KR20210103657A - silicone pad for hot press - Google Patents
silicone pad for hot press Download PDFInfo
- Publication number
- KR20210103657A KR20210103657A KR1020200018064A KR20200018064A KR20210103657A KR 20210103657 A KR20210103657 A KR 20210103657A KR 1020200018064 A KR1020200018064 A KR 1020200018064A KR 20200018064 A KR20200018064 A KR 20200018064A KR 20210103657 A KR20210103657 A KR 20210103657A
- Authority
- KR
- South Korea
- Prior art keywords
- pad
- hot press
- layer
- circuit board
- silicone
- Prior art date
Links
- 229920001296 polysiloxane Polymers 0.000 title claims description 25
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000009792 diffusion process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000002210 silicon-based material Substances 0.000 claims abstract description 9
- 239000012779 reinforcing material Substances 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 229910001679 gibbsite Inorganic materials 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000007731 hot pressing Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 26
- 239000002655 kraft paper Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
본 발명은 핫 프레스용 실리콘 패드에 관한 것으로, 보다 상세하게는 PCB 또는 FPCB와 같은 회로기판에 절연수지층을 가열, 가압할 때 사용되는 것으로 재사용이 가능하도록 구성된 핫 프레스용 실리콘 패드에 관한 것이다.
또한, 회로기판 제조공정 중 핫 프레스를 통해 절연수지층을 형성시키는 핫 프레스 공정에서 회로기판의 상,하부에 배치되는 실리콘 재질로 구성된 패드로서, 상기 패드는 수직방향 열전도율을 기 설정된 범위로 조절하기 위한 열확산재가 혼합되어 판상으로 경화된 실리콘 재질로 구성된 제1 레이어를 포함하는 것을 특징으로 한다.The present invention relates to a silicon pad for hot press, and more particularly, to a silicon pad for hot press used when heating and pressing an insulating resin layer on a circuit board such as a PCB or FPCB and configured to be reusable.
In addition, a pad made of a silicon material disposed on the upper and lower portions of the circuit board in a hot press process of forming an insulating resin layer through hot pressing during the circuit board manufacturing process, wherein the pad adjusts the vertical thermal conductivity to a preset range. It is characterized in that it includes a first layer made of a silicon material hardened in a plate shape by mixing a thermal diffusion material for the.
Description
본 발명은 핫 프레스용 실리콘 패드에 관한 것으로, 보다 상세하게는 PCB 또는 FPCB와 같은 회로기판에 절연수지층을 가열, 가압할 때 사용되는 것으로 재사용이 가능하도록 구성된 핫 프레스용 실리콘 패드에 관한 것이다.The present invention relates to a silicon pad for hot press, and more particularly, to a silicon pad for hot press used when heating and pressing an insulating resin layer on a circuit board such as a PCB or FPCB and configured to be reusable.
일반적으로 PCB 또는 FPCB와 같은 회로기판은 동박으로 구성된 회로가 노출되지 않도록 절연수지층이 적층되도록 제조된다.In general, a circuit board such as a PCB or FPCB is manufactured so that an insulating resin layer is laminated so that a circuit composed of copper foil is not exposed.
최근 전자제품의 소형화로 그 수요가 크게 증가하고 있는 FPCB는 회로기판 제조공정 중 핫 프레스를 통해 절연수지층을 형성시키는 핫 프레스 공정을 통해 폴리이미드 필름과 같은 수지계열의 필름을 가열, 가압하여 절연수지층을 형성하게 된다.FPCB, whose demand is increasing due to the recent miniaturization of electronic products, is insulated by heating and pressing a resin-based film such as a polyimide film through a hot press process that forms an insulating resin layer through hot pressing during the circuit board manufacturing process. A resin layer is formed.
