KR20210106811A - Method manufacturing structure for flexible printed circuit board and device thereof - Google Patents

Abstract

The present invention relates to a manufacturing method of a flexible circuit board laminated structure wherein by surface-treating a base film by irradiating an ion beam with an oxygen-argon mixed gas as a source, provided are the manufacturing method and manufacturing device of the flexible circuit board laminated structure that has excellent adhesiveness, heat resistance, and dimensional stability, and can contribute in improving productivity. The manufacturing method comprises: a surface-treating step; a tie layer forming step; and a metal plating layer forming step.

Description

Manufacturing method and manufacturing apparatus of a flexible circuit board laminated structure

The present invention relates to a method for manufacturing a laminated structure composed of a base film and a metal thin film used for manufacturing a flexible printed circuit board (FPCB), and more particularly, to a base having excellent adhesion, heat resistance, and dimensional stability. It relates to a method of manufacturing a laminated structure for a flexible circuit board, characterized in that the surface treatment of the film.

Recently, the use of printed circuit boards is increasing according to the trend of lighter, smaller, and higher-functioning electronic products. Among them, the demand for flexible printed circuit boards is rapidly increasing because the material is flexible and thin, so that circuits can be effectively constructed in a narrow space. the current situation.

In general, as a base film material for a flexible circuit board, polyimide, polyester, polyparavinyl acid film, etc. are used, and as a conductive metal thin film, copper, aluminum, iron, nickel, etc. are used. The base film is thermal and electrical. , polyimide films are mainly used because of their mechanical superiority.

As a conventional flexible circuit board, a three-layer board in which a copper thin film and a polyimide film are bonded to each other by an adhesive is known. The three-layer substrate undergoes a heating process and a wet chemical treatment process (etching, plating, developing, soldering, etc.) during pattern formation. In this case, there are problems such as a decrease in dimensional accuracy due to a difference in the coefficient of thermal expansion between the adhesive and the copper thin film and the polyimide film, and a decrease in adhesive strength due to chemical treatment.

The specifications of display devices such as electronic products, especially mobile phones and LCDs, are becoming more complex and dense. At the same time, the number and degree of integration of driver ICs for driving devices have become higher, requiring high-density circuit patterns, and the three-layer substrate cannot be used for high-density circuit patterns due to the above problems caused by adhesives.

In order to improve the above problems, research has been conducted on a two-layer flexible circuit board that does not use an adhesive having a metal layer formed thereon by deposition, sputtering, ion plating, or copper plating.

There are approximately two methods of manufacturing a flexible circuit two-layer substrate. The first method is a casting method in which a polyimide solution is coated on a metal layer, dried and cured, and then produced in the form of a film. As another method, there is a plating method in which a surface treatment to improve adhesion is performed on a polyimide film, a metal is vacuum coated thereto, and then a metal thin film is manufactured through electroplating as a conductive layer.

In the case of a two-layer substrate that does not use an adhesive, the problem of poor dimensional accuracy due to the difference in the coefficient of thermal expansion between the adhesive and the metal thin film and the polyimide film is solved as in the three-layer substrate, but the adhesive strength between the metal thin film and the polyimide film is reduced. Significantly reduced problems arise.

In order to improve the adhesion between the film and the deposition metal, it is preferable to use a surface-treated polyimide film or to treat the surface of the polyimide film before deposition. As such, the surface treatment of the polyimide film is performed not only for cleaning, but also for improving the adhesion between the polyimide film and the deposited metal.

Specific surface treatment means for the film include blasting, mechanical treatment such as hair line treatment and embossing, physicochemical treatment such as corona discharge, plasma treatment, chemical solution treatment using a solvent, acid or alkali, etc. includes Among these means, oxygen plasma treatment, which is a treatment under vacuum, is widely used in consideration of continuity with subsequent steps, productivity, stain resistance, adhesion, deterioration of the film, and the like. The oxygen plasma treatment can be performed continuously while the film is being transferred followed by vacuum deposition, or it can be done independently.

As such, the plasma treatment is performed for two purposes for cleaning and better adhesion, but there is still a problem in that adhesion and heat resistance are not improved to a satisfactory degree. In addition, when the base film is surface-treated by plasma, the film surface treatment speed is about 1 m/min, so there is a problem that the treatment speed must be increased in order to improve productivity.

Korean Patent Publication No. 10-2006-0012152 (published on March 30, 2007)

It is an object of the present invention to provide an apparatus and method for manufacturing a flexible printed circuit board laminate structure capable of surface-treating a base film to have excellent adhesion, heat resistance, and dimensional stability.

