next, the contact of the pressing body 500 with the burr 142 (or the connection member 130) is detected using a sensor, and the pressing body 500 is abutted against the burr 142 (or the connection member 130) until a prescribed pressure is reached. In addition, a camera or a sensor may be used to capture or detect reflected light from the burr 142 different from the connection member 130, and the pressing body 500 may be moved along the end of the side surface of the groove 140 so that the reflected light from the burr 142 varies. That is, it can be determined that the protrusion 141 is formed based on the change in reflected light from the protrusion 141.

In the vapor deposition mask manufacturing method using the pressing member 500 according to the modification, the protrusions 141 can be formed in the groove 140. Further, the tip of the protrusion 141 may be directed to the bottom surface of the groove 140, and the protrusion 141 may not protrude outward from the surface of the mask body 110. Therefore, the vapor deposition mask 10 does not damage the vapor deposition target substrate, and vapor deposition failure of the product can be reduced. Further, the surface of the connection member 130 can be flattened by the pressing member 500, so that vapor deposition failure of the product can be further reduced.

The embodiments of the present invention described above can be appropriately combined and implemented without contradiction. Further, those skilled in the art can appropriately add, delete, or change the design of the constituent elements, or add, omit, or change the conditions of the steps based on the respective embodiments, and the embodiments are included in the scope of the present invention as long as they include the gist of the present invention.

Even other operational effects different from those of the embodiments described above are, of course, operational effects of the present invention, as long as they are known from the description of the present specification or can be easily expected by a person skilled in the art from the description of the present specification.

Claims (6)

1. A method for manufacturing an evaporation mask,

The vapor deposition mask includes: a mask frame having a space surrounded by a frame portion or a barrier portion; a first plating layer formed in a region overlapping the gap in a plan view and not overlapping the frame or the spacer in a plan view; and a second plating layer that bonds the mask frame and the first plating layer, wherein the first plating layer is formed so as to protrude from the mask frame in a first direction that is a direction protruding toward the substrate to be vapor deposited, and a groove portion is formed by a step between the mask frame and the first plating layer, which is caused by the protrusion of the first plating layer from the mask frame,

The method for manufacturing the vapor deposition mask is characterized by comprising the following steps:

And a step of pushing a protrusion protruding from the second plating layer in the first direction into the groove so as not to be cut off, but to remain on the vapor deposition mask as a protrusion, and so that a tip of the protrusion does not protrude outward from a surface of the first plating layer and an extension line of the surface, at a boundary between the second plating layer and the first plating layer.

2. The method for manufacturing an evaporation mask according to claim 1, wherein:

The step of pushing the protrusion over comprises the step of abutting the bar against the protrusion,

The material of the rod body is a material with higher hardness than the second plating layer.

3. The method for manufacturing an evaporation mask according to claim 1, wherein:

The step of pushing down the projection includes a step of abutting the rotating body against the projection,

The material of the portion of the rotating body that contacts the protrusion is a material having a higher hardness than the second plating layer.

4. The method for manufacturing an evaporation mask according to claim 1, wherein:

The step of pushing down the projection includes a step of abutting a pressing body including a convex portion having an inclined surface against the projection,

The material of the convex portion is a material having a higher hardness than the second plating layer.

5. The method for manufacturing a vapor deposition mask according to any one of claims 1 to 4, characterized in that:

the protrusion is judged to be formed based on a change in reflected light from the protrusion.

6. A vapor deposition mask manufactured by the method for manufacturing a vapor deposition mask according to any one of claims 1 to 5, comprising:

A mask frame having a space surrounded by a frame portion or a barrier portion;

a first plating layer formed in a region overlapping the gap in a plan view and not overlapping the frame or the spacer in a plan view; and

A second plating layer joining the mask frame and the first plating layer,

The first plating layer is formed to protrude from the mask frame in a first direction,

A protrusion is formed at an end portion of the second plating layer at a boundary between the second plating layer and the first plating layer,

The front end of the protrusion faces in a direction away from a boundary between the second plating layer and the first plating layer and does not protrude outward from the surface of the first plating layer and an extension line of the surface.