핫 프레스 공정에서는 수지계열의 필름이 들뜨지 않고 고르게 부착시키기 위해 적게는 수 장에서부터 많게는 수십 장에 이르는 크라프트 페이퍼(Kraft Paper)를 회로기판의 상,하부에 적층하여 프레스가 크라프트 페이퍼를 통해서 수지계열의 필름을 가압할 때 압력분포가 균일하도록 실시되고 있다.In the hot press process, in order to adhere the resin-based film evenly without lifting it, from a few sheets to a maximum of several tens of kraft papers are laminated on the top and bottom of the circuit board, and the press is made of resin-based films through the kraft paper. When the film is pressed, the pressure distribution is uniform.
반면, 전량 수입에 의존하고 있는 크라프트 페이퍼는 일회용으로 재사용이 어렵고 종이재질로 지분 등 이물이 다수 발생되는 문제점이 있었다.On the other hand, kraft paper, which is entirely dependent on imports, has a problem in that it is difficult to reuse because it is disposable, and a large number of foreign substances such as stakes are generated as paper materials.
이에 따라, 한국등록특허 제10-0969705호 "연성인쇄회로기판(FPCB) 제조용 복합필름 및 이를이용한 연성인쇄회로기판의 제조방법"과 같이 크라프트 페이퍼를 대체하기 위한 기술개발이 지속적으로 이루어지고 있으나, 실리콘만으로는 이형성확보가 어렵거나, 크라프트 페이퍼를 대체할 수 있는 경도 및 열전도율 범위로 제조하기 어려운 문제점이 있었다.Accordingly, technology development to replace kraft paper is continuously being made, as in Korean Patent Registration No. 10-0969705 "Composite film for manufacturing flexible printed circuit board (FPCB) and manufacturing method of flexible printed circuit board using the same", There was a problem in that it was difficult to secure releasability only with silicon, or it was difficult to manufacture in a range of hardness and thermal conductivity that could replace kraft paper.
본 발명의 목적은 상술한 바와 같은 문제점을 해결하기 위해 안출된 것으로서, 공정이나 장치를 변경하지 않고 기존의 크라프트 페이퍼를 대체하기 위한 핫 프레스용 실리콘 패드를 제공하는 것이다.It is an object of the present invention to provide a silicone pad for hot press to replace the existing kraft paper without changing the process or apparatus as devised to solve the above problems.
본 발명의 다른 목적은 휘어짐에 따른 파손을 방지하기 위한 핫 프레스용 실리콘 패드를 제공하는 것이다.Another object of the present invention is to provide a silicone pad for hot press for preventing damage due to bending.
상기 목적을 달성하기 위해 본 발명에 따른 핫 프레스용 실리콘 패드는 회로기판 제조공정 중 핫 프레스를 통해 절연수지층을 형성시키는 핫 프레스 공정에서 회로기판의 상,하부에 배치되는 실리콘 재질로 구성된 패드로서, 상기 패드는 수직방향 열전도율을 기 설정된 범위로 조절하기 위한 열확산재가 혼합되어 판상으로 경화된 실리콘 재질로 구성된 제1 레이어를 포함하는 것을 특징으로 한다.In order to achieve the above object, the silicone pad for hot press according to the present invention is a pad made of a silicone material disposed on the upper and lower parts of the circuit board in the hot press process of forming an insulating resin layer through hot pressing during the circuit board manufacturing process. , The pad is characterized in that it comprises a first layer made of a silicon material hardened in the form of a plate in which a thermal diffusion material for adjusting the vertical direction thermal conductivity to a preset range is mixed.
또한, 상기 열확산재는 BN, AlN, MgO, Al₂O₃, SiC, Al(OH)₃, Cu, Fe, Al, 그라파이트, 그래핀, 탄소나노튜브 중 적어도 어느 하나 이상을 포함하여 구성되는 것을 특징으로 한다.In addition, the thermal diffusion material is characterized in that it comprises at least any one or more of BN, AlN, MgO, Al₂O₃, SiC, Al(OH)₃, Cu, Fe, Al, graphite, graphene, and carbon nanotubes.