A method for manufacturing a flexible printed circuit board laminated structure includes the steps of surface-treating a base film; forming a tie layer on the base film; forming a metal conducting layer on the base film on which the tie layer is formed; and forming a metal plating layer by deposition of a metal on the base film on which the metal conducting layer is formed, wherein the base film is subjected to surface treatment by irradiating an ion beam using an oxygen-argon mixed gas.

The base film is characterized in that it is a polyimide film.

The oxygen-argon mixed gas is characterized in that the oxygen content is 50% or less.

The oxygen-argon mixed gas is characterized in that the oxygen content is 20 to 40%.

The material used for the metal conducting layer and the metal plating layer is characterized in that copper.

An apparatus for manufacturing a flexible printed circuit board laminated structure includes: an unwinding roller on which a base film is unwound; a film guide roller for guiding and transporting the base film; a surface treatment unit for performing surface treatment by irradiating an ion beam using an oxygen-argon mixed gas on the transferred base film; a tie layer forming unit for forming a tie layer on the surface-treated base film; a metal conductive layer forming unit for forming a metal conductive layer on the surface-treated base film; a metal plating layer forming part for forming a metal plating layer on the metal conducting layer; and a winding roller on which the base film on which the metal plating layer is formed is wound.

The tie layer forming part is characterized in that it further comprises a first main drum to which the base film is in contact while forming the tie layer.

The first main drum is characterized in that it is provided with a cooling device.

The metal plating layer forming unit may further include a second main drum to which the base film is in contact while the metal plating layer is formed.

The oxygen-argon mixed gas is characterized in that the oxygen content is 50% or less.

The oxygen-argon mixed gas is characterized in that the oxygen content is 20 to 40%.

According to the technical idea of the present invention, there is provided an apparatus and method for manufacturing a flexible printed circuit board laminated structure excellent in terms of the number of pinholes, average grain boundary size, adhesive strength and tensile strength, which have a great influence on the reliability of the flexible printed circuit board. can provide

1A and 1B are views showing a cross-sectional structure of a flexible printed circuit board laminated structure according to the present invention.
2 is a view showing an apparatus for manufacturing a flexible printed circuit board laminated structure according to the present invention.
3A and 3B are diagrams illustrating the relationship between the thickness of the tie layer and the copper thin film and the thickness uniformity of the copper plating film according to the application of sputtering power.
4 is a graph comparing the flexural characteristics of the laminated structure formed by the manufacturing method of the laminated structure according to the present invention and the flexural characteristics of the comparative example.
5A and 5B are SEM diagrams showing the surface state of the base film by oxygen plasma and the surface state of the base film by ion beam pretreatment according to the present invention.
6 is a graph showing the heat resistance test results of the laminated structure surface-treated with the base film by oxygen plasma.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Advantages and features of the present disclosure, and methods for achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the technical spirit of the present disclosure is not limited to the following embodiments, but may be implemented in various different forms, and only the following embodiments complete the technical spirit of the present disclosure, and in the technical field to which the present disclosure belongs It is provided to fully inform those of ordinary skill in the scope of the present disclosure, and the technical spirit of the present disclosure is only defined by the scope of the claims.

In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the present disclosure, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present disclosure, the detailed description thereof will be omitted.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which this disclosure belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular. The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present disclosure. As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase.

In addition, in describing the components of the present disclosure, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the components from other components, and the essence, order, or order of the components are not limited by the terms. When a component is described as being “connected”, “coupled” or “connected” to another component, the component may be directly connected or connected to the other component, but another component is between each component. It should be understood that elements may be “connected,” “coupled,” or “connected.”

As used herein, “comprises” and/or “comprising” refers to a referenced component, step, operation and/or element of one or more other components, steps, operations and/or elements. The presence or addition is not excluded.

A component included in one embodiment and a component having a common function may be described using the same name in another embodiment. Unless otherwise stated, the descriptions described in one embodiment may be applied to other embodiments, and specific descriptions will be omitted within the overlapping range or within the range that can be clearly understood by those skilled in the art. can

Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

Hereinafter, the present invention will be described in detail with reference to preferred embodiments of the present invention and the accompanying drawings.