또한, 상기 패드는 제1 레이어의 일면 또는 양면에 실리콘 재질로만 구성된 제2 레이어를 더 포함하는 것을 특징으로 한다.In addition, the pad further comprises a second layer made of only a silicon material on one or both surfaces of the first layer.
또한, 상기 제1 레이어는 판상으로 수평하게 배치되는 보강재를 더 포함하는 것을 특징으로 한다.In addition, the first layer is characterized in that it further comprises a reinforcing material disposed horizontally in a plate shape.
또한, 상기 패드는 판상으로 수평하게 배치되는 보강재를 더 포함하며, 제1 레이어와 보강재가 교번하여 적층된 것을 특징으로 한다.In addition, the pad further includes a reinforcing material horizontally arranged in a plate shape, characterized in that the first layer and the reinforcing material are alternately stacked.
또한, 상기 패드는 하기 식 1 내지 3을 동시에 만족하는 것을 특징으로 한다.In addition, the pad is characterized in that it simultaneously satisfies
70 ≤ A ≤ 90 (식 1)70 ≤ A ≤ 90 (Equation 1)
0.2 ≤ B ≤ 1 (식 2)0.2 ≤ B ≤ 1 (Equation 2)
0.1 ≤ C ≤ 10 (식 3)0.1 ≤ C ≤ 10 (Equation 3)
( A : 쇼어(shore) A 경도, B : 열전도율(W/mk), C : 열확산재의 입자직경(㎛) )( A: shore A hardness, B: thermal conductivity (W/mk), C: particle diameter of thermal diffusion material (㎛) )
상술한 바와 같이, 본 발명에 따른 핫 프레스용 실리콘 패드에 의하면, 재사용이 가능하여 원가를 절감하고 산업폐기물 발생을 줄일 수 있는 효과가 있다.As described above, according to the silicone pad for hot press according to the present invention, it is possible to reuse, thereby reducing the cost and reducing the generation of industrial waste.
또한, 본 발명에 따른 핫 프레스용 실리콘 패드에 의하면, 보강재를 통해 휘어짐을 방지하여 재사용율을 크게 높일 수 있는 효과가 있다.In addition, according to the silicone pad for hot press according to the present invention, there is an effect that can greatly increase the reuse rate by preventing bending through the reinforcing material.
도 1은 본 발명에 따른 핫 프레스용 실리콘 패드를 도시한 단면도.
도 2는 본 발명에 따른 핫 프레스용 실리콘 패드의 다른 실시예를 도시한 단면도.
도 3은 본 발명에 따른 핫 프레스용 실리콘 패드의 또 다른 실시예를 도시한 단면도.1 is a cross-sectional view showing a silicone pad for hot press according to the present invention.
Figure 2 is a cross-sectional view showing another embodiment of the silicone pad for hot press according to the present invention.
Figure 3 is a cross-sectional view showing another embodiment of the silicone pad for hot press according to the present invention.
본 명세서에 개시되어 있는 본 발명의 개념에 따른 실시 예들에 대해서 특정한 구조적 또는 기능적 설명은 단지 본 발명의 개념에 따른 실시 예들을 설명하기 위한 목적으로 예시된 것으로서, 본 발명의 개념에 따른 실시 예들은 다양한 형태들로 실시될 수 있으며 본 명세서에 설명된 실시 예들에 한정되지 않는다.Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are only exemplified for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention are It may be implemented in various forms and is not limited to the embodiments described herein.
본 발명의 개념에 따른 실시 예들은 다양한 변경들을 가할 수 있고 여러 가지 형태들을 가질 수 있으므로 실시 예들을 도면에 예시하고 본 명세서에서 상세하게 설명하고자 한다. 그러나, 이는 본 발명의 개념에 따른 실시 예들을 특정한 개시 형태들에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물, 또는 대체물을 포함한다.Since the embodiments according to the concept of the present invention may have various changes and may have various forms, the embodiments will be illustrated in the drawings and described in detail herein. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and includes all modifications, equivalents, or substitutes included in the spirit and scope of the present invention.
이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
도 1은 본 발명에 따른 핫 프레스용 실리콘 패드를 도시한 단면도이며, 도 2는 본 발명에 따른 핫 프레스용 실리콘 패드의 다른 실시예를 도시한 단면도이고, 도 3은 본 발명에 따른 핫 프레스용 실리콘 패드의 또 다른 실시예를 도시한 단면도이다.1 is a cross-sectional view showing a silicone pad for hot press according to the present invention, FIG. 2 is a cross-sectional view showing another embodiment of a silicone pad for hot press according to the present invention, and FIG. 3 is a cross-sectional view for hot press according to the present invention It is a cross-sectional view showing another embodiment of the silicon pad.
도 1에 도시된 바와 같이, 본 발명에 따른 핫 프레스용 실리콘 패드(이하, 패드)는 회로기판 제조공정 중 핫 프레스를 통해 폴리이미드 필름과 같은 수지계열의 필름을 가열, 가압하여 절연수지층을 형성시키는 핫 프레스 공정에서 회로기판의 상,하부에 배치되는 실리콘 재질로 구성된 패드(10)로 회로기판의 상,하부에서 소정의 온도로 가열되어 가압하는 프레스를 대신하여 수지계열의 필름에 접하여 열과 압력을 전달하게 된다.As shown in FIG. 1, the silicone pad for hot press (hereinafter, the pad) according to the present invention heats and presses a resin-based film such as a polyimide film through hot press during the circuit board manufacturing process to form an insulating resin layer. In the hot press process to form, the
특히, 상기 패드(10)는 수직방향 열전도율을 기 설정된 범위로 조절하기 위한 열확산재(3)가 혼합되어 판상으로 경화된 실리콘 재질로 구성된 제1 레이어(1)를 포함하여 열전도율이 낮은 실리콘 재질로 인해 열이 균일하게 전달되지 못하거나, 특정 영역에 열이 집중되는 것을 효과적으로 방지하게 된다.In particular, the
상기 제1 레이어(1)는 열확산재의 분포가 균일하도록 액상 실리콘과 열확산재를 혼합한 후 판상으로 경화시켜 제조되거나, 실리콘, 실리콘을 용해시키기 위한 용제, 열확산재를 혼합한 후 가열, 건조를 통해 용제를 휘발시키는 방법으로 제조될 수도 있다.The first layer (1) is manufactured by mixing liquid silicone and a thermal diffusion material so that the distribution of the thermal diffusion material is uniform, and then curing it into a plate shape, or mixing silicone, a solvent for dissolving the silicone, and a thermal diffusion material, and then heating and drying. It can also be prepared by a method of volatilizing a solvent.
또한, 상기 열확산재는 BN, AlN, MgO, Al₂O₃, SiC, Al(OH)₃, Cu, Fe, Al, 그라파이트, 그래핀, 탄소나노튜브 중 적어도 어느 하나 이상을 포함하도록 구성될 수 있으며, 열확산재의 형상은 판상, 구상을 비롯하여 다양한 형태로 이루어질 수 있다.In addition, the thermal diffusion material may be configured to include at least any one or more of BN, AlN, MgO, Al₂O₃, SiC, Al(OH)₃, Cu, Fe, Al, graphite, graphene, and carbon nanotubes. The shape may be formed in various forms, including a plate shape and a spherical shape.
상기 열확산재(3)는 수평 방향으로도 균일하게 열을 확산시킴으로써, 프레스에 설치된 히터의 위치에 열이 집중되지 않고, 히터의 위치에 관계없이 효율적으로 표면 전체에 고르게 열을 전달할 수 있다.The heat spreader 3 uniformly spreads heat in the horizontal direction, so that heat is not concentrated at the location of the heater installed in the press, and heat can be efficiently and evenly transmitted to the entire surface regardless of the location of the heater.