1A and 1B are views showing a cross-sectional structure of a flexible printed circuit board laminated structure according to the present invention. Referring to FIG. 1A , the laminated structure 10 includes a tie layer (SL) provided on a base film (BF) and a metal plating layer (MP) provided on the tie layer (TL). includes Referring to FIG. 1B , the laminated structure 11 includes a tie layer TL provided on the front and rear surfaces of the base film BF, respectively, and a metal plating layer MP stacked on the tie layer TL, respectively.

The base film BF may be a polymer film. The base film is formed of a polymer material that has thermal stability and is lighter than glass, and can replace a conventional glass substrate. For example, the base film BF may be formed of polyimide. Polyimide is a key material for flexible circuit boards (FPCBs) and flexible copper clad laminates (FCCLs). The base film BF may have an appropriate thickness for operating as a printed circuit board, for example, may have a thickness of 12.5 to 50 micrometers.

The tie layer TL may be laminated on one surface or both sides of the front and rear surfaces of the base film BF. A process of depositing the tie layer TL on the base film BF is as follows.

First, the surface of the base film BF is surface-activated. In the step of activating the surface of the base film BF, the surface energy of the base film BF may be increased, thereby increasing adhesion with the metal plating layer MP laminated thereon.

The surface activation method may use UV surface treatment, plasma surface treatment, or ion beam surface treatment.

UV surface treatment is a surface modification method that uses photo-chemical decomposition between molecules and photons to increase surface roughness, cut polymer chains, or form new chemical bonds to increase hydrophilic functional groups. The UV surface treatment is a horizontal light mode, and a wavelength of 200 to 420 nm may be used, but is not limited thereto. In addition, the UV irradiation intensity of the UV surface treatment is 10 to 30 mW/cm2, preferably 15 to 25 mW/cm2 may be used, and the irradiation time may be 1 to 20 minutes, preferably 5 minutes to 10 minutes, but not limited thereto.

Plasma surface treatment is a surface treatment method using plasma, which is an ionized and electrically neutral gas as a whole, and is a surface modification method to increase hydrophilic functional groups. The plasma treatment may use one or more selected from the group consisting of argon plasma, nitrogen plasma, or oxygen plasma, but is not limited thereto. The plasma surface treatment is performed at 50 to 300 W output in an inert nitrogen gas and reactive oxygen gas injection atmosphere, respectively, and preferably has an output of 100 to 150 W, but is not limited thereto. In addition, the plasma surface treatment has a process pressure of 150 to 300 mTorr or less, preferably 150 to 200 mTorr. The treatment time may be 3 minutes to 10 minutes, preferably 5 minutes, but is not limited thereto. Plasma surface treatment may be performed using a process type ion beam source.

Second, the tie layer TL is deposited by sputtering.

In general, semiconductor deposition technology is largely divided into physical vapor deposition (PVD) technology, chemical vapor deposition (CVD) technology, and plating deposition technology.

Physical Vapor Deposition (PVD) technology transports a solid target containing the constituent atoms of the desired thin film into atoms, molecules, and clusters by physical action (evaporation, sublimation, sputtering) on the substrate surface and transports them to the surface of the thin film. way to form The sputtering technique is one of the physical vapor deposition (PVD) methods using the principle that the ionized cation gas (Ar+) in a plasma state strongly collides with the target and the target material is deposited on the substrate by the collision energy. .

In the present invention, the formation of the tie layer TL may be performed by applying power to an alloy sputtering target of tin (Sn) and nickel (Ni) to perform sputtering. In this case, the thickness of the tie layer TL may be variously determined in a range of 10 to 50 nm depending on intended conditions. The average grain size and variation of the crystal grains of the alloy sputtering target are not particularly limited.

Third, the metal plating layer MP is deposited by sputtering.

The metal plating layer MP may be formed by a process continuous with the tie layer TL process. The metal plating layer MP may be variously determined in a range of 50 to 300 nm depending on intended conditions.

The laminate structure 10 according to the present invention can solve problems such as peeling, separation, cracking, pinholes, and resistance concentration due to bonding due to a decrease in adhesion between the metal plating layer MP and the base film BF.

2 is a view showing an apparatus 100 for manufacturing a flexible printed circuit board laminated structure according to the present invention. The apparatus 100 for manufacturing a flexible circuit board laminated structure is an apparatus for laminating a tie layer (TL) and a metal plating layer (MP) on a base film (1), and a heater (2), a surface treatment apparatus (3), a tie layer sputtering Cathode (4a), metal conducting layer sputtering cathode (4b), metal plating layer sputtering cathode (5), first main drum (6), second main drum (7), film guide roller (8), unwinding roller (9) , may include a winding roller 12 . The apparatus 100 for manufacturing the flexible printed circuit board laminated structure may include vacuum chambers 13, 14, and 15 for making the inside of the laminated structure in a vacuum state.