또한, 상기 패드(10)는 복수 개의 제1 레이어(1)가 적층된 형태일 수도 있으며, 복수 개의 제1 레이어(1) 사이에 별도의 접착층이 형성되어 있을 수도 있다.In addition, the
다른 실시예로써, 도 2에 도시된 바와 같이 또한, 상기 제1 레이어(1)는 판상으로 수평하게 배치되는 보강재(4)를 더 포함할 수도 있으며, 보강재(4)는 천연섬유, 합성섬유가 직조되거나, 수지, 금속이 판상 또는 일정 패턴으로 구성된 형태일 수도 있다.As another embodiment, as shown in FIG. 2 , the
예를 들면, 격자 형태로 직조된 유리섬유와 같은 보강재(4)가 제1 레이어(1)의 내부에 수평하게 배치된 형태로 제1 레이어(1)가 제조되어 패드가 찢어지거나 휘어지는 것을 효과적으로 방지하도록 구성될 수 있다.For example, the
또는, 보강재(4)가 제1 레이어(1)의 일면 또는 양면에 부착되거나, 보강재(4)가 배치된 상태에서 열확산재가 혼합된 액상 실리콘을 경화시켜 보강재(4)가 제1 레이어(1)의 일면 또는 양면에 일체로 형성되도록 제조될 수도 있다.Alternatively, the reinforcing
또는, 복수 개의 제1 레이어(1) 사이에 보강재(4)가 배치되되, 제1 레이어(1)와 보강재(4)가 교번하여 적층되는 형태로 구성될 경우 패드(10)가 휘어지는 것을 보다 효과적으로 억제할 수 있다.Alternatively, when the reinforcing
도 3에 도시된 또 다른 실시예와 같이, 상기 패드(10)는 제1 레이어(1)의 일면 또는 양면에 실리콘 재질로만 구성되거나, 제1 레이어(1)와는 열확산재(3)의 혼합비율이 상이한 제2 레이어(2)를 더 포함하도록 구성될 수도 있다.3 , the
위에서 설명한 상기 패드(10)는 별도의 구성추가나, 종래 핫 프레스 공정을 위한 공정 및 장치의 변경없이 종래의 크라프트 페이퍼를 대체하여 반복적인 재사용이 가능하도록 하기 식 1 내지 3을 동시에 만족하도록 구성됨이 바람직하다.The
70 ≤ A ≤ 90 (식 1)70 ≤ A ≤ 90 (Equation 1)
0.2 ≤ B ≤ 1 (식 2)0.2 ≤ B ≤ 1 (Equation 2)
0.1 ≤ C ≤ 10 (식 3)0.1 ≤ C ≤ 10 (Equation 3)
( A : 쇼어(shore) A 경도, B : 열전도율(W/mk), C : 열확산재의 입자직경(㎛) )( A: shore A hardness, B: thermal conductivity (W/mk), C: particle diameter of thermal diffusion material (㎛) )
이상과 같이 본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 본 발명의 범주를 벗어남이 없이 많은 다양한 자명한 변형이 가능하다는 것은 명백하다. 따라서 본 발명의 범주는 이러한 많은 변형의 예들을 포함하도록 기술된 청구범위에 의해서 해석되어져야 한다.As described above, the present invention has been mainly described with reference to the accompanying drawings, but it is apparent to those skilled in the art that many various obvious modifications are possible without departing from the scope of the present invention from these descriptions. Accordingly, the scope of the present invention should be construed by the appended claims to include examples of many such modifications.
1 : 제1 레이어
2 : 제2 레이어
3 : 열확산재
4 : 보강재
10 : 패드1: first layer
2: second layer
3: thermal diffusion material
4: Reinforcement
10: pad
Claims (6)
상기 패드는 수직방향 열전도율을 기 설정된 범위로 조절하기 위한 열확산재가 혼합되어 판상으로 경화된 실리콘 재질로 구성된 제1 레이어를 포함하는 것을 특징으로 하는
핫 프레스용 실리콘패드.
A pad made of silicon material disposed on the upper and lower parts of the circuit board in the hot press process of forming an insulating resin layer through hot press during the circuit board manufacturing process,
The pad is characterized in that it comprises a first layer made of a silicon material hardened in the form of a plate in which a thermal diffusion material for adjusting the vertical direction thermal conductivity to a preset range is mixed.
Silicone pad for hot press.
상기 열확산재는
BN, AlN, MgO, Al₂O₃, SiC, Al(OH)₃, Cu, Fe, Al, 그라파이트, 그래핀, 탄소나노튜브 중 적어도 어느 하나 이상을 포함하여 구성되는 것을 특징으로 하는
핫 프레스용 실리콘 패드.
The method of claim 1,
The heat spreader is
BN, AlN, MgO, Al₂O₃, SiC, Al(OH)₃, Cu, Fe, Al, graphite, graphene, characterized in that it comprises at least any one or more of carbon nanotubes
Silicone pad for hot press.
상기 패드는
제1 레이어의 일면 또는 양면에 실리콘 재질로만 구성된 제2 레이어를 더 포함하는 것을 특징으로 하는
핫 프레스용 실리콘 패드.
The method of claim 1,
the pad is
Characterized in that it further comprises a second layer made of only silicon material on one or both sides of the first layer
Silicone pad for hot press.
상기 제1 레이어는
판상으로 수평하게 배치되는 보강재를 더 포함하는 것을 특징으로 하는
핫 프레스용 실리콘 패드.
The method of claim 1,
the first layer
Characterized in that it further comprises a reinforcing material disposed horizontally in a plate shape.
Silicone pad for hot press.
상기 패드는
판상으로 수평하게 배치되는 보강재를 더 포함하며,
제1 레이어와 보강재가 교번하여 적층된 것을 특징으로 하는
핫 프레스용 실리콘 패드.
The method of claim 1,
the pad is
Further comprising a reinforcing material disposed horizontally in a plate shape,
characterized in that the first layer and the reinforcing material are alternately laminated
Silicone pad for hot press.
상기 패드는
하기 식 1 내지 3을 동시에 만족하는 것을 특징으로 하는
핫 프레스용 실리콘 패드.
70 ≤ A ≤ 90 (식 1)
0.2 ≤ B ≤ 1 (식 2)
0.1 ≤ C ≤ 10 (식 3)
( A : 쇼어(shore) A 경도, B : 열전도율(W/mk), C : 열확산재의 입자직경(㎛) )
The method of claim 1,
the pad is
Characterized in that it simultaneously satisfies the following formulas 1 to 3
Silicone pad for hot press.
70 ≤ A ≤ 90 (Equation 1)
0.2 ≤ B ≤ 1 (Equation 2)
0.1 ≤ C ≤ 10 (Equation 3)
( A: shore A hardness, B: thermal conductivity (W/mk), C: particle diameter of thermal diffusion material (㎛) )
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200018064A KR102380624B1 (en) | 2020-02-14 | 2020-02-14 | silicone pad for hot press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200018064A KR102380624B1 (en) | 2020-02-14 | 2020-02-14 | silicone pad for hot press |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210103657A true KR20210103657A (en) | 2021-08-24 |
| KR102380624B1 KR102380624B1 (en) | 2022-03-31 |
Family
ID=77507055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020200018064A KR102380624B1 (en) | 2020-02-14 | 2020-02-14 | silicone pad for hot press |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR102380624B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116799240A (en) * | 2023-08-29 | 2023-09-22 | 北京氢璞创能科技有限公司 | Bipolar plate sealing method for detachable fuel cell stack |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128829A (en) * | 2005-11-07 | 2007-05-24 | Fuji Polymer Industries Co Ltd | Sheet for thermocompression bonding |
| KR100969705B1 (en) | 2008-05-30 | 2010-07-14 | 전미경 | Composite film for the manufacture of flexible printed circuit boards (FPC) and method for manufacturing the flexible printed circuit boards using the same |
| KR20120053467A (en) * | 2010-11-17 | 2012-05-25 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone rubber sheet for thermocompression bonding |
| KR20120099633A (en) * | 2009-10-22 | 2012-09-11 | 덴끼 가가꾸 고교 가부시키가이샤 | Insulating sheet, circuit board, and process for production of insulating sheet |
| KR101500904B1 (en) * | 2014-07-24 | 2015-03-12 | 강상태 | Fabricating method for Flexible Printed Circuit Board and hot lamination type cushion pad |