The base film 1 may be a polymer film. The base film 1 is formed of a polymer material that has thermal stability and is lighter than glass, and can replace a conventional glass substrate. For example, the base film 1 may be formed of polyimide.

The heater 2 may be a device for preheating the unwound polyimide film by heating the base film 1 . The heater 2 may be, for example, an infrared heater. The heater 2 heats the base film 1 to 60 to 80 degrees, thereby facilitating surface activation of the base film 1 .

The surface treatment apparatus 3 may improve adhesion by surface-treating the base film using plasma. The surface treatment apparatus 3 according to the present invention can have excellent effects in heat-resistant adhesive strength, copper foil tensile strength, initial adhesive strength, and number of pinholes of the laminated structure by irradiating the mixed gas with an ion beam. Specifically, the surface treatment apparatus 3 according to the present invention _{may irradiate a mixed gas of argon (Ar) gas and oxygen (O 2} ) gas with an ion beam. The mixing ratio of argon gas and oxygen gas may have an oxygen content of 10 to 50%, preferably 20 to 40% or less.

item Comparative Example 1 2nd comparative example 3rd comparative example Example Copper thickness deviation (μm) ±0.8 ±0.8 ±0.8 ±0.35 Number of pin holes 35 25 55 8 Average grain size (㎛) 2-3 3 to 5 0.7 to 1.0 0.1 to 0.3 Initial adhesive strength (kgf/cm) 0.65 0.68 0.7 0.8 Heat-resistant adhesive strength (kgf/cm) 0.35 0.38 0.4 0.45 Copper Foil Tensile Strength 38 38 38 75

The experimental results showed that the laminated structure manufactured through the surface treatment according to the present example had superior quality compared to the comparative example. Referring to Table 1, in the case of copper foil thickness deviation, this Example showed a thickness deviation of 0.35 micrometers, whereas in Comparative Examples 1 to 3, a thickness deviation of 0.8 micrometers was observed. This was analyzed as an effect due to the reaction action of a special leveler contained in the additive of the plating solution.

Referring to Table 1, in the case of pinholes, it was found that there were only 8 pinholes in this embodiment compared to the first comparative example (35 pieces), the second comparative example (25 pieces), and the third comparative example (55 pieces). It was analyzed that since the characteristics of the carrier and the copper crystal size to be filled during plating were lower than those of the comparative example, the packing density increased and the pinholes were less generated while plating more densely.

Referring to Table 1, in the case of the initial adhesive strength, the adhesive strength according to this example was higher than that of Comparative Examples 1 to 3, confirming that the adhesive strength was improved. It was confirmed that, through the composition ratio of the N-Cr-Sn alloy used as the tie layer before the deposition of the metal plating layer (copper), the micro-content of tin played a role as a glue on the surface of the copper thin film and the polyimide film, and the adhesion was improved.

Referring to Table 1, it was found that the heat-resistant adhesive strength according to the present example was improved compared to the comparative example. This is analyzed to be because the heat resistance of the metal plating layer itself formed of copper is excellent.

Referring to Table 1, it is shown that the tensile strength of the laminated structure according to the present embodiment is improved compared to the comparative example. It is analyzed that the strength of the metal plating layer is increased as the composition ratio of amine in the component of the brightener is optimized compared to the comparative example in the plating solution additive, and the tensile strength is increased.

The tie layer sputtering cathode 4a forms a tie layer through sputtering while the base film 1 is in contact with the first main drum 6 . The metal conducting layer sputtering cathode 4b forms a metallic conducting layer through sputtering while the base film 1 is in contact with the first main drum 6 .

The metal plating layer sputtering cathode 5 may deposit a metal plating layer on the base film 1 on which the tie layer and the metal conducting layer are formed. Metal plating layer sputtering The cathode 5 forms a metal plating layer through sputtering while the base film 1 is in contact with the second main drum 7 .

The first main drum 6 and the second main drum 7 serve to guide the base film 1 in one direction. The first main drum 6 and the second main drum 7 may include a cooling system to prevent the base film 1 from being damaged by high heat generated during the process.

The unwinding roller 9 may be a roller for ejecting the rolled base film 1 in one direction in a roll shape. The winding roller 12 may be a roller for accommodating the base film 1 on which the process is completed by rolling in one direction. The unwinding roller 9 and the winding roller 12 are coupled to both ends of the base film 1 , thereby providing an appropriate tension to the base film 1 .

Hereinafter, an operation method of the apparatus 100 for manufacturing a flexible printed circuit board laminated structure according to the present invention having the above configuration will be described in detail.

First, the base film 1 is unwound from the unwinding roller 9 with a constant tension. The unwound base film 1 is heated by a heater 2 between the film guide rollers 8 and 8b, and then surface-treated by a surface treatment device 3 . As an example of such a surface treatment, the method of improving adhesive force by surface-treating a polyimide film by plasma is mentioned.

Thereafter, the base film 1 is transferred to the first main drum 6 via the film guide roller 8c. While the base film 1 is in contact with the first main drum 6, a tie layer is first formed by a tie layer sputtering cathode 4a, and then a tie layer is formed by a metal conducting layer sputtering cathode 4b. A metal conducting layer is formed on the layer. Since the method of performing sputtering is the same as previously known, a description thereof will be omitted. The metal conducting layer may be formed of, for example, a metal material such as copper, gold, silver, or aluminum, but is not limited thereto.

Thereafter, the base film 1 is transferred to the second main drum 7 . The plating layer sputtering cathode 5 deposits a copper plating layer on the copper conducting layer while the base film is in contact with the second main drum 7 . For example, the plating layer sputtering cathode 5 may be composed of an electron gun and a metal ingot. The electron gun irradiates an electron beam to the metal mass to cause evaporation of the metal, and the evaporated copper component may be deposited on the base film. If the sputtering apparatus is not limited to the above-described examples, various sputtering apparatuses may be used.

The base film 1 on which the copper plating layer is formed is then wound on a winding roller 12 .

In the apparatus 100 for manufacturing a flexible printed circuit board laminated structure of the present invention, all components are provided in the vacuum chambers 13, 14, and 15, and therefore all manufacturing processes are performed in a vacuum state. Conventionally, the copper plating layer is formed through a wet plating process after the polyimide film formed up to the copper conducting layer is exposed to the outside atmosphere instead of inside the vacuum chamber. ,14,15) is replacing the conventional wet plating process by forming a copper plating layer on the polyimide film by internal deposition, that is, by dry plating.

Therefore, according to the present invention, there is no fear that the polyimide film on which the copper conducting layer is formed is oxidized by the atmosphere or contaminated by dust present in the external atmosphere.

In addition, since chemical substances such as aqueous copper sulfate solution used to form the copper plating layer in the conventional wet plating process are not used at all, environmental pollution caused by these chemicals can be prevented.

3A and 3B are diagrams showing the relationship between the thickness of the tie layer and the copper thin film and the thickness uniformity of the copper plating film according to the application of sputtering power.

3A is a graph showing the relationship between the thickness of the tie layer and the copper thin film according to the application of sputtering power in a sputtering process of depositing a copper conductive layer.

Referring to FIG. 3A , it can be seen that the thickness of the copper thin film increases linearly as the sputtering power increases. In the part where the applied power is increased, the sputter yield is somewhat lowered due to the collision between the re-sputtered particles and the coated particles due to the re-sputter phenomenon (the phenomenon in which sputtered particles bounce back when too much force is applied from the substrate) This can happen.

3B is a graph showing the thickness uniformity of a copper plating film plated by sputtering.

±3% 이내에서 박막이 형성됨을 수치상으로 확인 하였다.3b, the measurement method is to measure the sheet resistance while moving a total of 55 points from left to right at intervals of 1 meter and show this as a graph. In conclusion, 3,000

It was numerically confirmed that a thin film was formed within ±3%.

4 is a graph comparing the flexural characteristics of the laminated structure formed by the manufacturing method of the laminated structure according to the present invention and the flexural characteristics of the comparative example.

Referring to FIG. 4 , it can be seen that the flexural characteristics of the laminated structure according to the present invention do not generate cracks even after bending attempts of 50,000 times or more, so that the resistance is maintained, while the comparative examples manufactured by domestic and foreign companies have as little as 40,000 times and as much as 40,000 times. It can be seen that cracks occur from 70,000 cycles and the resistance rises sharply. This effect is analyzed to be due to the superiority of the plating technology of the laminated structure according to the present invention.

5A and 5B are SEM diagrams showing the surface state of the base film by oxygen plasma and the surface state of the base film by ion beam pretreatment according to the present invention.

Referring to FIG. 5a, the surface roughness of the base film sample surface-treated with oxygen plasma is shown. Referring to FIG. 5b, the surface roughness of the base film sample surface-treated by an ion beam irradiated with an oxygen-argon mixed gas is shown. .

으로 나타난 반면, 본 발명에 따른 산소-아르곤 혼합가스를 조사한 이온빔에으로 표면처리한 베이스 필름은 표면의 거칠기가 25 μm 두께를 기준으로 평균제곱근 13.42

으로 나타나, 거칠기가 36%수준으로 낮아진 것으로 나타났다.The base film surface-treated with oxygen plasma has a surface roughness of 37.16 root mean square based on a thickness of 25 μm.

On the other hand, the base film surface-treated with an ion beam irradiated with an oxygen-argon mixed gas according to the present invention had a surface roughness of 13.42 root mean square based on a thickness of 25 μm.

, and the roughness was lowered to the level of 36%.

6 is a graph showing the heat resistance test results of the laminated structure surface-treated with the base film by oxygen plasma.

Referring to FIG. 6 , as a result of a heat resistance test, the laminate structure (FEM) to which the technical idea of the present invention is applied has improved heat resistance compared to the conventional laminate structures (A, B, C).

The method of manufacturing a flexible circuit board laminate structure according to the present invention can be applied to all fields of electronic products, for example, not only a flexible circuit board but also a circuit board requiring bonding such as TAB, COF, and BGA.

As mentioned above, although the present invention has been described in detail through specific embodiments, the present invention is not limited to the above-described embodiments, and various modifications are possible by those of ordinary skill within the scope of the technical spirit of the present invention. .

MP: metal plating layer TL: tie layer
BF, 1: Base film 10, 11: Flexible circuit board laminated structure
100: flexible circuit board laminated structure manufacturing device
2: Heater 3: Surface treatment part
4a: tie layer sputtering cathode 4b: metal conducting layer sputtering cathode
5: metal plating layer sputtering cathode 6: first main drum
7: 2nd main drum 8a ~ 8f: film guide roller
9: unwinding roller 12: winding roller
13,14,15: vacuum chamber

Claims (11)

A method for manufacturing a flexible circuit board laminated structure, the method comprising:
surface treatment of the base film;
forming a tie layer on the base film; and
Forming a metal plating layer by deposition of a metal on the base film on which the tie layer is formed,
A method of manufacturing a flexible circuit board laminate structure, characterized in that the base film is surface-treated by irradiating an ion beam using an oxygen-argon mixed gas. The method of claim 1,
The base film is a method of manufacturing a flexible circuit board laminate structure, characterized in that the polyimide film. 3. The method according to claim 1 or 2,
The oxygen-argon mixed gas has an oxygen content of 50% or less. 4. The method of claim 3,
The oxygen-argon mixed gas is a method of manufacturing a flexible printed circuit board laminate structure, characterized in that the oxygen content of 20 to 40%. The method of claim 1,
Before the step of forming the metal plating layer,
The method of manufacturing a flexible printed circuit board laminate structure further comprising the step of forming a metal conducting layer on the base film on which the tie layer is formed. An apparatus for manufacturing a flexible circuit board laminated structure, comprising:
an unwinding roller on which the base film is unwound;
a film guide roller for guiding and transporting the base film;
a surface treatment unit for performing surface treatment by irradiating an ion beam using an oxygen-argon mixed gas on the transferred base film;
a tie layer forming unit for forming a tie layer on the surface-treated base film;
a metal plating layer forming part for forming a metal plating layer on the tie layer; and
and a winding roller on which the base film on which the metal plating layer is formed is wound. 7. The method of claim 6,
and a first main drum to which the base film is in contact while the tie layer forming unit forms the tie layer. 8. The method of claim 7,
The first main drum is an apparatus for manufacturing a flexible printed circuit board laminated structure, characterized in that it includes a cooling device. 7. The method of claim 6,
and a second main drum to which the base film is in contact while the metal plating layer forming unit forms the metal plating layer. 7. The method of claim 6,
The apparatus for manufacturing a flexible circuit board laminate structure, characterized in that the oxygen-argon mixed gas has an oxygen content of 50% or less. 7. The method of claim 6,
The apparatus for manufacturing a flexible printed circuit board laminate structure further comprising a metal conducting layer forming part for forming a metal conducting layer on the surface-treated base film.

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