-
2020
- 2020-02-14 KR KR1020200018064A patent/KR102380624B1/en active IP Right Grant
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128829A (en) * | 2005-11-07 | 2007-05-24 | Fuji Polymer Industries Co Ltd | Sheet for thermocompression bonding |
| KR100969705B1 (en) | 2008-05-30 | 2010-07-14 | 전미경 | Composite film for the manufacture of flexible printed circuit boards (FPC) and method for manufacturing the flexible printed circuit boards using the same |
| KR20120099633A (en) * | 2009-10-22 | 2012-09-11 | 덴끼 가가꾸 고교 가부시키가이샤 | Insulating sheet, circuit board, and process for production of insulating sheet |
| KR20120053467A (en) * | 2010-11-17 | 2012-05-25 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone rubber sheet for thermocompression bonding |
| KR101500904B1 (en) * | 2014-07-24 | 2015-03-12 | 강상태 | Fabricating method for Flexible Printed Circuit Board and hot lamination type cushion pad |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116799240A (en) * | 2023-08-29 | 2023-09-22 | 北京氢璞创能科技有限公司 | Bipolar plate sealing method for detachable fuel cell stack |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102380624B1 (en) | 2022-03-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003145567A (en) | Cushioning material for hot press and method for producing laminated plate | |
| KR102380624B1 (en) | silicone pad for hot press | |
| WO2003034798A1 (en) | Method of manufacturing circuit formed substrate | |
| JPH08148814A (en) | Manufacture of flexible printed wiring board provided with coverlays | |
| JP2008023749A (en) | Cushioning material for heat press and its manufacturing method | |
| JP2006192786A (en) | Cushioning material for hot press, its production method, and method for producing laminated plate | |
| JP4567466B2 (en) | Manufacturing method of micro system | |
| JP2013074166A (en) | Flexible printed board and manufacturing method of the same | |
| JP5001868B2 (en) | Multilayer board manufacturing method | |
| JP2005022323A (en) | Epoxy resin laminated sheet for reinforcing material of flexible printed circuit board | |
| KR101151648B1 (en) | Printing technique with high aspect ratio electrode formation method | |
| KR20180085174A (en) | calorific plate and manufacturing method thereof | |
| KR20100011776A (en) | Manufacturing method of imprinting device or tool | |
| JP2004146624A (en) | Manufacturing method of metal foil-clad laminate with inner layer circuit | |
| KR100925761B1 (en) | Manufacturing method of printed circuit board | |
| JP5662853B2 (en) | Manufacturing method of flexible printed wiring board | |
| JP2001246720A (en) | Decorative panel | |
| JPH11214842A (en) | Manufacture of multilayer board | |
| JPH08118385A (en) | Manufacture of laminated sheet | |
| JP2010109042A (en) | Cushioning material for manufacturing circuit board | |
| JP2015153921A (en) | Wiring circuit board and method for manufacturing the same | |
| JP2570397B2 (en) | Method of manufacturing metal core printer board for bending | |
| JPH0985884A (en) | Metal foil-plated laminated board | |
| JP2004243688A (en) | Method for producing resin substrate and method for producing substrate with film | |
| JPH06286057A (en) | Manufacture of laminated plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20200214 |
|
| PA0201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20210721 Patent event code: PE09021S01D |
|
| PG1501 | Laying open of application | ||
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20220323 |
|
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20220325 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20220325 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |